Heat exchanger with fluidized particle bed

Abstract

A cold plate for a heat exchanger system may include a base in thermal communication with a thermal load, one or more walls extending from the base, a first fluid path through the cold plate, a plurality of particles disposed within the first fluid path, or any combination thereof. The first fluid path may have an inlet and an outlet and / or be delimited by walls on at least two sides. A plurality of particles may be fluidly confined within the first fluid path between the inlet and the outlet. A plurality of particles may be loosely disposed within the vertical portion of the first fluid path.

Description

[0001] Cross-references to related applications

[0002] This application claims the benefit of U.S. Provisional Patent Application No. 63 / 520,576, filed August 18, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This invention relates generally to heat exchangers, and more specifically to cold plate heat exchangers. Background Technology

[0004] As manufacturers continue to develop increasingly advanced chip architectures and pack more and more transistors onto small silicon wafers, power density increases dramatically. In high-density applications, air cooling cannot provide sufficient heat flux to maintain chip temperature, leading to overheating and performance throttling. The highest density cooling applications may require direct on-chip two-phase cooling.

[0005] Forced two-phase cooling using cold plates has proven to be an effective method for achieving high critical heat flux (i.e., the maximum heat per unit area that a given device can reasonably cool, or the heat flux in which boiling is no longer an effective form of heat transfer from a solid surface to a liquid). Two-phase cooling achieves high critical heat flux by evaporating the coolant / refrigerant and maintaining a nearly uniform temperature across the entire cold plate. Heat is removed as the vapor exits the outlet and condenses using a heat dissipation device.

[0006] Although forced two-phase cooling effectively maintains a nearly perfectly uniform temperature gradient, boiling liquid at the surface of the cold plate wall can generate slightly superheated vapor. The expansion of this vapor prevents rewetting and leads to the formation of temporary dry points. The vapor in these areas has low thermal conductivity and may overheat before bubbling, resulting in reduced heat transfer and increased surface temperature. Summary of the Invention

[0007] The applicant has created new and useful devices, systems, and methods for heat exchangers, such as cold plates. In at least one embodiment, a cold plate for a heat exchanger system according to this disclosure may include: a base configured to be thermally connected to a heat load; a first pair of walls extending from the base; a first fluid path passing through the cold plate; a plurality of particles disposed within the first fluid path; or any combination thereof. In at least one embodiment, the first fluid path may have an inlet and an outlet and / or may be delimited on at least two sides by the first pair of walls. In at least one embodiment, the plurality of particles may be fluidly confined within the first fluid path between the inlet and the outlet. In at least one embodiment, the plurality of particles may be loosely disposed within the first fluid path. In at least one embodiment, the first fluid path may have a vertical portion, and the plurality of particles may be confined within the vertical portion.

[0008] In at least one embodiment, the plurality of particles may be thermally conductive particles. In at least one embodiment, the plurality of particles may include metallic particles. In at least one embodiment, the plurality of particles may be configured to increase the rate of heat transfer from the first pair of walls to the two-phase cooling fluid. In at least one embodiment, the plurality of particles may be configured to fluidize as the cooling fluid, such as a single-phase subcooled cooling fluid or a two-phase saturated cooling fluid, moves through the first fluid path. In at least one embodiment, the thermally conductive particles may be configured to transfer heat, such as through particle-wall collisions and / or particle-particle collisions. In at least one embodiment, the plurality of particles may be configured to resist vapor insulation against at least a portion of one or more walls or other surfaces during two-phase cooling of the cold plate. In at least one embodiment, the plurality of particles may be configured to induce or increase turbulence in at least a portion of the first fluid path.

[0009] In at least one embodiment, the cold plate may have fins extending from the base. In at least one embodiment, one of the first pair of walls may be a sidewall of a fin. In at least one embodiment, the cold plate may have a plurality of fins extending from the base, a plurality of fluid paths passing through the cold plate, and a plurality of particles disposed within each of the plurality of fluid paths. In at least one embodiment, each of the plurality of fluid paths may have an inlet and an outlet and / or be demarcated on at least one side by a sidewall of one of the plurality of fins. In at least one embodiment, the particles may be fluidly confined between the inlet and outlet of each of the plurality of fluid paths.

[0010] In at least one embodiment, the cold plate may have an inlet manifold in fluid communication with the inlet of a first fluid path, an outlet manifold in fluid communication with the outlet of the first fluid path, an inlet filter fluidly disposed downstream of the inlet manifold, an outlet filter fluidly disposed upstream of the outlet manifold, or any combination thereof. In at least one embodiment, a plurality of particles may be fluidly confined between the inlet filter and the outlet filter. In at least one embodiment, each of the plurality of particles may have a primary size, the inlet filter may have an inlet filter size, and the outlet filter may have an outlet filter size. In at least one embodiment, the primary size may be larger than the inlet filter size and / or the outlet filter size. In at least one embodiment, the inlet filter size and the outlet filter size may be different. In at least one embodiment, the inlet filter size and / or the outlet filter size may be configured to allow cooling fluid to flow through the cold plate while the plurality of particles are fluidly confined between the inlet and the outlet within the first fluid path.

