Conductive polymer layer for charge dissipation

Abstract

This application relates to a conductive polymer layer located on an electrostatic chuck. The conductive polymer layer comprises a conductive polymer and a photosensitive polymer. The conductivity of the conductive polymer facilitates charge dissipation through the conductive polymer layer, while the photosensitivity of the photosensitive polymer allows the surface of the conductive polymer layer to be optically patterned. The degree of conductivity and photosensitivity of the conductive polymer layer can be adjusted by varying the relative amounts of the conductive polymer and the photosensitive polymer.

Description

Technical Field

[0001] This disclosure relates to conductive polymer layers that can be used for charge dissipation and related methods. Background Technology

[0002] Semiconductor processing uses electrically insulating materials. These materials are susceptible to the accumulation of electrostatic charges on their surfaces. This accumulation of electrostatic charges can delay processes, damage components, or cause injury. Summary of the Invention

[0003] Some embodiments relate to an apparatus comprising: an electrostatic chuck; and a conductive polymer layer disposed on the electrostatic chuck. In some embodiments, the conductive polymer layer comprises a conductive polymer and a photosensitive polymer.

[0004] In some embodiments, the electrostatic chuck is configured to hold a substrate by applying an electrostatic force.

[0005] In some embodiments, the conductive polymer layer has 10 12 Chip resistors with ohms / square or less.

[0006] In some embodiments, the conductive polymer layer has a Young's modulus of 3.5 gigapascals (GPa) or less.

[0007] In some embodiments, the photosensitive polymer includes at least one of phenylcyclobutene (BCB), polybenzoxazole (PBO), epoxy resin, polyimide, or any combination thereof.

[0008] In some embodiments, the conductive polymer includes at least one of polyacetylene (PAC), poly(phenylene), polyphenylene, polyphenylene oxide polymer, polypyrene, polyazine, polynaphthalene, polypyrrole (PPY), polycarbazole, polyindole, polyazide, polyaniline (PANI), poly(phenylene oxide), polythiophene (PT), polythiophene vinylidene, poly(p-phenylene sulfide) (PPS), poly(p-phenylene oxide polymer) (PPV), polypyridine, poly(3,4-ethylenedioxythiophene) (PEDOT), polystyrene sulfonate (PSS), poly(triarylamine) (PTAA), poly(hydroxymethyl 3,4-ethylenedioxythiophene) (PEDOT-OH), or any combination thereof.

[0009] In some embodiments, the conductive polymer layer comprises a cross-linked photosensitive polymer. In some embodiments, the conductive polymer layer comprises a light-patterned surface.

[0010] In some embodiments, the conductive polymer layer does not include metal contaminants.

[0011] In some embodiments, the metallic contaminants include at least one or any combination of chromium, manganese, hafnium, iron, aluminum, magnesium, potassium, sodium, calcium, strontium, barium, copper, lead, zinc, tin, cobalt, nickel, antimony, mercury, cadmium, bismuth, gold, silver, platinum, ruthenium, rhodium, palladium, iridium, beryllium, lithium, cesium, titanium, zirconium, vanadium, niobium, tantalum, tungsten, molybdenum, gallium, indium, thallium, germanium, rhenium, lanthanum, cerium, praseodymium, neodymium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium, lutetium, scandium, yttrium, and thorium.

[0012] Some embodiments relate to an electrostatic chuck including a conductive polymer layer located on the electrostatic chuck. In some embodiments, the conductive polymer layer includes a conductive polymer and a photosensitive polymer.

[0013] In some embodiments, the conductive polymer layer has 10 12 Chip resistors with ohms / square or less.

[0014] In some embodiments, the conductive polymer layer has a Young's modulus of 3.5 gigapascals (GPa) or less.

[0015] In some embodiments, the photosensitive polymer includes at least one of phenylcyclobutene (BCB), polybenzoxazole (PBO), epoxy resin, polyimide, or any combination thereof.

[0016] In some embodiments, the conductive polymer includes at least one of polyacetylene (PAC), poly(phenylene), polyphenylene, polyphenylene oxide polymer, polypyrene, polyazine, polynaphthalene, polypyrrole (PPY), polycarbazole, polyindole, polyazide, polyaniline (PANI), poly(phenylene oxide), polythiophene (PT), polythiophene vinylidene, poly(p-phenylene sulfide) (PPS), poly(p-phenylene oxide polymer) (PPV), polypyridine, poly(3,4-ethylenedioxythiophene) (PEDOT), polystyrene sulfonate (PSS), poly(triarylamine) (PTAA), poly(hydroxymethyl 3,4-ethylenedioxythiophene) (PEDOT-OH), or any combination thereof.

[0017] In some embodiments, the conductive polymer layer comprises a cross-linked photosensitive polymer. In some embodiments, the conductive polymer layer comprises a light-patterned surface.

[0018] In some embodiments, the conductive polymer layer does not include metal contaminants.

[0019] In some embodiments, the metallic contaminants include at least one or any combination of chromium, manganese, hafnium, iron, aluminum, magnesium, potassium, sodium, calcium, strontium, barium, copper, lead, zinc, tin, cobalt, nickel, antimony, mercury, cadmium, bismuth, gold, silver, platinum, ruthenium, rhodium, palladium, iridium, beryllium, lithium, cesium, titanium, zirconium, vanadium, niobium, tantalum, tungsten, molybdenum, gallium, indium, thallium, germanium, rhenium, lanthanum, cerium, praseodymium, neodymium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium, lutetium, scandium, yttrium, and thorium.

[0020] Some embodiments relate to a method comprising one or more of the following steps: obtaining a solution comprising a conductive polymer and a photosensitive polymer; depositing the solution onto at least a portion of the surface of an electrostatic chuck; applying a photomask to define exposed portions of the solution and unexposed portions of the solution; exposing the solution to light to cure the exposed portions of the solution; developing the solution to remove the unexposed portions of the solution; and heating the solution to a temperature sufficient to remove at least a portion of the solvent from the solution.

