Memory bank plugging device

Abstract

The embodiment of the invention provides a memory bank plugging device. The memory bank inserting and pulling device comprises a driving piece, a moving structure and an opening and closing piece. The moving structure is connected with the driving part so as to move in the first direction under the driving of the driving part; the moving structure is further used for being connected with the memory bank, and the moving structure is used for driving the memory bank to move in the direction close to or away from the memory connector in the first direction; a guide part is arranged on the opening and closing piece, at least part of the moving structure is matched with the guide part, and the moving structure moves along the guide part when driving the memory bank to move in the first direction so as to drive the opening and closing piece to rotate around the axis extending in the second direction, and the second direction intersects with the first direction; the opening and closing piece is used for being connected with a buckle of the memory connector so as to drive the buckle to be switched between the clamping position and the unlocking position in the rotating process, when the opening and closing piece is located at the clamping position, the buckle stretches into the containing space of the memory bank so as to lock the memory bank, and when the opening and closing piece is located at the unlocking position, the buckle is separated from the containing space so as to unlock the memory bank. And the efficiency of plugging and unplugging the memory bank is improved.

Description

Technical Field

[0001] This application relates to the field of server technology, and in particular to a memory module insertion and removal device. Background Technology

[0002] During server motherboard testing, memory modules need to be installed in the memory connectors of the motherboard under test as a load for memory stress testing, and then removed after the test. Memory connectors typically have latches that need to be manually opened or closed to connect or disconnect the memory modules, making the process cumbersome and inefficient.

[0003] In related technologies, an adapter card is placed on the memory connector, allowing the memory module to be electrically connected via the adapter card, thus eliminating the need for operating the clips. However, the adapter card introduces additional signal transmission loss, which can easily affect signal integrity, leading to memory stress test failure and impacting the reliability and efficiency of the test. Summary of the Invention

[0004] This application provides a memory insertion and removal device that can automatically insert and remove memory modules during testing, thereby improving the efficiency of memory module insertion and removal.

[0005] To achieve the above objectives, the embodiments of this application adopt the following technical solutions: In a first aspect, embodiments of this application provide a memory module insertion / removal device, comprising: Drive components; A movable structure is connected to a driving element to move along a first direction under the drive of the driving element; the movable structure is also used to connect a memory module, and the movable structure is used to drive the memory module to move along the first direction toward or away from the memory connector. The opening and closing component is provided with a guide portion, at least part of the moving structure cooperates with the guide portion, and moves along the guide portion when driving the memory module to move in the first direction, so as to drive the opening and closing component to rotate about an axis extending in the second direction, the second direction intersecting the first direction; The opening and closing mechanism is used to connect with the memory connector via a latch, so that the latch can switch between a latched position and an unlocked position during rotation. In the latched position, the latch extends into the receiving space of the memory module to lock the memory module. In the unlocked position, the latch disengages from the receiving space to unlock the memory module.

[0006] The memory insertion / removal device provided in this application includes a driving member and a moving structure. The driving member drives the moving structure to move along a first direction, causing the moving structure to move the memory module closer to or further away from the memory connector. Simultaneously, by introducing an opening / closing member, the movement of the moving structure along the first direction cooperates with the guide portion of the opening / closing member. This allows the moving structure to move the memory module along the first direction while simultaneously causing the opening / closing member to rotate around an axis extending along a second direction, switching the latch between an engaged position and an unlocked position to smoothly insert or remove the memory module from the memory connector. This automates and improves the efficiency of memory module insertion / removal during testing.

[0007] In one implementation, the guide portion is constructed as a guide groove, which includes a first guide segment and a second guide segment arranged and connected along a first direction, and the first guide segment is located on the side of the second guide segment away from the accommodating space of the memory module. The first guide section is inclined toward the central area of ​​the moving structure in a direction away from the second guide section; when the moving structure moves along the first guide section to the second guide section, it drives the opening and closing member to rotate around the axis extending along the second direction in the first clockwise direction, so that the buckle is in the unlocked position; when the moving structure moves along the second guide section to the first guide section, it drives the opening and closing member to rotate around the axis extending along the second direction in the second clockwise direction, so that the buckle is in the engaged position.

[0008] In this embodiment, the guide portion is constructed as a guide groove, and the guide groove includes a first guide segment and a second guide segment that are arranged and connected along a first direction. The moving structure cooperates with the first guide segment and the second guide segment so that the opening and closing component drives the latch to be in the unlocked position or the latched position. This enables the moving structure to automatically adjust the position of the latch during the insertion and removal of memory modules, thereby achieving automated insertion and removal of memory modules.

[0009] In one implementation, the guide slot further includes a third guide segment connected to the second guide segment, and the third guide segment is located on the side of the second guide segment near the accommodating space of the memory module, and the third guide segment is inclined toward the central region of the moving structure in a direction away from the second guide segment. When the moving structure moves from the second guide section to the third guide section, it causes the opening and closing component to swing around the axis extending along the second direction in the second clockwise direction, so that the buckle is in the engaged position; when the moving structure moves from the third guide section to the second guide section, it causes the opening and closing component to swing around the axis extending along the second direction in the first clockwise direction, so that the buckle is in the unlocked position.

[0010] In this embodiment, the third guide segment is used to enable the memory connector to snap into the memory module's accommodating space when it is mounted on the memory connector. This enhances the stability of the memory module in the memory connector, avoids the memory module from shaking or coming out during testing, and improves the accuracy of the test results.

[0011] In one implementation, the movement structure includes: A first movable member is connected to a drive member and extends into a guide groove so that it can move along the guide groove when moving in a first direction; The second moving part is used to connect the memory module; An elastic element is elastically connected between the first movable element and the second movable element along a first direction; The elastic element is configured as follows: When the first moving member moves toward the memory connector in the first direction, the second moving member is squeezed by the elastic member, and at least a portion of the first moving member moves along the third guide segment to press the memory module connected to the second moving member into the memory connector. The latch is switched to the latching position by the opening and closing member.

[0012] In this embodiment, the elasticity of the elastic element ensures stable contact between the memory module and the inner bottom wall of the memory connector, establishing a stable electrical connection and improving the stability of test results. Furthermore, the elastic element, connected between the first and second moving parts, helps to buffer the significant inertia of the first and second moving parts as they move downwards, reducing its impact on the memory module and lowering the risk of inertial damage.

