Electronic device

Abstract

The invention provides an electronic device which comprises a middle frame, a circuit board, a loudspeaker, a support and a sealing piece, the middle frame comprises a middle plate and a frame connected with the edge of the middle plate, the loudspeaker is arranged on the surface of the middle plate and close to the frame, the circuit board comprises an avoiding groove, the sealing piece comprises a first sealing body and a second sealing body, the first sealing body is connected to the surface of the middle plate, and the second sealing body is connected to the surface of the middle plate. The first sealing body is clamped between the circuit board and the middle plate, and the second sealing body is clamped between the circuit board and the bracket; the surfaces of the two free ends of the first sealing body and the second sealing body abut against the inner side face of the frame. The first sealing body and the second sealing body surround the loudspeaker and are arranged at intervals with the loudspeaker. The end face of the circuit board abuts against the inner side face of the frame, the loudspeaker is located in the receding groove, the first sealing body and the second sealing body are arranged along the edge of the receding groove, part of the middle plate, the frame, the circuit board, the sealing piece and the support jointly define a rear cavity of the loudspeaker, and the end face of the support is connected with the inner side face of the frame in a sealed mode.

Description

Technical Field

[0001] This application relates to the field of communication equipment technology, and more particularly to an electronic device. Background Technology

[0002] Audio handsets or speakers typically require a larger rear cavity space to achieve better audio performance; the larger the physical volume of the rear cavity, the better the low-frequency effect. To achieve better audio performance within the limited space of a terminal device, current technology uses the space between the middle plate and the rear cover of the terminal device as the rear cavity of the speaker. When the speaker operates, it causes gas fluctuations and airflow. This airflow propagates between the middle plate and the rear cover, causing vibration in the rear cover, which affects the user experience. Summary of the Invention

[0003] This application provides an electronic device that isolates the rear cavity from the rear shell, thereby preventing the rear shell from vibrating due to the speaker and affecting the user experience.

[0004] In one embodiment of this application, an electronic device is provided, comprising a mid-frame, a circuit board, a speaker, a bracket, and a seal. The mid-frame includes a mid-plate and a frame connecting the edges of the mid-plate. The speaker is located on the surface of the mid-plate and near the inner side of the frame.

[0005] The circuit board includes a clearance groove that extends through two surfaces of the circuit board in the thickness direction and an end face connecting the two surfaces.

[0006] The sealing element includes a first sealing body and a second sealing body. Both the first sealing body and the second sealing body have two free ends. The two free ends of the first sealing body are spaced apart and opposite to each other, and the two free ends of the second sealing body are also spaced apart and opposite to each other.

[0007] Along the thickness direction of the electronic device, the first sealing body, the circuit board, the second sealing body, and the bracket are sequentially stacked on the middle plate. The first sealing body is connected to the surface of the middle plate and is sandwiched between the circuit board and the middle plate. The second sealing body is sandwiched between the circuit board and the bracket.

[0008] The surfaces of both free ends of the first sealing body abut against the inner side of the frame. The first sealing body surrounds the speaker and is spaced apart from the speaker. The surfaces of both free ends of the second sealing body abut against the inner side of the frame. The second sealing body surrounds the speaker and is spaced apart from the speaker. The end face of the circuit board abuts against the inner side of the frame. The speaker is located within the clearance groove. The first and second sealing bodies are arranged along the edge of the clearance groove. A portion of the middle frame, a portion of the frame, the circuit board, the sealing element, and the bracket together form the rear cavity of the speaker. The end face of the bracket is sealed to the inner side of the frame. Moreover, in this embodiment, the rear cavity is formed by the middle plate, a portion of the frame, the circuit board, the sealing element, and the bracket. This makes full use of space. Compared to creating separate cavities in the middle plate and the circuit board, it saves space in the electronic device. In other words, it can fully utilize the space formed by the middle frame, a portion of the frame, the circuit board, the sealing element, and the bracket to create the rear cavity, ensuring the speaker's sound effect.

