Method and system for determining adhesive tape material in target electronic industry
By processing the fundamental signal and obtaining the harmonic values of the tape material through the processing module, the problem of selecting a suitable tape material is solved, and a rapid and accurate improvement in radio frequency performance is achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- LUXSHARE ITECH(ZHEJIANG) CO LTD
- Filing Date
- 2024-10-28
- Publication Date
- 2026-04-28
AI Technical Summary
Choosing the right tape material for the electronics industry to improve radio frequency performance can be challenging and may lead to performance mismatch and resource waste.
The initial fundamental signal is processed by the processing module to obtain the target fundamental signal. The signal is transmitted at the target measurement position and under pressure using the needle point to obtain the harmonic values of multiple tape materials. The target tape material is determined based on the comparison results of the harmonic values.
Quickly and accurately select the tape material with better RF performance, avoiding the waste of resources and increased costs in later design verification.
Smart Images
Figure CN121933579A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of signal detection technology, and in particular to a method and system for determining target electronic industry tape materials. Background Technology
[0002] The market is currently flooded with various electronic industry tape materials, such as single-sided conductive tape, double-sided conductive tape, and single-sided conductive foam tape. The base materials, adhesion, conductivity, rebound, and thermal reaction of these materials are also different.
[0003] Inside electronic products, there are all sorts of components, flexible circuit boards, chips, and antenna devices, filled with various structures. Ensuring that the modules do not interfere with each other, that the grounding is stable, and that the structures are compatible within a confined space is crucial to radio frequency (RF) performance. Even small noises can easily affect the antenna's transmission and reception performance, reduce communication quality, and in severe cases, cause signal loss, making the communication system unable to function properly.
[0004] Choosing the right electronic industry tape is one way to improve radio frequency (RF) performance. However, the main problem at present is that it is difficult to select electronic industry tape materials with better RF performance. If the selection is inaccurate, it may lead to problems such as performance mismatch, increased costs, or waste of design verification resources in subsequent product development. Summary of the Invention
[0005] This application provides a method and system for determining target electronic industry tape materials, which can accurately determine target electronic industry tape materials with better radio frequency performance.
[0006] In a first aspect, embodiments of this disclosure provide a method for determining a target electronic industry tape material, comprising: processing an initial fundamental signal through a processing module to obtain a target fundamental signal; moving a needle point to a target measurement position of the electronic industry tape material, and controlling the pressure between the needle point and the electronic industry tape material as a target measurement pressure; wherein, the output end of the processing module is connected to a first end of the needle point, and a second end of the needle point abuts against the electronic industry tape material; under the scenario of the target measurement position and the target measurement pressure, transmitting the target fundamental signal through the needle point to obtain harmonic values corresponding to multiple electronic industry tape materials; and determining the target electronic industry tape material based on the comparison results between the harmonic values corresponding to multiple electronic industry tape materials.
[0007] Secondly, this disclosure also provides a system for determining target electronic industry tape material, comprising: the system including: a processing module, a first spectrum analyzer, a moving platform, a pin point, a pressure gauge, a first PCB board, a second PCB board, a microstrip line, a load with a set ohm, a fixed platform, a first driving structure, and a second driving structure; wherein, the first spectrum analyzer is connected to the processing module; the output end of the processing module is connected to the first end of the pin point; wherein, the first PCB board and the second PCB board are arranged opposite to each other, the microstrip line is disposed on the side of the first PCB board facing the second PCB board, and one end of the microstrip line is configured with the load with the set ohm; the pin point is disposed on the second PCB board; during measurement, the second end of the pin point abuts against the electronic industry tape material, and the electronic industry tape material is connected to the surface of the microstrip line; wherein, the first... A PCB board is connected to a fixed platform, which drives the first PCB board to move vertically. A pressure gauge measures the pressure between the needle point and the electronic industry tape material. A second PCB board is connected to a moving platform, which drives the second PCB board to move horizontally. A processing module processes the initial fundamental signal to obtain a target fundamental signal. A first driving structure controls the movement of the fixed platform to control the pressure between the needle point and the electronic industry tape material as the target measurement pressure. A second driving structure controls the movement of the moving platform to move the needle point to the target measurement position of the electronic industry tape material. A first spectrum analyzer acquires harmonic values corresponding to multiple electronic industry tape materials and determines the target electronic industry tape material based on the comparison results between the harmonic values corresponding to multiple electronic industry tape materials.
[0008] The technical solution of this disclosure involves processing an initial fundamental wave signal through a processing module to obtain a target fundamental wave signal; moving a needle point to a target measurement position on an electronic industry adhesive tape material, and controlling the pressure between the needle point and the electronic industry adhesive tape material as the target measurement pressure; wherein, the output end of the processing module is connected to a first end of the needle point, and a second end of the needle point abuts against the electronic industry adhesive tape material; under the scenario of the target measurement position and the target measurement pressure, the target fundamental wave signal is transmitted through the needle point to obtain harmonic values corresponding to multiple electronic industry adhesive tape materials; and the target electronic industry adhesive tape material is determined based on the comparison results between the harmonic values corresponding to multiple electronic industry adhesive tape materials. This disclosure, by transmitting the target fundamental wave signal through the needle point to obtain harmonic values corresponding to multiple electronic industry adhesive tape materials under the scenario of the target measurement position and the target measurement pressure, and determining the target electronic industry adhesive tape material based on the comparison results between the harmonic values corresponding to multiple electronic industry adhesive tape materials, can quickly and accurately select a target electronic industry adhesive tape material with better radio frequency performance. Attached Figure Description
[0009] The above and other features, advantages, and aspects of the embodiments of this disclosure will become more apparent from the accompanying drawings and the following detailed description. Throughout the drawings, the same or similar reference numerals denote the same or similar elements. It should be understood that the drawings are schematic, and the originals and elements are not necessarily drawn to scale.
