Display panel, manufacturing method thereof and display device

Abstract

The invention is suitable for the technical field of display equipment, and provides a display panel, a manufacturing method of the display panel and a display device. The isolation structure is located in the display area and arranged on one side of the substrate, and an isolation opening is defined by the isolation structure; the light-emitting layer comprises a plurality of light-emitting units located in the display area, and the light-emitting units are at least partially located in the isolation openings; the alignment mark is used for machining alignment, and the alignment mark is located in the non-display area and arranged on one side of the substrate; the protection structure is located in the non-display area and arranged on one side of the substrate, and the protection structure is at least partially located on the side, away from the display area, of the alignment mark in the direction parallel to the surface of the substrate; and the packaging layer is located in the display area and the non-display area, and the packaging layer covers the light-emitting units and the protection structure. The alignment mark can be prevented from being damaged.

Description

Technical Field

[0001] This application belongs to the field of display device technology, and in particular relates to a display panel and its manufacturing method, and a display device. Background Technology

[0002] With the development of display technology, OLED (Organic Light Emitting Diode) display panels have been widely used due to their advantages such as being thinner and lighter, brighter, having lower power consumption, faster response, and higher resolution.

[0003] In the manufacturing process of OLED display panels, there is a problem that the film layer is easily damaged during processing, which affects the product yield. Summary of the Invention

[0004] In view of this, the present application provides a display panel and its manufacturing method and display device to solve the problem that the current display panel manufacturing process is prone to film layer damage during processing, which affects the product processing yield.

[0005] A first aspect of this application provides a display panel having a display area and a non-display area, the non-display area being disposed on at least one side of the display area. The display panel includes: a substrate; an isolation structure located in the display area and disposed on one side of the substrate, the isolation structure enclosing an isolation opening; a light-emitting layer including a plurality of light-emitting units located in the display area, the light-emitting units being at least partially located within the isolation opening; alignment marks for processing alignment, the alignment marks being located in the non-display area and disposed on one side of the substrate; a protective structure located in the non-display area and disposed on one side of the substrate, along a direction parallel to the surface of the substrate, the protective structure being at least partially located on the side of the alignment marks away from the display area; and an encapsulation layer located in the display area and the non-display area, the encapsulation layer covering the light-emitting units and the protective structure.

[0006] The aforementioned display panel, by providing a protective structure on one side of the substrate in the non-display area, with the protective structure located at least partially on the side of the alignment mark away from the display area in a direction parallel to the substrate surface, allows the encapsulation layer to contact at least a portion of the surface of the protective structure, thus improving the adhesion between the encapsulation layer and the substrate and the protective structure compared to a structure where the encapsulation layer only contacts the substrate surface. This avoids gaps between the encapsulation layer and the substrate, preventing damage to the alignment mark through these gaps during subsequent etching processes of related film layers. Furthermore, the protective structure also isolates the alignment mark from the external environment on the side away from the display area, preventing damage to the alignment mark during processing of film layers located outside the protective structure, thereby improving the product manufacturing yield.

[0007] In one embodiment, the orthographic projection of the alignment mark on the substrate is located within the orthographic projection of the protective structure on the substrate. This arrangement isolates the alignment mark from both the external environment on the side furthest from the display area and the external environment on the side closest to the display area, thus providing better protection for the alignment mark.

[0008] In one embodiment, the orthographic projection outline of the protective structure on the substrate is circular, elliptical, or polygonal in a direction perpendicular to the substrate surface. By setting the shape of the orthographic projection outline of the protective structure on the substrate to the above-mentioned shape, it is easier to manufacture the protective structure and also easier to ensure that the orthographic projection of the alignment mark on the substrate surface is located within the orthographic projection outline of the protective structure on the substrate surface.

[0009] In one embodiment, the alignment mark and the protective structure are spaced apart from each other along a direction parallel to the substrate surface. By spacing the alignment mark and the protective structure apart, the alignment mark is effectively protected without affecting its normal use in subsequent processes.

[0010] In one embodiment, along a direction parallel to the substrate surface, the alignment mark and the protective structure satisfy the following relationship: 5μm ≤ d ≤ 10μm; where d is the minimum distance between the alignment mark and the protective structure. By setting the minimum distance d between the alignment mark and the protective structure within the above-mentioned size range, both the protective effect on the alignment mark and the ease of processing and manufacturing can be considered.

[0011] In one embodiment, the display panel further includes a pixel defining layer located between the display area and the non-display area and disposed on one side of the substrate. The pixel defining layer defines a plurality of pixel openings, and each light-emitting unit is correspondingly disposed with respect to each pixel opening. The pixel defining layer covers the surface of the alignment mark facing away from the substrate, and the protective structure and the encapsulation layer are respectively disposed on the side of the pixel defining layer facing away from the substrate. By providing the pixel defining layer, the alignment mark can be insulated from other related film layers, ensuring the normal use of each film layer.

[0012] In one embodiment, the pixel defining layer is made of a non-metallic material. This configuration improves the adhesion between the pixel defining layer and the protective structure, preventing gaps between them and thus avoiding alignment damage caused by such gaps.

[0013] In one embodiment, the protective structure and the isolation structure are layered on the same floor and made of the same material. By making the protective structure and the isolation structure layered on the same floor and made of the same material, no additional steps are required during the fabrication of the protective structure, simplifying the processing steps and reducing manufacturing costs.

[0014] In one embodiment, the isolation structure includes an isolator and a blocking portion, the blocking portion being located on the side of the isolator facing away from the substrate; the protective structure includes a first protective portion and a second protective portion, the second protective portion being located on the side of the first protective portion facing away from the substrate, the first protective portion being co-layered and made of the same material as the isolator, and the second protective portion being co-layered and made of the same material as the blocking portion; the encapsulation layer covers the sidewalls of the first and second protective portions, and the encapsulation layer also covers at least a portion of the surface of the second protective portion facing away from the substrate. By configuring the protective structure to include a first protective portion co-layered and made of the same material as the isolator in the isolation structure, and a second protective portion co-layered and made of the same material as the blocking portion in the isolation structure, the adhesion between the encapsulation layer and the protective structure can be further improved, and the isolation effect on the alignment mark and the structure outside the protective structure can also be further improved.

