Cooling device of electrical engineering relay protector

Abstract

The invention discloses a cooling device of an electrical engineering relay protector, which comprises a protector body, a cooling bin, a main radiating fin, a laminate, an auxiliary part I, an auxiliary part II, a semiconductor refrigeration part, a miniature water pump and a circulating pipe, and is characterized in that the cooling bin is arranged below the protector body, the main radiating fin is arranged in the cooling bin, the laminate is horizontally arranged in the cooling bin, and the semiconductor refrigeration part is arranged in the circulating pipe. The semiconductor refrigerating part penetrates through the layer plate, the micro water pump is arranged on the bottom wall of the cooling bin, one end of the circulating pipe is connected to the micro water pump, the other end of the circulating pipe is connected to the other end of the cooling bin, and the first auxiliary part and the second auxiliary part are arranged on the two sides of the main cooling fin respectively. The main heat dissipation fins can still achieve heat dissipation even in a high-temperature environment, liquid is guided to flow among the main heat dissipation fins through the first auxiliary part and the second auxiliary part, and it is guaranteed that the temperature of the main heat dissipation fins is evenly reduced.

Description

Technical Field

[0001] This invention relates to the technical field of electrical engineering, and in particular to a cooling device for electrical engineering relay protection devices. Background Technology

[0002] A relay protector is an electrical control device that causes a predetermined step change in the controlled quantity in the electrical output circuit when the change in the input quantity (excitation quantity) reaches the specified requirements. Therefore, it plays a role in automatic adjustment, safety protection, and circuit switching in the circuit.

[0003] Existing relay protectors mostly use heat dissipation fins to conduct heat from the relay protector to the surrounding air, or use fans to promote airflow to achieve a cooling effect. However, the above cooling measures are not ideal when the ambient temperature is already high. In order to prevent the relay protector from overheating during operation and causing accidents such as fires, a cooling device for electrical engineering relay protectors is proposed to optimize the above-mentioned problems. Summary of the Invention

[0004] The present invention aims to at least partially solve one of the technical problems in the related art.

[0005] Therefore, the purpose of this invention is to provide a cooling device for an electrical engineering relay protection device. By providing a low-temperature source by setting a semiconductor cooling element at the lower end of the main heat dissipation fins, the main heat dissipation fins can still dissipate heat even in high-temperature environments. Furthermore, by using auxiliary components one and two, liquid is guided to flow between the main heat dissipation fins to ensure that the temperature of the main heat dissipation fins drops uniformly.

[0006] To achieve the above objectives, this invention proposes a cooling device for an electrical engineering relay protector, comprising a protector body, a cooling chamber, main heat dissipation fins, a shelf, auxiliary component one, auxiliary component two, a partition, a semiconductor cooling element, a micro water pump, and a circulation pipe. The cooling chamber is located below the protector body; the main heat dissipation fins are located within the cooling chamber and connected to the lower part of the protector body; the shelf is horizontally positioned within the cooling chamber and sleeved onto the main heat dissipation fins, dividing the main heat dissipation fins into upper and lower parts; the semiconductor cooling element penetrates the shelf and is located on one side of the main heat dissipation fins. A partition is located under the shelf and on one side of the auxiliary heat dissipation fins. The micro water pump is located on the bottom wall of the cooling chamber and is connected through the partition. One end of the circulation pipe is connected to the micro water pump, and the other end of the circulation pipe is connected to the other end of the cooling chamber. Auxiliary component one and auxiliary component two are respectively located on both sides of the main heat dissipation fins. Two sets of auxiliary component one and auxiliary component two are symmetrically arranged. The sides of auxiliary component one and auxiliary component two are provided with plate structures. The plate structures are sleeved on the main heat dissipation fins. The plate structures of auxiliary component one and auxiliary component two are arranged alternately.

[0007] In addition, the cooling device for electrical engineering relay protection devices proposed above according to the present invention may also have the following additional technical features:

[0008] Specifically, the micro water pump and auxiliary heat dissipation fins are arranged on both sides of the partition.

[0009] Specifically, the two openings of the circulation pipe are located at both ends of the main heat dissipation fins.

