Continuous polishing and continuous plating method and continuous polishing and continuous plating production line for silver-plated copper wire

Abstract

The invention is suitable for the technical field of silver-plated copper wire processing, and particularly relates to a continuous polishing and continuous plating method for a silver-plated copper wire and a continuous polishing and continuous plating production line, the method is applied to the continuous polishing and continuous plating production line, and the method comprises the steps that a first electroplating parameter is obtained; after the first copper wire output by the polishing device is conveyed into a micro-electrolysis area at the conveying speed, detection information is obtained; determining surface condition information of the first copper wire based on the detection information and the transmission speed; determining a second electroplating parameter based on the surface condition information, the first electroplating parameter and the detection information; after it is detected that the second copper wire output by the micro-electrolysis area enters the electroplating area at the transmission speed, electroplating the second copper wire based on the first electroplating parameter or the second electroplating parameter; wherein the second copper wire refers to the first copper wire passing through the micro-electrolysis area. According to the continuous polishing and continuous plating method for the silver-plated copper wire, the efficiency of the edge polishing degree of the silver-plated copper wire and the plating layer quality can be improved.

Description

Technical Field

[0001] This application belongs to the field of silver-plated copper wire processing technology, and particularly relates to a continuous polishing and plating method and production line for silver-plated copper wire. Background Technology

[0002] Continuous polishing and plating of silver-plated copper wire refers to a processing technology that integrates the surface polishing of copper wire with the silver plating process through an automated production line, completing the process seamlessly and without interruption. Most existing continuous polishing and plating processes still employ a step-by-step approach: polishing first, then straightening, then winding, and finally electroplating. This involves first offline polishing of the copper wire to remove surface oxide and impurities; then straightening to correct the straightness of the wire; followed by winding to complete the polishing process loop; and finally, the wound wire is re-laid out and transferred to the electroplating unit for silver deposition, ultimately forming a silver-plated copper wire product.

[0003] In related technologies, during the winding, transfer, and secondary unwinding processes of polished copper wires, cross-entanglement and mutual friction can easily occur between the wires. This can cause new scratches, wear, or oil contamination on the already clean surface, directly affecting the uniformity and adhesion of the silver layer deposition during subsequent electroplating. This reduces plating precision and product yield. Furthermore, during winding, transfer, and secondary unwinding, a very thin oxide film or organic adsorption layer can easily form on the copper wire surface. Conventional image inspection methods cannot effectively detect the different surface conditions of the copper wire. The very thin oxide film can severely hinder the deposition of silver atoms in the early stages of electroplating, leading to insufficient adhesion between the plating layer and the copper wire, ultimately resulting in plating peeling and other problems, reducing plating precision and product yield. Even with the addition of an activation treatment step, production costs will increase, and the additional activation treatment step may weaken the adhesion between the silver layer and the copper substrate, ultimately reducing the production efficiency and plating quality of silver-plated copper wire. Summary of the Invention

[0004] This application provides a continuous polishing and plating method and production line for silver-plated copper wire, which can improve the current problems of low production efficiency and low plating quality of silver-plated copper wire during the polishing process.

[0005] In a first aspect, embodiments of this application provide a continuous polishing and plating method for silver-plated copper wire, applied to a continuous polishing and plating production line. The continuous polishing and plating production line includes a straightening device, a take-up device, a polishing device, an electroplating device, and another take-up device arranged sequentially. The electroplating device includes a micro-electrolysis area and an electroplating area. The method: Obtain the first electroplating parameter; wherein the first electroplating parameter is used to reflect the parameters preset for electroplating copper wire; After the first copper wire output by the polishing device is conveyed into the micro-electrolysis region at a transmission speed, detection information is obtained; wherein, the first copper wire refers to the copper wire polished by the polishing device, and the detection information is used to reflect the current response signal generated after the first copper wire enters the micro-electrolysis region. Based on the detection information and the transmission speed, the surface condition information of the first copper wire is determined; wherein, the surface condition information is used to reflect the surface quality condition of the first copper wire. Based on the surface condition information, the first electroplating parameters, and the detection information, a second electroplating parameter is determined; wherein, the second electroplating parameter is used to reflect the parameters after the first electroplating parameter has been adjusted. After detecting that the second copper wire output from the micro-electrolysis region enters the electroplating region at a transmission speed, the second copper wire is electroplated based on the first electroplating parameter or the second electroplating parameter; wherein, the second copper wire refers to the first copper wire after passing through the micro-electrolysis region.

[0006] The technical solutions described in this application embodiment have at least the following technical effects: The continuous polishing and plating method for silver-plated copper wire provided in this application first acquires a first electroplating parameter reflecting a pre-set silver plating operation on the copper wire. Then, after the copper wire polished by the polishing device is transported to the micro-electrolysis area at a transmission speed, detection information reflecting the current response signal generated after the copper wire polished by the polishing device enters the micro-electrolysis area is acquired. Then, based on the detection information and the transmission speed, surface condition information of the surface quality of the copper wire polished by the polishing device is determined. Then, based on the surface condition information, the first electroplating parameter, and the detection information, a second electroplating parameter reflecting the adjusted parameters of the first electroplating parameter is determined. When the second copper wire, which is the first copper wire after passing through the micro-electrolysis area, is detected to enter the electroplating area at a transmission speed, the second copper wire is electroplated according to the first electroplating parameter or the second electroplating parameter.

[0007] This method effectively allows polished copper wires to directly connect to the electroplating process via a micro-electrolysis zone, eliminating the need for wire collection, transfer, and secondary release. This avoids the problems of wire tangling and mutual abrasion inherent in traditional processes, while also reducing the time the copper wires are exposed to air, lowering the risk of secondary oxidation or impurity adhesion. This provides a clean, intact, and undamaged copper substrate surface for silver deposition, ensuring strong adhesion between the silver layer and the copper substrate from the outset. By detecting the current response signal after the copper wire enters the micro-electrolysis zone, the surface quality of the copper wire is converted into quantifiable detection information, replacing traditional offline sampling or manual judgment. This enables continuous, real-time monitoring of the surface condition of each section of copper wire. Based on the production line's transmission speed, surface condition judgment and parameter adjustments are linked, ensuring high synchronization between the entire process—from polishing to micro-electrolysis detection to dynamic electroplating—and the production line rhythm. No downtime for parameter adjustments or offline testing is required, enabling uninterrupted continuous operation. This improves the efficiency of simultaneous polishing and plating, and reduces rework and downtime losses due to product defects through real-time parameter adjustments, enhancing production stability and capacity utilization, ultimately achieving a dual improvement in efficiency and quality.

[0008] In one possible implementation of the first aspect, determining the surface condition information of the first copper wire based on the detection information and the transmission speed includes: Based on the detection information and the transmission speed, a first condition region and a second condition region are determined; wherein, the first condition region is used to reflect the normal area of ​​the surface polishing of the first copper wire, and the second condition region is used to reflect the abnormal area of ​​the surface polishing of the first copper wire. The detection time corresponding to the first condition area and the detection time corresponding to the first condition area are jointly identified as the surface condition information.

[0009] In one possible implementation of the first aspect, determining the first state region and the second state region based on the detection information and the transmission speed includes: Identify multiple zero-crossing points in the detection information; wherein, the zero-crossing point refers to the moment when the transient response signal of the first copper wire decays and crosses its equilibrium potential during the interval of the applied periodic current pulse; A feature data sequence is determined from the detection information based on multiple zero-crossing points; wherein, the feature data sequence is used to characterize the degree of abnormality of the surface state at each point along the copper wire axis; Based on the characteristic data sequence and the transmission speed, the first condition region and the second condition region are determined.

