Display panel, manufacturing method thereof and display device

Abstract

The invention provides a display panel, a manufacturing method thereof and a display device. The display panel comprises a hole opening area, a partition area surrounding the hole opening area and a display area surrounding the partition area. A substrate; the partition mechanism is located in the partition area and surrounds the trepanning area; the partition mechanism comprises at least one partition column; the protective layer covers one side, deviating from the substrate, of the partition mechanism; the surface section width of one side, close to the partition mechanism, of the protective layer in the direction parallel to the substrate is larger than or equal to the surface section width of one side, away from the substrate, of the partition mechanism. The partition mechanism is protected through the existing film layer, silver is prevented from being separated out and attached to the top face of the partition mechanism, the packaging effect is improved, and the yield is increased.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a display panel, its manufacturing method, and a display device. Background Technology

[0002] Organic Light Emitting Diode (OLED) technology, with its thinness, high response speed, low power consumption, high luminous efficiency, and flexible display capabilities, has become a promising display solution. Driven by ever-increasing user demands and intensifying industry competition, improving screen-to-body ratio has become the core direction of OLED technology development, aiming to bring users a more immersive visual experience.

[0003] Display area aperture technology refers to placing an earpiece or camera within the display area of ​​the screen to increase the screen-to-body ratio and ultimately achieve full-screen display technology. To ensure the packaging effect, a partition structure is set between the display area and the aperture area to separate the vapor-deposited material. Currently, the industry mainly uses a titanium / aluminum / titanium structure. However, using a titanium / aluminum / titanium structure will cause silver precipitation on the surface during anodizing, affecting the packaging effect and reducing the yield. Summary of the Invention

[0004] In view of the above problems, the present invention provides a display panel and its manufacturing method and display device, which are used to solve the problem of silver precipitation in existing display panels during the anodic etching process.

[0005] To achieve the above objectives, the present invention provides a display panel, the display panel including an opening area, a partition area surrounding the opening area, and a display area surrounding the partition area; a substrate; a partition mechanism located in the partition area and disposed around the opening area; the partition mechanism including at least one isolation pillar; a protective layer covering the side of the partition mechanism away from the substrate; the cross-sectional width of the protective layer on the side of the partition mechanism in the direction parallel to the substrate is greater than or equal to the cross-sectional width of the side of the partition mechanism away from the substrate.

[0006] Furthermore, the protective layer includes at least one protective portion, and the orthographic projection of the isolation pillar on the substrate is located within the orthographic projection range of the protective portion on the substrate;

[0007] Preferably, the partition mechanism includes a plurality of spaced-apart isolation columns arranged sequentially around the periphery of the opening area, the number of protective parts being less than the number of isolation columns, and the protective parts covering at least one isolation column located near the opening area.

[0008] Preferably, the number of protective sections is the same as the number of isolation columns, and the protective sections and isolation columns are arranged in a one-to-one correspondence.

[0009] Further, the display panel further includes a light-emitting unit located in the display area. The light-emitting unit includes a first electrode on the side close to the substrate, and at least part of the materials of the protective layer and the first electrode are the same.

[0010] Further, the first electrode includes a first material layer, a second material layer, and a third material layer. The three material layers are sequentially arranged in a direction perpendicular to the substrate, and the protective layer is at least the first material layer.

[0011] Further, the first electrode includes a first material layer, a second material layer, and a third material layer. The three material layers are sequentially arranged in a direction perpendicular to the substrate; the protective layer includes a first material layer, a second material layer, and a third material layer; preferably, the first material layer and the third material layer include indium tin oxide or indium zinc oxide; the second material layer includes silver.

[0012] Further, the protective layer can also be an organic glue; preferably, the material of the organic glue can be a polyimide precursor.

[0013] Further, the display panel further includes a planarization layer located in the display area, and the protective layer and the planarization layer are arranged in the same layer.

[0014] Further, the isolation column is a "worker"-shaped overlapping multi-layer metal structure.

[0015] The present invention also provides a manufacturing method of a display panel. The display panel includes a through-hole area, a partition area surrounding the through-hole area, and a display area surrounding the partition area. The manufacturing method includes the following steps: providing a substrate; forming a partition mechanism located in the partition area on the substrate; forming a protective material layer on the side of the partition mechanism背离 the substrate, and the protective material layer covers the display area and the partition area; patterning the protective material layer to form a protective layer in the partition area, and the surface cross-sectional width of the protective layer on the side close to the partition mechanism in the direction parallel to the substrate is greater than or equal to the surface cross-sectional width of the partition mechanism on the side背离 the substrate.