[0013] In one implementation, the moving structure further includes a middleware connected to the second moving component; The first moving member has a receiving groove, and the intermediate member is positioned within the receiving groove so that the receiving groove restricts the movement of the second moving member along the first direction.

[0014] In this embodiment, the first moving member is connected to the driving member, and the second moving member is connected to the first moving member through an elastic member. By configuring the intermediate member connected to the second moving member in the receiving groove, the relative distance between the first moving member and the second moving member can be limited within the range allowed to move in the receiving groove, thereby improving the relative stability of the first moving member and the second moving member during movement.

[0015] In one implementation, the movable structure further includes a mating part that extends into the guide groove and is rotatable about an axis extending in a second direction, so as to be able to move along the guide groove.

[0016] In this embodiment, the moving structure rolls into the guide groove through the mating part, which helps to improve the smoothness of at least part of the moving structure moving along the guide groove.

[0017] In one implementation, the opening / closing component includes: The main body and the guide section are located within the main body. The actuating part has a first part and a second part that are angularly connected, and the first part is connected to the main body part, while the second part is used to connect with a snap fastener.

[0018] In one implementation, the memory module insertion / removal device includes two opening / closing components, which are located on both sides of the movable structure. The two opening / closing components are respectively used to connect with the latches on both sides of the memory connector, so as to drive the corresponding latches to switch between the engaged position and the unlocked position during rotation.

[0019] In this embodiment, when using a memory connector with double-sided latches, two opening / closing parts can be provided corresponding to the two latches of the memory connector. Each opening / closing part is provided with a guide portion, which cooperates with both sides of the movable structure to switch the corresponding latch between the engaged and unlocked positions.

[0020] In one implementation, the movable structure includes a first fixing block and a second fixing block arranged opposite each other along a third direction. The first fixing block and the second fixing block are capable of opening and closing in a direction toward each other to clamp the memory module; the third direction intersects with the first direction.

[0021] In this embodiment of the application, the memory module is clamped or removed by opening and closing the first fixing block and the second fixing block, thereby facilitating the replacement of the memory module according to different server motherboards.

[0022] In one implementation, the first fixing block has at least one first slot, and the second fixing block has at least one second slot corresponding to the first slot; The inner wall of the first slot is designed to mate with the first outer wall of the memory module; The inner wall of the second slot is used to mate with the second outer wall of the memory module, and the first and second outer walls of the memory module are arranged opposite to each other to clamp at least one memory module.

[0023] In this embodiment, the inner walls of the two slots contact the outer wall of the memory module, increasing the contact area between the first and second fixing blocks and the memory module when they clamp together, thereby improving the stability of the memory module clamped by the two fixing blocks.

[0024] In one implementation, the inner wall of the first slot, which is used to mate with the first outer wall of the memory module, is provided with a first elastic block; and / or, the inner wall of the second slot, which is used to mate with the second outer wall of the memory module, is provided with a second elastic block.

[0025] In this embodiment of the application, when the first fixing block and the second fixing block clamp the memory module in a direction toward each other, the first elastic block (second elastic block) can buffer the clamping force of the first fixing block and / or the second fixing block toward the memory module, reducing the risk of damage to the memory module. Attached Figure Description

[0026] Figure 1 This is a schematic diagram illustrating an application scenario of a testing device provided in an embodiment of this application; Figure 2 This is a schematic diagram of a memory module insertion / removal device provided in this application embodiment in a first state in an application scenario; Figure 3 yes Figure 2 The diagram shows the structure of the memory module insertion / removal device without the rotating support component. Figure 4 yes Figure 3 A magnified schematic diagram of point A in the memory module insertion / removal device shown; Figure 5a This is a schematic diagram of a memory module insertion / removal device provided in this application embodiment in a second state in an application scenario; Figure 5b This is a schematic diagram of a memory module insertion / removal device provided in this application embodiment in a third state in an application scenario; Figure 6 yes Figure 2 The diagram shows a partial structure of the memory module insertion / removal device without the intermediate components. Figure 7 This is a schematic diagram of the structure of the middleware in the memory module insertion and removal device provided in the embodiments of this application; Figure 8 This is a schematic diagram of the memory module insertion / removal device provided in this application embodiment at one angle; Figure 9 yes Figure 8 Enlarged structural diagram at point B; Figure 10 yes Figure 8 A schematic diagram of the structure at point B from another angle.

[0027] Explanation of reference numerals in the attached figures: 1000 - Test equipment; 400 - Server motherboard; 500 - Test unit; 300 - Test board; 301 - Test board connector; 302 - Cable; 303 - Memory connector; 3031 - Clip; 100 - Memory module insertion / removal device; 10 - Driver; 20 - Moving structure; T1 - First direction; 200 - Memory module; 30a - Main body; 30b - Actuating part; 301 - First section; 302 - Second section; 30 - Opening / closing part; 31 - Guide section; T2 - Second direction; 311 - First guide section; 312 - Second guide section; 315 - First transition section ; 313-Third guide section; 316-Second transition section; 21-First moving part; 22-Second moving part; 23-Elastic part; 24-Intermediate part; 211-Receiving groove; 241-First protrusion; 2111-Second protrusion; 242-Second protrusion; 221-Connecting groove; 101-Base; 102-Guide structure; 25-Matching part; 103-Rotating support; 104-Rotating shaft; 22a-First fixing block; 22b-Second fixing block; T3-Third direction; 2211-First slot; 28-First elastic block; 3032-Inclined surface; 303a-Slot. Detailed Implementation

[0028] The technical solutions of the embodiments of this application will now be described with reference to the accompanying drawings. To facilitate a clear description of the technical solutions of the embodiments of this application, the use of terms such as "first," "second," etc., in the embodiments of this application is for illustrative purposes and to distinguish the objects being described. There is no particular order between them, nor does it indicate a specific limitation on the number of devices in the embodiments of this application, and they do not constitute any limitation on the embodiments of this application.

[0029] To enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of this application.

[0030] It should be noted that many specific details are set forth in the following description in order to provide a full understanding of this application. However, this application may also be implemented in other ways different from those described herein. Therefore, the scope of protection of this application is not limited to the specific embodiments disclosed below.

