High-light-transmittance and low-reflection glass substrate special for lamp and preparation method of high-light-transmittance and low-reflection glass substrate

Abstract

The invention relates to the technical field of glass processing, and discloses a high-light-transmittance and low-reflection special glass substrate for lamps, which comprises an ultra-white glass substrate and a composite coating layer, the iron content of the ultra-white glass substrate is less than or equal to 0.015%, the thickness is 1.5-5mm, and the visible light basic light transmittance is greater than or equal to 92%; the composite coating layer covers the surface of one side or two sides of the ultra-white glass substrate, the total thickness of the composite coating layer is 150-300nm, and the composite coating layer consists of a bottom-layer nanoscale metal oxide multilayer film and a top-layer low-radiation conductive polymer film. According to the high-light-transmittance and low-reflection glass substrate special for the lamp and the preparation method thereof, the visible light transmittance of the glass substrate is larger than or equal to 95%, the reflectivity is smaller than or equal to 1.5%, the light source energy utilization rate is increased by 18% or above, and light source power input can be reduced under the same illumination brightness; due to the top low-radiation film layer, the radiance of the middle-infrared band is smaller than or equal to 0.25, the heat dissipation energy consumption of the lamp is reduced by 30% or above, meanwhile, the ultraviolet rejection rate is larger than or equal to 99%, and the multiple energy-saving and protection effects are achieved.

Description

Technical Field

[0001] This invention relates to the field of glass processing technology, specifically to a high-transmittance, low-reflection glass substrate for lighting fixtures and its preparation method. Background Technology

[0002] In the lighting field, glass substrates, as the core optical components of luminaires, directly affect the energy utilization rate, lighting effect, lifespan, and overall energy consumption of the light source due to their transmittance, reflectance, thermal radiation performance, and stability. Currently, most luminaire glass substrates on the market are made of ordinary clear glass, with a single-sided reflectance of about 8% and a visible light transmittance of only about 85%. A large amount of light is reflected and lost, causing the light source to output higher power to achieve the preset lighting brightness, resulting in serious energy waste. At the same time, the light pollution caused by reflected light not only affects visual comfort but may also interfere with the light balance of the surrounding environment, especially in indoor lighting and landscape lighting scenarios. To address the aforementioned issues, low-reflection glass substrates have emerged in the prior art, primarily achieving anti-reflection effects through a single coating layer or simple multi-layer coatings. However, these methods have several drawbacks: The improvement in optical performance is limited. Some products can only reduce the reflectivity to about 5%, and the transmittance is difficult to exceed 90%. Furthermore, heat radiation control is not taken into account. When the lamp is working, the glass substrate absorbs the heat of the light source and easily radiates heat to the environment. This not only increases the energy consumption burden of the lamp's heat dissipation system, but may also affect the lifespan of the light source due to temperature fluctuations, leading to an increase in secondary energy consumption. Insufficient film stability, poor adhesion and insufficient weather resistance of a single coating layer, easy to peel off and yellow when exposed to humid, hot and ultraviolet environments for a long time, leading to the degradation of optical performance and shortening the service life of the glass substrate. The manufacturing process is not environmentally friendly. Traditional glass manufacturing often uses gas-fired furnaces, which have high CO2 emissions. In addition, some coating processes use harmful solvents, which does not conform to the development trend of green and energy-saving industries. Therefore, developing a special glass substrate for lighting fixtures that combines high light transmittance and low reflection optical performance, excellent energy-saving effect, stable durability and environmentally friendly manufacturing process, and solving the problem of difficulty in balancing optical performance, energy saving and stability in existing technologies through multi-dimensional structural design and process optimization, has become an urgent need in the current lighting materials field. Summary of the Invention

[0003] To address the shortcomings of existing technologies, this invention provides a high-transmittance, low-reflection glass substrate for lighting fixtures and its preparation method, thus solving the aforementioned problems.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a high-transmittance, low-reflection glass substrate for lighting fixtures, comprising an ultra-clear glass substrate and a composite coating layer; The ultra-white glass substrate has an iron content of ≤0.015%, a thickness of 1.5-5mm, and a visible light transmittance of ≥92%. The composite coating layer covers one or both sides of the ultra-white glass substrate, with a total thickness of 150-300nm, and consists of a bottom layer of nanoscale metal oxide multilayer film and a top layer of low-emissivity conductive polymer film. The underlying nanoscale metal oxide multilayer film consists of 8-12 alternating layers of silicon dioxide and titanium dioxide films, with each layer having a thickness error of ≤1nm and a total thickness of 100-220nm. The top low-emissivity conductive polymer film is an n-PBDF colloidal ultrathin layer with a thickness of 50-80 nm and an average particle diameter of 25-30 nm. The glass substrate has a visible light transmittance of ≥95%, a visible light reflectance of ≤1.5%, a mid-infrared emissivity of ≤0.25, and an ultraviolet blocking rate of ≥99%.

[0005] Preferably, the ultra-white glass substrate further contains 0.05-0.1 wt% cerium oxide, wherein the purity of the cerium oxide is ≥99.9%, which is used to improve the ultraviolet blocking auxiliary performance and chemical stability of the substrate.

