Tin adding device for earphone production

Abstract

The invention relates to the technical field of earphone production welding, and discloses an earphone production tin adding device which comprises a workbench. The L-shaped processing seat is arranged above the workbench, and an earphone PCB is arranged on the L-shaped processing seat and used for soldering tin production of the earphone PCB; the welding gun is arranged on the L-shaped processing seat and is used for soldering tin to the earphone PCB; the lifting mechanism is arranged on the L-shaped machining base and used for lifting a welding gun to move up and down to remove soldering tin; and the tin wire is arranged at the bottom of the welding gun, is positioned on the earphone PCB and is matched with the welding gun to move downwards to weld the tin wire. Through the design of the first air cylinder and the lifting mechanism, the welding gun can automatically move up and down for welding, manual intervention is reduced, the welding efficiency is improved, the first spring in the lifting mechanism can automatically adjust the position of the welding gun according to the pressure change in the welding process, and the welding stability and adaptability are ensured; and the earphone PCB is prevented from being damaged due to rigid contact.

Description

Technical Field

[0001] This invention relates to the field of welding technology in headphone manufacturing, specifically to a tin-adding device in headphone manufacturing. Background Technology

[0002] In the headphone manufacturing process, soldering is a crucial step in ensuring the reliability and stability of the electrical connections on the headphone PCB board. The soldering equipment commonly used is manual operation with a soldering gun, which is not only inefficient but also makes it difficult to guarantee the consistency of soldering quality.

[0003] In recent years, with the development of automation and robotics technologies, some improved soldering equipment has emerged. For example, some equipment has achieved automated soldering operations by introducing automated control systems. Other equipment has improved soldering efficiency and quality by optimizing the design of the soldering gun and solder feeding mechanism. However, most of these improved devices suffer from the following problem: although they possess certain automation functions, they cannot adjust the solder wire feeding according to the thickness of the PCB board. Therefore, a solder feeding device for headphone production is proposed to solve the aforementioned problems. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a tin-adding device in the production of headphones, which addresses the shortcomings of the prior art.

[0005] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is: a tin-adding device in headphone production, comprising: Workbench; An L-shaped processing stand is positioned above the workbench, and an earphone PCB board is mounted on the L-shaped processing stand for soldering the earphone PCB board. A soldering gun, mounted on the L-shaped processing base, is used for soldering solder onto the headphone PCB board; A lifting mechanism is provided on the L-shaped processing base for lifting the welding gun to move up and down to remove solder; Solder wire is placed at the bottom of the soldering gun and on the headphone PCB board, and is soldered to the solder wire as the soldering gun moves down; An angle adjustment mechanism is located on one side of the soldering gun and is used to adjust the position of the solder wire; A solder feeding mechanism is mounted on the angle adjustment mechanism, and the solder wire is disposed within the solder feeding mechanism to feed solder. The lifting mechanism includes: Cylinder 1 is fixedly installed on the back of the L-shaped machining base; A lifting plate is disposed on the front of the L-shaped processing seat, and the welding gun is disposed on the lifting plate and moves up and down on its front side; The movable rod is fixedly connected to both sides of the lifting plate and moves through the two rectangular holes opened on the L-shaped processing base; Two sliding columns are fixedly connected in the rectangular hole, and the movable rod slides up and down with the outer wall of the sliding column. The bottom of the movable rod is connected to the output end of cylinder one to push the movable rod to move up and down. The tin feeding mechanism includes: A solder feeding tube, mounted on the angle adjustment mechanism, is used to push solder wire; The guide tube, connected to one end of the solder feeding tube, is used to guide the solder wire; A tapered mounting sleeve, threadedly connected to the outer wall of the solder feeding tube, is used to deliver solder wire; A propulsion component is disposed inside the solder feeding tube and is used to push the solder wire disposed inside the solder feeding tube to move.

[0006] Preferably, the lifting mechanism further includes: Two threaded sleeves are threadedly connected to the outer wall of the welding gun, and the welding gun is movably connected to the lifting plate; Spring 1 is sleeved on the outer wall of the welding torch and located below the lifting plate, used to push the welding torch downward.

