A processing technique for small size product sequencing

Abstract

The application discloses a processing technology for small-size product sorting, which comprises the following steps: adopting a layout software to design product array layout, generating a layout plate layout according to product appearance and assembly direction, and marking a positioning reference point; arranging products on a mother plate based on the layout plate layout, pasting a customized adhesive bearing film, performing film pretreatment and visual calibration, and forming a bearing film intermediate mother plate; using a special punching die to punch the intermediate mother plate, completing product separation through a positioning structure and a giving place structure, removing waste, and keeping the product fixed by the bearing film; aligning the punched intermediate with a customized blister tray, performing downward transfer through a pressing clamp, embedding the product into the blister tray at one time, realizing low-damage and batch one-time transfer of small-size products into the blister tray, and thus significantly improving productivity and yield.

Description

Technical Field

[0001] This invention relates to the field of circuit board technology, and in particular to a processing technology for sorting small-sized products. Background Technology

[0002] As industries such as electronics, precision machinery, medical devices, micro connectors, and wearable devices move towards miniaturization and high density, an increasing number of production processes require the efficient sorting, counting, and packaging of extremely small and diverse components for subsequent placement, packaging, or assembly processes. Typical applications include the sequential traying of electronic components (micro-resistors, capacitors, sensor pins) after punching / die cutting for use by pick-and-place machines. These scenarios share common production requirements: high throughput, low damage, traceable batch transfer, and standardized palletizing to ensure that downstream automated equipment or manual assembly can reliably and continuously obtain qualified parts.

[0003] In existing technologies, common methods for sorting and transferring small parts include feeding them by a vibratory feeder / feeder and then using a robotic arm (vacuum suction or micro gripper) to pick them up one by one, tape / roll-type feeding, and manual placement of each part on a tray or temporary fixation with adhesive tape followed by manual transfer. These methods are feasible in certain scenarios, but they have significant shortcomings from the perspective of "automating the grasping / handling": First, the mass and contact area of ​​small parts are limited, and vacuum suction is prone to unstable grasping, flipping, or missing parts due to center of gravity shift or surface morphology; second, micro grippers are sensitive to shape, tolerance, and surface fragility, and frequent contact can easily damage thin-walled or precision surfaces; third, the grasping and positioning accuracy is limited by the attitude and path control of the end effector, making it difficult to achieve non-destructive and high-precision placement of an entire array of small parts into the corresponding blister pack recesses in a single operation.

[0004] Therefore, existing technologies have the technical problem of making it difficult to achieve batch non-destructive positioning and placement of small-sized products during the process of separation and transfer into pallets. Summary of the Invention

[0005] The purpose of this invention is to provide a processing technology for sorting small-sized products, thereby solving the above-mentioned technical problems.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] A processing technique for sorting small-sized products includes the following steps:

[0008] S1. Use layout software to design product array layout, generate layout board based on product shape and assembly direction, and mark positioning reference points;

[0009] S2, based on the layout of the layout board, arrange the products on the mother board, and apply a customized adhesive carrier film, perform film pretreatment and visual calibration, to form an intermediate mother board with a carrier film;

[0010] S3 uses a special punching die to punch the intermediate mother plate, and completes the product separation through the positioning structure and the clearance structure, and removes the waste material, keeping the product fixed by the carrier film;

[0011] S4. Align the punched intermediate part with the customized blister tray, and use the pressing clamp to perform downward transfer, embedding the product into the blister tray in one go.

[0012] Optionally, step S4 may be followed by:

[0013] S5 performs carrier film peeling, cleaning, sealing, and online visual inspection on the blister pack with embedded products, and outputs the finished blister pack.

[0014] Optionally, the carrier film is a low-residue acrylic re-peel film or a surface-treated PE film, the peel force of which is matched with the product weight and friction characteristics.