[0006] Preferably, in the bottom nanoscale metal oxide multilayer film, the thickness ratio of silicon dioxide film to titanium dioxide film is 1.5-2:1, and a transition layer is formed at the interface of two adjacent films by plasma treatment, with a thickness of 2-5 nm, to improve interlayer adhesion.

[0007] Preferably, the top n-PBDF colloidal ultrathin layer is also doped with 0.3-0.5 wt% of nano-tin oxide particles, the average diameter of which is 5-8 nm, to optimize the low-emissivity performance and conductivity stability of the film.

[0008] Preferably, the outer side of the composite coating layer is further provided with a nano-silane protective film with a thickness of 10-15 nm. The nano-silane protective film is a hydrolysis product of methyltrimethoxysilane, which is used to improve the abrasion resistance and moisture resistance of the composite coating layer.

[0009] A method for preparing a high-transmittance, low-reflection glass substrate for lighting fixtures includes the following steps: S1: Preparation of ultra-clear glass substrate Take 70-75 parts by weight of quartz sand, 15-18 parts of soda ash, 5-8 parts of dolomite, 1-2 parts of alumina, 0.05-0.1 parts of cerium oxide, and 0.3-0.5 parts of clarifying agent, mix them evenly, and put them into an all-electric melting furnace. Melt and clarify at 1500-1550℃ for 2-3 hours. Stir at a rate of 50-80 r / min during the melting process. Use the float forming process to obtain the original sheet. After annealing, cutting, and polishing, the ultra-white glass substrate is obtained. The annealing temperature is 550-600℃. After holding at the temperature for 1-1.5 hours, the temperature is gradually reduced to room temperature at a rate of 20-30℃ / h. S2: Substrate Pretreatment The ultra-white glass substrate obtained in step S1 is sequentially subjected to ultrasonic cleaning with deionized water, dehydration with anhydrous ethanol, and plasma activation treatment. The plasma activation power is 200-300W and the treatment time is 5-8 minutes. After treatment, it is quickly transferred to a magnetron sputtering device to avoid secondary surface contamination. S3: Preparation of bottom-layer nanoscale metal oxide multilayer film The pretreated substrate was placed in a magnetron sputtering apparatus, with argon as the protective gas and the vacuum level controlled at 1×10⁻⁶. -3 -5×10 -3 Pa, high-purity silica and titanium dioxide targets were used as the targets, and silica films and titanium dioxide films were deposited alternately. The sputtering power was controlled at 80-120W and the deposition rate was 0.1-0.3nm / s during the deposition of each film. Plasma interface treatment was performed between adjacent film deposition layers for 1-2 minutes. The film thickness was adjusted in real time by spectral monitoring. After deposition, the film was baked at 200-250℃ for 30-40 minutes to form the bottom layer film. S4: Preparation of the top low-emissivity conductive polymer film Prepare an ethanol-based n-PBDF ink solution with an n-PBDF concentration of 0.5-1.0 wt%. Add 0.3-0.5 wt% nano-tin oxide particles and perform ultrasonic dispersion treatment at a dispersion power of 300-400 W for 30-40 min. Then add 0.1-0.2 wt% dispersant and stir evenly. Apply the solution to the substrate surface treated in step S3 using a spraying process. The spraying pressure is 0.3-0.5 MPa, the spraying distance is 15-20 cm, the spraying speed is 5-8 cm / s, the drying temperature is 80-100℃, and the drying time is 20-30 min to form an n-PBDF colloidal ultrathin layer. S5: Preparation of protective film A methyltrimethoxysilane hydrolysate with a concentration of 1-1.5 wt% was prepared and coated onto the surface of the top layer film using a vacuum spraying process at a vacuum degree of 5 × 10⁻⁶. -2 -1×10 -1Pa, after spraying, keep at 100-120℃ for 15-20 minutes to form a nano-silane protective film; S6: Finished Product Processing The substrate obtained in step S5 is cured at a low temperature of 120-150℃ for 1-2 hours. After cooling to room temperature, it undergoes optical performance testing, appearance screening, and weather resistance testing. Qualified products are the finished products.

[0010] Preferably, the clarifying agent in step S1 is a mixture of sodium nitrate and antimony oxide in a weight ratio of 2:1, and nitrogen gas with a purity of ≥99.99% is introduced in the later stage of molten clarification at a rate of 0.5-1 L / min for 30 min to improve the clarity of the molten liquid.

[0011] Preferably, the argon gas used in the magnetron sputtering in step S3 has a purity of ≥99.999%, the substrate temperature is maintained at 100-120℃ during the deposition process, and the purity of both the silicon dioxide target and the titanium dioxide target is ≥99.995%, thereby reducing the impact of impurities on the film performance.

[0012] Preferably, the dispersant in step S4 is polyethylene glycol octylphenyl ether, and the substrate after spraying is dried by hot air circulation with the air speed controlled at 1-2 m / s to ensure the uniformity of the film layer.

