Compact implantation system of chip capacitor

Abstract

The invention discloses a compact implanting system for chip capacitors. The compact implanting system comprises a feeding plate storage mechanism, an automatic discharging mechanism, an implanting mechanism, a leveling mechanism, a discharging buffering mechanism, a plate moving mechanism and a transferring mechanism. According to the compact implanting system of the chip capacitor, the operations of spreading, implanting and leveling of the capacitor which need to be manually completed in the traditional process are completely replaced, unmanned operation of the whole process from loading of the material loading plate to implanting completion is achieved, the labor cost can be effectively reduced through long-term operation, and the efficiency is improved. And meanwhile, product consistency fluctuation caused by manual operation difference is avoided. Besides, main procedures of the scheme adopt modular linear layout, material transfer among the main procedures is realized by the aid of a plate moving mechanism, and the whole equipment is small in occupied area, convenient to quickly deploy or transform in an existing production line, particularly applicable to small and medium-sized electronic component manufacturing workshops with limited spaces and high in production efficiency. And collaborative optimization of high efficiency, high yield, low cost and small occupied area is realized.

Description

Technical Field

[0001] This invention relates to the field of surface mount capacitor manufacturing equipment technology, and in particular to a compact implantation system for surface mount capacitors. Background Technology

[0002] With the rapid development of electronic technology, the types of electronic components are becoming increasingly diverse. As people's requirements for the quality of electronic products continue to improve, capacitors, as a basic and important electronic component, are also widely used in the production of electronic products, and the production and processing technology of capacitors is also constantly improving.

[0003] As one of the key processes in capacitor manufacturing, the sealing process plays a decisive role in the production efficiency, product performance, and quality of capacitors. The sealing process usually requires a sealing machine to complete.

[0004] To facilitate the mass production and sealing of surface mount capacitors, adhesive application and implantation are generally required before sealing. Specifically, the operator first prepares a carrier board, a fixing sticker, and unsealed surface mount capacitors. Then, the fixing sticker is affixed to one side of the carrier board, and the unsealed surface mount capacitors are manually spread on the other side of the carrier board so that they are implanted into the material holes of the carrier board. At the same time, one end of the surface mount capacitor is adhered to the fixing sticker. After the above operations are completed, the sealing machine performs silver printing for sealing.

[0005] As can be seen from the above, existing end-sealing machines can generally only perform the silver printing step in the end-sealing process, while the implantation step before the silver printing step needs to be completed manually, which greatly increases the labor cost in the end-sealing process; in addition, too much manual intervention is not conducive to improving the end-sealing efficiency of surface mount capacitors.

[0006] Although some manufacturers have attempted to develop auxiliary systems with automatic implantation functions, existing implantation devices generally suffer from problems such as complex structure, large size, and large footprint, making it difficult to integrate them compactly with existing end-sealing machines. They are especially unsuitable for small and medium-sized production lines with limited space, which restricts their promotion and application. Summary of the Invention

[0007] The purpose of this invention is to propose a compact implantation system for surface mount capacitors. This system is compact, saves space, and enables automated implantation of surface mount capacitors during the sealing process. It effectively improves the sealing efficiency of surface mount capacitors and helps reduce labor costs in the sealing process, thus overcoming the shortcomings of existing technologies.

[0008] To achieve this objective, the present invention adopts the following technical solution: A compact implantation system for surface mount capacitors includes a feeding and storage mechanism, an automatic unloading mechanism, an implantation mechanism, a leveling mechanism, an unloading buffer mechanism, a board transfer mechanism, and a transport mechanism. The feeding ends of the feeding plate mechanism, the implantation mechanism and the leveling mechanism are located on the same straight line. The plate moving mechanism is erected above the feeding plate mechanism, the implantation mechanism and the leveling mechanism, and the plate moving mechanism is used to realize the movement of the material plate between the feeding plate mechanism, the implantation mechanism and the leveling mechanism. The automatic feeding mechanism is located close to the implantation mechanism, and the automatic feeding mechanism is used to feed the chip capacitors into the implantation mechanism; The feeding buffer mechanism is located near the feeding end of the leveling mechanism, and the leveling mechanism is used to feed the carrier board with embedded chip capacitors into the feeding buffer mechanism. The feeding buffer mechanism is used to store the carrier board with embedded chip capacitors. The loading end of the transfer mechanism is located above the unloading buffer mechanism, and the transfer mechanism is used to unload the carrier board with embedded chip capacitors from the compact implantation system.

[0009] Preferably, the plate-moving mechanism includes a gantry frame, a first adsorption fixture, and a second adsorption fixture; The gantry frame is erected above the feeding end of the feeding storage plate mechanism, the implantation mechanism, and the leveling mechanism; the first adsorption fixture and the second adsorption fixture are installed on the gantry frame, and both the first adsorption fixture and the second adsorption fixture can move horizontally and vertically relative to the gantry frame, and the direction of the horizontal movement is parallel to the extension direction of the straight line. Both the first and second adsorption fixtures have multiple suction cups at their bottoms for adsorbing the material carrier plate.

[0010] Preferably, the plate-moving mechanism further includes an anti-static fan, which is installed on the rear side of the gantry frame, and the air outlet of the anti-static fan faces the implantation mechanism.

[0011] Preferably, the feeding storage plate mechanism and the unloading buffer mechanism have the same structure; The feeding and storage plate mechanism includes a storage plate seat and a lifting assembly; the storage plate seat has a storage plate cavity inside, and the lifting assembly is movably installed inside the storage plate cavity, and the top surface of the lifting assembly is used to place the material carrier plate; The lifting assembly includes a lifting platform, a guide rod, a sensing block, and a lifting detector. The lifting platform is located inside the storage plate cavity and can move up and down relative to the storage plate cavity. The guide rod is connected to the bottom of the lifting platform and extends vertically through the storage plate seat, and can move up and down relative to the storage plate seat. The sensing block is fixedly installed at the end of the guide rod, and the lifting detector is installed at the bottom of the storage plate seat, located on one side of the travel of the guide rod. The lifting detector is used to detect the position of the sensing block.

[0012] Preferably, the automatic feeding mechanism includes a feeding device, which includes a mounting base, a vibrator, a storage hopper, a discharge trough, a feeding hopper, and a stacking detector; The vibrator is mounted on the top of the mounting base, and the discharge chute is mounted on the top of the vibrator; The storage hopper is installed on the top of the discharge trough, and the discharge port of the storage hopper is located above the inlet end of the discharge trough; the discharge hopper is installed at the bottom of the discharge trough, and the inlet end of the discharge hopper is located below the discharge end of the discharge trough, and the discharge end of the discharge hopper is oscillating. The stacking detector is located near the discharge end of the discharge chute, and the detection end of the stacking detector faces the feed end of the discharge hopper. The stacking detector is used to detect the stacking height of the chip capacitors at the feed end of the discharge hopper. The stacking detector is electrically connected to the vibrator.

[0013] Preferably, the bottom of the discharge trough is horizontal.

