Coil device and semiconductor process equipment

Abstract

The invention provides a coil device and semiconductor process equipment, and the coil device comprises a fixed coil, a split coil and a conductive part, a strong magnetic area and a weak magnetic area are formed on the fixed coil, and the split coil is movably connected with the fixed coil and can move to the position corresponding to the weak magnetic area; the conductive part is used for conducting the split coil and the fixed coil to form a current loop. In the technological process, the split coil can move to the position corresponding to the weak magnetic area. The conductive member can electrically connect the two ends of the split coil with the fixed coil to form a current loop, and current passes through the split coil to generate a magnetic field, so that the magnetic field intensity of the strong and weak magnetic area is compensated, the uniformity of the magnetic field intensity is improved, and the wafer processing uniformity is further improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing, and more specifically, to a coil device and semiconductor process equipment. Background Technology

[0002] Plasma dry etching involves introducing various process gases (such as chlorine, silicon chloride, hydrobromic acid, perfluorobutadiene, and oxygen) into a high-vacuum reaction chamber, and then exciting these gases into a plasma state using an external magnetic field. In inductively coupled plasma (ICP) etching, an inductor coil is placed above the vacuum chamber. Applying a high-frequency current to the coil generates a magnetic field that penetrates a dielectric window (typically made of ceramic or quartz) below the inductor coil, exciting the process gases in the vacuum chamber into a plasma state. The plasma contains a large number of active particles, including electrons, positive and negative ions, excited atoms, molecules, and free radicals. These active particles interact with the wafer surface placed in the reaction chamber, physically and chemically removing the unmasked portions of the wafer surface. Byproducts from the bombardment are removed by a vacuum pump, completing the etching process.

[0003] Plasma is a type of charged particle whose distribution is disordered in the absence of external interference. When it moves in a magnetic field, it is affected by the Lorentz force perpendicular to the magnetic field direction, which accelerates its movement in that direction. Therefore, the magnetic field strength affects the velocity of the plasma, and thus the etching rate. Due to the uneven distribution of magnetic field strength, over-etching or under-etching often occurs during wafer fabrication.

[0004] While existing technologies can improve over-etching or under-etching in certain areas to some extent, they lack sufficient precision and have a limited adjustment range for etching uniformity. Therefore, improving the uniformity of magnetic field distribution is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0005] This application aims to solve at least one of the technical problems existing in the prior art, and proposes a coil device and semiconductor process equipment that can improve the uniformity of magnetic field distribution.

[0006] To achieve the purpose of this application, a coil device is provided for semiconductor process equipment, comprising a fixed coil, a split coil, and a conductive element, wherein;

[0007] The fixed coil has a strong magnetic region and a weak magnetic region. The split coil is movably connected to the fixed coil and can move to the position corresponding to the weak magnetic region.

[0008] The conductive element is used to conduct current through the split coil and the fixed coil to form a current loop.

[0009] In some embodiments, the fixed coil has a plurality of mounting positions for mounting the split coil, the plurality of mounting positions being distributed circumferentially along the fixed coil, and the split coil being selectively connected to the mounting positions.

[0010] In some embodiments, the conductive element includes a fixed conductive element and a flexible conductive element, and the split coil includes a fixed end and a movable end, wherein the fixed end is rotatably connected to the mounting position;

[0011] The fixed conductive member is used to electrically connect the fixed end to the fixed coil, and the flexible conductive member is used to electrically connect the movable end to the fixed coil. The length of the flexible conductive member is greater than the length of the fixed conductive member.

[0012] In some embodiments, a connector is also included, wherein the mounting position has a connection through hole and the two ends of the split coil have connection holes;

[0013] The connector is used to connect the connecting hole at one end of the split coil to one of the connecting through holes in the mounting position;

[0014] The end of the split coil connected to the connector is the fixed end, and the other end is the movable end.

[0015] In some embodiments, the fixed conductive element and the flexible conductive element are detachably connected to the fixed coil and the split coil;

[0016] The conductive element and the flexible conductive element selectively connect the split coil and the fixed coil according to the distribution of the weak magnetic region.

[0017] In some embodiments, the connecting hole is located on the side of the split coil facing the fixed coil, and all connecting holes are blind holes.

[0018] In some embodiments, the connector is tubular, and the fixed conductive element can be inserted through the connector.

[0019] In some embodiments, the fixed conductive element includes a fixed conductive post, which can pass through the connecting through hole and the connecting hole.

[0020] In some embodiments, the fixed conductive element further includes a first conductive element, which is mounted on the outer peripheral surface of the fixed conductive post, and the outer wall of the first conductive element is used to fit against the inner wall of the connecting through hole and the inner wall of the connecting hole.

