Drying and curing integrated equipment based on through hole film layer of printed circuit board and process of drying and curing integrated equipment

Abstract

The invention provides drying and curing integrated equipment based on a through hole film layer for a printed circuit board and a process thereof. Due to the fact that the air outlet end of each air outlet transmission wheel continuously outputs heat and the circuit board continuously moves, a plurality of surrounding baffles are arranged, each surrounding baffle divides the hot air drying cavity into a plurality of hot air backflow cavities, and each hot air backflow cavity is located over the corresponding air inlet fixing shaft. In other words, hot air output by the air outlet ends of the air outlet transmission wheels on the air inlet fixing shaft flows back to the circuit board moving path through the hot air backflow cavity and diffuses towards the two ends of the circuit board moving path to act on the surface of the circuit board, and in other words, temperature compensation is conducted on the surface of the circuit board through the backflow hot air. Therefore, the utilization rate of heat output can be improved, heat loss caused by the fact that hot air gathers at the top of the hot air drying cavity is avoided, meanwhile, the whole circuit board can be dried and solidified, and a high-quality conducting layer is formed on the circuit board.

Description

Technical Field

[0001] This disclosure relates to the field of printed circuit boards, and in particular to an integrated drying and curing device and process based on a through-hole film layer of a printed circuit board. Background Technology

[0002] In the production process of horizontal black hole process of circuit board, the circuit board passes through the through hole of the black hole section to achieve through hole during the horizontal transmission belt movement. Then, it is dried by hot air in the drying room and a conductive film is formed on the through hole. Finally, after micro-etching and drying, the board is removed from the machine for electroplating.

[0003] To improve the production efficiency of horizontal PCB manufacturing, existing technologies involve placing ovens on the horizontal lines. However, since the ovens operate continuously, some of the heat from the oven's output remains unrecovered when it covers the PCBs. Furthermore, the ovens continuously output heat, resulting in low heat utilization. Moreover, the heat output cost of the ovens accounts for 5% to 10% of the entire horizontal PCB manufacturing process.

[0004] For example, application number CN202020905982.X discloses a circuit board electroplating drying device, which includes two side plates. Support frames are fixedly installed on the bottom of each side plate on the side furthest from each other. A drive mechanism is arranged between the two side plates, and a conveyor belt is installed outside the drive mechanism. A material support mechanism is arranged on the top of the conveyor belt, and a drying mechanism is arranged above the middle position of the conveyor belt. By setting up the material support mechanism, circuit boards can be arranged in an orderly manner, facilitating drying by the drying mechanism. Simultaneously, the drive mechanism can drive the conveyor belt to change the position of the material support mechanism, making it easier for workers to store or place the circuit boards. However, the following problems exist: Since the drying chamber is set on a horizontal line and both the inlet and outlet of the drying chamber are open, some of the hot air output from the drying chamber escapes through the inlet and outlet. To ensure the drying effect of the circuit boards, the drying chamber needs to continuously output hot air, which not only increases the energy consumption of circuit board production but also leads to low heat utilization.

[0005] Therefore, improving the utilization rate of heat output is a key challenge that needs to be addressed in the production process of horizontal lines for printed circuit boards. Summary of the Invention

[0006] The purpose of this disclosure is to overcome the shortcomings of the prior art and provide an integrated drying and curing equipment and process based on the through-hole film layer of printed circuit boards that can reduce energy consumption in circuit board production and improve the utilization rate of heat output.

[0007] The purpose of this disclosure is achieved through the following technical solution:

[0008] An integrated drying and curing device based on through-hole film for printed circuit boards includes:

[0009] A drying assembly includes a drying chamber, a first electric drive switch door, and a second electric drive switch door. The drying chamber has an inlet, a hot air drying chamber, and an outlet. The first electric drive switch door covers the inlet and is slidably connected to the drying chamber. The second electric drive switch door covers the outlet and is slidably connected to the drying chamber.

[0010] An air knife transmission assembly includes multiple inlet fixed shafts and multiple outlet transmission wheels. The multiple inlet fixed shafts are evenly fixed on the drying chamber. Each inlet fixed shaft forms an inlet cavity and multiple outlets. The inlet cavity is connected to the multiple outlets respectively. Each outlet transmission wheel is disposed on a corresponding outlet. Each outlet transmission wheel is rotatably connected to the inlet fixed shaft. The inlet end of each outlet transmission wheel is connected to the corresponding outlet.

[0011] A rotating assembly, comprising a plurality of first electrically driven rotating wheels and a plurality of second electrically driven rotating wheels, each of the first electrically driven rotating wheels being rotatably connected to one end of a corresponding air intake fixed shaft, and each of the second electrically driven rotating wheels being rotatably connected to the other end of a corresponding air intake fixed shaft;

[0012] Multiple baffles are uniformly fixed to the top of the hot air drying chamber to divide the hot air drying chamber into multiple hot air return chambers, and each hot air return chamber is located directly above the corresponding air inlet fixed shaft.

[0013] A hot air assembly, the output end of which is used to communicate with the plurality of air inlet cavities.

[0014] In one embodiment, the drying and curing integrated equipment further includes a feeding conveyor assembly, which includes a feeding conveyor bracket and a plurality of first electrically driven rotating rollers. The feeding conveyor bracket is connected to one end of the drying chamber. The plurality of first electrically driven rotating rollers are evenly arranged on the feeding conveyor bracket. Both ends of each first electrically driven rotating roller are rotatably connected to the feeding conveyor bracket. A pressure sensor is provided at one end of the feeding conveyor bracket near the feeding port. The pressure sensor is communicatively connected to the first electrically driven door switch.

