Method and system for differentiating performance between integrated solutions

Abstract

A graphical user interface (GUI) to communicate evidence-based value claim to a customer. The tool is capable of presenting evidence-based values with interactive appeal and enabling interaction with various integrated solutions that can be customized for specific customer requirements. Thus, the tool of the present invention desires to demonstrate an interface of various integrated solutions to provide evidence-based value claims for customer evaluation and consideration.

Description

Technical Field

[0001] The present invention relates to a reliability enhancement tool for demonstrating the performance capabilities of various integrated solutions in electronic manufacturing, which can indicate system-level performance improvements. Background Technology

[0002] Integrated material design encompasses integrated solutions for bonding materials in the handling / manufacturing of PWBs, PCBs, interconnects, and other components in electronic manufacturing.

[0003] These integrated solutions may be selected from one or more specialized electronic materials, including but not limited to solder paste, sintering materials, flux, chemicals, polymers, metals (in various forms) and films, which, when put into use, present themselves in close physical contact with each other and in close physical contact with other substrate surfaces in the electronic application.

[0004] However, the selection of individual bonding materials that constitute an integrated solution can lead to undesirable interactions between materials, resulting in, for example, decreased system-level reliability or reduced individual material performance. Furthermore, different electronic applications have different and variable reliability requirements. Therefore, it is desirable to develop a solution that can assess and explore these interactions, specific to market segment application requirements and their associated risk factors.

[0005] For example, chemical interactions are known to alter polymer curing kinetics. Additionally, polymer reinforcements at higher thermal profiles may be more susceptible to surface insulation resistance (SIR) failure. Ineffective underfill materials can lead to low adhesion strength or SIR failure. Based on this, it can be seen that different encapsulation designs have different requirements, thus necessitating different / appropriate reinforcement strategies.

[0006] One of the main challenges in bonding electronic substrates lies in evaluating the multiple materials to be used in combination, as different materials may be incompatible, and the expectations of one industry segment / manufacturing division for a certain property may differ from those of another. Furthermore, most bonding materials are evaluated only for their individual properties, and users / customers may have to conduct extensive testing and evaluation of materials and material combinations to develop an integrated solution with the desired properties and characteristics.

[0007] Furthermore, integrated material solutions may include one or more solder pastes, sintering materials, fluxes, chemicals, polymers, metals (in various forms), films, and components integrated / bonded together. The compatibility (including, for example, electrochemical reliability, curing properties, and / or adhesion) and board-level reliability (BLR) (including, for example, thermal cycling, vibration, drop impact, etc.) of the materials constituting these integrated material solutions must be evaluated. Differences in material costs and processing costs must also be assessed.

[0008] Furthermore, different industry segments may have varying performance requirements that must be met, and there is a desire to streamline and / or simplify this material selection. For example, assembly challenges related to board-level reliability in the automotive sector can lead to solder joint failure over time due to accumulated strain. It is known that both package design and operating conditions can contribute to shear strain that results in creep fatigue.

[0009] Therefore, it can be seen that the complexity of packaging design necessitates improving board-level reliability through a combination of solutions that appropriately combine bonding materials. Summary of the Invention

[0010] One object of the present invention is to provide a board-level reliability solution.

[0011] One object of this invention is to demonstrate the performance capabilities of multiple bonding materials in an integrated solution of materials.

[0012] Another objective of this invention is to minimize undesirable interactions and / or potential performance problems between incompatible bonding materials.

[0013] Another objective of this invention is to characterize the interdependencies of multiple bonding materials in an integrated solution for customer / user evaluation.

[0014] Another object of the present invention is to provide a tool for interpreting / defining / characterizing the properties of multiple integrated solutions.

[0015] Another objective of this invention is to demonstrate a solution for overcoming potential negative material interactions that may occur in specific applications.

[0016] Another object of the present invention is to verify the performance of material solutions and / or integration solutions when one or more bonding materials or bonding solutions are used in combination.

[0017] Therefore, in one embodiment, the present invention relates throughout to a computer-implemented method for demonstrating differentiated performance among integrated solutions for bonding components (PCBs, PWBs, interconnects, etc.), wherein the computer-implemented method comprises at least: a processor for executing instructions; a memory for storing instructions therein; and a database populated with data related to bonding materials, wherein the database is accessible by the processor, wherein the computer-implemented method is executed within a host organization, and wherein the method includes: - Instructions are executed via the processor, wherein the processor is programmed to (a) access data stored in the database, and (b) generate a graphical user interface (GUI) at a user computing device to display a graphical representation of the differentiated performance among multiple integrated solutions, wherein each of the multiple integrated solutions includes one or more bonding materials; - Populate the GUI with data related to the bonding material, wherein the data related to the bonding material and its properties is stored in the database; - The GUI is transmitted to the user's computing device for display, whereby the GUI displays information to demonstrate the differentiated performance among the multiple integrated solutions. The plurality of integrated solutions include a baseline integrated solution, wherein the baseline integrated solution includes a baseline bonding material or a plurality of baseline bonding materials, and a continuum of one or more additional integrated solutions measured relative to the baseline integrated solution, wherein each of the one or more additional integrated solutions includes one or more additional bonding materials in addition to the baseline bonding material or the plurality of baseline bonding materials. The GUI is configured to display a graphical representation of the multiple integrated solutions, wherein the graphical representation provides the product properties of each of the multiple integrated solutions, and wherein the product properties of the integrated solution differ from the product properties of the individual bonding materials constituting the integrated solution. The graphic representation is arranged such that one of the X-axis and the Y-axis identifies and displays the nature of the integrated solution, and the other of the X-axis or the Y-axis identifies the integrated solution, wherein the data is arranged such that the first row / column constructs the benchmark integrated solution; The intersection of X and Y data points represents a specific property of a particular integrated solution; This method also includes: - Based on the selection of the intersection of specific XY data points, a pop-up window is generated to display a visualization of product information related to the data / support / analysis of the benchmark integrated solution, or a visualization of product information related to the data / support / analysis of the specific integrated solution compared to the benchmark integrated solution, to indicate system-level performance improvements; - Based on the selection of product properties on the X-axis or Y-axis, a pop-up window is generated to display visualizations of information related to test data, performance data, and conditions used to generate this information related to the data / support / analysis of the multiple integrated solutions; and / or - Based on the selection of the integration solution on the X-axis or Y-axis, a pop-up window is generated to display a visualization of information related to that integration solution.

