Vapor chamber and electronic equipment

Abstract

The embodiment of the invention provides a vapor chamber and electronic equipment, and relates to the technical field of vapor chambers. The vapor chamber comprises a shell, a first heat conduction foil and working medium fluid. An evaporation area and a condensation area are arranged on the shell, the shell is provided with a containing cavity, and a plurality of capillary channels are formed in the inner wall of the containing cavity. A plurality of first micro holes are formed in the first heat conduction foil at intervals, and the first heat conduction foil is arranged in the containing cavity. The first heat conduction foil is a thin metal sheet formed by extending metal with good heat conduction performance, the first heat conduction foil covers the capillary channel to form a capillary structure, the containing cavity is not filled or occupied, the sectional area of the steam flowing channel is remarkably enlarged, it is ensured that steam in the containing cavity flows smoothly, flowing resistance is reduced, and therefore the rapid diffusion capacity of the steam is improved. The first heat conduction foil absorbs and distributes liquid through the first micropores and provides capillary driving force, the capillary channels directionally guide liquid working medium fluid to flow back to the evaporation area, and the first heat conduction foil and the capillary channels cooperate to ensure the backflow efficiency.

Description

Technical Field

[0001] This application relates to the field of heat exchanger technology, and more particularly to a heat exchanger and electronic device. Background Technology

[0002] With the trend of electronic products becoming thinner and lighter and higher performance, the requirements for the heat dissipation power of their internal chips are getting higher and higher. Therefore, more and more electronic products are choosing vapor chambers as heat dissipation modules.

[0003] In related technologies, a vapor chamber includes a shell containing a vacuum chamber. Within the vacuum chamber, a working fluid and a capillary structure formed by sintering copper powder or stacking copper mesh are arranged. When the vapor chamber is in operation, the working fluid in the heated area absorbs heat and rapidly vaporizes, forming steam. Under the influence of the pressure difference, the steam quickly flows to the lower-temperature area, where it condenses and releases heat, returning to a liquid working fluid. The liquid working fluid then flows back to the heated area under the capillary force of the capillary structure, absorbing heat and vaporizing again.

[0004] However, the capillary structure formed by copper powder sintering or copper mesh stacking will occupy a large amount of the effective space inside the vacuum chamber, reduce the cross-sectional area of ​​the steam flow channel, and hinder the rapid diffusion and condensation reflux of steam. Summary of the Invention

[0005] This application provides a heat spreader and electronic device to solve the problem that the capillary structure formed by copper powder sintering or copper mesh stacking will occupy a large amount of effective space inside the vacuum chamber.

[0006] In a first aspect, the heat spreader provided in the embodiments of this application includes:

[0007] The shell has an evaporation zone and a condensation zone, and the shell has a receiving cavity. The inner wall of the receiving cavity is provided with multiple capillary channels, which extend from the evaporation zone to the condensation zone.

[0008] The first thermally conductive foil has a plurality of first micropores spaced apart on it. The first thermally conductive foil is disposed in the receiving cavity and extends from the evaporation zone to the condensation zone and covers the capillary channels.

[0009] The working fluid is placed inside the receiving cavity.

[0010] In one possible implementation, the heat spreader provided in this application embodiment further includes a plurality of second heat-conducting foils stacked sequentially. The second heat-conducting foils are disposed in the receiving cavity, connected to the first heat-conducting foils, and correspond to the evaporation zone.

[0011] In one possible implementation, the heat spreader provided in this application embodiment has a first thermally conductive foil as a first copper foil;

[0012] And / or, the second thermally conductive foil is a second copper foil.

[0013] In one possible implementation, the vapor chamber provided in this application embodiment has at least two condensation zones, which are arranged around the periphery of the evaporation zone.

[0014] In one possible implementation, the heat spreader provided in this application embodiment has a housing including a first housing portion and a second housing portion, wherein the first housing portion and the second housing portion are connected to form a receiving cavity;

[0015] Both the inner walls of the first housing portion and the inner walls of the second housing portion are provided with capillary channels, and the first housing portion and the second housing portion are respectively provided with a first heat-conducting foil.