[0010] In one possible implementation of the first aspect, determining the feature data sequence from the detection information based on a plurality of the zero-crossing points includes: Based on multiple zero-crossing points, the fluctuation variance between the i-th zero-crossing point and the (i+1)-th zero-crossing point is determined; wherein, the fluctuation variance is used to characterize the electrical signal fluctuation intensity on the surface of the corresponding copper line segment within the window between adjacent zero-crossing points, and i is a positive integer greater than or equal to 1; Based on the multiple fluctuation variances, the mean square error is determined; wherein, the mean square error is used to reflect the fluctuation level of the copper wire surface state during a stable period; Based on the mean squared error and multiple variances of fluctuation, feature data corresponding to each zero crossing point is determined, and a feature data sequence is determined based on multiple feature data; wherein, the feature data refers to the ratio between the variance of fluctuation and the mean squared error.

[0011] In one possible implementation of the first aspect, determining the mean squared error based on a plurality of said variances of fluctuation includes: By comparing the i-th variance with the (i+1)-th variance among the multiple variances, the i-th difference value is obtained; wherein, the difference value is used to reflect the absolute value of the difference between the i-th variance and the (i+1)-th variance. When the difference between the (i+1)th difference value and the ith difference value is greater than the difference between the ith difference value and the (i-1)th difference value, the average fluctuation variance between the first fluctuation variance and the ith fluctuation variance is taken as the mean squared variance.

[0012] In one possible implementation of the first aspect, determining the first state region and the second state region based on the feature data sequence and the transmission speed includes: Read the feature data in the feature data sequence sequentially; When n consecutive feature data are read and are all greater than or equal to a preset threshold, a first time point is determined from the initial feature data among the n feature data, and a second time point is determined from the last feature data among the nth feature data; wherein, the initial feature data is used to reflect the first feature data among the n feature data, the last feature data refers to the last feature data among the n feature data, the first time point is used to reflect the time corresponding to the data that has the greatest impact on the variance of the initial feature data, and the second time point is used to reflect the time corresponding to the data that has the greatest impact on the variance of the last feature data; The copper wire axial range mapped by the first time point, the second time point, and the transmission speed is determined as the second condition region. The axial section of the copper wire that was not identified as the second condition region is identified as the first condition region.

[0013] In one possible implementation of the first aspect, determining the first time point from the initial feature data among the n feature data and determining the second time point from the last feature data among the nth feature data includes: Based on the initial feature data, a first maximum impact data is determined; wherein, the first maximum impact data is used to reflect the data in the initial feature data that has the greatest impact on the variance of the initial feature data. Based on the end feature data, a second maximum impact data is determined; wherein, the second maximum impact data is used to reflect the data in the end feature data that has the greatest impact on the fluctuation variance of the end feature data; A first time is determined from the initial feature data based on the first maximum impact data, and a second time is determined from the final feature data based on the second maximum impact data.

[0014] In one possible implementation of the first aspect, determining the first maximum impact data based on the initial feature data includes: The initial feature data is traversed, and first data is determined from the initial feature data in traversal order; wherein, the first data is used to reflect any current response signal in the initial feature data; Based on the first data and the initial feature data, a first exclusion variance is determined; wherein, the first exclusion variance is used to reflect the variance of the initial feature data after removing the first data; The ratio between the first eliminated volatility variance and the volatility variance corresponding to the initial feature data is used as the first comparison result; The first data corresponding to the smallest first comparison result is confirmed as the first maximum impact data.

[0015] In one possible implementation of the first aspect, determining the second maximum impact data based on the end feature data includes: Traverse the last feature data and determine the second data from the last feature data in traversal order; wherein the second data is used to reflect any one of the current response signals in the last feature data; Based on the second data and the end feature data, a second removal volatility variance is determined; wherein, the second removal volatility variance is used to reflect the volatility variance in the end feature data after removing the second data; The ratio between the second eliminated volatility variance and the volatility variance corresponding to the end feature data is used as the second comparison result; The second data corresponding to the smallest second comparison result is confirmed as the second most influential data.

[0016] In one possible implementation of the first aspect, determining the second electroplating parameter based on the surface condition information, the first electroplating parameter, and the detection information includes: Based on the comparison between the first condition region and the second condition region in the surface condition information, the condition difference rate corresponding to the detection information in the first condition region and different second condition regions is obtained; wherein, the condition difference rate is used to indicate the ratio between the effective current value of the detection information in the first condition region and the effective current value of the detection information in different second condition regions. The condition difference rate corresponding to different second condition regions is processed with the first electroplating parameter to obtain the second electroplating parameter.

[0017] Secondly, embodiments of this application provide a continuous polishing and plating system for silver-plated copper wire, comprising: An acquisition unit is used to acquire first electroplating parameters; wherein the first electroplating parameters are used to reflect preset parameters for electroplating copper wires. The transmission unit is used to transport the first copper wire output by the polishing device into the micro-electrolysis region at a transmission speed and then acquire detection information; wherein, the first copper wire refers to the copper wire polished by the polishing device, and the detection information is used to reflect the current response signal generated after the first copper wire enters the micro-electrolysis region. A condition confirmation unit is used to determine the surface condition information of the first copper wire based on the detection information and the transmission speed; wherein the surface condition information is used to reflect the surface quality condition of the first copper wire. The parameter analysis unit is used to determine the second electroplating parameter based on the surface condition information, the first electroplating parameter, and the detection information; wherein the second electroplating parameter is used to reflect the parameter after the first electroplating parameter has been adjusted. An electroplating unit is used to detect that the second copper wire output from the micro-electrolysis region enters the electroplating region at a transmission speed, and then electroplats the second copper wire based on the first electroplating parameter or the second electroplating parameter; wherein, the second copper wire refers to the first copper wire after passing through the micro-electrolysis region.

[0018] Thirdly, embodiments of this application provide a continuous polishing and plating production line, including a straightening device, a take-up device, a polishing device, an electroplating device, a take-up device, and a control device arranged sequentially. The straightening device, the take-up device, the polishing device, the electroplating device, and the take-up device are all electrically connected to the control device. The control device includes a memory, a processor, and a computer program stored in the memory and executable on the processor. When the computer program is executed by the processor, it implements the method described in any of the first aspects above.

[0019] Fourthly, embodiments of this application provide a computer-readable storage medium storing a computer program that, when executed by a processor, implements the method described in any of the first aspects above.

[0020] Fifthly, embodiments of this application provide a computer program that, when running on a continuous polishing and plating production line, causes the continuous polishing and plating production line to perform the continuous polishing and plating method for silver-plated copper wire described in any of the first aspects above.

[0021] It is understood that the beneficial effects of the second to fifth aspects mentioned above can be found in the relevant descriptions in the first aspect mentioned above, and will not be repeated here. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic flowchart of a continuous polishing and plating method for silver-plated copper wire provided in an embodiment of this application; Figure 2 This is a schematic diagram illustrating the implementation process of a continuous polishing and plating method for silver-plated copper wire provided in an embodiment of this application; Figure 3 This is a schematic diagram of the structure of a continuous polishing and plating system for silver-plated copper wire provided in an embodiment of this application; Figure 4 This is a schematic diagram of the structure of the control device for a continuous polishing and plating production line provided in one embodiment of this application. Detailed Implementation

[0024] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.

[0025] It should be understood that, when used in this application specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or a collection thereof.

[0026] It should also be understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0027] As used in this application specification and the appended claims, the term "if" may be interpreted, depending on the context, as "when," "once," "in response to determination," or "in response to detection." Similarly, the phrase "if determined" or "if detected [the described condition or event]" may be interpreted, depending on the context, as meaning "once determined," "in response to determination," "once detected [the described condition or event]," or "in response to detection [the described condition or event]."