[0015] Optionally, step S1 specifically includes the following steps:

[0016] S11, obtain the product outline and assembly direction requirements, and input the inner cavity dimensions and arrangement specifications of the target blister tray;

[0017] S12, Based on the product outline, use layout software to generate an initial array layout, and rotate and align the product units according to the assembly direction requirements to form a regular matrix or staggered arrangement;

[0018] S13, mark uniform positioning reference points in the initial array layout, the positioning reference points include array corner points and center reference points;

[0019] S14, adjust the product spacing according to the punching process requirements, set the die clearance distance and waste discharge channel, and automatically detect and correct the interference area;

[0020] S15, output the final layout file, and simultaneously generate the carrier film window diagram and the blister tray positioning hole processing diagram corresponding to the layout.

[0021] Optionally, the special punching die includes a positioning reference pin that matches the positioning reference point of the layout board, a cutting edge profile, a clearance area, and a waste discharge channel.

[0022] Optionally, step S2 specifically includes the following steps:

[0023] S21, Prepare a cleaned layout board and a custom adhesive carrier film, wherein the layout board is pre-set with positioning reference points and array coordinate information;

[0024] S22, the products are arranged in an array according to the layout board, and a carrier film with zoned adjustable adhesion is used for application. The dense product areas use high adhesion areas, and the edge areas use medium and low adhesion areas.

[0025] S23, Pre-treatment of the applied carrier film, including tension flattening and heat activation treatment at 40-60℃ for 2-5 minutes;

[0026] S24. Using a visual calibration system, the layout reference point is compared with the actual position of the carrier film to perform position deviation compensation calibration, thus forming an intermediate motherboard with a carrier film.

[0027] Optionally, step S3 specifically includes the following steps:

[0028] S31, the intermediate mother plate with the carrier film is placed in the special punching die, and the die positioning pin is aligned with the layout reference point and clamped and fixed.

[0029] S32, start the punching equipment, control the punching speed to 20-40mm / s, and the stroke to be 1.2-1.5 times the product thickness to complete the precise separation of the product's outline;

[0030] S33, the vacuum adsorption mechanism is activated simultaneously during the punching process, and the generated waste is collected into the waste bin through the mold waste discharge channel;

[0031] S34, after punching, keep the carrier film intact, and use the ejection mechanism to smoothly eject the intermediate part from the mold, maintaining the array state of the product on the carrier film.

[0032] Optionally, the pressure box clamp is equipped with a force sensor to monitor the pressing force during the pressing and transfer process.

[0033] Optionally, the layout design is: an arraying method using a regular matrix, rotational alignment, or local offset based on the product's shape.

[0034] Compared with existing technologies, this invention has the following advantages: This process is designed for small-sized products. The carrier film provides temporary fixation for small-sized products during the punching and transfer process, positioning each piece during separation and handling. The positioning and clearance structure of the special mold, combined with the preset layout, ensures that the cutting size of each tiny part is consistent and is not damaged by impact, thereby reducing processing damage. The overall downward pressure of the box clamp helps to disperse pressure, enabling high-precision alignment and gentle placement in one-time batch transfer. The overall linkage significantly increases throughput and strengthens process stability, making it particularly suitable for small-sized products. Therefore, it is significantly superior to the traditional piece-by-piece tray loading process in terms of efficiency, yield, and automation level, achieving low damage to small-sized products and enabling batch one-time transfer into blister trays, thereby significantly improving production capacity and yield. Attached Figure Description

[0035] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0036] The structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and objectives that the present invention can produce, should still fall within the scope of the technical content disclosed in the present invention.

[0037] Figure 1 This is a schematic diagram of the layout of the processing technology for sorting small-sized products in this embodiment;

[0038] Figure 2 This is a schematic diagram of the layout of the intermediate motherboard for the processing technology of sorting small-sized products in this embodiment.

[0039] Figure 3 This is a schematic diagram of the blister tray used for the layout of the typesetting board in this embodiment;

[0040] Figure 4 This is a physical image of the special punching die used for the layout of the typesetting board in this embodiment. Detailed Implementation

[0041] To make the objectives, features, and advantages of this invention more apparent and understandable, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0042] In the description of this invention, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component positioned centrally in the connection.

