Camera module

Abstract

A camera module includes: a lens module; a circuit board disposed on the lens module; a light emitting diode (LED) module disposed to be spaced apart from the circuit board; a pillar disposed between the circuit board and the LED module to support the LED module; and a first heat dissipation member disposed on the LED module.

Description

Technical Field

[0001] This disclosure relates to camera modules. Background Technology

[0002] Thanks to significant advancements in information and communication technologies, semiconductor technologies, and more, camera modules can be used in mobile mechanical devices such as autonomous vehicles and industrial robots.

[0003] Camera modules installed in vehicles can be placed in various locations such as the front, sides, rear, and interior rearview mirror. Similarly, camera modules in industrial robots can be positioned in front of the robot's face, on the side of the face, behind the face, on the palm, back of the hand, wrist, or in front of the knee.

[0004] Because camera modules for vehicles and camera modules for industrial robots are used in confined spaces or harsh external environments, heat dissipation inside the camera module can be a problem.

[0005] Camera modules used in vehicles and industrial robots can be high-performance camera modules that include high-resolution image sensors and LEDs (light-emitting diodes). In IR LED (infrared light-emitting diode) camera modules assembled using adhesive methods with the LED boards in a tilted position, the space required for applying heat dissipation structures can be a problem due to the presence of the adhesive coating area.

[0006] Therefore, it is desirable to develop a structure that can minimize the increase in camera module size while effectively dissipating heat inside the camera module.

[0007] The above information is presented as background information and is intended to aid in understanding this disclosure. No determination or assertion is made as to whether any of the above content can be used as prior art with respect to this disclosure. Summary of the Invention

[0008] The summary portion of this invention is intended to provide a brief overview of the chosen concepts, which will be further described in the detailed description portion below. This summary portion is not intended to identify key or essential features of the claimed subject matter, nor is it intended to help determine the scope of the claimed subject matter.

[0009] In one general aspect, the camera module includes: a lens module; a circuit board disposed on the lens module; a light-emitting diode (LED) module disposed spaced apart from the circuit board; a support pillar disposed between the circuit board and the LED module to support the LED module; and a first heat dissipation member disposed on the LED module.

[0010] An LED module may include an LED chip and an LED substrate, and a first heat dissipation component may be disposed around the LED chip.

[0011] The camera module may also include an upper housing that houses the lens module and the LED module, and a lower housing that is connected to the upper housing and supports the circuit board.

[0012] The first heat dissipation component can be disposed between the upper housing and the LED substrate.

[0013] The upper housing may include a surface having a first opening extending through the surface to expose a lens module and a second opening extending through the surface to expose an LED module.

[0014] The camera module may also include a gasket disposed in the first opening to connect the lens module to the upper housing.

[0015] The lower housing may include a base attached to the lower part of the circuit board and a shielding cover attached to the lower part of the base, the base having a surface including an opening extending through the surface to expose a portion of the circuit board.

[0016] The circuit board and LED module can be electrically connected via support pillars.

[0017] The camera module may also include an image sensor disposed on the surface of the circuit board below the lens module.

[0018] The camera module may also include a second heat dissipation component disposed on the surface of the circuit board.

[0019] The camera module may also include at least one third heat dissipation member disposed on the rear surface of the electronic components mounted on the circuit board.

[0020] Electronic components may include serializers / deserializers and power management integrated circuits.

[0021] The lens module may include a lens barrel that houses at least one lens and a lens holder that houses the lens barrel.

[0022] The lens holder may include an extension that extends through the surface of the circuit board.

[0023] The camera module may also include a second heat dissipation member disposed below the lower surface of the extension.

[0024] The first heat dissipation component may include one or both of a thermal interface material and a phase change material.

[0025] The first heat dissipation component may include any one or any combination of two or more of the following: heat dissipation pad, heat dissipation film, heat dissipation paste, heat dissipation adhesive, and heat dissipation tape.

[0026] Other features and aspects will become apparent from the following detailed description and accompanying drawings. Attached Figure Description

[0027] Figure 1 This is a perspective view showing the appearance of the camera module according to an embodiment.

[0028] Figure 2 This is a schematic exploded perspective view of a camera module according to an embodiment.

[0029] Figure 3 This is a perspective view showing a portion of a camera module according to an embodiment.

[0030] Figure 4 This is an exploded perspective view schematically showing the lens module of the camera module according to an embodiment.

