Composite circuit board

Abstract

The invention discloses a composite circuit board. The composite circuit board comprises a multi-layer board body and two stacking layers formed on the two opposite sides of the multi-layer board body respectively. The multi-layer plate body comprises two core layers and a connecting layer connected between the two core layers. Each core layer comprises a substrate and a conductor embedded in the substrate. Wherein one substrate is a ceramic substrate, and the other substrate is one of a ceramic substrate, a glass substrate and a copper foil substrate. Each conductor is provided with an inner connecting surface which is coplanar with the plate surface of the corresponding substrate; the connecting layer comprises an insulating layer clamped between the two substrates, and a conductive coating embedded in the insulating layer. The conductive coating is sintered to connect the inner contact surfaces of the two core layers. Therefore, on the premise that the two stack-up layers can be electrically coupled with each other through the multi-layer plate body, the effects of heat dissipation and bending resistance are effectively improved.

Description

Technical Field

[0001] This invention relates to a circuit board, and more particularly to a composite circuit board. Background Technology

[0002] Existing composite circuit boards all use silicon substrates or single glass substrates as the core layer. Therefore, the heat dissipation and bending resistance of existing composite circuit boards are limited by the silicon substrate and single glass substrate, making improvement difficult. Thus, the inventors believe that the above-mentioned defects can be improved, and propose an invention with a reasonable design that effectively improves these defects. Summary of the Invention

[0003] This invention provides a composite circuit board that can effectively improve the defects that may occur in existing composite circuit boards.

[0004] This invention discloses a composite circuit board, comprising: a multilayer board body, including: a first core layer, comprising: a first substrate having a first through hole, wherein the first substrate is a ceramic substrate; a first conductor filling the first through hole; wherein the first conductor has a first inner surface coplanar with a surface of the first substrate; a second core layer, stacked on the first core layer in a thickness direction and including: a second substrate having a second through hole, wherein the second substrate is one of a ceramic substrate, a glass substrate, and a copper foil substrate; a second conductor filling the second through hole; wherein the second conductor has a second inner surface coplanar with a surface of the second substrate. A board surface; wherein a first inner surface of a first core layer faces a second inner surface of a second core layer along the thickness direction; a connecting layer is connected between the first core layer and the second core layer, and the connecting layer includes: an insulating layer sandwiched between a first substrate and a second substrate; a conductive coating embedded within the insulating layer; wherein the conductive coating connects the first inner surface of a first conductor and the second inner surface of a second conductor by sintering; a first stacked layer and a second stacked layer are respectively formed on opposite sides of a multilayer board, and the first stacked layer and the second stacked layer are electrically coupled to each other through the multilayer board; wherein the first stacked layer and the second stacked layer are each used to provide at least one electronic component for connection thereto.

[0005] Optionally, the second core layer includes an external conductor connected to the second conductor and located away from the second inner surface, and the external conductor is formed on another surface of the second substrate.

[0006] Optionally, a receiving groove is recessed on another surface of the second core layer. The second core layer includes: an embedded electronic component disposed within the receiving groove; an insulator filling the receiving groove and covering the embedded electronic component; wherein an external conductor passes through the insulator and is connected to the embedded electronic component.

[0007] Optionally, the first core layer includes a conductive post embedded within the first substrate, and one end of the conductive post is adjacent to the bottom of the receiving groove and electrically coupled to the embedded electronic component.

[0008] Optionally, the external conductor has a bottom surface connected to another plate and a ring side edge connected to the bottom surface, and the ring side edge forms an acute angle with the other plate.

[0009] Optionally, the included angle is between 30 degrees and 75 degrees.

[0010] Optionally, the external conductor is formed on another surface of the second substrate using a direct copper plating technique.

[0011] Optionally, the multilayer panel has a first panel surface and a second panel surface located on the opposite side of the first panel surface; the first panel surface has a first modified region connected to the first stacked layer; the second panel surface has a second modified region connected to the second stacked layer.

[0012] Optionally, the conductive coating may include solder paste, active lead solder paste, one-nanometer silver paste, one-nanometer copper paste, or one-nanometer gold paste.

[0013] Optionally, the multilayer board has a first board surface and a second board surface located on the opposite side of the first board surface; wherein the first stacked layer includes: a first organic dielectric layer and a first inorganic dielectric layer, which are stacked on the first board surface; a first circuit embedded within the first organic dielectric layer and the first inorganic dielectric layer; wherein one end of the first circuit is connected to the multilayer board, and the other end of the first circuit is exposed from one of the first organic dielectric layer and the first inorganic dielectric layer.

[0014] Optionally, the second stacked layer includes: a second organic dielectric layer and a second inorganic dielectric layer, which are stacked on the second substrate; a second circuit embedded within the second organic dielectric layer and the second inorganic dielectric layer; wherein one end of the second circuit is connected to the multilayer substrate, and the other end of the second circuit is exposed from one of the second organic dielectric layer and the second inorganic dielectric layer; wherein the first circuit and the second circuit are electrically coupled to each other through the multilayer substrate.

