Audio acquisition equipment and lifting control method of microphone assembly

Abstract

The invention relates to audio acquisition equipment and a lifting control method of a microphone assembly. Based on the application, the audio acquisition equipment can comprise the microphone interface board which ascends and descends synchronously with the microphone assembly, the microphone interface board can be in conductive contact with the equipment main board when the microphone assembly is in a high-position exposed state, and the microphone assembly can be in conductive contact with the equipment main board based on the conductive contact between the microphone interface board and the equipment main board. According to the technical scheme, the microphone assembly can generate the analog audio signal to the equipment mainboard when the microphone assembly is in the high-order exposed state, so that a dynamic flexible conductive medium does not need to be used, and miniaturization of equipment is facilitated. Moreover, the stability of the electrical connection between the microphone assembly and the equipment mainboard can be ensured by the positioning of the rising target height when the microphone assembly is in the high-position exposed state, so that the audio acquisition reliability can be improved. Furthermore, the embodiment of the invention can consider the miniaturization of the audio acquisition equipment and the audio acquisition reliability under the condition of supporting the lifting of the microphone assembly.

Description

Technical Field

[0001] This application relates to an audio acquisition device and a method for controlling the lifting of a microphone assembly. Background Technology

[0002] An audio acquisition device may include a device motherboard and a microphone assembly. The microphone assembly can generate an analog audio signal to the device motherboard based on the received sound wave from the sound source. Then, after the analog audio signal is processed by the device motherboard, the audio data of the sound source can be obtained.

[0003] To balance the microphone assembly's efficiency in receiving sound waves from the source, as well as its protection against dust and moisture, the audio acquisition device can have a base. The audio acquisition device can allow the microphone assembly to be raised and lowered. That is, the audio acquisition device can have a base, and the microphone assembly can be raised to a high exposed state extending above the base when the audio acquisition device is in use. Furthermore, the microphone assembly can be lowered to a low retracted state inside the base when the audio acquisition device is not in use.

[0004] If the audio acquisition device allows the microphone assembly to be raised and lowered, then since the device motherboard is fixedly installed in the device base, the microphone assembly and the device motherboard can be electrically connected by a flexible conductive medium such as a cable or cable chain. Furthermore, the flexible conductive medium can deform and move during the raising and lowering of the microphone assembly. That is, there is a dynamic flexible conductive medium in the device base of the audio acquisition device that deforms and moves due to the raising and lowering of the microphone assembly.

[0005] Generally, to meet the miniaturization requirements of audio acquisition devices, the size of the device base is usually set to be small. This leads to a higher risk of wire interference between the dynamic flexible conductive medium and other structures or components within the device base. Furthermore, wire interference may cause the dynamic flexible conductive medium to detach from the microphone assembly or the device motherboard, resulting in low reliability of audio acquisition. If the size of the device base is increased to reduce the risk of wire interference, it will be difficult to meet the miniaturization requirements of audio acquisition devices.

[0006] As can be seen above, existing technologies, when using liftable microphone components, cannot simultaneously achieve both the miniaturization of audio acquisition devices and the reliability of audio acquisition. Summary of the Invention

[0007] The embodiments of this application provide an audio acquisition device and a method for controlling the lifting of a microphone assembly, which can balance the miniaturization of the audio acquisition device and the reliability of audio acquisition while supporting the lifting of the microphone assembly.

[0008] In one embodiment of this application, an audio acquisition device is provided, comprising:

[0009] Equipment base;

[0010] The device motherboard is fixedly installed inside the device base;

[0011] A microphone assembly that, based on the control of the device motherboard, can switch between a low-position retracted state and a high-position exposed state relative to the device base;

[0012] A microphone interface board is movably located within the device base. The microphone interface board is normally electrically connected to the microphone assembly, and the microphone interface board is raised and lowered synchronously with the microphone assembly below the device motherboard.

[0013] in:

[0014] The microphone interface board is physically separated from the device motherboard when the microphone assembly is in the low-position storage state.

[0015] When the microphone assembly is in the high-position exposed state, the microphone interface board enables the microphone assembly to generate analog audio signals to the device motherboard through conductive contact with the device motherboard;

[0016] The target height for the microphone assembly in the high-exposed state is determined by the device motherboard based on the successful detection of the conductive contact.

[0017] In some examples, optionally, a sensing component is fixed inside the device base, the sensing range of the sensing component covering the target descent height of the microphone component when it is in the low-position storage state, and the device motherboard is used to position the microphone component in the low-position storage state to the target descent height based on the sensing result of the sensing component.

[0018] In some examples, the conductive contact may optionally have a spring allowance, and the target rise height may be positioned such that the spring allowance is compressed.

[0019] In some examples, the conductive contact may optionally include terminal contacts occurring synchronously between multiple terminal pairs, and two signal terminals in each of the multiple terminal pairs are respectively arranged on the microphone interface board and the device motherboard; wherein the two signal terminals in each of the multiple terminal pairs respectively include a metal contact and a spring probe, and the spring probe in each of the multiple terminal pairs is used to provide the elastic margin for the terminal contact of the terminal pair.

[0020] In some examples, the conductive contact may optionally include terminal contacts between multiple terminal pairs, and two signal terminals in each of the multiple terminal pairs are respectively arranged on the microphone interface board and the device motherboard; the multiple terminal pairs include a first terminal pair, which is independent of the operating circuit of the microphone assembly; wherein the device motherboard determines the detection result of the conductive contact by detecting the terminal contacts of the first terminal pair.

[0021] In some examples, optionally, the first terminal pair includes: a detection terminal located on the device motherboard and a clamping terminal located on the microphone interface board; wherein: the detection terminal is used to generate a detection signal, the default level of the detection signal being a first level, and the first level being used to characterize the physical separation of the microphone interface board from the device motherboard; the clamping terminal is used to set the detection signal to a second level by contacting the terminal of the detection terminal; and the device motherboard, in response to the second level of the detection signal, determines successful detection of the conductive contact.

[0022] In some examples, the first terminal pair may optionally be redundantly configured as two pairs.

[0023] In some examples, the plurality of terminals may optionally include a second terminal pair, which connects the operating circuit to the device motherboard when terminal contact occurs.

[0024] In some examples, the operating circuit may optionally include: a power supply circuit for powering the microphone assembly, and an output circuit for the microphone assembly to output the analog audio signal.

[0025] In some examples, the second terminal pair may optionally include: a power terminal located on the device motherboard and a coupling terminal located on the microphone interface board; wherein: the power terminal is connected to the motherboard power supply of the device motherboard and the signal processing circuit of the device motherboard; the coupling terminal is connected to the power supply circuit and the output circuit; and the terminal contact between the power terminal and the coupling terminal is used to: supply power to the microphone assembly using the power supply circuit, and transmit the analog audio signal generated by the microphone assembly to the signal processing circuit using the power signal generated by the power terminal as a carrier.

[0026] In some examples, the second terminal pair is optionally redundantly configured as two pairs.

[0027] In some examples, the plurality of terminals may optionally include a third terminal pair, the microphone assembly being equipped with an indicator light, and the third terminal pair controlling the indicator light to illuminate when terminal contact occurs.

[0028] In some examples, the third terminal pair may optionally include a lighting control terminal located on the device motherboard and a driver terminal located on the microphone interface board; the lighting control terminal is used to generate a drive current, the driver terminal is connected to the indicator light, and the driver terminal makes contact with the terminal of the lighting control terminal to illuminate the indicator light using the drive current.

[0029] In some examples, the plurality of terminals may optionally include a fourth terminal pair, which is used to enable a common ground between the device motherboard and the microphone interface board when terminal contact occurs.

[0030] In some examples, optionally, both the microphone interface board and the microphone assembly are mounted on an integrated mounting component; wherein, the device motherboard controls the synchronous lifting and lowering of the microphone interface board and the microphone assembly by controlling the lifting and lowering of the integrated mounting component within the device base.

[0031] In some examples, the integrated mounting component may optionally include an interface board support and a microphone support, wherein the microphone interface board is fixedly mounted on the interface board support, and the microphone assembly is fixedly mounted on the microphone support.

[0032] In some examples, optionally, the interface board support and the microphone support are staggered in both the lifting direction of the microphone interface board and the microphone assembly, and in the horizontal direction perpendicular to the lifting direction; wherein: the microphone interface board has a terminal deployment area and a microphone connection area, the terminal deployment area is used to achieve the conductive contact with the device motherboard, and the terminal deployment area is stacked with the interface board support; the microphone connection area is closer to the microphone support in the horizontal direction relative to the terminal deployment area, and the microphone connection area is staggered to avoid the microphone support in the lifting direction; the microphone assembly has a microphone signal connector, the microphone signal connector is located on the side of the microphone support closer to the microphone support in the lifting direction, and the microphone signal connector and the microphone connection area are normally electrically connected adjacent to each other to achieve normal electrical connection between the microphone interface board and the microphone assembly.

[0033] In some examples, optionally, the device base is equipped with a lifting mechanism, wherein: the lifting mechanism includes a power component and a transmission component, the power component is controlled by the device motherboard, the power component generates power output, the power output drives the conveyor belt of the transmission component to move parallel to the lifting direction of the microphone interface board and the microphone assembly, and the integrated device component is fixedly mounted on the conveyor belt to lift and lower under the control of the device motherboard; the lifting mechanism also includes a support rail and a support slider, the support rail is fixed in the device base and parallel to the lifting direction, the support slider is slidably mounted on the support rail, the support slider is fixedly connected to the integrated device component, and the support rail provides anti-shake support for the lifting and lowering movement of the integrated device component using the support slider.

[0034] In some examples, optionally, the conveyor belt is fixedly equipped with a lifting plate, the integrated assembly has mounting lugs, the integrated assembly is fixedly mounted on the conveyor belt by means of the mounting lugs and the lifting plate, and the support slider achieves fixed connection with the integrated assembly and anti-vibration support for the integrated assembly by means of the fixed connection with the lifting plate.

[0035] In some examples, optionally, the microphone assembly includes a microphone tip and a microphone support rod. The microphone tip is located at the top of the microphone support rod, and the bottom end of the microphone support rod is fixedly connected above the integrated mounting component. Both the microphone tip and the microphone support rod are located inside the device base when the microphone assembly is in the low-position retracted state. When the microphone assembly is in the high-position exposed state, both the microphone tip and the microphone support rod extend above the base top plate of the device base. Furthermore, the microphone support rod is bendable. The device base is also equipped with a straightening member, which is used to straighten and correct the microphone support rod during the switching process of the microphone assembly from the high-position exposed state to the low-position retracted state.

[0036] In some examples, optionally, the base top plate has a top through hole for the microphone tip and the microphone support rod to pass through; the top of the straightening member has a correction hole seat, the correction hole seat is coaxially arranged with the top through hole, the microphone support rod is movably inserted through the correction hole seat, and the microphone tip is located above the correction hole seat; wherein: when the microphone assembly is in the high exposed state, the correction hole seat abuts against the bottom of the base top plate, and the microphone support rod extends through the top through hole above the base top plate, thereby releasing the bending freedom of the microphone support rod; during the process of the microphone assembly switching from the high exposed state to the low retracted state, the microphone support rod passes through the correction hole seat into the rod segment of the device base and is retracted into the device base in a straightened state.