[0014] Preferably, the implantation mechanism includes an implantation seat, a positioning seat, a feeding seat, and an electromagnet; the positioning seat is installed on the top front side of the implantation seat and is used to install a material carrier plate; the rear end of the implantation seat is connected to the rear end of the feeding seat through a bearing seat, and the feeding seat swings relative to the implantation seat. The feeding seat includes an implantation basket and a receiving box. The rear end of the implantation basket is sway-mounted on the bearing seat, and the receiving box is installed on the top of the rear end of the implantation basket. The receiving box is used to hold surface mount capacitors. The implantation basket has multiple implantation mesh holes, and the implantation mesh holes match the material holes of the carrier plate; the electromagnet is installed inside the implantation base, and the electromagnet is used to cause the chip capacitor to vibrate through the implantation mesh holes and fall into the material holes of the carrier plate. The implantation mechanism further includes a mounting base and a swing assembly. The mounting base is located below the implant, and the swing assembly is disposed between the mounting base and the swing assembly. The implant swings relative to the mounting base via the swing assembly, and the swing axis of the implant swinging relative to the mounting base is parallel to the swing axis of the feeding seat swinging relative to the implant. The swing assembly includes a bearing base and a swing arm. The bearing base is mounted on the top of the mounting base, and the middle part of the swing arm is mounted in the bearing of the bearing base via a pin. The swing arm rotates relative to the bearing base. The swing arm includes a connecting end and a counterweight end, and the connecting end is fixedly connected to the bottom of the implant.

[0015] Preferably, the oscillation assembly further includes a sensing plate and an oscillation sensor; The sensing element is protrudingly mounted on the outer wall of the counterweight end, and the swing sensor is mounted on the outer wall of the mounting base. The swing sensor is used to detect the position of the sensing element.

[0016] Preferably, the leveling mechanism includes a leveling platform, a leveling component, and a hammering component. The leveling component includes a pressure roller, which is used to make the top ends of the chip capacitors in the material holes of the carrier plate flush with each other. The leveling component is mounted on top of the leveling platform, and the leveling platform moves horizontally relative to the leveling component. The leveling component is located in the middle of the horizontal movement of the leveling platform, and the starting position of the horizontal movement of the leveling platform is the striking position, and the ending position of the horizontal movement of the leveling platform is the unloading position. The striking component is located on one side of the striking position, the feeding buffer mechanism is located on one side of the feeding position, and the striking component and the feeding buffer mechanism are located on the same side of the leveling platform. The leveling platform includes a platform body and a U-shaped flip frame. The U-shaped flip frame is embedded in the top of the platform body and flips relative to the platform body. The flip axis of the U-shaped flip frame is parallel to the horizontal movement direction of the leveling platform. The top of both the platform body and the U-shaped flipping frame are fitted with suction cups for adsorbing the material carrier plate; the U-shaped flipping frame is used to flip the material carrier plate into the interior of the striking component, and the striking component is used to strike the material carrier plate; the U-shaped flipping frame is also used to flip the material carrier plate into the unloading buffer mechanism for unloading.

[0017] Preferably, the striking assembly includes a receiving seat and a silicone hammer. The receiving seat is disposed on one side of the striking position, and the silicone hammer is mounted on the outside of the receiving seat. The silicone hammer swings relative to the receiving seat and is used to strike the carrier plate.

[0018] The technical solution provided by this invention may include the following beneficial effects: This solution proposes a compact implantation system for surface mount capacitors, completely replacing the manual operations of capacitor spreading, implantation, and leveling required in traditional processes. It achieves fully automated operation from substrate loading to implantation completion, effectively reducing labor costs in the long term and avoiding product consistency fluctuations caused by human error. Furthermore, the main processes of this solution adopt a modular linear layout and utilize a transfer mechanism to achieve material transfer between the main processes. The overall equipment has a small footprint, reducing space requirements by more than 40% compared to existing split implantation and sealing equipment. This facilitates rapid deployment or modification in existing production lines, making it particularly suitable for space-constrained small and medium-sized electronic component manufacturing workshops. It achieves synergistic optimization of high efficiency, high yield, low cost, and small footprint. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of a compact implantation system for a chip capacitor according to the present invention.

[0020] Figure 2 This is a partial structural schematic diagram of a compact implantation system for a surface-mount capacitor according to the present invention.

[0021] Figure 3 This is a partial structural schematic diagram of a compact implantation system for a surface-mount capacitor according to the present invention.

[0022] Figure 4 This is a partial top view of the compact implantation system for a surface-mount capacitor according to the present invention.

[0023] Figure 5 This is a schematic diagram of the feeding and storage plate mechanism in this invention.

[0024] Figure 6 This is a schematic diagram of the feeding and storage plate mechanism in this invention.

[0025] Figure 7 This is a schematic diagram of the feeding and storage plate mechanism in this invention.

[0026] Figure 8 This is a schematic diagram of the feeding and storage plate mechanism in this invention.

[0027] Figure 9 This is a schematic diagram of the automatic feeding mechanism in this invention.

[0028] Figure 10This is a schematic diagram of the automatic feeding mechanism in this invention.

[0029] Figure 11 This is a schematic diagram of the automatic feeding mechanism in this invention.

[0030] Figure 12 This is a cross-sectional view of the automatic feeding mechanism in this invention.

[0031] Figure 13 This is a schematic diagram of the implantation mechanism in this invention.

[0032] Figure 14 This is a schematic diagram of the implantation mechanism in this invention.

[0033] Figure 15 This is a schematic diagram of the implantation process of the implantation mechanism in this invention.

[0034] Figure 16 This is a side view of the implantation mechanism in this invention.

[0035] Figure 17 This is a schematic diagram of the leveling mechanism in this invention.

[0036] Figure 18 This is a schematic diagram of the leveling platform and the hammering component in this invention.

[0037] Figure 19 This is a schematic diagram of the leveling platform and leveling components in this invention.

[0038] Figure 20 This is a partial structural schematic diagram of the leveling mechanism in this invention.

[0039] The components include: a feeding storage plate mechanism 1, a storage plate seat 11, a storage plate base 111, a limiting post 112, a height detector 113, a lifting assembly 12, a lifting platform 121, a guide rod 122, a sensing block 123, a lifting detector 124, a fiber optic probe 125, a lifting drive assembly 13, a drive motor 131, a drive rod 132, a tray 14, a limiting groove 141, and a clearance hole 142; an automatic unloading mechanism 2, an unloading device 21, a mounting base 211, a slider 2111, a weight reduction chamber 2112, a vibrator 212, a storage hopper 213, a discharge chute 214, an unloading hopper 215, a stacking detector 216, an electric push rod 217, a movable base 22, a slide rail 221, and a cover plate 23; and an implantation mechanism 3, an implantation seat 31, an upper mounting plate 311, a support rod 312, a lower mounting plate 313, a positioning seat 32, an infeed seat 33, an implantation basket 331, and a receiving device. Box 332, electromagnet 34, mounting base 35, upper base plate 351, shock absorber 352, lower base plate 353, swing assembly 36, bearing base 361, swing arm 362, connecting end 3621, counterweight end 3622, sensing plate 363, swing sensor 364, limit swing column 365, drive wheel 366; leveling mechanism 4, leveling platform 41, platform body 411, U-shaped flip frame 412, receiving groove 413, leveling assembly 42, pressure roller 421, mounting bracket 422, brush 423, flatness detection assembly 424, detection roller 4241, level detector 4242, striking assembly 43, receiving seat 431, silicone hammer 432, flip detector 433; unloading buffer mechanism 5; plate shifting mechanism 6, gantry frame 61, first adsorption fixture 62, second adsorption fixture 63, antistatic fan 64; transfer mechanism 7; material carrier plate 8. Detailed Implementation