[0015] In one embodiment, the orthographic projection of the isolator on the substrate lies within the orthographic projection of the blocking portion on the substrate; the orthographic projection of the first protective portion on the substrate lies within the orthographic projection of the second protective portion on the substrate. This design facilitates the fabrication and molding of the isolation structure and the protective structure.

[0016] In one embodiment, the substrate, the first protective portion, and the second protective portion together define a notch, the encapsulation layer fills the notch, and the encapsulation layer also covers the surface of the second protective portion facing the substrate. This design further enhances the adhesion between the encapsulation layer and the protective structure, preventing the encapsulation layer from detaching from the protective structure, thereby avoiding gaps between the encapsulation layer and the substrate.

[0017] In one embodiment, the isolation structure further includes a base located on the side of the isolation body closest to the substrate; the protective structure further includes a third protective portion located on the side of the first protective portion closest to the substrate, the third protective portion being in the same layer and made of the same material as the base. By providing a base and a third protective portion in the same layer and made of the same material as the base, the effectiveness of the isolation structure and the protective structure in blocking moisture can be further improved.

[0018] In one embodiment, the orthographic projection of the isolator on the substrate lies within the orthographic projection of the base on the substrate; the orthographic projection of the first protective portion on the substrate lies within the orthographic projection of the third protective portion on the substrate. This design facilitates the fabrication and molding of the isolation and protective structures.

[0019] A second aspect of this application provides a method for manufacturing a display panel, comprising: forming an alignment mark on one side of a substrate, the alignment mark being located in a non-display area; disposing an isolation material layer on one side of the substrate, the isolation material layer covering a display area and the non-display area; etching the isolation material layer to form an isolation structure in the display area and a protective structure in the non-display area, the isolation structure enclosing a first isolation opening and a second isolation opening; forming a first light-emitting material layer, a first cathode material layer, and a first sub-encapsulation material layer in the display area and the non-display area; and etching away a portion of the first light-emitting material in the display area. The process involves forming a first light-emitting functional layer, a first cathode, and a first encapsulation material layer, respectively, to obtain a first light-emitting functional layer, a first cathode, and a first sub-encapsulation unit, each at least partially located within the first isolation opening. A first marking protection layer, a second marking protection layer, and a third marking protection layer are also located in the non-display area. A second light-emitting material layer, a second cathode material layer, and a second sub-encapsulation material layer are formed in the display area and the non-display area. A portion of the second light-emitting material layer, the second cathode material layer, and the second encapsulation material layer in the display area is etched away to obtain a second light-emitting functional layer, a second cathode, and a second sub-encapsulation unit, each at least partially located within the second isolation opening.

[0020] The display panel manufactured using the above method has a protective structure that protrudes onto the substrate, allowing the encapsulation layer to contact at least a portion of the surface of the protective structure. Compared to a structure where the encapsulation layer only contacts the substrate surface, this method improves the adhesion between the encapsulation layer, the substrate, and the protective structure, preventing gaps between the encapsulation layer and the substrate. Consequently, during subsequent etching processes of related film layers, the alignment marks are not damaged due to these gaps. Furthermore, the protective structure isolates the alignment marks from the external environment on the side furthest from the display area, preventing damage to the alignment marks during processing of film layers located outside the protective structure and improving the product yield.

[0021] In one embodiment, while etching away portions of the second light-emitting material layer, the second cathode material layer, and the second sub-encapsulation material layer in the display area, the second light-emitting material layer, the second cathode material layer, and the second sub-encapsulation material layer in the non-display area are also removed. This design means that only the first, second, and third marker protection layers exist on the alignment mark, while the second light-emitting material layer, the second cathode material layer, and the second sub-encapsulation material layer are removed. Compared to the display area, the number of film layers on the alignment mark is relatively small, improving the visibility of the alignment mark and facilitating subsequent alignment.

[0022] A third aspect of this application provides a display device, including: a display panel as described above; or a display panel prepared by the method described above for manufacturing a display panel.

[0023] It is understandable that the beneficial effects of the third aspect mentioned above can be found in the relevant descriptions of the first and second aspects mentioned above, and will not be repeated here. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a partial structural cross-sectional view of a display panel in related technologies;

[0026] Figure 2 This is a schematic diagram of the overall structure of a display panel provided in one embodiment of this application;

[0027] Figure 3 This application provides a display panel along one embodiment. Figure 2 A cross-sectional view along the JJ direction;

[0028] Figure 4 This is a partial top view of the display panel provided in one embodiment of this application;

[0029] Figure 5 This application provides a display panel along one embodiment. Figure 4 A cross-sectional view along the KK direction;

[0030] Figure 6 This is a flowchart of a method for manufacturing a display panel according to an embodiment of this application;

[0031] Figure 7 This is a structural schematic diagram of the manufacturing process of a display panel provided in one embodiment of this application;

[0032] Figure 8 This is a structural schematic diagram of the manufacturing process of a display panel provided in another embodiment of this application;

[0033] Figure 9 This is a structural schematic diagram of the manufacturing process of a display panel provided in another embodiment of this application;

[0034] Figure 10 This is a schematic diagram of the overall structure of a display device provided in one embodiment of this application.

[0035] Icon labels:

[0036] 10. Display device;

[0037] 100. Display panel;

[0038] 110. Substrate;

[0039] 120. Isolation structure; 121. Isolation opening; 1211. First isolation opening; 1212. Second isolation opening; 122. Isolation body; 123. Blocking part; 124. Base.