[0021] In some embodiments, the conductive polymer includes at least one of polyacetylene (PAC), poly(phenylene), polyphenylene, polyphenylene oxide polymer, polypyrene, polyazine, polynaphthalene, polypyrrole (PPY), polycarbazole, polyindole, polyazide, polyaniline (PANI), poly(phenylene oxide), polythiophene (PT), polythiophene vinylidene, poly(p-phenylene sulfide) (PPS), poly(p-phenylene oxide polymer) (PPV), polypyridine, poly(3,4-ethylenedioxythiophene) (PEDOT), polystyrene sulfonate (PSS), poly(triarylamine) (PTAA), poly(hydroxymethyl 3,4-ethylenedioxythiophene) (PEDOT-OH), or any combination thereof.

[0022] In some embodiments, the solution does not include at least one of the following metals: chromium, manganese, hafnium, iron, aluminum, magnesium, potassium, sodium, calcium, strontium, barium, copper, lead, zinc, tin, cobalt, nickel, antimony, mercury, cadmium, bismuth, gold, silver, platinum, ruthenium, rhodium, palladium, iridium, beryllium, lithium, cesium, titanium, zirconium, vanadium, niobium, tantalum, tungsten, molybdenum, gallium, indium, thallium, germanium, rhenium, lanthanum, cerium, praseodymium, neodymium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium, lutetium, scandium, yttrium, thorium, or any combination thereof. Attached Figure Description

[0023] This document describes some embodiments by way of example only, with reference to the accompanying drawings. Specific reference will now be made to the details of the drawings, and it should be emphasized that the embodiments shown in the drawings are by way of example and for the purpose of illustrative discussion of embodiments of this disclosure. In this regard, the description taken in conjunction with the drawings will enable those skilled in the art to understand how embodiments of this disclosure can be practiced.

[0024] Figure 1This is a flowchart of a non-limiting embodiment of a method for preparing a conductive polymer layer according to some embodiments.

[0025] Figure 2 This is a cross-sectional view of a non-limiting embodiment of a device according to some embodiments. Detailed Implementation

[0026] Other objects and advantages of this disclosure will become apparent from the following description taken in conjunction with the accompanying drawings, amidst the disclosed benefits and improvements. Detailed embodiments of this disclosure are disclosed herein; however, it should be understood that the disclosed embodiments are merely illustrative of the disclosure as it may be embodied in various forms. Furthermore, each of the examples given with respect to the various embodiments of this disclosure is intended to be illustrative rather than restrictive.

[0027] Any prior patents and publications referenced herein are incorporated herein by reference in their entirety.

[0028] Throughout this specification and claims, unless the context clearly specifies otherwise, the following terms have the meaning explicitly applicable herein. Although the phrases “in one embodiment,” “in an embodiment,” and “in some embodiments” as used herein may refer to the same embodiment, they do not necessarily refer to the same embodiment. Furthermore, the phrases “in another embodiment” and “in some other embodiments” as used herein do not necessarily refer to different embodiments. All embodiments of this disclosure are intended to be combinable without departing from the scope or spirit of this disclosure.

[0029] As used herein, unless the context clearly specifies otherwise, the term "based on" is non-exclusive and allows for consideration of additional factors not described. Furthermore, throughout the specification, "a" and "described" have the meaning of plural references. "In" has the meaning of both "in" and "on".

[0030] Some embodiments relate to polymer layers for electrostatic chuck applications. In some embodiments, a conductive polymer is combined with a photosensitive polymer to obtain a polymer layer that is both conductive and photosensitive. The conductivity of the conductive polymer promotes the dissipation of electrostatic charge through the polymer layer, while the photosensitivity of the photosensitive polymer allows the surface of the polymer layer to be optically patterned. The degree of conductivity and photosensitivity of the polymer layer can be adjusted by varying the relative amounts of the conductive and photosensitive polymers. Various other properties of the polymer layer can also be adjusted by varying the relative amounts of the conductive and photosensitive polymers and optionally by incorporating other materials.

[0031] Some embodiments relate to an apparatus comprising a conductive polymer layer located on an electrostatic chuck. In some embodiments, the conductive polymer layer comprises at least one of a conductive polymer material, a photosensitive polymer material (e.g., a cross-linked or non-cross-linked photosensitive polymer), or any combination thereof. In some embodiments, the conductive polymer layer has a patterned surface (e.g., a photopatterned surface). In some of these embodiments, the photosensitive polymer material comprises a cross-linked photosensitive polymer. In some embodiments, the conductive polymer layer has an unpatterned surface (e.g., a non-photopatterned surface). In some of these embodiments, the photosensitive polymer material comprises a non-cross-linked photosensitive polymer.

[0032] Some embodiments relate to an electrostatic chuck including a conductive polymer layer on the surface of the electrostatic chuck. In some embodiments, the conductive polymer layer includes at least one of a conductive polymer material, a photosensitive polymer material (e.g., a cross-linked or non-cross-linked photosensitive polymer), or any combination thereof. In some of these embodiments, the conductive polymer layer has a patterned surface (e.g., a photopatterned surface). In some of these embodiments, the photosensitive polymer material includes a cross-linked photosensitive polymer. In some embodiments, the conductive polymer layer has a non-patterned surface (e.g., a non-photopatterned surface). In some of these embodiments, the photosensitive polymer material includes a non-cross-linked photosensitive polymer.

[0033] An electrostatic chuck can be configured to hold a substrate to a conductive polymer layer by applying an electrostatic force. The electrostatic force may be sufficient to hold the substrate to the surface of the conductive polymer layer. That is, in some embodiments, the substrate may be held to the conductive polymer layer by an electrostatic chuck without applying any mechanical force, such as (e.g., but not limited to) a mechanical clamp. In some embodiments, a mechanical force is applied to hold the substrate (e.g., via a mechanical clamp). The substrate held to the conductive polymer layer is not particularly limited and may comprise (e.g., but not limited to) a wafer, a workpiece, or any combination thereof. In some embodiments, the substrate comprises a semiconductor wafer. In some embodiments, the substrate comprises a silicon wafer. It should be understood that other substrates may be used herein without departing from the scope of this disclosure.

