Method and device for determining temperature of rotary friction pair, electronic equipment and storage medium

Abstract

The application relates to a temperature determination method and device of a rotary friction pair, an electronic device and a storage medium. The method comprises the following steps: acquiring rotary state information of a rotating part in a rotary friction pair under a target working condition; correcting a preset thermal conductivity of the rotating part in a first direction based on the rotary state information of the rotating part, so as to obtain the corrected thermal conductivity of the rotating part in the first direction under the target working condition; and performing simulation calculation based on the corrected thermal conductivity of the rotating part, so as to determine temperature distribution data of the rotary friction pair. The method can effectively improve the accuracy of temperature prediction of the rotating part under a complex dynamic working condition.

Description

Technical Field

[0001] This application relates to the field of data processing technology, specifically to a method, apparatus, electronic device, and storage medium for determining the temperature of a rotating friction pair. Background Technology

[0002] In electrical and other fields, high-speed rotating components are prone to localized overheating, material degradation, and even failure. Therefore, accurate temperature field analysis is crucial for predicting thermal deformation, assessing electrical contact performance, and preventing overheating failure.

[0003] Currently, when analyzing the temperature field of systems containing rotating components, a frozen rotor model is commonly used. This model treats the rotating components as stationary at a fixed position in space at a specific instant, and calculates heat transfer from this stationary state. However, because the frozen rotor method neglects the solid-state energy transport effect during rotation, the accuracy of the calculation results is relatively low. Summary of the Invention

[0004] This application provides a method, apparatus, electronic device, and storage medium for determining the temperature of a rotating friction pair. By correcting the preset thermal conductivity in a first direction, the temperature distribution of the rotating component can be predicted efficiently and with high accuracy.

[0005] To achieve the above objective, according to a first aspect of this application, a method for determining the temperature of a rotating friction pair is provided, the method comprising:

[0006] Obtain the rotational state information of the rotating components in the rotating friction pair under the target working condition;

[0007] Based on the rotation state information of the rotating component, the preset thermal conductivity of the rotating component in the first direction is corrected to obtain the corrected thermal conductivity of the rotating component in the first direction under the target working condition.

[0008] Simulation calculations are performed based on the corrected thermal conductivity of the rotating component to determine the temperature distribution data of the rotating friction pair.

[0009] Optionally, the preset thermal conductivity is the thermal conductivity of the material to which the rotating component belongs, and the rotation state information includes the rotational angular velocity of the rotating component;

[0010] The step of correcting the preset thermal conductivity of the rotating component in the first direction based on the rotation state information of the rotating component to obtain the corrected thermal conductivity of the rotating component in the first direction under the target operating condition includes:

[0011] Based on the rotational angular velocity of the rotating component and the characteristic parameters of the rotating component, a correction amount for the preset thermal conductivity in the first direction is obtained;

[0012] The preset thermal conductivity in the first direction is corrected based on the indicated correction amount to obtain the corrected thermal conductivity of the rotating component in the first direction.

[0013] Optionally, the characteristic parameters of the rotating component include the material parameters and geometric parameters of the rotating component. The step of obtaining a correction amount for the preset thermal conductivity in the first direction based on the rotational angular velocity of the rotating component and the characteristic parameters of the rotating component includes:

[0014] The geometric parameters of the rotating component are squared to obtain the squared result of the geometric parameters;

[0015] The square of the geometric parameters of the rotating component, the rotational angular velocity, and the material parameters are multiplied to obtain the correction amount for the preset thermal conductivity in the first direction.

[0016] Optionally, after obtaining the correction amount for the preset thermal conductivity in the first direction based on the rotational angular velocity of the rotating component and the characteristic parameters of the rotating component, the method further includes:

[0017] Based on the ratio of the correction amount to the preset thermal conductivity, the relative strength parameter of the rotating component is determined. The relative strength parameter is used to characterize the strength of the thermal conductivity generated by the rotational motion relative to the thermal conductivity of the material of the rotating component.

[0018] If the relative strength parameter exceeds a preset strength threshold, the step of correcting the preset thermal conductivity in the first direction based on the indicated correction amount is performed to obtain the corrected thermal conductivity of the rotating component in the first direction.

[0019] Optionally, the step of performing simulation calculations based on the corrected thermal conductivity of the rotating component to determine the temperature distribution data of the rotating friction pair includes:

[0020] Obtain the heat conduction control equation of the rotating component in the stationary coordinate system, and the heat conduction control equation of the stationary component in the rotating friction pair in the stationary coordinate system;

[0021] The heat conduction control equation of the rotating component is updated based on the corrected thermal conductivity of the rotating component in the first direction, and the updated heat conduction control equation of the rotating component is obtained.

[0022] Based on the updated heat conduction control equations of the rotating component and the stationary component, temperature distribution data of the rotating component and the stationary component are obtained.

[0023] Optionally, the first direction is the rotation direction of the rotating component.

[0024] Optionally, the method further includes:

[0025] Obtain the actual temperature data at the preset position of the rotating component;

[0026] Calculate the deviation between the actual temperature data at the preset location and the simulated temperature data at the preset location in the temperature distribution data;

[0027] If the deviation exceeds a preset deviation threshold, the corrected thermal conductivity is adjusted according to the deviation to obtain the adjusted thermal conductivity.

[0028] Based on the adjusted thermal conductivity, the temperature distribution data of the rotating friction pair is re-determined.

[0029] According to a second aspect of this application, embodiments of this application also provide a temperature determination device for a rotary friction pair, the device comprising:

[0030] The acquisition module is used to acquire the rotational state information of the rotating components in the rotating friction pair under the target working condition;

[0031] The correction module is used to correct the preset thermal conductivity of the rotating component in the first direction based on the rotation state information of the rotating component, so as to obtain the corrected thermal conductivity of the rotating component in the first direction under the target working condition.

[0032] The prediction module is used to perform simulation calculations based on the corrected thermal conductivity of the rotating component to determine the temperature distribution data of the rotating friction pair.

[0033] According to a third aspect of this application, embodiments of this application also provide an electronic device, comprising:

[0034] A memory on which computer programs are stored;

[0035] A processor is configured to execute the computer program in the memory to implement the steps of any of the methods provided in the embodiments of this application.

[0036] According to a fourth aspect of this application, embodiments of this application also provide a computer-readable storage medium having a computer program stored thereon, wherein the computer program, when executed by a processor, implements the steps of any of the methods provided in embodiments of this application.

[0037] Some embodiments of this application include at least the following beneficial effects: the thermal conductivity of the rotating component in the rotating friction pair is corrected in the first direction based on the rotational state information, which can characterize the energy transport effect caused by the rotational motion, thereby avoiding the temperature field distortion problem caused by the traditional frozen rotor model ignoring the energy transport effect in the first direction. The corrected thermal conductivity is matched with the actual target working condition, improving the accuracy of temperature distribution data prediction for the rotating friction pair.

