Warping measurement method, device and equipment of power module product and medium

Abstract

The invention discloses a warping measurement method and device for a power module product, equipment and a medium. The method comprises the steps of obtaining a to-be-tested power module, and placing the to-be-tested power module on a warping measurement seat; when the to-be-tested power module is in a natural placement state without applying an installation fastening force, measuring natural state warping data of a heat dissipation bottom plate of the to-be-tested power module through a displacement sensor; the method comprises the following steps of: applying pressure for simulating mounting fastening force to a heat dissipation bottom plate of a power module to be tested through a pressure applying device, and controlling the pressure applying device to keep the pressure constant when the applied pressure reaches a preset simulated fastening force value; measuring warping data of a heat dissipation bottom plate of the power module to be tested in a fastening state through a displacement sensor in a state that the pressure is kept constant; and the pressure applying device is controlled to remove the applied pressure, and the to-be-tested power module is moved out of the warping measuring seat. According to the invention, the warping state of the power module under the action of the installation fastening force can be accurately measured.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and specifically to a method, apparatus, device, and medium for measuring the warpage of power module products. Background Technology

[0002] Power modules, as core components of power electronic systems, are widely used in new energy vehicles, industrial frequency converters, and renewable energy fields. To meet the demands of high power density and efficient heat dissipation, power modules typically employ an integrated heat dissipation solution combining a heat sink base plate and an external cooling water tank. Specifically, the heat sink base plate is mechanically fixed to the cooling water tank with screws, and a sealing ring is installed between the two to act as a buffer and sealing medium at the interface of the heat sink base plate, preventing coolant leakage as it flows through the water tank.

[0003] However, as power ratings increase, the physical dimensions of power modules also gradually increase. Simultaneously, the power module package is typically constructed from various materials with different coefficients of thermal expansion. During the manufacturing process, multiple high-temperature processes are required. These heating and cooling processes cause uncoordinated expansion and contraction of the materials, resulting in significant warping deformation of the heat sink base plate. This warping deformation can have serious consequences during actual installation. When the module is secured to the cooling water tank with screws, if the warping of its base plate is excessive, even after tightening the screws, gaps in localized areas may still exceed the effective compensation range of the sealing ring. This can lead to coolant leakage from the leaking gaps. Therefore, it is crucial to promptly and accurately assess the actual fit of the power module after installation and fixation to the cooling water tank before it leaves the factory. Currently, the industry typically uses offline flatness measurement equipment to scan the surface of the power module's heat sink base plate before installation to measure its flatness in its natural state or the height difference at specified points. However, this method measures the warping of the power module in an unconstrained state and cannot reflect its true deformation state under the constraint of screw tightening force. Secondly, this offline measurement method is inefficient, requires manual handling and positioning, which increases the production cycle and labor costs, and can easily cause physical damage to precision modules during handling.

[0004] Therefore, how to accurately measure the warping state of the power module under the action of installation fastening force is a technical problem that urgently needs to be solved. Summary of the Invention

[0005] This invention provides a method, apparatus, device, and medium for measuring the warpage of power module products, in order to solve the technical problem of how to accurately measure the warpage state of power modules under the action of installation fastening force.

[0006] To address the aforementioned technical problems, in a first aspect, the present invention provides a method for measuring the warpage of a power module product, comprising: Obtain the power module to be tested and place it on the warp measurement stand; With the power module under test in its natural placement state without any installation fastening force, the warpage data of its heat sink base is measured by a displacement sensor. The pressure is applied to the heat sink plate of the power module under test by a pressure application device to simulate the installation and fastening force, and when the applied pressure reaches the preset simulated fastening force value, the pressure application device is controlled to keep the pressure constant. With the pressure kept constant, the warpage data of the heat sink base plate of the power module under test in the tightened state is measured by the displacement sensor. Control the pressure application device to release the applied pressure and remove the power module to be tested from the warp measurement seat.

[0007] Optionally, the step of measuring the natural warpage data of the heat sink base plate using a displacement sensor when the power module under test is in a natural placement state without applied mounting fastening force includes: The power module is positioned on the warp measurement seat, and multiple displacement sensors are arranged along the preset sealing ring installation path on the heat dissipation base plate; The first height value of the heat dissipation base plate relative to the measurement reference on the warpage measuring seat is simultaneously measured by multiple displacement sensors at the corresponding measurement points. Based on the first height value, the warping distribution of the heat dissipation base plate in its natural state is determined as the natural warping data of the heat dissipation base plate.