[0016] The present invention also provides a display device, including the display panel as described above, or including the display panel manufactured by the manufacturing method as described above.

[0017] The advantages of the present invention are: a display panel and a manufacturing method provided by the present invention, through optimizing the graphic structure design, using the existing film layer to protect the partition structure, avoiding the deposited silver from adhering to the top surface of the partition mechanism, improving the encapsulation effect, and enhancing the yield. Description of the Drawings

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of a display panel provided in an embodiment of the present invention;

[0020] Figure 2 This is a partially enlarged schematic diagram of the display panel provided in an embodiment of the present invention;

[0021] Figure 3 This is a schematic diagram of the display area structure of the display panel cut along the B-B' plane according to an embodiment of the present invention;

[0022] Figure 4 A schematic diagram of the partition area structure of the display panel cut along the B-B' surface according to an embodiment of the present invention;

[0023] Figure 5 A schematic diagram of the partition area structure of the display panel cut along the B-B' surface, provided in another embodiment of the present invention;

[0024] Figure 6 A schematic diagram of a partition area structure of a display panel cut along the B-B' plane, provided in another embodiment of the present invention;

[0025] Figure 7 This is a schematic diagram of the structure of the protective layer on the display panel partition mechanism provided in an embodiment of the present invention;

[0026] Figure 8 This is a schematic diagram of another partition area structure for a display panel cut along the B-B' surface, provided in an embodiment of the present invention.

[0027] Figure 9 This is a schematic diagram of another partition area structure for a display panel cut along the B-B' surface, provided in an embodiment of the present invention.

[0028] Figure 10 for Figure 2 An enlarged schematic diagram of the partition area of ​​the provided display panel;

[0029] AA - Display area; A1 - Partition area; A2 - Opening area; 101 - Substrate; 102 - Partition mechanism; 103 - Isolation pillar; 104 - Protective layer; 104a - Protective part; 104b - Metal film layer; 104c - Organic adhesive; 1041 - First material layer; 1042 - Second material layer; 1043 - Third material layer; 105 - Buffer layer; 106 - Dam; 107 - Insulating layer; 1071 - First gate insulating layer; 1072 - Capacitor dielectric layer; 1073 - First dielectric layer; 1074 - Second gate insulating layer; 1075 - Second dielectric layer; 1 1-Driving circuit layer; 12-Light-emitting device layer; 13-Encapsulation layer; 111-First active layer; 112-First gate layer; 113-Second electrode plate layer; 114-Source / drain metal layer; 115-Second active layer; 116-Second gate layer; 117-Auxiliary connection layer; 12a-Light-emitting device; 121-First electrode; 122-Organic material layer; 123-Second electrode; 133-First inorganic encapsulation layer; 132-First organic encapsulation layer; 131-Second inorganic encapsulation layer; 14-Planarization layer; 141-First planarization layer; 142-Second planarization layer; Detailed implementation method:

[0030] The accompanying drawings illustrate preferred embodiments of the present invention, demonstrating its implementability. These embodiments provide a complete overview of the invention to those skilled in the art, making its technical content clearer and easier to understand. The present invention can be embodied in many different forms of embodiments, and its scope of protection is not limited to the embodiments mentioned herein. In the drawings, components with the same structure are indicated by the same numerical designation, and components with similar structures or functions are indicated by similar numerical designations. The dimensions and thicknesses of each component shown in the drawings are arbitrary; the present invention does not limit the dimensions and thicknesses of each component. To make the illustrations clearer, the thickness of some components is appropriately exaggerated in the drawings.

[0031] Furthermore, the following descriptions of the embodiments of the invention are made with reference to the accompanying illustrations, illustrating specific embodiments in which the invention can be implemented. Directional terms used in this invention, such as "upper," "lower," "front," "rear," "left," "right," "inner," "outer," and "side," are merely directional references to the accompanying drawings. Therefore, the use of directional terms is for better and clearer explanation and understanding of the invention, and does not indicate or imply that the referred device or element must have a specific orientation, or be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0032] When a component is described as being "on" another component, the component may be placed directly on the other component; alternatively, there may be an intermediate component on which the component is placed, and the intermediate component is placed on the other component. When a component is described as being "installed to" or "connected to" another component, both can be understood as being directly "installed" or "connected" to, or as being indirectly "installed to" or "connected to" another component via an intermediate component.