[0015] Optionally, the materials of the first organic dielectric layer and the second organic dielectric layer are each selected from at least one of the following: polyimide, Ajinomoto multilayer film, liquid crystal polymer, acrylic resin, thermoplastic resin, thermosetting resin, polybenzoxazole, benzocyclobutene resin, epoxy resin, cyanate ester resin, polytetrafluoroethylene / Teflon, polyester resin, polyolefin, photolithographic epoxy resin, and polymer-ceramic composite dielectric material.

[0016] Optionally, the materials of the first inorganic dielectric layer and the second inorganic dielectric layer are each selected from at least one of silicon dioxide, aluminum oxynitride, zirconium-toughened alumina, beryllium oxide, silicon carbide, aluminum oxide, aluminum nitride, silicon nitride, zirconium oxide, quartz, mica, hafnium oxide, tantalum pentoxide, magnesium oxide, titanium dioxide, and boron nitride.

[0017] Optionally, the multilayer board has a first board surface and a second board surface located on the opposite side of the first board surface; the first stacked layer includes: a first dielectric layer formed on the first board surface; a first circuit embedded in the first dielectric layer; wherein one end of the first circuit is connected to the multilayer board, and the other end of the first circuit is exposed outside the first dielectric layer.

[0018] Optionally, the second stacked layer includes: a second dielectric layer formed on the second board surface; a second circuit embedded in the second dielectric layer; wherein one end of the second circuit is connected to the multilayer board, and the other end of the second circuit is exposed outside the second dielectric layer; wherein the first circuit and the second circuit are electrically coupled to each other through the multilayer board.

[0019] Optionally, at least one of the first dielectric layer and the second dielectric layer is an organic dielectric layer, the material of which is selected from at least one of polyimide, Ajinomoto multilayer film, liquid crystal polymer, acrylic resin, thermoplastic resin, thermosetting resin, polybenzoxazole, benzocyclobutene resin, epoxy resin, cyanate ester resin, polytetrafluoroethylene / Teflon, polyester resin, polyolefin, photolithographic epoxy resin, and polymer-ceramic composite dielectric material.

[0020] Optionally, at least one of the first dielectric layer and the second dielectric layer is an inorganic dielectric layer, and its material is selected from at least one of silicon dioxide, aluminum oxynitride, zirconium-toughened alumina, beryllium oxide, silicon carbide, aluminum oxide, aluminum nitride, silicon nitride, zirconium oxide, quartz, mica, hafnium oxide, tantalum pentoxide, magnesium oxide, titanium dioxide, and boron nitride.

[0021] Optionally, the wall of the first through hole is cut flush with the wall of the second through hole along the thickness direction.

[0022] Optionally, the width of the conductive coating is greater than the width of both the first inner surface and the second inner surface.

[0023] Optionally, the projection area formed by the second core layer and the first inner surface orthogonally projected along the thickness direction completely overlaps the second inner surface but does not overlap the second substrate.

[0024] In summary, the composite circuit board disclosed in the embodiments of the present invention effectively improves the heat dissipation and bending resistance of the composite circuit board by using a multilayer board body to replace the existing silicon substrate or glass substrate, and ensures that the first stacked layer and the second stacked layer can be electrically coupled to each other through the multilayer board body.

[0025] Furthermore, the composite circuit board provided in this embodiment of the invention uses a ceramic substrate as a skeleton in the first substrate of the multilayer board body, so that the second substrate can selectively use a ceramic substrate with higher strength, a glass substrate with better high-frequency signal transmission effect, or a copper foil substrate with lower cost, thereby meeting various different needs in the market.

[0026] To further understand the features and technical content of this invention, please refer to the following detailed description and accompanying drawings. However, these descriptions and drawings are only for illustrating the invention and are not intended to limit the scope of protection of the invention in any way. Attached Figure Description

[0027] Figure 1 This is a cross-sectional schematic diagram of the composite circuit board according to Embodiment 1 of the present invention.

[0028] Figure 2 for Figure 1 An enlarged schematic diagram of region II.

[0029] Figure 3 This is a schematic diagram of another usage state of the multi-layer plate body according to Embodiment 1 of the present invention.

[0030] Figure 4 This is a cross-sectional schematic diagram of the composite circuit board according to Embodiment 2 of the present invention.

[0031] Figure 5 This is a cross-sectional schematic diagram of the composite circuit board according to Embodiment 3 of the present invention.

[0032] Figure 6 for Figure 5 An enlarged diagram of region VI.

[0033] Figure 7 This is a cross-sectional schematic diagram of another aspect of the composite circuit board according to Embodiment 3 of the present invention.

[0034] Figure 8 This is a cross-sectional schematic diagram of the composite circuit board according to Embodiment 4 of the present invention.

[0035] Figure 9 This is a cross-sectional schematic diagram of another aspect of the composite circuit board according to Embodiment 4 of the present invention.

[0036] Figure 10 for Figure 8A partial top view of the first dielectric layer is omitted.

[0037] Figure 11 This is a cross-sectional schematic diagram of another aspect of the composite circuit board according to Embodiment 4 of the present invention. Detailed Implementation

[0038] The following specific embodiments illustrate the implementation of the "composite circuit board" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, the accompanying drawings of this invention are for simple illustrative purposes only and are not depictions of actual dimensions; this is stated in advance. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention.