[0038] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0039] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0040] Figure 1 This is an application scenario diagram of the method for determining the temperature of a rotating friction pair provided in some embodiments of this application;

[0041] Figure 2 This is a schematic flowchart of a method for determining the temperature of a rotating friction pair provided in some embodiments of this application;

[0042] Figure 3 This is a flowchart illustrating another method for determining the temperature of a rotating friction pair provided in some embodiments of this application;

[0043] Figure 4 This is an exemplary schematic diagram of the main structure of the current collector provided in some embodiments of this application;

[0044] Figure 5 This is an exemplary schematic diagram of the flow field boundary definition of the CFD conjugate heat transfer simulation model of the current collector provided in some embodiments of this application;

[0045] Figure 6 This is an exemplary schematic diagram of the solid-solid region and fluid-solid region contact interface of the CFD conjugate heat transfer simulation model of the current collector provided in some embodiments of this application;

[0046] Figure 7 This is an exemplary schematic diagram of another main structure of a current collector provided in some embodiments of this application;

[0047] Figure 8 This is an exemplary schematic diagram of the temperature field of an AC current collector provided in some embodiments of this application;

[0048] Figure 9This is an exemplary schematic diagram showing the calculated and measured values ​​of the temperature of the AC current collector provided in some embodiments of this application;

[0049] Figure 10 This is an exemplary schematic diagram illustrating the calculation cost of the temperature field of an AC current collector provided in some embodiments of this application;

[0050] Figure 11 This is an exemplary schematic diagram of a temperature determination device for a rotary friction pair provided in some embodiments of this application;

[0051] Figure 12 These are exemplary schematic diagrams of electronic devices provided in some embodiments of this application.

[0052] Explanation of reference numerals in the attached figures:

[0053] 1. Slip ring, 2. Conductive plate, 3. Rotating support, 4. Insulating fastener, 5. Carbon brush, 11. Solid region, 111. Computational domain of slip ring, 112. Computational domain of conductive plate, 113. Computational domain of carbon brush, 114. Contact surface of rotating friction pair, 115. Contact surface between slip ring and air, 116. Contact surface between carbon brush and air, 117. Contact surface between carbon brush and conductive plate, 12. Air region, 121. Flow field inlet boundary, 122. Flow field outlet boundary, 123. Environmental boundary. Detailed Implementation

[0054] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0055] To facilitate understanding of the implementation schemes provided in this application, the relevant application background of the method for determining the temperature of a rotating friction pair provided in this application will be explained first.

[0056] In related technologies, the sliding mesh model simulates the rotational motion of the slip ring by using a smaller time step. This improves the robustness of numerical calculations while accurately depicting the distribution and transfer of heat generated by the sliding friction pair between the slip ring and the carbon brush. However, it takes approximately 30 minutes for the current collector to reach thermal stability from a cold state, while the time step used in the sliding mesh model (or the sliding mesh method) typically corresponds to the time required for the slip ring to rotate 1°. Taking a rotational speed n = 428.6 rpm as an example, the corresponding time step δt = 60 s / n / 360° ≈ 3.89 × 10⁻⁶. -4To simulate the entire thermal stabilization process, the required number of time steps is N = 30 min / δt ≈ 4.6 × 10⁻⁶. 6 If the computation time for each time step is t1 = 1 second, then the total computation time required to complete this transient simulation is t = t1 × N ≈ 1277 hours. For practical engineering problems, a computation time of thousands of hours cannot meet the requirements of product design and development cycles.

[0057] To reduce computational costs, the frozen rotor model (or frozen rotor method) is often used as an alternative to the slip mesh method. The frozen rotor model simplifies the handling of the interface by defining a relative reference frame for the fluid on the surface of the rotating component and freezing the relative positions between the rotating and stationary components. This simplification eliminates the need for transient field simulations, reducing the computation time for obtaining the thermally stable temperature field to within a few hours (typically only about 1 × 10⁻⁶). 4 The convergent solution can be obtained in a few iterations. However, since the frozen rotor model does not consider the actual motion state of the slip ring, it cannot reflect the dynamic influence of the motion state on the spatial distribution of heat flux density and the transfer rate. It also lacks a characterization of the slip ring's own circumferential heat conduction capacity, which leads to deviations in the calculated temperature field, such as excessively high local temperature rise and shifts in hot spot positions.

[0058] In view of this, some embodiments of this application provide a method for determining the temperature of a rotating friction pair. Based on the assumption of anisotropy of the thermal conductivity of the rotating component, the method corrects the dynamic influence of the rotational motion state of the rotating component on the spatial distribution of heat flux density and the transfer rate. This effectively balances computational efficiency and accuracy to meet the temperature field analysis requirements of high-power AC current collectors under various operating conditions.

[0059] Figure 1 This is an application scenario diagram of the method for determining the temperature of a rotating friction pair provided in some embodiments of this application.

[0060] The method for determining the temperature of rotating friction pairs in this application can be applied to various rotating friction pair scenarios. For example, it can be used to predict the temperature field of the AC current collector of a doubly-fed generator / motor under high current and high-speed rotation conditions, in order to avoid device arcing and failure caused by local overheating.

[0061] The implementing entity of the technical solution in this application embodiment can be a power device, which can be a temperature determining device for a rotating friction pair. This temperature determining device can be implemented in hardware and / or software, and can be configured in any electronic device with network communication capabilities. This electronic device can be a server, a terminal, or other similar device.

[0062] like Figure 1As shown, the method for determining the temperature of a rotating friction pair provided in this application embodiment can be applied to, for example... Figure 1 The application environment shown depicts a terminal communicating with a server via a network. This terminal can be, but is not limited to, various personal computers, laptops, smartphones, tablets, portable wearable devices, smart voice interaction devices, smart home appliances, in-vehicle terminals, and other vehicle-to-everything (V2X) devices.

[0063] The server can be implemented using a standalone server or a server cluster composed of multiple servers. It is understood that the server provided in this application embodiment can be a standalone physical server, a server cluster composed of multiple physical servers, or a distributed system. It can also be a cloud server providing basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communication, middleware services, domain name services, security services, and big data and artificial intelligence platforms. The terminal and server can be connected directly or indirectly through wired or wireless communication methods; this application embodiment does not impose any limitations on this.

[0064] In some embodiments, the application scenario may also include, for example, networks, storage devices, etc. Networks may include any suitable wired or wireless networks that facilitate the exchange of information and / or data. Storage devices are used to store data, instructions, and / or any other information.

[0065] It is important to note that the application scenarios for determining the temperature of rotating friction pairs are provided for illustrative purposes only and are not intended to limit the scope of this specification. Those skilled in the art can make various changes and modifications based on the description in this specification. For example, application scenarios may also include databases, information sources, etc. Furthermore, application scenarios may be implemented on other devices to achieve similar or different functions. However, these changes and modifications will not depart from the scope of this specification.

[0066] Figure 2 This is a schematic flowchart of a method for determining the temperature of a rotating friction pair provided in some embodiments of this application. In some embodiments, process 200 can be executed based on electronic devices. Figure 2 As shown, process 200 includes the following steps.

[0067] Step 210: Obtain the rotational state information of the rotating component in the rotating friction pair under the target working condition.

[0068] A rotary friction pair refers to a pair or combination of two components that are in direct contact and rotate relative to each other in a mechanical device. For example, a rotary friction pair may include a rotating component and a stationary component.

[0069] Rotating components are mechanical parts that rotate around a fixed axis during operation. Examples of rotating components include, but are not limited to, slip rings in a motor's current collector. Rotating components are subjected to frictional heat and Joule heating during operation, and their temperature field distribution affects structural strength, contact performance, and service life.

[0070] The target operating condition refers to the working state of a rotating component under specific operating conditions. For example, the target operating condition may include, but is not limited to, parameters such as the rotational angular velocity of the rotating component, ambient temperature, load current, external cooling conditions, and contact pressure of the rotating friction pair.

[0071] In some embodiments, the target operating condition is used to define the boundary conditions of the simulation or analysis to ensure that the temperature calculation results are consistent with the actual operating scenario.

[0072] Rotational state information is a set of physical quantities used to describe the motion characteristics of a rotating component under target operating conditions. For example, rotational state information may include parameters such as rotational angular velocity (e.g., rad / s or rpm), rotational direction, and angular acceleration.