[0007] Preferably, the propulsion component includes: A slide bar is movably connected to the inner wall of the solder feeding tube, and the inner wall of the slide bar is hollow for moving through the solder wire; A fixing sleeve is fixedly connected to the inner wall of the solder feeding tube; Spring 2 is disposed on the inner wall of the solder feeding tube and located on the outer wall of the slide bar, and is used to push the slide bar to move to one side; The wedge-shaped block is fixedly connected to the outer wall of the slide rod; A pusher block is disposed within the movable hole of the solder feeding tube and abuts against the wedge block, used to push the wedge block to move; Cylinder 2 is fixedly connected to the outer wall of the solder feeding tube, and a spherical push block is fixedly connected to the telescopic end of cylinder 2. The outer wall of the spherical push block abuts against the inclined part of the push block to push the push block to move.

[0008] Preferably, the slide rod has three grooves on one side. When the slide rod slides into the fixed sleeve, it contracts and gathers together. When the slide rod moves outward and disengages from the fixed sleeve, the grooves open up to release the clamping of the solder wire.

[0009] Preferably, the conical mounting sleeve is provided with an auxiliary component to assist the movement of the solder wire; The auxiliary components include: An anti-breakage tube is installed inside the conical mounting sleeve, with one end penetrating through the conical mounting sleeve and extending outwards; Two rotating plates are rotatably connected to the inner wall of the conical mounting sleeve, and the anti-breakage tube is fixedly connected to the axis of the rotating plates and rotates with the rotating plates; Multiple through holes are formed on the outer wall of the anti-breakage tube, and the interior of the conical mounting sleeve is filled with rosin grease. The through holes are used for the flow of rosin grease to contact the solder wire. Multiple triangular blocks are fixedly connected in a circular and equally spaced mounting slot on one side of the rotating plate; Multiple spherical contact blocks are fixedly connected to one end of the slide bar fork, and move with the slide bar to contact the outer wall of the triangular block.

[0010] Preferably, the angle adjustment mechanism includes: A fixed rod is movably connected to the inner wall of the lifting plate and is fixed by bolts; Mounting post one is sleeved on the outer wall of the fixing rod and moves up and down on the outer wall of the fixing rod, and is fixed by bolts; The connecting block is sleeved on one side of the mounting post and rotates at its sleeve location; Mounting post two is located on the other side of the connecting block, and the connecting block is provided with two adjusting bolts for fixing the connecting block; The solder delivery tube is movably connected inside the second mounting column and is fixed by bolts.

[0011] Preferably, the outer wall of the mounting post is provided with an absorption mechanism for absorbing the fumes generated during soldering; The suction mechanism includes: The exhaust pipe is fixedly connected to the outer wall of the mounting column one; An extraction tube is installed on the outer wall of the welding torch and connected to the exhaust pipe via a conduit, used to extract the fumes generated during welding. A deflection assembly is disposed between the suction tube and the mounting post 1 for deflecting the suction tube.

[0012] Preferably, the deflection component includes: The mounting base is fixedly connected to the outer wall of the mounting column one; Two connecting sleeves are rotatably connected to the mounting base via a rotating shaft, and a bearing is provided on one side of each connecting sleeve for rotating the connecting sleeve; Two L-shaped rods are respectively set on the inner wall of the connecting sleeve and slide, with the other end connected to the suction tube; A threaded groove is formed on the outer wall of one of the L-shaped rods and is threadedly connected to the connecting sleeve to adjust the retraction of the L-shaped rod; Two levers are fixedly connected to the outer wall of the welding torch and abut against the bottom of the suction tube. When the welding torch moves upward, they are used to push the suction tube upward. A torsion spring, fitted onto the pivot, is used to lower the connecting sleeve for reset.

[0013] The present invention, by adopting the above technical solution, can bring the following beneficial effects: 1. The soldering device in the production of this earphone uses a cylinder and a lifting mechanism to automatically move the soldering gun up and down for soldering, reducing manual intervention and improving soldering efficiency. The spring in the lifting mechanism can automatically adjust the position of the soldering gun according to the pressure changes during the soldering process, ensuring the stability and adaptability of the soldering and avoiding damage to the earphone PCB board due to rigid contact.

