Imaging device, heat dissipation sheet, structure for housing wiring board

Abstract

The present application relates to controlling vibration with high precision to eliminate image shake. An image pickup apparatus according to an embodiment of the present invention comprises a vibration reduction mechanism for suppressing an effect of external vibration on an image sensor, the vibration reduction mechanism comprising: a vibration suppression structure provided within a housing; the driving structure comprises two pairs of coil type actuators, the two pairs of coil type actuators are located in the vibration suppression structure, each pair of coil type actuators are oppositely arranged at intervals relative to an opening, the opening is used for light of a shot body to pass through, each pair of coil type actuators are electrically connected, and the coil type actuators are electrically connected with the vibration suppression structure. The image sensor is driven in a direction in which the vibration with respect to the image sensor can be cancelled.

Description

Camera device, heat sink, wiring substrate storage structure and moving body

Technical field

[0001] The present invention generally relates to a camera device, a heat sink, a storage structure for a wiring substrate, and a movable body, and in particular, to a camera device capable of correcting dynamic image jitter caused by the vibration of the machine on which it is mounted, a heat sink provided on the camera device, a storage structure for a wiring substrate, and a movable body equipped with the camera device. [Background Technology]

[0002] Similar to smartphone cameras, multi-cameras are becoming increasingly popular in cameras mounted on mobile objects such as unmanned aerial vehicles (UAVs), such as drones. The magnification required for telephoto lenses is increasing year by year.

[0003] However, as the magnification increases, the vibration transmitted from the drone body to the camera cannot be fully eliminated by the three-axis control of the camera gimbal alone, resulting in the problem of residual dynamic image jitter of approximately 100Hz to 150Hz.

[0004] For example, Reference 1 discloses a structure in which a fixed portion of an OIS (Optical Image Stabilization) movable portion is swingably held by four suspension wires within a plane perpendicular to the optical axis.

[0005] However, since the structure disclosed in Reference 1 uses a movable magnet type, there is a limit to improving the ratio of the voice coil motor thrust (VCM) / the weight of the OIS movable part, making it difficult to fully cope with dynamic image judder of approximately 100Hz to approximately 150Hz.

[0006] [Prior art literature]

[0007] [Patent Document]

[0008] [Patent Document 1] Japanese Patent No. 6842046

[0009] [Patent Document 2] Japanese Patent Application Laid-Open No. 2011-087027

[0010] [Summary of the invention]

[0011] The main object of the present invention is to provide a camera device, a heat sink, a wiring substrate storage structure and a moving body with a BIS (Body Image Stabilizer) function, that is, a function of controlling vibration with high precision to eliminate image jitter.

[0012] A first aspect of the present invention provides a camera device, comprising:

[0013] an optical system comprising at least one lens;

[0014] an image sensor that receives light from a subject via the optical system and generates a signal of an image of the subject;

[0015] a housing having an opening for incident light from the subject, the image sensor being located on the back side of the housing; and

[0016] a vibration reduction mechanism for suppressing the influence of external vibration on the image sensor;

[0017] Wherein, the vibration reduction mechanism includes:

[0018] a vibration suppression structure disposed within the housing; and

[0019] a driving structure comprising two pairs of coil-type actuators, the two pairs of coil-type actuators being located within the vibration suppression structure, and each pair of coil-type actuators being spaced apart relative to the opening;

[0020] Each pair of the coil-type actuators is electrically connected to drive the image sensor in a direction capable of offsetting the vibration of the image sensor.

[0021] In addition, a second aspect of the present invention provides a heat dissipation structure, which is provided in the camera device of the first aspect.

[0022] One end of the heat dissipation structure is fixed to the radiator, and the other end is connected to the image sensor and is used to dissipate heat from the camera device to the radiator.

[0023] After being folded once, it is fixed to the opposite surface between the image sensor and the radiator. In the deformed area except the fixed surface with the image sensor and the radiator, the heat dissipation structure is provided with at least one slit along the folding direction.

[0024] In addition, a third aspect of the present invention provides a wiring substrate storage structure, which is provided in the imaging device according to the first aspect.

[0025] The housing includes a top plate on the subject side, a bottom plate on the back side, and first to fourth side plates arranged on the outer peripheral surface of the rectangular parallelepiped.

[0026] A first space is provided between the first side plate and the driving structure, and a second space is provided between the third side plate and the fourth side plate and the driving structure.

[0027] The non-shielding member is configured to extend from the first space to a corner of the second space,

[0028] In the storage structure, the shielded component is configured to extend from the first space to the second space between the non-shielding component and the image sensor, and its two ends are bent to cover the corners of the first side plate and the third side plate and the corners of the first side plate and the fourth side plate.

[0029] Furthermore, a fourth aspect of the present invention provides a mobile object including the imaging device according to the first aspect.

[0030] According to the present disclosure, there are provided an imaging device capable of controlling vibration with high precision to solve the problem of image shake, and a mobile object equipped with the imaging device.

[0031] In addition, according to the present disclosure, a heat sink capable of suppressing the jelly effect that may occur in an imaging device is provided.

[0032] Furthermore, according to the present disclosure, a wiring substrate housing structure is provided that ensures sufficient magnetic field shielding of an image sensor.