[0031] Figure 5 This is an exploded perspective view schematically showing the heat dissipation structure of the LED module of the camera module according to an embodiment.

[0032] Figure 6 This is a perspective view showing the upper housing of the camera module according to an embodiment.

[0033] Figure 7 This is a perspective view showing the base of the camera module according to an embodiment.

[0034] Figure 8 This is a perspective view showing the shielding cover of the camera module according to an embodiment.

[0035] Figure 9 It is along Figure 1 A cross-sectional view taken from line V-V'.

[0036] Figure 10 This is a view showing the heat dissipation path of the camera module according to an embodiment.

[0037] Figure 11 This is a schematic cross-sectional view of a camera module according to another embodiment.

[0038] Throughout the accompanying drawings and detailed embodiments, unless otherwise described, the same reference numerals refer to the same elements. For purposes of clarity, illustration, and convenience, the drawings may not be drawn to scale, and the relative dimensions, scale, and depiction of elements in the drawings may be exaggerated. Detailed Implementation

[0039] In the following description, although examples of this disclosure will be described in detail with reference to the accompanying drawings, it should be noted that the examples are not limited thereto.

[0040] The following detailed embodiments are provided to aid the reader in gaining a comprehensive understanding of the methods, apparatus, and / or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatus, and / or systems described herein will become apparent upon understanding this disclosure. For example, the order of operations described herein is merely illustrative and is not limited to the order set forth herein, except for operations that must occur in a specific order, as will become apparent upon understanding this disclosure. Furthermore, for clarity and brevity, descriptions of features well-known in the art may be omitted.

[0041] The features described herein may be implemented in different forms and should not be construed as being limited to the examples described herein. Rather, the examples described herein are provided merely to illustrate some of the many possible ways in which the methods, devices, and / or systems described herein will become apparent upon understanding this disclosure.

[0042] Throughout this specification, when an element such as a layer, region, or substrate is described as being "on," "connected to," or "attached to" another element, the element may be directly "on," directly "connected to," or directly "attached to" the other element, or there may be one or more other elements between the element and the other element. Conversely, when an element is described as being "directly on," "directly connected to," or "directly attached to" another element, there are no other elements between the element and the other element.

[0043] As used herein, the term “and / or” includes any one of the associated listed items and any combination of any two or more items; similarly, “at least one” includes any one of the associated listed items and any combination of any two or more items.

[0044] Although terms such as “first,” “second,” and “third” may be used herein to describe various components, parts, regions, layers, or sections, these components, parts, regions, layers, or sections are not limited by these terms. Rather, these terms are used only to distinguish one component, part, region, layer, or section from another. Therefore, without departing from the teachings of the examples described herein, the first component, first part, first region, first layer, or first section mentioned in these examples may also be referred to as a second component, second part, second region, second layer, or second section.

[0045] Spatial relative terms such as “above,” “above,” “below,” and “under” may be used herein for descriptive convenience to describe the relationship of one element relative to another, as shown in the accompanying drawings. In addition to covering the orientation depicted in the drawings, these spatial relative terms are intended to also cover different orientations of the device in use or operation. For example, if the device in the drawings is flipped, an element described as being “above” or “above” another element would be located “below” or “under” that other element. Thus, depending on the spatial orientation of the device, the term “above” covers both orientations of “above” and “below”. The device may also be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relative terms used herein should be interpreted accordingly.

[0046] The terminology used herein is for the purpose of describing various examples only and is not intended to limit this disclosure. Unless the context clearly indicates otherwise, the terms “a,” “an,” and “the” are intended to include the plural form as well. The terms “comprising,” “including,” and “having” indicate the presence of the stated features, quantities, operations, components, elements, and / or combinations thereof, but do not preclude the presence or addition of one or more other features, quantities, operations, components, elements, and / or combinations thereof.

[0047] Due to manufacturing techniques and / or tolerances, the shapes shown in the accompanying drawings may vary. Therefore, the examples described herein are not limited to the specific shapes shown in the accompanying drawings, but include shape variations that occur during manufacturing.

[0048] It should be noted that in this document, the word “may” is used relative to “example”, such as regarding what an example may include or implement, meaning that there exists at least one example that includes or implements such a feature, but not all examples are limited to this.

[0049] The features of the examples described herein can be combined in various ways that will become apparent upon understanding this disclosure. Furthermore, although the examples described herein have multiple configurations, other configurations that will become apparent upon understanding this disclosure are also possible.