[0010] Figure 1 This invention provides a schematic diagram of a system architecture for determining target adhesive tape materials in the electronics industry.
[0011] Figure 2 This is a schematic diagram of another system architecture for determining target electronic industry tape materials provided in an embodiment of the present invention;
[0012] Figure 3 This is a schematic flowchart of a method for determining a target electronic industry tape material, provided in an embodiment of this application.
[0013] Figure 4 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Detailed Implementation
[0014] Embodiments of this disclosure will now be described in more detail with reference to the accompanying drawings. While some embodiments of this disclosure are shown in the drawings, it should be understood that this disclosure can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of this disclosure. It should be understood that the accompanying drawings and embodiments of this disclosure are for illustrative purposes only and are not intended to limit the scope of protection of this disclosure.
[0015] It should be understood that the various steps described in the method embodiments of this disclosure may be performed in different orders and / or in parallel. Furthermore, the method embodiments may include additional steps and / or omit the steps shown. The scope of this disclosure is not limited in this respect. The term "comprising" and its variations as used herein are open-ended, meaning "including but not limited to". It should be noted that the concepts of "first," "second," etc., mentioned in this disclosure are used only to distinguish different devices, modules, or units, and are not intended to limit the order of functions performed by these devices, modules, or units or their interdependencies. It should be noted that the modifications "a" and "a plurality" mentioned in this disclosure are illustrative rather than restrictive, and those skilled in the art should understand that unless explicitly indicated otherwise in the context, they should be understood as "one or more". It is understood that the data involved in this technical solution (including but not limited to the data itself, the acquisition or use of data) shall comply with the requirements of applicable laws, regulations, and relevant provisions.
[0016] Figure 1This is a schematic diagram of a system architecture for determining target electronic industry adhesive tape materials, provided by an embodiment of the present invention. The system is used to execute a method for determining target electronic industry adhesive tape materials. Figure 1 As shown, the system includes: a processing module 101, a first spectrum analyzer 102, a first drive structure 103, a pressure gauge 104, a fixed platform 105, a first PCB board 106, a microstrip line 107, a load with set ohms 108, a pin point 109, a second PCB board 110, a moving platform 111, a second drive mechanism 112, and an electronic industry adhesive tape material 113.
[0017] The processing module 101 is used to filter the harmonics in the initial fundamental signal to obtain the target fundamental signal; the target fundamental signal is transmitted to the electronic industry tape material 113 through the pin point 109, the electronic industry tape material 113 generates harmonics, and the first spectrum analyzer 102 is used to obtain the harmonic values corresponding to multiple electronic industry tape materials 113; the target electronic industry tape material is determined based on the comparison results between the harmonic values corresponding to multiple electronic industry tape materials 113.
[0018] The first drive structure 103 is used to control the movement of the fixed platform 105, with the pressure of the needle point 109 against the electronic industry tape material 113 as the target measurement pressure;
[0019] The second drive mechanism 112 is used to control the movement of the moving platform 111 to move the needle point 109 to the target measurement position of the electronic industry tape material 113.
[0020] The term "printed circuit board" (PCB) is used here. In this embodiment, the ohm setting is not limited; for example, it can be 50 ohms. The target electronics industry tape material can be an electronics industry tape material with superior radio frequency performance.
[0021] The first spectrum analyzer 102 is connected to the processing module 101. The output terminal of the processing module 101 is connected to the first end of the pin point 109. The pin point 109 is disposed on the second PCB board 110 (e.g., Figure 1 (on the green part in the middle).
[0022] The first PCB board 106 and the second PCB board 110 are arranged opposite to each other, and the microstrip line 107 (e.g.) Figure 1 The yellow portion in the image is located on the side of the first PCB board 106 facing the second PCB board 110, and one end of the microstrip line 107 (e.g., the yellow portion in the image) is located on one side of the first PCB board 106 facing the second PCB board 110. Figure 1 The right end of the configuration settings sets the load to 108 ohms.
[0023] The load 108 with a set ohm is used to reduce electromagnetic interference and can minimize signal reflection.
[0024] During measurement, the second end of the needle point 109 abuts against the electronic industry tape material 113, which is connected to the surface of the microstrip line 107. The electronic industry tape material 113 (e.g., ...) Figure 1 The red part in the image is located above the needle point 109.
[0025] In this embodiment, a fixed bracket may also be included, which is located on the mobile platform 111; the second PCB board 110 is connected to the mobile platform 111 via the fixed bracket. Driven by the second drive mechanism 112, the mobile platform 111 moves along the horizontal direction (…). Figure 1 (Moves along the x-axis and / or y-axis).
[0026] In this embodiment, it may also include a base, on which are arranged along the vertical direction ( Figure 1 A guide rail extends along the z-axis, and a fixed platform 105 moves along the guide rail under the drive of a first drive structure 103. A first PCB board 106 is connected to the fixed platform 105, and the fixed platform 105 is used to drive the first PCB board 106 to move vertically.