[0033] In related display technologies, silver deposition can occur on the top surface of the partition mechanism between the display area and the aperture area during anodic etching, affecting the encapsulation effect and reducing yield. To solve this problem, existing technologies thicken the bottom layer of the partition mechanism and combine it with two-step anodic etching. However, this increases manufacturing costs, reduces product competitiveness, and impacts production capacity. Therefore, balancing the improvement of silver deposition, cost savings, and minimal impact on production capacity remains a significant challenge.

[0034] Based on the technical problems discovered in the aforementioned related display technologies, this embodiment of the invention provides a display panel, such as... Figure 1 and Figure 2 As shown. Figure 1 This is a schematic diagram of the structure of a display panel provided in an embodiment of the present invention. Figure 2 This is a partially enlarged schematic diagram of a display panel provided in an embodiment of the present invention. The display panel includes: an opening area A2, a partition area A1 surrounding the opening area A2, and a display area AA surrounding the partition area A1; a substrate 101; a partition mechanism 102 located in the partition area A1 and disposed around the opening area A2; the partition mechanism 102 includes at least one isolation pillar 103; a protective layer 104 covering the side of the partition mechanism 102 facing away from the substrate 101; the cross-sectional width of the protective layer 104 on the side of the partition mechanism 102 in the direction parallel to the substrate 101 is equal to the cross-sectional width of the side of the partition mechanism 102 facing away from the substrate 101. Figure 3In the embodiment of the present invention, the display area film structure of the display panel may optionally include a substrate 101, and may further include a buffer layer 105, a driving circuit layer 11, a light-emitting device layer 12, an encapsulation layer 13, and a planarization layer 14 on the substrate 101. The substrate 101 may be alkali-free glass, such as a glass substrate made of silicate glass, used for LCD or rigid OLED displays; it may also be a flexible substrate made of polyimide, used for flexible OLED displays; or it may be a silicon substrate made of monocrystalline silicon, used for Micro-OLED displays. Optionally, a buffer layer 105 may be provided between the substrate 101 and the partition mechanism 102, and the material of the buffer layer 105 may include silicon oxide, silicon nitride, and polyimide, etc. The buffer layer 105 can block impurities and prevent ions (such as sodium and potassium ions) in the substrate from diffusing upwards and contaminating important semiconductor layers (such as polysilicon), thereby ensuring the performance and stability of devices such as TFTs (thin-film transistors); it can also flatten the surface, fill microscopic defects on the substrate surface, and provide a flat and uniform substrate for fabricating nanometer-precision circuits; it can buffer stress, alleviate internal stress caused by the difference in thermal expansion coefficients between the substrate and the functional layers above, and prevent film cracking or peeling; it can block water and oxygen, especially for OLED devices that are extremely sensitive to water and oxygen, the buffer layer can act as an additional barrier to prevent external water and oxygen from intruding and extend device life; and it can insulate heat, in some processes, the buffer layer can reduce the impact of high-temperature processes on the substrate (especially flexible substrates with poor heat resistance).

[0035] The driving circuit layer 11 is composed of multiple stacked metal layers and is used to construct the pixel driving circuits arranged in an array. Specifically, along the direction away from the substrate 11, the driving circuit layer 11 sequentially includes: a first active layer 111, a first gate layer 112, a second electrode plate layer 113, a second active layer 115, a second gate layer 116, a source / drain metal layer 114, and an auxiliary connection layer 117. Therefore, the display panel of this embodiment can use low-temperature polycrystalline oxide (LTPO) technology. Alternatively, the display panel can also use low-temperature polysilicon (LTPS) technology, in which case the film structure included in the driving circuit layer 11 will be similar to... Figure 3The details shown are slightly different. It should be noted that this embodiment does not limit the specific type of display panel; only an LTPO display panel is used as an example for explanation. Inside the driving circuit layer 11, adjacent film layers are electrically isolated by an insulating layer 107. The light-emitting device layer 12 contains light-emitting devices 12a arranged in an array. The light-emitting device layer 12 includes a first electrode 121, an organic material layer 122, and a second electrode 123. After a voltage difference is applied between the first electrode 121 and the second electrode 123, the electroluminescent material in the organic material layer 122 is excited to emit light of the corresponding color. The pixel driving circuit is responsible for providing driving current to the corresponding light-emitting device 12a, causing the corresponding light-emitting device to emit light. An encapsulation layer 13 is provided on the side of the light-emitting device layer 12 away from the substrate 101 to block external moisture, oxygen, and impurities, protecting the internal structure of the display panel. The encapsulation layer 13 typically employs a structure of alternating stacks of organic and inorganic materials. For example, in this embodiment, it sequentially includes a first inorganic encapsulation layer 133, a first organic encapsulation layer 132, and a second inorganic encapsulation layer 131 along the direction away from the substrate 101. A planarization layer 14 can be disposed between the pixel circuit layer 11 and the light-emitting device layer 12. The planarization layer 14 may further include a first planarization layer 141 and a second planarization layer 142. The first planarization layer 141 is located between the source / drain metal layer 114 and the auxiliary connection layer 117, and the second planarization layer 142 is located between the auxiliary connection layer 117 and the first electrode 121.

