Liquid cooling heat dissipation system for notebook computer

Abstract

The invention discloses a notebook computer liquid cooling heat dissipation system which is characterized in that a first heat dissipation fin group and a second heat dissipation fin group which are matched with a first inner guide pipe and a second inner guide pipe respectively are arranged in a notebook computer; the surfaces of the same sides of the first inner guide pipe and the second inner guide pipe are in contact with the two side surfaces of the corresponding first heat dissipation fin set and the second heat dissipation fin set in an attached mode, and an outer liquid cooling plate is connected between the liquid outlet end of the water cooling row and the second outer guide pipe. The surface of the side, opposite to the water cooling row, of the outer liquid cooling plate is in contact connection with the refrigeration face of a refrigeration piece, the heat dissipation face of the refrigeration piece is in contact fit with a heat conduction piece, one ends of a plurality of heat conduction pipes arranged at intervals are connected with the heat conduction piece, and the other ends of the heat conduction pipes extend in the direction away from the heat conduction piece. The internal space of the notebook computer can be saved, the length of the liquid cooling pipeline and the contact area between the liquid cooling pipeline and the heat dissipation fins can be increased, the temperature of liquid circulating back to the liquid cooling pipeline in the notebook computer can be reduced, and the heat dissipation effect on the interior of the notebook computer is improved.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation in electronic products, and more particularly to a liquid cooling system for laptops. Background Technology

[0002] With continuous technological advancements, laptop processors are becoming increasingly powerful, leading to a corresponding increase in power consumption and heat generation. Currently, the heat generated by next-generation high-performance mobile processors under heavy loads far exceeds the cooling capacity of traditional air-cooling systems. This causes laptops to overheat and throttle during prolonged high-load operation, impacting performance. To meet users' demands for high-performance laptops, a more efficient cooling system is urgently needed to address the heat dissipation issues of core components such as the processor. Summary of the Invention

[0003] The purpose of this invention is to provide a liquid cooling system for laptops. This system can save internal space in the laptop while increasing the length of the liquid cooling pipes and the contact area between them and the heat dissipation fins. It can also reduce the temperature of the liquid circulating back into the internal liquid cooling pipes of the laptop, thereby improving the heat dissipation effect on the laptop's internal components.

[0004] To achieve the above objectives, the technical solution adopted by the present invention is as follows: a liquid cooling system for a laptop, comprising: at least one internal liquid cooling plate for thermally contacting a heat-generating element inside the laptop, and a circulation pump and a water cooling radiator respectively disposed outside the laptop; one end of a first internal conduit is connected to the liquid outlet of the internal liquid cooling plate, the other end of the first internal conduit is connected to one end of a first external conduit via an adapter, the other end of the first external conduit is connected to the liquid inlet of the water cooling radiator, the other end of a second external conduit connected to the liquid outlet of the water cooling radiator is connected to the adapter, the circulation pump is mounted on the second external conduit, and the adapter is connected to the liquid inlet of the internal liquid cooling plate via the second internal conduit; The laptop is internally provided with a first heat dissipation fin group and a second heat dissipation fin group that respectively cooperate with the first inner conduit and the second inner conduit. The first inner conduit and the second inner conduit, which are configured as flat tubes, each have at least one U-shaped segment. The areas of the first segment and the second segment at both ends of the U-shaped segment are parallel to each other and each has a bent portion that fits against the end face of the corresponding first heat dissipation fin group and the second heat dissipation fin group away from the inner liquid cooling plate, so that the same side surface of the first inner conduit and the second inner conduit respectively fits and contacts the two side surfaces of the corresponding first heat dissipation fin group and the second heat dissipation fin group. An external liquid cooling plate is connected between the liquid outlet end of the water cooling radiator and the second external conduit. The surface of the external liquid cooling plate opposite to the water cooling radiator is in contact with the cooling surface of a cooling chip. The heat dissipation surface of the cooling chip is in contact with a heat-conducting chip. Several spaced heat-conducting pipes each have one end connected to the heat-conducting chip and the other end extending away from the heat-conducting chip.