[0021] In some embodiments, the flexible conductive element includes a connecting cable, a first conductive post, and a second conductive post, wherein the second conductive post can pass through the connecting through hole, and the connecting cable connects the first conductive post and the second conductive post.

[0022] In some embodiments, the flexible conductive element further includes at least two second conductive elements, which are respectively mounted on the outer peripheral surfaces of the first conductive post and the second conductive post. The outer wall of the second conductive element on the outer periphery of the first conductive post is attached to the inner wall of the connecting through hole, and the outer wall of the second conductive element on the outer periphery of the second conductive post is attached to the inner wall of the connecting hole.

[0023] In some embodiments, the edges of both ends of the split coil are rounded.

[0024] In some embodiments, the fixed coil includes a plurality of concentrically arranged annular coils, the strong magnetic region includes the area corresponding to the annular coils, and the weak magnetic region includes the area corresponding to the gap between two adjacent annular coils.

[0025] This application also provides a semiconductor process apparatus, including a radio frequency (RF) device and any of the above-described coil devices, wherein the RF device is connected to the fixed coil and feeds RF signals into the fixed coil.

[0026] In some embodiments, the device further includes a reaction chamber, a base, and a dielectric window. The base is located inside the reaction chamber for supporting the wafer. The dielectric window is located at the top of the reaction chamber. The coil assembly is located above the reaction chamber. The split coil is located on the side of the fixed coil near the dielectric window.

[0027] This application has the following beneficial effects:

[0028] The coil device provided in this application is used in semiconductor process equipment, including a fixed coil, a split coil, and conductive components, wherein;

[0029] The fixed coil has a strong magnetic region and a weak magnetic region, and the split coil is movably connected to the fixed coil and can move to the position of the corresponding weak magnetic region.

[0030] Conductive components are used to conduct current through the split coil and the fixed coil to form a current loop.

[0031] During the process, the split coil can be moved to the corresponding weak magnetic field area. The conductive component can electrically connect the two ends of the split coil to the fixed coil to form a current loop. The current passing through the split coil generates a magnetic field, thereby strengthening the magnetic field strength in the weak magnetic field area, improving the uniformity of the magnetic field strength, and thus improving the uniformity of wafer processing.

[0032] This application also provides a semiconductor process apparatus including the above-described coil device, and has the aforementioned advantages. Attached Figure Description

[0033] Figure 1 A schematic diagram of the structure of a coil device provided in a specific embodiment of this application;

[0034] Figure 2 for Figure 1 A partial exploded view of the central coil assembly;

[0035] Figure 3 for Figure 1 A schematic diagram of a structure in which a fixed coil and a separate coil are connected by a fixed conductive component and a connector;

[0036] Figure 4 for Figure 3 Schematic diagram of the structure of the fixed conductive component;

[0037] Figure 5 This is a schematic diagram of the structure of a flexible conductive component;

[0038] Figure 6 A schematic diagram showing the connection between the fixed coil and the split coil;

[0039] Figure 7 This is a schematic diagram of the structure after the angle of the split coil has been adjusted.

[0040] Figure 8 for Figure 1 A schematic diagram of the structure in which the coil device and the process chamber are integrated;

[0041] Figure 9 A top view of the split coil after angle adjustment;

[0042] Figure 10 This is a cross-sectional view of a semiconductor process equipment.

[0043] in, Figures 1 to 10 The attached figures are labeled as follows:

[0044] 100. Fixed coil; 110. Ring coil; 111. Connecting through hole; 200. Split coil; 201. Connecting hole; 300. Connector; 400. Fixed conductive component; 410. Fixed conductive post; 411. First mounting groove; 412. First limiting stage; 420. First conductive component; 500. Flexible conductive component; 501. Second mounting groove; 510. First conductive post; 511. Second limiting stage; 520. Second conductive post; 530. Connecting cable; 540. Second conductive component; 600. Medium window; 700. Reaction chamber; 800. Base. Detailed Implementation

[0045] To enable those skilled in the art to better understand the technical solutions of this application, the coil device and semiconductor process equipment provided in this application will be described in detail below with reference to the accompanying drawings.

[0046] The coil device provided in this application is used in semiconductor process equipment. The coil device includes a fixed coil 100, a separate coil 200, and conductive components, wherein;

[0047] The fixed coil 100 has a strong magnetic region and a weak magnetic region. The fixed coil 100 is connected to the radio frequency (RF) device of the semiconductor process equipment, which feeds RF signals into the fixed coil 100. RF current flows through the fixed coil 100, generating a magnetic field that can excite the process gas into plasma. Due to the presence of gaps in the fixed coil 100, the areas through which current flows form strong magnetic regions, while the areas where the gaps are located do not have current flow, forming weak magnetic regions. The plasma in the strong magnetic regions moves faster, resulting in a faster etching rate; the plasma in the weak magnetic regions moves slower, resulting in a slower etching rate. This difference in etching rates between the strong and weak magnetic regions causes uneven etching on the wafer surface, affecting product quality.