[0011] In at least one embodiment, the cold plate may have a first heat transfer rate when the first cooling fluid moves through the first fluid path at a first flow rate and no particles are disposed within the first fluid path. In at least one embodiment, the cold plate may have a second heat transfer rate when the first cooling fluid moves through the first fluid path at a first flow rate and multiple particles are disposed within the first fluid path. In at least one embodiment, the second heat transfer rate may be greater than the first heat transfer rate.

[0012] In at least one embodiment, the cold plate may have a first critical heat flux when the first cooling fluid moves through the first fluid path at a first flow rate and no particles are disposed within the first fluid path. In at least one embodiment, the cold plate may have a second critical heat flux when the first cooling fluid moves through the first fluid path at a first flow rate and multiple particles are disposed within the first fluid path. In at least one embodiment, the second critical heat flux may be greater than the first critical heat flux.

[0013] In at least one embodiment, the plurality of particles may be configured to increase the heat transfer rate from the first pair of walls to the two-phase cooling fluid. In at least one embodiment, the plurality of particles may be configured to fluidize as the two-phase cooling fluid or other cooling fluid moves through the first fluid path. In at least one embodiment, the plurality of particles may include metal particles.

[0014] In at least one embodiment, the heat exchanger according to this disclosure may include one or more cold plates. In at least one embodiment, any or all cold plates may include: a base configured to be in thermal communication with a heat load; a plurality of fins extending from the base; a plurality of fluid paths passing through the cold plates, wherein each of the plurality of fluid paths has an inlet and an outlet; a plurality of particle groups, wherein each of the plurality of particle groups is disposed within a corresponding fluid path of the plurality of fluid paths; a prime mover causing the two-phase cooling fluid to circulate through the plurality of fluid paths at a velocity that fluidizes each of the plurality of particle groups; or any combination thereof. In at least one embodiment, each of the plurality of fluid paths passing through the cold plates may have a vertically oriented portion. In at least one embodiment, the particle groups may be confined within the vertically oriented portions by means of a filter. In at least one embodiment, the fluidized particle groups may resist vapor insulation from one or more heat transfer surfaces during cooling of one or more cold plates.

[0015] In at least one embodiment, the cooling method according to the present disclosure may include: providing a cold plate in thermal communication with a heat load, moving two-phase cooling fluid through a fluid path of the cold plate, fluidizing a particle group disposed within the fluid path, or any combination thereof. Attached Figure Description

[0016] Figure 1 This is a block diagram of one embodiment of a heat exchanger system according to the present disclosure.

[0017] Figure 2 It is intercepted along line AA. Figure 1 A cross-sectional view of one embodiment of a heat exchanger system as part of a series of implementations.

[0018] Figure 3 It is intercepted along line AA. Figure 1 A cross-sectional view of another embodiment of a part of a heat exchanger system.

[0019] Figure 4 It is intercepted along line AA. Figure 1 A cross-sectional view of yet another embodiment of a part of a heat exchanger system.

[0020] Figure 5 This is a side view of one embodiment of a heat exchanger system as part of this disclosure.

[0021] Figure 6 is a front view of one of many embodiments of a heat exchanger system according to a portion of this disclosure.

[0022] Figure 7 This is a simplified block diagram of one of many embodiments of a heat exchanger system according to this disclosure.

[0023] Figure 8 This is a front view of one embodiment of a heat exchanger system as part of this disclosure.

[0024] Figure 9 This is a simplified representation of one of many embodiments of the fluid flow path of the heat exchanger system according to the present disclosure.

[0025] Figure 10 This is another simplified representation of one of many embodiments of the fluid flow path of the heat exchanger system according to the present disclosure.

[0026] Figure 11 It is a simplified representation of a steam bag within the fluid flow path of a heat exchanger system according to this disclosure.

[0027] Figure 12 It is a simplified representation of particles interacting with the steam bag within the fluid flow path of the heat exchanger system according to this disclosure.

[0028] Figure 13 It is a simplified representation of particles within the fluid flow path of the heat exchanger system according to this disclosure.

[0029] Figure 14 This is an exemplary graph illustrating various aspects of the relationship between wall heat flux and wall superheat within the fluid flow path of a heat exchanger system according to this disclosure in the absence of particles present therein.

[0030] Figure 15 This is an exemplary graph illustrating various aspects of the relationship between wall heat flux and wall superheat within the fluid flow path of a heat exchanger system according to this disclosure, in the presence of particles therein. Detailed Implementation

[0031] The accompanying drawings and the following written description of specific structures and functions are not intended to limit the scope of the applicant's invention or the scope of the appended claims. Rather, the drawings and written description are provided to teach any person skilled in the art to make and use the patent-seeking invention. It will be understood by those skilled in the art that not all features of a commercial implementation of the invention are described or illustrated for clarity and understanding. It will also be understood by those skilled in the art that the development of a practical commercial implementation incorporating various aspects of the invention will require numerous implementation-specific decisions to achieve the developer's ultimate goals for the commercial implementation. Such implementation-specific decisions may include, but may not be limited to, compliance with system-related, commercial-related, governmental-related constraints, and other constraints that may vary by specific implementation, location, and over time. While the developer's efforts may be complex and time-consuming in an absolute sense, such efforts will be a routine task for those skilled in the art who benefit from this disclosure. It must be understood that the invention disclosed and taught herein is readily adaptable to many and various modifications and alternative forms.