[0008] Optionally, the step of applying simulated mounting force to the heat sink of the power module under test via a pressure application device, and controlling the pressure application device to maintain a constant pressure when the applied pressure reaches a preset simulated mounting force value, includes: The pressure heads of the pressure application device are moved to the positions of the corresponding mounting screw holes on the heat dissipation base plate; An elastic buffer is provided at the end of each pressure head of the pressure application device, and the elastic buffer makes each pressure head of the pressure application device make flexible contact with the heat dissipation base plate. The pressure applied by each pressure head of the pressure application device is used to apply simulated installation and fastening force to the heat dissipation base plate until the applied pressure reaches the preset simulated fastening force value.

[0009] Optionally, the step of applying simulated mounting force to the heat dissipation base plate of the power module under test via a pressure application device, and controlling the pressure application device to maintain a constant pressure when the applied pressure reaches a preset simulated mounting force value, further includes: The pressure value output by the pressure application device is monitored in real time by a pressure sensor, and the monitored pressure value is fed back to the pressure source controller. The monitored pressure value is compared with the preset simulated tightening force value, and the pressure value output by the pressure application device is dynamically adjusted according to the comparison result. When the monitored pressure value reaches the preset simulated tightening force value, the pressure source controller controls the pressure application device to stop pressurizing and maintain a constant pressure.

[0010] Optionally, measuring the warpage data of the heat sink base plate of the power module under test in a tightened state using the displacement sensor while maintaining constant pressure includes: While the pressure applied to the heat dissipation base plate by the pressure application device is maintained at a preset simulated fastening force value, multiple displacement sensors are arranged along the preset sealing ring installation path on the heat dissipation base plate, and the second height value of the heat dissipation base plate relative to the measurement reference on the warping measuring seat is measured synchronously by the multiple displacement sensors. Based on the second height value, the warping distribution of the heat dissipation base plate after deformation under simulated installation fastening force is determined, and used as the warping data of the heat dissipation base plate in the fastened state.

[0011] Optionally, controlling the pressure application device to release the applied pressure and remove the power module to be tested from the warp measurement holder includes: The pressure source controller sends a pressure relief command to the pressure application device, controlling each pressure head of the pressure application device to release pressure synchronously, so that the pressure applied to the heat dissipation base plate is gradually reduced to zero. After the pressure application device is depressurized and each pressure head is reset, the power module is removed from the warp measurement seat.

[0012] Optionally, the method of acquiring the power module to be tested and placing the power module to be tested before placing it on the warp measurement stand further includes: Obtain a calibration plate with a zero-warpage reference plane, place the calibration plate on the warpage measuring seat, and ensure that the reference plane covers the measurement area of ​​the heat dissipation base plate; The original height of the calibration plate relative to the reference plane at each corresponding measurement point is simultaneously measured using the multiple displacement sensors. Based on the original height values ​​of each corresponding measurement point relative to the reference plane, the calibration compensation value for correcting the displacement sensor error is calculated.

[0013] Secondly, the present invention provides a warpage measurement device for a power module product, comprising an acquisition module, a first measurement module, a force application module, a second measurement module, and a removal module: The acquisition module is used to acquire the power module to be tested and place the power module to be tested on the warp measurement seat; The first measurement module is used to measure the natural warpage data of the heat sink base plate of the power module under test in its natural placement state without the application of installation fastening force, using a displacement sensor. Force acquisition is used to apply pressure to the heat sink base plate of the power module under test through a pressure application device to simulate the installation fastening force, and to control the pressure application device to keep the pressure constant when the applied pressure reaches the preset simulated fastening force value. The second measurement module is used to measure the warpage data of the heat sink base plate of the power module under test in a tightened state by means of the displacement sensor under constant pressure. The removal module is used to control the pressure application device to remove the applied pressure and remove the power module to be tested from the warp measurement seat.

[0014] Thirdly, the present invention provides a warpage measurement device for a power module product, comprising a memory and a processor, wherein: The memory is used to store computer programs; The processor is used to read the program in the memory and execute the steps of a warpage measurement method for a power module product as provided in the first aspect above.

[0015] Fourthly, the present invention provides a computer-readable storage medium having a readable computer program stored thereon, which, when executed by a processor, implements the steps of a warpage measurement method for a power module product as provided in the first aspect above.