[0050] Figure 1 This is a perspective view showing the appearance of the camera module according to an embodiment. Figure 2 This is a schematic exploded perspective view of a camera module according to an embodiment. Figure 3 This is a perspective view showing a portion of a camera module according to an embodiment.

[0051] refer to Figures 1 to 3According to the embodiments, the camera module 10 may include an image sensor module 100, a lens module 200, a light-emitting diode (LED) module 300, and a housing assembly 500.

[0052] The image sensor module 100 may include a circuit board 110 and an image sensor 120. The circuit board 110 may be electrically connected to a motherboard (not shown) and may include a circuit board with a wiring pattern capable of making electrical connections, such as a rigid circuit board, a flexible circuit board, or a rigid-flex circuit board.

[0053] Image sensor 120 may be a device that converts light incident through the lens of lens module 200 into an electrical signal, and may be either a charge-coupled device (CCD) or a complementary metal-oxide-semiconductor (CMOS), but this disclosure is not limited thereto.

[0054] Image sensor 120 can be mounted on one surface of circuit board 110 and can be positioned below lens module 200 along the optical axis of the lens. Image sensor 120 and circuit board 110 can be connected by a method such as wire bonding. The electrical signal converted by image sensor 120 can be output as an image through the display unit (or display section) of the electronic device.

[0055] Lens module 200 may include at least one lens 210 and a lens barrel 220 for housing the lens 210 (see Figure 4 Lens 210 may include one or more lenses having optical properties such as the same or different refractive indices, and may be mounted in lens barrel 220 along the optical axis. The optical axis may be set as the central axis of lens 210 housed in lens barrel 220, and the direction of the optical axis may refer to a direction parallel to the central axis. The number of lenses 210 may vary depending on the design of lens barrel 220.

[0056] The lens barrel 220 may have a hollow cylindrical shape, so that at least one lens 210 of the subject can be accommodated therein. The image sensor 120 may be arranged below the lens barrel 220 along the direction of the optical axis to convert the light incident through the lens barrel 220 into an electrical signal, and the electrical signal may be transmitted to the circuit board 110 and to an electronic device such as a mobile phone.

[0057] The LED module 300 can be used as a light source at night, on cloudy days, or in dark places to brighten the image. The LED module 300 can be arranged around the lens module 200 and can include a first LED module 310 and a second LED module 320 respectively arranged on the left and right sides.

[0058] The housing assembly 500 protects the internal components of the camera module 10 and can be formed of aluminum or metal sheet, or of a material with a low corrosion rate such as stainless steel (SUS). Furthermore, the housing assembly 500 can shield electromagnetic waves. For example, the housing assembly 500 can shield electromagnetic waves to prevent electromagnetic waves generated inside the camera module 10 from affecting other electronic components within the electronic device, or to prevent noise current flowing in from outside the camera module 10 from affecting the interior of the camera module 10.

[0059] The housing assembly 500 may include an upper housing 510 that houses the lens module 200 and the LED module 300, and a lower housing 540 that is coupled to the upper housing 510 and supports the image sensor module 100. The upper housing 510 and the lower housing 540 may be coupled to each other to form the internal space of the camera module 10.

[0060] Such as the serializer / deserializer (SerDes) 150 for high-speed data transmission (see...) Figure 9 ) and a power management integrated circuit (PMIC) 170 for generating, distributing, and controlling the power required for each component within the camera module 10 (see Figure 9 The electronic components can be housed in the internal space formed by the housing assembly 500.

[0061] The upper housing 510 may have an opening 515 extending through the surface of the upper housing 510 to expose portions of the lens module 200 and the LED module 300.

[0062] The lower housing 540 may include a base 520 connected to the lower part of the circuit board 110 of the image sensor module 100 and a shielding cover 530 connected to the lower part of the base 520. Both the base 520 and the shielding cover 530 can be manufactured by bending a sheet member of stainless steel (SUS) and can be manufactured to have a thickness of 0.15 mm to 0.3 mm, so that the base 520 and the shielding cover 530 can be miniaturized compared to conventional aluminum covers and can be advantageous in terms of heat dissipation.

[0063] The base 520 can be formed by bending the edge of the plate-shaped member to accommodate the circuit board 110, and the shield 530 can be formed by bending the edge of the plate-shaped member to accommodate the circuit board 110 and the base 520.