[0032] The use of singular terms such as, but not limited to, “one” is not intended as a limitation on the number of items. Furthermore, the use of relational terms such as, but not limited to, “top,” “bottom,” “left,” “right,” “upper,” “lower,” “below,” “above,” “side,” etc., in the written description is for clarity when specifically referring to the accompanying drawings and is not intended to limit the scope of the invention or the appended claims. The terms “comprising” and “e.g.” are illustrative, not restrictive. The terms “connected,” “linked,” “connecting,” “connecting element,” and similar terms are used extensively herein and may include any method or means for fixing, joining, bonding, fastening, attaching, engaging, inserting therein, forming thereon, or in which one or more components are connected, or otherwise, for example, mechanically, magnetically, electrically, chemically, operably, directly, or indirectly through an intermediate element, to associate one or more components together, and these terms and similar terms may also include, but are not limited to, integrally forming one functional component with another functional component in a monolithic manner. Connections can occur in any direction, including rotationally. Furthermore, all parts and components of this disclosure that can be physically and inherently implemented include both hypothetical and real features, regardless of whether such features are explicitly described herein. These features include, but are not limited to, features such as axis, ends, inner and outer surfaces, internal space, top, bottom, sides, boundaries, dimensions (e.g., height, length, width, thickness), mass, weight, volume, and density.

[0033] The applicant has created new and useful devices, systems, and methods for heat exchangers, such as cold plates. The inventions disclosed herein allow for higher critical heat fluxes and generally improve the thermal performance of heat exchangers, such as cold plates. In at least one embodiment, the heat exchanger, such as the cold plate, utilizes a bed of conductive particles fluidized or suspended in a fluid via a refrigerant flow. Such fluidized particles can support or improve heat transfer in one or more ways, such as by: disrupting vapor formation and dry points; disrupting mechanisms that control the critical heat flux for fluid boiling; disrupting vapor film separation between hot walls or other surfaces and the overall flow; disrupting dense bubble clusters near hot surfaces; disrupting bubble coalescence near liquid sublayers near hot surfaces; colliding with bubble structures on wall surfaces, thereby breaking up and mixing them into the overall flow; rewetting dry points on walls, for example by disrupting surface tension of vapor, in cases of interfacial separation between liquid surfaces and hot walls; colliding with walls and conducting heat, thereby providing wall-to-particle conduction; colliding with other particles and conducting heat, thereby providing particle-to-particle conduction; increasing heat transfer area; providing nucleation sites to promote boiling at lower temperatures; increasing turbulence overall; or any combination thereof. Such particles can be carried away from the walls by the fluid and can be cooled from critical areas.

[0034] Figure 1 This is a block diagram of one embodiment of a heat exchanger system according to the present disclosure. Figure 2 It is intercepted along line AA. Figure 1 A cross-sectional view of one embodiment of a heat exchanger system as part of a series of implementations. Figure 3 It is intercepted along line AA. Figure 1 A cross-sectional view of another embodiment of a part of a heat exchanger system. Figure 4 It is intercepted along line AA. Figure 1 A cross-sectional view of yet another embodiment of a part of a heat exchanger system. Figure 5 Figure 6 is a side view of one embodiment of a heat exchanger system according to a portion of the present disclosure. Figure 7 is a front view of one embodiment of a heat exchanger system according to a portion of the present disclosure. Figure 7 This is a simplified block diagram of one of many embodiments of a heat exchanger system according to this disclosure. Figure 8 This is a front view of one embodiment of a heat exchanger system as part of this disclosure. Figure 9 This is a simplified representation of one of many embodiments of the fluid flow path of the heat exchanger system according to the present disclosure. Figure 10This is another simplified representation of one of many embodiments of the fluid flow path of the heat exchanger system according to the present disclosure. Figure 11 It is a simplified representation of a steam bag within the fluid flow path of a heat exchanger system according to this disclosure. Figure 12 It is a simplified representation of particles interacting with the steam bag within the fluid flow path of the heat exchanger system according to this disclosure. Figure 13 It is a simplified representation of particles within the fluid flow path of the heat exchanger system according to this disclosure. Figure 14 This is an exemplary graph illustrating various aspects of the relationship between wall heat flux and wall superheat within the fluid flow path of a heat exchanger system according to this disclosure in the absence of particles present therein. Figure 15 This is an exemplary graph illustrating various aspects of the relationship between wall heat flux and wall superheat within the fluid flow path of a heat exchanger system according to this disclosure, in the presence of particles therein. Figures 1 to 15 It is a description that combines each other.

[0035] In at least one embodiment, the heat exchanger or heat exchanger system 200 according to the present disclosure may include one or more cold plates 100 for cooling one or more heat loads, such as electronic components used in a data center. In at least one embodiment, the cold plate 100 according to the present disclosure may include: one or more bases 102 configured to be in thermal communication with one or more heat loads 202; two or more walls 104 extending from the bases 102; one or more fluid paths 106 passing through the cold plate 100; a plurality of particles 108 disposed within one or more of the fluid paths 106; or any combination thereof. In at least one embodiment, the heat exchanger system 200 may include one or more secondary heat exchangers 204 to dissipate heat extracted from the heat load 202 by the cold plate 100. In at least one embodiment, the heat exchanger system 200 may include one or more prime movers 206, such as pumps or compressors, to circulate one or more cooling fluids or working fluids, such as two-phase cooling fluids, through the fluid path 106 of the cold plate 100.

