Phase change type chip radiator

Abstract

The utility model relates to a phase change type chip radiator, which belongs to the technical field of heat radiation, and comprises a cover plate, the cover plate is provided with a heat exchange cavity groove and a pair of cover plate through holes communicated with the heat exchange cavity groove, and the periphery of the heat exchange cavity groove is provided with a cold plate positioning groove; the heat dissipation cold plate abuts against the cold plate positioning groove, a heat exchange cavity is formed by the space between the heat dissipation cold plate and the heat exchange cavity groove, and a heat dissipation enhancing structure is arranged on the side wall, located in the heat exchange cavity, of the heat dissipation cold plate; and the pair of joints is respectively connected with the pair of cover plate through holes and is used for connecting the heat exchange cavity with an external circulating pipeline. According to the utility model, the heat radiator cover plate can be connected with the heat radiation cold plate and the chip substrate at the same time, so that the plane fitting degree of the bottom surface of the heat radiation cold plate and the chip integrated heat radiation top cover can be improved; the heat dissipation enhancing structure can effectively enhance the heat exchange process and improve the heat transfer coefficient of the heat dissipation device.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, specifically to a phase change chip heat sink. Background Technology

[0002] With the rapid development of microelectronics technology, chip integration is constantly increasing and chip size is getting smaller. This leads to a significant increase in the heat generated by the chip core and the accumulation of heat due to stacking, resulting in a sharp increase in the chip's heat flux density. Chip performance is highly sensitive to operating temperature, making thermal management design increasingly important. To ensure stable chip operation and lifespan, the heat dissipation performance of the heat sink is crucial.

[0003] Common heat sinks can be categorized into various types based on their heat dissipation methods, including air cooling, heat pipe heat sinks, liquid cooling, and semiconductor refrigeration. With the continuous increase in heat flux density of electronic devices, traditional air cooling and liquid cooling methods are no longer sufficient to meet the demands for efficient heat dissipation. Phase change liquid heat sinks have attracted considerable attention due to their compact design. Especially during the phase change process of the liquid flow, they can absorb a large amount of latent heat of vaporization, thereby providing a higher heat transfer coefficient and superior heat dissipation performance, far exceeding traditional heat dissipation solutions.

[0004] Working at the microscale involves complex physical phenomena, such as surface tension effects and bubble behavior, which increases design complexity. Conventional phase-change cooling devices suffer from limitations in structural design, including limited heat dissipation, poor surface temperature uniformity, and inability to sustain high-power cooling, making them unsuitable for the heat dissipation requirements of high heat flux density chips. Therefore, designing novel and efficient two-phase cooling chip heat sinks is a common concern for those skilled in the art. Utility Model Content

[0005] The purpose of this invention is to overcome at least one of the defects of the prior art and provide a phase change chip heat sink.

[0006] The objective of this utility model can be achieved through the following technical solutions:

[0007] A phase-change chip heat sink, comprising:

[0008] The cover plate has a heat exchange cavity groove and a pair of cover plate through holes communicating with the heat exchange cavity groove. The heat exchange cavity groove has a cold plate positioning groove around its periphery.

[0009] A heat dissipation plate abuts against a positioning groove on a cold plate. The space between the heat dissipation plate and the groove of the heat exchange cavity forms a heat exchange cavity. The side wall of the heat dissipation plate inside the heat exchange cavity is provided with a heat dissipation enhancement structure.

[0010] A pair of connectors, which are respectively connected to the pair of through holes in the cover plate, are used to connect the heat exchange chamber to the external circulation pipeline.

[0011] Furthermore, the cover plate and the heat dissipation plate are connected by welding or screws, and the pair of joints are respectively connected to the pair of through holes in the cover plate by welding or screws.

[0012] Furthermore, the heat dissipation enhancement structure includes multiple microstructure ribs arrayed on the heat dissipation plate; the array arrangement of the multiple microstructure ribs is either a straight array arrangement or an interleaved array arrangement.