[0018] In another embodiment, the invention also relates throughout to a system comprising: a. A processor for executing instructions, wherein the processor is programmed to (a) access data stored in a database and (b) generate graphical representations of multiple bonded materials and their properties; b. A database populated with data relating to the bonding material and its properties, wherein the database is accessible to the processor; and c. A memory operatively connected to the processor, the memory having instructions executable by the processor, the instructions including: - The processor executes the generation of a graphical user interface (GUI) at the user's computing device to display the differentiated performance among multiple integrated solutions, each of which includes one or more bonding materials; - Populate the GUI with data related to the bonding material and its properties; - Display the GUI on the user's computing device, where the GUI displays information to demonstrate the differentiated performance between the multiple integrated solutions. The plurality of integrated solutions include a baseline integrated solution, wherein the baseline integrated solution includes a baseline bonding material or a plurality of baseline bonding materials, and a continuum of one or more additional integrated solutions measured relative to the baseline integrated solution, wherein each of the one or more additional integrated solutions includes one or more additional bonding materials in addition to the baseline bonding material or the plurality of baseline bonding materials. The GUI is configured to display a graphical representation of the multiple integrated solutions, wherein the graphical representation provides the product properties of each of the multiple integrated solutions, and wherein the product properties of the integrated solution differ from the product properties of the individual bonding materials constituting the integrated solution. The graphic representation is arranged such that one of the X-axis and the Y-axis identifies and displays the nature of the integrated solution, and the other of the X-axis or the Y-axis identifies the integrated solution, wherein the data is arranged such that the first row / column constructs the benchmark integrated solution; The intersection of the X and Y data points represents a specific property of a particular integrated solution.

[0019] In another embodiment, the invention also relates throughout to a computer program product embodied in a non-transitory computer-readable medium, the computer-readable medium storing a sequence of instructions that, when executed by a processor, cause the processor to perform a method for presenting a user with differentiated performance data for an integrated solution of mating components, the method comprising: - Provides a series of graphical user interfaces (GUIs) to display (i) integrated solutions for specific industry segments, manufacturing processes, or application processes; and (ii) successively displays multiple levels of information related to the differentiated performance data of multiple integrated solutions; - Generate a first graphical user interface that includes one or more first-level view icons, which display selections for industry segmentation, manufacturing process, or application process; - When one of the first-level view icons is selected, a second graphical user interface is generated, which displays information regarding the differentiated performance among the multiple integrated solutions. The plurality of integrated solutions include a baseline integrated solution, wherein the baseline integrated solution includes a baseline bonding material or a plurality of baseline bonding materials, and a continuum of one or more additional integrated solutions measured relative to the baseline integrated solution, wherein each of the one or more additional integrated solutions includes one or more additional bonding materials in addition to the baseline bonding material or the plurality of baseline bonding materials. The second GUI is configured to display a graphical representation of the plurality of integrated solutions, wherein the graphical representation provides the product properties of each of the plurality of integrated solutions, wherein the product properties of the integrated solution differ from the product properties of the individual bonding materials constituting the integrated solution. The graphic representation is arranged such that one of the X-axis and the Y-axis identifies and displays the nature of the integrated solution, and the other of the X-axis or the Y-axis identifies the integrated solution, wherein the data is arranged such that the first row / column constructs the benchmark integrated solution; The intersection of the X and Y data points represents a specific property of a particular integrated solution. Attached Figure Description

[0020] The accompanying drawings, which are incorporated in and form part of this disclosure, illustrate various exemplary embodiments of the invention.

[0021] In the attached diagram: Figure 1 This is a block diagram of a sample system used to provide an interface for a dataset.

[0022] Figure 2 This is a flowchart of an example method for providing an interactive experience of a dataset.

[0023] Figure 3 It is a block diagram of various applications that can present a representation of a dataset.

[0024] Figure 4 It is a block diagram used to present various performance spectra of data for a specific segment or process.

[0025] Figure 5 It is a block diagram used to present various performance spectra of data for a specified industry segment.

[0026] Figure 6 This is an example of the main screen of the example GUI according to the present invention.

[0027] Figures 7 to 22 An additional screen presents an example GUI according to the present invention. Detailed Implementation

[0028] In one embodiment, the present invention relates generally to a tool (GUI) for communicating an evidence-based value proposition to customers in the electronics industry. This tool is capable of presenting an interactively appealing evidence-based value proposition and enables interaction with a variety of integrated solutions that can be tailored to specific customer needs. Therefore, the tool of the present invention aims to demonstrate interfaces for various integrated solutions, which may include supplies related to bonding materials, such as solder paste / sintering materials, protective materials, and reinforcement solutions, to provide an evidence-based value proposition for customer evaluation and consideration. The tool also enables customers to assess / mitigate the risks associated with negative material interactions that may occur in a particular application or due to incompatible combinations of bonding materials, even if the individual bonding materials may have desired properties.

[0029] This invention describes a reliability enhancement tool that includes an interactive interface that highlights / explains / defines the differentiated performance between integrated solutions used for bonding components (PCBs, PWBs, interconnects, etc.), layers, etc. Differentiated performance typically requires extensive testing of various bonding material combinations to identify integrated solutions with desired interactions that positively impact system-level reliability or performance. The reliability enhancement tool described herein characterizes the interdependencies of bonding materials and bonding material combinations when used in integrated solutions such as in board-level electronics manufacturing, while emphasizing the importance of selecting a suitable integrated solution compared to choosing multiple individual bonding materials.

[0030] In the example computing device, a retrieveable dataset is retrieved from a data storage device. This dataset contains product information, test data, performance data, etc., for various bonding materials, bonding solutions, related materials, etc., as well as their individual properties and their integrated properties (i.e., the interactions between two or more bonding materials or bonding solutions included in the dataset, as determined by empirical test data). An interactive visualization of the dataset is presented in a graphical user interface (GUI) at the user's computing device. The system allows the user to interact with the data to determine an integrated solution suitable for their needs based on the visualization of product information / test data / performance data / hypotheses, etc., on the GUI.

[0031] The following detailed description refers to the accompanying drawings. Where possible, the same reference numerals are used in the drawings and the following description to refer to the same or similar elements. While specific embodiments may be described, modifications, adjustments, and other specific embodiments are possible. For example, elements illustrated in the drawings may be replaced, added, or modified, and the methods described herein may be modified by replacing, reordering, or adding stages to the disclosed methods. Therefore, the following detailed description is not intended to limit the invention; rather, the appropriate scope of the invention is defined by the appended claims.

