Glue injection sealing method and mold based on combination of multiple materials

Abstract

The invention relates to a glue injection sealing method and mold based on combination of multiple materials. The method comprises the steps that a main mold made of a first soft material with the hardness of 50-90 A is provided; a positioning pit is formed in the position, corresponding to the to-be-sealed area, of the main mold; a second soft material with the hardness of 10-50 A is applied to the positioning pit position and cured to form a local sealing reinforcing structure; the main mold and the intelligent equipment part are closed to form a sealing mold, and the local sealing reinforcing structure is attached to the step, groove or segment difference of the product; sealant is injected into the formed sealant cavity; and demolding after curing to obtain a product. Through rigid-flexible material combination, the local sealing reinforcing structure can elastically deform to fill micro gaps, and the problems of glue overflowing and poor sealing in the prior art are effectively solved. The invention further provides a mold for implementing the method. The mold comprises a main mold body made of the first soft material, the positioning pit position and the local sealing reinforcing structure made of the second soft material.

Description

Technical Field

[0001] This application belongs to the field of electronic device packaging and sealing technology, and more specifically, it relates to an injection sealing method and mold based on a combination of multiple materials. Background Technology

[0002] In the manufacturing of high-end electronic products such as smartphones and wearable devices, to achieve high screen-to-body ratios, excellent waterproof and dustproof performance, and structural reliability, overmolding or low-pressure injection molding processes are often used to seal vulnerable areas such as the edges of display modules and the bending areas of flexible circuit boards. These processes typically rely on the mold and product being closed to form a sealing cavity, into which sealing materials such as silicone, epoxy resin, or UV adhesive are injected. However, existing technologies have the following problems: The product surface often has geometric features such as steps, grooves, and differences (e.g., the height difference between the glass cover and the support frame), which can cause the mold and the product to not fit tightly, making it easy for glue to overflow at the mold gap. A single-material mold cannot simultaneously meet the requirements of overall dimensional stability and local flexible sealing. Commonly used 60A / 80A silicone materials have small deformation when a sealing force of less than 25Kg is applied (greater sealing force will cause the product module to be crushed), which cannot adapt to the step or groove structure on the OLED screen module. Soft materials are easy to deform and cannot meet the dimensional accuracy requirements, which will affect the subsequent assembly process. Although some solutions introduce contour mold structures, the ±0.15mm error when the product enters the mold directly causes the room structure to be unable to align with the steps or grooves, making it impossible to achieve reliable sealing in complex curved surfaces or tiny gaps. Another technique involves injecting glue into both sides of the bend through a dammed glue groove, but this does not solve the problem of the mold's own adaptive sealing ability for irregular structures. This method leaves glue residue on the product after injection, and the size error of the residue exceeds 1mm, which is unacceptable from an appearance point of view.

[0003] Therefore, there is an urgent need for a new sealing method that can balance dimensional accuracy and local flexibility to improve the yield of adhesive injection, reduce adhesive overflow and bubbles, and be applicable to intelligent device components with complex surface features. Summary of the Invention

[0004] The purpose of this invention is to provide a glue injection sealing method and mold based on a combination of multiple materials. By combining two soft materials with different hardnesses to form a glue injection mold, the overall structural stability is guaranteed and the local sealing adaptability is enhanced, thereby effectively solving the glue overflow problem caused by product step differences, steps or deformation in the prior art.

[0005] To achieve the above objectives, the first aspect of this application is to provide a glue injection sealing method based on a combination of multiple materials, comprising the following steps: providing a main mold, the main mold being made of a first soft material, the first soft material having a hardness of 50A to 90A; Positioning pits are provided on the main mold at positions corresponding to the areas to be sealed. A second soft material with a hardness of 10A to 50A is applied to the positioning pit and cured to form a local sealing and reinforcing structure. The main mold and the smart device component are molded together to form a sealing mold. The local sealing reinforcement structure is attached to the step, groove or stepped structure of the smart device component to form a sealing cavity in the sealing mold. Inject sealing adhesive into the sealing cavity of the sealing mold; After the sealing colloid cures, it is demolded to obtain a fully sealed product.

[0006] By adopting the above technical solution, a balance between the overall rigidity and local flexibility of the mold is achieved by combining soft materials with different hardness. This solves the problem that traditional single-material molds cannot simultaneously meet the sealing requirements of overall rigidity and local flexibility, especially the overflow phenomenon that easily occurs when dealing with intelligent device components with complex geometric features.