[0036] For illustrative purposes, such as Figures 1 to 8As shown, in at least one embodiment, the cold plate 100 may be a solid-to-fluid heat exchanger, such as a direct-chip heat exchanger for direct thermal communication with heat-generating electronic components. However, this is not always the case, and other embodiments are contemplated. For example, in at least one embodiment, the cold plate 100 may be, or include, a fluid-to-fluid heat exchanger, an air-to-fluid heat exchanger, or another type of heat exchanger according to an implementation of this disclosure. Similarly, in at least one embodiment, the heat exchanger system 200 or the cold plate 100 may utilize a two-phase cooling fluid or a refrigerant. However, phase change cooling is not necessarily required, and in at least one embodiment, the heat exchanger system 200 or the cold plate 100 may utilize a single-phase cooling fluid or a combination of two or more cooling fluids.

[0037] In at least one embodiment, the fluid path 106 may have one or more inlets 112, such as inlets from an inlet manifold, and one or more outlets 114, such as outlets leading to an outlet manifold, and / or may be defined on one or more sides by one or more walls of the walls 104, such as the sidewall of the cold plate 100, the sidewall of one fin of the fins 122, another heat transfer surface of the cold plate 100, or a combination thereof. In at least one embodiment, particles 108 may be confined within the fluid path 106 or a portion of the fluid path 106 between the inlet 112 and the outlet 114, for example, by an inlet filter 116 and / or an outlet filter 118. In at least one embodiment, particles 108 may be loosely disposed, entrained, or suspended, for example, in a fluid manner within the fluid path 106. In at least one embodiment, particles 108 may be loosely disposed within the fluid path 106. In at least one embodiment, the fluid path 106 may have a vertical portion, and particles 108 may be confined within the vertical portion.

[0038] In at least one embodiment, one or more tanks, storage compartments, and / or recirculation paths may be in fluid communication with one or more fluid paths of fluid path 106 for storing and / or guiding at least a portion of particles 108, for example, to resist or prevent clogging during cooling operations. For example, in at least one embodiment, outlet filter 118 may be tilted or angled relative to fluid path 106, or may be otherwise configured to eject or deflect particles 108 impacting outlet filter 118 toward, or into, a tank or recirculation path 130 upstream of outlet filter 118. In at least one embodiment, recirculation path or loop 130 may guide particles toward the inlet end of fluid path 106, or otherwise guide them into fluid path 106 upstream of outlet filter, thereby repositioning or reusing particles 108 for cooling operations, and / or preventing particles 108 from clogging outlet filter 118. In at least one embodiment, a pump, compressor, conveyor or other mechanism 132 may be used to clean the outlet filter 118 and / or recirculate the particles 108.

[0039] In at least one embodiment, particle 108 may be a thermally conductive particle, which may be made of any thermally conductive material required or desired in the implementation of this disclosure. In at least one embodiment, particle 108 may include metal particles. In at least one embodiment, particle 108 may include thermally conductive metal particles, such as copper, aluminum, steel, brass, titanium, lead, alloys of any of the foregoing, or any combination thereof. In at least one embodiment, particle 108 may be made wholly or partially of an oxidation-resistant or corrosion-resistant metal or alloy (e.g., stainless steel), which may help reduce any possibility of oxidation or corrosion negatively impacting the heat transfer process. However, this is not necessary, and materials with relatively low corrosion resistance may also be used.

[0040] In at least one embodiment, the particles 108 may be macroscopic in scale. For example, in at least one embodiment, according to the implementation of this disclosure, the particles 108 may have a diameter or other cross-sectional dimension, or other dimensions, from 0.1 mm to 6 mm. In at least one embodiment, according to the implementation of this disclosure, one or more particles 108 may be spherical, cylindrical, polyhedral, rectangular, irregular, or other shapes. As other examples, one or more particles 108 may be a spherical shape with a pointed tip, or may be, for example, star-shaped or jack-shaped (i.e., similar to a hexagon with rounded, pointed, or otherwise shaped points).

[0041] In at least one embodiment, the physical properties of the particles 108 used in a given implementation of this disclosure may depend at least in part on the type of working fluid or cooling fluid used (and the type of working fluid or cooling fluid used may depend at least in part on the physical properties of the particles), which, according to an implementation of this disclosure, may be or include any particle properties and / or fluid type. For example, in at least one embodiment, chip downclocking may be set at or near 90°C, and the implementation of this disclosure may be constructed accordingly. As another example, in at least one embodiment, the working fluid temperature of a relatively advanced high-density chip may be 50°C (or lower), and the implementation of this disclosure may be constructed accordingly. Similarly, a wide variety of refrigerants or coolants may be used as required or desired by a given implementation of this disclosure. For example, common two-phase fluids used in IT cooling applications may include fluorinated chemicals or fluorocarbon fluids, but other fluids may also be used in one or more embodiments of this disclosure depending on relevant design factors, such as (but not limited to) performance impact, maintenance, chemical or material compatibility, electrical performance, flammability, environmental considerations, boiling point or other physical properties, safety considerations, etc.

[0042] In at least one embodiment, particle 108 may have a uniform size and shape. In at least one embodiment, particle 108 may have a different size and / or shape. In at least one embodiment, particle 108 may have a uniform size and / or shape in one fluid path 106a, and a different size and / or shape in another fluid path 106b. In at least one embodiment, particle 108 may still have a different size and / or shape in one or more other fluid paths 106c...106n (collectively referred to as fluid paths 106).