[0036] Patterning is required during the fabrication of each metal layer in the driving circuit layer 11 and the first electrode 121 of the light-emitting device layer 12. Specifically, taking the fabrication of a single-layer metal film as an example, a complete metal film is first deposited by sputtering or evaporation. Then, photoresist is coated on its surface, and exposure and development are performed using a photomask to transfer the design pattern onto the photoresist. Next, the metal areas not protected by the photoresist are removed by etching. Finally, the remaining photoresist is peeled off to obtain the desired metal pattern structure.

[0037] like Figures 1 to 3As shown, in this embodiment of the invention, the display panel includes a display area AA and an opening area A2 located therein. The opening area A2 is a through-hole penetrating the panel and is configured to accommodate preset components such as a camera and a sensor. A partition area A1 is provided between the display area AA and the opening area A2, and an isolation pillar 103 is arranged in this area. In terms of encapsulation, a first inorganic encapsulation layer 133 and a second inorganic encapsulation layer 131 extend from the display area A3 and cover the entire partition area A2; while a first organic encapsulation layer 132 extends from the display area AA to a portion of the partition area A1, its boundary being blocked by a dam 106. The material of the first organic encapsulation layer 132 may include epoxy resin, acrylic resin, or silicon carbide, etc., and the materials of the first inorganic encapsulation layer 133 and the second inorganic encapsulation layer 131 may include silicon nitride, silicon oxide, or aluminum oxide, etc. This encapsulation structure can effectively block the water and oxygen pathways that seep in through the opening area A2, thereby improving the display effect.

[0038] To provide a more intuitive illustration of the specific structure of the isolation pillar 103 and the protective layer 104, the schematic diagrams of the partition area structure in the embodiments of the present invention do not show the structure of the light-emitting device layer 12 and the encapsulation layer 13.

[0039] like Figure 4As shown in this embodiment of the invention, the partition mechanism 102 in the partition area A1 may include multiple partition pillars 103, all of which are arranged parallel to each other on the insulating layer 107 in the direction away from the substrate 101. Specifically, they may be disposed on the surface of the second dielectric layer 1075. The partition pillars 103 and the aforementioned source / drain metal layer 114 or auxiliary connection layer 117 may be disposed in the same layer, so that the placement of the partition pillars 103 does not require an additional process, saving process complexity and improving panel manufacturing efficiency. Multiple metal layers or non-metal layers may be provided between the partition pillars 103 and the substrate 101. The partition pillar 103 includes at least one metal layer, and the metal layer material may include any one of titanium (Ti), aluminum (Al), iron (Fe), nickel (Ni), chromium (Cr), molybdenum (Mo), and copper (Cu). That is, the partition pillar 103 may be only one metal layer or multiple metal layers. This embodiment does not make any special limitation on this. Preferably, the partition pillar is a titanium / aluminum / titanium three-layer structure, with a titanium metal layer, an aluminum metal layer, and a titanium metal layer arranged sequentially in the direction away from the substrate 101. Since the opening area A2 is a physical through-hole, its edge is a region of concentrated stress and mechanical fragility. During manufacturing or daily use, tiny cracks can easily originate from the opening edge and propagate towards the display area AA. The multiple isolation pillars 103 in the isolation mechanism 102 can block the extension of such cracks, protecting the delicate pixel circuitry within the display area AA from damage. Simultaneously, the multiple isolation pillars 103 also provide a flat substrate for the inorganic encapsulation layer, define the boundary of the organic encapsulation layer, and enhance the water and oxygen barrier path, improving encapsulation reliability. The aforementioned titanium / aluminum / titanium structure isolation pillars 103 are typically fabricated before the anode. During the anode etching process, silver ions undergo a displacement reaction with the active metal, adsorbing onto the surface of the isolation pillars 103, affecting the encapsulation effect and reducing yield.

[0040] In this embodiment, a protective layer 104 is provided to cover the side of the isolation mechanism 102 facing away from the substrate 101. Furthermore, the cross-sectional width of the protective layer 104 on the side near the isolation pillar 103 is designed to be greater than or equal to the cross-sectional width of the isolation pillar 103 on the side facing away from the substrate 101. This design effectively covers the isolation pillar 103, preventing silver ions from contacting the metal and undergoing a displacement reaction, thus avoiding precipitation and adhesion to the top surface of the isolation pillar 103. This configuration improves the packaging effect and increases yield.

