Electronic unit for vehicle and corresponding assembly method

Abstract

An electronic unit (1) for a vehicle, comprising a housing (15) housing therein:-at least one electronic module (100),-at least one electronic board (3A, 3B) carrying said at least one electronic module (100),-a frame (7) releasably connectable to said at least one board (3A, 3B),-a first cooling system (25), the invention relates to an electronic module (100) comprising a frame (7) having a first cooling system configured to cool the at least one electronic module (100), the first cooling system comprising a heat sink (27) and a ventilation device (29) configured to convey a flow of air through the heat sink (27), characterized in that the frame (7) comprises a shaped portion (43) defining a second heat sink (45), and a second heat sink (45) configured to provide heat exchange with said at least one electronic module (100), wherein said shaped portion (43) of the frame (7) defining said second heat sink (45) comprises at least one channel (47; 51, 65, 67) in fluid communication with the environment outside said housing (15) of the electronic unit (1).

Description

[0001] manual Technical Field

[0002] This specification relates to the field of electronic units for vehicles. In particular, this solution relates to onboard electronic units that exchange data with vehicle peripherals and the data exchanged. Background Technology

[0003] In the automotive industry, the aforementioned type of electronic unit is typically used to control one or more electrical components of a vehicle.

[0004] For this purpose, the electronic unit has one or more modules configured to exchange data with vehicle systems external to the electronic unit, such as sensors associated with corresponding devices or other electronic units of the vehicle. The one or more modules may also include a processor module configured to process the data exchanged with the system.

[0005] Furthermore, electronic units known in the art typically include at least one electronic board configured to carry the aforementioned modules and enable electrical connections between modules of the electronic unit.

[0006] As is known by way of the fact, during operation of the electronic unit, the module may heat up to high temperatures, for example, in the range between 80°C and 110°C, which may cause damage or malfunction to the electronic unit itself.

[0007] Therefore, there is a need to provide a system for cooling modules.

[0008] In this regard, the electronic unit described in the same applicant’s document IT 102017000104682 includes a cooling system that includes a heat sink and a ventilation device in the form of a fan associated with the heat sink.

[0009] In this solution, heat dissipation is achieved by generating convective heat transfer between a heat sink with a laminated structure having multiple defined pathways and an incident airflow delivered by a fan through the pathways.

[0010] The electronic unit disclosed in IT 102017000104682 also includes a frame made of a polymeric material (e.g., a combination of polycarbonate and acrylonitrile-butadiene-styrene (so-called ABS)) that can be releasably connected to an electronic board; and a housing that defines the outer wall of the electronic unit and is configured to receive the module, the electronic board, and the cooling system therein.

[0011] Referring to the aforementioned solutions, and more generally to electronic units known in the art, the applicant has identified a number of drawbacks.

[0012] In fact, the recent improvements in the performance of modules used in automotive applications, and consequently the greater power required during the operation of the electronic unit, inevitably lead to a higher amount of heat released by the modules within the electronic unit, thus necessitating more efficient heat dissipation.

[0013] The increasingly stringent requirements related to the simplicity and size of electronic units have further exacerbated this problem. Summary of the Invention

[0014] One or more implementations are intended to help provide solutions that allow for more efficient heat dissipation in the vehicle's electronic units.

[0015] According to one or more embodiments, this objective is achieved via an electronic unit for a vehicle having the features set forth in the appended claims.

[0016] The claims are an integral part of the technical teachings provided with respect to the embodiments.

[0017] The solution described herein includes an electronic unit for a vehicle, the electronic unit comprising a housing in which the following is housed:

[0018] -At least one electronic module,

[0019] - At least one electronic board, which carries at least one electronic module.

[0020] - A frame that can be releasably connected to at least one plate.

[0021] - A first cooling system configured to cool at least one electronic module, the first cooling system including a heat sink and a ventilation device configured to deliver airflow through the heat sink.

[0022] The frame is characterized by including a molded portion defining a second heat sink configured to provide heat exchange with at least one electronic module.

[0023] The frame-defined second heat sink includes at least one channel in fluid communication with the environment outside the housing of the electronic unit.

[0024] In various implementations, the frame is made of metallic materials, preferably aluminum or magnesium alloys.

[0025] In various embodiments, the electronic unit includes a second cooling system comprising a molded portion defined by a frame and a second ventilation device associated with the molded portion, the second ventilation device being configured to deliver an airflow through at least one channel defined by the frame.

[0026] In various embodiments, at least one channel defined by the framework includes an inlet port in fluid communication with the environment outside the electronic unit.

[0027] The inlet port is arranged to face the second ventilation device in order to receive airflow from the second ventilation device.

[0028] At least one channel includes an exit port arranged to be in fluid communication with the environment outside the electronic unit.

[0029] The outlet port is located downstream of the inlet port and is configured to discharge the airflow conveyed therethrough to the outside of the electronic unit.

[0030] In various implementations, at least one channel is an open channel having a substantially U-shaped geometry.

[0031] In various implementation schemes, the framework includes:

[0032] -At least one surface,

[0033] - At least one rib and / or at least one ridge protruding relative to the surface,

[0034] At least one rib and / or at least one ridge, along with the surface, laterally and at the bottom define the at least one channel, thereby defining the substantially U-shaped geometry of the at least one channel.