Brief Description of the Drawings

[0033] FIG. 1 is an example of a diagram showing a schematic shape of a moving object on which an imaging device according to some embodiments of the present disclosure is mounted.

[0034] FIG. 2 is an example of a simplified cross-sectional view showing a schematic configuration of the imaging device according to the first embodiment.

[0035] FIG. 3 is an example of a simplified perspective view showing the appearance of a housing that accommodates the vibration damping mechanism.

[0036] FIG. 4 is an example of a cross-sectional view of a corner portion along the cutting line AA in FIG. 3 .

[0037] FIG. 5 is an example of a perspective view showing a schematic structure of a vibration damping mechanism including upper and lower metal plates and suspension wires.

[0038] FIG. 6 is an example of a perspective view showing the structure of FIG. 5 in a state in which it is turned upside down.

[0039] FIG. 7 is an example of a perspective view showing a configuration in which the yoke is removed from the configuration in FIG. 5 .

[0040] FIG. 8 is an example of a perspective view of the structure shown in FIG. 6 including a coil slider.

[0041] FIG. 9 is an example of a diagram illustrating a current path in the driving structure of the imaging device according to the first embodiment.

[0042] FIG. 10A is an example of a perspective view showing a main part of an imaging device according to a second embodiment.

[0043] FIG. 10B is an example of a simplified cross-sectional view along the cutting line BB in FIG. 10A .

[0044] FIG. 11 is an example of a diagram illustrating a location where balls are arranged in the imaging device according to the second embodiment.

[0045] FIG. 12 is an example of a diagram illustrating an example of a method of connecting a vibration reduction mechanism and a driving structure using balls in the imaging device according to the second embodiment.

[0046] FIG. 13 is a diagram showing an example of wiring connection between a leaf spring and a coil in the second embodiment.

[0047] FIG. 14 is an example of a perspective view of the imaging device according to the third embodiment as seen from the rear side.

[0048] FIG. 15 is an example of a partial front view of the imaging device according to the third embodiment as viewed from the +Y direction of FIG. 14 .

[0049] 16A is an example of a perspective view of a heat dissipation member included in the imaging device according to the third embodiment, as seen from an oblique rear surface side.

[0050] FIG. 16B is an example of a perspective view showing an example of a heat sink included in the heat dissipation component shown in FIG. 16A .

[0051] FIG. 16C is an example of a perspective view showing a state in which the heat dissipation fins included in the heat dissipation component shown in FIG. 16A are bent, as seen from the oblique top surface side.

[0052] FIG. 17A is an example of a plan view showing a detailed structure of a heat sink included in the heat dissipation component shown in FIG. 16A .

[0053] FIG. 17B is an example of a top view of the heat sink after being bent along the fold line FD in FIG. 17A .

[0054] FIG. 18 is an example of a perspective view showing a schematic structure of a sensor FPC included in the imaging device according to the third embodiment.

[0055] FIG. 19A is an example of a rear view of the imaging device according to the third embodiment.

[0056] FIG. 19B is an example of an explanatory diagram of a structure for reducing a bending load in the sensor FPC shown in FIG. 18 .

[0057] FIG. 19C is another example of an explanatory diagram of a structure for reducing a bending load in the sensor FPC shown in FIG. 18 . [Specific implementation method]

[0058] Hereinafter, some embodiments of the present invention will be described with reference to the accompanying drawings. The accompanying drawings are only for easy understanding of the present invention and are not intended to limit the scope of the invention. In the accompanying drawings, the same reference symbols are marked for the same or corresponding elements and components, and their repeated descriptions are appropriately omitted. In addition, for the convenience of explanation, the shapes and sizes of the components in the drawings may sometimes be appropriately enlarged, reduced, or omitted, which may be inconsistent with the actual scale and ratio. In addition, the use of the word "substantially" is intended to include measurement errors.

[0059] In addition, the terms "first", "second", etc. used below are merely identification symbols used to distinguish identical or corresponding components, and identical or corresponding components are not limited by the terms "first", "second", etc.

[0060] In addition, the so-called combination, from the perspective of the contact relationship between the various constituent elements, does not only refer to the situation where the various constituent elements are in direct physical contact, but also includes the situation where there are other structures between the various constituent elements and the various constituent elements are in contact through the other structures.

[0061] In the following description, the direction along the optical axis of the imaging device's optical system 22 is referred to as the Z direction, a direction perpendicular to the Z direction is referred to as the X direction, and a direction perpendicular to both the Z and Y directions is referred to as the Y direction. The Z direction corresponds to, for example, the first direction defined in the claims, and the X and Y directions correspond to, for example, the second and third directions defined in the claims, respectively. Furthermore, the +Z side is sometimes referred to as the "upper side" or "top surface," the -Z side as the "lower side" or "back side," the +X side as the "right side," and the +Y side as the "front side."

[0062] (1) First embodiment

[0063] Figure 1 illustrates an example of a schematic shape of a mobile object equipped with an imaging device according to some embodiments of the present disclosure. Figure 1 shows a UAV 1 as an example of a mobile object. UAV 1 is an example of a mobile object propelled by thrust. The concept of a mobile object includes not only UAVs but also other aircraft traveling in the air, vehicles traveling on the ground, and ships traveling on water.