[0013] Preferably, the weathering test in step S6 includes a damp heat test and an ultraviolet aging test. The damp heat test conditions are a temperature of 55°C and a humidity of 95% for 72 hours. The ultraviolet aging test uses a 340nm ultraviolet lamp with an irradiance of 0.8W / m². 2 After 100 hours of continuous testing, the film layer showed no peeling and the light transmittance decreased by ≤1%.

[0014] Compared with the prior art, the present invention provides a high-transmittance, low-reflection glass substrate for lighting fixtures and its preparation method, which has the following beneficial effects: 1. The high-transmittance, low-reflection glass substrate for lighting fixtures and its preparation method, through substrate optimization and composite coating layer design, achieves a visible light transmittance of ≥95% and a reflectance of ≤1.5% on the glass substrate, improving the energy utilization rate of the light source by more than 18%, and reducing the power input of the light source under the same lighting brightness; the top low-emissivity film layer makes the emissivity of the mid-infrared band ≤0.25, reducing the heat dissipation energy consumption of the lighting fixture by more than 30%, while the ultraviolet blocking rate is ≥99%, achieving multiple energy-saving and protection effects.

[0015] 2. The high-transmittance, low-reflection glass substrate for lighting fixtures and its preparation method feature a triple design: a bottom layer interface transition treatment, a top layer particle doping, and an outer protective film. This design results in strong film adhesion, resistance to over 100,000 washes, no peeling after weathering tests, and a light transmittance attenuation of ≤1%. It can adapt to complex environments such as humidity, heat, and ultraviolet radiation, and its service life is more than twice that of existing technologies.

[0016] 3. The high-transmittance, low-reflection glass substrate for lighting fixtures and its preparation method, including processes such as all-electric furnace melting, ethanol-based ink, and spraying without harmful solvents, reduce CO2 emissions by more than 40% compared to traditional processes. Furthermore, the low-temperature baking and curing processes reduce energy consumption during the preparation process. Processes such as plasma treatment and vacuum spraying improve product consistency, reducing the defect rate to below 1% and reducing production losses.

[0017] 4. The high-transmittance, low-reflection glass substrate for lighting fixtures and its preparation method allow for flexible adjustment of product thickness, making it suitable for various energy-saving lighting fixtures such as LED and fluorescent lamps. It caters to the needs of multiple scenarios, including indoor and outdoor, industrial, and landscape applications. At the same time, it can protect internal components of the lighting fixtures and surrounding objects from ultraviolet damage, expanding application scenarios while reducing the overall maintenance cost of the lighting fixtures. Detailed Implementation

[0018] The technical solutions of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0019] A high-transmittance, low-reflection glass substrate for lighting fixtures, comprising an ultra-clear glass substrate and a composite coating layer; The ultra-white glass substrate has an iron content of ≤0.015%, a thickness of 1.5-5mm, and a visible light transmittance of ≥92%. The composite coating layer covers one or both sides of the ultra-white glass substrate, with a total thickness of 150-300nm, and consists of a bottom layer of nanoscale metal oxide multilayer film and a top layer of low-emissivity conductive polymer film. The bottom layer of nanoscale metal oxide multilayer film consists of 8-12 alternating layers of silicon dioxide film and titanium dioxide film, with each layer having a thickness error of ≤1nm and a total thickness of 100-220nm. The top low-emissivity conductive polymer film is an n-PBDF colloidal ultrathin layer with a thickness of 50-80 nm and an average particle diameter of 25-30 nm; The glass substrate has a visible light transmittance of ≥95%, a visible light reflectance of ≤1.5%, a mid-infrared emissivity of ≤0.25, and an ultraviolet blocking rate of ≥99%.

[0020] The ultra-white glass substrate also contains 0.05-0.1 wt% cerium oxide with a purity of ≥99.9%, which is used to improve the substrate's UV blocking performance and chemical stability.

[0021] In the bottom nanoscale metal oxide multilayer film, the thickness ratio of silicon dioxide film to titanium dioxide film is 1.5-2:1, and a transition layer is formed at the interface of two adjacent films by plasma treatment. The thickness of the transition layer is 2-5nm, which improves the interlayer adhesion.

[0022] The top n-PBDF colloidal ultrathin layer is also doped with 0.3-0.5wt% of nano-tin oxide particles, with an average diameter of 5-8nm, to optimize the low-emissivity performance and conductivity stability of the film.

[0023] The outer side of the composite coating layer is also provided with a nano-silane protective film with a thickness of 10-15nm. The nano-silane protective film is a hydrolysis product of methyltrimethoxysilane and is used to improve the abrasion resistance and moisture resistance of the composite coating layer.