[0035] In various embodiments, at least one electronic board includes a first electronic board and a second electronic board arranged on opposite sides of the frame.

[0036] In various embodiments, the frame includes at least one platform defining a contact surface configured to abut a corresponding module in at least one module within an assembled configuration of the electronic units. In various embodiments, the platform includes a thermal pad disposed at its free end, defining the aforementioned contact surface.

[0037] In various embodiments, the housing includes a first metal portion and a second metal portion, each metal portion being releasably connected to the frame.

[0038] In various implementations, the first electronic board and the second electronic board, the first metal portion and the second metal portion are releasably connected to the frame by a plurality of fixing elements arranged at the periphery of the frame.

[0039] In various implementations, multiple fixing elements include:

[0040] - A first set of fixing elements, configured to connect the first electronic board and the first metal portion to the frame.

[0041] The first fixing element extends through corresponding through holes arranged on the frame and the first electronic board, and engages with a corresponding fixing seat arranged on the first metal part.

[0042] - A second set of fixing elements, configured to connect the second electronic board and the second metal portion to the frame.

[0043] The second fixing element extends through a corresponding through hole arranged on the second metal part and the second electronic board, and engages with a corresponding fixing seat arranged on the frame.

[0044] In various implementations, the electronic module includes a module configured to exchange data with a system outside the electronic unit and / or process the data.

[0045] The solution described in this article also relates to a method for assembling electronic units, the method comprising:

[0046] -Provide the first metal part,

[0047] - The first electronic board and the frame are stacked on the first metal part, such that the first electronic board is positioned between the first metal part and the frame.

[0048] - The frame is connected to the first metal part via the first set of fixing elements.

[0049] Connecting the frame to the first metal part includes inserting a first set of fixing elements through a through hole in the frame along a first insertion direction.

[0050] - The second electronic board and the second metal part are stacked on the frame, such that the second electronic board is positioned between the second metal part and the frame 7.

[0051] - The second metal part is connected to the frame via a second set of fixing elements.

[0052] The feature is that connecting the second metal portion to the frame via the second set of fixing elements includes inserting the second set of fixing elements through a through hole in the second metal portion along a second insertion direction parallel to the first insertion direction.

[0053] The solutions described in this article help to achieve more efficient heat dissipation within electronic units.

[0054] In particular, the frame that defines at least one channel for fluid communication with the environment outside the electronic unit enhances the dissipation of heat released by one or more modules.

[0055] One or more of the features mentioned above further enhance the dissipation of heat released by the module.

[0056] For example, the metal structure of the frame increases the conduction of heat from the module toward at least one channel.

[0057] In addition, a second ventilation device configured to force airflow through at least one channel enhances convective heat transfer from the frame to the incident airflow.

[0058] Finally, the platform that provides adjacent modules expands the contact surface between the modules and the frame, thereby improving heat flow away from the modules. Attached Figure Description

[0059] One or more embodiments will now be described by way of example only, with reference to the accompanying drawings, wherein:

[0060] Figure 1A This is a front perspective view of the electronic unit described here;

[0061] Figure 1B This is a rear perspective view of the electronic unit in Figure 1;

[0062] Figure 2 yes Figure 1A An exploded diagram of the electronic units;

[0063] Figure 3 This is a top perspective view of the framework of the electronic unit described here;

[0064] Figure 4 This is a bottom perspective view of the framework of the electronic unit described here;

[0065] Figures 5 to 7 This is an exploded diagram illustrating the assembly pattern of the electronic unit described here.

[0066] Unless otherwise stated, corresponding numbers and symbols in different figures usually refer to corresponding parts.

[0067] The accompanying drawings are intended to clearly illustrate relevant aspects of the implementation scheme and are not necessarily drawn to scale.

[0068] The edges of features drawn in the attached figures do not necessarily indicate the end of the feature's range. Detailed Implementation

[0069] In the following description, one or more specific details are illustrated to provide a thorough understanding of examples of embodiments of the present specification. These embodiments may be obtained without one or more of the specific details or by using other methods, components, materials, etc. In other instances, known structures, materials, or operations are not illustrated or described in detail so that certain aspects of the embodiments will not be obscured.

[0070] References to “implementation” or “an implementation” within the framework of this specification are intended to indicate that a particular configuration, structure, or feature described with respect to that implementation is included in at least one implementation. Therefore, phrases such as “in an implementation” or “in one implementation” that may appear at one or more points in this specification do not necessarily refer to an implementation and the same implementation.

[0071] Furthermore, specific configurations, structures, or characteristics can be combined in any suitable manner in one or more implementations.

[0072] The titles / references used in this document are provided for convenience only and therefore do not limit the scope of protection or the scope of implementation.

[0073] For simplicity and ease of explanation, similar reference numerals are used throughout this specification and in the various figures to indicate similar parts or elements unless the context otherwise requires, and the corresponding descriptions will not be repeated for each figure.

[0074] according to Figures 1A to 2 Reference numeral 1 in the figure refers to an electronic unit for a vehicle according to an embodiment of this solution.