[0016] In one possible implementation, the heat spreader provided in this application embodiment has a flow guide disposed in the cavity, and the two ends of the flow guide are respectively connected to the first heat-conducting foil on the first housing part and the first heat-conducting foil on the second housing part.

[0017] In one possible implementation, the heat spreader provided in this application embodiment further includes heat dissipation fins, which are disposed on the housing and located outside the receiving cavity, with the heat dissipation fins corresponding to the condensation zone.

[0018] In one possible implementation, the heat spreader provided in this application embodiment has a first thermally conductive foil with a thickness greater than 0 and less than or equal to 0.1 mm.

[0019] And / or, the pore size of the first micropore is greater than or equal to 40µm and less than or equal to 60µm;

[0020] And / or, the spacing between two adjacent first micropores is greater than or equal to 90µm and less than or equal to 110µm.

[0021] In one possible implementation, the temperature distribution plate provided in this application embodiment has a spacing between two adjacent capillary channels that is greater than or equal to 20µm and less than or equal to 200µm.

[0022] And / or, the width of the capillary channel is greater than or equal to 10µm and less than or equal to 100µm;

[0023] And / or, the depth of the capillary channels is greater than or equal to 10µm and less than or equal to 50µm.

[0024] Secondly, the electronic device provided in this application includes a device body and a heat spreader, as described above, disposed on the device body.

[0025] This application provides a vapor chamber and an electronic device. The vapor chamber's first thermally conductive foil is a thin metal sheet extended from a metal with good thermal conductivity. The first thermally conductive foil covers the capillary channels to form a capillary structure, without filling or crowding the receiving cavity, significantly increasing the cross-sectional area of ​​the steam flow channel to ensure smooth steam flow within the receiving cavity, reducing flow resistance, and thereby improving the rapid diffusion capability of steam. The first thermally conductive foil absorbs and distributes liquid through first micropores, providing capillary driving force, while the capillary channels directionally guide the liquid working fluid back to the evaporation zone. The two work together to ensure reflux efficiency. Attached Figure Description

[0026] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0027] Figure 1 This is a schematic diagram of the disassembled structure of the heat spreader provided in the embodiments of this application;

[0028] Figure 2 A cross-sectional view of the heat spreader provided in an embodiment of this application;

[0029] Figure 3 for Figure 1 A schematic diagram of the structure of the second shell section;

[0030] Figure 4 for Figure 3 A magnified view of the area indicated by A in the image;

[0031] Figure 5 for Figure 1 A schematic diagram of the structure of the first thermally conductive foil in the middle;

[0032] Figure 6 for Figure 5 A magnified view of the area indicated by B in the image;

[0033] Figure 7 for Figure 2 A schematic diagram of the structure of the second thermally conductive foil.

[0034] Explanation of reference numerals in the attached figures:

[0035] 100. Shell; 101. Evaporation zone; 102. Condensation zone; 103. Receiving cavity; 104. Capillary channel; 110. First shell section; 120. Second shell section;

[0036] 200, First thermally conductive foil; 210, First micropore;

[0037] 300. Second thermally conductive foil; 310. Second micropore;

[0038] 400. Airflow guide;

[0039] 500. Heat dissipation fins.

[0040] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0041] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0042] The terms “first,” “second,” “third,” and “fourth,” etc., as used in this application description (if applicable), are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms “comprising” and “having,” and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0043] As described in the background section, the vapor chamber includes a shell containing a vacuum chamber. Within the vacuum chamber, a working fluid and a capillary structure formed by sintering copper powder or stacking copper mesh are disposed. During operation, the working fluid in the heated region absorbs heat and rapidly vaporizes, forming steam. Under the influence of the pressure difference, the steam quickly flows towards the lower-temperature region, where it condenses and releases heat, reverting to a liquid working fluid. The liquid working fluid then flows back to the heated region under the capillary force of the capillary structure, absorbing heat and vaporizing again.