[0032] Furthermore, while the invention described herein describes a dataset containing product information, test data, performance data, etc., of various bonding materials, bonding solutions, related materials, etc., as well as their individual properties and their integrated properties (i.e., including the interactions between two or more bonding materials or bonding solutions contained in the dataset as determined by empirical test data), it is also contemplated that the processes and methods described herein can also be used with datasets containing different product information and / or product solutions based on different interactions and / or attempting to solve different problems.

[0033] The test and performance data of the developed integrated solution are unique in terms of methodology, test platform design, preparation, and insights used to interpret data involving various bonding materials, bonding solutions, and related materials included in a particular integrated solution. Furthermore, the dataset concerning the specific integrated solution is clearly conveyed in the data storage device 170, demonstrating that the presented integrated solution overcomes potential negative material interactions that may arise in specific applications and / or due to the use of incompatible materials.

[0034] In addition, insights gained from understanding risk factors and ways to mitigate the risks associated with integrating different materials can help customers assess and select specific integration solutions that meet their needs, fit their requirements, and do not exhibit any negative material interactions.

[0035] When integrating different materials onto components, potentially significant risk factors include, but are not limited to, curing kinetic interactions, surface insulation resistance (SIR), package-specific strain vectors, and underfill surface compatibility. In the case of curing kinetic interactions, certain flux chemicals can negatively impact the curing kinetics of polymeric epoxy resins. To mitigate these risks, it is essential to select an integration solution that demonstrates compatibility in bonding materials that can be evaluated using the GUI described herein. Additionally, moisture can penetrate / diffuse through the polymer material, potentially increasing with temperature and leading to decreased surface resistance. The GUI described herein allows for the evaluation of various integration solutions to select one with proven reliability. Furthermore, different die-to-package ratios result in different stress vectors, which can influence reinforcement design configuration techniques. The GUI described herein allows for the recommendation of various integration solutions based on specific component design characteristics. Finally, certain flux chemicals can inhibit the application of polymeric epoxy resins by altering their surface tension, leading to solder shrinkage. However, by using the GUI described herein to understand and evaluate different integration solutions, solder shrinkage can be minimized or eliminated.

[0036] Referring now to the accompanying drawings, where similar numbers denote similar elements, various implementation schemes will be described. Figure 1 This is a block diagram illustrating a system architecture having components for allowing users to interact with calculations on data points in a chart and with data points in a chart associated with a dataset. The system architecture includes a computing device 100 and a user computing device 102. The computing device 100 can be one of a variety of suitable computing devices. For example, the computing device 100 or the user computing device 102 may include a tablet computing device, a desktop computer, a mobile communication device, a laptop computer, a laptop / tablet hybrid computing device, a gaming device, or other types of computing devices for performing various tasks.

[0037] The computing device 100 may include a processor 115, a network interface 120, and an interface module 125.

[0038] Data storage device 170 includes one or more datasets containing information related to bonding materials, bonding solutions, and related materials (such as solder paste, other welding materials, sintering materials, adhesives, glues, fluxes, chemicals, polymers, metals (in various forms), films, protective materials, reinforcement solutions, etc., used for bonding, joining, bonding, or otherwise connecting components, layers, surfaces, boards (i.e., PWB, PCB), inner layers, etc., that can be used in electronic industry structures for bonding, joining, bonding, or otherwise connecting). This information may include product properties, test and performance data related to individual bonding materials and / or bonding solutions and / or related materials, test and performance data related to integrated solutions of combinations of one or more individual bonding materials and / or bonding solutions and / or related materials, risk factors and risk mitigation strategies, and insights into certain known and perceived risks associated with individual bonding materials and incompatible material combinations, insights into individual materials or material combinations, material costs, usage costs, etc.

[0039] Data storage device 170 can be accessed by computing device 100 via network 160 or another network. User computing device 102 may include processor 150, display device 130, user interface 140, and network interface 145. Network interfaces 120 and 145 allow respective computing devices to communicate with each other or with other computing devices via network 160, which may be, for example, a public data network or a private data network.

[0040] A user of user computing device 102 may request access to a dataset stored in data storage device 170. This request may take the form of interaction with a graphical user interface (GUI) (such as a webpage) generated by processor 115 of execution interface module 125. A graphical representation associated with the requested dataset is presented to the user via display device 120. The presented graphical representation includes elements (i.e., data points) linked to one or more subspaces (i.e., supporting test data, etc.) of the requested dataset.

[0041] refer to Figure 2 This illustrates aspects of routine 200 for providing an interactive experience related to a graphical representation of a dataset, as further described herein.

[0042] First, at operation 210, a dataset is received or accessed from data storage device 170, which includes data related to a specific set of bonding materials / bonding solutions and their properties. The data structure may be stored at data storage device 170 or at another remote storage location. Processor 115 may identify datasets available for investigation. Processor 115 may present available datasets (such as web pages) in an interface accessible to user computing device 102. User-controlled cursors or other display tools on user interface 140 on user computing device 102 are used to identify available datasets that the user wishes to investigate.

[0043] At operation 220, a GUI related to the received dataset is presented to the user on the display device 130 of the user computing device 102. The interface module 125 generates the GUI.

[0044] Next, at operation 230, interface module 125 receives selections of data points located within the presented chart via user interface 140 and network interface 145 of user computing device 102.

[0045] At operation 240, in response to data point selection, a graphical representation of the specific integrated solution, along with associated facts and / or information and / or test data and / or performance data, is presented to the user on display device 130 of user computing device 102. The graphical representation may be presented on one or more separate pages or windows within the GUI.

[0046] At operation 250, interface module 125 receives, via user interface 140 and network interface 145 of user computing device 102, a selection of one of the calculated facts / information presented regarding a bonding material / bonding solution. In one example, selection is made by activating a cursor on a graphical element associated with the calculated fact / information.

[0047] At operation 260, interface module 125 alters the visual presentation associated with the calculated facts / information. For example, product / property-specific information, test data for combinations of bonding materials / bonding solutions, performance data for combinations of bonding materials / bonding solutions, etc., can be presented on the GUI. Operations 230 and 240, or operations 250 and 260, can be executed multiple times and in multiple sequences to allow the user to view / analyze / consider additional combinations of solutions.