[0075] For example, the aforementioned unit can be designed to control a vehicle's cluster display, HUD display, central display, passenger display, speakers, and microphones.

[0076] As is known per se, electronic unit 1 includes at least one electronic module (in Figure 2 (Ref. 100 is used as an indicator). Preferably, at least one electronic module 100 includes one or more data exchange modules configured to exchange data with systems outside the electronic unit 1 (hereinafter referred to as vehicle peripherals). The electronic module 100 may also include one or more modules operating as processor modules configured to process the data exchanged by the data exchange modules.

[0077] In the example, the data exchanged by the data exchange module may include information or measurements about any devices or electrical components of the vehicle, such as data about the status of vehicle parts, or measurements acquired by the vehicle's sensors.

[0078] Data transmission, or more generally electrical connections, within electronic unit 1 are achieved by at least one electronic board configured to carry the aforementioned module. (See reference) Figure 2 An exemplary electronic board is indicated by 3A.

[0079] In one or more embodiments, electronic board 3A is a printed circuit board (PCB) that is known per se.

[0080] Specifically, the modules of electronic unit 1, collectively indicated by individual modules 100, are securely connected to electronic board 3A using any technique known to those skilled in the art (e.g., by soldering). Figure 2 In the diagram, module 100 (which represents one or more electronic modules) is shown in dashed lines because it is fixed to the lower surface of electronic board 3A.

[0081] To establish the electrical connection, the electronic board 3A extends substantially planar along the first plane P and has a layered structure comprising a central layer of insulating material (e.g., glass fiber) stacked between two conductive layers (e.g., made of copper) disposed on opposite sides of the central layer.

[0082] The conductive layer of the electronic board 3A defines multiple traces (not shown) extending through the electronic board 3A, thereby enabling electrical connections between modules of the electronic unit.

[0083] In various embodiments, the electronic board 3A may include a plurality of through holes (not shown) extending along the width direction of the board 3A, the plurality of through holes being configured to electrically connect the conductive layer of the board 3A.

[0084] As illustrated, the electronic unit 1 also includes an electrical connector 5 carried by the electronic board 3A and arranged in the peripheral portion thereof.

[0085] Such connectors 5 are provided with corresponding seats, each seat being configured to receive a corresponding end connector carried by a connection line associated with the vehicle's peripheral equipment and electrically connected to the end of the trace of the electronic board 3A.

[0086] Therefore, connector 5 enables electrical connection between the module of electronic unit 1 (indicated by 100) and the vehicle's peripheral equipment.

[0087] exist Figure 2 In the preferred embodiment shown, the electronic unit 1 includes a first electronic board 3A as discussed, and a second electronic board 3B arranged in parallel with each other.

[0088] In this embodiment, each electronic board 3A, 3B carries at least one electronic module of the electronic module 100 of the electronic unit 1 and at least one connector 5.

[0089] As illustrated, the electronic unit 1 also includes a support structure 6 comprising a frame 7 and at least one housing 15 comprising at least a first portion 11, particularly a first sheet, which is designed or shaped to define one or more outer walls 9 of the housing 15, and thus one or more outer walls of the electronic unit, and a second portion 13, particularly a second sheet, which is designed or shaped to further define one or more of the outer walls 9.

[0090] Specifically, the first part 11 and the second part 13 are configured to cooperate with each other to define the housing 15 of the electronic unit 1.

[0091] Preferably, at least one of the first part 11 and the second part 13 of the housing 15 is made of a metallic material.

[0092] Even more preferably, both the first part 11 and the second part 13 of the housing 15 are made of metallic material.

[0093] exist Figure 2 In the embodiment shown, the frame 7 extends substantially parallel to the plane P and defines a first side 7A and a second side 7B that are opposite to each other relative to the plane P.

[0094] Preferably, the frame 7 is arranged at the middle position between the first electronic board 3A and the second electronic board 3B, such that in the assembly configuration of the electronic unit 1, the frame 7 is stacked between the first electronic board 3A and the second electronic board 3B, wherein the first electronic board 3A and the second electronic board 3B face the first side 7A and the second side 7B of the frame 7, respectively.

[0095] Preferably, the electronic modules of electronic unit 1 are arranged between the corresponding electronic boards 3A, 3B and the frame 7.

[0096] In other words, in the aforementioned assembly configuration of electronic unit 1, each module is defined by frame 7 and corresponding electronic boards 3A and 3B along a direction orthogonal to plane P.

[0097] like Figure 1A and Figure 1B As shown, the housing 15 has an opening 17 disposed on one of its outer walls 9, which is configured to allow the electrical connector 5 to be accessed from the outside of the electronic unit 1, for example to be engaged with the aforementioned connection line associated with the vehicle's peripheral equipment.

[0098] Preferably, the opening 17 of the housing 15 is shaped to outline the outer contour of the connector 5.

[0099] In other words, on the one hand, the metal parts 11 and 13 define the overall size of the electronic unit 1 and define the housing for other components of the electronic unit 1 therein.

[0100] On the other hand, frame 7 forms an internal skeleton, which is configured to reinforce the structure of electronic unit 1.