[0073] In some embodiments, rotational status information can be obtained in real time by sensors (such as encoders on rotating components), or it can be obtained through manual input or historical operating data.

[0074] Step 220: Based on the rotation state information of the rotating component, the preset thermal conductivity of the rotating component in the first direction is corrected to obtain the corrected thermal conductivity of the rotating component in the first direction under the target working condition.

[0075] The preset thermal conductivity in the first direction refers to the inherent thermal conductivity value of the material used in the rotating component in the first direction under non-rotational or static conditions.

[0076] In some embodiments, the preset thermal conductivity of the rotating component in a first direction can be obtained from a material handbook, experimental measurements, or a database. The preset thermal conductivity of the rotating component in the first direction can be a fundamental thermophysical property parameter of the material.

[0077] The first direction is the direction of rotation of the rotating component, i.e., the tangential direction. In addition, in space, the radial direction refers to the direction from the rotation axis to the outer edge of the rotating component or along the outer edge of the rotating component to the rotation axis, and the axial direction refers to the direction parallel to the rotation axis.

[0078] It should be understood that since the rotation effect has a significant impact on the heat conduction of the rotating component in the first direction, it is necessary to perform a correction operation on the thermal conductivity in the first direction.

[0079] It should be understood that the rotation effect does not affect the heat conduction of the rotating component in other directions of space.

[0080] The corrected thermal conductivity refers to the equivalent thermal conductivity value obtained after dynamically correcting the preset thermal conductivity based on the rotational state information under the target operating conditions.

[0081] It should be understood that the correction does not change the inherent properties of the material itself, but rather reflects the energy transport effect caused by rotational motion as an enhancement of thermal conductivity in a specific direction by introducing an equivalent thermal conductivity. The corrected thermal conductivity in the first direction is used to replace the preset thermal conductivity in the first direction in subsequent heat conduction calculations, thereby improving the physical accuracy of the temperature field prediction.

[0082] In one implementation, the rotational angular velocity, the geometric parameters of the rotating component (such as radius and thickness), and the material parameters (such as density, specific heat capacity, and original thermal conductivity) can be substituted into a preset functional relationship to calculate the correction amount for the thermal conductivity. The preset functional relationship can be determined through manual analysis, theoretical calculation, or numerical simulation.

[0083] In another embodiment, a correction operation on the preset thermal conductivity parameter in the first direction is performed only when the target operating condition meets the preset correction conditions (e.g., the rotational angular velocity exceeds the preset angular velocity threshold) in order to avoid erroneous correction under low-speed operating conditions.

[0084] Step 230: Perform simulation calculations based on the corrected thermal conductivity of the rotating component to determine the temperature distribution data of the rotating friction pair.

[0085] Temperature distribution data is used to characterize the temperature changes of rotating components in space and / or time.

[0086] In some embodiments, temperature distribution data can be represented as a set of temperature values ​​on different grids; or, temperature distribution data can be represented as a temperature curve along a specific path (such as a radial section, axial centerline, or circumferential direction); or, temperature distribution data can be in the form of a time series, describing the temperature changes of a grid or region during the operation of a target working condition.

[0087] In some embodiments, the temperature distribution data of the rotating friction pair is determined by calculating using numerical heat transfer analysis methods based on the corrected thermal conductivity of the rotating component. For example, the numerical heat transfer analysis method can be implemented using CFD software such as Fluent or STAR-CCM+.

[0088] In some embodiments, a three-dimensional model of the rotating component can be established, which can be obtained through various CAE software (such as UG, ProE, etc.); the three-dimensional model of the rotating component is imported into simulation software (such as Fluent software), and the physical quantities applied to each mesh are determined according to the target working condition (e.g., density, thermal conductivity, specific heat capacity, etc. are determined according to the material of the rotating component); simulation is performed in the simulation software to obtain the predicted value of the temperature field of the rotating component under the target working condition.

[0089] In some embodiments of this application, the preset thermal conductivity in the first direction is corrected based on the rotational state information, so that the corrected thermal conductivity can dynamically respond to changes in operating conditions such as rotational speed, thereby reasonably equivalently simulating the additional heat transport effect brought about by rotation, and thus more accurate temperature distribution data can be obtained through simulation.

[0090] In some embodiments, the preset thermal conductivity is the thermal conductivity corresponding to the material to which the rotating component belongs, and the rotation state information includes the rotation angular velocity of the rotating component;

[0091] Based on the rotational state information of the rotating component, the preset thermal conductivity of the rotating component in the first direction is corrected to obtain the corrected thermal conductivity of the rotating component in the first direction under the target operating condition, including:

[0092] Based on the rotational angular velocity of the rotating component and the characteristic parameters of the rotating component, the correction amount of the preset thermal conductivity in the first direction is obtained;

[0093] The preset thermal conductivity in the first direction is corrected based on the indicated correction amount to obtain the corrected thermal conductivity of the rotating component in the first direction.

[0094] The characteristic parameters of a rotating component are a series of parameters related to its own physical properties. These characteristic parameters determine the extent to which the rotational effect influences the heat conduction of the rotating component. For example, characteristic parameters may include, but are not limited to, the dimensional parameters of the rotating component (such as radius, thickness, or distance from a specific point to the axis of rotation), the density of the material, and its specific heat capacity.

[0095] The correction amount refers to the change in the preset thermal conductivity calculated based on the rotational angular velocity and characteristic parameters.

[0096] In some embodiments, the correction amount for the preset thermal conductivity in the first direction can be obtained in various ways based on the rotational angular velocity and characteristic parameters of the rotating component. For example, based on the rotational angular velocity and characteristic parameters under the current target operating condition, a similar reference rotational angular velocity and reference characteristic parameters can be matched in a preset lookup table, and the reference correction amount corresponding to the reference rotational angular velocity and reference characteristic parameters can be determined as the current correction amount. The preset lookup table includes the correspondence between multiple reference rotational angular velocities, multiple reference characteristic parameters, and multiple reference correction amounts, which can be determined based on prior knowledge or historical data.

[0097] In some embodiments, historical data under the same or similar target operating conditions can be filtered, and the current correction amount can be determined based on the historical data. For example, historical rotational angular velocities and historical characteristic parameters that are the same as or similar to the current rotational angular velocity and characteristic parameters can be selected from the historical data under the target operating conditions, and the historical correction amounts corresponding to the historical rotational angular velocities and historical characteristic parameters can be determined as the current correction amount.

[0098] In some embodiments, the preset thermal conductivity in the first direction can be corrected based on a correction amount, and the corrected thermal conductivity of the rotating component can be obtained in various ways. For example, the corrected thermal conductivity = preset thermal conductivity + correction amount; or, the correction amount can be converted into a proportionality coefficient, and the corrected thermal conductivity = preset thermal conductivity × (1 + proportionality coefficient), wherein the proportionality coefficient can be related to the ratio of the correction amount and the preset thermal conductivity to better reflect the thermal conduction effect of the rotation effect on the material of the rotating component itself.

[0099] In some embodiments, the characteristic parameters of the rotating component include the material parameters and geometric parameters of the rotating component. Based on the rotational angular velocity of the rotating component and the characteristic parameters of the rotating component, a correction amount for a preset thermal conductivity in the first direction is obtained, including:

[0100] The geometric parameters of the rotating component are squared to obtain the squared results of the geometric parameters;

[0101] The correction amount for the preset thermal conductivity in the first direction is obtained by multiplying the square of the geometric parameters of the rotating component, the rotational angular velocity, and the material parameters.