[0013] Furthermore, the shape of the microstructure rib is selected from one or more of the following: rectangular cross-section prism, rectangular cross-section cone, rectangular cross-section frustum, trapezoidal prism, trapezoidal cone, trapezoidal frustum, parallelogram prism, parallelogram cone, parallelogram frustum, triangular prism, triangular cone, triangular frustum, circular prism, circular cone, circular frustum, elliptical prism, elliptical cone, elliptical frustum, hemispherical or umbrella-shaped.

[0014] Furthermore, when the microstructure ribs are umbrella-shaped, they include a root and a head arranged from the inside out on the heat dissipation plate;

[0015] The root and the head structures may be the same or different, and are selected from one or more shapes such as rectangular cross-section prism, rectangular cross-section cone, rectangular cross-section frustum, trapezoidal prism, trapezoidal cone, trapezoidal frustum, parallelogram prism, parallelogram cone, parallelogram frustum, triangular prism, triangular cone, triangular frustum, circular prism, circular cone, circular frustum, elliptical prism, elliptical cone, elliptical frustum, and hemispherical.

[0016] Furthermore, the circumcenters of the horizontal projection contours of the root and the head coincide or are misaligned. The radius of the circumcircle of the horizontal projection contour of the root is denoted as R1, and the radius of the circumcircle of the horizontal projection contour of the head is denoted as R2. The ratio of R1 to R2 is 0.1 to 10. When the root and the head are misaligned, the misalignment distance is less than or equal to the sum of R1 and R2.

[0017] Furthermore, when the microstructure ribs are umbrella-shaped, their root periphery is covered with interstitial capillary structures.

[0018] Furthermore, the microstructure rib is a solid rib covered with a rib capillary structure, and the thickness of the rib capillary structure accounts for 0% to 100% of the total thickness of the microstructure rib.

[0019] When the thickness of the capillary structure of the rib column is 0%, the microstructure rib column is a completely solid rib column; when the thickness of the capillary structure of the rib column is 100%, the microstructure rib column is composed of a completely porous capillary structure.

[0020] Furthermore, the sidewall of the area where the heat dissipation plate is located within the heat exchange cavity is also covered with a bottom capillary structure; when the thickness of the bottom capillary structure is 0, the sidewall is a smooth metal surface.

[0021] Furthermore, the thickness of the capillary structure at different locations or in different regions is adjusted non-uniformly according to design requirements.

[0022] Compared with the prior art, the present invention has the following advantages:

[0023] (1) The heat sink cold plate of this utility model serves as a connection between the heat sink cold plate and the chip substrate. Unlike the method of connecting the cold plate to the cover plate and then connecting it through the fixed base, this design reduces the assembly steps and is more conducive to improving the flatness of the bottom surface of the heat sink cold plate and the chip integrated heat sink top cover.

[0024] (2) The umbrella-shaped ribs of this utility model have a large surface area, which can increase the heat dissipation area. The abrupt expansion of the umbrella-shaped structure helps to enhance the turbulence effect of the fluid and improve the dispersion of bubbles. The ribs create a complex flow path during the fluid flow process, making it difficult for bubbles to form large aggregates in the fluid, thereby reducing the bubble detachment diameter and increasing the bubble detachment speed.

[0025] (3) The height ratio of the microstructure ribs to the heat exchange cavity in this invention is 0 to 1, which means that the height of the ribs can be increased from none to fill the longitudinal space of the heat exchange cavity. High ribs are suitable for increasing surface area and turbulence effect, but are prone to causing flow resistance and bubble retention; low ribs can reduce resistance but the heat exchange area is limited, and they have a lower pressure drop in high flow rate heat dissipation systems. Ribs of different heights can better cope with different heat dissipation scenarios.

