Display device

Abstract

A display device according to one or more examples includes: a substrate; a plurality of sub-pixels; a planarization layer disposed over the substrate and having a first opening region; an anode disposed in the first opening region and on a top surface and a side portion of the planarization layer; a first bank covering a portion of the anode and including a black resin; a second bank covering sides of the first bank and the anode and having a second open region; an organic layer disposed on the anode exposed through the second opening region; and a cathode disposed on the organic layer. According to the display device, the reflectivity is improved.

Description

[0001] Cross-reference to related applications

[0002] This application claims the benefit and priority of Korean Patent Application No. 10-2024-0143236, filed on October 18, 2024, with the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference for all purposes. Technical Field

[0003] This disclosure relates to display devices. Background Technology

[0004] Currently, with the advent of the comprehensive information age, the field of display devices that visually express electrical information signals has developed rapidly, and research continues to be conducted to improve the performance of various display devices, such as thinness, light weight and low power consumption.

[0005] Among various display devices, electroluminescent displays are self-emissive, eliminating the need for a separate light source, unlike liquid crystal displays. Therefore, electroluminescent displays can be manufactured with a light weight and thin profile. Furthermore, because electroluminescent displays are driven by low voltage, they offer advantages not only in terms of power consumption but also in terms of color reproduction, response speed, viewing angle, and contrast. Therefore, they are expected to be used in a wide range of applications.

[0006] Meanwhile, light emitted from the light-emitting layer of the electroluminescent display device passes through various components of the electroluminescent display device to be released to the outside of the electroluminescent display device. However, when some of the light emitted from the light-emitting layer is trapped in the electroluminescent display device and is not released to the outside of the electroluminescent display device, the light extraction efficiency of the electroluminescent display device may deteriorate.

[0007] The description of related technologies should not be construed as prior art simply because they are mentioned or associated with this section. The description of related technologies includes information describing one or more aspects of the subject matter, and the description in this section does not limit the scope of the invention. Summary of the Invention

[0008] One aspect of this disclosure is to provide a display device that increases the amount of extracted light.

[0009] Another aspect of this disclosure is to provide a display device having a display panel with reduced thickness.

[0010] Another aspect of this disclosure is to provide a display device with reduced power consumption.

[0011] Another aspect of this disclosure is to provide a display device with improved reflective visibility.

[0012] The aspects of this disclosure are not limited to those mentioned above, and those skilled in the art will clearly understand other aspects not mentioned above based on this disclosure.

[0013] To achieve the aspects described above, according to one aspect of this disclosure, a display device includes: a substrate; a plurality of sub-pixels; a planarization layer disposed above the substrate and having a first opening region; an anode disposed in the first opening region and on a top surface and side portion of the planarization layer; a first dam covering a portion of the anode and comprising black resin; a second dam covering the first dam and the side portion of the anode and having a second opening region; an organic layer disposed on the anode exposed through the second opening region; and a cathode disposed on the organic layer.

[0014] Further details of the example implementation are included in the detailed implementation and the accompanying drawings.

[0015] According to one or more aspects of this disclosure, a side mirror (SM) structure of the anode can be used to increase the amount of light extracted by the display device. Therefore, the display device can operate with reduced power consumption. Furthermore, greenhouse gas emissions can be reduced by decreasing the use of fossil fuels for power generation, thereby achieving ESG (Environmental, Social, and Governance).

[0016] According to one or more aspects of this disclosure, a color-on-encapsulation (COE) structure is used to reduce the thickness of the display panel. Therefore, a lightweight and slim design can be achieved.

[0017] According to one or more aspects of this disclosure, a black dam is formed on the anode having an SM structure to improve reflectivity. Therefore, light entering the thin-film transistor (TFT) element is blocked, thereby enhancing device reliability.

[0018] According to one or more aspects of this disclosure, a display device can be provided in which a light receiving device is located behind the display panel, such that the light receiving device, which needs to receive light from the front surface, is not exposed on the front surface. Therefore, the bezel of the front surface of the display device is reduced, and the front surface design of the display device can be enhanced.

[0019] According to one or more aspects of this disclosure, when the light receiving device is located behind the display panel, an additional transmission area is ensured in the first active region overlapping with the light receiving device to satisfactorily transmit light from the front surface of the display panel through the display panel to the light receiving device. Therefore, the image quality of the light receiving device can be improved.

[0020] The effects of one or more aspects of this disclosure are not limited to those provided above, and various other effects are included in this disclosure.

[0021] Additional features, advantages, and aspects of this disclosure are set forth in part in the description which follows, and in part will become apparent from this disclosure, or may be learned by practicing the inventive concept provided herein. Other features, advantages, and aspects of this disclosure may be realized and obtained from the description provided in or derived from this disclosure, the claims of this disclosure, and the accompanying drawings. All such features, advantages, and aspects are intended to be included in this description, within the scope of this disclosure, and protected by the appended claims. Nothing in this section should be construed as limiting these claims. Other features, advantages, and aspects are discussed below in conjunction with embodiments of this disclosure.

[0022] It should be understood that both the foregoing description and the following description of this disclosure are examples and are intended to provide further explanation of the claimed disclosure. Attached Figure Description

[0023] The accompanying drawings are included to provide a further understanding of this disclosure. The drawings are incorporated into and constitute a part of this disclosure. The drawings illustrate aspects and embodiments of this disclosure and, together with the description, serve to illustrate the principles and examples of this disclosure. In the drawings:

[0024] Figure 1 This is an example diagram schematically illustrating the configuration of a display device according to an example embodiment of the present disclosure;

[0025] Figure 2 It is shown schematically. Figure 1 Example floor plan of the display panel;

[0026] Figure 3 This is an example perspective view showing the structure of embedding a touch panel in a display panel;

[0027] Figure 4 This is an example diagram illustrating the pixel structure of a display panel according to a first exemplary embodiment of the present disclosure;

[0028] Figure 5 It is along Figure 4 Example cross-sectional view taken from line A-A';

[0029] Figure 6 This is an example cross-sectional view illustrating the sub-pixel structure of a second exemplary embodiment of the present disclosure;

[0030] Figure 7 It shows along Figure 6Example image of a luminescent image captured by a cross-section;

[0031] Figure 8 This is an example plan view schematically showing a display device according to a third exemplary embodiment of the present disclosure;

[0032] Figure 9 It is shown Figure 8 An example diagram of the first active area of ​​a display device;

[0033] Figure 10 It is shown Figure 8 Example diagram of part A;

[0034] Figure 11 This is an example diagram showing the cross-sectional structure of the non-transmissive region and the transmissive region in the first active region and the cross-sectional structure of the second active region in a display device according to a third exemplary embodiment of the present disclosure;

[0035] Figure 12 This is an example cross-sectional view illustrating the sub-pixel structure of a third exemplary embodiment of the present disclosure;

[0036] Figure 13 This is an example diagram illustrating the pixel structure of a display panel according to a fourth exemplary embodiment of the present disclosure;

[0037] Figure 14 It is along Figure 13 Example cross-sectional view taken from line B-B';

[0038] Figure 15 This is an example cross-sectional view illustrating the sub-pixel structure of a fifth exemplary embodiment of the present disclosure;

[0039] Figure 16 This is an example diagram illustrating the pixel structure of a display panel according to a sixth exemplary embodiment of the present disclosure; and

[0040] Figure 17 It is along Figure 16 Example cross-sectional view taken from line C-C'.

[0041] Throughout the accompanying drawings and detailed embodiments, unless otherwise described, the same reference numerals should be understood to refer to the same elements, features, and structures. For clarity, illustration, and / or convenience, the dimensions, lengths, and thicknesses of layers, regions, and elements, and their descriptions, may be exaggerated. Detailed Implementation

[0042] Reference will now be made to embodiments of this disclosure in detail, examples of which are illustrated in the accompanying drawings. In the following description, detailed descriptions of well-known methods, functions, structures, or configurations may be omitted for brevity where such omissions might unnecessarily obscure aspects of this disclosure. Furthermore, repeated descriptions may be omitted for brevity. The described processing steps and / or the progression of operations are non-limiting examples.

[0043] The order of steps and / or operations is not limited to the order set forth herein and may be changed to occur in a different order than that described herein, except for steps and / or operations that must occur in a specific order. In one or more examples, two consecutive operations may be performed substantially simultaneously, or, depending on the functions or operations involved, they may be performed in reverse or a different order.

[0044] Unless otherwise stated, even if the same reference numerals are shown in different figures, they may refer to the same elements throughout. Unless otherwise stated, the same reference numerals may be used to refer to the same or substantially the same elements throughout the specification and figures. In one or more aspects, unless otherwise stated, the same elements (or elements with the same name) in different figures may have the same or substantially the same function and characteristics. The names of the various elements used in the following description are chosen for convenience only and may therefore differ from the names used in actual products.

[0045] The advantages and features of this disclosure, and its implementation methods, are illustrated by means of embodiments described with reference to the accompanying drawings. However, this disclosure may be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are exemplary and provided so that this disclosure may be detailed and complete to aid those skilled in the art in understanding the inventive concept, without limiting the scope of protection of this disclosure.

[0046] The shapes, dimensions (e.g., size, length, width, height, thickness, position, radius, diameter, and area), proportions, ratios, angles, numbers, number of elements, etc., disclosed herein (including those shown in the accompanying drawings) are merely examples, and therefore, this disclosure is not limited to the details shown. However, it should be noted that the relative dimensions of the components shown in the accompanying drawings are part of this disclosure.

[0047] When terms such as “comprising,” “having,” “including,” “containing,” “constituting,” “made of,” “formed by,” “composed of,” etc., are used relative to one or more elements (e.g., layer, film, component, electrode, structure, transistor, segment, member, part, region, area, section, step, operation, etc.), one or more other elements may be added unless terms such as “only” are used. The terminology used in this disclosure is merely for describing particular exemplary embodiments and is not intended to limit the scope of this disclosure. Unless the context clearly indicates otherwise, singular terms may include plural forms. For example, an element may be one or more elements. An element may include multiple elements. The word “exemplary” is used to mean used as an example or illustration. An implementation is an exemplary implementation. An aspect is an exemplary aspect. In one or more implementations, “implementation,” “example,” “aspect,” etc., should not be construed as preferred or superior to other implementations. Unless otherwise stated, implementation, example, exemplary implementation, aspect, etc., may refer to one or more implementations, one or more examples, one or more example implementations, one or more aspects, etc. Furthermore, the term “may” covers all meanings of the term “capable of.”

[0048] In one or more respects, unless otherwise expressly stated, components, features, or corresponding information (e.g., level, range, dimension, size, etc.) are interpreted as including a range of errors or tolerances, even if no explicit description of such a range of errors or tolerances is provided. Ranges of errors or tolerances can be caused by a variety of factors (e.g., process factors, internal or external influences, noise, etc.). When interpreting numerical values, unless otherwise expressly stated, the value is interpreted as including the range of errors.

[0049] When using any of the terms indicating location or position, such as “on top of,” “above,” “on the top of,” “above,” “below,” “on the top of,” “above,” “on the top of,” “above,” “below,” “below,” “below,” “under,” “near,” “close to,” “adjacent to,” “next to,” “beside,” “at,” or “on one side of,” to describe the positional relationship between two elements (e.g., layers, films, components, electrodes, structures, transistors, segments, components, sections, areas, regions, parts, etc.), one or more other elements may be located between the two elements, unless more restrictive terms such as “closely adjacent,” “directly,” or “tightly” are used. For example, when any of the foregoing terms is used to describe one element and another element, the description should be interpreted to include cases where the elements are in direct contact with each other and cases where one or more additional elements are disposed or inserted between them. Furthermore, spatial relative terms such as those mentioned above, as well as other terms such as "front," "back," "back," "left," "right," "top," "bottom," "upper," "lower," "downward," "upward," "above," "below," "column," "row," "vertical," "horizontal," and "diagonal," refer to any frame of reference. For example, these terms can be used to exemplarily understand the relative relationships between elements, including any correlations as shown in the accompanying drawings. However, embodiments of this disclosure are not limited to or restricted by these terms. Spatial relative terms should be understood to include terms for different orientations of elements in use or operation, in addition to those depicted in the drawings or described herein. For example, in the case where a lower element or an element positioned below another element is flipped, that element may be referred to as an upper element or an element positioned above another element. Thus, for example, the terms "below" or "under" can semantically encompass the terms "above" or "over." Example terms such as "below" can include all directions, including the directions of "below," "above," and diagonal directions. Similarly, example terms such as "above," "on," etc. can include all directions, including directions such as "above," "on," "below," and diagonal directions.

[0050] When describing temporal relationships, when the temporal sequence is described as such as “after,” “following,” “after,” “next,” “before,” “previously,” “in front of,” etc., it may include discontinuous or non-sequential situations, and therefore one or more other events may occur in between, unless more restrictive terms such as “just,” “immediately,” or “directly” are used.

[0051] It should be understood that although the terms "first," "second," etc., may be used herein to describe various elements (e.g., layer, film, component, electrode, structure, transistor, segment, member, part, region, area, section, step, operation, etc.), these elements should not be limited by these terms, for example, not by any particular order, priority, or number of elements. These terms are used only to distinguish one element from another. For example, without departing from the scope of this disclosure, a first element may refer to a second element, and similarly, a second element may refer to a first element. Furthermore, without departing from the scope of this disclosure, first elements, second elements, etc., may be named arbitrarily as is convenient for those skilled in the art. For clarity, the function or structure of these elements (e.g., first element, second element, etc.) is not limited by the ordinal number or name preceding the element. Furthermore, a first element may include one or more first elements. Similarly, a second element, etc., may include one or more second elements, etc.

[0052] In describing elements of this disclosure, the terms “first,” “second,” “A,” “B,” “(a),” “(b),” etc., may be used. These terms are intended to identify the corresponding element from other elements, and are not used to define the nature, basis, order, or number of elements.

[0053] The expression "joined" of an element (e.g., layer, film, component, electrode, structure, transistor, segment, member, part, region, area, section, etc.) with another element can be understood to mean, for example, that the element can be joined directly or indirectly to the other element. The term "joined" or similar expressions can refer to terms such as "cover," "surround," "contact," "overlap," "cross," "intersect," "connect," "couple," "attach," "adhere," "combine," "link," "provide," "set," "interact," etc. Unless otherwise stated, joining can involve one or more intermediate elements disposed or inserted between an element and another element. Furthermore, unless otherwise stated, an element can be joined at least partially or wholly (or completely) to another element. Additionally, an element can be included in at least one of two or more elements joined together. Similarly, another element can be included in at least one of two or more elements joined together. When an element joins with another element, at least a portion of the element can be joined with at least a portion of the other element. The term “with another element” or similar expression may be understood, depending on the context, as “another element”, or “with, to another element, in another element, or on another element.” Similarly, the term “each other” may be understood, depending on the context, as “each other”, or “with, to, or on each other.”

[0054] The phrase “cross” can be understood, for example, as crossing at least partially or completely.

[0055] Terms such as “line” or “direction” should not be interpreted solely based on the geometric relationships in which the individual lines or directions are parallel, perpendicular, diagonal, or inclined relative to each other, but may mean a line or direction with broad directionality within the scope in which the components of this disclosure can be functionally operated. For example, the terms “first direction,” “second direction,” etc., should not be interpreted solely based on the geometric relationships in which the individual directions are parallel, perpendicular, diagonal, or inclined relative to each other, but may mean a direction with broad directionality within the scope in which the components of this disclosure can be functionally operated.