[0005] The following are further improvements to the above technical solution: 1. In the above solution, the adapter is installed on the laptop.

[0006] 2. In the above scheme, the two internal liquid cooling plates, which are connected in series via conduits, make thermal contact with the CPU chip and GPU chip inside the laptop, respectively.

[0007] 3. In the above scheme, both of the inner liquid cooling plates are mounted on a base plate, and the base plate is provided with a plurality of mounting holes spaced apart, and a plurality of bolts for connecting with the laptop pass through the corresponding mounting holes.

[0008] 4. In the above scheme, a spring is fitted on the outside of each bolt and between the base plate and the bolt cap.

[0009] 5. In the above scheme, a first fan is installed on the outside of the water cooling radiator.

[0010] 6. In the above scheme, the cooling chip is a semiconductor cooling chip or a TEC cooling chip.

[0011] 7. In the above scheme, the external liquid cooling plate is installed on the end face of the water cooling radiator near the adapter.

[0012] 8. In the above scheme, a second fan is provided on the side of the heat-conducting plate opposite to the external liquid cooling plate, and several heat-conducting pipes are respectively provided on both sides of the second fan. At least two heat-conducting pipes on the same side are each fitted with a third heat dissipation fin group on their outer side.

[0013] 9. In the above scheme, a water tank is provided on the second external conduit and located between the external liquid cooling plate and the circulating pump, and the water tank is located above the circulating pump.

[0014] Due to the application of the above technical solution, the present invention has the following advantages and effects compared with the prior art: This invention relates to a liquid cooling system for laptops. The laptop interior contains a first heat dissipation fin group and a second heat dissipation fin group, which respectively cooperate with a first inner conduit and a second inner conduit. The first and second inner conduits, configured as flat tubes, each have at least one U-shaped segment. The regions of the first and second segments near the U-shaped segments are parallel to each other, and each segment has a bent portion that fits against the end face of the corresponding first or second heat dissipation fin group away from the inner liquid cooling plate. This allows the same side surface of the first and second inner conduits to contact the two side surfaces of the corresponding first and second heat dissipation fin groups. An outer liquid cooling plate connects the liquid outlet of the radiator to the second outer conduit. The surface of the outer liquid cooling plate opposite to the radiator contacts the cooling surface of a cooling element. The heat dissipation surface of the cooling element contacts a heat-conducting plate. Each heat pipe, spaced apart, has one end connected to a heat-conducting fin, and the other end extends away from the fin. Through interconnected internal and external liquid cooling pipes, this design significantly improves the laptop's heat dissipation performance. It saves internal space while increasing the length of the liquid cooling pipes and the contact area between them and the cooling fins, further enhancing the laptop's internal cooling efficiency. Furthermore, the active cooling of the liquid in the external liquid cooling pipes further reduces the temperature of the liquid circulating back into the laptop, improving overall heat dissipation. Additionally, a water tank is installed on the second external conduit, located between the external liquid cooling plate and the circulation pump. This tank, positioned above the circulation pump, facilitates initial liquid injection and replenishment within the pipes, eliminates the need for self-priming by the circulation pump, and allows for the venting of gases from the pipes, improving the stability of various performance aspects during use. Attached Figure Description

[0015] Appendix Figure 1 This is a schematic diagram of the liquid cooling system for laptops according to the present invention; Appendix Figure 2 This is a partial structural diagram of the liquid cooling system for laptops according to the present invention. Figure 1 ; Appendix Figure 3 This is a partial structural diagram of the liquid cooling system for laptops according to the present invention. Figure 2 .

[0016] In the attached diagrams: 1. Inner liquid cooling plate; 2. Circulation pump; 3. Water cooling radiator; 41. First inner conduit; 42. Second inner conduit; 5. Adapter joint; 61. First outer conduit; 62. Second outer conduit; 71. First heat dissipation fin group; 72. Second heat dissipation fin group; 81. U-shaped section; 82. First section; 83. Second section; 9. Bending section; 10. First fan; 11. Outer liquid cooling plate; 12. Cooling chip; 13. Heat-conducting fin; 14. Heat-conducting pipe; 15. Water tank; 16. Second fan; 17. Third heat dissipation fin group; 18. Base plate; 181. Mounting hole; 19. Bolt; 191. Cap; 20. Spring. Detailed Implementation

[0017] The present patent can be further understood through the specific embodiments given below, but they are not intended to limit the present patent.