[0043] In at least one embodiment, particle 108 may have a uniform mass and density. In at least one embodiment, particle 108 may have a different mass and / or density. In at least one embodiment, particle 108 may have a uniform mass and / or density in one fluid path 106a, and a different mass and / or density in another fluid path 106b. In at least one embodiment, particle 108 may have a still different mass and / or density in one or more other fluid paths 106.

[0044] In at least one embodiment, the particles 108 may be shaped, sized, and / or otherwise arranged to promote or support turbulence through at least a portion of the cold plate 100 to increase heat transfer from the cold plate 100 to the cooling fluid. In at least one embodiment, the particles 108 may be shaped, sized, and / or otherwise arranged to avoid dense packing of the particles 108 with each other, for example, to minimize the chance of clogging or excessively restricting the fluid path 106 through the cold plate 100 or the fluid path 106 of the cold plate 100.

[0045] In at least one embodiment, particles 108 may be configured to increase the rate of heat transfer from wall 104 to the two-phase cooling fluid, for example, by increasing the rate of heat transfer relative to embodiments without particles 108. In at least one embodiment, particles 108 may be configured to fluidize when the cooling fluid is propelled or otherwise moved through fluid path 106, for example, at a fluidization rate (or higher). In at least one embodiment, particles 108 may be configured to fluidize when a single-phase subcooled cooling fluid or a two-phase saturated cooling fluid is propelled or otherwise moved through fluid path 106 at a fluidization rate. In at least one embodiment, thermally conductive particles 108 may be configured to transfer heat, for example, through particle-wall collisions and / or particle-particle collisions. In at least one embodiment, particles 108 may be configured to resist vapor insulation 138 of at least a portion of wall 104 of cold plate 100 and / or one or more other surfaces during two-phase cooling of cold plate 100. In at least one embodiment, particles 108 may be configured to induce or increase turbulence in at least a portion of fluid path 106.

[0046] In at least one embodiment, the cold plate 100 may have one or more fins 122 extending from the base 102. In at least one embodiment, one or more walls of the walls 104 may be sidewalls of the fins 122. In at least one embodiment, the cold plate 100 may have a plurality of fins 122 extending from the base 102, a plurality of fluid paths 106 passing through the cold plate 100, and a plurality of particles 108 or groups of particles 108 disposed within one or more of the fluid paths 106. In at least one embodiment, each of the plurality of fluid paths may have an inlet 112 and an outlet 114, and / or may be defined on at least one side by a sidewall 104 of the cold plate 100, such as the sidewall 104 of one of the fins 122. In at least one embodiment, a particle 108 in a corresponding fluid path 106 may be fluidly confined between the inlet 112 and the outlet 114 of the fluid path 106, or fluidly confined between a corresponding inlet filter 116 and an outlet filter 118. In at least one embodiment, the cold plate 100 may have one or more fins 122 that extend fully from the base 102 across the fluid path 106, thereby dividing the fluid path 106 into multiple fluid paths (e.g., see fluid paths 106a, 106b, 106c). This division may extend along the entire length of the fluid path 106 or only along a portion of the fluid path 106. In at least one embodiment, the cold plate 100 may have one or more fins 122 that extend partially from the base 102 across the fluid path 106, thereby dividing the fluid path 106. This division may extend along the entire length of the fluid path 106 or only along a portion of the fluid path 106.

[0047] In at least one embodiment, the cold plate may have an inlet manifold 140 in fluid communication with an inlet 112 of the fluid path 106, an outlet manifold 142 in fluid communication with an outlet 114 of the fluid path 106, an inlet filter 116 fluidly disposed downstream of the inlet manifold 140, an outlet filter 118 fluidly disposed upstream of the outlet manifold 142, or any combination thereof. In at least one embodiment, particles 108 may be fluidly confined between the inlet filter 116 and the outlet filter 118. In at least one embodiment, each particle 108 may have a primary size, the inlet filter 116 may have an inlet filter size, and the outlet filter 118 may have an outlet filter size. In at least one embodiment, the primary size may be larger than the inlet filter size and / or the outlet filter size. In at least one embodiment, the inlet filter size and the outlet filter size may be different. In at least one embodiment, the inlet filter size and / or outlet filter size may be configured to allow cooling fluid to flow through the cold plate 100 while the particles 108 are fluidly confined within the fluid path 106 between the inlet 112 and the outlet 114 and / or between the inlet filter 116 and the outlet filter 118.

[0048] In at least one embodiment, the cold plate 100 may have a first heat transfer rate when the cooling fluid moves through the fluid path 106 at a first flow rate and no particles 108 are disposed within the fluid path 106. In at least one embodiment, the cold plate 100 may have a second heat transfer rate when the cooling fluid moves through the fluid path 106 at the first flow rate and particles 108 are disposed within the fluid path 106. In at least one embodiment, the second heat transfer rate may be greater than the first heat transfer rate. In at least one embodiment, the presence of particles 108 disposed within the fluid path 106 contributes to the second heat transfer rate being greater than the first heat transfer rate. In at least one embodiment, the presence of particles 108 disposed within the fluid path 106 may be responsible for making the second heat transfer rate greater than the first heat transfer rate, for example, by improving heat transfer in one or more ways discussed herein.