[0064] UAV1 includes multiple rotors for generating thrust. UAV1 is flown by controlling the rotation of the multiple rotors. UAV1 can fly using, for example, four rotors. However, the number of rotors is not limited to four. Alternatively, UAV1 may be a fixed-wing aircraft without rotors.

[0065] UAV 1 is equipped with multiple cameras. Figure 1 shows camera 10 mounted via gimbal 8. Camera 10 is, for example, a high-magnification telephoto camera. Gimbal 8 uses three-axis control to suppress vibration transmission from the aircraft, but this cannot be completely suppressed. Conventional cameras can produce motion jitter of approximately 100 Hz to 150 Hz.

[0066] Figure 2 is a schematic cross-sectional view of an imaging device 10 according to the first embodiment. The imaging device 10 includes a lens unit 20, which includes an optical system 22 comprising at least one lens and receives light from a subject; and an imaging unit 100, which generates image data based on an image of the subject formed by the lens unit 20. The lens unit 20 and the imaging unit 100 may be integrally formed, or the lens unit 20 may be configured as a removable, interchangeable unit that can be attached to and detached from the imaging unit 100.

[0067] The camera unit 100 includes a housing 80 , a vibration reduction mechanism 50 housed in the housing 80 , an image sensor 30 , and a driving mechanism 60 .

[0068] Figure 3 is an example of a simplified perspective view of the exterior appearance of the housing 80. The housing 80 has a hollow rectangular parallelepiped shape with a generally rectangular opening in the center for transmitting light from the subject incident from the Z direction. The housing 80 includes a top plate 42 disposed on the top surface, a bottom plate 44 (not shown) disposed on the bottom surface, side plates 46a to 46d disposed on the outer circumference, and inner plates 48a to 48d disposed on the inner circumference of the opening. The image sensor 30 is disposed below the bottom plate 44. Metal plates 52a to 52d are disposed above the side plate 46d on the circumference of the top plate 42. The ends of the metal plates 52a to 52d are exposed as electrodes in Figure 3. Metal plates 54a to 54d are disposed below the side plate 46d (see Figure 6). At each corner of the top plate 42, welds 40a to 40d are formed between the suspension wires 56a to 56d, which are characteristic of this embodiment, and the top plate 42.

[0069] FIG4 shows a cross-sectional view of the corner portion along the cutting line AA in FIG3 . As representatively shown in FIG4 , suspension wire 56a is connected to metal plates 52a and 64d, which are arranged vertically opposite each other in a direction parallel to the optical axis. The upper metal plate 52a is fixed to the top plate 42. The lower metal plate 54d is fixed to a portion of the coil slider 72a.

[0070] By adopting a structure in which the upper and lower metal plates are connected by suspension wires 56a-56d, it is possible to meet the requirement for high rigidity while forming the upper and lower metal plates 52a-52d and 54a-54d in a limited and narrow area. Furthermore, it is possible to prevent the suspension wires 56a-56d from being bent by the impact of a falling moving object. In this embodiment, the suspension wires 56a-56d correspond to, for example, the "connecting member" described in the claims.

[0071] Figure 5 is an example of a three-dimensional view showing the overall structure of upper and lower metal plates 52a to 52d, 54a to 54d, and suspension wires 56a to 56d. Figure 6 is an example of a three-dimensional view showing the structure of Figure 5 in an upside-down manner. Metal plates 52a and 52d are composed of a base portion serving as an electrode and a head portion, the shape of which corresponds to the corners of top plate 42. Metal plates 52b and 52c are composed of a base portion serving as an electrode, a head portion, the shape of which corresponds to the corners of top plate 42, and a strip portion extending from the base portion to the head portion.

[0072] Coils 62a-62d are placed in the space between upper and lower metal plates 52a-52d, 54a-54d. Magnets MUa1-MUd1, MUa2-MUd2, and magnets MLa1-MLd1, MLa2-MLd2 are placed above and below each coil, sandwiching the coils 62a-62d (see Figure 7). Magnetic yokes 68a-68d are provided to cover the coils 62a-62d, the upper and lower pairs of magnets MUa1-MUd1, MUa2-MUd2, MLa1-MLd1, MLa2-MLd2, and the coil sliders 72 (see Figure 8) described below. The upper and lower surfaces of the yokes are fixed to the metal plates 52a-52d, 54a-54d, respectively.

[0073] Figure 7 is an example of a three-dimensional view of the configuration of Figure 5 excluding yokes 68a to 68d. In this embodiment, two magnets are provided in the upper section and two magnets are provided in the lower section, corresponding to each coil. Each magnet is arranged adjacent to another in a plane parallel to a plane perpendicular to the optical axis. The two magnets in the upper section (e.g., MUa1 and MUa2) have the same polarity, while the two magnets in the lower section (e.g., MLa1 and MLa2) have the same polarity but opposite polarity to the upper magnets. The magnets are fixed to the yoke. For example, the two magnets in the upper section (e.g., MUa1 and MUa2) are fixed to the upper lower surface of the yoke (e.g., 68a), while the two magnets in the lower section (e.g., MLa1 and MLa2) are fixed to the lower upper surface of the yoke (e.g., 68a). This provides a gap between the upper and lower magnets, allowing the coils to move.