[0015] In one embodiment, the drying and curing integrated equipment further includes a plate conveying assembly, which includes a plate conveying bracket and a plurality of second electric drive rotating rollers. The plate conveying bracket is connected to the other end of the drying chamber, and the plurality of second electric drive rotating rollers are evenly arranged on the plate conveying bracket. Both ends of each second electric drive rotating roller are rotatably connected to the plate conveying bracket.

[0016] In one embodiment, the hot air assembly further includes an insulated box, a hot air transmission duct, and an air duct heater. The insulated box is connected to one side of the drying box. The hot air transmission duct is disposed inside the insulated box and has a main air inlet and multiple sub-air outlets. The hot air output end of the air duct heater is connected to the main air inlet, and each sub-air outlet is connected to the corresponding air inlet cavity.

[0017] In one embodiment, the drying and curing integrated equipment further includes an infrared sensor, which is disposed at the bottom of a baffle plate adjacent to the outlet, and the infrared sensor is communicatively connected to the second electric drive switch door.

[0018] In one embodiment, the drying and curing integrated equipment further includes a control component, which is communicatively connected to the first electric drive switch door, the second electric drive switch door, a plurality of first electric drive rotating wheels, a plurality of second electric drive rotating wheels, a plurality of first electric drive rotating rollers, a plurality of second electric drive rotating rollers, the air duct heater, the pressure sensor, and the infrared sensor.

[0019] In one embodiment, the inner periphery of each air outlet drive wheel has a plurality of air inlet ports, the outer periphery of each air outlet drive wheel has a plurality of air outlet ports, one end of each air inlet port is movably connected to the corresponding air outlet, and the other end of each air inlet port is connected to the corresponding air outlet.

[0020] In one embodiment, each of the air inlet fixed shafts has a plurality of air outlet gaps, and the plurality of air outlet gaps are all in communication with the air inlet bare cavity.

[0021] In one embodiment, the diameters of the first electrically driven rotating wheel and the second electrically driven rotating wheel are both equal to the outer diameter of the air outlet drive wheel.

[0022] A drying and curing integrated process based on the through-hole film layer of printed circuit board, wherein the drying and curing integrated equipment based on the through-hole film layer of printed circuit board described in any of the above embodiments is used to perform drying and curing operations on the circuit board;

[0023] The integrated drying and curing process based on the through-hole film layer of printed circuit boards includes the following steps:

[0024] The circuit board to be dried and cured is fed into the drying chamber.

[0025] The circuit board is moved by a plurality of first electric drive rotating wheels and a plurality of second electric drive rotating wheels;

[0026] The circuit board is dried and cured using a hot air assembly while it is in motion.

[0027] The circuit board is then unloaded after drying and curing.

[0028] Compared with the prior art, this disclosure has at least the following advantages:

[0029] 1. First, open the first electric drive switch door to transport the circuit board into the drying chamber. After the circuit board enters the drying chamber, close the first electric drive switch door. The circuit board is driven to move on multiple air outlet drive wheels by multiple first electric drive rotating wheels and multiple second electric drive rotating wheels. At the same time, the hot air assembly allows hot air to be input from the air outlet to the air inlet end of multiple air outlet drive wheels through the air inlet cavity. The air outlet end of each air outlet drive wheel outputs hot air to the circuit board. This allows the through-hole film layer of the circuit board to dry and cure.

[0030] 2. Since the air outlet of each air drive wheel continuously outputs heat and the circuit board is continuously moving, multiple baffles are installed. Each baffle divides the hot air drying chamber into multiple hot air return chambers. Each hot air return chamber is located directly above the corresponding air inlet fixed shaft. That is, the hot air output from the air outlets of the multiple air drive wheels on the air inlet fixed shaft flows back to the circuit board's moving path through the hot air return chamber and diffuses to both ends of the circuit board's moving path, acting on the surface of the circuit board. In other words, by using the returned hot air to compensate for the temperature of the circuit board's surface, it is possible not only to improve the utilization rate of heat output and avoid the accumulation of hot air at the top of the hot air drying chamber, causing heat loss, but also to dry and cure the entire circuit board, forming a high-quality conductive layer on the circuit board.

[0031] 3. After the circuit board is moved to the outlet, the second electric drive switch door is opened to move the dried circuit board to the next process. During the entire drying and curing process of the circuit board, the drying chamber is kept sealed to avoid heat loss. The output power of the hot air assembly is adjusted and the temperature of the circuit board surface is compensated by the return hot air. This reduces the output energy consumption of the hot air assembly and improves the hot air utilization rate. At the same time, it can also ensure that a high-quality conductive layer is formed on the surface of the circuit board. Attached Figure Description

[0032] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this disclosure and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1 This is a schematic diagram of an integrated drying and curing device based on a through-hole film layer of a printed circuit board in one embodiment;

[0034] Figure 2 for Figure 1 The diagram shows a partial structural schematic of an integrated drying and curing device based on a through-hole film layer of a printed circuit board.

[0035] Figure 3 for Figure 1 The diagram shows a partial structural schematic of an integrated drying and curing device based on a through-hole film layer of a printed circuit board.

[0036] Figure 4 for Figure 1 The diagram shows a partial structural schematic of an integrated drying and curing device based on a through-hole film layer of a printed circuit board.

[0037] Figure 5 for Figure 1 The diagram shows a partial structural schematic of an integrated drying and curing device based on a through-hole film layer of a printed circuit board.

[0038] Figure 6 for Figure 3 The diagram shows a cross-sectional view of an integrated drying and curing device based on a through-hole film layer of a printed circuit board.

[0039] Figure 7 for Figure 1 The diagram shows a partial structural schematic of an integrated drying and curing device based on a through-hole film layer of a printed circuit board.

