Jet liquid cooling heat dissipation device for chip cooling

Abstract

The invention discloses a jet liquid cooling heat dissipation device for chip cooling, and belongs to the technical field of chip cooling, the jet liquid cooling heat dissipation device comprises a jet cooling mechanism capable of being installed on a circuit board chip, the jet cooling mechanism comprises a cover body, a flow guide defoaming assembly and a jet assembly are arranged in the cover body and are communicated with each other, and the jet assembly comprises an annular groove body and a bottom cover. A plurality of groups of nozzles are arranged on the inner edge of the annular groove body, and the plurality of groups of nozzles are a first group of nozzles, a second group of nozzles and a third group of nozzles in sequence from top to bottom in the vertical direction. In the heat dissipation process, cooling liquid gathers towards the center in a vortex mode and is sucked nearby to accelerate backflow, the turbulent flow problem caused by multiple nozzles is effectively solved, the air resistance occurrence probability is reduced, efficient and stable heat dissipation is guaranteed, the spraying angle is increased along with temperature rise of a chip, the flow path is optimized, and the heat dissipation efficiency is improved. And the appearance of a static liquid film is effectively inhibited, the condition of hot spots is avoided, and the heat load is better adapted.

Description

Technical Field

[0001] This invention relates to integrated circuit manufacturing, specifically to the technical field of chip jet cooling, and more specifically to a jet liquid cooling heat dissipation device for chip cooling. Background Technology

[0002] A chip is a core electronic device that integrates a large number of transistors and circuits on a semiconductor silicon wafer through processes such as photolithography and etching. It is the "brain" of electronic devices. As the integration and computing speed of chips continue to increase, their power consumption and heat flux density increase dramatically. If the heat generated cannot be dissipated in time, it will cause the chip temperature to rise, which will not only trigger automatic frequency reduction and reduce computing performance, but also accelerate transistor aging and shorten its lifespan. In severe cases, it may even cause thermal breakdown and burn out the chip. Therefore, it is necessary to cool and dissipate heat from the chip.

[0003] Currently, there are four main heat dissipation methods: First, air cooling, which uses a fan to accelerate airflow and remove heat from the heat sink on the chip surface; this method is simple in structure and low in cost. Second, cold plate liquid cooling, which uses coolant to circulate inside a metal cold plate and indirectly absorbs heat from the chip through a thermal interface material; this method is more efficient than air cooling. Third, immersion liquid cooling, which immerses the chip directly in an insulating coolant and relies on liquid convection and phase change to absorb and dissipate heat; this method is suitable for high heat flux density scenarios. Fourth, jet liquid cooling, which uses nozzles to spray high-speed jets of coolant directly onto the chip surface, breaking the thermal boundary layer and enhancing heat transfer; this is one of the most efficient and precise heat dissipation methods currently available.

[0004] The main structure of current chip jet liquid cooling devices consists of a sealed cover, nozzles, a coolant supply system, and a return device. The coolant is jetted at high speed onto the chip surface through the nozzles to achieve heat exchange. To further improve heat dissipation efficiency and adapt to the increasing heat flux density requirements of chips, it is usually necessary to increase the number of nozzles to expand the effective contact area between the coolant and the chip. However, increasing the number of nozzles can easily cause multiple jets to collide and interfere with each other, forming turbulence, which can damage the jet shear force and lead to the formation of a static liquid film on the chip surface, hindering heat transfer. At the same time, the interaction between jets and local overheating can cause gas to be released or undergo phase change in the coolant to generate bubbles. These bubbles are difficult to expel quickly and tend to accumulate in the flow channels and on the chip surface, forming gas resistance, which can seriously reduce heat exchange efficiency and even cause the risk of gas lock. Summary of the Invention

[0005] This invention addresses the problem of overly simplistic solutions in existing technologies by providing a significantly different approach. The chip jet cooling technology of this invention pertains to integrated circuit manufacturing and primarily offers a jet liquid cooling device for chip cooling. This addresses the issue raised in the background section where increasing the number of nozzles is commonly used to improve jet cooling efficiency. However, the collision and interference of multiple jets create turbulence, reducing shear strength and causing a static liquid film to form on the chip surface, thus hindering heat transfer.