[0040] 130. Light-emitting layer; 131. Light-emitting unit; 1311. First anode; 1312. First light-emitting functional layer; 1313. First cathode; 1314. Second anode; 1315. Second light-emitting functional layer; 1316. Second cathode;

[0041] 140. Alignment mark;

[0042] 150. Protective structure; 151. First protective section; 152. Second protective section; 153. Third protective section; 154. Notch section;

[0043] 160. Encapsulation layer; 161. First sub-encapsulation layer; 1611. First sub-encapsulation unit; 1612. Second sub-encapsulation unit; 162. Second sub-encapsulation layer; 163. Third sub-encapsulation layer.

[0044] 170. Pixel limiting layer; 171. Pixel opening;

[0045] 181. First marking protection layer; 182. Second marking protection layer; 183. Third marking protection layer;

[0046] AA, display area; NA, non-display area. Detailed Implementation

[0047] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.

[0048] It should also be understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0049] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0050] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0051] Furthermore, in the description of this application and the appended claims, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0052] References to "one embodiment" or "some embodiments" in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized. "A plurality" means two or more.

[0053] See Figure 1 As shown, the substrate in the related technology includes a substrate 11, an alignment mark 12 disposed on the substrate 11, an interlayer insulating layer 13 disposed on the substrate 11, a light-emitting material layer 14 and a cathode layer 15 disposed on the interlayer insulating layer 13, and an encapsulation layer 16 disposed on the cathode layer 15. Since gaps are easily generated between the surfaces of the interlayer insulating layer 13 and the light-emitting material layer 14 that are in contact with each other, and between the surfaces of the cathode layer 15 and the encapsulation layer 16 that are in contact with each other, when the relevant film layers are etched in the subsequent processing, the etching material can easily penetrate from the above-mentioned gap positions to the alignment mark positions, damaging the alignment mark, affecting the subsequent normal alignment, and even causing the product to be scrapped.

[0054] To at least partially resolve the above issues, please refer to Figures 2 to 5 This application provides a display panel 100, which has a display area AA and a non-display area NA. The non-display area NA is located on at least one side of the display area AA. The display panel 100 includes: a substrate 110, an isolation structure 120, a light-emitting layer 130, an alignment mark 140, a protective structure 150, and an encapsulation layer 160.

[0055] The display area AA is the area in the display panel 100 used for screen display, while the non-display area NA is a region located on at least one side of the display area AA, which can be adjacent to the display area AA, used for wiring and does not have screen display function. The specific shape, size, relative position relationship, quantity, and arrangement of the display area AA and the non-display area NA can be set according to the actual usage requirements of the display panel 100, and are not limited here.

[0056] Specifically, the isolation structure 120, the light-emitting layer 130, the alignment mark 140, and the protective structure 150 are respectively disposed on the substrate 110. The substrate 110 is used to support and carry other film layers in the display panel 100. For example, the substrate 110 can be made of materials such as glass or polyimide. The substrate 110 may include pixel circuitry for controlling the light-emitting units to emit light at the correct time, and may also include driving circuitry for driving the light-emitting units to emit light.

[0057] The light-emitting layer 130 includes a plurality of light-emitting units 131 disposed at intervals in the display area AA. An isolation structure 120 is located in the display area AA. The isolation structure 120 can form an isolation opening 121 for at least partially accommodating the light-emitting units 131, so that the light-emitting units 131 can be formed without the aid of a mask. That is, in the light-emitting layer 130, an isolation structure 120 is provided between a portion of two adjacent light-emitting units 131, or an isolation structure 120 is provided between every two adjacent light-emitting units 131. The specific structural form of the isolation structure 120 is not limited, as long as it can effectively separate two light-emitting units 131.

[0058] The composition and preparation of the isolation structure 120 are further described in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, and PCT / CN2024 / 099072 for reference.

[0059] The light-emitting units 131 in the light-emitting layer 130 can be red light-emitting units for emitting red light, green light-emitting units for emitting green light, blue light-emitting units for emitting blue light, or white light-emitting units for emitting white light, etc. The number of different types of light-emitting units 131, the arrangement of multiple light-emitting units 131, and the spacing between two adjacent light-emitting units 131 can be flexibly set and are not limited here. The light-emitting units 131 can emit light under the driving action of the driving circuit. Specifically, the light-emitting material in the light-emitting unit 131 can emit light under the action of an electric field. The light-emitting unit 131 can include a first electrode and a second electrode. An electric field can be generated under the action of the first electrode and the second electrode, so that the light-emitting material in the light-emitting unit 131 can emit light under the driving action of the electric field.

[0060] Alignment mark 140 is located in the non-display area NA. It facilitates the alignment of substrate 110 with a mask or other film layers during subsequent processing. The principle is that the mask or other film layer has another mark identical or similar to the alignment mark 140 on substrate 110. When alignment between substrate 110 and the mask or other film layer is required, the alignment between the two film layers is achieved by aligning the alignment mark 140 on substrate 110 with the other mark on the mask or other film layer. Alignment mark 140 can be a film layer structure with a specific shape formed on substrate 110 using any material. Its specific shape, location on substrate 110, and size are not limited and can be flexibly set according to actual usage requirements. Figure 4 and Figure 5 In the embodiment shown, the alignment mark 140 is a cross-shaped structure made of metal.

[0061] The protective structure 150 is disposed in the non-display area NA. Along a direction parallel to the surface of the substrate 110, the protective structure 150 is at least partially located on the side of the alignment mark 140 away from the display area AA. That is, the protective structure 150 is located between the alignment mark 140 and the outer frame of the display panel 100 on the side where the alignment mark 140 is located. Thus, the protective structure 150 can relatively isolate the alignment mark 140 from the external environment on the side away from the display area AA, thereby providing protection. Specifically, the cross-sectional shape and size of the protective structure 150 are not limited and can be correspondingly set according to the shape and size of the alignment mark 140, as long as it can provide isolation and protection. It should be noted that, along a direction perpendicular to the surface of the substrate 110, the alignment mark 140 and the protective structure 150 can be disposed on the same layer, while in... Figure 5 In the embodiment shown, the alignment mark 140 and the protective structure 150 may not be disposed on the same layer along the direction perpendicular to the surface of the substrate 110.