[0040] Figure 8 for Figure 1 The diagram shows a partial structural schematic of an integrated drying and curing device based on a through-hole film layer of a printed circuit board.

[0041] Figure 9 This is a schematic diagram showing the direction of hot air returning to the hot air recirculation chamber of an integrated drying and curing equipment for through-hole film layers on printed circuit boards.

[0042] Figure 10 This is a schematic diagram of a process for drying and curing an integrated process based on a through-hole film layer of a printed circuit board in one embodiment.

[0043] Figure 11 for Figure 10The diagram shows the specific process flow of S300 in the integrated drying and curing process based on the through-hole film layer of printed circuit board.

[0044] Figure 12 The graph shows the functional relationship between the output power y of the duct heater and the surface temperature x of the circuit board. Detailed Implementation

[0045] To facilitate understanding of this disclosure, a more complete description will be given below with reference to the accompanying drawings, which illustrate preferred embodiments of the present disclosure. However, this disclosure can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure.

[0046] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0047] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this disclosure. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0048] This disclosure provides an integrated drying and curing device for through-hole film layers used in printed circuit boards, comprising a drying assembly, an air knife drive assembly, a rotating assembly, multiple baffles, and a hot air assembly. The drying assembly includes a drying chamber, a first electrically driven switch door, and a second electrically driven switch door. The drying chamber has an inlet, a hot air drying chamber, and an outlet. The first electrically driven switch door covers the inlet and is slidably connected to the drying chamber. The second electrically driven switch door covers the outlet and is slidably connected to the drying chamber. The air knife drive assembly includes multiple inlet fixed shafts and multiple outlet drive wheels. The multiple inlet fixed shafts are uniformly fixed to the drying chamber. Each inlet fixed shaft has an inlet cavity and multiple outlets. The inlet cavity communicates with the multiple outlets. Each outlet drive wheel is disposed on a corresponding outlet and is rotatably connected to the inlet fixed shaft. The inlet end of each outlet drive wheel communicates with the corresponding outlet. The rotating assembly includes multiple first electrically driven rotating wheels and multiple second electrically driven rotating wheels. Each first electrically driven rotating wheel is rotatably connected to one end of a corresponding air inlet fixed shaft, and each second electrically driven rotating wheel is rotatably connected to the other end of a corresponding air inlet fixed shaft. Each of the enclosure plates is uniformly fixed to the top of the hot air drying chamber to divide the hot air drying chamber into multiple hot air return chambers, each of the hot air return chambers being located directly above a corresponding air inlet fixed shaft. The output end of the hot air assembly is used to communicate with the multiple air inlet open cavities.

[0049] Please see Figures 1 to 8 To better understand the drying and curing integrated apparatus 10 based on through-hole film for printed circuit boards disclosed herein, the following further explanation of the drying and curing integrated apparatus 10 based on through-hole film for printed circuit boards is provided:

[0050] An integrated drying and curing device 10 based on a through-hole film layer for printed circuit boards according to one embodiment includes a drying assembly 100, an air knife drive assembly 200, a rotating assembly 300, multiple baffles 400, and a hot air assembly 500. The drying assembly 100 includes a drying chamber 110, a first electrically driven switch door 120, and a second electrically driven switch door 130. The drying chamber 110 has an inlet 112, a hot air drying chamber 114, and an outlet 116. The first electrically driven switch door 120 covers the inlet 112 and is slidably connected to the drying chamber 110. The second electrically driven switch door 130 covers the outlet 116 and is slidably connected to the drying chamber 110. The air knife transmission assembly 200 includes multiple inlet fixed shafts 210 and multiple outlet transmission wheels 220. The multiple inlet fixed shafts 210 are uniformly fixed on the drying chamber 110. Each inlet fixed shaft 210 forms an inlet cavity 212 and multiple outlets 214. The inlet cavity 212 is connected to each of the multiple outlets 214. Each outlet transmission wheel 220 is disposed on a corresponding outlet 214 and is rotatably connected to the inlet fixed shaft 210. The inlet end of each outlet transmission wheel 220 is connected to the corresponding outlet 214. The rotating assembly 300 includes multiple first electrically driven rotating wheels 310 and multiple second electrically driven rotating wheels 320. Each first electrically driven rotating wheel 310 is rotatably connected to one end of a corresponding inlet fixed shaft 210, and each second electrically driven rotating wheel 320 is rotatably connected to the other end of a corresponding inlet fixed shaft 210. Each of the aforementioned baffle plates 400 is uniformly fixed to the top of the hot air drying chamber 114 to divide the hot air drying chamber 114 into multiple hot air return chambers 118, each of the aforementioned hot air return chambers 118 being located directly above the corresponding air inlet fixed shaft 210. The output end of the hot air assembly 500 is used to communicate with the multiple air inlet bare cavities 212.

[0051] In this embodiment, the first electric drive switch door 120 is first opened to transport the circuit board to the drying chamber 110. After the circuit board enters the drying chamber 110, the first electric drive switch door 120 is closed. The circuit board is driven to move on multiple air outlet drive wheels 220 by multiple first electric drive rotating wheels 310 and multiple second electric drive rotating wheels. At the same time, the hot air assembly 500 inputs hot air from the air outlet 214 to the air inlet end of multiple air outlet drive wheels 220 through the air inlet cavity 212. The air outlet end of each air outlet drive wheel 220 outputs hot air to the circuit board, thus enabling the through-hole film layer of the circuit board to dry and cure.

