Full-automatic substrate cutting equipment

Abstract

The invention relates to full-automatic base plate cutting equipment which comprises a rack, a feeding and discharging mechanism is connected to the outer side of the rack, a Y-axis moving module is connected to the rack, an X-axis moving module is connected to the Y-axis moving module through a sliding block, a feeding fixing plate is connected to the X-axis moving module through a sliding block, and a feeding assembly is connected to the feeding fixing plate. An adsorption assembly is connected to the feeding fixing plate, a portal frame is connected to the rack, a laser cutting mechanism is connected to the upper portion of the portal frame, a material taking and placing assembly is connected to the side edge of the portal frame, a Z-axis moving module is connected to the portal frame, and a sliding block of the Z-axis moving module is connected with a camera assembly. The machining efficiency can be improved.

Description

Technical Field

[0001] This invention relates to a fully automated substrate cutting device. Background Technology

[0002] Laser cutting uses a laser beam instead of a traditional mechanical blade, offering advantages such as high precision, fast cutting speed, no limitation on cutting patterns, smooth cuts, and low processing costs. It is gradually improving upon or replacing traditional cutting processes and equipment. Currently, processing small-sized MEMS substrates after cutting requires specialized jigs, which are expensive and time-consuming. Furthermore, laser cutting machines rely on manual feeding and unloading, resulting in low efficiency, low machine uptime, long periods of ineffective operation, and low production capacity.

[0003] In view of the above-mentioned shortcomings, the designer actively researched and innovated in order to create a new type of fully automated substrate cutting equipment with greater industrial application value. Summary of the Invention

[0004] To address the aforementioned technical problems, the purpose of this invention is to provide a fully automated substrate cutting device.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A fully automatic substrate cutting equipment includes a frame, an unloading mechanism connected to the outside of the frame, a Y-axis moving module connected to the frame, an X-axis moving module connected to the Y-axis moving module via a sliding block, a feeding fixing plate connected to the X-axis moving module via a sliding block, a feeding assembly connected to the feeding fixing plate, an adsorption assembly connected to the feeding fixing plate within the feeding assembly, a gantry frame connected to the frame, a laser cutting mechanism for laser cutting products on the adsorption assembly connected above the gantry frame, a pick-and-place assembly for picking up and placing products in the unloading mechanism connected to the side of the gantry frame, a Z-axis moving module connected to the gantry frame, a sliding block of the Z-axis moving module connected to the laser cutting working end in the laser cutting mechanism, and a camera assembly connected to the sliding block of the Z-axis moving module. With the movement of the X-axis and Y-axis moving modules, the adsorption assembly and the feeding assembly are movably positioned between the unloading mechanism, the pick-and-place assembly, the laser cutting mechanism, and the camera assembly.

[0007] Preferably, in the fully automatic substrate cutting equipment, the loading and unloading mechanism includes a loading and unloading moving module, which is vertically connected to the side of the frame. A loading and unloading support frame is connected to the sliding block of the loading and unloading moving module, and a material box is connected to the loading and unloading support frame. A window opposite to the material box is opened on the side of the frame.

[0008] Preferably, in the fully automatic substrate cutting equipment, the laser cutting mechanism includes a laser, a reflector module, a galvanometer and a field lens module. The laser and the reflector module are connected to a gantry, and the galvanometer and the field lens module are connected to a Z-axis moving module. The laser, the reflector module, and the galvanometer and the field lens module form a laser cutting optical path.

[0009] Preferably, in the fully automatic substrate cutting equipment, the material handling assembly includes a material handling bracket connected to the side of the gantry frame. An X-axis material handling moving module is connected to the material handling bracket. A first Z-axis material handling cylinder is connected to the sliding block of the X-axis material handling moving module. A material handling fixing plate is connected to the drive shaft of the first Z-axis material handling cylinder. An X-axis material handling cylinder is connected to the material handling fixing plate. The drive shaft of the X-axis material handling cylinder is connected to a material handling connecting plate. A material handling connecting bracket plate is connected below the material handling connecting plate. A lower clamping piece for clamping the bottom of the product is connected to the bottom of the material handling connecting bracket plate. A material handling clamping cylinder is connected to the material handling connecting bracket plate. An upper clamping piece opposite to the lower clamping piece is connected to the drive shaft of the material handling clamping cylinder.