[0101] For this purpose, the metal parts 11, 13 and the electronic boards 3A, 3B can be loosely connected to the frame 7 by means of a plurality of interlocking elements.

[0102] In the considered embodiments, the interlocking elements include fixing elements, such as screws, which are connected to the corresponding fixing form, for example via a threaded connection.

[0103] Specifically, the fixing element includes a first set of fixing elements 19A that extends through corresponding through holes 23A provided at the periphery of the frame 7 and on the first electronic board 3A, and engages with corresponding fixing seats 21A provided on the first metal part 11.

[0104] Similarly, the fixing element also includes a second set of fixing elements 19B that extends through corresponding through holes 23B provided on the second metal part 11 and the second electronic board 3B, and engages with corresponding fixing forms 21B provided on the peripheral portion of the frame 7.

[0105] According to Figure 2 In various embodiments, the electronic unit 1 includes a cooling system 25 configured to cool the electronic module during operation of the electronic unit 1, and includes a heat sink 27 and a ventilation device 29, such as a fan 29.

[0106] As is known per se, the heat sink 27 includes a base portion 28 configured to be fixed to a support structure 6 of the electronic unit 1; and a laminated portion 30 including a plurality of fins 31 protruding from the base portion 28 and arranged parallel to and spaced apart from each other, thereby defining a plurality of channels 33.

[0107] As illustrated, the heat sink 27 is positioned at the midpoint between the first electronic board 3A and the first metal portion 11, and is oriented with the channel 33 extending parallel to the plane P.

[0108] Specifically, in the assembly configuration of electronic unit 1, heat sink 27 is received in recess 35 arranged on first metal part 11, and base portion 28 of heat sink 27 can be releasably connected to first metal part 11.

[0109] Specifically, the connection between the base portion 28 of the radiator 27 and the first metal portion 11 is achieved by means of a connecting element 37, which extends through a corresponding fixing hole 38 arranged on the base portion 28 and engages with a corresponding fixing seat 39 provided on the first metal portion 11.

[0110] Referring to the cooling system 25, the ventilation device 29 is arranged to face the channel 33 defined by the fins 31 of the heat sink 27, and is configured to force airflow through it so as to induce convective heat transfer between the fins 31 and the fresh air forced into the electronic unit 1, which has a higher temperature due to the heat released by the electronic module.

[0111] As illustrated, the first metal portion 11 includes a through-hole 41 disposed on the outer wall 9 of the housing 15, which allows the ventilation device 29 to be in fluid communication with the environment outside the electronic unit 1.

[0112] In various embodiments, the outer wall 9, which is different from (preferably opposite to) the outer wall 9 having the orifice 41, may include a perforated portion 42 for allowing air exiting the channel 33 of the radiator 27 to flow out. Figure 1B example in).

[0113] Based on this solution, refer to Figure 3 and Figure 4 The frame 7 includes a molded portion 43 that defines the second heat sink 45.

[0114] Specifically, the molded portion 43 of the frame 7 defines at least one channel 47, which is configured to deliver an airflow therethrough for cooling the electronic module of the electronic unit 1.

[0115] In various embodiments, at least one channel 47 of the molding portion 43 includes a plurality of channels 47 extending substantially parallel to the plane P.

[0116] Specifically, each channel 47 extends from a corresponding inlet port 49, which is arranged to be in fluid communication with the environment outside the electronic unit 1.

[0117] Preferably, the entrance port 49 of each channel 47 is arranged on the same edge 50 of the frame 7, wherein the term "edge" refers to the peripheral portion of the frame 7, i.e., the boundary of the frame 7.

[0118] exist Figure 3 and Figure 4 In the illustrated embodiment, the channel 47 is arranged on the same side of the frame 7, i.e., the first side 7A. However, the channel 47 of the molded portion 43 may be provided on either side 7A, 7B of the frame 7, or on both sides thereof.

[0119] In the considered implementation, channel 47 includes a pair of central channels 51 that extend substantially linearly from the respective inlet port 49 along a first direction A.

[0120] More specifically, the central channel 49 extends within the recessed portion 53 arranged within the frame 7.

[0121] like Figure 3 and Figure 4 As shown, the recessed portion 53 includes a bottom wall 55 that extends parallel to the plane P and is offset relative to surfaces 57 and 59 defined by the first side 7A and the second side 7B of the frame, respectively.

[0122] Specifically, the recessed portion 53 causes the bottom wall 55 to retract relative to the surface 57 of the frame 7 and protrude relative to the surface 59 of the frame 7.

[0123] In the considered embodiment, the recessed portion 53 also includes a pair of lateral ribs 60 connecting the bottom wall 55 to the surface 59 of the frame 7, and a third rib 61 extending parallel to the two lateral ribs at an intermediate position between the two lateral ribs 60, thereby defining two central channels 51.

[0124] In one embodiment, the third rib 61 has an extension along the first direction A smaller than that of the lateral rib 60, such that the two central channels 51 merge into a single channel 51A, which has an outlet port 62 arranged circumferentially relative to the frame 7 at the second edge 64 of the frame 7.

[0125] Preferably, the second edge 64 of the frame 7 is arranged relative to the edge 50 of the frame 7 associated with the corresponding entrance port 49.