[0040] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0041] This technical solution provides a compact implantation system for surface mount capacitors, including a feeding and storage mechanism 1, an automatic unloading mechanism 2, an implantation mechanism 3, a leveling mechanism 4, an unloading buffer mechanism 5, a plate-shifting mechanism 6, and a transfer mechanism 7. The feeding ends of the feeding plate mechanism 1, the implantation mechanism 3 and the leveling mechanism 4 are located on the same straight line. The moving plate mechanism 6 is mounted above the feeding plate mechanism 1, the implantation mechanism 3 and the leveling mechanism 4, and the moving plate mechanism 6 is used to realize the movement of the material carrier plate 8 between the feeding plate mechanism 1, the implantation mechanism 3 and the leveling mechanism 4. The automatic feeding mechanism 2 is located close to the implantation mechanism 3, and the automatic feeding mechanism 2 is used to feed the chip capacitors into the implantation mechanism 3; The feeding buffer mechanism 5 is located near the feeding end of the leveling mechanism 4, and the leveling mechanism 4 is used to feed the carrier board 8 with embedded chip capacitors to the feeding buffer mechanism 5. The feeding buffer mechanism 5 is used to store the carrier board 8 with embedded chip capacitors. The loading end of the transfer mechanism 7 is located above the unloading buffer mechanism 5, and the transfer mechanism 7 is used to unload the carrier board 8 with embedded chip capacitors from the compact implantation system.

[0042] This technical solution provides a compact, highly automated, and efficient integrated solution for the automatic implantation and sealing of surface mount capacitors, which can work in conjunction with sealing machines. This overcomes the technical bottlenecks of existing technologies, such as high reliance on manual labor, low efficiency, and excessive equipment footprint, thereby improving the overall intelligence level and manufacturing competitiveness of capacitor sealing processes.

[0043] Specifically, such as Figure 1-4 As shown, the compact implantation system of this solution includes a loading and storage mechanism 1 for storing the carrier plate 8 to be implanted (with a fixing sticker attached to its bottom surface), an automatic feeding mechanism 2 for feeding the chip capacitors to the implantation mechanism 3, an implantation mechanism 3 for implanting the chip capacitors into the feeding holes of the carrier plate 8, a leveling mechanism 4 for effectively attaching the chip capacitors to the fixing stickers and making the ends of the chip capacitors flush, a plate moving mechanism 6 for moving the carrier plate 8 between the loading and storage mechanism 1, the implantation mechanism 3 and the leveling mechanism 4, a feeding buffer mechanism 5 for storing the carrier plate 8 with implanted chip capacitors, and a transfer mechanism 7 for feeding the carrier plate 8 into the compact implantation system.

[0044] The implantation process of this implantation system includes the following steps: First, the carrier plate 8 with a fixed sticker on its bottom surface is stored in the loading and storage mechanism 1; the carrier plate 8 located in the loading and storage mechanism 1 is moved to the implantation mechanism 3 by the transfer mechanism 6 for implantation of the chip capacitor; after implantation, the carrier plate 8 located in the implantation mechanism 3 is moved to the leveling mechanism 4 by the transfer mechanism 6 for leveling; after leveling, it is first stored in the unloading buffer mechanism 5 for buffering, and then the carrier plate 8 is unloaded from the compact implantation system by the transfer mechanism 7 to enter the next process.

[0045] This solution completely replaces the manual operations of capacitor spreading, implantation, and leveling in traditional processes, achieving fully automated operation from loading the carrier board 8 to completion of implantation. Long-term operation can effectively reduce labor costs and avoid product consistency fluctuations caused by variations in manual operation. Furthermore, the main processes of this solution adopt a modular linear layout and utilize a transfer mechanism 6 to achieve material transfer between the main processes. The overall equipment has a small footprint, reducing space occupation by more than 40% compared to existing split implantation and sealing equipment. This facilitates rapid deployment or modification in existing production lines, making it particularly suitable for space-constrained small and medium-sized electronic component manufacturing workshops, achieving synergistic optimization of high efficiency, high yield, low cost, and small footprint.

[0046] It should be noted that the transfer mechanism 7 in this solution is a conventional structure in this field and will not be described in detail here.

[0047] To further explain, the plate-shifting mechanism 6 includes a gantry frame 61, a first adsorption fixture 62, and a second adsorption fixture 63; The gantry frame 61 is mounted above the feeding end of the feeding storage plate mechanism 1, the implantation mechanism 3, and the leveling mechanism 4; the first adsorption fixture 62 and the second adsorption fixture 63 are installed on the gantry frame 61, and both the first adsorption fixture 62 and the second adsorption fixture 63 can move horizontally and vertically relative to the gantry frame 61, and the direction of the horizontal movement is parallel to the extension direction of the straight line. The bottom of both the first adsorption fixture 62 and the second adsorption fixture 63 is provided with a plurality of suction cups for adsorbing the material carrier plate 8.

[0048] This solution adds two sets of adsorption fixtures to the plate transfer mechanism 6, which helps to eliminate waiting time between process steps and improve the overall production cycle of surface mount capacitors.

[0049] Furthermore, the plate-moving mechanism 6 also includes an anti-static fan 64, which is installed on the rear side of the gantry frame 61, with the air outlet of the anti-static fan 64 facing the implantation mechanism 3.

[0050] During the implantation of surface mount capacitors, an ionized airflow is blown into the implantation mechanism 3 by an anti-static fan 64 to eliminate static electricity adsorption caused by friction, ensuring that the surface mount capacitors reliably fall into the material holes of the carrier plate 8 and adhere stably to the fixing sticker, avoiding implantation displacement or detachment caused by static electricity, and improving the end-capping yield.

[0051] To further clarify, the feeding storage plate mechanism 1 and the unloading buffer mechanism 5 have the same structure; The feeding and storage plate mechanism 1 includes a storage plate seat 11 and a lifting assembly 12; the storage plate seat 11 has a storage plate cavity inside, the lifting assembly 12 is movably installed inside the storage plate cavity, and the top surface of the lifting assembly 12 is used to place the material carrier plate 8. The lifting assembly 12 includes a lifting platform 121, a guide rod 122, a sensing block 123, and a lifting detector 124. The lifting platform 121 is located inside the storage plate cavity and can move up and down relative to the storage plate cavity. The guide rod 122 is connected to the bottom of the lifting platform 121 and extends vertically through the storage plate seat 11, and can move up and down relative to the storage plate seat 11. The sensing block 123 is fixedly installed at the end of the guide rod 122. The lifting detector 124 is installed at the bottom of the storage plate seat 11 and is located on one side of the travel of the guide rod 122. The lifting detector 124 is used to detect the position of the sensing block 123.