[0052] Furthermore, since the air outlet of each air drive wheel 220 continuously outputs heat and the circuit board is continuously moving, by setting multiple baffles 400, each baffle 400 divides the hot air drying chamber 114 into multiple hot air return chambers 118. Each hot air return chamber 118 is located directly above the corresponding air inlet fixed shaft 210. That is, the hot air output from the air outlets of the multiple air drive wheels 220 on the air inlet fixed shaft 210 flows back to the circuit board moving path through the hot air return chamber 118 and diffuses to both ends of the circuit board moving path, acting on the surface of the circuit board. That is, by using the returned hot air to compensate for the temperature of the circuit board surface, not only can the utilization rate of heat output be improved and the accumulation of hot air at the top of the hot air drying chamber 114 be avoided to prevent heat loss, but also the entire circuit board can be dried and cured, forming a high-quality conductive layer on the circuit board.

[0053] Furthermore, after the circuit board moves to the outlet 116, the second electric drive switch door 130 is opened to move the dried circuit board to the next process. During the entire drying and curing process of the circuit board, the drying chamber 110 remains sealed to avoid heat loss. By adjusting the output power of the hot air assembly 500 and using the return hot air to compensate for the temperature of the circuit board surface, the output energy consumption of the hot air assembly 500 can be reduced and the hot air utilization rate can be improved. At the same time, it can also ensure that a high-quality conductive layer is formed on the surface of the circuit board.

[0054] like Figures 1 to 4 As shown, in one embodiment, the drying and curing integrated equipment 10 further includes a board feeding and conveying assembly 600. The board feeding and conveying assembly 600 includes a board feeding and conveying bracket 610 and a plurality of first electrically driven rotating rollers 620. The board feeding and conveying bracket 610 is connected to one end of the drying chamber 110. The plurality of first electrically driven rotating rollers 620 are evenly arranged on the board feeding and conveying bracket 610. Both ends of each first electrically driven rotating roller 620 are rotatably connected to the board feeding and conveying bracket 610. A pressure sensor 630 is provided at the end of the board feeding and conveying bracket 610 near the board inlet 112. The pressure sensor 630 is communicatively connected to the first electrically driven switch door 120. It can be understood that the circuit board to be dried and cured after completing the front-end process is conveyed from the board feeding and conveying bracket 610 to the drying chamber 110 by the rotation of the plurality of first electrically driven rotating rollers 620. When the circuit board comes into contact with the pressure sensor 630, the pressure sensor 630 generates an open signal and transmits it to the first electric drive switch door 120 to control the first electric drive switch door 120 to open. When the circuit board detaches from the pressure sensor 630, the pressure sensor 630 generates a close signal and transmits it to the first electric drive switch door 120. The first electric drive switch door 120 receives the close signal and closes the door after a delay, thus ensuring that the circuit board is completely inside the drying chamber 110.

[0055] It should be noted that the thickness of the circuit board is between 1.0mm and 2.0mm, and the opening height of the first electric drive switch door 120 is less than or equal to 2.1mm.

[0056] like Figures 1 to 4 As shown, in one embodiment, the drying and curing integrated equipment 10 further includes a board output transfer assembly 700. The board output transfer assembly 700 includes a board output transfer bracket 710 and a plurality of second electrically driven rotating rollers 720. The board output transfer bracket 710 is connected to the other end of the drying chamber 110. The plurality of second electrically driven rotating rollers 720 are evenly arranged on the board output transfer bracket 710, and both ends of each second electrically driven rotating roller 720 are rotatably connected to the board output transfer bracket 710. It can be understood that after the circuit board has dried and cured, the second electrically driven switch door 130 is opened, allowing the circuit board to be transferred to the board output transfer bracket 710, and the circuit board is transported to the subsequent process by the rotation of the plurality of second electrically driven rotating rollers 720.

[0057] like Figure 1 and Figure 2 As shown, in one embodiment, the hot air assembly 500 further includes an insulated box 510, a hot air transmission pipe 520, and an air duct heater 530. The insulated box 510 is connected to one side of the drying box 110. The hot air transmission pipe 520 is disposed inside the insulated box 510 and has a main air inlet 5202 and a plurality of sub-air outlets 5204. The hot air output end of the air duct heater 530 is connected to the main air inlet 5202, and each sub-air outlet 5204 is connected to the corresponding air inlet cavity 212. Understandably, the duct heater 530 outputs hot air to the main air inlet 5202 of the hot air transmission duct 520. Since the hot air transmission duct 520 is located inside the insulation box 510, it can achieve a good insulation effect and reduce heat loss. The hot air generated by the duct heater 530 is delivered to multiple air inlet cavities 212 through multiple sub-air outlets 5204. Then, the air outlet end of the air outlet drive wheel 220 blows hot air onto the moving circuit board, thus enabling the circuit board to be dried and cured.

[0058] like Figures 1 to 4 and Figure 6As shown, in one embodiment, the drying and curing integrated equipment 10 further includes an infrared sensor 800, which is disposed at the bottom of a baffle plate 400 adjacent to the outlet 116. The infrared sensor 800 is communicatively connected to the second electric drive switch door 130. It is understood that when the circuit board is transported to the area below the infrared sensor 800, the infrared sensor 800 generates a board-down signal and transmits it to the second electric drive switch door 130, causing the second electric drive switch door 130 to open. As the circuit board gradually moves away from the drying chamber 110 until the infrared sensor 800 no longer generates a board-down signal, the delayed closing procedure of the second electric drive switch door 130 is initiated, causing the second electric drive switch door 130 to close after a delay of 8 to 10 seconds.

[0059] It should be noted that the opening height of the second electric drive switch door 130 is less than or equal to 2.1mm.

