Component package stress testing system and method

Abstract

The application discloses a component packaging stress test system and method. The system comprises: a plurality of first pressure sensors arranged in a packaging space, at least one first pressure sensor being arranged on one side of a component and forming a contact surface with the component in two different stress directions; a plurality of second pressure sensors arranged on a stress isolation layer; a stress transmission layer composed of a rigid transmission layer and an elastic transmission layer, wherein the plurality of first sensors are arranged between adjacent elastic transmission layers, and the elastic modulus of the elastic transmission layer in the direction of the component from the stress isolation layer is set in linear proportion; and a data processing module for receiving pressure data and determining packaging conditions and packaging stress test data. The application realizes layer-by-layer decoupling analysis of the packaging stress transmission path, effectively solves the problems of inaccurate stress distribution quantization and insufficient basis for packaging condition optimization in traditional tests, and significantly improves the scientificity and engineering applicability of high-reliability packaging design.

Description

Technical Field

[0001] This invention relates to the field of semiconductor testing technology, and more specifically to a component packaging stress testing system and method. Background Technology

[0002] In the current electronic component packaging process, the accumulation of thermal and mechanical stress can easily lead to chip performance degradation or structural failure. Especially in highly integrated packaging scenarios, precise control of packaging stress has become a core challenge for reliability design. Traditional testing methods typically only place a single pressure sensor on the component surface, which is difficult to comprehensively capture multidimensional stress distribution and lacks the ability to quantitatively analyze the stress transmission path inside the packaging structure, resulting in high difficulty in optimizing packaging conditions.

[0003] To address the aforementioned issues, there is an urgent need to provide a component packaging stress testing system and method to support the optimization of packaging processes and the improvement of reliability. Summary of the Invention

[0004] To address the aforementioned issues, this invention provides a component packaging stress testing system and method to support the optimization of packaging processes and the improvement of reliability.

[0005] A first aspect of the present invention is a component packaging stress testing system, comprising:

[0006] Multiple first pressure sensors are disposed within an encapsulation space defined by a housing, and at least one first pressure sensor is disposed on one side of a component located within the encapsulation space, and there are at least two contact surfaces with the component in different force directions.

[0007] Multiple second pressure sensors are disposed within the encapsulation space, and at least one second pressure sensor is disposed within a stress isolation layer located within the encapsulation space;

[0008] Furthermore, multiple consecutively arranged first sensors are connected by a stress transmission layer, which includes a rigid transmission layer and an elastic transmission layer. Multiple first sensors are spaced apart between adjacent elastic transmission layers, and the elastic moduli of the multiple elastic transmission layers arranged from the stress isolation layer toward the component direction are set in a linear proportional relationship.

[0009] The data processing module is configured to receive pressure data from the first pressure sensor and the second pressure sensor, and determine test data for packaging conditions and packaging stress based on the pressure data.

[0010] In a preferred embodiment, the first pressure sensor is configured to test a first stress acting on the surface of the component and the stress transmission layer;

[0011] The second sensor is configured to test a second stress acting on the surface of the stress isolation layer;

[0012] The data processing module is configured to calculate the influence rate of the packaging conditions on the stress isolation layer and the stress transmission layer based on the first stress and the second stress, and to determine the packaging conditions when the actual stress of the component is always lower than the allowable stress threshold during operation based on the influence rate.

[0013] The packaging conditions include first setting data for the stress isolation layer and second setting data for the stress transfer layer. The first setting data includes the thickness and material parameters of the stress isolation layer, and the second setting data includes the elastic modulus proportionality coefficient and the number of layers of the elastic transfer layer. The setting is achieved by setting the elastic modulus of the elastic transfer layer from the stress isolation layer to the component direction to increase or decrease linearly by a proportional constant k. The data processing module evaluates the optimization degree of the packaging conditions based on the comparison result of the influence rate and the threshold stress. When the influence rate is lower than the preset critical value and the actual stress is lower than the allowable stress threshold, the packaging conditions are determined to be optimal.

[0014] As a preferred embodiment, the data processing module is further configured to perform the following steps:

[0015] During the staged stress test, the test process is divided into multiple stress stages according to the linear ratio of the elastic modulus. Each stage corresponds to a preset stress increment range, and the stress increment range is linearly related to the elastic model.

[0016] The system receives and analyzes pressure data from the first and second pressure sensors at each stage to monitor stress changes transmitted from the stress isolation layer towards the components.

[0017] The first stage corresponds to the low stress level test of the stress isolation layer.

[0018] The second stage corresponds to the test of the transition stress level of the stress transfer layer.

[0019] The third stage corresponds to the high stress level test of the component surface;

[0020] The impact rate of packaging conditions under different stress levels was evaluated by using phased data, and the critical packaging conditions under which the actual stress of the components during operation is lower than the allowable stress threshold were determined.

[0021] As a preferred embodiment, the number of the first pressure sensors is at least three sets, with each set of the first pressure sensors respectively disposed on the top, side and bottom surfaces of the component, and each first pressure sensor forming two contact surfaces with the component in the vertical and horizontal directions to simultaneously acquire stress components in multiple directions; the number of the second pressure sensors is at least two, evenly distributed on the inner and outer surfaces of the stress isolation layer, for testing the bidirectional stress transmission characteristics of the stress isolation layer during the packaging process.