[0056] The term "at least one" should be understood to include any and all combinations of one or more of the associated enumerated items. For example, each of the phrases "at least one of the first, second, or third items" and "at least one of the first, second, and third items" can mean (i) a combination of items provided by two or more of the first, second, and third items, or (ii) only one of the first, second, or third items. Furthermore, "at least one of a plurality of elements" can mean (i) one element of a plurality of elements, (ii) some elements of a plurality of elements, or (iii) all elements of a plurality of elements. Additionally, "at least some," "at least some parts," "at least some sections," "at least a portion," "at least one or more parts," "at least a section," "at least one or more sections," "at least some elements," "one or more," etc., in the context of a plurality of elements can mean (i) one element of a plurality of elements, (ii) a part (or section) of a plurality of elements, (iii) one or more parts (or sections) of a plurality of elements, (iv) multiple elements of a plurality of elements, or (v) all elements of a plurality of elements. Furthermore, the terms "at least some," "at least some parts," "at least some sections," "at least a portion," "at least one or more parts," "at least a part," "at least one or more sections," etc., in the context of an element can indicate (i) a part (or section) of an element, (ii) one or more parts (or sections) of an element, (iii) an element, or (iv) all parts of an element. Additionally, "some," "some parts," "some sections," "a portion," "one or more parts," "a part," "one or more sections," etc., can respectively refer to "at least some," "at least some parts," "at least some sections," "at least a portion," "at least one or more parts," "at least one part," "at least one or more sections," etc.

[0057] The expression "first element," "second element," and " / or" "third element" should be understood as any one of the first, second, and third elements, or any or all combinations of the first, second, and third elements. A similar interpretation applies when "and / or" is used with two or more elements. By way of example, A, B, and / or C can refer to only A; only B; only C; any one of A, B, and C (e.g., A, B, or C); some combinations of A, B, and C (e.g., A and B; A and C; or B and C); or all of A, B, and C. Furthermore, the expression "A / B" can be understood as A and / or B. For example, the expression "A / B" can refer to only A; only B; A or B; or A and B.

[0058] In one or more aspects, unless otherwise stated, for convenience, the terms "between" and "among" may be used interchangeably. For example, the expression "between multiple elements" can be understood as "among multiple elements." In another example, the expression "among multiple elements" can be understood as "between multiple elements." In one or more examples, the number of elements may be two. In one or more examples, the number of elements may be more than two. Furthermore, when an element is referred to as being "between" at least two elements, the element may be the only element between at least two elements, or there may be one or more intermediate elements.

[0059] In one or more aspects, unless otherwise stated, for convenience, the phrases “each other” and “mutually” may be used interchangeably. For example, the expression “different from each other” can be understood as “different from each other”. In another example, the expression “different from each other” can be understood as “different from each other”. In one or more examples, the number of elements involved in the foregoing expression may be two. In one or more examples, the number of elements involved in the foregoing expression may be more than two.

[0060] In one or more respects, unless otherwise stated, for convenience, the phrases “one or more of them” and “one or more of them” may be used interchangeably.

[0061] The term "or" means "inclusive or" rather than "exclusive or". That is, unless otherwise stated or clear from the context, the expression "x uses a or b" means any of the natural inclusive permutations. For example, "a or b" can mean "a", "b", or "a and b". For example, "a, b, or c" can mean "a", "b", "c", "a and b", "b and c", "a and c", or "a, b, and c".

[0062] The phrases “substantially identical” or “nearly identical” can indicate the degree to which they are considered equivalent, taking into account minor differences caused by errors in the manufacturing process.

[0063] Features of the various embodiments of this disclosure may be partially or completely coupled or combined with each other, may be technically related to each other, and may operate, link, or drive together in various ways. Embodiments of this disclosure may be implemented or performed independently of each other, or may be implemented or performed together in a mutually dependent or related relationship. In one or more aspects, components of each device and apparatus according to the various embodiments of this disclosure are operatively coupled and configured.

[0064] Unless otherwise defined, the terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which the exemplary embodiments pertain. It should also be understood that terms defined, for example, in common dictionaries, should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and should not be interpreted in an idealized or overly formal sense unless otherwise defined herein. For example, the terms “component” or “unit” can be applied, for example, to individual circuits, components or structures, integrated circuits, computational blocks of circuit devices, or any structure configured to perform the described functions, as would be understood by one of ordinary skill in the art.

[0065] The terms used herein have been selected as those commonly used in the relevant technical fields; however, other terms may exist depending on technological developments and / or changes, conventions, preferences of those skilled in the art, etc. Therefore, the terms used herein should not be construed as limiting the technical concept, but rather as examples of terms used to describe exemplary embodiments.

[0066] Furthermore, in certain circumstances, the terminology may be arbitrarily chosen by the applicant, and in such cases, its detailed meaning is described herein. Therefore, the terminology used herein should be understood not only based on its name but also on its meaning and content.

[0067] In the following description, various exemplary embodiments of the present disclosure are described in more detail with reference to the accompanying drawings. Reference numerals for each element in the drawings may be used to indicate the same or similar elements in other drawings, and similar reference numerals may refer to similar elements unless otherwise stated. Identical or similar elements may be represented by the same reference numerals even if they are depicted in different drawings. For the sake of brevity, repeated descriptions of identical or similar elements may be omitted, and unless otherwise stated, the description provided for elements in one or more drawings may also apply to elements using the same reference numerals in other drawings.

[0068] For ease of description, the scale, size, dimensions, and thickness of each element shown in the accompanying drawings may differ from the actual scale, size, dimensions, and thickness, and therefore, embodiments of this disclosure are not limited to the scale, size, dimensions, and thickness shown in the accompanying drawings.

[0069] In the following, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0070] Figure 1 This is an example diagram schematically illustrating the configuration of a display device according to an exemplary embodiment of the present disclosure.

[0071] For example, Figure 1 A schematic configuration of a display device with a touch panel (TSP) embedded in an exemplary embodiment of the present disclosure is shown. However, the present disclosure is not limited thereto, and the display device according to the exemplary embodiment of the present disclosure may not include a display panel.

[0072] Reference Figure 1 The display device according to the example embodiments of this disclosure can provide both the function of displaying images and the function of sensing touch.

[0073] To provide image display functionality, a display device according to an example embodiment of the present disclosure may include a display panel (DISP), a gate drive circuit (GDC), a data drive circuit (DDC), and a timing controller (TC).

[0074] For example, in a display panel DISP, multiple data lines and multiple gate lines are set, and multiple sub-pixels SP defined by the multiple data lines and multiple gate lines can be set.

[0075] The data drive circuit DDC drives multiple data lines, and the gate drive circuit GDC drives multiple gate lines. The timing controller TC can control the operation of the data drive circuit DDC and the gate drive circuit GDC.

[0076] Each of the data driver circuit (DDC), gate driver circuit (GDC), and timing controller (TC) can be implemented by one or more separate components. In some cases, two or more of the data driver circuit (DDC), gate driver circuit (GDC), and timing controller (TC) can be integrated into a single component. For example, the data driver circuit (DDC) and timing controller (TC) can be implemented as a single integrated chip (IC chip).

[0077] Furthermore, to provide touch sensing functionality, the display device according to an example embodiment of this disclosure may include a touch panel (TSP) and a touch sensing circuit (TSC). The touch panel (TSP) includes a plurality of touch electrodes. The touch sensing circuit (TSC) supplies touch drive signals to the touch panel (TSP) and detects touch sensing signals from the touch panel (TSP) to sense the presence of a user's touch or the touch position (touch coordinates) in the touch panel (TSP) based on the detected touch sensing signals.

[0078] For example, a touch sensing circuit (TSC) may include a touch driving circuit (TDC) and a touch controller (TCTR). The touch driving circuit (TDC) supplies touch driving signals to the touch panel (TSP) and detects touch sensing signals from the touch panel (TSP). The touch controller (TCTR) senses the presence of a user's touch and / or the touch position in the touch panel (TSP) based on the touch sensing signals detected by the touch driving circuit (TDC). The touch driving circuit (TDC) may include a first circuit portion that supplies touch driving signals to the touch panel (TSP) and a second circuit portion that detects touch sensing signals from the touch panel (TSP).

[0079] For example, the touch driver circuit TDC and the touch controller TCTR can be implemented by separate components, or in some cases, they can be integrated into a single component.

[0080] For example, each of the data drive circuit (DDC), gate drive circuit (GDC), and touch drive circuit (TDC) can be implemented by one or more integrated circuits. From the viewpoint of electrical connection with the display panel (DISP), these circuits can be implemented using chip-on-glass (COG), chip-on-film (COF), or tape-on-package (TCP) types. Furthermore, the gate drive circuit (GDC) can also be implemented using a gate-in-panel (GIP) type.

[0081] For example, each of the circuit configurations DDC, GDC, and TC for display driving and the circuit configurations TDC and TCTR for touch sensing can be implemented by one or more separate components. In some cases, one or more of the circuit configurations DDC, GDC, and TC for display driving and one or more of the circuit configurations TDC and TCTR for touch sensing are functionally integrated so that they can be implemented by one or more components.

[0082] For example, the data driver circuit (DDC) and the touch driver circuit (TDC) can be implemented as integrated into one or two or more integrated circuit chips. When the data driver circuit (DDC) and the touch driver circuit (TDC) are implemented as integrated into two or more integrated circuit chips, each of the two or more integrated circuit chips can have both data driving and touch driving functions.

[0083] Furthermore, the display device according to the exemplary embodiments of this disclosure can be of various types, such as a light-emitting display device or a liquid crystal display device. In the following description, for ease of description, a light-emitting display device will be used as an example of a display device. That is, although the display panel DISP can be of various types, such as a light-emitting display panel or a liquid crystal display panel, in the following description, for ease of description, a light-emitting display panel will be used as an example of a display panel DISP.

[0084] In addition, as will be described below, the touch panel TSP may include: a plurality of touch electrodes to which touch driving signals are applied or touch sensing signals are detected; and a plurality of touch routing lines connecting the plurality of touch electrodes to the touch driving circuit TDC.

[0085] The touch panel TSP can be located outside the display panel DISP. For example, the touch panel TSP and the display panel DISP can be manufactured separately for assembly. Such a touch panel TSP is called an external or additional type.

[0086] In contrast, a touch panel TSP can be embedded in a display panel DISP. For example, when manufacturing a display panel DISP, the touch sensor structure that constitutes the touch panel TSP, such as multiple touch electrodes and multiple touch routing lines, can be formed together with multiple electrodes and multiple signal lines used for display driving.

[0087] Furthermore, the touch panel TSP can be formed directly above the encapsulation unit of the display panel DISP. For example, the touch insulating film and touch electrodes are patterned above the encapsulation unit and connected to signal lines formed as electrodes for display driving to be driven. In the following description, for ease of description, an example of the touch panel TSP being formed directly above the encapsulation unit will be described.

[0088] Figure 2 It is shown schematically. Figure 1 Example floor plan of the display panel.

[0089] Reference Figure 2 The display panel DISP may include an active region AA in which an image is displayed, and a non-active region NA that is the outer region of the active region AA as the outer boundary line BL.

[0090] In the active area AA of the display panel DISP, multiple sub-pixels SP are set for displaying images, and various electrodes or signal lines for display driving are set.

[0091] Furthermore, multiple touch electrodes for touch sensing and multiple touch routing lines electrically connected to the touch electrodes can be set in the active area AA of the display panel DISP. Therefore, the active area AA can also be referred to as the touch sensing area capable of sensing touch.

[0092] In the passive area NA of the display panel DISP, link lines extending from or electrically connecting to various signal lines located in the active area AA, as well as pads electrically connected to these link lines, can be configured. The pads in the passive area NA can be coupled to or electrically connected to the display driver circuitry.

[0093] Furthermore, in the non-active area NA of the display panel DISP, link lines extending from or electrically connected to multiple touch route lines located in the active area AA, as well as pads electrically connected to these link lines, can be provided. The pads in the non-active area NA can be coupled to or electrically connected to the touch driver circuitry.

[0094] In the non-active region NA, a portion of the outermost touch electrode among the multiple touch electrodes disposed in the active region AA extends, or one or more electrodes (touch electrodes) may be disposed of from the same material as the multiple touch electrodes disposed in the active region AA.

[0095] For example, all of the multiple touch electrodes disposed in the display panel DISP can exist in the active region AA, or some of the multiple touch electrodes disposed in the display panel DISP (e.g., the outermost touch electrode) can exist in the non-active region NA. Some of the multiple touch electrodes disposed in the display panel DISP (e.g., the outermost touch electrode) can exist above the active region AA and the non-active region NA.

[0096] Reference Figure 2 The display panel DISP according to an example embodiment of the present disclosure may include a dam region DA having a dam for suppressing any layer (e.g., encapsulation unit in the display panel) from passing through the display panel DISP in the active region AA.

[0097] The dam region DA can be located at the boundary between the active region AA and the non-active region NA, or at any location in the non-active region NA, which is an outer region of the active region AA.

[0098] A dam set in the dam region DA can be set to surround all directions of the active region AA, or it can be set only outside one or two or more parts of the active region AA.

[0099] A dam set in the dam area DA can have one connected pattern or two or more separate patterns. In addition, in the dam area DA, only a main dam can be set, or two or more dams (main dam and secondary dam) can be set, or three or more dams can be set.

[0100] For example, in the dam area DA, only the main dam is set in one direction, while in the other direction, both the main dam and the secondary dam can be set.

[0101] Figure 3 This is an example perspective view showing the structure of embedding a touch panel in a display panel.

[0102] Figure 3 This is an example perspective view showing the structure of embedding a touch panel in a display panel according to an example embodiment of the present disclosure.

[0103] Reference Figure 3 For example, in the display panel ( Figure 2 In the active region AA of the DISP, multiple sub-pixels SP can be set above the substrate 110.

[0104] Each sub-pixel SP may include: a light-emitting diode 120, a first transistor T1 for driving the light-emitting diode 120, a second transistor T2 for sending a data voltage VDATA to a first node N1 of the first transistor T1, and a storage capacitor Cst for maintaining a constant voltage for one frame.

[0105] For example, the first transistor T1 may include a first node N1 to which a data voltage VDATA is applied, a second node N2 electrically connected to the light-emitting diode 120, and a third node N3 to which a driving voltage VDD is applied from the driving voltage line DVL. The first node N1 is a gate node, the second node N2 may be a source node or a drain node, and the third node N3 may be a drain node or a source node. The first transistor T1 may also be referred to as the driving transistor for driving the light-emitting diode 120.

[0106] The light-emitting diode 120 may include a first electrode (e.g., an anode), a light-emitting layer, and a second electrode (e.g., a cathode). The first electrode may be electrically connected to a second node N2 of the first transistor T1, and the second electrode may be applied with a base voltage VSS.

[0107] The light-emitting layer in the light-emitting diode 120 can be made of organic or inorganic materials.

[0108] For example, the second transistor T2 is controlled to be turned on or off by a scan signal SCAN applied through the gate line GL, and can be electrically connected between the first node N1 of the first transistor T1 and the data line DL. Furthermore, the second transistor T2 can be referred to as a switching transistor.

[0109] For example, when the second transistor T2 is turned on by the scan signal SCAN, the second transistor T2 can send the data voltage VDATA supplied from the data line DL to the first node N1 of the first transistor T1.

[0110] In addition, the storage capacitor Cst can be electrically connected between the first node N1 and the second node N2 of the first transistor T1.

[0111] like Figure 3 As shown, each sub-pixel SP can have a 2T1C structure including two transistors T1 and T2 and a capacitor Cst, and in some cases, it can also include one or more transistors or one or more capacitors.