[0010] Preferably, the fully automatic substrate cutting equipment includes a feeding assembly comprising a first feeding fixture and a second feeding fixture. The first feeding fixture is connected to one side of a feeding fixture plate, and a feeding slide rail is connected to the other side of the feeding fixture plate. The second feeding fixture is slidably connected to the feeding slide rail via a slider. A hand-cranked transmission screw for moving the second feeding fixture is connected between the first feeding fixture and the second feeding fixture. A conveyor belt for product transfer is connected above the first feeding fixture and the second feeding fixture.

[0011] Preferably, in the fully automatic substrate cutting equipment, the conveyor belt is a motor-driven belt conveyor.

[0012] Preferably, in the fully automatic substrate cutting equipment, the adsorption assembly includes an adsorption fixing plate, an adsorption lifting cylinder connected to the adsorption fixing plate, an adsorption connecting plate connected to the drive shaft of the adsorption lifting cylinder, a blow-suction pipe connected to the bottom of the adsorption connecting plate, an adsorption plate connected to the adsorption connecting plate, an adsorption hole communicating with the blow-suction pipe on the adsorption plate, and an adsorption guide column passing through the adsorption fixing plate via a linear bearing, the top end of the adsorption guide column being connected to the adsorption connecting plate.

[0013] Preferably, in the fully automatic substrate cutting equipment, the bottom of the Z-axis moving module is connected to a dust collection box for collecting dust generated by the laser cutting mechanism.

[0014] Preferably, in the fully automatic substrate cutting equipment, the galvanometer and field lens module are arranged on the same axis as the camera assembly.

[0015] Preferably, in the fully automatic substrate cutting equipment, the camera assembly includes a camera fixing block and a camera, and the camera is connected to the sliding block of the Z-axis moving module via the camera fixing block.

[0016] By means of the above-described solution, the present invention has at least the following advantages:

[0017] 1. This invention can be used with MEMS sheet products with ring-shaped UV films to achieve automated laser processing of micro products, enabling the processing of various products and reducing costs.

[0018] 2. The material loading and unloading of the present invention uses a shared set of loading and unloading components, which reduces the overall material quantity of the equipment and improves the cost-effectiveness of the product.

[0019] 3. This invention solves the problem of film adhesion in laser processing by blowing away the film on the adsorption plate, effectively improving the stability of equipment processing.

[0020] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it in accordance with the contents of the specification, the preferred embodiments of the present invention are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the structure of the present invention;

[0023] Figure 2 yes Figure 1 Internal structure diagram;

[0024] Figure 3 This is a schematic diagram of the structure of the loading and unloading assembly of the present invention;

[0025] Figure 4 This is a schematic diagram of the material handling assembly of the present invention;

[0026] Figure 5 This is a schematic diagram of the laser cutting mechanism and camera assembly of the present invention;

[0027] Figure 6This is a schematic diagram of the feeding assembly of the present invention;

[0028] Figure 7 This is a schematic diagram of the adsorption component of the present invention. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0030] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0031] Example

[0032] like Figures 1 to 7 As shown, a fully automatic substrate cutting equipment includes a frame 1, with a loading / unloading mechanism 2 connected to the outer side of the frame 1. A Y-axis moving module 3 is connected to the frame 1, and an X-axis moving module 11 is connected to the Y-axis moving module 3 via a sliding block. A feeding fixing plate is connected to the X-axis moving module 11 via a sliding block. A feeding assembly 4 is connected to the feeding fixing plate, and an adsorption assembly 5 is connected to the feeding fixing plate within the feeding assembly. A gantry frame 6 is connected to the frame 1, and a laser cutting mechanism 7 for laser cutting the products on the adsorption assembly 5 is connected above the gantry frame 6. The side of the gantry 6 is connected to a material handling assembly 8 for picking up and placing products in the loading and unloading mechanism 2. A Z-axis moving module 9 is connected to the gantry 6. The sliding block of the Z-axis moving module 9 is connected to the laser cutting working end in the laser cutting mechanism 7. The sliding block of the Z-axis moving module 9 is connected to the camera assembly 10. The galvanometer and field lens module 73 are arranged on the same axis as the camera assembly 10. Under the movement of the X-axis moving module 11 and the Y-axis moving module 3, the adsorption assembly 5 and the feeding assembly are movably arranged between the loading and unloading mechanism 2, the material handling assembly 8, the laser cutting mechanism 7 and the camera assembly 10.