[0027] The pressure gauge 104 is used to measure the pressure between the needle point 109 and the electronic industry tape material 113. In this embodiment, the pressure gauge 104 is connected to the fixed platform 105 and moves with the fixed platform 105 to measure the pressure. Alternatively, the pressure gauge 104 can be connected and driven in other ways.
[0028] In this embodiment, the processing module 101 generates an initial fundamental signal and processes it to obtain the target fundamental signal. This embodiment does not limit the processing method; it can include various methods, such as power amplification and interference signal filtering.
[0029] In this embodiment, multiple electronic industry adhesive tape materials 113 need to be measured. One electronic industry adhesive tape material 113 is measured at a time. After measuring one electronic industry adhesive tape material 113, the unmeasured electronic industry adhesive tape material 113 can be measured by substitution. For example, the measured electronic industry adhesive tape material 113 can be replaced with the unmeasured electronic industry adhesive tape material 113, thereby enabling the measurement of multiple electronic industry adhesive tape materials 113.
[0030] In this embodiment, the multiple electronic industry tape materials 113 have the same shape and size, which can ensure the consistency of measurement and make it possible to compare the various electronic industry tape materials 113.
[0031] In this embodiment, the harmonic values generated by various electronic industry tape materials 113 need to be measured under the same target measurement location and the same target measurement pressure. Different electronic industry tape materials 113 will generate different levels of harmonics, ranging from -50 to -130 dBm. When the level of the generated harmonics is above the spectral noise floor, the technical solution provided in this embodiment can quickly distinguish the quality of the materials.
[0032] In this embodiment, the fixed platform 105 can be driven to move vertically, such as along the z-axis, by the first driving structure 103, simultaneously moving the first PCB board 106 and the electronic industry tape material 113 along the z-axis to simulate different pressure conditions. The pressure gauge 104 can obtain the pressure between the needle point 109 and the electronic industry tape material 113, which serves as the target measurement pressure. The moving platform 111 can be driven horizontally, such as along the x-axis and / or y-axis, by the second driving mechanism 112, thereby moving the second PCB board 110 and the needle point 109 along the x-axis and / or y-axis. After the moving platform 111 moves, the target measurement position of the electronic industry tape material 113 can be obtained, which can be characterized by (x, y).
[0033] In this embodiment, after determining the target measurement position and target measurement pressure, the target fundamental wave signal can be transmitted to the electronic industry tape material 113 through the needle point 109. When the target fundamental wave signal touches the electronic industry tape material 113, a harmonic corresponding to the electronic industry tape material 113 is generated and reflected back to the processing module. The first spectrum analyzer 102 obtains the harmonic value corresponding to the reflected harmonic, thereby obtaining multiple harmonic values corresponding to the electronic industry tape material 113; and determines the target electronic industry tape material based on the comparison results between the harmonic values corresponding to multiple electronic industry tape materials 113.
[0034] In this embodiment, the initial fundamental signal is processed by the processing module 101 to obtain the target fundamental signal; the fixed platform 105 is moved to control the pressure between the needle point and the electronic industry tape material as the target measurement pressure; the moving platform 111 is driven by the second driving mechanism 112 to move the needle point 109 to the target measurement position of the electronic industry tape material 113; the harmonic values corresponding to multiple electronic industry tape materials 113 are obtained by the first spectrum analyzer 102; the target electronic industry tape material is determined based on the comparison results between the harmonic values corresponding to multiple electronic industry tape materials 113. This can effectively realize the measurement of the harmonic values of multiple electronic industry tape materials and accurately select the target electronic industry tape material with better radio frequency performance.
[0035] like Figure 2 As shown, Figure 2 This is a schematic diagram of another system architecture for determining target electronic industry tape materials provided in an embodiment of the present invention. The processing module 201 includes a signal generator 2011, a power amplifier 2012, a filter 2013, a directional coupler 2014, an attenuator 2015, and a second spectrum analyzer 2016; the directional coupler 2014 is connected to the second spectrum analyzer 2016 via the attenuator 2015. Figure 2 As shown, the system also includes a first spectrum analyzer 202, a first drive structure 203, a pressure gauge 204, a fixed platform 205, a first PCB board 206, a microstrip line 207, a load with set ohms 208, a pin point 209, a second PCB board 210, a moving platform 211, a second drive mechanism 212, and an electronic industry adhesive tape material 213.
[0036] The second spectrum analyzer 2016 is used to monitor the target fundamental wave signal in real time, thereby monitoring the signal generated by the signal generator 2011. The attenuator 2015 is used to reduce the power of the target fundamental wave signal to prevent it from overloading the second spectrum analyzer 2016 and to protect it.
[0037] The signal generator 2011 is used to generate an initial fundamental signal;
[0038] The filter 2013 is used to filter the initial fundamental signal to obtain the first target fundamental signal;
[0039] The directional coupler 2014 is used to monitor the first target fundamental wave signal through the power amplifier 2012 to obtain the target fundamental wave signal; wherein the power of the target fundamental wave signal falls within a set power range.
[0040] The directional coupler 2014 is further configured to, if the power of the first target fundamental wave signal does not fall within the set power range, amplify the initial fundamental wave signal through the power amplifier 2012 to obtain a second target fundamental wave signal, wherein the power of the second target fundamental wave signal falls within the set power range; and use the second target fundamental wave signal as a new initial fundamental wave signal, and re-filter the new initial fundamental wave signal through the filter 2013 to obtain a new first target fundamental wave signal, until the power of the new first target fundamental wave signal falls within the set power range.