[0039] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various elements or features, these elements or features should not be limited by these terms. These terms are primarily used to distinguish one element from another, or one feature from another. Furthermore, the term "or" as used herein may, as appropriate, include any combination of one or more of the related listed items.

[0040] [Example 1]

[0041] Please see Figures 1 to 3 As shown, this is an embodiment of the present invention. Figure 1 and Figure 2 As shown, this embodiment discloses a composite circuit board 100, which includes a multilayer board body 3 and a first stacked layer 1 and a second stacked layer 2 formed on opposite sides of the multilayer board body 3. The multilayer board body 3 is formed by stacking multiple core layers, and the first stacked layer 1 and the second stacked layer 2 are electrically coupled to each other through the multilayer board body 3. Each of the first stacked layer 1 and the second stacked layer 2 is used to connect at least one electronic component (not shown in the figure, e.g., a circuit board or a power chip) thereon. In other words, any circuit board that does not employ multiple core layers is different from the composite circuit board 100 described in this embodiment.

[0042] It should be further noted that the multi-layered plate 3 in this embodiment Figure 1 and Figure 2 Although the description refers to its combination with the first stacked layer 1 and the second stacked layer 2, the present invention is not limited thereto. For example, such as Figure 3As shown, the multi-layer plate 3 can also be used independently according to actual needs and can be used to connect at least one electronic component 200 thereto.

[0043] In this embodiment, as Figure 1 and Figure 2 As shown, the multi-layer board 3 includes a first core layer 31, two second core layers 32 stacked along a thickness direction H on opposite sides of the first core layer 31, and two connecting layers 33 located between the first core layer 31 and the two second core layers 32. However, the present invention is not limited thereto. For example, in other embodiments of the present invention not shown, the multi-layer board 3 may employ one second core layer 32 or three or more second core layers 32 depending on actual needs.

[0044] The first core layer 31 includes a first substrate 311 and a plurality of first conductors 312 embedded in the first substrate 311. In this embodiment, the first substrate 311 is a ceramic substrate and has a plurality of first through holes 3111 formed therein, and the plurality of first conductors 312 are respectively filled in the plurality of first through holes 3111, but the present invention is not limited thereto.

[0045] It should be noted that although the number of the first through holes 3111 and the number of the first conductors 312 of the first substrate 311 are each shown as multiple in the accompanying drawings of this embodiment, in other embodiments not shown in this invention, the number of the first through holes 3111 and the number of the first conductors 312 may each be at least one. Furthermore, for ease of understanding this embodiment, the following description will use one of the first conductors 312 and its corresponding first through hole 3111 to illustrate its structure and corresponding connection relationship.

[0046] Furthermore, the first conductor 312 has two first inner surfaces 3121 located at its two ends, and each of the first inner surfaces 3121 of the first conductor 312 is coplanar with the adjacent surface of the first substrate 311. To ensure stable formation and bonding of the first conductor 312 to the first substrate 311, the first conductor 312 can employ a multilayer structure, comprising a sublayer formed on the first substrate 311 and a conductive layer formed on the seed layer. In this embodiment, the seed layer comprises a copper alloy layer (e.g., a titanium-copper layer or a nickel-copper layer) formed on the first substrate 311 by deposition, and a copper layer formed on the copper alloy layer by chemical plating, while the conductive layer is formed on the copper layer by direct copper plating; however, this invention is not limited thereto.

[0047] Furthermore, since the two second core layers 32 adopt a substantially identical architecture in this embodiment, for ease of understanding, the following description only illustrates the connection relationship between one of the second core layers 32, the first core layer 31, and the corresponding connecting layer 33, but the present invention is not limited thereto. For example, in other embodiments of the present invention not shown, the plurality of second core layers 32 included in the multilayer plate 3 may also adopt different architectures depending on actual needs.

[0048] The second core layer 32 includes a second substrate 321, a plurality of second conductors 322 embedded in the second substrate 321, and a plurality of external conductors 323 respectively connected to the plurality of second conductors 322. The second substrate 321 is one of a ceramic substrate, a glass substrate, and a copper clad laminate (CCL), and the second substrate 321 has an inner plate surface adjacent to the first substrate 311 and an outer plate surface away from the first substrate 311.

[0049] In this embodiment, the second substrate 321 has a plurality of second through holes 3211, and a plurality of second conductors 322 are respectively filled in the plurality of second through holes 3211. Each external conductor 323 is integrally connected to a second conductor 322 and is formed on the outer plate surface (e.g., the external conductor 323 is formed on the outer plate surface of the second substrate 321 by direct copper plating technology), but the present invention is not limited thereto.

[0050] It should be noted that although the number of the second through holes 3211, the number of the second conductors 322, and the number of the external conductors 323 of the second substrate 321 are each shown as multiple in the accompanying drawings of this embodiment, in other embodiments not shown in this invention, the number of the second through holes 3211, the number of the second conductors 322, and the number of the external conductors 323 may each be at least one. Furthermore, for ease of understanding this embodiment, the following description will use one of the second conductors 322, a corresponding second through hole 3211, and a corresponding external conductor 323 to illustrate its structure and corresponding connection relationships.