[0033] In this embodiment, the loading / unloading mechanism 2 includes a loading / unloading moving module 21, which is vertically connected to the side of the frame 1. A loading / unloading support frame 22 is connected to the sliding block of the loading / unloading moving module 21, and a material box 23 is connected to the support frame 22. A window opposite the material box is provided on the side of the frame 1. In actual operation, a single material box is used in the loading / unloading mechanism to load and unload products, saving space.

[0034] In practice, the loading and unloading of the material box is controlled by a back-end control device (PC). After unloading, the processed product is returned to its original position (i.e., loading). During loading, the material box rises or falls once for each sequential item. The rising or falling is set by those skilled in the art.

[0035] In this embodiment, the laser cutting mechanism 7 includes a laser 71, a reflector module 72, and a galvanometer and field mirror module 73. The laser 71 and the reflector module 72 are connected to a gantry, and the galvanometer and field mirror module 73 is connected to a Z-axis moving module 9. The laser 71, the reflector module 72, and the galvanometer and field mirror module 73 form a laser cutting optical path. The laser 71, the reflector module 72, and the galvanometer and field mirror module 73 are all technologies known to those skilled in the art, and their installation is also known to those skilled in the art, so it will not be described in detail here.

[0036] In this embodiment, the material handling assembly 8 includes a material handling bracket 81 connected to the side of the gantry 6. An X-axis material handling moving module 82 is connected to the material handling bracket 81. A first Z-axis material handling cylinder 83 is connected to the sliding block of the X-axis material handling moving module 82. A material handling fixing plate 84 is connected to the drive shaft of the first Z-axis material handling cylinder 83. An X-axis material handling cylinder 85 is connected to the material handling fixing plate 84. The drive shaft of the X-axis material handling cylinder 85 is connected to a material handling connecting plate. A material handling connecting bracket plate 86 is connected below the material handling connecting plate. A lower clamping piece 87 for clamping the bottom of the product is connected to the bottom of the material handling connecting bracket plate 86. A material handling clamping cylinder 88 is connected to the material handling connecting bracket plate 86. An upper clamping piece 89 opposite to the lower clamping piece is connected to the drive shaft of the material handling clamping cylinder 88.

[0037] In actual operation, the loading and unloading component 8 removes the product from the loading and unloading component and places it on the feeding component. Similarly, the loading component removes the cut and processed product from the feeding component and places it into the material box inside the loading and unloading component.

[0038] In this embodiment, the feeding assembly 4 includes a first feeding fixing frame 41 and a second feeding fixing frame 42. The first feeding fixing frame 41 is connected to one side of a feeding fixing plate, and a feeding slide rail 43 is connected to the other side of the feeding fixing plate. The second feeding fixing frame 42 is slidably connected to the feeding slide rail 43 via a slider. A hand-cranked transmission screw 44 for moving the second feeding fixing frame 42 passes between the first feeding fixing frame 41 and the second feeding fixing frame 42. A conveyor belt 45 for product transfer is connected above the first feeding fixing frame 41 and the second feeding fixing frame 42. The feeding assembly 4 delivers the product directly above the adsorption assembly or returns the processed product to the starting position.

[0039] In the above-mentioned transmission process, the transmission belt 45 is a motor-driven belt conveyor. The belt conveyor driven by the motor is a well-known technology known to those skilled in the art, and the specific structure will not be described in detail.

[0040] Meanwhile, the hand-cranked transmission screw 44 in the feeding assembly 4 can slide the second feeding fixture 42, which can adapt to different product sizes.