[0007] Optionally, the first soft material is silicone, and the main mold is prepared by injection molding. Preferably, the silicone is 80A granular silicone.

[0008] By adopting the above technical solution, silicone material can ensure the dimensional accuracy and durability of the mold through injection molding, reduce dimensional deviations in mass production, and improve the stability and consistency of production.

[0009] Optionally, the second soft material is formed on the positioning pit by dispensing, printing, pasting, or multiple injection molding, so that the local sealing reinforcement structure can adapt to different shapes of steps and groove structures.

[0010] By adopting the above technical solution and through flexible molding methods, the local sealing reinforcement structure can accurately fill various complex steps and groove structures, thereby improving the reliability and adaptability of the seal.

[0011] Optionally, the depth and contour of the positioning pit are pre-designed according to the step height and sealing path of the smart device component, and are used to limit the second soft material during the application of the second soft material to the positioning pit.

[0012] By adopting the above technical solution, the depth and contour of the positioning pit are pre-designed to ensure that the second soft material can be cured in the correct position and shape, thus avoiding the risk of sealing failure caused by positional deviation or shape mismatch.

[0013] Optionally, the sealant is at least one of UV adhesive, epoxy resin adhesive, or silicone adhesive.

[0014] Using the above technical solutions, UV adhesive, epoxy resin adhesive, or silicone adhesive all have good sealing performance. The most suitable sealing adhesive can be selected according to the specific application scenario, which improves the reliability and flexibility of sealing.

[0015] Optionally, the second soft material is moisture-curing silicone, preferably with a hardness of 30A.

[0016] Using the above technical solution, the moisture-curing adhesive has good elasticity and adaptability, and can better fill and seal complex geometric structures, thus improving the sealing effect and reliability.

[0017] Optionally, in the step of closing the main mold and the smart device component to form a sealing mold, the local sealing reinforcement structure undergoes elastic deformation under the mold closing pressure to fill the micro gaps on the surface of the smart device component.

[0018] By adopting the above technical solution, the local sealing reinforcement structure can effectively fill the micro gaps through elastic deformation, ensuring the integrity and reliability of the seal and reducing the risk of bubbles and leakage.

[0019] Compared with existing technologies, the injection sealing method based on a combination of multiple materials provided in this application constructs an innovative sealing solution by cleverly combining soft materials with different hardness characteristics. Specifically, by using a first soft material with higher hardness (50A-90A) to form the main mold and provide overall structural stability, a second soft material with lower hardness (10A-50A) is embedded in the positioning pits in key sealing areas to form a local sealing reinforcement structure, achieving a sealing effect that combines rigidity and flexibility. This combined structure overcomes the shortcomings of a single hard material in adapting to microscopic deformation, and avoids the problems of easy deformation and inaccurate positioning of a single soft material. In practical applications, this invention can effectively solve the common problems of glue overflow, insufficient glue, and air bubbles in the injection process of intelligent device components (especially areas with stepped, grooved, or stepped structures), significantly improving product sealing quality and production yield. In addition, the process of this invention is simple to implement, compatible with existing production lines, and the main mold is reusable, which has good economic benefits and industrialization prospects. Compared with existing technologies, this invention has significant improvements in sealing reliability, applicability, and production efficiency, providing an efficient and reliable glue-sealing solution for the field of intelligent equipment manufacturing.

[0020] Secondly, this application provides a mold for implementing the injection sealing method described in the first aspect, comprising: The main mold is made of a first soft material, the hardness of which is 50A to 90A. The positioning pit is located on the main mold at the position corresponding to the area to be sealed. The local sealing reinforcement structure is made of a second soft material with a hardness of 10A to 50A, and is fixed in the positioning pit.

[0021] The main mold is provided with an inlet and outlet for glue, which are connected to a sealed glue cavity formed by the main mold, the partial sealing reinforcement structure and the intelligent device components after they are molded together; Preferably, the main mold is further provided with a bearing groove, which is used to limit the edge of the intelligent device component when the mold is closed, and together with the local sealing reinforcement structure, forms a sealing line.