[0048] Figure 3Examples of various “applications” 180 are provided, consistent with datasets or subsets of data that can be presented to users via a GUI. These “applications” 180 include, for example, performance objectives 181, material solutions and integration solutions 182, risk management 183, compatibility 184, “correct size” processing 185, performance enhancement 186, and performance spectrum 190, which provide data / information related to a continuum of material solutions and / or integration solutions for possible bonded materials.

[0049] Additionally, it should be noted that performance spectrum 190 can organize and / or present data for a specific assembly process 191, industry segment 192, application process 193, or manufacturing process 194, as well as... Figure 4 As shown. Performance Spectrum 190 can be further broken down / defined to provide comparative data on various bonding solutions and / or integration solutions for various products or market segments. For example, in the case of a specific industry segment 192, for bonding materials and bonding solutions used in electronics manufacturing, the GUI can present data for industry segment 192, such as, but not limited to, bonding materials and bonding solutions for electronics manufacturing. Figure 5 The examples shown are the automotive industry (196), mobile device industry (197), computing industry (198), and general electronics industry (199). Other industry segments and / or industry segment or sub-segment definitions can also be defined.

[0050] In one implementation, the reliability enhancement tools described herein can be shared with customers by providing them with a temporary link. In another implementation, the reliability enhancement tools can be shared with customers by directly interacting with them to demonstrate the tools.

[0051] In one embodiment, the present invention relates throughout to a computer-implemented method for demonstrating differentiated performance among integrated solutions for bonding components (PCBs, PWBs, interconnects, etc.), wherein the computer-implemented method comprises at least: a processor for executing instructions; a memory for storing instructions therein; and a database populated with data related to bonding materials, wherein the database is accessible by the processor, wherein the computer-implemented method is executed within a host organization, and wherein the method includes: - Instructions are executed via the processor to generate a graphical user interface (GUI) at a user computing device to display the differentiated performance among multiple integrated solutions, wherein each of the multiple integrated solutions includes one or more bonding materials; - Populate the GUI with data related to the bonding material; - The GUI is transmitted to the user's computing device for display, whereby the GUI displays information to demonstrate the differentiated performance among the multiple integrated solutions. The plurality of integrated solutions include a baseline integrated solution, wherein the baseline integrated solution includes a baseline bonding material or a plurality of baseline bonding materials, and a continuum of one or more additional integrated solutions measured relative to the baseline integrated solution, wherein each of the one or more additional integrated solutions includes one or more additional bonding materials in addition to the baseline bonding material or the plurality of baseline bonding materials. The GUI is configured to display a graphical representation of the multiple integrated solutions, wherein the graphical representation provides the product properties of each of the multiple integrated solutions, and wherein the product properties of the integrated solution differ from the product properties of the individual bonding materials constituting the integrated solution. The graphic representation is arranged such that one of the X-axis and the Y-axis identifies and displays the nature of the integrated solution, and the other of the X-axis or the Y-axis identifies the integrated solution, wherein the data is arranged such that the first row / column constructs the benchmark integrated solution; The intersection of X and Y data points represents a specific property of a particular integrated solution; This method also includes: - Based on the selection of the intersection of specific XY data points, a pop-up window is generated to display a visualization of product information related to the data / support / analysis of the benchmark integrated solution, or a visualization of product information related to the data / support / analysis of the specific integrated solution compared to the benchmark integrated solution, to indicate system-level performance improvements; - Based on the selection of product properties on the X-axis or Y-axis, a pop-up window is generated to display visualizations of information related to test data, performance data, and conditions used to generate this information related to the data / support / analysis of the multiple integrated solutions; and / or - Based on the selection of the integration solution on the X-axis or Y-axis, a pop-up window is generated to display a visualization of information related to that integration solution.

[0052] As described herein, these integrated solutions may be selected, for example, from a group of two or more specialized electronic materials, including but not limited to solders, sintering materials, fluxes, chemicals, polymers, metals (in various forms), films, and other bonding materials, which, when put into use, present themselves in close physical contact with each other and in close physical contact with other substrate surfaces in the electronic application.

[0053] The inventors of this invention have discovered that the methods and systems described herein provide an improved GUI tool for demonstrating / analyzing / optimizing enhanced system-level reliability performance or enabling technologies. This GUI tool is supported by a knowledge base / test data / performance data derived from unique combinations of test methods, test vehicles, and test vehicle preparation to verify the performance of material solutions and / or integrated solutions when bonding materials are used in combination.

[0054] Based on the different requirements of test proposals for industry segments or industry definitions, demonstrate the compatibility and synergy of integrated solutions to mitigate or completely eliminate multiple well-defined risk factors associated with combining these types of materials.

[0055] The GUI described in this article demonstrates how material combinations in a specific integrated solution can overcome certain persistent potential failure modes.

[0056] In another embodiment, the invention also relates throughout to a system comprising: a. A processor, which executes instructions; b. A database populated with data related to the bonding material, wherein the database is accessible to the processor; and c. A memory operatively connected to the processor, the memory having instructions executable by the processor, the instructions including: - The processor executes the generation of a graphical user interface (GUI) at the user's computing device to display the differentiated performance among multiple integrated solutions, each of which includes one or more bonding materials; - Populate the GUI with data related to the bonding material; - Display the GUI on the user's computing device, where the GUI displays information to demonstrate the differentiated performance between the multiple integrated solutions. The plurality of integrated solutions include a baseline integrated solution, wherein the baseline integrated solution includes a baseline bonding material or a plurality of baseline bonding materials, and a continuum of one or more additional integrated solutions measured relative to the baseline integrated solution, wherein each of the one or more additional integrated solutions includes one or more additional bonding materials in addition to the baseline bonding material or the plurality of baseline bonding materials. The GUI is configured to display a graphical representation of the multiple integrated solutions, wherein the graphical representation provides the product properties of each of the multiple integrated solutions, and wherein the product properties of the integrated solution differ from the product properties of the individual bonding materials constituting the integrated solution. The graphic representation is arranged such that one of the X-axis and the Y-axis identifies and displays the nature of the integrated solution, and the other of the X-axis or the Y-axis identifies the integrated solution, wherein the data is arranged such that the first row / column constructs the benchmark integrated solution; The intersection of the X and Y data points represents a specific property of a particular integrated solution.