[0041] In this embodiment of the invention, the protective layer 104 includes at least one protective portion 104a, and the orthographic projection of the isolation pillar 103 on the substrate 101 is located within the orthographic projection range of the protective portion 104a on the substrate 101, so that the isolation pillar 103 is effectively covered; preferably, the partition mechanism 102 includes a plurality of spaced isolation pillars 103, the plurality of isolation pillars 103 are arranged sequentially on the periphery of the opening area A2, the number of protective portions 104a is less than the number of isolation pillars 103, and the protective portions 104a cover at least one isolation pillar 103 located near the opening area A2.

[0042] The number of protective parts 104a is the same as the number of isolation pillars 103. The protective parts 104a and isolation pillars 103 are arranged in a one-to-one correspondence to avoid silver ions from coming into contact with active metals and undergoing a displacement reaction to precipitate out and attach to the top surface of the isolation pillars 103, thereby improving the encapsulation effect and increasing the yield.

[0043] In this embodiment of the invention, the display panel further includes a light-emitting unit located in the display area AA. The light-emitting unit includes a first electrode 121 near the substrate 101, and the protective layer 104 is at least partially made of the same material as the first electrode 121. The protective layer 104 is actually a patterned protective material layer formed on the side of the partition mechanism 102 away from the substrate 101, and covers the display area AA and the partition area A1. The protective layer 104 can be a metal film layer 104b or an organic adhesive 104c. That is, in some embodiments of the invention, the metal film layer 104b is made of the same material as the first electrode 121; in another embodiment of the invention, the organic adhesive 104c is made of the same material as the second planarization layer 142.

[0044] In some embodiments of this application, the protective layer 104 can be trapezoidal, semi-circular, or rectangular, which allows the encapsulation layer to cover the surface continuously and uniformly, resulting in a more uniform stress distribution. This prevents breakage due to stress concentration, provides the best water and oxygen barrier effect, effectively prevents silver precipitation, and ensures the integrity and long-term reliability of the entire encapsulation structure.

[0045] exist Figures 4-6In the illustrated embodiment, the protective layer 104 is a metal film layer 104b, disposed in the same layer as the first electrode 121. The first electrode 121 includes a first material layer 1041, a second material layer 1042, and a third material layer 1043, which are sequentially disposed along a direction perpendicular to the substrate 101. The metal film layer 104b is at least the first material layer 1041. That is, the metal film layer 104b can be a single-layer material structure, including indium oxide, zinc oxide, tin oxide, and gallium oxide, or it can be a multilayer structure composed of these materials. In addition, it can also include a mixture of at least two of indium oxide, zinc oxide, tin oxide, and gallium oxide. For example, the metal film layer 104b can include indium tin oxide (ITO) or indium zinc oxide (IZO). Furthermore, the metal film layer 104b can also be a stacked structure composed of the above materials. This embodiment does not impose any special limitations on this.

[0046] In this embodiment of the invention, the first electrode 121 includes a first material layer 1041, a second material layer 1042, and a third material layer 1043, which are sequentially disposed along a direction perpendicular to the substrate 101; the protective layer 104 includes the first material layer 1041, the second material layer 1042, and the third material layer 1043; preferably, the first and third material layers include indium tin oxide or indium zinc oxide; the second material layer includes silver, that is, the metal film layer 104a adopts the same ITO / Ag / ITO stacked structure as the first electrode 121, such as... Figure 7 As shown, the middle Ag layer is the functional layer and the primary target for etching. Two layers of ITO cover the top and bottom sides of the Ag layer. During the etching of the Ag layer, the etchant only contacts the upper ITO layer or the sidewalls. Since the surface of the titanium / aluminum / titanium isolation pillar 103 is completely covered by the lower ITO layer, the etchant cannot contact the titanium / aluminum / titanium metal, thus blocking the path of electrochemical displacement reaction between Ag ions and titanium / aluminum / titanium metal. This prevents silver from depositing and adhering to the isolation pillar surface, ensuring that the subsequent inorganic encapsulation layer can form a dense, defect-free adhesion with the underlying functional layer (including the ITO-covered isolation pillar), guaranteeing the encapsulation lifespan. In addition, the upper ITO layer covering the top of the isolation pillar 103 forms a smooth, stable, and chemically inert surface, effectively preventing the encapsulation layer from failing due to interface unevenness or high reactivity. Furthermore, this setup requires only one etching process, saving production costs.