[0010] Specifically, the cooling chamber is provided with an outer frame, which is fitted over the outside of the circulation pipe. Stabilizing blocks are evenly distributed on the outer frame and are fitted onto the circulation pipe.

[0011] Specifically, the cooling chamber is symmetrically equipped with filters on both sides, and the cooling chamber is symmetrically equipped with fans. The fans are respectively located on both sides of the main heat dissipation fins and on the top of the shelf.

[0012] Specifically, the semiconductor cooling device is provided with auxiliary heat dissipation fins, which are disposed under the shelf.

[0013] Specifically, the main heat dissipation fins are composed of several fins, and the fins located on both sides of the main heat dissipation fins are in contact with auxiliary component one and auxiliary component two.

[0014] Specifically, the top of the layer plate is symmetrically provided with limiting plates, the limiting plates are disposed on one side of the auxiliary component, and there is a gap between the limiting plates, the gap being directly opposite the center position of the main heat dissipation fins.

[0015] Compared with the prior art, the technical solution provided by the present invention has the following beneficial effects: The cooling device of the electrical engineering relay protection device of the present invention provides a low temperature source by setting a semiconductor cooling element at the lower end of the main heat dissipation fins, so that the main heat dissipation fins can still dissipate heat even in high temperature environments. Furthermore, by using auxiliary components one and two, the liquid is guided to flow between the main heat dissipation fins, ensuring that the temperature of the main heat dissipation fins drops uniformly, and preventing the relay from overheating and causing secondary accidents such as fire or loss of control.

[0016] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0017] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the following description of the embodiments taken in conjunction with the accompanying drawings, wherein:

[0018] Figure 1 This is a schematic diagram of the cooling device structure of the electrical engineering relay protection device of the present invention;

[0019] Figure 2 This is a schematic diagram of the internal structure of the cooling device of the electrical engineering relay protection device of the present invention;

[0020] Figure 3 This is a schematic diagram of the internal structure of the cooling chamber of the cooling device of the electrical engineering relay protection device of the present invention;

[0021] Figure 4 This is a schematic diagram of the main heat dissipation fin structure of the cooling device of the electrical engineering relay protection device of the present invention.

[0022] As shown in the figure: 1. Protector body; 2. Cooling chamber; 3. Main heat dissipation fins; 4. Sheet; 5. Auxiliary component one; 6. Auxiliary component two; 7. Partition; 8. Semiconductor cooling component; 9. Miniature water pump; 10. Circulation pipe; 11. Outer frame; 12. Stabilizing sleeve; 13. Filter screen; 14. Fan; 15. Auxiliary heat dissipation fins; 16. Limiting plate. Detailed Implementation

[0023] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the invention, and should not be construed as limiting the invention. Rather, embodiments of the invention include all variations, modifications, and equivalents falling within the spirit and scope of the appended claims.

[0024] The cooling device for an electrical engineering relay protection device according to an embodiment of the present invention will be described below with reference to the accompanying drawings.

[0025] like Figure 1-4 As shown, the cooling device for the electrical engineering relay protector of this embodiment of the invention may include a protector body 1, a cooling chamber 2, a main heat dissipation fin 3, a shelf 4, an auxiliary component 1 5, an auxiliary component 2 6, a partition 7, a semiconductor cooling component 8, a micro water pump 9, and a circulation pipe 10.

[0026] The cooling chamber 2 is located below the protector body 1. The main heat dissipation fins 3 are located inside the cooling chamber 2 and connected to the protector body 1. The shelf 4 is horizontally located inside the cooling chamber 2 and is fitted onto the main heat dissipation fins 3, dividing the main heat dissipation fins 3 into upper and lower parts. The semiconductor cooling component 8 is installed through the shelf 4 and is located on one side of the main heat dissipation fins 3. The partition 7 is located below the shelf 4 and is located on one side of the auxiliary heat dissipation fins 15. The micro water pump 9 is located on the bottom wall of the cooling chamber 2 and is connected to the partition 7. One end of the circulation pipe is connected to the micro water pump 9, and the other end of the circulation pipe is connected to the other end of the cooling chamber 2. The auxiliary component 1 5 and the auxiliary component 2 6 are respectively located on both sides of the main heat dissipation fins 3. The auxiliary component 1 5 and the auxiliary component 2 6 are symmetrically arranged in two sets. The auxiliary component 1 5 and the auxiliary component 2 6 have plate structures extending from their sides. The plate structures are fitted onto the main heat dissipation fins 3. The plate structures of the auxiliary component 1 5 and the auxiliary component 2 6 are interleaved.