[0016] Compared with the prior art, the warpage measurement method, apparatus, equipment and medium of the power module product provided by the present invention have the following beneficial effects: This invention applies simulated mounting and tightening force to the heat sink base plate of a power module under test using a pressure application device. When the applied pressure reaches a preset simulated tightening force value, the pressure application device is controlled to maintain a constant pressure. A displacement sensor measures the warpage data of the heat sink base plate of the power module under test under the tightened state. By simulating the tightening force under actual installation conditions, this invention can effectively evaluate the warpage performance of a power module under actual installation conditions and accurately measure the warpage state of the power module under the action of mounting and tightening force. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention, and not all embodiments. For those skilled in the art, other drawings obtained from these drawings without creative effort are all within the scope of protection of this application.

[0018] Figure 1 A flowchart illustrating a warpage measurement method for a power module product provided in an embodiment of the present invention.

[0019] Figure 2 This is a structural example diagram of a power module provided in an embodiment of the present invention.

[0020] Figure 3 This is a structural example diagram of a pressure application device provided in an embodiment of the present invention.

[0021] Figure 4 This is a structural example diagram of each test point of a power module provided in an embodiment of the present invention.

[0022] Figure 5 This is a structural example diagram illustrating the application of simulated installation and fastening force to a heat dissipation base plate, provided as an embodiment of the present invention.

[0023] Figure 6 This is a structural example diagram of a calibration plate provided in an embodiment of the present invention.

[0024] Figure 7 This invention provides a warpage measurement device for a power module product.

[0025] Figure 8 This is a schematic diagram of the structure of a warp measurement device for a power module product provided in an embodiment of the present invention.

[0026] Figure 9 This is a schematic diagram of the structure of a computer-readable storage medium provided in an embodiment of the present invention.

[0027] Among them, 100 is the power module, 10 is the pin assembly, 101 is the test point, 11 is the signal pin, 20 is the circuit assembly, 21 is the circuit board, 22 is the chip, 23 is the lead wire, 30 is the protective shell, 40 is the heat dissipation assembly, 41 is the heat dissipation base plate, 42 is the cooling water tank, 43 is the water inlet, 44 is the water outlet, 50 is the welding surface, 61 is the adjustable pressure source, 62 is the pressure source sensor, 63 is the elastic buffer, 64 is the pressure head, 65 is the mounting screw hole, 66 is the calibration plate, and 67 is the displacement sensor. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0029] To make the description of this disclosure more detailed and complete, illustrative descriptions of embodiments and specific examples of the present invention are provided below; however, these are not the only forms of implementing or utilizing the specific embodiments of the present invention. The embodiments cover features of multiple specific embodiments and the methods, steps, and their order for constructing and operating these specific embodiments. However, other specific embodiments may also be used to achieve the same or equivalent functions and step sequences. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application.

[0030] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in sequences other than those illustrated or described herein.

[0031] In the description of the embodiments of the present invention, unless otherwise stated, " / " means "or". For example, A / B can mean A or B. The word "and / or" in the text is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist simultaneously, and B exists alone. In addition, in the description of the embodiments of this application, "multiple" means two or more. Other quantifiers should be understood similarly. The preferred embodiments described herein are only used to illustrate and explain the present invention and are not intended to limit the present invention. Furthermore, the embodiments and features in the embodiments of this application can be combined with each other without conflict.

[0032] Example 1 like Figure 1 The flowchart described above illustrates a warpage measurement method for a power module product provided in an embodiment of the present invention, which includes the following steps.

[0033] S10: Obtain the power module to be tested and place it on the warp measurement stand. Specifically, in this embodiment of the invention, as follows... Figure 2The diagram provided is an example of the structure of a power module according to an embodiment of the present invention. The power module 100 includes: a pin assembly 10, comprising signal pins 11 and power pins (not shown in the diagram); a circuit assembly 20, comprising a circuit board 21, a chip 22, and leads 23; a protective shell 30; and a heat dissipation assembly 40, comprising a finned metal heat dissipation base plate 41, a cooling water tank 42, a water inlet 43, and a water outlet 44. The heat dissipation base plate 41 is a finned metal heat dissipation base plate 41. The front side of the finned metal heat dissipation base plate 41 is a welding surface 50, which is interconnected with the circuit assembly 20. The back side of the finned metal heat dissipation base plate 41 is a finned surface, which is fixedly installed with the cooling water tank 42 to form a heat dissipation path, thereby timely removing the heat generated by the circuit assembly 20 during operation through the heat dissipation assembly 40.

[0034] S20: When the power module under test is in its natural placement state without any applied installation fastening force, the warpage data of its heat sink base is measured using a displacement sensor. Specifically, in this embodiment of the invention, measuring the warpage data of the heat sink base in its natural placement state allows us to obtain the true state of the power module when it is not affected by external forces. This data is an important benchmark for evaluating the performance of the power module. Obtaining the warpage data in its natural state provides necessary reference for subsequent comparative analysis.