[0102] Among them, material parameters characterize the inherent properties of the materials constituting the rotating component, such as the material's density and specific heat capacity; geometric parameters are used to describe the dimensions of the rotating component, such as the radius, axial length, contact surface width, or characteristic radius of curvature of the rotating component.

[0103] In one specific implementation, the correction amount (Δk) for the preset thermal conductivity in the first direction is determined by the material density (ρ) and specific heat capacity (c) of the rotating component. pThe rotational angular velocity and the square (r²) of geometric parameters (such as the distance r between any point on the rotating component and the axis of rotation) are determined, and can be expressed as: Δk=c p *ρ*ω*r².

[0104] In one specific implementation, the corrected thermal conductivity in the first direction is k2 = k1 + Δk, where k1 is the preset thermal conductivity in the first direction.

[0105] In some embodiments, after obtaining a correction amount for the preset thermal conductivity in the first direction based on the rotational angular velocity of the rotating component and the characteristic parameters of the rotating component, the method further includes:

[0106] Based on the ratio of the correction amount to the preset thermal conductivity, the relative strength parameter of the rotating component is determined. The relative strength parameter is used to characterize the strength of the thermal conductivity generated by the rotational motion relative to the thermal conductivity of the material of the rotating component.

[0107] If the relative strength parameter exceeds the preset strength threshold, the step of correcting the preset thermal conductivity in the first direction based on the indicated correction amount is performed to obtain the corrected thermal conductivity of the rotating component.

[0108] Specifically, the relative strength parameter Ψ = |correction amount (Δk)| / |preset thermal conductivity (k1)|. The numerator Δk represents the additional thermal conduction effect generated or equivalent to the rotational motion; the denominator k1 represents the inherent thermal conductivity of the material itself. Therefore, the relative strength parameter Ψ is a dimensionless number, characterizing the contribution of the rotational effect to thermal conduction under the target operating condition (a specific ω) and a specific rotating component (specific geometric parameters), and its relative strength compared to the contribution of the material's intrinsic thermal conduction. If Ψ is much less than 1, it indicates that the material's intrinsic thermal conduction is dominant, and the temperature effect caused by the rotational effect is negligible; if Ψ is close to or greater than 1, it indicates that the additional thermal conduction generated by the rotational effect has reached or exceeded the material's intrinsic thermal conduction, and the temperature effect caused by the rotational effect cannot be ignored.

[0109] The preset intensity threshold can be a system default value, an empirical value, a manually preset value, or any combination thereof, set according to actual needs.

[0110] In some embodiments, simulation calculations are performed based on the corrected thermal conductivity of the rotating component to determine the temperature distribution data of the rotating friction pair, including:

[0111] Obtain the heat conduction control equations for the rotating component in the stationary coordinate system, and the heat conduction control equations for the stationary component in the rotating friction pair in the stationary coordinate system;

[0112] The heat conduction control equation of the rotating component is updated based on the corrected thermal conductivity of the rotating component in the first direction, and the updated heat conduction control equation of the rotating component is obtained.

[0113] Based on the updated heat conduction control equations for the rotating component and the stationary component, temperature distribution data for the rotating and stationary components are obtained.

[0114] A stationary coordinate system is an inertial reference system that is fixed in space and does not rotate or translate with any component. It remains stationary during simulation or analysis. In the thermal analysis scenario of a current collector, the stationary coordinate system can be a cylindrical coordinate system established with the equipment casing, support, or ground as a reference. It is used to uniformly describe the relative positions, heat conduction paths, and boundary conditions between rotating components (such as current collector rings) and stationary components (such as carbon brushes or conductive plates).

[0115] Using a stationary coordinate system allows the entire current collector (including moving and non-moving parts) to be modeled within the same mathematical framework. When combined with simplification strategies such as the frozen rotor method, the rotating parts can be physically frozen in this stationary coordinate system. By introducing anisotropic thermal conductivity vectors, the energy transport effect generated by the rotation effect can be indirectly reflected, thus maintaining both computational efficiency and physical realism.

[0116] In one specific implementation, to accurately obtain temperature distribution data for rotating components, especially in engineering scenarios where they form a rotating friction pair with stationary components (such as brushes and slip rings, brake discs and calipers), a stationary coordinate system is uniformly adopted. This facilitates coupled solutions for two relatively moving components. Although the rotating component is actually in motion, in heat conduction problems, ignoring or equivalently treating the convection term allows the energy equation to be established on a fixed mesh, avoiding complex moving meshes or coordinate transformations, thereby improving computational efficiency. The heat conduction control equation for the rotating component can be constructed based on Fourier's law of heat conduction and the principle of energy conservation, and its form can be: Where T represents the temperature field of the rotating component. , For the density and specific heat capacity of the rotating component, For thermal conductivity tensor, These are heat source terms (such as Joule heating, frictional heat, etc.). The governing equations for stationary components have the same form, but the material parameters and heat source terms differ.

[0117] In one specific embodiment, based on the corrected thermal conductivity of the rotating component in the first direction obtained from the aforementioned steps, the preset thermal conductivity term in the first direction of the heat conduction control equation of the rotating component is updated, replacing the preset thermal conductivity k1 in the first direction with a direction-dependent equivalent thermal conductivity k2. The thermal conductivity tensor of the rotating component is represented as diag(kθ,k2,kz) in cylindrical coordinates. Through this update, the heat conduction control equation of the rotating component is transformed into an updated heat conduction control equation that better reflects the actual physical behavior.

[0118] In one specific implementation, the updated heat conduction control equations of the rotating component and the stationary component can be coupled and solved to obtain the temperature distribution data of the entire rotating friction pair system. The two heat conduction control equations are coupled at the sliding contact interface through boundary conditions: such as a heat flow continuity condition (the heat flow from the rotating component to the interface is equal to the heat flow from the interface to the stationary component) and a temperature matching condition or a contact thermal resistance model (the temperatures at both interfaces are directly equal, i.e.: (or related through a contact thermal resistance). Based on the updated equations for the rotating component and the heat conduction control equations for the stationary component, the boundary conditions at the interface, and the external boundary conditions (such as convection and radiation), the temperature field of the entire rotating friction pair in space can be obtained simultaneously by numerical methods (such as the finite element method), including the temperature distribution data of the rotating component and the stationary component respectively.

[0119] In some embodiments, the method further includes:

[0120] Obtain the actual temperature data at the preset position of the rotating component;

[0121] Calculate the deviation between the actual temperature data at the preset location and the simulated temperature data at the preset location in the temperature distribution data;

[0122] If the deviation exceeds the preset deviation threshold, the corrected thermal conductivity is adjusted according to the deviation to obtain the adjusted thermal conductivity.

[0123] Based on the adjusted thermal conductivity, the temperature distribution data of the rotating component was recalculated.

[0124] A preset position refers to one or more specific points on a rotating component that are pre-selected and convenient for physical measurement. For example, a preset position may be a critical area of ​​thermal load (such as the contact surface between the slip ring and the brush, or the friction surface of the brake disc) or a location where sensors can be easily installed.

[0125] In some embodiments, during testing or actual operation, the actual temperature data of the preset position of the rotating component can be obtained by measuring with thermocouples, infrared thermal imagers, fiber optic grating sensors, etc., installed at preset positions.

[0126] In some embodiments, the actual temperature data of the preset position of the rotating component can be compared with the simulated temperature data corresponding to the same spatial coordinate point in the temperature distribution data calculated by the aforementioned steps (using the corrected thermal conductivity), such as calculating the difference (absolute deviation) or the relative difference (relative deviation) between the two.