[0126] In various embodiments, the molded portion 43 of the frame 7 includes reinforcing ribs 63 that extend along the surfaces 57, 59 of the frame 7 and protrude therefrom.

[0127] like Figure 3 As shown, in one embodiment, the first pair of reinforcing ribs 63 defines a third channel 65 extending from the corresponding inlet port 49 to the outlet port 67, which is arranged together with the central channel 51A at the edge 64 of the frame 7.

[0128] Incidentally, the outlet ports 62 and 67 of channels 51A and 65 are respectively arranged as perforations facing the outer casing 15, so that the incident airflow flowing through channels 51A and 65 can flow directly out toward the outside of the electronic unit 1.

[0129] exist Figure 3 In the illustrated embodiment, the third channel 65 includes an upstream portion 65A that extends substantially parallel to the first direction A, adjacent to the central channel 51; and a downstream portion 65B that extends along a second direction B incident relative to the first direction A and is connected to the upstream portion 65A by means of a bend portion 65C.

[0130] In one embodiment, the molded portion 43 further includes a fourth channel 67, which is laterally defined on one side by the ridge 63 of the frame 7 and on the other side by one of the lateral ribs 60 of the aforementioned lateral ribs of the recessed portion 53.

[0131] As illustrated, the fourth channel 67 extends parallel to the first direction A from the corresponding inlet port 49 to the outlet port 69, which is recessed relative to the edge 64 of the frame 7, such that the airflow delivered by the channel 67 flows into the portion 70 of the surfaces 57, 59 of the frame 7.

[0132] In summary, the channel 47 has a substantially U-shaped cross-section, which is laterally defined by ribs 60, 61 and / or by ridge 63, and at the bottom by bottom wall 55 or by surfaces 57, 59 of frame 7.

[0133] Therefore, in the assembly configuration of electronic unit 1, the opening side of each channel 47 faces the corresponding electronic board 3A, 3B, so that the module carried by electronic board 3A, 3B is directly exposed to the air flowing in the channel 47.

[0134] Furthermore, it should be emphasized that for each channel 47 (which is an open channel on frame 7), that is, the boundary of the unassembled channel 47 seen in cross-section is not solid and the rigid boundary (cross-section) is only C-shaped or U-shaped, with the open side facing the electronic board 3A. In the assembled configuration, the surfaces of the electronic boards 3A and 3B facing the channel 47 essentially form the wall of the channel 47, making such channels 47 take the form of pipes or conduits. Therefore, in the assembled state, the channel 47, together with the board 3A, marks a conduit for airflow, specifically from one side of the housing 15 to the opposite side.

[0135] In other words, in the assembly configuration of electronic unit 1, electronic boards 3A and 3B cooperate with ribs 60 and 61, ridge 63, bottom wall 55 and surfaces 57 and 59 of frame 7 to form closed conduits, wherein the term closed conduit refers to a channel defined by a solid wall in any direction.

[0136] In various embodiments of this solution, electronic unit 1 includes a second cooling system comprising a second heat sink defined by channel 47 of frame 7 and a second ventilation device 71, such as a second fan 29 associated with the second heat sink.

[0137] like Figure 2 As illustrated, similar to the first ventilation device 29 of the first cooling system 25, the second ventilation device 71 is arranged to face the inlet port 49 of the passage 47 so as to force airflow through it.

[0138] Specifically, the second ventilation device 71 is in fluid communication with the external environment of the electronic unit by means of a through hole 73 arranged on the outer wall 9 of the housing 15.

[0139] according to Figure 1AIn one embodiment, the first ventilation device 29 and the second ventilation device 71 are arranged side by side, or in other words, both the first ventilation device 29 and the second ventilation device 71 face the same outer wall 9 of the housing 15.

[0140] like Figure 3 and Figure 4 As illustrated, in various embodiments, the frame 7 is provided with a plurality of platforms 75 protruding relative to the surfaces 57, 59 of the frame 7.

[0141] Specifically, platform 75 defines a corresponding contact surface 77, preferably a flat contact surface 77, which is configured to abut the corresponding electronic module in the assembly configuration of electronic unit 1 in order to exchange heat with it.

[0142] exist Figure 4 In the example shown, the recessed portion 53 can also be used as an additional platform 75, wherein the bottom wall 55 defines an additional contact surface configured to abut one or more modules carried by the second electronic board 3B.

[0143] Therefore, the contact surface 77 enhances conductive heat exchange between the electronic module and the frame 7 during operation of the electronic unit 1.

[0144] In one embodiment, each platform 75 may have a thermal pad 79 disposed at its free end. The thermal pad 79 defines the aforementioned contact surface 77 and is preferably made of a material with a lower stiffness than the material constituting the frame 7, in order to achieve better adhesion between the platform and the corresponding module.

[0145] In fact, when manufacturing the frame 7, the contact surface 77 may include surface defects that result in an imperfectly flat surface, which could lead to uneven contact with the corresponding module. Similarly, the surface of the electronic module facing the platform 75 may not be perfectly flat.

[0146] Therefore, the localized yielding of the thermal pad 79 ensures a uniform contact surface, thereby ensuring more efficient heat transfer from the module to the platform 75.