[0048] Optionally, the fixed coil 100 is typically located within a preset plane, and the wafer can be placed parallel to the preset plane during wafer processing. The orthographic projection of the fixed coil 100 onto the preset plane corresponds to a strong magnetic region, and the orthographic projection of the gap in the fixed coil 100 onto the preset plane corresponds to a weak magnetic region. For example, as... Figure 1 and Figure 2 As shown, the fixed coil 100 includes a plurality of concentrically arranged annular coils 110, with gaps between adjacent annular coils 110. Of course, the fixed coil 100 may also take other shapes, such as involutes, etc., which are not limited here.

[0049] Optionally, the multiple ring coils 110 of the fixed coil 100 are all located within a preset plane. During the machining of the fixed coil 100, the overall flatness should be ensured, typically less than or equal to 0.1. The flatness of the fixed coil 100 affects its distance from the dielectric window 600; good flatness ensures a more uniform magnetic field strength generated by the fixed coil 100. Each ring coil 110 is fixed by a coil bracket. The structure of the coil bracket can refer to existing technology and will not be elaborated here.

[0050] The annular gap between two adjacent ring coils 110 and the split coil 200 generates a magnetic field that reinforces the weak magnetic region, making the magnetic field strength generated by the coil device more uniform. This results in a more uniform plasma movement speed, ultimately leading to a more uniform etching rate and improved processing quality. The region corresponding to the ring coil 110 has a higher magnetic field strength and is a strong magnetic region. The region corresponding to the gap has no current flowing through it and a weak magnetic field strength, which is a weak magnetic region. The weak magnetic region may also include the circular region inside the innermost ring coil 110 and the region outside the outermost ring coil 110.

[0051] In actual operation, the distribution of strong and weak magnetic regions of the fixed coil 100 is often affected by factors such as the internal resistance, current distribution, and power supply characteristics of the fixed coil 100. Different fixed coils 100 often have different distributions of strong and weak magnetic regions.

[0052] The split coil 200 can be arranged parallel to a preset plane. The split coil 200 is movably connected to the fixed coil 100 and can move to a position corresponding to a weak magnetic field region. The movement of the split coil 200 includes translation, rotation, and a combination of both. The conductive element can be a conductive column made of rigid or flexible material, or a conductive support. For example, the split coil 200 can be connected to the fixed coil 100 via the conductive support. The split coil 200 can slide within the conductive support, allowing its orthographic projection on the preset plane to move from a strong magnetic field region to a weak magnetic field region, thereby increasing the magnetic field strength in the weak magnetic field region. The conductive element electrically connects the split coil 200 and the fixed coil 100, forming a circuit. The current in the fixed coil 100 flows through the split coil 200, generating a magnetic field at the split coil 200.

[0053] The magnetic field generated by the split coil 200 can reinforce weak magnetic regions, making the magnetic field strength generated by the coil device more uniform. This results in a more uniform plasma movement speed, ultimately leading to a more uniform etching rate and improved processing quality. It should be noted that the position of the split coil 200 typically does not coincide with that of the fixed coil 100. Specifically, the orthographic projection of the split coil 200 onto the surface of the wafer to be processed does not coincide with the orthographic projection of the fixed coil 100 onto the surface of the wafer to be processed, avoiding interference with the magnetic field strength in areas where the etching rate is normal. Of course, the above applies only to embodiments where the area corresponding to the fixed coil 100 is entirely a strong magnetic region. If the area of ​​the orthographic projection of the fixed coil 100 onto the surface of the wafer to be processed also contains weak magnetic regions, these can be reinforced by the split coil 200, and this is not a limitation here.

[0054] In some embodiments, the fixed coil 100 has a plurality of mounting positions for mounting the split coil 200, the plurality of mounting positions being distributed circumferentially along the fixed coil 100, and the split coil 200 being selectively connected to the mounting positions.

[0055] The fixed coil 100 has multiple mounting positions along the circumference. The split coil 200 can be set at the mounting position corresponding to the weak magnetic area according to the actual distribution of the strong magnetic area and weak magnetic area of ​​the fixed coil 100, thereby reinforcing the weak magnetic area.

[0056] The distribution of strong and weak magnetic regions in the fixed coil 100 usually needs to be obtained through actual measurement. For example, before the formal process begins, the test wafer can be processed by the fixed coil 100, and the distribution of strong and weak magnetic regions can be determined according to the etching condition on the test wafer. Then, the split coil 200 corresponding to the weak magnetic region is electrically connected to the fixed coil 100 to reinforce the weak magnetic region.