[0049] In at least one embodiment, the cold plate 100 may have a first critical heat flux when the cooling fluid moves through the fluid path 106 at a first flow rate and no particles 108 are disposed within the fluid path 106. In at least one embodiment, the cold plate 100 may have a second critical heat flux when the cooling fluid moves through the fluid path 106 at a first flow rate and particles 108 are disposed within the fluid path 106. In at least one embodiment, the second critical heat flux may be greater than the first critical heat flux. In at least one embodiment, the presence of particles 108 disposed within the fluid path 106 contributes to the second critical heat flux being greater than the first critical heat flux. In at least one embodiment, the presence of particles 108 disposed within the fluid path 106 may be responsible for making the second critical heat flux greater than the first critical heat flux, for example, by improving heat transfer in one or more ways discussed herein.

[0050] In at least one embodiment, particles 108 may be configured to increase the rate of heat transfer from wall 104 to the two-phase cooling fluid. In at least one embodiment, particles 108 may be configured to fluidize as the two-phase cooling fluid moves through fluid path 106 at a velocity sufficient to fluidize particles 108, which may be or include any velocity according to the implementation of this disclosure. In at least one embodiment, fluid path 106 may be defined by base 102, one or more opposing walls 124, and one or more sidewalls 104. In at least one embodiment, heat may be transferred from heat load 202 to base 102 and through or via sidewalls 104 or fins 122 to opposing walls 124. In at least one embodiment, particles 108 may be configured to increase the rate of heat transfer from base 102, opposing walls 124, sidewalls 104, or any combination thereof to the two-phase cooling fluid.

[0051] In at least one embodiment, the heat exchanger system 200 according to the present disclosure may include one or more cold plates 100. In at least one embodiment, any or all of the cold plates 100 may include a base 102 configured to be in thermal communication with a heat load 202, a plurality of fins 122 extending from the base 102, and a plurality of fluid paths 106 passing through the cold plates 100. In at least one embodiment, each of the fluid paths 106 may have an inlet 112 and an outlet 114, and a plurality of particles 108 disposed in the fluid path. In at least one embodiment, the system 200 may include one or more prime movers 206, such as pumps or compressors, for circulating a two-phase cooling fluid or other cooling fluid at a rate that fluidizes each of the plurality of groups of particles 108 or any combination thereof through the fluid paths 106. In at least one embodiment, each of the fluid paths 106 passing through the cold plates 100 may have a vertically oriented portion. In at least one embodiment, the groups of particles 108 may be confined within the vertically oriented portion, for example, by means of filters 116, 118. In at least one embodiment, the fluidized particles 108 can resist vapor insulation 138 of one or more heat transfer surfaces during two-phase cooling of one or more cold plates 100.

[0052] In at least one embodiment, the method according to this disclosure may include: providing a cold plate 100 in thermal communication with a heat load 202, moving a two-phase cooling fluid through a fluid path 106 of the cold plate 100, fluidizing a group of particles 108 disposed within the fluid path 106, or any combination thereof. In at least one embodiment, the method may include resisting clogging of the particles 108, for example by guiding or retaining some or all of the particles 108 in a tank or recirculation path 130 or by guiding or retaining some or all of the particles 108 to a tank or recirculation path 130. In at least one embodiment, the method may include resisting vapor insulation 138 of one or more heat transfer surfaces during cooling operations by contacting a heat transfer surface with one or more of the particles 108. In at least one embodiment, the method may include: utilizing one or more particles 108 and disrupting vapor formation and dry points; disrupting reasonable mechanisms for controlling the critical heat flux of flow boiling; disrupting vapor film separation between hot walls or other surfaces and the overall flow; disrupting dense bubble clusters adjacent to hot surfaces; disrupting bubble coalescence near liquid sublayers near hot surfaces; colliding with bubble structures on wall surfaces, thereby breaking up the bubble structures and mixing them into the overall flow; rewetting dry points on walls, for example by disrupting the surface tension of vapor, in the case of interfacial separation between liquid surfaces and hot walls; colliding with walls and conducting heat, thereby providing wall-to-particle conduction; colliding with other particles and conducting heat, thereby providing particle-to-particle conduction; increasing heat transfer area; providing nucleation sites to promote boiling at lower temperatures; increasing turbulence overall; or any combination thereof. In at least one embodiment, the method may include guiding particles 108 away from one or more heat transfer surfaces or regions and cooling particles 108.

[0053] In at least one embodiment, the cold plate for a heat exchanger system according to the present disclosure may include a base configured to be thermally communicated with a heat load, a first pair of walls extending from the base, a first fluid path through the cold plate, a plurality of particles disposed within the first fluid path, or any combination thereof. In at least one embodiment, the first fluid path may have an inlet and an outlet and / or be delimited on at least two sides by the first pair of walls. In at least one embodiment, the plurality of particles may be fluidly confined within the first fluid path between the inlet and the outlet. In at least one embodiment, the plurality of particles may be loosely disposed within the first fluid path. In at least one embodiment, the first fluid path may have a vertical portion, and the plurality of particles may be confined within the vertical portion.