[0009] In this embodiment, a portion of the middle plate, circuit board, seal, and bracket together form the rear cavity of the speaker. The overall structure is simple. The first and second seals surround the speaker, forming a space that is part of the rear cavity. Furthermore, there is a bracket spacer between the rear cavity and the rear shell. This ensures that the rear cavity has sufficient space while preventing sound waves from vibrating the rear shell during speaker operation, thus avoiding vibrations that could affect the user experience. Moreover, the first and second seals seal the gaps between the circuit board and the middle plate, as well as between the circuit board and the bracket, achieving a sealing function for the rear cavity and saving space in the electronic device. In fact, the seals are elastic and can also buffer the sound waves from the speaker, reducing vibrations to the rear shell.

[0010] In one embodiment, the first sealing body has a first notch, and the second sealing body has a second notch. The clearance groove, the first notch, and the second notch are all C-shaped structures. Along the thickness direction of the electronic device, the orthographic projections of the clearance groove, the first notch, and the second notch completely overlap. The bracket covers the clearance groove, the first notch, and the second notch. The speaker is located inside the first notch and the second notch. In this embodiment, a portion of the middle plate, the circuit board, the sealing element, and the bracket together form the rear cavity of the speaker. That is, the second notch, the first notch, the clearance groove, and the recess constitute the space of the rear cavity. Compared with the rear cavity formed by the rear shell and the bracket in the prior art, the space formed by the sealing element can increase the space of the rear cavity, while ensuring sealing and simplifying the structure.

[0011] In one embodiment, the bracket includes an end face, and a sealing strip is connected between the end face of the bracket and the inner side of the frame. In this embodiment, the sealing strip seals the gap between the bracket and the frame, further sealing the rear cavity.

[0012] In one embodiment, the bracket abuts against the inner side of the frame. The electronic device further includes a back cover connected to the middle frame. An adhesive backing is applied between the back cover and the middle frame, covering and sealing the gap between the bracket and the inner side of the frame in the thickness direction of the electronic device. In this embodiment, the adhesive backing between the functional back cover and the bracket directly seals the rear cavity, eliminating the need for additional adhesive application, simplifying the process and improving sealing performance.

[0013] In one embodiment, the end face of the bracket includes a bevel, which is spaced apart from the inner side of the frame. A groove is formed between the bevel and the inner side of the frame. A sealing strip is formed in the groove and connects the bevel and the inner side of the frame. In this embodiment, the sealing strip is formed by an adhesive dispensing process. The bracket forms a groove between the bevel and the inner side of the frame, eliminating the need for additional grooving or pre-reserved gaps between the bracket and the inner side. The adhesive-formed sealing strip directly seals the gap between the bracket and the frame, improving assembly accuracy and facilitating processing.

[0014] In one embodiment, the electronic device further includes a dispensing groove. Along the thickness direction of the electronic device, the dispensing groove extends through the end of the circuit board, the free end of the first sealing body, the free end of the second sealing body, and the end of the bracket. The dispensing groove communicates with the trench. The sealing strip extends to the dispensing groove and connects to the groove wall, the inner side of the frame, and the surface of the middle plate. In this embodiment, in the thickness direction of the electronic device, a sealing adhesive is formed in the dispensing groove through a dispensing process and connected to the sealing strip. This connects the circuit board, sealing components, middle frame, and bracket while improving the tightness of the connection in the thickness direction. Furthermore, it seals the gap located in the rear cavity along the width direction of the electronic device, further improving the sealing performance of the rear cavity.

[0015] In one embodiment, along the thickness direction of the electronic device, the first sealing body and the second sealing body are connected by a connecting portion. A sealing strip connects the two free ends of the second sealing body and is located on the surface of the second sealing body facing away from the first sealing body. The sealing strip is clamped between the end face of the bracket and the inner side of the frame. In this embodiment, the first sealing body and the second sealing body form an integral structure through the connecting portion, and the sealing strip is integrally formed with the second sealing body. During the assembly of the sealing components, it can be installed simultaneously with the first and second sealing bodies, simplifying the installation steps and improving the sealing performance.

[0016] In one embodiment, the circuit board further includes two first adhesive grooves located on opposite sides of the clearance groove. The first adhesive grooves penetrate the end face of the circuit board. The two free ends of the first sealing body are provided with second adhesive grooves, the two free ends of the second sealing body are provided with third adhesive grooves, and the bracket is provided with two spaced fourth adhesive grooves.