[0028] Furthermore, in the description of this application and the appended claims, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0029] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0030] In related technologies, during the winding, transfer, and secondary unwinding processes of polished copper wires, cross-entanglement and mutual friction can easily occur between the wires, causing new scratches, wear, or oil contamination on the already clean surface. This directly affects the uniformity and adhesion of the silver layer deposition during subsequent electroplating, thereby reducing plating precision and product yield. Furthermore, during winding, transfer, and secondary unwinding, a very thin oxide film or organic adsorption layer can easily form on the copper wire surface. Conventional image inspection methods cannot effectively detect the different surface conditions of the copper wire, and the very thin oxide film can severely hinder the deposition of silver atoms in the early stages of electroplating. This leads to insufficient adhesion between the electroplated layer and the copper wire, ultimately resulting in problems such as plating peeling, reducing plating precision and product yield. Even with the addition of an activation treatment step, production costs will increase, and the additional activation treatment step may also weaken the adhesion between the silver layer and the copper substrate, ultimately reducing the production efficiency and plating quality of silver-plated copper wire.

[0031] To address the aforementioned problems, this application provides a continuous polishing and plating method for silver-plated copper wire. In this method, firstly, first electroplating parameters reflecting a pre-set silver plating operation on the copper wire are acquired. Then, after the polished copper wire is transported to a micro-electrolysis region at a transmission speed, detection information reflecting the current response signal generated after the polished copper wire enters the micro-electrolysis region is acquired. Surface condition information reflecting the surface quality of the polished copper wire is determined using the detection information and the transmission speed. Second electroplating parameters reflecting the adjusted parameters of the first electroplating parameters are then determined using the surface condition information, the first electroplating parameters, and the detection information. When a second copper wire, representing the first copper wire after passing through the micro-electrolysis region, is detected entering the electroplating region at a transmission speed, electroplating is performed on the second copper wire according to either the first or second electroplating parameters.

[0032] This method effectively allows polished copper wires to directly connect to the electroplating process via a micro-electrolysis zone, eliminating the need for wire collection, transfer, and secondary release. This avoids the problems of wire tangling and mutual abrasion inherent in traditional processes, while also reducing the time the copper wires are exposed to air, lowering the risk of secondary oxidation or impurity adhesion. This provides a clean, intact, and undamaged copper substrate surface for silver deposition, ensuring strong adhesion between the silver layer and the copper substrate from the outset. By detecting the current response signal after the copper wire enters the micro-electrolysis zone, the surface quality of the copper wire is converted into quantifiable detection information, replacing traditional offline sampling or manual judgment. This enables continuous, real-time monitoring of the surface condition of each section of copper wire. Based on the production line's transmission speed, surface condition judgment and parameter adjustments are linked, ensuring high synchronization between the entire process—from polishing to micro-electrolysis detection to dynamic electroplating—and the production line rhythm. No downtime for parameter adjustments or offline testing is required, enabling uninterrupted continuous operation. This improves the efficiency of simultaneous polishing and plating, and reduces rework and downtime losses due to product defects through real-time parameter adjustments, enhancing production stability and capacity utilization, ultimately achieving a dual improvement in efficiency and quality.

[0033] The continuous polishing and plating method for silver-plated copper wire provided in this application embodiment can be applied to a continuous polishing and plating production line. In this case, the continuous polishing and plating production line is the main body for executing the continuous polishing and plating method for silver-plated copper wire provided in this application embodiment. This application embodiment does not impose any restrictions on the specific type of continuous polishing and plating production line.

[0034] The continuous polishing and plating production line includes a straightening device, a take-up device, a polishing device, an electroplating device, a take-up device again, and a control device arranged sequentially. The electroplating device includes a micro-electrolysis area and an electroplating area. These devices are connected sequentially via a transmission mechanism. All four devices—straightening, take-up, polishing, electroplating, and transmission—are electrically connected to the control device. The straightening device includes a straightening roller group, a tension adjustment component, and a limiting guide module. The straightening roller group is symmetrically arranged vertically along the copper wire transmission direction; for example, it can be a carbide straightening roller or a polyurethane-coated straightening roller. The tension adjustment component is linked to the straightening roller group and is used to adjust the tension of the copper wire in real time; for example, it can be a pneumatic tensioner or a tension adjustment wheel driven by a servo motor. The limiting guide module is located at the inlet and outlet of the straightening device to limit the transmission path of the copper wire. The take-up device includes a wire feeding frame and a braking module, with the braking module electrically connected to the wire feeding frame. The wire feeding frame is used for active wire feeding; for example, it can be a cantilever wire feeding frame or a dual-station flip-over wire feeding frame. The braking module is used to adjust the wire feeding resistance. The polishing device is used for pre-treatment polishing of the copper wire surface to remove oxide layers and surface impurities; for example, it can be a diamond wheel polishing head, an ultrasonic vibration polishing device, or a flexible abrasive belt polishing mechanism. The micro-electrolysis area includes a micro-electrolysis tank, electrode assemblies, and a current detection module. The micro-electrolysis tank contains the electrolyte required for micro-electrolysis and has a guide channel adapted to the copper wire transport, allowing the copper wire to pass smoothly through the micro-electrolysis area. The electrode assemblies are located inside the micro-electrolysis tank, symmetrically distributed on both sides of the copper wire transport path, and are used to apply a preset electric field to achieve micro-electrolysis treatment of the copper wire surface; for example, they can be platinum electrodes or ruthenium-plated titanium electrodes, possessing corrosion resistance and stable conductivity. The electroplating area includes an electroplating tank, an electrolyte system, and electrode assemblies. The electroplating tank stores a high-purity silver ion electrolyte. The electrolyte system maintains the uniformity of electrolyte concentration and temperature; for example, it can be a constant-temperature circulating pump or a high-precision concentration sensor module. The electrode assemblies deposit the electrolyte from the electroplating tank onto the surface of the copper wire. The conveying equipment sequentially transports the copper wire to be processed to a straightening device, a take-up device, a polishing device, an electroplating device, and another take-up device. For example, it can be a precision roller conveyor, a synchronous belt drive conveyor, or a servo motor-driven traction conveyor. The control device monitors and controls the entire continuous copper wire polishing and electroplating process. For example, the control device can be a programmable logic controller (PLC) or a distributed control system (DCS).

[0035] To better understand the continuous polishing and plating method for silver-plated copper wire provided in the embodiments of this application, the specific implementation process of the continuous polishing and plating method for silver-plated copper wire provided in the embodiments of this application will be described by way of example below.

[0036] Figure 1 and Figure 2 A schematic flowchart illustrating the continuous polishing and plating method for silver-plated copper wire provided in this application embodiment is shown. Please refer to [link / reference]. Figure 1 and Figure 2 The continuous polishing and plating methods for silver-plated copper wire include: S100, Obtain the first electroplating parameters; wherein, the first electroplating parameters are used to reflect the parameters preset for electroplating copper wires.

[0037] It can be understood that the first electroplating parameter refers to the parameters set in advance for the copper wire electroplating process to guide and control the electroplating operation. Its core function is to ensure that the plating performance of the copper wire after electroplating (such as thickness, adhesion, uniformity, etc.) meets the preset requirements. The first electroplating parameter may specifically include parameters that are directly related to the electroplating effect, such as current density, electroplating time, plating solution temperature, plating solution pH value, and copper wire travel speed.

[0038] For example, the first electroplating parameter can be obtained through manual input. Alternatively, it can be obtained directly from an electroplating parameter database. An electroplating parameter database contains the performance requirements of different plating layers and their corresponding electroplating parameters. This data can be obtained through laboratory experiments, on-site measurements and monitoring, and past experience. After acquisition, the collected data is organized, classified, and archived, useful information and patterns are extracted, and the relevant data is then saved into the database to form the electroplating parameter database.