[0057] In another embodiment, the invention also relates throughout to a computer program product embodied in a non-transitory computer-readable medium, the computer-readable medium storing a sequence of instructions that, when executed by a processor, cause the processor to perform a method for presenting a user with differentiated performance data for an integrated solution of mating components, the method comprising: - Provides a series of graphical user interfaces (GUIs) to display (i) integrated solutions for specific industry segments, manufacturing processes, or application processes; and (ii) successively displays multiple levels of information related to the differentiated performance data of multiple integrated solutions; - Generate a first graphical user interface that includes one or more first-level view icons, which display selections for industry segmentation, manufacturing process, or application process; - When one of the first-level view icons is selected, a second graphical user interface is generated, which displays information regarding the differentiated performance among the multiple integrated solutions. The plurality of integrated solutions include a baseline integrated solution, wherein the baseline integrated solution includes a baseline bonding material or a plurality of baseline bonding materials, and a continuum of one or more additional integrated solutions measured relative to the baseline integrated solution, wherein each of the one or more additional integrated solutions includes one or more additional bonding materials in addition to the baseline bonding material or the plurality of baseline bonding materials. The second GUI is configured to display a graphical representation of the plurality of integrated solutions, wherein the graphical representation provides the product properties of each of the plurality of integrated solutions, wherein the product properties of the integrated solution differ from the product properties of the individual bonding materials constituting the integrated solution. The graphic representation is arranged such that one of the X-axis and the Y-axis identifies and displays the nature of the integrated solution, and the other of the X-axis or the Y-axis identifies the integrated solution, wherein the data is arranged such that the first row / column constructs the benchmark integrated solution; -The intersection of X and Y data points represents a specific property of a particular integrated solution.

[0058] In one embodiment, the computer program product further includes: - Generate additional graphical user interfaces for displaying information related to one or more of the quality and / or performance and / or reliability objectives, quality and / or performance and / or reliability solutions; and risk mitigation for analyzing / determining / calculating performance data of one or more of the multiple integrated solutions, wherein each of the additional graphical user interfaces includes one or more view icons for distinguishing / highlighting / displaying the information to the user.

[0059] An example of the GUI according to the present invention is in Figures 6 to 22 It is shown in the figure and explained in detail below.

[0060] When a user of computing device 102 requests access to a dataset stored in data storage device 170, a graphical representation of information associated with the requested dataset is presented to the user via display device 120. For example... Figure 6 As shown, the request is in the form of interacting with a graphical user interface (GUI) generated by the processor 115 of the execution interface module 125. Figure 6 A main screen 300 is depicted for viewing by the user of computing device 102 when the GUI is launched. The main screen 300 provides multiple navigation tiles 302, 303, 304, and 305 to provide navigation to additional display screens of the GUI. Navigation between different display screens can also be achieved via navigation icons 308 shown at the top of the display screens.

[0061] For example, if a user selects navigation tile 305 (or its associated navigation icon), then the user is presented with... Figure 7 The different display screens shown provide additional navigation tiles linked to different industry segments 192, and users can select specific industry segments. Figure 7 The industry segment 192 described in the text corresponds to Figure 5 The industry segment 192 shown is an example. Industry segments may include, for example, the automotive industry 196, the mobile device industry 197, the computing industry 198, and the general electronics industry 199, etc. These industry segments are merely examples of different industry segments that can be used with the integrated solutions described herein. It is anticipated that those skilled in the art may incorporate other industry segments if needed.

[0062] When selecting specific industry segments 196, 197, 198, or 199, such as Figure 8As shown, a graphical representation of a dataset corresponding to a specific industry segment 192' is presented to the user for exploration. In this graphical representation, the X-axis 420 contains headers (not shown) relating to specific properties and / or information related to various material solutions and / or integrated solutions, and the Y-axis 410 provides headers (not shown) relating to specific material solutions and / or integrated solutions. Additionally, in some embodiments, icons 422 (not shown) for specific properties or integrated solutions may also be provided. The headers 420, 410 and / or icons 422 may be optional (i.e., "clickable" or otherwise interactive), allowing the GUI to display additional information about the selected properties and / or integrated solutions.

[0063] Properties associated with various integrated solutions may include mechanical reliability, electrochemical reliability, and cost analysis. Mechanical reliability properties may include thermal cycling, vibration, and / or drop impact. Electrochemical reliability properties may include surface insulation resistance (SIR), curing kinetic interactions, and / or adhesion strength. Cost analysis properties may include material costs and / or processing costs. The first row / column of data in the graphical representation is typically designated as a baseline and forms the basis for comparing various material solutions and / or integrated solutions. In one implementation, this baseline may be the first row / column 402 in the graphical representation. When the user selects (i.e., “clicks” or otherwise interacts with) icons 430 and 432 designated as “i”, the icon provides insights to further highlight or define the features depicted in the graphical representation of the data, which allows the GUI to display additional information.

[0064] For example, if the user selects such Figure 9 The column 445, indicated as 430, is highlighted or emphasized. This highlighting or emphasis can be achieved by filling the column with color and / or crosshair patterns, or by otherwise bringing emphasis to a specific area of ​​the display. Additionally, the display provides a pop-up display 450 with additional insights into the data contained in the highlighted column in the graphical display. Selecting icon 451 within the pop-up display 450 generates additional information, which may include insights related to, for example, risk factors and risk mitigation, solution failure, material interactions, etc. For example, for this particular solution, selecting icon 451 will display the following... Figure 21 The information presented herein. Alternatively (or additionally), this pop-up may display other data or information that provides insights into a particular property or solution. Additionally, selecting “i” 432 may display other insights. Selecting “X” 452 closes the pop-up and returns the user to the previous screen.

[0065] When a pop-up display or pop-up window is provided with additional insights, the graphical representation can be paused or held in the background. Once the pop-up display or window is closed, the graphical representation of the specific industry segment 192 or 192' resumes functionality and interactivity.

[0066] like Figure 10 As shown, if the user selects a specific property to depict on the X-axis 420 or icon 422, the column 446 corresponding to that specific property is highlighted or emphasized. Information related to test conditions and failure definitions, test equipment, and test vehicles is displayed in pop-up window 460. Additional information about the test being performed can be viewed by selecting any of the navigation blocks (i.e., “Test Conditions and Failure Definitions,” “Test Equipment,” or “Test Vehicle”). (Note that this is merely an example of the information that can be displayed regarding additional information, and other / different information and / or information may be displayed in different ways.) Similarly, one or more pop-up windows can be closed by selecting “X” 452.