[0022] The beneficial effects of the mold provided in this application are: the mold has a simple and practical structure, can efficiently seal the components of intelligent devices, and has good adaptability and reliability, making it suitable for large-scale production and application. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 A schematic flowchart illustrating an adhesive sealing method based on a combination of multiple materials, provided for an embodiment of this application; Figure 2 This is a schematic diagram of the structure of the injection mold provided in the embodiments of this application; Figure 3 A schematic diagram of the external structure of a smart device component manufactured using the glue injection sealing method described in this application; Figure 4 This is a schematic diagram of the appearance of a component in a smart device. Figure 5 This is a schematic diagram of the main mold provided in an embodiment of this application.

[0025] The following are the labeling elements in the figure: 100. Smart device components; 110. OLED screen stepped joint; 120. Watch front cover glass; 200. Sealing colloid; 210. Sealing line; 300. Main mold; 310. Positioning pit; 320. Partial sealing reinforcement structure; 400. Bearing groove; 500. Inlet and outlet of glue. Detailed Implementation

[0026] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0027] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0028] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0029] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0030] In the current technology, overmolding technology is widely used in the smart device and wearable device manufacturing industry to achieve better waterproof and dustproof performance, larger display area, and improved reliability. Existing technologies typically use a single-material silicone mold directly molded to the smart device component. Due to structural features such as steps and grooves on the product surface, a complete seal cannot be achieved between the silicone mold and the product. This causes the sealant to easily overflow from the gaps during the adhesive injection process, resulting in excess adhesive. To solve this problem, existing technologies often pre-apply liquid adhesive to the steps of the product as a sealing aid. However, due to the limitations of the dispensing process and the randomness of adhesive flow, the liquid adhesive may be squeezed outside the silicone mold during the extrusion process between the product and the silicone mold, resulting in excess adhesive, or it may flow to other places, failing to achieve a proper seal. This uncontrollability leads to low production yield, unstable quality, and difficulty in achieving automated mass production.

[0031] Based on this, this application provides a method for constructing an injection mold by combining two soft materials with different hardnesses, thus solving the aforementioned technical problems. Please refer to [link / reference]. Figure 1 The specific technical steps are as follows: S1. Preparation of main mold: A main mold is provided, which is made of a first soft material with a hardness of 50A to 90A, preferably silicone material, and is prepared by injection molding.

[0032] S2. Positioning pit design: Positioning pits are set on the main mold at the positions corresponding to the areas to be sealed. The depth and contour of the positioning pits are pre-designed according to the step height of the intelligent device components and the sealing path.

[0033] S3. Local sealing and reinforcement structure forming: A second soft material is applied to the positioning pit. The hardness of the second soft material is 10A to 50A, preferably a moisture-curing adhesive, and then cured to form a local sealing and reinforcement structure.

[0034] S4. Mold closing to form a sealing mold: The main mold and the smart device component are closed to form a sealing mold, and the local sealing reinforcement structure is attached to the step, groove or step structure of the smart device component to form a sealing cavity in the sealing mold.

[0035] S5. Injection and Curing: Inject sealing adhesive into the sealing cavity of the sealing mold. The sealing adhesive may be at least one of UV adhesive, epoxy resin adhesive, or silicone adhesive. Curing is completed by heating, light exposure, or natural curing according to the material characteristics.

[0036] S6. Demolding to obtain the finished product: After the sealing colloid has cured, it is demolded to obtain a sealed product.

[0037] Compared to existing technologies, this application provides a combination of two soft materials with different hardness levels, which maintains the overall structural stability of the main mold, while the local sealing reinforcement structure can adapt to the microscopic unevenness of the product surface, especially providing additional sealing capabilities in difficult-to-seal areas such as steps and grooves. The design of the positioning pits ensures the accurate positioning and effective limitation of the local sealing reinforcement structure, avoiding the problem of uncontrollable liquid adhesive flow in traditional processes.

[0038] The technical solutions adopted in this application will be further explained below with reference to specific embodiments.

[0039] Example 1: A sealing method based on a combination of silicone and moisture-curing adhesive Master mold preparation: like Figure 2 As shown, silicone material with a hardness of 70A is injection molded into the main mold 300 using an injection molding process. This main mold 1 is designed with a cavity that matches the product contour, and its bottom has inlet and outlet gates. During the injection molding process, the temperature is set at 170°C, the injection pressure is 80MPa, and the holding time is 45 seconds to ensure that the main mold has accurate dimensions and good surface quality.