[0127] The preset deviation threshold can be determined based on experiments or experience. When the deviation exceeds this preset deviation threshold, an adjusted thermal conductivity that matches the simulated temperature data with the actual temperature data can be derived through optimization algorithms (such as least squares method, gradient descent method, etc.), making it closer to the true equivalent thermal conductivity under the current target operating conditions.

[0128] In some embodiments, the adjusted thermal conductivity can be used as a new parameter and substituted back into the heat conduction control equation of the rotating component to perform simulation calculations again, thereby obtaining updated temperature distribution data.

[0129] In some embodiments of this application, by adjusting the corrected thermal conductivity, uncertainties caused by factors such as batch differences in materials, long-term service performance degradation, and simplification of complex boundary conditions can be resolved, thereby improving the consistency between simulation results and actual target operating conditions and thus improving the accuracy of simulation results.

[0130] It should be noted that the above description of the process is for illustrative purposes only and does not limit the scope of this specification. Those skilled in the art can make various modifications and changes to the process under the guidance of this specification. However, these modifications and changes remain within the scope of this specification.

[0131] To better understand the above scheme, the method for determining the temperature of a rotating friction pair will be explained below with a specific embodiment.

[0132] Taking a current collector as an example, the method for determining the temperature of this rotating friction pair includes:

[0133] Step 1: Calculate the heat source of the current collector;

[0134] Step 2: Based on the theoretical derivation of the energy equation for the rotating component, the anisotropy assumption of the thermal conductivity of the collector ring is established, and the thermal conductivity vector of the collector ring is calculated and defined accordingly.

[0135] Step 3: Establish a CFD conjugate heat transfer simulation model of the current collector, use the results obtained in Step 1 and Step 2 as boundary conditions, and use a frozen rotor model to calculate the temperature field of the current collector.

[0136] By introducing a direction-dependent equivalent thermal conductivity vector, the enhanced effect of tangential heat transport caused by rotation is accurately reproduced while maintaining the computational efficiency of the frozen rotor model, thus enabling the correct calculation of the collector ring temperature field.

[0137] In cylindrical coordinates, the Laplace operator takes the form shown in equation (1):

[0138] (1)

[0139] The generalized energy equation for a solid containing an internal heat source in cylindrical coordinates is expressed as shown in equation (2):

[0140] (2)

[0141] in, For material density, For specific heat capacity, For heat source terms per unit volume, , , These are the radial, tangential, and axial thermal conductivity components, respectively. The velocity vector characterizing the motion state of a solid, where T is the temperature. This is to characterize the energy convection term associated with the motion state of a solid.

[0142] For stationary components in a current collector (such as carbon brushes, brush holders, etc.), the velocity vector =0, and the material is usually isotropic, that is ,in, The thermal conductivity of the material corresponding to the stationary component can be considered as a constant. The energy equation of the stationary component is shown in formula (3):

[0143] (3)

[0144] However, for the rotating component of the current collector that rotates around the z-axis, namely the slip ring, due to , Formula (2) simplifies to formula (4):

[0145] (4)

[0146] in, Therefore, rotational motion is mathematically equivalent to increasing the tangential thermal conductivity, while the radial and axial thermal conductivity remain the same as the material's thermal conductivity values.

[0147] Comparing formulas (3) and (4), it can be seen that the energy equations for stationary and rotating components differ only in form in terms of tangential thermal conductivity. A thermal conductivity vector k for the collector ring is defined to unify the mathematical form of the energy equations for solid regions in different motion states, ensuring that the time-varying influence of the collector ring's rotational motion state on the spatial transfer rate of heat flux density on its surface and interior can be correctly considered when analyzing the temperature field of the collector device using the frozen rotor model in step three.

[0148] According to formulas (3) and (4), the mathematical form of the thermal conductivity vector k of the collector ring can be defined as shown in formula (5):

[0149] , (5)

[0150] In formula (5), These are orthogonal unit vectors in cylindrical coordinates, representing the radial, tangential, and axial directions, respectively.

[0151] The thermal conductivity vector k of the slip ring is decomposed into three orthogonal components in cylindrical coordinates: radial, tangential, and axial. The radial and axial components are constants consistent with the thermal conductivity of the slip ring material. tangential component This is related to the rotational angular velocity of the slip ring. and radial coordinates Related functions .

[0152] Based on the above assumptions, in step three, when using the frozen rotor model to calculate the temperature field of the collector, the motion state of the solid region is set to absolute stillness, the reference coordinate system of the air domain on the surface of the collector ring is set to a rotating coordinate system, and the thermal conductivity vector of the calculation domain of the collector ring is set to... This can be achieved by writing a script file.

[0153] It should be noted that this thermal conductivity vector does not reflect the actual physical properties of the material, but rather is an equivalent modeling assumption derived from the mathematical reconstruction of the energy equation. Its purpose is to introduce the convection-diffusion coupling effect caused by rotation into the thermal conductivity tensor, so that the thermal transport behavior of the moving parts can still be accurately described in the stationary coordinate system.

[0154] Based on the above theory, in the CFD conjugate heat transfer simulation in step three, all solid regions (including slip rings, conductive plates, rotating supports, insulating fasteners, and carbon brushes) are set to be absolutely stationary, while the air region outside the slip rings is configured to be in a rotating coordinate system rotating at the actual speed. That is, while using the frozen rotor model, it is ensured that the enhancement effect of rotation on tangential heat flow is accurately taken into account.

[0155] By employing the above steps and defining the anisotropy of the thermal conductivity vector, the rotational motion state of the collector ring is correlated with the spatial transfer rate of its internal heat flux density. This effectively corrects the underestimation of the temperature field or distortion of the temperature distribution caused by neglecting the convection term in existing frozen rotor models, thus improving the accuracy of the analysis. The entire calculation process is still based on frozen meshes, avoiding the mesh reconstruction and extremely small time steps required by sliding mesh or moving mesh methods. This reduces the consumption of computational resources and simulation time, improving the solution efficiency while ensuring the accuracy of the calculation results. It provides an analytical tool that combines accuracy and engineering practicality for comparing multiple design schemes, optimizing structures, and evaluating the thermal reliability of collector devices.

[0156] Using a current collector device as an application scenario, this paper describes the process of determining the temperature of rotating components, enabling high-precision prediction of the temperature field of high-speed rotating components such as current collector rings.

[0157] Please see Figure 4 (DC collector) and Figure 7 (AC current collector), such as Figure 4 and Figure 7 As shown, the slip ring 1 comprises multiple mutually insulated parallel conductive rings, which are fixedly mounted on a predetermined axial position of the rotating bracket 3 by insulating fasteners 4. The rotating bracket 3 is rigidly connected to the main rotating shaft of the motor via a flange and rotates synchronously with the main rotating shaft. The slip ring 1 is internally electrically connected to the motor rotor through the conductive busbar of the rotating bracket 3.

[0158] The conductive plate 2 comprises multiple mutually insulated parallel conductive rings and a supporting structure, which are installed in the outer space of the collector ring 1 and are stationary components. The conductive plate 2 is externally electrically connected to the excitation power supply via a cable. A certain number of carbon brushes 5 are mounted on the side of the conductive plate 2 and electrically connected thereto. Each carbon brush 5 may include a carbon brush 5 and a brush holder for fixing the carbon brush 5, and is a stationary component.

[0159] The carbon brush 5 is subjected to stable radial pressure by a constant force spring inside the brush holder, and its end working surface always maintains a sliding contact state with the outer circular surface of the slip ring 1. This contact state realizes the electrical connection between the slip ring 1 and the conductive plate 2, and thus realizes the electrical connection between the motor rotor and the excitation power supply.