[0062] An encapsulation layer 160 is disposed in the display area AA and the non-display area NA, and the encapsulation layer 160 covers the light-emitting unit 131 and the protective structure 150. For example... Figure 3 and Figure 5As shown, exemplarily, the encapsulation layer 160 can cover the surface of the light-emitting unit 131 facing away from the substrate 110, and the encapsulation layer 160 also covers at least a portion of the surface of the protective structure 150 facing away from the substrate 110. The encapsulation layer 160 can encapsulate and protect the isolation structure 120, the light-emitting unit 131, the alignment mark 140, and the protective structure 150 as a whole. The encapsulation layer 160 can be a single-layer structure made of inorganic or organic materials, or a multilayer structure made of at least one of inorganic or organic materials, without limitation herein. Since the protective structure 150 protrudes from the substrate 110, the encapsulation layer 160 can contact at least a portion of the surface of the protective structure 150. Compared to a structure in which the encapsulation layer 160 only contacts the surface of the substrate 110, this can improve the adhesion between the encapsulation layer 160 and the substrate 110 and the protective structure 150, and avoid gaps between the encapsulation layer 160 and the substrate 110.

[0063] The display panel 100 of this application embodiment provides a protective structure 150 on one side of the substrate 110 in the non-display area NA. The protective structure 150 is located at least partially on the side of the alignment mark 140 away from the display area AA in a direction parallel to the surface of the substrate 110. In this way, since the protective structure 150 protrudes from the substrate 110, the encapsulation layer 160 can contact at least a portion of the surface of the protective structure 150. Compared with a structure in which the encapsulation layer 160 only contacts the surface of the substrate 110, the adhesion between the encapsulation layer 160 and the substrate 110 and the protective structure 150 can be improved, and gaps can be avoided between the encapsulation layer 160 and the substrate 110. Therefore, during the subsequent etching process of related film layers, the problem of damage to the alignment mark 140 caused by the gap will not occur. In addition, the protective structure 150 can also isolate the alignment mark 140 from the external environment on the side away from the display area AA, avoiding the problem of damage to the alignment mark 140 when processing the film layer located outside the protective structure 150, thereby improving the yield rate of product manufacturing.

[0064] To further enhance the protective effect on the alignment mark 140, in some embodiments, the orthographic projection of the alignment mark 140 on the substrate 110 lies within the orthographic projection of the protective structure 150 on the substrate 110. That is, along a direction parallel to the surface of the substrate 110, the protective structure 150 is at least partially located on the side of the alignment mark 140 closest to the display area AA. This arrangement effectively isolates the alignment mark 140 from both the external environment on its side furthest from the display area AA and the external environment on its side closest to the display area AA, thus providing better protection for the alignment mark 140. It should be noted that, to avoid affecting the alignment function of the alignment mark 140, the structure of the protective structure 150 located directly above the alignment mark 140 can be cut out along a direction parallel to the surface of the substrate 110 to form an opening that exposes the alignment mark. This approach does not affect the protective effect of the protective structure 150 or the alignment function of the alignment mark 140.

[0065] The shape and size of the orthographic projection outline of the protective structure 150 on the substrate 110 are not limited along the direction perpendicular to the surface of the substrate 110, and can be set according to the shape and size of the alignment mark 140. In some embodiments, the shape of the orthographic projection outline of the protective structure 150 on the substrate 110 may optionally be circular, elliptical, or polygonal. That is, viewed along the direction perpendicular to the surface of the substrate 110, the cross-sectional shape of the protective structure 150 is circular, elliptical, or polygonal. By setting the shape of the orthographic projection outline of the protective structure 150 on the substrate 110 to the above-mentioned shape, it is convenient to manufacture the protective structure 150, and it is also convenient to ensure that the orthographic projection of the alignment mark 140 on the surface of the substrate 110 is located within the orthographic projection outline of the protective structure 150 on the surface of the substrate 110. Figure 4 In the embodiment shown, the protective structure 150 has a quadrilateral cross-sectional shape.

[0066] In order not to affect the normal use of the alignment mark 140, in some embodiments, the alignment mark 140 and the protective structure 150 are optionally spaced apart from each other in a direction parallel to the surface of the substrate 110. By making the alignment mark 140 and the protective structure 150 spaced apart from each other, the alignment mark 140 can be well protected without affecting its normal use in subsequent processes.

[0067] Based on the above embodiments, optionally, along a direction parallel to the surface of the substrate 110, the alignment mark 140 and the protective structure 150 satisfy the following relationship: 5μm≤d≤10μm; where d is the minimum distance between the alignment mark 140 and the protective structure 150. For example, in... Figure 4In the illustrated embodiment, along the direction perpendicular to the surface of the substrate 110, the orthographic projection outline of the protective structure 150 on the substrate 110 is quadrilateral, and the alignment mark 140 has a cross-shaped structure. The alignment mark 140 has four protrusions that correspond one-to-one with the four outline edges of the protective structure 150, and each protrusion and its corresponding outline edge of the protective structure 150 are spaced apart from each other. In some specific embodiments, the minimum distance d between the alignment mark 140 and the protective structure 150 can be 5μm, 5.5μm, 6μm, 7.6μm, 8.4μm, 9.2μm, 10μm, etc. The above are only examples of the minimum distance d between the alignment mark 140 and the protective structure 150. In actual embodiments, the minimum distance d between the alignment mark 140 and the protective structure 150 can also be other distance values ​​that satisfy the above range. By setting the minimum spacing d between the alignment mark 140 and the protective structure 150 within the aforementioned size range, both the protective function of the alignment mark 140 and the ease of processing and manufacturing can be taken into account.