[0043] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0044] Combination Figures 1 to 4 As shown, this embodiment of the invention provides a processing technology for sorting small-sized products, including the following steps:

[0045] S1. Use layout software to design the product array layout, generate layout board 10 based on the product shape and assembly direction, and mark the positioning reference points.

[0046] Combination Figure 1 As shown, the two-dimensional contour data of the product is first imported using layout software. The arrangement rules are then determined based on the product assembly direction and the inner cavity dimensions of the target blister pack, generating a layout board (10). During the layout process, uniform positioning reference points (e.g., array corner points and center reference points) are marked for each product unit, and gaps are reserved between adjacent units for die-cutting toolpaths and mold clearance. Simultaneously, waste material discharge channels and a distribution diagram of the carrier film openings / micropores are designed. The layout file can be output in the engineering format required for CNC machining and serves as the direct basis for carrier film openings, mold manufacturing, and blister pack mold opening. The completed layout board serves as the input for the next step of film application.

[0047] S2, based on the layout board 10, arrange the products on the mother board and apply a customized adhesive carrier film, perform film pretreatment and visual calibration, and form an intermediate mother board 20 with a carrier film.

[0048] Combination Figure 2As shown, according to the output layout 10, after the product array is arranged on the cleaned motherboard, a carrier film is applied to the motherboard. The carrier film is preferably a low-residue acrylic re-peel film or a treated PE film, and its peel strength must match the product weight and friction characteristics. A zoned adhesion design can be used during application—a high-adhesion zone for densely packed products and a medium-low adhesion zone for edges or auxiliary areas. After film application, tension leveling and heat activation treatment are performed at 40–60℃ for approximately 2–5 minutes to eliminate wrinkles and stabilize adhesion. Subsequently, a visual calibration system is used to compare the layout reference points with the actual position of the carrier film and compensate for any deviations, forming an intermediate motherboard 20 with the carrier film, which is then provided for die-cutting.

[0049] S3, using a special punching die 40 to punch the intermediate mother plate 20, the product is separated by the positioning structure and the clearance structure, and the waste is removed, keeping the product fixed by the carrier film.

[0050] Combination Figure 4 As shown, the intermediate part mother plate 20 with a carrier film is clamped into a special punching die 40 that matches the layout reference point. The die is equipped with a positioning reference pin, a cutting edge contour, a clearance area, and a waste discharge channel. The punching equipment is started, and the punching speed can be controlled at about 20–40 mm / s. The stroke is set to about 1.2–1.5 times the product thickness to ensure complete cutting and reduce ejection impact. Simultaneously with punching, a vacuum adsorption or air blowing chip removal device is activated to extract waste material through the die discharge channel and collect it into a waste bin. After punching, the intermediate part is smoothly ejected from the die by the ejection mechanism to ensure that the array positioning of the product on the carrier film is not disturbed, and the intermediate part is used as the direct workpiece.

[0051] S4. Align the punched intermediate part with the customized blister tray, and use the pressing clamp to perform downward transfer, embedding the product into the blister tray in one go.

[0052] It should be noted that the customized blister trays, one-to-one with the layout, are placed on the lower positioning platform and fixed with alignment pins or reference slots. After positioning, the punched intermediate parts are placed on the upper mold or transfer table and visually or mechanically aligned to ensure that the two references are aligned. After alignment, the pressing fixture presses down in controlled stroke and controlled force zones, squeezing the carrier film and the product underneath into the recess of the blister tray. The fixture is equipped with a force sensor to monitor the pressing force in real time. If the pressing force in a certain area exceeds the set threshold or obvious abnormalities occur (such as jamming or missing parts), the control system stops and triggers an alarm or rejection process. For extremely small or easily flipped products, a short-term vacuum can be used during the pressing process to stabilize the product posture. After the product is fully in place, the carrier film is peeled off by the fixture's built-in or subsequent peeling mechanism, completing a one-time batch transfer and transferring the blister tray containing the product.