[0074] Figure 8 is an example of a perspective view of the configuration shown in Figure 6 , including a coil slider 72. The outer walls of the yokes are omitted. The coil slider 72 secures the coils. When current flows through the coils 62a to 62d, as described in detail below, the coil slider 72 moves in two directions (X and Y) perpendicular to the optical axis (Z) and mutually perpendicular to each other, driving the image sensor 30 via the coil slider 72. In this embodiment, the coils 62a to 62d and the magnets MUa1 to MUd1, MUa2 to MUd2, MLa1 to MLd1, and MLa2 to MLd2 correspond to, for example, a coil-type actuator. This also applies to the second and third embodiments described below.

[0075] In the past, closed-loop control was used, that is, a position detection device was set near the coil, and the position detection device was used for feedback. This closed-loop control can control low-frequency vibrations of about 1Hz to about 15Hz, but it cannot promptly control high-frequency vibrations such as 100Hz to 150Hz. Low-frequency vibrations are used, for example, in the previous shake correction devices used in handheld cameras, and high-frequency vibrations are caused by the body vibrations of mobile objects such as drones like the present invention. In particular, when using high-resolution camera elements, the magnification of the lens has a greater impact. Therefore, in this embodiment, a position detection device is not used, but a large-sized magnet is arranged to enhance the magnetic force, thereby realizing the BIS (Body Image Stabilizer) function of open-loop control that can accurately drive the metal plate fixed by resin molding with micron precision. The large-sized magnet extends to the area where the position detection device was set in the previous technology.

[0076] Figure 9 is an example diagram illustrating the current path used to drive the coil-type actuator of this embodiment. A coil FPC 70 is provided above the metal plates 54a to 54d to supply power to each coil. In the disclosed embodiment, the coil FPC 70 corresponds to, for example, the "first wiring substrate" defined in the claims.

[0077] In this embodiment, there are two current paths, and these two current paths are wired separately. In FIG9 , a solid line and numbers in parentheses indicate (a first wiring path), and a dashed line and numbers in parentheses indicate (a second wiring path).

[0078] In more detail, the first wiring path is a path starting from the base (1) of the metal plate 52a, passing through the head (2) corresponding to the corner → the suspension wire 56a (3) → the first wiring (4) on the metal plate 54a (4) → the coil 62a → the second wiring (5) to (6) on the metal plate 54a (4) → the wiring (7) (dashed line part) on the back side of each metal plate 54b and 54c → the wiring (8) and (9) of the coil FPC70 on the metal plate 54c → the coil 62c → the wiring (10) of the coil FPC70 → the metal plate 54c (11) → the suspension wire 56c → the head (12) of the metal plate 52c → the base (13) of the metal plate 52c.

[0079] The second wiring path starts from the base of the metal plate 52b, passes through the head → suspension wire 56b → metal plate 54c → coil FPC70 → coil 62b → coil FPC70 → wiring around the rectangular opening on the coil FPC70 → coil 62d → coil FPC70 → metal plate 54d → suspension wire 56d → head of the metal plate 52d → base of the metal plate 52d.

[0080] By flowing current through the first and second wiring paths, the image sensor 30 moves in the ±Y directions. By wiring each pair of actuators spaced relative to the opening, opening control is achieved. Alternatively, the electrical wiring from metal plates 54a to 54c can be collectively represented as the first wiring, while the electrical wiring from metal plates 54b to 54d can be collectively represented as the second wiring. In this embodiment, metal plates 54a to 54d correspond to, for example, the "wiring plate" defined in the claims.

[0081] According to this embodiment, a camera device 10 is provided, which includes a vibration reduction mechanism. The vibration reduction mechanism is formed by fixing upper and lower metal plates respectively formed of resin on a housing to the corners of the housing using suspension wires. The space of the position detection device used in the previous closed-loop control is replaced with a magnet space, and the relatively arranged coils are connected to achieve open control. Therefore, the camera element can be driven with high precision, for example, a precision of several microns, ensuring a resonant frequency of more than 1,000 Hz.

[0082] (2) Second embodiment

[0083] In the above embodiment, the vibration damping mechanism is formed by connecting and fixing the upper and lower metal plates with suspension wires, and the current path is realized by the metal plates, suspension wires and coil FPC, but it is not limited to the above form. For example, the vibration damping mechanism and current path can also be realized by leaf springs and balls.

[0084] FIG10A is an example of a perspective view showing the main part of the imaging device 110 configured in this aspect, and FIG10B is an example of a simplified cross-sectional view along the cutting line BB in FIG10A .

[0085] In the imaging device 110 of this embodiment, a plurality of, at least three, balls 90 are provided between the rear side of the housing 80 and the coil slider 72. Leaf springs 82a to 82d are also provided on the coil slider 72. The remaining configuration is substantially the same as that of the imaging device 10 described above.

[0086] The leaf springs 82a to 82d each have an folded shape, that is, a highly rigid strip of metal plate housed within the top plate 42 around the corners of the housing 80. The contact portions of the leaf springs 82a to 82d and the coil slider 72 are fixed with adhesive or the like.