[0044] However, the capillary structure formed by copper powder sintering or copper mesh stacking will occupy a large amount of the effective space inside the vacuum chamber, reduce the cross-sectional area of ​​the steam flow channel, and hinder the rapid diffusion and condensation reflux of steam.

[0045] To address the aforementioned problems in the prior art, this invention provides a vapor chamber and an electronic device. The vapor chamber includes a housing, a first thermally conductive foil, and a working fluid. The housing has an evaporation zone and a condensation zone, and a receiving cavity. The inner wall of the receiving cavity is provided with multiple capillary channels extending from the evaporation zone to the condensation zone. The first thermally conductive foil has multiple first micropores spaced apart. The first thermally conductive foil is disposed within the receiving cavity, extending from the evaporation zone to the condensation zone and covering the capillary channels. The working fluid is disposed within the receiving cavity. The first thermally conductive foil is a thin metal sheet extended from a metal with good thermal conductivity. The first thermally conductive foil covers the capillary channels to form a capillary structure, without filling or crowding the receiving cavity, significantly increasing the cross-sectional area of ​​the steam flow channel, ensuring smooth steam flow within the receiving cavity, reducing flow resistance, and thereby improving the rapid diffusion capability of steam. The first thermally conductive foil absorbs and distributes liquid through the first micropores, providing capillary driving force, while the capillary channels directionally guide the liquid working fluid back to the evaporation zone. The two work together to ensure reflux efficiency.

[0046] The following describes exemplary application scenarios of the present invention.

[0047] The vapor chamber provided by this invention can be applied to electronic devices, such as tablet computers, laptops, and smartphones. Specifically, the vapor chamber provided by this invention has a first thermally conductive foil made of a thin metal sheet extended from a metal with good thermal conductivity. The first thermally conductive foil covers the capillary channels to form a capillary structure, which does not fill or encroach on the receiving cavity, reduces flow resistance, and thus improves the rapid diffusion capability of steam.

[0048] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will now be described with reference to the accompanying drawings.

[0049] Reference Figures 1 to 7 As shown, the heat spreader provided in this embodiment includes a housing 100, a first thermally conductive foil 200, and a working fluid.

[0050] The housing 100 has an evaporation zone 101 and a condensation zone 102. The housing 100 also has a receiving cavity 103. The inner wall of the receiving cavity 103 is provided with multiple capillary channels 104, which extend from the evaporation zone 101 to the condensation zone 102. A first thermally conductive foil 200 is provided with multiple first micropores 210 at intervals. The first thermally conductive foil 200 is disposed within the receiving cavity 103, extending from the evaporation zone 101 to the condensation zone 102 and covering the capillary channels 104. The working fluid is disposed within the receiving cavity 103.

[0051] It is understood that the vapor chamber provided in this application embodiment can be applied to electronic devices. The evaporation zone 101 of the vapor chamber is connected to the heat source of the electronic device (e.g., chip, processor, power module, etc.). The heat generated by the heat source is quickly conducted to the evaporation zone 101 of the vapor chamber. The working fluid in the corresponding receiving cavity 103 of the evaporation zone 101 absorbs heat and rapidly vaporizes to form high-temperature steam. Under the action of the pressure difference inside the receiving cavity 103, the high-temperature steam flows rapidly to the condensation zone 102 of the vapor chamber. The high-temperature steam releases the heat it carries in the condensation zone 102 and re-condenses into a liquid state.

[0052] Reference Figure 1 , Figure 2 and Figure 3 As shown, the receiving cavity 103 is provided with capillary channels 104 extending from the evaporation zone 101 to the condensation zone 102. This allows the liquid condensed in the condensation zone 102 to quickly and directionally flow back to the evaporation zone 101 through the continuous capillary channels 104. A first heat-conducting foil 200 is provided on the capillary channels 104, and the first heat-conducting foil 200 has multiple first micropores 210. The first micropores 210 have small pore sizes and are uniformly distributed, generating high capillary force to quickly adsorb and pull the condensed working fluid, ensuring that the liquid can smoothly flow back from the condensation zone 102 to the evaporation zone 101.