[0037] In some examples, optionally, when the microphone assembly is in the low-positioned storage state, the microphone tip is snapped onto the correction hole seat, the snapping engagement of the microphone tip with the correction hole seat is used to subject the top end of the microphone support rod to an upward pulling force, the bottom end of the microphone support rod to a downward pulling force from the integrated mounting component, and the microphone support rod remains straight based on the opposing upward and downward pulling forces.

[0038] In some examples, optionally, the straightening member normally bears a first elastic force, which is used to cause the straightening member to move upward, and the direction of movement of the straightening member is parallel to the lifting direction of the microphone interface board and the microphone assembly; wherein: when the microphone assembly is in the low-position storage state, the first elastic force generates the upward pulling force on the top of the microphone support rod through the snap-fit ​​engagement between the microphone end and the correction hole seat.

[0039] In some examples, optionally, during the transition of the microphone assembly from the low-position retracted state to the high-position exposed state, the straightening member, driven by the first elastic force, rises synchronously with the microphone assembly and the microphone interface board until the correction hole seat abuts against the bottom of the base top plate. Furthermore, after the microphone tip extends through the top through-hole above the base top plate, it disengages from the correction hole seat and continues to rise until the microphone support rod extends through the top through-hole above the base top plate. When the microphone assembly is in the high-position exposed state... In the current state, the upward pulling force disappears as the microphone tip disengages from the correction hole seat, releasing the bending freedom of the microphone support rod. During the switching process of the microphone assembly from the high exposed state to the low retracted state, the section of the microphone support rod passing through the correction hole seat is retracted into the device base in a straightened state until the microphone tip is re-engaged with the correction hole seat. Furthermore, the straightening member overcomes the first elastic force based on the engagement between the microphone tip and the correction hole seat, and descends synchronously with the microphone assembly and the microphone interface board.

[0040] In some examples, optionally, the device motherboard is fixed to the top plate of the base; the microphone assembly has a microphone signal connector located at the bottom end of the microphone support rod, and the microphone interface board achieves normal electrical connection with the microphone assembly by making normal conductive contact with the microphone signal connector; wherein, when the microphone assembly is in the high exposed state, the microphone interface board makes conductive contact with the device motherboard below the top plate of the base.

[0041] Optionally, in some examples, the device base may also include a movable flip cover, a flip cover lever, and a lever rod; the movable flip cover is movably mounted below the top plate of the base; the flip cover lever has a first position and a second position, wherein when in the first position, the flip cover lever supports the movable flip cover and seals the top through-hole, and when in the second position, the flip cover lever removes its support for the movable flip cover, allowing the movable flip cover to fall below the top plate of the base under gravity and open the top through-hole; the moving direction of the lever rod is parallel to the lifting direction of the microphone interface board and the microphone assembly, and the lever rod... The mechanism is configured to: when the microphone assembly is in the low-position retracted state, place the flip cover lever in the first position; during the switching of the microphone assembly from the low-position retracted state to the high-position exposed state, place the flip cover lever in the second position before the microphone end reaches the top through-hole; when the microphone assembly is in the high-position exposed state, maintain the flip cover lever in the second position; during the switching of the microphone assembly from the high-position exposed state to the low-position retracted state, return the flip cover lever to the first position after the microphone end retracts through the top through-hole to below the base top plate.

[0042] In some examples, optionally, the paddle lever normally bears a second elastic force, and the second elastic force is used to cause the paddle lever to place the flip-up paddle in the second position; wherein: when the microphone assembly is in the low-position retracted state, the integrated mounting member presses the paddle lever down against the second elastic force, causing the flip-up paddle to be placed in the first position; during the process of the microphone assembly switching from the low-position retracted state to the high-position exposed state, the paddle lever, driven by the second elastic force, follows the microphone assembly and the... The microphone interface board rises synchronously, causing the paddle lever to position the flip cover paddle in the second position before the microphone end reaches the top through hole; when the microphone assembly is in the high exposed state, the paddle lever holds the flip cover paddle in the second position under the drive of the second elastic force; during the process of the microphone assembly switching from the high exposed state to the low retracted state, after the microphone end passes through the top through hole and is lower than the hanging movable flip cover, the paddle lever is restored to being pressed down by the integrated mounting component.

[0043] In another embodiment of this application, a lifting control method for a microphone assembly is provided. The microphone assembly is used in an audio acquisition device, which includes a device base, a device motherboard, and a microphone interface board. The lifting control method controls the microphone assembly to switch between a low-position retracted state and a high-position exposed state. The microphone interface board is normally electrically connected to the microphone assembly. The microphone interface board moves up and down synchronously with the microphone assembly within the device base. When the microphone assembly is in the low-position retracted state, the microphone interface board is physically separated from the device motherboard. Furthermore, the lifting control method includes:

[0044] The conductive contact between the microphone interface board and the device motherboard is detected; wherein, the conductive contact is used to enable the microphone interface board to acquire and transmit the analog audio signal generated by the microphone component to the device motherboard when the microphone component is in the high-position exposed state;

[0045] Based on the successful detection of the conductive contact, the target height of the microphone assembly in the high-exposed state is determined.

[0046] In some examples, optionally, the conductive contact includes terminal contact between multiple terminal pairs, and two signal terminals in each of the multiple terminal pairs are respectively arranged on the microphone interface board and the device motherboard; the multiple terminal pairs include a first terminal pair, and the first terminal pair is independent of the operating circuit of the microphone interface board and the microphone assembly; detecting the conductive contact between the microphone interface board and the device motherboard includes: detecting the terminal contact of the first terminal pair; locating the target height of the microphone assembly in the high-exposed state based on the successful detection of the conductive contact includes: determining the detection result of the conductive contact by detecting the terminal contact of the first terminal pair.

[0047] In some examples, optionally, a sensing component is fixed inside the device base, the sensing range of the sensing component covering the target descent height of the microphone component when it is in the low-position storage state, and the lifting control method further includes: positioning the microphone component in the low-position storage state to the target descent height based on the sensing result of the sensing component.

[0048] Based on embodiments of this application, an audio acquisition device may include a microphone interface board that rises and falls synchronously with the microphone assembly. This microphone interface board can make conductive contact with the device motherboard when the microphone assembly is in a high-exposed state. Based on this conductive contact between the microphone interface board and the device motherboard, the microphone assembly can generate analog audio signals to the device motherboard when in a high-exposed state. Therefore, electrical connection between the microphone assembly and the device motherboard in a high-exposed state can be achieved without a dynamic flexible conductive medium, thus facilitating the miniaturization of the audio acquisition device. Furthermore, the target height of the microphone assembly in the high-exposed state can be determined by the device motherboard based on successful detection of the conductive contact between the microphone interface board and the device motherboard, thereby ensuring the stability of the electrical connection between the microphone assembly and the device motherboard in a high-exposed state, and thus improving the audio acquisition reliability of the audio acquisition device. Therefore, embodiments of this application can balance device miniaturization and audio acquisition reliability while supporting a height-adjustable microphone assembly.

[0049] Furthermore, since the embodiments of this application do not require the use of a dynamic flexible conductive medium to achieve electrical connection between the microphone assembly and the device motherboard, the embodiments of this application can also eliminate the need for a dynamic flexible conductive medium, thereby reducing the equipment cost of the audio acquisition device and improving the equipment assembly efficiency of the audio acquisition device. Attached Figure Description

[0050] The following figures are for illustrative purposes only and do not limit the scope of this application:

[0051] Figure 1 This is a partial assembly diagram of the audio acquisition device in the embodiments of this application;

[0052] Figure 2 This is an exploded view of the audio acquisition device in the embodiments of this application;

[0053] Figure 3 This is a schematic diagram of the microphone assembly of the audio acquisition device in the embodiment of this application when it is in a low-positioned storage state.

[0054] Figure 4 This is a schematic diagram of the microphone assembly of the audio acquisition device in this application embodiment when it is exposed in a high position.

[0055] Figure 5 This is a schematic diagram of the anti-fragmentation structure of the audio acquisition device in the embodiments of this application;

[0056] Figure 6 This is a schematic diagram of the topology of the signal terminals of the audio acquisition device in the embodiments of this application;

[0057] Figure 7This is a schematic diagram of the rising process of the microphone assembly of the audio acquisition device in the embodiments of this application;

[0058] Figure 8 This is a schematic diagram of the microphone assembly descent process of the audio acquisition device in the embodiments of this application;

[0059] Figure 9 This is a schematic diagram illustrating the adaptive opening and closing principle of the active flip cover of the audio acquisition device in this application embodiment;

[0060] Figure 10 This is an exemplary flowchart illustrating the microphone assembly lifting control method in the embodiments of this application;

[0061] Figure 11 This is an extended flowchart illustrating the microphone assembly lifting control method in the embodiments of this application.

[0062] Figure Labels 10 Equipment Base

[0063] 11 Base Backplate

[0064] 12 base top plate

[0065] 120 top through hole

[0066] 125 Human-Computer Interaction Components 126 external interface

[0067] 13 Base side plates

[0068] 130 sensing components

[0069] 15 Straightening members

[0070] 150 Correction Hole Seat

[0071] 16-inch flip cover

[0072] 161 Flip Chip

[0073] 162 Paddle Push Rod

[0074] 163 Pressing End

[0075] 166 shift pin 20 device motherboards

[0076] 21 Motherboard Power Supply

[0077] 22 Signal Processing Circuit

[0078] 26 metal contacts 30 Lifting Mechanism

[0079] 31 Power Components

[0080] 33 Transmission Components

[0081] 331 drive wheel

[0082] 332 driven wheel

[0083] 333 transmission belt

[0084] 337 Lifting Platform

[0085] 35 support rails

[0086] 36 Support Slider 50 microphone components

[0087] 51 microphone tip

[0088] 511 power supply circuit

[0089] 512 output circuit

[0090] 52 microphone support pole

[0091] 53 Microphone Signal Connector

[0092] 60 microphone interface board

[0093] 62 Spring Probe

[0094] 65 Onboard Interface

[0095] 70 Integrated Installation Components

[0096] 71 main components

[0097] 73 Install side ears

[0098] 75 Microphone Stand

[0099] 76 Interface Board Support Platform Detailed Implementation

[0100] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided with reference to the accompanying drawings and embodiments.

[0101] Figure 1 This is a partial assembly diagram of the audio acquisition device in the embodiments of this application. Figure 2 This is an exploded view of the audio acquisition device in an embodiment of this application. Please refer to [link / reference]. Figure 1 and Figure 2 In embodiments of this application, the audio acquisition device may include a device base 10, a device motherboard 20, a microphone assembly 50, and a microphone interface board 60.

[0102] For example, in an embodiment of this application, the device base 10 may have a hollow inner cavity.