[0067] In a similar way, and as Figure 11 and Figure 12 As shown, if the user selects a specific bonding material / material solution / integration solution from the bonding materials / material solutions / integration solutions arranged on the Y-axis 410 or icon 422, the rows 447 and 448 associated with the material / solution are highlighted or emphasized. Data related to the properties of the material / solution are also displayed in the pop-up window. Figure 11 The baseline solution 447 shown is depicted, while Figure 11 Different solutions 448 on the continuum shown in the figure are depicted. Figure 11 and Figure 12 Of the two, pop-up windows 470 and 470' provide information about materials / material solutions, which can be further explored by selecting navigation block 471, allowing users to access information such as... Figure 13 The pop-up window 480 shown explores additional features / advantages of the selected material / material solution. These additional features / advantages can be illustrated by comparison with a benchmark solution. One or more pop-up windows can be closed by selecting "X" 452.

[0068] like Figure 14As shown, if XY data point 449 corresponding to a specific bonding material / material solution / integrated solution (Y-axis) and a specific test parameter or performance parameter (X-axis) is selected, that XY data point 449 is highlighted or emphasized, and a pop-up window 490 is provided to offer information related to the specific combination and the positive increase / change relative to a baseline. Additionally, if icon 492 is selected, precise data regarding the specific combination of bonding material / material solution / integrated solution is displayed to the user, such as... Figure 15 As shown in the figure, pop-up window 500 displays data / process conditions / etc. for a specific combination of materials / material solutions / integrated solutions. This precise data can also be shown as a performance comparison with a benchmark solution. One or more pop-ups can be closed by selecting "X" 452.

[0069] Figure 16 and Figure 17 It describes different industry segments. For example... Figure 16 and Figure 17 As shown, depending on industry segmentation, different test data / performance data / information may be included, and different insights may be included, as indicated by “i” 431. By selecting “i” 431, a different display is provided, which shows the benchmark and maximum value as a graphical representation 610, which is further explained in a pop-up window 620. The pop-up window can be closed by selecting “X” 452.

[0070] Another important aspect of this invention is characterizing the risks that may arise due to the use of incompatible materials. Therefore, a key feature of this invention also involves understanding the risks associated with incompatible materials or potentially adverse material interactions in a particular application. Thus, in one embodiment, the invention also relates to the characterization and mitigation / minimization of negative material interactions. This can also be achieved through the corresponding system-level performance improvements resulting from the use of an integrated solution that has demonstrated differentiated performance and is shown to be suitable as an integrated solution for specific substrate surfaces in electronic applications (which can vary based on specific industry segments, assembly processes, application processes, or manufacturing processes, and certain packaging designs), or for use under high stress or other distinctive conditions.

[0071] Therefore, turning back to Figure 6The diagram depicts the main screen 300 viewed by a user of computing device 102 when the GUI is launched. The main screen 300 provides multiple navigation tiles 302, 303, 304, and 305 to provide navigation to additional display screens of the GUI. Navigation between different display screens can also be accomplished via navigation icons 308 shown at the top of the display screens. In this case, if the user selects navigation tile 304 (or its associated navigation icon), the following is presented to the user: Figure 18 The different display screens shown display information related to risk factors and risk mitigation when integrating different materials onto components.

[0072] like Figure 18 As shown, the GUI provides navigation icons for "Cure Kinetics Interaction" 702, "Encapsulation-Specific Strain Vector" 704, "SIR Temperature Sensitivity" 706, and "Underlying Filler Surface Compatibility" 708. As will be apparent to those skilled in the art, these navigation icons may be named differently and / or additional navigation icons may exist for additional risk factors depending on the specific integrated solution presented or when additional information becomes available.

[0073] When a user selects one of the navigation blocks / icons 702, 704, 706, or 708, a pop-up window displays a graphical representation of the associated risk factors, risk mitigation, and information related to the specific risk factors. For example, when the user selects the navigation block / icon for solidifying dynamic interactions 702, a pop-up window 703 is displayed, such as... Figure 19 As shown. Also as... Figure 19 As shown, information explaining specific risks 710 and specific risk mitigation 720 is displayed to the user, along with additional information to help the user understand and differentiate specific risks. Similarly, as... Figure 20 As shown, when selecting a navigation tile / icon to encapsulate a specific strain vector 704, a pop-up window 705 is displayed to the user to provide detailed risk-related information about that specific topic. Similarly, in Figure 21 and Figure 22 In the context of selecting navigation tiles / icons 706 or 708, pop-up windows 707 and 709 are displayed to the user, respectively. Like any other pop-up window described in this document, it can be closed by selecting "X" 452.

[0074] As described herein, the computer-implemented methods and systems described herein demonstrate a unique ability to effectively communicate the following: 1) A very large, complex and unique dataset that supports recommendations for combining various material solutions; 2) Indicative performance in key technical requirements, which are specific to individual material sets and industry segment-specific test proposals, support customer-design-level material selection processes that can be used for specific applications; 3) Enabling technologies that enable customers / users to meet new and more demanding performance requirements driven by new circuit board designs, semiconductor packaging designs, and ever-increasing reliability requirements; 4) Improved system-level reliability; and 5) The ability to reduce total cost of ownership while still meeting technical specifications.

[0075] This interactive digital tool is presented seamlessly: 1) Test methods, conditions, failure criteria, equipment set, test carrier preparation standards, performance data, performance standards, cost of ownership, etc. 2) A continuum of various integrated material solutions; 3) Performance improvements of a range of integrated solution materials, such as those measured against benchmark industry standards that aid in customer / user decision-making processes; and 4) Risk factors and risk mitigation techniques, which are used to assess the risks associated with the use of incompatible bonding materials, etc., to help customers evaluate and select specific integration solutions that meet their needs.

[0076] The tools described in this article can be used by one of the following types of customers: a. Challenged by new component / reliability requirements; b. Understand the different available constructs and are considering the recommended solution; c. The solution being used for evaluation is being treated as a second source; and / or d. To understand the options that can be used to reduce total cost of ownership.

[0077] Examples of risk factors that arise when different materials are integrated into a component include, but are not limited to: a. Encapsulating specific strain vectors—different encapsulation:die ratios produce varying strain patterns (i.e., in different XYZ vectors) and require appropriate reinforcement strategies; b. Curing kinetics interactions—chemical interactions can alter the polymer curing kinetics; c. SIR temperature sensitivity—Polymer reinforcements are more prone to SIR failure at higher thermal distribution profiles; and / or d. Underfill surface compatibility – Ineffective underfill / flux combination can lead to low adhesion strength and / or SIR failure.