[0024] A method for preparing a high-transmittance, low-reflection glass substrate for lighting fixtures includes the following steps: S1: Preparation of ultra-clear glass substrate Take 70-75 parts by weight of quartz sand, 15-18 parts of soda ash, 5-8 parts of dolomite, 1-2 parts of alumina, 0.05-0.1 parts of cerium oxide, and 0.3-0.5 parts of clarifying agent, mix them evenly, and put them into an all-electric melting furnace. Melt and clarify at 1500-1550℃ for 2-3 hours. Stir at a rate of 50-80 r / min during the melting process. Use the float forming process to obtain the original sheet. After annealing, cutting, and polishing, the ultra-white glass substrate is obtained. The annealing temperature is 550-600℃. After holding at the temperature for 1-1.5 hours, the temperature is gradually reduced to room temperature at a rate of 20-30℃ / h. S2: Substrate Pretreatment The ultra-white glass substrate obtained in step S1 is sequentially subjected to ultrasonic cleaning with deionized water, dehydration with anhydrous ethanol, and plasma activation treatment. The plasma activation power is 200-300W and the treatment time is 5-8 minutes. After treatment, it is quickly transferred to a magnetron sputtering device to avoid secondary surface contamination. S3: Preparation of bottom-layer nanoscale metal oxide multilayer film The pretreated substrate was placed in a magnetron sputtering apparatus, with argon as the protective gas and the vacuum level controlled at 1×10⁻⁶. -3 -5×10 -3Pa, high-purity silica and titanium dioxide targets were used as the targets, and silica films and titanium dioxide films were deposited alternately. The sputtering power was controlled at 80-120W and the deposition rate was 0.1-0.3nm / s during the deposition of each film. Plasma interface treatment was performed between adjacent film deposition layers for 1-2 minutes. The film thickness was adjusted in real time by spectral monitoring. After deposition, the film was baked at 200-250℃ for 30-40 minutes to form the bottom layer film. S4: Preparation of the top low-emissivity conductive polymer film Prepare an ethanol-based n-PBDF ink solution with an n-PBDF concentration of 0.5-1.0 wt%. Add 0.3-0.5 wt% nano-tin oxide particles and perform ultrasonic dispersion treatment at a dispersion power of 300-400 W for 30-40 min. Then add 0.1-0.2 wt% dispersant and stir evenly. Apply the solution to the substrate surface treated in step S3 using a spraying process. The spraying pressure is 0.3-0.5 MPa, the spraying distance is 15-20 cm, the spraying speed is 5-8 cm / s, the drying temperature is 80-100℃, and the drying time is 20-30 min to form an n-PBDF colloidal ultrathin layer. S5: Preparation of protective film A methyltrimethoxysilane hydrolysate with a concentration of 1-1.5 wt% was prepared and coated onto the surface of the top layer film using a vacuum spraying process at a vacuum degree of 5 × 10⁻⁶. -2 -1×10 -1 Pa, after spraying, keep at 100-120℃ for 15-20 minutes to form a nano-silane protective film; S6: Finished Product Processing The substrate obtained in step S5 is cured at a low temperature of 120-150℃ for 1-2 hours. After cooling to room temperature, it undergoes optical performance testing, appearance screening, and weather resistance testing. Qualified products are the finished products.

[0025] The clarifying agent in step S1 is a mixture of sodium nitrate and antimony oxide in a weight ratio of 2:1. Nitrogen gas with a purity of ≥99.99% is introduced in the later stage of molten clarification at a rate of 0.5-1 L / min for 30 min to improve the clarity of the molten liquid.

[0026] In step S3, the argon gas used for magnetron sputtering has a purity of ≥99.999%, the substrate temperature is maintained at 100-120℃ during the deposition process, and the purity of both the silicon dioxide target and the titanium dioxide target is ≥99.995%, thereby reducing the impact of impurities on the film performance.

[0027] The dispersant in step S4 is polyethylene glycol octylphenyl ether, and the substrate after spraying is dried by hot air circulation with the air speed controlled at 1-2 m / s to ensure the uniformity of the film layer.

[0028] The weather resistance test in step S6 includes a damp heat test and an ultraviolet aging test. The damp heat test conditions are a temperature of 55°C and a humidity of 95% for 72 hours. The ultraviolet aging test uses a 340nm ultraviolet lamp with an irradiance of 0.8W / m². 2 After 100 hours of continuous testing, the film layer showed no peeling and the light transmittance decreased by ≤1%.

[0029] Example 1: A high-transmittance, low-reflection glass substrate for lighting fixtures and its preparation method are disclosed below. S1: Preparation of ultra-clear glass substrate 72 parts by weight of quartz sand, 16 parts of soda ash, 6 parts of dolomite, 1.5 parts of alumina, 0.08 parts of cerium oxide, and 0.4 parts of clarifying agent (sodium nitrate: antimony oxide = 2:1) were mixed evenly and then put into an all-electric melting furnace. The mixture was melted and clarified at 1520℃ for 2.5 hours, with stirring at a rate of 60 r / min during the melting process. In the later stage of clarification, nitrogen gas with a purity of 99.99% was introduced at a rate of 0.8 L / min for 30 minutes. The original sheet was obtained by float glass forming process, and then annealed, cut, and polished. The annealing temperature was 580℃, and the temperature was held for 1.2 hours. Then, the temperature was gradually reduced to room temperature at a rate of 25℃ / h to obtain an ultra-white glass substrate with a thickness of 2 mm. The basic visible light transmittance was measured to be 92.5%.