[0052] In this way, the loading and storage mechanism 1 can work in conjunction with the implantation mechanism 2. The lifting component 12, through height positioning, can ensure that the carrier plate 8 is in a matching position that the transfer mechanism 6 can easily pick up and place, thereby further improving the overall production cycle of the chip capacitors. Similarly, the unloading buffer mechanism 5 can work in conjunction with the leveling mechanism 4. The lifting component 12, through height positioning, can ensure that the lifting platform 121 is in a matching position that the leveling mechanism 4 can easily unload.

[0053] Specifically, such as Figure 5-8 As shown, the lifting assembly 12 of this solution includes a lifting platform 121, a guide rod 122, a sensing block 123, and a lifting detector 124. Firstly, the guide rod 122 improves the lifting stability of the lifting platform 121. Secondly, the sensing block 123 and the lifting detector 124 enable real-time monitoring of the lifting position of the lifting platform 121, thereby achieving real-time monitoring of the position of the material carrier plate 8. This ensures that the transfer mechanism 6 always picks up the material carrier plate 8 at the optimal height, effectively avoiding material picking failure, cycle time loss, and equipment collision risks caused by height deviation.

[0054] Preferably, the feeding storage plate mechanism 1 further includes a lifting drive assembly 13, which is installed at the bottom of the storage plate seat 11 and is used to drive the lifting assembly 12 to move up and down. The lifting drive assembly 13 includes a drive motor 131 and a drive rod 132; the drive motor 131 is installed at the bottom of the storage plate seat 11, and the drive rod 132 is connected to the bottom of the lifting platform 121 and extends vertically through the storage plate seat 11; the output end of the drive motor 131 is connected to the drive rod 132, and the drive motor 131 is used to drive the drive rod 132 to move up and down.

[0055] In a preferred embodiment of this technical solution, a drive motor 131 is used to drive the vertical drive rod 132 to move up and down, thereby driving the lifting platform 121 to rise and fall. The structure is compact and has good rigidity. Compared with the traditional pneumatic lifting method, this driving method runs smoothly and responds quickly, which can effectively ensure that the material plate 8 is always in the optimal pick-up and put-down position of the plate-shifting mechanism 6, significantly improving the automation level, operational reliability and production cycle of the equipment.

[0056] Preferably, the storage plate seat 11 includes a storage plate base 111 and limiting posts 112; multiple limiting posts 112 are provided, and the multiple limiting posts 112 are evenly distributed and protrude from the edge of the storage plate base 111, and the multiple limiting posts 112 together form the storage plate cavity.

[0057] In this way, the position of the material plate 8 stored in the loading and storage mechanism 1 can be effectively avoided during the lifting process, ensuring that it can be effectively picked up by the transfer mechanism 6.

[0058] Preferably, the storage plate base 11 further includes a height detector 113, which is protruding from the edge of the storage plate base 111 and is used to detect the stacking height of the material carrier plates 8.

[0059] In order to determine the number of remaining material plates 8 in the material storage mechanism 1, this solution also adds a height detector 113 in the storage plate seat 11. The height sensor 113 monitors the stacking height of the material plates 8 in the storage plate cavity, thereby determining the remaining amount of material plates 8, effectively preventing unplanned shutdowns caused by the depletion of material plates 8, and ensuring continuous production.

[0060] Preferably, the feeding and storage mechanism 1 further includes a tray 14, which is detachably placed on the top of the lifting platform 121, and the edge of the tray 14 abuts against the side walls of all the limiting posts 112; the tray 14 is used to place the material carrier plate 8. The top of the tray 14 is recessed downwards and a limiting groove 141 is provided, which is used to accommodate the material carrier plate 8.

[0061] In another preferred embodiment of this technical solution, the material carrier plate 8 can be placed by the tray 14. The tray 14 with the limiting groove 141 can ensure that the material carrier plate 8 is precisely aligned in the stacked state and achieve limited stacking. If it is directly stacked on the smooth lifting platform 121, relying solely on gravity stacking, it may be easy to cause interlayer misalignment due to slight tilt, edge burrs or electrostatic adsorption, which will affect the gripping accuracy of the plate transfer mechanism 6 or even cause plate jamming.

[0062] Preferably, the lifting assembly 12 further includes an optical fiber probe 125, which is embedded in the top surface of the lifting platform 121 and is used to detect the positioning of the tray 14.

[0063] This allows for quick and accurate determination of the location of pallet 14, ensuring the stable operation of the mechanism.

[0064] Preferably, the tray 14 is further provided with a vertically penetrating clearance hole 142, and the clearance hole 142 is located inside the limiting groove 141.

[0065] This facilitates the removal of the material carrier plate 8 that fits into the limiting groove 141 in the tray 14.

[0066] To further explain, the automatic feeding mechanism 2 includes a feeding device 21, which includes a mounting base 211, a vibrator 212, a storage hopper 213, a discharge chute 214, a feeding hopper 215, and a stacking detector 216. The vibrator 212 is mounted on the top of the mounting base 211, and the discharge chute 214 is mounted on the top of the vibrator 212; The storage hopper 213 is installed on the top of the discharge trough 214, and the discharge port of the storage hopper 213 is located above the inlet end of the discharge trough 214; the discharge hopper 215 is installed at the bottom of the discharge trough 214, and the inlet end of the discharge hopper 215 is located below the discharge end of the discharge trough 214, and the discharge end of the discharge hopper 215 is oscillating. The stacking detector 216 is located near the discharge end of the discharge chute 214, and the detection end of the stacking detector 216 faces the feed end of the discharge hopper 215. The stacking detector 216 is used to detect the stacking height of the chip capacitors at the feed end of the discharge hopper 215. The stacking detector 216 is electrically connected to the vibrator 212.

[0067] Currently, the industry generally uses a vibrating screening method to achieve automatic arrangement and implantation of surface mount capacitors: a large number of surface mount capacitors are put into the material box, and vibration is used to arrange the surface mount capacitors in an orderly manner and fall into the corresponding material holes of the carrier plate 8 below.

[0068] However, in existing technologies, the surface-mount capacitors in the material box typically rely on manual, intermittent replenishment. Operators must rely on experience to judge the timing and amount of replenishment to maintain an appropriate level of capacitors in the box. Too much material will prevent vibration energy from being effectively transferred to the bottom layer of product, making it difficult for the capacitors to tumble, orient, and fall, significantly reducing the screening rate. Too little material will result in insufficient product density in the vibrating screen area, incomplete filling of the material holes, also leading to a decrease in the screening rate. In addition, manual replenishment suffers from high subjectivity, uneven cycle time, and high labor intensity, making it difficult to meet the demands of high-speed, continuous production. Although some equipment has attempted to introduce automatic feeding devices, these are often complex in structure, costly, or not linked to the vibrating screen status, still unable to accurately control the material level in the vibrating screen box, making it difficult to achieve dynamic constant-volume feeding.

[0069] To address the aforementioned technical issues, this solution provides an automatic feeding mechanism 2 that is simple in structure, responds promptly, and can automatically adjust the feeding amount according to the actual state of the material. This solves the problem of unstable screening rate caused by improper manual feeding in the prior art, and improves the automation level and reliability of the chip capacitor implantation process.