[0103] For example, in an embodiment of this application, the device base 10 may include a base back plate 11, a base side plate 13, and a base top plate 12. The base back plate 11 may be parallel to the width direction X and the height direction Z of the device base 10; the base side plate 13 may be parallel to the thickness direction Y and the height direction Z of the device base 10; and the base top plate 12 may be parallel to the width direction X and the thickness direction Y of the device base 10. The base back plate 11 and the base side plate 13 may be fixedly connected to each other, and the base top plate 12 may be fixedly connected to the base back plate 11 and the base side plate 13 above the base back plate 11 and the base side plate 13. Thus, the hollow inner cavity of the device base 10 may be surrounded by the base back plate 11 and the base side plate 13 below the base top plate 12. It is understood that in the embodiments of this application, the hollow inner cavity of the device base 10 can be a closed inner cavity. Furthermore, in order to facilitate viewing the internal structure of the device base 10, the illustrations of the embodiments of this application omit other structures that together with the base back plate 11, base side plate 13, and base top plate 12 enclose the hollow inner cavity.

[0104] For example, in an embodiment of this application, the device motherboard 20 may include a PCB (Printed Circuit Board), and the device motherboard 20 may be used to implement overall control of the audio acquisition device and signal processing of the analog audio signals generated by the microphone assembly 50.

[0105] For example, in an embodiment of this application, the device base 10 (e.g., base top plate 12) may have a human-machine interface component 125. The human-machine interface component 125 may have operable components such as a device power switch, volume adjustment buttons, and microphone enable and disable switches. In this case, the device motherboard 20's overall control of the audio acquisition device may include at least one of the following: starting and stopping the audio acquisition device, adjusting the playback volume of the audio data obtained by using analog audio signals, controlling the microphone component 50 to start (i.e., turn on the microphone) and turn it off (i.e., mute the microphone), and controlling the lifting of the microphone component 50.

[0106] Exemplarily, in embodiments of this application, the device motherboard 20 can use analog audio signals to obtain audio data that can be played through a speaker. This speaker can include a built-in speaker located in the device base 10, or it can be an external speaker independent of the device base 10. For example, the device base 10 (e.g., base top plate 12) can also have an external interface 126 such as a USB (Universal Serial Bus) interface, and the device motherboard 20 can connect to an external speaker through this external interface 126, allowing the audio data obtained using analog audio signals to be transmitted to the external speaker for playback.

[0107] For example, in the embodiments of this application, the device motherboard 20 can be fixed inside the device base 10. For instance, the device motherboard 20 can be fixedly installed below or on the lower surface of the base top plate 12, and the device motherboard 20 can be parallel to the width direction X and the thickness direction Y of the device base 10.

[0108] For example, in an embodiment of this application, the microphone assembly 50 may include a microphone tip 51, a microphone strut 52, and a microphone signal connector 53. The microphone tip 51 may be located at the top of the microphone strut 52, and the microphone signal connector 53 may be located at the bottom of the microphone strut 52.

[0109] Exemplarily, in an embodiment of this application, the microphone tip 51 is used to receive sound waves from a sound source (e.g., a speaker) in the environment where the audio acquisition device is located. The microphone tip 51 is also used to generate an analog audio signal based on the received sound waves. Furthermore, the analog audio signal generated by the microphone tip 51 can be transmitted to the microphone signal connector 53 through wiring inside the microphone strut 52. For example, the microphone tip 51 may include at least one pickup element such as a silicon microphone or an electret condenser. It is understood that the illustrative examples herein are intended to illustrate the function of the microphone tip 51, and the embodiments of this application are not intended to unnecessarily limit the type and number of pickup elements built into the microphone tip 51.

[0110] For example, in the embodiments of this application, the microphone support 52 is flexible; for example, the microphone support 52 may include a gooseneck. It is understood that a flexible microphone support 52 can facilitate the positional adjustment of the microphone tip 51 when the microphone assembly 50 is used, but the embodiments of this application are not intended to limit the microphone support 52 to be flexible; that is, the embodiments of this application are also applicable to the case where the microphone support 52 is a rigid support.

[0111] For example, in the embodiments of this application, the microphone assembly 50 can be raised and lowered between a low-positioned storage state and a high-position exposed state relative to the device base 10, based on the control of the device motherboard 20. That is, the raising and lowering direction of the microphone assembly 50 can be parallel to the height direction Z of the device base 10. Furthermore, if the device motherboard 20 is parallel to the width direction X and the thickness direction Y of the device base 10, then the device motherboard 20 is perpendicular to the raising and lowering direction of the microphone assembly 50.

[0112] For example, in the embodiments of this application, the audio acquisition device may further include a lifting mechanism 30, which may include a power component 31 and a transmission component 33. The power component 31 may be controlled by the device motherboard 20 and may be used to generate power output, which is used to drive the microphone component 50 to switch between a low-position retracted state and a high-position exposed state relative to the device base 10.

[0113] Exemplarily, in an embodiment of this application, the power component 31 can be fixedly installed inside the device base 10 (e.g., fixedly installed on the base back plate 11). The power component 31 may include a motor controlled by the device motherboard 20, which can generate power output for driving the microphone component 50 to rise and fall. The motor can be connected to the transmission component 33 via a transmission connection component such as a gearbox. The motor of the power component 31 and the device motherboard 20 can be connected by a cable. Since both the power component 31 and the device motherboard 20 are fixedly installed inside the device base 10, there will be no relative movement between them. Furthermore, the cable between the power component 31 and the device motherboard 20 will deform and move; that is, the cable is a static flexible conductive medium. The cable can be fixedly bound to the device base 10 (e.g., fixedly bound to the base back plate 11).

[0114] Exemplarily, in an embodiment of this application, the transmission component 303 may be located within the device base 10, and the transmission component 33 may be a belt drive component with lower cost than gear drives. The transmission component 33 may include a drive pulley 331, a driven pulley 332, and a transmission belt 333. The drive pulley 331 may be connected to a motor, and the driven pulley 332 may be spaced apart from the drive pulley 331 in the lifting direction of the microphone assembly 50 (or in the height direction Z of the device base 10) (e.g., fixedly supported on the base back plate 11). The transmission belt 33 may be tensioned between the drive pulley 331 and the driven pulley 332, and the transmission belt 33 may move in the lifting direction of the microphone assembly 50 (or in the height direction Z of the device base 10) in response to the rotation of the drive pulley 331 when the motor generates power. In this case, the microphone assembly 50 may be mounted on the transmission belt, thereby enabling the device motherboard 20 to control its movement between a low-position retracted state and a high-position exposed state relative to the device base 10.

[0115] Figure 3 This is a schematic diagram showing the microphone assembly of the audio acquisition device in this embodiment of the application in a low-profile retracted state. Please refer to... Figure 3 In the embodiments of this application, the microphone assembly 50 in the low-position storage state can be retracted inside the device base 10 (i.e., lowered below the device top plate 12). For example, the microphone assembly 50 can be retracted entirely (i.e., the microphone tip 51, microphone support rod 52, and microphone signal connector 53) inside the device base 10 (i.e., lowered entirely below the device top plate 12). If the microphone support rod 52 is flexible, it can remain straight when the microphone assembly 50 is in the low-position storage state.

[0116] Figure 4 This is a schematic diagram showing the microphone assembly of the audio acquisition device in this embodiment of the application in a high-exposed state. Please refer to... Figure 4 In the embodiments of this application, the microphone assembly 50, which is in a high-exposed state, extends outside the device base 10 (i.e., above the device top plate 12). For example, the microphone assembly 50 may extend at least partially (i.e., the microphone tip 51 and the microphone support 52) ​​outside the device base 10 (i.e., above the device top plate 12). Wherein, if the microphone support 52 is flexible, then the microphone support 52 may be able to bend freely when the microphone assembly 50 is in a high-exposed state.

[0117] For example, in an embodiment of this application, the top of the device base 10 (e.g., the base top plate 12) may have a top through hole 120. The top of the device base 10 (e.g., the base top plate 12) is also provided with a movable flip cover 16 at the top through hole 120. The movable flip cover 16 can selectively cover or open the top through hole 120. That is, the movable flip cover 16 can open the top through hole 120 when the microphone assembly 50 is raised and lowered through the top through hole 120, and close the top through hole 120 when the microphone assembly 50 is in a low-position storage state.

[0118] For example, in an embodiment of this application, the microphone interface board 60 may include a PCB. To distinguish it from the device motherboard 20, the PCB included in the device motherboard 20 may be referred to as the first PCB, and the PCB included in the microphone interface board 60 may be referred to as the second PCB.

[0119] For example, in the embodiments of this application, the microphone interface board 60 (e.g., the second PCB) can be regarded as a connection bridge between the microphone assembly 50 and the device motherboard 20 (e.g., the first PCB). That is, the microphone interface board 60 can be normally electrically connected to the microphone assembly 50 (e.g., the microphone signal connector 53), and the microphone interface board 60 (e.g., the second PCB) can also make conductive contact with the device motherboard 20 (e.g., the first PCB). When the microphone interface board 60 (e.g., the second PCB) is in conductive contact with the device motherboard 20 (e.g., the first PCB), it can be used to realize the electrical connection between the microphone assembly 50 and the device motherboard 20 (e.g., the first PCB), thereby enabling the microphone assembly 50 to generate analog audio signals to the device motherboard 20 (e.g., the first PCB).

[0120] For example, in an embodiment of this application, when the audio acquisition device is powered on and the microphone assembly 50 is turned on, the conductive contact between the microphone interface board 60 (e.g., the second PCB) and the device motherboard 20 (e.g., the first PCB) can be used for: the device motherboard 20 to supply power to the microphone interface board 60, and the device motherboard 20 to receive the analog audio signal generated by the microphone assembly 50 (e.g., the pickup element in the microphone tip 51) in the powered state based on the sound wave of the sound source through the microphone interface board 60.

[0121] For example, in an embodiment of this application, the microphone interface board 60 may have a microphone connection area, and the microphone connection area of ​​the microphone interface board 60 is used to realize the normal electrical connection between the microphone interface board 60 and the microphone assembly 50 (e.g., microphone signal connector 53). For example, the microphone interface board 60 (e.g., the second PCB) may have an onboard interface 65, for example, the onboard interface 65 may be located in the microphone connection area of ​​the microphone interface board 60, and the onboard interface 65 may be normally electrically connected to the microphone signal connector 53 through a connector or cable, thereby realizing the normal electrical connection between the microphone interface board 60 (e.g., the second PCB) and the microphone assembly 50. Since the microphone interface board 60 (e.g., the second PCB) and the microphone assembly 50 rise and fall synchronously, there is no relative movement between the microphone interface board 60 (e.g., the second PCB) and the microphone assembly 50. If the onboard interface 65 is normally electrically connected to the microphone signal connector 53 through a cable, the cable will not deform or move with the rise and fall of the microphone interface board 60 (e.g., the second PCB) and the microphone assembly 50, that is, the cable is a static flexible conductive medium.