[0017] Along the thickness direction of the electronic device, the first adhesive groove, the second adhesive groove, the third adhesive groove, and the fourth adhesive groove are connected to form a dispensing groove. A sealing adhesive is formed within the dispensing groove, and the sealing adhesive connects the groove wall, the inner side of the frame, and the surface of the middle plate. In this embodiment, adhesive grooves are provided on the first sealing body, the second sealing body, the circuit board, and the bracket, and are connected to the frame. The first sealing body, the second sealing body, the circuit board, the middle frame, the bracket, and the frame are connected by dispensing adhesive, which improves the stability of the connection between the various components.

[0018] In one embodiment, along the thickness direction of the electronic device, the two free ends of the first sealing body and the two free ends of the second sealing body are respectively connected by connecting portions, and an insertion gap is formed between the first sealing body and the second sealing body. The circuit board is located within the insertion gap, and the end face of the circuit board abuts against the connecting portion. The first sealing body and the second sealing body form an integral structure through the connecting portion, which can be integrally molded in the manufacturing process, simplifying the assembly process of the sealing component.

[0019] In one embodiment, the sealing element further includes a support plate, which is connected between the two free ends of the second sealing body. The surface of the support plate and the second sealing body facing away from the first sealing body is the sealing surface.

[0020] The sealing element further includes a sealing strip, which protrudes from the sealing surface;

[0021] The support plate and the second sealing body are sandwiched between the circuit board and the bracket, and the sealing strip connects and seals between the end face of the bracket and the inner side of the frame. Along the thickness direction of the electronic device, the support plate and the second sealing body are sandwiched between the circuit board and the bracket; along the length direction of the electronic device, the sealing strip connects and seals between the end face of the bracket and the inner side of the frame. The support plate not only increases the sealing area of ​​the bracket and the sealing element, but also increases the load-bearing capacity of the second sealing body when it is subjected to pressure from the bracket.

[0022] In one embodiment, the end face of the bracket is an inclined surface, the sealing strip includes a surface, and a bearing inclined surface connects the surface and the sealing surface. The bearing plate and the second sealing body are clamped between the circuit board and the bracket, and the end face of the bracket abuts against the bearing inclined surface. In this embodiment, the cooperation between the end face and the bearing inclined surface can divide the pressure of the bracket in the thickness direction of the electronic device into a force in the thickness direction (Z-axis) and a force in the length direction (Y-axis) (perpendicular to the frame and sealing strip direction). That is, it reduces the force in the thickness direction, reduces the force on the second sealing body, and increases the holding force of the bracket in the frame direction, increases the force clamping the sealing strip, and can offset the pressure on the sealing strip in the thickness direction, preventing the sealing strip from moving towards the circuit board between the frame and the end face of the bracket, thus improving the sealing performance and installation stability of the sealing element.

[0023] In one embodiment, the surface of the first sealing body facing away from the second sealing body is a first sealing surface, and the surface of the second sealing body facing away from the first sealing body is also a first sealing surface.

[0024] The first sealing surface has a first sealing protrusion extending along the length of the first sealing body, and the second sealing surface has a second sealing protrusion extending along the length of the second sealing body. In this embodiment, by providing the first and second sealing protrusions, both will deform when clamped by the circuit board, bracket, and middle plate, thereby improving the sealing performance of the sealing element.

[0025] In one embodiment, the first and second sealing protrusions are made of an elastic material, and the hardness of the first and second sealing protrusions is less than the hardness of the first and second sealing bodies. The elastic material of the first and second sealing protrusions ensures sealing performance, while the higher hardness of the first and second sealing bodies ensures the load-bearing strength of the sealing element.

[0026] In one embodiment, the outer surfaces of the first and second sealing bodies are elastic surfaces. Both the first and second sealing bodies include a plastic skeleton and a soft rubber covering the outer periphery of the skeleton, with the surface of the soft rubber being the elastic surface. The first and second sealing bodies are made of a combination of hard and soft materials, ensuring sealing performance while improving the strength of the sealing element.