[0030] S2: Substrate Pretreatment The substrate was sequentially subjected to ultrasonic cleaning with deionized water for 15 minutes, dehydration with anhydrous ethanol for 5 minutes, and plasma activation treatment with a plasma activation power of 250W and a treatment time of 6 minutes. After treatment, it was quickly transferred to a magnetron sputtering device.

[0031] S3: Preparation of bottom-layer nanoscale metal oxide multilayer film The pretreated substrate was placed in a magnetron sputtering apparatus, and argon gas with a purity of 99.999% was introduced. The vacuum level was controlled at 3 × 10⁻⁶. -3 Pa, substrate temperature maintained at 110℃, target materials used were 99.995% pure silicon dioxide and titanium dioxide targets, silicon dioxide film and titanium dioxide film were deposited alternately, a total of 10 layers, the thickness ratio of the two films was 1.8:1, the sputtering power of each film was 100W, the deposition rate was 0.2nm / s, the gap between adjacent film deposition was treated with plasma interface treatment for 1.5min, the thickness error of each layer was controlled by spectral monitoring ≤1nm, the total thickness was 180nm, and after deposition was completed, baked at 220℃ for 35min.

[0032] S4: Preparation of the top low-emissivity conductive polymer film Prepare a 0.8 wt% ethanol-based n-PBDF ink solution, add 0.4 wt% nano-tin oxide particles (average diameter 6 nm), ultrasonically disperse at 350 W for 35 min, then add 0.15 wt% polyethylene glycol octylphenyl ether, stir evenly, and then coat using a spraying process with a spraying pressure of 0.4 MPa, a spraying distance of 18 cm, and a spraying speed of 6 cm / s. Dry using hot air circulation at a wind speed of 1.5 m / s at 85℃ for 25 min to form a 65 nm thick n-PBDF colloidal ultrathin layer.

[0033] S5: Preparation of protective film A 1.2 wt% methyltrimethoxysilane hydrolysate was prepared and coated onto the surface of the top layer film using a vacuum spraying process at a vacuum degree of 8 × 10⁻⁶. -2 Pa, after spraying, is kept at 110℃ for 18 minutes to form a 12nm thick nano-silane protective film.

[0034] S6: Finished Product Processing After curing at 135℃ for 1.5 hours and cooling to room temperature, the finished product showed a visible light transmittance of 95.8%, a visible light reflectance of 1.2%, a mid-infrared emissivity of 0.22%, and an ultraviolet blocking rate of 99.3%. Weather resistance testing showed no abnormalities after damp heat testing, and the transmittance decreased by 0.6% after ultraviolet aging testing, meeting the requirements for lighting fixtures.

[0035] Example 2: A high-transmittance, low-reflection glass substrate for lighting fixtures and its preparation method are disclosed below. S1: Preparation of ultra-clear glass substrate Take 75 parts by weight of quartz sand, 15 parts of soda ash, 7 parts of dolomite, 1.2 parts of alumina, 0.1 parts of cerium oxide, and 0.3 parts of clarifying agent, mix them evenly, and put them into an all-electric melting furnace. Melt and clarify at 1550℃ for 2 hours. Stir at a rate of 80 r / min during the melting process. In the later stage of clarification, nitrogen gas is introduced at a rate of 1 L / min for 30 minutes. After float forming, anneal at 600℃ and hold for 1 hour. Then, cool down to room temperature at a rate of 30℃ / h. Cut and polish to obtain an ultra-white glass substrate with a thickness of 3 mm and a basic visible light transmittance of 92.2%.

[0036] S2: Substrate Pretreatment The sample was ultrasonically cleaned with deionized water for 20 minutes, dehydrated with anhydrous ethanol for 8 minutes, and then activated with plasma at 300W for 8 minutes. After the treatment, it was transferred to a magnetron sputtering device.

[0037] S3: Preparation of bottom-layer nanoscale metal oxide multilayer film Argon gas with a purity of 99.999% was introduced, and the vacuum degree was 5×10⁻⁶. -3Pa, substrate temperature 120℃, using high-purity target material, 12 layers of silicon dioxide film and titanium dioxide film were alternately deposited with a thickness ratio of 2:1, sputtering power of 120W per layer, deposition rate of 0.3nm / s, plasma treatment of adjacent layers for 2min, total thickness 220nm, and baking at 250℃ for 30min.

[0038] S4: Preparation of the top low-emissivity conductive polymer film Prepare a 1.0 wt% ethanol-based n-PBDF ink solution, add 0.5 wt% nano-tin oxide particles, ultrasonically disperse at 400W for 30 min, add 0.2 wt% dispersant, spray at a pressure of 0.5 MPa, a spraying distance of 20 cm, a spraying rate of 8 cm / s, and dry with hot air circulation (wind speed 2 m / s) at 100℃ for 20 min to form a top layer film with a thickness of 80 nm.

[0039] S5: Preparation of protective film Prepare a 1.5 wt% methyltrimethoxysilane hydrolysate and vacuum spray it (vacuum degree 1×10). -1 Pa), heat-preserved at 120℃ for 20 minutes, forming a protective film with a thickness of 15nm.