[0026] (4) The porous capillary structure of this utility model increases the area and path of liquid flow on the surface of the cold plate and the liquid supply, making the phase change heat dissipation technology more efficient and improving the overall performance of the heat sink. Attached Figure Description

[0027] Figure 1 This is an exploded view of the overall structure of the radiator according to an embodiment of the present invention;

[0028] Figure 2 This is a schematic diagram of the assembly structure of the cover plate and the heat dissipation connector according to an embodiment of the present utility model;

[0029] Figure 3This is a schematic diagram of the cover plate according to an embodiment of the present utility model;

[0030] Figure 4 This is another structural schematic diagram of the cover plate according to an embodiment of the present utility model;

[0031] Figure 5 This is a schematic diagram of the heat dissipation plate according to an embodiment of the present utility model;

[0032] Figure 6 This is another structural schematic diagram of the heat dissipation cold plate according to an embodiment of the present utility model;

[0033] Figure 7 This is a schematic diagram of the structure of the sealing gasket according to an embodiment of the present invention;

[0034] Figure 8 This is a schematic diagram of the structure of the radiator connector according to the welding method of this utility model embodiment;

[0035] Figure 9 This is a structural schematic diagram of the rib column shape features of an embodiment of the present utility model;

[0036] Figure 10 This is a schematic diagram of the structure of the umbrella-shaped rib column with overlapping and misaligned centers of gravity according to an embodiment of the present utility model.

[0037] Figure 11 This is a schematic diagram of the structure of two types of ribs covered by the porous capillary structure according to an embodiment of the present invention.

[0038] Figure 12 This is a schematic diagram of the heat dissipation structure of the overall welding method in an embodiment of this utility model;

[0039] Figure 13 This is a cross-sectional view of the heat dissipation structure of the overall welding method according to an embodiment of this utility model;

[0040] Marked in the image:

[0041] 1-Cooling plate; 11-Microstructure ribs; 12-Bottom surface of ribs; 13-Screw holes in the cooling plate; 14-Bottom surface of the cooling plate; 111-Capillary structure of ribs; 112-Gap capillary structure; 121-Capillary structure of bottom surface;

[0042] 2-Cover plate; 21-Fastener connection hole; 22-Fastener positioning hole; 23-Cover plate through hole; 24-Heat exchange chamber groove; 25-Gasket positioning groove; 26-Cover plate screw hole; 27-Cold plate positioning groove; 28-Cover plate bottom surface;

[0043] 3-Connector; 31-Connection structure; 32-Mounting structure;

[0044] 4-Sealing gasket; 41-Gasket through hole;

[0045] 5-Connecting screws. Detailed Implementation

[0046] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. These embodiments are implemented based on the technical solution of the present invention, providing detailed implementation methods and specific operating procedures. However, the scope of protection of the present invention is not limited to the following embodiments.

[0047] This utility model provides a phase-change chip heat sink, comprising:

[0048] Cover plate 2, the cover plate 2 is provided with heat exchange cavity groove 24 and a pair of cover plate through holes 23 communicating with the heat exchange cavity groove 24, and the heat exchange cavity groove 24 is provided with cold plate positioning groove 27 around its periphery;

[0049] The heat dissipation plate 1 abuts against the cold plate positioning groove 27. The space between the heat dissipation plate 1 and the heat exchange cavity groove 24 forms a heat exchange cavity. The side wall of the heat dissipation plate 1 in the heat exchange cavity is provided with a heat dissipation enhancement structure.

[0050] A pair of connectors 3 are respectively connected to the pair of cover plate through holes 23 for connecting the heat exchange chamber to the external circulation pipeline.

[0051] In some embodiments of this utility model, the heat dissipation plate 1 and the cover plate 2 are embedded at the bottom and connected by welding or screws. The bottom surface of the heat dissipation plate 1 is attached to the chip integrated heat dissipation top cover. The upper surface of the heat dissipation plate 1 is provided with microstructure ribs 11 and rib bottom surfaces 12 covered with a certain capillary structure.