[0160] The working process of this current collector is as follows: the electrical energy from the excitation power supply is transmitted to the conductive plate 2 through the wires. The current is then electrically connected to the carbon brush 5, and through the rotating current-carrying friction pair between the carbon brush 5 and the slip ring 1, it is guided to the rotating slip ring 1 and finally transmitted to the motor rotor, completing the continuous transmission of current from the stationary side to the rotating side. This current collector achieves stable conductivity under dynamic operating conditions through the rotating current-carrying friction pair formed by the carbon brush 5 and the slip ring 1.

[0161] Please refer to the current collector temperature field calculation process, such as... Figure 3 As shown. The structure and location of each component are illustrated. Figure 4 , 5 6, 7.

[0162] The eddy current loss of the metal is calculated. Specifically, a three-dimensional eddy current field model of the current collector is established using finite element method (FEM) electromagnetic analysis software (such as JMAG). This three-dimensional eddy current field model includes a solid region composed of a collector ring 1, a conductive plate 2, and a carbon brush 5. After meshing the above region, each mesh is assigned corresponding electromagnetic physical properties, such as material parameters like resistivity, conductivity, and permeability. Subsequently, the boundary conditions of the eddy current field model are defined, including applying an AC current source with a specific current amplitude, phase, and frequency at the excitation source, while considering the contact impedance between the collector ring and the carbon brush to simulate real electrical contact characteristics. By iteratively solving Maxwell's equations, the eddy current field distribution of the entire current collector is obtained, and the spatial distribution data of the eddy current loss inside the collector ring 1 and conductive plate 2 is extracted as the heat source for the collector ring 1 and conductive plate 2, used as input for the internal heat source in subsequent simulations.

[0163] Calculate the losses of the rotating friction pair. Based on the sliding contact heat generation model, combined with known operating parameters, such as... Figure 6 The relative friction velocity, effective contact area, contact pressure, and resistivity or contact impedance at the contact surface 114 of the rotating friction pair shown are used to calculate the frictional heat generated by mechanical friction and the Joule heat caused by contact resistance, which act on the contact surface of the friction and are factors contributing to the local temperature rise of the current collector. For example, frictional heat can be calculated using the formula: Pf = μ × N × A × v.

[0164] Where μ is the coefficient of kinetic friction, N is the normal contact pressure, A is the contact area, V is the relative velocity, and Pf is the frictional heat.

[0165] Joule heating can be calculated using the formula: Pe = I^2 × R0 × A, where I is the current, R0 is the contact resistance per unit area, and A is the contact area.

[0166] Based on this, according to the energy equation in the moving medium, the energy convection and heat diffusion terms caused by rotational motion are equivalently combined to derive three orthogonal components of the thermal conductivity tensor of the slip ring in cylindrical coordinates. The radial and axial components retain the inherent constant thermal conductivity of the material, while the tangential component is a function related to the rotational angular velocity and radial coordinates to reflect the enhancing effect of rotational shear flow on circumferential heat transport. Based on the actual rotational speed, geometric dimensions (such as radius), and material parameters of the slip ring, a user-defined function script (such as a UDF file suitable for Fluent) is written for use in computational fluid dynamics (CFD) software to dynamically define the anisotropic thermal conductivity of each mesh of the slip ring during simulation.

[0167] Based on this, a CFD conjugate heat transfer simulation model of the current collector is established. The spatial distribution data of the aforementioned eddy current loss and the spatial distribution data of friction loss (including frictional heat and Joule heat) are used as the boundary conditions of the heat source. The frozen rotor model is used for fluid-thermal coupling solution. In specific implementation, CFD software (such as ANSYS Fluent) is used to construct a three-dimensional geometric model of the solid region 11, including the current collector ring, conductive plate, rotating support, insulating fasteners and carbon brushes, and the air region 12 on the outer surface of the current collector ring, and the mesh is completed. In the solution setup, the solid region 11 is treated as a static computational domain (e.g., computational domain 111 of the slip ring, computational domain 112 of the conductive plate, computational domain 113 of the carbon brush, contact surface 114 of the rotating friction pair, contact surface 115 of the slip ring and air, contact surface 116 of the carbon brush and air, contact surface 117 of the carbon brush and conductive plate, etc.). The air region 12 is placed in a rotating coordinate system that rotates at the actual rotational speed of the slip ring. The effect of rotation on the flow field is simulated by the frozen rotor method. The thermophysical properties of the mesh elements are assigned values. Specifically, the thermal conductivity vector of the computational domain 111 of the collector ring is implemented by calling the aforementioned user-defined script, with its radial, tangential, and axial components denoted as k1, k2, and k1, respectively. The conductive plate 2 and other solid components employ isotropic thermal conductivity. The computational domains 111 of the collector ring and 112 of the conductive plate are loaded with the calculated spatial distribution data of eddy current losses, serving as the heat source for the collector ring and the conductive plate, respectively. The contact surface 114 of the rotating friction pair is loaded with the calculated spatial distribution data of friction losses (including frictional heat and Joule heat), serving as the contact surface heat source. Furthermore, flow field boundary conditions are set for the air region 12, such as... Figure 5 As shown, this includes specifying pressure and temperature at the flow field inlet boundary 121 and flow field outlet boundary 122, and defining the convective heat transfer coefficient and ambient temperature at the ambient boundary 123. After setting a reasonable number of iteration steps and a convergence check, the coupled solution is started to finally obtain the steady-state or transient temperature field of the entire current collector.

[0168] like Figure 8 As shown, the temperature field distribution of the AC current collector obtained by the method of this application embodiment tends to be consistent along the tangential direction, i.e., the rotation direction of the current collector ring 1. The calculation results are closer to the actual temperature distribution law than the calculation results of the frozen rotor model in the prior art.

[0169] like Figure 9 As shown, the AC collector ring friction surface temperature and carbon brush tail temperature obtained by the method of the present invention are 93.5℃ and 87.9℃, respectively, which are in high agreement with the measured values ​​of 94.0℃ and 88.0℃ of the prototype, and in high agreement with the calculated values ​​of 94.3℃ and 88.0℃ of the existing sliding mesh model. They are also more accurate than the calculated values ​​of 115.1℃ and 105.1℃ of the existing frozen rotor method.

[0170] like Figure 10 As shown, under the same computing software and hardware conditions, the method of the present invention takes 4.2 hours of computing time when used for temperature field analysis of AC current collectors, which is comparable to the 4.0 hours of computing time taken by the existing frozen rotor method and far less than the 1277.0 hours of computing time taken by the existing sliding mesh model.

[0171] In this embodiment, the FEM eddy current field calculation results are mapped to the CFD frozen rotor model as the Joule heat source term of the metal parts in the AC electromagnetic field, so as to realize the electromagnetic heating and flow field and temperature field coupling calculation of the high-power AC current collector.

[0172] The derivation process of the tangential equivalent thermal conductivity is as follows: The energy equation of a solid containing a heat source is shown in formula (2).

[0173] For rotating solid regions, , Formula (2) simplifies to formula (6):

[0174] (6)

[0175] In the formula, For density, For specific heat capacity, For heat source items, These are the orthogonal thermal conductivities, Defined as the tangential coordinates in the rotating coordinate system and the tangential coordinates in the stationary coordinate system. There is a corresponding relationship between them, as shown in formula (7):

[0176] (7)

[0177] The temperatures on both sides of the contact surface of the rotating friction pair satisfy the temperature continuity condition, as shown in formula (8):

[0178] (8)

[0179] At present, when the general frozen rotor method is used to calculate the temperature field of the rotating friction pair, the energy equations of all solid domains are solved in the stationary coordinate system according to formula (3), without considering the influence of time-varying effects on the energy transport of the rotating body. Therefore, the calculated temperature value of the collector ring deviates significantly from the actual temperature.