[0018] Example 1: A liquid cooling system for a laptop includes: at least one internal liquid cooling plate 1 for thermally contacting heat-generating elements inside the laptop, and a circulation pump 2 and a water cooling radiator 3 respectively disposed outside the laptop. One end of a first internal conduit 41 is connected to the liquid outlet of the internal liquid cooling plate 1, and the other end of the first internal conduit 41 is connected to one end of a first external conduit 61 through an adapter 5. The other end of the first external conduit 61 is connected to the liquid inlet of the water cooling radiator 3. The other end of a second external conduit 62, one end of which is connected to the liquid outlet of the water cooling radiator 3, is connected to the adapter 5. The circulation pump 2 is mounted on the second external conduit 62, and the adapter 5 is connected to the liquid inlet of the internal liquid cooling plate 1 through the second internal conduit 42. The laptop is internally provided with a first heat dissipation fin group 71 and a second heat dissipation fin group 72 that respectively cooperate with the first inner conduit 41 and the second inner conduit 42. The first inner conduit 41 and the second inner conduit 42, which are configured as flat tubes, each have at least one U-shaped segment 81. The areas of the first segment 82 and the second segment 83 located at both ends of the U-shaped segment 81 are parallel to each other and each has a bent portion 9 that fits with the end face of the corresponding first heat dissipation fin group 71 and the second heat dissipation fin group 72 away from the inner liquid cooling plate 1, so that the same side surface of the first inner conduit 41 and the second inner conduit 42 respectively fits and contacts the two side surfaces of the corresponding first heat dissipation fin group 71 and the second heat dissipation fin group 72. An external liquid cooling plate 11 is connected between the liquid outlet end of the water cooling radiator 3 and the second external conduit 62. The surface of the external liquid cooling plate 11 opposite to the water cooling radiator 3 is in contact with the cooling surface of a cooling chip 12. The heat dissipation surface of the cooling chip 12 is in contact with a heat-conducting plate 13. Several spaced heat-conducting pipes 14 each have one end connected to the heat-conducting plate 13 and the other end extending away from the heat-conducting plate 13.

[0019] The aforementioned adapter 5 is installed on the laptop; the two aforementioned internal liquid cooling plates 1, which are connected in series via conduits, respectively make thermal contact with the CPU chip and GPU chip inside the laptop. Two of the above-mentioned internal liquid cooling plates 1 are mounted on a base plate 18. The base plate 18 is provided with a plurality of mounting holes 181 spaced apart, and a plurality of bolts 19 for connecting to the notebook pass through the corresponding mounting holes 181 respectively. A spring 20 is fitted on the outside of each of the above bolts 19 and between the base plate 18 and the cap 191 of the bolt 19. This facilitates the installation of the internal liquid cooling plate and ensures the stability of the surface contact with the heat-generating components inside the notebook, thereby ensuring the stability of heat conduction and heat dissipation. A first fan 10 is installed on the outside of the water-cooled radiator 3; the first heat dissipation fin group 71 and the second heat dissipation fin group 72 are respectively disposed on both sides of the inner liquid cooling plate 1; the cooling chip 12 is a semiconductor cooling chip.

[0020] After the external liquid cooling pipes are connected to the internal liquid cooling module of the laptop (water cooling connectors are plugged in), the water inside the internal liquid cooling plate is heated by the CPU and GPU chips, and then enters the water cooling radiator driven by the circulating micro pump. Under the cooling of the axial fan, the water temperature drops and enters the external liquid cooling plate. The external liquid cooling plate is equipped with a TEC active cooling device. The cold side of the TEC is attached to the liquid cooling plate, and the hot side is attached to the heat pipe radiator. The cold side absorbs heat, causing the water temperature to drop further, and the heat generated by the hot side is dissipated through the heat pipe radiator. The further cooled water enters the water tank for storage and is then pumped into the laptop liquid cooling module by the micro pump to form the final circulation.