[0034] The conductive polymer layer may include a conductive polymer material. The conductive polymer material may include a conductive polymer material. In some embodiments, the conductive polymer material includes at least one of conductive monomers, conductive oligomers, and conductive polymers, or any combination thereof. In some embodiments, the conductive polymer material includes a conjugated polymer. In some embodiments, the conductive polymer material includes a conductive polymer. In some embodiments, the conductive polymer material includes at least one of polyacetylene (PAC), poly(phenylene oxide), polyphenylene oxide, poly(phenylene sulfide) polymer, poly(phenylene oxide), poly(phenylene oxide), poly(p-phenylene sulfide) (PPS), poly(p-phenylene oxide) polymer (PPV), polypyridine, poly(3,4-ethylenedioxythiophene) (PEDOT), polystyrene sulfonate (PSS), poly(triarylamine) (PTAA), and poly(hydroxymethyl 3,4-ethylenedioxythiophene) (PEDOT-OH), or any combination thereof.

[0035] Based on the total weight of the conductive polymer layer, the conductive polymer layer may include any range or subrange of conductive polymer material from 0.01 wt% to 99.99 wt% or between. For example, in some embodiments, based on the total weight of the conductive polymer layer, the conductive polymer layer comprises 0.01 wt% to 99 wt%, 1 wt% to 99 wt%, 10 wt% to 99 wt%, 20 wt% to 99 wt%, 30 wt% to 99 wt%, 40 wt% to 99 wt%, 50 wt% to 99 wt%, 60 wt% to 99 wt%, 70 wt% to 99 wt%, 80 wt% to 99 wt%, 90 wt% to 99 wt%, 0.01 wt% to 90 wt%, 0.01 wt% to 80 wt%, 0.01 wt% to 70 wt%, 0.01 wt% to 60 wt%, 0.01 wt% to 50 wt%, 0.01 wt% to 40 wt%, 0.01 wt% to 30 wt%, 0.01 wt% to 20 wt%, 0.01 wt% to 10 wt%, or any range or subrange of conductive polymer material therebetween. In some embodiments, based on the total weight of the conductive polymer layer, the conductive polymer layer comprises 10 wt% to 50 wt%, 20 wt% to 50 wt%, 30 wt% to 50 wt%, 40 wt% to 50 wt%, 10 wt% to 40 wt%, 10 wt% to 30 wt%, 10 wt% to 20 wt% or any range or subrange thereof of conductive polymer material.

[0036] The conductive polymer layer may include a photosensitive polymer material. The photosensitive polymer material may include a polymer material that undergoes a change in properties or structure when exposed to light. In some embodiments, the photosensitive polymer material includes at least one of photosensitive monomers, photosensitive oligomers, and photosensitive polymers, or any combination thereof. In some embodiments, the photosensitive polymer material includes a photosensitive polymer. In some embodiments, the photosensitive polymer material includes a cross-linked photosensitive polymer. For example, in some embodiments, the photosensitive polymer material—such as a photosensitive monomer, a photosensitive oligomer, or any combination thereof—is exposed to light to obtain a cross-linked photosensitive polymer. In some embodiments in which the conductive polymer layer has a light-patterned surface, the photosensitive polymer material includes a cross-linked photosensitive polymer. In some embodiments, the photosensitive polymer includes a non-cross-linked photosensitive polymer. In some embodiments, the photosensitive polymer material includes at least one of phenylcyclobutene (BCB), polybenzoxazole (PBO), epoxy resin, and polyimide, or any combination thereof.

[0037] Based on the total weight of the conductive polymer layer, the conductive polymer layer may include 0.01% by weight to 99.99% by weight of photosensitive polymer material, or any range or subrange thereof. For example, in some embodiments, based on the total weight of the conductive polymer layer, the conductive polymer layer comprises 0.01 wt% to 99 wt%, 1 wt% to 99 wt%, 10 wt% to 99 wt%, 20 wt% to 99 wt%, 30 wt% to 99 wt%, 40 wt% to 99 wt%, 50 wt% to 99 wt%, 60 wt% to 99 wt%, 70 wt% to 99 wt%, 80 wt% to 99 wt%, 90 wt% to 99 wt%, 0.01 wt% to 90 wt%, 0.01 wt% to 80 wt%, 0.01 wt% to 70 wt%, 0.01 wt% to 60 wt%, 0.01 wt% to 50 wt%, 0.01 wt% to 40 wt%, 0.01 wt% to 30 wt%, 0.01 wt% to 20 wt%, 0.01 wt% to 10 wt%, or any range or subrange thereof of photosensitive polymer material. In some embodiments, based on the total weight of the conductive polymer layer, the conductive polymer layer comprises 50% to 90% by weight, 50% to 80% by weight, 50% to 70% by weight, 50% to 60% by weight, 60% to 90% by weight, 70% to 90% by weight, 80% to 90% by weight, or any range or subrange thereof of photosensitive polymer material.

[0038] The amounts of conductive polymer material and photosensitive polymer material present in the conductive polymer layer can be adjusted to achieve at least one or any combination of the desired sheet resistance, desired Young's modulus, and so on. For example, the conductive polymer material and photosensitive polymer material can be present in sufficient amounts to give the conductive polymer layer at least one or any combination of the desired sheet resistance, desired Young's modulus, and so on.

[0039] The conductive polymer layer may have 10 13 Ohms / square or less, 10 12 Ohms / square or less, 10 11 Ohms / square or less, 10 10 Ohms / square or less, 10 9 Ohms / square or less, 10 8 Ohms / square or less, 10 7 Ohms / square or less, 10 6 Ohms / square or less and 10 5 Sheet resistance of ohms / square or less. In some embodiments, the conductive polymer layer may have 10 ohms / square or less. 2 Ohms / square to 10 10 Ohms / square, 10 2 Ohms / square to 10 9 Ohms / square, 10 2 Ohms / square to 10 8 Ohms / square, 10 2 Ohms / square to 10 7 Ohms / square, 10 2 Ohms / square to 10 6 Ohms / square, 10 2 Ohms / square to 10 5 Ohms / square, 10 2 Ohms / square to 10 4 Ohms / square, 10 2 Ohms / square to 10 3 Ohms / square, 10 3 Ohms / square to 10 9 Ohms / square, 10 4 Ohms / square to 10 9 Ohms / square, 10 5 Ohms / square to 10 9 Ohms / square, 10 6 Ohms / square to 10 9 Ohms / square, 10 7 Ohms / square to 10 9 Ohms / square, 10 8 Ohms / square to 10 9 A sheet resistor of any range or subrange of ohms per square.