[0054] In at least one embodiment, the plurality of particles may be thermally conductive particles. In at least one embodiment, the plurality of particles may include metallic particles. In at least one embodiment, the plurality of particles may be configured to increase the rate of heat transfer from the first pair of walls to the two-phase cooling fluid. In at least one embodiment, the plurality of particles may be configured to fluidize as the two-phase cooling fluid moves through the first fluid path. In at least one embodiment, the thermally conductive particles may be configured to transfer heat, such as through particle-wall collisions and / or particle-particle collisions. In at least one embodiment, the plurality of particles may be configured to resist vapor insulation of at least a portion of one or more of the first pair of walls during two-phase cooling of the cold plate. In at least one embodiment, the plurality of particles may be configured to induce or increase turbulence in at least a portion of the first fluid path.

[0055] In at least one embodiment, the cold plate may have fins extending from the base. In at least one embodiment, one of the first pair of walls may be a sidewall of a fin. In at least one embodiment, the cold plate may have a plurality of fins extending from the base, a plurality of fluid paths passing through the cold plate, and a plurality of particles disposed within each of the plurality of fluid paths. In at least one embodiment, each of the plurality of fluid paths may have an inlet and an outlet and / or be demarcated on at least one side by a sidewall of one of the plurality of fins. In at least one embodiment, the particles may be fluidly confined between the inlet and outlet of each of the plurality of fluid paths.

[0056] In at least one embodiment, the cold plate may have an inlet manifold in fluid communication with the inlet of a first fluid path, an outlet manifold in fluid communication with the outlet of the first fluid path, an inlet filter fluidly disposed downstream of the inlet manifold, an outlet filter fluidly disposed upstream of the outlet manifold, or any combination thereof. In at least one embodiment, a plurality of particles may be fluidly confined between the inlet filter and the outlet filter. In at least one embodiment, each of the plurality of particles may have a primary size, the inlet filter may have an inlet filter size, and the outlet filter may have an outlet filter size. In at least one embodiment, the primary size may be larger than the inlet filter size and / or the outlet filter size. In at least one embodiment, the inlet filter size and the outlet filter size may be different. In at least one embodiment, the inlet filter size and / or the outlet filter size may be configured to allow cooling fluid to flow through the cold plate while the plurality of particles are fluidly confined between the inlet and the outlet within the first fluid path.

[0057] In at least one embodiment, the cold plate may have a first heat transfer rate when the first cooling fluid moves through the first fluid path at a first flow rate and no particles are disposed within the first fluid path. In at least one embodiment, the cold plate may have a second heat transfer rate when the first cooling fluid moves through the first fluid path at a first flow rate and multiple particles are disposed within the first fluid path. In at least one embodiment, the second heat transfer rate may be greater than the first heat transfer rate.

[0058] In at least one embodiment, the cold plate may have a first critical heat flux when the first cooling fluid moves through the first fluid path at a first flow rate and no plurality of particles are disposed within the first fluid path. In at least one embodiment, the cold plate may have a second critical heat flux when the first cooling fluid moves through the first fluid path at a first flow rate and the plurality of particles are disposed within the first fluid path. In at least one embodiment, the second critical heat flux may be greater than the first critical heat flux. In at least one embodiment, the plurality of particles may be configured to increase the heat transfer rate from the first opposing walls to the two-phase cooling fluid. In at least one embodiment, the plurality of particles may be configured to fluidize as the two-phase cooling fluid moves through the first fluid path. In at least one embodiment, the plurality of particles may include metal particles.

[0059] In at least one embodiment, the heat exchanger according to the present disclosure may include one or more cold plates. In at least one embodiment, any or all cold plates may include: a base configured to be thermally connected to a heat load; a plurality of fins extending from the base; a plurality of fluid paths passing through the cold plates, wherein each of the plurality of fluid paths has an inlet and an outlet; a plurality of particle groups, wherein each of the plurality of particle groups is disposed within a corresponding fluid path of the plurality of fluid paths; a prime mover causing the two-phase cooling fluid to circulate through the plurality of fluid paths at a velocity that fluidizes each of the plurality of particle groups; or any combination thereof. In at least one embodiment, each of the plurality of fluid paths passing through the cold plates may have a vertically oriented portion. In at least one embodiment, the particle groups may be confined within the vertically oriented portions by means of a filter. In at least one embodiment, the fluidized particle groups may resist vapor insulation from one or more heat transfer surfaces during two-phase cooling of one or more cold plates. In at least one embodiment, the cooling method according to the present disclosure may include: providing a cold plate in thermal communication with a heat load, moving two-phase cooling fluid through a fluid path of the cold plate, fluidizing a particle group disposed within the fluid path, or any combination thereof.

[0060] Without departing from the spirit of the applicant's disclosure, other embodiments and additional embodiments utilizing one or more aspects of this disclosure are conceivable. For example, apparatuses, systems, and methods can be implemented for many different types and sizes in many different industries. Furthermore, various embodiments of apparatuses, systems, and methods, and various methods, can be included in combination with each other to produce variations of the disclosed methods and embodiments. The singular element discussed may include a plural element, and the plural element discussed may include a singular element. Unless otherwise specifically limited, the order of steps can occur in various orders. The various steps described herein can be combined with other steps, interspersed with stated steps, and / or split into multiple steps. Similarly, elements have been functionally described and can be implemented as individual components or can be combined into components with multiple functions.