[0039] S200: After the first copper wire output by the polishing device is conveyed into the micro-electrolysis area at a transmission speed, detection information is obtained; wherein, the first copper wire refers to the copper wire polished by the polishing device, and the detection information is used to reflect the current response signal generated after the first copper wire enters the micro-electrolysis area.

[0040] It can be understood that the first copper wire refers to the copper wire after it has been treated by a polishing device, in which the surface oxide layer, scratches, and impurities have been removed. The detection information refers to the current response signal generated when the first copper wire enters the micro-electrolysis area, due to the electrochemical interaction between the copper wire surface and the micro-electrolysis system. This signal can reflect the surface activity state of the copper wire in real time.

[0041] S300, based on the detection information and transmission speed, determines the surface condition information of the first copper wire; wherein, the surface condition information is used to reflect the surface quality condition of the first copper wire.

[0042] For example, by detecting information and transmission speed, areas of normal and abnormal surface polishing of the first copper wire can be determined. Then, by combining different polished areas with their corresponding detection times, the polished areas combined with the detection times are collectively identified as surface condition information. Alternatively, the detection information and transmission speed can be input into a learning model, which outputs the corresponding surface condition information. The training process of the learning model can use the processed data of the detection information, transmission speed, and corresponding surface condition information as the training dataset, and then input this training dataset into the learning model for training, ultimately obtaining the learning model. And so on, but not limited to these examples.

[0043] In one possible implementation, in step S300, the surface condition information of the first copper wire is determined based on the detection information and the transmission speed, including: S310, based on the detection information and transmission speed, a first condition area and a second condition area are determined; wherein, the first condition area is used to reflect the normal area of ​​the surface polishing of the first copper wire, and the second condition area is used to reflect the abnormal area of ​​the surface polishing of the first copper wire.

[0044] It is understandable that during the transmission of copper wire, slight vibrations or wobbling may occur due to slippage of the traction wheel or misalignment of the guide wheel, resulting in unstable contact between the copper wire and the polishing device. For example, the copper wire may be biased towards one side of the polishing wheel during transmission, leading to over-polishing on that side and under-polishing on the other, thus creating a situation where normal and abnormal areas coexist on the same copper wire. The first condition area refers to the axial section of the first copper wire whose surface polishing quality is determined to meet the preset standard. The second condition area refers to the axial section of the first copper wire whose surface polishing quality is determined to be substandard.

[0045] For example, by analyzing the moment when the transient response signal of the output reflected in the detection information decays and crosses its equilibrium potential during the interval of the applied periodic current pulse, and determining the degree of anomaly characterizing the surface state of each point along the copper wire axis based on multiple such moments, a first condition region and a second condition region can be determined. Alternatively, the detection information and transmission speed can be input into a learning model, which outputs the corresponding first and second condition regions, and so on, but are not limited to these methods.

[0046] In one possible implementation, step S310, determining the first state region and the second state region based on the detection information and transmission speed, includes: S311 identifies multiple zero-crossing points in the detection information; where a zero-crossing point refers to the moment when the transient response signal of the first copper wire decays and crosses its equilibrium potential during the interval of the applied periodic current pulse.

[0047] It is understandable that the number of zero-crossing points, their occurrence intervals, and transient characteristics can indirectly reflect the uniformity of the distribution of active sites on the surface of the first copper wire, the residual state of the oxide layer, and the dynamic stability of the micro-electrolysis reaction. These are key characteristic points for quantifying the surface microstructure.

[0048] S312, determine the feature data sequence from the detection information based on multiple zero-crossing points; wherein, the feature data sequence is used to characterize the degree of abnormality of the surface state at each point along the copper wire axis.

[0049] It can be understood that the feature data sequence refers to a set of data formed by extracting quantitative parameters directly related to the surface state of the copper wire based on multiple zero-crossing points in the detection information and arranging them in order of the axial position of the copper wire. Each data point corresponds to a specific position on the axial direction of the copper wire. The magnitude of the data value is positively correlated with the severity of the surface defect at that position. The larger the value, the more obvious the surface anomaly at that position, and vice versa.

[0050] For example, the electrical signal fluctuation intensity between two adjacent zero-crossing points can be determined using multiple zero-crossing points. This fluctuation intensity can then be used to determine the fluctuation level of the copper wire surface during a stable period. Finally, the characteristic data sequence can be determined by the ratio between the fluctuation level of the copper wire surface during a stable period and the electrical signal fluctuation intensity between multiple adjacent zero-crossing points. Alternatively, each zero-crossing point can be determined using multiple zero-crossing points.

[0051] In one possible implementation, step S312 involves determining a feature data sequence from the detection information based on multiple zero-crossing points, including: S3121, based on multiple zero-crossing points, determine the fluctuation variance between the i-th zero-crossing point and the (i+1)-th zero-crossing point; where the fluctuation variance is used to characterize the electrical signal fluctuation intensity on the surface of the corresponding copper line segment within the window between adjacent zero-crossing points, and i is a positive integer greater than or equal to 1.

[0052] It can be understood that there is a fluctuation variance between each pair of adjacent zero-crossing points. That is, the i-th fluctuation variance refers to the variance value obtained by statistically analyzing the electrical signal generated on the surface of the first copper wire within the time-space window formed by the i-th and (i+1)-th zero-crossing points. Since the fluctuation of the electrical signal is directly related to the surface state of the copper wire, when the copper wire surface is uniform and clean, the electrochemical reaction is stable and the signal fluctuation is small. However, when there are defects such as oxidation residues and micro-scratches on the surface of the copper wire, the electrochemical reaction is locally unbalanced and the signal fluctuation is large. Therefore, the fluctuation variance can characterize the uniformity of the surface state of the corresponding copper wire segment. The larger the variance value, the more violent the electrical signal fluctuation on the surface of the copper wire segment and the more unstable the surface state. The smaller the variance value, the more stable the electrical signal and the more uniform the surface state.

[0053] S3122, determine the mean square error based on multiple fluctuation variances; where the mean square error is used to reflect the fluctuation level of the copper wire surface state during a stable period.

[0054] As can be understood, the mean squared error refers to the average variance value of the subset of fluctuation variances that characterizes the stable state of the copper wire surface from multiple fluctuation variances, and can reflect the benchmark fluctuation level when the copper wire surface state is stable.

[0055] For example, by analyzing multiple variances, the absolute value of the difference between any two adjacent variances can be determined. Then, these absolute values ​​are iterated in chronological order. When the absolute value of the i-th variance is greater than the absolute value of the (i-1)-th variance, the average value between the first and i-th variances is taken as the mean squared error. Here, the absolute value of the i-th variance is the absolute value of the difference between the (i+1)-th and i-th variances. Alternatively, a normal distribution analysis can be performed on the multiple variances, and the variance corresponding to the maximum probability density of the normal distribution can be taken as the mean squared error.

[0056] In one possible implementation, in step S3122, the mean squared error is determined based on multiple variances of fluctuation, including: S31221, compare the i-th variance with the (i+1)-th variance among multiple variances to obtain the i-th difference value; where the difference value is used to reflect the absolute value of the difference between the i-th variance and the (i+1)-th variance.

[0057] It can be understood that the i-th difference value = |i+1-th fluctuation variance - i-th fluctuation variance|. The smaller the difference value, the more stable the surface fluctuation state of the two adjacent copper wire segments, and the more uniform the transition of the surface state. The larger the difference value, the more obvious the abrupt change in the fluctuation intensity of the two adjacent copper wire segments.

[0058] S31222, when the difference between the (i+1)th difference value and the ith difference value is greater than the difference between the ith difference value and the (i-1)th difference value, the average fluctuation variance between the first fluctuation variance and the ith fluctuation variance is taken as the mean squared variance.