[0006] The technical solution adopted by the present invention to solve the above-mentioned technical problems is as follows: A liquid cooling device for chip cooling includes a jet cooling mechanism that can be mounted on a circuit board chip. The jet cooling mechanism includes a detachable cover, the lower side of which is bonded to the upper side of the circuit board chip with sealant. A flow guiding and defoaming component and a jetting component are disposed within the cover. The jetting component is located below the flow guiding and defoaming component and is connected to it. The flow guiding and defoaming component includes a lower housing, an upper housing, and a return flow component. A rotating shaft and a first impeller on the rotating shaft are disposed within the cavity formed by the lower and upper housings. The lower end of the rotating shaft passes through the lower housing and extends into the return flow component. At the bottom of the cavity, the spraying assembly includes an annular groove and a bottom cover. An annular floating block capable of moving up and down is provided in the cavity formed by the annular groove and the bottom cover. Multiple guide holes are equally spaced around the annular floating block. Multiple sets of nozzles are provided on the inner edge of the annular groove. Each set of nozzles is tilted downward and aimed at the upper side of the circuit board chip. The multiple sets of nozzles are arranged vertically from top to bottom as the first set of nozzles, the second set of nozzles, and the third set of nozzles. The angle between each nozzle of the first set of nozzles, the second set of nozzles, and the third set of nozzles and the central axis of the annular groove increases from top to bottom.

[0007] Preferably, each of the first group of nozzles, the second group of nozzles, and the third group of nozzles is distributed at equal intervals around the inner edge of the annular groove.

[0008] Preferably, the outer wall of the annular groove is threaded with multiple connecting copper tubes. Each connecting copper tube is located in the middle position above two adjacent guide holes. The upper end of each guide hole is flared, and each guide hole and the corresponding nozzle in each group of nozzles are in the same vertical plane.

[0009] Preferably, a limiting block is provided on one side of the inner wall of the annular groove, and the limiting block is slidably connected to a limiting groove, which is provided on one side of the outer wall of the annular floating block. Both the inner and outer walls of the annular floating block are provided with annular sealing coatings.

[0010] Preferably, the annular groove and the bottom cover are connected by bolts, and a reset spring is also provided in the cavity formed by the annular groove and the bottom cover. The reset spring is located on the lower side of the folded edge of the annular floating block.

[0011] Preferably, the lower housing and the upper housing are connected by a threaded connection. The lower housing has multiple interfaces arranged at equal intervals around its lower side, and each interface is threaded to the upper end of a corresponding connecting copper pipe. An inlet pipe is provided on one side of the upper surface of the upper housing.

[0012] Preferably, the rotating shaft is further provided with a second impeller and a defoaming blade, and the second impeller is located at the bottom end of the rotating shaft.

[0013] Preferably, the reflux component includes a reflux hood and a reflux cylinder, and the reflux hood and the reflux cylinder are threaded together. The reflux hood covers the second impeller, the defoaming blade is located inside the reflux cylinder, an outlet pipe is provided on one side of the outer wall of the reflux cylinder, and a connecting frame is provided on the upper side of the outer wall of the reflux cylinder. The connecting frame is connected to the lower side of the outer wall of the lower housing by bolts.

[0014] Preferably, shaft seals are provided at each mating point between the rotating shaft and the upper housing, lower housing, and reflux cylinder.

[0015] Preferably, a display screen with a temperature sensor is provided on the upper side of the outer wall of the cover, and a disc motor is also provided inside the cover, with the output end of the disc motor connected to the upper end of the rotating shaft.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows: (1) The present invention, through the setting of a cover, display screen, disc motor, lower shell, upper shell, inlet pipe, rotating shaft, return component, outlet pipe, spray assembly, second impeller, connecting frame, shaft seal and first impeller, realizes that in the process of spraying cooling of chip, the coolant vortex is formed by multiple nozzles, which effectively expands the contact range between coolant and chip surface, greatly improves heat dissipation coverage, and at the same time, with the help of the negative pressure suction formed by the second impeller in the return cover, the coolant gathered on the chip surface can be actively recovered directly, avoiding the turbulence problem caused by long-distance liquid flow in the traditional return method, significantly reducing the bubbles generated by mutual interference of jets, and reducing the probability of air resistance problem; Furthermore, through the cooperation between the rotating shaft, reflux cylinder, reflux shroud, and defoaming blades, the defoaming blades cut and break up air bubbles in the coolant during the reflux process, completely avoiding the risk of air resistance caused by the accumulation of large air bubbles, ensuring the smooth circulation of coolant. The synergistic effect of negative pressure suction and vortex jet allows the coolant to evenly cover the entire chip area, preventing uneven heat dissipation and hot spots caused by local heat dissipation blind spots. At the same time, the shearing force brought by the vortex disrupts the formation conditions of the thermal boundary layer, effectively reducing the probability of static liquid film formation and improving the uniformity and stability of heat dissipation.