[0047] As described above, the metal film layer 104b is disposed on the surface of the isolation pillar 103 in a covering form, which can prevent silver ions from contacting the metal and undergoing a displacement reaction to precipitate and adhere to the top surface of the isolation pillar 103. This arrangement improves the packaging effect and increases the yield; in addition, since the metal film layer is an existing film layer in the actual process flow, this solution does not require adding or changing the existing film layer, reducing manufacturing costs and saving production capacity.

[0048] In another embodiment of the invention, such as Figure 8 As shown, the protective layer 104 can be organic adhesive 104c. Organic adhesive 104c can be a single organic adhesive, which can be directly removed by a cleaning process to avoid etching residue.

[0049] In this embodiment of the invention, the display panel further includes a planarization layer 14 located in the display area AA, and a protective layer 104 is disposed on the same layer as the planarization layer 14. This arrangement requires only one etching process, saving production costs.

[0050] In another embodiment of the invention, the auxiliary connecting layer 117 is disposed in the same layer as the isolation pillar 103, so the organic adhesive 104c and the second planarization layer 142 are made of the same material, and more specifically, can be a polyimide precursor. The co-location of the organic adhesive 104c and the second planarization layer 142 allows for the continuous, uniform, and stress-free deposition of the subsequent inorganic encapsulation layer, greatly reducing the risk of water and oxygen intrusion due to cracks and improving the encapsulation effect. If the panel is a flexible panel, the stress can be redistributed to a larger area, reducing local stress peaks and significantly improving the bending resistance and reliability of the flexible panel. On the other hand, since the second planarization layer 142 is an existing film layer in the process flow, there is no need to add or change the existing film layer, and only one etching process is required, reducing manufacturing costs and saving production capacity.

[0051] In another embodiment of the present invention, when the source / drain metal layer 114 and the isolation pillar 103 are disposed in the same layer, the organic adhesive 104c is made of the same material as the first planarization layer 141. The effect is the same as that of being disposed in the same layer as the second planarization layer, and will not be repeated here. In this embodiment of the present invention, the isolation area A1 may also be provided with a dam 106, which may be a stacked structure composed of multiple insulating layers of the display panel. Optionally, an encapsulation layer 13 is also provided on the side of the dam 106 facing away from the substrate 101. This encapsulation layer 13 can effectively block moisture, oxygen, and other impurities in the air, thereby protecting the internal film structure of the display panel. The encapsulation layer 13 is typically composed of alternating stacked organic and inorganic layers, wherein the organic layer is made of a highly fluid organic material, and the presence of the dam 106 can effectively prevent the organic material from overflowing outwards. The encapsulation layer 13 includes a first inorganic encapsulation layer 133, a first organic encapsulation layer 132, and a second inorganic encapsulation layer 131 disposed along the direction facing away from the substrate 101. The first inorganic encapsulation layer 133 and the second inorganic encapsulation layer 131 extend from the display area AA to cover the partition area A1; while the first organic encapsulation layer 132 extends from the display area AA to the dam 106 and is blocked by the dam 106. Since the first organic encapsulation layer 132 uses a highly fluid organic material, the dam 106 can effectively limit its flow range and prevent overflow. Optionally, in a plane parallel to the substrate 101, the dam 106 can be designed as a closed structure surrounding the opening area A2 to achieve complete isolation of the organic material.

[0052] In this embodiment of the invention, a protective layer 104 can be provided on all the isolation pillars 103. This method can comprehensively and efficiently protect the surface of the isolation pillars 103, preventing silver metal particles from adhering to them, thereby effectively blocking water and oxygen from penetrating the encapsulation layer and ensuring the final display effect of the display panel. In addition, as... Figure 9 As shown, a protective layer 104 can also be selectively applied to only some of the isolation pillars 103. Since the isolation pillars 103 closer to the opening area A2 are less affected by silver ions in the etching solution, while those closer to the display area AA are more significantly affected, the protective layer 104 can be preferentially applied to the isolation pillars 103 closer to the display area AA. For isolation pillars farther from the display area AA and less affected, the impact on the display panel's display effect is minimal, and therefore, the protective layer 104 can be omitted.