[0057] In this embodiment, the fixed coil 100 is provided with multiple mounting positions, which can provide accurate correspondence between the mounting positions and the weak magnetic region. The fixed coil 100 is electrically connected to the split coil 200 at the appropriate mounting position as needed to accurately reinforce the weak magnetic region, thereby improving the uniformity of the magnetic field and improving the processing quality of semiconductor process equipment.

[0058] Optionally, the split coil 200 can be arc-shaped or straight-shaped to reduce mutual interference when the split coils 200 rotate. The shorter the length of the split coil 200, the denser it can be distributed around the fixed coil 100. As needed, the corresponding split coils 200 can be electrically connected to the fixed coil 100, allowing for more precise adjustment of the magnetic field and less impact of the generated additional magnetic field on other areas. However, shorter and more numerous split coils 200 require more fixed conductive parts 400 and flexible conductive parts 500, increasing the cost of the coil device. Longer split coils 200 reduce adjustment precision but lower the cost of the coil device. The arc length or straight-line length of the split coil 200 can be set as needed and is not limited here. The split coil 200 can also be set to other shapes, such as sheet-like shapes, as needed and is not limited here.

[0059] In some embodiments, the conductive element includes a fixed conductive element 400 and a flexible conductive element 500. The split coil 200 includes a fixed end and a movable end, with the fixed end rotatably connected to the mounting position. The fixed conductive element 400 is used to electrically connect the fixed end to the fixed coil 100, and the flexible conductive element 500 is used to electrically connect the movable end to the fixed coil 100. The length of the flexible conductive element 500 is greater than the length of the fixed conductive element 400.

[0060] The fixed end and movable end of the split coil 200 are connected to the fixed coil 100 via a fixed conductive element 400 and a flexible conductive element 500, respectively. The split coil 200, the fixed conductive element 400, the fixed coil 100, and the flexible conductive element 500 form a current loop. The current in the fixed coil 100 flows through the split coil 200, generating a magnetic field at the split coil 200. The split coil 200 can rotate around the fixed conductive element 400, and the flexible conductive element 500 can deform as the split coil 200 rotates, thereby causing the movable end of the split coil 200 to swing to the position corresponding to the weak magnetic region.

[0061] The flexible conductive element 500 is capable of deformation. In this application, the length of the flexible conductive element 500 is greater than the length of the fixed conductive element 400. As the split coil 200 rotates, the distance between the movable end and the connection point on the fixed coil 100 changes. The flexible conductive element 500 deforms along with the movable end, ensuring that the movable end of the split coil 200 is always electrically connected to the fixed coil 100. The length of the flexible conductive element 500 limits the rotation range of the split coil 200. Users can set the length of the flexible conductive element 500 as needed to ensure that the rotation range of the split coil 200 meets the requirements for reinforcing the weak magnetic field region.

[0062] Optionally, the fixed coil 100 and the separate coil 200 can be made of T1 copper or T2 copper. Both T1 and T2 copper have a copper content greater than 99.90%. T1 and T2 copper have good electrical and thermal conductivity, are relatively inexpensive, and also possess excellent machinability and weldability, making them widely used in conductive components in semiconductor equipment. The fixed coil 100 can be entirely silver-plated or gold-plated to improve its conductivity and corrosion resistance. The separate coil 200 can also be silver-plated or gold-plated. Of course, other materials can also be used for the fixed coil 100 and the separate coil 200; this is not limited here.

[0063] In some embodiments, the coil device further includes a connector 300, the mounting position having a connecting through hole 111, and the two ends of the split coil 200 having connecting holes 201; the connector 300 is used to connect the connecting hole 201 at one end of the split coil 200 to a connecting through hole 111 in the mounting position; the end of the split coil 200 connected to the connector 300 is a fixed end, and the other end is a movable end.

[0064] The connector 300 can be made of dielectric materials, such as quartz, ceramic, PTFE, etc. Dielectric materials have excellent electrical insulation properties and are commonly used isolation materials in semiconductor etching equipment. Each mounting position of the fixed coil 100 can be connected to a separate coil 200 through the connector 300. After the coil device is installed in the semiconductor process equipment, the distribution of strong and weak magnetic regions of the fixed coil 100 is detected. Then, the separate coil 200 corresponding to the weak magnetic region is electrically connected to the fixed coil 100 through the fixed conductive component 400 and the flexible conductive component 500, and the separate coil 200 is adjusted to an appropriate angle.