[0052] The cover plate 2 is connected to the chip substrate by screws or fasteners. The bottom surface 28 of the cover plate is provided with a heat exchange cavity groove 24. The periphery of the heat exchange cavity groove 24 is provided with a cold plate positioning groove 27. The heat exchange cavity groove 24 and the cold plate positioning groove 27 form a first-level stepped structure to fit with the heat dissipation cold plate 1. The heat exchange cavity groove 24, the surface 11 of the microstructure rib and the bottom surface 12 of the rib combine to form a heat exchange cavity. The top surface of the cover plate is provided with a cover plate through hole 23 to connect the heat exchange cavity groove.

[0053] The connector 3 is installed in the through hole 23 of the cover plate and connected to the cover plate 2 by welding or threading. The connector 3 connects the external circulation pipeline and the heat exchange chamber.

[0054] In some embodiments of this utility model, when the connection between the heat dissipation plate 1 and the cover plate 2 is by welding, the contact surfaces of the heat dissipation plate 1 and the cover plate 2 are filled with solder, and the sealing and connection between the heat dissipation plate 1 and the cover plate 2 are achieved by welding.

[0055] In some embodiments of this utility model, when the connection between the heat dissipation plate 1 and the cover plate 2 is by screws, a sealing gasket is provided between the heat dissipation plate 1 and the cover plate 2, and a sealing connection is achieved by connecting screws 5; the cover plate 2 has a gasket positioning groove 25 between the heat exchange chamber groove 24 and the cold plate positioning groove 27 to form a two-stage stepped structure; the surface of the gasket positioning groove 25 has evenly distributed cover plate screw holes 26; the periphery of the heat dissipation plate 1 has cold plate screw holes 13 corresponding to the cover plate screw holes 26; the sealing gasket 4 is installed in the gasket positioning groove 25 to achieve the sealing between the heat dissipation plate 1 and the cover plate 2, and the sealing gasket 4 has a gasket through hole to avoid the connecting screws 5, and the connecting screws 5 achieve the connection between the heat dissipation plate 1 and the cover plate 2.

[0056] Understandably, welding methods include fusion welding, brazing, and diffusion welding. Taking brazing as an example, brazing fills the joint gap with molten solder to form a continuous and dense metal bonding layer, avoiding microcracks or porosity that may occur in traditional welding, and ensuring that the cold head maintains a tight seal under high pressure or high frequency thermal cycling. Screw or threaded connections allow for non-destructive disassembly and assembly, facilitating regular cleaning, replacement of sealing rings, or maintenance of internal flow channels, avoiding the high cost of replacing the entire weld. The choice between the two connection methods depends on the actual needs.

[0057] In some embodiments of this utility model, when the connector 3 is installed with the cover plate by welding, the connector 3 is manufactured by a custom process, the through holes 23 of the cover plate are all smooth holes, the connector 3 is provided with a connector structure 31 and an installation structure 32 for realizing pipeline connection and connector installation respectively, and the contact surfaces of the connector 3 and the cover plate 2 are filled with solder to achieve sealing and connection.

[0058] In some embodiments of this utility model, when the connector 3 is installed with the cover plate by means of threads, the through holes 23 of the cover plate are all threaded holes, and the connector 3 is selected from one of the following: a standard threaded quick-connect water-stop connector, a pagoda connector, a ferrule connector, or a quick-tight connector.

[0059] In some embodiments of this utility model, the microstructure ribs 11 are arranged in a straight line or staggered pattern; the coverage size of the microstructure ribs 11 is greater than or equal to the size of the chip's integrated heat dissipation top cover.

[0060] In some embodiments of this utility model, the heat dissipation enhancement structure includes a plurality of microstructure ribs 11 arrayed on the heat dissipation plate 1; the array arrangement of the plurality of microstructure ribs 11 is a straight array arrangement or an interleaved array arrangement.