[0051] Furthermore, the second conductor 322 has a second inner surface 3221 and an outer surface 3222 located at its two ends, respectively. The second inner surface 3221 of the second conductor 322 is coplanar with the inner surface of the second substrate 321, while the outer surface 3222 of the second conductor 322 is coplanar with the outer surface and connected to the outer conductor 323 (that is, the outer conductor 323 is away from the second inner surface 3221). To ensure that the second conductor 322 and the outer conductor 323 can be stably formed and bonded to the second substrate 321, each of the second conductor 322 and the outer conductor 323 can adopt a multilayer structure, comprising a sublayer formed on the second substrate 321 and a conductive layer formed on the seed layer. In this embodiment, the seed layer includes a copper alloy layer (such as a titanium copper layer or a nickel copper layer) formed on the second substrate 321 by deposition, and a copper layer formed on the copper alloy layer by chemical plating. The conductive layer is formed on the copper layer by direct copper plating, but the present invention is not limited thereto.

[0052] The connecting layer 33 connects the first core layer 31 and the second core layer 32, and the connecting layer 33 includes an insulating layer 331 and a conductive paste 332 embedded within the insulating layer 331. The insulating layer 331 is sandwiched between the first substrate 311 and the second substrate 321, and the insulating layer 331 can be an organic material, such as Ajinomoto Build-up Film (ABF), polypropylene (PP), polyimide (PI), epoxy resin, or liquid crystal polymer (LCP).

[0053] Furthermore, the conductive coating 332 connects the first inner surface 3121 of the first conductor 312 and the second inner surface 3221 of the second conductor 322 through sintering, and the width W332 of the conductive coating 332 is greater than the width W3121 of the first inner surface 3121 and also greater than the width W3221 of the second inner surface 3221. In this embodiment, the conductive coating 332 may include solder paste, active meta brazing (AMB) paste, nano silver paste, nano copper paste, or nanoscale colloidal gold paste, but the present invention is not limited thereto.

[0054] More specifically, the first inner surface 3121 of the first core layer 31 faces the second inner surface 3221 along the thickness direction H. In this embodiment, the wall of the first through hole 3111 is flush with the wall of the second through hole 3211 along the thickness direction H; that is, the projection area formed by the second core layer 32 and the first inner surface 3121 projected orthogonally along the thickness direction H completely overlaps the second inner surface 3221 and does not overlap the second substrate 321, but this is not a limitation.

[0055] It should be further noted that the multilayer board 3 has a first board surface 3a and a second board surface 3b located on the opposite side of the first board surface 3a, and in this embodiment, the first board surface 3a and the second board surface 3b of the multilayer board 3 are respectively the outer board surfaces of the two second substrates 321.

[0056] Furthermore, to enhance the bonding strength between the multilayer plate 3 and the first stacked layer 1 and the second stacked layer 2, the multilayer plate 3 may have a first modified region 3a1 connected to the first stacked layer 1 on the first plate surface 3a, and a second modified region 3b1 connected to the second stacked layer 2 on the second plate surface 3b. The areas of the first modified region 3a1 and the second modified region 3b1 can be adjusted and varied according to actual needs, and this invention does not impose any limitations on these adjustments.

[0057] Furthermore, the modification methods for the first modified region 3a1 and the second modified region 3b1 can be physical modification (such as roughening or surface coating) or chemical modification (such as changing the molecular structure of the material or surface functional groups) according to actual needs. For example, the first plate surface 3a and / or the second plate surface 3b can be modified by laser or wet process to form the first modified region 3a1 and the second modified region 3b1, thereby improving the adhesion of the multilayer plate 3 to the first stacked layer 1 and the second stacked layer 2.

[0058] The first stacked layer 1 includes a first dielectric layer 11 formed on the first plate surface 3a and a first circuit 12 embedded in the first dielectric layer 11. In this embodiment, the first dielectric layer 11 may be a multilayer structure, and the first dielectric layer 11 may be an inorganic dielectric layer or an organic dielectric layer according to actual needs, which is not limited herein.

[0059] Furthermore, the first dielectric layer 11 has at least one of the external conductors 323 embedded therein, and the first dielectric layer 11 connects to (or covers) the first modified region 3a1 to improve the bonding strength between the first dielectric layer 11 and the multilayer plate 3.

[0060] Furthermore, one end of the first line 12 is connected to the multilayer board 3 (e.g., an external conductor 323), and the other end of the first line 12 is exposed outside the first dielectric layer 11. It should be noted that, in the accompanying drawings of this embodiment, although the first line 12 is generally positioned above its corresponding first through hole 3111, in other embodiments not shown in this invention, the first line 12 may be misaligned with the corresponding first through hole 3111 according to actual needs.

[0061] The second stacked layer 2 includes a second dielectric layer 21 formed on the second plate surface 3b and a second circuit 22 embedded in the second dielectric layer 21. In this embodiment, the second dielectric layer 21 may be a multilayer structure, and the second dielectric layer 21 may be an inorganic dielectric layer or an organic dielectric layer according to actual needs, which is not limited herein.