[0053] Figure 10 for Figure 2 The illustrated embodiment shows an enlarged schematic diagram of the partition area. The protective layer 104 can form a ring structure along the isolation pillar 103 in a direction perpendicular to the substrate 101. Since the isolation pillar 103 itself is a closed shape surrounding the opening area A2, the protective layer 104 disposed on it is also arranged around the opening area A2 accordingly. It should be noted that, as Figure 10As shown, the "ring" here includes both a standard closed ring-shaped connected structure and a similar ring-shaped connected form. With this arrangement, the protective layer 104 can uniformly cover the top surface of the isolation pillar 103, thereby effectively protecting its surface. Specifically, during the etching process, the protective layer 104 can cover the isolation pillar 103, preventing silver ions from contacting the metal and undergoing a displacement reaction, thus preventing precipitation and adhesion to the top surface of the isolation pillar 103. This helps to form a smooth and flat structure on the side of the isolation pillar 103 away from the substrate 101, enhancing the packaging quality of the display panel, preventing water and oxygen intrusion due to cracking of the packaging layer, and significantly improving the overall reliability of the display panel. In this embodiment of the invention, the isolation pillars 103 in the partition mechanism 102 are preferably overlapping multi-layer metal structures, as described above, with a titanium metal layer, an aluminum metal layer, and another titanium metal layer sequentially arranged along the direction away from the substrate 101. Furthermore, the upper and lower titanium metal layers in the isolation pillar 103 extend beyond the edge of the aluminum metal layer, forming a recessed sidewall of the isolation pillar 103, creating an "I"-shaped structure to isolate the OLED material. Specifically, during the anodic etching process, the anodic etching solution hollows out the middle aluminum metal layer, making it into an "I"-shaped structure; alternatively, after the anodic etching is completed, an alkaline solution (such as developer TMAH) can be used to hollow out the aluminum metal layer to form an "I"-shaped structure.

[0054] Optionally, in this embodiment of the invention, the display panel may further include: an insulating layer 107, which is disposed along a direction away from the substrate. For example... Figure 4 As shown, the insulating layer 107 may include a first gate insulating layer 1071, a capacitor dielectric layer 1072, a first dielectric layer 1073, a second gate insulating layer 1074, and a second dielectric layer 1075. Specifically, the first gate insulating layer 1071 is located between the first active layer 111 and the first gate layer 112; the capacitor dielectric layer 1072 is located between the first gate layer 112 and the second electrode plate layer 113; the first dielectric layer 1073 is located between the second electrode plate layer 113 and the second active layer 115; the second gate insulating layer 1074 is located between the second active layer 115 and the second gate layer 116; and the second dielectric layer 1075 is located between the second gate layer 116 and the source / drain metal layer 114.

[0055] This invention also provides a method for manufacturing a display panel, comprising the following steps: setting a substrate 101; forming a partition mechanism located in the partition area on the substrate, forming a protective material layer on the side of the partition mechanism away from the substrate, the protective material layer covering the display area and the partition area; patterning the protective material layer, forming a protective layer in the partition area, wherein the cross-sectional width of the protective layer on the side of the partition mechanism in the direction parallel to the substrate is greater than or equal to the cross-sectional width of the partition mechanism on the side away from the substrate.

[0056] The step of forming a partition mechanism located in the partition area on a substrate includes: forming a first metal material layer on the substrate, the first metal material layer covering the display area and the partition area, patterning the first metal material layer, forming a source / drain metal layer in the display area, and forming a partition mechanism in the partition area.

[0057] The step of forming a partition mechanism located in the partition area on a substrate may include: forming a second metal material layer on the substrate, the second metal material layer covering the display area and the partition area, patterning the second metal material layer, forming an auxiliary connection layer in the display area, and forming a partition mechanism in the partition area.

[0058] The protective layer includes an organic adhesive, forming a protective material layer on the side of the partition mechanism away from the substrate. The protective material layer covers the display area and the partition area, including: retaining the protective material layer of the display area to form a first planarization layer, patterning the protective material layer of the partition area, and forming a plurality of protective parts.

[0059] The protective layer also includes a metal film layer, forming a protective material layer on the side of the partition mechanism away from the substrate. The protective material layer covers the display area and the partition area, including: a patterned display area protective material layer forming multiple first electrodes, and a patterned partition area protective material layer forming multiple protective parts.

[0060] This invention also provides a display device comprising the display panel described above, or a display panel manufactured using the method described above. This device can be installed as a display device in any electronic terminal with display functionality, such as a mobile phone, laptop, tablet computer, or in-vehicle display. The display device can be used to display static images, such as pictures or photographs. It can also be used to display dynamic images, such as videos.

[0061] In addition, the display device can also perform functions such as taking photos, recording videos, fingerprint recognition, and facial recognition. Accordingly, the display device also includes at least one functional module for implementing the above functions, such as an under-display camera or an under-display fingerprint sensor. The display device provided according to the embodiments of this application and the display panel provided in the embodiments of this application belong to the same inventive concept, and have corresponding film layer structures and beneficial effects. Details not described in detail in the embodiments of the display device can be found in the embodiments of the display panel, and will not be repeated here.