[0070] Specifically, such as Figure 9-12 As shown, the automatic feeding mechanism 2 of this solution includes a feeding device 21. During operation, sufficient chip capacitors can be added to the storage hopper 213. When it is necessary to add chip capacitors to the implantation mechanism 3 through the automatic feeding mechanism 2, the vibrator 212 is activated. The vibration causes the chip capacitors located at the feeding end of the discharge trough 214 to be vibrated to their feeding end and fall into the feeding end of the feeding hopper 215. When the stacking detector 216 detects that the stacking height of the chip capacitors located at the feeding end of the feeding hopper 215 meets the implantation requirements, the vibrator 212 can be turned off to prevent the chip capacitors in the discharge trough 214 from continuing to fall into the feeding hopper 215. Then, the feeding end of the feeding hopper 215 is swung to make the chip capacitors fall from the feeding end of the feeding hopper 215, thus completing the automatic feeding process of the automatic feeding mechanism 2.

[0071] To further explain, the bottom of the discharge trough 214 is set horizontally.

[0072] This is more conducive to preventing the chip capacitors in the discharge trough 214 from continuing to fall into the feed hopper 215 when the vibrator 212 is turned off.

[0073] Preferably, the automatic feeding mechanism 2 further includes a movable base 22, and the feeding device 21 is horizontally movably mounted on the top of the movable base 22.

[0074] In a preferred embodiment of this technical solution, a movable base 22 is added for the horizontal movement of the feeding device 21. This allows the feeding device 21 to be positioned so as to avoid hindering the normal operation of other structures (such as the implantation mechanism 3) while ensuring automatic feeding. This is more conducive to ensuring the smooth progress of the implantation process while maintaining the compact structure of the implantation system.

[0075] Preferably, the top of the movable base 22 is provided with a slide rail 221, and the bottom of the mounting base 211 is provided with a slider 2111. The bottom of the slider 2111 is provided with a sliding groove, and the slider 2111 is horizontally matched and installed on the slide rail 221 through the sliding groove.

[0076] Thus, the structure is simple, the performance is reliable, and the movement is smooth.

[0077] Preferably, the automatic feeding mechanism 2 further includes a cover plate 23, the cover plate 23 being in the shape of an inverted U; The mounting base 211 has a weight-reducing cavity 2112 in the middle. The cover plate 23 passes through the weight-reducing cavity 2112 and is installed above the movable base 22. The cover plate 23 is used to cover the slide rail 221.

[0078] In a more preferred embodiment of this technical solution, a cover plate 23 is also provided above the movable base 22, which helps to prevent sporadic chip capacitors from falling to the top of the movable base 22 during the self-feeding process and hindering the horizontal movement of the feeding device 21.

[0079] Preferably, the feeding device 21 further includes an electric push rod 217, the mounting end of which is hinged to the mounting base 211, and the push-pull end of which is hinged to the feeding hopper 215. The electric push rod 217 is used to drive the oscillation of the feeding end of the feeding hopper 215.

[0080] Thus, when the push-pull end of the electric push rod 217 extends or retracts, it drives the hopper 215 to swing around the swing arm, resulting in a simple structure, low cost, and large thrust.

[0081] To further explain, the implantation mechanism 3 includes an implantation seat 31, a positioning seat 32, a feeding seat 33, and an electromagnet 34; the positioning seat 32 is installed on the top front side of the implantation seat 31, and the positioning seat 32 is used to install the material carrier plate 8; the rear end of the implantation seat 31 is connected to the rear end of the feeding seat 33 through a bearing seat, and the feeding seat 33 swings relative to the implantation seat 31. The feeding seat 33 includes an implantation basket 331 and a receiving box 332. The rear end of the implantation basket 331 is sway-mounted on the bearing seat, and the receiving box 332 is installed on the top of the rear end of the implantation basket 331. The receiving box 332 is used to hold surface mount capacitors. The implantation basket 331 has multiple implantation mesh holes, and the implantation mesh holes match the material holes of the carrier plate 8; the electromagnet 34 is installed inside the implantation base 31, and the electromagnet 34 is used to cause the chip capacitor to vibrate through the implantation mesh holes and fall into the material holes of the carrier plate 8. The implantation mechanism 3 further includes a mounting base 35 and a swing assembly 36. The mounting base 35 is located below the implant 31, and the swing assembly 36 is disposed between the mounting base 35 and the swing assembly 36. The implant 31 swings relative to the mounting base 35 through the swing assembly 36, and the swing axis of the implant 31 relative to the mounting base 36 is parallel to the swing axis of the feed seat 33 relative to the implant 31. The swing assembly 36 includes a bearing base 361 and a swing arm 362. The bearing base 361 is mounted on the top of the mounting base 35. The middle part of the swing arm 362 is mounted in the bearing of the bearing base 361 by a pin. The swing arm 362 rotates relative to the bearing base 361. The swing arm 362 includes a connecting end 3621 and a counterweight end 3622. The connecting end 3621 is fixedly connected to the bottom of the implant 31.

[0082] In existing chip capacitor implantation mechanisms, the chip capacitors to be implanted are typically poured into the top of the implantation basket from the feeding port of the feeding mechanism and piled up to a certain height on top of the implantation basket. This causes the chip capacitors to need to be dispersed from the piled state into a single layer flat state before falling into the material hole of the loading tray. This makes the implantation process take a lot of time, which not only reduces the implantation efficiency, but also increases the energy consumption of the vibrator and / or oscillator that realizes the shape change of the chip capacitor.

[0083] This solution proposes an implantation mechanism 3, such as Figure 13-16 As shown, by using a flip-type feeding method, the chip capacitor is directly laid flat on top of the implantation basket, thereby shortening the implantation time of the chip capacitor and reducing the energy consumption of the electromagnet that realizes the shape change of the chip capacitor, thus overcoming the shortcomings of the prior art.

[0084] Specifically, compared to existing chip capacitor implantation mechanisms, the implantation mechanism 3 of this solution mainly sets the feeding seat 33, including the implantation basket 331, as a flip-type feeding structure. That is, when the automatic feeding mechanism 2 delivers chip capacitors to the implantation mechanism 3, the receiving box 332 first receives the preset implantation quantity (i.e., the number of chip capacitors); then the feeding seat 33 swings relative to the implantation seat 31, causing the implantation basket 331 to rotate above the positioning seat 32 on which the carrier plate 8 is installed. During the swinging process, the chip capacitors can be laid relatively evenly on the surface of the implantation basket 331 under the combined action of the swing and their own gravity. Then, by changing the magnetic field inside the implantation basket 331 through the switching on and off of the electromagnet 34, the chip capacitors change their placement orientation and shape under the action of the magnetic field, thus achieving rapid implantation. Compared to existing chip capacitor implantation mechanisms that use a vibrator to disperse the chip capacitors from a stacked state into a single, flat layer during implantation, this solution utilizes a mechanical tilting action to quickly lay the chip capacitors flat on the surface of the implantation basket 331. This effectively shortens the implantation time and reduces the energy consumption of the electromagnet used to change the shape of the chip capacitors. Furthermore, it also effectively reduces the size of the implantation mechanism, making its structure more compact.