[0041] In this embodiment, if the power of the first target fundamental signal falls within the set power range, there is no need to select a power amplifier. This embodiment does not limit the set power range; it only needs to meet practical requirements.
[0042] In this embodiment, an initial fundamental wave signal is generated by a signal generator 2011; a pass filter 2013 filters the initial fundamental wave signal to remove interference signals other than the fundamental wave, thereby obtaining a first target fundamental wave signal. A directional coupler 2014 monitors the first target fundamental wave signal through a power amplifier 2012 to obtain the target fundamental wave signal; wherein the power of the target fundamental wave signal falls within a set power range. If the power of the first target fundamental wave signal does not fall within the set power range through the directional coupler 2014, the initial fundamental wave signal is amplified by the power amplifier 2012 to obtain a second target fundamental wave signal, wherein the power of the second target fundamental wave signal falls within the set power range. The second target fundamental wave signal is used as a new initial fundamental wave signal, and the filter 2013 is used again to filter the new initial fundamental wave signal to obtain a new first target fundamental wave signal, until the power of the new first target fundamental wave signal falls within the set power range. This effectively processes the initial fundamental wave signal and improves the accuracy of determining the target fundamental wave signal.
[0043] like Figure 2 As shown, the system also includes a duplexer 214; the duplexer 214 includes a low-pass terminal (e.g., Figure 2 F in the middle), High-pass end (such as F ...) Figure 2 H in the middle) and public terminals (such as Figure 2 (C) The high-pass terminal is connected to the first spectrum analyzer 202; the common terminal is connected to the pin point 209; and the low-pass terminal is connected to the directional coupler 2014.
[0044] The needle point 209, which comes into contact with the tape material 213 in the electronics industry, can be made of a conductive material, preferably gold or gold-plated copper.
[0045] The duplexer 214 is used to transmit the target fundamental wave signal from the low-pass terminal to the common terminal; and to transmit the target fundamental wave signal to the pin point 209 through the common terminal; wherein, when the target fundamental wave signal is transmitted through the pin point 209 and touches the electronic industry tape material 213, a corresponding harmonic is generated.
[0046] The duplexer 214 is also used to transmit the reflected harmonics through the common terminal to the high-pass terminal.
[0047] The first spectrum analyzer 202 is used to acquire and display the harmonic values corresponding to the reflected harmonics.
[0048] In this embodiment, the target fundamental wave signal is transmitted from the low-pass terminal to the common terminal via a duplexer 214; the target fundamental wave signal is then transmitted to the pin point 209 via the common terminal; when the target fundamental wave signal is transmitted via the pin point 209 and touches the electronic industry adhesive tape 213, a harmonic corresponding to the electronic industry adhesive tape 213 is generated. The duplexer 214 transmits the reflected harmonic to the high-pass terminal via the common terminal; the first spectrum analyzer 202 acquires and displays the harmonic value corresponding to the reflected harmonic, enabling rapid measurement and capture of the harmonic value corresponding to the electronic industry adhesive tape material.
[0049] In this embodiment, the signal generator 2011, power amplifier 2012, filter 2013, directional coupler 2014, duplexer 214, and pin point 209 can all be connected by radio frequency cables.
[0050] In this embodiment, the fundamental wave generated or transmitted by the signal generator 2011, the power amplifier 2012 and the corresponding radio frequency cable are filtered using the filter 2013 and the duplexer 214 to ensure that the signal reaching the pin point 209 is not subject to strong fundamental wave interference.
[0051] It should be noted that by adopting the system provided in this embodiment, electronic industry tape materials with better radio frequency performance can be introduced in the early stages of product development, at the semi-finished product stage or even the material stage. This controls costs from the material end, optimizes the radio frequency performance of the product, and avoids the need for large-scale whole-machine verification and various experimental designs in the later stage, greatly saving design verification resources and human resources.
[0052] Figure 3 This is a schematic flowchart illustrating a method for determining a target electronic industry adhesive tape material according to an embodiment of this application. This disclosure is applicable to situations where a target electronic industry adhesive tape material with superior radio frequency performance is selected. Optionally, this can be implemented using an electronic device, such as a mobile terminal, PC, or server. Figure 3 As shown, the method includes:
[0053] S310. The initial fundamental signal is processed by the processing module to obtain the target fundamental signal.
[0054] In this embodiment, the processing module generates an initial fundamental signal and processes it to obtain the target fundamental signal. This embodiment does not limit the processing method; it can include various methods, such as power amplification and interference signal filtering.
[0055] The processing module includes a signal generator, a filter, and a directional coupler.
[0056] Optionally, the initial fundamental signal is processed by the processing module to obtain the target fundamental signal, including: generating the initial fundamental signal by the signal generator; filtering the initial fundamental signal by the filter to obtain the first target fundamental signal; and monitoring the first target fundamental signal by the directional coupler to obtain the target fundamental signal; wherein the power of the target fundamental signal falls within a set power range.
[0057] In this embodiment, if the power of the first target fundamental wave signal falls within the set power range, no power amplifier needs to be selected, and the first target fundamental wave signal can be directly used as the target fundamental wave signal. If the power of the first target fundamental wave signal does not fall within the set power range, a power amplifier needs to be selected to amplify the power of the initial fundamental wave signal.
[0058] In this embodiment, the initial fundamental wave signal is generated by the signal generator; the initial fundamental wave signal is filtered by the filter to obtain the first target fundamental wave signal; and the first target fundamental wave signal is monitored by the directional coupler. This effectively processes the initial fundamental wave signal, making the obtained target fundamental wave signal more accurate and effective.