[0061] In some embodiments of this utility model, the shape of the microstructure rib 11 is selected from one of the following, depending on the applicable situation: rectangular cross-section prism, rectangular cross-section cone, rectangular cross-section frustum, trapezoidal prism, trapezoidal cone, trapezoidal frustum, parallelogram prism, parallelogram cone, parallelogram frustum, triangular prism, triangular cone, triangular frustum, circular prism, circular cone, circular frustum, elliptical prism, elliptical cone, elliptical frustum, hemispherical or umbrella-shaped.

[0062] In some embodiments of this utility model, when the microstructure rib 11 is umbrella-shaped, it includes a root and a head arranged from the inside out on the heat dissipation plate 1.

[0063] The root and head structures may be the same or different, and are selected from one or more shapes such as rectangular cross-section prisms, rectangular cross-section cones, rectangular cross-section frustums, trapezoidal prisms, trapezoidal cones, trapezoidal frustums, parallelogram prisms, parallelogram cones, parallelogram frustums, triangular prisms, triangular cones, triangular frustums, circular prisms, circular cones, circular frustums, elliptical prisms, elliptical cones, elliptical frustums, and hemispherical shapes. It is understood that umbrella-shaped ribs, compared to ordinary circular or rectangular ribs, increase the contact area between the ribs and the fluid, significantly improving the convective heat transfer coefficient. The abrupt expansion structure at the top or bottom of the umbrella shape can enhance the turbulence effect and disrupt the fluid boundary layer.

[0064] In some embodiments of this utility model, the circumcenters of the horizontal projection contours of the root and the head coincide or are misaligned. The circumradius of the horizontal projection contour of the root is denoted as R1, and the circumradius of the horizontal projection contour of the head is denoted as R2. The ratio of R1 to R2 is 0.1 to 10. When the root and the head are misaligned, the misalignment distance is less than or equal to the sum of R1 and R2.

[0065] In some embodiments of this utility model, when the microstructure rib 11 is umbrella-shaped, its root periphery is covered with a gap capillary structure 112.

[0066] In some embodiments of this utility model, the height ratio of the microstructure rib 11 to the heat exchange cavity is 0 to 1.

[0067] In some embodiments of this utility model, the microstructure rib 11 is a solid rib covered with rib capillary structure 111, and the thickness of the rib capillary structure 111 accounts for 0% to 100% of the total thickness of the microstructure rib 11.

[0068] When the thickness of the capillary structure 111 is 0%, the microstructure rib 11 is a completely solid rib; when the thickness of the capillary structure 111 is 100%, the microstructure rib 11 is composed of a completely porous capillary structure.

[0069] In some embodiments of this utility model, the sidewall of the heat dissipation plate 1 located in the heat exchange cavity is also covered with a bottom capillary structure 121; when the thickness of the bottom capillary structure 121 is 0, the sidewall is a smooth metal surface.

[0070] In some embodiments of this utility model, the rib capillary structure 111, the gap capillary structure 112, and the bottom capillary structure 121 are all porous capillary structures. The porous capillary structure is constructed using a method selected from metal powder sintering, metal wire sintering, or a mixed sintering method of metal powder and metal wire. The thickness of the porous capillary structure at different locations or regions is non-uniformly adjusted according to design requirements. It is understood that the addition of a porous capillary structure can significantly increase the surface area of ​​the cold plate, helping to enhance heat conduction and dispersion, promote uniform liquid distribution, and facilitate more efficient evaporation and condensation processes on the surface of the cold plate. Furthermore, the capillary structure can help the coolant be rapidly drawn in and distributed through capillary action, ensuring the uniformity of the coolant in the radiator, reducing localized drying of the liquid, and improving the stability of the heat dissipation system.

[0071] In some embodiments of this utility model, the materials of the heat dissipation plate 1, the cover plate 2 and the connector 3 are selected from one of copper, aluminum, aluminum alloy, stainless steel, aluminum nitride, silicon carbide, gallium nitride, plastic, ceramic or glass; the sealing gasket 4 is selected from one of rubber, silicone, fluororubber or plastic.