[0085] In one specific embodiment, the positioning seat 32 of this solution may be equipped with a positioning suction cup (not shown in the figure) to achieve stable installation of the material carrier plate 8 on the positioning seat 32.

[0086] Furthermore, in order to further shorten the implantation time and improve the implantation efficiency, this solution also sets the implantation seat 31 as a swing mechanism, realizes the swing of the implantation seat 31 relative to the mounting base 35 through the swing component 36, and adds a counterweight end 3622 to prevent the implantation seat 31 from being "top-heavy". Specifically, the implantation process of the implantation mechanism 3 in this solution includes the following steps: First, the unloaded carrier plate 8 is installed on the positioning seat 32, and at the same time, the chip capacitor is poured into the receiving box 332 by the automatic feeding mechanism 2 to wait for implantation; the feeding seat 33 is swung relative to the implantation seat 31, and the bottom of the implantation basket 331 abuts against the top of the positioning seat 32; so as to achieve a tight match between the implantation mesh of the implantation basket 331 and the material hole of the carrier plate 8, so that the chip capacitor can fall directly into the corresponding material hole after passing through the implantation mesh; then the implantation seat 31 is swung slightly relative to the mounting base 35, and the electromagnet 34 is turned on, so that the chip capacitor located in the implantation basket 331 falls into the corresponding material hole after passing through the implantation mesh under the dual action of the swing of the implantation seat 31 and the electromagnet 34, thus completing the implantation process.

[0087] Furthermore, the swing assembly 36 also includes a sensing plate 363 and a swing sensor 364; The sensing plate 363 is protrudingly mounted on the outer wall of the counterweight end 3622, and the swing sensor 364 is mounted on the outer wall of the mounting base 35. The swing sensor 364 is used to detect the position of the sensing plate 363.

[0088] In this way, the swing angle of the implantation seat 31 can be monitored in real time, thereby improving the controllability of the implantation process. It should be noted that the number and position of the swing sensors 364 installed in this solution can be determined according to the actual size of the implantation mechanism 3, and are not limited here.

[0089] Preferably, the swing assembly 36 further includes a limiting column 365, which is mounted on the top of the mounting base 35 and located on both sides of the bearing base 361. A swing gap is left between the top of the swing column 365 and the bottom of the implant 31.

[0090] By setting the swing limit column 365, the swing range of the implant 31 can be physically limited to prevent the implant 31 from falling due to excessive swing angle.

[0091] Preferably, the swing assembly 36 further includes a drive wheel 366, which is mounted in the bearing of the bearing base 361 via the pin, and the drive wheel 366 is rotatable relative to the bearing base 361. The rotation of the drive wheel 366 drives the rotation of the swing arm 362.

[0092] In this design, the rotation of the swing arm 362 can be driven by the rotation of the drive wheel 366, resulting in a simple structure and reliable performance. It should be noted that the rotation of the drive wheel 366 can be driven by a motor (not shown in the diagram) or by a transmission belt / chain (not shown in the diagram); this design does not impose any limitation on this.

[0093] Preferably, the mounting base 35 includes an upper substrate 351, a shock absorber 352, and a lower substrate 353 arranged sequentially from top to bottom; at least four shock absorbers 352 are provided, and the shock absorbers 352 are evenly distributed on the top edge of the lower substrate 353.

[0094] The shock absorber 352 can effectively buffer the vibration caused by the swing of the implant seat 31, thereby protecting other mechanical structures in the space where the implantation mechanism 3 is located.

[0095] Preferably, the implantation seat 31 includes an upper mounting plate 311, a support rod 312 and a lower mounting plate 313 connected sequentially from top to bottom, and the electromagnet 34 is mounted on the lower mounting plate 313, and the electromagnet 34 is located between the upper mounting plate 311 and the lower mounting plate 313; The implant 31 also includes a shock-absorbing plate, which rests between the electromagnet 34 and the lower mounting plate 313.

[0096] Since the electromagnet 34 generates a magnetic field by the flow of current in the wire, this magnetic field can attract or repel other magnetic materials. In order to avoid the electromagnet 34 causing resonance to the structure of other magnetic materials in the implantation mechanism 3, this solution also adds a damping plate (not shown in the figure) between the electromagnet 34 and the lower mounting plate 313 on which the electromagnet 34 is installed, so as to effectively alleviate the resonance phenomenon and prevent unnecessary vibration to other magnetic material structures.

[0097] It should be noted that the shock-absorbing pads in this solution include, but are not limited to, silicone pads, and the number of shock-absorbing pads can be set as needed and is not limited here. Additionally, the number of electromagnets 34 used in this solution is not limited here and can be set as needed based on the implantation effect.

[0098] To further explain, the leveling mechanism 4 includes a leveling platform 41, a leveling component 42, and a striking component 43. The leveling component 42 includes a pressure roller 421, which is used to make the top ends of the chip capacitors in the material holes of the carrier plate 8 flush with each other. The leveling component 42 is mounted on top of the leveling platform 41, and the leveling platform 41 moves horizontally relative to the leveling component 42. The leveling component 42 is located in the middle of the horizontal movement of the leveling platform 41, and the starting position of the horizontal movement of the leveling platform 41 is the striking position, and the ending position of the horizontal movement of the leveling platform 41 is the unloading position. The striking component 43 is located on one side of the striking position, the feeding buffer mechanism 5 is located on one side of the feeding position, and the striking component 43 and the feeding buffer mechanism 5 are located on the same side of the leveling platform 41. The leveling platform 41 includes a platform body 411 and a U-shaped flip frame 412. The U-shaped flip frame 412 is embedded in the top of the platform body 411 and flips relative to the platform body 411. The flip axis of the U-shaped flip frame 412 is parallel to the horizontal movement direction of the leveling platform 41. The top of both the platform body 411 and the U-shaped flipping frame 412 is inlaid with suction cups for adsorbing the material carrier plate 8; the U-shaped flipping frame 412 is used to flip the material carrier plate 8 into the interior of the striking component 43, and the striking component 43 is used to strike the material carrier plate 8; the U-shaped flipping frame 412 is also used to flip the material carrier plate 8 into the material feeding buffer mechanism 5 for feeding.

[0099] During the implantation of surface mount capacitors into the substrate holes, the small size and susceptibility to static electricity of the capacitors, coupled with machining tolerances or micro-burrs in the substrate holes, often result in some capacitors failing to fully sink to the bottom of the holes, exhibiting floating or incomplete mounting. This means that although the capacitor is located in the hole, its end is not in full contact with the fixing sticker. Such defects can easily lead to silver paste misalignment, electrode short circuits, or open circuits during subsequent silver printing and sealing processes. Furthermore, capacitors of inconsistent height may interfere with the sealing machine's scraper, causing equipment alarms or even component damage. Existing technologies mostly rely on natural settling or direct flattening, which are inefficient, inconsistent, and difficult to meet the demands of fully automated high-speed production.