[0078] Risk management based on the use of various integrated solutions can also be evaluated / assessed / calculated, and this information, centrally included in the dataset, can be stored in data storage device 170 for system access. For example, the combination of polymer reinforcing materials and flux residues can interact to accelerate electrochemical failures caused by incomplete curing, moisture ingress due to increased temperature and humidity, etc. Additionally, mechanical properties (such as mechanical vibration) and packaging considerations (such as surface mount packaging, such as ball grid array (BGA) architectures that determine the stress-induced behavior of devices during thermal cycling) and the mechanical properties of adhesives can be evaluated / assessed / calculated to mitigate risks.

[0079] SIR testing of various bonding materials and integrated solutions containing one or more bonding materials demonstrates that many integrated solution sets with bonding materials fail in SIR tests. While each material is of high quality on its own, interactions within the integrated solution can lead to failure. This demonstrates the necessity of knowing which materials work synergistically with each other, which can only be verified through extensive testing and evaluation of material combinations. This test and / or performance data is stored in data storage device 170 and is accessible to the user for each specific material solution / integrated solution on user interface 140. It should also be noted that any untested combination presents a significant probability of failure. That is, utilizing the tools described herein ensures obtaining appropriate integrated solutions with qualified components while minimizing the risks arising from the use of incompatible materials or materials whose compatibility has not been evaluated or tested.

[0080] As used herein, the term “bonding material” generally refers to solder paste, other welding materials, sintering materials, adhesives, glues, fluxes, chemicals, polymers, metals (in various forms), films, protective materials, reinforcement solutions, etc., which are used to bond, join, bond, or otherwise connect components, layers, surfaces, boards (i.e., PWB, PCB), inner layers, etc. in the electronics industry.

[0081] As used herein, unless the context clearly indicates otherwise, “a,” “an,” and “the” refer to both singular and plural references.

[0082] As used herein, the term “about” refers to a measurable value, such as a parameter, quantity, duration, etc., and is intended to include variations of + / -15% or less, preferably + / -10% or less, more preferably + / -5% or less, even more preferably + / -1% or less, and even more preferably + / -0.1% or less, provided such variations are suitable for implementation in the invention described herein. Furthermore, it should be understood that the values ​​referred to by the modifier “about” are themselves specifically disclosed herein.

[0083] As used herein, for ease of description, spatial relative terms such as “below,” “under,” “lower,” “above,” and “upper” are used to describe the relationship of one element or feature to one or more other elements or features, as shown in the figures. Spatial relative terms may be intended to cover different orientations of the device in use or operation other than those shown in the figures.

[0084] As used herein, the term "comprising and / or including" specifies the presence of the described features, integers, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

Claims

1. A computer-implemented method for demonstrating differentiated performance among integrated solutions for joining components, wherein the computer-implemented method comprises at least: Processor, the processor being used to execute instructions; A memory, wherein instructions are stored; and a database populated with data related to bonding materials, wherein the database is accessible by the processor, wherein the computer-implemented method is executed within a host organization, wherein the method includes: - Instructions are executed via the processor, wherein the processor is programmed to (a) access data stored in the database, and (b) generate a graphical user interface (GUI) at a user computing device to display a graphical representation of the differentiated performance among a plurality of integrated solutions, wherein each of the plurality of integrated solutions includes one or more bonding materials; - Populate the GUI with data related to the bonding material, wherein the data related to the bonding material and its properties is stored in the database; - The GUI is transmitted to the user computing device for display, wherein the GUI displays information to demonstrate the differentiated performance among the multiple integrated solutions. The plurality of integrated solutions include a baseline integrated solution, wherein the baseline integrated solution includes a baseline bonding material or a plurality of baseline bonding materials, and a continuum of one or more additional integrated solutions measured relative to the baseline integrated solution, wherein each of the one or more additional integrated solutions includes one or more additional bonding materials in addition to the baseline bonding material or the plurality of baseline bonding materials; The GUI is configured to display a graphical representation of the plurality of integrated solutions, wherein the graphical representation provides the product properties of each of the plurality of integrated solutions, wherein the product properties of the integrated solutions differ from the product properties of the individual bonding materials constituting the integrated solutions. The graphical representation is arranged such that one of the X-axis and the Y-axis identifies and displays the properties of the integrated solution, and the other of the X-axis or the Y-axis identifies the integrated solution, wherein the data is arranged such that the first row / column constructs the benchmark integrated solution; The intersection of X and Y data points represents a specific property of a particular integrated solution; The method further includes: - Based on the selection of the intersection of specific XY data points, a pop-up window is generated to display a visualization of product information related to the data / support / analysis of the benchmark integrated solution, or a visualization of product information related to the data / support / analysis of the specific integrated solution compared to the benchmark integrated solution, to indicate system-level performance improvements; - Based on the selection of product properties on the X-axis or Y-axis, a pop-up window is generated to display visualizations of information related to test data, performance data, and conditions used to generate the information related to the data / support / analysis of the multiple integrated solutions; and / or - Based on the selection of the integrated solution on the X-axis or the Y-axis, a pop-up window is generated to display a visualization of information related to the integrated solution.

2. The method of claim 1, wherein the GUI comprises a plurality of GUIs, each of the plurality of GUIs constructing an integrated solution for a specific industry segment, manufacturing process, or application process.

3. The method according to claim 1 or claim 2, wherein the product properties constitute one or more of mechanical reliability, electrochemical reliability, and cost analysis.

4. The method according to any one of claims 1 to 3, wherein the bonding material is selected from the group consisting of: welding materials, solder paste, glue, adhesive, polymer, resin, sintering materials, protective materials, reinforcing materials, other bonding and joining materials commonly used in electronic manufacturing, and combinations thereof.

5. The method according to any one of claims 1 to 4, wherein the GUI is configured to transmit information related to risk factors and risk mitigation strategies of the bonding material and the integrated solution including the bonding material.

6. The method according to any one of claims 1 to 5, wherein when the pop-up window is displayed, the graphic representation remains in a hover state.