[0064] The base 520 may have at least one opening 525 extending through the surface of the base 520 to expose at least a portion of a surface of the circuit board 110, and the shielding cover 530 may include at least one protrusion 535 corresponding to the opening 525.

[0065] In the following text, reference will be made to Figure 4The lens module 200 of the camera module 10 according to this embodiment will be described in more detail. Figure 4 This is an exploded perspective view schematically showing the lens module of the camera module according to an embodiment.

[0066] refer to Figure 4 The lens module 200 may include at least one lens 210, a lens barrel 220 for housing the lens 210, and a lens support 230 for housing the lens barrel 220.

[0067] The lens holder 230 may be a device for mounting the lens module 200 on the circuit board 110, and may include a lens actuator (not shown) for moving the lens module 200.

[0068] The lens actuator may include an AF drive unit (or AF drive section) and an OIS drive unit (or OIS drive section), and can move the lens barrel 220 to adjust the focus or correct camera shake. For example, the AF drive unit may include an AF drive magnet and an AF drive coil, and can achieve the function of adjusting the focus or zooming by moving the lens barrel 220 along the optical axis through the electromagnetic influence between the AF drive magnet and the AF drive coil. Similarly, the OIS drive unit may include an OIS drive magnet and an OIS drive coil, and can achieve the function of correcting camera shake or shakiness by moving the lens barrel 220 in a direction perpendicular to the optical axis through the electromagnetic influence between the OIS drive magnet and the OIS drive coil.

[0069] The lens holder 230 can accommodate the lens actuator and the lens barrel 220 within its internal space and can be mounted on the circuit board 110. The lens barrel 220 can be moved in the direction of the optical axis or in a direction perpendicular to the optical axis by the driving force of the lens actuator while the lens barrel 220 is accommodated in the lens holder 230.

[0070] The lens holder 230 may have an opening extending through its surface to receive a lens barrel 220, the opening being formed at the upper part of the lens holder 230, and may have an open lower part such that the image sensor 120 is disposed at the lower part of the lens holder 230. Therefore, the lens holder 230 may include an upper surface and side surfaces extending downward from the upper surface, the upper surface having an opening formed therein for receiving the lens barrel 220.

[0071] The lens module 200 may also include a gasket 240 to fill the space formed between the lens module 200 and the upper housing 510. The gasket 240 connects the lens module 200 and the upper housing 510, ensuring that all light incident on the camera module 10 enters the lens module 200. The gasket 240 also serves to shield electromagnetic waves.

[0072] In the following text, reference will be made to Figure 5 The heat dissipation structure of the LED module of the camera module 10 according to this embodiment is described in more detail. Figure 5 This is an exploded perspective view schematically showing the heat dissipation structure of the LED module of the camera module according to an embodiment.

[0073] refer to Figure 5 The LED module 300 can be configured to be separated from the circuit board 110, and can include a first LED module 310 and a second LED module 320. The first LED module 310 may include a first LED substrate 311 and a first LED chip 312, and the second LED module 320 may include a second LED substrate 321 and a second LED chip 322.

[0074] The support column 400 can be disposed between the circuit board 110 and the LED module 300, and support the LED module 300. Therefore, the LED module 300 can be configured to be spaced apart from the circuit board 110 by the support column 400.

[0075] The support pillar 400 may include a first support pillar 410 configured to position the first LED module 310 spaced apart from the circuit board 110 and a second support pillar 420 configured to position the second LED module 320 spaced apart from the circuit board 110.

[0076] The first pillar 410 and the second pillar 420 can support the first LED substrate 311 and the second LED substrate 321. The first pillar 410 and the second pillar 420 may each include electrode terminals for electrically connecting the first LED module 310 and the second LED module 320 to the circuit board 110.

[0077] The first heat dissipation component 610 can be disposed on the LED module 300. The first heat dissipation component 610 can form a heat transfer path for dissipating the heat generated by the LED module 300 to the outside. For example, the first heat dissipation component 610 can be disposed between the upper housing 510 and the first LED substrate 311 and the second LED substrate 321.

[0078] The first heat dissipation component 610 may include a first heat dissipation material 611 disposed around the first LED chip 312 and a second heat dissipation material 612 disposed around the second LED chip 322. The first heat dissipation material 611 and the second heat dissipation material 612 may each be disposed to completely or partially surround the first LED chip 312 and the second LED chip 322. This disclosure is not limited thereto, and other arrangements may of course be used to maximize heat dissipation efficiency.