[0072] In some embodiments of this utility model, the cooling medium of the chip heat sink is selected from one or more mixtures of water, alcohols, ammonia, hydrocarbons, refrigerants, mineral oil, transformer oil, or fluorinated liquid.

[0073] The basic operating principle of the chip heat sink in this invention is as follows: a low-temperature cooling medium enters the heat exchange cavity composed of a heat dissipation plate 1 and a cover plate 2 through one side connector 3, where it undergoes boiling heat exchange, carrying away the heat conducted from the high-temperature chip to the microchannel cold plate, and is discharged to the external circulation pipeline through the other side connector 3. It is understood that the chip is a high-power semiconductor device, and this invention does not limit the type of chip. For example, the chip may be a CPU chip, a GPU chip, or a laser chip.

[0074] Example 1

[0075] Please see Figures 1 to 8As shown, this embodiment provides a phase change chip heat sink, including a heat dissipation plate 1, a cover plate 2, and a connector 3;

[0076] The heat dissipation plate 1 is embedded in the bottom of the cover plate 2 and connected by welding. The bottom surface 14 of the heat dissipation plate is attached to the chip integrated heat dissipation top cover. The upper surface of the heat dissipation plate 1 is provided with microstructure ribs 11 and rib bottoms 12 covered with a certain capillary structure.

[0077] The cover plate 2 is connected to the chip substrate via fasteners. The cover plate 2 has fastener mounting holes 21 and fastener positioning holes 22. The bottom surface 28 of the cover plate has a heat exchange cavity groove 24. The periphery of the heat exchange cavity groove 24 has a cold plate positioning groove 27. The heat exchange cavity groove 24 and the cold plate positioning groove 27 form a first-level stepped structure to fit with the heat dissipation cold plate 1. The heat exchange cavity groove 23, the surface of the microstructure rib 11 and the bottom surface 12 of the rib 11 are combined to form a heat exchange cavity. The top surface of the cover plate 2 has a cover plate through hole 23 to connect the heat exchange cavity groove 24. The fasteners used in this embodiment are common in the art, so the specific structure of the fasteners will not be described in detail here.

[0078] Connector 3 is installed in the through hole 23 of the cover plate and connected to the cover plate 2 by means of threads. Connector 3 connects the external circulation pipeline and the heat exchange chamber.

[0079] A sealing gasket 4 is provided between the heat dissipation cold plate 1 and the cover plate 2, and a sealing connection is achieved by connecting screws 5; the cover plate 2 has a gasket positioning groove 25 between the heat exchange chamber groove 24 and the cold plate positioning groove 27, forming a two-stage stepped structure; the surface of the gasket positioning groove 25 has evenly distributed cover plate screw holes 26; the periphery of the heat dissipation cold plate 1 has cold plate screw holes 13 corresponding to the cover plate screw holes 26; the sealing gasket 4 is installed in the gasket positioning groove 25 to achieve the sealing between the heat dissipation cold plate 1 and the cover plate 2, and the sealing gasket 4 has a gasket through hole 41 to avoid the connecting screws 5, and the connecting screws 5 achieve the connection between the heat dissipation cold plate 1 and the cover plate 2.

[0080] The cover plate through holes 23 are all threaded holes, and the connector 3 is selected from one of the following: standard threaded quick-stop connector, pagoda connector, ferrule connector, and quick-tight connector.

[0081] The microstructure ribs 11 are arranged in a straight line or staggered pattern; the coverage size of the microstructure ribs 11 is greater than or equal to the size of the chip's integrated heat dissipation top cover.

[0082] Please see Figures 9 to 11 The shape of the microstructure rib 11 shown is selected from, depending on the application, a rectangular cross-section prism, a rectangular cross-section pyramid, a rectangular cross-section frustum, a trapezoidal prism, a trapezoidal pyramid, a trapezoidal frustum, a parallelogram prism, a parallelogram pyramid, a parallelogram frustum, a triangular prism, a triangular pyramid, a triangular frustum, a circular prism, a circular pyramid, a circular frustum, an elliptical prism, an elliptical pyramid, an elliptical frustum, a hemispherical shape, or an umbrella shape.