[0017] (2) The present invention, through the setting of annular groove, limiting block, bottom cover, connecting copper pipe, first set of nozzles, second set of nozzles, third set of nozzles, annular floating block, guide hole, limiting groove and reset spring, realizes that during the chip cooling process, as the chip temperature rises, the speed of the disc motor driven shaft increases, driving the first impeller to generate a greater negative pressure, which not only accelerates the flow speed of the coolant in the whole system, but also allows the high temperature coolant after heat absorption to be carried away more quickly, further improving the cooling and heat dissipation efficiency; Meanwhile, the increased hydraulic pressure pushes the annular floating block downwards to switch between different groups of nozzles, achieving dynamic adjustment of the spray angle according to temperature. The gradual increase in the spray angle optimizes the flow path of the coolant, avoids the problem of liquid film stacking caused by excessive jet velocity in the central area, effectively eliminates uneven heat dissipation, and the larger spray angle can generate stronger flow field shear force, significantly enhance shear heat transfer efficiency, destroy the formation of static liquid film, and thus greatly improve heat transfer efficiency, further ensuring the efficient and stable operation of the heat dissipation system.

[0018] The present invention will be explained in detail below with reference to the accompanying drawings and specific embodiments. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the jet cooling mechanism of the present invention; Figure 3 This is an exploded view of the jet cooling mechanism of the present invention; Figure 4 This is a schematic diagram of the flow guiding and defoaming component and the spraying component of the present invention; Figure 5 This is an exploded view of the flow guiding and defoaming component of the present invention; Figure 6 This is an exploded view of the reflow component of the present invention; Figure 7 This is an exploded view of the spray assembly of the present invention; Figure 8 This is a schematic diagram of the internal structure of the annular groove of the present invention; Figure 9 This is a top view of the annular groove of the present invention; Figure 10 This is a schematic cross-sectional view of the annular floating block of the present invention; Figure 11 For the present invention Figure 9 Enlarged diagram of area A.

[0020] In the diagram: 1. Circuit board chip; 2. Jet cooling mechanism; 21. Cover; 22. Display screen; 23. Disc motor; 3. Flow guiding and defoaming assembly; 31. Lower housing; 311. Interface; 32. Upper housing; 321. Inlet pipe; 33. Rotating shaft; 34. Return component; 341. Return cylinder; 342. Return cover; 343. Outlet pipe; 35. First impeller; 36. Defoaming blade; 37. Second impeller; 38. Connecting frame; 39. Shaft seal; 4. Jet assembly; 41. Annular groove; 411. Limiting block; 42. Bottom cover; 43. Connecting copper pipe; 44. First set of nozzles; 45. Second set of nozzles; 46. Third set of nozzles; 47. Annular floating block; 471. Flow guiding hole; 472. Limiting groove; 473. Annular sealing coating; 48. Return spring. Detailed Implementation

[0021] To facilitate understanding of the present invention, a more comprehensive description of the present invention will be given below with reference to the accompanying drawings, which illustrate several embodiments of the present invention. However, the present invention can be implemented in different forms and is not limited to the embodiments described in the text. Rather, these embodiments are provided to make the disclosure of the present invention more thorough and complete.

[0022] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly associated with those skilled in the art to which this invention pertains. The terminology used herein in the specification of this invention is for the purpose of describing particular embodiments and is not intended to limit the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0024] Example 1, please refer to the appendix for details. Figure 1-11As shown, a liquid cooling device for chip cooling includes a jet cooling mechanism 2 that can be mounted on a circuit board chip 1. The jet cooling mechanism 2 includes a detachable cover 21, the lower side of which is bonded to the upper side of the circuit board chip 1 with sealant. A flow guiding and defoaming component 3 and a jetting component 4 are disposed inside the cover 21. The jetting component 4 is located below the flow guiding and defoaming component 3 and is connected to it. The flow guiding and defoaming component 3 includes a lower housing 31, an upper housing 32, and a return component 34. A rotating shaft 33 and a first impeller 35 on the rotating shaft 33 are disposed in the cavity formed by the lower housing 31 and the upper housing 32. The lower end of the rotating shaft 33 passes through the lower housing 31 and extends to the bottom of the cavity of the return component 34. The spraying assembly 4 includes an annular groove 41 and a bottom cover 42. An annular floating block 47 capable of moving up and down is provided in the cavity formed by the annular groove 41 and the bottom cover 42. Multiple guide holes 471 are equally spaced around the annular floating block 47. Multiple sets of nozzles are provided on the inner edge of the annular groove 41. Each set of nozzles is tilted downward and aligned with the upper side of the circuit board chip 1. The multiple sets of nozzles are arranged vertically from top to bottom as a first set of nozzles 44, a second set of nozzles 45, and a third set of nozzles 46. The angle between each nozzle of the first set of nozzles 44, the second set of nozzles 45, and the third set of nozzles 46 and the central axis of the annular groove 41 increases from top to bottom. The nozzles in the same set are in the same horizontal plane.