[0059] The processing module further includes a power amplifier, which is located between the signal generator and the filter.
[0060] Optionally, monitoring the first target fundamental wave signal via a directional coupler to obtain the target fundamental wave signal includes: if the power of the first target fundamental wave signal does not fall within the set power range, then amplifying the initial fundamental wave signal using the power amplifier to obtain a second target fundamental wave signal, wherein the power of the second target fundamental wave signal falls within the set power range; using the second target fundamental wave signal as a new initial fundamental wave signal, and re-filtering the new initial fundamental wave signal using the filter to obtain a new first target fundamental wave signal, until the power of the new first target fundamental wave signal falls within the set power range.
[0061] In this embodiment, when the power of the first target fundamental wave signal does not fall within the set power range, the initial fundamental wave signal is amplified by the power amplifier to obtain a second target fundamental wave signal whose signal power falls within the set power range. The second target fundamental wave signal is then used as a new initial fundamental wave signal, and the new initial fundamental wave signal is filtered again by the filter to obtain a new first target fundamental wave signal. This process continues until the power of the new first target fundamental wave signal falls within the set power range, effectively enabling the monitoring of the first target fundamental wave signal to ensure that the power of the target fundamental wave signal falls within the set power range.
[0062] S320. Move the needle point to the target measurement position of the electronic industry tape material, and control the pressure between the needle point and the electronic industry tape material to be the target measurement pressure.
[0063] The output end of the processing module is connected to the first end of the needle point, and the second end of the needle point abuts against the tape material used in the electronics industry.
[0064] In this embodiment, the needle point can be moved in any way to the target measurement position of the electronic industry tape material, thus ensuring the accuracy and consistency of the measurement. Alternatively, the movement of the electronic industry tape material can be controlled in any way to control the pressure between the needle point and the tape material, which serves as the target measurement pressure. This ensures the consistency and accuracy of measurements when measuring multiple electronic industry tape materials by applying consistent pressure and setting consistent positions.
[0065] The needle point is set on the second PCB board, which is connected to the moving platform. The moving platform is used to drive the second PCB board to move horizontally.
[0066] In this embodiment, by controlling the movement of the moving platform, the second PCB board can be moved horizontally, such as along the z-axis, thereby causing the needle point to move horizontally, thus enabling the measurement of the position of tape material in the electronics industry.
[0067] The electronic industry tape material is disposed on a first PCB board; the first PCB board and the second PCB board are spaced apart; a microstrip line is provided on the side of the first PCB board facing the second PCB board, and a load of a set ohm is configured at one end of the microstrip line; the electronic industry tape material is connected to the surface of the microstrip line; the first PCB board is connected to a fixed platform; the fixed platform is located on the side of the first PCB board away from the second PCB board; the fixed platform is used to drive the first PCB board to move in the vertical direction.
[0068] The load setting of ohms is used to reduce electromagnetic interference and can minimize signal reflection.
[0069] In this embodiment, by controlling the movable fixed platform, the first PCB board can be moved vertically, such as along the x-axis or y-axis, and the electronic industry tape material can be moved vertically, thereby enabling the measurement of the pressure between the needle point and the electronic industry tape material.
[0070] Optionally, moving the needle point to the target measurement position of the electronic industry tape and controlling the pressure between the needle point and the electronic industry tape material as the target measurement pressure includes: controlling the movement of the moving platform to move the needle point to the target measurement position of the electronic industry tape material; controlling the movement of the fixed platform and using a pressure gauge to measure the pressure between the needle point and the electronic industry tape material, so as to control the pressure between the needle point and the electronic industry tape material as the target measurement pressure.
[0071] In this embodiment, a first driving structure can drive a fixed platform to move vertically, such as along the z-axis, simultaneously moving the first PCB board and the electronic industry tape material along the z-axis to simulate different pressure conditions. A pressure gauge can obtain the pressure at which the needle point contacts the electronic industry tape material, serving as the target measurement pressure. A second driving mechanism can drive a moving platform horizontally, such as along the x-axis or y-axis, thereby moving the second PCB board and the needle point along the x-axis or y-axis. After the moving platform has moved, the target measurement position of the electronic industry tape material can be obtained, characterized by (x, y). The first driving structure and the second driving mechanism can be different motors.
[0072] In this embodiment, by precisely controlling the moving and fixed platforms, the needle point can be accurately moved to the designated measurement position on the electronic industry tape material while maintaining constant measurement pressure, thereby achieving accurate measurement of the harmonic values of the electronic industry tape material. This enhances the repeatability and reliability of the measurement, providing accurate data for material performance analysis.
[0073] S330. In the scenario of the target measurement position and the target measurement pressure, the target fundamental wave signal is transmitted through the needle point to obtain the harmonic values corresponding to multiple electronic industry tape materials.
[0074] In this embodiment, the harmonic values of various electronic industry tape materials can be measured at the same target measurement location and under the same target measurement pressure.
[0075] In this embodiment, the shapes and sizes of multiple electronic industry tape materials are consistent, which can ensure the consistency of measurement and make it possible to compare the various electronic industry tape materials.
[0076] In this embodiment, after determining the target measurement location and target measurement pressure, the target fundamental wave signal can be transmitted to the electronic industry tape material through the needle point. When the target fundamental wave signal touches the electronic industry tape material, the harmonic corresponding to the electronic industry tape material is generated and reflected back to the processing module. The first spectrum analyzer obtains the harmonic value corresponding to the reflected harmonic, thereby obtaining the harmonic values corresponding to multiple electronic industry tape materials.