[0040] The conductive polymer layer may have a Young's modulus of 3.5 gigapascals (GPa) or less, 3 gigapascals (GPa) or less, 2.5 gigapascals (GPa) or less, 2 gigapascals (GPa) or less, 1.5 gigapascals (GPa) or less, 1 gigapascals (GPa) or less, 0.5 gigapascals (GPa) or less, 0.1 gigapascals (GPa) or less, or 0.01 gigapascals (GPa) or less. In some embodiments, the conductive polymer layer may have a strength of 0.001 GPa to 1 GPa, 0.001 GPa to 0.9 GPa, 0.001 GPa to 0.8 GPa, 0.001 GPa to 0.7 GPa, 0.001 GPa to 0.6 GPa, 0.001 GPa to 0.5 GPa, 0.001 GPa to 0.4 GPa, 0.001 GPa to 0.3 GPa, 0.001 GPa to 0.2 GPa, +0.001 GPa to 0.1 GPa, 0.001 GPa to 0.01 GPa, 0.001 GPa to 3.5 GPa, or 0.01 GPa to 3.5 GPa. Young's modulus in any range or subrange of Pa, 0.1 GPa to 3.5 GPa, 1 GPa to 3.5 GPa, 1.5 GPa to 3.5 GPa, 2 GPa to 3.5 GPa, 2.5 GPa to 3.5 GPa, 3 GPa to 3.5 GPa, 0.001 GPa to 3 GPa, 0.001 GPa to 2.5 GPa, 0.001 GPa to 2 GPa, 0.001 GPa to 1.5 GPa, 0.001 GPa to 1 GPa, 0.001 GPa to 0.5 GPa, 0.001 GPa to 0.1 GPa, 0.001 GPa to 0.01 GPa, or between.

[0041] The conductive polymer layer may include a conductive optically patterned polymer layer. That is, in some embodiments, the conductive polymer layer includes: a conductive polymer material, such as a conductive polymer; and a photosensitive polymer material, such as a cross-linked photosensitive polymer. In some embodiments, the photosensitive polymer is cross-linked such that the conductive polymer layer has an optically patterned surface. In some embodiments, the conductive optically patterned layer includes protrusions or a plurality of protrusions. The surface of the protrusions or the conductive optically patterned layer may define a substrate contact surface (e.g., a wafer contact surface). The protrusions may have any geometry. In some embodiments, for example, the protrusions (in other structures) form pillars. In some embodiments, the protrusions have at least one dimension in the range of 1 μm to 100 μm or any range or subrange thereof.

[0042] The thickness of the conductive polymer layer can range from 1 μm to 50 μm. For example, in some embodiments, the thickness of the conductive polymer layer is within the range of 1 μm to 50 μm, 1 μm to 45 μm, 1 μm to 40 μm, 1 μm to 35 μm, 1 μm to 30 μm, 1 μm to 25 μm, 1 μm to 20 μm, 1 μm to 15 μm, 1 μm to 10 μm, 1 μm to 5 μm, 5 μm to 50 μm, 10 μm to 50 μm, 15 μm to 50 μm, 20 μm to 50 μm, 25 μm to 50 μm, 30 μm to 50 μm, 35 μm to 50 μm, 40 μm to 50 μm, 45 μm to 50 μm, or any range or subrange thereof. In some embodiments, the thickness of the conductive polymer layer is in the range of 5 μm to 25 μm, 5 μm to 20 μm, 5 μm to 15 μm, or any range or subrange thereof.

[0043] In some embodiments, the conductive polymer layer does not include metallic contaminants. In some embodiments, the metallic contaminants include, are composed of, or are substantially composed of at least one of or any combination thereof of chromium, manganese, hafnium, iron, aluminum, magnesium, potassium, sodium, calcium, strontium, barium, copper, lead, zinc, tin, cobalt, nickel, antimony, mercury, cadmium, bismuth, gold, silver, platinum, ruthenium, rhodium, palladium, iridium, beryllium, lithium, cesium, titanium, zirconium, vanadium, niobium, tantalum, tungsten, molybdenum, gallium, indium, thallium, germanium, rhenium, lanthanum, cerium, praseodymium, neodymium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium, lutetium, scandium, yttrium, and thorium.

[0044] In some embodiments, the conductive polymer layer comprises any range or subrange of metallic contaminants from 0.01 wt% to 10 wt% or between, based on the total weight of the conductive polymer layer. For example, in some embodiments, the conductive polymer layer comprises less than 10 wt%, less than 9 wt%, less than 8 wt%, less than 7 wt%, less than 6 wt%, less than 5 wt%, less than 4 wt%, less than 3 wt%, less than 2 wt%, less than 1 wt%, or less than 0.1 wt% metallic contaminants based on the total weight of the conductive polymer layer. In some embodiments, the conductive polymer layer comprises 0.01 wt% to 10 wt%, 0.01 wt% to 9 wt%, 0.01 wt% to 8 wt%, 0.01 wt% to 7 wt%, 0.01 wt% to 6 wt%, 0.01 wt% to 5 wt%, 0.01 wt% to 4 wt%, 0.01 wt% to 3 wt%, 0.01 wt% to 2 wt%, 0.01 wt% to 1 wt%, 1 wt% to 10 wt%, 2 wt% to 10 wt%, 3 wt% to 10 wt%, 4 wt% to 10 wt%, 5 wt% to 10 wt%, 6 wt% to 10 wt%, 7 wt% to 10 wt%, 8 wt% to 10 wt%, 9 wt% to 10 wt%, or any range or subrange of metallic contaminants therein.