[0031] In the description of this application, it should be understood that the terms "upper," "lower," "horizontal," "bottom," "inner," and "outer" (if any) indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. In this application, unless otherwise expressly specified and limited, "upper" or "lower" of the first feature and the second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium.

[0032] In this application, unless otherwise expressly specified and limited, the terms "connected," "linked," and "fixed," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral unit; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. However, specifying a direct connection indicates that the two entities at the point of connection are not connected through a transitional structure, but are simply linked together to form a whole. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0033] In this application, the use of terms such as "first," "second," etc., is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features.

[0034] Figure 1 This is a schematic diagram illustrating an application scenario of a testing device provided in an embodiment of this application.

[0035] Reference Figure 1 As shown, when the server motherboard 400 is tested by the test device 1000, the test device 1000 and the server motherboard 400 constitute a test system.

[0036] The testing equipment 1000 mainly includes a testing unit 500 and a test board 300. The testing unit 500 acts as the control center, responsible for issuing test commands and receiving the execution results of the test commands returned by the server motherboard 400. Based on the execution results, it determines whether the performance parameters of the server motherboard 400 are qualified. The test board 300 is connected between the testing unit 500 and the server motherboard 400. On one hand, it transmits the test commands output by the testing unit 500 to the server motherboard 400; on the other hand, it receives the execution results transmitted by the server motherboard 400 and sends the results back to the testing unit 500.

[0037] The testing equipment 1000 also includes a test board connector 301, a cable 302, and a memory connector 303. The test board connector 301 is mounted on the test board 300, and the memory connector 303 is mounted on the server motherboard 400. The test board connector 301 and the memory connector 303 are electrically connected via the cable 302 to establish a communication connection between the test board 300 and the server motherboard 400. Thus, test commands are output from the test board 300 and transmitted to the motherboard 400 via the test board connector 301, cable 302, and memory connector 303.

[0038] The test equipment 1000 proposed in this application embodiment also includes a memory module insertion / removal device 100 (see...). Figure 2 The memory module is used to load the memory module into the memory connector 303, connecting the memory module to the server motherboard 400 for testing. At this time, the memory module serves as the load for testing within the test system. After testing, the memory module insertion / removal device 100 is also used to remove the memory module from the memory connector 303, thereby automating and maximizing the insertion and removal of memory modules during testing.

[0039] Figure 2 This is a schematic diagram of a memory module insertion / removal device provided in this application embodiment in its first state in an application scenario. It should be noted that none of the accompanying drawings in this application show a comparison between the unlocked and engaged positions of the latch 3031; the latch 3031 in all the accompanying drawings is in the engaged position, and the working principle of the latch 3031 is based on the textual description.

[0040] Reference Figure 2 As shown in the embodiment of this application, the memory module insertion / removal device 100 includes a driving member 10 and a moving structure 20. The moving structure 20 is connected to the driving member 10 to move along a first direction T1 under the drive of the driving member 10.

[0041] The driving component 10 can be constructed as a motor or cylinder, etc. The embodiments of this application do not limit the type of driving component 10.

[0042] In some embodiments, the drive element 10 can be a linear motor, linear cylinder, or hydraulic cylinder, or other drive element capable of outputting linear motion. Then, the moving structure 20 is connected to the drive element 10 to move along the first direction T1 under the drive of the drive element 10.

[0043] In other embodiments, the driving component 10 is a rotary motor, rotary cylinder, or hydraulic motor, or other driving component capable of outputting rotational motion. The moving structure 20 can then be connected to the driving component 10 via a transmission structure, so that under the drive of the driving component 10, the moving structure 20 can move along the first direction T1 using the transmission structure.

[0044] In some examples, the transmission structure can be a lead screw and nut or a gear and rack structure, and the embodiments of this application do not limit the type of transmission structure.

[0045] In this embodiment, the movable structure 20 is also used to connect the memory module 200, and the movable structure 20 is used to drive the memory module 200 to move along the first direction T1 toward or away from the memory connector 303.

[0046] In some embodiments, the movable structure 20 can be connected to the memory module 200 in the following manner: the movable structure 20 can be provided with a slide rail locking assembly, the memory module 200 is embedded in the slide rail and the memory module is pushed to move relative to the slide rail, so that the memory module 200 is locked in the slide rail by the locking member, thereby realizing the connection of the movable structure 20 to the memory module 200.

[0047] In other embodiments, the movable structure 20 can also be connected to the memory module 200 in the following way: the movable structure 20 and the memory module 200 are bonded and fixed by an adhesive layer, thereby realizing the connection between the movable structure 20 and the memory module 200.

[0048] In the above scheme, the driving unit 10 can output movement in a first direction and a second direction. When the driving unit 10 outputs movement in the first direction, the moving structure 20 moves along the first direction T1 toward the memory connector 303, thereby driving the memory module 200 to move along the first direction T1 toward the memory connector 303. When the driving unit 10 outputs movement in the second direction, the moving structure 20 moves along the first direction T1 away from the memory connector 303, thereby driving the memory module 200 to move along the first direction T1 away from the memory connector 303. The first and second directions are two opposite directions.

[0049] In some examples, when the drive 10 is a drive that outputs linear motion, the first direction and the second direction can be two directions along the first direction T1.

[0050] In other examples, when the drive 10 is a drive that outputs rotational motion, the first direction and the second direction can be two different directions in which the drive 10 outputs rotation.

[0051] It should be noted that the first direction and the second direction can be determined according to the actual situation, so that when the driving member 10 outputs the first direction of movement, it drives the moving structure 20 to move along the first direction T1 towards the memory connector 303; when the driving member 10 outputs the second direction of movement, it drives the moving structure 20 to move along the first direction T1 away from the memory connector 303. The embodiments of this application do not limit the directions of the first direction and the second direction.

[0052] In this embodiment of the application, the memory module insertion and removal device 100 further includes an opening and closing member 30. The opening and closing member 30 is provided with a guide portion 31. At least a portion of the moving structure 20 cooperates with the guide portion 31 and moves along the guide portion 31 when driving the memory module 200 to move along the first direction T1, so as to drive the opening and closing member 30 to rotate around the axis extending along the second direction T2, where the second direction T2 intersects the first direction T1.

[0053] The opening and closing component 30 is used to connect with the latch 3031 of the memory connector 303 so that the latch 3031 can switch between the latched position and the unlocked position during rotation. In the latched position, the latch extends into the receiving space of the memory module 200 to lock the memory module 200. In the unlocked position, the latch 3031 disengages from the receiving space to unlock the memory module 200.