[0077] Optionally, in the scenario of the target measurement location and the target measurement pressure, the target fundamental wave signal is transmitted through the needle point to obtain harmonic values corresponding to multiple electronic industry tape materials, including: for any electronic industry tape material, transmitting the target fundamental wave signal to the needle point through a duplexer; wherein, when the target fundamental wave signal is transmitted to the electronic industry tape material via the needle point, a corresponding harmonic is generated; and obtaining the harmonic value corresponding to the reflected harmonic through a first spectrum analyzer.
[0078] In this embodiment, the target fundamental wave signal is transmitted from the low-pass terminal to the common terminal via a duplexer; the target fundamental wave signal is then transmitted to the pin point via the common terminal; wherein, when the target fundamental wave signal is transmitted via the pin point and touches the electronic industry tape material, harmonics corresponding to the electronic industry tape material are generated. The duplexer transmits the reflected harmonics to the high-pass terminal via the common terminal; a first spectrum analyzer acquires and displays the harmonic values corresponding to the reflected harmonics, enabling rapid measurement and capture of the harmonic values corresponding to the electronic industry tape material.
[0079] S340. Determine the target electronic industry tape material based on the comparison results between the harmonic values corresponding to multiple electronic industry tape materials.
[0080] In this embodiment, after obtaining the harmonic values corresponding to each electronic industry tape material, the harmonic values of multiple electronic industry tape materials are compared one by one to select the electronic industry tape material with better radio frequency performance. The comparison results may include the minimum harmonic value and the corresponding electronic industry tape material.
[0081] Optionally, the target electronic industry tape material is determined based on the comparison results between the harmonic values corresponding to multiple electronic industry tape materials, including: selecting the electronic industry tape material with the smallest harmonic value as the target electronic industry tape material.
[0082] For example, with an initial fundamental signal of 787.5 MHz and taking three types of electronic industry tape materials as an example, the harmonic values of the three electronic industry tape materials measured by this method are -123.06 dBm, -114.77 dBm, and -94.76 dBm, respectively. Among them, -123.06 dBm is the harmonic value of the material with better performance (as the target electronic industry tape material); -114.77 dBm is the harmonic value of the material with average performance; and -94.76 dBm is the harmonic value of the material with poor performance.
[0083] In this embodiment, by selecting the electronic industry tape material with the lowest harmonic value as the target electronic industry tape material, it is possible to effectively and accurately select an electronic industry tape material with better radio frequency performance.
[0084] The technical solution of this disclosure involves processing an initial fundamental wave signal through a processing module to obtain a target fundamental wave signal; moving a needle point to a target measurement position on an electronic industry adhesive tape material, and controlling the pressure between the needle point and the electronic industry adhesive tape material as the target measurement pressure; wherein, the output end of the processing module is connected to a first end of the needle point, and a second end of the needle point abuts against the electronic industry adhesive tape material; under the scenario of the target measurement position and the target measurement pressure, the target fundamental wave signal is transmitted through the needle point to obtain harmonic values corresponding to multiple electronic industry adhesive tape materials; and the target electronic industry adhesive tape material is determined based on the comparison results between the harmonic values corresponding to multiple electronic industry adhesive tape materials. This disclosure, by transmitting the target fundamental wave signal through the needle point to obtain harmonic values corresponding to multiple electronic industry adhesive tape materials under the scenario of the target measurement position and the target measurement pressure, and determining the target electronic industry adhesive tape material based on the comparison results between the harmonic values corresponding to multiple electronic industry adhesive tape materials, can quickly and accurately select a target electronic industry adhesive tape material with better radio frequency performance.
[0085] Figure 4 A schematic diagram of an electronic device 10, which can be used to implement embodiments of this application, is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processors, cellular phones, smartphones, wearable devices (such as helmets, glasses, watches, etc.), and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely illustrative and are not intended to limit the implementation of the application described and / or claimed herein.
[0086] like Figure 4 As shown, the electronic device 10 includes at least one processor 11 and a memory, such as a read-only memory (ROM) 12 or a random access memory (RAM) 13, communicatively connected to the at least one processor 11. The memory stores computer programs executable by the at least one processor. The processor 11 can perform various appropriate actions and processes based on the computer program stored in the ROM 12 or loaded from storage unit 18 into the RAM 13. The RAM 13 may also store various programs and data required for the operation of the electronic device 10. The processor 11, ROM 12, and RAM 13 are interconnected via a bus 14. An input / output (I / O) interface 15 is also connected to the bus 14.
[0087] Multiple components in electronic device 10 are connected to I / O interface 15, including: input unit 16, such as keyboard, mouse, etc.; output unit 17, such as various types of displays, speakers, etc.; storage unit 18, such as disk, optical disk, etc.; and communication unit 19, such as network card, modem, wireless transceiver, etc. Communication unit 19 allows electronic device 10 to exchange information / data with other devices through computer networks such as the Internet and / or various telecommunications networks.
[0088] Processor 11 can be a variety of general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of processor 11 include, but are not limited to, central processing unit (CPU), graphics processing unit (GPU), various special-purpose artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, digital signal processors (DSPs), and any suitable processor, controller, microcontroller, etc. Processor 11 performs the various methods and processes described above, such as the determination of adhesive tape materials for the electronics industry.