[0068] To further avoid signal crosstalk between adjacent light-emitting units 131, in some embodiments, the display panel 100 may optionally include a pixel defining layer 170. The pixel defining layer 170 is located in the display area AA and the non-display area NA and is disposed on one side of the substrate 110. The pixel defining layer 170 defines a plurality of pixel openings 171, and each light-emitting unit 131 is correspondingly disposed with each pixel opening 171.

[0069] With this configuration, the light emitted by each light-emitting unit 131 is blocked by the sidewall of the pixel opening 171 in the pixel limiting layer 170, preventing interference with the light emitted by adjacent light-emitting units 131 and avoiding signal crosstalk between adjacent light-emitting units 131. Furthermore, the pixel limiting layer 170 covers the surface of the alignment mark 140 facing away from the substrate 110, and the protective structure 150 and the encapsulation layer 160 are respectively disposed on the side of the pixel limiting layer 170 facing away from the substrate 110.

[0070] The material used to fabricate the pixel defining layer 170 is not specifically limited. In some embodiments, the pixel defining layer 170 is made of a non-metallic material. This arrangement can improve the adhesion between the pixel defining layer 170 and the protective structure 150, preventing gaps from forming between the pixel defining layer 170 and the protective structure 150, thereby avoiding damage to the alignment mark 140 caused by such gaps.

[0071] To facilitate the fabrication of the protective structure 150, in the embodiments of this application, the protective structure 150 and the isolation structure 120 are on the same layer and made of the same material. In this way, the isolation structure 120 located in the display area AA and the protective structure 150 located in the non-display area NA can be formed simultaneously in one process.

[0072] The specific structural forms of the isolation structure 120 and the protective structure 150 are not limited, such as Figure 3 As shown, in some embodiments, optionally, the isolation structure 120 includes an isolation body 122 and a blocking portion 123, with the blocking portion 123 located on the side of the isolation body 122 facing away from the substrate 110. Correspondingly, the protective structure 150 includes a first protective portion 151 and a second protective portion 152, with the second protective portion 152 located on the side of the first protective portion 151 facing away from the substrate 110. The first protective portion 151 is in the same layer and made of the same material as the isolation body 122, and the second protective portion 152 is in the same layer and made of the same material as the blocking portion 123. The encapsulation layer 160 covers the sidewalls of the first protective portion 151 and the second protective portion 152, and the encapsulation layer 160 also covers at least a portion of the surface of the second protective portion 152 facing away from the substrate 110.

[0073] In other words, the isolation structure 120 includes a relatively independent isolator 122 and a blocking portion 123. The isolator 122 is located on the substrate 110 or the pixel defining layer 170, and the blocking portion 123 is located on the side of the isolator 122 facing away from the substrate 110. The protective structure 150 includes a relatively independent first protective portion 151 and a second protective portion 152. The first protective portion 151 is located on the substrate 110 or the pixel defining layer 170, and the second protective portion 152 is located on the side of the first protective portion 151 facing away from the substrate 110. By configuring the protective structure 150 to include a first protective portion 151 that is in the same layer and made of the same material as the isolator 122 in the isolation structure 120, and a second protective portion 152 that is in the same layer and made of the same material as the blocking portion 123 in the isolation structure 120, the adhesion between the encapsulation layer 160 and the protective structure 150 can be further improved, and the isolation effect on the alignment mark 140 and the structure outside the protective structure 150 can also be further improved.

[0074] Furthermore, the orthographic projection of the isolator 122 on the substrate 110 lies within the orthographic projection of the blocking portion 123 on the substrate 110; the orthographic projection of the first protective portion 151 on the substrate 110 lies within the orthographic projection of the second protective portion 152 on the substrate 110. That is, the area covered by the orthographic projection of the blocking portion 123 on the substrate 110 is relatively large, while the area covered by the orthographic projection of the isolator 122 on the substrate 110 is relatively small, so that the orthographic projection of the blocking portion 123 on the substrate 110 can cover the orthographic projection of the isolator 122 on the substrate 110. Similarly, the area covered by the orthographic projection of the second protective portion 152 on the substrate 110 is relatively large, while the area covered by the orthographic projection of the first protective portion 151 on the substrate 110 is relatively small, so that the orthographic projection of the second protective portion 152 on the substrate 110 can cover the orthographic projection of the first protective portion 151 on the substrate 110. The cross-sectional shapes of the isolator 122, the blocking part 123, the first protective part 151, and the second protective part 152 can be regular shapes, such as rectangles or triangles, or irregular shapes. Figure 3 In the illustrated embodiment, the cross-sectional shapes of the isolator 122, the blocking portion 123, the first protective portion 151, and the second protective portion 152 are all trapezoidal. This design facilitates the processing and forming of the isolation structure 120 and the protective structure 150.

[0075] Based on the above embodiment, the substrate 110, the first protective portion 151, and the second protective portion 152 together define a notch 154. The encapsulation layer 160 fills the notch 154 and also covers the surface of the second protective portion 152 facing the substrate 110. Since the area covered by the orthographic projection of the second protective portion 152 on the substrate 110 is relatively large, while the area covered by the orthographic projection of the first protective portion 151 on the substrate 110 is relatively small, the encapsulation layer 160 protrudes into the notch 154 between the substrate 110, the first protective portion 151, and the second protective portion 152. This design can further strengthen the adhesion between the encapsulation layer 160 and the protective structure 150, preventing the encapsulation layer 160 from detaching from the protective structure 150, thereby preventing gaps from forming between the encapsulation layer 160 and the substrate 110.