[0054] In some embodiments, the movable structure 20 can cooperate with the guide portion 31 to drive the opening / closing member 30 to rotate in the following manner: the movable structure 20 is provided with a connecting rod that can rotate about an axis extending about a second direction T2, and the end of the connecting rod is rotatably connected to the guide portion 31. When the driving member 10 drives the movable structure 20 to move along the first direction T1, the opening / closing member 30 rotates about an axis extending about the second direction T2 under the action of the cooperation between the connecting rod and the guide portion 31.

[0055] In other embodiments, the movable structure 20 can cooperate with the guide portion 31 to drive the opening / closing member 30 to rotate in the following manner: the movable structure 20 is provided with a rack extending along a first direction, and the guide portion is constructed as a gear. When the driving member 10 drives the movable structure 20 to move along the first direction T1, the movement of the movable structure 20 is converted into the rotation of the gear under the action of the rack and gear, so that the opening / closing member 30 rotates about the axis extending in the second direction T2.

[0056] It should be noted that the above two ways of cooperating between the moving structure 20 and the guide part 31 are only examples, and the embodiments of this application do not impose specific restrictions on the cooperation structure between the moving structure 20 and the guide part 31.

[0057] Among them, the second direction T2 can be referenced. Figure 2 The direction shown in T2 is not specifically limited in this embodiment of the application.

[0058] In some implementations, the opening / closing member 30 can be inserted into the latch 3031 of the memory connector 303, so that the opening / closing member 30 can drive the latch to switch between the engaged position and the unlocked position.

[0059] In other embodiments, the opening / closing member 30 can be bonded to the latch 3031 of the memory connector 303 so that the opening / closing member 30 can drive the latch to switch between the engaged position and the unlocked position.

[0060] It should be noted that the plug-in and adhesive connections are only examples of how the opening and closing component 30 can be connected to the buckle 3031. This application embodiment does not limit the connection method between the two.

[0061] Here, the accommodating space of the memory module 200 can be understood as the space occupied by the memory module 200 when it is mounted on the memory connector 303 and electrically connected to it. It is easy to understand that the latch 3031 is designed to interlock with the memory module 200; therefore, the memory module 200 will have a notch corresponding to the latch 3031, and this notch should also be understood as accommodating space.

[0062] In this embodiment, the latch 3031 is elastically connected to the memory connector 303 around an axis extending along the second direction T2. ​​In its free state, the latch 3031 is in the latched position, at which point the latch 3031 extends into the accommodating space of the memory module 200, preventing the memory module 200 from being inserted into the memory connector 303.

[0063] When the latch 3031 is rotated by the opening and closing component 30 towards the central area away from the moving structure, it switches to the unlocked position. At this time, the latch 3031 is disengaged from the accommodating space of the memory module 200, and the memory connector 303 can be used to insert the memory module 200.

[0064] A memory module insertion / removal device according to an embodiment of this application includes a driving member 10 and a moving structure 20. The driving member 10 drives the moving structure 20 to move along a first direction T1, causing the moving structure 20 to move the memory module 200 towards or away from the memory connector 303. Simultaneously, by introducing an opening / closing member 30, the movement of the moving structure 20 along the first direction T1 is coordinated with the guide portion 31 of the opening / closing member 30. This allows the moving structure 20 to move the memory module 200 along the first direction T1 while simultaneously causing the opening / closing member 30 to rotate around an axis extending along a second direction T2. ​​This causes the latch 3031 to switch between a latched position and an unlocked position, smoothly inserting or removing the memory module 200 from the memory connector 303. This achieves automation and high efficiency in inserting and removing the memory module 200 during testing.

[0065] Figure 3 yes Figure 2 The diagram shown illustrates the structure of the memory module insertion / removal device without the rotating support component. Figure 4 yes Figure 3 The diagram shows an enlarged view of point A in the memory module insertion / removal device.

[0066] The rotating support is used to cooperate with the opening and closing member 30 to realize the rotation of the opening and closing member 30 around the axis extending along the second direction T2. ​​The details are explained later.

[0067] Combination Figures 2 to 4 As shown, in some embodiments, the guide portion 31 is constructed as a guide groove, which includes a first guide segment 311 and a second guide segment 312 that are arranged and connected along the first direction T1, and the first guide segment 311 is located on the side of the second guide segment 312 away from the accommodating space of the memory module 200. The first guide segment 311 is inclined toward the central region of the movable structure 20 in a direction away from the second guide segment 312; when the movable structure 20 moves along the first guide segment 311 to the second guide segment 312, it drives the opening and closing member 30 to rotate around the axis extending along the second direction T2 in the first clockwise direction, so that the latch 3031 is in the unlocked position; when the movable structure 10 moves along the second guide segment 312 to the first guide segment 311, it drives the opening and closing member 30 to rotate around the axis extending along the second direction T2 in the second clockwise direction, so that the latch 3031 is in the engaged position.

[0068] Here, the first clockwise direction is consistent with the direction in which the latch 3031 rotates away from the center region of the moving structure 20, and the second clockwise direction is opposite to the first clockwise direction.

[0069] Figure 5a This is a schematic diagram illustrating a memory module insertion / removal device provided in this application embodiment in its second state in an application scenario. Figure 2 In the example, the moving structure 20 is located in the second guide segment 312. Figure 5a In the example, the moving structure 20 is located in the first guide segment 311.

[0070] Reference Figure 2 and Figure 5a As shown, in the above scheme, if the memory module 200 needs to be installed into the memory connector 303, the moving structure 20 is initially located in the first guide segment 311 of the guide portion 31. Accordingly, driven by the drive member 10, the moving structure 20 moves along the first guide segment 311 while driving the memory module 200 to move towards the memory connector 303 along the first direction T1 until it reaches the second guide segment 312. At this point, it drives the opening / closing member 30 to rotate around the axis extending along the second direction T2 in the first clockwise direction, causing the latch 3031 to be in the unlocked position. At this time, the memory connector 303 can be used to install the memory module 200. Accordingly, the moving structure 20 continues to drive the memory module 200 to move along the first direction T1 towards the memory connector 303 and within the second guide segment 312, so that the memory module 200 is loaded into the memory connector 303.