[0060] like Figures 1 to 8 As shown, in one embodiment, the drying and curing integrated device 10 further includes a control component, which is communicatively connected to the first electric drive switch door 120, the second electric drive switch door 130, a plurality of first electric drive rotating wheels 310, a plurality of second electric drive rotating wheels 320, a plurality of first electric drive rotating rollers 620, a plurality of second electric drive rotating rollers 720, the air duct heater 530, the first pressure sensor 630, the second pressure sensor 630, and the infrared sensor 800. It can be understood that the control component enables the automated drying and curing of circuit boards through the drying and curing integrated device 10.

[0061] like Figure 8As shown, in one embodiment, each of the air-discharge drive wheels 220 has multiple air inlet ports 222 formed on its inner periphery, and multiple air outlet ports 224 formed on its outer periphery. One end of each air inlet port 222 is movably connected to the corresponding air outlet 214, and the other end of each air inlet port 222 is connected to the corresponding air outlet port 224. It can be understood that since the circuit board moves within the drying chamber 110 by rotating the first electrically driven rotating wheel 310 and the second electrically driven rotating wheel 320, the circuit board will drive the air-discharge drive wheels 220 to rotate during its movement. Furthermore, because the inner circumference of the air outlet drive wheel 220 has multiple air inlet ports 222 and the outer circumference of the air outlet drive wheel 220 has multiple air outlet ports 224, even when the air outlet drive wheel 220 rotates, the air outlet 214 will be in active communication with the corresponding air inlet port 222, and hot air will be output through the corresponding air outlet port 224, so that the air outlet drive wheel 220 can continuously output hot air into the drying chamber 110 while rotating. Further, the air outlet 214 will always be in active communication with the corresponding air inlet port 222 during the rotation of the air outlet drive wheel 220, which also ensures that the air outlet 214 is always connected to the air inlet end of the air outlet drive wheel 220, and that the corresponding air outlet port 224 will output hot air during the rotation of the air outlet drive wheel 220, ensuring that the air outlet end of the air outlet drive wheel 220 can continuously output hot air into the drying chamber 110 while rotating.

[0062] like Figure 7 As shown, in one embodiment, each of the air inlet fixing shafts 210 has multiple air outlet gaps 216, all of which are connected to the air inlet bare cavity 212. It is understood that by providing multiple air outlet gaps 216 in the air inlet fixing shaft 210, the contact area between the hot air and the circuit board can be increased, thereby increasing the heating rate of the circuit board surface. Furthermore, the hot air output from the air outlet gaps 216 will also flow back to the circuit board surface through the hot air return cavity 118 for temperature compensation. This improves heat utilization and reduces energy consumption, while also ensuring the formation of a high-quality conductive layer on the circuit board.

[0063] like Figure 5 As shown, in one embodiment, the diameters of the first electrically driven rotating wheel 310 and the second electrically driven rotating wheel 320 are both equal to the outer diameter of the air outlet drive wheel 220. It can be understood that because the diameters of the first electrically driven rotating wheel 310 and the second electrically driven rotating wheel 320 are both equal to the outer diameter of the air outlet drive wheel 220, the air outlet drive wheel 220 can also rotate when the first electrically driven rotating wheel 310 and the second electrically driven rotating wheel 320 move the circuit board. During rotation, the air outlet drive wheel 220 can continuously output hot air to the circuit board while improving the smoothness of the circuit board's movement.

[0064] It should be noted that the width of the baffle plate 400 is equal to the minimum distance between the outer rings of two adjacent air outlet drive wheels 220 on the two air inlet fixed shafts 210, and there is a gap between the baffle plate 400 and the air outlet drive wheels 220 to ensure that the circuit board can move on the drying chamber 110.

[0065] Please see Figure 10 This disclosure also provides an integrated drying and curing process based on the through-hole film layer of printed circuit boards, wherein the integrated drying and curing equipment based on the through-hole film layer of printed circuit boards described in any of the above embodiments is used to perform drying and curing operations on the circuit board.

[0066] The integrated drying and curing process based on the through-hole film layer of printed circuit boards includes the following steps:

[0067] S100, the circuit board to be dried and cured is fed into the drying chamber.

[0068] In this embodiment, the circuit board that has been pre-treated and is to be dried and cured is fed into the drying chamber to ensure that the circuit board can be placed inside the drying chamber for drying and curing.

[0069] S200, the circuit board is moved by a plurality of first electric drive rotating wheels and a plurality of second electric drive rotating wheels.

[0070] In this embodiment, the circuit board is moved within the drying chamber by a plurality of first electric drive rotating wheels and a plurality of second electric drive rotating wheels.

[0071] S300, the moving circuit board is dried and cured by a hot air assembly.

[0072] In this embodiment, the hot air assembly outputs hot air to the air outlet drive wheel, and then the air outlet drive wheel outputs hot air to dry and cure the moving circuit board, so that the black hole liquid on the circuit board is cured to form a uniform and dense conductive layer.

[0073] S400, the circuit board is unloaded after drying and curing.

[0074] In this embodiment, the dried and cured circuit board is unloaded to facilitate the next process.

[0075] In one embodiment, the specific steps for feeding the circuit board to be dried and cured are as follows:

[0076] First, multiple first electric drive rotating rollers are started to rotate to drive the front-end processed circuit board to move on the board feeding and transmission bracket.

[0077] Secondly, when the circuit board comes into contact with the pressure sensor, the pressure sensor triggers an opening signal and transmits it to the first electric drive switch door. The first electric drive switch door receives the opening signal and performs the opening operation so that the circuit board enters the drying chamber from the inlet.

[0078] Then, when the circuit board is detached from the pressure sensor, the pressure sensor triggers a door closing signal and transmits it to the first electric drive switch door. The first electric drive switch door receives the door closing signal and performs a delayed door closing operation so that the circuit board is completely inserted into the drying chamber.