[0087] Fig. 11 is an example of a diagram illustrating an arrangement position of the balls 90. The balls 90 are sandwiched between the coil slider 72 and the leaf springs 82a to 82d, thereby being fixed.

[0088] An example of a method of connecting the fixed portion, which is a main part of the vibration suppression structure, and the driving structure using balls 90 will be described with reference to FIG. 12 .

[0089] Surfaces for ball rolling are pre-set at both the fixed portion and the drive mechanism. After placing ball 90 on these surfaces, the coil slider 72 is aligned so that it abuts against ball 90. Then, the leaf springs 82a to 82d are pressed with a force at least twice the weight of the drive mechanism. This allows the ball 90 to be sandwiched between the fixed portion and the drive mechanism, creating a connection.

[0090] By configuring the vibration suppression structure in this manner, a vibration reduction mechanism is realized similarly to the first embodiment, which ensures a resonance frequency of 1,000 Hz or higher and prevents the optical axis from tilting in the drive mechanism even if the leaf springs 82 a to 82 d are deformed.

[0091] The wiring connection between the leaf spring and the coil will be described with reference to FIG. 13 .

[0092] First, regarding the first wiring, the connection is carried out in the following manner: the outer electrode portion (+X) of the leaf spring 82b → the inner front end portion (1) of the leaf spring 82b → the -Y side end portion (2) of the coil 62b → the +Y side end portion (3) of the coil 62d → the -Y side end portion (4) of the coil 62d → the +Y side end portion (5) of the coil 62d → the inner front end portion (6) of the leaf spring 82d → the outer electrode portion (X-) of the leaf spring 82d.

[0093] Similarly, regarding the second wiring, the connection can be made in the following manner: the outer electrode portion (+Y) of the leaf spring 82a → the inner front end portion (7) of the leaf spring 82a → the -X side end portion (8) of the coil 62a → the +X side end portion (9) of the coil 62c → the -X side end portion (10) of the coil 62c → the +X side end portion (11) of the coil 62c → the inner front end portion (12) of the leaf spring 82c → the outer electrode portion (Y-) of the leaf spring 82c.

[0094] By wiring in this manner, the pairs of coils spaced apart from each other with respect to the opening are connected to form a VCM structure.

[0095] This embodiment also employs a VCM structure, using leaf springs 82 instead of metal plates to connect the coils spaced relative to the opening. This ensures a resonant frequency of the drive structure above 1,000 Hz. Furthermore, the use of ultra-rigid leaf springs suppresses deformation in a plane perpendicular to the optical axis. Furthermore, since the vibration damping mechanism is connected to the drive structure via balls 90, tilting of the drive structure's optical axis due to leaf spring deformation is prevented.

[0096] (3) Third embodiment

[0097] As described in the first and second embodiments, the imaging device of the present disclosure can ensure that the resonance frequency of the drive structure is 1,000 Hz or higher by using the open-controlled VCM structure. However, depending on the layout of connection components such as the wiring substrate, a jelly effect may sometimes occur.

[0098] For example, a heat sink is provided on the back side, connected to the sensor FPC extending in the +X direction and also extending in the -X direction. In this case, the image sensor 30 is sufficiently resistant to vibration in the X direction. However, if the drive structure drives the image sensor 30 in the Y direction, a rolling shutter effect occurs in opposite directions, with the axis DR1 parallel to the Y direction, as shown in the back-side perspective view of FIG14 . This rolling shutter effect is primarily composed of rolling shutter effect R2 in the image sensor 30 due to deformation of the sensor FPC and rolling shutter effect R1 in the image sensor 30 due to deformation of the heat sink.

[0099] Therefore, the imaging device 105 of this embodiment includes a first connecting member and a second connecting member. The first connecting member and the second connecting member have different functions for offsetting and reducing the rolling shutter effect caused by the deformation reaction force, which is the force exerted on the driving structure when the image sensor 30 is driven in the Y direction. The rest of the configuration of the imaging device 105 of this embodiment is substantially the same as that of the first embodiment.

[0100] 14 is an example of a perspective view of the imaging device 105 according to the third embodiment as viewed from the rear side, and FIG. 15 is an example of a partial front view of the imaging device 105 as viewed from the +Y direction shown in FIG. 14 .

[0101] In this embodiment, a heat dissipation member and a sensor FPC 182 are used as the first connection member and the second connection member. First, the heat dissipation member will be described with reference to FIG15 to FIG17B.

[0102] FIG16A is an example of a perspective view of a heat dissipation component viewed from an oblique inner side. In this embodiment, the heat dissipation unit includes a heat sink 126 and heat sink 122. Heat sink 122 performs a heat dissipation function by transferring heat generated by image sensor 30 to heat sink 126, as shown in the perspective view of FIG16B .

[0103] As shown in Figures 15 and 16C, the heat sink 122 in this embodiment is folded once in the direction parallel to the Y direction in the area between its two ends, and the upper surface side including one end is fixed on the heat sink 126, and the lower surface side including the other end is fixed on the back of the image sensor 30.