[0014] 2. The solder feeding device in the production of this earphone has a solder feeding mechanism that, through the design of cylinder two, propulsion component and slide bar, can accurately control the delivery of solder wire and ensure a stable supply of solder wire during the soldering process. The angle adjustment mechanism, through the design of fixed rod, mounting column one, mounting column two and connecting block, can dynamically adjust the angle of the solder feeding tube according to the thickness of the earphone PCB board and the soldering position, ensuring the accuracy of soldering.

[0015] 3. The soldering device in the production of this earphone, through the design of anti-breakage tube, rotating plate and rosin grease, can pre-treat the solder wire, remove oxides, reduce surface tension, prevent re-oxidation and improve the soldering quality. The rotating design of the rotating plate can ensure that the rosin grease is in uniform contact with the solder wire, further improving the soldering effect.

[0016] 4. The soldering device in the production of this earphone has an absorption mechanism that, through the design of an exhaust pipe, an absorption pipe, and a deflection component, can effectively absorb the fumes generated during the soldering process, improve the working environment, and protect the health of operators. The deflection component can dynamically adjust the angle of the absorption pipe according to the position changes during the soldering process, thereby improving the efficiency of fume absorption. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a schematic diagram of the side structure of the present invention; Figure 3 This is a partial structural diagram of the lifting mechanism of the present invention; Figure 4 This is a schematic diagram of the suction mechanism of the present invention; Figure 5 This is a schematic diagram of the tin feeding mechanism of the present invention; Figure 6 This is a schematic cross-sectional view of the tin feeding mechanism of the present invention; Figure 7 This is an exploded cross-sectional view of the present invention.

[0018] In the diagram: 1. Workbench; 2. L-shaped machining base; 3. Welding torch; 4. Lifting mechanism; 41. Cylinder 1; 42. Movable rod; 43. Lifting plate; 44. Threaded sleeve; 45. Spring 1; 46. Sliding column; 5. Solder wire; 6. Angle adjustment mechanism; 61. Mounting column 1; 62. Connecting block; 63. Fixing rod; 64. Mounting column 2; 65. 7. Solder feeding mechanism; 71. Solder feeding tube; 72. Guide tube; 73. Conical mounting sleeve; 74. Auxiliary components 741. Anti-breakage pipe; 742. Through hole; 743. Rotating plate; 744. Triangular block; 745. Spherical contact block; 75. Slide rod; 76. Fixing sleeve; 77. Spring II; 78. Wedge block; 79. Push block; 710. Cylinder II; 711. Spherical push block; 8. Suction mechanism; 81. Suction pipe; 82. L-shaped rod; 83. Connecting sleeve; 84. Threaded groove; 85. Mounting base; 86. Torsion spring; 87. Conduit; 88. Exhaust pipe. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] Please see Figures 1-7 One embodiment of the present invention is: a tin-adding device in headphone manufacturing, comprising: Workbench 1; L-shaped processing base 2 is set above workbench 1, and earphone PCB board is set on L-shaped processing base 2 for producing solder for earphone PCB board. Soldering gun 3, set on L-shaped processing base 2, is used for soldering to the headphone PCB board; The lifting mechanism 4 is set on the L-shaped processing base 2 and is used to lift the welding gun 3 to move up and down to remove solder. Solder wire 5 is placed at the bottom of soldering gun 3 and located on the headphone PCB board. Soldering is performed on solder wire 5 in conjunction with the downward movement of soldering gun 3. An angle adjustment mechanism 6 is located on one side of the soldering gun 3 and is used to adjust the position of the solder wire 5; The solder feeding mechanism 7 is mounted on the angle adjustment mechanism 6, and the solder wire 5 is placed inside the solder feeding mechanism 7 to feed solder. The lifting mechanism 4 includes: Cylinder 41 is fixedly mounted on the back of L-shaped machining base 2; The lifting plate 43 is located on the front of the L-shaped processing base 2, and the welding gun 3 is located on the lifting plate 43 and moves up and down on its front. The movable rod 42 is fixedly connected to both sides of the lifting plate 43 at both ends, and moves through the two rectangular holes opened on the L-shaped processing base 2. Two sliding columns 46 are fixedly connected in rectangular holes, and the movable rod 42 slides up and down with the outer wall of the sliding column 46. The bottom of the movable rod 42 is connected to the output end of the cylinder 41 to push the movable rod 42 to move up and down. Tin-feeding mechanism 7 includes: Solder feeding tube 71 is mounted on angle adjustment mechanism 6 and is used to push solder wire 5; The guide tube 72 is connected to one end of the solder feeding tube 71 and is used to guide the solder wire 5; A tapered mounting sleeve 73 is threaded onto the outer wall of the solder feeding tube 71 and is used to feed solder wire 5. A propulsion component, disposed within the solder feeding tube 71, is used to move the solder wire 5 disposed within the solder feeding tube 71.