[0062] This invention provides a display panel including an opening area, a partition area surrounding the opening area, and a display area surrounding the partition area; a substrate; a partition mechanism located in the partition area and surrounding the opening area; the partition mechanism including at least one isolation pillar; and a protective layer covering the side of the isolation pillar facing away from the substrate. The cross-sectional width of the protective layer on the side of the isolation pillar in the direction parallel to the substrate is greater than or equal to the cross-sectional width of the side of the isolation pillar facing away from the substrate. The protective layer can be a metal film layer and an organic adhesive, respectively disposed in the same layer as the first electrode and the second planarization layer, to prevent silver ions from contacting the metal and undergoing a displacement reaction, thus preventing precipitation. The protective layer adheres to the top surface of the isolation pillar, improving the encapsulation effect, increasing yield, and saving production capacity.

[0063] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0064] The block diagrams of devices, apparatuses, devices, and systems involved in this application are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, devices, and systems can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.

[0065] It should also be noted that in the apparatus, equipment, and methods of this application, the components or steps can be disassembled and / or recombined. These disassemblies and / or recombinations should be considered as equivalent solutions of this application.

[0066] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of this application. Therefore, this application is not intended to be limited to the aspects shown herein, but rather to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0067] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

[0068] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A display panel, characterized in that, Comprising: An opening area, a partition area surrounding the opening area, and a display area surrounding the partition area; A substrate; A partition mechanism, located in the partition area and disposed around the opening area; the partition mechanism includes at least one isolation column; a protective layer covering the side of the isolation column facing away from the substrate; the surface cross-sectional width of the protective layer on the side close to the isolation column in the direction parallel to the substrate is greater than or equal to the surface cross-sectional width of the isolation column on the side facing away from the substrate.

2. The display panel according to claim 1, characterized in that, The protective layer includes at least one protective portion; the orthographic projection of the isolation column on the substrate is within the orthographic projection range of the protective portion on the substrate; Preferably, the partition mechanism includes a plurality of spaced isolation columns, the plurality of isolation columns are arranged in sequence on the periphery of the opening area, the number of the protective portions is less than the number of the isolation columns, and the protective portion covers at least one of the isolation columns disposed close to the opening area; Preferably, the number of the protective portions is the same as the number of the isolation columns, and the protective portions and the isolation columns are arranged in one-to-one correspondence.

3. The display panel according to claim 1, characterized in that, It further includes a light-emitting unit located in the display area, the light-emitting unit includes a first electrode on the side close to the substrate, and at least part of the materials of the protective layer and the first electrode are the same.

4. The display panel according to claim 3, characterized in that, The first electrode includes a first material layer, a second material layer, and a third material layer, and the three material layers are sequentially arranged in the direction perpendicular to the substrate, and the protective layer is at least the first material layer.

5. The display panel according to claim 3, characterized in that, The first electrode includes a first material layer, a second material layer, and a third material layer, and the three material layers are sequentially arranged in the direction perpendicular to the substrate; The protective layer includes a first material layer, a second material layer, and a third material layer; Preferably, the first material layer and the third material layer include indium tin oxide or indium zinc oxide; the second material layer includes silver.

6. The display panel according to claim 1, characterized in that, The protective layer can also be an organic glue; Preferably, the material of the organic glue can be a polyimide precursor.

7. The display panel according to claim 1, characterized in that, The display panel further includes a planarization layer located in the display area, and the protective layer and the planarization layer are arranged in the same layer.

8. The display panel according to claim 1, characterized in that, The isolation column is a "work"-shaped overlapping multi-layer metal structure.

9. A method for manufacturing a display panel, characterized in that, The display panel includes an opening area, a partition area surrounding the opening area, and a display area surrounding the partition area, and the manufacturing method includes the following steps: Providing a substrate; Forming a partition mechanism located in the partition area on the substrate; Forming a protective material layer on the side of the partition mechanism facing away from the substrate, and the protective material layer covers the display area and the partition area; Patterning the protective material layer to form a protective layer in the partition area, and the surface cross-sectional width of the protective layer on the side close to the partition mechanism in the direction parallel to the substrate is greater than or equal to the surface cross-sectional width of the partition mechanism on the side facing away from the substrate.

10. A display device, characterized in that, Comprising the display panel according to any one of claims 1-8, or comprising the display panel manufactured by the manufacturing method according to claim 9.

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