[0053] S5 performs carrier film peeling, cleaning, sealing, and online visual inspection on the blister tray 30 with embedded products, and outputs the finished blister tray.

[0054] Combination Figure 3 As shown, the process involves removing residual film and cleaning the surface of the blister pack with the embedded product: First, mechanical peeling or a continuous belt peeling mechanism is used to remove residual film. Then, compressed air is used for blowing, low-intensity brushing, or wiping / cleaning processes that meet production cleanliness requirements to remove trace amounts of residual adhesive and debris. Subsequently, the blister pack 30 is sealed (e.g., with a heat-sealed cover film or a press-fit cover). The sealing parameters (temperature, pressure, time) are determined based on the material. After sealing, the blister pack 30 is inspected by an online visual inspection (AOI) unit for missing parts, misalignment, orientation, appearance damage, and sealing integrity. Blister packs 30 that pass inspection are shipped as finished products, while those that fail are sent to a rework or rejection station. The cause of the abnormality is recorded and fed back to the layout, film material, or fixture parameters for process optimization.

[0055] The working principle of this invention is as follows: This process is designed for small-sized products. The carrier film provides temporary fixation for small-sized products during the punching and transfer process, positioning each piece during separation and handling. The positioning and clearance structure of the special mold, combined with the preset layout, ensures that the cutting size of each tiny part is consistent and is not damaged by impact, thereby reducing processing damage. The overall downward pressure of the box clamp helps to disperse pressure, enabling high-precision alignment and gentle placement in one-time batch transfer. The overall linkage significantly increases throughput and strengthens process stability, making it particularly suitable for small-sized products. Therefore, it is significantly superior to the traditional piece-by-piece tray loading process in terms of efficiency, yield, and automation level, achieving low damage to small-sized products and enabling batch one-time transfer into blister trays, thereby significantly improving production capacity and yield.

[0056] In this embodiment, the carrier film is a low-residue acrylic re-peeling film or a surface-treated PE film, the peeling force of which is matched with the product weight and friction characteristics.

[0057] It should be noted that the carrier film used is preferably a low-residue acrylic re-peeling film or a surface-treated polyethylene (PE) film. The adhesion properties of the carrier film are determined experimentally to match the peeling force with the weight and contact surface friction characteristics of the small-sized product to be treated.

[0058] During implementation, standard peel force tests (such as 90° peel test) are used to determine the appropriate peel force range of the film material. Based on the different needs of dense and edge areas of the product, zoned adhesion is designed (relatively high peel force for dense areas and low peel force for edge areas) to balance the fixation reliability during the punching process and the peelability of the film after transfer.

[0059] After the lamination process, the carrier film can be thermally activated or tension flattened to stabilize its bonding performance. During the subsequent pressing and peeling processes, it exhibits characteristics of low adhesive residue, easy peeling, and no damage to the product surface, thereby improving the transfer success rate and reducing the rework rate.

[0060] In this embodiment, step S1 specifically includes the following steps:

[0061] S11, obtain product outline and assembly direction requirements, and input the inner cavity dimensions and arrangement specifications of the target blister tray 30;

[0062] First, obtain the two-dimensional outline or three-dimensional projection data of the small-sized product to be processed and its assembly direction requirements, and input the inner cavity size, each cell size and overall arrangement specifications of the target blister tray 30 as design constraints; the above parameters serve as geometric inputs for the layout algorithm, and are also used for subsequent mold opening and blister tray 30 manufacturing dimension verification to ensure that the layout result can accurately match the final tray.

[0063] S12, Based on the product outline, use layout software to generate an initial array layout, and rotate and align the product units according to the assembly direction requirements to form a regular matrix or staggered arrangement;

[0064] Based on the obtained product outline, an initial array layout is generated in the typesetting software, and the units are rotated and aligned according to the assembly direction requirements. The array can be optimized by means of regular matrix, staggered arrangement or local rotation, etc., to optimize space occupation and assembly orientation. The initial array provides the basis for subsequent spacing adjustment and reference point annotation.