[0065] Optionally, both ends of the connector 300 are machined with external threads, the bottom of the connecting through hole 111 of the fixed coil 100 can be machined with internal threads, and the top of the connecting hole 201 of the split coil 200 is also machined with internal threads. The upper and lower ends of the connector 300 are connected to the connecting through hole 111 and the connecting hole 201 respectively by threads. The connector 300 connects the fixed coil 100 and the split coil 200 and keeps the two coils a certain distance apart without conducting electricity. The split coil 200 can rotate in a certain circumferential direction about the connector 300 as the rotation axis. Of course, the connector 300 can also be connected to the connecting through hole 111 and the connecting hole 201 in other ways, such as interference fit or snap fit, etc., which are not limited here.

[0066] The end of the split coil 200 connected to the connector 300 is a fixed end, meaning that the connector 300 can connect any end of the split coil 200 to the fixed coil 100. For example... Figure 9 As shown, users can select the fixed end and the movable end of the split coil 200 as needed. The swing mode is different depending on the fixed position of the split coil 200. The split coil 200 can select the swing mode as needed, thereby improving the flexibility of magnetic field adjustment.

[0067] Optionally, the connection hole 201 is located on the surface of the split coil 200 facing the fixed coil 100, and all connection holes 201 are blind holes.

[0068] The connection hole 201 of the split coil 200 will not penetrate the split coil 200, which is typically located on the side of the fixed coil 100 closer to the dielectric window 600. The connection hole 201 does not extend to the surface of the split coil 200 away from the fixed coil 100, thus keeping the distance between this surface and the dielectric window 600 constant and preventing the formation of localized weak magnetic fields.

[0069] In some embodiments, the connector 300 is tubular, and the fixed conductive element 400 can be inserted into the connector 300.

[0070] The connector 300 has an internal hole, such as Figure 3As shown, when connecting the fixed coil 100 and the separate coil 200, the inner hole of the connector 300 corresponds to the connecting through hole 111 and the connecting hole 201. The fixed conductive member 400 passes through the connecting through hole 111, the inner hole, and the connecting hole 201, with its lower end inserted into the connecting hole 201. The fixed conductive member 400 fits against the inner walls of the connecting through hole 111 and the connecting hole 201, thereby electrically connecting the fixed coil 100 and the separate coil 200. The diameter of the inner hole is usually larger than the diameter of the connecting through hole 111 and the connecting hole 201 to ensure that the fixed conductive member 400 can pass through smoothly. The plug-in fit between the connector 300 and the fixed conductive member 400 reduces the installation difficulty of the fixed conductive member 400. The fixed conductive member 400 can also be used to electrically connect the fixed coil 100 and the separate coil 200 in other ways, which are not limited here.

[0071] Optionally, the fixed conductive element 400 and the flexible conductive element 500 are detachably connected to the fixed coil 100 and the split coil 200; the fixed conductive element 400 and the flexible conductive element 500 selectively conduct the split coil 200 to the fixed coil 100 according to the distribution of the weak magnetic region.

[0072] Since the fixed coil 100 has multiple mounting positions, the split coil 200 can be pre-connected to the mounting positions via the connector 300. After determining the positions of the strong magnetic region and the weak magnetic region, the operator can install the fixed conductive component 400 into the connector 300 corresponding to the weak magnetic region, and connect the corresponding split coil 200 to the fixed coil 100 via the flexible conductive component 500. The other split coils 200 corresponding to the strong magnetic region do not have the fixed conductive component 400 or the flexible conductive component 500 installed, therefore these split coils 200 will not generate a magnetic field.

[0073] In some embodiments, the fixed conductive element 400 includes a fixed conductive post 410, which can pass through the connecting through hole 111 and the connecting hole 201.

[0074] Optionally, the fixed conductive post 410 can be made of T1 copper or T2 copper. The advantages of T1 copper or T2 copper have been described above and will not be repeated here. After the fixed conductive post 410 is processed, it is plated with silver and then gold, which improves the conductivity and avoids copper oxidation, thus preventing the electrical connection from being affected. Of course, the material of the fixed conductive post 410 is not limited to these.

[0075] Optionally, the top of the fixed conductive post 410 is provided with a first limiting platform 412, the outer diameter of which is larger than the diameter of the connecting through hole 111. When the fixed conductive post 410 is inserted into the connecting through hole 111 of the fixed coil 100, the first limiting platform 412 on the top of the fixed conductive post 410 is engaged with the upper surface of the fixed coil 100 for limiting. Of course, the fixed conductive post 410 can also adopt other limiting structures, such as limiting protrusions, etc., which are not limited here.

[0076] In some embodiments, the fixed conductive member 400 further includes a first conductive member 420, which is mounted on the outer peripheral surface of the fixed conductive post 410. The outer wall of the first conductive member 420 is used to fit against the inner wall of the connecting through hole 111 and the inner wall of the connecting hole 201.