[0062] It should be further noted that when the first dielectric layer 11 and / or the second dielectric layer 21 adopt the organic dielectric layer, its material can be selected from at least one of polyimide (PI), Ajinomoto Build-up Film (ABF), Liquid Crystal Polymer (LCP), Acrylic resin, Thermoplastics, Thermosetting materials, Polybenzoxazole (PBO), Benzocyclobutene (BCB), Epoxy Resin, Cyanate Ester Resin, Polytetrafluoroethylene / Teflon, Polyester, Polyolefin, Photolithographic Epoxy Resin (SU-8), and Hybrid Polymer-Ceramic Materials.

[0063] Furthermore, when the first dielectric layer 11 and / or the second dielectric layer 21 adopt the inorganic dielectric layer, its material can be selected from at least one of silicon dioxide (SiO2), aluminum oxynitride (AlON), zirconium-toughened alumina (ZTA), beryllium oxide (BeO), silicon carbide (SiC), aluminum oxide (Al2O3), aluminum nitride (AlN), silicon nitride (Si3N4), zirconium oxide (ZrO2), quartz, mica, hafnium oxide (HfO2), tantalum pentoxide (Ta2O3), magnesium oxide (MgO), titanium dioxide (TiO2), and boron nitride (BN).

[0064] Furthermore, the second dielectric layer 21 has at least one of the external conductors 323 embedded therein, and the second dielectric layer 21 connects to (or covers) the second modified region 3b1 to improve the bonding strength between the second dielectric layer 21 and the multilayer plate 3.

[0065] Furthermore, one end of the second line 22 is connected to the multilayer board 3 (e.g., an external conductor 323), and the other end of the second line 22 is exposed outside the second dielectric layer 21. It should be noted that, in the accompanying drawings of this embodiment, although the second line 22 is generally shown below its corresponding second through hole 3211, in other embodiments of the present invention not shown, the second line 22 may be misaligned with the corresponding second through hole 3211 according to actual needs.

[0066] As described above, the composite circuit board 100 provided in this embodiment replaces the existing silicon substrate or glass substrate by adopting a multilayer board body 3, and ensures that the first stacked layer 1 (e.g., the first line 12) and the second stacked layer 2 (e.g., the second line 22) can be electrically coupled to each other through the multilayer board body 3, thereby effectively improving the heat dissipation and bending resistance of the composite circuit board 100.

[0067] Furthermore, the composite circuit board 100 provided in this embodiment uses a ceramic substrate as a skeleton in the first substrate 311 of the multilayer board body 3, so that the second substrate 321 can selectively use a ceramic substrate with higher strength, a glass substrate with better high-frequency signal transmission effect, or a copper foil substrate with lower cost, thereby meeting various different needs in the market.

[0068] [Example 2] Please see Figure 4 As shown, this is Embodiment Two of the present invention. Since this embodiment is similar to Embodiment One described above, the similarities between the two embodiments will not be repeated. The main differences between this embodiment and Embodiment One are as follows: This embodiment discloses a composite circuit board 100, which includes a multilayer board body 3 and a first stacked layer 1 and a second stacked layer 2 respectively formed on opposite sides of the multilayer board body 3, and the first stacked layer 1 and the second stacked layer 2 can be electrically coupled to each other through the multilayer board body 3. That is to say, any circuit board that does not use a multilayer board body 3 is different from the composite circuit board 100 referred to in this embodiment. It should be noted that the structure of the multilayer board body 3 in this embodiment is generally the same as that described in Embodiment 1 above, and will not be repeated here.

[0069] The first stacked layer 1 is formed on the first surface 3a of the multilayer plate 3, and at least one external conductor 323 is embedded in the first stacked layer 1. The first stacked layer 1 includes a first organic dielectric layer 11a and a first inorganic dielectric layer 11b stacked on top of each other on the first surface 3a, and a first circuit 12 embedded within the first organic dielectric layer 11a and the first inorganic dielectric layer 11b.

[0070] Furthermore, the first organic dielectric layer 11a can be a single-layer or multi-layer structure, and the first inorganic dielectric layer 11b can be a single-layer or multi-layer structure. Moreover, one end of the first line 12 is connected to the multi-layer plate 3 (e.g., an external conductor 323), and the other end of the first line 12 is exposed from either the first organic dielectric layer 11a or the first inorganic dielectric layer 11b. It should be noted that the structure of the first line 12 in this embodiment is generally the same as described in Embodiment 1 above, and will not be repeated here.

[0071] In the accompanying drawings of this embodiment, the first stacked layer 1 is formed on the first plate surface 3a by the first inorganic dielectric layer 11b and connected to the first modified region 3a1, so that at least one external conductor 323 is embedded in the first inorganic dielectric layer 11b, and the first organic dielectric layer 11a is stacked on the first inorganic dielectric layer 11b, so that the other end of the first line 12 is exposed from the first organic dielectric layer 11a, but the present invention is not limited thereto.

[0072] For example, in other embodiments not shown in this invention, the first stacked layer 1 may also be formed by the first organic dielectric layer 11a on the first plate surface 3a and connected to the first modified region 3a1, such that at least one of the external conductors 323 is embedded in the first organic dielectric layer 11a, and the first inorganic dielectric layer 11b is stacked on the first organic dielectric layer 11a, such that the other end of the first line 12 is exposed from the first inorganic dielectric layer 11b.