[0122] For example, in an embodiment of this application, the microphone interface board 60 may have a terminal deployment area, and the terminal deployment area of ​​the microphone interface board 60 is used to achieve conductive contact between the microphone interface board 60 and the device motherboard 20. For example, the terminal deployment area of ​​the microphone interface board 60 may include multiple signal terminals, and the device motherboard 20 may also have corresponding multiple signal terminals. The multiple signal terminals of the terminal deployment area of ​​the microphone interface board 60 and the multiple signal terminals of the device motherboard 20 may be paired up, so that the conductive contact between the microphone interface board 60 and the device motherboard 20 may include terminal contact that occurs synchronously between multiple terminal pairs, wherein the two signal terminals of each terminal pair are respectively arranged on the microphone interface board 60 (i.e., the terminal deployment area) and the device motherboard 20.

[0123] For example, in the embodiments of this application, a plurality of signal terminals of the device motherboard 20 may be located on the side panel of the device motherboard 20 facing the microphone interface board 60; a plurality of signal terminals of the microphone interface board 60 may be located on the side panel of the microphone interface board 60 facing the device motherboard 20; and, in each terminal pair, a pair of signal terminals located in the device motherboard 20 and the microphone interface board 60 are aligned along the lifting direction of the microphone assembly 50, so that when the microphone interface board 60 rises to a height adjacent to the device motherboard 20, the pair of signal terminals located in each terminal pair in the device motherboard 20 and the microphone interface board 60 can make paired conductive contact in the lifting direction of the microphone assembly 50.

[0124] Exemplarily, in embodiments of this application, the microphone interface board 60 (e.g., the second PCB) can move synchronously with the microphone assembly 50 within the device base 10 (e.g., below the base top plate 12). That is, the microphone interface board 60 (e.g., the second PCB) can move synchronously with the microphone assembly 50, and the synchronous movement range of the microphone interface board 60 (e.g., the second PCB) is located within the device base 10 (e.g., below the base top plate 12). For example, the microphone interface board 60 (e.g., the second PCB) can remain parallel to the device motherboard 20; that is, the microphone interface board 60 can be parallel to the width direction X and thickness direction Y of the device base 10 and perpendicular to the lifting direction (e.g., the height direction Z) of the microphone assembly 50.

[0125] For example, in the embodiments of this application, the power output generated by the power component 31 mentioned above can also be used to drive the microphone interface board 60 and the microphone component 50 to rise and fall synchronously.

[0126] For example, in the embodiments of this application, the microphone interface board 60 and the microphone assembly 50 can both be mounted on the integrated device component 70, and the power output generated by the power component 31 can be used to drive the lifting and lowering movement of the integrated device component 70. Thus, by driving the lifting and lowering of the integrated device component 70, the microphone interface board 60 and the microphone assembly 50 can be driven to lift and lower synchronously. Furthermore, the device motherboard 20 can control the lifting and lowering of the integrated device component 70 within the device base 10 to achieve synchronous lifting and lowering control of the microphone interface board 60 and the microphone assembly 50.

[0127] For example, in the embodiments of this application, the integrated mounting component 70 can be fixedly mounted on the conveyor belt 333 of the transmission assembly 33 to rise and fall under the control of the device motherboard 20, thereby realizing the synchronous rising and falling control of the audio acquisition board 60 and the microphone assembly 50 by the device motherboard 20. For example, as illustrated in the embodiments of this application, the conveyor belt 333 of the transmission assembly 33 can be fixedly mounted with a lifting carrier plate 337, the integrated mounting component 70 can have a mounting lug 73, and the integrated mounting component 70 can fix the conveyor belt 333 of the transmission assembly 33 by means of the fixed connection between the mounting lug 73 and the lifting carrier plate 337.

[0128] For example, in an embodiment of this application, if the transmission component 33 is a belt drive component including a conveyor belt 333, the conveyor belt 333 may vibrate during the lifting and lowering process. In this case, the lifting mechanism 30 may further include a support rail 35 and a support slider 36. The support rail 35 may be fixed inside the device base 10 (e.g., fixedly mounted on the base back plate 11). The support rail 35 may be parallel to the lifting direction (e.g., the height direction Z) of the microphone assembly 50 and the microphone interface board 60. The support slider 36 may be slidably mounted on the support rail 35. The support slider 36 may be fixedly connected to the integrated device component 70. The support slider 36 may be fixedly connected to the integrated device component 70 by means of a fixed connection with the lifting carrier plate 337. Furthermore, the support rail 35 may provide anti-vibration support for the lifting and lowering movement of the integrated device component 70 by means of the support slider 36, thereby providing anti-vibration support for the synchronous lifting and lowering of the microphone assembly 50 and the microphone interface board 60.

[0129] For example, in an embodiment of this application, the integrated mounting component 70 may include an interface board support 76 and a microphone support 75. The microphone interface board 60 is fixedly mounted on the interface board support 76. For instance, the microphone interface board 60 may be fixedly mounted on the interface board support 76 in an orientation parallel to the width direction X and thickness direction Y of the device base 10, i.e., the microphone interface board 60 is parallel to the device motherboard 20 and perpendicular to the lifting direction (e.g., the height direction Z) of the microphone assembly 50. The microphone assembly 50 (e.g., the bottom end of the microphone support rod 52) may be fixedly mounted on the microphone support 75. The microphone signal connector 53 of the microphone assembly 50 may be located below the microphone support 75, and the microphone signal connector 53 may be normally electrically connected to the microphone interface board 60 (i.e., the onboard interface 65) below the microphone support 75.

[0130] For example, in an embodiment of this application, the interface board support 76 and microphone support 75 of the integrated mounting component 70 are staggered in the lifting direction (e.g., height direction Z) of the microphone interface board 60 and the microphone assembly 50, and in the horizontal direction (e.g., width direction X) perpendicular to the lifting direction and parallel to the base back plate 13. In this case, if, as described above, the microphone interface board 60 has a terminal deployment area and a microphone connection area, the terminal deployment area is used to realize the conductive contact between the microphone interface board 60 and the device motherboard 20, and the microphone connection area is used to realize the normal electrical connection between the microphone interface board 60 and the microphone assembly 50 (e.g., microphone signal connector 53), then:

[0131] The terminal deployment area of ​​the microphone interface board 60 is stacked with the interface board support 76 of the integrated mounting component 70, and the terminal deployment area of ​​the microphone interface board 60 is aligned with the area of ​​the device motherboard 20 having signal terminals along the lifting direction (e.g., height direction Z) of the microphone interface board 60 and the microphone assembly 50.

[0132] The microphone connection area of ​​the microphone interface board 60 is closer to the microphone support platform 75 in the horizontal direction (e.g., the width direction X) parallel to the base back plate 13 than the terminal deployment area. For example, it can extend to the outer edge of the interface board support platform 76 near the microphone support platform 75 in the horizontal direction (e.g., the width direction X). Furthermore, the microphone connection area of ​​the microphone interface board 60 is offset from the microphone support platform 75 in the lifting direction (e.g., the height direction Z) of the microphone interface board 60 and the microphone assembly 50. For example, the microphone connection area of ​​the microphone interface board 60 can be located below the microphone support platform 75.

[0133] The microphone signal connector 53 of the microphone assembly 50 is located below the microphone support platform 75 of the integrated device component 70. That is, the microphone support platform 75 is close to the microphone support platform 75 in the lifting direction (e.g., height direction Z) of the microphone interface board 60 and the microphone assembly 50. Thus, the microphone signal connector 53 of the microphone assembly 50 can be adjacent to the microphone connection area of ​​the microphone interface board 60. Furthermore, the microphone signal connector 53 and the microphone connection area of ​​the microphone interface board 60 are normally electrically connected to each other, so as to realize the normal electrical connection between the microphone interface board 60 and the microphone assembly 50.

[0134] For example, in an embodiment of this application, the integrated mounting component 70 may include a plate-shaped component body 71. In this case, the integrated mounting component 70 may be made of sheet metal. Furthermore, the mounting lug 73, interface plate support 76, and microphone support 75 of the integrated mounting component 70 may all be bent and flanged at the edge of the component body 71. This simplifies the structural design of the integrated mounting component 70 and reduces its manufacturing cost.

[0135] It is understood that the embodiments of this application merely use the integrated mounting component 70 as an example to provide a feasible method for the synchronous raising and lowering of the microphone interface board 60 and the microphone assembly 50, and are not intended to limit the synchronous raising and lowering of the microphone interface board 60 and the microphone assembly 50 to depend on the integrated mounting component 70. That is, the synchronous raising and lowering of the microphone interface board 60 and the microphone assembly 50 can be achieved by any connection structure, and the embodiments of this application do not exhaustively describe them.

[0136] For example, in the embodiments of this application, the conductive contact between the microphone interface board 60 (e.g., the second PCB) and the device motherboard 20 (e.g., the first PCB) is not normal, and the conductive contact between the microphone interface board 60 (e.g., the second PCB) and the device motherboard 20 (e.g., the first PCB) can be activated or deactivated by the synchronous raising and lowering of the microphone interface board 60 (e.g., the second PCB) and the microphone assembly 50.

[0137] Exemplarily, in an embodiment of this application, the microphone interface board 60 is positioned such that the microphone assembly 50 is in a position as described above. Figure 3 When in the low-position storage state shown, it can be physically separated from the device motherboard 20. At this time, the conductive contact between the microphone interface board 60 (e.g., the second PCB) and the device motherboard 20 (e.g., the first PCB) is released.

[0138] For example, in an embodiment of this application, the device motherboard 20's control over the lifting of the microphone assembly 50 may include positioning the microphone assembly 50 at its height when it is in a low-position retracted state. In this case, a sensing component 130 may also be fixed inside the device base 10. For example, the sensing component 130 may include any sensor capable of sensing a target object, such as a photoelectric sensor or a Hall sensor, and the sensing component 130 may be fixed to the base side plate 13. The sensing range of the sensing component 130 may cover the target descent height of the microphone assembly 50 when it is in a low-position retracted state, and the device motherboard 20 may be used to position the microphone assembly 50 in the low-position retracted state to the target descent height based on the sensing result of the sensing component 130.

[0139] For example, in the embodiments of this application, the target descent height of the positioning microphone assembly 50 in the low-position storage state can be characterized by the height of the bottom end of the microphone support rod 52 or the height of the integrated mounting component 70.

[0140] Exemplarily, in an embodiment of this application, the microphone interface board 60 is positioned such that the microphone assembly 50 is in a position as described above. Figure 4 In the high-exposed state shown, the microphone assembly 50 generates analog audio signals to the device motherboard 20 through conductive contact with the motherboard 20. That is, the microphone interface board 60 is in the position where the microphone assembly 50 is exposed. Figure 4 When exposed in a high position as shown, it should form a conductive contact with the mainboard 20 of the device.