[0035] S30: Apply simulated mounting and fastening force to the heat sink base plate of the power module under test using a pressure application device, and control the pressure application device to maintain a constant pressure when the applied pressure reaches a preset simulated fastening force value. Specifically, in this embodiment of the invention, such as... Figure 3 The diagram provided is an example of a pressure application device structure according to an embodiment of the present invention. The pressure application device includes an adjustable pressure source 61, a pressure source sensor 62, an elastic buffer 63, and a pressure head 64. By simulating the tightening force under actual installation conditions, it can effectively evaluate the warpage performance of the power module in its operating state. Maintaining a constant pressure ensures the consistency of test conditions, thereby improving the repeatability of measurement results. Furthermore, this simulated test can reflect warpage phenomena that may occur under actual use, providing an important basis for optimizing product design and improving product reliability.

[0036] S40: Under constant pressure, the warpage data of the heat sink base plate of the power module under test is measured using the displacement sensor in a tightened state. Specifically, in this embodiment of the invention, measuring the warpage data under applied pressure can directly reflect the deformation characteristics of the power module in a tightened state. The displacement sensor can be a contact displacement sensor, such as a laser displacement sensor or a vision measurement sensor, to obtain the position information of the heat sink base plate surface with high precision.

[0037] S50: Control the pressure application device to release the applied pressure and remove the power module to be tested from the warp measurement seat. Specifically, in this embodiment of the invention, the integrity and safety of the testing process are ensured by safely releasing the applied pressure. Simultaneously, the state after pressure release also helps to observe and record possible recovery, ensuring the standardization of the testing procedure.

[0038] As an optional implementation, in step S20, the step of measuring the natural warpage data of the heat sink base plate using a displacement sensor when the power module under test is in a natural placement state without applied mounting fastening force includes: S21: Position the power module on the warp measurement seat, and arrange multiple displacement sensors along the preset sealing ring mounting path on the heat dissipation base plate. Specifically, in this embodiment of the invention, as follows... Figure 4 The diagram provided is a structural example of various test points of a power module according to an embodiment of the present invention. The power module is positioned on a warp measurement base, and the mechanical dimensions of the warp measurement base should ensure that the power module has sufficient space for extension and movement within it. The arrangement of multiple displacement sensors can cover different measurement points 101 of the heat sink base of the power module. This distributed measurement method makes data acquisition more comprehensive and detailed. By arranging sensors along the installation path of the sealing ring, key areas that may affect the sealing performance can be focused on, thereby better evaluating the overall condition of the heat sink base. The warp measurement base should maintain sufficient rigidity and stability and can be made of materials such as steel or stone.

[0039] S22: The first height value of the heat dissipation base plate relative to the measurement reference on the warp measurement seat at the corresponding measurement point is simultaneously measured using multiple displacement sensors. Specifically, in this embodiment of the invention, the height values ​​of multiple measurement points are measured simultaneously, making the acquisition of warp data more efficient and reliable. By simultaneously measuring the height at different locations, the time delay and environmental interference during the measurement process can be effectively reduced, ensuring the consistency and accuracy of the data.

[0040] S23: Based on the first height value, determine the warping distribution of the heat dissipation base plate in its natural state, and use it as the natural state warping data of the heat dissipation base plate. Specifically, in this embodiment of the invention, based on the first height value of the measurement point relative to the measurement reference on the warping measurement seat, the warping distribution diagram of the heat dissipation base plate is analyzed to obtain the natural state warping data of the heat dissipation base plate.

[0041] As an optional implementation, in step S30, applying simulated mounting force pressure to the heat dissipation base plate of the power module under test via a pressure application device, and controlling the pressure application device to maintain a constant pressure when the applied pressure reaches a preset simulated mounting force value, includes: S31: Move the multiple pressure heads of the pressure application device to the positions of the corresponding mounting screw holes on the heat dissipation base plate. Specifically, in this embodiment of the invention, as follows: Figure 5 The diagram provided in this embodiment of the invention illustrates a structure for applying simulated installation and fastening force to a heat sink base plate. This requires precisely aligning the pressure head of the pressure application device with the mounting screw holes 65 on the heat sink base plate 41 to achieve uniform and effective pressure application. By applying pressure at multiple points, the actual fastening process during installation can be simulated, avoiding localized deformation caused by concentrated pressure.