[0073] The second stacked layer 2 is formed on the second surface 3b of the multilayer plate 3, and at least one of the external conductors 323 is embedded in the second stacked layer 2. The second stacked layer 2 includes a second organic dielectric layer 21a and a second inorganic dielectric layer 21b stacked on top of each other on the second surface 3b, and a second circuit 22 embedded within the second organic dielectric layer 21a and the second inorganic dielectric layer 21b.

[0074] Furthermore, the second organic dielectric layer 21a can be a single-layer or multi-layer structure, and the second inorganic dielectric layer 21b can be a single-layer or multi-layer structure. Moreover, one end of the second line 22 is connected to the multi-layer plate 3 (e.g., an external conductor 323), and the other end of the second line 22 is exposed from one of the second organic dielectric layer 21a or the second inorganic dielectric layer 21b. It should be noted that the structure of the second line 22 in this embodiment is generally the same as described in Embodiment 1 above, and will not be repeated here.

[0075] In the accompanying drawings of this embodiment, the second stacked layer 2 is formed on the second plate surface 3b and connected to the second modified region 3b1 by the second inorganic dielectric layer 21b, so that at least one external conductor 323 is embedded in the second inorganic dielectric layer 21b, and the second organic dielectric layer 21a is stacked on the second inorganic dielectric layer 21b, so that the other end of the second line 22 is exposed from the second organic dielectric layer 21a, but the present invention is not limited thereto.

[0076] For example, in other embodiments of the present invention not shown, the second stacked layer 2 may also be formed on the second plate surface 3b and connected to the second modified region 3b1 by the second organic dielectric layer 21a, such that at least one of the external conductors 323 is embedded in the second organic dielectric layer 21a, and the second inorganic dielectric layer 21b is stacked on the second organic dielectric layer 21a, such that the other end of the second line 22 is exposed from the second inorganic dielectric layer 21b.

[0077] The materials of the first organic dielectric layer 11a and the second organic dielectric layer 21a may each be selected from at least one of the following: polyimide (PI), Ajinomoto build-up film (ABF), liquid crystal polymer (LCP), acrylic resin, thermoplastic resin, thermosetting resin, polybenzoxazole (PBO), benzocyclobutene resin (BCB), epoxy resin, cyanate ester resin, polytetrafluoroethylene / Teflon, polyester resin, polyolefin, photolithographic epoxy resin (SU-8), and hybrid polymer-ceramic composite dielectric materials.

[0078] The materials of the first inorganic dielectric layer 11b and the second inorganic dielectric layer 21b can each be selected from at least one of silicon dioxide (SiO2), aluminum oxynitride (AlON), zirconium-toughened alumina (ZTA), beryllium oxide (BeO), silicon carbide (SiC), aluminum oxide (Al2O3), aluminum nitride (AlN), silicon nitride (Si3N4), zirconium oxide (ZrO2), quartz, mica, hafnium oxide (HfO2), tantalum pentoxide (Ta2O3), magnesium oxide (MgO), titanium dioxide (TiO2), and boron nitride (BN).

[0079] Furthermore, the first inorganic dielectric layer 11b and the second inorganic dielectric layer 21b can be manufactured by chemical vapor deposition (CVD), physical vapor deposition (PVD), or electrophoretic deposition (EPD). It should be noted that quartz and mica are minerals extracted from natural ores and then processed or synthesized; therefore, they are not formed by deposition.

[0080] More specifically, the chemical vapor deposition in this embodiment may include atomic layer deposition (ATL), high pressure chemical vapor deposition (HPCVD), plasma enhanced chemical vapor deposition (PECVD), microwave plasma chemical vapor deposition (MPCVD), low pressure chemical vapor deposition (LPCVD), vapor phase epitaxy (VPE), metal-organic chemical vapor deposition (MOCVD), or spray pyrolysis.

[0081] Furthermore, the physical vapor deposition in this embodiment may include electron gun evaporation, ion beam evaporation, DC magnetron sputtering, ion beam sputtering, pulsed laser deposition (PLD), cathodic arc deposition, or molecular beam epitaxy (MBE).

[0082] It should be noted that, in other embodiments not shown in this invention, the multilayer plate 3 may also be used individually as needed and may be used to connect at least one electronic component thereto.

[0083] [Example 3] Please see Figures 5 to 7 As shown, this is Embodiment Three of the present invention. Since this embodiment is similar to Embodiments One and Two described above, the similarities between the two embodiments will not be repeated. The main differences between this embodiment and Embodiments One and Two described above are as follows: In this embodiment, the external conductor 323 has a bottom surface 3231 connected to the outer plate surface (e.g., the first plate surface 3a or the second plate surface 3b), and an annular side edge 3232 connected to the bottom surface 3231, and the annular side edge 3232 forms an acute angle σ with the outer plate surface. The angle σ is between 30 degrees and 75 degrees.