[0112] The first transistor T1 and the second transistor T2 can be composed of n-type transistors or p-type transistors. As described above, circuit elements such as a light-emitting diode 120, two or more transistors T1 and T2, and one or more capacitors Cst can be provided in the display panel DISP. The circuit elements (specifically, the light-emitting diode 120) are susceptible to external moisture or oxygen, therefore, a packaging unit 140 can be provided on the display panel DISP to suppress the penetration of external moisture or oxygen into the circuit elements.

[0113] The packaging unit 140 can be formed by one layer or by multiple layers.

[0114] Meanwhile, in the display device according to the example embodiment of this disclosure, the touch panel TSP can be disposed above the packaging unit 140. For example, in the display device according to the example embodiment of this disclosure, a touch sensor structure, such as a plurality of touch electrodes TE constituting the touch panel TSP, can be disposed above the packaging unit 140.

[0115] Furthermore, the display device according to the example embodiments of this disclosure can sense touch based on the capacitance formed in the touch electrode TE.

[0116] The display device according to the example embodiments of this disclosure employs a capacitance-based touch sensing method, such that touch is sensed by a mutual capacitance-based touch sensing method or a self-capacitance-based touch sensing method.

[0117] For example, based on the mutual capacitance-based touch sensing method, multiple touch electrodes TE can be divided into driving touch electrodes (transmitting touch electrodes) to which touch driving signals are applied and sensing touch electrodes (receiving touch electrodes) that detect touch sensing signals and form capacitance with the driving touch electrodes.

[0118] In the case of touch sensing based on mutual capacitance, the touch sensing circuit can sense the presence of a touch and / or touch coordinates based on the change in capacitance (mutual capacitance) between the driving touch electrode and the sensing touch electrode, according to the presence of an indicator such as a finger or pen.

[0119] In a self-capacitance-based touch sensing method, each touch electrode TE can function as both a driving touch electrode and a sensing touch electrode. For example, a touch sensing circuit applies a touch driving signal to one or more touch electrodes TE and detects the touch sensing signal using the touch electrode TE to which the touch driving signal is applied. The touch sensing circuit then identifies changes in capacitance between an indicator such as a finger or pen and the touch electrode TE based on the detected touch sensing signal to sense the presence of a touch and / or touch coordinates. In a self-capacitance-based touch sensing method, there is no distinction between driving and sensing touch electrodes.

[0120] As described above, the display device according to the example embodiments of this disclosure can sense touch using either a mutual capacitance-based touch sensing method or a self-capacitance-based touch sensing method. However, in the following description, for ease of description, a display device performing mutual capacitance-based touch sensing and including a touch sensor structure for mutual capacitance-based touch sensing will be described as an example.

[0121] The configuration of subpixels will be described in detail below with reference to the accompanying drawings.

[0122] Figure 4 This is an example diagram illustrating the pixel structure of a display panel according to a first exemplary embodiment of the present disclosure.

[0123] Figure 4 A portion of the display panel is shown, with three sub-pixels SP1, SP2, and SP3 set as an example. Furthermore, Figure 4 The planar surface structure of the second dam 117 is shown. The planar surface structure includes a second opening region OA2 as the main light-emitting region, an anode 121 with a side mirror structure, a first dam 116 disposed on a third region 121c of the anode 121, a third planarization layer 115c including the first opening region OA1, and a spacer 118.

[0124] Reference Figure 4The display panel according to the first exemplary embodiment of the present disclosure may include a pixel area with multiple sub-pixels SP1, SP2 and SP3 and a wiring area with various signal lines.

[0125] Multiple first sub-pixels SP1, second sub-pixels SP2, and third sub-pixels SP3 can be set in a pixel area.

[0126] For example, the first sub-pixel SP1 could be a red sub-pixel.

[0127] For example, the second sub-pixel SP2 could be a green sub-pixel.

[0128] For example, the third sub-pixel SP3 could be a blue sub-pixel.

[0129] For example, the first sub-pixel SP1, the second sub-pixel SP2, and the third sub-pixel SP3 can have circular or elliptical shapes, but are not limited to these, and can have polygonal shapes such as rectangular shapes or shapes that combine various shapes.

[0130] At this point, the shapes of sub-pixels SP1, SP2, and SP3 are defined by, but not limited to, the shape of the second opening region OA2.

[0131] exist Figure 4 The image shows a pixel consisting of a first sub-pixel SP1, a second sub-pixel SP2, and a third sub-pixel SP3, but it is not limited to this. For example, a white fourth sub-pixel can be added to the first sub-pixel SP1, the second sub-pixel SP2, and the third sub-pixel SP3.

[0132] Furthermore, according to one or more aspects of this disclosure, due to the side mirror SM structure of the anode 121, a reflective light-emitting region and a main light-emitting region are added, thus the light-emitting region can be expanded compared to each sub-pixel SP1, SP2, and SP3. The side mirror structure will be described in detail below.

[0133] like Figure 4 As shown, the third planarization layer 115c, in which the anode 121 with a side mirror structure is provided, may include a first opening region OA1 obtained by removing (opening) portions of the third planarization layer 115c corresponding to the main light-emitting region, the reflected light-emitting region, and the second non-light-emitting region of the sub-pixels SP1, SP2, and SP3.

[0134] As described above, according to one or more aspects of this disclosure, the side mirror structure of the anode 121 is used to increase the amount of light extracted by the display device, and a color filter layer is applied to the color on encapsulation (COE) structure on the encapsulation unit to reduce the thickness of the display panel. Furthermore, according to one or more aspects of this disclosure, a black first dam 116 is applied to the anode 121 having the side mirror structure to improve the reflectivity under the COE structure, which will be described in detail with reference to the accompanying drawings.

[0135] Figure 5 It is along Figure 4 Example cross-sectional view taken from line A-A'.

[0136] Figure 5 A portion of a cross-section of a subpixel of a display panel according to a first exemplary embodiment of this disclosure is shown. For example, Figure 5 This illustrates cutting approximately in the left-right direction. Figure 4 The first sub-pixel SP1 is the center of the section obtained.

[0137] Reference Figure 5 The driving transistor Td, the switching transistor Ts, and the light-emitting diode 120 can be disposed above the substrates 110a, 110b, and 110c.

[0138] For example, substrates 110a, 110b, and 110c may include a first substrate 110a, a second substrate 110b, and an interlayer insulating layer 110c. The interlayer insulating layer 110c may be disposed between the first substrate 110a and the second substrate 110b.

[0139] As described above, substrates 110a, 110b, and 110c are configured with a first substrate 110a, a second substrate 110b, and an interlayer insulating layer 110c to effectively suppress moisture penetration. For example, the first substrate 110a and the second substrate 110b may be polyimide (PI) substrates, but are not limited thereto.

[0140] Furthermore, substrates 110a, 110b, and 110c can be made of flexible materials to become flexible substrates. By using this, foldable or bendable foldable display panels can be manufactured.

[0141] Multiple transistors, such as driving transistor Td or switching transistor Ts, can be disposed above substrates 110a, 110b, and 110c.

[0142] A multi-buffer layer 111a is provided on the second substrate 110b, and an active buffer layer 111b can be provided on the multi-buffer layer 111a.

[0143] Meanwhile, a first light-shielding layer 135a can be disposed above the second substrate 110b. However, it is not limited to this, and the first light-shielding layer 135a can be disposed on the multi-buffer layer 111a.

[0144] The first light-shielding layer 135a can be used for light shading.

[0145] The multiple buffer layer 111a can be disposed on the first light-shielding layer 135a.

[0146] An active buffer layer 111b can be placed above a multi-buffer layer 111a.

[0147] The first active layer 134a of the driving transistor Td can be set above the active buffer layer 111b.

[0148] A first gate insulating layer 112a can be disposed on the first active layer 134a.

[0149] In addition, the first gate electrode 131a of the driving transistor Td can be disposed on the first gate insulating layer 112a.

[0150] Furthermore, for example, a gate material layer 136a may be formed on the first gate insulating layer 112a at a location different from the formation location of the driving transistor Td. For example, the gate material layer 136a may be the first storage electrode, but is not limited thereto.

[0151] A first interlayer insulating layer 113a can be provided on the first gate electrode 131a.

[0152] A metal layer 136b may be disposed on the first interlayer insulating layer 113a. For example, the metal layer 136b may be a second storage electrode, but is not limited thereto.

[0153] In this case, the metal layer 136b can be configured together with the gate material layer 136a to form a storage capacitor, but is not limited thereto.

[0154] In addition, for example, a second light-shielding layer 135b may be provided on the first interlayer insulating layer 113a at a position different from the formation position of the metal layer 136b.

[0155] The buffer layer 111c can be disposed on the metal layer 136b and the second light-shielding layer 135b.

[0156] The second active layer 134b of the switching transistor Ts can be set on the buffer layer 111c.

[0157] A second gate insulating layer 112b can be disposed on the second active layer 134b.

[0158] In addition, the second gate electrode 131b of the switching transistor Ts can be disposed on the second gate insulating layer 112b.

[0159] A second interlayer insulating layer 113b can be provided on the second gate electrode 131b.

[0160] The first source electrode 132a and the first drain electrode 133a of the driving transistor Td can be disposed on the second interlayer insulating layer 113b. In addition, the second source electrode 132b and the second drain electrode 133b of the switching transistor Ts can be disposed on the second interlayer insulating layer 113b.

[0161] At this time, for example, the first source electrode 132a and the first drain electrode 133a can be electrically connected to one side and the other side of the first active layer 134a through contact holes provided in the second interlayer insulating layer 113b, the second gate insulating layer 112b, the buffer layer 111c, the first interlayer insulating layer 113a and the first gate insulating layer 112a.

[0162] In addition, for example, a portion of the first drain electrode 133a can be electrically connected to one side of the first light-shielding layer 135a through contact holes disposed in the second interlayer insulating layer 113b, the second gate insulating layer 112b, the buffer layer 111c, the first interlayer insulating layer 113a, the first gate insulating layer 112a, the active buffer layer 111b, and the multiple buffer layer 111a.

[0163] Furthermore, for example, the second source electrode 132b and the second drain electrode 133b can be electrically connected to one side and the other side of the second active layer 134b respectively through contact holes provided in the second interlayer insulating layer 113b and the second gate insulating layer 112b.

[0164] The portion of the first active layer 134a that overlaps with the first gate electrode 131a is a channel region. For example, one of the first source electrode 132a and the first drain electrode 133a is connected to the source region on one side of the channel region in the first active layer 134a, and the other is connected to the drain region on the other side of the channel region in the first active layer 134a.

[0165] Furthermore, a portion of the second active layer 134b that overlaps with the second gate electrode 131b is a channel region. For example, one of the second source electrode 132b and the second drain electrode 133b is connected to the source region on one side of the channel region in the second active layer 134b, and the other is connected to the drain region on the other side of the channel region in the second active layer 134b.

[0166] Although not shown, a protective layer may be provided on the first source electrode 132a, the first drain electrode 133a, the second source electrode 132b, and the second drain electrode 133b.

[0167] Planarization layers 115a and 115b may be disposed above the first source electrode 132a, the first drain electrode 133a, the second source electrode 132b, and the second drain electrode 133b. For example, planarization layers 115a and 115b may include a first planarization layer 115a and a second planarization layer 115b.

[0168] A first planarization layer 115a can be set on the protective layer.

[0169] A connecting electrode 125 can be disposed on the first planarization layer 115a.

[0170] For example, the connecting electrode 125 can be electrically connected to one of the first source electrode 132a and the first drain electrode 133a through the contact hole CH provided in the first planarization layer 115a.

[0171] A second planarization layer 115b can be provided on the connecting electrode 125.

[0172] A third planarization layer 115c can be set on the second planarization layer 115b.

[0173] The third planarization layer 115c can be configured from an organic material such as an acrylic resin or an epoxy resin, and for example, from photoacrylic acid (PAC). For ease of description, the third planarization layer 115c may be referred to as a planarization layer.

[0174] For example, the third planarization layer 115c may include a first opening region OA1 obtained by removing (opening) the portion of the third planarization layer 115c corresponding to the main light-emitting region EA1, the reflected light-emitting region EA2, and the second non-light-emitting region NEA2 of the sub-pixel.

[0175] In the plan view, the first opening area OA1 can have an approximately (or overall) circular or elliptical shape, but is not limited to this, and can have a polygonal shape, such as a rectangular shape.

[0176] The third planarization layer 115c may include a top surface and sides.

[0177] The top surface of the third planarization layer 115c is located on top of the third planarization layer 115c and is substantially parallel to the surface of the second substrate 110b.

[0178] Furthermore, the side portion of the third planarization layer 115c can be a surface extending from the top surface of the third planarization layer 115c to the side surface. For example, the side portion of the third planarization layer 115c can have a predetermined cone angle. For example, the side portion of the third planarization layer 115c can have a cone angle θ1 of 45° to 65°, but is not limited thereto.

[0179] Here, the cone angle (or tangential angle) refers to the angle between the upper surface of the second planarization layer 115b on which the third planarization layer 115c is disposed and the side of the third planarization layer 115c.

[0180] In the planar view, the side of the third planarization layer 115c may have an approximately (or overall) circular or elliptical shape, similar to the edge of the first opening region OA1, but not limited thereto, and may have a polygonal shape, such as a rectangular shape.

[0181] For example, the anode 121 may be disposed on a portion of the top surface and side surface of the third planarization layer 115c and a portion of the top surface of the second planarization layer 115b. For example, the anode 121 may be disposed on the first opening region OA1 and a portion of the top surface and side surface of the third planarization layer 115c. For example, the anode 121 disposed in the first opening region OA1 may be in contact with the top surface of the second planarization layer 115b.

[0182] That is, for example, the anode 121 may include a first region 121a and a second region 121b. The first region 121a is disposed in the first opening region OA1 and has a surface substantially parallel to the surface of the second substrate 110b. The second region 121b extends from the first region 121a such that its surface has a predetermined angle relative to the second substrate 110b. In this case, for example, the first region 121a of the anode 121 may be configured to correspond to the first opening region OA1. Furthermore, the second region 121b of the anode 121 may be configured to correspond to the side portion of the third planarization layer 115c. Therefore, the second region 121b of the anode 121 may be referred to as the side portion of the anode 121.

[0183] In one or more aspects of this disclosure, the second region 121b of the anode 121 is a portion having a side mirror shape and can be configured with an SM structure. For example, the SM structure of the anode 121 can form a reflective light-emitting region EA2. Reference will be made below. Figure 7 The reflective luminescent region EA2 is described in detail.

[0184] The SM structure of anode 121 increases the amount of extracted light to improve viewing angle brightness and luminous efficiency. Simultaneously, the increased amount of extracted light enables lower power consumption. Therefore, by reducing greenhouse gas emissions and decreasing the use of fossil fuels for power generation, ESG (Environmental, Social, and Governance) goals are achieved.

[0185] If the increased amount of extracted light is mainly directed forward, it helps improve luminous efficiency, and if the increased amount of extracted light is directed diagonally, it may help improve viewing angle brightness.

[0186] The anode 121 may include a third region 121c extending from the second region 121b, such that its surface is substantially parallel to the surface of the second substrate 110b. The third region 121c may be configured to correspond to the top surface of the third planarization layer 115c.

[0187] As described above, in a sub-pixel, the second planarization layer 115b and the third planarization layer 115c may include at least one contact hole CH spaced apart from the first opening region OA1. Therefore, the driving transistor Td and the anode 121 are electrically connected through the contact hole CH.

[0188] The first dam 116 can be set on the third planarization layer 115c, while covering a portion of the anode 121.

[0189] The first dike 116 may cover the third region 121c of the anode 121. Furthermore, the first dike 116 may cover the third region 121c of the anode 121, including the contact hole CH. The first dike 116 may cover the top surface of the third region 121c of the anode 121 and the third planarization layer 115c.