[0100] To solve the above-mentioned technical problems, this technical solution proposes a simple and reliable leveling mechanism 4, such as... Figure 17-20 As shown, the assembly includes a leveling platform 41, a leveling component 42, and a tapping component 43. The leveling platform 41 is used to place the carrier plate 8 (with the chip capacitors protruding from the top surface of the carrier plate 8, and a fixing sticker adhered to the bottom surface of the carrier plate 8), and to move the carrier plate 8 between a tapping position and a feeding position. The leveling component 42 is used to flatten the ends of the chip capacitors in the feed holes of the carrier plate 8 using a pressure roller 421. The tapping component 43 is used to tap the side of the carrier plate 8 with the fixing sticker, applying a brief downward pressure to make the sticker tightly wrap around the upper surface of the capacitor, squeezing out air and enhancing adhesion. This ensures reliable adhesion while maximizing the protection of the fragile chip capacitors from mechanical damage. It can also clean up any unimplanted capacitors scattered on the surface of the carrier plate 8.

[0101] The working process of the leveling mechanism 4 in this solution is as follows: the carrier plate 8 with embedded chip capacitors is loaded onto the top of the leveling platform 41 located at the striking position. The carrier plate 8 is flipped into the inside of the striking component 43 by the U-shaped flipping frame 412 and struck. After the striking is completed, the U-shaped flipping frame 412 is reset. During the process of the leveling platform 41 moving to the unloading position, the carrier plate 8 is leveled by the leveling component 42. When the leveling platform 41 moves to the unloading position, the carrier plate 8 is flipped into the unloading buffer mechanism 5 by the U-shaped flipping frame 412 for unloading.

[0102] This solution effectively solves problems such as floating and incomplete bonding of chip capacitors caused by electrostatic adsorption, geometric interference, or insufficient adhesion by adding a taping process during the leveling process. It ensures that all capacitors are completely submerged in the material hole and reliably adhered to the fixing sticker. This not only significantly improves the accuracy and yield of subsequent silver printing and sealing, but also avoids the risk of equipment interference caused by inconsistent heights, thereby achieving a highly efficient and reliable fully automated leveling operation.

[0103] To further explain, the striking assembly 43 includes a receiving seat 431 and a silicone hammer 432. The receiving seat 431 is disposed on one side of the striking position, and the silicone hammer 432 is mounted on the outside of the receiving seat 431. The silicone hammer 432 swings relative to the receiving seat 431 and is used to strike the carrier plate 8.

[0104] In a preferred embodiment of this technical solution, a soft and elastic silicone hammer 432 is used to strike the carrier plate 8. This can evenly disperse the impact force, avoid localized high pressure, absorb excess energy, prevent brittle chip capacitors from cracking due to rigid impact, effectively adapt to the slight warping of the carrier plate 8, and achieve uniform pressing of the entire plate. The addition of the receiving seat 431 facilitates the recycling of unimplanted capacitors.

[0105] Preferably, the striking assembly 43 further includes a flip detector 433, which is installed on the outside of the receiving seat 431 and the detection end of the flip detector 433 faces the inside of the receiving seat 431. The flip detector 433 is used to detect the flipping position of the material carrier plate 8. The flip detector 433 is electrically connected to the swing driver of the silicone hammer 432.

[0106] This helps to speed up the production cycle and ensures the smooth and efficient progress of the leveling process.

[0107] Preferably, the leveling component 42 further includes a mounting bracket 422 and a brush 423; The mounting bracket 422 is mounted on the top of the leveling platform 41; the brush 423 is mounted on the mounting bracket 422 and can move up and down relative to the mounting bracket 422; the brush 423 is used to brush away the chip capacitors located on the surface of the carrier plate 8. The pressure roller 421 is rotatably mounted on the mounting bracket 422, and the pressure roller 421 can move up and down relative to the mounting bracket 422. The rotation axis of the pressure roller 421 is perpendicular to the horizontal movement direction of the leveling platform 41.

[0108] In another preferred embodiment of this technical solution, a brush 423 for brushing away chip capacitors located on the surface of the carrier plate 8 is also provided in the leveling component 42, so that the leveling process includes the following steps: the edge of the carrier plate 8 is moved directly below the brush 423 by the leveling platform 41, so that the brush 423 moves downward and contacts the surface of the carrier plate 8, and then the brush 423 sweeps away the chip capacitors (i.e., chip capacitors without implanted holes) located on the surface of the carrier plate 8 during the downward movement of the leveling platform 41; the brush 423 and the leveling platform 41 are reset, and then the pressure roller 421 is moved downward and abuts against the surface of the carrier plate 8, and then the pressure roller 421 rolls over the surface of the carrier plate 8 during the downward movement of the leveling platform 41, so that the chip capacitors implanted in the holes are tightly attached to the fixing sticker covering the bottom surface of the carrier plate 8, thereby ensuring that the chip capacitors are effectively attached to the fixing sticker and preventing the chip capacitors from falling off the carrier plate 8 during the silver printing and sealing process.

[0109] Preferably, the end of the leveling platform 41 is provided with a receiving groove 413 protruding outward, the receiving groove 413 being used to catch the chip capacitor brushed away by the brush 423.

[0110] This makes it easier to catch the surface-mount capacitors brushed away by the brush 423.

[0111] Preferably, the leveling component 42 further includes a flatness detection component 424, which is mounted on the mounting bracket 422. The flatness detection component 424 is used to detect whether the top of the chip capacitor in the material hole of the carrier plate 8 is flush, and the flatness detection component 424 is electrically connected to the pressure roller 421. The flatness detection assembly 424 includes a detection roller 4241 and a level detector 4242. The detection roller 4241 is rotatably mounted between two opposing inner sidewalls of the mounting bracket 422 via bearings, and the detection roller 4241 can move up and down relative to the mounting bracket 422. The detection roller 4241 is used to adhere to and roll over the surface of the material carrier plate 8. The level detector 4242 is mounted on the mounting bracket 422 and located above the two ends of the detection roller 4241, with the detection end of the level detector 4242 facing the end of the detection roller 4241. The level detector 4242 is used to detect whether the rotating shaft of the detection roller 4241 is horizontal.

[0112] To further ensure that the ends of the surface mount capacitors are flush, this solution also adds a flatness detection component 424 to the leveling mechanism 4 to detect whether the ends of the surface mount capacitors are flush. By setting up the horizontal detectors 4242 at both ends, it is possible to accurately detect whether the displacement of the two ends of the detection roller 4241 is the same, thereby determining whether the shaft of the detection roller 4241 is horizontal, and further determining whether the ends of the surface mount capacitors are flush.

[0113] The technical principles of the present invention have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of the invention and should not be construed as limiting the scope of protection of the invention in any way. Based on this explanation, those skilled in the art can readily conceive of other specific embodiments of the invention without inventive effort, and these embodiments will all fall within the scope of protection of the present invention.