[0180] To address the aforementioned issues, the assumption of anisotropic thermal conductivity of the collector ring is introduced to improve the accuracy of the temperature field calculation of the rotating solid using the frozen rotor method.

[0181] In some embodiments, the convection term (first derivative term) on the left side of equation (6) can be moved to the right side and rearranged to obtain equation (9):

[0182] (9)

[0183] Introduction ,make:

[0184] (10)

[0185] Then the tangential thermal conductivity of the rotating solid domain is not equal to the thermal conductivity of the material itself. In this case, equation (6) can be simplified to equation (11);

[0186] (11)

[0187] And when When constant, temperature function and Satisfy the transformation relationship:

[0188] (12)

[0189] Substituting into equations (10) and (11), we get:

[0190] (13)

[0191] (14)

[0192] At this point, the energy equation (14) of the rotating solid domain and the energy equation (3) of the stationary solid domain have a unified mathematical form, and the temperature field can be calculated in the same stationary coordinate system. By introducing the anisotropic assumption of the thermal conductivity of the collector ring, the frozen rotor method can take into account the time-varying effect of the spatial transfer rate of the heat flux density of the rotating body on the existing basis.

[0193] To make the system of equations solvable, it is necessary to further eliminate the unknowns in formula (10) and derive the variables. Expressions for known quantities. Here, the exponential transformation method is used, assuming the temperature function... satisfy:

[0194] (15)

[0195] The mathematical forms of the first and second derivative terms of the temperature function are as follows:

[0196] (16)

[0197] (17)

[0198] Substitute into formula (10) and divide both sides by After combining like terms, we get:

[0199] (18)

[0200] For a rotating disk with a uniform temperature distribution in the circumference, the function Since the objective fact that the derivative terms of each order approach zero is satisfied, formula (18) simplifies to:

[0201] (19)

[0202] because 0, get

[0203] (20)

[0204] Formula (20) is the variable The calculation expression is given here. To simplify the problem, let's assume... .

[0205] Of course, we can also discuss this further in the form of equation (19). We can let... =0, 1, infinity, used to analyze the pattern of k2:

[0206] (1) When When k = 0, k2 is infinite, which indicates that the rotational speed of the collector ring reaches infinity, which does not exist in reality.

[0207] (2) When When =1, ;

[0208] (3) When When k2=k1, formula (14) becomes formula (3), which indicates that the collector ring does not rotate, which is inconsistent with the actual situation.

[0209] therefore, The specific value is actually related to the actual motion state of the rotating solid domain (i.e., the rotating component), which has a similar meaning to the dimensionless number Pe (Peckley number) in related heat transfer theories, used to characterize the relative intensity of convection and diffusion (Pe). At 1 o'clock, convection dominates, Pe When Pe=1, diffusion dominates; when Pe=1, the two intensities are comparable.

[0210] The Peckley number of a rotating solid can be expressed as: ;

[0211] In the formula, k is the inherent thermal conductivity of the material. When dealing with current collectors, the actual calculation effect can be verified by substituting specific data.

[0212] The slip ring is made of metal steel plate, r=0.8m, rated speed 428.6rpm (angular velocity). =44.9rad / s), density 7800kg / m3, specific heat 460J / kg / K, material thermal conductivity 50W / m / K. Substituting these parameters into the formula, we can obtain the following conclusion:

[0213] (1) The Peclet number of the collector ring is Pe = 2.06 × 10^6, which is much greater than 1, indicating that the tangential convection term of the collector ring dominates the heat transfer process.

[0214] (2) The data calculated using the above equivalent thermal conductivity are shown in Table 1:

[0215] Table 1

[0216]

[0217] Comparison with actual temperature field calculations revealed that when k2 ≥ 1 × 10^5, the collector ring temperature essentially no longer changes, and the simulated temperature data is very close to the measured temperature data, further illustrating... The value of is close to 1.

[0218] Figure 11 This is an exemplary schematic diagram of a temperature determination device for a rotary friction pair provided in some embodiments of this application.

[0219] like Figure 11 As shown in the diagram, one or more embodiments of this specification also provide a structural schematic of a device for determining the temperature of a rotating friction pair. This device for determining the temperature of a rotating friction pair may include:

[0220] The acquisition module 1101 is used to acquire the rotational state information of the rotating components in the rotating friction pair under the target working condition;

[0221] The correction module 1102 is used to correct the preset thermal conductivity of the rotating component in the first direction based on the rotation state information of the rotating component, so as to obtain the corrected thermal conductivity of the rotating component in the first direction under the target working condition.

[0222] The prediction module 1103 is used to perform simulation calculations based on the corrected thermal conductivity of the rotating component to determine the temperature distribution data of the rotating friction pair.

[0223] The acquisition module 1101, correction module 1102, and prediction module 1103 can be used to execute the embodiments corresponding to the above-mentioned method for determining the temperature of the rotating friction pair. For the specific implementation of these modules and more details, please refer to the corresponding method section, which will not be elaborated here.

[0224] In some embodiments of this application, the temperature determination device for the rotating friction pair can be implemented as a computer program, which can be implemented in, for example... Figure 12 The device operates on the electronic device shown. The memory of the electronic device can store various program modules that constitute the temperature determination device for the rotating friction pair. The computer program composed of these program modules causes the processor to execute the steps in the temperature determination method for the rotating friction pair of the various embodiments of this application described in this specification.

[0225] For details on the implementation of each of the above operations, please refer to the previous examples, which will not be repeated here.

[0226] Figure 12 These are exemplary schematic diagrams of electronic devices provided in some embodiments of this application.

[0227] This application also provides an electronic device 1200, which may include components such as a processor 1201 with one or more processing cores, a memory 1202 with one or more computer-readable storage media, a power supply 1203, and an input unit 1204. Those skilled in the art will understand that... Figure 12 The electronic device structure shown does not constitute a limitation on the electronic device and may include more or fewer components than shown, or combine certain components, or have different component arrangements. Wherein:

[0228] The processor 1201 is the temperature determination center for the rotating friction pair. It connects to various parts of the electronic device via various interfaces and lines. By running or executing software programs and / or modules stored in the memory 1202, and by calling data stored in the memory 1202, it performs various functions and processes data, thereby providing overall monitoring of the electronic device. It is understood that the processor 1201 communicates with the controller via signal transmission. Optionally, the processor 1201 may include one or more processing cores; preferably, the processor 1201 may integrate an application processor and a modem processor, wherein the application processor mainly handles the operating system, user interface, and applications, while the modem processor mainly handles wireless communication. It is understood that the modem processor may also not be integrated into the processor 1201.

[0229] The memory 1202 can be used to store software programs and modules. The processor 1201 executes various functional applications and data processing by running the software programs and modules stored in the memory 1202. The memory 1202 may mainly include a program storage area and a data storage area. The program storage area may store the operating system, application programs required for at least one function (such as sound playback function, image playback function, etc.), etc.; the data storage area may store data created according to the use of the electronic device, etc. In addition, the memory 1202 may include high-speed random access memory, and may also include non-volatile memory, such as at least one disk storage device, flash memory device, or other volatile solid-state storage device. Accordingly, the memory 1202 may also include a memory controller to provide the processor 1201 with access to the memory 1202.