[0059] It can be understood that when the difference between the (i+1)th difference value and the ith difference value is greater than the difference between the ith difference value and the (i-1)th difference value, it is the critical point where the fluctuation variance changes from stable to a violent change. Data after this critical point indicates that the fluctuation variance has entered the abnormal change stage, while the surface state of the copper line segment corresponding to the first fluctuation variance to the ith fluctuation variance is still in a stable period. At this time, the average value of this part of the fluctuation variance is taken as the mean squared error.

[0060] This setup allows for the determination of the trend in fluctuation variance by comparing the differences between adjacent fluctuation variances. Trend analysis is more sensitive to identifying stable intervals than direct comparison of fluctuation variances. By analyzing the trend of the differences, fluctuation variance in abnormal areas can be effectively removed, ensuring that the mean squared error only reflects the fluctuation level of the normal polishing area. This solves the problem of the mean squared error including abnormal fluctuations that cause benchmark distortion.

[0061] S3123, determine the feature data corresponding to each zero crossing point based on the mean squared error and multiple variances, and determine the feature data sequence based on multiple feature data; wherein, the feature data refers to the ratio between the variance and the mean squared error.

[0062] As can be understood, feature data refers to the ratio of the variance to the root mean square error corresponding to each zero-crossing point, used to reflect the degree to which the surface state of the copper line segment deviates from the stable state corresponding to each zero-crossing point window. A zero-crossing point window refers to the temporal-spatial window generated by two adjacent zero-crossing points. Multiple feature data are constructed together in chronological order to form a feature data sequence, with the feature data corresponding to each zero-crossing point window corresponding to each sequence node of the feature data sequence.

[0063] With this setup, the fluctuation variance between the i-th zero-crossing point and the (i+1)-th zero-crossing point is calculated. By focusing on the local electrical signal fluctuations of adjacent zero-crossing points, the surface uniformity of the corresponding copper wire segment can be accurately reflected. The root mean square error reflects the fluctuation level during the stable period of the copper wire surface state and is used as a global benchmark. This reduces the absolute value difference of fluctuation variance under different batches of copper wire and different micro-electrolysis current intensities, making the feature data comparable across scenarios.

[0064] S313, based on the characteristic data sequence and transmission speed, determine the first state region and the second state region.

[0065] For example, each feature data in the feature data sequence can be read sequentially over time. When multiple consecutive feature data are read and are all greater than or equal to a preset threshold, the initial and final feature data are determined from the consecutively read feature data. Then, the time corresponding to the data with the greatest impact on the fluctuation variance is determined from these two feature data. The copper wire axial interval mapped by these two times and the transmission speed is then determined as the second condition region. The copper wire axial interval that is not determined as the second condition region is identified as the first condition region. Alternatively, the feature data sequence and the transmission speed can be input into the learning model, and the learning model can output the corresponding first and second condition regions, and so on, but it is not limited to these methods.

[0066] This setup clearly defines the degree of anomaly in the surface state of each point along the copper wire's axial direction using characteristic data sequences, realizing the conversion of current response signals into axial characteristics of the copper wire and aligning with the continuous transmission process characteristics of copper wires. The zero-crossing point is the moment when the transient response of the copper wire potential crosses the equilibrium potential during the interval of a periodic current pulse. Its occurrence time and amplitude directly reflect the electrochemical activity of the copper wire surface, and the selection of this index conforms to the physical laws of the micro-electrolysis process. The feature extraction method based on zero-crossing points is unaffected by the magnitude of the micro-electrolysis current or small fluctuations in the copper wire transmission speed, ensuring the comparability of characteristic data sequences under different process conditions and improving the stability of region division.

[0067] In one possible implementation, step S313, determining the first state region and the second state region based on the characteristic data sequence and transmission speed, includes: S3131, sequentially read the feature data in the feature data sequence.

[0068] It can be understood that sequential reading refers to the operation of extracting each feature data from the beginning to the end of the sequence according to the inherent arrangement logic of the feature data sequence (i.e., the order that corresponds one-to-one with the axial position of the copper wire).

[0069] S3132, when n consecutive feature data are read and are all greater than or equal to a preset threshold, a first time point is determined from the initial feature data among the n feature data and a second time point is determined from the last feature data among the n feature data; wherein, the initial feature data is used to reflect the first feature data among the n feature data, the last feature data refers to the last feature data among the n feature data, the first time point is used to reflect the time corresponding to the data that has the greatest impact on the fluctuation variance of the initial feature data, and the second time point is used to reflect the time corresponding to the data that has the greatest impact on the fluctuation variance of the last feature data.

[0070] It can be understood that the initial feature data refers to the first data in the set of n consecutively read feature data that are greater than or equal to the preset threshold. It is the core quantitative indicator at the beginning of the abnormal region, and the final feature data is the last data in the set. It is the core quantitative indicator at the end of the abnormal region.

[0071] For example, one can analyze the initial feature data to determine the data that has the greatest impact on the variance of the initial feature data, and analyze the final feature data to determine the data that has the greatest impact on the variance of the final feature data. The time corresponding to the data that has the greatest impact on the variance of the initial feature data is taken as the first time point, and the time corresponding to the data that has the greatest impact on the variance of the final feature data is taken as the second time point. Alternatively, one can perform normal distribution analysis on each electrical signal in the initial feature data and take the time point of the electrical signal corresponding to the maximum probability density of the normal distribution in the initial feature data as the second time point, and perform normal distribution analysis on each electrical signal in the final feature data and take the time point of the electrical signal corresponding to the maximum probability density of the normal distribution in the final feature data as the third time point.

[0072] In one possible implementation, step S3132, determining a first time point from the initial feature data among the n feature data and determining a second time point from the last feature data among the nth feature data, includes: S31321, Based on the initial feature data, determine the first maximum influence data; wherein, the first maximum influence data is used to reflect the data in the initial feature data that has the greatest impact on the fluctuation variance of the initial feature data.

[0073] For example, the initial feature data can be traversed, and the current response signals to be traversed can be determined from the initial feature data in traversal order. The fluctuation variance of the current response signal removed from the initial feature data is determined based on the current response signal traversed at each time point. Then, by analyzing the ratio between the fluctuation variance of the current response signal removed from the current time point and the fluctuation variance of the corresponding initial feature data, after traversing the current response signals at each time point, the data corresponding to the minimum value of the ratio between the fluctuation variance of the current response signal removed from the current time point and the fluctuation variance of the corresponding initial feature data is taken as the first maximum influence data. Alternatively, each electrical signal in the initial feature data can be analyzed to determine the average value among the electrical signals in the initial feature data. Then, by traversing each electrical signal in the initial feature data and calculating the difference between the current signal and the average value among the electrical signals in the initial feature data, the data with the largest absolute value of the difference is taken as the first maximum influence data.

[0074] In one possible implementation, in step S31321, the first maximum influence data is determined based on the initial feature data, including: S313211, Traverse the initial feature data and determine the first data from the initial feature data in the traversal order; wherein, the first data is used to reflect any current response signal in the initial feature data.

[0075] It can be understood that the first data refers to any current response signal collected within the fluctuation variance window corresponding to the initial feature data. Its core attribute is that it belongs to the original electrical signal data within that window, without any fixed position restrictions.

[0076] S313212, Based on the first data and the initial feature data, determine the first removed volatility variance; wherein, the first removed volatility variance is used to reflect the volatility variance of the initial feature data after removing the first data.

[0077] It is understandable that by comparing the difference between the original volatility variance before and after removal, the influence of the current top data point on the original volatility variance can be quantitatively determined. The greater the difference, the more likely the top data point is the main contributor to the original volatility variance, thus providing a basis for selecting the data point with the greatest influence. S313213, the ratio between the first eliminated volatility variance and the volatility variance corresponding to the initial feature data is taken as the first comparison result.