[0104] Figures 17A and 17B are examples of top views illustrating the detailed structure of the heat sink 122. For example, as shown in Figure 17A , a fold FD is provided in a direction (Y direction) perpendicular to the direction (X direction) in which the heat sink 122 extends, and the heat sink 122 is bent along this fold FD. At least one slit SL is provided in the heat sink 122 along a direction intersecting the fold FD. In the example shown in Figure 17A , three slits SL1 to SL3 are provided. The presence of these slits SL provides elasticity in the Y direction, which is the driving direction of the drive mechanism. This allows the heat sink 122 to mitigate the jelly effect caused by the deformation reaction force R1 of the heat sink 122. Figure 17B shows an example of a top view of the heat sink 122 after being bent along the fold FD. The area of ​​the heat sink 122 where the slits FL1 to FL3 are provided constitutes the deformable portion, and the two ends located to the left and right of the deformable portion constitute the attachment portion between the image sensor 30 and the heat sink 126.

[0105] FIG. 18 is an example of a perspective view showing a schematic structure of the sensor FPC 182 , and FIG. 19A is an example of a rear view of the imaging device 105 . The sensor FPC182 includes: an electrode portion 182a, which is connected to an external power supply on the outside of the shell 80; branch portions 182b and 182c, which are divided into two branches from the electrode portion 182a and extend to the space SP1 between the side plate 46d of the shell 80 and the driving structure 60; a bending portion 182d, which extends from the end portions of the branch portions 182b and 182c toward the top surface side in the space SP1, and extends toward the corners at both ends of the side plate 46d, bends in the space SP2 between the side plates 46b and 46c of the shell 80 and the driving structure 60, enters the shell 80, and then extends again toward the driving structure 60 on the top surface side; and a connecting portion 182e, which extends on the image sensor 30 in connection with the bending portion 182d, is connected to the image sensor 30 and supplies power from the external power supply to the image sensor 30.

[0106] As such, the sensor FPC 182 is configured to extend from the outside of the housing 80 into the housing 80, passing through the bend 182d and extending over the image sensor. Therefore, the sensor FPC 182 itself can mitigate the rolling shutter effect caused by the deformation reaction force R2 of the sensor FPC 182. Furthermore, because the deformation reaction force R1 of the heat sink 122 and the deformation reaction force R2 of the sensor FPC 182 act in opposite directions, they can cancel each other out, thereby eliminating the rolling shutter effect caused by the drive structure driving the image sensor 30 in the Y direction.

[0107] Here, the sensor FPC 182 has a shielding structure that can suppress electromagnetic wave radiation while controlling its own deformation load. This will be described in detail with reference to Figures 18 to 19C.

[0108] As shown in Figure 18, the bending portion 182d of the sensor FPC182 has: external shielding parts 134a and 134b, which extend from near the center of the side plate 46d of the shell 80 in the branch parts 182b and 182c, extend along the ±Y direction and extend around the adjacent corners; and a non-shielding part 132, which is connected to the external shielding parts 134a and 134b, and extends in the shell 80 along each side plate 46a, 46c, and 46d in space SP2 and space SP1.

[0109] Furthermore, the imaging device 105 of the present embodiment further includes an inner shielding plate 130 that is disposed between the non-shielding member 132 and the driving mechanism 60 in the spaces SP1 and SP2 and is covered with a shielding material.

[0110] Because non-shielding member 132 lacks shielding material, it is thin and easily bendable. Therefore, as shown in Figure 19B , X-direction component 132b of non-shielding member 132 bends slightly when drive mechanism 60 is driven in the Y direction. As shown in Figure 19C , Y-direction component 132a also bends slightly when drive mechanism 60 is driven in the X direction. This reduces the bending load on FPC 182 within spaces SP1 and SP2. In this embodiment, spaces SP1 and SP2 correspond, for example, to the first and second spaces defined in the claims, respectively.

[0111] Furthermore, the outer shielding members 134a and 134b are arranged at a distance from the inner shield plate 130 that does not interfere with the bending movement of the FPC 182 itself, thereby suppressing electromagnetic wave radiation while controlling the deformation load of the FPC.

[0112] Because the outer shielding components 134a and 134b are covered with shielding material within the housing 80, the sensor FPC is relatively thick and difficult to bend. Meanwhile, the sensor FPC 182 must bend to accommodate the operation of the drive mechanism 60. Therefore, removing the shielding within the housing 80 to form the non-shielding component 132 reduces the thickness of the sensor FPC 182 and makes it easier to bend. However, simply removing the shielding does not shield the image sensor 30 from the magnetic field. Therefore, an inner shielding plate 130 is provided between the image sensor 30 and the sensor FPC 182 within the housing 80.

[0113] According to this embodiment, heat sink 122 and sensor FPC 182 are arranged to extend in the X direction perpendicular to the optical axis, and each is configured to bend along the Y direction. This can suppress the rolling shutter effect caused by deformation of these components. In this embodiment, sensor FPC 182 corresponds to, for example, the "second wiring substrate" defined in the claims.

[0114] In addition, a non-shielding component 132 that is easy to bend is provided in the space between the shell 80 and the driving structure 60 to reduce the overall bending load of the sensor FPC 182. On the other hand, external shielding components 134a and 134b that are not easy to bend are arranged on the outside of the shell 80, and an internal shielding plate 130 is arranged on the inside of the shell 80. In this way, an FPC storage structure can be realized to ensure that the image sensor 30 is fully shielded from the magnetic field.