[0021] The lifting mechanism 4 also includes: Two threaded sleeves 44 are threadedly connected to the outer wall of the welding gun 3, and the welding gun 3 is movably connected to the lifting plate 43; Spring 45 is sleeved on the outer wall of welding torch 3 and located below lifting plate 43, used to push welding torch 3 downward.

[0022] The propulsion components include: The slide bar 75 is movably connected to the inner wall of the solder feeding tube 71, and the inner wall of the slide bar 75 is hollow for moving through the solder wire 5; The fixing sleeve 76 is fixedly connected to the inner wall of the solder feeding tube 71; Spring 2 77 is disposed on the inner wall of the solder feeding tube 71 and located on the outer wall of the slide bar 75, and is used to push the slide bar 75 to move to one side; Wedge block 78 is fixedly connected to the outer wall of slide bar 75; Push block 79 is disposed in the movable hole of solder tube 71 and abuts against wedge block 78, and is used to push wedge block 78 to move; Cylinder 2 710 is fixedly connected to the outer wall of solder feeding tube 71, and a spherical push block 711 is fixedly connected to the telescopic end of cylinder 2 710. The outer wall of the spherical push block 711 abuts against the inclined part of push block 79 to push push block 79 to move.

[0023] The slide rod 75 has three grooves on one side. When the slide rod 75 slides into the fixed sleeve 76, it contracts and gathers. When the slide rod 75 moves outward and disengages from the fixed sleeve 76, the grooves open up to release the clamping of the solder wire 5.

[0024] The tapered mounting sleeve 73 has an auxiliary component 74 inside to assist in the movement of the solder wire 5; Auxiliary component 74 includes: The anti-breakage tube 741 is installed inside the conical mounting sleeve 73, with one end penetrating through the conical mounting sleeve 73 and extending outwards; Two rotating plates 743 are rotatably connected to the inner wall of the conical mounting sleeve 73, and the anti-breakage tube 741 is fixedly connected to the axis of the rotating plate 743 and rotates with the rotating plate 743. Multiple through holes 742 are formed on the outer wall of the anti-breakage tube 741, and the inside of the tapered mounting sleeve 73 is filled with rosin grease. The through holes 742 are used for the flow of rosin grease to contact the solder wire 5. Multiple triangular blocks 744 are fixedly connected in a circumference and equally spaced within the mounting groove on one side of the rotating plate 743; Multiple spherical abutment blocks 745 are fixedly connected to one end of the fork of the slide rod 75, and move with the slide rod 75 to abut against the outer wall of the triangular block 744.

[0025] Angle adjustment mechanism 6 includes: The fixed rod 63 is movably connected to the inner wall of the lifting plate 43 and is fixed by bolts; Mounting post 61 is fitted onto the outer wall of fixing rod 63 and moves up and down along the outer wall of fixing rod 63, and is fixed by bolts; The connecting block 62 is sleeved on one side of the mounting post 61 and rotates at its sleeve location; Mounting post 64 is located on the other side of connecting block 62, and two adjusting bolts are provided on connecting block 62 for fixing connecting block 62; The solder tube 71 is movably connected inside the mounting post 2 64 and is fixed by bolts.