[0040] S6: Finished Product Processing After curing at 150℃ for 1 hour and cooling, the finished product showed a visible light transmittance of 95.2%, a visible light reflectance of 1.4%, a mid-infrared emissivity of 0.24%, and an ultraviolet blocking rate of 99.1%. After weather resistance testing, there was no peeling, and the transmittance decreased by 0.8%, which met the requirements.

[0041] Example 3: A high-transmittance, low-reflection glass substrate for lighting fixtures and its preparation method are disclosed below. S1: Preparation of ultra-clear glass substrate Take 70 parts by weight of quartz sand, 18 parts of soda ash, 5 parts of dolomite, 2 parts of alumina, 0.05 parts of cerium oxide, and 0.5 parts of clarifying agent (sodium nitrate: antimony oxide = 2:1), mix them evenly, and put them into an all-electric melting furnace. Melt and clarify at 1500℃ for 3 hours, stirring at a rate of 50 r / min during the melting process; During the clarification phase, nitrogen gas with a purity of 99.99% was introduced at a rate of 0.5 L / min for 30 min. The raw sheet is produced by float glass forming process and then annealed, cut and polished. The annealing temperature was 550℃, and after holding at that temperature for 1.5 hours, the temperature was gradually reduced to room temperature at a rate of 20℃ / h to obtain an ultra-white glass substrate with a thickness of 1.5 mm. The basic transmittance of visible light was measured to be 92.1%. S2: Substrate Pretreatment The substrate was sequentially subjected to ultrasonic cleaning with deionized water for 10 min, dehydration with anhydrous ethanol for 3 min, and plasma activation treatment. Plasma activation power 200W, processing time 5min, and then quickly transferred to magnetron sputtering equipment; S3: Preparation of bottom-layer nanoscale metal oxide multilayer film The pretreated substrate was placed in a magnetron sputtering apparatus, and 99.999% pure argon gas was introduced, with the vacuum level controlled at 1×10⁻⁶. -3 Pa, substrate temperature maintained at 100℃; The target materials used are silicon dioxide target with a purity of 99.995% and titanium dioxide target. Silicon dioxide film and titanium dioxide film are deposited alternately, for a total of 8 layers, with a thickness ratio of 1.5:1 between the two layers. Each film was sputtered at a power of 80W and a deposition rate of 0.1nm / s. Plasma interface treatment was performed between adjacent film deposition layers for 1 minute. The thickness error of each layer was controlled to be ≤1nm by spectral monitoring, with a total thickness of 100nm. After deposition, the layers were baked at 200℃ for 40min. S4: Preparation of the top low-emissivity conductive polymer film Prepare a 0.5 wt% ethanol-based n-PBDF ink solution, add 0.3 wt% nano-tin oxide particles (average diameter 5 nm), and ultrasonically disperse at 300 W for 40 min; Add 0.1 wt% of polyethylene glycol octylphenyl ether, stir evenly, and then coat using a spray coating process; The spraying pressure was 0.3 MPa, the spraying distance was 15 cm, the spraying rate was 5 cm / s, and hot air circulation drying was used with a wind speed of 1 m / s. The drying time was 80℃ for 30 min to form an n-PBDF colloidal ultrathin layer with a thickness of 50 nm. S5: Preparation of protective film A 1 wt% methyltrimethoxysilane hydrolysate was prepared and coated onto the surface of the top layer film using a vacuum spraying process at a vacuum degree of 5 × 10⁻⁶. -2 Pa; After spraying, keep at 100℃ for 15 minutes to form a 10nm thick nano-silane protective film; S6: Finished Product Processing After curing at 120℃ for 2 hours and cooling to room temperature, the finished product showed a visible light transmittance of 95.1%, a visible light reflectance of 1.3%, a mid-infrared emissivity of 0.23%, and an ultraviolet light blocking rate of 99.2%. After weather resistance testing and damp heat testing, there were no abnormalities. After ultraviolet aging testing, the light transmittance decreased by 0.7%, which meets the requirements for lighting fixtures.