[0141] For example, in an embodiment of this application, the lifting control of the microphone assembly 50 by the device motherboard 20 may include height positioning of the microphone assembly 50 in a high-exposed state. Furthermore, the device motherboard 20 may also be used to: detect the contact state of the conductive contacts between the microphone interface board 60 and the device motherboard 20, and, based on the detection result of the contact state, position the target height of the microphone assembly 50 in the high-exposed state. That is, the target height of the microphone assembly 50 in the high-exposed state is positioned by the device motherboard 20 based on the successful detection of the conductive contacts between the microphone interface board 60 (e.g., the second PCB) and the device motherboard 20 (e.g., the first PCB), and the target height of the microphone assembly 50 in the high-exposed state ensures that the conductive contacts between the microphone interface board 60 and the device motherboard 20 remain active.

[0142] For example, in an embodiment of this application, the target height of the positioning microphone assembly 50 in a high exposed state can be characterized by the height of the bottom end of the microphone support rod 52 or the height of the integrated mounting component 70.

[0143] As can be seen above, based on the embodiments of this application, the audio acquisition device may include a microphone interface board 60 that rises and falls synchronously with the microphone assembly 50. This microphone interface board 60 can make conductive contact with the device motherboard 20 when the microphone assembly 50 is in a high-exposed state. Based on this conductive contact between the microphone interface board 60 and the device motherboard 20, the microphone assembly 50 can generate analog audio signals to the device motherboard 20 when in a high-exposed state. Therefore, electrical connection between the microphone assembly 50 and the device motherboard 20 in a high-exposed state can be achieved without a dynamic flexible conductive medium, thus facilitating the miniaturization of the audio acquisition device. Furthermore, the target height of the microphone assembly 50 in the high-exposed state can be positioned by the device motherboard 20 based on the successful detection of the conductive contact between the microphone interface board 60 and the device motherboard 20. This ensures the stability of the electrical connection between the microphone assembly 50 and the device motherboard 20 in a high-exposed state, thereby improving the audio acquisition reliability of the audio acquisition device. Therefore, the embodiments of this application can balance the miniaturization of the audio acquisition device and the reliability of audio acquisition while supporting the raising and lowering of the microphone assembly 50.

[0144] Furthermore, since the embodiments of this application do not require the use of a dynamic flexible conductive medium to achieve electrical connection between the microphone assembly and the device motherboard, the embodiments of this application can also eliminate the need for a dynamic flexible conductive medium, thereby reducing the equipment cost of the audio acquisition device and improving the equipment assembly efficiency of the audio acquisition device.

[0145] For example, in the embodiments of this application, if a rigid contact is used between the microphone interface board 60 and the device motherboard 20, it may cause the conductive contact between the microphone interface board 60 and the device motherboard 20 to become intermittent. For example, as mentioned above, the conductive contact between the microphone interface board 60 and the device motherboard 20 may include terminal contacts between multiple terminal pairs, and the rigid contact between the microphone interface board 60 and the device motherboard 20 may affect the synchronicity of the terminal contacts between multiple terminal pairs, thereby causing at least one terminal pair to become intermittent. In order to avoid the conductive contact between the microphone interface board 60 and the device motherboard 20 becoming intermittent, in the embodiments of this application, the conductive contact between the microphone interface board 60 and the device motherboard 20 may be configured to have an elastic margin, and the target height of the microphone assembly 50 in the high-exposed state may compress this elastic margin to compensate for the synchronicity difference of the terminal contacts between multiple terminal pairs, thereby ensuring that the conductive contact between the microphone interface board 60 and the device motherboard 20 remains effective in a state of elastic contact.

[0146] For example, in embodiments of this application, the synchronicity difference of terminal contacts among multiple terminal pairs may include the following: Since the positional spacing between each pair of signal terminals located on the device motherboard 20 and the microphone interface board 60 in the lifting direction of the microphone assembly 50 is not entirely the same, for example, the positional spacing between each pair of signal terminals located on the device motherboard 20 and the microphone interface board 60 in the lifting direction of the microphone assembly 50 may be due to processing errors of the signal terminals and / or assembly errors on the board surface; therefore, when the microphone interface board 60 rises to a height adjacent to the device motherboard 20, the signal terminals in some terminal pairs located on the device motherboard 20 and the microphone interface board 60 make paired conductive contact, and at least one other terminal pair fails to make contact due to a large positional spacing between the signal terminals in the lifting direction of the microphone assembly 50. In this case, compression of the elastic margin can eliminate the positional spacing between each pair of signal terminals in the lifting direction of the microphone assembly 50, thereby compensating for the synchronicity difference of terminal contacts among multiple terminal pairs.

[0147] For example, in an embodiment of this application, if the conductive contact between the microphone interface board 60 and the device motherboard 20 includes terminal contacts that occur synchronously between multiple terminal pairs, and the two signal terminals of each terminal pair are respectively arranged on the microphone interface board 60 (i.e., the terminal deployment area) and the device motherboard 20, then the two signal terminals of each terminal pair include a metal contact and a spring probe (Pogopin), and the spring probe of each terminal pair can be used to provide elastic margin for the terminal contact of the terminal pair.

[0148] Exemplarily, in embodiments of this application, each of the plurality of terminal pairs includes a spring probe that may be parallel to the lifting direction of the microphone assembly 50, and the nominal length of each spring probe in the plurality of terminal pairs in the lifting direction of the microphone assembly 50 may be the same. In this case, processing errors of the signal terminals and / or assembly errors on the board surface may result in length errors of each spring probe in the plurality of terminal pairs and / or insertion depth errors of the spring probes on the board surface.

[0149] Figure 5 This is a schematic diagram of the anti-loose connection structure of the audio acquisition device in this application embodiment. Please refer to... Figure 5 In embodiments of this application, one signal terminal in each terminal pair located on the microphone interface board 60 (e.g., the terminal deployment area) may include a spring probe 62, and the other signal terminal in each terminal pair located on the device motherboard 20 may include a metal contact 26.

[0150] It is understood that in the embodiments of this application, the positions of the spring probe and the metal contact can also be interchanged. That is, one signal terminal in each terminal pair located on the microphone interface board 60 (e.g., the terminal deployment area) may include a metal contact, and the other signal terminal in each terminal pair located on the device motherboard 20 may include a spring probe.

[0151] Figure 6 This is a schematic diagram of the topology of the signal terminals of the audio acquisition device in an embodiment of this application. Please refer to... Figure 6 In the embodiments of this application, if the conductive contact between the microphone interface board 60 and the device motherboard 20 includes terminal contacts occurring synchronously between multiple terminal pairs, and the two signal terminals of each terminal pair are respectively arranged on the microphone interface board 60 (e.g., the terminal deployment area) and the device motherboard 20, then the multiple terminal pairs may include a first terminal pair. For example, a pair of signal terminals in the first terminal pair may include a detection terminal DET located on the device motherboard 20 and a clamping terminal SET located on the microphone interface board 60 (e.g., the terminal deployment area). Furthermore, the device motherboard 20 may determine the detection result of the conductive contact between the microphone interface board 60 and the device motherboard 20 by detecting the terminal contact of the first terminal pair, that is, determine the detection result of the terminal release between all terminal pairs of the microphone interface board 60 and the device motherboard 20.

[0152] Exemplarily, in embodiments of this application, the aforementioned first terminal pair (e.g., detection terminal DET and clamping terminal SET) can be independent of the operating circuit of the microphone assembly 50. For example, the operating circuit of the microphone assembly 50 may include a power supply circuit 511 for powering the microphone assembly 50 (e.g., the pickup element in the microphone tip 51) and an output circuit 512 for outputting an analog audio signal Sig_aud from the microphone assembly 50 (e.g., the pickup element in the microphone tip 51). Therefore, the detection of the conductive contact between the microphone interface board 60 and the device motherboard 20 by the device motherboard 20 can be avoided from interference by the operating circuit of the microphone assembly 50.

[0153] For example, in an embodiment of this application, the detection terminal DET of the device motherboard 20 can be used to generate a detection signal Sig_det. The default level of the detection signal Sig_det can be a first level, that is, the detection signal Sig_det can be at the default first level when the microphone interface board 60 is physically separated from the device motherboard 20. The first level can be at the same potential as the I / O voltage of the device motherboard 20, and the first level is used to characterize the physical separation of the microphone interface board 60 from the device motherboard 20 (i.e., the conductive contact is in a failed state of being released); the clamping terminal S of the microphone interface board 60 ET is used to set the detection signal Sig_det generated by the detection terminal DET of the device motherboard 20 to a second level by contacting the terminal of the detection terminal DET of the device motherboard 20. For example, the clamping terminal SET of the microphone interface board 60 can be grounded, and the second level can be at the same potential as the ground level of the microphone interface board 60. In response to the second level of the detection signal Sig_det, the device motherboard 20 can determine the successful detection of the conductive contact between the microphone interface board 60 and the device motherboard 20, that is, determine that the conductive contact between the microphone interface board 60 and the device motherboard 20 is effective.

[0154] See also Figure 6 In embodiments of this application, multiple terminal pairs may further include second terminal pairs. For example, a pair of signal terminals in the second terminal pair may include a power terminal ADDV located on the device motherboard 20 and a coupling terminal CP located on the microphone interface board 60 (e.g., the terminal deployment area). Furthermore, when terminal contact occurs, the second terminal pair can connect the working circuit of the microphone assembly 50 (e.g., the power supply circuit 511 and the output circuit 512) to the device motherboard 20, thereby enabling terminal multiplexing for power supply and signal output.

[0155] For example, in the embodiments of this application, the power supply terminal ADDV of the device motherboard 20 can be connected to the motherboard power supply 21 of the device motherboard 20 and the signal processing circuit 22 of the device motherboard 20; the coupling terminal CP of the microphone interface board 60 can be connected to the power supply circuit 511 and the output circuit 512 of the microphone assembly 50; and the terminal contact between the power supply terminal ADDV of the device motherboard 20 and the coupling terminal CP of the microphone interface board 60 can be used to: supply power to the microphone assembly 50 (e.g., the pickup element of the microphone tip 51) using the power supply circuit 511, and transmit the analog audio signal Sig_aud generated by the microphone assembly 50 (e.g., the pickup element of the microphone tip 51) to the signal processing circuit 22 of the device motherboard 20 with the power signal generated by the power supply terminal ADDV of the device motherboard 20 as the carrier. For example, the signal processing circuit 22 may include a filtering and amplification circuit, and the filtering and amplification circuit can be used to filter out the carrier and then amplify the remaining analog audio signal Sig_aud.

[0156] See also Figure 6 In embodiments of this application, the microphone assembly 50 may be equipped with an indicator light 55, which may include a light-emitting element such as an LED (Light Emitting Diode). In this case, the multiple terminal pairs may also include a third terminal pair. For example, a pair of signal terminals in the third terminal pair may include a lighting control terminal CTR located on the device motherboard 20 and a driver terminal DRV located on the microphone interface board 60 (e.g., the terminal deployment area). The third terminal pair can control the indicator light 55 to light up when terminal contact occurs. For example, the lighting control terminal CTR of the device motherboard 20 can be used to generate a drive current I_led, and the driver terminal DRV of the microphone interface board 60 can be connected to the indicator light 55. Furthermore, when the driver terminal DRV of the microphone interface board 60 contacts the terminal of the lighting control terminal CTR of the device motherboard 20, it can be used to light up the indicator light 55 using the drive current I_led. The device motherboard 20 can control the indicator light 55 to light up when the microphone assembly 50 is in a high-exposed state.