[0026] The outer wall of mounting post 61 is equipped with a suction mechanism 8, which is used to absorb the fumes generated during soldering. The absorption mechanism 8 includes: The exhaust pipe 88 is fixedly connected to the outer wall of the mounting column 61. The suction pipe 81 is disposed on the outer wall of the welding torch 3 and connected to the exhaust pipe 88 through the conduit 87, and is used to absorb the fumes generated during welding. A deflection assembly is disposed between the suction tube 81 and the mounting post 61 to deflect the suction tube 81.

[0027] The deflection components include: Mounting base 85 is fixedly connected to the outer wall of mounting column 61; Two connecting sleeves 83 are rotatably connected to the mounting base 85 via a rotating shaft, and a bearing is provided on one side of the connecting sleeve 83 for rotating the connecting sleeve 83; Two L-shaped rods 82 are respectively set to slide on the inner wall of the connecting sleeve 83, and the other end is connected to the suction tube 81; A threaded groove 84 is formed on the outer wall of one of the L-shaped rods 82 and is threadedly connected to the connecting sleeve 83 for adjusting the retraction of the L-shaped rod 82; Two levers are fixedly connected to the outer wall of the welding torch 3 and abut against the bottom of the suction tube 81. When the welding torch 3 moves upward, they are used to push the suction tube 81 upward. Torsion spring 86 is sleeved on the pivot and used to reset the connecting sleeve 83 downwards.

[0028] Working principle: When soldering the headphone PCB board, the headphone PCB board to be soldered is placed on the L-shaped processing base 2 and fixed. Then, by rotating the bolts on the angle adjustment mechanism 6, the bolts on the lifting plate 43 can be adjusted to adjust the height of the fixing rod 63. Adjusting the bolts on the first mounting post 61 can adjust the height of the first mounting post 61 on the fixing rod 63. Adjusting the bolts on the second mounting post 64 can adjust the distance between the solder feeding tube 71 and the soldering gun 3. Adjusting the two bolts on the connecting block 62 can finally adjust the angle of the solder feeding tube 71 relative to the soldering gun 3 when feeding solder, so as to adapt to the soldering gun 3 to solder headphone PCB boards of different thicknesses. At this time, the cylinder 41 is started directly by the control device, which will push the movable rod 42 to move up and down on the slide column 46. When the movable rod 42 moves down, it will simultaneously drive the lifting plate 43 to move down, thereby pushing the welding gun 3 to move down and contact the welding wire 5, so that the welding wire 5 is welded to the welding part through the welding gun 3. At the same time, during the continuous descent of the lifting plate 43, it will squeeze the spring 45. At this time, the spring 45 is compressed, and the welding gun 3 slides upward on the lifting plate 43, thereby improving the welding adaptability during welding and avoiding the situation where the welding gun 3 rigidly contacts the headphone PCB board, thereby damaging the headphone PCB board. Simultaneously, during synchronous welding, cylinder 2 710 is activated, which pushes the spherical pusher 711 to move, thereby pushing the pusher 79 to slide. When the pusher 79 slides into the solder tube 71, it will abut against the wedge block 78 and move. This will push the slide rod 75 to move through the wedge block 78. When the slide rod 75 moves, its retracted state on one side will push the solder wire 5 on its inner wall outward until the slide rod 75 disengages from the inner wall of the fixing sleeve 76. Under the external power pushing the solder wire 5, the solder wire 5 will move into the anti-breakage tube 741 and be delivered to the bottom of the welding gun 3 for automatic soldering. When cylinder 2 710 returns to its original position, the spherical pusher 711 resets. Under the action of spring 2 77, the slide rod 75 and the wedge block 78 are reset, and the pusher 79 is also reset. Furthermore, when the slide bar 75 moves, it drives the spherical contact block 745 to move and contact the triangular block 744. At this time, the contact with the triangular block 744 will cause it to deflect, thereby driving the rotating plate 743 to rotate. When the solder wire 5 is delivered into the anti-breakage tube 741, it will contact the rosin grease inside the rotating plate 74 through the through hole 742, thereby removing oxides from the solder wire 5, reducing its surface tension, preventing re-oxidation, and providing fluxing effect, thus improving work efficiency. At the same time, when the rotating plate 743 rotates, it will drive the anti-breakage tube 741 to rotate, thereby promoting the uniform contact of the rosin grease with the solder wire 5 and improving its auxiliary effect. During welding, the external negative pressure suction device is activated simultaneously, and suction is performed through the exhaust pipe 88, conduit 87 and suction pipe 81 to improve the working environment. At the same time, when the welding torch 3 is pressed upward, the suction pipe 81 is moved upward by two levers on its outer wall, and deflected around its rotation point by the L-shaped rod 82 and connecting sleeve 83, thereby changing the suction range and improving the suction effect.