[0061] The invention has been described in terms of preferred and other embodiments, but not every embodiment of the invention has been described. Obvious modifications and variations of the described embodiments will be apparent to those skilled in the art who will benefit from this disclosure. The disclosed and undisclosed embodiments are not intended to limit or constrain the scope or applicability of the invention conceived by the applicant, but rather, in accordance with patent law, the applicant intends to fully protect all such modifications and improvements that fall within the scope or range of equivalents of the appended claims.

Claims

1. A cold plate for a heat exchanger, the cold plate comprising: The base is configured to be in thermal communication with a heat load; The first pair of walls extends from the base; A first fluid path passes through the cold plate, the first fluid path has an inlet and an outlet, and is demarcated on at least two sides by the first opposing walls; as well as Multiple particles, wherein the multiple particles are disposed within the first fluid path; The plurality of particles are fluidly confined between the inlet and the outlet within the first fluid path.

2. The cold plate of claim 1, further comprising a fin extending from the base, wherein, One of the first pair of walls is the sidewall of the fin.

3. The cold-rolled plate according to claim 1, further comprising: Multiple fins, the multiple fins extending from the base, Multiple fluid paths pass through the cold plate, each of the multiple fluid paths having an inlet and an outlet, and being demarcated on at least one side by the sidewall of one of the multiple fins; as well as Multiple particles are disposed within each of the multiple fluid paths and are fluidly confined between the inlet and the outlet of the multiple fluid paths.

4. The cold-rolled plate according to claim 1, further comprising: An inlet manifold, which is in fluid communication with the inlet of the first fluid path; An outlet manifold, wherein the outlet manifold is in fluid communication with the outlet of the first fluid path; An inlet filter is disposed downstream of the inlet manifold in terms of fluid flow. as well as An outlet filter is disposed upstream of the outlet manifold in terms of fluid flow. The plurality of particles are confined in terms of fluid between the inlet filter and the outlet filter.

5. The cold plate of claim 4, wherein, Each of the plurality of particles has a principal size, the inlet filter has an inlet filter size, and the outlet filter has an outlet filter size; and wherein the principal size is greater than the inlet filter size and the outlet filter size.

6. The cold plate of claim 5, wherein, The inlet filter and the outlet filter are of different sizes.

7. The cold plate of claim 5, wherein, The inlet filter size and the outlet filter size are configured to allow cooling fluid to flow through the cold plate while the plurality of particles are fluidly confined between the inlet and the outlet within the first fluid path.

8. The cold plate of claim 1, wherein, The plurality of particles are loosely disposed within the first fluid path.

9. The cold plate of claim 1, wherein, The first fluid path has a vertical portion, and the plurality of particles are confined within the vertical portion.

10. The cold plate of claim 1, wherein, The plurality of particles include thermally conductive particles, wherein the thermally conductive particles are configured to transfer heat via at least one of particle-wall collisions, particle-particle collisions, and combinations thereof.

11. The cold plate of claim 1, wherein, The plurality of particles are configured to resist vapor insulation against at least a portion of one or more of the first pair of walls during two-phase cooling of the cold plate.

12. The cold plate of claim 1, wherein, The plurality of particles are configured to induce or increase turbulence in at least a portion of the first fluid path.

13. The cold-rolled plate according to claim 1, wherein When the first cooling fluid moves through the first fluid path at a first flow rate and no particles are present in the first fluid path, the cold plate has a first heat transfer rate. Wherein, when the first cooling fluid moves through the first fluid path at the first flow rate and the plurality of particles are disposed within the first fluid path, the cold plate has a second heat transfer rate; and The second heat transfer rate is greater than the first heat transfer rate.

14. The cold-rolled plate according to claim 1, wherein When the first cooling fluid moves through the first fluid path at a first flow rate and no particles are present in the first fluid path, the cold plate has a first critical heat flux. Wherein, when the first cooling fluid moves through the first fluid path at the first flow rate and the plurality of particles are disposed within the first fluid path, the cold plate has a second critical heat flux; and The second critical heat flux is greater than the first critical heat flux.

15. The cold-rolled plate according to claim 1, wherein, The plurality of particles are configured to increase the rate of heat transfer from the first pair of walls to the two-phase cooling fluid.

16. The cold-rolled plate according to claim 1, wherein, The plurality of particles are configured to fluidize as the two-phase cooling fluid moves through the first fluid path.

17. The cold plate of claim 1, wherein, The plurality of particles include metal particles.

18. A heat exchanger, comprising: One or more cold plates, wherein each of the one or more cold plates comprises: Base, the base being configured to be in thermal communication with a heat load; Multiple fins extending from the base; and Multiple fluid paths passing through the cold plate, each of the multiple fluid paths having an inlet and an outlet; Multiple particle groups, wherein each of the multiple particle groups is disposed within a corresponding fluid path in one of the multiple fluid paths; and The prime mover causes the two-phase cooling fluid to circulate through the plurality of fluid paths at a rate that fluidizes each of the plurality of particle groups.

19. The heat exchanger of claim 18, wherein, Each of the plurality of fluid paths passing through the cold plate has a vertically oriented portion, wherein the particle group is confined within the vertically oriented portion by a filter.

20. The heat exchanger of claim 19, wherein, The fluidized particle group is configured to resist vapor insulation against one or more heat transfer surfaces during two-phase cooling of the one or more cold plates.

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