[0157] See also Figure 6 In embodiments of this application, the plurality of terminal pairs may further include a fourth terminal pair. For example, a pair of signal terminals in the fourth terminal pair may include a first ground terminal AGND located on the device motherboard 20 and a second ground terminal GND located on the microphone interface board 60 (e.g., the terminal deployment area). The terminal contacts of the fourth terminal pair are used to realize the common ground of the device motherboard 20 and the microphone interface board 60.

[0158] Exemplary, in embodiments of this application, the third terminal pair can be selectively configured depending on whether the microphone assembly 50 includes an indicator light 55. The common grounding implemented by the fourth terminal pair can also be achieved through other alternative methods. For example, the device motherboard 20 and the microphone interface board 60 can share a common ground using the device base 10 as the conductive medium. Therefore, both the third and fourth terminal pairs are optional. Compared to the third and fourth terminal pairs, the detection of conductive contact implemented by the first terminal pair and the access to the working circuit implemented by the second terminal pair are more important functions. Therefore, in embodiments of this application, such as... Figure 6 As shown, at least one of the first terminal pair and the second terminal pair described above can be redundantly configured as two pairs.

[0159] Exemplarily, in the embodiments of this application, as described above, if the microphone support rod 52 of the microphone assembly 50 is flexible, for example, the microphone support rod 52 includes a gooseneck rod, then the microphone support rod 52 can be freely bent only when the microphone assembly 50 is in a high exposed state (i.e., extending above the base top plate 12), and the microphone support rod 52 can be kept straight when the microphone assembly 50 is in a low retracted state (i.e., retracted below the base top plate 12). In order to facilitate the automatic straightening and correction of the microphone support rod 52 during the process of switching the microphone assembly 50 from a high exposed state to a low retracted state, in the embodiments of this application, a straightening member 15 may also be installed in the device base 10, and the straightening member 15 is used to straighten and correct the microphone support rod 52 during the process of switching the microphone assembly 50 from a high exposed state to a low retracted state.

[0160] For example, in an embodiment of this application, as described above, the base top plate 12 of the device base 10 may have a top through hole 120, and the top through hole 120 may be used for the microphone tip 51 and the microphone support rod 52 to pass through.

[0161] Exemplarily, in an embodiment of this application, the straightening member 15 may extend parallel to the lifting direction (e.g., the height direction Z) of the microphone assembly 50 and the microphone interface board 60. The top of the straightening member 15 may have a correction hole seat 150, which may be coaxially arranged with the top through hole 120. The microphone support rod 52 is movably inserted through the correction hole seat 150, and the microphone tip 51 is located above the correction hole seat 150. In this case, the straightening and correction of the microphone support rod 52 performed by the straightening member 15 during the switching process of the microphone assembly 50 from a high exposed state to a low retracted state can be achieved using the correction hole seat 150.

[0162] Exemplarily, in an embodiment of this application, when the microphone assembly 50 is in a high-exposed state, the straightening hole seat 150 of the straightening member 15 can abut against the bottom of the base top plate 12, and the microphone support rod 52 extends through the top through hole 120 above the base top plate 12, thereby releasing the bending freedom of the microphone support rod 52. In this case, during the process of switching the microphone assembly 50 from a high-exposed state to a low-retracted state, the section of the microphone support rod 52 that passes through the straightening hole seat 150 into the device base 10 can be retracted into the device base 10 in a straightened state, thereby realizing the straightening and correction of the microphone support rod 52.

[0163] For example, in an embodiment of this application, when the microphone assembly 50 is in a low-position storage state, the microphone tip 51 can be snapped onto the top of the correction hole seat 150. The snapping engagement between the microphone tip 51 and the correction hole seat 150 can cause the top end of the microphone support rod 52 to be subjected to an upward pulling force. At the same time, the bottom end of the microphone support rod 52 can also withstand the downward pulling force of the integrated mounting component 70. Furthermore, the microphone support rod 52 remains straight based on the opposite upward and downward pulling forces.

[0164] For example, in the embodiments of this application, the straightening member 15 can move parallel to the lifting direction (e.g., height direction Z) of the microphone assembly 50 and the microphone interface plate 60. For example, the straightening member 15 can be slidably mounted on the base back plate 13 of the device base 10, and the straightening member 15 can move parallel to the lifting direction (e.g., height direction Z) of the microphone assembly 50 and the microphone interface plate 60 by means of sliding cooperation with the base back plate 13.

[0165] Figure 7 This is a schematic diagram of the rising process of the microphone assembly of the audio acquisition device in the embodiments of this application. Figure 8 This is a schematic diagram illustrating the descent process of the microphone assembly of the audio acquisition device in an embodiment of this application. Please refer to [link / reference]. Figure 7 and Figure 8 In the embodiments of this application, the straightening member 15 can normally bear the first elastic force F1. For example, the straightening member 15 and the base back plate 13 can be connected by a first spring (not shown in the figure), and the first spring is used to generate the first elastic force F1 on the straightening member 15, and the first elastic force F1 is used to cause the straightening member (15) to move upward.

[0166] like Figure 7 As shown, when the microphone assembly 50 is in the low-position retracted state:

[0167] The microphone tip 51 is snapped onto the correction hole seat 150 of the straightening member 15, and the first elastic force F1 generates an upward pulling force on the top of the microphone support rod 52 through the snapping engagement between the microphone tip 51 and the correction hole seat 150 of the straightening member 15.

[0168] The bottom end of the microphone support rod 52 is subjected to a downward force (e.g., a downward force generated by the integrated mounting component 70), and the microphone support rod 52 remains straight based on the upward and downward forces in opposite directions applied to the top and bottom ends, respectively.

[0169] Furthermore, the straightening member 15's correction hole seat 150 is also subjected to a locking force F5 from the microphone end 51, which can keep the straightening member 15 stationary relative to the microphone assembly 50 and the microphone interface board 60 while the microphone strut 52 remains in a straightened state.

[0170] See also Figure 7 During the process of microphone assembly 50 switching from a low-position retracted state to a high-position exposed state:

[0171] The straightening member 15 remains stationary relative to the microphone assembly 50, the microphone interface board 60, and the integrated mounting member 70. Therefore, as the microphone assembly 50 and the microphone interface board 60 rise synchronously (e.g., rise synchronously under the drive of the integrated mounting member 70), the straightening member 15 rises synchronously with the microphone assembly 50 and the microphone interface board 60 under the first elastic force F1 until the straightening member 15's correction hole seat 150 abuts against the bottom of the base top plate 12. At this time, the microphone tip 51 protrudes above the base top plate 12 through the top through hole 120 of the base top plate 12.

[0172] After the microphone tip 51 extends above the base top plate 12, it will continue to rise. The microphone tip 51 can disengage from the correction hole seat 150 that is abutted against the base top plate 12 and continue to rise until the microphone support rod 52 extends through the top through hole 120 and extends above the base top plate 12. That is, the microphone assembly 50 is in a high exposed state. At this time, the microphone interface board 60 can make conductive contact with the device motherboard 20 below the base top plate 12.

[0173] When the microphone assembly 50 is in a high exposed position, the upward pulling force on the top of the microphone support rod 52 disappears as the microphone end 51 disengages from the correction hole seat 150, thus releasing the bending freedom of the microphone support rod 52, that is, the microphone support rod 52 can be bent freely.

[0174] like Figure 8 As shown, during the process of the microphone assembly 50 switching from a high-position exposed state to a low-position retracted state:

[0175] The microphone support rod 52 passes through the rod segment of the straightening member 15's correction hole seat 150 and can be retracted into the device base 10 in a straightened state based on the correction of the correction hole seat 150 (i.e., retracted to below the base top plate 12) until the microphone end 51 is re-engaged with the straightening member 15's correction hole seat 150.

[0176] After the microphone tip 51 re-engages with the straightening member 15's correction hole seat 150, it retracts into the device base 10 (i.e., retracts to below the base top plate 12). This allows the straightening member 15 to overcome the first elastic force based on the engagement between the microphone tip 51 and the correction hole seat 150, and to descend synchronously with the microphone assembly 50 and the microphone interface board 60.

[0177] See also Figure 8 When the microphone assembly 50 returns to its low-position storage state, the microphone support rod 52 returns to its straightened state based on the opposite upward and downward pulling forces exerted on its top and bottom ends, respectively.

[0178] Exemplary, in an embodiment of this application, a movable flip cover 16 may also be installed inside the device base 10, wherein:

[0179] When the microphone assembly 50 is in a high exposed position, the movable flip cover 16 can cover the top through hole 120 of the device base 10;

[0180] During the transition of the microphone assembly 50 from a low-position retracted state to a high-position exposed state, the movable flip cover 16 can open the top through-hole 120 of the device base 10 before the microphone tip 51 reaches the top through-hole 120.

[0181] When the microphone assembly 50 is in a high exposed position, the active flip cover 16 can keep the top through-hole 120 open.

[0182] During the transition of the microphone assembly 50 from a high exposed state to a low retracted state, the movable flip cover 16 can restore the cover on the top through-hole 120 after the microphone end 51 is retracted into the device base 10 (i.e. below the base top plate 12) through the top through-hole 120.

[0183] Therefore, in the embodiments of this application, the movable flip cover 16 can provide internal sealing protection for the device base 10 when the microphone assembly 50 is in a low-position storage state without obstructing the lifting and lowering of the microphone assembly 50; while when the microphone assembly 50 is in a high-position exposed state, the correction hole seat 150 abutting below the base top plate 12 of the device base 10 can block the radial gap between the microphone support rod 52 and the top through hole 120, thereby providing internal sealing protection for the device base 10 when the microphone assembly 50 is in a high-position exposed state.

[0184] For example, in an embodiment of this application, the movable flip cover 16 can be movably mounted below the base top plate 120. The movable flip cover 16 can be covered by external force to seal the top through hole 120. The movable flip cover 16 can be opened by gravity-induced falling when the external force support is removed. Furthermore, the external force support for the movable flip cover 16 can be adaptively activated or deactivated according to the height of the microphone assembly 50 and the microphone interface board 160.

[0185] Figure 9 This is a schematic diagram illustrating the adaptive opening and closing principle of the movable flip cover of the audio acquisition device in this embodiment. Please refer to... Figure 9 In the embodiments of this application, the device base 10 may also be equipped with a flip cover lever 161 and a lever top rod 162.