[0077] See Figure 3 and Figure 4 In the embodiment shown, the fixed conductive component 400 includes two first conductive components 420. The outer periphery of the fixed conductive post 410 is provided with two first mounting grooves 411, which correspond to the fixed coil 100 and the separate coil 200, respectively. The two first conductive components 420 are disposed in the two first mounting grooves 411. The first conductive components 420 can also be connected to the fixed conductive post 410 by welding, interference fit, or other methods; this is not limited here.

[0078] In other embodiments, the fixed conductive element 400 may include one first conductive element 420 or three or more first conductive elements 420. In embodiments where there is one first conductive element 420, the upper and lower ends of the first conductive element are respectively disposed in the connecting through hole 111 and the connecting hole 201. In embodiments where there are three or more first conductive elements 420, at least one first conductive element 420 is disposed in both the connecting through hole 111 and the connecting hole 201.

[0079] Figure 3 and Figure 4 In the specific embodiment shown, the fixed conductive post 410 is limited by a boss. When the fixed conductive post 410 is inserted into the connecting through hole 111 of the fixed coil 100, the two first mounting grooves 411 on the outer periphery of the fixed conductive post 410 correspond to the positions of the fixed coil 100 and the split coil 200, respectively, and are not completely blocked by the connector 300. Two first conductive elements 420 are respectively installed in the two first mounting grooves 411 on the outer periphery of the fixed conductive post 410. The first conductive elements 420 can be watch strap fingers, and their material can be beryllium copper plated with gold, which is commonly used in electrical connection applications. The two first conductive elements 420 installed on the fixed conductive post 410 are tightly fitted with the inner walls of the connecting through hole 111 and the connecting hole 201, respectively, to form an electrical connection, ensuring that the fixed conductive post 410 can fully contact the fixed coil 100 and the split coil 200, thereby improving the electrical connection efficiency.

[0080] In some embodiments, the flexible conductive element 500 includes a connecting cable 530, a first conductive post 510, and a second conductive post 520. The first conductive post 510 can be inserted into the connecting through hole 111, and the second conductive post 520 can be inserted into the connecting hole 201. The connecting cable 530 connects the first conductive post 510 and the second conductive post 520.

[0081] like Figure 5 As shown, the connecting cable 530 connects the ends of the first conductive post 510 and the second conductive post 520. The flexible conductive post serves to electrically connect the movable ends of the fixed coil 100 and the split coil 200. Specifically, the first conductive post 510 and the second conductive post 520 can be respectively inserted into the connecting through hole 111 and the connecting hole 201. The first conductive post 510 drives a second limiting platform 511 on its outer periphery. When the first conductive post 510 is inserted into the connecting through hole 111, the second limiting platform 511 is locked onto the upper surface of the fixed coil 100 for limiting. The first conductive post 510 fits against the inner wall of the connecting through hole 111, thereby electrically connecting to the fixed coil 100. The second conductive post 520 is inserted into the connecting hole 201 and fits against the inner wall of the connecting hole 201, thereby electrically connecting to the split coil 200. The connecting cable 530 electrically connects the first conductive post 510 and the second conductive post 520. Figure 6 As shown, when a high-frequency current is applied to the fixed coil 100, the fixed coil 100, the split coil 200, the first conductive post 510 and the second conductive post 520 form a current loop, and a magnetic field can be generated around the split coil 200 at this time.

[0082] Optionally, the first conductive post 510 and the second conductive post 520 can be made of T1 copper or T2 copper. After processing, the first conductive post 510 and the second conductive post 520 are plated with silver and then gold, which improves the conductivity and avoids copper oxidation, thus preventing the electrical connection from being affected. Of course, the materials of the first conductive post 510 and the second conductive post 520 are not limited to these.

[0083] Since the flexible conductive post is not equipped with a connector 300, the split coil 200 can rotate to a certain extent about the connector 300 as an axis in a direction parallel to the preset plane. The absolute length of the flexible conductive post (the length of the connecting cable 530 when straight) is greater than the length of the fixed conductive post 410, such as... Figure 7 As shown, when the split coil 200 rotates to its maximum angle, the projected length of the connecting cable 530 on the preset plane is 'a', the distance between the fixed coil 100 and the split coil 200 is 'b', and the length of the connecting cable 530 is 'L'. When the split coil 200 deflects at different angles, the angle θ between the line connecting the lower end of the connecting through hole 111 and the upper end of the connecting hole 201 and the projection 'a' of the connecting cable 530 will change, while the distance 'b' remains constant. The length of the connecting cable 530 when the split coil 200 rotates to its maximum angle is L = b / sinθ. Here, the length of the line connecting the lower end of the connecting through hole 111 and the upper end of the connecting hole 201 is approximated as the length of the connecting cable 530.