[0053] The first micropores 210 are densely and uniformly distributed, which allows the liquid working fluid to be evenly spread on the evaporation zone 101 to form a stable and continuous liquid film, preventing local liquid shortage, drying, and hot spots under high heat flux density, which would lead to heat dissipation failure.

[0054] The capillary channels 104 can be formed by laser etching or chemical etching processes, as shown in the reference. Figure 3 and Figure 4 As shown, the capillary channel 104 can be elongated.

[0055] In this way, the first thermally conductive foil 200 absorbs and distributes liquid through the first micropore 210 and provides capillary driving force, while the capillary channel 104 guides the liquid working fluid back to the evaporation zone 101 in a directional manner. The two work together to ensure the reflux efficiency.

[0056] Among them, reference Figure 5 and Figure 6 As shown, the first thermally conductive foil 200 is a thin metal sheet extended from a metal with good thermal conductivity, such as copper foil, aluminum foil, titanium foil, etc. The first thermally conductive foil 200 is formed by etching a first micro-hole 210 on the thin metal sheet. The shape of the first micro-hole 210 can be circular, elliptical, rectangular, etc., and the embodiments of this application do not impose too many restrictions on this.

[0057] In this way, the first heat-conducting foil 200 has a thin sheet structure and covers the capillary channel 104 to form a capillary structure. It will not fill or encroach on the receiving cavity 103, which significantly expands the cross-sectional area of ​​the steam flow channel, so as to ensure smooth steam flow in the receiving cavity 103, reduce flow resistance, and thus improve the rapid diffusion capability of steam.

[0058] Furthermore, the first heat-conducting foil 200 also achieves spatial isolation, with steam and liquid located on opposite sides of the first heat-conducting foil 200, avoiding steam and liquid collision. Steam can quickly diffuse to the condensation zone 102, and liquid can quickly flow back to the evaporation zone 101 without interfering with each other, significantly improving heat transfer efficiency.

[0059] In summary, the heat spreader provided in this embodiment has a first thermally conductive foil 200, which is a thin metal sheet extended from a metal with good thermal conductivity. The first thermally conductive foil 200 covers the capillary channel 104 to form a capillary structure, without filling or crowding the receiving cavity 103. This significantly expands the cross-sectional area of ​​the steam flow channel, ensuring smooth steam flow within the receiving cavity 103, reducing flow resistance, and thereby improving the rapid diffusion capability of steam. The first thermally conductive foil 200 absorbs and distributes liquid through the first micropores 210, providing capillary driving force, while the capillary channel 104 directionally guides the liquid working fluid back to the evaporation zone 101. The two work together to ensure reflux efficiency.

[0060] For example, the working fluid can be deionized water, acetone, ethanol, or other liquids, as long as it can absorb heat and vaporize into a vapor state within the sealed inner cavity, and condense and release heat upon cooling to return to a liquid state. This application does not impose too many restrictions on this.

[0061] In some embodiments, refer to Figure 2 and Figure 7 As shown, the heat spreader provided in this embodiment of the application also includes a plurality of second heat-conducting foils 300 stacked sequentially. A plurality of second micropores 310 are provided on the second heat-conducting foils 300 at intervals. The second heat-conducting foils 300 are disposed in the receiving cavity 103. The second heat-conducting foils 300 are connected to the first heat-conducting foil 200 and correspond to the evaporation zone 101.

[0062] The second thermally conductive foil 300 is a thin metal sheet made of a metal with good thermal conductivity, such as copper foil, aluminum foil, or titanium foil. The second thermally conductive foil 300 is formed by etching a second micro-hole 310 on the thin metal sheet. The shape of the second micro-hole 310 can be circular, elliptical, rectangular, etc., and this application embodiment does not impose too many restrictions on this.