[0042] S32: An elastic buffer is provided at the end of each pressure head of the pressure application device, and the elastic buffer enables each pressure head of the pressure application device to form a flexible contact with the heat dissipation base plate. Specifically, in the embodiments of the present invention, such as... Figure 3 As described above, by setting an elastic buffer 63 at the end of the pressure head, flexible contact with the heat dissipation base plate can be achieved. This effectively absorbs the impact and vibration that may occur during the application process, avoiding damage or unnecessary deformation to the heat dissipation base plate. The adjustable pressure source 61 in the pressure application device can be... Figure 3 The shared pressure source shown can also be Figure 5 Each pressure head shown is equipped with a pressure source. The output mode of the adjustable pressure source can be motor servo, hydraulic and pneumatic, or other pressure sources.

[0043] S33: The pressure heads of the pressure application device apply simulated installation and fastening force to the heat dissipation base plate until the applied pressure reaches a preset simulated fastening force value. Specifically, in this embodiment of the invention, by gradually applying pressure, the applied simulated installation and fastening force can be precisely controlled, thereby effectively simulating the fastening state under actual working conditions. Maintaining a constant pressure after reaching the preset simulated fastening force value allows the heat dissipation base plate to be measured under stable conditions, reducing data errors caused by pressure fluctuations.

[0044] As an optional implementation, in step S30, the step of applying simulated mounting force pressure to the heat dissipation base plate of the power module under test through the pressure application device, and controlling the pressure application device to maintain constant pressure when the applied pressure reaches a preset simulated mounting force value, further includes: S34: The pressure value output by the pressure application device is monitored in real time by a pressure sensor, and the monitored pressure value is fed back to the pressure source controller. Specifically, in this embodiment of the invention, real-time monitoring of the pressure value ensures that the applied pressure is always under control, avoiding measurement errors caused by pressure fluctuations. By feeding the monitoring data back to the pressure source controller, pressure changes can be continuously monitored, ensuring high stability and accuracy throughout the entire testing process.

[0045] S35: The monitored pressure value is compared with a preset simulated tightening force value, and the pressure value output by the pressure application device is dynamically adjusted based on the comparison result. Specifically, in this embodiment of the invention, dynamic adjustment of the applied pressure can be achieved by comparing the real-time monitored pressure value with a preset value. This dynamic control not only improves the accuracy of the measurement but also effectively reduces deviations caused by pressure instability, ensuring the reliability of the test results.

[0046] S36: When the monitored pressure value reaches the preset simulated tightening force value, the pressure source controller controls the pressure application device to stop pressurizing and maintain a constant pressure. Specifically, in this embodiment of the invention, stopping pressurization in time when the monitored pressure value reaches the preset simulated tightening force value can effectively prevent damage or deformation of the heat sink base plate caused by excessive pressure. This ensures the safety and reliability of the testing process, allowing the heat sink base plate to be subjected to reasonable pressure under actual working conditions, thereby obtaining accurate warpage data. Simultaneously, maintaining a constant pressure helps in data acquisition under stable conditions, enhancing the effectiveness and repeatability of the measurement, and providing a good foundation for subsequent data analysis. Different output pressures can be set through the pressure source controller to adapt to different base plate mounting screw tightening forces. Figure 5 As shown, each pressure head is equipped with a pressure sensor connected to the pressure source controller to read the applied single-point pressure in real time. Alternatively, it could be... Figure 3 As shown, all pressure heads share a single pressure sensor to read the total pressure value in real time. Specific settings can be configured according to actual needs; this embodiment of the invention does not impose further limitations.

[0047] As an optional implementation method, such as Figure 5 As shown, in step S40, measuring the warpage data of the heat sink base plate of the power module under test in a tightened state using the displacement sensor while maintaining constant pressure includes: S41: With the pressure applied to the heat dissipation base plate maintained at a preset simulated fastening force value by the pressure application device, multiple displacement sensors are arranged along the preset sealing ring installation path on the heat dissipation base plate. The second height value of the heat dissipation base plate relative to the measurement reference on the warp measuring seat is simultaneously measured at the corresponding measurement point using these multiple displacement sensors. Specifically, in this embodiment of the invention, multiple displacement sensors 67 are configured along the sealing ring installation path, enabling simultaneous measurement of multiple positions on the heat dissipation base plate. This distributed measurement method can comprehensively reflect the actual warp of the heat dissipation base plate under fastening conditions. Simultaneous data acquisition by multiple displacement sensors effectively reduces errors caused by measurement time delays, ensuring data consistency.