[0147] In one embodiment, the base portion 28 of the heat sink 27 may include a recessed portion 81 having at least one platform 83 (e.g., Figure 5 and Figure 6 exemplified).

[0148] The platform 83 of the base portion 28 of the heat sink 27 is similar to the platform 75 of the frame 7 described above. Therefore, the same considerations made for platform 75 still apply to platform 83.

[0149] Specifically, platform 83 protrudes from the bottom surface 85 of the recessed portion 81 of base portion 28, such that in the assembly configuration of the electronic unit, platform 83 is adjacent to the corresponding module 100 located at the intermediate position between the first electronic board 3A and the heat sink 27.

[0150] In one embodiment, the frame is made of a thermally conductive material, such as a metal. Preferably, the frame 7 is made of an aluminum or magnesium alloy.

[0151] Frame 7 can be manufactured using any technique known to those skilled in the art, such as by die casting or sheet metal stamping.

[0152] The metallic composition of frame 7 plays a major advantage in terms of heat dissipation within electron dissipation unit 1.

[0153] In fact, manufacturing the metal frame 7 not only enhances heat transfer from the module to the platform 75 through the contact surface 77, but also enhances heat exchange between the channel 47 and the incident airflow transported through it.

[0154] like Figure 3 and Figure 4 As illustrated, in various embodiments, the frame 7 may include at least one through-hole 87 configured to perform a dual function: on the one hand, to reduce the weight of the frame 7, especially when the frame is made of a metallic material; and on the other hand, to provide a mount for modules of electronic units 1 that protrude from the electronic boards 3A, 3B beyond the frame 7 and face the respective surfaces 57, 59 of the electronic boards.

[0155] refer to Figures 5 to 7 The following describes a method for assembling electronic unit 1 according to this solution.

[0156] Specifically, the method for assembling electronic unit 1 includes a first step (in... Figure 5 (As illustrated in the example), the first step includes arranging the radiator 27 of the first cooling system 25 within the recess 35 of the first metal portion 11 and connecting it by means of the connecting element 37.

[0157] Meanwhile, the first ventilation device 29 and the second ventilation device 71 are fixed to the outer wall 9 in any suitable manner (e.g., via screws).

[0158] Additional steps in the assembly method (in) Figure 6 (Example) Includes arranging a first electronic board 3A such that the electronic board 3A abuts against the base portion 28 of the heat sink 27.

[0159] Subsequently, the frame 7 is arranged such that the platform 75 disposed on the first side 7A of the frame 7 is adjacent to the corresponding module carried by the electronic board 3A.

[0160] In other words, in the assembly configuration of frame 7, electronic board 3A is defined on one side by heat sink 27 and first metal part 11, and on the other side by frame 7.

[0161] In this stage, the frame 7 is connected to the first electronic board 3A and the first metal part 11 by means of the first set of fixing elements 19A.

[0162] Specifically, as previously described in this disclosure, the fixing element 19A extends through the corresponding through hole 23A of the frame 7 and the first electronic board 3A, and engages with the corresponding fixing seat 21A disposed on the first metal part 11.

[0163] Specifically, during the connection step between the frame 7 and the first metal part 11, the first set of fixing elements 19A is inserted from the second side 7B of the frame 7 along the insertion direction (in... Figure 6 and Figure 7 (Indicated by arrow C) Insert through the corresponding through hole 23A.

[0164] refer to Figure 7 The assembly method further includes arranging the second electronic board 3B such that the corresponding module thereby carried is adjacent to the platform 75 of the second side 7B of the frame 7.

[0165] Subsequently, the second metal portion 13 is connected to the frame 7 by means of the second set of fixing elements 19B, so as to define the housing 15 together with the first metal portion 11 and to house the frame 7, electronic boards 3A, 3B and cooling system therein.

[0166] Specifically, as previously described in this disclosure, the fixing element 19B extends through the corresponding through hole 23B of the second metal portion 13 and the second electronic board 3B, and engages with the corresponding fixing seat 21B disposed on the frame 7.

[0167] Similar to the first set of fixing elements 19A, during the connection step between the second metal part 13 and the frame 7, the second set of fixing elements 19B is inserted from the outer surface 87 of the second metal part 13 (corresponding to the base surface of the electronic unit 1 in the assembly configuration) along the second insertion direction D parallel to the first insertion direction C through the corresponding through hole 23B.

[0168] Therefore, based on the above, the solution described herein relates to a method for assembling an electronic unit as previously described (e.g., 1), the method comprising:

[0169] - Provide a first metal part, such as 11,

[0170] - The first electronic board (such as board 3A) and the frame (e.g., 7) are stacked on the first metal portion, such that the first electronic board (e.g., 3A) is arranged between the first metal portion (e.g., 11) and the frame (e.g., 7).

[0171] - The frame (e.g., 7) is connected to the first metal part (e.g., 11) via the first set of fixing elements (e.g., 19A).

[0172] Connecting the frame (e.g., 7) to the first metal part (e.g., 11) includes inserting the first set of fixing elements (e.g., 19A) through the through hole (e.g., 23A) of the frame (e.g., 7) along a first insertion direction (e.g., C).