[0042] Example 4: A high-transmittance, low-reflection glass substrate for lighting fixtures and its preparation method are disclosed below. S1: Preparation of ultra-clear glass substrate Take 73 parts by weight of quartz sand, 17 parts of soda ash, 8 parts of dolomite, 1.8 parts of alumina, 0.09 parts of cerium oxide, and 0.45 parts of clarifying agent (sodium nitrate: antimony oxide = 2:1), mix them evenly, and put them into an all-electric furnace. The mixture was melted and clarified at 1530℃ for 2.8 hours, with stirring at a rate of 70 r / min during the melting process. During the clarification phase, nitrogen gas with a purity of 99.99% was introduced at a rate of 0.9 L / min for 30 min. The raw sheet is produced by float glass forming process and then annealed, cut and polished. The annealing temperature was 590℃, and after holding at that temperature for 1.3 hours, the temperature was gradually reduced to room temperature at a rate of 28℃ / h to obtain an ultra-white glass substrate with a thickness of 5 mm. The basic visible light transmittance was measured to be 92.3%. S2: Substrate Pretreatment The substrate was sequentially subjected to ultrasonic cleaning with deionized water for 18 min, dehydration with anhydrous ethanol for 6 min, and plasma activation treatment. The plasma activation power is 280W, the processing time is 7min, and the plasma is quickly transferred to the magnetron sputtering equipment after processing. S3: Preparation of bottom-layer nanoscale metal oxide multilayer film The pretreated substrate was placed in a magnetron sputtering apparatus, and argon gas with a purity of 99.999% was introduced. The vacuum level was controlled at 4 × 10⁻⁶. -3 Pa, substrate temperature maintained at 115℃; The target materials used are silicon dioxide target with a purity of 99.995% and titanium dioxide target. Silicon dioxide film and titanium dioxide film are deposited alternately, for a total of 11 layers, with a thickness ratio of 1.9:1 between the two layers. Each film was sputtered at a power of 110W and a deposition rate of 0.25nm / s. Plasma interface treatment was performed between adjacent film deposition layers for 1.8min. The thickness error of each layer was controlled to be ≤1nm by spectral monitoring, with a total thickness of 200nm. After deposition, the layers were baked at 240℃ for 32min. S4: Preparation of the top low-emissivity conductive polymer film Prepare a 0.9 wt% ethanol-based n-PBDF ink solution, add 0.45 wt% nano-tin oxide particles (average diameter 7 nm), and ultrasonically disperse at 380 W for 32 min; Add 0.18 wt% of polyethylene glycol octylphenyl ether, stir evenly, and then coat using a spray coating process; The spraying pressure was 0.45 MPa, the spraying distance was 19 cm, the spraying rate was 7 cm / s, and hot air circulation drying was used with a wind speed of 1.8 m / s. The drying time was 95℃ for 22 min to form an n-PBDF colloidal ultrathin layer with a thickness of 75 nm. S5: Preparation of protective film A 1.4 wt% methyltrimethoxysilane hydrolysate was prepared and coated onto the surface of the top layer film using a vacuum spraying process at a vacuum degree of 9 × 10⁻⁶. -2 Pa; After spraying, the coating is kept at 115℃ for 17 minutes to form a 14nm thick nano-silane protective film. S6: Finished Product Processing After curing at 145℃ for 1.2 hours and cooling to room temperature, the finished product showed a visible light transmittance of 95.5%, a visible light reflectance of 1.3%, a mid-infrared emissivity of 0.23%, and an ultraviolet light blocking rate of 99.4%. After weather resistance testing and damp heat testing, there were no abnormalities. After ultraviolet aging testing, the light transmittance decreased by 0.7%, which meets the requirements for lighting fixtures.

[0043] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-transmittance, low-reflection glass substrate for lighting fixtures, characterized in that, Includes an ultra-clear glass substrate and a composite coating layer; The ultra-white glass substrate has an iron content of ≤0.015%, a thickness of 1.5-5mm, and a visible light transmittance of ≥92%. The composite coating layer covers one or both sides of the ultra-white glass substrate, with a total thickness of 150-300nm, and consists of a bottom layer of nanoscale metal oxide multilayer film and a top layer of low-emissivity conductive polymer film. The underlying nanoscale metal oxide multilayer film consists of 8-12 alternating layers of silicon dioxide and titanium dioxide films, with each layer having a thickness error of ≤1nm and a total thickness of 100-220nm. The top low-emissivity conductive polymer film is an n-PBDF colloidal ultrathin layer with a thickness of 50-80 nm and an average particle diameter of 25-30 nm. The glass substrate has a visible light transmittance of ≥95%, a visible light reflectance of ≤1.5%, a mid-infrared emissivity of ≤0.25, and an ultraviolet blocking rate of ≥99%.

2. The high-transmittance, low-reflection glass substrate for lamps according to claim 1, characterized in that: The ultra-white glass substrate also contains 0.05-0.1 wt% cerium oxide, with a purity of ≥99.9%, which is used to improve the substrate's UV blocking performance and chemical stability.

3. The high-transmittance, low-reflection glass substrate for lamps according to claim 1, characterized in that: In the underlying nanoscale metal oxide multilayer film, the thickness ratio of silicon dioxide film to titanium dioxide film is 1.5-2:1, and a transition layer is formed at the interface of two adjacent films by plasma treatment. The thickness of the transition layer is 2-5nm, which improves the interlayer adhesion.

4. The high-transmittance, low-reflection glass substrate for lamps according to claim 1, characterized in that: The top n-PBDF colloidal ultrathin layer is also doped with 0.3-0.5wt% of nano-tin oxide particles, the average diameter of which is 5-8nm, to optimize the low-emissivity performance and conductivity stability of the film.

5. The high-transmittance, low-reflection glass substrate for lamps according to claim 1, characterized in that: The outer side of the composite coating layer is also provided with a nano-silane protective film with a thickness of 10-15nm. The nano-silane protective film is a hydrolysis product of methyltrimethoxysilane and is used to improve the abrasion resistance and moisture resistance of the composite coating layer.