[0190] The first barrier 116 of this disclosure is configured (or includes) a black resin and can be used to improve reflective visibility in a color-on-encapsulation (COE) structure. For example, the first barrier 116 is configured such that black pigment is dispersed in an organic material, but is not limited thereto, and the first barrier can be configured from any material as long as it is black. Furthermore, the organic material can be, for example, a cardo-based polymer and a polymer including epoxy acrylates, but is not limited thereto. Because the first barrier 116 includes a black material, reflection of external light can be reduced, specifically, irregular reflections caused when the first barrier 116 is formed of a transparent material.

[0191] Furthermore, the first dam 116 can be formed of multiple layers. For example, the lower dam layer is formed of a black material, and the upper dam layer disposed thereon can be formed of a transparent material. Additionally, the upper dam layer may include spacers 118. Spacers 118 can be used to suppress damage generated on the configuration disposed above the substrates 110a, 110b, and 110c when the mask used during the deposition of the organic layer 122 comes into contact with the substrates 110a, 110b, and 110c.

[0192] For example, the first dike 116 may have a height of about 1.0 μm to 2.0 μm. Therefore, the height of the second dike 117 disposed on the first dike 116 may be reduced accordingly, but is not limited thereto.

[0193] Furthermore, the first embankment 116 may have the same height along the perimeter of the second opening area OA2, but is not limited thereto, and may have different heights along the steps configured below it.

[0194] Specifically, when applying a COE structure in an SM structure, if a black barrier is not used, totally internally reflected light enters the TFT element, which may reduce device reliability. Therefore, according to one or more aspects of this disclosure, the first barrier 116 is configured with a black-based resin to block light from entering the TFTs Td and Ts, thereby improving device reliability (see [link to disclosure]). Figure 5 (arrow). Furthermore, according to one or more aspects of this disclosure, when a COE structure is applied in an SM structure, the first dam 116 is configured with a black base resin, such that the increase in reflectivity of the second region 121b and the third region 121c of the anode 121 can be improved.

[0195] Specifically, according to one or more aspects of this disclosure, when a COE structure is applied in an SM structure, in order to solve the problem of light absorption occurring in the first dam 116 before the anode 121 reflects light, the first dam 116 may be disposed on the third region 121c of the anode 121 to cover the third region 121c.

[0196] In a first exemplary embodiment of this disclosure, the first dam 116 may be configured to cover the entire third region 121c of the anode 121, but is not limited thereto, and taking into account process tolerances, the first dam 116 may expose a portion of the third region 121c of the anode 121.

[0197] That is, the end of the first dike 116 can match the end of the third region 121c, but is not limited thereto.

[0198] For example, the side of the first dam 116 may have a cone angle θ2 of 30° to 40°, and the cone angle θ2 of the first dam 116 may be smaller than the cone angle θ1 of the third planarization layer 115c, but is not limited thereto.

[0199] Furthermore, the side portion of the first dam 116 may have the same cone angle θ2 along the periphery of the second opening region OA2, but is not limited thereto, and the cone angle θ2 of a portion may be different from the cone angle θ2 of other portions. For example, when considering the viewing angle, the cone angle θ2 of the side portion of the first dam 116 relative to the left and right sides of the sub-pixel may be different from the cone angle θ2 of the side portion of the first dam 116 relative to the upper and lower sides.

[0200] Meanwhile, the second dike 117 can be set on the first dike 116.

[0201] The second dike 117 may cover the first dike 116 and the second region 121b of the anode 121. Furthermore, the second dike 117 may cover a portion of the first region 121a of the anode 121. For example, the second dike 117 may cover a portion of the edge of the first region 121a of the anode 121.

[0202] At this time, the portion of the second dam 117 corresponding to the main light-emitting region EA1 of the sub-pixel can be open. That is, the second dam 117 can include a second open region OA2 obtained by removing (opening) the portion of the second dam 117 corresponding to the main light-emitting region EA1 of each sub-pixel. For example, the first open region OA1 can have a larger width and area than the second open region OA2.

[0203] The reflected light-emitting area EA2 does not overlap with the main light-emitting area EA1 and can be positioned while surrounding the main light-emitting area EA1.

[0204] Subpixels can be divided by the main emitting region EA1.

[0205] Next, the second dike 117 may include a top surface, sides and a bottom surface.

[0206] For example, the top surface of the second dam 117 is located at the top of the second dam 117 and is substantially parallel to the surface of the second substrate 110b. The top surface of the second dam 117 may correspond to the top surface of the first dam 116 and the top surface of the third planarization layer 115c.

[0207] The side portion of the second dike 117 may be a surface extending from the top surface of the second dike 117 to the side surface. The side portion of the second dike 117 may have a predetermined cone angle. For example, the side portion of the second dike 117 may have a cone angle of 45° to 65°, but this disclosure is not limited thereto. The side portion of the second dike 117 may correspond to the side portion of the third planarization layer 115c.

[0208] For example, the bottom surface of the second dam 117 may correspond to the surface adjacent to the first region 121a and the second region 121b of the anode 121, the top and side surfaces of the first dam 116, and the top surface of the third planarization layer 115c.

[0209] For example, a portion of the first region 121a of the anode 121 can be exposed through the second opening region OA2.

[0210] The second dam 117 can be formed from PI-based materials, but is not limited to this.

[0211] Furthermore, for example, the side of the second embankment 117 has a circular or elliptical shape that is substantially the same as the edge of the second opening region OA2, but is not limited thereto, and may have a polygonal shape, such as a rectangular shape.

[0212] Meanwhile, the organic layer 122 can be disposed in or near the second opening region OA2 of the second dike 117. For example, the organic layer 122 can be disposed on the first region 121a of the anode 121 exposed through the second opening region OA2 of the second dike 117. Furthermore, for example, the organic layer 122 can be disposed in the second opening region OA2 of the second dike 117.

[0213] The organic layer 122 may be disposed only in the second opening region OA2, but this disclosure is not limited thereto, and a portion thereof may also be disposed on the top surface and sides of the second embankment 117 other than the second opening region OA2.

[0214] The cathode 123 can be disposed on the organic layer 122.

[0215] The light-emitting diode 120 can be configured with an anode 121, an organic layer 122, and a cathode 123.

[0216] For example, the main light-emitting area EA1 can be formed by a light-emitting diode 120 disposed in the second opening area OA2.

[0217] The packaging unit 140 can be disposed above the aforementioned light-emitting diode 120.

[0218] Due to the properties of the organic material in the organic layer 122, the light-emitting diode 120 can react with external moisture and oxygen, causing dark spots or pixel shrinkage. To suppress this problem, the encapsulation unit 140 can be disposed above the cathode 123. Although not shown, the encapsulation unit 140 can be configured with a first inorganic insulating film, a foreign matter compensation layer, and a second inorganic insulating film, but is not limited thereto.

[0219] A first inorganic insulating film may be disposed above substrates 110a, 110b and 110c, wherein cathode 123 is disposed adjacent to light-emitting diode 120.

[0220] For example, the first inorganic insulating film can be configured from an inorganic insulating material that allows for low-temperature deposition, such as silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiON), or aluminum oxide (Al2O3). The deposition of the first inorganic insulating film at a low-temperature atmosphere suppresses damage to the organic layer 122, which includes organic materials susceptible to high-temperature atmospheres, during deposition.

[0221] The foreign matter compensation layer can be configured to have a smaller area than the first inorganic insulating film and can be configured to expose both ends of the first inorganic insulating film. The foreign matter compensation layer can be formed from an organic insulating material such as acrylic resin, epoxy resin, polyimide, polyethylene, or silicon-oxygen carbon (SiOC).

[0222] Simultaneously, when forming the foreign matter compensation layer using inkjet printing, one or more dams can be set in the boundary region between the non-active and active regions, or dam regions corresponding to a portion of the non-active region can be set. Within such dam regions, a main dam adjacent to the active region and a secondary dam adjacent to the pad unit can be set.

[0223] When a liquid foreign object compensation layer is formed in the active region, one or more dams are set in the dam region to prevent the liquid foreign object compensation layer from collapsing in the direction of the non-active region to invade the pad cell.

[0224] The main dam and / or secondary dam can be configured as a single-layer or multi-layer structure.

[0225] In addition, the foreign matter compensation layer, which includes organic materials, can be located only on the inner surface of the main dam.

[0226] Furthermore, the second inorganic insulating film can be configured to cover the upper and side surfaces of each of the first inorganic insulating film and the foreign matter compensation layer. The second inorganic insulating film can be used to minimize or prevent the penetration of external moisture or oxygen into the first inorganic insulating film and the foreign matter compensation layer. In this case, the second inorganic insulating film is formed of an inorganic insulating material such as silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiON), or aluminum oxide (Al2O3).

[0227] A touch buffer film 151 can be provided on the encapsulation unit 140.

[0228] A bridging pattern 155 may be provided on the touch buffer film 151. However, it is not limited to this, and touch electrodes (or touch lines) may also be provided on the touch buffer film 151.

[0229] The touch buffer film 151 can be located between the bridging pattern 155 and the encapsulation unit 140.

[0230] The bridging pattern 155 can be positioned above the encapsulation unit 140 without having a touch buffer membrane 151.

[0231] The bridging pattern 155 can have a single-layer or multi-layer structure made of metals with strong corrosion resistance and acid resistance, such as aluminum (Al), titanium (Ti), copper (Cu) or molybdenum (Mo).

[0232] A touch insulating film 152 can be set on the bridging pattern 155.

[0233] For example, the touch insulating film 152 can be an organic or inorganic film that can be formed by a low-temperature process. When an organic film is used for the touch insulating film 152, after the organic film is coated over the substrates 110a, 110b, and 110c, the organic film is cured at a temperature of 100°C or lower to form the touch insulating film 152, thereby suppressing damage to the high-temperature-sensitive organic layer 122. When an inorganic film is used for the touch insulating film 152, in order to suppress damage to the high-temperature-sensitive organic layer 122, the low-temperature chemical vapor deposition process and the cleaning process are repeated at least twice to form the touch insulating film 152 with a multilayer structure.

[0234] A portion of the touch insulating film 152 is selectively removed to form touch contact holes to expose a portion of the bridging pattern 155.

[0235] Touch electrodes (or touch lines) 156 can be provided on the touch insulating film 152. However, it is not limited to this, and bridging patterns can be provided on the touch insulating film 152.

[0236] For example, touch electrode 156 can be electrically connected to bridging pattern 155 via touch contact hole.

[0237] In addition, a touch planarization layer 157 may be provided on the touch electrode 156, but it is not limited to this, and the touch planarization layer may be omitted.

[0238] A black matrix 180 can be set on the touch flattening layer 157.

[0239] The black matrix 180 can be located above the touch electrode 156.

[0240] The black matrix 180 can be located in the first non-luminous region NEA1.

[0241] According to one or more aspects of this disclosure, a black first dam 116 is disposed below the black matrix 180, such that the width of the black matrix 180 can be reduced compared to the prior art, thereby ensuring a wide viewing angle. That is, the critical dimension (CD) of the black matrix 180 can be smaller than the CD of the first dam 116. For example, according to a first exemplary embodiment of this disclosure, the black matrix 180 may have a first distance d1 from the end of the first dam 116 (i.e., the boundary between the second region 121b and the third region 121c of the anode 121).

[0242] A color filter layer 170 can be set in the main luminescent area EA1, the first non-luminescent area NEA1, the reflective luminescent area EA2, and the second non-luminescent area NEA2 between the black matrix 180.

[0243] For example, color filter layer 170 may include a red color filter layer, a green color filter layer, and a blue color filter layer, but is not limited thereto, and may also include a white color filter layer.

[0244] The black matrix 180 can be disposed on the boundary of the color filter layers 170 with different colors. Therefore, the black matrix 180 can define sub-pixel regions. The sub-pixel regions defined by the black matrix 180 can be red sub-pixel regions, green sub-pixel regions, and blue sub-pixel regions. Furthermore, the sub-pixel regions can also include white sub-pixel regions. That is, the region with the red color filter layer corresponds to the red sub-pixel region, the region with the green color filter layer corresponds to the green sub-pixel region, and the region with the blue color filter layer corresponds to the blue sub-pixel region. Additionally, the region with the white color filter layer corresponds to the white sub-pixel region.

[0245] For example, red light can be emitted in areas with a red color filter layer, green light in areas with a green color filter layer, blue light in areas with a blue color filter layer, and white light can be emitted in areas with a white color filter layer.

[0246] Furthermore, as described above, according to one or more aspects of this disclosure, the anode 121 has a side mirror (SM) structure, which increases the amount of extracted light. That is, the second region 121b of the anode 121, including the reflective layer, serves as a side mirror, causing light generated in the light-emitting diode 120 and intended to be released into the second region 121b to be reflected and extracted in the front surface, thereby improving the efficiency of the display device. Additionally, the color filter layer 170 and the black matrix 180 are disposed above the encapsulation unit 140 to remove the polarizer, thereby improving luminous efficiency and reducing the thickness of the display panel. Therefore, a lightweight and slim design can be achieved.

[0247] Furthermore, according to one or more aspects of this disclosure, when a COE structure is applied in an SM structure, a black first dam 116 is formed on the third region 121c of the anode 121 to cover the third region 121c, thereby improving the reflectivity of the second region 121b and the third region 121c of the anode 121. Therefore, light entering the TFT element is blocked to improve device reliability.

[0248] In a first exemplary embodiment of this disclosure, the first dike 116 may be configured to cover the entire third region 121c of the anode 121, but is not limited thereto, and considering process tolerances, the first dike 116 may expose a portion of the third region 121c of the anode 121. This will be described in detail with reference to the accompanying drawings.

[0249] Figure 6This is an example cross-sectional view illustrating the sub-pixel structure of a second exemplary embodiment of the present disclosure.

[0250] Figure 7 It shows along Figure 6 Example image of a luminescent image captured by a cross section.

[0251] Figure 6 A portion of a cross-section of a subpixel of a display panel according to a second exemplary embodiment of the present disclosure is shown.

[0252] Figure 7 A portion of a cross-section of a sub-pixel of a display panel according to a second exemplary embodiment of this disclosure is shown, along with its corresponding luminescent image. Figure 7 For convenience, the configuration above and below the LED 120 is not shown, but this disclosure is not limited thereto.

[0253] Figure 6 and Figure 7 The second example implementation of this disclosure has the same characteristics as described above. Figure 4 and Figure 5 The first exemplary embodiment of this disclosure differs in the configuration of the first dike 216 and the second dike 217, but other configurations are substantially the same, therefore redundant descriptions will be omitted. Here, the descriptions of the same reference numerals may refer to... Figures 1 to 5 The description provided.

[0254] Reference Figure 6 and Figure 7 As described above, multiple transistors, such as driving transistor Td and switching transistor Ts, can be disposed above substrates 110a, 110b and 110c.

[0255] The first planarization layer 115a can be disposed above the driving transistor Td and the switching transistor Ts.

[0256] The connecting electrode 125 can be disposed on the first planarization layer 115a.

[0257] The second planarization layer 115b can be disposed on the connecting electrode 125.

[0258] The third planarization layer 115c can be set on the second planarization layer 115b.

[0259] For example, the third planarization layer 115c may include a first opening region OA1 obtained by removing (opening) the portion of the third planarization layer 115c corresponding to the main light-emitting region EA1, the reflected light-emitting region EA2, and the second non-light-emitting region NEA2 of the sub-pixel.

[0260] In the plan view, the first opening area OA1 can have an approximately (or overall) circular or elliptical shape, but is not limited to this, and can have a polygonal shape, such as a rectangular shape.