[0084] When the split coil 200 does not deflect, the length of the line connecting the lower end of the connecting through hole 111 and the upper end of the connecting hole 201 is equal to the distance b between the fixed coil 100 and the split coil 200. Therefore, the length of the connecting cable 530 is greater than b and less than or equal to b / sinθ. Specifically, the length of the connecting cable 530 can be determined according to the length of the split coil 200 and the required rotation angle of the split coil 200, and is not limited here.

[0085] Optionally, the first conductive post 510 and the second conductive post 520 are connected by a connecting cable 530. The first conductive post 510 and the second conductive post 520 can be connected to the connecting cable 530 by welding or threaded connection.

[0086] In some embodiments, the flexible conductive element 500 further includes at least two second conductive elements 540, which are respectively installed on the outer peripheral surfaces of the first conductive post 510 and the second conductive post 520. The outer wall of the second conductive element 540 on the outer periphery of the first conductive post 510 is attached to the inner wall of the connecting through hole 111, and the second conductive element 540 on the outer periphery of the second conductive post 520 is attached to the inner wall of the connecting hole 201.

[0087] See Figure 5 In the illustrated embodiment, both the first conductive post 510 and the second conductive post 520 have second mounting grooves 501 on their outer peripheral surfaces, corresponding to the connecting through hole 111 and the connecting hole 201, respectively. The second mounting grooves 501 of the first conductive post 510 and the second conductive post 520 are used to mount second conductive elements 540. The second conductive element 540 can be a watch strap finger, and its material can be beryllium copper plated with gold, which is commonly used in electrical connection applications. For example, there are two second conductive elements 540, with each of the first conductive post 510 and the second conductive post 520 having a second mounting groove 501. The two first conductive elements 420 are tightly fitted to the inner walls of the connecting through hole 111 and the connecting hole 201, respectively, forming an electrical connection. This ensures that the first conductive post 510 and the second conductive post 520 are in full contact with the fixed coil 100 and the separate coil 200, respectively, improving the electrical connection efficiency. In other embodiments, the number of second conductive elements 540 can be three or more.

[0088] In some embodiments, the edges of both ends of the split coil 200 are rounded.

[0089] In this embodiment, both ends of the split coil 200 are rounded to avoid sharp protrusions on the split coil 200, thereby preventing tip discharge at both ends of the split coil 200 when energized and improving the safety of the device.

[0090] This application also provides a semiconductor process apparatus, including a radio frequency (RF) device and a coil device as described in any of the above embodiments. The RF device is connected to a fixed coil 100 and feeds RF signals into the fixed coil 100. After the RF signals are fed into the fixed coil 100, a current is formed in the fixed coil 100 and between the fixed coil 100 and the split coil 200. This current generates a magnetic field, which can ionize the process gas, thereby processing the wafer.

[0091] In some embodiments, such as Figure 8 and Figure 10 As shown, the semiconductor process equipment also includes a reaction chamber 700, a dielectric window 600, and a base 800. The base 800 is located inside the reaction chamber 700 and is used to support the wafer. The dielectric window 600 is located above the reaction chamber 700, and a coil device is located above the dielectric window 600. An RF device feeds RF signals to the coil device, and the magnetic field generated by the coil device passes through the dielectric window 600, exciting the process gas inside the reaction chamber 700 into plasma, thereby processing the wafer on the base 800. A split coil 200 is located on the side of the fixed coil 100 near the dielectric window 600. The strength of the magnetic field is proportional to the distance from the coil and the current intensity in the coil. In this embodiment, the split coil 200 is placed on the side of the fixed coil 100 near the dielectric window 600. The distance between the split coil 200 and the internal space of the reaction chamber 700 is small, thus increasing the magnetic field strength of the corresponding area of ​​the split coil 200 inside the reaction chamber 700, thereby reinforcing the weak magnetic field area. Users can also adjust the distance between the split coil 200 and the dielectric window 600 by changing the length of the connector 300 and the fixed conductive part 400 as needed.

[0092] The coil device in this application allows for magnetic field adjustment of the weak magnetic region of the fixed coil 100 by rotating the split coil 200. Figure 8 and Figure 10 As shown, the split coil 200 is connected to the fixed coil 100 via the connector 300. One end is the fixed end, and the other end is the free end. The split coil 200 can rotate around the fixed end. Because the fixed coil 100 has strong and weak magnetic regions, the etching rate of the semiconductor process equipment is unevenly distributed. The split coil 200 in this application can, based on the etching uniformity test results, strengthen the weak magnetic region by rotating clockwise or counterclockwise around the fixed end, thereby improving the uniformity of the magnetic field distribution and ultimately improving the etching uniformity.