Claims

1. A compact implantation system for surface mount capacitors, characterized in that: It includes a material storage plate mechanism, an automatic unloading mechanism, an insertion mechanism, a leveling mechanism, an unloading buffer mechanism, a plate shifting mechanism, and a transfer mechanism; The feeding ends of the feeding plate mechanism, the implantation mechanism and the leveling mechanism are located on the same straight line. The plate-moving mechanism is mounted above the feeding plate mechanism, the implantation mechanism and the leveling mechanism, and the plate-moving mechanism is used to realize the movement of the material plate between the feeding plate mechanism, the implantation mechanism and the leveling mechanism. The automatic feeding mechanism is located close to the implantation mechanism, and the automatic feeding mechanism is used to feed the chip capacitors into the implantation mechanism; The feeding buffer mechanism is located near the feeding end of the leveling mechanism, and the leveling mechanism is used to feed the carrier board with embedded chip capacitors to the feeding buffer mechanism. The feeding buffer mechanism is used to store the carrier board with embedded chip capacitors. The loading end of the transfer mechanism is located above the unloading buffer mechanism, and the transfer mechanism is used to unload the carrier board with embedded chip capacitors from the compact implantation system.

2. The compact implantation system for a surface mount capacitor according to claim 1, characterized in that: The plate-shifting mechanism includes a gantry frame, a first adsorption fixture, and a second adsorption fixture; The gantry frame is erected above the feeding end of the feeding storage plate mechanism, the implantation mechanism, and the leveling mechanism; the first adsorption fixture and the second adsorption fixture are installed on the gantry frame, and both the first adsorption fixture and the second adsorption fixture can move horizontally and vertically relative to the gantry frame, and the direction of the horizontal movement is parallel to the extension direction of the straight line. Both the first and second adsorption fixtures have multiple suction cups at their bottoms for adsorbing the material carrier plate.

3. The compact implantation system for a surface-mount capacitor according to claim 2, characterized in that: The plate-moving mechanism also includes an anti-static fan, which is installed on the rear side of the gantry frame and the air outlet of the anti-static fan faces the implantation mechanism.

4. The compact implantation system for a surface mount capacitor according to claim 1, characterized in that: The feeding storage plate mechanism and the unloading buffer mechanism have the same structure; The feeding and storage plate mechanism includes a storage plate seat and a lifting assembly; the storage plate seat has a storage plate cavity inside, and the lifting assembly is movably installed inside the storage plate cavity, and the top surface of the lifting assembly is used to place the material carrier plate; The lifting assembly includes a lifting platform, a guide rod, a sensing block, and a lifting detector. The lifting platform is located inside the storage plate cavity and can move up and down relative to the storage plate cavity. The guide rod is connected to the bottom of the lifting platform and extends vertically through the storage plate seat, and can move up and down relative to the storage plate seat. The sensing block is fixedly installed at the end of the guide rod, and the lifting detector is installed at the bottom of the storage plate seat, located on one side of the travel of the guide rod. The lifting detector is used to detect the position of the sensing block.

5. The compact implantation system for a surface-mount capacitor according to claim 1, characterized in that: The automatic feeding mechanism includes a feeding device, which includes a mounting base, a vibrator, a storage hopper, a discharge trough, a feeding hopper, and a stacking detector. The vibrator is mounted on the top of the mounting base, and the discharge chute is mounted on the top of the vibrator; The storage hopper is installed on the top of the discharge trough, and the discharge port of the storage hopper is located above the inlet end of the discharge trough; the discharge hopper is installed at the bottom of the discharge trough, and the inlet end of the discharge hopper is located below the discharge end of the discharge trough, and the discharge end of the discharge hopper is oscillating. The stacking detector is located near the discharge end of the discharge chute, and the detection end of the stacking detector faces the feed end of the discharge hopper. The stacking detector is used to detect the stacking height of the chip capacitors at the feed end of the discharge hopper. The stacking detector is electrically connected to the vibrator.

6. The compact implantation system for a surface-mount capacitor according to claim 5, characterized in that: The bottom of the discharge trough is set horizontally.

7. The compact implantation system for a surface mount capacitor according to claim 1, characterized in that: The implantation mechanism includes an implantation seat, a positioning seat, a feeding seat, and an electromagnet; the positioning seat is installed on the top front side of the implantation seat and is used to install a material carrier plate; the rear end of the implantation seat is connected to the rear end of the feeding seat through a bearing seat, and the feeding seat swings relative to the implantation seat. The feeding seat includes an implantation basket and a receiving box. The rear end of the implantation basket is sway-mounted on the bearing seat, and the receiving box is installed on the top of the rear end of the implantation basket. The receiving box is used to hold surface mount capacitors. The implantation basket has multiple implantation mesh holes, and the implantation mesh holes match the material holes of the carrier plate; the electromagnet is installed inside the implantation base, and the electromagnet is used to cause the chip capacitor to vibrate through the implantation mesh holes and fall into the material holes of the carrier plate. The implantation mechanism further includes a mounting base and a swing assembly. The mounting base is located below the implant, and the swing assembly is disposed between the mounting base and the swing assembly. The implant swings relative to the mounting base via the swing assembly, and the swing axis of the implant swinging relative to the mounting base is parallel to the swing axis of the feeding seat swinging relative to the implant. The swing assembly includes a bearing base and a swing arm. The bearing base is mounted on the top of the mounting base, and the middle part of the swing arm is mounted in the bearing of the bearing base via a pin. The swing arm rotates relative to the bearing base. The swing arm includes a connecting end and a counterweight end, and the connecting end is fixedly connected to the bottom of the implant.

8. The compact implantation system for a surface mount capacitor according to claim 7, characterized in that: The swing assembly also includes a sensing plate and a swing sensor; The sensing element is protrudingly mounted on the outer wall of the counterweight end, and the swing sensor is mounted on the outer wall of the mounting base. The swing sensor is used to detect the position of the sensing element.

9. The compact implantation system for a surface mount capacitor according to claim 1, characterized in that: The leveling mechanism includes a leveling platform, a leveling component, and a hammering component. The leveling component includes a pressure roller, which is used to make the top ends of the chip capacitors in the material holes of the carrier plate flush with each other. The leveling component is mounted on top of the leveling platform, and the leveling platform moves horizontally relative to the leveling component. The leveling component is located in the middle of the horizontal movement of the leveling platform, and the starting position of the horizontal movement of the leveling platform is the striking position, and the ending position of the horizontal movement of the leveling platform is the unloading position. The striking component is located on one side of the striking position, the feeding buffer mechanism is located on one side of the feeding position, and the striking component and the feeding buffer mechanism are located on the same side of the leveling platform. The leveling platform includes a platform body and a U-shaped flip frame. The U-shaped flip frame is embedded in the top of the platform body and flips relative to the platform body. The flip axis of the U-shaped flip frame is parallel to the horizontal movement direction of the leveling platform. The top of both the platform body and the U-shaped flipping frame are fitted with suction cups for adsorbing the material carrier plate; the U-shaped flipping frame is used to flip the material carrier plate into the interior of the striking component, and the striking component is used to strike the material carrier plate; the U-shaped flipping frame is also used to flip the material carrier plate into the unloading buffer mechanism for unloading.

10. A compact implantation system for a surface mount capacitor according to claim 9, characterized in that: The striking assembly includes a receiving seat and a silicone hammer. The receiving seat is located on one side of the striking position, and the silicone hammer is mounted on the outside of the receiving seat. The silicone hammer swings relative to the receiving seat and is used to strike the carrier plate.

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