[0045] In some embodiments, the conductive polymer layer includes at least one or any combination of additives, binders, solvents, dopants, and surfactants. In some embodiments, the additives do not include metals (e.g., the metal contaminants disclosed herein). In some embodiments, the binders do not include metals (e.g., the metal contaminants disclosed herein). In some embodiments, the solvents do not include metals (e.g., the metal contaminants disclosed herein). In some embodiments, the dopants do not include metals (e.g., the metal contaminants disclosed herein). In some embodiments, the surfactants do not include metals (e.g., the metal contaminants disclosed herein).

[0046] Based on the total weight of the conductive polymer layer, the conductive polymer layer may include at least one or any combination thereof of additives, binders, solvents, dopants, surfactants, or any range or subrange thereof, ranging from 0.01 wt% to 99 wt% or more. For example, in some embodiments, based on the total weight of the conductive polymer layer, the conductive polymer layer may include 0.01 wt% to 99 wt%, 1 wt% to 99 wt%, 10 wt% to 99 wt%, 20 wt% to 99 wt%, 30 wt% to 99 wt%, 40 wt% to 99 wt%, 50 wt% to 99 wt%, 60 wt% to 99 wt%, 70 wt% to 99 wt%, 80 wt% to 99 wt%, 90 wt% to 99 wt%, 0. The conductive polymer layer comprises at least one or any combination of additives, binders, solvents, dopants, and surfactants in any range or subrange from 0.01 wt% to 90 wt%, 0.01 wt% to 80 wt%, 0.01 wt% to 70 wt%, 0.01 wt% to 60 wt%, 0.01 wt% to 50 wt%, 0.01 wt% to 40 wt%, 0.01 wt% to 30 wt%, 0.01 wt% to 20 wt%, 0.01 wt% to 10 wt%, or any range or subrange thereof, based on the total weight of the conductive polymer layer. In some embodiments, based on the total weight of the conductive polymer layer, the conductive polymer layer comprises at least one or any combination of additives, binders, solvents, dopants, and surfactants in any range or subrange from 50 wt% to 90 wt%, 50 wt% to 80 wt%, 50 wt% to 70 wt%, 50 wt% to 60 wt%, 60 wt% to 90 wt%, 70 wt% to 90 wt%, 80 wt% to 90 wt%, or any range or subrange thereof, based on the total weight of the conductive polymer layer.

[0047] Figure 1 This is a flowchart of a non-limiting embodiment of a method 100 for preparing a conductive polymer layer according to some embodiments. The conductive polymer layer may include any of the conductive polymer layers disclosed herein.

[0048] In step 102, a solution comprising a conductive polymer material and a photosensitive polymer material is obtained. In some embodiments, the solution comprises a homogeneous mixture of the conductive polymer material and the photosensitive polymer material. In some embodiments, the solution further comprises a solvent. In some embodiments, the solvent comprises at least one of γ-butyrolactone, propylene glycol methyl ether acetate, acetone, dodecane, cyclopentanone, or any combination thereof.

[0049] In step 104, a solution is deposited onto at least a portion of the surface of the electrostatic chuck. Deposition may include coating (e.g., spraying, ultrasonic spraying, spin coating, or other application) onto at least a portion of the surface of the electrostatic chuck. In some embodiments, the solution is deposited onto the surface of the electrostatic chuck to form a coating, layer, or film. In some embodiments, the solution deposited on the surface of the electrostatic chuck has a thickness of 0.1 μm to 1 μm or any range or subrange thereof. In some embodiments, the thickness of the solution deposited on the surface of the electrostatic chuck is any range or subrange thereof, ranging from 1 μm to 10 μm, 1 μm to 9 μm, 1 μm to 8 μm, 1 μm to 7 μm, 1 μm to 6 μm, 1 μm to 5 μm, 1 μm to 4 μm, 1 μm to 3 μm, 1 μm to 2 μm, 2 μm to 10 μm, 3 μm to 10 μm, 4 μm to 10 μm, 5 μm to 10 μm, 6 μm to 10 μm, 7 μm to 10 μm, 8 μm to 10 μm, 9 μm to 10 μm, or between. In some embodiments, the solution is deposited to cover the entire surface of the electrostatic chuck.

[0050] In step 106, at least a portion of the solution on the surface of the electrostatic chuck is exposed to light. The solution may be exposed to light of any wavelength. For example, the solution may be exposed to at least one or any combination of gamma rays, X-rays, ultraviolet light, visible light, infrared light, radio waves, and microwaves. The exposure time should be sufficient to solidify the solution.

[0051] Although not shown in the figures, in some embodiments, the method further includes one or more of the following steps, optionally performed between steps 106 and 108: applying a photomask to define exposed portions of the solution and unexposed portions of the solution; exposing the solution to light to solidify the exposed portions of the solution; and developing the solution to remove at least a portion of the unexposed portions of the solution. In some of these embodiments, developing the solution results in the formation of a patterned surface, wherein the unexposed portions are removed while the exposed portions are retained.

[0052] In step 108, the solution is heated to a temperature sufficient to remove at least a portion of the solvent from the solution. The temperature is not particularly limited and can be (e.g., but not limited to) a range from 150°C to 400°C or any subrange thereof. The duration of heating is not particularly limited and should be sufficient to complete, or at least partially complete, the process of removing the solvent from the solution. In some embodiments, heating forms a conductive polymer layer. In some embodiments, the conductive polymer layer is a patterned conductive polymer layer (e.g., a photopatterned conductive polymer layer). In some embodiments, the conductive polymer layer is an unpatterned conductive polymer layer.

[0053] Figure 2 This is a cross-sectional view of a non-limiting embodiment of the apparatus 200 according to some embodiments. For example... Figure 2 As shown, device 200 includes a conductive polymer layer 202 located on an electrostatic chuck 204. The conductive polymer layer 202 may include a plurality of protrusions 208 defining a photo-patterned surface and a substrate contact surface. In the embodiment shown in the figures, the electrostatic chuck 204 is configured to hold a substrate 206 to the conductive polymer layer 202 by applying an electrostatic force. The substrate 206 may comprise (e.g., but not limited to) a silicon wafer or other semiconductor substrate.