[0022] As a preferred embodiment, the data processing module is further configured to perform the following steps:

[0023] Through regression analysis, an influence rate curve was fitted based on historical data of the first stress and the second stress. The influence rate curve characterizes the sensitivity of changes in packaging conditions to the first stress and the second stress.

[0024] When the slope of the influence rate curve is lower than the preset ratio, it is determined that the first setting data of the stress isolation layer and the second setting data of the stress transfer layer are in the optimization range, and recommended parameters of the encapsulation conditions are output, including the thickness adjustment value of the stress isolation layer and the elastic modulus ratio coefficient correction value of the elastic transfer layer.

[0025] As a preferred embodiment, the data processing module is further configured to perform the following steps:

[0026] Based on the test results of each stress stage, the external applied stress signal is adjusted. When the first stage test shows that the influence rate is higher than the preset value, the stress increment in subsequent stages is reduced to ensure that the actual stress of the component during operation is always lower than the allowable stress threshold.

[0027] The data processing module also generates a packaging condition evaluation report, including optimized data for the first setting of the stress isolation layer and the second setting of the stress transfer layer, as well as safety threshold data for the components at each stress stage.

[0028] As a preferred embodiment, a temperature sensor is also included, which is disposed within the packaging space and close to the component, for real-time monitoring of temperature change data during the operation of the component;

[0029] The data processing module is also configured to receive the temperature change data, calculate the thermal stress component, the thermal stress component being determined based on the product of the temperature change rate and the material's thermal expansion coefficient, and couple the thermal stress component with the first stress and the second stress to correct the calculation of the influence rate.

[0030] When the temperature change rate exceeds the first preset threshold, the thickness parameter in the first setting data of the stress isolation layer or the elastic modulus ratio coefficient k in the second setting data of the stress transmission layer is adjusted by reducing the thickness of the stress isolation layer within the first preset adjustment range or increasing the increment of the elastic modulus ratio coefficient k within the second preset adjustment range.

[0031] Based on the thermal stress component, output thermal stress feedback signal, optimize the test parameters of the packaging conditions, and calibrate the influence rate of the packaging conditions on the stress isolation layer and stress transfer layer.

[0032] A second aspect of the present invention provides a method for testing the stress of a component package, comprising the following steps:

[0033] S1. A plurality of first pressure sensors and a plurality of second pressure sensors are provided within the encapsulation space defined by the housing, wherein the first pressure sensors are disposed on one side of the component and have at least two contact surfaces with the component with different force directions, and the second pressure sensors are disposed in the stress isolation layer.

[0034] S2. Based on the linear proportional relationship of the elastic modulus in the elastic transfer layer, the test process is divided into multiple stress stages, each stage corresponding to a preset stress increment range. The first stage corresponds to the low stress level test of the stress isolation layer, the second stage corresponds to the transition stress level test of the stress transfer layer, and the third stage corresponds to the high stress level test of the component surface.

[0035] S3. Receive pressure data from the first pressure sensor and the second pressure sensor at each stress stage to monitor stress changes transmitted from the stress isolation layer toward the component.

[0036] S4. Calculate the influence rate of the packaging conditions on the stress isolation layer and the influence rate on the stress transmission layer based on the pressure data;

[0037] S5. Determine the packaging conditions under which the actual stress of the component during operation is always lower than the allowable stress threshold based on the influence rate. The packaging conditions include the first setting data of the stress isolation layer and the second setting data of the stress transfer layer.

[0038] S6. Monitor the temperature change data of the components in real time during operation, calculate the thermal stress component, and couple the thermal stress component with the pressure data to correct the influence rate;

[0039] S7. When the temperature change rate exceeds the first preset threshold, dynamically adjust the thickness parameter of the stress isolation layer or the elastic modulus ratio coefficient of the elastic transfer layer to compensate for the thermal stress effect and ensure that the actual stress is lower than the allowable stress threshold.

[0040] Compared with the prior art, the present invention has the following advantages:

[0041] In this invention, the first pressure sensor forms a bidirectional contact surface with the component, while a second pressure sensor monitors the stress isolation layer, enabling synchronous sampling of multi-dimensional stress components in the packaging structure. The resulting packaging condition influence rate calculation method accurately quantifies the dynamic correlation between the stress isolation layer and the stress transmission layer, avoiding optimization deviations caused by traditional single stress monitoring, and fundamentally ensuring that the actual stress of the component remains below the safety threshold under all operating conditions.

[0042] A staged stress testing mechanism based on a linear scaling factor of the elastic modulus has, for the first time, achieved layer-by-layer decoupling analysis of the stress transmission path. This mechanism divides the testing process into a low-stress stage for the stress isolation layer, a transition stage for the stress transmission layer, and a high-stress stage for the components. This allows packaging condition optimization to no longer rely on the final stress result, but rather on independent monitoring data based on the transition stress level of the stress transmission layer. With the collaboration of multi-directional sensors, the system can accurately capture the stress gradient change pattern transmitted from the stress isolation layer to the components, revealing the sensitive response mechanism of the elastic modulus scaling factor of the elastic transmission layer to the load buffering effectiveness. This source monitoring of the stress transmission path overcomes the limitations of traditional technologies that only focus on overall stress, providing a physical basis for the scientific fitting of the influence rate curve and significantly improving the predictability and engineering applicability of packaging optimization.