[0065] S13, mark uniform positioning reference points in the initial array layout. Positioning reference points include array corner points and center reference points;

[0066] On the initial array, a unified positioning reference point is marked for each layout unit and the entire array. The positioning reference point includes the corner reference point of the four corners of the array and the center reference point of each unit. These reference points are used as coordinate references for the mold positioning pin, the alignment of the carrier film and the positioning hole of the blister tray 30, to ensure the coordinate consistency between each process.

[0067] S14, adjust the product spacing according to the punching process requirements, set the die clearance distance and waste discharge channel, and automatically detect and correct the interference area;

[0068] The product spacing of the initial array is adjusted according to the requirements of the punching and transfer process, and the die clearance distance and waste discharge channel are set. At the same time, the automatic detection function of the layout software is used to identify interference or too close areas and perform local offset correction according to the rules to ensure the safety of the tool path, smooth waste flow and minimize interference when pressing into the pallet.

[0069] S15, output the final layout file, and simultaneously generate the carrier film window diagram and the blister tray positioning hole processing diagram corresponding to the layout.

[0070] In this embodiment, the special punching die 40 includes a positioning reference pin that matches the positioning reference point of the layout board 10, a cutting edge contour, a clearance area, and a waste discharge channel.

[0071] It should be noted that the structure of the special punching die 40 includes: a positioning reference pin and a guide sleeve that match the positioning reference point of the layout board 10; a cutting edge contour for separating the product shape; a clearance area (or buffer zone) for buffering and protecting small parts; and a channel and centralized collection structure for waste discharge.

[0072] The mold is designed to work in conjunction with the carrier film. The mold's locating pins align with the layout reference points to ensure consistent positioning accuracy for each punching operation. A clearance or buffer structure is incorporated around the cutting edge to reduce the impact risk to small parts during punching. Simultaneously, vacuum or air-blowing interfaces are located at the bottom or side of the mold to draw waste material into a waste bin via a pre-designed discharge channel, preventing material from getting stuck in the product position. The mold corresponds to the layout file and the carrier film's windowed diagram. After punching, an ejection or return mechanism smoothly removes the intermediate parts, ensuring the product array remains intact and ready for S4 to perform row transfer.

[0073] In this embodiment, step S2 specifically includes the following steps:

[0074] S21, Prepare a cleaned typesetting board and a custom adhesive carrier film. The typesetting board is pre-set with positioning reference points and array coordinate information.

[0075] Prepare a layout board with a clean surface and pre-set positioning reference points and array coordinate information, and select a customized adhesive carrier film (such as a low-residue acrylic re-peel film or a treated PE film). The selection of the layout board and carrier film materials is determined according to the subsequent punching and transfer requirements to ensure the temporary fixation and subsequent peeling performance of the product after application.

[0076] S22, the products are arranged in an array according to the layout 10, and a carrier film with zoned adjustable adhesion is used for application. The dense product areas use high adhesion areas, and the edge areas use medium and low adhesion areas.

[0077] Arrange the products in an array according to the layout 10 generated by S1, and apply them with a carrier film with a partitioned adhesive design: set a relatively high adhesive area for densely packed product areas to ensure reliable fixation, and set medium and low adhesive areas for edges or non-critical areas for subsequent peeling. During the application process, pay attention to aligning with the layout reference for subsequent calibration.

[0078] S23, Pre-treatment of the applied carrier film, including tension flattening and heat activation treatment at 40-60℃ for 2-5 minutes;

[0079] The pretreatment process for the laminated carrier film includes tension flattening and thermal activation at 40–60°C for approximately 2–5 minutes to eliminate wrinkles, stabilize the contact between the film and the substrate, and ensure that the adhesion performance meets the process requirements, thus providing a stable fixation state for subsequent punching.

[0080] S24. Using a visual calibration system, the layout reference point is compared with the actual position of the carrier film to perform position deviation compensation calibration, forming the intermediate mother plate 20 with the carrier film.