[0048] S42: Based on the second height value, determine the warpage distribution of the heat dissipation base plate after deformation under simulated installation fastening force, as the warpage data of the heat dissipation base plate in the fastened state. Specifically, in this embodiment of the invention, based on the second height value, the warpage distribution of the heat dissipation base plate after deformation under simulated installation fastening force is analyzed. Through in-depth analysis of the warpage data, heat dissipation design can be improved, sealing performance can be enhanced, and product lifespan can be extended, further enhancing the reliability and stability of the power module.

[0049] As an optional implementation, in step S50, controlling the pressure application device to release the applied pressure and remove the power module to be tested from the warp measurement seat includes: S51: The pressure source controller sends a pressure relief command to the pressure application device, controlling each pressure head of the pressure application device to simultaneously release pressure, gradually reducing the pressure applied to the heat dissipation base plate to zero. Specifically, in this embodiment of the invention, by issuing a pressure relief command, precise control of the applied pressure can be achieved, ensuring the smoothness and safety of the pressure relief process. Synchronous pressure relief allows each pressure head to release pressure simultaneously, avoiding damage or deformation of the heat dissipation base plate caused by sudden changes in local pressure.

[0050] S52: After the pressure application device is depressurized and each pressure head is reset, the power module is removed from the warp measurement seat. Specifically, in this embodiment of the invention, ensuring that each pressure head is reset before removing the power module effectively avoids unexpected impacts on the heat sink base plate during the depressurization process, reducing the risk of accidental damage when removing the power module. Simultaneously, the reset pressure heads do not interfere with the position of the heat sink base plate, ensuring the accuracy and repeatability of the warp data obtained during the measurement process. Furthermore, a smooth and safe removal process prepares the system for the start of the next test cycle, improving testing efficiency and reducing wear and tear on the equipment and samples.

[0051] As an optional implementation method, such as Figure 6 The above is a structural example diagram of a calibration plate provided in an embodiment of the present invention. In step S10, the power module to be tested is obtained and placed before the warp measurement seat. The method further includes: S01: Obtain a calibration plate with a zero-warpage reference plane, place the calibration plate on the warpage measurement seat, and ensure that the reference plane covers the measurement area of ​​the heat dissipation base plate. Specifically, in this embodiment of the invention, a calibration plate 66 with a zero-warpage reference plane can be obtained first. The process of introducing the calibration plate provides a standardized reference for the entire warpage measurement process. This zero-warpage reference plane ensures the accuracy of subsequent measurements because it eliminates errors caused by changes in the measuring equipment itself or the environment. In addition, ensuring that the calibration plate covers the measurement area also provides a clear reference mark for data acquisition, making subsequent analysis and comparison simpler and more intuitive.

[0052] S02: The original height of the calibration plate relative to the reference plane at each corresponding measurement point is simultaneously measured using the multiple displacement sensors. Specifically, in this embodiment of the invention, by accurately measuring the height of the calibration plate, necessary data support can be provided for subsequent error correction, ensuring that every step of the measurement process is based on reliability.

[0053] S03: Based on the original height values ​​of each corresponding measurement point relative to the reference plane, calculate the calibration compensation value to correct the displacement sensor error. Specifically, in this embodiment of the invention, calculating the calibration compensation value enables the measurement process to perform self-calibration, thereby effectively eliminating the sensor's own error and ensuring that the final warping data reflects the true situation.

[0054] In this invention, a pressure application device applies simulated installation and fastening force to the heat sink base plate of the power module under test. When the applied pressure reaches a preset simulated fastening force value, the pressure application device maintains a constant pressure. A displacement sensor measures the warpage data of the heat sink base plate of the power module under test under the fastened state. This invention, by simulating the fastening force under actual installation conditions, can effectively evaluate the warpage performance of the power module under actual installation conditions and can accurately measure the warpage state of the power module under the action of installation and fastening force.

[0055] Example 2 Based on the aforementioned warpage measurement method for power module products, this invention provides a warpage measurement device for power module products, such as... Figure 7 As shown in Figure 7, the warpage measurement device of this power module product includes an acquisition module 71, a first measurement module 72, a force application module 73, a second measurement module 74, and a removal module 75.

[0056] Acquisition module 71 is used to acquire the power module to be tested and place the power module to be tested on the warp measurement seat; The first measurement module 72 is used to measure the warpage data of the heat sink base plate of the power module under test in a natural placement state without the application of installation fastening force, using a displacement sensor. Force acquisition 73 is used to apply pressure simulating installation fastening force to the heat dissipation base plate of the power module under test through the pressure application device, and control the pressure application device to keep the pressure constant when the applied pressure reaches the preset simulated fastening force value. The second measurement module 74 is used to measure the warpage data of the heat dissipation base plate of the power module under test in a tight state by means of the displacement sensor under constant pressure. The removal module 75 is used to control the pressure application device to remove the applied pressure and remove the power module to be tested from the warp measurement seat.