[0027] In one embodiment, the first sealing body further includes two first sealing segments and a first connecting segment. The first connecting segment connects the ends of the two first sealing segments, and the two first sealing segments and the first connecting segment form a first notch. A second adhesive groove is provided at the end of the first sealing segment away from the first connecting segment. The second sealing body further includes two second sealing segments and a second connecting segment. The second connecting segment connects the ends of the two second sealing segments, and the two second sealing segments and the second connecting segment form a second notch. A third adhesive groove is provided at the end of the second sealing segment away from the second connecting segment. The sealing element in this embodiment is a split type with a simple structure.

[0028] In one embodiment, the bracket has a recess that is recessed into the bracket from one surface. Along the thickness direction of the electronic device, the recess faces the clearance groove and forms part of the rear cavity. In this embodiment, the recess increases the space of the rear cavity in the thickness direction of the electronic device, thereby improving the sound quality of the speaker.

[0029] In one embodiment, the electronic device includes a back cover and a screen, the back cover and the screen being mounted on opposite sides of the mid-frame in the thickness direction, the back cover covering the bracket;

[0030] Alternatively, a front cavity for a speaker is formed between the middle plate and the rear shell, and a sound outlet gap is formed between the screen covering the bracket and the frame, with the front cavity of the speaker communicating with the sound outlet gap.

[0031] In one embodiment, the middle plate is further provided with a through groove that penetrates the surface of the middle plate in the thickness direction. Along the thickness direction of the electronic device, the speaker is opposite to the through groove.

[0032] The electronic device further includes a screen, which is mounted on both sides of the middle plate along its thickness direction along with the speaker. A sound outlet gap is formed between the screen and the frame. The screen closes the through slot and forms a front cavity with the through slot. The front cavity communicates with the sound outlet gap. In this embodiment, the electronic device described above can use the aforementioned sealing element to form a rear cavity. When the speaker is working, the rear cavity is not directly connected to the rear shell, which can prevent the rear shell from vibrating and affecting its performance. Attached Figure Description

[0033] To more clearly illustrate the technical solution of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0034] Figure 1 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application;

[0035] Figure 2 for Figure 1 A three-dimensional structural cross-sectional view of a first embodiment of the electronic device shown from one angle;

[0036] Figure 3 for Figure 1 An exploded structural diagram of the first embodiment of the electronic device shown;

[0037] Figure 4 for Figure 3 A schematic diagram of the structure of the electronic device's mid-frame and speaker;

[0038] Figure 5 for Figure 2 A schematic diagram of a portion of the structure of the electronic device shown;

[0039] Figure 6 for Figure 3 The diagram shows the assembly of some parts of the electronic device.

[0040] Figure 7 for Figure 6 The diagram shown illustrates the structure of the electronic device equipped with a support frame.

[0041] Figure 8 for Figure 1 A three-dimensional cross-sectional view of the electronic device shown from another angle;

[0042] Figure 9 for Figure 1 A perspective cross-sectional view of the second embodiment of the electronic device from one angle;

[0043] Figure 10 for Figure 1 A partial structural schematic diagram of a second embodiment of the electronic device shown;

[0044] Figure 11 for Figure 1 A partial structural diagram of the electronic device shown from another angle;

[0045] Figure 12 for Figure 1 A partial structural assembly diagram of the second embodiment of the electronic device shown;

[0046] Figure 13 for Figure 1 A perspective cross-sectional view of the second embodiment of the electronic device shown from another angle;

[0047] Figure 14 for Figure 1A partially exploded view of the third embodiment of the electronic device shown;

[0048] Figure 15 for Figure 14 An exploded view of the electronic device from another angle;

[0049] Figure 16 for Figure 1 A perspective structural cross-sectional view of the third embodiment of the electronic device shown from one angle;

[0050] Figure 17 for Figure 1 Another perspective three-dimensional structural cross-sectional view of the third embodiment of the electronic device shown. Detailed Implementation

[0051] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0052] Please see Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application; Figure 2 for Figure 1 A three-dimensional structural cross-sectional view of a first embodiment of the electronic device shown from one angle.