[0027] Specifically, when the external environment is hot, the semiconductor cooling device 8 is activated. The upper surface of the semiconductor cooling device 8 generates heat, while the lower surface generates cold. The auxiliary heat dissipation fins 15 contact the lower surface of the semiconductor cooling device 8, causing their temperature to drop. The micro water pump 9 draws liquid from the bottom of the cooling chamber 2 and sends it to the other end of the cooling chamber 2 through a circulation pipe. The liquid then flows back to the side of the micro water pump 9. During this flow, the liquid contacts both the main heat dissipation fins 3 and the auxiliary heat dissipation fins 15. Heat from the main heat dissipation fins 3 is transferred to the liquid. As the liquid comes into contact with the auxiliary heat dissipation fins 15, its temperature decreases, thus cooling the main heat dissipation fins 3.

[0028] The liquid flows into the main heat dissipation fin 3. Some of the liquid flows directly over the two sides of the fin at the center of the main heat dissipation fin 3, while some of the liquid flows between the fins on both sides of the main heat dissipation fin 3. Under the guidance of auxiliary component 5 and auxiliary component 6, the liquid circulates between the fins on both sides, driving the liquid near the fins on both sides to ensure that the liquid near the fins on the main heat dissipation fin 3 is in a flowing state, thus ensuring the heat exchange efficiency of the main heat dissipation fin 3 and thus ensuring the heat dissipation quality.

[0029] In one embodiment of the present invention, such as Figure 2 As shown, the micro water pump 9 and the auxiliary heat dissipation fins 15 are arranged on both sides of the partition 7.

[0030] In one embodiment of the present invention, such as Figure 2 As shown, the openings at both ends of the circulation pipe are located at both ends of the main heat dissipation fin 3.

[0031] In one embodiment of the present invention, such as Figure 1 As shown, the cooling chamber 2 is provided with an outer frame 11, which is fitted on the outside of the circulation pipe. Stable sleeves 12 are evenly distributed on the outer frame 11 and are fitted onto the circulation pipe.

[0032] It should be noted that the stabilizing sleeve 12 and the outer frame 11 described in this embodiment are fixedly sleeved on the outside of the circulation pipe to protect the circulation pipe and prevent damage to the circulation pipe.

[0033] In one embodiment of the present invention, such as Figure 2 As shown, filters 13 are symmetrically arranged on both sides of the cooling chamber 2, and fans 14 are symmetrically arranged inside the cooling chamber 2. The fans 14 are respectively arranged on both sides of the main heat dissipation fins 3 and on the top of the shelf 4.

[0034] It should be noted that the fan 14 drives the airflow, and the air blows towards the main heat dissipation fins 3, causing the temperature of the main heat dissipation fins 3 to drop. Then the air is blown out through the filter 13 on one side, and the outside air enters the cooling chamber 2 through the filter 13 on the other side.

[0035] In one embodiment of the present invention, such as Figure 2 As shown, the semiconductor cooling device 8 is provided with auxiliary heat dissipation fins 15, which are disposed under the layer plate 4.

[0036] In one embodiment of the present invention, such as Figure 3 As shown, the main heat dissipation fin 3 is composed of several fins, and the fins located on both sides of the main heat dissipation fin 3 are in contact with auxiliary component 1 5 and auxiliary component 2 6.

[0037] In one embodiment of the present invention, such as Figure 3 As shown, the top of the shelf 4 is symmetrically provided with limiting plates 16. The limiting plates 16 are located on one side of the auxiliary component 5. There is a gap between the limiting plates 16, and the gap is directly opposite the center of the main heat dissipation fins 3.