[0040] Location pit design: Positioning recesses 310 are pre-designed and formed at the corresponding sealing area of ​​the main mold. The depth and contour of these positioning recesses 310 are precisely designed according to the step height (e.g., 0.5 mm) of the smart device components and the sealing path. Figure 1 As shown, the cross-section of the positioning pit is trapezoidal, with a bottom width of 0.3mm, a top width of 0.5mm, and a depth of 0.5mm. This design is beneficial for the positioning of the second soft material and the stress dispersion after curing.

[0041] Local sealing and reinforcement structure forming: like Figure 2 As shown, a dispensing process is used to apply moisture-curing adhesive (hardness 30A) to the positioning pits, which is then left to cure for 12 hours, forming a localized sealing and reinforcing structure 320. During the dispensing process, the amount of adhesive is controlled using precision dispensing equipment to ensure that the moisture-curing adhesive completely fills the positioning pits and protrudes slightly from the surface of the main mold by approximately 0.1mm. Figure 2 As shown, this helps to generate sufficient sealing pressure during the mold closing process.

[0042] Mold closing and injection molding: The main mold with the local sealing reinforcement structure is closed with the intelligent device component. During the mold closing process, the local sealing reinforcement structure undergoes elastic deformation under pressure, completely fitting the product step. At this point, a complete sealing cavity is formed between the main mold, the local sealing reinforcement structure, and the intelligent device component. Then, a vacuum of 99.9% is applied, and thermosetting adhesive (sealing adhesive 200) is injected into the sealing cavity through the injection port under vacuum. The amount of adhesive injected is based on the amount of adhesive overflowing from the injection port, ensuring that the cavity is completely filled.

[0043] Curing and demolding: After vacuuming, the adhesive was heated at 60°C for 45 minutes to cure. Once cured, the product was removed from the mold. The sealant completely filled the product edges, with no excess adhesive or air bubbles, and the sealing effect at the interface between the localized sealing reinforcement structure and the product steps was excellent. Inspection revealed that the combination of the silicone main mold and the moisture-curing adhesive forming the localized sealing reinforcement structure was in good condition, with no separation observed.

[0044] Mold maintenance and reuse: After producing 50 products, an inspection of the mold revealed slight wear on the surface of the main mold and minor deformation of the local sealing reinforcement structure. In this case, simply reapply moisture-curing adhesive to the positioning slots and allow it to cure before reuse. In this way, the same main mold can be reused approximately 150 times, significantly extending its lifespan.

[0045] Example 2: Glue Sealing Method Based on 3D Printing Technology Master mold preparation: The main mold was formed using injection molding, with silicone material of hardness 60A. The injection parameters were set as follows: temperature 165°C, pressure 70MPa, and holding time 40 seconds. After completion, the main mold underwent precision testing to ensure its dimensional tolerances were controlled within ±0.02mm.

[0046] Location pit design: In the corresponding sealing area of ​​the main mold, a positioning pit with a depth of 0.3mm and a contour matching the product step is designed. In this embodiment, the positioning pit adopts a U-shaped cross-section design with a bottom radius of 0.1mm. This design is beneficial for the precise molding of 3D printing materials and subsequent elastic deformation.

[0047] Local sealing and reinforcement structure forming: Using high-precision 3D printing equipment, moisture-curing adhesive (hardness 25A) was directly printed into the positioning pits, with a layer thickness of 0.15mm and a printing speed of 15mm / s. After printing, it was left to cure at 25°C and 50% relative humidity for 24 hours to form a locally sealed and reinforced structure. 3D printing technology enables the precise replication of complex geometries for locally sealed and reinforced structures, making it particularly suitable for sealing areas with irregular contours.

[0048] Mold closing and injection molding: The main mold with the localized sealing reinforcement structure is then closed with the smart device component. The closing force is set to 12 kg, allowing the localized sealing reinforcement structure to deform moderately and fit perfectly against the product step. UV-curable adhesive is injected into the sealant cavity at a controlled injection rate of 2 mL / min to minimize air bubbles. After injection, the adhesive is irradiated with a 365 nm wavelength UV light source for 30 seconds to allow for initial curing.