[0054] The electrostatic chuck 204 may include a dielectric layer 210 and an insulating layer 212. In some embodiments, the dielectric layer 210 has a first surface and a second surface opposite to the first surface. In some embodiments, the first surface of the dielectric layer 210 is bonded to the conductive polymer layer 202. In some embodiments, the second surface of the dielectric layer 210 is bonded to the insulating layer 212.

[0055] Device 200 may include electrode 214. Electrode 214 may be located below the top surface of electrostatic chuck 204. In some embodiments, electrode 214 is engaged with electrode pin 216 (e.g., optionally through conductive epoxy or other materials). In some embodiments, electrode pin 216 extends from electrode 214 through insulating layer 212, as shown in the figures. It should be understood that other configurations of electrode 214, dielectric layer 210, and insulating layer 212 may be employed without departing from the scope of this disclosure. It should be further understood that electrostatic chuck 204 may include other components without departing from the scope of this disclosure.

[0056] aspect

[0057] The following describes various aspects. It should be understood that any or more of the features listed in the following aspects may be combined with any or more other aspects.

[0058] Aspect 1. An apparatus comprising:

[0059] electrostatic chuck; and

[0060] A conductive polymer layer is located on the electrostatic chuck.

[0061] The conductive polymer layer includes a conductive polymer and a photosensitive polymer.

[0062] Aspect 2. The apparatus according to aspect 1, wherein the electrostatic chuck is configured to fix a substrate by applying an electrostatic force.

[0063] Aspect 3. The apparatus according to any one of aspects 1 to 2, wherein the conductive polymer layer has 10 12 Chip resistors with ohms / square or less.

[0064] Aspect 4. The apparatus according to any one of aspects 1 to 3, wherein the conductive polymer layer has a Young's modulus of 3.5 gigapascals (GPa) or less.

[0065] Aspect 5. The apparatus according to any one of aspects 1 to 4, wherein the conductive polymer layer comprises from 0.01 wt% to 99.99 wt% of the photosensitive polymer based on the total weight of the conductive polymer layer.

[0066] Aspect 6. The apparatus according to any one of aspects 1 to 5, wherein the photosensitive polymer comprises at least one of phenylcyclobutene (BCB), polybenzoxazole (PBO), epoxy resin, polyimide, or any combination thereof.

[0067] Aspect 7. The apparatus according to any one of aspects 1 to 6, wherein the photosensitive polymer comprises a cross-linked photosensitive polymer.

[0068] Aspect 8. The apparatus according to any one of aspects 1 to 6, wherein the photosensitive polymer comprises a non-crosslinked photosensitive polymer.

[0069] Aspect 9. The apparatus according to any one of aspects 1 to 8, wherein the conductive polymer layer comprises 0.01% by weight to 99.99% by weight of conductive polymer based on the total weight of the conductive polymer layer.

[0070] Aspect 10. The apparatus according to any one of aspects 1 to 9, wherein the conductive polymer comprises a conjugated polymer.

[0071] Aspect 11. The apparatus according to any one of aspects 1 to 10, wherein the conductive polymer comprises at least one of or any combination thereof, polyacetylene (PAC), poly[unspecified], polyphenylene, polyphenylene oxide polymer, polypyrene, polyazine, polynaphthalene, polypyrrole (PPY), polycarbazole, polyindole, polyacrylonitrile, polyaniline (PANI), poly[unspecified]benzene, polythiophene (PT), polythiophene vinylidene, poly(p-phenylene sulfide) (PPS), poly(p-phenylene oxide polymer) (PPV), polypyridine, poly(3,4-ethylenedioxythiophene) (PEDOT), polystyrene sulfonate (PSS), poly(triarylamine) (PTAA), and poly(hydroxymethyl 3,4-ethylenedioxythiophene) (PEDOT-OH).

[0072] Aspect 12. The apparatus according to any one of aspects 1 to 11, wherein the conductive polymer layer has an optically patterned surface.

[0073] Aspect 13. The apparatus according to aspect 12, wherein the optically patterned surface defines a substrate contact surface.

[0074] Aspect 14. The apparatus according to aspect 12, wherein the optically patterned surface includes protrusions.

[0075] Aspect 15. The apparatus according to aspect 14, wherein the protrusion has at least one size in the range of 1 μm to 100 μm.

[0076] Aspect 16. The apparatus according to any one of aspects 1 to 15, wherein the conductive polymer layer has a thickness of 1 μm to 50 μm.

[0077] Aspect 17. The apparatus according to any one of aspects 1 to 16, wherein the conductive polymer layer does not include metal contaminants.

[0078] Aspect 18. The apparatus according to aspect 17, wherein the metal contaminant comprises at least one or any combination thereof of chromium, manganese, hafnium, iron, aluminum, magnesium, potassium, sodium, calcium, strontium, barium, copper, lead, zinc, tin, cobalt, nickel, antimony, mercury, cadmium, bismuth, gold, silver, platinum, ruthenium, rhodium, palladium, iridium, beryllium, lithium, cesium, titanium, zirconium, vanadium, niobium, tantalum, tungsten, molybdenum, gallium, indium, thallium, germanium, rhenium, lanthanum, cerium, praseodymium, neodymium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium, lutetium, scandium, yttrium, and thorium.

[0079] Aspect 19. The apparatus according to any one of aspects 1 to 18, wherein the conductive polymer layer further comprises at least one of additives, binders, solvents, dopants, surfactants, or any combination thereof.

[0080] Aspect 20. The apparatus according to aspect 19, wherein the additive, the binder, the solvent, the dopant, and the surfactant do not include metals.

[0081] Aspect 21. An electrostatic chuck, comprising:

[0082] A conductive polymer layer is located on the electrostatic chuck.

[0083] The conductive polymer layer includes a conductive polymer and a photosensitive polymer.

[0084] Aspect 22. The electrostatic chuck according to aspect 21, wherein the conductive polymer layer has 10 12 Chip resistors with ohms / square or less.

[0085] Aspect 23. The electrostatic chuck according to any one of aspects 21 to 22, wherein the conductive polymer layer has a Young's modulus of 3.5 gigapascals (GPa) or less.

[0086] Aspect 24. The electrostatic chuck according to any one of aspects 21 to 23, wherein the conductive polymer layer comprises 0.01% to 99.99% by weight of a photosensitive polymer based on the total weight of the conductive polymer layer.