[0043] The thermal stress coupling mechanism achieves real-time coupling correction of thermal stress components and multidimensional stresses through the dynamic correlation between temperature sensors and pressure data. When the rate of temperature change exceeds a threshold under thermal cycling conditions, the system automatically adjusts the thickness parameter of the stress isolation layer or the proportional coefficient of the elastic modulus of the elastic transfer layer to ensure that a stress safety margin is maintained under thermo-mechanical composite loads. Combined with a phased stress testing framework, this closed-loop feedback mechanism upgrades packaging condition optimization from static parameter adjustment to dynamic path control, effectively solving the problem of thermal stress accumulation caused by the lag in the response of the stress transfer layer. Ultimately, this invention, through precise testing and control of the stress transfer layer, not only avoids the risk of local stress concentration but also establishes a quantitative correlation model between packaging conditions and component reliability, providing irreplaceable technical support for the reliability design of highly integrated electronic components. Attached Figure Description

[0044] The present invention will be further described with reference to the accompanying drawings, but the embodiments in the drawings do not constitute any limitation on the present invention. For those skilled in the art, other drawings can be obtained based on the following drawings without creative effort.

[0045] Figure 1 This is a schematic diagram of the component packaging structure provided in an embodiment of the present invention.

[0046] Figure 2 This is provided by the embodiments of the present invention. Figure 1 A schematic diagram at point A in the middle;

[0047] Figure 3 This is a schematic diagram of the component packaging stress testing system provided by the present invention.

[0048] The components include: 1. housing; 2. components; 3. first pressure sensor; 4. second pressure sensor; 5. stress isolation layer; 6. stress transmission layer; 7. rigid transmission layer; and 8. elastic transmission layer. Detailed Implementation

[0049] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0050] This disclosure provides a component packaging stress testing system, such as... Figure 1-3 As shown, the system includes a sensor assembly and a data processing module. The system aims to collect stress data during the packaging process using the sensor assembly and transmit it to the data processing module for analysis and processing, thereby providing a scientific basis for stress testing in component packaging.

[0051] Specifically, the sensor components in the embodiments of this disclosure include:

[0052] First pressure sensor: Configured to acquire first stress data of the component surface and stress transfer layer. In this embodiment, the first pressure sensor uses a semiconductor chip as the test object, acquiring stress data of the chip surface during the packaging process and stress data transferred from the stress transfer layer to the component as first stress data. The first pressure sensor is disposed within the packaging space defined by the housing, and at least one first pressure sensor is located on one side of the component, forming two contact surfaces with the component in different force directions. The first stress data can reflect the actual stress state of the component during the packaging process, providing basic data support for determining packaging conditions. In this embodiment, the first pressure sensor adopts a miniature piezoresistive sensor with dimensions of 0.5mm × 0.5mm × 0.2mm, a range of 0-50MPa, and an accuracy of ±0.5%FS, capable of accurately measuring the stress distribution in a small area.

[0053] The second pressure sensor is configured to collect second stress data of the stress isolation layer. In this embodiment, the second pressure sensor is embedded to collect stress transfer characteristic data of the stress isolation layer during the packaging process. The second stress data can intuitively reflect the buffering effect of the stress isolation layer on the packaging stress, which helps to evaluate the reliability of the packaging structure. In this embodiment, the second pressure sensor is a thin-film pressure sensor with a thickness of 0.1 mm, a diameter of 1.0 mm, a range of 0-20 MPa, and a response time of 0.1 ms, which can monitor the dynamic stress changes of the stress isolation layer in real time.

[0054] Stress transmission layer: Configured to connect multiple consecutively arranged first pressure sensors, including a rigid transmission layer and an elastic transmission layer. In this embodiment, the stress transmission layer consists of alternating rigid and elastic transmission layers, with multiple first pressure sensors spaced apart between adjacent elastic transmission layers. The elastic moduli of the multiple elastic transmission layers arranged from the stress isolation layer towards the component direction are linearly proportional. This structural design allows stress to be transmitted in an orderly manner along a predetermined path, facilitating the analysis of stress distribution characteristics at different levels. In this embodiment, the rigid transmission layer is made of a copper alloy material with a thickness of 0.05 mm, and the elastic transmission layer is made of polydimethylsiloxane material. Its elastic modulus increases linearly from the stress isolation layer towards the component direction with a constant k, where k is set to 1.1, and the difference in elastic modulus between adjacent elastic transmission layers is 0.5 MPa.

[0055] Specifically, the data processing module in this embodiment of the disclosure is configured as follows:

[0056] The system receives pressure data from both the first and second pressure sensors. In this embodiment, the data processing module acquires the pressure data collected by the sensor components in real time via wired or wireless means. The data processing module acts as a bridge for data interaction between the system and the sensor components, ensuring that the system can obtain accurate stress test data.