[0261] The third planarization layer 115c may include a top surface and sides.

[0262] For example, the anode 121 may be disposed on a portion of the top surface and side of the third planarization layer 115c and a portion of the top surface of the second planarization layer 115b.

[0263] That is, for example, the anode 121 may include a first region 121a and a second region 121b, the first region 121a being disposed in the first opening region OA1 and having a surface substantially parallel to the surface of the second substrate 110b, and the second region 121b extending from the first region 121a such that the surface has a predetermined angle relative to the second substrate 110b.

[0264] In one or more aspects of this disclosure, the second region 121b of the anode 121 is a portion having a side mirror shape and can be configured with an SM structure. For example, the SM structure of the anode 121 can form a reflective light-emitting region EA2. In this case, for example, the reflective light-emitting region EA2 follows the contour of the main light-emitting region EA1, such that when the light-emitting diode 120 emits light, the reflective light-emitting region can be shown as a light-emitting image having an uninterrupted circular ring shape (or a circular ring shape) or a discontinuous circular ring shape. However, this disclosure is not limited to this, and when the first opening region OA1 has a polygonal shape, the reflective light-emitting region EA2 can be shown as a polygonal ring light-emitting image corresponding to the shape of the first opening region OA1. If the reflective light-emitting region EA2 is shown as a light-emitting image having a discontinuous ring shape, the reflective light-emitting region can surround the contour of the main light-emitting region EA1 in a discontinuous manner.

[0265] As described above, the SM structure disposed in the first opening region OA1 forms a reflective light-emitting region EA2. A portion of the light emitted by the light-emitting diode 120 is reflected from the second region 121b of the anode 121 by the SM structure to form a circular annular reflective light-emitting region EA2. Therefore, the amount of extracted light can be increased. However, the present disclosure is not limited thereto, and when the first opening region OA1 has a polygonal shape, the reflective light-emitting region EA2 can have a polygonal annular shape corresponding to the shape of the first opening region OA1.

[0266] The anode 121 may include a third region 121c extending from the second region 121b, such that its surface is substantially parallel to the surface of the second substrate 110b.

[0267] The first dam 216 can be set on the third planarization layer 115c, while covering a portion of the anode 121.

[0268] The first dike 216 of the second exemplary embodiment of this disclosure may cover a portion of the third region 121c of the anode 121. The first dike 216 of the second exemplary embodiment of this disclosure may cover a portion of the third region 121c of the anode 121, including the contact hole CH, and the top surface of the third planarization layer 115c. As described, when process tolerances are taken into account, the first dike 216 of the second exemplary embodiment of this disclosure may expose other portions of the third region 121c of the anode 121.

[0269] Therefore, the first dam 216 according to the second exemplary embodiment of this disclosure can be spaced apart from the boundaries of the second region 121b and the third region 121c of the anode 121 by a predetermined distance. For example, the distance D between the boundaries of the second region 121b and the third region 121c and the first dam 216 is about 0.5 μm to 1.5 μm, but is not limited thereto. Here, the distance D can be the same for all sub-pixels, but is not limited thereto, and can vary for each sub-pixel.

[0270] The first dam 216 can be formulated from a black-based resin.

[0271] As described above, in the second exemplary embodiment of this disclosure, the first dam 216 may be disposed on the third region 121c of the anode 121 to cover a portion of the third region 121c.

[0272] For example, the side of the first embankment 216 may have a cone angle of 30° to 40°, which may be smaller than the cone angle of the third planarization layer 115c, but is not limited thereto.

[0273] The second dike 217 can be set on the first dike 216.

[0274] The second dike 217 of the second exemplary embodiment of this disclosure may cover the first dike 216, as well as other exposed portions of the second region 121b and the third region 121c of the anode 121. Furthermore, the second dike 217 of the second exemplary embodiment of this disclosure may cover a portion of the edge of the first region 121a of the anode 121.

[0275] The second dam 217 may include a second opening region OA2 obtained by removing the portion of the second dam 217 corresponding to the main light-emitting region EA1 of each sub-pixel. For example, in a planar view, the second opening region OA2 may have a circular or elliptical shape, but is not limited to these, and may have a polygonal shape, such as a rectangular shape.

[0276] Simultaneously, the main light-emitting region EA1 can have a shape corresponding to the shape of the second opening region OA2. When the shape of any component corresponds to the shape of another component, this means that the shape of any component has the same shape as the other component, or has the same shape but different dimensions, or the shape of any component is formed by transferring the shape of another component through any method. Therefore, the shape of the main light-emitting region EA1 is essentially understood as being obtained by transferring the shape of the second opening region OA2 through light emitted from the organic layer 122 located in the second opening region OA2.

[0277] The reflected light-emitting area EA2 does not overlap with the main light-emitting area EA1 and can be positioned while surrounding the main light-emitting area EA1.

[0278] Subpixels can be divided by the main emitting region EA1.

[0279] For example, a portion of the first region 121a of the anode 121 can be exposed through the second opening region OA2.

[0280] Furthermore, for example, the side of the second embankment 217 may have a circular or elliptical shape that is substantially the same as the edge of the second opening region OA2, but is not limited thereto, and may have a polygonal shape, such as a rectangular shape.

[0281] A packaging unit 140 can be provided above the aforementioned light-emitting diode 120.

[0282] A touch sensor layer, configured with a touch buffer film 151, a bridging pattern 155, a touch insulating film 152, a touch electrode 156, and a touch planarization layer 157, can be disposed above the packaging unit 140.

[0283] A black matrix 280 can be set on the touch flattening layer 157.

[0284] According to one or more aspects of this disclosure, a first black embankment 216 is disposed below the black matrix 280, such that the width of the black matrix 280 can be reduced compared to the prior art, thereby ensuring a wide viewing angle. For example, according to a second exemplary embodiment of this disclosure, the black matrix 280 has a first distance d1 from the end of the first embankment 216 and may have a second distance d2 from the boundaries of the second region 121b and the third region 121c. According to the second exemplary embodiment of this disclosure, compared to the first exemplary embodiment described above, the width of the black matrix 280 can be further reduced by the same amount as the distance D.

[0285] Color filter layer 170 can be set between black matrices 280.

[0286] Meanwhile, according to one or more aspects of this disclosure, a display device is provided, wherein a light receiving device is located behind a display panel, such that the light receiving device that needs to receive light from the front surface is not exposed to the front surface. The display device will be described in detail with reference to the accompanying drawings.

[0287] Figure 8 This is an example plan view schematically showing a display device according to a third exemplary embodiment of the present disclosure.

[0288] Reference Figure 8 The display device according to the third exemplary embodiment of the present disclosure may include a display panel DISP for displaying images and a light receiving device 150 for receiving light.

[0289] As described above, the display panel DISP may include an active region AA that displays the image and a non-active region NA that is the outer region of the outer boundary line BL of the active region AA.

[0290] In addition, the display panel DISP may include a dam region DA, in which a dam is provided to suppress any layer extension beyond the active region AA of the display panel DISP.

[0291] Despite Figure 8 The diagram shows a non-active region NA surrounding a quadrilateral active region AA, but the shapes and placements of the active region AA and the non-active region NA are not limited to these. Figure 8 Examples are shown below. That is, the active region AA and the passive region NA can have shapes suitable for the design of electronic devices including display devices. For example, example shapes of the active region AA can be pentagonal, hexagonal, circular, or elliptical.

[0292] At the same time, refer to Figure 8 The active region AA may include the first active region AA1 and the second active region AA2, but is not limited to these.

[0293] The light receiving device 150 is a means of receiving light to perform a defined function. For example, the light receiving device 150 may include one or more of a camera and a proximity sensor.

[0294] The light receiver 150 is a device that requires light reception, but it can be disposed on the rear surface of the display panel DISP, which is behind (below) the display panel DISP. For example, the light receiver 150 can be disposed on the opposite side of the viewing surface of the display panel DISP. The light receiver 150 is not exposed on the front surface of the display device. Therefore, the light receiver 150 is not visible when the user views the front surface of the display device.

[0295] Here, the camera located behind (below) the display panel DISP is the front-facing camera, which captures the view in front and can also be considered as a camera lens.

[0296] The light receiver 150 can be configured to overlap with the active area AA of the display panel DISP. For example, the light receiver 150 can be located within the active area AA.

[0297] Here, the area within the active region AA that overlaps with the light receiving device 150 is referred to as the first active region AA1, and the other areas are referred to as the second active region AA2. Therefore, the light receiving device 150 can be positioned to overlap with the first active region AA1 of the active region AA. In other words, the light receiving device 150 can be located within the first active region AA1 of the active region AA. The first active region AA1 is the area overlapping with the light receiving device 150, such that the transmittance of the first active region AA1 needs to be superior to the transmittance of the second active region AA2, which does not overlap with the light receiving device 150.

[0298] To improve the transmittance of the first active region AA1 overlapping with the light receiving device 150, the first active region AA1 and the second active region AA2 may have different resolutions, different sub-pixel placement structures, different numbers of sub-pixels per unit area, different electrode structures, different line structures, different electrode placement structures, or different wiring placement structures. However, this disclosure is not limited thereto.

[0299] For example, the number of sub-pixels per unit area in the first active region AA1 can be less than the number of sub-pixels per unit area in the second active region AA2. Therefore, the resolution of the first active region AA1 can be lower than the resolution of the second active region AA2. For example, in the second active region AA2, the pixels per inch (PPI) is 400 or higher, but in the first active region AA1, the PPI can be 200 or higher, but it is not limited to this.

[0300] For example, as a light receiving device 150 located below the display panel DISP and not exposed to the outside, the camera is referred to as a lower display camera (UDC). Furthermore, as the light receiving device 150, the IR sensor is also referred to as a lower display IR sensor (UDIR). However, this disclosure is not limited to the aforementioned UDC or UDIR models.

[0301] In the case of the display device 100 according to the third exemplary embodiment of this disclosure, the bezel width can be smaller, and there is no need to manufacture a recessed display panel (DISP). Furthermore, since the light receiving device 150 has no design limitations, design freedom is increased.

[0302] Furthermore, although the light receiving device 150 is located behind the display panel DISP in the display device according to the third exemplary embodiment of this disclosure, the light receiving device 150 needs to receive light normally and perform specific functions. Also, although the light receiving device 150 is located behind the display panel DISP and overlaps with the active area AA in the display device according to the third embodiment of this disclosure, the light receiving device 150 needs to receive light normally and perform specific functions. In addition, the image needs to be displayed normally in the active area AA.

[0303] Therefore, the display device according to the third exemplary embodiment of the present disclosure may have a structure that improves the transmittance of the first active region AA1 overlapping with the light receiving device 150.

[0304] Figure 9 It is shown Figure 8 An example diagram of the first active area of ​​a display device.

[0305] Figure 10 It is shown Figure 8 Example diagram of part A.

[0306] exist Figure 10 In, with Figure 9 In contrast, a portion of the second active region AA2 and its pixel structure are additionally shown.

[0307] Reference Figure 9 and Figure 10 The active region may include a first active region AA1 that overlaps with the optical receiving device and a second active region AA2 that constitutes the remaining region.

[0308] The first active region AA1 can overlap with the optical receiving device.

[0309] The first active region AA1 may include a non-transmissive region NTA and a transmissive region TA. As described above, in the UDC model and the UDIR model, the first active region AA1 includes: a light-emitting region for display, i.e., the non-transmissive region NTA; and a transmissive region TA in which the light-receiving device 150 receives light.

[0310] The transmission region TA is a portion of the first active region AA1, and external light can be transmitted to the light receiving device when the opaque configuration, such as the cathode, is removed.

[0311] For example, the transmission region TA can have a circular or elliptical shape and is also referred to as the aperture region.

[0312] Furthermore, the non-transmissive region NTA is another part of the first active region AA1, and the transistors of the transistor layer and the light-emitting diodes of the light-emitting diode layer can be located in the non-transmissive region.

[0313] The non-transmissive region NTA may include a pixel region in which multiple sub-pixels SP1_1, SP1_2, SP1_3, SP2_1, SP2_2 and SP2_3 are provided; and a wiring region in which various signal lines are provided.

[0314] When the transmission region TA is surrounded by the non-transmission region NTA, the first active region AA1 may include multiple separate transmission regions TA, but is not limited thereto.

[0315] In the first active region AA1, a plurality of first sub-pixels SP1_1, SP1_2, and SP1_3 may be disposed in the pixel region. Furthermore, for example, the first sub-pixels SP1_1, SP1_2, and SP1_3 may include a first-first sub-pixel SP1_1, a first-second sub-pixel SP1_2, and a first-third sub-pixel SP1_3.

[0316] In the second active region AA2, multiple second sub-pixels SP2_1, SP2_2, and SP2_3 can be disposed in the pixel region. Furthermore, for example, the second sub-pixels SP2_1, SP2_2, and SP2_3 may include a second-first sub-pixel SP2_1, a second-second sub-pixel SP2_2, and a second-third sub-pixel SP2_3.

[0317] For example, the first sub-pixel SP1_1 and the second sub-pixel SP2_1 can be red sub-pixels.

[0318] For example, the first-second sub-pixel SP1_2 and the second-second sub-pixel SP2_2 can be green sub-pixels.

[0319] For example, the first and third sub-pixels SP1_3 and the second and third sub-pixels SP2_3 can be blue sub-pixels.

[0320] For example, the first-first sub-pixel SP1_1 and the second-first sub-pixel SP2_1, as well as the first-third sub-pixel SP1_3 and the second-third sub-pixel SP2_3, can have circular or polygonal shapes, but are not limited to these.

[0321] For example, the first-second sub-pixel SP1_2 and the second-second sub-pixel SP2_2 can have an elliptical shape or a substantially rectangular shape, but are not limited to this.

[0322] exist Figure 3The diagram illustrates a first pixel formed by the aggregation of a first sub-pixel SP1_1, two first sub-pixels SP1_2, and a first sub-pixel SP1_3, and a second pixel formed by the aggregation of a second sub-pixel SP2_1, two second sub-pixels SP2_2, and a second sub-pixel SP2_3. However, this disclosure is not limited thereto.

[0323] Furthermore, each of the first pixel set in the first active region AA1 and the second pixel set in the second active region AA2 has a rhombus shape, but is not limited thereto.

[0324] Furthermore, the first pixel located in the first active region AA1 can be configured to be surrounded by four transmissive regions TA, but is not limited thereto.

[0325] As from Figure 10 As can be seen and understood, the first pixel disposed in the first active region AA1 has a lower pixel per inch (PPI) than the second pixel disposed in the second active region AA2. Therefore, the transmittance of the first active region AA1 overlapping with the light receiving device can be improved.

[0326] As described above, in the third exemplary embodiment of this disclosure, in order to ensure the transmission region TA, the number of first pixels in the first active region AA1 overlapping with the light receiving device can be reduced. Doing so results in an efficiency discrepancy between the first active region AA1 and the second active region AA2. In this case, visibility at the boundary between the first active region AA1 and the second active region AA2 may become problematic.

[0327] Therefore, according to the third exemplary embodiment of this disclosure, an anode with a side mirror (SM) structure can be formed on the side surface of the emitting layer in the first sub-pixels SP1_1, SP1_2, and SP1_3 of the first active region AA1. This improves the light extraction efficiency of the first active region AA1, reducing the efficiency deviation and visibility difference between the first active region AA1 and the second active region AA2, as well as the visibility difference between the transmissive region TA and the non-transmissive region NTA in the first active region AA1. By doing so, the degradation of sharpness and color perception is improved, and additionally, the transmissive region TA in which the light receiving device receives light is ensured, thereby improving the image quality of the light receiving device.