[0084] In other words, an annular groove 324 is formed between the annular side edge 3232 and the outer plate surface, and the annular groove 324 is filled with the first dielectric layer 11 (e.g.: Figure 5 ) or filled with one of the first inorganic dielectric layer 11b and the first organic dielectric layer 11a (e.g.: Figure 7 The bonding strength between the outer conductor 323 and the first stacked layer 1 (or the second stacked layer 2) is further enhanced by the outer conductor 323 having the included angle σ.

[0085] It should be noted that, in other embodiments not shown in this invention, the multilayer plate 3 may also be used individually as needed and may be used to connect at least one electronic component thereto.

[0086] [Example 4] Please see Figures 8 to 11 This is Embodiment Four of the present invention. Since this embodiment is similar to Embodiments One to Three above, the similarities between the two embodiments will not be repeated. The main differences between this embodiment and Embodiments One to Three above are explained as follows: In this embodiment, as Figures 8 to 10 As shown, the multilayer board 3 further includes an embedded electronic component 34 and an insulator 35. A receiving groove 3c is recessed in the first surface 3a of the multilayer board 3. The embedded electronic component 34 is disposed within the receiving groove 3c, and its two electrodes 341 are coplanar on the first surface 3a. The insulator 35 fills the receiving groove 3c and covers the embedded electronic component 34. Furthermore, two external conductors 323 pass through the insulator 35 and are respectively connected to the embedded electronic component 34 (e.g., the two electrodes 341).

[0087] It should be further noted that the embedded electronic component 34 is described in this embodiment as being located on the first plate surface 3a, but the present invention is not limited thereto. For example, in other embodiments of the present invention not shown, the embedded electronic component 34 may also be located on the second plate surface 3b according to actual needs.

[0088] In addition, such as Figure 11 As shown, the first core layer 31 includes a conductive post 313 embedded in the first substrate 311, and one end of the conductive post 313 is adjacent to the bottom of the receiving groove 3c and electrically coupled to the embedded electronic component 34.

[0089] It should be noted that, in other embodiments not shown in this invention, the multilayer plate 3 may also be used individually as needed and may be used to connect at least one electronic component thereto.

[0090] [Technical Effects of the Embodiments of the Invention] In summary, the composite circuit board disclosed in the embodiments of the present invention effectively improves the heat dissipation and bending resistance of the composite circuit board by using a multilayer board body to replace the existing silicon substrate or glass substrate, and ensures that the first stacked layer (e.g., the first line) and the second stacked layer (e.g., the second line) can be electrically coupled to each other through the multilayer board body.

[0091] Furthermore, the multilayer board disclosed in the embodiments of the present invention uses a ceramic substrate as the skeleton for the first substrate, so that the second substrate can selectively use a ceramic substrate with higher strength, a glass substrate with better high-frequency signal transmission effect, or a copper foil substrate with lower cost, thereby meeting various different needs in the market.

[0092] The content disclosed above is only a preferred and feasible embodiment of the present invention, and is not intended to limit the patent scope of the present invention. Therefore, all equivalent technical changes made based on the content of the present invention specification and drawings are included within the patent scope of the present invention.

Claims

1. A composite circuit board, characterized in that, The composite circuit board includes: A multi-layered panel, comprising: The first core layer includes: A first substrate having a first through hole, and the first substrate being a ceramic substrate; and A first conductor is filled in the first through hole; wherein the first conductor has a first inner surface, the first inner surface being coplanar with a surface of the first substrate; A second core layer, which is stacked on top of the first core layer in a thickness direction and includes: A second substrate having a second through hole, and the second substrate being one of a ceramic substrate, a glass substrate, and a copper foil substrate; and A second conductor fills the second through hole; wherein the second conductor has a second inner surface, the second inner surface being coplanar with a surface of the second substrate; wherein the first inner surface of the first core layer faces the second inner surface of the second core layer along the thickness direction; and A connection layer is provided between the first core layer and the second core layer, and the connection layer comprises: An insulating layer is sandwiched between the first substrate and the second substrate; and A conductive coating is embedded within the insulating layer; wherein the conductive coating is sintered to connect the first inner surface of the first conductor to the second inner surface of the second conductor; and A first stacked layer and a second stacked layer are respectively formed on opposite sides of the multilayer plate, and the first stacked layer and the second stacked layer are electrically coupled to each other through the multilayer plate; wherein the first stacked layer and the second stacked layer are each used to provide at least one electronic component to be connected thereto.

2. The composite circuit board according to claim 1, characterized in that, The second core layer includes an external conductor connected to the second conductor and located away from the second inner surface, and the external conductor is formed on another surface of the second substrate.

3. The composite circuit board according to claim 2, characterized in that, The other surface of the second core layer is recessed with a receiving groove, and the second core layer includes: An embedded electronic component is disposed within the receiving groove; and An insulator is filled within the receiving groove and covers the embedded electronic component; wherein the external conductor passes through the insulator and is connected to the embedded electronic component.

4. The composite circuit board according to claim 3, characterized in that, The first core layer includes a conductive post embedded within the first substrate, and one end of the conductive post is adjacent to the bottom of the receiving groove and electrically coupled to the embedded electronic component.