[0057] The first and second influence rates are calculated. In this embodiment, the data processing module calculates the first influence rate of the packaging conditions on the stress isolation layer and the second influence rate on the stress transfer layer based on the first and second stresses. The first influence rate is defined as the ratio of the actual stress change of the component to the change in the stress isolation layer parameters when the stress isolation layer parameters change; the second influence rate is defined as the ratio of the actual stress change of the component to the change in the stress transfer layer parameters when the stress transfer layer parameters change. For example, when the stress isolation layer thickness increases by 0.1 mm, resulting in a decrease of 0.8 MPa in the actual stress of the component, the first influence rate is 8 MPa / mm; when the elastic modulus proportionality coefficient k of the elastic transfer layer increases by 0.1 (i.e., Δk=0.1), resulting in a decrease of 1.2 MPa in the actual stress of the component, the second influence rate is 12 MPa / 0.1k. Here, "0.1k" indicates that the change in the elastic modulus proportionality coefficient k is 0.1 units, consistent with the unit method of "mm" representing the thickness change in the first influence rate. By analyzing the first and second stresses, the data processing module assesses the sensitivity of the impact of changes in packaging conditions on the stress of components, providing a basis for subsequent optimization of packaging conditions.

[0058] The packaging conditions are determined. In this embodiment, the data processing module determines the packaging conditions when the actual stress of the component during operation is consistently lower than the allowable stress threshold, based on the calculated first and second influence rates. The packaging conditions include first setting data for the stress isolation layer and second setting data for the stress transfer layer. The first setting data includes the thickness and material parameters of the stress isolation layer, and the second setting data includes the elastic modulus proportionality coefficient and the number of layers of the elastic transfer layer. In this embodiment, the thickness of the stress isolation layer ranges from 0.1 mm to 1.0 mm, and the material parameters include elastic modulus, Poisson's ratio, and coefficient of thermal expansion; the elastic modulus proportionality coefficient k of the elastic transfer layer ranges from 0.9 to 1.2, and the number of layers is 3. The data processing module evaluates the optimization degree of the packaging conditions based on the comparison result of the first influence rate and the threshold stress. When the first influence rate is lower than 0.3 MPa / mm and the actual stress is lower than the allowable stress threshold, the packaging conditions are determined to be optimal.

[0059] A phased stress test is performed. In this embodiment, the data processing module divides the test process into multiple stress stages based on the linear proportional relationship of the elastic modulus in the elastic transfer layer. Each stage corresponds to a preset stress increment range. The first stage corresponds to the low stress level test of the stress isolation layer, with a stress range of 0-5 MPa; the second stage corresponds to the transition stress level test of the stress transfer layer, with a stress range of 5-15 MPa; and the third stage corresponds to the high stress level test of the component surface, with a stress range of 15-25 MPa. The data processing module evaluates the first and second influence rates of the packaging conditions under different stress levels using phased data and determines the critical packaging conditions where the actual stress of the component during operation is lower than the allowable stress threshold. In this embodiment, the allowable stress threshold is 20 MPa, and the critical packaging conditions refer to the combination of packaging parameters where the maximum stress on the component surface does not exceed 18 MPa when the component's operating temperature varies within the range of -40°C to 125°C.

[0060] Specifically, in the embodiments of this disclosure, the following is true:

[0061] The number of first pressure sensors is at least three sets, with each set of first pressure sensors respectively disposed on the top, side, and bottom surfaces of the component. Each first pressure sensor forms two contact surfaces with the component, one vertical and one horizontal, representing different stress directions, to simultaneously acquire stress components in multiple directions. In this embodiment, the three sets of first pressure sensors are respectively mounted on the upper, side, and lower surfaces of the semiconductor chip. Each sensor set contains two mutually perpendicular sensing units, capable of simultaneously measuring stress components in the X and Y axes. This multi-directional stress monitoring design enables the system to comprehensively capture the three-dimensional stress distribution of the component during the packaging process, avoiding data deviations caused by traditional single-directional stress monitoring.

[0062] At least two second pressure sensors are evenly distributed on the inner and outer surfaces of the stress isolation layer to test the bidirectional stress transfer characteristics of the stress isolation layer during the packaging process. In this embodiment, the two second pressure sensors are embedded in the inner and outer interfaces of the stress isolation layer, respectively. The inner interface sensor monitors the stress transferred to the component, while the outer interface sensor monitors the stress input from the package housing. This bidirectional stress monitoring design enables the system to accurately quantify the buffering effectiveness of the stress isolation layer, providing data support for optimizing the parameters of the stress isolation layer.

[0063] The data processing module is configured to perform influence rate curve fitting. In this embodiment, the data processing module fits an influence rate curve based on historical data of the first and second stresses. This influence rate curve characterizes the sensitivity of encapsulation condition changes to the first and second stresses. When the slope of the influence rate curve is less than 0.2 MPa / mm, it is determined that the first setting data of the stress isolation layer and the second setting data of the stress transfer layer are in the optimization range, and recommended parameters for the encapsulation conditions are output, including the thickness adjustment value of the stress isolation layer and the elastic modulus proportional coefficient correction value of the elastic transfer layer. In this embodiment, the data processing module uses the least squares method for curve fitting, and the adjustment step size of the recommended parameters is 0.05 mm for the stress isolation layer thickness and 0.05 for the elastic modulus proportional coefficient.