[0071] If it is necessary to remove the memory module 200 from the memory connector 303, the moving structure 20 is initially located at the second guide segment 312 of the guide portion 31, at which point the latch 3031 is in the unlocked position. Correspondingly, driven by the drive member 10, the moving structure 20 moves along the second guide segment 312 while moving the memory module 200 away from the memory connector 303 along the first direction T1, until the memory module 200 is removed from the memory connector 303. Simultaneously with the removal of the memory module 200 from the memory connector 303, the moving structure 20 moves from the second guide segment 312 to the first guide segment 311, causing the opening / closing member 30 to rotate around the axis extending along the second direction T2 in a second clockwise direction, so that the latch 3031 is in the engaged position. At this time, the memory connector 303 cannot be used to insert the memory module 200.

[0072] According to the memory module insertion and removal device 100 provided in the embodiments of this application: the guide portion 31 is constructed as a guide groove, and the guide groove includes a first guide segment 311 and a second guide segment 312 arranged and connected along the first direction T1. The moving structure 20 cooperates with the first guide segment 311 and the second guide segment 312, so that the opening and closing member 30 drives the latch 3031 to be in the unlocked position or the latched position; so that the moving structure 20 automatically adjusts the position of the latch 3031 during the insertion and removal of the memory module 200, thereby realizing automated insertion and removal of the memory module 200.

[0073] In some embodiments, the guide groove further includes a first transition section 315, which is smoothly connected between the first guide section 311 and the second guide section 312, so that the moving structure 20 can move between the first guide section 311 and the second guide section 312 via the first transition section 315. In this way, by providing the first transition section 315 between the first guide section 311 and the second guide section 312, at least a portion of the moving structure 20 can make stable contact with the inner walls of the first guide section 311, the first transition section 315, and the second guide section 312, which helps to improve the smoothness of the movement of the moving structure 20 between the first guide section 311 and the second guide section 312, and improves the operational stability of the memory module insertion / removal device 100.

[0074] In some examples, the extension surface of the first transition segment 315 is tangent to the extension surface of the first guide segment 311 near the end of the second guide segment 312, and the extension surface of the first transition segment 315 is tangent to the extension surface of the second guide segment 312 near the end of the first guide segment 311. Thus, the first guide segment 311 smoothly transitions to the second guide segment 312.

[0075] In some examples, the profile of the first transition segment 315 along the first direction T1 can be constructed as an arc.

[0076] Continue to refer to Figure 4As shown, in some embodiments, the guide groove further includes a third guide section 313 connected to the second guide section 312, and the third guide section 313 is located on the side of the second guide section 312 near the accommodating space of the memory module 200. The third guide section 313 is inclined towards the central region of the moving structure 20 in a direction away from the second guide section 312. When the moving structure 20 moves along the second guide section 312 to the third guide section 313, it causes the opening and closing member 30 to swing around the axis extending along the second direction T2 in a second clockwise direction, so that the latch 3031 is in the latched position; when the moving structure 20 moves along the third guide section 313 to the second guide section 312, it causes the opening and closing member 30 to swing around the axis extending along the second direction T2 in a first clockwise direction, so that the latch 3031 is in the unlocked position.

[0077] Figure 5b This is a schematic diagram illustrating a memory module insertion / removal device provided in this application embodiment in a third state within an application scenario. Figure 5b In the example, the moving structure 20 is located in the third guide segment 313.

[0078] Reference Figure 2 and Figure 5a and Figure 5b As shown, through the above scheme, during the process of installing the memory module 200 into the memory connector 303, the moving structure 20 drives the memory module 200 to move along the first direction T1 towards the memory connector 303 and within the second guide section 312. When the memory module 200 is installed in the memory connector 303, the moving structure 20 moves to the third guide section 313, causing the opening / closing member 30 to rotate around the axis extending along the second direction T2 in a second clockwise direction, so that the latch 3031 is in the latched position. Thus, by utilizing the third guide section 313, when the memory connector 200 is installed in the memory connector 303, the latch 3031 is engaged in the accommodating space of the memory module 200, enhancing the stability of the memory module 200 in the memory connector 303, preventing the memory module 200 from shaking or falling out during testing, and improving the accuracy of the test results.

[0079] If it is necessary to remove the memory module 200 from the memory connector 303, the moving structure 20 is initially located at the third guide segment 313 of the guide portion 31, at which time the latch 3031 is in the engaged position. Correspondingly, driven by the drive member 10, the moving structure 20 moves to the second guide segment 312 while moving the memory module 200 along the first direction T1 away from the memory connector 303, causing the opening / closing member 30 to rotate around the axis extending along the second direction T2 in the first clockwise direction, thus placing the latch 3031 in the unlocked position. Correspondingly, the moving structure 20 continues to move along the first direction T1 away from the memory connector 303 to remove the memory module 200 from the memory connector 303.

[0080] In some embodiments, the guide groove further includes a second transition section 316, which is smoothly connected between the second guide section 312 and the third guide section 313, so that the moving structure 20 can move between the second guide section 312 and the third guide section 313 via the second transition section 316. In this way, by providing the second transition section 316 between the second guide section 312 and the third guide section 313, at least a portion of the moving structure 20 can stably contact the inner walls of the second guide section 312, the second transition section 316, and the third guide section 313, which helps to improve the smoothness of the movement of the moving structure 20 between the second guide section 312 and the third guide section 313, and improves the operational stability of the memory module insertion / removal device 100.

[0081] In some examples, the extension surface of the second transition segment 316 is tangent to the extension surface of the second guide segment 312 near the end of the third guide segment 313, and is also tangent to the extension surface of the third guide segment 313 near the end of the second guide segment 312. Thus, the second guide segment 312 smoothly transitions to the third guide segment 313.

[0082] In some examples, the profile of the second transition segment 316 along the first direction T1 can be constructed as an arc.

[0083] In some embodiments, the movable structure 20 includes a first movable member 21, a second movable member 22, and an elastic member 23. The first movable member 21 is connected to the drive member 10 and extends into the guide groove so that it can move along the guide groove when moving in a first direction T1; the second movable member 22 is used to connect the memory module 200. The elastic member 23 is elastically connected between the first movable member 21 and the second movable member 22 in the first direction T1.