[0328] Furthermore, according to a third exemplary embodiment of this disclosure, a COE structure in which a color filter layer is disposed above the encapsulation unit is applied to reduce the thickness of the display panel DISP. Additionally, according to a third exemplary embodiment of this disclosure, a black first dam is applied to the anode having a side mirror structure to improve the reflectivity under the COE structure, which will refer to... Figure 11 and Figure 12 Provide a detailed description.

[0329] Figure 11 This is an example diagram showing the cross-sectional structure of the non-transmissive region and the transmissive region in the first active region and the cross-sectional structure of the second active region in a display device according to a third exemplary embodiment of the present disclosure;

[0330] Reference Figure 11 The first active region AA1 of the display panel DISP may include a transmissive region TA and a non-transmissive region NTA. The second active region AA2 of the display panel DISP can be considered as a non-transmissive region NTA.

[0331] The following text describes the laminated structure of the nontransmissive region NTA of the first active region AA1, the laminated structure of the transmissive region TA, and the laminated structure of the second active region AA2.

[0332] First, the laminated structure of the second active region AA2 is as follows.

[0333] In the second active region AA2, a transistor layer TRL is disposed above the substrate SUB, and a planarization layer PLN may be disposed above the transistor layer TRL. Furthermore, a light-emitting diode layer EDL is disposed above the planarization layer PLN, and an encapsulation layer ENCAP may be disposed above the light-emitting diode layer EDL.

[0334] A touch sensor layer (TSL) can be placed above the encapsulation layer (ENCAP), and a protective layer (PAC) can be placed above the touch sensor layer (TSL).

[0335] In the second active region AA2, various transistors can be disposed on the transistor layer TRL, such as driving transistors and scanning transistors for each sub-pixel, and various insulating films for forming the transistors can also be disposed. These insulating films can include organic and inorganic films.

[0336] In the second active region AA2, various wirings, such as data lines, gate lines, or drive voltage lines, can be set on the transistor layer TRL.

[0337] In the second active region AA2, a light-emitting diode 120 for each sub-pixel can be provided on the light-emitting diode layer EDL. For example, an anode, multiple organic layers, and a cathode for configuring the light-emitting diode 120 can be provided on the light-emitting diode layer EDL.

[0338] In the second active region AA2, a touch sensor can be set on the touch sensor layer TSL, and a touch buffer film and a touch insulating film required to form the touch sensor can also be set.

[0339] Next, the laminated structure of the nontransmissive region NTA of the first active region AA1 is basically the same as the laminated structure of the second active region AA2 excluding the SM structure.

[0340] Reference Figure 11 In the nontransmissive region NTA of the first active region AA1, a transistor layer TRL is disposed above the substrate SUB, and a planarization layer PLN may be disposed above the transistor layer TRL.

[0341] A light-emitting diode (EDD) layer is placed above the planarization layer PLN, and an encapsulation layer ENCAP can be placed above the EDL layer. Furthermore, a touch sensor layer TSL is placed above the ENCAP layer, and a protective layer PAC is placed above the TSL layer.

[0342] The light-emitting diode 120 is susceptible to moisture or oxygen. For example, the encapsulation layer ENCAP inhibits the penetration of moisture or oxygen to prevent the light-emitting diode 120 from being exposed to moisture or oxygen. The encapsulation layer ENCAP can be formed of one or more layers.

[0343] In the nontransmissive region NTA of the first active region AA1, multiple transistors are disposed on the transistor layer TRL, such as driving transistors and scanning transistors for each sub-pixel, and various insulating films for forming the transistors may also be disposed. Here, the various insulating films may include organic films and inorganic films.

[0344] Furthermore, in the non-transmissive region NTA of the first active region AA1, various wirings, such as data lines, gate lines, or drive voltage lines, can be set on the transistor layer TRL.

[0345] In addition, a first and a second dam can be set in the non-transmittance region NTA of the first active region AA1.

[0346] In the non-transmissive region NTA of the first active region AA1, a light-emitting diode 120 for each sub-pixel can be disposed on the light-emitting diode layer EDL. For example, an anode, multiple organic layers, and a cathode for configuring the light-emitting diode 120 can be disposed on the light-emitting diode layer EDL. For example, in the non-transmissive region NTA of the first active region AA1, the anode can have a side mirror (SM) structure, wherein the side surface of the light-emitting layer has a mirror shape.

[0347] Furthermore, in the non-transmissive region NTA of the first active region AA1, a touch sensor TS can be disposed on the touch sensor layer TSL, and a touch buffer film and a touch insulating film required for forming the touch sensor TS can also be disposed.

[0348] Furthermore, the laminated structure of the transmission region TA of the first active region AA1 is as follows.

[0349] Reference Figure 11 In the transmission region TA of the first active region AA1, a transistor layer TRL is disposed above the substrate SUB, and a planarization layer PLN may be disposed above the transistor layer TRL.

[0350] A light-emitting diode (EDD) layer is placed above the planarization layer PLN, and an encapsulation layer ENCAP can be placed above the EDL layer. Furthermore, a touch sensor layer TSL is placed above the ENCAP layer, and a protective layer PAC can be placed above the TSL layer.

[0351] For example, in the transmissive region TA of the first active region AA1, no multiple transistors or wiring are disposed on the transistor layer TRL. However, in the transmissive region TA of the first active region AA1, various insulating films required for forming transistors can be disposed on the transistor layer TRL. Here, the various insulating films can include organic films and inorganic films.

[0352] Furthermore, the first and second dikes may not be located in the transmission region TA of the first active region AA1.

[0353] In the transmissive region TA of the first active region AA1, the light-emitting diode 120 of each sub-pixel is not disposed on the light-emitting diode layer EDL. For example, in the transmissive region TA of the first active region AA1, the anode, multiple organic layers, and cathode are not disposed on the light-emitting diode layer EDL. However, this disclosure is not limited to this, and in the transmissive region TA of the first active region AA1, only some of the anode, multiple organic layers, and cathode may be disposed on the light-emitting diode layer EDL. For example, in the transmissive region TA of the first active region AA1, only the organic layers or only the anode may extend to be disposed on the light-emitting diode layer EDL.

[0354] In the transmissive region TA of the first active region AA1, the touch sensor is not disposed on the touch sensor layer TSL. In the transmissive region TA of the first active region AA1, the touch buffer film and the touch insulating film may be disposed on the touch sensor layer TSL.

[0355] Reference Figure 11 Between the metal material layer and the insulating material layer disposed in the non-transmitting region NTA of the first active region AA1 and the second active region AA2, the metal material layer is not disposed in the transmitting region TA of the first active region AA1. However, between the metal material layer and the insulating material layer disposed in the non-transmitting region NTA of the first active region AA1 and the second active region AA2, the insulating material layer may be disposed to extend into the transmitting region TA of the first active region AA1.

[0356] In other words, the metallic material layer is disposed in the non-transmissive region NTA of the first active region AA1 and the non-transmissive region NTA of the second active region AA2, but not in the transmissive region TA of the first active region AA1. The insulating material layer may be disposed together in the non-transmissive region NTA of the first active region AA1, the non-transmissive region NTA of the second active region AA2, and the transmissive region TA of the first active region AA1, but this disclosure is not limited thereto.

[0357] Furthermore, the transmission region TA of the first active region AA1 can overlap with the light receiving device 150, and external light can be transmitted to the light receiving device 150 through the transmission region TA of the first active region AA1. Therefore, for the normal operation of the light receiving device 150, the transmittance of the transmission region TA of the first active region AA1 needs to be high.

[0358] Figure 12 This is an example cross-sectional view illustrating the sub-pixel structure of a third exemplary embodiment of the present disclosure.

[0359] Figure 12 A portion of the cross-section of the non-transmitting region NTA and the transmitting region TA of the first active region is shown.

[0360] Reference Figure 12 The substrate SUB of the first active region can be divided into a non-transmissive region NTA and a transmissive region TA. The transistor layer TRL, the planarization layer PLN, the light-emitting diode layer EDL, the encapsulation layer ENCAP, and the protective layer PAC can be disposed on the substrate SUB, which is divided into the non-transmissive region NTA and the transmissive region TA.

[0361] In the transmission region TA, some configurations of the substrate SUB and transistor layer TRL may be omitted, but this disclosure is not limited thereto.

[0362] First, the laminated structure of the non-transmissive region NTA included in the first active region will be described.

[0363] As described above, the substrate SUB may include a first substrate 110a, a second substrate 110b, and an interlayer insulating layer 110c.

[0364] Multiple transistors can be placed on the transistor layer TRL, such as the driving transistor Td or the switching transistor Ts.

[0365] The planarization layer PLN can be located above the transistor layer TRL.

[0366] The planarization layer PLN may include a first planarization layer 115a and a second planarization layer 115b. The first planarization layer 115a is formed of a PI-based material, and the second planarization layer 115b may be formed of a PAC-based material. That is, the pixel shrinkage problem in the UDC or UDIR model is mainly caused by the venting of the second planarization layer 115b rather than the first planarization layer 115a, therefore only the second planarization layer 115b can be configured with a PAC-based material, but it is not limited thereto.

[0367] The third planarization layer 115c can be placed above the second planarization layer 115b.

[0368] The third planarization layer 115c may include a top surface and sides.

[0369] The light-emitting diode layer (EDL) can be located above the third planarization layer 115c.

[0370] For example, the anode 121 may be disposed on a portion of the top surface and side of the third planarization layer 115c and a portion of the top surface of the second planarization layer 115b.

[0371] That is, for example, the anode 121 may include a first region 121a and a second region 121b, the first region 121a being disposed in the first opening region OA1 and having a surface substantially parallel to the surface of the second substrate 110b, and the second region 121b extending from the first region 121a such that the surface has a predetermined angle relative to the second substrate 110b.

[0372] In one or more aspects of this disclosure, the second region 121b of the anode 121 is a portion having a side mirror shape and can be configured with an SM structure.

[0373] The anode 121 may include a third region 121c that extends from the second region 121b such that its surface is substantially parallel to the surface of the second substrate 110b.

[0374] The first dike 316 may be disposed on the third planarization layer 115c, while covering a portion of the anode 121. According to a third exemplary embodiment of the present disclosure, the first dike 316 covers a portion of the third region 121c of the anode 121 including the contact hole CH and the top surface of the third planarization layer 115c.

[0375] The first dam 316 can be formulated from a black base resin.

[0376] For example, the side of the first embankment 316 may have a cone angle θ2 of 30° to 40°, and the cone angle θ2 of the first embankment 316 may be smaller than the cone angle θ1 of the third planarization layer 115c, but is not limited thereto.

[0377] Furthermore, according to the third exemplary embodiment of this disclosure, the side of the first dike 316 adjacent to the transmission region TA has a cone angle θ3 that is different from the cone angle θ2 of the other side. That is, for example, the side of the first dike 316 adjacent to the transmission region TA may have a cone angle θ3 that is larger than the cone angle θ2 of the other side and smaller than the cone angle θ1 of the third planarization layer 115c, but is not limited thereto. Therefore, the side of the first dike may have a cone angle θ3 that is equal to the cone angle θ2 of the other side.

[0378] The second dike 217 can be set on the first dike 316.

[0379] Organic layer 122 can be disposed on the top surface and sides of the second opening region OA2 and the second embankment 217.

[0380] The cathode 123 can be disposed on the organic layer 122.

[0381] The encapsulation layer ENCAP can be located above the aforementioned light-emitting diode layer EDL.

[0382] The encapsulation layer ENCAP can have a single-layer or multi-layer structure. For example, the encapsulation layer ENCAP can be configured by an encapsulation unit 140 including a first inorganic insulating film, a foreign matter compensation layer, and a second inorganic insulating film.

[0383] Although not shown, one or more dams may be provided at or near the ends of the inclined surfaces of the ENCAP encapsulation layer to suppress collapse. One or more dams may be provided in or near the boundary between the active and non-active regions.

[0384] For example, the foreign matter compensation layer comprising organic material may be located only on the innermost surface of the main dam. In this case, the foreign matter compensation layer may not be provided above all dams. Instead, the foreign matter compensation layer comprising organic material may be provided at least above the main dam, between the main dam and the secondary dam. For example, the foreign matter compensation layer may be positioned to extend to the upper part of the main dam. Alternatively, for example, the second encapsulation layer 117b may be positioned to extend to the upper part of the secondary dam by passing through the upper part of the main dam.

[0385] The touch sensor layer TSL can be placed above the aforementioned encapsulation layer ENCAP.

[0386] The touch sensor layer TSL can be configured with a touch buffer film 151, a bridging pattern 155, a touch insulating film 152, a touch electrode 156, and a touch planarization layer 157.

[0387] The black matrix 280 and the color filter layer 170 can be positioned above the touch sensor layer TSL.

[0388] Furthermore, for example, a protective layer PAC can be provided to cover the black matrix 280 and the color filter layer 170. The protective layer PAC can be configured as an organic insulating film of photoacrylic acid (PAC).

[0389] The laminated structure of the transmission region TA included in the first active region will be described below.

[0390] Reference Figure 12 The substrate SUB and a portion of the various insulating films 115a, 115b, 115c, 140, 151, 152, 157 and PAC disposed in the non-transmittent region NTA of the first active region can also be disposed in the transmittent region TA of the first active region in the same manner.

[0391] For example, at least one of the following components disposed in the nontransmissive region NTA of the first active region, namely the first substrate 110a, the interlayer insulating layer 110c, the first planarization layer 115a, the second planarization layer 115b, the third planarization layer 115c, the encapsulation unit 140, the touch buffer film 151, the touch insulating film 152, the touch planarization layer 157, and the protective layer PAC, may also be disposed in the transmissive region TA of the first active region in the same manner.

[0392] However, in the non-transmissive region NTA of the first active region, apart from the insulating material, no material layer (e.g., a metal material layer or a semiconductor layer) with electrical or opaque properties is provided in the transmissive region TA of the first active region.

[0393] For example, the metal material layers 135a, 135b, 131a, 131b, 132a, 132b, 133a, 133b, 125, 136a, 136b associated with the transistor, and the semiconductor layers 134a and 134b may not be disposed in the transmissive region TA. Furthermore, the first barrier 316, the second barrier 217, and the light-emitting diode 120 are not disposed in the transmissive region TA. Additionally, the bridging pattern 155 and the touch electrode 156 included in the touch sensor layer TSL may not be disposed in the transmissive region TA, but this disclosure is not limited thereto.

[0394] Additionally, according to one or more aspects of this disclosure, trenches are formed between adjacent sub-pixels to improve current leakage through the common layer of multiple light-emitting diodes, which will be described in detail with reference to the fourth and fifth exemplary embodiments of this disclosure.

[0395] Figure 13 This is an example diagram illustrating the pixel structure of a display panel according to a fourth exemplary embodiment of the present disclosure.

[0396] Figure 14 It is along Figure 13Example cross-sectional view taken from line B-B';

[0397] Figure 13 A portion of a display panel with three sub-pixels SP1, SP2, and SP3 is shown as an example. Furthermore, Figure 13 The diagram shows a planar surface structure including a second dam 417, which is a second opening region OA2 as the main light-emitting region; an anode 121 with a side mirror structure; a first dam 416 disposed on a third region 121c of the anode 121; a third planarization layer 415c including the first opening region OA1; a spacer 118; and a trench T disposed between sub-pixels SP1, SP2, and SP3.

[0398] Figure 14 A portion of a cross-section of a subpixel of a display panel according to a fourth exemplary embodiment of this disclosure is shown. For example, Figure 14 It shows cutting in a roughly left-right direction Figure 13 The first sub-pixel SP1 is the center of the section obtained.