[0115] (4) Moving body

[0116] As representatively shown in Figure 1 , the imaging apparatus of some of the above embodiments can be mounted on a mobile body via a support member such as a pan / tilt head. This provides a mobile body capable of capturing images with high-precision motion-shake suppression.

[0117] The mobile object is not limited to the UAV 1 shown in FIG1 , and may also be, for example, an unmanned ground vehicle or a ground remote-controlled robot. In some embodiments, a mobile object consistent with the embodiments of the present disclosure may be used to perform various tasks in at least one of the following fields, such as power line monitoring, communications, meteorology, agriculture, oceanography, exploration, photography, disaster prevention and mitigation, crop forecasting, anti-smuggling, border protection, security defense, and counter-terrorism.

[0118] The embodiments described above are provided for illustration and purpose. The description is not intended to be exhaustive, nor is it intended to limit the embodiments of the present invention to the precise forms disclosed. Modifications and variations may be made according to the above teachings, or various embodiments may be implemented.

[0119] For example, in the above embodiment, metal plates 54a to 54d are listed as wiring boards for supplying power to the coils, but the wiring boards are not limited thereto, and any wiring board can be used as long as it has a certain resistance to vibration and is conductive or can form conductive wiring on the surface.

[0120] Furthermore, while an example of using four suspension wires as connecting members is provided, this is not limited to four and five or more may be used. Furthermore, an example of providing two magnets in each of the upper and lower segments of each coil is provided, but this is not a limitation. Depending on the magnetic strength of the magnets used, two magnets may be provided for each coil, one for each segment, or more magnets may be provided.

[0121] Furthermore, in the third embodiment, an example is given of providing a first connecting component and a second connecting component on the back side of the camera device of the first embodiment to offset the jelly effect that may be caused by the deformation reaction force, but it is not limited to this and can also be provided on the back side of the camera device of the second embodiment.

[0122] The embodiments discussed in this specification are selected to illustrate the principles and properties of the various embodiments and their practical applications, so that those skilled in the art can apply the present invention in various modifications and embodiments suitable for specific applications. The features of the embodiments described in this specification can be composed of all possible combinations of methods, devices, modules, and systems.

[0123] Reference numerals

[0124] 1: UAV (mobile vehicle)

[0125] 8: PTZ

[0126] 10, 105, 110: Camera device

[0127] 20: Lens unit

[0128] 22: Optical system

[0129] 30: Image sensor

[0130] 40a~40d:Welding points

[0131] 42: Top plate

[0132] 44: Base plate

[0133] 46a~46d:Side panels

[0134] 48a~48d: Inner plate

[0135] 50: Vibration reduction mechanism

[0136] 52a to 52d: Metal plates (wiring boards)

[0137] 102, 202, 302: Beam scanner

[0138] 54a~54d:Metal plate

[0139] 56a~56d: hanging line

[0140] 60: Drive structure

[0141] 62a~62d:coil

[0142] 68a~68d:Yoke

[0143] 70: Coil FPC (first wiring substrate)

[0144] 72: Coil slider

[0145] 80: Shell

[0146] 82a~82d:Leaf spring

[0147] 90: Ball

[0148] 100: Camera unit

[0149] 122: These heat sinks

[0150] 126: Radiator

[0151] 130: Inner shield plate

[0152] 132: Unshielded components

[0153] 134a, 134b: outer shielding components

[0154] 182: Sensor FPC (second wiring substrate)

[0155] 182a: Electrode

[0156] 182b, 182c: Branch

[0157] FD: Crease

[0158] FL1~FL3:Slit

[0159] MUa1~MUd1、MUa2~MUd2:Magnet (upper section)

[0160] MLa1~MLd1、MLa2~MLd2:Magnet (lower section)

[0161] R1, R2: Jello effect

[0162] SP1: (First) Space

[0163] SP2: (Second) Space

Claims

1. A camera device, characterized in that: include: an optical system comprising at least one lens; An image sensor receives light from a subject via the optical system and generates a signal of an image of the subject; a housing having an opening for incident light from the subject, wherein the image sensor is located on the back side of the housing; as well as A vibration reduction mechanism for suppressing the influence of external vibration on the image sensor; Wherein, the vibration reduction mechanism comprises: a vibration suppression structure disposed within the housing; and A driving structure, the driving structure comprising two pairs of coil-type actuators, the two pairs of coil-type actuators being located in the vibration suppression structure, and each pair of coil-type actuators being arranged at a relative interval relative to the opening; Each pair of the coil-type actuators is electrically connected to drive the image sensor in a direction capable of offsetting the vibration of the image sensor.

2. The camera device according to claim 1, characterized in that in, The vibration suppression structure is also used to provide a current path from the image sensor to the coil actuator.

3. The imaging device according to claim 1 or 2, characterized in that: in, The vibration suppression structure further comprises: a plurality of wiring boards, the plurality of wiring boards being stacked along a first direction to sandwich the coil-type actuator therebetween, wherein the first direction is a direction along an optical axis of the optical system; a connection portion connected to the wiring board in the first direction; and A first wiring substrate is provided on the wiring board on the back side and is used to form a current path leading to the actuator.