[0093] Both ends of the split coil 200 can be connected to the fixed coil 100 via the connector 300. The end connected to the connector 300 is the fixed end, and the other end is the free end. Figure 9 As shown, the fixed end and free end of the split coil 200 can be swapped according to the need to reinforce the weak magnetic field region. Figure 9The solid line in the diagram represents the current position of the split coil 200, while the dashed line represents the adjustable positions of the split coil 200. The increased selectable positions of the split coil 200 further enhances the flexibility of magnetic field adjustment in the coil device and improves the uniformity of the magnetic field distribution.

[0094] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of this application, and this application is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and substance of this application, and these modifications and improvements are also considered to be within the scope of protection of this application.

Claims

1. A coil device for use in semiconductor process equipment, characterized in that, It includes a fixed coil, a separate coil, and conductive components, wherein; The fixed coil has a strong magnetic region and a weak magnetic region. The split coil is movably connected to the fixed coil and can move to the position corresponding to the weak magnetic region. The conductive element is used to conduct current through the split coil and the fixed coil to form a current loop.

2. The coil device according to claim 1, characterized in that, The fixed coil has a plurality of mounting positions for mounting the split coil, the plurality of mounting positions being distributed circumferentially along the fixed coil, and the split coil being selectively connected to the mounting positions.

3. The coil device according to claim 2, characterized in that, The conductive component includes a fixed conductive component and a flexible conductive component, and the split coil includes a fixed end and a movable end, with the fixed end being rotatably connected to the mounting position. The fixed conductive member is used to electrically connect the fixed end to the fixed coil, and the flexible conductive member is used to electrically connect the movable end to the fixed coil. The length of the flexible conductive member is greater than the length of the fixed conductive member.

4. The coil device according to claim 3, characterized in that, It also includes connectors, the mounting position having a connection through hole, and both ends of the split coil having connection holes; The connector is used to connect the connecting hole at one end of the split coil to one of the connecting through holes in the mounting position; The end of the split coil connected to the connector is the fixed end, and the other end is the movable end.

5. The coil device according to claim 4, characterized in that, The fixed conductive element and the flexible conductive element are detachably connected to the fixed coil and the split coil; The conductive element and the flexible conductive element selectively connect the split coil and the fixed coil according to the distribution of the weak magnetic region.

6. The coil device according to claim 4, characterized in that, The connecting holes are located on the side of the split coil facing the fixed coil, and all connecting holes are blind holes.

7. The coil device according to claim 4, characterized in that, The connector is tubular, and the fixed conductive element can be inserted through the connector.

8. The coil device according to claim 4, characterized in that, The fixed conductive component includes a fixed conductive post, which can be inserted into the connecting through hole and the connecting hole.

9. The coil device according to claim 8, characterized in that, The fixed conductive component further includes a first conductive component, which is installed on the outer peripheral surface of the fixed conductive post. The outer wall of the first conductive component is used to fit against the inner wall of the connecting through hole and the inner wall of the connecting hole.

10. The coil device according to claim 4, characterized in that, The flexible conductive component includes a connecting cable, a first conductive post, and a second conductive post. The second conductive post can be inserted into the connecting through hole. The connecting cable connects the first conductive post and the second conductive post.

11. The coil device according to claim 10, characterized in that, The flexible conductive element further includes at least two second conductive elements, which are respectively installed on the outer peripheral surfaces of the first conductive post and the second conductive post. The outer wall of the second conductive element on the outer periphery of the first conductive post is attached to the inner wall of the connecting through hole, and the outer wall of the second conductive element on the outer periphery of the second conductive post is attached to the inner wall of the connecting hole.

12. The coil device according to any one of claims 3 to 11, characterized in that, The edges of both ends of the split coil are rounded.

13. The coil device according to any one of claims 3 to 9, characterized in that, The fixed coil includes multiple concentric ring coils, the strong magnetic region includes the area corresponding to the ring coils, and the weak magnetic region includes the area corresponding to the gap between two adjacent ring coils.

14. A semiconductor process apparatus, characterized in that, It includes a radio frequency device and a coil device as described in any one of claims 1 to 13, wherein the radio frequency device is connected to the fixed coil and feeds radio frequency into the fixed coil.

15. The semiconductor process equipment according to claim 14, characterized in that, It also includes a reaction chamber, a base, and a dielectric window. The base is located inside the reaction chamber and is used to support the wafer. The dielectric window is located at the top of the reaction chamber. The coil assembly is located above the reaction chamber. The split coil is located on the side of the fixed coil near the dielectric window.

Images