[0063] Evaporation zone 101 is a high heat flux density region where the working fluid evaporates extremely quickly and is prone to drying out due to liquid shortage. By stacking multiple second heat-conducting foils 300 on the first heat-conducting foil 200, with the second heat-conducting foils 300 located in evaporation zone 101, a multi-level capillary structure is formed in evaporation zone 101, significantly improving capillary suction and liquid storage capacity, ensuring continuous liquid supply in evaporation zone 101 under high heat load and preventing localized drying out.

[0064] In the condensation zone 102, only the first heat-conducting foil 200 is provided. The condensation zone 102 is mainly for steam to condense into liquid. The single-layer first heat-conducting foil 200 is thin and has good air permeability, which will not hinder the steam from contacting the condensation wall, thus ensuring high condensation efficiency and rapid liquid precipitation.

[0065] In one specific embodiment, the first thermally conductive foil 200 is a first copper foil.

[0066] In one specific embodiment, the second thermally conductive foil 300 is a second copper foil.

[0067] The first thermally conductive foil 200 and the second thermally conductive foil 300 can both be formed by stretching metallic copper. Copper has excellent thermal conductivity, which improves evaporation and heat exchange efficiency and enhances the overall heat dissipation capacity of the vapor chamber. Furthermore, copper has stable chemical properties, good compatibility with conventional vapor chamber working fluids, is not easily corroded, and does not produce gas, ensuring that the vapor chamber will not fail and has a long service life.

[0068] In some embodiments, refer to Figure 1 and Figure 2 As shown, there are at least two condensation zones 102, and at least two condensation zones 102 are arranged around the periphery of the evaporation zone 101.

[0069] In the above embodiment, steam radiates and diffuses from the central evaporation zone 101 to multiple peripheral condensation zones 102, resulting in a larger total heat dissipation area and significantly enhanced heat dissipation capacity. The condensed liquid working fluid then flows back to the central evaporation zone 101 through the capillary structure formed by the first heat-conducting foil 200 and the capillary channels 104, forming a multi-path circulation loop. This ensures that the evaporation zone 101 can be quickly replenished and dissipated in all directions, preventing localized drying and hot spots under high heat flux density.

[0070] The condensation zone 102 is arranged around the evaporation zone 101, which makes better use of space and smaller in size with the same heat dissipation capacity, making it suitable for compact electronic devices such as mobile phones, watches, and laptops.

[0071] Specifically, refer to Figure 1 and Figure 2 As shown, there are two condensation zones 102, and the evaporation zone 101 is located between the two condensation zones 102.

[0072] In some embodiments, refer to Figure 1 and Figure 2 As shown, the housing 100 includes a first housing portion 110 and a second housing portion 120, which are connected to form a receiving cavity 103. The inner walls of the first housing portion 110 and the second housing portion 120 are both provided with capillary channels 104, and the first housing portion 110 and the second housing portion 120 are respectively provided with a first heat-conducting foil 200.

[0073] In the above embodiments, both the first housing portion 110 and the second housing portion 120 are provided with capillary channels 104 and capillary structures formed by the first heat-conducting foil 200 to form a double-sided composite capillary passage. The condensed liquid working fluid can flow back to the evaporation zone 101 from both sides of the first housing portion 110 and the second housing portion 120, respectively, resulting in stronger liquid supply capacity and significantly improved anti-drying performance.

[0074] Furthermore, this allows both the first housing portion 110 and the second housing portion 120 to exchange heat efficiently, effectively increasing the total heat exchange area and significantly improving the overall heat dissipation capacity of the heat exchange plate.

[0075] Reference Figure 1 and Figure 2 As shown, the second housing portion 120 is used to contact the heat source of the electronic device. Multiple second thermal conductive foils 300 can be superimposed on the first thermal conductive foil 200 of the second housing portion 120 by welding or adhesive bonding. The evaporation zone 101 of the second housing portion 120 is a high heat flux region. By superimposing multiple second thermal conductive foils 300, stronger capillary force and larger liquid storage space are provided to ensure a continuous and sufficient supply of working fluid, and local drying and hot spots are less likely to occur under high load.