[0049] Curing and demolding: After initial UV curing, the product is further cured at 60°C for 1 hour to ensure complete curing of the colloid. The cross-section of the demolded product shows a tight bond between the sealing colloid and the product surface, with no excess adhesive or air bubbles, demonstrating excellent sealing performance. The locally reinforced sealing structure formed through 3D printing technology maintains good shape stability even after multiple uses, making it suitable for small-batch, high-precision production needs.

[0050] Example 3: Sealing Application Based on Smartwatch Display Module To further verify the applicability of this application in typical consumer electronics products, a sealing test was conducted on a circular smartwatch front cover module.

[0051] Master mold preparation: Using injection molding, silicone material with a hardness of 85A is injection molded into the main mold 300. The injection temperature is set at 175°C, the pressure at 90MPa, and the holding time at 50 seconds. The main mold 300 is designed with a circular cavity, the inner diameter of which matches the outer diameter of the watch display module, with a tolerance controlled within ±0.015mm. In addition, a bearing groove 400 is provided on the main mold 300 to limit the edge of the product when the mold is closed, ensuring that it does not shift during the sealing process.

[0052] Location pit design: like Figure 5As shown, an annular locating recess 310 with a depth of 0.45 mm and a width of 0.6 mm is pre-designed and machined at the location of the area to be sealed on the main mold 300. The inner side of this locating recess 310 has a 0.2 mm raised structure to provide additional sealing pressure during mold closing. The depth and contour of the locating recess 310 are pre-designed based on the step height and sealing path of the smart device components (such as the OLED screen stepped structure 110) to ensure that the local sealing reinforcement structure can precisely conform to complex geometries.

[0053] Local sealing and reinforcement structure forming: Using precision dispensing equipment, moisture-curing silicone with a hardness of 30A is injected into the positioning pit 310, and the amount of silicone is controlled so that it protrudes slightly from the surface of the main mold by about 0.1mm. After standing for 12 hours, the moisture-curing silicone is completely cured, forming a local sealing and reinforcing structure 320, which is tightly bonded to the substrate of the main mold 300.

[0054] Mold preparation: like Figure 4 The diagram shows the appearance of the smartwatch display module before the sealing process. The smart device component 100 is clearly visible, including the OLED screen 110, the watch front cover glass 120, and their associated bezel structure. These components constitute the key areas requiring sealing, particularly the stepped structure 110 between the OLED screen 110 and the bezel, which is both the focus and the challenge in sealing.

[0055] Mold closing and injection molding: The smart device component 100 is placed into the main mold 300, and the mold closing pressure is set to 10 kg. Under this pressure, the local sealing reinforcement structure 320 undergoes elastic deformation, tightly fitting the microscopic gap between the OLED screen stepped structure 110 and the frame; simultaneously, the bearing groove 400 reliably limits the product edge, preventing displacement. Subsequently, under a vacuum of 99.5%, epoxy resin adhesive (sealant 200) is injected through the inlet / outlet 500 at a rate of 1.5 mL / min until the adhesive steadily overflows from the inlet / outlet 500, indicating that the sealant cavity has been completely filled.

[0056] Curing and demolding: After devastating, heat at 60°C for 45 minutes to cure. After curing, demold to obtain the desired result. Figure 3 The finished product shown. (From...) Figure 3 As can be seen, the sealant 200 is evenly coated on the entire edge of the product, with a clean appearance and no residue or excess adhesive.

[0057] Mold maintenance: After producing 80 units continuously, the local sealing reinforcement structure 320 exhibited slight permanent compression deformation. At this point, simply removing the old adhesive and reapplying moisture-curing silicone to the positioning pits 310 and allowing it to cure will restore the mold's sealing performance. The main mold 300 itself showed no significant wear and is expected to be reused more than 150 times.

[0058] To verify the technical effectiveness of this invention, we conducted a comparative experiment between a traditional single silicone mold and the combined mold of this invention. Traditional molds frequently exhibit defects such as excess adhesive and air bubbles at product step differences, while the combined mold of this invention effectively avoids these problems. Experimental results show that, compared to a traditional single silicone mold, the injection sealing method based on a combination of multiple materials in this application significantly improves all key performance indicators, fully verifying the technical effectiveness of this application.