[0089] In some embodiments, the determination of the target electronic industry tape material by method can be implemented as a computer program tangibly contained in a computer-readable storage medium, such as storage unit 18. In some embodiments, part or all of the computer program can be loaded and / or mounted on electronic device 10 via ROM 12 and / or communication unit 19. When the computer program is loaded into RAM 13 and executed by processor 11, one or more steps of the determination of the target electronic industry tape material described above can be performed. Alternatively, in other embodiments, processor 11 can be configured to perform the determination of the target electronic industry tape material by any other suitable means (e.g., by means of firmware).
[0090] Various embodiments of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), systems-on-a-chip (SoCs), payload-programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments may include implementations in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which may be a dedicated or general-purpose programmable processor, capable of receiving data and instructions from a storage system, at least one input device, and at least one output device, and transmitting data and instructions to the storage system, the at least one input device, and the at least one output device.
[0091] Computer programs used to implement the methods of this application may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when executed by the processor, the computer programs cause the functions / operations specified in the flowcharts and / or block diagrams to be performed. The computer programs may be executed entirely on a machine, partially on a machine, or as a standalone software package, partially on a machine and partially on a remote machine, or entirely on a remote machine or server.
[0092] In the context of this application, a computer-readable storage medium can be a tangible medium that may contain or store a computer program for use by or in conjunction with an instruction execution system, apparatus, or device. A computer-readable storage medium can be, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination of the foregoing. Alternatively, a computer-readable storage medium can be a machine-readable signal medium. More specific examples of machine-readable storage media include electrical connections based on one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the foregoing.
[0093] To provide interaction with a user, the systems and techniques described herein can be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user provides input to the electronic device. Other types of devices can also be used to provide interaction with the user; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including sound input, voice input, or tactile input).
[0094] The systems and technologies described herein can be implemented in computing systems that include backend components (e.g., as data servers), or computing systems that include middleware components (e.g., application servers), or computing systems that include frontend components (e.g., user computers with graphical user interfaces or web browsers through which users can interact with implementations of the systems and technologies described herein), or any combination of such backend, middleware, or frontend components. The components of the system can be interconnected via digital data communication of any form or medium (e.g., communication networks). Examples of communication networks include local area networks (LANs), wide area networks (WANs), blockchain networks, and the Internet.
[0095] A computing system can include clients and servers. Clients and servers are generally located far apart and typically interact through communication networks. The client-server relationship is created by computer programs running on the respective computers and having a client-server relationship with each other. The server can be a cloud server, also known as a cloud computing server or cloud host, which is a hosting product within the cloud computing service system to address the shortcomings of traditional physical hosts and VPS services, such as high management difficulty and weak business scalability.
[0096] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the method for determining target electronic industry tape materials as provided in any embodiment of this application.
[0097] In the implementation of the computer program product, computer program code for performing the operations of this application can be written in one or more programming languages or a combination thereof. Programming languages include object-oriented programming languages such as Java, Smalltalk, and C++, as well as conventional procedural programming languages such as C or similar languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network—including a local area network (LAN) or a wide area network (WAN)—or can be connected to an external computer (e.g., via the Internet using an Internet service provider).
[0098] Note that the above description is merely a preferred embodiment and the technical principles employed in this application. Those skilled in the art will understand that this application is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of this application. Therefore, although this application has been described in detail through the above embodiments, this application is not limited to the above embodiments. Many other equivalent embodiments may be included without departing from the concept of this application, and the scope of this application is determined by the scope of the appended claims.
Claims
1. A method for determining target adhesive tape materials for the electronics industry, characterized in that, include: The initial fundamental signal is processed by the processing module to obtain the target fundamental signal; The needle point is moved to the target measurement position of the electronic industry tape material, and the pressure between the needle point and the electronic industry tape material is controlled as the target measurement pressure; wherein, the output end of the processing module is connected to the first end of the needle point, and the second end of the needle point is pressed against the electronic industry tape material; In the scenario of the target measurement position and the target measurement pressure, the target fundamental wave signal is transmitted through the needle point to obtain the harmonic values corresponding to multiple electronic industry tape materials; The target electronic industry tape material is determined based on the comparison results between the harmonic values of multiple electronic industry tape materials.
2. The method according to claim 1, characterized in that, in, The needle point is set on the second PCB board, and the second PCB board is connected to the moving platform. The moving platform is used to drive the second PCB board to move in the horizontal direction. The electronic industry adhesive tape is disposed on a first PCB board; the first PCB board and the second PCB board are spaced apart; a microstrip line is provided on the side of the first PCB board facing the second PCB board, and one end of the microstrip line is configured with a load of set ohms; the electronic industry adhesive tape is connected to the surface of the microstrip line; wherein, the first PCB board is connected to a fixed platform; the fixed platform is located on the side of the first PCB board away from the second PCB board; the fixed platform is used to drive the first PCB board to move in the vertical direction.
3. The method according to claim 2, characterized in that, Move the needle point to the target measurement position on the electronic industry tape, and control the pressure between the needle point and the electronic industry tape material to the target measurement pressure, including: Control the movement of the mobile platform to move the needle point to the target measurement location for tape materials in the electronics industry; The fixed platform is moved under control, and a pressure gauge is used to measure the pressure between the needle point and the electronic industry tape material. The target pressure is to control the pressure between the needle point and the electronic industry tape material.