[0025] Through the above structure, the coolant is made to gather towards the center in the form of a vortex during the cooling and heat dissipation process of the circuit board chip 1, and the negative pressure suction accelerates the return flow. This effectively reduces the turbulence caused by multiple nozzles, reduces the probability of air resistance caused by bubbles, and ensures efficient and stable heat dissipation. Furthermore, as the chip temperature rises, the spray angle is increased and the flow path is optimized, which effectively suppresses the formation of static liquid film, avoids hot spots, and better adapts to the heat load.

[0026] The specific operation is as follows: First, the cover 21 of the spray cooling mechanism 2 is glued to the circuit board chip 1 that needs to be cooled using sealant. Then, the inlet pipe 321 and outlet pipe 343 are connected to the coolant supply system (the coolant supply system is existing equipment and is not shown in the diagram). Next, the disc motor 23 is turned on to drive the rotating shaft 33 to rotate. As a result, the first impeller 35 above the rotating shaft 33 rotates, accelerating the introduction of coolant into the cavity formed by the upper housing 32 and the lower housing 31 through the inlet pipe 321. Subsequently, the coolant flows through the connector on the interface 311. The copper pipe 43 enters the cavity formed by the annular groove 41 and the cover. Hydraulic pressure acts on the annular floating block 47, causing the annular floating block 47 to move downward. The lower end of the guide hole 471 is connected to the first set of nozzles 44, compressing the reset spring 48. At the same time, the coolant flows on the upper side of the annular floating block 47 and enters the first set of nozzles 44 through the guide hole 471, and then sprays out. Since the orientation of the first set of nozzles 44 has a certain angle with the central axis of the annular groove 41, the coolant will form a vortex on the surface of the circuit board chip 1 and gather towards the middle return cover 342. Since the rotating shaft 33 passes through the lower housing 31 and extends into the return component 34 formed by the return shroud 342 and the return cylinder 341, and the rotating shaft 33 is also equipped with a second impeller 37 and a defoaming blade 36, the second impeller 37 is located inside the return shroud 342, which can directly form a negative pressure, draw in nearby, accelerate the return flow, avoid turbulence, and generate bubbles. Subsequently, the coolant enters the return cylinder 341 from the return shroud 342 and is cut by the defoaming blade 36 to avoid large bubbles causing air blockage and affecting the return flow. Then, the coolant enters the coolant supply system from the outlet pipe 343 for cooling treatment and is injected back into the inlet pipe 321, repeating this process. As the chip temperature increases, the speed of the rotating shaft 33 driven by the disc motor 23 increases, and the negative pressure generated by the first impeller 35 increases. Consequently, the pressure of the coolant acting on the annular floating block 47 increases, causing the annular floating block 47 to move further downward. The return spring 48 is further compressed and deformed. At this time, the guide hole 471 on the annular floating block 47 changes from being connected to the first set of nozzles 44 to being connected to the second set of nozzles 45. The volume of the annular floating block 47 itself will block the first nozzle. Since the angle between the orientation of the second set of nozzles 45 and the central axis of the annular groove 41 further increases, the shear heat transfer efficiency can be enhanced, and turbulence and static liquid film can be suppressed. Similarly, if the temperature increases, the annular floating block 47 will move downward, and the guide hole 471 will be connected to the third set of nozzles 46 with a larger offset angle. The annular floating block 47 uses its own volume to block the first set of nozzles 44 and the second set of nozzles 45, ensuring that only one set of nozzles is used at a time, avoiding mutual interference.