[0087] Aspect 25. The electrostatic chuck according to any one of aspects 21 to 24, wherein the photosensitive polymer comprises at least one of phenylcyclobutene (BCB), polybenzoxazole (PBO), epoxy resin, polyimide, or any combination thereof.

[0088] Aspect 26. The electrostatic chuck according to any one of aspects 21 to 25, wherein the photosensitive polymer includes a cross-linked photosensitive polymer.

[0089] Aspect 27. The electrostatic chuck according to any one of aspects 21 to 25, wherein the photosensitive polymer includes a non-crosslinked photosensitive polymer.

[0090] Aspect 28. The electrostatic chuck according to any one of aspects 21 to 27, wherein the conductive polymer layer comprises 0.01% by weight to 99.99% by weight of the conductive polymer, based on the total weight of the conductive polymer layer.

[0091] Aspect 29. The electrostatic chuck according to any one of aspects 21 to 28, wherein the conductive polymer includes a conjugated polymer.

[0092] Aspect 30. The electrostatic chuck according to any one of aspects 21 to 29, wherein the conductive polymer comprises at least one of or any combination thereof, polyacetylene (PAC), poly[unspecified], polyphenylene, polyphenylene oxide polymer, polypyrene, polyazine, polynaphthalene, polypyrrole (PPY), polycarbazole, polyindole, polyacrylamide, polyaniline (PANI), poly[unspecified]benzene, polythiophene (PT), polythiophene vinylidene, poly(p-phenylene sulfide) (PPS), poly(p-phenylene oxide polymer) (PPV), polypyridine, poly(3,4-ethylenedioxythiophene) (PEDOT), polystyrene sulfonate (PSS), poly(triarylamine) (PTAA), and poly(hydroxymethyl 3,4-ethylenedioxythiophene) (PEDOT-OH).

[0093] Aspect 31. The electrostatic chuck according to any one of aspects 21 to 30, wherein the conductive polymer layer has an optically patterned surface.

[0094] Aspect 32. The electrostatic chuck according to aspect 31, wherein the optically patterned surface defines the substrate contact surface.

[0095] Aspect 33. The electrostatic chuck according to aspect 31, wherein the optically patterned surface includes protrusions.

[0096] Aspect 34. The electrostatic chuck according to aspect 33, wherein the protrusion has at least one size in the range of 1 μm to 100 μm.

[0097] Aspect 35. The electrostatic chuck according to any one of aspects 21 to 34, wherein the conductive polymer layer has a thickness of 1 μm to 50 μm.

[0098] Aspect 36. The electrostatic chuck according to any one of aspects 21 to 35, wherein the conductive polymer layer does not include metal contaminants.

[0099] Aspect 37. The electrostatic chuck according to aspect 36, wherein the metal contaminant comprises at least one or any combination thereof of chromium, manganese, hafnium, iron, aluminum, magnesium, potassium, sodium, calcium, strontium, barium, copper, lead, zinc, tin, cobalt, nickel, antimony, mercury, cadmium, bismuth, gold, silver, platinum, ruthenium, rhodium, palladium, iridium, beryllium, lithium, cesium, titanium, zirconium, vanadium, niobium, tantalum, tungsten, molybdenum, gallium, indium, thallium, germanium, rhenium, lanthanum, cerium, praseodymium, neodymium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium, lutetium, scandium, yttrium, and thorium.

[0100] Aspect 38. The electrostatic chuck according to any one of aspects 21 to 37, wherein the conductive polymer layer further comprises at least one of additives, binders, solvents, dopants, surfactants, or any combination thereof.

[0101] Aspect 39. The electrostatic chuck according to aspect 38, wherein the additive, the binder, the solvent, the dopant and the surfactant do not include metals.

[0102] Aspect 40. A method comprising:

[0103] A solution comprising conductive polymers and photosensitive polymers was obtained;

[0104] The solution is deposited on at least a portion of the surface of the electrostatic chuck;

[0105] Exposing at least a portion of the solution on the surface of the electrostatic chuck to light; and

[0106] The solution is heated to a temperature sufficient to remove at least a portion of the solvent from the solution.

[0107] Aspect 41. The method according to aspect 40, wherein the solution comprises a homogeneous mixture of the conductive polymer and the photosensitive polymer.

[0108] Aspect 42. The method according to any one of aspects 40 to 41, wherein the solvent comprises at least one of γ-butyrolactone, propylene glycol methyl ether acetate, acetone, dodecane, cyclopentanone, or any combination thereof.

[0109] Aspect 43. The method according to any one of aspects 40 to 42, wherein deposition includes spraying.

[0110] Aspect 44. The method according to any one of aspects 40 to 43, wherein the deposition solution covers the entire surface of the electrostatic chuck.

[0111] Aspect 45. The method according to any one of aspects 40 to 44, wherein exposure comprises exposing the solution to light of any wavelength.

[0112] Aspect 46. The method according to any one of aspects 40 to 44 further includes one or more of the following:

[0113] A photomask is applied to define the exposed portion of the solution and the unexposed portion of the solution;

[0114] The solution is exposed to light to solidify the exposed portion of the solution; and

[0115] The solution is developed to remove at least a portion of the unexposed portion of the solution.

[0116] Aspect 47. The method according to any one of aspects 40 to 46, wherein heating includes heating to a temperature in the range of 150°C to 400°C.

[0117] Aspect 48. The method according to any one of aspects 40 to 47, wherein the conductive polymer comprises at least one of or any combination thereof, polyacetylene (PAC), poly[unspecified], polyphenylene, polyphenylene oxide polymer, polypyrene, polyazine, polynaphthalene, polypyrrole (PPY), polycarbazole, polyindole, polyacrylonitrile, polyaniline (PANI), poly[unspecified]benzene, polythiophene (PT), polythiophene vinylidene, poly(p-phenylene sulfide) (PPS), poly(p-phenylene oxide polymer) (PPV), polypyridine, poly(3,4-ethylenedioxythiophene) (PEDOT), polystyrene sulfonate (PSS), poly(triarylamine) (PTAA), poly(hydroxymethyl 3,4-ethylenedioxythiophene) (PEDOT-OH).