[0084] The elastic member 23 is configured such that when the first moving member 21 moves along the first direction T1 toward the memory connector 303, the elastic member 23 presses the second moving member 22, and at least a portion of the first moving member 21 moves along the third guide segment 313 to press the memory module 200 connected to the second moving member 22 into the memory connector 303, and the latch 3031 switches to the latching position under the action of the opening and closing member 30.

[0085] Reference Figure 2 and Figure 5bAs shown, in the above scheme, during the process of inserting the memory module 200 into the memory connector 303, the moving structure 20 drives the memory module 200 to move along the first direction T1 towards the memory connector 303 and within the second guide section 312. When the memory module 200 is loaded into the memory connector 303, the first moving member 21 continues to move to the third guide section 313, causing the opening / closing member 30 to rotate around the axis extending along the second direction T2 in a second clockwise direction, so that the latch 3031 is in the latched position. Simultaneously, the first moving member 21 continues to move along the first direction T1 towards the memory connector 303, using the elasticity of the elastic member 23 to press the second moving member 22, thereby pressing the memory module 200 into the memory connector 303. Thus, the elasticity of the elastic member 23 allows the memory module 200 to make stable contact with the inner bottom wall of the memory connector 303, establishing a stable electrical connection and improving the stability of the test results. In addition, the elastic element 23 is elastically connected between the first moving element 21 and the second moving element 22, which helps to buffer the large inertia when the first moving element 21 and the second moving element 22 move downward, reduce its effect on the memory module, and reduce the risk of inertial damage to the memory module 200.

[0086] In some embodiments, the elastic member 23 can be elastically connected between the first moving member 21 and the second moving member 22 in the following manner: the first moving member 21 has a first connecting portion on the side facing the second moving member 22, and the second moving member 22 has a second connecting portion on the side facing the first moving member 21; the opposite ends of the elastic member 23 are respectively connected to the first connecting portion and the second connecting portion. Thus, the elastic member 23 is elastically connected between the first moving member 21 and the second moving member 22 along a first direction T1.

[0087] In some examples, the elastic element 23 can be a rubber block, and the opposite ends of the rubber block can be interference-fitted into the first connecting part and the second connecting part, respectively.

[0088] In other examples, the elastic element 23 can be a spring, in which case the first connecting part can be constructed as a first threaded connecting part, and the second connecting part can be constructed as a second threaded connecting part, with the opposite ends of the spring along the deformation direction respectively threaded to the first threaded connecting part and the second threaded connecting part.

[0089] It should be noted that the rubber block and spring are only examples of elastic elements 23, and the embodiments of this application do not limit the types of elastic elements 23.

[0090] In some embodiments, the number of elastic elements 23 can be 2, 3, 4 or other numbers, and multiple elastic elements 23 are spaced apart between the first moving element 21 and the second moving element 22 to increase the uniformity of the elastic action between the first moving element 21 and the second moving element 22.

[0091] Figure 6 yes Figure 2 The schematic diagram shown is a partial structure of the memory module insertion and removal device without the intermediate component, illustrating the first and second moving components.

[0092] Reference Figure 6 As shown, in some embodiments, the moving structure 20 further includes an intermediate member 24 connected to the second moving member 22; the first moving member 21 has a receiving groove 211, and the intermediate member 24 is positioned within the receiving groove 211 so that the receiving groove 211 restricts the movement of the second moving member 22 along the first direction T1.

[0093] In the above scheme, the first moving member 21 is connected to the driving member 10, and the second moving member 22 is connected to the first moving member 21 through the elastic member 23. By configuring the intermediate member 24 connected to the second moving member 22 in the receiving groove 211, the relative distance between the first moving member 21 and the second moving member 22 can be limited within the range allowed to move in the receiving groove 211, thereby improving the relative stability of the first moving member 21 and the second moving member 22 during movement.

[0094] In some embodiments, the receiving groove 211 may be configured to be formed by drilling a hole inward along the second direction T2 from the outer wall of the first moving member 21.

[0095] In some examples, the intermediate component 24 can be embedded in the receiving groove 211. In this case, the elastic component 23 is mainly used to buffer the inertial force of the two moving components.

[0096] In other examples, the intermediate member 24 can move within the receiving groove 211 along the first direction T1, so that the first moving member 21 can move relative to the second moving member 22 along the first direction T1, which is beneficial to the cooperation of the first moving member 21 with the third guide section 313.

[0097] Figure 7 This is a schematic diagram of the middleware structure in the memory module insertion and removal device provided in the embodiments of this application.

[0098] Reference Figure 7 As shown, in some embodiments, the intermediate member 24 includes a first protrusion 241, and the inner wall of the receiving groove 211 may be provided with a second protrusion 2111 along the second direction T2. ​​When the first protrusion 241 and the second protrusion 2111 abut against each other in the first direction T1, the first moving member 21 and the second moving member 22 move to their maximum distance. Thus, the design configuration of the first protrusion 241 and the second protrusion 2111 maximizes the distance between the first moving member 21 and the second moving member 22.

[0099] In some embodiments, the dimension of the third guide segment 313 in the first direction T1 can be consistent with the movable dimension of the intermediate member 24 within the receiving groove 211 along the first direction T1. This allows for the cooperation between the first moving member 21 and the third guide segment 313.

[0100] In some embodiments, the second movable member 22 includes a connecting groove 221, and the intermediate member 24 further includes a second protrusion 242. The second protrusion 242 is fitted into the connecting groove 221, and a fastener is inserted through the second protrusion 242 and the connecting groove 221 to achieve a fixed connection between the intermediate member 24 and the second movable member 22. Thus, by fitting the second protrusion 242 into the connecting groove 221, the dimensions of the second movable member 22 and the intermediate member 24 in their overlapping direction are smaller, thereby reducing the structural size of the memory module insertion and removal device 100.

[0101] In some embodiments, the memory module insertion / removal device 100 further includes a base 101. The base 101 is used to secure the drive member 10.

[0102] In some embodiments, the memory module insertion / removal device 100 further includes a guide structure 102, which extends along a first direction T1 and is fixedly connected to the base 101. A first movable member 21 and a second movable member 22 are movably connected to the guide structure 102 along the first direction T1. In this way, the guide structure 102 can guide the first movable member 21 and the second movable member 22 to move along the first direction T1, improving the operational stability of the movable structure 20.