[0057] For further details regarding the implementation of the above-mentioned technical solution by each module in the warp measurement device of the power module product, please refer to the description in the warp measurement method of the power module product provided in the above-mentioned embodiments of the invention, which will not be repeated here.

[0058] Example 3 Based on the warpage measurement method of the above power module products, such as Figure 8 As shown in the diagram, an embodiment of the present invention provides a structural schematic of a warpage measurement device for a power module product. The device includes a processor 81 and a memory 82 coupled to the processor 81. The memory 82 stores a computer program, which, when executed by the processor 81, causes the processor 81 to perform the steps of the warpage measurement method for the power module product described in the above embodiment.

[0059] For further details regarding the implementation of the above technical solution by the processor 81 in the warp measurement device for the power module product, please refer to the description in the warp measurement method for the power module product provided in the above embodiments of the invention, which will not be repeated here.

[0060] The processor 81 can also be called a CPU (Central Processing Unit). The processor 81 may be an integrated circuit chip with signal processing capabilities. The processor 81 can also be a general-purpose processor, a DSP (Digital Signal Processor), an ASIC (Application Specific Integrated Circuit), an FPGA (Field Programmable Gate Array), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components. The general-purpose processor can be a microprocessor, or the processor 81 can be any conventional processor.

[0061] Example 4 like Figure 9 The diagram illustrates the structure of a computer-readable storage medium provided in this embodiment of the invention. The storage medium stores a readable computer program 91. This computer program 91 can be stored in the storage medium as a software product, including several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) or processor to execute all or part of the steps of the methods described in various embodiments of the invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, magnetic disks or optical disks, ROM (Read-Only Memory), RAM (Random Access Memory), or terminal devices such as computers, servers, mobile phones, and tablets.

[0062] In the several embodiments provided in this application, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of modules is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple modules or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be indirect coupling or communication connection through some interfaces, apparatuses, or modules, and may be electrical, mechanical, or other forms.

[0063] The modules described as separate components may or may not be physically separate. The components shown as modules may or may not be physical modules; that is, they may be located in one place or distributed across multiple network modules. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0064] Furthermore, the functional modules in the various embodiments of this application can be integrated into one processing module, or each module can exist physically separately, or two or more modules can be integrated into one module. The integrated module can be implemented in hardware or as a software functional module. If the integrated module is implemented as a software functional module and sold or used as an independent product, it can be stored in a computer-readable storage medium.

[0065] In the above embodiments, implementation can be achieved, in whole or in part, through software, hardware, firmware, or any combination thereof. When implemented in software, it can be implemented, in whole or in part, as a computer program product.

[0066] The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of this application are generated. The computer may be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions may be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions may be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via wired (e.g., coaxial cable, fiber optic, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium may be any available medium that a computer can store or a data storage device such as a server or data center that integrates one or more available media. The available medium may be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., DVD), or a semiconductor medium (e.g., solid-state disk (SSD)).

[0067] The technical solutions provided in this application have been described in detail above. Specific examples have been used in this application to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

[0068] Those skilled in the art will understand that embodiments of this application can be provided as methods, systems, or computer program products. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application can take the form of a computer program product embodied on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0069] This application is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to this application. It should be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart illustrations and / or block diagrams. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0070] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0071] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0072] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A method for measuring the warpage of a power module product, characterized in that, include: Obtain the power module to be tested and place it on the warp measurement stand; With the power module under test in its natural placement state without any installation fastening force, the warpage data of its heat sink base is measured by a displacement sensor. The pressure is applied to the heat sink plate of the power module under test by a pressure application device to simulate the installation and fastening force, and when the applied pressure reaches the preset simulated fastening force value, the pressure application device is controlled to keep the pressure constant. With the pressure kept constant, the warpage data of the heat sink base plate of the power module under test in the tightened state is measured by the displacement sensor. Control the pressure application device to release the applied pressure and remove the power module to be tested from the warp measurement seat.

2. The warpage measurement method for power module products according to claim 1, characterized in that, The step of measuring the warpage data of the heat sink base plate by means of a displacement sensor when the power module under test is in a natural placement state without any applied installation fastening force includes: The power module is positioned on the warp measurement seat, and multiple displacement sensors are arranged along the preset sealing ring installation path on the heat dissipation base plate; The first height value of the heat dissipation base plate relative to the measurement reference on the warpage measuring seat is simultaneously measured by multiple displacement sensors at the corresponding measurement points. Based on the first height value, the warping distribution of the heat dissipation base plate in its natural state is determined as the natural warping data of the heat dissipation base plate.