[0064] The data processing module is also configured to perform stress increment adjustment. In this embodiment, the data processing module outputs an adjustment signal for the externally applied stress based on the test results of each stress stage. When the first stage test shows a first influence rate higher than 0.4 MPa / mm, the stress increment in subsequent stages is reduced to ensure that the actual stress of the component during operation is always lower than the allowable stress threshold. The data processing module also generates a packaging condition evaluation report, including optimized data for the first setting data of the stress isolation layer and the second setting data of the stress transfer layer, as well as safety threshold data for the component at each stress stage. In this embodiment, when the first influence rate in the first stage exceeds 0.4 MPa / mm, the data processing module automatically reduces the stress increment in subsequent stages from 2 MPa to 1.5 MPa to ensure that the maximum stress on the component surface does not exceed the safety threshold of 18 MPa.

[0065] The data processing module is also configured to monitor temperature change data. In this embodiment, a temperature sensor is placed within the packaging space and close to the component to monitor temperature changes during the component's operation in real time. The temperature sensor uses a miniature thermocouple with dimensions of 0.3mm × 0.3mm, a temperature range of -50℃ to 150℃, and an accuracy of ±0.5℃. The data processing module receives the temperature change data, calculates the thermal stress component, which is determined based on the product of the temperature change rate and the material's coefficient of thermal expansion. The thermal stress component is then coupled with a first stress and a second stress to correct the calculation of the first and second influence rates. When the temperature change rate exceeds 5℃ / min, the data processing module automatically adjusts the thickness parameter of the stress isolation layer or the elastic modulus proportionality coefficient of the elastic transfer layer. This is achieved by reducing the thickness of the stress isolation layer within the range of 0.05mm to 0.15mm or increasing the increment of the elastic modulus proportionality coefficient within the range of 0.05 to 0.15, to compensate for the thermal stress effect and ensure that the actual stress is below the allowable stress threshold. In this embodiment, the thermal stress feedback signal is used to optimize the test parameters of the packaging conditions and calibrate the influence rate of the packaging conditions on the stress isolation layer and stress transfer layer, so that the system can maintain the surface stress of the components within a safe range during thermal cycling tests.

[0066] The data processing module is further configured to calculate a third influence rate, defined as the degree of interference of sensor physical characteristics on the actual stress measurement value of the component; the sensor physical characteristics include the thickness and stiffness of the first pressure sensor and the embedding depth of the second pressure sensor; the data processing module corrects the first and second influence rates based on the third influence rate to eliminate the interference of the sensor itself on the packaging stress measurement; the data processing module is also configured to establish a sensor interference compensation model, which, based on the correspondence between sensor physical characteristics and measurement errors, uses the corrected first and second influence rates for the evaluation and optimization of packaging conditions to ensure that the test results accurately reflect the true packaging stress state.

[0067] In this embodiment, the data processing module calculates the third influence rate based on the sensor's physical characteristics. This third influence rate is defined as the degree of interference of the sensor's own physical characteristics on the actual stress measurement value of the component. The sensor's physical characteristics include the thickness and stiffness of the first pressure sensor and the embedding depth of the second pressure sensor. For example, when an increase of 0.01 mm in the thickness of the first pressure sensor leads to an increase of 0.05 MPa in the measured stress value, the third influence rate is 5 MPa / mm; when an increase of 0.02 mm in the embedding depth of the second pressure sensor leads to an increase of 0.03 MPa in the measured stress value, the third influence rate is 1.5 MPa / mm. It should be clarified that the sensor exists only as a testing tool and does not participate in the final packaging structure. Therefore, the role of the third influence rate is to quantify the degree of interference of the sensor on the measurement results, rather than to adjust the sensor configuration.

[0068] In this embodiment, the data processing module corrects the first and second influence rates based on the third influence rate. Specifically, the data processing module establishes a sensor interference compensation model, which experimentally calibrates the correspondence between sensor physical characteristics and measurement errors. For example, by measuring the sensor output under conditions without encapsulation stress, the sensor's own stress response characteristics are determined; then, by comparing the measured values ​​under conditions with encapsulation stress, the measurement deviation introduced by the sensor is calculated. When the thickness of the first pressure sensor is 0.2 mm, the measured value is typically about 0.1 MPa higher than the actual stress, and the data processing module corrects the original measurement data accordingly.

[0069] In the specific implementation process, the data processing module uses the corrected first and second influence rates for the evaluation and optimization of packaging conditions. For example, when the original measured first influence rate is 8 MPa / mm, after considering the third influence rate correction, the actual first influence rate is adjusted to 7.8 MPa / mm. This correction mechanism ensures that the test results accurately reflect the true packaging stress state and avoids misjudgment of packaging conditions due to sensor interference. In this embodiment, after the third influence rate correction, the accuracy of packaging condition evaluation is improved by 15%, effectively reducing the packaging design risk caused by measurement errors.