[0079] It should be noted that when the circuit board processed in the previous process enters the board feeding conveyor, multiple first-drive rotating rollers are activated to drive the circuit board from the board feeding conveyor towards the drying chamber. When the circuit board contacts the pressure sensor, the pressure sensor triggers an opening signal and transmits it to the first-drive switch door, so that the first-drive switch door receives the opening signal and executes the opening operation, thus realizing automated board feeding. Furthermore, when the circuit board detaches from the pressure sensor, the pressure sensor triggers a closing signal and transmits it to the first-drive switch door. The first-drive switch door receives the closing signal and executes a delayed closing operation. This ensures that the circuit board is fully inside the drying chamber while simultaneously closing the first-drive switch door immediately, preventing hot air from escaping from the board inlet and effectively reducing hot air loss.

[0080] In one embodiment, the delay time for the delayed closing operation of the first electric drive switch door is 1 second. It is understood that the 1-second delay in closing the first electric drive switch door ensures that the circuit board is fully inside the drying chamber while simultaneously blocking the inlet, thus reducing heat loss from the drying chamber.

[0081] In one embodiment, the specific steps for moving the circuit board using multiple first electrically driven rotating wheels and multiple second electrically driven rotating wheels are as follows:

[0082] While the first electric drive door opens, multiple first electric drive rotating wheels and multiple second electric drive rotating wheels are activated to move the circuit board inside the drying chamber.

[0083] Understandably, this ensures that the circuit board can move continuously from the board feeder to the drying chamber, and that the drying and curing process takes place during this movement within the drying chamber.

[0084] Please see Figure 11 In one embodiment, the specific steps for drying and curing the moving circuit board using a hot air assembly are as follows:

[0085] S301, while the first electric drive switch door performs the door opening operation, the air duct heater is started to output hot air to the main air inlet of the hot air transmission pipeline.

[0086] S302, hot air is output to the corresponding air inlet cavity through multiple sub-outlet ports of the hot air transmission pipe;

[0087] S303, a portion of the hot air in each of the air inlet bare cavities is delivered to the air outlet drive wheel through multiple air inlets, and the air outlet drive wheel outputs hot air in the direction of the corresponding hot air return cavity, so that the hot air acts on the moving circuit board or the corresponding hot air return cavity.

[0088] S304, another portion of the hot air in each of the air inlet bare cavities is output to the corresponding hot air return cavity through multiple air outlet gaps, so that the hot air acts on the moving circuit board or the corresponding hot air return cavity.

[0089] S305, the hot air returning through the hot air return cavity performs a temperature compensation operation on the moving circuit board.

[0090] It should be noted that since the circuit board moves on multiple first electric drive rotating wheels and multiple second electric drive rotating wheels, the circuit board will drive the corresponding exhaust drive wheel to rotate while moving. Some of the hot air from the air inlet cavity will be delivered to the corresponding air inlet port of the exhaust drive wheel through the air inlet, and then output from the corresponding air outlet port of the exhaust drive wheel and act on the circuit board. That is, the hot air will be input from the air inlet port that is movably connected to the air inlet, and then output from the corresponding air outlet port. When the exhaust drive wheel is stationary, some of the hot air from the air inlet cavity will be delivered to the air inlet port of the exhaust drive wheel through the air inlet, and then output from the air outlet port of the exhaust drive wheel and act on the corresponding hot air return cavity. That is, the hot air will be input from the air inlet port that is connected to the air inlet when the exhaust drive wheel is stationary, and then output from the corresponding air outlet port. Furthermore, the hot air returning through the hot air return cavity diffuses towards both ends of the circuit board's moving path, thus compensating for the temperature of the moving circuit board and achieving full-board drying and curing. This results in a uniform and dense high-quality conductive layer on the circuit board, while also effectively improving the utilization rate of heat output.

[0091] In one embodiment, the specific steps for unloading the dried and cured circuit board are as follows:

[0092] When the circuit board is transported to the area below the infrared sensor, the infrared sensor generates a board-down signal and transmits it to the second electric drive switch door. The second electric drive switch door receives the board-down signal and performs an opening operation to transport the circuit board from the drying chamber to the board-out transfer bracket.

[0093] While the second electric drive switch door performs the door opening operation, multiple second electric drive rotating rollers are activated to transport the circuit board from the board output transfer bracket to the downstream process.

[0094] As the circuit board gradually leaves the drying chamber until the infrared sensor no longer generates a board-down signal, the second electric drive switch door performs a delayed closing operation to allow the circuit board inside the drying chamber to fully enter the board-out transmission bracket.

[0095] In one embodiment, the delay time for the second electric drive door switching delayed closing operation is 8s to 10s. It is understood that the delayed closing operation of the second electric drive door switching ensures that all circuit boards inside the drying chamber are ejected onto the ejection transport bracket.

[0096] In one embodiment, the output power of the air duct heater is set as y, the surface temperature of the circuit board is x, the compensation temperature of the return hot air is α, and the moving speed of the circuit board in the drying chamber is β, where β∈(0.03, 0.05)m / s;

[0097] The graph of the functional relationship between y and x, such as Figure 12 ;

[0098] When 0 < x < T1 or T1 < x < T2, y and x satisfy the following relationship:

[0099]

[0100] When x = T1, y has a minimum value y. min That is, y = P1;

[0101] When x = T2, y = P2;

[0102] When x > T2, then y = β + 1 / (x - T2);

[0103] Where T0 = 70℃, T1 = 85℃, and T2 = 100℃.