[0103] In some examples, the guide structure 102 can be a guide post that extends along the first direction T1 and is fixedly connected to the base 101. The first moving member 21 and the second moving member 22 are sleeved on the guide structure 102 so that the guide structure 102 guides the first moving member 21 and the second moving member 22 to move along the first direction T1.

[0104] In some examples, the guide structure 102 may include two guide posts spaced apart to improve the smoothness of the guide.

[0105] In some embodiments, the movable structure 20 further includes a mating portion 25 that extends into the guide groove and is rotatable about an axis extending along the second direction T2, so as to be able to move along the guide groove. Thus, the movable structure 20 rolls into the guide groove through the mating portion 25, which helps to improve the smoothness of at least a portion of the movable structure 20 moving along the guide groove.

[0106] In some examples, the mating part 25 can be a roller that is rotatably connected to the movable structure 20 about an axis extending along the second direction T2, so that the mating part 25 can roll along the guide groove when it moves along the guide groove, thereby reducing friction and making the mating of at least part of the movable structure 20 with the guide groove smoother.

[0107] In some embodiments, the opening / closing member 30 can rotate about an axis extending in the second direction in the following manner: The memory module insertion / removal device 100 also includes a rotating support 103 connected to the base 101, and an opening / closing member 30 rotatably connected to the rotating support 103 about an axis extending along the second direction T2. ​​Thus, with at least a portion of the moving structure 20 cooperating with the guide portion 31, the opening / closing member 30 can rotate relative to the rotating support 103 about an axis extending along the second direction T2.

[0108] In some examples, the opening / closing member 30 and the rotating support member 103 are rotatably connected by a rotating shaft 104. In other words, the rotating shaft 104 passes through the opening / closing member 30 and the rotating support member 103 along the second direction T2, so that the opening / closing member 30 can rotate about the axis of the rotating shaft 104.

[0109] Reference Figure 7 As shown, in some embodiments, the opening / closing member 30 includes a main body portion 30a and a toggle portion 30b. A guide portion 31 is provided on the main body portion 30a, and the toggle portion 30b has a first portion 301 and a second portion 302 connected at an angle, with the first portion 301 connected to the main body portion 30a and the second portion 302 used to connect with the latch 3031. Thus, the toggle portion 30b can easily extend to connect with the latch 3031 without interfering with the moving structure 20.

[0110] In some examples, the opening / closing member 30 also includes a reinforcing rib (not shown) connected between the first part 301 and the second part 302 to increase the rigidity of the actuating part 30b, prevent deformation when the actuating part 30b drives the buckle 3031 to rotate, and improve the accuracy of switching the buckle 3031 between the engaging and unlocking positions.

[0111] In some embodiments, the memory module insertion and removal device 100 includes two opening and closing parts 30, which are respectively located on both sides of the movable structure 20; the two opening and closing parts 30 are respectively used to connect with the latches 3031 on both sides of the memory connector 303, so as to drive the corresponding latches 3031 to switch between the engaged position and the unlocked position during rotation.

[0112] With the above solution, when using a memory connector 303 with double-sided latches 3031, two opening / closing parts 30 can be provided corresponding to the two latches 3031 of the memory connector 303. Each opening / closing part 30 is provided with a guide part 31, which cooperates with both sides of the moving structure 20 to switch the corresponding latch 3031 between the latched position and the unlocked position.

[0113] In some embodiments, the technical solution of one of the two opening and closing parts 30 can refer to the aforementioned embodiments of the opening and closing parts 30, and will not be repeated here.

[0114] In some embodiments, the movable structure 20 is provided with a first fixing block 22a and a second fixing block 22b disposed opposite to each other along a third direction T3. The first fixing block 22a and the second fixing block 22b can open and close in the direction facing each other to clamp the memory module 200; the third direction T3 intersects with the first direction T1. Thus, by opening and closing the first fixing block 22a and the second fixing block 22b, the memory module 200 can be clamped or removed, thereby facilitating the replacement of the memory module 200 according to different server motherboards 400.

[0115] In some embodiments, the first fixing block 22a is rotatably connected to one side of the second moving member 22 along the third direction T3 about an axis extending along the second direction T2. ​​The second fixing block 22b is rotatably connected to the other side of the second moving member 22 along the third direction T3 about an axis extending along the second direction T2, so that the first fixing block 22a and the second fixing block 22b can open and close in the direction facing each other.

[0116] Figure 8 This is a schematic diagram of the memory module insertion and removal device provided in this application embodiment at one angle. Figure 9 yes Figure 8 A magnified structural diagram at point B in the middle.

[0117] Reference Figure 8 and Figure 9 As shown, in some embodiments, the first fixing block 22a has at least one first slot 2211, and the second fixing block 22b has at least one second slot (not shown) corresponding to the first slot 2211. The inner wall of the first slot 2211 is used to mate with the first outer wall of the memory module 200; The inner wall of the second slot is used to mate with the second outer wall of the memory module 200, and the first and second outer walls of the memory module 200 are arranged opposite to each other to clamp at least one memory module 200. Thus, by providing a first slot 2211 in the first fixing block 22a and a second slot in the second fixing block 22b, the contact area between the inner walls of the two slots and the outer walls of the memory module 200 is increased when the first fixing block 22a and the second fixing block 22b clamp the memory module 200, thereby improving the stability of the two fixing blocks clamping the memory module 200.

[0118] In some embodiments, the first fixing block 22a has a first slot 2211, and the second fixing block 22b has a second slot corresponding to the first slot 2211. In this case, the first fixing block 22a and the second fixing block 22b can hold a memory module 200.

[0119] In other embodiments, the first fixing block 22a has a plurality of first slots 2211, which are spaced apart along the second direction T2. ​​The second fixing block 22b has a plurality of second slots corresponding to the first slots 2211. In this case, the first fixing block 22a and the second fixing block 22b can hold multiple memory modules 200. Thus, when the server motherboard 400 can be equipped with multiple memory connectors 303, multiple memory modules 200 can be inserted and removed simultaneously using the memory module insertion and removal device 100, thereby improving the efficiency of inserting and removing memory modules 200.

[0120] Figure 10 yes Figure 8 A schematic diagram of the structure at point B from another angle.