[0079] According to this embodiment, since the LED module 300 can be positioned at a certain distance from the circuit board 110 via the support post 400, the LED module 300 can be positioned almost parallel to the circuit board 110. Furthermore, since the support post 400 can be attached to the rear surface of the LED substrate, no adhesive coating space is required for fixing the LED module 300, thereby allowing heat dissipation components to be placed around the LED chips on the LED substrate.

[0080] In the following text, reference will be made to Figures 6 to 8 The housing assembly 500 of the camera module 10 according to this embodiment will be described in more detail. Figure 6 This is a perspective view showing the upper housing of the camera module according to an embodiment. Figure 7 This is a perspective view showing the base of the camera module according to an embodiment. Figure 8 This is a perspective view showing the shielding cover of the camera module according to an embodiment.

[0081] refer to Figures 6 to 8 The housing assembly 500 may include an upper housing 510 and a lower housing 540, and the lower housing 540 may include a base 520 and a shielding cover 530.

[0082] The upper housing 510 may include an upper surface portion 511 disposed above in the optical axis direction and disposed in a direction perpendicular to the optical axis, and a side surface portion 512 extending downward from the upper surface portion 511 in the optical axis direction. The upper surface portion 511 may have an approximately rectangular shape and have an opening 515 that exposes portions of the lens module 200 and the LED module 300.

[0083] An opening 515 may be formed through the upper surface portion 511 and may include a first opening 515a exposing the lens module 200 and second openings 515b and 515c exposing the LED module 300. The top of the lens module 200 may be exposed through the first opening 515a, and the lens 210 may also be exposed to allow light to pass through. The top of the LED module 300 may be exposed through the second openings 515b and 515c, allowing light to be emitted from the LED chip.

[0084] The side surface portion 512 can extend downward along the optical axis from the edge of the upper surface portion 511. The side surface portion 512 can be used as a part to accommodate components within the camera module 10, and can have various shapes depending on the arrangement of the internal components, for example, it can have a prism shape, a cylindrical shape with an open bottom, or a hemispherical shape.

[0085] The base 520 may include a plate-shaped portion 521 facing one surface of the circuit board 110 and a side plate portion 522 that is bent along the edge of the plate-shaped portion 521 to face the side of the circuit board 110.

[0086] An opening 525 may be formed at the plate-shaped portion 521 to correspond to at least one of the electronic components mounted on the circuit board 110. The opening 525 allows inspection of the mounting status of the electronic components mounted on the circuit board 110 and exposes the electronic components for coating with the heat dissipation member 600 (see [link]). Figure 9 Electronic components may include an image sensor 120, a serializer / deserializer 150, a power management integrated circuit 170, etc. The image sensor 120, serializer / deserializer 150, and power management integrated circuit 170 may be disposed on the same surface or different surfaces of the circuit board 110. For example, the serializer / deserializer 150 and power management integrated circuit 170 may be disposed on the back side of the mounting surface of the image sensor 120.

[0087] The opening 525 may include a first opening 525a corresponding to the image sensor 120, a second opening 525b corresponding to the serializer / deserializer 150, and a third opening 525c corresponding to the power management integrated circuit 170. The openings 525 may be formed corresponding to components in the electronic components mounted on the circuit board 110 that require heat dissipation, and the number and size of the openings 525 are not limited.

[0088] The first opening 525a can be formed to expose the portion of the rear surface of the circuit board 110 corresponding to the image sensor 120, the second opening 525b can be formed to expose the portion of the circuit board 110 where the serializer / deserializer 150 is mounted, and the third opening 525c can be formed to expose the portion of the circuit board 110 where the power management integrated circuit 170 is mounted.

[0089] The base 520 may include at least one protrusion 527 on its outer surface. The protrusion 527 may connect the base 520 to the shielding cover 530 and may be formed on the side plate portion 522.

[0090] The shielding cover 530 can accommodate the circuit board 110 and the base 520, and similar to the base 520, the shielding cover 530 can be manufactured by bending the plate-shaped member.

[0091] The shielding cover 530 may include a bottom 531 that contacts the plate-shaped portion 521 of the base 520 and a wall portion 532 formed by bending along the edge of the bottom 531. The shielding cover 530 may be attached to the base 520 to serve as a shield for electromagnetic waves.