[0118] Aspect 49. The method according to any one of aspects 40 to 48, wherein the solution does not include at least one of the following metals: chromium, manganese, hafnium, iron, aluminum, magnesium, potassium, sodium, calcium, strontium, barium, copper, lead, zinc, tin, cobalt, nickel, antimony, mercury, cadmium, bismuth, gold, silver, platinum, ruthenium, rhodium, palladium, iridium, beryllium, lithium, cesium, titanium, zirconium, vanadium, niobium, tantalum, tungsten, molybdenum, gallium, indium, thallium, germanium, rhenium, lanthanum, cerium, praseodymium, neodymium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium, lutetium, scandium, yttrium, thorium, or any combination thereof.

[0119] It should be understood that detailed changes may be made without departing from the scope of this disclosure, particularly in terms of the construction materials and the shape, size, and arrangement of components. This specification and the described embodiments are examples, wherein the true scope and spirit of this disclosure are indicated by the appended claims.

Claims

1. An apparatus comprising: electrostatic chuck; and A photo-patternable conductive polymer layer is located on the electrostatic chuck. The conductive polymer layer comprises a mixture of a conductive polymer and a photosensitive polymer. The conductive polymer mentioned therein is an intrinsically conductive polymer.

2. The apparatus of claim 1, wherein the electrostatic chuck is configured to fix the substrate by applying an electrostatic force.

3. The device according to claim 1, wherein the conductive polymer layer has 10 12 Chip resistors with ohms / square or less.

4. The device according to claim 1, wherein the conductive polymer layer has a Young's modulus of 3.5 gigapascals (GPa) or less.

5. The apparatus of claim 1, wherein the photosensitive polymer is selected from the group consisting of at least one of phenylcyclobutene (BCB), polybenzoxazole (PBO), epoxy resin, polyimide, or any combination thereof.

6. The apparatus of claim 1, wherein the intrinsically conductive polymer is selected from the group consisting of at least one of the following: polyacetylene (PAC), polyfluorene, polyphenylene, polyphenylene oxide, polypyrene, polyazine, polynaphthalene, polypyrrole (PPY), polycarbazole, polyindole, polyazide, polyaniline (PANI), poly(phenylene oxide), polythiophene (PT), polythiophene vinylidene, poly(p-phenylene sulfide) (PPS), poly(p-phenylene vinylidene polymer) (PPV), polypyridine, poly(3,4-ethylenedioxythiophene) (PEDOT), polystyrene sulfonate (PSS), poly(triarylamine) (PTAA), poly(hydroxymethyl 3,4-ethylenedioxythiophene) (PEDOT-OH), or any combination thereof.

7. The apparatus of claim 1, wherein the photosensitive polymer is cross-linked such that the conductive polymer layer has a photopatterned surface.

8. The apparatus of claim 1, wherein the conductive polymer layer does not contain metal contaminants.

9. The apparatus of claim 8, wherein the metallic contaminant is selected from the group consisting of at least one chromium, manganese, hafnium, iron, aluminum, magnesium, potassium, sodium, calcium, strontium, barium, copper, lead, zinc, tin, cobalt, nickel, antimony, mercury, cadmium, bismuth, gold, silver, platinum, ruthenium, rhodium, palladium, iridium, beryllium, lithium, cesium, titanium, zirconium, vanadium, niobium, tantalum, tungsten, molybdenum, gallium, indium, thallium, germanium, rhenium, lanthanum, cerium, praseodymium, neodymium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium, lutetium, scandium, yttrium, thorium, or any combination thereof.

10. An electrostatic chuck, comprising: A photo-patternable conductive polymer layer is located on the electrostatic chuck. The conductive polymer layer comprises a mixture of a conductive polymer and a photosensitive polymer. The conductive polymer mentioned therein is an intrinsically conductive polymer.

11. The electrostatic chuck of claim 10, wherein the conductive polymer layer has 10 12 Chip resistors with ohms / square or less.

12. The electrostatic chuck of claim 10, wherein the conductive polymer layer has a Young's modulus of 3.5 gigapascals (GPa) or less.

13. The electrostatic chuck of claim 10, wherein the photosensitive polymer comprises at least one of phenylcyclobutene (BCB), polybenzoxazole (PBO), epoxy resin, polyimide, or any combination thereof.

14. The electrostatic chuck of claim 10, wherein the intrinsically conductive polymer is selected from the group consisting of at least one of the following: polyacetylene (PAC), polyfluorene, polyphenylene, polyphenylene oxide, polypyrene, polyazine, polynaphthalene, polypyrrole (PPY), polycarbazole, polyindole, polyazide, polyaniline (PANI), poly(phenylene oxide), polythiophene (PT), polythiophene vinylidene, poly(p-phenylene sulfide) (PPS), poly(p-phenylene vinylidene polymer) (PPV), polypyridine, poly(3,4-ethylenedioxythiophene) (PEDOT), polystyrene sulfonate (PSS), poly(triarylamine) (PTAA), poly(hydroxymethyl 3,4-ethylenedioxythiophene) (PEDOT-OH), or any combination thereof.

15. The electrostatic chuck of claim 10, wherein the photosensitive polymer is cross-linked such that the conductive polymer layer has a photopatterned surface.

16. The electrostatic chuck of claim 10, wherein the conductive polymer layer does not contain metal contaminants.

17. The electrostatic chuck of claim 16, wherein the metallic contaminant is selected from the group consisting of at least one chromium, manganese, hafnium, iron, aluminum, magnesium, potassium, sodium, calcium, strontium, barium, copper, lead, zinc, tin, cobalt, nickel, antimony, mercury, cadmium, bismuth, gold, silver, platinum, ruthenium, rhodium, palladium, iridium, beryllium, lithium, cesium, titanium, zirconium, vanadium, niobium, tantalum, tungsten, molybdenum, gallium, indium, thallium, germanium, rhenium, lanthanum, cerium, praseodymium, neodymium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium, lutetium, scandium, yttrium, thorium, or any combination thereof.

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