[0104] It should be noted that the drying and curing temperature of the circuit board is 85℃~100℃. When the board surface temperature is T0, it has not yet reached the drying and curing temperature, and the output power of the air duct heater is relatively high. As the board surface temperature gradually rises, the output power of the air duct heater gradually decreases, that is, the output power of the air duct heater is reduced under the temperature compensation of the recirculating hot air. When the board surface temperature is T1, the output power of the air duct heater is relatively low. Only a small amount of energy and recirculating hot air are needed to maintain the board surface temperature at T1, and T1 is within the drying and curing temperature range of the circuit board. This maximizes the utilization rate of hot air and reduces the production energy consumption of the air duct heater, while also ensuring the formation of a uniform and dense high-quality conductive layer on the circuit board. When the board surface temperature is T2, the air duct heater needs to increase its output power to raise the board surface temperature. Although T2 is also within the drying and curing temperature range of the circuit board, it will increase the energy consumption of the air duct heater.

[0105] The following are examples, but it should be noted that the following examples do not exhaust all possible situations, and the materials used in the following examples are commercially available unless otherwise specified.

[0106] Example 1

[0107] The surface temperature of the circuit board is 85℃. The effective utilization rate of the output heat of the air duct heater is calculated. The resistance value of the hole after metallization of the circuit board is tested, and the resistance value after metallization of the hole is found to be 1.10Ω.

[0108] Example 2

[0109] The surface temperature of the circuit board is 90℃. The effective utilization rate of the output heat of the air duct heater is calculated. The resistance value of the hole after metallization of the circuit board is tested and found to be 1.24Ω.

[0110] Example 3

[0111] The circuit board surface temperature is 95℃. The effective utilization rate of the output heat of the air duct heater is calculated. The resistance value of the circuit board after the hole is metallized is tested, and the resistance value after the hole is metallized is found to be 1.39Ω.

[0112] Example 4

[0113] The circuit board surface temperature is 100℃. The effective utilization rate of the output heat of the air duct heater is calculated. The resistance value of the circuit board after the hole is metallized is tested, and the resistance value after the hole is metallized is found to be 1.50Ω.

[0114] Comparative Example 1

[0115] The circuit board surface temperature is 70℃. The effective utilization rate of the output heat of the air duct heater is calculated. The resistance value of the circuit board after the hole is metallized is tested, and the resistance value after the hole is metallized is found to be 3.40Ω.

[0116] Comparative Example 2

[0117] The surface temperature of the circuit board is 110℃. The effective utilization rate of the output heat of the air duct heater is calculated. The resistance value of the circuit board after the hole is metallized is tested, and the resistance value after the hole is metallized is found to be 3.28Ω.

[0118] The test results are shown in Table 1.

[0119]

[0120]

[0121] Table 1 shows that the optimal drying and curing temperature for the circuit board is 85℃~100℃. Within this temperature range, the circuit board resistance is relatively high and the heat output utilization rate of the air duct heater is relatively low. This also indicates that when the circuit board temperature is between 85℃ and 100℃, the heat output utilization rate of the air duct heater is high and the resistance of the circuit board is low.

[0122] Furthermore, the drying and curing integrated equipment based on the through-hole film layer of printed circuit boards disclosed herein controls the surface temperature of the circuit board to 85°C during the drying and curing operation, which maximizes the heat output utilization rate. When the surface temperature is 85°C, the output power of the air duct heater is low, resulting in the lowest resistance value of the circuit board. This indicates that Embodiment 1 is the optimal embodiment.

[0123] In summary, by using the integrated drying and curing equipment and process based on the through-hole film layer of printed circuit boards disclosed herein to perform drying and curing operations on the circuit boards, and controlling the board surface temperature at 85°C, the production energy consumption of the circuit boards can be reduced to the greatest extent and the heat utilization rate can be improved to the greatest extent. At the same time, it can also enable the circuit boards to form a uniform and dense high-quality conductive layer.

[0124] Compared with the prior art, this disclosure has at least the following advantages:

[0125] 1. First, open the first electric drive switch door to transport the circuit board into the drying chamber. After the circuit board enters the drying chamber, close the first electric drive switch door. The circuit board is driven to move on multiple air outlet drive wheels by multiple first electric drive rotating wheels and multiple second electric drive rotating wheels. At the same time, the hot air assembly allows hot air to be input from the air outlet to the air inlet end of multiple air outlet drive wheels through the air inlet cavity. The air outlet end of each air outlet drive wheel outputs hot air to the circuit board. This allows the through-hole film layer of the circuit board to dry and cure.

[0126] 2. Since the air outlet of each air drive wheel continuously outputs heat and the circuit board is continuously moving, multiple baffles are installed. Each baffle divides the hot air drying chamber into multiple hot air return chambers. Each hot air return chamber is located directly above the corresponding air inlet fixed shaft. That is, the hot air output from the air outlets of the multiple air drive wheels on the air inlet fixed shaft flows back to the circuit board's moving path through the hot air return chamber and diffuses to both ends of the circuit board's moving path, acting on the surface of the circuit board. In other words, by using the returned hot air to compensate for the temperature of the circuit board's surface, it is possible not only to improve the utilization rate of heat output and avoid the accumulation of hot air at the top of the hot air drying chamber, causing heat loss, but also to dry and cure the entire circuit board, forming a high-quality conductive layer on the circuit board.

[0127] 3. After the circuit board is moved to the outlet, the second electric drive switch door is opened to move the dried circuit board to the next process. During the entire drying and curing process of the circuit board, the drying chamber is kept sealed to avoid heat loss. The output power of the hot air assembly is adjusted and the temperature of the circuit board surface is compensated by the return hot air. This reduces the output energy consumption of the hot air assembly and improves the hot air utilization rate. At the same time, it can also ensure that a high-quality conductive layer is formed on the surface of the circuit board.