[0027] Example 2, please refer to the appendix for details. Figure 7-11As shown, each nozzle in the first group of nozzles 44, the second group of nozzles 45, and the third group of nozzles 46 is evenly distributed around the inner edge of the annular groove 41 to ensure the stability of the vortex formation and reduce mutual interference between coolant sprayed from different directions. Multiple connecting copper pipes 43 are threaded onto the upper side of the outer wall of the annular groove 41. Each connecting copper pipe 43 is located in the middle position above two adjacent guide holes 471, so that after the coolant passes through the connecting copper pipes 43, the pressure can directly act on the annular floating block 47, causing the annular floating block 47 to move downwards. Then, the coolant is discharged through guide holes 471. The upper end of each guide hole 471 is flared to facilitate the introduction of coolant. Each guide hole 471 and the corresponding nozzle in each group of nozzles are in the same vertical plane. A limit block 411 is provided on one side of the inner wall of the annular groove 41. The limit block 411 is slidably connected to a limit groove 472. The limit groove 472 is provided on one side of the outer wall of the annular floating block 47. Through the mutual cooperation between the limit block 411 and the limit groove 472, the rotation of the annular floating block 47 within the annular groove 41 is prevented, ensuring... The guide hole 471 and the corresponding nozzle are in the same vertical plane, ensuring that the coolant can be smoothly sprayed out from the corresponding nozzle after passing through the guide hole 471. Both the inner and outer walls of the annular floating block 47 are provided with annular sealing coatings 473, which fit tightly with the inner wall of the annular groove 41 to prevent a small amount of coolant from overflowing from the gap between the annular floating block 47 and the annular groove 41 during the up-and-down movement of the annular floating block, thus affecting the flow rate of the coolant sprayed from the nozzle. The annular groove 41 and the bottom cover 42 are connected by... The annular groove 41 and the bottom cover 42 are bolted together. A return spring 48 is also provided in the cavity. The return spring 48 is located on the lower side of the folded edge of the annular floating block 47. The return spring 48 realizes that after the rotation speed of the rotating shaft 33 decreases, it pushes the annular floating block 47 to move upward and reset, and switches different groups of nozzles. The elastic coefficient of the return spring 48 depends on the frictional resistance of the annular sealing coating 473, so that the force provided by the return spring 48 can overcome the resultant force of the frictional resistance of the annular sealing coating 473 and the weight of the annular floating block 47 to move upward.

[0028] Example 3, please refer to the appendix for details. Figure 3 and attached Figure 5-7As shown, the lower housing 31 and the upper housing 32 are connected by threads. Multiple interfaces 311 are evenly spaced around the lower side of the lower housing 31, each interface 311 being threaded to the upper end of a corresponding connecting copper pipe 43. An inlet pipe 321 is provided on one side of the upper surface of the upper housing 32, through which low-temperature coolant is introduced into the cavity formed by the upper housing 32 and the lower housing 31. The rotating shaft 33 is also equipped with a second impeller 37 and a defoaming blade 36. The second impeller 37 is located at the bottom end of the rotating shaft 33, providing a nearby suction effect, greatly improving the reflux efficiency and preventing temperature buildup. The defoaming blade 36 breaks up large air bubbles generated during the reflux process, preventing air blockage. The reflux component 34 includes a reflux hood 342 and a reflux cylinder 341, which are threaded together. A reflux shroud 342 covers the second impeller 37, and the defoaming blade 36 is located inside the reflux cylinder 341. An outlet pipe 343 is provided on one side of the outer wall of the reflux cylinder 341, and a connecting frame 38 is provided on the upper side of the outer wall of the reflux cylinder 341. The connecting frame 38 is connected to the lower side of the outer wall of the lower housing 31 by bolts. The reflux cylinder 341 is installed on the lower side of the lower housing 31 through the connecting frame 38 and bolts. Shaft seals 39 are provided at each mating point of the rotating shaft 33 with the upper housing 32, the lower housing 31 and the reflux cylinder 341. The shaft seals 39 improve the sealing of the connection and prevent leakage. A display screen 22 with a temperature sensor is provided on the upper side of the outer wall of the shroud 21, which can display the temperature of the chip in real time. A disc motor 23 is also provided inside the shroud 21. The output end of the disc motor 23 is connected to the upper end of the rotating shaft 33, and the disc motor 23 is electrically connected to the temperature sensor in the display screen 22.

[0029] The present invention has been described by way of example in conjunction with the accompanying drawings. Obviously, the specific implementation of the present invention is not limited to the above-described manner. Any non-substantial improvement made by adopting the inventive concept and technical solution of the present invention, or the direct application of the inventive concept and technical solution of the present invention to other occasions without modification, shall be within the protection scope of the present invention.