[0399] Figure 13 and Figure 14 The fourth example implementation of the present disclosure is the same as described above. Figure 6 and Figure 7 The second exemplary embodiment of this disclosure differs in that a groove T is provided between adjacent sub-pixels SP1, SP2, and SP3. However, the other configurations are substantially the same, and therefore redundant descriptions will be omitted. Here, the description of the same reference numerals can be found in relation to... Figures 1 to 12 The description provided.

[0400] Reference Figure 13 and Figure 14 As described above, multiple transistors, such as driving transistor Td and switching transistor Ts, can be disposed above substrates 110a, 110b and 110c.

[0401] A first planarization layer 115a, a second planarization layer 115b, and a third planarization layer 415c can be disposed above the driving transistor Td and the switching transistor Ts.

[0402] For example, the third planarization layer 415c may include a first opening region OA1 obtained by removing (opening) portions of the third planarization layer 415c corresponding to the main light-emitting region, the reflected light-emitting region, and the second non-light-emitting region of sub-pixels SP1, SP2, and SP3.

[0403] Furthermore, for example, the third planarization layer 415c may include a trench T obtained by removing (opening) the portion of the third planarization layer 415c between adjacent sub-pixels SP1, SP2, and SP3. At this time, in Figure 14 The diagram shows the removal of the entire thickness of the third planarization layer 415c to form the trench T; however, this disclosure is not limited to this, and a portion of the thickness of the third planarization layer 415c may be removed to form the trench T. Furthermore, in Figure 14 The diagram illustrates the formation of a trench T in a sub-pixel SP1, SP2, or SP3, but this disclosure is not limited thereto, and multiple trenches T can be formed.

[0404] exist Figure 13 The diagram shows a trench T having an uninterrupted, substantially circular annular shape along the contours of each sub-pixel SP1, SP2, and SP3. However, this disclosure is not limited to this, and the trench may have a discontinuous circular annular shape. Furthermore, when the sub-pixels SP1, SP2, and SP3 have polygonal shapes, the trench T may have an uninterrupted polygonal annular shape or a discontinuous polygonal annular shape along the contours of each sub-pixel SP1, SP2, and SP3.

[0405] The trench T according to the fourth exemplary embodiment of this disclosure can be formed by etching the third planarization layer 415c by an additional mask process (or photoprocess), but is not limited thereto.

[0406] The trench T described above is used to improve the lateral leakage current generated in a multi-stacked structure. That is, due to the trench T according to the fourth exemplary embodiment of this disclosure, the current path between the organic layer 422 and the cathode 423 between sub-pixels SP1, SP2, and SP3 is increased. However, this disclosure is not limited to multi-stacked structures, but can be effectively applied when lateral leakage current is generated in conventional organic light-emitting display devices.

[0407] According to one or more aspects of this disclosure, the current path is increased to reduce leakage current attributable to the process characteristics of the organic light-emitting display device, leakage current generated due to the use of a common layer, and leakage current generated primarily when a current path is strongly formed in a low grayscale region.

[0408] For example, the anode 121 may be disposed on a portion of the top surface and side of the third planarization layer 415c and on a portion of the top surface of the second planarization layer 115b.

[0409] The first dike 416 can be set on the third leveling layer 415c, while covering a portion of the anode 121.

[0410] According to the fourth exemplary embodiment of this disclosure, the first dam 416 may cover a portion of the third region 121c of the anode 121 including the contact hole CH, a portion of the top surface of the third planarization layer 415c, and other portions of the top surface of the third planarization layer 415c including the trench T.

[0411] According to the fourth exemplary embodiment of this disclosure, the portion of the first embankment 416 corresponding to the groove T may have a concave shape along the shape of the groove T.

[0412] The first dam 416 can be formulated from a black-based resin.

[0413] As described above, the first dam 416 of the fourth exemplary embodiment of this disclosure may be disposed on the third region 121c of the anode 121 to cover a portion of the third region 121c.

[0414] The second dike 417 can be set on the first dike 416.

[0415] The second dike 417 of the fourth exemplary embodiment of this disclosure may cover the first dike 416, and other exposed portions of the second region 121b and the third region 121c of the anode 121. Furthermore, the second dike 417 of the fourth exemplary embodiment of this disclosure may cover a portion of the edge of the first region 121a of the anode 121. Additionally, the portion of the second dike 417 corresponding to the trench T according to the fourth exemplary embodiment of this disclosure may have a concave shape along the shape of the trench T.

[0416] Organic layer 422 can be disposed on the top surface and sides of the second opening region OA2 and the second dike 417.

[0417] The cathode 423 can be disposed on the organic layer 422.

[0418] At this time, the portions of the organic layer 422 and the cathode 423 corresponding to the trench T in the fourth exemplary embodiment of this disclosure may have a concave shape along the shape of the trench T, thereby increasing the current path to improve lateral leakage current.

[0419] The packaging unit 140 can be disposed above the aforementioned light-emitting diode 420.

[0420] A touch sensor layer configured with a touch buffer film 151, a bridging pattern 155, a touch insulating film 152, a touch electrode 156, and a touch planarization layer 157 can be disposed above the packaging unit 140.

[0421] The black matrix 280 and the color filter layer 170 can be positioned above the touch sensor layer.

[0422] Figure 15 This is an example cross-sectional view illustrating the sub-pixel structure of a fifth exemplary embodiment of the present disclosure.

[0423] Figure 15 A portion of a cross-section of a subpixel of a display panel according to a fifth exemplary embodiment of the present disclosure is shown.

[0424] Figure 15 The fifth example implementation of this disclosure is the same as described above. Figure 6 and Figure 7 The second exemplary embodiment of this disclosure differs in that a groove T is provided between adjacent sub-pixels, but the other configurations are substantially the same, therefore redundant descriptions will be omitted. Here, the descriptions of the same reference numerals may refer to those in conjunction with... Figures 1 to 14 The description provided.

[0425] Reference Figure 15 As described above, multiple transistors, such as driving transistor Td and switching transistor Ts, can be disposed above substrates 110a, 110b and 110c.

[0426] The first planarization layer 115a, the second planarization layer 115b, and the third planarization layer 515c can be disposed above the driving transistor Td and the switching transistor Ts.

[0427] For example, the third planarization layer 515c may include a first opening region OA1 obtained by removing (opening) the portion of the third planarization layer 515c corresponding to the main light-emitting region, the reflected light-emitting region, and the second non-light-emitting region of the sub-pixel.

[0428] Furthermore, for example, the third planarization layer 515c may include a trench T obtained by removing (opening) the portion of the third planarization layer 515c between adjacent sub-pixels. At this time, in Figure 15 The diagram illustrates forming a trench T by removing the entire thickness of the second dike 517, the first dike 516, and the third planarization layer 515c; however, this disclosure is not limited to this. Therefore, the entire thickness of the second dike 517 and the first dike 516, as well as a portion of the thickness of the third planarization layer 515c, are removed to form the trench T. Furthermore, in Figure 15 The diagram illustrates the formation of a trench T in a subpixel, but this disclosure is not limited thereto, and multiple trenches T can be formed.

[0429] The trench T according to the fifth exemplary embodiment of this disclosure can be formed by etching the second dam 517, the first dam 516, and the third planarization layer 515c using existing optical processes or laser melting, but is not limited thereto. In this case, compared with the fourth exemplary embodiment described above, the width and depth of the trench T are increased, making it possible to more effectively improve lateral leakage current.

[0430] As described above, the anode 121 may be disposed on a portion of the top surface and side of the third planarization layer 515c and a portion of the top surface of the second planarization layer 115b.

[0431] The first embankment 516 can be set on the third planarization layer 515c, while covering a portion of the anode 121.

[0432] According to a fifth exemplary embodiment of this disclosure, the first dam 516 may cover a portion of the third region 121c of the anode 121 including the contact hole CH, a portion of the top surface of the third planarization layer 515c, and other portions of the top surface of the third planarization layer 515c excluding the trench T.

[0433] The first dam 516 can be formulated from black-based resin.

[0434] As described above, in the fifth exemplary embodiment of this disclosure, the first dam 516 may be disposed on the third region 121c of the anode 121 to cover a portion of the third region 121c.

[0435] The second dike 517 can be set on the first dike 516.

[0436] The second dike 517 of the fifth exemplary embodiment of this disclosure may cover the first dike 516, and other exposed portions of the second region 121b and the third region 121c of the anode 121. Furthermore, the second dike 517 of the fifth exemplary embodiment of this disclosure may cover a portion of the edge of the first region 121a of the anode 121. Additionally, the second dike 517 of the fifth exemplary embodiment of this disclosure may cover the first dike 516 excluding the trench T.

[0437] The organic layer 522 can be disposed on the top surface and sides of the second opening region OA2 and the second embankment 517. In the fifth exemplary embodiment of this disclosure, the organic layer 522 can be disposed in the trench T.

[0438] The cathode 523 may be disposed on the organic layer 522. In the fifth exemplary embodiment of this disclosure, the cathode 523 may be disposed in the trench T.

[0439] As described above, the organic layer 522 and cathode 523 of the fifth exemplary embodiment of this disclosure can be disposed in the trench T to increase the current path and improve the lateral leakage current.

[0440] The packaging unit 140 can be disposed above the aforementioned light-emitting diode 520.

[0441] A touch sensor layer configured with a touch buffer film 151, a bridging pattern 155, a touch insulating film 152, a touch electrode 156, and a touch planarization layer 157 can be disposed above the packaging unit 140.

[0442] The black matrix 280 and the color filter layer 170 can be positioned above the touch sensor layer.

[0443] Meanwhile, as mentioned above, the distance between the boundaries of the second and third regions of the anode and the first dike is the same for all sub-pixels, but this disclosure is not limited to this and can vary for each sub-pixel, as will be described in detail with reference to the accompanying drawings.

[0444] Figure 16 This is an example diagram illustrating the pixel structure of a display panel according to a sixth exemplary embodiment of the present disclosure.

[0445] Figure 17 It is along Figure 16 Example cross-sectional view taken from line C-C'.

[0446] Figure 16 A portion of the display panel is shown, with three sub-pixels SP1, SP2, and SP3 set up as an example. Furthermore, Figure 16 The diagram shows a planar surface structure including a second dam 617, which is a second opening region OA2 as the main light-emitting region, an anode 121 with a side mirror structure, first dams 616_1, 616_2, and 616_3 disposed on a third region 121c of the anode 121, a third planarization layer 115c including the first opening region OA1, and a spacer 118.

[0447] Figure 17 A portion of a cross-section of a pixel of a display panel according to a sixth exemplary embodiment of this disclosure is shown. For example, Figure 17 It shows Figure 16 A portion of the cross-section of the first sub-pixel SP1, the second sub-pixel SP2, and the third sub-pixel SP3. Figure 17 For convenience, the configuration above and below the LED 120 is not shown, but this disclosure is not limited thereto.

[0448] Figure 16 and Figure 17 The sixth example implementation of the present disclosure and Figure 6 and Figure 7 The difference between the second exemplary embodiment of this disclosure and the one described above is that the distances D1, D2, and D3 of the first dikes 616_1, 616_2, and 616_3 are different for each sub-pixel SP1, SP2, and SP3. Other configurations are substantially the same, therefore redundant descriptions will be omitted. Here, the description of the same reference numerals may refer to... Figures 1 to 17 The description provided.

[0449] Reference Figure 16 and Figure 17 As described above, the third planarization layer 115c can be disposed on the second planarization layer 115b.

[0450] For example, the anode 121 may be disposed on a portion of the top surface and side of the third planarization layer 115c and a portion of the top surface of the second planarization layer 115b.

[0451] The first dikes 616_1, 616_2, and 616_3 can be set on the third planarization layer 115c, while also covering a portion of the anode 121.

[0452] According to the sixth exemplary embodiment of this disclosure, the first dikes 616_1, 616_2, 616_3 may cover a portion of the third region 121c of the anode 121 including the contact hole CH and a portion of the top surface of the third planarization layer 115c.

[0453] According to the sixth exemplary embodiment of this disclosure, the first dikes 616_1, 616_2, and 616_3 may have different distances D1, D2, and D3 in sub-pixels SP1, SP2, and SP3. For example, the first dikes 616_1, 616_2, and 616_3 may include a first-first dike 616_1 disposed in the first sub-pixel SP1, a second-first dike 616_2 disposed in the second sub-pixel SP2, and a third-first dike 616_3 disposed in the third sub-pixel SP3. Furthermore, for example, the first-first dike 616_1 has a first distance D1, the second-first dike 616_2 has a second distance D2, and the third-first dike 616_3 has a third distance D3.

[0454] For example, in the first sub-pixel SP1, the first distance D1 lies between the boundary of the second region 121b and the third region 121c of the anode 121 and the first-first embankment 616_1; in the second sub-pixel SP2, the second distance D2 lies between the boundary of the second region 121b and the third region 121c of the anode 121 and the second-first embankment 616_2. Furthermore, in the third sub-pixel SP3, the third distance D3 lies between the boundary of the second region 121b and the third region 121c of the anode 121 and the third-first embankment 616_3. At this time, in... Figure 17In the above-described UDC model or UDIR model, the second distance D2 is 0, the first distance D1 is greater than the second distance D2, and the third distance D3 is greater than the first distance D1, but this disclosure is not limited thereto. For example, the first distance D1 is 0.5 μm, the second distance D2 is 0 μm, and the third distance D3 is 1.5 μm, but this disclosure is not limited thereto. Furthermore, according to one or more aspects of this disclosure, the distance of any one sub-pixel is different from the distances of the other two sub-pixels, and the distance can vary for each sub-pixel depending on the position of the display panel. For example, the distance of a sub-pixel located at the edge of the display panel can be different from the distance of sub-pixels at other locations. Additionally, for example, the distance of a sub-pixel located at the center of the display panel is different from the distance of sub-pixels at other locations. Furthermore, when this disclosure is applied to the above-described UDC model or UDIR mode, the distance of the sub-pixels in the first active region can be different from the distance in the second active region.

[0455] The first dikes 616_1, 616_2 and 616_3 can be configured from black base resin.

[0456] As described above, the first dikes 616_1, 616_2 and 616_3 of the sixth exemplary embodiment of this disclosure may be disposed on the third region 121c of the anode 121 to cover a portion of the third region 121c.

[0457] The second dike 617 can be set on the first dikes 616_1, 616_2 and 616_3.

[0458] In a sixth exemplary embodiment of this disclosure, the second dike 617 may cover the first dikes 616_1, 616_2, and 616_3, as well as other exposed portions of the second region 121b and the third region 121c of the anode 121. (See also...) Figure 17 As an example, in the first sub-pixel SP1, the second dike 617 of the sixth exemplary embodiment of this disclosure covers the first dike 616_1, and a portion of the exposed second region 121b and third region 121c of the anode 121. Furthermore, in the second sub-pixel SP2, the second dike 617 covers the second dike 616_2 and the second region 121b of the anode 121, and in the third sub-pixel SP3, it covers the remaining exposed portions of the third dike 616_3, and the second region 121b and third region 121c of the anode 121; however, this disclosure is not limited thereto.

[0459] Meanwhile, the packaging unit can be positioned above the light-emitting diode 120.

[0460] In addition, the touch sensor layer can be disposed above the packaging unit, and the black matrix and color filter layer can be disposed above the touch sensor layer.

[0461] Various examples and aspects of this disclosure are described below. These are provided by way of example and do not limit the scope of this disclosure.

[0462] Return to reference Figure 4 and Figure 5 The main light-emitting region EA1 can correspond to the area of ​​the top surface of the anode 121 exposed through the second dam 117. That is, the main light-emitting region EA1 can be a region where some of the light emitted from the organic layer 122 is extracted to the outside of the display device via the organic layer 122 and the cathode 123.