6. A method for preparing a high-transmittance, low-reflection glass substrate for lighting fixtures according to any one of claims 1-5, characterized in that, Includes the following steps: S1: Preparation of ultra-clear glass substrate Take 70-75 parts by weight of quartz sand, 15-18 parts of soda ash, 5-8 parts of dolomite, 1-2 parts of alumina, 0.05-0.1 parts of cerium oxide, and 0.3-0.5 parts of clarifying agent, mix them evenly, and put them into an all-electric melting furnace. Melt and clarify at 1500-1550℃ for 2-3 hours. Stir at a rate of 50-80 r / min during the melting process. Use the float forming process to obtain the original sheet. After annealing, cutting, and polishing, the ultra-white glass substrate is obtained. The annealing temperature is 550-600℃. After holding at the temperature for 1-1.5 hours, the temperature is gradually reduced to room temperature at a rate of 20-30℃ / h. S2: Substrate Pretreatment The ultra-white glass substrate obtained in step S1 is sequentially subjected to ultrasonic cleaning with deionized water, dehydration with anhydrous ethanol, and plasma activation treatment. The plasma activation power is 200-300W and the treatment time is 5-8 minutes. After treatment, it is quickly transferred to a magnetron sputtering device to avoid secondary surface contamination. S3: Preparation of bottom-layer nanoscale metal oxide multilayer film The pretreated substrate was placed in a magnetron sputtering apparatus, with argon as the protective gas and the vacuum level controlled at 1×10⁻⁶. -3 -5×10 -3 Pa, high-purity silica and titanium dioxide targets were used as the targets, and silica films and titanium dioxide films were deposited alternately. The sputtering power was controlled at 80-120W and the deposition rate was 0.1-0.3nm / s during the deposition of each film. Plasma interface treatment was performed between adjacent film deposition layers for 1-2 minutes. The film thickness was adjusted in real time by spectral monitoring. After deposition, the film was baked at 200-250℃ for 30-40 minutes to form the bottom layer film. S4: Preparation of the top low-emissivity conductive polymer film Prepare an ethanol-based n-PBDF ink solution with an n-PBDF concentration of 0.5-1.0 wt%. Add 0.3-0.5 wt% nano-tin oxide particles and perform ultrasonic dispersion treatment at a dispersion power of 300-400 W for 30-40 min. Then add 0.1-0.2 wt% dispersant and stir evenly. Apply the solution to the substrate surface treated in step S3 using a spraying process. The spraying pressure is 0.3-0.5 MPa, the spraying distance is 15-20 cm, the spraying speed is 5-8 cm / s, the drying temperature is 80-100℃, and the drying time is 20-30 min to form an n-PBDF colloidal ultrathin layer. S5: Preparation of protective film A methyltrimethoxysilane hydrolysate with a concentration of 1-1.5 wt% was prepared and coated onto the surface of the top layer film using a vacuum spraying process at a vacuum degree of 5 × 10⁻⁶. -2 -1×10 -1 Pa, after spraying, keep at 100-120℃ for 15-20 minutes to form a nano-silane protective film; S6: Finished Product Processing The substrate obtained in step S5 is cured at a low temperature of 120-150℃ for 1-2 hours. After cooling to room temperature, it undergoes optical performance testing, appearance screening, and weather resistance testing. Qualified products are the finished products.

7. The method for preparing a high-transmittance, low-reflection glass substrate for lighting fixtures according to claim 6, characterized in that: The clarifying agent mentioned in step S1 is a mixture of sodium nitrate and antimony oxide in a weight ratio of 2:

1. Nitrogen gas with a purity of ≥99.99% is introduced in the later stage of molten clarification at a rate of 0.5-1 L / min for 30 min to improve the clarity of the molten liquid.

8. The method for preparing a high-transmittance, low-reflection glass substrate for lighting fixtures according to claim 6, characterized in that: In step S3, the argon gas used for magnetron sputtering has a purity of ≥99.999%, the substrate temperature is maintained at 100-120℃ during the deposition process, and the purity of both the silicon dioxide target and the titanium dioxide target is ≥99.995%, thereby reducing the impact of impurities on the film performance.

9. The method for preparing a high-transmittance, low-reflection glass substrate for lighting fixtures according to claim 6, characterized in that: The dispersant mentioned in step S4 is polyethylene glycol octylphenyl ether, and the substrate after spraying is dried by hot air circulation with the air speed controlled at 1-2 m / s to ensure the uniformity of the film layer.

10. The method for preparing a high-transmittance, low-reflection glass substrate for lighting fixtures according to claim 6, characterized in that: The weather resistance test described in step S6 includes a damp heat test and an ultraviolet aging test. The damp heat test conditions are a temperature of 55°C and a humidity of 95% for 72 hours. The ultraviolet aging test uses a 340nm ultraviolet lamp with an irradiance of 0.8W / m². 2 After 100 hours of continuous testing, the film layer showed no peeling and the light transmittance decreased by ≤1%.