[0092] At least one protrusion 535 may be formed at the bottom 531 to correspond to the position of an electronic component mounted on the circuit board 110. That is, the protrusion 535 may be formed corresponding to the position of the image sensor 120, serializer / deserializer 150 and power management integrated circuit 170 mounted on the circuit board 110.

[0093] The protrusion 535 can be formed corresponding to the opening 525 of the base 520, and can face the electronic components mounted on the circuit board 110 through the opening 525. That is, the protrusion 535 may include a first protrusion 535a formed corresponding to the first opening 525a, a second protrusion 535b formed corresponding to the second opening 525b, and a third protrusion 535c formed corresponding to the third opening 525c. The protrusion 535 can be formed corresponding to the heat dissipation components among the electronic components mounted on the circuit board 110, and the number and size of the protrusion 535 are not limited.

[0094] The first protrusion 535a can be formed as a portion facing the circuit board 110 where the image sensor 120 is mounted, the second protrusion 535b can be formed as a portion facing the circuit board 110 where the serializer / deserializer 150 is mounted, and the third protrusion 535c can be formed as a portion facing the circuit board 110 where the power management integrated circuit 170 is mounted.

[0095] The shielding cover 530 may include at least one hole 537 on its inner surface. The hole 537 may be connected to a protrusion 527 of the base 520 to connect the base 520 and the shielding cover 530, and may be formed at the wall portion 532. This disclosure is not limited thereto, and the hole may be formed at the base, the protrusion may be formed at the shielding cover, and other means (e.g., another device) for connecting the base and the shielding cover may be used.

[0096] During the assembly of the lower housing 540, if the base 520 is connected to the circuit board 110 by soldering or the like, and then the protrusion 527 is fastened to the hole 537 of the shielding cover 530, the base 520 and the shielding cover 530 can be connected to complete the assembly of the lower housing 540.

[0097] The lower housing 540 can be assembled in a way that shortens assembly time: the base 520 is assembled to the circuit board 110, and then the mounting status of the electronic components is inspected through the opening 525 and the heat dissipation component 600 is coated, and then the shielding cover 530 is attached to the base 520 to complete the assembly of the lower housing 540. Furthermore, because space is provided through the opening 525 for coating the heat dissipation component 600, the increase in the height of the camera module 10 can be minimized.

[0098] In the following text, reference will be made to Figure 9 and Figure 10 The heat dissipation structure and heat dissipation path of the camera module 10 according to this embodiment are described in more detail. Figure 9 It is along Figure 1 The cross-sectional view of line V-V', and Figure 10 This is a view showing the heat dissipation path of the camera module according to an embodiment.

[0099] refer to Figure 9 The heat dissipation component 600 can be disposed between the electronic components and the housing assembly 500 to dissipate heat generated from the electronic components within the camera module 10.

[0100] The heat dissipation component 600 can serve as a path for transferring heat between heat-generating components disposed inside the camera module 10 and a heat sink. The main electronic components for heat dissipation may include an image sensor 120, a serializer / deserializer 150, a power management integrated circuit 170, an LED module 300, etc., and the heat sink may be a housing assembly 500. That is, the heat dissipation component 600 can transfer heat generated from the image sensor 120, serializer / deserializer 150, power management integrated circuit 170, LED module 300, etc., to the housing assembly 500 to dissipate the transferred heat to the outside of the camera module 10.

[0101] For this purpose, the heat dissipation component 600 can contact the housing assembly 500. For example, heat dissipation components located at the image sensor 120, serializer / deserializer 150, and power management integrated circuit 170 can contact the lower housing 540 or the shielding cover 530. In this case, the protrusion 535 formed at the bottom 531 of the shielding cover 530 ensures that the heat dissipation component 600 makes firm contact between the electronic components and the shielding cover 530. The heat dissipation component located at the LED module 300 can contact the upper housing 510.

[0102] The heat dissipation component 600 can be disposed between the upper housing 510 and the LED module 300, and can also be disposed between the lower housing 540 and the image sensor 120, serializer / deserializer 150, and power management integrated circuit 170 mounted on the circuit board 110. In the lower housing 540, the heat dissipation component 600 can be disposed at the protruding portion 535 of the shielding cover 530.