[0230] In some embodiments of this application, the temperature determination device for the rotating friction pair can be implemented as a computer program, which can be implemented in, for example... Figure 12 The device operates on the electronic device shown. The memory of the electronic device can store various program modules that constitute the temperature determination device for the rotating friction pair. The computer program composed of these program modules causes the processor to execute the steps in the temperature determination method for the rotating friction pair of the various embodiments of this application described in this specification.

[0231] The electronic device also includes a power supply 1203 for supplying power to various components. Preferably, the power supply 1203 can be logically connected to the processor 1201 through a power management system, thereby enabling functions such as charging, discharging, and power consumption management through the power management system. The electronic device may also include an input unit 1204, which can be used to receive input digital or character information and generate keyboard, mouse, joystick, optical, or trackball signal inputs related to user settings and function control.

[0232] Although not shown, electronic devices may also include display units, etc., which will not be described in detail here.

[0233] In practice, each of the above units or structures can be implemented as an independent entity or can be arbitrarily combined to be implemented as the same or several entities. For the specific implementation of each of the above units or structures, please refer to the previous method embodiments, which will not be repeated here.

[0234] It should be noted that, Figure 12 This is merely one implementation of the electronic device 1200 provided in this application embodiment. In actual applications, the electronic device 1200 may include more or fewer components, which is not limited here.

[0235] It should also be understood that, in the various embodiments of this application, the order of the above-mentioned processes does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0236] Based on the above embodiments and the same concept, this application also provides a computer-readable storage medium storing a computer program that, when run on a computer, causes the computer to perform the method provided in the above embodiments.

[0237] Based on the above embodiments and the same concept, this application also provides a computer program product, which includes a computer program that, when run on a computer, causes the computer to execute the method provided in the above embodiments.

[0238] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0239] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0240] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Although the descriptions of each embodiment in this application have different focuses, and the parts not described in detail in a certain embodiment can be referred to the relevant embodiments of other embodiments, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of this application without departing from the content of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A method for determining the temperature of a rotating friction pair, characterized in that, The method includes: Obtain the rotational state information of the rotating components in the rotating friction pair under the target working condition; Based on the rotation state information of the rotating component, the preset thermal conductivity of the rotating component in the first direction is corrected to obtain the corrected thermal conductivity of the rotating component in the first direction under the target working condition; wherein, the first direction is the rotation direction of the rotating component; Simulation calculations are performed based on the corrected thermal conductivity of the rotating component to determine the temperature distribution data of the rotating friction pair; The preset thermal conductivity is the thermal conductivity of the material to which the rotating component belongs, and the rotational state information includes the rotational angular velocity of the rotating component; The step of correcting the preset thermal conductivity of the rotating component in the first direction based on the rotation state information of the rotating component to obtain the corrected thermal conductivity of the rotating component in the first direction under the target operating condition includes: Based on the rotational angular velocity of the rotating component and the characteristic parameters of the rotating component, a correction amount for the preset thermal conductivity in the first direction is obtained; The preset thermal conductivity in the first direction is corrected based on the indicated correction amount to obtain the corrected thermal conductivity of the rotating component in the first direction. The characteristic parameters of the rotating component include the material parameters and geometric parameters of the rotating component. The step of obtaining a correction amount for the preset thermal conductivity in the first direction based on the rotational angular velocity of the rotating component and the characteristic parameters of the rotating component includes: The geometric parameters of the rotating component are squared to obtain the squared result of the geometric parameters; Multiply the square of the geometric parameters of the rotating component, the rotational angular velocity, and the material parameters to obtain the correction amount for the preset thermal conductivity in the first direction; After obtaining the correction amount for the preset thermal conductivity in the first direction based on the rotational angular velocity of the rotating component and the characteristic parameters of the rotating component, the method further includes: Based on the ratio of the correction amount to the preset thermal conductivity, the relative strength parameter of the rotating component is determined. The relative strength parameter is used to characterize the strength of the thermal conductivity generated by the rotational motion relative to the thermal conductivity of the material of the rotating component. If the relative strength parameter exceeds a preset strength threshold, the step of correcting the preset thermal conductivity in the first direction based on the indicated correction amount is performed to obtain the corrected thermal conductivity of the rotating component in the first direction.

2. The method according to claim 1, characterized in that, The simulation calculation based on the corrected thermal conductivity of the rotating component to determine the temperature distribution data of the rotating friction pair includes: Obtain the heat conduction control equation of the rotating component in the stationary coordinate system, and the heat conduction control equation of the stationary component in the rotating friction pair in the stationary coordinate system; The heat conduction control equation of the rotating component is updated based on the corrected thermal conductivity of the rotating component in the first direction, and the updated heat conduction control equation of the rotating component is obtained. Based on the updated heat conduction control equations of the rotating component and the stationary component, temperature distribution data of the rotating component and the stationary component are obtained.

3. The method according to claim 1 or 2, characterized in that, The method further includes: Obtain the actual temperature data at the preset position of the rotating component; Calculate the deviation between the actual temperature data at the preset location and the simulated temperature data at the preset location in the temperature distribution data; If the deviation exceeds a preset deviation threshold, the corrected thermal conductivity is adjusted according to the deviation to obtain the adjusted thermal conductivity. Based on the adjusted thermal conductivity, the temperature distribution data of the rotating friction pair is re-determined.

4. A device for determining the temperature of a rotating friction pair, characterized in that, The device includes: The acquisition module is used to acquire the rotational state information of the rotating components in the rotating friction pair under the target working condition; The correction module is used to correct the preset thermal conductivity of the rotating component in a first direction based on the rotation state information of the rotating component, so as to obtain the corrected thermal conductivity of the rotating component in the first direction under the target working condition; wherein, the first direction is the rotation direction of the rotating component; The prediction module is used to perform simulation calculations based on the corrected thermal conductivity of the rotating component to determine the temperature distribution data of the rotating friction pair; The preset thermal conductivity is the thermal conductivity of the material to which the rotating component belongs, and the rotational state information includes the rotational angular velocity of the rotating component; The correction module is also used for: Based on the rotational angular velocity of the rotating component and the characteristic parameters of the rotating component, a correction amount for the preset thermal conductivity in the first direction is obtained; The preset thermal conductivity in the first direction is corrected based on the indicated correction amount to obtain the corrected thermal conductivity of the rotating component in the first direction. The characteristic parameters of the rotating component include the material parameters and the geometric parameters of the rotating component; The correction module is also used for: The geometric parameters of the rotating component are squared to obtain the squared result of the geometric parameters; Multiply the square of the geometric parameters of the rotating component, the rotational angular velocity, and the material parameters to obtain the correction amount for the preset thermal conductivity in the first direction; After obtaining the correction amount for the preset thermal conductivity in the first direction based on the rotational angular velocity of the rotating component and the characteristic parameters of the rotating component, the correction module is further configured to: Based on the ratio of the correction amount to the preset thermal conductivity, the relative strength parameter of the rotating component is determined. The relative strength parameter is used to characterize the strength of the thermal conductivity generated by the rotational motion relative to the thermal conductivity of the material of the rotating component. If the relative strength parameter exceeds a preset strength threshold, the step of correcting the preset thermal conductivity in the first direction based on the indicated correction amount is performed to obtain the corrected thermal conductivity of the rotating component in the first direction.

5. An electronic device, characterized in that, include: A memory on which computer programs are stored; A processor for executing the computer program in the memory to implement the steps of the method according to any one of claims 1 to 3.

6. A computer-readable storage medium, characterized in that, It stores a computer program that, when executed by a processor, implements the steps of the method according to any one of claims 1 to 3.

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