Claims

1. A liquid jet cooling device for chip cooling, comprising a jet cooling mechanism (2) that can be mounted on a circuit board chip (1), the jet cooling mechanism (2) comprising a detachable cover (21), the lower side of the cover (21) and the upper side of the circuit board chip (1) being bonded together by sealant, characterized in that... The cover (21) is provided with a flow guiding and defoaming component (3) and a spraying component (4). The spraying component (4) is located below the flow guiding and defoaming component (3) and is connected to it. The flow guiding and defoaming component (3) includes a lower shell (31), an upper shell (32) and a return component (34). The cavity formed by the lower shell (31) and the upper shell (32) is provided with a rotating shaft (33) and a first impeller (35) on the rotating shaft (33). The lower end of the rotating shaft (33) passes through the lower shell (31) and extends to the bottom of the cavity of the return component (34). The spraying component (4) includes an annular groove (41) and a bottom cover (42). 1) An annular floating block (47) capable of moving up and down is provided in the cavity formed by the bottom cover (42). Multiple guide holes (471) are arranged around the annular floating block (47) at equal intervals. Multiple sets of nozzles are provided on the inner edge of the annular groove (41). Each set of nozzles is tilted downward and aligned with the upper side of the circuit board chip (1). The multiple sets of nozzles are arranged vertically from top to bottom as the first set of nozzles (44), the second set of nozzles (45) and the third set of nozzles (46). The angle between each nozzle of the first set of nozzles (44), the second set of nozzles (45) and the central axis of the annular groove (41) increases from top to bottom.

2. The chip cooling jet liquid cooling heat dissipation device according to claim 1, characterized in that, Each nozzle in the first group of nozzles (44), the second group of nozzles (45) and the third group of nozzles (46) is distributed at equal intervals around the inner edge of the annular groove (41).

3. The chip cooling jet liquid cooling heat dissipation device according to claim 2, characterized in that, The outer wall of the annular groove (41) is threaded with multiple connecting copper pipes (43). Each connecting copper pipe (43) is located in the middle position above two adjacent guide holes (471). The upper end of each guide hole (471) is flared, and each guide hole (471) is in the same vertical plane as the corresponding nozzle in each group of nozzles.

4. The chip cooling jet liquid cooling heat dissipation device according to claim 3, characterized in that, A limiting block (411) is provided on one side of the inner wall of the annular groove (41), and the limiting block (411) is slidably connected to a limiting groove (472). The limiting groove (472) is provided on one side of the outer wall of the annular floating block (47), and annular sealing coatings (473) are provided on both the inner and outer walls of the annular floating block (47).

5. The chip cooling jet liquid cooling heat dissipation device according to claim 4, characterized in that, The annular groove (41) and the bottom cover (42) are connected by bolts. A reset spring (48) is also provided in the cavity formed by the annular groove (41) and the bottom cover (42). The reset spring (48) is located on the lower side of the folded edge of the annular floating block (47).

6. The chip cooling jet liquid cooling heat dissipation device according to claim 1, characterized in that, The lower housing (31) and the upper housing (32) are connected by threads. The lower housing (31) has multiple interfaces (311) arranged at equal intervals around its lower side. Each interface (311) is threaded to the upper end of the corresponding connecting copper pipe (43). The upper surface of the upper housing (32) is provided with an inlet pipe (321).

7. The chip cooling jet liquid cooling heat dissipation device according to claim 1, characterized in that, The rotating shaft (33) is also provided with a second impeller (37) and a defoaming blade (36), and the second impeller (37) is located at the bottom end of the rotating shaft (33).

8. The chip cooling jet liquid cooling heat dissipation device according to claim 1, characterized in that, The reflux component (34) includes a reflux hood (342) and a reflux cylinder (341), and the reflux hood (342) and the reflux cylinder (341) are threaded together. The reflux hood (342) covers the second impeller (37), and the defoaming blade (36) is located inside the reflux cylinder (341). A discharge pipe (343) is provided on one side of the outer wall of the reflux cylinder (341), and a connecting frame (38) is provided on the upper side of the outer wall of the reflux cylinder (341). The connecting frame (38) is connected to the lower side of the outer wall of the lower housing (31) by bolts.

9. A liquid-jet cooling device for chip cooling according to claim 7, characterized in that, Shaft seals (39) are provided at each mating point between the rotating shaft (33) and the upper housing (32), the lower housing (31) and the return cylinder (341).

10. A liquid-jet cooling device for chip cooling according to claim 1, characterized in that, The outer wall of the cover (21) is provided with a display screen (22) with a temperature sensor. The cover (21) is also provided with a disc motor (23). The output end of the disc motor (23) is connected to the upper end of the rotating shaft (33).

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