[0076] In some embodiments, the isolation structure 120 may further include a base 124 located on the side of the isolation body 122 near the substrate 110. The protective structure 150 further includes a third protective portion 153 located on the side of the first protective portion 151 near the substrate 110. The third protective portion 153 is in the same layer and made of the same material as the base 124. By providing the base 124 and the third protective portion 153, which is in the same layer and made of the same material as the base 124, the effectiveness of the isolation structure 120 and the protective structure 150 in blocking moisture can be further improved.

[0077] Furthermore, the orthographic projection of the isolator 122 on the substrate 110 can be located within the orthographic projection of the base 124 on the substrate 110. That is, the area covered by the orthographic projection of the base 124 on the substrate 110 is relatively large, while the area covered by the orthographic projection of the isolator 122 on the substrate 110 is relatively small. This allows the orthographic projection of the base 124 on the substrate 110 to cover the orthographic projection of the isolator 122 on the substrate 110. In this way, the base 124, the isolator 122, and the blocking portion 123 can form an undercut structure, which is beneficial for the encapsulation layer 160 to contact the sidewall of the isolation structure 120, improves the adhesion between the encapsulation layer 160 and the isolation structure 120, and also facilitates the processing and molding of the isolation structure 120.

[0078] Similarly, the orthographic projection of the first protective portion 151 on the substrate 110 is located within the orthographic projection of the third protective portion 153 on the substrate 110. That is, the area covered by the orthographic projection of the third protective portion 153 on the substrate 110 is relatively large, while the area covered by the orthographic projection of the first protective portion 151 on the substrate 110 is relatively small. This allows the orthographic projection of the third protective portion 153 on the substrate 110 to cover the orthographic projection of the first protective portion 151 on the substrate 110. In this way, an undercut structure can be formed between the third protective portion 153, the first protective portion 151, and the second protective portion 152. This facilitates the contact between the encapsulation layer 160 and the sidewall of the protective structure 150, improves the adhesion between the encapsulation layer 160 and the protective structure 150, and also facilitates the processing and molding of the protective structure 150.

[0079] Please combine Figures 2 to 5 See also Figures 6 to 9 This application embodiment also provides a method for manufacturing a display panel 100, which includes the following steps:

[0080] S102. An alignment mark 140 is formed on one side of the substrate 110, and the alignment mark 140 is located in the non-display area NA.

[0081] S104. An isolation material layer is provided on one side of the substrate 110, and the isolation material layer covers the display area AA and the non-display area NA.

[0082] The isolation material layer can be a single-layer structure made of inorganic or organic materials, or a multilayer structure made of at least one of inorganic or organic materials, without limitation here.

[0083] S106. The isolation material layer is etched to form an isolation structure 120 in the display area AA and a protective structure 150 in the non-display area NA. The isolation structure 120 encloses a first isolation opening 1211 and a second isolation opening 1212.

[0084] like Figure 7 As shown, the isolation material layer in the display area AA and the non-display area NA is etched simultaneously, so that the isolation structure 120 can be formed in the display area AA and the protective structure 150 can be formed in the non-display area NA in the same process.

[0085] In some embodiments, the manufacturing method may further include the following steps: forming an anode material layer on one side of a substrate 110, etching the anode material layer to form a first anode 1311, a second anode 1314, etc. in the display area AA, and then forming a pixel defining material layer on one side of the substrate 110, etching the pixel defining material layer to form a pixel defining layer 170 in the display area AA, the pixel defining layer 170 defining a plurality of pixel openings 171, and the first anode 1311 and the second anode 1314 being exposed at least partially from the pixel openings 171.

[0086] S108. A first light-emitting material layer, a first cathode material layer, and a first sub-encapsulation material layer are formed in the display area AA and the non-display area NA.

[0087] S110, etching away part of the first light-emitting material layer, the first cathode material layer, and the first sub-encapsulation material layer in the display area AA to obtain at least part of the first light-emitting functional layer 1312, the first cathode 1313, and the first sub-encapsulation unit 1611 located in the first isolation opening 1211, as well as the first marking protection layer 181, the second marking protection layer 182, and the third marking protection layer 183 located in the non-display area NA. The first light-emitting functional layer 1312 and the first cathode 1313 correspond to the first anode 1311.

[0088] like Figure 8 As shown, a portion of the first light-emitting material layer, the first cathode material layer, and the first sub-encapsulation material layer in the display area AA are etched away. For example, a portion of the first light-emitting material layer, the first cathode material layer, and the first sub-encapsulation material layer are etched away to obtain the first light-emitting functional layer 1312, the first cathode 1313, and the first sub-encapsulation unit 1611, with at least a portion of their structure located within the first isolation opening 1211. The first light-emitting functional layer 1312 and the first cathode 1313 correspond to the first anode 1311 exposed from the pixel opening 171. At the same time, a first marking protection layer 181, a second marking protection layer 182, and a third marking protection layer 183 are formed in the non-display area NA. In other words, the first marking protection layer 181 can be disposed on the same layer and made of the same material as the first light-emitting functional layer 1312, and can be processed and formed synchronously in the same process; the second marking protection layer 182 can be disposed on the same layer and made of the same material as the first cathode 1313, and can be processed and formed synchronously in the same process; and the third marking protection layer 183 can be disposed on the same layer and made of the same material as the first sub-encapsulation unit 1611, and can be processed and formed synchronously in the same process.

[0089] S112, A second light-emitting material layer, a second cathode material layer, and a second sub-encapsulation material layer are formed in the display area AA and the non-display area NA.

[0090] S114. Part of the second light-emitting material layer, the second cathode material layer, and the second sub-encapsulation material layer of the display area AA are etched away to obtain a second light-emitting functional layer 1315, a second cathode 1316, and a second sub-encapsulation unit 1612 located at least partially within the second isolation opening 1212. The second light-emitting functional layer 1315 and the second cathode 1316 correspond to the second anode 1314.