3. The warpage measurement method for power module products according to claim 1, characterized in that, The step of applying simulated mounting force to the heat sink of the power module under test via a pressure application device, and controlling the pressure application device to maintain a constant pressure when the applied pressure reaches a preset simulated mounting force value, includes: The pressure heads of the pressure application device are moved to the positions of the corresponding mounting screw holes on the heat dissipation base plate; An elastic buffer is provided at the end of each pressure head of the pressure application device, and the elastic buffer makes each pressure head of the pressure application device make flexible contact with the heat dissipation base plate. The pressure applied by each pressure head of the pressure application device is used to apply simulated installation and fastening force to the heat dissipation base plate until the applied pressure reaches the preset simulated fastening force value.

4. The warpage measurement method for power module products according to claim 3, characterized in that, The method of applying simulated mounting force to the heat dissipation base plate of the power module under test through a pressure application device, and controlling the pressure application device to maintain a constant pressure when the applied pressure reaches a preset simulated mounting force value, further includes: The pressure value output by the pressure application device is monitored in real time by a pressure sensor, and the monitored pressure value is fed back to the pressure source controller. The monitored pressure value is compared with the preset simulated tightening force value, and the pressure value output by the pressure application device is dynamically adjusted according to the comparison result. When the monitored pressure value reaches the preset simulated tightening force value, the pressure source controller controls the pressure application device to stop pressurizing and maintain a constant pressure.

5. The warpage measurement method for power module products according to claim 1, characterized in that, The step of measuring the warpage data of the heat sink base plate of the power module under test in a tightened state using the displacement sensor while maintaining constant pressure includes: While the pressure applied to the heat dissipation base plate by the pressure application device is maintained at a preset simulated fastening force value, multiple displacement sensors are arranged along the preset sealing ring installation path on the heat dissipation base plate, and the second height value of the heat dissipation base plate relative to the measurement reference on the warping measuring seat is measured synchronously by the multiple displacement sensors. Based on the second height value, the warping distribution of the heat dissipation base plate after deformation under simulated installation fastening force is determined, and used as the warping data of the heat dissipation base plate in the fastened state.

6. The warpage measurement method for power module products according to claim 1, characterized in that, The control of the pressure application device to release the applied pressure and remove the power module to be tested from the warp measurement seat includes: The pressure source controller sends a pressure relief command to the pressure application device, controlling each pressure head of the pressure application device to release pressure synchronously, so that the pressure applied to the heat dissipation base plate is gradually reduced to zero. After the pressure application device is depressurized and each pressure head is reset, the power module is removed from the warp measurement seat.

7. The warpage measurement method for power module products according to claim 1, characterized in that, The method of acquiring the power module to be tested and placing it before the warp measurement fixture further includes: Obtain a calibration plate with a zero-warpage reference plane, place the calibration plate on the warpage measuring seat, and ensure that the reference plane covers the measurement area of ​​the heat dissipation base plate; The original height of the calibration plate relative to the reference plane at each corresponding measurement point is simultaneously measured using the multiple displacement sensors. Based on the original height values ​​of each corresponding measurement point relative to the reference plane, the calibration compensation value for correcting the displacement sensor error is calculated.

8. A warpage measurement device for a power module product, characterized in that, It includes an acquisition module, a first measurement module, a force application module, a second measurement module, and a removal module: The acquisition module is used to acquire the power module to be tested and place the power module to be tested on the warp measurement seat; The first measurement module is used to measure the natural warpage data of the heat sink base plate of the power module under test in its natural placement state without the application of installation fastening force, using a displacement sensor. Force acquisition is used to apply pressure to the heat sink base plate of the power module under test through a pressure application device to simulate the installation fastening force, and to control the pressure application device to keep the pressure constant when the applied pressure reaches the preset simulated fastening force value. The second measurement module is used to measure the warpage data of the heat sink base plate of the power module under test in a tightened state by means of the displacement sensor under constant pressure. The removal module is used to control the pressure application device to remove the applied pressure and remove the power module to be tested from the warp measurement seat.

9. A warpage measurement device for a power module product, characterized in that, Includes memory and processor, wherein: The memory is used to store computer programs; The processor is used to read the computer program in the memory and execute the steps of the warpage measurement method for the power module product as described in any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that, It stores a readable computer program that, when executed by a processor, implements the steps of the warpage measurement method for the power module product as described in any one of claims 1 to 7.

Images