[0121] Reference Figure 10 As shown, in some embodiments, the inner wall of the first slot 2211, which is used to mate with the first outer wall of the memory module 200, is provided with a first elastic block 28. Therefore, when the first fixing block 22a and the second fixing block 22b clamp the memory module 200 in directions relative to each other, the first elastic block 28 can buffer the clamping force of the first fixing block 22a toward the memory module 200, reducing the risk of damage to the memory module 200.

[0122] In some embodiments, the first elastic block 28 is disposed on the inner bottom wall of the first slot 2211. Thus, the clamping force of the first fixing block 22a and the second fixing block 22b acting on the memory module 200 is directed along the inner bottom wall of the first slot 2211 toward the memory module 200, and the first elastic block 28 is placed on the inner bottom wall of the first slot 2211 to buffer the clamping force.

[0123] Reference Figure 10As shown, in some embodiments, the inner wall of the second slot, which mates with the second outer wall of the memory module 200, is provided with a second elastic block. Therefore, when the first fixing block 22a and the second fixing block 22b clamp the memory module 200 in directions relative to each other, the second elastic block can buffer the clamping force of the second fixing block 22b toward the memory module 200, reducing the risk of damage to the memory module 200.

[0124] In some implementations, the technical solution of the second elastic block can refer to the implementation of the first elastic block 28, and will not be repeated here.

[0125] Reference Figure 9 As shown, in some embodiments, in the test device 1000 provided in the present application, the memory connector 303 is provided with an inclined surface 3032 that forms an angle with the first direction T1, for guiding the memory module 200 to be loaded into the memory connector 303.

[0126] In some embodiments, the memory connector 303 is provided with a slot 303a, and the memory module 200 is loaded into the slot 303a, that is, loaded into the memory connector 303. A bevel 3032 may be provided on the side surface of the slot 303a for insertion of the memory module 200.

[0127] The above embodiments are merely specific embodiments of this application and are not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, improvements, etc., made based on the technical solution of this application should be included within the scope of protection of this application.

Claims

1. A memory module insertion and removal device, characterized in that, include: Drive components; A movable structure is connected to the driving element to move along a first direction under the drive of the driving element; the movable structure is also used to connect a memory module, and the movable structure is used to drive the memory module to move along the first direction toward or away from the memory connector; The opening and closing component is provided with a guide portion, at least a portion of the moving structure cooperates with the guide portion, and moves along the guide portion when driving the memory module to move along the first direction, so as to drive the opening and closing component to rotate about an axis extending along a second direction, the second direction intersecting the first direction; The opening and closing component is used to connect with the latch of the memory connector, so that the latch can be switched between a latched position and an unlocked position during rotation. In the latched position, the latch extends into the receiving space of the memory module to lock the memory module. In the unlocked position, the latch disengages from the receiving space to unlock the memory module.

2. The memory module insertion and removal device according to claim 1, characterized in that, The guide portion is constructed as a guide groove, which includes a first guide segment and a second guide segment arranged and connected along a first direction, and the first guide segment is located on the side of the second guide segment away from the accommodating space of the memory module. The first guide segment is inclined toward the central region of the movable structure in a direction away from the second guide segment; when the movable structure moves along the first guide segment to the second guide segment, it drives the opening and closing member to rotate around the axis extending along the second direction in a first clockwise direction, so that the buckle is in the unlocked position; when the movable structure moves along the second guide segment to the first guide segment, it drives the opening and closing member to rotate around the axis extending along the second direction in a second clockwise direction, so that the buckle is in the engaged position.

3. The memory module insertion / removal device according to claim 2, characterized in that, The guide groove further includes a third guide section connected to the second guide section, and the third guide section is located on the side of the second guide section near the accommodating space of the memory module. The third guide section is inclined toward the central region of the moving structure in a direction away from the second guide section. When the moving structure moves along the second guide section to the third guide section, it causes the opening and closing member to swing around the axis extending along the second direction in a second clockwise direction, so that the buckle is in the engaging position; when the moving structure moves along the third guide section to the second guide section, it causes the opening and closing member to swing around the axis extending along the second direction in a first clockwise direction, so that the buckle is in the unlocking position.

4. The memory module insertion / removal device according to claim 3, characterized in that, The movable structure includes: A first movable member is connected to the drive member and extends into the guide groove so that it can move along the guide groove when moving in the first direction; The second moving part is used to connect the memory module; An elastic element is elastically connected between the first movable element and the second movable element along the first direction; The elastic element is configured as follows: As the first movable member moves toward the memory connector along the first direction, the second movable member is squeezed by the elastic member, and at least a portion of the first movable member moves along the third guide segment to press the memory module connected to the second movable member into the memory connector. The latch is switched to the latching position by the opening and closing member.

5. The memory module insertion and removal device according to claim 4, characterized in that, The moving structure further includes an intermediate component connected to the second moving component; The first moving member has a receiving groove, and the intermediate member is used to be located in the receiving groove; So that the receiving groove restricts the movement of the second moving member along the first direction.

6. The memory module insertion and removal device according to claim 2, characterized in that, The movable structure further includes a mating part that extends into the guide groove and is rotatable about an axis extending in a second direction, so as to be able to move along the guide groove.

7. The memory module insertion and removal device according to any one of claims 1 to 6, characterized in that, The opening / closing component includes: The main body, wherein the guide portion is disposed on the main body; The actuating part has a first part and a second part that are angularly connected, wherein the first part is connected to the main body and the second part is used to connect with the buckle.

8. The memory module insertion and removal device according to any one of claims 1 to 6, characterized in that, The memory module insertion and removal device includes two opening and closing components, which are respectively located on both sides of the movable structure; The two opening and closing components are respectively used to connect with the latches on both sides of the memory connector, so as to drive the corresponding latches to switch between the engaged position and the unlocked position during rotation.

9. The memory module insertion and removal device according to claim 8, characterized in that, The movable structure includes a first fixing block and a second fixing block arranged opposite each other along a third direction. The first fixing block and the second fixing block are capable of opening and closing in a direction toward each other to clamp the memory module. The third direction intersects with the first direction.

10. The memory module insertion and removal device according to claim 9, characterized in that, The first fixing block has at least one first slot, and the second fixing block has at least one second slot corresponding to the first slot. The inner wall of the first slot is used to mate with the first outer wall of the memory module; The inner wall of the second slot is used to mate with the second outer wall of the memory module, and the first and second outer walls of the memory module are arranged opposite to each other to clamp at least one memory module.

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