[0091] like Figure 9 As shown, a portion of the second light-emitting material layer, the second cathode material layer, and the second sub-encapsulation material layer of the display area AA are etched away. For example, a portion of the second light-emitting material layer, the second cathode material layer, and the second sub-encapsulation material layer are etched away to obtain the second light-emitting functional layer 1315, the second cathode 1316, and the second sub-encapsulation unit 1612 of the second light-emitting unit, which has at least a partial structure located within the second isolation opening 1212. The second light-emitting functional layer 1315 and the second cathode 1316 correspond to the second anode 1314 exposed from the pixel opening 171.

[0092] In other embodiments, the fabrication method may further include forming a third light-emitting material layer, a third cathode material layer, and a third sub-encapsulation material layer in the display area AA and the non-display area NA, and etching away part of the third light-emitting material layer, the third cathode material layer, and the third sub-encapsulation material layer in the display area AA to obtain the third light-emitting functional layer, the third cathode, and the third sub-encapsulation unit of the third light-emitting unit, etc., which will not be described in detail here.

[0093] In the above embodiments, the encapsulation layer 160 includes a first sub-encapsulation layer 161. Specifically, the first sub-encapsulation layer 161 may include a first sub-encapsulation unit 1611, a second sub-encapsulation unit 1612, etc. The first sub-encapsulation unit 1611 corresponds to the first isolation opening 1211 and is used to encapsulate the first light-emitting unit. The second sub-encapsulation unit 1612 corresponds to the second isolation opening 1212 and is used to encapsulate the second light-emitting unit. In other embodiments, please continue to refer to... Figure 3 The encapsulation layer 160 may also include a second sub-encapsulation layer 162 disposed on the side of the first sub-encapsulation layer 161 facing away from the substrate 110, and a third sub-encapsulation layer 163 disposed on the side of the second sub-encapsulation layer 162 facing away from the substrate 110. By providing a multi-layer encapsulation including the first sub-encapsulation layer 161, the second sub-encapsulation layer 162 and the third sub-encapsulation layer 163, the overall encapsulation effect of the display panel 100 can be enhanced, and moisture intrusion can be prevented.

[0094] In the display panel 100 manufactured using the above method, since the protective structure 150 protrudes from the substrate 110, the encapsulation layer 160 can contact at least a portion of the surface of the protective structure 150. Compared to a structure where the encapsulation layer 160 only contacts the surface of the substrate 110, this improves the adhesion between the encapsulation layer 160 and the substrate 110 and the protective structure 150, preventing gaps between the encapsulation layer 160 and the substrate 110. As a result, during the subsequent etching process of the relevant film layers, the alignment mark 140 will not be damaged due to these gaps. Furthermore, the protective structure 150 can also isolate the alignment mark 140 from the external environment on the side away from the display area AA, preventing damage to the alignment mark 140 during the processing of the film layer located outside the protective structure 150, thereby improving the product manufacturing yield.

[0095] In some embodiments, optionally, while etching away a portion of the second light-emitting material layer, the second cathode material layer, and the second sub-encapsulation material layer in the display area AA, the second light-emitting material layer, the second cathode material layer, and the second sub-encapsulation material layer in the non-display area NA are also removed.

[0096] That is, the second light-emitting material layer, the second cathode material layer, and the second sub-encapsulation material layer located in the non-display area NA are no longer retained. With this design, only the first mark protection layer 181, the second mark protection layer 182, and the third mark protection layer 183 exist on the alignment mark 140, while the second light-emitting material layer, the second cathode material layer, and the second sub-encapsulation material layer are removed. Compared with the display area AA, the number of film layers on the alignment mark 140 is relatively small, which improves the visibility of the alignment mark 140 and facilitates subsequent alignment.

[0097] As described above, the isolation material layer can be a single-layer structure made of inorganic or organic materials, or a multilayer structure made of at least one of inorganic or organic materials. In some embodiments, the isolation material layer includes a first material layer and a second material layer stacked together. In this case, step S106 specifically includes:

[0098] S1062. The first material layer is etched to form an isolation body 122 of the isolation structure 120 in the display area AA, and a first protective part 151 of the protective structure 150 in the non-display area NA.

[0099] S1064. The second material layer is etched to form a blocking portion 123 of the isolation structure 120 in the display area AA and a second protective portion 152 of the protective structure 150 in the non-display area NA.

[0100] The isolation structure 120 and the protective structure 150, which are multi-layered, can also be formed by processing them in layers simultaneously. This design can further improve the adhesion between the encapsulation layer 160 and the protective structure 150, and can also further improve the isolation effect on the alignment mark 140.

[0101] Based on the above embodiments, step S106 further includes:

[0102] S1066, The etching range of the first material layer is greater than the etching range of the second material layer, so as to form a notch 154 between the substrate 110, the first protective portion 151 and the second protective portion 152.

[0103] Since the etching range of the first material layer is larger than that of the second material layer, the notch 154 can be formed between the substrate 110, the first protective part 151 and the second protective part 152, so that the encapsulation layer 160 can fill the notch 154 and cover the surface of the second protective part 152 facing the substrate 110. This can further strengthen the adhesion between the encapsulation layer 160 and the protective structure 150, prevent the encapsulation layer 160 from detaching from the protective structure 150, and thus prevent the formation of a gap between the encapsulation layer 160 and the substrate 110.

[0104] Please see Figure 10 A fourth aspect of the present application provides a display device 10, which includes a display panel 100 according to any of the above embodiments.

[0105] The display panel 100 disclosed in this application embodiment is applied in a display device 10 to provide screen display functionality. The display device 10 can be any product or component with display functionality, including but not limited to mobile phones, tablets, laptops, e-readers, wearable devices, remote controls, televisions, desktop computers, and in-vehicle devices. By employing the display panel 100 in any of the above embodiments, the adhesion between the encapsulation layer 160 and the substrate 110 and the protective structure 150 can be improved, preventing gaps between the encapsulation layer 160 and the substrate 110. This prevents damage to the alignment mark 140 caused by these gaps during subsequent etching processes of related film layers. Furthermore, the protective structure 150 can isolate the alignment mark 140 from the external environment on the side furthest from the display area AA, preventing damage to the alignment mark 140 during processing of the film layer located outside the protective structure 150, thereby improving the product manufacturing yield.