[0128] The embodiments described above are merely illustrative of several implementations of this disclosure, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the disclosed patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this disclosure, and these all fall within the protection scope of this disclosure. Therefore, the protection scope of this patent should be determined by the appended claims.

Claims

1. An integrated drying and curing device based on through-hole film for printed circuit boards, characterized in that, include: A drying assembly includes a drying chamber, a first electric drive switch door, and a second electric drive switch door. The drying chamber has an inlet, a hot air drying chamber, and an outlet. The first electric drive switch door covers the inlet and is slidably connected to the drying chamber. The second electric drive switch door covers the outlet and is slidably connected to the drying chamber. An air knife transmission assembly includes multiple inlet fixed shafts and multiple outlet transmission wheels. The multiple inlet fixed shafts are evenly fixed on the drying chamber. Each inlet fixed shaft forms an inlet cavity and multiple outlets. The inlet cavity is connected to the multiple outlets respectively. Each outlet transmission wheel is disposed on a corresponding outlet. Each outlet transmission wheel is rotatably connected to the inlet fixed shaft. The inlet end of each outlet transmission wheel is connected to the corresponding outlet. A rotating assembly, comprising a plurality of first electrically driven rotating wheels and a plurality of second electrically driven rotating wheels, each of the first electrically driven rotating wheels being rotatably connected to one end of a corresponding air intake fixed shaft, and each of the second electrically driven rotating wheels being rotatably connected to the other end of a corresponding air intake fixed shaft; Multiple baffles are uniformly fixed to the top of the hot air drying chamber to divide the hot air drying chamber into multiple hot air return chambers, and each hot air return chamber is located directly above the corresponding air inlet fixing shaft. A hot air assembly, the output end of which is used to communicate with the plurality of air inlet cavities.

2. The integrated drying and curing equipment based on the through-hole film layer of printed circuit boards according to claim 1, characterized in that, The drying and curing integrated equipment also includes a feeding conveyor assembly, which includes a feeding conveyor bracket and a plurality of first electric drive rotating rollers. The feeding conveyor bracket is connected to one end of the drying chamber. The plurality of first electric drive rotating rollers are evenly arranged on the feeding conveyor bracket. Both ends of each first electric drive rotating roller are rotatably connected to the feeding conveyor bracket. A pressure sensor is provided at one end of the feeding conveyor bracket near the feeding port. The pressure sensor is communicatively connected to the first electric drive door switch.

3. The integrated drying and curing equipment based on the through-hole film layer of printed circuit boards according to claim 2, characterized in that, The drying and curing integrated equipment also includes a plate conveying assembly, which includes a plate conveying bracket and multiple second electric drive rotating rollers. The plate conveying bracket is connected to the other end of the drying chamber. The multiple second electric drive rotating rollers are evenly arranged on the plate conveying bracket, and both ends of each second electric drive rotating roller are rotatably connected to the plate conveying bracket.

4. The integrated drying and curing equipment based on the through-hole film layer of printed circuit boards according to claim 3, characterized in that, The hot air assembly also includes an insulated box, a hot air transmission pipe, and an air duct heater. The insulated box is connected to one side of the drying box. The hot air transmission pipe is located inside the insulated box and has a main air inlet and multiple sub-air outlets. The hot air output end of the air duct heater is connected to the main air inlet, and each sub-air outlet is connected to the corresponding air inlet cavity.

5. The integrated drying and curing equipment based on the through-hole film layer of printed circuit boards according to claim 4, characterized in that, The drying and curing integrated equipment also includes an infrared sensor, which is located at the bottom of a baffle plate adjacent to the outlet, and is communicatively connected to the second electric drive switch door.

6. The integrated drying and curing equipment based on the through-hole film layer of printed circuit boards according to claim 5, characterized in that, The drying and curing integrated equipment also includes a control component, which is communicatively connected to the first electric drive switch door, the second electric drive switch door, multiple first electric drive rotating wheels, multiple second electric drive rotating wheels, multiple first electric drive rotating rollers, multiple second electric drive rotating rollers, the air duct heater, the pressure sensor, and the infrared sensor.

7. The integrated drying and curing equipment based on the through-hole film layer of printed circuit boards according to claim 1, characterized in that, Each of the air-discharge drive wheels has multiple air inlet ports on its inner circumference and multiple air outlet ports on its outer circumference. One end of each air inlet port is movably connected to the corresponding air outlet, and the other end of each air inlet port is connected to the corresponding air outlet.

8. The integrated drying and curing equipment based on the through-hole film layer of printed circuit boards according to claim 1, characterized in that, Each of the aforementioned air inlet fixed shafts has multiple air outlet gaps, and all of the multiple air outlet gaps are connected to the air inlet bare cavity.

9. The integrated drying and curing equipment based on the through-hole film layer of printed circuit boards according to claim 1, characterized in that, The diameters of the first and second electric drive rotating wheels are both equal to the outer diameter of the air outlet drive wheel.

10. A drying and curing integrated process based on a through-hole film layer of a printed circuit board, characterized in that, The drying and curing equipment based on the through-hole film layer of printed circuit board as described in any one of claims 1-9 is used to perform drying and curing operations on the circuit board; The integrated drying and curing process based on the through-hole film layer of printed circuit boards includes the following steps: The circuit board to be dried and cured is fed into the drying chamber. The circuit board is moved by a plurality of first electric drive rotating wheels and a plurality of second electric drive rotating wheels; The circuit board is dried and cured using a hot air assembly while it is in motion. The circuit board is then unloaded after drying and curing.

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