[0021] Example 2: A liquid cooling system for a laptop includes: at least one internal liquid cooling plate 1 for thermally contacting a heat-generating element inside the laptop, and a circulation pump 2 and a water cooling radiator 3 respectively disposed outside the laptop. One end of a first internal conduit 41 is connected to the liquid outlet of the internal liquid cooling plate 1, and the other end of the first internal conduit 41 is connected to one end of a first external conduit 61 via an adapter 5. The other end of the first external conduit 61 is connected to the liquid inlet of the water cooling radiator 3. The other end of a second external conduit 62, one end of which is connected to the liquid outlet of the water cooling radiator 3, is connected to the adapter 5. The circulation pump 2 is mounted on the second external conduit 62, and the adapter 5 is connected to the liquid inlet of the internal liquid cooling plate 1 via the second internal conduit 42. The laptop is internally provided with a first heat dissipation fin group 71 and a second heat dissipation fin group 72 that respectively cooperate with the first inner conduit 41 and the second inner conduit 42. The first inner conduit 41 and the second inner conduit 42, which are configured as flat tubes, each have at least one U-shaped segment 81. The areas of the first segment 82 and the second segment 83 located at both ends of the U-shaped segment 81 are parallel to each other and each has a bent portion 9 that fits with the end face of the corresponding first heat dissipation fin group 71 and the second heat dissipation fin group 72 away from the inner liquid cooling plate 1, so that the same side surface of the first inner conduit 41 and the second inner conduit 42 respectively fits and contacts the two side surfaces of the corresponding first heat dissipation fin group 71 and the second heat dissipation fin group 72. An external liquid cooling plate 11 is connected between the liquid outlet end of the water cooling radiator 3 and the second external conduit 62. The surface of the external liquid cooling plate 11 opposite to the water cooling radiator 3 is in contact with the cooling surface of a cooling chip 12. The heat dissipation surface of the cooling chip 12 is in contact with a heat-conducting plate 13. Several spaced heat-conducting pipes 14 each have one end connected to the heat-conducting plate 13 and the other end extending away from the heat-conducting plate 13.

[0022] The aforementioned cooling chip 12 is a TEC cooling chip; the aforementioned external liquid cooling plate 11 is installed on the end face of the water cooling radiator 3 near the adapter 5. A second fan 16 is provided on the side opposite to the external liquid cooling plate 11 of the aforementioned heat-conducting plate 13. Several heat-conducting pipes 14 are respectively provided on both sides of the second fan 16. At least two heat-conducting pipes 14 located on the same side are each fitted with a third heat dissipation fin group 17. A water tank 15 is provided on the second external conduit 62 and located between the external liquid cooling plate 11 and the circulating pump 2. The water tank 15 is located above the circulating pump 2.

[0023] The liquid cooling plate, circulating pump, water cooling radiator, and cooling chip can all be purchased externally and are within the scope of existing technology, so this application will not elaborate on them.

[0024] When the above-mentioned liquid cooling system for laptops is adopted, the liquid cooling pipelines that connect the inside and outside can greatly improve the heat dissipation performance of the laptop. At the same time, it can save internal space of the laptop, increase the length of the liquid cooling pipelines and the contact area between them and the heat dissipation fins, thereby further improving the heat dissipation efficiency inside the laptop. Furthermore, by actively cooling the liquid in the external liquid cooling pipelines, the temperature of the liquid circulating back into the internal liquid cooling pipelines of the laptop is further reduced, thus improving the heat dissipation effect inside the laptop. Furthermore, a water tank 15 is provided on the second external conduit 62 and located between the external liquid cooling plate 11 and the circulating pump 2. The water tank 15 is located above the circulating pump 2, which facilitates the initial injection and replenishment of liquid in the pipeline, eliminates the need for self-priming of the circulating pump, and facilitates the venting of gas in the pipeline, thereby improving the stability of various performance aspects during use.