[0106] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0107] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A display panel, characterized in that, The display panel includes a display area and a non-display area, wherein the non-display area is located on at least one side of the display area. substrate; An isolation structure is located in the display area and disposed on one side of the substrate, and the isolation structure encloses an isolation opening; The light-emitting layer includes a plurality of light-emitting units located in the display area, wherein the light-emitting units are at least partially located within the isolation opening; Alignment marks are used for alignment during processing. The alignment marks are located in the non-display area and are disposed on one side of the substrate. A protective structure, located in the non-display area and disposed on one side of the substrate, along a direction parallel to the surface of the substrate, wherein the protective structure is at least partially located on the side of the alignment mark away from the display area; and An encapsulation layer is located in the display area and the non-display area, and the encapsulation layer covers the light-emitting unit and the protective structure.

2. The display panel as described in claim 1, characterized in that, The orthographic projection of the alignment mark on the substrate is located within the orthographic projection of the protective structure on the substrate.

3. The display panel as described in claim 1, characterized in that, Along a direction perpendicular to the surface of the substrate, the orthographic projection outline of the protective structure on the substrate is circular, elliptical, or polygonal.

4. The display panel as described in claim 1, characterized in that, The alignment marks and the protective structure are spaced apart from each other along a direction parallel to the surface of the substrate.

5. The display panel as described in claim 4, characterized in that, Along a direction parallel to the surface of the substrate, the alignment mark and the protective structure satisfy the following relationship: 5μm≤d≤10μm; Wherein, d is the minimum distance between the alignment mark and the protective structure.

6. The display panel as described in claim 1, characterized in that, The display panel further includes a pixel defining layer, which is located in the display area and the non-display area and is disposed on one side of the substrate. The pixel defining layer defines a plurality of pixel openings, and each of the light-emitting units is disposed corresponding to each of the pixel openings. The pixel defining layer covers the surface of the alignment mark on the side opposite to the substrate, and the protective structure and the encapsulation layer are respectively disposed on the side of the pixel defining layer opposite to the substrate.

7. The display panel as described in claim 6, characterized in that, The pixel-defining layer is made of a non-metallic material.

8. The display panel as described in claim 1, characterized in that, The protective structure and the isolation structure are on the same layer and made of the same material.

9. The display panel as described in claim 8, characterized in that, The isolation structure includes an isolation body and a blocking part, wherein the blocking part is located on the side of the isolation body opposite to the substrate; The protective structure includes a first protective part and a second protective part. The second protective part is located on the side of the first protective part away from the substrate. The first protective part is in the same layer and made of the same material as the isolator. The second protective part is in the same layer and made of the same material as the blocking part. The encapsulation layer covers the sidewalls of the first protective portion and the second protective portion, and the encapsulation layer also covers at least a portion of the surface of the second protective portion facing away from the substrate.

10. The display panel as claimed in claim 9, characterized in that, The orthogonal projection of the isolator on the substrate is located within the orthogonal projection of the blocking portion on the substrate; The orthographic projection of the first protective part on the substrate is located within the orthographic projection of the second protective part on the substrate.

11. The display panel as claimed in claim 10, characterized in that, The substrate, the first protective portion, and the second protective portion together define a notch, the encapsulation layer fills the notch, and the encapsulation layer also covers the surface of the second protective portion facing the substrate.

12. The display panel as claimed in claim 9, characterized in that, The isolation structure further includes a base, which is located on the side of the isolation body closer to the substrate; The protective structure further includes a third protective part, which is located on the side of the first protective part near the substrate. The third protective part is in the same layer and made of the same material as the substrate.

13. The display panel as claimed in claim 12, characterized in that, The orthographic projection of the isolator on the substrate is located within the orthographic projection of the base on the substrate; the orthographic projection of the first protective part on the substrate is located within the orthographic projection of the third protective part on the substrate.

14. A method for manufacturing a display panel, characterized in that, include: Alignment marks are formed on one side of the substrate, and the alignment marks are located in the non-display area; An isolation material layer is disposed on one side of the substrate, the isolation material layer covering the display area and the non-display area; The isolation material layer is etched to form an isolation structure in the display area and a protective structure in the non-display area, wherein the isolation structure encloses a first isolation opening and a second isolation opening; A first light-emitting material layer, a first cathode material layer, and a first sub-encapsulation material layer are formed in the display area and the non-display area; Etching removes a portion of the first light-emitting material layer, the first cathode material layer, and the first sub-encapsulation material layer in the display area to obtain at least a portion of the first light-emitting functional layer, the first cathode, and the first sub-encapsulation unit located within the first isolation opening, as well as the first marking protection layer, the second marking protection layer, and the third marking protection layer located in the non-display area. A second light-emitting material layer, a second cathode material layer, and a second sub-encapsulation material layer are formed in the display area and the non-display area; Etching removes a portion of the second light-emitting material layer, the second cathode material layer, and the second sub-encapsulation material layer in the display area to obtain a second light-emitting functional layer, a second cathode, and a second sub-encapsulation unit that are at least partially located within the second isolation opening.

15. The manufacturing method as described in claim 14, characterized in that, While etching away portions of the second light-emitting material layer, the second cathode material layer, and the second sub-encapsulation material layer in the display area, the second light-emitting material layer, the second cathode material layer, and the second sub-encapsulation material layer in the non-display area are also removed.

16. A display device, characterized in that, include: The display panel as described in any one of claims 1 to 13; or A display panel prepared by the method of manufacturing a display panel as described in claim 14 or 15.

Images