[0103] The heat dissipation component 600 may include a first heat dissipation component 610 disposed between the upper housing 510 and the LED module 300, a second heat dissipation component 620 disposed between the image sensor 120 and the lower housing 540, and a third heat dissipation component 630 disposed between the lower housing 540 and the serializer / deserializer 150 and the power management integrated circuit 170. The heat dissipation components 600 may be configured to correspond to heat-generating electronic components mounted on the circuit board 110, and the number or location of the heat dissipation components 600 is not limited.

[0104] The heat dissipation component 600 may include at least one of a thermal interface material and a phase change material. The thermal interface material can be manufactured by mixing a polymer resin with a thermally conductive filler such as ceramic. The resin may be silicone, acrylic, or epoxy resin, and the thermally conductive filler may be ceramics such as alumina (Al2O3) and boron nitride (BN), graphite, polymers such as PP and PTFE, or metals such as silver and copper. The heat dissipation component 600 may include a heat dissipation pad, a heat dissipation film, a heat dissipation paste, a heat dissipation adhesive, a heat dissipation tape, etc.

[0105] The first heat dissipation component 610 may include a first heat dissipation material 611 disposed around a first LED chip 312 on a first LED substrate 311 and a second heat dissipation material 612 disposed around a second LED chip 322 on a second LED substrate 321. The first heat dissipation material 611 and the second heat dissipation material 612 may each be disposed around the first LED chip 312 and the second LED chip 322.

[0106] The second heat dissipation member 620 may be disposed between the rear surface of the circuit board 110 on which the image sensor 120 is mounted and the first protrusion 535a of the shielding cover 530. The second heat dissipation member 620 may have dimensions corresponding to the size of the area on which the image sensor 120 is mounted. However, the second heat dissipation member 620 may extend to the mounting area of ​​the lens holder 230 to additionally dissipate heat generated from the lens module 200.

[0107] The third heat dissipation component 630 may include a third heat dissipation material 631 disposed between the serializer / deserializer 150 and the second protrusion 535b of the shielding cover 530, and a fourth heat dissipation material 632 disposed between the power management integrated circuit 170 and the third protrusion 535c of the shielding cover 530.

[0108] refer to Figure 10In the heat dissipation path of the camera module 10 according to this embodiment, the heat generated from the LED module 300 can be transferred to the upper housing 510 through the first heat dissipation member 610, so as to be emitted to the outside of the camera module 10. Specifically, the heat generated from the first LED module 310 can be dissipated through the first heat dissipation material 611, and the heat generated from the second LED module 320 can be dissipated through the second heat dissipation material 612.

[0109] Heat generated from the image sensor 120 can be transferred to the shielding cover 530 via the second heat dissipation member 620, and can also be transferred to the upper housing 510 connected to the shielding cover 530, for discharge to the outside of the camera module 10. At the same time, heat generated from the lens module 200 can also be released to the outside of the camera module 10 via the second heat dissipation member 620.

[0110] Additionally, heat generated from the serializer / deserializer 150 and the power management integrated circuit 170 can be transferred to the shielding cover 530 via the third heat dissipation member 630, and the heat transferred to the shielding cover 530 can be transferred to the upper housing 510 for discharge to the outside of the camera module 10. Specifically, heat generated from the serializer / deserializer 150 can be dissipated via the third heat dissipation material 631, and heat generated from the power management integrated circuit 170 can be dissipated via the fourth heat dissipation material 632.

[0111] According to this embodiment, heat generated from the electronic components disposed inside the camera module 10 can be discharged to the outside through the upper housing 510 and the lower housing 540, thus forming an effective heat dissipation path. Recently, due to the high performance of camera modules, high-pixel image sensors have been adopted, and various IC components such as PMICs, SerDes, MCUs, and LED modules have been embedded in camera modules. Therefore, errors caused by heat dissipation within the camera module are becoming a problem in image sensors, and this embodiment maximizes the heat dissipation effect of the camera module by forming an effective heat dissipation path.

[0112] In the following text, reference will be made to Figure 11 A camera module 10 according to another embodiment will be described in more detail. Figure 11 This is a schematic cross-sectional view of a camera module according to another embodiment.

[0113] Figure 11 The camera module shown can have the same features as the reference. Figures 1 to 3 The configurations of the described embodiments are substantially the same. Different configurations are described below, and the same reference numerals are used for the same configurations. Configurations not described separately can be used in conjunction with… Figures 1 to 3 The implementation shown is configured in the same way.