[0078] It is understandable that the first comparison result = the first eliminated variance ÷ the variance of the initial feature data.

[0079] S313214, when the first comparison result is the smallest, the corresponding first data is confirmed as the first maximum impact data.

[0080] It is understandable that when the first comparison result is the smallest, it means that the variance of the fluctuation decreases the most after removing the first data. This indicates that the first data is the main contributor to the original variance of the fluctuation and has a significant impact on the magnitude of the original variance of the fluctuation. Therefore, it is identified as the data with the greatest impact.

[0081] This setup, by iterating through and removing each current response signal from the initial feature data, calculates the variance of the removed data, which directly quantifies the impact of a single data point on the overall variance of the variance. The ratio of the first removed variance to the variance of the initial feature data is used as the comparison result, thus achieving data normalization. The smaller the comparison result, the greater the impact of the data on the variance of the variance, making the judgment criteria clear.

[0082] S31322, Based on the end feature data, determine the second maximum impact data; wherein, the second maximum impact data is used to reflect the data in the end feature data that has the greatest impact on the variance of the end feature data.

[0083] For example, one approach is to iterate through the final feature data and determine the current response signals being iterated from it in the traversal order. Then, based on the current response signals from each traversal, the variance of the current response signals removed from that traversal is determined in the final feature data. The ratio between the variance of the removed current response signals and the variance of the corresponding final feature data is analyzed. After traversing the current response signals at each time point in the final feature data, the data corresponding to the minimum value of the ratio between the variance of the current response signals from each traversal and the variance of the corresponding final feature data is taken as the second most influential data. Alternatively, one approach is to analyze each electrical signal in the final feature data, determine the average value of each electrical signal, then iterate through each electrical signal in the final feature data, calculate the difference between that signal and the average value of each electrical signal in the final feature data, and take the data with the largest absolute value of this difference as the second most influential data.

[0084] In one possible implementation, in step S31322, the second maximum influence data is determined based on the end feature data, including: S313221, Traverse the last feature data and determine the second data from the last feature data in the traversal order; wherein, the second data is used to reflect any current response signal in the last feature data.

[0085] It is understandable that the second data can be obtained by determining the first data in step S313211, which will not be elaborated here.

[0086] S313222, Based on the second data and the end feature data, determine the second elimination volatility variance; wherein, the second elimination volatility variance is used to reflect the volatility variance in the end feature data after removing the second data.

[0087] It is understandable that the second variance can be obtained by determining the first variance in step S313212, which will not be elaborated here.

[0088] S313223, the ratio between the second elimination variance and the variance corresponding to the last feature data is used as the second comparison result.

[0089] It is understandable that the second comparison result can be obtained by determining the first comparison result in step S313213, which will not be elaborated here.

[0090] S313224, when the second comparison result is the smallest, the corresponding second data is confirmed as the second largest impact data.

[0091] It is understandable that when the second comparison result is the smallest, it indicates that the variance decreases the most after removing this second data point. This means that the second data point is the main contributor to the original variance and has a significant impact on the magnitude of the original variance. Therefore, it is identified as the second most influential data point. This setup, by iterating through and removing each current response signal from the final feature data, calculates the variance of the removed data, which directly quantifies the impact of a single data point on the overall variance of the variance. The ratio of the second removed variance to the variance of the final feature data is used as a comparison result, thus achieving data normalization. The smaller the comparison result, the greater the impact of the data on the variance of the variance, making the judgment criteria clear.

[0092] S31323, determine the first time from the initial feature data based on the first maximum impact data, and determine the second time from the end feature data based on the second maximum impact data.

[0093] It is understandable that "first time" refers to the specific moment when the first most impactful data was collected, and "second time" refers to the specific moment when the second most impactful data was collected.

[0094] With this setting, the key contribution point of the fluctuation variance corresponding to the data with the greatest impact can accurately reflect the start and end time of the abnormal area. From the time domain, the copper wire is divided into different condition areas, and the time point can also make basic settings for the timing of subsequent electroplating parameter adjustments.

[0095] S3133, based on the copper wire axial interval mapped by the first time point, the second time point, and the transmission speed, is determined as the second condition region.

[0096] It can be understood that the axial range of the copper wire refers to the range of physical positions along the copper wire's axis obtained after linear mapping calculations using a first time point, a second time point, and the transmission speed; that is, the range formed by the starting position and the ending position. Specifically, the starting position is the location point within the axial range of the copper wire calculated using the first time point and the transmission speed, and the ending position is the location point within the axial range of the copper wire calculated using the second time point and the transmission speed.

[0097] S3134, the axial section of the copper wire that was not identified as the second condition region is identified as the first condition region.

[0098] It can be understood that the axial section of the copper wire not identified as the second condition area refers to the remaining continuous or segmented copper wire segments within the axial physical range of the entire first copper wire, excluding the identified second condition area.

[0099] This configuration effectively filters out single-point interference signals by using the judgment criteria for n consecutive data points, reducing misjudgments of abnormal areas caused by occasional electrical signal fluctuations and improving process stability. Furthermore, the continuous traversal of abnormal point judgments and the mapping of time positions can accurately identify abnormal polishing areas along the copper wire axis.

[0100] S320, the detection time of the first condition area and the detection time of the corresponding first condition area, and the detection time of the second condition area and the corresponding second condition area are jointly identified as surface condition information.

[0101] It can be understood that surface condition information is a comprehensive quantitative information that integrates spatial and temporal dimensions. Its core components include the copper wire axial range of the first condition region and the corresponding detection time range, as well as the copper wire axial range of the second condition region and the corresponding detection time range.

[0102] This setup simultaneously correlates the surface condition with the axial region of the copper wire and the corresponding detection time, clearly defining the spatial location of abnormal areas and recording the time it takes for them to pass through the micro-electrolysis region. This enables precise spatiotemporal positioning of the copper wire surface condition during continuous transmission. Consequently, it reduces the complexity of subsequent data analysis, facilitating rapid system identification of abnormal areas and triggering adjustment commands.

[0103] S400, based on surface condition information, first electroplating parameters, and detection information, determines second electroplating parameters; wherein, the second electroplating parameters are used to reflect the parameters after the first electroplating parameters have been adjusted.

[0104] It is understandable that, since the surface of copper wire has different surface conditions at different locations, and the electrodeposition reaction of electroplating is strongly correlated with the surface activity of copper wire, it is necessary to set corresponding electroplating parameters for different surface condition areas of copper wire.

[0105] For example, the difference between the first feature data and the second feature data in the surface condition information can be obtained by comparing the detection information in the first condition region and the effective current value corresponding to the detection information in different second condition regions. The first electroplating parameter can then be adjusted according to the time sequence based on this difference to obtain the second electroplating parameter. Alternatively, the surface condition information, the first electroplating parameter, and the detection information can be input into a learning model, and the learning model can output the corresponding second electroplating parameter, and so on, but are not limited to these methods.

[0106] In one possible implementation, in step S400, the second electroplating parameters are determined based on the surface condition information, the first electroplating parameters, and the detection information, including: S410, based on the comparison between the first condition area and the second condition area in the surface condition information, the condition difference rate corresponding to the detection information in the first condition area and different second condition areas is obtained; wherein, the condition difference rate is used to indicate the ratio between the effective current value corresponding to the detection information in the first condition area and the effective current value corresponding to the detection information in different second condition areas.

[0107] It can be understood that the condition difference rate = effective current value of the first characteristic data ÷ effective current value of different second condition regions. The effective current value refers to the statistically valid value of the current response signal within the detection time range of the corresponding region in the detection information. Different second condition regions refer to multiple discrete or continuous surface anomaly segments present in the copper wire.