[0083] When the shape of the microstructure rib 11 is umbrella-shaped, the umbrella structure is divided into two parts: a head structure and a root structure. The head structure and the root structure can be the same or different, and both are selected from one or more shapes such as rectangular cross-section prism, rectangular cross-section cone, rectangular cross-section frustum, trapezoidal prism, trapezoidal cone, trapezoidal frustum, parallelogram prism, parallelogram cone, parallelogram frustum, triangular prism, triangular cone, triangular frustum, circular prism, circular cone, circular frustum, elliptical prism, elliptical cone, elliptical frustum, and hemispherical.

[0084] The circumcenters of the horizontal projection contours of the root structure and the head structure of the umbrella-shaped structure can be aligned or misaligned according to design requirements. R1 is defined as the circumradius of the horizontal projection contour of the root structure, and R2 is defined as the circumradius of the horizontal projection contour of the head structure. When the root and head are misaligned, the misalignment distance is less than or equal to the sum of R1 and R2. The ratio of the circumradius R1 of the root structure to the circumradius R2 of the head structure is 0.1 to 10. The height ratio of the root structure to the head structure can be adjusted to any value according to design requirements.

[0085] The height ratio of the microstructure rib 11 to the heat exchange cavity is 0 to 1.

[0086] The microstructure rib 11 is a solid rib covering the capillary structure 111. The thickness of the capillary structure 111 accounts for 0% to 100% of the total thickness of the microstructure rib 11. When the thickness of the capillary structure 111 is 0%, the microstructure rib 11 is a completely solid rib. When the thickness of the capillary structure 111 is 100%, the microstructure rib 11 is composed of a completely porous capillary structure.

[0087] When the shape of the microstructure rib 11 is umbrella-shaped, an additional layer of interstitial capillary structure 112 covers the root structure.

[0088] The bottom surface 12 of the rib is covered with a bottom capillary structure 121; when the thickness of the bottom capillary structure 121 is zero, the bottom surface 12 of the rib is a smooth metal surface.

[0089] The rib capillary structure 111, the interstitial capillary structure 112, and the bottom capillary structure 121 are all porous capillary structures. The porous capillary structure is constructed by one of the following methods: metal powder sintering, metal wire sintering, or a mixture of metal powder and metal wire sintering. The thickness of the porous capillary structure at different positions or in different regions is non-uniformly adjusted according to design requirements.

[0090] The heat dissipation plate 1, cover plate 2 and connector 3 are made of copper, aluminum, aluminum alloy, stainless steel, aluminum nitride, silicon carbide, gallium nitride, plastic, ceramic or glass; the sealing gasket 4 is made of rubber, silicone, fluororubber or plastic.

[0091] The cooling medium for the chip heat sink is selected from one or more mixtures of water, alcohols, ammonia, hydrocarbons, refrigerants, mineral oil, transformer oil, or fluorinated liquids.

[0092] The basic application principle of the chip heat sink is as follows: the low-temperature cooling medium enters the heat exchange cavity composed of the heat dissipation cold plate 1 and the cover plate 2 through one side connector 1 and undergoes boiling heat exchange, which takes away the heat conducted from the high-temperature chip to the microchannel cold plate 1, and is discharged to the external circulation pipeline through the other side connector 1.

[0093] Example 2

[0094] Please see Figure 12-13 As shown, the difference between this embodiment and embodiment 1 is that the connection between the connector 3 and the cover plate 2 is a welding connection, and the connection between the heat dissipation plate 1 and the cover plate 2 is also a welding connection. The purpose of this is to simplify the heat sink structure and improve the reliability of the connection between the components. The heat dissipation plate 1, the cover plate 2 and the connector 3 can be fully integrated by a single vacuum welding or protective atmosphere welding.