[0041] In this embodiment, the adsorption assembly 5 includes an adsorption fixing plate 51, an adsorption lifting cylinder 52 connected to the adsorption fixing plate 51, an adsorption connecting plate 53 connected to the drive shaft of the adsorption lifting cylinder 52, a blow-suction pipe connected to the bottom of the adsorption connecting plate 53, an adsorption plate 54 connected to the adsorption connecting plate 53, and an adsorption hole on the adsorption plate 54 communicating with the blow-suction pipe. An adsorption guide post 55 is connected to the adsorption fixing plate 51 via a linear bearing, and the top end of the adsorption guide post 55 is connected to the adsorption connecting plate 53. The adsorption assembly can adsorb products. Specifically, after the sensor detects a product, the adsorption lifting cylinder rises, bringing the adsorption plate into contact with the product. Then, the product is adsorbed through the blow-suction pipe and an external blow-suction device, thereby achieving product adsorption.

[0042] After laser processing, the film on the product tends to adhere to the adsorption plate. To solve the adhesion problem, the entire platform is backflushed with gas through a blower to the adsorption plate surface.

[0043] In this embodiment, the bottom of the Z-axis moving module 9 is connected to a dust collection box 12 for collecting dust generated by the laser cutting mechanism 7.

[0044] In an embodiment, the camera assembly 10 includes a camera fixing block 101 and a camera 102, wherein the camera 102 is connected to the sliding block of the Z-axis moving module 9 via the camera fixing block 101.

[0045] The working principle of this invention is as follows:

[0046] In actual operation, the loading and unloading assembly lifts the material box to the window, and the picking and placing assembly places the product (sheet) along with the sheet towards the conveying assembly. The conveying assembly then moves it above the adsorption assembly. The adsorption assembly then lifts the adsorption plate to contact the product and adsorbs it. After adsorption is completed, the camera assembly and the laser cutting mechanism work together to realize image recognition, processing, and galvanometer correction of the MEMS substrate sheet. After the camera assembly recognizes the sheet that has been grabbed, the laser cutting mechanism controls the laser switch light and the galvanometer angle to make the laser move along the pattern trajectory to achieve laser cutting processing of the sheet.

[0047] If the pattern to be processed exceeds the single processing range of the marking laser cutting mechanism, it can also be spliced ​​through the X-axis and Y-axis moving modules. The processing method is the same as the above-mentioned method, except that the excess part is processed by moving the X-axis and Y-axis moving modules.

[0048] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0049] This invention can be used with MEMS sheet products featuring ring-shaped UV films to achieve automated laser processing of micro-products, enabling the processing of multiple products and reducing costs. Loading and unloading utilize a shared set of components, reducing the overall material quantity of the equipment and improving product cost-effectiveness. It also solves the problem of film adhesion during laser processing by blowing away the film from the adsorption plate, effectively improving the stability of the equipment.

[0050] In the description of this application, it should be noted that the terms "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0051] Furthermore, terms such as "horizontal" and "vertical" do not imply that components must be absolutely horizontal or vertical, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0052] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0053] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A fully automatic substrate cutting equipment, characterized in that: The system includes a frame (1), with a loading and unloading mechanism (2) connected to the outside of the frame (1). A Y-axis moving module (3) is connected to the frame (1), and an X-axis moving module (11) is connected to the Y-axis moving module (3) via a sliding block. A feeding fixing plate is connected to the X-axis moving module (11) via a sliding block. A feeding assembly (4) is connected to the feeding fixing plate. An adsorption assembly (5) is connected to the feeding fixing plate inside the feeding assembly. A gantry frame (6) is connected to the frame (1), and a laser cutting mechanism (7) for laser cutting products on the adsorption assembly (5) is connected above the gantry frame (6). The side of the gantry (6) is connected to a material handling component (8) for picking up and placing products in the loading and unloading mechanism (2). The gantry (6) is connected to a Z-axis moving module (9). The sliding block of the Z-axis moving module (9) is connected to the laser cutting working end in the laser cutting mechanism (7). The sliding block of the Z-axis moving module (9) is connected to the camera component (10). Under the movement of the X-axis moving module (11) and the Y-axis moving module (3), the adsorption component (5) and the feeding component are movably arranged between the loading and unloading mechanism (2), the material handling component (8), the laser cutting mechanism (7) and the camera component (10).