[0081] The layout reference point is compared with the actual position of the carrier film using a visual calibration system. After measuring and calculating the positional deviation, the alignment is achieved through mechanical or software compensation. After calibration, an intermediate mother plate 20 with a carrier film is formed and used as the input part for the S3 punching process.

[0082] In this embodiment, step S3 specifically includes the following steps:

[0083] S31, the output intermediate mother plate with the carrier film is placed in the special punching die 40, and the die positioning pin is aligned with the layout reference point and clamped and fixed.

[0084] The intermediate part mother plate with the carrier film is placed on a special punching die. Precise alignment is achieved by using the positioning reference pins on the die and the preset positioning reference points on the layout board. The intermediate part is then clamped and fixed to eliminate slippage and loosening. After clamping, the position of the reference points is checked to ensure that the relative position of the cutting edge and the product contour meets the design tolerance, providing a stable tooling reference for subsequent punching.

[0085] S32, start the punching equipment, control the punching speed to 20-40mm / s, and the stroke to be 1.2-1.5 times the product thickness to complete the precise separation of the product's outline;

[0086] Start the punching equipment and execute the punching process according to the set parameters: control the punching speed in the range of about 20–40 mm / s, and set the stroke to about 1.2–1.5 times the product thickness to ensure that the cutting edge completely penetrates the material and provides appropriate ejection allowance, thereby achieving precise separation of the product's outline and minimizing the damage to small parts caused by punching impact.

[0087] S33, the vacuum adsorption mechanism is activated simultaneously during the punching process, and the generated waste is collected into the waste bin through the mold waste discharge channel;

[0088] The vacuum adsorption or air blowing mechanism is activated simultaneously during punching to collect and transport the waste generated by cutting or blanking through the pre-set waste discharge channel in the mold to the waste bin, so as to avoid the waste falling into the product position and causing jamming or contamination; the vacuum assistance can also stabilize small parts for a short time when necessary to prevent them from flipping or shifting during cutting.

[0089] S34, after punching, keep the carrier film intact, and use the ejection mechanism to smoothly eject the intermediate part from the mold, maintaining the array state of the product on the carrier film.

[0090] After punching, the integrity of the carrier film is maintained. The intermediate mother plate is smoothly ejected and transferred out of the mold area through the ejection mechanism of the mold. The ejection action needs to control the stroke and speed to avoid impacting the separated but still fixed products by the carrier film, thereby maintaining the array arrangement of the products on the carrier film and ensuring that they are input as a whole to the next process for alignment and transfer.

[0091] In this embodiment, the pressure box fixture is equipped with a force sensor to monitor the pressing force during the pressing and transfer process, and to trigger an alarm or rejection when an abnormality occurs.

[0092] After aligning the fixture with the intermediate part reference and the blister tray positioning reference, the fixture presses down in sections. Sensors in each section collect the pressing force and feed the data back to the control system. If the pressing force of any section exceeds or falls below a preset threshold (e.g., jamming, missing parts, or not in place), the control system immediately stops the operation and triggers an alarm or initiates a rejection / rework process.

[0093] In this embodiment, the layout design is based on an arraying method using a regular matrix, rotational alignment, or local offset, according to the product's shape.

[0094] In practice, the product outline and the inner cavity dimensions of the target blister tray are first collected. An initial array is generated using layout software, and the units are rotated or partially offset as necessary according to the assembly direction to avoid interference between adjacent parts. Then, a unified positioning reference point is marked in the layout and possible interference areas are automatically detected. The product spacing and mold clearance position are adjusted according to the punching and transfer process requirements. Finally, a CNC layout file that is compatible with mold manufacturing, window opening of the carrier film, and mold opening of the blister tray is output.