[0029] This invention provides a tin-adding device for earphone production. Many methods and approaches exist for implementing this technical solution; the above description is merely a preferred embodiment. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of this invention, and these improvements and modifications should also be considered within the scope of protection of this invention. All components not explicitly stated in this embodiment can be implemented using existing technology.

Claims

1. A tin-adding device for earphone manufacturing, characterized in that, include: Workbench (1); L-shaped processing seat (2) is set above the workbench (1), and the L-shaped processing seat (2) is provided with an earphone PCB board for producing solder for the earphone PCB board; A soldering gun (3) is set on the L-shaped processing seat (2) and is used to solder to the headphone PCB board; The lifting mechanism (4) is set on the L-shaped processing seat (2) and is used to lift the welding gun (3) to move up and down to remove solder. Solder wire (5) is placed at the bottom of the soldering gun (3) and located on the headphone PCB board. The soldering gun (3) moves down to solder the solder wire (5). An angle adjustment mechanism (6) is provided on one side of the soldering gun (3) for adjusting the position of the solder wire (5); A solder feeding mechanism (7) is provided on the angle adjustment mechanism (6), and the solder wire (5) is provided in the solder feeding mechanism (7) to feed solder; The lifting mechanism (4) includes: Cylinder 1 (41) is fixedly installed on the back of the L-shaped machining base (2); The lifting plate (43) is located on the front of the L-shaped processing seat (2), and the welding gun (3) is located on the lifting plate (43) and moves up and down on its front side; The movable rod (42) is fixedly connected to both sides of the lifting plate (43) and moves through the two rectangular holes opened on the L-shaped processing base (2); Two sliding columns (46) are fixedly connected in the rectangular hole respectively, and the movable rod (42) slides up and down with the outer wall of the sliding column (46), and the bottom of the movable rod (42) is connected to the output end of the cylinder (41) to push the movable rod (42) to move up and down; The tin feeding mechanism (7) includes: A solder feeding tube (71) is mounted on the angle adjustment mechanism (6) and is used to push solder wire (5). The guide tube (72) is connected to one end of the solder feeding tube (71) and is used to guide the solder wire (5). A tapered mounting sleeve (73) is threaded onto the outer wall of the solder feeding tube (71) for conveying solder wire (5); A propulsion component is disposed inside the solder feeding tube (71) for pushing the solder wire (5) disposed inside the solder feeding tube (71) to move.

2. The tin-adding device in headphone production according to claim 1, characterized in that: The lifting mechanism (4) also includes: Two threaded sleeves (44) are threadedly connected to the outer wall of the welding gun (3), and the welding gun (3) is movably connected to the lifting plate (43); Spring 1 (45) is sleeved on the outer wall of the welding gun (3) and located below the lifting plate (43) to push the welding gun (3) down.

3. The tin-adding device in headphone production according to claim 2, characterized in that: The propulsion component includes: A slide bar (75) is movably connected to the inner wall of the solder feeding tube (71), and the inner wall of the slide bar (75) is hollow for moving through the solder wire (5); A fixing sleeve (76) is fixedly connected to the inner wall of the solder feeding tube (71); Spring 2 (77) is disposed on the inner wall of the solder tube (71) and located on the outer wall of the slide bar (75), and is used to push the slide bar (75) to move to one side; A wedge block (78) is fixedly connected to the outer wall of the slide bar (75); Push block (79) is disposed in the movable hole of the solder tube (71) and abuts against the wedge block (78) to push the wedge block (78) to move; Cylinder 2 (710) is fixedly connected to the outer wall of the solder feeding tube (71), and a spherical push block (711) is fixedly connected to the telescopic end of cylinder 2 (710), and the outer wall of the spherical push block (711) abuts against the inclined part of the push block (79) to push the push block (79) to move.