[0173] - The second electronic board (e.g., 3B) and the second metal portion (e.g., 13) are stacked on the frame (e.g., 7), such that the second electronic board (e.g., 3B) is arranged between the second metal portion (e.g., 13) and the frame (e.g., 7).

[0174] - The second metal part (e.g., 13) is connected to the frame (e.g., 7) via the second set of fixing elements (e.g., 19B).

[0175] In such a method, connecting the second metal part (e.g., 13) to the frame (e.g., 7) via the second set of fixing elements (e.g., 19B) includes inserting the second set of fixing elements (e.g., 19B) into the through hole (e.g., 23B) through the second metal part (e.g., 13) along a second insertion direction D parallel to the first insertion direction C.

[0176] It should be noted that although the above assembly method relates to the assembly of an electronic unit 1 having a structure described according to this solution, particularly including a molded portion (e.g., 43) having another heat sink (e.g., 45) to provide heat exchange with an electronic module (e.g., 100), such a molded portion including at least one channel (such as 47 or 51, 65, 67) in fluid communication with the environment outside the housing (e.g., 15) of the electronic unit, the same method can be performed to assemble any electronic unit including a frame (such as frame 7) provided with through holes (such as 23A) for connecting frame 7 to a first metal portion (e.g., 11) via a first set of fixing elements 19A, and provided with a fixing seat 21B for connecting a second metal portion 13 to frame 7. As can be inferred, the assembly method according to the solution described herein can be performed regardless of the geometry of frame 7 described herein, particularly regardless of the presence or geometry of the molded portion 43 of frame 7.

[0177] Therefore, the solution described herein enhances the dissipation of heat released by the electronic module during the operation of electronic unit 1.

[0178] In particular, as known to those skilled in the art, effective techniques for enhancing heat dissipation from the body include:

[0179] - Enlarge the surface of the primary body exposed to a cooler medium (e.g., air, water), and a second primary body to increase heat flow through the surface itself.

[0180] - When using thermally conductive materials (such as metals) to manufacture the body,

[0181] - Expose the body to an incident flow of a cooling fluid (e.g., air or water) to enhance convective heat exchange between the body and the incident flow.

[0182] As can be understood from the preceding description, this solution implements all the techniques described above in order to enhance heat dissipation within electronic unit 1 relative to known solutions.

[0183] In particular, the frame 7 with a molded portion 43 defining the second heat sink 45 allows for an expansion of the surface of the frame 7, and at the same time allows for the definition of a channel for receiving fresh air from outside the electronic unit 1.

[0184] This advantage is further facilitated by providing a second ventilation device 71, which forces airflow through the channel 47 of the frame 7, thereby aiding in convective heat transfer from the frame 7 to the incident airflow.

[0185] In addition, the use of metallic materials (such as aluminum or magnesium alloys) as the constituent material of frame 7 enhances the absorption of heat released by the module.

[0186] By providing a platform 75 that protrudes from the surfaces 57, 59 of the frame 7 and is adjacent to the module of the electronic unit 1, conductive heat transfer from the module to the frame 7 is further enhanced.

[0187] Another advantage of this solution involves the sustainability of the manufacture of electronic unit 1.

[0188] In fact, using metal materials as the constituent materials of the first part 11 and the second part 13 of the housing 15 reduces the need for plastic parts, thereby promoting more sustainable production of the electronic unit 1 and more sustainable end-of-life disposal.

[0189] Another advantage of this solution is the simplicity of the assembly method for electronic unit 1.

[0190] In fact, since the first set of fixing elements 19A and the second set of fixing elements 19B can be inserted along their respective insertion directions C and D that are parallel to each other, the assembly of the electronic unit 1 can be performed by simply stacking the first metal part 11, the first electronic board 3A, the frame 7, the second electronic board 3B and the second metal part 13 on each other according to the assembly method described herein, without needing to flip the electronic unit during intermediate steps of the assembly process.

[0191] Furthermore, the fact that each electronic board 3A and / or 3B and each metal part 11, 13 constituting the housing 15 is connected to the frame 7 via the first set of fixing elements 19A or the second set of fixing elements 19B makes the frame 7 itself a reference member when assembling the electronic unit 1, thereby ensuring the correct positioning of the aforementioned components.

[0192] In other words, the framework 7 of this solution enables the assembly of electronic unit 1 without the need for additional reference components, which determines the chain dimensions of the required components, resulting in wider geometric tolerances.

[0193] Without compromising the fundamental principles or departing from the scope of the implementation plan, the details and implementation plan can vary significantly from what is described by way of example only.

[0194] The scope of protection is determined by the appended claims.

Claims

1. An electronic unit (1) for a vehicle, the electronic unit comprising a housing (15) wherein: - At least one electronic module (100). - At least one electronic board (3A, 3B), said at least one electronic board carrying said at least one electronic module (100). - Frame (7), which can be releasably connected to the at least one plate (3A, 3B). - A first cooling system (25) configured to cool the at least one electronic module (100), the first cooling system including a radiator (27) and a ventilation device (29) configured to deliver an airflow through the radiator (27). Its features are, The frame (7) includes a molded portion (43) defining a second heat sink (45) configured to provide heat exchange with the at least one electronic module (100). The frame (7) defining the molded portion (43) of the second heat sink (45) includes at least one channel (47; 51, 65, 67) in fluid communication with the environment outside the housing (15) of the electronic unit (1).