[0076] The first housing portion 110 and the second housing portion 120 can both be formed by stamping copper. Then, capillary channels 104 are formed on the inner walls of the first housing portion 110 and the second housing portion 120 by laser etching or chemical etching processes, respectively. Next, the first heat-conducting foil 200 is sintered on the inner walls of the first housing portion 110 and the second housing portion 120, respectively. Then, the first housing portion 110 and the second housing portion 120 can be connected by welding (e.g., diffusion welding, laser welding, solder brazing, etc.).

[0077] In some embodiments, refer to Figure 2 As shown, a flow guide 400 is provided in the cavity 103, and the two ends of the flow guide 400 are respectively connected to the first heat-conducting foil 200 on the first housing part 110 and the first heat-conducting foil 200 on the second housing part 120.

[0078] In the above embodiment, by providing a flow guide 400 to connect the first heat-conducting foil 200 on the first housing portion 110 and the first heat-conducting foil 200 on the second housing portion 120, the originally independent capillary structures on both sides are connected into one, thereby enhancing the liquid reflux effect.

[0079] The guide element 400 can be made of copper braided wire, copper powder strip, etc. The guide element 400 has a linear or strip-shaped small cross-section structure, which only conducts liquid longitudinally, does not occupy a large area of ​​the steam chamber space, and allows steam to diffuse smoothly without increasing vapor-liquid resistance.

[0080] In some embodiments, refer to Figure 1 and Figure 2 As shown, the heat dissipation plate provided in this embodiment of the application also includes heat dissipation fins 500. The heat dissipation fins 500 are disposed on the housing 100 and located outside the receiving cavity 103. The heat dissipation fins 500 are correspondingly disposed with the condensation zone 102.

[0081] In the above embodiment, the heat dissipation fins 500 increase the surface area of ​​the condensation zone 102, thereby improving the heat dissipation efficiency. After releasing heat, the steam in the condensation zone 102 diffuses to the external environment through the surface area of ​​the heat dissipation fins 500, thus accelerating the heat removal.

[0082] Specifically, refer to Figure 1 and Figure 2 As shown, heat dissipation fins 500 are disposed on the first housing part 110, and the second housing part 120 is used to connect to the heat source of the electronic device. This makes the surface of the second housing part 120 flat and the second housing part 120 directly attached to the heat source. The heat dissipation fins 500 of the first housing part 110 face the air duct or heat dissipation space. The installation is simple and the layout is reasonable, which is conducive to the thinning and compactness of the device.

[0083] The heat dissipation fins 500 can be integrally formed by stamping with the first housing part 110, or the heat dissipation fins 500 can be fixed to the first housing part 110 by welding.

[0084] In some embodiments, the thickness of the first thermally conductive foil 200 is greater than 0 and less than or equal to 0.1 mm.

[0085] In this way, the thickness of the first thermally conductive foil 200 is relatively thin, and it will not fill or occupy the space of the receiving cavity 103.

[0086] For example, the thickness of the first thermally conductive foil 200 can be 0.01mm, 0.02mm, 0.03mm, 0.04mm, 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.1mm, etc.

[0087] Of course, the thickness of the second thermally conductive foil 300 can also be greater than 0 and less than or equal to 0.1 mm, which will not be elaborated further here.

[0088] In some embodiments, the pore size of the first micropore 210 is greater than or equal to 40 μm and less than or equal to 60 μm.

[0089] The first micropore 210 can be a circular hole. By reasonably setting the pore size of the first micropore 210, the magnitude of capillary force and the reflux rate of the working fluid can be adjusted.

[0090] For example, the pore size of the first micropore 210 can be 40μm, 42μm, 44μm, 46μm, 48μm, 50μm, 52μm, 54μm, 56μm, 58μm, 60μm, etc.