[0025] The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement it accordingly. They should not be construed as limiting the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A liquid cooling system for laptops, comprising: At least one internal liquid cooling plate (1) for thermally contacting the heating element inside the notebook and a circulation pump (2) and a water cooling radiator (3) respectively disposed outside the notebook, characterized in that: one end of a first internal conduit (41) is connected to the liquid outlet end of the internal liquid cooling plate (1), the other end of the first internal conduit (41) is connected to one end of a first external conduit (61) through an adapter (5), the other end of the first external conduit (61) is connected to the liquid inlet end of the water cooling radiator (3), the other end of a second external conduit (62) connected to the liquid outlet end of the water cooling radiator (3) is connected to the adapter (5), the circulation pump (2) is installed on the second external conduit (62), and the adapter (5) is connected to the liquid inlet end of the internal liquid cooling plate (1) through the second internal conduit (42); The laptop is provided with a first heat dissipation fin group (71) and a second heat dissipation fin group (72) that cooperate with the first inner conduit (41) and the second inner conduit (42) respectively. The first inner conduit (41) and the second inner conduit (42) are flat tubes and each has at least one U-shaped segment (81). The areas of the first section (82) and the second section (83) at both ends of the U-shaped segment (81) are parallel to each other and each has a bend (9) that fits with the end face of the corresponding first heat dissipation fin group (71) and the second heat dissipation fin group (72) away from the inner liquid cooling plate (1), so that the same side surface of the first inner conduit (41) and the second inner conduit (42) respectively fits and contacts the two side surfaces of the corresponding first heat dissipation fin group (71) and the second heat dissipation fin group (72); An external liquid cooling plate (11) is connected between the liquid outlet end of the water cooling radiator (3) and the second external conduit (62). The surface of the external liquid cooling plate (11) opposite to the water cooling radiator (3) is in contact with the cooling surface of a cooling chip (12). The heat dissipation surface of the cooling chip (12) is in contact with a heat-conducting plate (13). Several spaced heat-conducting pipes (14) each have one end connected to the heat-conducting plate (13) and the other end of each extending away from the heat-conducting plate (13).

2. The notebook liquid cooling system according to claim 1, characterized in that: The adapter (5) is installed on the laptop.

3. The notebook liquid cooling system according to claim 1, characterized in that: The two internal liquid cooling plates (1), which are connected in series via conduits, make thermal contact with the CPU chip and GPU chip inside the laptop, respectively.

4. The notebook liquid cooling system according to claim 3, characterized in that: Both of the internal liquid cooling plates (1) are mounted on a base plate (18). The base plate (18) has a number of mounting holes (181) spaced apart, and a number of bolts (19) for connecting to the notebook pass through the corresponding mounting holes (181).

5. The notebook liquid cooling system according to claim 4, characterized in that: A spring (20) is fitted on the outside of each bolt (19) and between the base plate (18) and the cap (191) of the bolt (19).

6. The notebook liquid cooling system according to claim 1, characterized in that: A first fan (10) is installed on the outside of the water cooling radiator (3).

7. The notebook liquid cooling system according to claim 1, characterized in that: The cooling chip (12) is a semiconductor cooling chip or a TEC cooling chip.

8. The notebook liquid cooling system according to claim 1, characterized in that: The external liquid cooling plate (11) is installed on the end face of the water cooling radiator (3) near the adapter (5).

9. The notebook liquid cooling system according to claim 1 or 8, characterized in that: A second fan (16) is provided on the side opposite to the external liquid cooling plate (11) of the heat-conducting plate (13), and several heat-conducting pipes (14) are respectively provided on both sides of the second fan (16). At least two heat-conducting pipes (14) on the same side are each fitted with a third heat dissipation fin group (17).

10. The notebook liquid cooling system according to claim 1, characterized in that: A water tank (15) is provided on the second external conduit (62) and between the external liquid cooling plate (11) and the circulation pump (2), and the water tank (15) is located above the circulation pump (2).

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