[0114] refer to Figure 11 According to this embodiment, the camera module 10 can be configured such that at least a portion of the lower part of the lens holder 230 penetrates the circuit board 110 to effectively dissipate heat generated from the lens module 200. In other words, the lens holder 230 may include an extension portion 231 extending through the circuit board 110 from at least a portion of the lower part of the lens holder 230.

[0115] The extension 231 can also be used to secure the lens module 200 to the circuit board 110. For this purpose, holes for connecting the extension 231 can be formed in the circuit board 110.

[0116] Heat generated from the lens module 200 can be transferred to the circuit board 110 via the extension 231 of the lens holder 230, and then to the shielding cover 530 via the second heat dissipation member 620 disposed on the rear surface of the circuit board 110 where the image sensor 120 is mounted, and then to the upper housing 510 connected to the shielding cover 530 for discharge to the outside of the camera module 10. In this case, the second heat dissipation member 620 can be configured to extend to the lower surface of the extension 231 to effectively dissipate the heat transferred through the extension 231.

[0117] One aspect of the embodiments of this disclosure is aimed at providing a camera module that can minimize the increase in size while forming an optimized heat dissipation path.

[0118] While specific examples have been shown and described above, it will be apparent upon understanding this disclosure that various changes in form and detail may be made to these examples without departing from the spirit and scope of the claims and their equivalents. The examples described herein are to be understood in a descriptive sense only and not for limiting purposes. The description of features or aspects in each example should be considered applicable to similar features or aspects in other examples. Suitable results may still be achieved if the described techniques are performed in a different order, and / or if components in the described system, architecture, apparatus, or circuit are combined in different ways and / or replaced or supplemented by other components or their equivalents. Therefore, the scope of this disclosure is not limited by the specific embodiments but by the claims and their equivalents, and all variations within the scope of the claims and their equivalents should be understood to be included in this disclosure.

Claims

1. Camera module, including: Lens module; A circuit board is mounted on the lens module; An LED module is disposed around the lens module and spaced apart from the circuit board; A support column, disposed between the circuit board and the LED module to support the LED module; and The first heat dissipation component is disposed on the LED module.

2. The camera module according to claim 1, wherein, The LED module includes an LED chip and an LED substrate, and the first heat dissipation component is disposed around the LED chip.

3. The camera module according to claim 2 further includes an upper housing and a lower housing, the upper housing accommodating the lens module and the LED module, and the lower housing connected to the upper housing and supporting the circuit board.

4. The camera module according to claim 3, wherein, The first heat dissipation component is disposed between the upper housing and the LED substrate.

5. The camera module according to claim 3, wherein, The upper housing includes a surface having a first opening extending through the surface to expose the lens module and a second opening extending through the surface to expose the LED module.

6. The camera module according to claim 5 further includes a gasket disposed in the first opening to connect the lens module and the upper housing.

7. The camera module according to claim 3, wherein, The lower housing includes a base coupled to the lower part of the circuit board and a shielding cover coupled to the lower part of the base. The base has a surface including an opening extending through the surface to expose a portion of the circuit board.

8. The camera module according to claim 1, wherein, The circuit board and the LED module are electrically connected via the support pillar.

9. The camera module according to claim 1 further includes an image sensor disposed on the circuit board below the lens module.

10. The camera module according to claim 9, further comprising a second heat dissipation member disposed on the rear surface of the circuit board.

11. The camera module of claim 1, further comprising at least one third heat dissipation member disposed on the rear surface of the electronic component mounted on the circuit board.

12. The camera module according to claim 11, wherein, The electronic components include a serializer / deserializer and a power management integrated circuit.

13. The camera module according to claim 1, wherein, The lens module includes a lens barrel that houses at least one lens and a lens holder that houses the lens barrel.

14. The camera module according to claim 13, wherein, The lens holder includes an extension that extends through the surface of the circuit board.

15. The camera module of claim 14, further comprising a second heat dissipation member disposed below the lower surface of the extension.

16. The camera module according to claim 1, wherein, The first heat dissipation component includes one or both of a thermal interface material and a phase change material.

17. The camera module according to claim 1, wherein, The first heat dissipation component includes any one or any combination of two or more of the following: heat dissipation pad, heat dissipation film, heat dissipation paste, heat dissipation adhesive, and heat dissipation tape.

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