[0186] Exemplarily, in an embodiment of this application, the flip cover lever 161 may have a first position (e.g., Figure 9 The flip lever 161 is represented by a solid line in the second pose (e.g., the second pose is shown in the second pose). Figure 9 The flip cover lever 161 (indicated by dashed lines) supports the movable flip cover 16 in the first position, sealing the top through-hole 120. In the second position, the flip cover lever 161 removes support from the movable flip cover 16, allowing the movable flip cover 16 to open the top through-hole 120 by falling under gravity. Figure 9 In the illustration, the switching trajectory of the flip cover lever 161 from the first position to the second position, and the switching trajectory of the movable flip cover 16 from the state of sealing the top through hole 120 to the state of opening the top through hole 120, are shown by solid arrows; the switching trajectory of the flip cover lever 161 from the second position to the first position, and the switching trajectory of the movable flip cover 16 from the state of opening the top through hole 120 to the state of sealing the top through hole 120, are shown by dashed arrows.

[0187] For example, in the embodiments of this application, the flip cover lever 161 can avoid the microphone assembly 50, microphone interface board 60, straightening member 15 and integrated mounting member 70 in a horizontal direction (e.g., thickness direction Y) perpendicular to the base back plate 13. The flip cover lever 161 can have a lever pin 166 protruding in a horizontal direction (e.g., thickness direction Y) perpendicular to the base back plate 13. Furthermore, the flip cover lever 161 can use the lever pin 166 to support the top through hole 120 of the flap 16.

[0188] For example, in the embodiments of this application, the paddle lever 162 can move parallel to the lifting direction (e.g., height direction Z) of the microphone assembly 50 and the microphone interface board 60. For example, the paddle lever 162 can be slidably mounted on the base back plate 13 of the device base 10, and the paddle lever 162 can move parallel to the lifting direction (e.g., height direction Z) of the microphone assembly 50 and the microphone interface board 60 by means of sliding cooperation with the base back plate 13.

[0189] Exemplarily, in embodiments of this application, the moving direction of the paddle lever 162 can be parallel to the lifting direction (e.g., the height direction Z) of the microphone assembly 50 and the microphone interface board 60, and the movement of the paddle lever 162 can be used for:

[0190] When the microphone assembly 50 is in a high exposed position, the flip cover lever 161 is placed in the first position, so that the movable flip cover 16 is supported by the flip cover lever 161 (e.g., lever pin 166) to cover the top through hole 120 of the device base 10.

[0191] During the process of switching the microphone assembly 50 from a low-position retracted state to a high-position exposed state, the flip cover lever 161 is moved upward by the solid line upward arrow at the lever 162 in the figure. Before the microphone end 51 reaches the top through hole 120, the flip cover lever 161 (e.g., lever pin 166) removes its support for the movable flip cover 16. Thus, the movable flip cover 16 can open the top through hole 120 of the device base 10 by falling under the action of gravity before the microphone end 51 reaches the top through hole 120.

[0192] When the microphone assembly 50 is in a high exposed position, the flip cover lever 161 is held in the second position so that the movable flip cover 16 can remain in a hanging position with the top through hole 120 open.

[0193] During the process of switching the microphone assembly 50 from a high exposed state to a low retracted state, the flip cover lever 161 is moved downward by the downward arrow at the dotted line at the lever 162 in the figure. After the microphone end 51 is retracted into the device base 10 through the top through hole 120 (i.e., below or below the hanging movable flip cover 16 of the base top plate 12), it returns to the first position. After the movable flip cover 16 is retracted into the device base 10 through the top through hole 120 (i.e., below or below the hanging movable flip cover 16 of the base top plate 12), it restores the cover to the top through hole 120.

[0194] Exemplarily, in an embodiment of this application, the paddle lever 162 can normally withstand a second elastic force F2, and the second elastic force F2 is used to cause the paddle lever 162 to move upward to position the flip paddle 161 in a second position. For example, the paddle lever 162 and the base back plate 13 can be connected by a second spring (not shown in the figures), and the second spring is used to generate a first elastic force F2 on the paddle lever 162. In this case:

[0195] When the microphone assembly 50 is in a high exposed state, the integrated mounting component 70 can press (e.g., the pressing force F7 shown in the figure) the paddle top rod 162 (e.g., the pressing end 163 at the bottom of the paddle top cover 162) to overcome the second elastic force F2 and move downward, so that the paddle top rod 162 puts the flip cover paddle 161 in the first position, and the movable flip cover 16 is supported by the flip cover paddle 161 (e.g., the paddle pin 166) to seal the top through hole 120 of the cover device base 10;

[0196] During the process of switching the microphone assembly 50 from a low-position retracted state to a high-position exposed state, the paddle lever 162 moves upward as shown by the solid upward arrow at the paddle lever 162 in the figure. Driven by the second elastic force F2, the paddle lever 162 rises synchronously with the microphone assembly 50 and the microphone interface board 60 (i.e., the integrated mounting component 70 that follows the applied pressing force F7). This causes the paddle lever 162 to place the flip cover paddle 161 in a second position before the microphone end 51 reaches the top through hole 120. This causes the flip cover paddle 161 (e.g., paddle pin 166) to remove its support for the movable flip cover 16. As a result, the movable flip cover 16 can open the top through hole 120 of the device base 10 by falling under the action of gravity before the microphone end 51 reaches the top through hole 120.

[0197] When the microphone assembly 50 is in a high exposed position, the lever 162, driven by the second elastic force F2, keeps the flip cover lever 161 in the second position, thereby keeping the movable flip cover 16 in a hanging state with the top through hole 120 open.

[0198] During the transition of the microphone assembly 50 from a high exposed state to a low retracted state, the paddle lever 162 restores the downward pressing of the integrated mounting member 70 after the microphone end 51 is retracted into the device base 10 through the top through-hole 120 (i.e., below or below the hanging movable flip cover 16). For example, the downward movement is caused by the integrated mounting member 70 pressing the pressing end 163 at the bottom of the paddle cover 162. Thus, through the downward movement as shown by the downward arrow of the dotted line at the paddle lever 162 in the figure, the paddle lever 162 restores the flip cover paddle 161 to the first position, so that the movable flip cover 16 restores the cover of the top through-hole 120 after the microphone end 51 is retracted into the device base 10 through the top through-hole 120 (i.e., below or below the hanging movable flip cover 16).

[0199] In another embodiment of this application, a lifting control method for a microphone assembly is also provided. The microphone assembly can be applied to an audio acquisition device, which may include a device base, a device motherboard, and a microphone interface board. The lifting control method is used to control the microphone assembly to switch between a low-position retracted state and a high-position exposed state. For example, in the low-position retracted state, the microphone assembly is retracted inside the device base, and in the high-position exposed state, the microphone assembly extends from the top plate of the device base to the outside of the device base. The microphone interface board is normally electrically connected to the microphone assembly. The microphone interface board moves up and down synchronously with the microphone assembly inside the device base. Furthermore, the microphone interface board is physically separated from the device motherboard when the microphone assembly is in the low-position retracted state.

[0200] Figure 10 This is an exemplary flowchart illustrating the microphone assembly lifting control method in an embodiment of this application. Please refer to... Figure 10 The lifting control method in the embodiments of this application may include:

[0201] S1010: After the microphone assembly switches from a low-position retracted state to a high-position exposed state, detect the conductive contact between the microphone interface board and the device motherboard.

[0202] For example, in an embodiment of this application, the conductive contact between the microphone interface board and the device motherboard can be used for: the device motherboard to supply power to the microphone interface board, and the device motherboard to receive analog audio signals generated by the microphone assembly (e.g., the pickup element in the microphone assembly) based on the sound wave of the sound source in the powered state through the microphone interface board.

[0203] S1030: Based on the successful detection of conductive contact between the microphone interface board and the device motherboard, locate the target height of the microphone assembly in the high-exposed state.

[0204] For example, in an embodiment of this application, the conductive contact between the microphone interface board and the device motherboard may include terminal contacts between multiple terminal pairs, and two signal terminals in each of the multiple terminal pairs are respectively arranged on the microphone interface board and the device motherboard. In this case, S1010 can detect the terminal contact of the first terminal pair, and S1030 can determine the detection result of the conductive contact between the microphone interface board and the device motherboard (e.g., the detection result of the terminal contact of all terminal pairs) based on the detection result of the terminal contact of the first terminal pair. The first terminal pair may be independently located outside the operating circuit of the microphone interface board and the microphone assembly to avoid interference from the operating circuit on the detection result.

[0205] For example, in an embodiment of this application, the microphone assembly in a high-position exposed state can generate analog audio signals to the device motherboard based on the sound waves from the sound source through conductive contact with the device motherboard.

[0206] Based on the embodiments of this application, when the microphone assembly is in a high-exposed state, the audio acquisition device can make conductive contact with the device motherboard using a microphone interface board that rises and falls synchronously with the microphone assembly. Therefore, electrical connection between the microphone assembly and the device motherboard in a high-exposed state can be achieved without a dynamic flexible conductive medium, thus facilitating the miniaturization of the audio acquisition device. Furthermore, the target height of the microphone assembly in the high-exposed state can be determined by the device motherboard based on successful detection of the conductive contact between the microphone interface board and the device motherboard, thereby ensuring the stability of the electrical connection between the microphone assembly and the device motherboard in the high-exposed state and improving the audio acquisition reliability of the audio acquisition device. Therefore, the embodiments of this application can balance device miniaturization and audio acquisition reliability while supporting a height-adjustable microphone assembly.

[0207] Furthermore, since the embodiments of this application do not require the use of a dynamic flexible conductive medium to achieve electrical connection between the microphone assembly and the device motherboard, the embodiments of this application can also eliminate the need for a dynamic flexible conductive medium, thereby reducing the equipment cost of the audio acquisition device and improving the equipment assembly efficiency of the audio acquisition device.

[0208] Figure 11 This is an extended flowchart illustrating the microphone assembly lifting control method in the embodiments of this application. Please refer to... Figure 11 In embodiments of this application, the lifting control method may further include:

[0209] S1110: After the microphone assembly is switched from a high-position exposed state to a low-position retracted state, the sensing result of the sensing component is detected. The sensing component is fixed in the device base of the audio acquisition device, and the sensing range of the sensing component can cover the target height of the microphone assembly when it is in the low-position retracted state.

[0210] S1130: Based on the sensing results of the sensing component, the microphone component, which is in a low-position storage state, is positioned to the target descent height.

[0211] Based on the above process, the automatic positioning of the microphone component when it is in a low-position storage state can be avoided.

[0212] For example, the lifting control method described above in the embodiments of this application can be executed by the device motherboard. Furthermore, the physical structure and circuit structure on which the conductive contact detected in the lifting control method is based, as well as the installation position of the sensing component, can be found in the previous description of the audio acquisition device, and will not be repeated here.

[0213] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. An audio acquisition device, characterized in that, include: Equipment base (10); The device motherboard (20) is fixedly installed inside the device base (10); The microphone assembly (50) is controlled by the device motherboard (20) and can switch between a low-position retracted state and a high-position exposed state relative to the device base (10). A microphone interface board (60) is movably located inside the device base (10). The microphone interface board (60) is normally electrically connected to the microphone assembly (50). Furthermore, the microphone interface board (60) moves synchronously with the microphone assembly (50) below the device motherboard (20). in: When the microphone assembly (50) is in the low-position storage state, the microphone interface board (60) is physically separated from the device motherboard (20); When the microphone assembly (50) is in the high-position exposed state, the microphone interface board (60) causes the microphone assembly (50) to generate an analog audio signal to the device motherboard (20) through conductive contact with the device motherboard (20); The target height of the microphone assembly (50) in the high-exposed state is determined by the device motherboard (20) based on the successful detection of the conductive contact.