[0095] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of this utility model without departing from its technical solution shall still fall within the protection scope of this utility model.

Claims

1. A phase-change chip heat sink, characterized in that, include: Cover plate (2), the cover plate (2) is provided with heat exchange cavity groove (24) and a pair of cover plate through holes (23) communicating with the heat exchange cavity groove (24), and the heat exchange cavity groove (24) is provided with cold plate positioning groove (27) around its periphery; A heat dissipation plate (1) abuts against the cold plate positioning groove (27). The space between the heat dissipation plate (1) and the heat exchange cavity groove (24) forms a heat exchange cavity. The side wall of the heat dissipation plate (1) in the heat exchange cavity is provided with a heat dissipation enhancement structure. A pair of connectors (3) are connected to the pair of cover plate through holes (23) respectively, for connecting the heat exchange chamber to the external circulation pipeline.

2. The phase-change chip heat sink according to claim 1, characterized in that, The heat dissipation enhancement structure includes multiple microstructure ribs (11) arrayed on the heat dissipation plate (1); the array arrangement of the multiple microstructure ribs (11) is either a straight array arrangement or an interleaved array arrangement.

3. A phase-change chip heat sink according to claim 2, characterized in that, The shape of the microstructure rib (11) is selected from one or more of the following: rectangular cross-section prism, rectangular cross-section cone, rectangular cross-section frustum, trapezoidal prism, trapezoidal cone, trapezoidal frustum, parallelogram prism, parallelogram cone, parallelogram frustum, triangular prism, triangular cone, triangular frustum, circular prism, circular cone, circular frustum, elliptical prism, elliptical cone, elliptical frustum, hemispherical or umbrella-shaped.

4. A phase-change chip heat sink according to claim 3, characterized in that, When the microstructure rib (11) is umbrella-shaped, it includes a root and a head arranged from the inside to the outside on the heat dissipation plate (1).

5. A phase-change chip heat sink according to claim 4, characterized in that, The root and the head structures may be the same or different, and are selected from one or more of the following: rectangular cross-section prism, rectangular cross-section cone, rectangular cross-section frustum, trapezoidal prism, trapezoidal cone, trapezoidal frustum, parallelogram prism, parallelogram cone, parallelogram frustum, triangular prism, triangular cone, triangular frustum, circular prism, circular cone, circular frustum, elliptical prism, elliptical cone, elliptical frustum, and hemisphere.

6. A phase-change chip heat sink according to claim 4, characterized in that, The circumcenters of the horizontal projection contours of the root and the head coincide or are misaligned. The radius of the circumcircle of the horizontal projection contour of the root is denoted as R1, and the radius of the circumcircle of the horizontal projection contour of the head is denoted as R2. The ratio of R1 to R2 is 0.1 to 10. When the root and the head are misaligned, the misalignment distance is less than or equal to the sum of R1 and R2.

7. A phase-change chip heat sink according to claim 4, characterized in that, When the microstructure rib (11) is umbrella-shaped, its root periphery is covered with interstitial capillary structures (112).

8. A phase-change chip heat sink according to claim 2, characterized in that, The height ratio of the microstructure rib (11) to the heat exchange cavity is 0 to 1.

9. A phase-change chip heat sink according to claim 2, characterized in that, The microstructure rib (11) is a solid rib covered with rib capillary structure (111), and the thickness of the rib capillary structure (111) accounts for 0% to 100% of the total thickness of the microstructure rib (11). When the thickness of the capillary structure (111) is 0%, the microstructure rib (11) is a completely solid rib; when the thickness of the capillary structure (111) is 100%, the microstructure rib (11) is a completely porous capillary structure.

10. A phase-change chip heat sink according to claim 1, characterized in that, The sidewall of the heat dissipation plate (1) located in the heat exchange cavity is also covered with a bottom capillary structure (121).

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