4. The imaging device according to claim 1, wherein: in, The actuator comprises: A coil, which is arranged in a second direction and a third direction respectively perpendicular to the first direction, and the coil is arranged relatively spaced relative to the opening; magnets stacked in the first direction to sandwich the coils therebetween; and A yoke is configured to cover the magnet and the coil.

5. The imaging device according to claim 4, characterized in that: in, The coil is formed of a hollow frame having an elongated elliptical planar shape, and the magnet can cover areas of both ends of the hollow frame except for arc portions.

6. The imaging device according to claim 3, wherein: in, The housing is substantially a rectangular parallelepiped, and the connecting component includes a suspension wire, which is arranged at a corner of the rectangular parallelepiped.

7. The imaging device according to claim 3, characterized in that: in, The suspension wire is connected to the wiring board by welding.

8. The camera device according to claim 3, characterized in that: in, The shell is roughly a cuboid, and each corner of the cuboid is also provided with a coil slider connected to the coil; The housing includes a top plate on the subject side, a bottom plate on the back side, and side plates located on the outer peripheral surface of the cuboid; The wiring board located on one side of the top plate is integrally formed with the top plate of the housing; The wiring board located on the back side is integrally formed with the coil slider.

9. The imaging device according to claim 1, wherein: in, The actuator comprises: Coils are arranged in a second direction and a third direction respectively perpendicular to the first direction, and the coils are arranged relatively spaced apart; magnets stacked in the first direction to sandwich the coils therebetween; and A coil slider, which is used to fix each of the coils, The vibration suppression structure further comprises: a plurality of balls disposed between the coil sliders and the housing; and A leaf spring is arranged on the coil slider.

10. The camera device according to claim 1, characterized in that: in, It also includes a plurality of connecting components, which include a first connecting component connected to the driving structure and a second connecting component connected to the image sensor, and have different functions. The plurality of connecting components are used to offset and reduce the jelly effect.

11. The imaging device according to claim 10, wherein: in, The first connecting component includes a heat dissipation component, and the heat dissipation component includes a heat sink. One end of the heat sink is fixed to the heat sink, and the one end is one of two ends in a second direction perpendicular to a first direction along the optical axis of the optical system. The other end of the heat sink is fixed to the driving structure, and a region between the two ends is provided with at least one slit extending along the second direction, and the slit is bent in the middle.

12. The imaging device according to claim 10, wherein: in, The housing is roughly a cuboid, and includes a top plate on the subject side, a bottom plate on the back side, and first to fourth side plates arranged on the outer peripheral surface of the cuboid. A first space is provided between the first side plate and the driving structure, and a second space is provided between the third side plate and the fourth side plate and the driving structure. The second connection member includes a second wiring substrate, the second wiring substrate extending in a second direction perpendicular to the first direction along the optical axis of the optical system. The second wiring substrate comprises: an electrode portion, which is located on the outer side of the first side plate; a bending portion connected to the electrode portion and extending toward the driving structure side, bending toward the top plate side once in the first space and the second space and then bending toward the bottom plate side again; and A connecting portion is connected to the bending portion and extends toward the driving structure to supply power to the image sensor.

13. The imaging device according to claim 12, wherein: in, The electrode portion is branched into a plurality of parts in a region between both ends in a third direction perpendicular to the first direction and the second direction.

14. The imaging device according to claim 12, wherein: in, An inner shielding component is further included, and the inner shielding component is configured to cover the vibration reduction mechanism in the first space and the second space.

15. The imaging device according to claim 12, wherein: in, The electrode portion is covered by a shielding material.

16. The imaging device according to claim 12, wherein: in, The bending portion comprises: an outer shielding member extending from an end of the electrode portion, extending in a third direction perpendicular to the first direction and the second direction, and extending around adjacent corners; and A non-shielding component is connected to the outer shielding component and extends in the second space and the first space along the third side plate, the fourth side plate and the first side plate in the housing.

17. A heat dissipation structure, provided in the camera device according to any one of claims 11 to 16, characterized in that: One end of the heat dissipation structure is fixed to the heat sink, and the other end is connected to the image sensor and is used to dissipate heat from the camera device to the heat sink. After being folded once, it is fixed to the opposite surface between the image sensor and the radiator. In the deformation area except the fixed surface with the image sensor and the radiator, the heat dissipation structure is provided with at least one slit along the folding direction.

18. A wiring substrate containing structure, which is arranged on the camera device according to any one of claims 11 to 16, characterized in that: The housing includes a top plate on the subject side, a bottom plate on the back side, and first to fourth side plates arranged on the outer peripheral surface of the cuboid. A first space is provided between the first side plate and the driving structure, and a second space is provided between the third side plate and the fourth side plate and the driving structure. The non-shielding member is configured to extend from the first space to a corner of the second space, The shielding component is configured to extend from the first space to the second space between the non-shielding component and the image sensor, and its two ends are bent to cover the corners of the first side plate and the third side plate and the corners of the first side plate and the fourth side plate.

19. The camera device according to claim 1, characterized in that: The shell is substantially a cube, and the opening is substantially a rectangle.

20. The camera device according to claim 1, characterized in that: Each pair of said actuators is electrically connected.

21. A mobile object comprising the imaging device according to any one of claims 11 to 19.

Images