2. The fully automatic substrate cutting equipment according to claim 1, characterized in that: The loading and unloading mechanism (2) includes a loading and unloading moving module (21), which is vertically connected to the side of the frame (1). A loading and unloading support frame (22) is connected to the sliding block of the loading and unloading moving module (21), and a material box (23) is connected to the loading and unloading support frame (22). A window opposite to the material box is opened on the side of the frame (1).

3. The fully automatic substrate cutting equipment according to claim 1, characterized in that: The laser cutting mechanism (7) includes a laser (71), a mirror module (72), and a galvanometer and field mirror module (73). The laser (71) and the mirror module (72) are connected to the gantry, and the galvanometer and field mirror module (73) are connected to the Z-axis moving module (9). The laser (71), the mirror module (72), and the galvanometer and field mirror module (73) form a laser cutting optical path.

4. The fully automatic substrate cutting equipment according to claim 1, characterized in that: The material handling assembly (8) includes a material handling bracket (81), which is connected to the side of the gantry (6). An X-axis material handling moving module (82) is connected to the material handling bracket (81). A first Z-axis material handling cylinder (83) is connected to the sliding block of the X-axis material handling moving module (82). A material handling fixing plate (84) is connected to the drive shaft of the first Z-axis material handling cylinder (83). An X-axis material handling fixing plate (84) is connected to the material handling fixing plate (84). The X-axis pick-and-place cylinder (85) is connected to the pick-and-place connecting plate. The pick-and-place connecting plate is connected to the bottom of the pick-and-place connecting plate. The bottom of the pick-and-place connecting plate (86) is connected to the lower clamping piece (87) for clamping the bottom of the product. The pick-and-place connecting plate (86) is connected to the pick-and-place clamping cylinder (88). The drive shaft of the pick-and-place clamping cylinder (88) is connected to the upper clamping piece (89) opposite to the lower clamping piece.

5. The fully automatic substrate cutting equipment according to claim 1, characterized in that: The feeding assembly (4) includes a first feeding fixture (41) and a second feeding fixture (42). The first feeding fixture (41) is connected to one side of the feeding fixture plate, and the other side of the feeding fixture plate is connected to a feeding slide rail (43). The second feeding fixture (42) is slidably connected to the feeding slide rail (43) by a slider. A hand crank transmission screw (44) for moving the second feeding fixture (42) is connected between the first feeding fixture (41) and the second feeding fixture (42). A conveyor belt (45) for product transfer is connected above the first feeding fixture (41) and the second feeding fixture (42).

6. The fully automatic substrate cutting equipment according to claim 5, characterized in that: The conveyor belt (45) is a motor-driven belt conveyor.

7. The fully automatic substrate cutting equipment according to claim 1, characterized in that: The adsorption assembly (5) includes an adsorption fixing plate (51), an adsorption lifting cylinder (52) is connected to the adsorption fixing plate (51), an adsorption connecting plate (53) is connected to the drive shaft of the adsorption lifting cylinder (52), a blow-suction pipe is connected to the bottom of the adsorption connecting plate (53), an adsorption plate (54) is connected to the adsorption connecting plate (53), an adsorption hole communicating with the blow-suction pipe is opened on the adsorption plate (54), an adsorption guide column (55) is connected to the adsorption fixing plate (51) through a linear bearing, and the top end of the adsorption guide column (55) is connected to the adsorption connecting plate (53).

8. The fully automatic substrate cutting equipment according to claim 1, characterized in that: The bottom of the Z-axis moving module (9) is connected to a dust collection box (12) for collecting dust generated by the laser cutting mechanism (7).

9. The fully automatic substrate cutting equipment according to claim 3, characterized in that: The galvanometer and field lens module (73) are arranged on the same axis as the camera assembly (10).

10. The fully automatic substrate cutting equipment according to claim 1, characterized in that: The camera assembly (10) includes a camera fixing block (101) and a camera (102), wherein the camera (102) is connected to the sliding block of the Z-axis moving module (9) via the camera fixing block (101).

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