[0070] The data processing module is also configured to store a third influence rate parameter library for sensors of different specifications. This library contains correction coefficients corresponding to the physical characteristics of various sensors. Before the test begins, the system automatically retrieves the corresponding correction coefficients according to the specifications of the sensor used, thereby automatically correcting the first and second influence rates. This covers the test scenarios and ensures the consistency and comparability of data under different test conditions.

[0071] This disclosure also provides a method for testing component packaging stress, including the following steps:

[0072] Step S1: Multiple first pressure sensors and multiple second pressure sensors are disposed within the encapsulation space defined by the housing. The first pressure sensors are disposed on one side of the component and have at least two contact surfaces with the component exhibiting different force directions. The second pressure sensors are disposed within the stress isolation layer. In this embodiment, the first pressure sensors are miniature piezoresistive sensors, mounted on the top, side, and bottom surfaces of the semiconductor chip, with each sensor forming contact with the chip surface in both vertical and horizontal directions. The second pressure sensors are thin-film pressure sensors, embedded in the inner and outer surfaces of the stress isolation layer.

[0073] Step S2: Based on the linear proportional relationship of the elastic modulus in the elastic transfer layer, the test process is divided into multiple stress stages. Each stage corresponds to a preset stress increment range. The first stage corresponds to the low stress level test of the stress isolation layer, the second stage corresponds to the transition stress level test of the stress transfer layer, and the third stage corresponds to the high stress level test of the component surface. In this embodiment, the stress range of the first stage is 0-5 MPa, the stress range of the second stage is 5-15 MPa, and the stress range of the third stage is 15-25 MPa, with a stress increment of 2 MPa in each stage.

[0074] Step S3: Receive pressure data from the first and second pressure sensors at each stress stage to monitor stress changes transmitted from the stress isolation layer towards the component. In this embodiment, the system collects pressure data every 0.5 seconds, acquiring at least 20 sets of data at each stress stage to ensure the reliability of the test results.

[0075] Step S4: Calculate the first influence rate and the second influence rate based on the pressure data. In this embodiment, the formula for calculating the first influence rate is: First influence rate = Δσ / ΔC, where Δσ represents the actual stress change of the component and ΔC represents the change in the stress isolation layer parameters; the formula for calculating the second influence rate is: Second influence rate = Δσ / ΔD, where ΔD represents the change in the stress transfer layer parameters. For example, when an increase of 0.1 mm in the stress isolation layer thickness leads to a decrease of 0.8 MPa in the actual stress of the component, the first influence rate is 8 MPa / mm; when an increase of 0.1 in the elastic modulus proportionality coefficient k of the elastic transfer layer leads to a decrease of 1.2 MPa in the actual stress of the component, the second influence rate is 12 MPa / 0.1k.

[0076] Step S5: Determine the packaging conditions when the actual stress of the component during operation is consistently lower than the allowable stress threshold based on the first influence rate and the second influence rate. The packaging conditions include the first setting data for the stress isolation layer and the second setting data for the stress transfer layer. In this embodiment, when the first influence rate is lower than 0.3 MPa / mm and the actual stress is lower than 20 MPa, the system determines that the current packaging conditions are optimal and outputs parameters such as the thickness and material parameters of the stress isolation layer, the elastic modulus ratio coefficient and the number of layers of the elastic transfer layer.

[0077] Step S6: Monitor the temperature change data of the components in real time during operation, calculate the thermal stress component, and couple the thermal stress component with the pressure data to correct the first and second influence rates. In this embodiment, the formula for calculating the thermal stress component is: thermal stress = temperature change rate × material thermal expansion coefficient × elastic modulus. The system vector-superimposes the thermal stress component with the mechanical stress to obtain the comprehensive stress value, and recalculates the first and second influence rates.

[0078] Step S7: When the temperature change rate exceeds the first preset threshold, dynamically adjust the thickness parameter of the stress isolation layer or the elastic modulus proportionality coefficient of the elastic transfer layer to compensate for the influence of thermal stress and ensure that the actual stress is lower than the allowable stress threshold. In this embodiment, when the temperature change rate exceeds 5℃ / min, the system automatically reduces the thickness of the stress isolation layer by 0.1mm or increases the elastic modulus proportionality coefficient by 0.1 to keep the maximum stress on the component surface within a safe range of below 18MPa.

[0079] This embodiment acquires first stress data on the component surface and stress transfer layer using a first pressure sensor. The data processing module then calculates the first influence rate of the packaging conditions on the stress isolation layer and the second influence rate on the stress transfer layer based on this data. This dual-path stress monitoring mechanism fully considers the interaction between the materials in each layer of the packaging structure, providing a scientific basis for stress testing of components with different packaging requirements and improving the reliability of the packaging design.

[0080] This embodiment of the disclosure uses a second pressure sensor to collect second stress data of the stress isolation layer. The data processing module combines this data with the first stress data to evaluate the first and second influence rates of the packaging conditions under different stress levels. The data processing module fits an influence rate curve based on historical data, and outputs recommended parameters when the curve slope is lower than a preset ratio. The data processing module dynamically adjusts the stress increment based on the test results to ensure that the actual stress of the component is always below the allowable threshold. This closed-loop testing mechanism achieves precise control of the packaging stress, making the packaging design more scientific and reasonable, and ensuring that the component maintains high reliability across the entire operating temperature range.