4. A tin-adding device for earphone production according to claim 3, characterized in that: The slide rod (75) has three grooves on one side. When the slide rod (75) slides into the fixed sleeve (76), it contracts and gathers. When the slide rod (75) moves outward and disengages from the fixed sleeve (76), the grooves open up to release the clamping of the solder wire (5).

5. A tin-adding device for earphone production according to claim 4, characterized in that: The tapered mounting sleeve (73) is provided with an auxiliary component (74) to assist the movement of the solder wire (5); The auxiliary component (74) includes: The anti-breakage tube (741) is installed inside the conical mounting sleeve (73), with one end penetrating through the conical mounting sleeve (73) and extending outward; Two rotating plates (743) are rotatably connected to the inner wall of the conical mounting sleeve (73), and the anti-breakage tube (741) is fixedly connected to the axis of the rotating plate (743) and rotates with the rotating plate (743); Multiple through holes (742) are formed on the outer wall of the anti-breakage tube (741), and the interior of the conical mounting sleeve (73) is filled with rosin grease. The through holes (742) are used for the flow of rosin grease to contact the solder wire (5). Multiple triangular blocks (744) are fixedly connected in a circumference and equally spaced within an installation groove on one side of the rotating plate (743); Multiple spherical contact blocks (745) are fixedly connected to one end of the fork of the slide bar (75) and move with the slide bar (75) to abut against the outer wall of the triangular block (744).

6. A tin-adding device for earphone production according to claim 5, characterized in that: The angle adjustment mechanism (6) includes: A fixed rod (63) is movably connected to the inner wall of the lifting plate (43) and fixed by bolts; Mounting post 1 (61) is sleeved on the outer wall of the fixing rod (63) and moves up and down on the outer wall of the fixing rod (63), and is fixed by bolts; The connecting block (62) is sleeved on one side of the mounting post (61) and rotates at its sleeve location; Mounting post 2 (64) is set on the other side of the connecting block (62), and the connecting block (62) is provided with two adjusting bolts for fixing the connecting block (62). The solder delivery tube (71) is movably connected inside the mounting post two (64) and fixed by bolts.

7. A tin-adding device for earphone production according to claim 6, characterized in that: The outer wall of the mounting post (61) is provided with an absorption mechanism (8) for absorbing the fumes generated during soldering; The suction mechanism (8) includes: The exhaust pipe (88) is fixedly connected to the outer wall of the mounting post (61); An extraction tube (81) is disposed on the outer wall of the welding torch (3) and connected to the exhaust pipe (88) via a conduit (87) for extracting the fumes generated during welding. A deflection assembly is disposed between the suction tube (81) and the mounting post (61) for deflecting the suction tube (81).

8. A tin-adding device for earphone production according to claim 7, characterized in that: The deflection component includes: Mounting base (85) is fixedly connected to the outer wall of mounting column one (61); Two connecting sleeves (83) are rotatably connected to the mounting base (85) via a rotating shaft, and a bearing is provided on one side of the connecting sleeve (83) for rotating the connecting sleeve (83). Two L-shaped rods (82) are respectively set to slide on the inner wall of the connecting sleeve (83), and the other end is connected to the suction tube (81); A threaded groove (84) is formed on the outer wall of one of the L-shaped rods (82) and is threadedly connected to the connecting sleeve (83) for adjusting the retraction of the L-shaped rod (82); Two levers are fixedly connected to the outer wall of the welding torch (3) and abut against the bottom of the suction tube (81). When the welding torch (3) moves upward, they are used to push the suction tube (81) upward. A torsion spring (86) is sleeved on the pivot and used to reset the connecting sleeve (83) downward.

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