7. A system comprising: a. A processor for executing instructions, wherein the processor is programmed to (a) access data stored in a database, and (b) generate graphical representations of a plurality of bonded materials and their properties; b. A database filled with data relating to the bonding material and its properties, wherein the database is accessible by the processor; and c. A memory operatively connected to the processor, the memory having instructions executable by the processor, the instructions including: - The processor executes the generation of a graphical user interface (GUI) at a user computing device to display the differentiated performance among multiple integrated solutions, each of which includes one or more bonding materials; - Populate the GUI with data related to the bonding materials and their properties; - The GUI is displayed on the user's computing device, wherein the GUI displays information to demonstrate the differentiated performance among the multiple integrated solutions. The plurality of integrated solutions include a baseline integrated solution, wherein the baseline integrated solution includes a baseline bonding material or a plurality of baseline bonding materials, and a continuum of one or more additional integrated solutions measured relative to the baseline integrated solution, wherein each of the one or more additional integrated solutions includes one or more additional bonding materials in addition to the baseline bonding material or the plurality of baseline bonding materials; The GUI is configured to display a graphical representation of the plurality of integrated solutions, wherein the graphical representation provides the product properties of each of the plurality of integrated solutions, wherein the product properties of the integrated solutions differ from the product properties of the individual bonding materials constituting the integrated solutions. The graphical representation is arranged such that one of the X-axis and the Y-axis identifies and displays the properties of the integrated solution, and the other of the X-axis or the Y-axis identifies the integrated solution, wherein the data is arranged such that the first row / column constructs the benchmark integrated solution; The intersection of the X and Y data points represents a specific property of a particular integrated solution.

8. The system of claim 7, wherein the system further comprises: - Based on the selection of the intersection of specific XY data points, a pop-up window is generated to display a visualization of product information related to the data / support / analysis of the benchmark integrated solution, or a visualization of product information related to the data / support / analysis of the specific integrated solution compared to the benchmark integrated solution, to indicate system-level performance improvements; - Based on the selection of product properties on the X-axis or Y-axis, a pop-up window is generated to display visualizations of information related to test data, performance data, and conditions used to generate the information related to the data / support / analysis of the multiple integrated solutions; And / or - Based on the selection of the integrated solution on the X-axis or the Y-axis, a pop-up window is generated to display a visualization of information related to the integrated solution.

9. The system of claim 7 or claim 8, wherein the GUI comprises a plurality of GUIs, each of the plurality of GUIs constructing an integrated solution for a specific industry segment, manufacturing process, or application process.

10. The system according to any one of claims 7 to 9, wherein the product properties constitute one or more of mechanical reliability, electrochemical reliability, and cost analysis.

11. The system according to any one of claims 7 to 10, wherein the bonding material is selected from the group consisting of: welding materials, solder paste, glue, adhesive, polymer, resin, sintering materials, protective materials, reinforcing materials, other bonding and joining materials commonly used in electronic manufacturing, and combinations thereof.

12. The system according to any one of claims 7 to 11, wherein the GUI is configured to transmit information related to risk factors and risk mitigation strategies of the bonding material and the integrated solution including the bonding material.

13. The system according to any one of claims 8 to 12, wherein when the pop-up window is displayed, the graphical representation remains in a hover state.

14. A computer program product embodied in a non-transitory computer-readable medium, the computer-readable medium storing a sequence of instructions, which, when executed by a processor, cause the processor to perform a method for presenting a user with differentiated performance data for an integrated solution of mating components, the method comprising: - Provides a range of graphical user interfaces (GUIs) to display (i) integrated solutions for specific industry segments, manufacturing processes, or application processes; (ii) successively displaying multiple levels of information related to the differentiated performance data of multiple integrated solutions; - Generate a first graphical user interface including one or more first-level view icons, which display selections for industry segmentation, manufacturing process, or application process; - Upon selection of one of the first-level view icons, a second graphical user interface is generated, which displays information regarding the differentiated performance among the multiple integrated solutions. The plurality of integrated solutions include a baseline integrated solution, wherein the baseline integrated solution includes a baseline bonding material or a plurality of baseline bonding materials, and a continuum of one or more additional integrated solutions measured relative to the baseline integrated solution, wherein each of the one or more additional integrated solutions includes one or more additional bonding materials in addition to the baseline bonding material or the plurality of baseline bonding materials; The second GUI is configured to display a graphical representation of the plurality of integrated solutions, wherein the graphical representation provides the product properties of each of the plurality of integrated solutions, wherein the product properties of the integrated solutions differ from the product properties of the individual bonding materials constituting the integrated solutions. The graphical representation is arranged such that one of the X-axis and the Y-axis identifies and displays the properties of the integrated solution, and the other of the X-axis or the Y-axis identifies the integrated solution, wherein the data is arranged such that the first row / column constructs the benchmark integrated solution; -The intersection of X and Y data points represents a specific property of a particular integrated solution.

15. The computer program product according to claim 14, further comprising: - Generate an additional graphical user interface for displaying information related to one or more of the quality and / or performance and / or reliability objectives, and quality and / or performance and / or reliability solutions; And risk mitigation, which is used to analyze / determine / calculate performance data for one or more of the plurality of integrated solutions, wherein each of the additional graphical user interfaces includes one or more view icons for distinguishing / highlighting / displaying the information to the user.

16. The computer program product according to claim 14 or claim 15, wherein the computer program product further comprises: - Based on the selection of the intersection of specific XY data points, a pop-up window is generated to display a visualization of product information related to the data / support / analysis of the benchmark integrated solution, or a visualization of product information related to the data / support / analysis of the specific integrated solution compared to the benchmark integrated solution, to indicate system-level performance improvements; - Based on the selection of product properties on the X-axis or Y-axis, a pop-up window is generated to display visualizations of information related to test data, performance data, and conditions used to generate the information related to the data / support / analysis of the multiple integrated solutions; And / or - Based on the selection of the integrated solution on the X-axis or the Y-axis, a pop-up window is generated to display a visualization of information related to the integrated solution.

17. The computer program product according to any one of claims 14 to 16, wherein the product properties are based on one or more of mechanical reliability, electrochemical reliability, and cost analysis.

18. The computer program product according to any one of claims 14 to 17, wherein the bonding material is selected from the group consisting of: welding materials, solder paste, glue, adhesive, polymer, resin, sintering materials, protective materials, reinforcing materials, other bonding and joining materials commonly used in electronic manufacturing, and combinations thereof.

19. The computer program product according to any one of claims 16 to 18, wherein when the pop-up window is displayed, the graphical representation remains in a hover state.

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