[0463] The second non-emitting region NEA2 may surround the main emitting region EA1. The second non-emitting region NEA2 may be a region in which some of the light emitted from the organic layer 122 reaches the second dam 117 such that the light is not extracted or is substantially not extracted to the outside of the display device. The second non-emitting region NEA2 may correspond to the area on the top surface of the second planarization layer 115b where the anode 121 is covered by the second dam 117.

[0464] The reflective light-emitting region EA2 may surround the second non-light-emitting region NEA2. The reflective light-emitting region EA2 of the sub-pixel may correspond to the region on the inclined surface of the third planarization layer 115c at the sub-pixel where the anode 121 of the sub-pixel is disposed. That is, the reflective light-emitting region EA2 may be a region where some of the light emitted from the organic layer 122 is reflected by the anode 121 disposed on the inclined surface (or the side with, for example, a cone angle θ1) of the third planarization layer 115c.

[0465] The first non-light-emitting region NEA1 may surround the reflective light-emitting region EA2. The first non-light-emitting region NEA1 may be an area provided with a component (e.g., transistor Td) for driving the light-emitting diode 120.

[0466] In one or more aspects, regarding Figure 4 and Figure 5 The foregoing description applies to... Figure 6 , Figure 7 and Figures 12 to 17 Related elements with the same name and with the same or different reference numerals.

[0467] According to one or more aspects of this disclosure, a display device is provided. The display device includes: a main light-emitting region EA1, a reflective light-emitting region EA2, a first non-light-emitting region NEA1, and a second non-light-emitting region NEA2; a planarization layer disposed on a substrate and in the reflective light-emitting region and the first non-light-emitting region, but not in the main light-emitting region and the second non-light-emitting region; an anode disposed on a portion of the planarization layer, in the main light-emitting region, the second non-light-emitting region, and the reflective light-emitting region, and in a portion of the first non-light-emitting region; a first dike disposed on a portion of the anode and in a portion of the first non-light-emitting region, but not in the main light-emitting region, the second non-light-emitting region, and the reflective light-emitting region; a second dike disposed on the first dike and in the reflective light-emitting region, the first non-light-emitting region, and the second non-light-emitting region; an organic layer disposed on the anode; and a cathode disposed on the organic layer. The second non-light-emitting region surrounds the main light-emitting region, the reflective light-emitting region surrounds the second non-light-emitting region, and the first non-light-emitting region surrounds the reflective light-emitting region. The first dike comprises black resin.

[0468] Various examples and aspects of this disclosure are described below. These are provided by way of example and do not limit the scope of this disclosure.

[0469] According to one or more aspects of this disclosure, a display device is provided. The display device includes: a substrate; a plurality of sub-pixels; a planarization layer disposed above the substrate and having a first opening region; an anode disposed in the first opening region and on a top surface and side of the planarization layer; a first dam covering a portion of the anode and comprising black resin; a second dam covering the first dam and the side of the anode and having a second opening region; an organic layer disposed on the anode exposed through the second opening region; and a cathode disposed on the organic layer.

[0470] The first opening area can be wider than the second opening area.

[0471] The side of the anode can correspond to the side of the planarization layer.

[0472] The display device may further include: an encapsulation unit disposed above the cathode; a touch sensor layer disposed above the encapsulation unit; and a black matrix and color filter layer disposed above the touch sensor layer.

[0473] The black matrix can be spaced apart from the end of the first dike.

[0474] An anode, an organic layer, and a cathode can form a light-emitting diode (LED). The LED can define a main light-emitting region, and a region corresponding to the side of the anode can define a reflective light-emitting region. The reflective light-emitting region can be formed around the main light-emitting region.

[0475] The anode may include: a first region disposed in a first opening region; a second region extending from the first region to correspond to a side of the planarization layer; and a third region extending from the second region and disposed on the top surface of the planarization layer.

[0476] The side of the first dike may have a cone angle smaller than that of the side of the flattening layer.

[0477] The second dike can cover the first dike, as well as a portion of the first area and the second area of ​​the anode.

[0478] The first dike can cover the entire third region of the anode and the top surface of the planarization layer.

[0479] The end of the first dike can be matched with the end of the third area.

[0480] The first dike can cover a portion of the third region of the anode and the top surface of the planarization layer, and can expose other parts of the third region of the anode.

[0481] The second dike may cover the first dike, as well as a portion of the first area of ​​the anode, the second area, and the other exposed portions of the third area.

[0482] The end of the first dike can be separated from the end of the third area.

[0483] The distance between the boundaries of the second and third regions of the anode and the first dike can be from 0.5 μm to 1.5 μm.

[0484] This distance can be the same for all sub-pixels across multiple sub-pixels.

[0485] This distance can be different for each of the multiple sub-pixels.

[0486] The first dike may include a first-first dike in a first sub-pixel among multiple sub-pixels, a second-first dike in a second sub-pixel among multiple sub-pixels, and a third-first dike in a third sub-pixel among multiple sub-pixels.

[0487] The first-first dike may have a first distance from the boundary, the second-first dike may have a second distance from the boundary, and the third-first dike may have a third distance from the boundary, and the first distance, the second distance, and the third distance may be different from each other.

[0488] The display device may include an active region divided into a first active region and a second active region, and the first active region may include a transmissive region and a non-transmissive region.

[0489] The display device may further include: a first pixel disposed in a non-transmissive region of a first active region; and a second pixel disposed in a second active region, wherein the first pixel may be configured by a plurality of first sub-pixels and the second pixel may be configured by a plurality of second sub-pixels.

[0490] The pixels per inch (PPI) of the first pixel can be smaller than the PPI of the second pixel.

[0491] The display device may further include: a light receiving device, which overlaps with the first active region.

[0492] The first dike can be set in the non-transmitting region of the first active region and the second active region, but it can be set outside the transmitting region of the first active region.

[0493] The side of the first dike adjacent to the transmission area may have a cone angle different from that of the other side of the first dike.

[0494] The planarization layer may include trenches formed by removing (opening) portions of the planarization layer between adjacent sub-pixels.

[0495] The first dike may cover a portion of the third region of the anode, a portion of the top surface of the planarization layer, and the trench.

[0496] The portions of the first embankment, organic layer, and cathode corresponding to the trench can have concave shapes corresponding to the shape of the trench.

[0497] The first dike may cover a portion of the third region of the anode, a portion of the top surface of the planarization layer, and other portions of the top surface of the planarization layer excluding the trenches, and the second dike may cover the first dike excluding the trenches, a portion of the first region of the anode, and the second region.

[0498] The organic layer and the cathode can be disposed in the trench.

[0499] The planarization layer may include contact holes spaced apart from the first opening region, the driving transistor disposed between the substrate and the planarization layer is electrically connected to the anode through the contact holes, and the first dam may cover the contact holes.

[0500] Although exemplary embodiments of the present disclosure have been described in detail with reference to the accompanying drawings, the present disclosure is not limited thereto, and the present disclosure can be implemented in many different forms without departing from the technical concept of the present disclosure. Therefore, the exemplary embodiments of the present disclosure are provided for illustrative purposes only and are not intended to limit the technical concept of the present disclosure. The scope of the technical concept of the present disclosure is not limited thereto. Therefore, it should be understood that the above exemplary embodiments are illustrative in all respects and do not limit the present disclosure. All technical concepts within the equivalent scope of the present disclosure should be construed as falling within the scope of the present disclosure.

[0501] This invention provides the following inventive concept:

[0502] 1. A display device, comprising:

[0503] substrate;

[0504] Multiple sub-pixels;

[0505] A planarization layer, the planarization layer being disposed above the substrate and having a first opening region;

[0506] An anode is disposed in the first opening region and on the top surface and sides of the planarization layer;

[0507] A first dike covers a portion of the anode and comprises black resin;

[0508] A second dike covers the side of the first dike and the anode and has a second opening area;

[0509] An organic layer, the organic layer being disposed on the anode exposed through the second opening region; and

[0510] The cathode is disposed on the organic layer.

[0511] 2. The display device according to inventive concept 1, wherein the first opening region is wider than the second opening region.

[0512] 3. The display device according to inventive concept 1, wherein the side of the anode corresponds to the side of the planarization layer.

[0513] 4. The display device according to inventive concept 1 further includes:

[0514] The encapsulation unit is disposed above the cathode;

[0515] A touch sensor layer, wherein the touch sensor layer is disposed above the packaging unit; and

[0516] A black matrix and a color filter layer are disposed above the touch sensor layer.

[0517] 5. The display device according to inventive concept 4, wherein the black matrix is ​​spaced apart from the end of the first embankment.

[0518] 6. The display device according to inventive concept 1, wherein the anode, the organic layer and the cathode form a light-emitting diode, the light-emitting diode defines a main light-emitting region, a region corresponding to the side of the anode defines a reflective light-emitting region, and the reflective light-emitting region is formed around the main light-emitting region.

[0519] 7. The display device according to inventive concept 1, wherein the anode comprises:

[0520] A first region, wherein the first region is located within the first opening region;

[0521] A second region, extending from the first region to correspond to the side of the planarization layer; and

[0522] A third region extends from the second region and is disposed on the top surface of the planarization layer.

[0523] 8. The display device according to inventive concept 1, wherein the side portion of the first embankment has a cone angle smaller than the cone angle of the side portion of the planarization layer.

[0524] 9. The display device according to inventive concept 7, wherein the second dike covers the first dike and a portion of the first region and the second region of the anode.

[0525] 10. The display device according to inventive concept 7, wherein the first embankment covers the entire third region of the anode and the top surface of the planarization layer.

[0526] 11. The display device according to inventive concept 10, wherein the end of the first embankment matches the end of the third region.

[0527] 12. The display device according to inventive concept 7, wherein the first embankment covers a portion of the third region of the anode and the top surface of the planarization layer, and exposes the remaining portion of the third region of the anode.

[0528] 13. The display device according to inventive concept 12, wherein the second dike covers the first dike, a portion of the first region of the anode, the second region, and the other exposed portions of the third region.

[0529] 14. The display device according to inventive concept 12, wherein the end of the first embankment is spaced apart from the end of the third region.

[0530] 15. The display device according to inventive concept 14, wherein the distance between the boundary of the second region and the third region of the anode and the first embankment is 0.5 μm to 1.5 μm.

[0531] 16. The display device according to inventive concept 15, wherein the distance is the same for all sub-pixels of the plurality of sub-pixels.

[0532] 17. The display device according to inventive concept 15, wherein the distance is different for each of the plurality of sub-pixels.

[0533] 18. The display device according to inventive concept 17, wherein the first barrier includes a first-first barrier disposed in a first sub-pixel of the plurality of sub-pixels, a second-first barrier disposed in a second sub-pixel of the plurality of sub-pixels, and a third-first barrier disposed in a third sub-pixel of the plurality of sub-pixels.

[0534] 19. The display device according to inventive concept 18, wherein the first-first embankment has a first distance from the boundary, the second-first embankment has a second distance from the boundary, and the third-first embankment has a third distance from the boundary, and the first distance, the second distance, and the third distance are different from each other.

[0535] 20. The display device according to inventive concept 1 includes an active region divided into a first active region and a second active region, wherein the first active region includes a transmissive region and a non-transmissive region.

[0536] 21. The display device according to inventive concept 20, further comprising:

[0537] A first pixel, wherein the first pixel is disposed in the non-transmissive region of the first active region; and

[0538] The second pixel is set in the second active region.

[0539] The first pixel is configured with a plurality of first sub-pixels, and the second pixel is configured with a plurality of second sub-pixels.

[0540] 22. The display device according to inventive concept 21, wherein the pixel per inch (PPI) of the first pixel is less than the PPI of the second pixel.

[0541] 23. The display device according to inventive concept 20 further includes:

[0542] An optical receiving device that overlaps with the first active region.

[0543] 24. The display device according to inventive concept 20, wherein the first barrier is disposed in the non-transmissive region of the first active region and the second active region, but not in the transmissive region of the first active region.

[0544] 25. The display device according to inventive concept 20, wherein the side of the first embankment adjacent to the transmission area has a cone angle different from the cone angle of the other side of the first embankment.

[0545] 26. The display device according to inventive concept 1, wherein the planarization layer includes trenches formed by removing portions of the planarization layer between adjacent sub-pixels.

[0546] 27. The display device according to inventive concept 26, wherein the anode comprises:

[0547] A first region, wherein the first region is located within the first opening region;

[0548] A second region, extending from the first region to correspond to the side of the planarization layer; and

[0549] A third region extends from the second region and is disposed on the top surface of the planarization layer, and

[0550] The first embankment covers a portion of the third region of the anode, a portion of the top surface of the planarization layer, and the trench.

[0551] 28. The display device according to inventive concept 26, wherein the portions of the first embankment, the organic layer, and the cathode corresponding to the trench have concave shapes corresponding to the shape of the trench.

[0552] 29. The display device according to inventive concept 26, wherein the anode comprises:

[0553] A first region, wherein the first region is located within the first opening region;

[0554] A second region, extending from the first region to correspond to the side of the planarization layer; and

[0555] A third region extends from the second region and is disposed on the top surface of the planarization layer.

[0556] Wherein, the first dike covers a portion of the third region of the anode, a portion of the top surface of the planarization layer, and the remaining portion of the top surface of the planarization layer excluding the trench, and

[0557] Wherein, the second dike covers the first dike that does not include the trench, a portion of the first region of the anode, and the second region.

[0558] 30. The display device according to inventive concept 26, wherein the organic layer and the cathode are disposed in the trench.

[0559] 31. The display device according to inventive concept 1,

[0560] The planarization layer includes contact holes spaced apart from the first opening region, and the driving transistor disposed between the substrate and the planarization layer communicates with the anode through the contact holes.

[0561] The hole is electrically connected, and

[0562] The first dike covers the contact hole.

Claims

1. A display device, comprising: substrate; Multiple sub-pixels; A planarization layer, the planarization layer being disposed above the substrate and having a first opening region; An anode is disposed in the first opening region and on the top surface and sides of the planarization layer; A first dike covers a portion of the anode and comprises black resin; A second dike covers the side of the first dike and the anode and has a second opening area; An organic layer is disposed on the anode exposed through the second opening region; as well as The cathode is disposed on the organic layer.

2. The display device according to claim 1, wherein, The first opening region is wider than the second opening region.

3. The display device according to claim 1, wherein, The side of the anode corresponds to the side of the planarization layer.

4. The display device according to claim 1, further comprising: The encapsulation unit is disposed above the cathode; A touch sensor layer is disposed above the packaging unit; as well as A black matrix and a color filter layer are disposed above the touch sensor layer.

5. The display device according to claim 4, wherein, The black matrix is ​​spaced apart from the end of the first dike.

6. The display device according to claim 1, wherein, The anode, the organic layer, and the cathode form a light-emitting diode, the light-emitting diode defining a main light-emitting region, a region corresponding to the side of the anode defining a reflected light-emitting region, and the reflected light-emitting region being formed around the main light-emitting region.

7. The display device according to claim 1, wherein, The anode includes: A first region, wherein the first region is located within the first opening region; A second region, extending from the first region to correspond to the side of the planarization layer; and A third region extends from the second region and is disposed on the top surface of the planarization layer.

8. The display device according to claim 1, wherein, The side of the first embankment has a cone angle smaller than that of the side of the flattening layer.

9. The display device according to claim 7, wherein, The second dike covers the first dike and a portion of the first region and the second region of the anode.

10. The display device according to claim 7, wherein, The first embankment covers the entire third region of the anode and the top surface of the planarization layer.

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