[0081] The first pressure sensor employs a multi-directional arrangement, enabling simultaneous acquisition of stress components from multiple directions. The second pressure sensor, through a bidirectional monitoring design, comprehensively assesses the stress transmission characteristics of the stress isolation layer. The data processing module utilizes a thermal-stress coupling mechanism to achieve accurate assessment of the stress state under thermo-mechanical combined loads. When the temperature change rate exceeds a threshold, the data processing module automatically adjusts the packaging parameters, providing comprehensive stress protection for the components.

[0082] The method provided in this disclosure divides the stress testing process into three stages: the isolation layer, the transfer layer, and the components. It employs monitoring strategies with varying levels of precision and calculates a first influence rate and a second influence rate at the end of each stage. Based on the influence rate indicators, a predefined parameter adjustment strategy is applied. When the first influence rate is higher than a preset value, the stress increment in subsequent stages is reduced; when the first influence rate is lower than the optimization range, recommended parameters are output. This phased, adaptive testing method continuously adapts to changes in component packaging characteristics, continuously improving the scientific rigor and reliability of packaging design, and achieving refined and scientific management of component packaging stress.

[0083] The foregoing description and accompanying drawings fully illustrate embodiments of this disclosure to enable those skilled in the art to practice them. Other embodiments may include structural, logical, electrical, procedural, and other changes. The embodiments represent only possible variations. Individual components and functions are optional unless explicitly required, and the order of operations may vary. Parts and features of some embodiments may be included in or replace parts and features of other embodiments. Moreover, the terminology used in this application is for describing embodiments only and is not intended to limit the claims. As used in the description of embodiments and claims, the singular forms “a,” “an,” and “the” are intended to equally include the plural forms unless the context clearly indicates otherwise. Similarly, the term “and / or” as used in this application means including one or more of the associated listed items and all possible combinations thereof. Additionally, when used in this application, the term "comprise" and its variations "comprises" and / or "comprising" refer to the presence of stated features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof. Without further limitations, an element defined by the phrase "comprises a..." does not exclude the presence of other identical elements in the process, method, or apparatus that includes said element. In this document, each embodiment may focus on the differences from other embodiments, and similar or identical parts between embodiments can be referred to mutually. For methods, products, etc., disclosed in the embodiments, if they correspond to the method section disclosed in the embodiments, the relevant parts can be referred to the description of the method section.

[0084] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented using electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods for each specific application to achieve the described functions, but such implementation should not be considered beyond the scope of the embodiments of this disclosure. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the described devices, apparatuses, and units can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0085] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, function, and operation of possible implementations of apparatus, methods, and computer program products according to embodiments of the present disclosure. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. In some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. In the descriptions corresponding to the flowcharts and block diagrams in the accompanying drawings, the operations or steps corresponding to different blocks may also occur in a different order than those disclosed in the description; sometimes there is no specific order between different operations or steps. For example, two consecutive operations or steps may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. Each block in a block diagram and / or flowchart, and combinations of blocks in a block diagram and / or flowchart, can be implemented using a dedicated hardware-based device that performs the specified function or action, or using a combination of dedicated hardware and computer instructions.

Claims

1. A component packaging stress testing system, characterized in that, include: Multiple first pressure sensors are disposed within an encapsulation space defined by a housing. At least one first pressure sensor is disposed on one side of a component located within the encapsulation space, and there are at least two contact surfaces with the component in two different force directions, one vertical and one horizontal. Multiple second pressure sensors are disposed within the encapsulation space, and at least one second pressure sensor is disposed within a stress isolation layer located within the encapsulation space; Furthermore, multiple consecutively arranged first sensors are connected by a stress transmission layer, which includes a rigid transmission layer and an elastic transmission layer. Multiple first sensors are spaced apart between adjacent elastic transmission layers, and the elastic moduli of the multiple elastic transmission layers arranged from the stress isolation layer toward the component direction are set in a linear proportional relationship. The first pressure sensor is configured to test a first stress acting on the surface of the component and the stress transmission layer; The second pressure sensor is configured to test a second stress acting on the surface of the stress isolation layer; The data processing module is configured to calculate the influence rate of the packaging conditions on the stress isolation layer and the influence rate on the stress transmission layer based on the first stress and the second stress, and to determine the packaging conditions and test data of the packaging stress when the actual stress of the component during operation is always lower than the allowable stress threshold based on the influence rate.

2. The component packaging stress testing system according to claim 1, characterized in that, The packaging conditions include first setting data for the stress isolation layer and second setting data for the stress transfer layer. The first setting data includes the thickness and material parameters of the stress isolation layer, and the second setting data includes the elastic modulus proportionality coefficient and the number of layers of the elastic transfer layer. The setting is achieved by setting the elastic modulus of the elastic transfer layer from the stress isolation layer to the component direction to increase or decrease linearly by a proportional constant k. The data processing module evaluates the optimization degree of the packaging conditions based on the comparison result of the influence rate and the threshold stress. When the influence rate is lower than the preset critical value and the actual stress is lower than the allowable stress threshold, the packaging conditions are determined to be optimal.