[0038] In summary, the cooling device for the electrical engineering relay protection device of this invention provides a low-temperature source by setting a semiconductor cooling element at the lower end of the main heat dissipation fins, enabling the main heat dissipation fins to still dissipate heat even in high-temperature environments. Furthermore, by utilizing auxiliary components one and two, the liquid is guided to flow between the main heat dissipation fins, ensuring that the temperature of the main heat dissipation fins drops uniformly. This avoids poor liquid flow at the main heat dissipation fins due to liquid issues, which could affect the overall heat dissipation efficiency of the main heat dissipation fins and prevent the relay from overheating, thereby preventing secondary accidents such as fires and loss of control.

[0039] In the description of this specification, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0040] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0041] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A cooling device for an electrical engineering relay protection device, characterized in that, The components include the protector body (1), cooling chamber (2), main heat dissipation fins (3), shelf (4), auxiliary component one (5), auxiliary component two (6), partition (7), semiconductor cooling component (8), micro water pump (9), and circulation pipe (10). The cooling chamber (2) is located below the protector body (1); The main heat dissipation fins (3) are disposed inside the cooling chamber (2) and connected to the lower part of the protector body (1); The shelf (4) is horizontally arranged inside the cooling chamber (2) and sleeved on the main heat dissipation fins (3), dividing the main heat dissipation fins (3) into upper and lower parts; The semiconductor cooling element (8) is disposed through the layer plate (4) and is disposed on one side of the main heat dissipation fin (3); The partition (7) is located under the shelf (4) and is located on one side of the auxiliary heat dissipation fins (15); The micro water pump (9) is installed on the bottom wall of the cooling chamber (2) and connected to the through partition (7); One end of the circulation pipe is connected to the micro water pump (9), and the other end of the circulation pipe is connected to the other end of the cooling chamber (2); The auxiliary component one (5) and the auxiliary component two (6) are respectively disposed on both sides of the main heat dissipation fin (3). The auxiliary component one (5) and the auxiliary component two (6) are symmetrically arranged in two sets. The auxiliary component one (5) and the auxiliary component two (6) have plate structures extending from their sides. The plate structures are sleeved on the main heat dissipation fin (3). The plate structures of the auxiliary component one (5) and the plate structures of the auxiliary component two (6) are interleaved.

2. The cooling device for electrical engineering relay protection devices according to claim 1, characterized in that, The micro water pump (9) and auxiliary heat dissipation fins (15) are located on both sides of the partition (7).

3. The cooling device for electrical engineering relay protection devices according to claim 1, characterized in that, The two openings of the circulation pipe are located at both ends of the main heat dissipation fins (3).

4. The cooling device for electrical engineering relay protection devices according to claim 1, characterized in that, The cooling chamber (2) is provided with an outer frame (11), which is fitted on the outside of the circulation pipe. Stable sleeve blocks (12) are evenly distributed on the outer frame (11), and the stable sleeve blocks (12) are fitted onto the circulation pipe.

5. The cooling device for electrical engineering relay protection devices according to claim 1, characterized in that, The cooling chamber (2) is symmetrically provided with filter screens (13) on both sides, and the cooling chamber (2) is symmetrically provided with fans (14). The fans (14) are respectively located on both sides of the main heat dissipation fins (3) and on the top of the shelf (4).

6. The cooling device for electrical engineering relay protection devices according to claim 1, characterized in that, The semiconductor cooling component (8) is provided with auxiliary heat dissipation fins (15), which are disposed under the shelf (4).

7. The cooling device for electrical engineering relay protection devices according to claim 1, characterized in that, The main heat dissipation fin (3) is composed of several fins, and the fins located on both sides of the main heat dissipation fin (3) are in contact with auxiliary component one (5) and auxiliary component two (6).

8. The cooling device for electrical engineering relay protection devices according to claim 1, characterized in that, The top of the layer plate (4) is symmetrically provided with limiting plates (16), the limiting plates (16) are located on one side of the auxiliary component (5), and there is a gap between the limiting plates (16), the gap is directly opposite the center position of the main heat dissipation fin (3).

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