[0091] Of course, the pore size of the second micropore 310 on the second thermally conductive foil 300 can also be greater than or equal to 40μm and less than or equal to 60μm, which will not be elaborated further here.

[0092] In some embodiments, the spacing between two adjacent first micropores 210 is greater than or equal to 90 μm and less than or equal to 110 μm.

[0093] In this way, by reasonably setting the spacing between two adjacent first micropores 210, the magnitude of capillary force and the reflux rate of the working fluid can be adjusted.

[0094] For example, the spacing between two adjacent first micropores 210 can be 90μm, 92μm, 94μm, 96μm, 98μm, 100μm, 102μm, 104μm, 106μm, 108μm, 110μm, etc.

[0095] Of course, the spacing between two adjacent second micropores 310 can also be greater than or equal to 90μm and less than or equal to 110μm, which will not be elaborated further here.

[0096] In some embodiments, the spacing between two adjacent capillary channels 104 is greater than or equal to 20 μm and less than or equal to 200 μm.

[0097] In this way, by reasonably setting the spacing between two adjacent capillary channels 104, the liquid reflux flow rate and flow resistance can be adjusted.

[0098] For example, the spacing between two adjacent capillary channels 104 can be 20μm, 40μm, 60μm, 80μm, 100μm, 120μm, 140μm, 160μm, 180μm, 200μm, etc.

[0099] In some embodiments, the width of the capillary channel 104 is greater than or equal to 10 μm and less than or equal to 100 μm.

[0100] In this way, by reasonably setting the width of the capillary channel 104, the liquid reflux flow rate and flow resistance can be adjusted.

[0101] For example, the width of the capillary channel 104 can be 10μm, 20μm, 40μm, 60μm, 80μm, 100μm, etc.

[0102] In some embodiments, the depth of the capillary channel 104 is greater than or equal to 10 μm and less than or equal to 50 μm.

[0103] In this way, by reasonably setting the depth of the capillary channel 104, the liquid reflux flow rate and flow resistance can be adjusted.

[0104] For example, the depth of the capillary channel 104 can be 10μm, 15μm, 20μm, 25μm, 30μm, 35μm, 40μm, 45μm, 50μm, etc.

[0105] The method for manufacturing a heat spreader provided in this embodiment of the invention includes the following steps:

[0106] S1. Select a first metal material and stamp the first metal strip. Process the stamped first metal material into capillary channels 104 to form a first housing portion 110 having capillary channels 104. Select a second metal material and stamp the second metal strip. Process the stamped second metal material into capillary channels 104 to form a second housing portion 120 having capillary channels 104.

[0107] The first metallic material can be a copper-steel composite material, a copper-aluminum composite material, or pure copper. The second metallic material is pure copper. The capillary channels 104 can be etched onto the stamped surface of the first metallic material using a laser. Alternatively, the capillary channels 104 can be etched onto the stamped surface of the first metallic material using a chemical solution.

[0108] S2. Extend the third metal material and etch multiple first micro-holes 210 on the third metal material to form a first thermally conductive foil 200. Extend the fourth metal material and etch multiple second micro-holes 310 on the fourth metal material to form a second thermally conductive foil 300.

[0109] The third and fourth metal materials are both pure copper.

[0110] S3. First thermally conductive foils 200 are sintered on the inner surface of the first housing portion 110 and the inner surface of the second housing portion 120, respectively, and a plurality of second thermally conductive foils 300 are superimposed on the first thermally conductive foils 200 of the first housing portion 110.

[0111] S4. The flow guide 400 is placed and sintered between the first heat-conducting foil 200 of the first housing portion 110 and the first heat-conducting foil 200 of the second housing portion 120.

[0112] Among them, the flow guide 400 can be copper braided wire, copper powder strip, etc.

[0113] S5. The first housing portion 110 and the second housing portion 120 are welded together to form a heat exchange plate with a receiving cavity 103.

[0114] The first housing portion 110 and the second housing portion 120 can be welded together by any one of diffusion welding, laser welding, or solder brazing.