4. The method according to claim 1, characterized in that, in, The processing module includes a signal generator, a filter, and a directional coupler; it processes the initial fundamental signal to obtain the target fundamental signal, including: The initial fundamental signal is generated by the signal generator. The initial fundamental signal is filtered by the filter to obtain the first target fundamental signal; The first target fundamental wave signal is monitored by a directional coupler to obtain the target fundamental wave signal; wherein the power of the target fundamental wave signal falls within a set power range.
5. The method according to claim 4, characterized in that, in, The processing module further includes a power amplifier; the power amplifier is located between the signal generator and the filter; the target fundamental signal is obtained by monitoring the first target fundamental signal through a directional coupler, including: If the power of the first target fundamental wave signal does not fall within the set power range, the initial fundamental wave signal is amplified by the power amplifier to obtain the second target fundamental wave signal, wherein the power of the second target fundamental wave signal falls within the set power range. The second target fundamental wave signal is used as a new initial fundamental wave signal, and the new initial fundamental wave signal is filtered again through the filter to obtain a new first target fundamental wave signal, until the power of the new first target fundamental wave signal falls within the set power range.
6. The method according to claim 1, characterized in that, In the scenario of the target measurement location and the target measurement pressure, the target fundamental signal is transmitted through the needle point to obtain the harmonic values corresponding to multiple electronic industry tape materials, including: For any electronic industry tape material, the target fundamental wave signal is transmitted to the pin point through a duplexer; wherein, when the target fundamental wave signal is transmitted to the electronic industry tape material via the pin point, a corresponding harmonic is generated; The harmonic values corresponding to the reflected harmonics are obtained by the first spectrum analyzer.
7. The method according to claim 1, characterized in that, The target electronic industry tape material was determined based on a comparison of harmonic values among multiple electronic industry tape materials, including: The electronic industry tape material with the lowest harmonic value as determined by the comparison results is selected as the target electronic industry tape material.
8. The method according to claim 1, wherein, The multiple electronic industry tape materials have the same shape and size; the needle points are made of conductive material.
9. A system for determining target adhesive tape materials for the electronics industry, characterized in that, The system includes: a processing module, a first spectrum analyzer, a moving platform, a needle point, a pressure gauge, a first PCB board, a second PCB board, a microstrip line, a load with a set ohm, a fixed platform, a first drive structure, and a second drive structure; The first spectrum analyzer is connected to the processing module; the output of the processing module is connected to the first end of the pin point; the first PCB board and the second PCB board are arranged opposite to each other, the microstrip line is arranged on the side of the first PCB board facing the second PCB board, and one end of the microstrip line is configured with a load of a set ohm; the pin point is arranged on the second PCB board and the pin point is made of conductive material. During measurement, the second end of the needle point comes into contact with the electronic industry tape material, and the electronic industry tape material is connected to the surface of the microstrip line; The first PCB board is connected to the fixed platform, which is used to move the first PCB board vertically; the pressure gauge is used to measure the pressure between the needle point and the electronic industry tape material. The second PCB board is connected to the moving platform, which is used to move the second PCB board in the horizontal direction. The processing module is used to process the initial fundamental signal to obtain the target fundamental signal; The first drive structure is used to control the movement of the fixed platform, with the pressure of the needle point against the electronic industry tape material as the target for pressure measurement; The second drive structure is used to control the movement of the moving platform to move the needle point to the target measurement position of the tape material in the electronics industry; The first spectrum analyzer is used to acquire harmonic values corresponding to multiple electronic industry tape materials; and to determine the target electronic industry tape material based on the comparison results between the harmonic values corresponding to multiple electronic industry tape materials.
10. The system according to claim 9, characterized in that, in, The processing module includes a signal generator, a filter, a directional coupler, a power amplifier, an attenuator, and a second spectrum analyzer; the directional coupler is connected to the second spectrum analyzer via the attenuator; the second spectrum analyzer is used to monitor the target fundamental signal; the attenuator is used to reduce the power of the target fundamental signal to prevent the target fundamental signal from overloading the second spectrum analyzer; The signal generator is used to generate the initial fundamental signal; The filter is used to filter the initial fundamental signal to obtain the first target fundamental signal; The directional coupler is used to monitor the first target fundamental wave signal through the power amplifier to obtain the target fundamental wave signal; wherein the power of the target fundamental wave signal falls within a set power range; The directional coupler is further configured to, if the power of the first target fundamental wave signal does not fall within the set power range, amplify the initial fundamental wave signal through the power amplifier to obtain a second target fundamental wave signal, wherein the power of the second target fundamental wave signal falls within the set power range; and use the second target fundamental wave signal as a new initial fundamental wave signal, and re-filter the new initial fundamental wave signal through the filter to obtain a new first target fundamental wave signal, until the power of the new first target fundamental wave signal falls within the set power range.
11. The system according to claim 10, characterized in that, The system further includes a duplexer; the duplexer includes a low-pass terminal, a high-pass terminal, and a common terminal; the high-pass terminal is connected to the first spectrum analyzer; the common terminal is connected to the pin point; and the low-pass terminal is connected to the directional coupler. The duplexer is used to transmit the target fundamental wave signal from the low-pass terminal to the common terminal; and to transmit the target fundamental wave signal to the pin point through the common terminal; wherein, when the target fundamental wave signal is transmitted through the pin point and touches the electronic industry tape material, a corresponding harmonic is generated; The duplexer is also used to transmit the reflected harmonics through the common terminal to the high-pass terminal; The first spectrum analyzer is used to acquire and display the harmonic values corresponding to the reflected harmonics.