[0059] Secondly, this application provides a type of injection mold, comprising: a main mold, said main mold being made of a first soft material, the first soft material having a hardness of 50A to 90A; The positioning pit is located on the main mold at the position corresponding to the area to be sealed. The local sealing reinforcement structure is made of a second soft material with a hardness of 10A to 50A, and is fixed in the positioning pit.

[0060] Compared with existing technologies, this application provides a glue injection sealing method and mold based on a combination of multiple materials. By innovatively combining two soft materials with different hardnesses to construct the glue injection system, it successfully solves the long-standing sealing technology problem in the field of intelligent device manufacturing. This application ingeniously combines a first soft material with a hardness of 50A to 90A (main mold) and a second soft material with a hardness of 10A to 50A (local sealing reinforcement structure), creating a collaborative working mechanism of "rigid support + flexible sealing". The main mold ensures the overall structural stability and dimensional accuracy, while the local sealing reinforcement structure can adaptively fill microscopic uneven areas, especially structural features such as steps and grooves that are difficult to seal using traditional processes. By pre-setting positioning pits on the main mold and precisely designing their depth and contour according to the product's step height and sealing path, the precise positioning and effective limiting of the local sealing reinforcement structure are achieved. This design avoids the problem of uncontrollable liquid glue flow in traditional processes, making the sealing process more reliable and repeatable. By fully utilizing the complementary properties of silicone material (main mold) and moisture-curing adhesive (local sealing and reinforcement structure), the former provides good structural support and reusability, while the latter has excellent deformation adaptability. The two form an optimal match in terms of hardness, elastic modulus and chemical stability, together achieving efficient sealing.

[0061] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A glue-sealing method based on a combination of multiple materials, used for glue-sealing intelligent device components with stepped, grooved, or stepped structures, characterized in that, Includes the following steps: A main mold is provided, the main mold being made of a first soft material, the first soft material having a hardness of 50A to 90A; Positioning pits are provided on the main mold at positions corresponding to the areas to be sealed. A second soft material with a hardness of 10A to 50A is applied to the positioning pit and cured to form a local sealing and reinforcing structure. The main mold and the smart device component are molded together to form a sealing mold. The local sealing reinforcement structure is attached to the step, groove or stepped structure of the smart device component to form a sealing cavity in the sealing mold. Inject sealing adhesive into the sealing cavity of the sealing mold; After the sealing colloid cures, it is demolded to obtain a fully sealed product.

2. The glue injection sealing method according to claim 1, characterized in that, The first soft material is silicone, and the main mold is prepared by injection molding.

3. The glue injection sealing method according to claim 1, characterized in that, The second soft material is formed on the positioning pit by means of dispensing, printing, pasting or multiple injection molding, so that the local sealing reinforcement structure can adapt to different shapes of steps and groove structures.

4. The glue-sealing method according to claim 1, characterized in that, The positioning pit is set on the main mold at the position corresponding to the area to be sealed. The depth and contour of the positioning pit are pre-designed according to the step height of the smart device component and the sealing path, and are used to limit the second soft material during the process of applying the second soft material to the positioning pit.

5. The method according to claim 1, characterized in that, The sealing adhesive is at least one of UV adhesive, epoxy resin adhesive, or silicone adhesive.

6. The method according to claim 1, characterized in that, The second soft material is a moisture-curing adhesive.

7. The method according to claim 1, characterized in that, In the step of closing the main mold and the smart device component to form a sealing mold, the local sealing reinforcement structure undergoes elastic deformation under the mold closing pressure, filling the microscopic gaps on the surface of the smart device component.

8. The glue-sealing method according to claim 1, characterized in that, The sealing cavity is provided with inlet and outlet ports, which are located on the main mold and at opposite ends of the sealing cavity, for the purpose of filling the cavity with adhesive and venting air.

9. A mold for implementing the injection sealing method as described in any one of claims 1 to 8, characterized in that, include: The main mold is made of a first soft material, the hardness of which is 50A to 90A. The positioning pit is located on the main mold at the position corresponding to the area to be sealed. The local sealing reinforcement structure is made of a second soft material with a hardness of 10A to 50A, and is fixed in the positioning pit.

10. The mold according to claim 9, characterized in that, The main mold is also provided with a bearing groove, which is used to accommodate and limit the edge structure of the smart device component when the mold is closed, so that the local sealing reinforcement structure and the product step or step form a sealing line.

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