3. The component packaging stress testing system according to claim 2, characterized in that, The data processing module is also configured to perform the following steps: During the staged stress test, the test process is divided into multiple stress stages according to the linear ratio of the elastic modulus. Each stage corresponds to a preset stress increment range, and the stress increment range is linearly related to the elastic model. The system receives and analyzes pressure data from the first and second pressure sensors at each stage to monitor stress changes transmitted from the stress isolation layer towards the components. The first stage corresponds to the low stress level test of the stress isolation layer. The second stage corresponds to the test of the transition stress level of the stress transfer layer. The third stage corresponds to the high stress level test of the component surface; The impact rate of packaging conditions under different stress levels was evaluated by using phased data, and the critical packaging conditions under which the actual stress of the components during operation is lower than the allowable stress threshold were determined.

4. The component packaging stress testing system according to claim 3, characterized in that, The number of the first pressure sensors is at least three sets, and the first pressure sensors in each set are respectively disposed on the top surface, side surface and bottom surface of the component. Each first pressure sensor forms two contact surfaces with the component with different force directions in the vertical and horizontal directions, so as to simultaneously obtain stress components in multiple directions. The number of the second pressure sensors is at least two, which are evenly distributed on the inner surface and outer surface of the stress isolation layer, and are used to test the bidirectional stress transmission characteristics of the stress isolation layer during the packaging process.

5. The component packaging stress testing system according to claim 4, characterized in that, The data processing module is further configured to perform the following steps: Through regression analysis, an influence rate curve was fitted based on historical data of the first stress and the second stress. The influence rate curve characterizes the sensitivity of changes in packaging conditions to the first stress and the second stress. When the slope of the influence rate curve is lower than the preset ratio, it is determined that the first setting data of the stress isolation layer and the second setting data of the stress transfer layer are in the optimization range, and recommended parameters of the encapsulation conditions are output, including the thickness adjustment value of the stress isolation layer and the elastic modulus ratio coefficient correction value of the elastic transfer layer.

6. The component packaging stress testing system according to claim 5, characterized in that, The data processing module is also configured to perform the following steps: Based on the test results of each stress stage, the external applied stress signal is adjusted. When the first stage test shows that the influence rate is higher than the preset value, the stress increment in subsequent stages is reduced to ensure that the actual stress of the component during operation is always lower than the allowable stress threshold. The data processing module also generates a packaging condition evaluation report, including optimized data for the first setting of the stress isolation layer and the second setting of the stress transfer layer, as well as safety threshold data for the components at each stress stage.

7. The component packaging stress testing system according to claim 6, characterized in that, It also includes a temperature sensor, which is located within the packaging space and close to the component, for real-time monitoring of temperature change data during the operation of the component; The data processing module is also configured to receive the temperature change data, calculate the thermal stress component, the thermal stress component being determined based on the product of the temperature change rate and the material's thermal expansion coefficient, and couple the thermal stress component with the first stress and the second stress to correct the calculation of the influence rate. When the temperature change rate exceeds the first preset threshold, the thickness parameter in the first setting data of the stress isolation layer or the elastic modulus ratio coefficient k in the second setting data of the stress transmission layer is adjusted by reducing the thickness of the stress isolation layer within the first preset adjustment range or increasing the increment of the elastic modulus ratio coefficient k within the second preset adjustment range. Based on the thermal stress component, output thermal stress feedback signal, optimize the test parameters of the packaging conditions, and calibrate the influence rate of the packaging conditions on the stress isolation layer and stress transfer layer.

8. A method for testing the stress of a component package, characterized in that, Includes the following steps: S1. A plurality of first pressure sensors and a plurality of second pressure sensors are provided within the encapsulation space defined by the housing, wherein the first pressure sensors are disposed on one side of the component and have at least two contact surfaces with the component with different force directions, and the second pressure sensors are disposed in the stress isolation layer. S2. Based on the linear proportional relationship of the elastic modulus in the elastic transfer layer, the test process is divided into multiple stress stages, each stage corresponding to a preset stress increment range. The first stage corresponds to the low stress level test of the stress isolation layer, the second stage corresponds to the transition stress level test of the stress transfer layer, and the third stage corresponds to the high stress level test of the component surface. S3. Receive pressure data from the first pressure sensor and the second pressure sensor at each stress stage to monitor stress changes transmitted from the stress isolation layer toward the component. S4. Calculate the influence rate of the packaging conditions on the stress isolation layer and the influence rate on the stress transmission layer based on the pressure data; S5. Determine the packaging conditions under which the actual stress of the component during operation is always lower than the allowable stress threshold based on the influence rate. The packaging conditions include the first setting data of the stress isolation layer and the second setting data of the stress transfer layer. S6. Monitor the temperature change data of the components in real time during operation, calculate the thermal stress component, and couple the thermal stress component with the pressure data to correct the influence rate; S7. When the rate of temperature change exceeds the first preset threshold, dynamically adjust the thickness parameter of the stress isolation layer or the elastic modulus ratio coefficient of the elastic transfer layer to compensate for the influence of thermal stress and ensure that the actual stress is lower than the allowable stress threshold.

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