2. The audio acquisition device according to claim 1, characterized in that, The conductive contact has an elastic margin, and the target height for rising is positioned such that the elastic margin is compressed.

3. The audio acquisition device according to claim 2, characterized in that, The conductive contact includes terminal contacts that occur synchronously between multiple terminal pairs, and the two signal terminals in each of the multiple terminal pairs are respectively arranged on the microphone interface board (60) and the device motherboard (20); In each of the plurality of terminal pairs, the two signal terminals respectively include a metal contact and a spring probe, and the spring probe in each of the plurality of terminal pairs is used to provide the elastic margin for the terminal contact of the terminal pair.

4. The audio acquisition device according to claim 1, characterized in that, The conductive contact includes terminal contacts between multiple terminal pairs, and the two signal terminals in each of the multiple terminal pairs are respectively arranged on the microphone interface board (60) and the device motherboard (20); The plurality of terminal pairs includes a first terminal pair, which is independent of the operating circuit of the microphone assembly (50); The device motherboard (20) determines the detection result of the conductive contact by detecting the terminal contact through the first terminal pair.

5. The audio acquisition device according to claim 4, characterized in that, The first terminal pair includes: a detection terminal located on the device motherboard (20) and a clamping terminal located on the microphone interface board (60); wherein: the detection terminal is used to generate a detection signal, the default level of the detection signal is a first level, and the first level is used to characterize the physical separation of the microphone interface board (60) from the device motherboard (20); the clamping terminal is used to set the detection signal to a second level by contacting the terminal of the detection terminal; and the device motherboard (20) determines successful detection of the conductive contact in response to the second level of the detection signal; And / or, The first terminal pair is redundantly configured into two pairs; And / or, The plurality of terminals also includes a second terminal pair, and the second terminal pair connects the operating circuit to the device motherboard (20) when terminal contact occurs; wherein the second terminal pair includes: a power terminal located on the device motherboard (20) and a coupling terminal located on the microphone interface board (60); wherein: the power terminal is connected to the motherboard power supply of the device motherboard (20) and the signal processing circuit of the device motherboard (20); the coupling terminal is connected to the power supply circuit and the output circuit; and the terminal contact between the power terminal and the coupling terminal is used to: power the microphone assembly (50) using the power supply circuit, and to transmit the analog audio signal generated by the microphone assembly (50) to the signal processing circuit with the power signal generated by the power terminal as the carrier; the second terminal pair is redundantly configured as two pairs; And / or, The working circuit includes: a power supply circuit for powering the microphone assembly (50), and an output circuit for the microphone assembly (50) to output the analog audio signal; And / or, The plurality of terminals also includes a third terminal pair, the microphone assembly (50) is equipped with an indicator light, and the third terminal pair controls the indicator light to illuminate when terminal contact occurs; wherein: the third terminal pair includes a light control terminal located on the device motherboard (20) and a drive terminal located on the microphone interface board (60); the light control terminal is used to generate a drive current, the drive terminal is connected to the indicator light, and the drive terminal makes terminal contact with the light control terminal to illuminate the indicator light using the drive current; And / or, The plurality of terminals also includes a fourth terminal pair, which is used to enable the common ground of the device motherboard (20) and the microphone interface board (60) when terminal contact occurs.

6. The audio acquisition device according to claim 1, characterized in that, Both the microphone interface board (60) and the microphone assembly (50) are mounted on the integrated mounting component (70); The device motherboard (20) controls the lifting and lowering of the integrated mounting component (70) within the device base (10) to achieve synchronous lifting and lowering control of the microphone interface board (60) and the microphone assembly (50).

7. The audio acquisition device according to claim 6, characterized in that, The integrated mounting component (70) includes an interface board support platform (76) and a microphone support platform (75). The microphone interface board (60) is fixedly mounted on the interface board support platform (76), and the microphone assembly (50) is fixedly mounted on the microphone support platform (75). Furthermore, the interface board support platform (76) and the microphone support platform (75) are staggered in the lifting direction of the microphone interface board (60) and the microphone assembly (50), as well as in the horizontal direction perpendicular to the lifting direction. in: The microphone interface board (60) has a terminal deployment area and a microphone connection area. The terminal deployment area is used to make conductive contact with the device motherboard (20), and the terminal deployment area is stacked with the interface board support (76). The microphone connection area is close to the microphone support (75) in the horizontal direction relative to the terminal deployment area, and the microphone connection area is offset from the microphone support (75) in the vertical direction. The microphone assembly (50) has a microphone signal connector (53) located on the side of the microphone support platform (75) in the lifting direction close to the microphone support platform (75). The microphone signal connector (53) is normally electrically connected to the microphone connection area adjacent to each other to realize the normal electrical connection between the microphone interface board (60) and the microphone assembly (50).

8. The audio acquisition device according to claim 6, characterized in that, The equipment base (10) is equipped with a lifting mechanism (30), wherein: The lifting mechanism (30) includes a power component (31) and a transmission component (33). The power component (31) is controlled by the device motherboard (20). The power component (31) is used to generate power output. The power output is used to drive the conveyor belt (333) of the transmission component (33) to move parallel to the lifting direction of the microphone interface board (60) and the microphone assembly (50). The integrated mounting component (70) is fixedly mounted on the conveyor belt (333) to lift and lower under the control of the device motherboard (20). The lifting mechanism (30) further includes a support rail (35) and a support slider (36). The support rail (35) is fixed inside the equipment base (10) and is parallel to the lifting direction. The support slider (36) is slidably mounted on the support rail (35) and is fixedly connected to the integrated assembly (70). The support rail (35) provides anti-shaking support for the lifting movement of the integrated assembly (70) by means of the support slider (36). The conveyor belt (333) is fixedly equipped with a lifting plate (337). The integrated mounting component (70) has a mounting lug (73). The integrated mounting component (70) is fixedly mounted on the conveyor belt (333) by means of the mounting lug (73) and the lifting plate (337). Furthermore, the support slider (36) is fixedly connected to the integrated mounting component (70) by means of the fixed connection with the lifting plate (337), thereby achieving a fixed connection with the integrated mounting component (70) and providing anti-shaking support for the integrated mounting component (70).

9. The audio acquisition device according to claim 6, characterized in that, The microphone assembly (50) includes a microphone tip (51) and a microphone support rod (52). The microphone tip (51) is located at the top of the microphone support rod (52). The bottom end of the microphone support rod (52) is fixedly connected to the upper part of the integrated mounting component (70). When the microphone assembly (50) is in the low-position storage state, both the microphone tip (51) and the microphone support rod (52) are located inside the device base (10). When the microphone assembly (50) is in the high-position exposed state, both the microphone tip (51) and the microphone support rod (52) extend above the base top plate (12) of the device base (10). Furthermore, the microphone support rod (52) is bendable. The device base (10) is also equipped with a straightening member (15), and the straightening member (15) is used to straighten and correct the microphone support rod (52) during the switching process of the microphone assembly (50) from the high exposed state to the low retracted state.

10. The audio acquisition device according to claim 9, characterized in that, The base top plate (12) has a top through hole (120), and the top through hole (120) is used for the microphone tip (51) and the microphone support rod (52) to pass through; The top of the straightening member (15) has a correction hole seat (150), the correction hole seat (150) is coaxially arranged with the top through hole (120), the microphone support rod (52) is movably inserted through the correction hole seat (150), and the microphone end (51) is located above the correction hole seat (150). in: When the microphone assembly (50) is in the high exposed state, the correction hole seat (150) abuts against the bottom of the base top plate (12), and the microphone support rod (52) extends through the top through hole (120) above the base top plate (12), thereby releasing the bending freedom of the microphone support rod (52). During the process of switching the microphone assembly (50) from the high exposed state to the low retracted state, the microphone support rod (52) passes through the correction hole seat (150) and enters the rod section of the device base (10) and is retracted into the device base (10) in a straightened state.

11. The audio acquisition device according to claim 10, characterized in that, When the microphone assembly (50) is in the low-position storage state, the microphone tip (51) is snapped onto the correction hole seat (150). The snapping of the microphone tip (51) and the correction hole seat (150) is used to subject the top end of the microphone support rod (52) to an upward pulling force, and the bottom end of the microphone support rod (52) to a downward pulling force from the integrated mounting component (70). Furthermore, the microphone support rod (52) remains straight based on the upward and downward pulling forces in opposite directions.

12. The audio acquisition device according to claim 11, characterized in that, The straightening member (15) normally bears a first elastic force, which is used to cause the straightening member (15) to move upward, and the direction of movement of the straightening member (15) is parallel to the lifting direction of the microphone interface board (60) and the microphone assembly (50); When the microphone assembly (50) is in the low-position storage state, the first elastic force generates the upward pulling force on the top of the microphone support rod (52) through the snap-fit ​​engagement between the microphone end (51) and the correction hole seat (150); During the process of the microphone assembly (50) switching from the low-position retracted state to the high-position exposed state, the straightening member (15) rises synchronously with the microphone assembly (50) and the microphone interface board (60) under the drive of the first elastic force until the correction hole seat (150) abuts against the bottom of the base top plate (12), and the microphone tip (51) continues to rise after passing through the top through hole (120) and extending above the base top plate (12), until the microphone support rod (52) passes through the top through hole (120) and extends above the base top plate (12); When the microphone assembly (50) is in the high exposed state, the upward pulling force disappears because the microphone end (51) is disengaged from the correction hole seat (150), thereby releasing the bending freedom of the microphone support rod (52). During the process of the microphone assembly (50) switching from the high exposed state to the low retracted state, the microphone support rod (52) passes through the rod segment of the correction hole seat (150) and is retracted into the device base (10) in a straightened state until the microphone end (51) resumes engagement with the correction hole seat (150). Furthermore, the straightening member (15) overcomes the first elastic force based on the engagement between the microphone end (51) and the correction hole seat (150) and descends synchronously with the microphone assembly (50) and the microphone interface board (60).

13. A method for controlling the lifting of a microphone assembly, characterized in that, The microphone assembly is used in an audio acquisition device, which includes a device base, a device motherboard, and a microphone interface board. The lifting control method controls the microphone assembly to switch between a low-position retracted state and a high-position exposed state. The microphone interface board is normally electrically connected to the microphone assembly. The microphone interface board moves synchronously with the microphone assembly within the device base. When the microphone assembly is in the low-position retracted state, the microphone interface board is physically separated from the device motherboard. Furthermore, the lifting control method includes: The conductive contact between the microphone interface board and the device motherboard is detected; wherein, the conductive contact is used to enable the microphone interface board to acquire and transmit the analog audio signal generated by the microphone component to the device motherboard when the microphone component is in the high-position exposed state; Based on the successful detection of the conductive contact, the target height of the microphone assembly in the high-exposed state is determined.

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