[0095] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A processing technology for sorting small-sized products, characterized in that, Includes the following steps: S1. Product array layout design is performed using typesetting software. A layout board is generated based on the product's shape and assembly direction, and positioning reference points are marked. Specifically, this includes: S11, obtain the product outline and assembly direction requirements, and input the inner cavity dimensions and arrangement specifications of the target blister tray; S12, Based on the product outline, use layout software to generate an initial array layout, and rotate and align the product units according to the assembly direction requirements to form a regular matrix or staggered arrangement; S13, mark uniform positioning reference points in the initial array layout, the positioning reference points include array corner points and center reference points; S14, adjust the product spacing according to the punching process requirements, set the die clearance distance and waste discharge channel, and automatically detect and correct the interference area; S15, output the final layout file, and simultaneously generate the carrier film window diagram and the blister tray positioning hole processing diagram corresponding to the layout; S2, based on the layout of the layout board, arrange the products on the motherboard, and apply a customized adhesive carrier film, perform film pretreatment and visual calibration, to form an intermediate motherboard with a carrier film; specifically including: S21, Prepare a cleaned layout board and a custom adhesive carrier film, wherein the layout board is pre-set with positioning reference points and array coordinate information; S22, the products are arranged in an array according to the layout board, and a carrier film with zoned adjustable adhesion is used for application. The dense product areas use high adhesion areas, and the edge areas use medium and low adhesion areas. S23, Pre-treatment of the applied carrier film, including tension flattening and heat activation treatment at 40-60℃ for 2-5 minutes; S24. Use a visual calibration system to compare the layout reference point with the actual position of the carrier film, perform position deviation compensation calibration, and form an intermediate mother plate with a carrier film. S3, using a dedicated punching die to punch the intermediate mother plate, the dedicated punching die including a positioning reference pin matching the positioning reference point of the layout board, a cutting edge contour, a clearance area, and a waste discharge channel, completing product separation and removing waste through the positioning structure and clearance structure, and keeping the product fixed by the carrier film; specifically including: S31, the intermediate mother plate with the carrier film is placed in the special punching die, and the die positioning pin is aligned with the layout reference point and clamped and fixed. S32, start the punching equipment, control the punching speed to 20-40mm / s, and the stroke to be 1.2-1.5 times the product thickness to complete the precise separation of the product's outline; S33, the vacuum adsorption mechanism is activated simultaneously during the punching process, and the generated waste is collected into the waste bin through the mold waste discharge channel; S34, after punching, keep the carrier film intact, and use the ejection mechanism to smoothly eject the intermediate part from the mold, maintaining the array state of the product on the carrier film; S4: Align the punched intermediate part with the customized blister tray, and use the pressing fixture to press and transfer the product into the blister tray in one go. Specifically, place the customized blister tray, which corresponds one-to-one with the layout, on the lower positioning platform and fix it with alignment pins or reference grooves. After positioning, place the punched intermediate part on the upper mold or transfer platform and perform visual or mechanical alignment to ensure that the two references are aligned. After alignment, the pressing fixture presses down in sections according to the controlled stroke and controlled force, squeezing the carrier film and the product underneath into the recess of the blister tray. For extremely small or easily flipped products, a short vacuum assistance is used during the pressing process to stabilize the product posture. After the product is fully in place, the carrier film is peeled off by the built-in or subsequent peeling mechanism of the fixture.

2. The processing technology for sorting small-sized products according to claim 1, characterized in that, The process following step S4 also includes: S5 performs carrier film peeling, cleaning, sealing, and online visual inspection on the blister pack with embedded products, and outputs the finished blister pack.

3. The processing technology for sorting small-sized products according to claim 1, characterized in that, The carrier film is a low-residue acrylic re-peeling film or a surface-treated PE film, and its peel force is matched with the product weight and friction characteristics.

4. The processing technology for sorting small-sized products according to claim 1, characterized in that, The pressure box fixture is equipped with a force sensor to monitor the pressing force during the pressing and transfer process.

5. The processing technology for sorting small-sized products according to claim 1, characterized in that, The layout design is based on an arraying method using regular matrices, rotational alignment, or local offset, according to the product's shape.

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