[0115] S6. Inject the working fluid into the receiving cavity 103.

[0116] After injecting the required working fluid into the cavity 103, a vacuum is drawn, and the cavity is welded and sealed to produce a high-performance, lightweight, and thin heat spreader.

[0117] The electronic device provided in this application includes a device body and a heat spreader, as described above, disposed on the device body.

[0118] In the above structural configuration, since the electronic device uses the heat dissipation plate in the above embodiment, it also has the advantages and benefits brought by the heat dissipation plate, namely, good heat dissipation effect.

[0119] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and embodiments are to be considered exemplary only.

[0120] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope.

Claims

1. A heat spreader, characterized in that, include: The housing (100) has an evaporation zone (101) and a condensation zone (102) and a receiving cavity (103) inside the housing (100). The inner wall of the receiving cavity (103) is provided with a plurality of capillary channels (104) extending from the evaporation zone (101) to the condensation zone (102). A first thermally conductive foil (200) is provided with a plurality of first micropores (210) spaced apart. The first thermally conductive foil (200) is disposed in the receiving cavity (103). The first thermally conductive foil (200) extends from the evaporation zone (101) to the condensation zone (102) and covers the capillary channel (104). The working fluid is disposed within the receiving cavity (103).

2. The temperature distribution plate according to claim 1, characterized in that, It also includes a plurality of second thermally conductive foils (300) stacked in sequence, with a plurality of second micropores (310) spaced apart on the second thermally conductive foils (300), the second thermally conductive foils (300) being disposed in the receiving cavity (103), the second thermally conductive foils (300) being connected to the first thermally conductive foils (200), and the second thermally conductive foils (300) corresponding to the evaporation zone (101).

3. The temperature distribution plate according to claim 2, characterized in that, The first thermally conductive foil (200) is a first copper foil; And / or, the second thermally conductive foil (300) is a second copper foil.

4. The temperature distribution plate according to claim 1, characterized in that, The number of condensation zones (102) is at least two, and at least two of the condensation zones (102) are arranged around the periphery of the evaporation zone (101).

5. The temperature distribution plate according to any one of claims 1 to 4, characterized in that, The housing (100) includes a first housing portion (110) and a second housing portion (120), the first housing portion (110) and the second housing portion (120) being connected to form the receiving cavity (103). The capillary channels (104) are provided on the inner wall of the first housing part (110) and the inner wall of the second housing part (120), and the first heat-conducting foil (200) is provided on the first housing part (110) and the second housing part (120).

6. The temperature distribution plate according to claim 5, characterized in that, The cavity (103) is provided with a flow guide (400), and the two ends of the flow guide (400) are respectively connected to the first heat-conducting foil (200) on the first housing part (110) and the first heat-conducting foil (200) on the second housing part (120).

7. The temperature distribution plate according to any one of claims 1 to 4, characterized in that, It also includes heat dissipation fins (500), which are disposed on the housing (100) and located outside the receiving cavity (103). The heat dissipation fins (500) are correspondingly disposed with the condensation zone (102).

8. The temperature distribution plate according to any one of claims 1 to 4, characterized in that, The thickness of the first thermally conductive foil (200) is greater than 0 and less than or equal to 0.1 mm; And / or, the pore size of the first micropore (210) is greater than or equal to 40 μm and less than or equal to 60 μm; And / or, the spacing between two adjacent first micropores (210) is greater than or equal to 90 μm and less than or equal to 110 μm.

9. The temperature distribution plate according to any one of claims 1 to 4, characterized in that, The spacing between two adjacent capillary channels (104) is greater than or equal to 20 μm and less than or equal to 200 μm; And / or, the width of the capillary channel (104) is greater than or equal to 10 μm and less than or equal to 100 μm; And / or, the depth of the capillary channel (104) is greater than or equal to 10 μm and less than or equal to 50 μm.

10. An electronic device, characterized in that, It includes a device body and a heat spreader as described in any one of claims 1 to 9 disposed on the device body.

Images