[0108] S420, the condition difference rate corresponding to different second condition regions is processed with the first electroplating parameter to obtain the second electroplating parameter.

[0109] It can be understood that the second electroplating parameter refers to the customized electroplating process parameter obtained for each different second condition region after quantifying the corresponding condition difference rate with the first electroplating parameter through a preset mapping rule.

[0110] This setup calculates the condition difference rate and adjusts parameters separately for different second-condition areas, achieving precise control of electroplating parameters corresponding to each condition area, thus aligning with the surface condition differences in different areas along the axial direction of the copper wire. Because of this zoned parameter adjustment, the production line can adapt to copper wires with different polishing qualities. Even if local abnormalities occur during the polishing process, they can be compensated for by adjusting the electroplating parameters, improving the production line's anti-interference capability and product qualification rate.

[0111] S500: After detecting that the second copper wire output from the micro-electrolysis region has entered the electroplating region at a transmission speed, the second copper wire is electroplated based on the first electroplating parameter or the second electroplating parameter; wherein, the second copper wire refers to the first copper wire after passing through the micro-electrolysis region.

[0112] It is understandable that when the detection system detects that the second copper wire enters the electroplating area at a constant transmission speed, it uses the mapping relationship between the axial position of the copper wire, the condition area, and the electroplating parameters obtained through the above steps to determine in real time the condition area to which the current section of the copper wire enters the electroplating area belongs, and automatically calls the corresponding first or second electroplating parameters for electroplating. That is, when the first condition area of ​​the copper wire enters the electroplating area, the detection system calls the first electroplating parameters to electroplat the area, and when the second condition area of ​​the copper wire enters the electroplating area, the detection system calls the second electroplating parameters to electroplat the area. Different second condition areas correspond to different second electroplating parameters.

[0113] With this setup, the micro-electrolysis zone not only completes the micro-electrolysis activation before copper wire electroplating, but also achieves non-contact detection of surface condition through current response signals. This eliminates the need for additional detection equipment, reducing production line costs and space requirements. The dynamically adjusted second electroplating parameter can be specifically adapted to the surface characteristics of areas with polishing abnormalities, achieving a technical solution where one region corresponds to one electroplating parameter. This improves the surface uniformity and adhesion of the silver-plated copper wire and is suitable for industrial production scenarios involving continuous high-speed copper wire transmission. This ensures real-time detection and adjustment without affecting production line efficiency.

[0114] It should be understood that the sequence number of each step in the above embodiments does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0115] Corresponding to the continuous polishing and plating method for silver-plated copper wire described in the above embodiments, this application also provides a continuous polishing and plating system for silver-plated copper wire. Each module of the continuous polishing and plating system for silver-plated copper wire can realize each step of the continuous polishing and plating method for silver-plated copper wire. Figure 3 The diagram shows a structural block diagram of the continuous polishing and plating system for silver-plated copper wire provided in the embodiments of this application. For ease of explanation, only the parts related to the embodiments of this application are shown.

[0116] Reference Figure 3 The continuous polishing and plating system for silver-plated copper wire includes: The acquisition unit is used to acquire the first electroplating parameters; wherein the first electroplating parameters are used to reflect the parameters preset for electroplating the copper wire.

[0117] The transmission unit is used to transport the first copper wire output by the polishing device into the micro-electrolysis area at a transmission speed and then acquire detection information; wherein, the first copper wire refers to the copper wire polished by the polishing device, and the detection information is used to reflect the current response signal generated after the first copper wire enters the micro-electrolysis area.

[0118] The condition confirmation unit is used to determine the surface condition information of the first copper wire based on the detection information and the transmission speed; wherein the surface condition information is used to reflect the surface quality condition of the first copper wire.

[0119] The parameter analysis unit is used to determine the second electroplating parameter based on surface condition information, the first electroplating parameter, and detection information; wherein the second electroplating parameter is used to reflect the parameter after the first electroplating parameter has been adjusted.

[0120] An electroplating unit is used to detect when the second copper wire output from the micro-electrolysis region enters the electroplating region at a transmission speed, and then electroplats the second copper wire based on the first electroplating parameters or the second electroplating parameters; wherein, the second copper wire refers to the first copper wire after passing through the micro-electrolysis region.

[0121] It should be noted that the information interaction and execution process between the above systems / units are based on the same concept as the method embodiments of this application. For details on their specific functions and technical effects, please refer to the method embodiments section, and they will not be repeated here.

[0122] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is merely an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the system can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. Furthermore, the specific names of the functional units and modules are only for easy differentiation and are not intended to limit the scope of protection of this application. The specific working process of the units and modules in the above system can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0123] This application embodiment also provides a continuous polishing and plating production line, which includes a straightening device, a take-up device, a polishing device, an electroplating device, and a control device arranged in sequence. The straightening device, take-up device, polishing device, electroplating device, and take-up device are all electrically connected to the control device. Figure 4 This is a schematic diagram of the structure of the control device 4 provided in one embodiment of this application. Figure 4 As shown, the control device 4 in this embodiment includes: at least one processor 40 ( Figure 4 Only one is shown in the image), at least one memory 41 ( Figure 4 (Only one is shown in the image) and a computer program 42 stored in the at least one memory 41 and executable on the at least one processor 40. When the processor 40 executes the computer program 42, it causes the control device 4 to perform the steps in any of the above embodiments of the continuous polishing and plating method for silver-plated copper wire, or causes the control device 4 to perform the functions of each module / unit in the above embodiments of the system.

[0124] For example, the computer program 42 may be divided into one or more modules / units, which are stored in the memory 41 and executed by the processor 40 to complete this application. The one or more modules / units may be a series of computer program instruction segments capable of performing a specific function, which describe the execution process of the computer program 42 in the control device 4.

[0125] The control device 4 can be a computing device such as a desktop computer, laptop, handheld computer, or cloud server. The control device 4 may include, but is not limited to, a processor 40 and a memory 41. Those skilled in the art will understand that... Figure 4 This is merely an example of control device 4 and does not constitute a limitation on control device 4. It may include more or fewer components than shown, or combine certain components, or different components, such as input / output devices, network access devices, buses, etc.

[0126] The processor 40 can be a Central Processing Unit (CPU), but it can also be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor can be a microprocessor or any conventional processor.

[0127] In some embodiments, the memory 41 may be an internal storage unit of the control device 4, such as a hard disk or memory of the control device 4. In other embodiments, the memory 41 may be an external storage device of the control device 4, such as a plug-in hard disk, smart media card (SMC), secure digital (SD) card, flash card, etc., equipped on the control device 4. Furthermore, the memory 41 may include both internal storage units and external storage devices of the control device 4. The memory 41 is used to store operating systems, applications, bootloaders, data, and other programs, such as the program code of computer programs. The memory 41 can also be used to temporarily store data that has been output or will be output.

[0128] This application also provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the steps in any of the above method embodiments.

[0129] This application provides a computer program product that, when run on a continuous polishing and plating production line, enables the continuous polishing and plating production line to perform the steps described in any of the above method embodiments.

[0130] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, all or part of the processes in the methods of the above embodiments of this application can be implemented by a computer program instructing related hardware. The computer program can be stored in a computer-readable storage medium, and when executed by a processor, it can implement the steps of the various method embodiments described above. The computer program includes computer program code, which can be in the form of source code, object code, executable files, or certain intermediate forms. The computer-readable medium can include at least: any entity or device capable of carrying the computer program code to a continuous polishing and plating production line, a recording medium, a computer memory, a read-only memory (ROM), a random access memory (RAM), an electrical carrier signal, a telecommunication signal, and a software distribution medium, such as a USB flash drive, a portable hard drive, a magnetic disk, or an optical disk.