2. The electronic unit according to claim 1, wherein the frame (7) is made of a metallic material, preferably an aluminum or magnesium alloy.

3. The electronic unit according to claim 1, the electronic unit comprising a second cooling system comprising the molding portion (43) defined by the frame (7) and a second ventilation device (71) associated with the molding portion, the second ventilation device (71) being configured to deliver an airflow through the at least one channel (47) defined by the frame (7).

4. The electronic unit according to claim 3, wherein the at least one channel (47) defined by the frame (7) includes an inlet port (49) in fluid communication with the environment outside the electronic unit (1). The inlet port (49) is arranged to face the second ventilation device (71) in order to receive the airflow delivered by the second ventilation device (71). The at least one channel (47) includes an outlet port (67, 62) arranged to be in fluid communication with the environment outside the electronic unit (1). The outlet ports (67, 62) are arranged downstream of the inlet port (49) and are configured to discharge the airflow conveyed therethrough toward the outside of the electronic unit (1).

5. The electronic unit according to claim 1, wherein the at least one channel (47; 51, 65, 67) is an open channel having a substantially U-shaped geometry.

6. The electronic unit according to claim 5, wherein the frame (7) comprises: - At least one surface (55, 57, 59). - At least one rib (60) and / or at least one ridge (63) protruding relative to the surfaces (55, 57, 59). The at least one rib (60) and / or the at least one spine (63) and the surfaces (55, 58, 59) define the at least one channel (47; 51, 65, 67) laterally and at the bottom, respectively, thereby defining the substantially U-shaped geometry of the at least one channel (47; 51, 65, 67).

7. The electronic unit of claim 6, wherein the at least one channel (47; 51, 65, 67) includes an opening side configured to face the at least one electronic board (3A, 3B). in, In the assembly configuration of the electronic unit (1), the at least one electronic plate (3A, 3B) mates with the at least one rib (60) and / or the at least one spine (63) and with the surface (55, 58, 59) to form a conduit therewith.

8. The electronic unit according to claim 1, wherein the at least one electronic board (3A, 3B) comprises a first electronic board and a second electronic board (3A, 3B) arranged on opposite sides (7A, 7B) of the frame (7).

9. The electronic unit according to claim 8, wherein the frame (7) comprises at least one platform (75). The at least one platform (75) defines a contact surface (77) configured to adjoin a corresponding module in the at least one module in the assembly configuration of the electronic unit (1).

10. The electronic unit according to claim 9, wherein the platform (75) includes a thermal pad (79) disposed on its free end, the thermal pad (79) defining the contact surface (77).

11. The electronic unit according to any one of the preceding claims, wherein the housing (15) comprises a first metal portion (11) and a second metal portion (13), each metal portion (11, 13) being releasably connected to the frame (7).

12. The electronic unit according to claim 11, wherein the first electronic board and the second electronic board (3A, 3B), the first metal portion and the second metal portion (11, 13) are releasably connected to the frame (7) by means of a plurality of fixing elements (19) arranged at the peripheral portion of the frame (7).

13. The electronic unit according to claim 12, wherein the plurality of fixing elements (19) comprises: - A first set of fixing elements (19A) configured to connect the first electronic board (3A) and the first metal part (11) to the frame (7). The first set of fixing elements (19A) extends through corresponding through holes (23A) arranged on the frame (7) and the first electronic board (3A), and engages with corresponding fixing seats (21A) arranged on the first metal part (11). - A second set of fixing elements (19B), configured to connect the second electronic board (3B) and the second metal portion (13) to the frame. The second fixing element (19B) extends through a corresponding through hole (23B) arranged on the second metal part and the second electronic board (3B), and engages with a corresponding fixing seat (21B) arranged on the frame (7).

14. The electronic unit according to any one of the preceding claims, wherein the electronic module (100) includes a module configured to exchange data with a system outside the electronic unit (1) and / or process the data.

15. A method for assembling an electronic unit (1) according to any one of claims 12 to 14, the method comprising: - Provide the first metal part (11). - The first electronic board (3A) and the frame (7) are stacked on the first metal part, such that the first electronic board (3A) is arranged between the first metal part (11) and the frame (7). - The frame (7) is connected to the first metal part (11) via the first set of fixing elements (19A). The connection of the frame (7) to the first metal part (11) includes inserting the first set of fixing elements (19A) through the through hole (23A) of the frame (7) along the first insertion direction (C). - The second electronic board (3B) and the second metal part (13) are stacked on the frame (7), such that the second electronic board (3B) is arranged between the second metal part (13) and the frame (7). - The second metal part (13) is connected to the frame (7) via the second set of fixing elements (19B). The feature is that connecting the second metal part (13) to the frame (7) via the second set of fixing elements (19B) includes inserting the second set of fixing elements (19B) into the through hole (23B) through the second metal part (13) along a second insertion direction D parallel to the first insertion direction C.

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