5. The composite circuit board according to claim 2, characterized in that, The external conductor has a bottom surface connected to the other plate surface and an annular side edge connected to the bottom surface, and the annular side edge forms an acute angle with the other plate surface.

6. The composite circuit board according to claim 5, characterized in that, The included angle is between 30 degrees and 75 degrees.

7. The composite circuit board according to claim 2, characterized in that, The external conductor is formed on the other side of the second substrate using a direct copper plating technique.

8. The composite circuit board according to claim 1, characterized in that, The multilayer plate has a first plate surface and a second plate surface located on the opposite side of the first plate surface; the first plate surface has a first modified region connected to the first stacked layer; the second plate surface has a second modified region connected to the second stacked layer.

9. The composite circuit board according to claim 1, characterized in that, The conductive coating comprises solder paste, active lead solder paste, one-nanometer silver paste, one-nanometer copper paste, or one-nanometer gold paste.

10. The composite circuit board according to claim 1, characterized in that, The multi-layered plate has a first plate surface and a second plate surface located on the opposite side of the first plate surface; wherein, the first stacked layer comprises: A first organic dielectric layer and a first inorganic dielectric layer are stacked on the first plate surface; and A first line is embedded within the first organic dielectric layer and the first inorganic dielectric layer; wherein, one end of the first line is connected to the multilayer plate, and the other end of the first line is exposed from one of the first organic dielectric layer and the first inorganic dielectric layer.

11. The composite circuit board according to claim 10, characterized in that, The second stacked layer includes: A second organic dielectric layer and a second inorganic dielectric layer are stacked on the second plate surface; and A second line is embedded within the second organic dielectric layer and the second inorganic dielectric layer; wherein, one end of the second line is connected to the multilayer plate, and the other end of the second line is exposed from one of the second organic dielectric layer and the second inorganic dielectric layer; The first line and the second line are electrically coupled to each other through the multi-layered plate.

12. The composite circuit board according to claim 11, characterized in that, The materials of the first organic dielectric layer and the second organic dielectric layer are respectively selected from at least one of the following: polyimide, Ajinomoto multilayer film, liquid crystal polymer, acrylic resin, thermoplastic resin, thermosetting resin, polybenzoxazole, benzocyclobutene resin, epoxy resin, cyanate ester resin, polytetrafluoroethylene / Teflon, polyester resin, polyolefin, photolithographic epoxy resin, and polymer-ceramic composite dielectric materials.

13. The composite circuit board according to claim 11, characterized in that, The materials of the first inorganic dielectric layer and the second inorganic dielectric layer are respectively selected from at least one of the following: silicon dioxide, aluminum oxynitride, zirconium-toughened alumina, beryllium oxide, silicon carbide, aluminum oxide, aluminum nitride, silicon nitride, zirconium oxide, quartz, mica, hafnium oxide, tantalum pentoxide, magnesium oxide, titanium dioxide, and boron nitride.

14. The composite circuit board according to claim 1, characterized in that, The multi-layered plate has a first plate surface and a second plate surface located on the opposite side of the first plate surface; the first stacked layer includes: A first dielectric layer is formed on the first plate surface; and A first line is embedded in the first dielectric layer; wherein one end of the first line is connected to the multilayer plate, and the other end of the first line is exposed outside the first dielectric layer.

15. The composite circuit board according to claim 14, characterized in that, The second stacked layer includes: A second dielectric layer is formed on the second plate surface; and A second line is embedded in the second dielectric layer; wherein, one end of the second line is connected to the multilayer board, and the other end of the second line is exposed outside the second dielectric layer; The first line and the second line are electrically coupled to each other through the multi-layered plate.

16. The composite circuit board according to claim 15, characterized in that, At least one of the first dielectric layer and the second dielectric layer is selected from: organic dielectric layers, the material of which is selected from at least one of polyimide, Ajinomoto multilayer film, liquid crystal polymer, acrylic resin, thermoplastic resin, thermosetting resin, polybenzoxazole, benzocyclobutene resin, epoxy resin, cyanate ester resin, polytetrafluoroethylene / Teflon, polyester resin, polyolefin, photolithographic epoxy resin, and polymer-ceramic composite dielectric materials.

17. The composite circuit board according to claim 15, characterized in that, At least one of the first dielectric layer and the second dielectric layer is selected from: an inorganic dielectric layer, the material of which is selected from at least one of silicon dioxide, aluminum oxynitride, zirconium-toughened alumina, beryllium oxide, silicon carbide, aluminum oxide, aluminum nitride, silicon nitride, zirconium oxide, quartz, mica, hafnium oxide, tantalum pentoxide, magnesium oxide, titanium dioxide, and boron nitride.

18. The composite circuit board according to claim 1, characterized in that, The wall of the first through hole is cut flush with the wall of the second through hole along the thickness direction.

19. The composite circuit board according to claim 1, characterized in that, The width of the conductive coating is greater than the width of the first inner surface and also greater than the width of the second inner surface.

20. The composite circuit board according to claim 1, characterized in that, The projection area formed by the first inner surface and the second core layer is completely superimposed on the second inner surface and not superimposed on the second substrate when the first inner surface is projected orthogonally along the thickness direction.

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