[0131] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0132] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0133] In the embodiments provided in this application, it should be understood that the disclosed continuous polishing and plating system for silver-plated copper wire can be implemented in other ways. For example, the embodiments of the continuous polishing and plating system for silver-plated copper wire described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be indirect coupling or communication connection through some interfaces, devices, or units, and may be electrical, mechanical, or other forms.

[0134] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0135] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A continuous polishing and plating method for silver-plated copper wire, characterized in that, The method is applied to a continuous polishing and plating production line, which includes a straightening device, a take-up device, a polishing device, an electroplating device, and another take-up device arranged sequentially. The electroplating device includes a micro-electrolysis zone and an electroplating zone. Obtain the first electroplating parameter; wherein the first electroplating parameter is used to reflect the parameters preset for electroplating copper wire; After the first copper wire output by the polishing device is conveyed into the micro-electrolysis region at a transmission speed, detection information is obtained; wherein, the first copper wire refers to the copper wire polished by the polishing device, and the detection information is used to reflect the current response signal generated after the first copper wire enters the micro-electrolysis region. Based on the detection information and the transmission speed, the surface condition information of the first copper wire is determined; wherein, the surface condition information is used to reflect the surface quality condition of the first copper wire. Based on the surface condition information, the first electroplating parameters, and the detection information, a second electroplating parameter is determined; wherein, the second electroplating parameter is used to reflect the parameters after the first electroplating parameter has been adjusted. After detecting that the second copper wire output from the micro-electrolysis region enters the electroplating region at a transmission speed, the second copper wire is electroplated based on the first electroplating parameter or the second electroplating parameter; wherein, the second copper wire refers to the first copper wire after passing through the micro-electrolysis region.

2. The continuous polishing and plating method for silver-plated copper wire as described in claim 1, characterized in that, The step of determining the surface condition information of the first copper wire based on the detection information and the transmission speed includes: Based on the detection information and the transmission speed, a first condition region and a second condition region are determined; wherein, the first condition region is used to reflect the normal area of ​​the surface polishing of the first copper wire, and the second condition region is used to reflect the abnormal area of ​​the surface polishing of the first copper wire. The detection time corresponding to the first condition area and the detection time corresponding to the first condition area are jointly identified as the surface condition information.

3. The continuous polishing and plating method for silver-plated copper wire as described in claim 2, characterized in that, The step of determining the first condition region and the second condition region based on the detection information and the transmission speed includes: Identify multiple zero-crossing points in the detection information; wherein, the zero-crossing point refers to the moment when the transient response signal of the first copper wire decays and crosses its equilibrium potential during the interval of the applied periodic current pulse; A feature data sequence is determined from the detection information based on multiple zero-crossing points; wherein, the feature data sequence is used to characterize the degree of abnormality of the surface state at each point along the copper wire axis; Based on the characteristic data sequence and the transmission speed, the first condition region and the second condition region are determined.

4. The continuous polishing and plating method for silver-plated copper wire as described in claim 3, characterized in that, Determining the feature data sequence from the detection information based on multiple zero-crossing points includes: Based on multiple zero-crossing points, the fluctuation variance between the i-th zero-crossing point and the (i+1)-th zero-crossing point is determined; wherein, the fluctuation variance is used to characterize the electrical signal fluctuation intensity on the surface of the corresponding copper line segment within the window between adjacent zero-crossing points, and i is a positive integer greater than or equal to 1. Based on the multiple fluctuation variances, the mean square error is determined; wherein, the mean square error is used to reflect the fluctuation level of the copper wire surface state during a stable period; Based on the mean squared error and multiple variances of fluctuation, feature data corresponding to each zero crossing point is determined, and a feature data sequence is determined based on multiple feature data; wherein, the feature data refers to the ratio between the variance of fluctuation and the mean squared error.

5. The continuous polishing and plating method for silver-plated copper wire as described in claim 4, characterized in that, The determination of the mean squared error based on multiple fluctuation variances includes: By comparing the i-th variance with the (i+1)-th variance among the multiple variances, the i-th difference value is obtained; wherein, the difference value is used to reflect the absolute value of the difference between the i-th variance and the (i+1)-th variance. When the difference between the (i+1)th difference value and the ith difference value is greater than the difference between the ith difference value and the (i-1)th difference value, the average fluctuation variance between the first fluctuation variance and the ith fluctuation variance is taken as the mean squared variance.

6. The continuous polishing and plating method for silver-plated copper wire as described in claim 5, characterized in that, The step of determining the first state region and the second state region based on the feature data sequence and the transmission speed includes: Read the feature data in the feature data sequence sequentially; When n consecutive feature data are read and are all greater than or equal to a preset threshold, a first time point is determined from the initial feature data among the n feature data, and a second time point is determined from the last feature data among the nth feature data; wherein, the initial feature data is used to reflect the first feature data among the n feature data, the last feature data refers to the last feature data among the n feature data, the first time point is used to reflect the time corresponding to the data that has the greatest impact on the variance of the initial feature data, and the second time point is used to reflect the time corresponding to the data that has the greatest impact on the variance of the last feature data; The copper wire axial range mapped by the first time point, the second time point, and the transmission speed is determined as the second condition region. The axial section of the copper wire that was not identified as the second condition region is identified as the first condition region.

7. The continuous polishing and plating method for silver-plated copper wire as described in claim 6, characterized in that, The step of determining a first time point from the initial feature data in the n feature data and determining a second time point from the last feature data in the nth feature data includes: Based on the initial feature data, a first maximum impact data is determined; wherein, the first maximum impact data is used to reflect the data in the initial feature data that has the greatest impact on the variance of the initial feature data. Based on the end feature data, a second maximum impact data is determined; wherein, the second maximum impact data is used to reflect the data in the end feature data that has the greatest impact on the fluctuation variance of the end feature data; A first time is determined from the initial feature data based on the first maximum impact data, and a second time is determined from the final feature data based on the second maximum impact data.

8. The continuous polishing and plating method for silver-plated copper wire as described in claim 6, characterized in that, The determination of the first maximum impact data based on the initial feature data includes: The initial feature data is traversed, and first data is determined from the initial feature data in traversal order; wherein, the first data is used to reflect any current response signal in the initial feature data; Based on the first data and the initial feature data, a first exclusion variance is determined; wherein, the first exclusion variance is used to reflect the variance of the initial feature data after removing the first data; The ratio between the first eliminated volatility variance and the volatility variance corresponding to the initial feature data is used as the first comparison result; The first data corresponding to the smallest first comparison result is confirmed as the first maximum impact data.

9. The continuous polishing and plating method for silver-plated copper wire as described in claim 6, characterized in that, The determination of the second maximum impact data based on the end feature data includes: Traverse the last feature data and determine the second data from the last feature data in traversal order; wherein the second data is used to reflect any one of the current response signals in the last feature data; Based on the second data and the end feature data, a second removal volatility variance is determined; wherein, the second removal volatility variance is used to reflect the volatility variance in the end feature data after removing the second data; The ratio between the second eliminated volatility variance and the volatility variance corresponding to the end feature data is used as the second comparison result; The second data corresponding to the smallest second comparison result is confirmed as the second most influential data.

10. The continuous polishing and plating method for silver-plated copper wire as described in claim 3, characterized in that, The step of determining the second electroplating parameter based on the surface condition information, the first electroplating parameter, and the detection information includes: Based on the comparison between the first condition region and the second condition region in the surface condition information, the condition difference rate corresponding to the detection information in the first condition region and different second condition regions is obtained; wherein, the condition difference rate is used to indicate the ratio between the effective current value of the detection information in the first condition region and the effective current value of the detection information in different second condition regions. The condition difference rate corresponding to different second condition regions is processed with the first electroplating parameter to obtain the second electroplating parameter.

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