[0053] Electronic devices include, but are not limited to, cellphones, notebook computers, tablet computers, personal digital assistants, and mobile devices. For ease of description, the width direction of electronic device 100 is defined as the X-axis, the length direction as the Y-axis, and the thickness direction as the Z-axis. The X-axis, Y-axis, and Z-axis are mutually perpendicular.

[0054] Continue to refer to Figure 1 and Figure 2 In this embodiment of the application, the electronic device 100 is a mobile phone as an example for illustration.

[0055] Electronic device 100 includes a back cover 10, a mid-frame 20, a screen 30, a circuit board 40, a seal 50, a speaker 60, a bracket 70, a camera module, a battery (not shown), and a processor (not shown). The back cover 10 and the screen 30 are located on opposite sides of the mid-frame 20 in the thickness direction. The screen 30 and the mid-frame 20 have sound outlet gaps F at their ends for sound transmission from the speaker 60. The circuit board 40, speaker 60, bracket 70, camera module, battery, etc., are all mounted on the mid-frame 20 and covered by the back cover 10. The front cavity A of the speaker 60 is closer to the screen 30, and the rear cavity B of the speaker is closer to the back cover 10. The processor can be the CPC (central processing unit) of electronic device 100. The power supply provides power to the screen 30, circuit board 40, processor, and other electronic components.

[0056] Please refer to the following: Figure 3 and Figure 4 , Figure 3 for Figure 1 An exploded structural diagram of the first embodiment of the electronic device shown; Figure 4 for Figure 3 The diagram shows the structural schematic of the electronic device's mid-frame and speaker.

[0057] In this embodiment, the rear cover 10 is the outer casing of the electronic device 100. The rear cover 10 includes an outer surface 11 and an inner surface 12, which are disposed opposite to each other along the thickness direction of the rear cover 10. The rear cover 10 is also provided with a camera window and a camera decorative element (not shown in the figure), which are not specifically limited here.

[0058] The mid-frame 20 includes a mid-plate 21 and a side frame 22, with the side frame 22 surrounding the mid-plate 21. The mid-frame 20 also includes a battery slot 28 and a mounting slot 29, which are adjacent to each other. The mid-plate 21 and the side frame 22 form the battery slot 28 and the mounting slot 29. The battery is housed in the battery slot 28. Components such as the circuit board 40, camera module, and speaker 60 are located in the mounting slot 29.

[0059] The middle plate 21 includes a first surface 211 and a second surface (not shown in the figure), with the first surface 211 and the second surface facing away from each other along the thickness direction of the middle plate 21. A frame 22 connects to the periphery of the middle plate 21, and the frame 22 and the middle plate 21 form a groove. A partition is provided within the groove, dividing the groove into the battery slot 28 and the mounting slot 29. A portion of the first surface 211 forms the bottom wall of the battery slot 28 and the mounting slot 29. In this embodiment, the frame 22 includes an inner side surface 221 and an outer side surface (not shown in the figure), which face away from each other along the thickness direction of the frame 22. The frame 22 also includes two spaced-apart side frames 22a and two spaced-apart end frames 22b. The two side frames 22a are respectively connected to the two end frames 22b. The side frames 22a extend along the length direction of the middle frame 20, and the end frames 22b extend along the width direction of the middle plate 21. One of the end frames 22b is a sidewall of the mounting slot 29. A step 222 is provided on the inner side 221 of the frame 22. The step 222 is away from the middle plate 21 and is used to support the rear shell 10.

[0060] like Figure 5 As shown, Figure 5 for Figure 2 The diagram shows a partial structure of the electronic device. A through groove 214 is also provided on the middle plate 21, penetrating the first surface 211 and the second surface. The through groove 214 is adjacent to the end frame 22b. A limiting part 291 is also protruding from the middle plate 21, protruding from the first surface 211 and close to the inner side 221 of one end frame 22b. In this embodiment, the limiting part 291 consists of multiple protrusions, spaced apart around the periphery of the through groove 214. The speaker 60 is located within the limiting part 291, and is surrounded by multiple protrusions. Specifically, both the through groove 214 and the limiting part 291 are located within the mounting groove 29. It can be understood that the through groove 214 penetrates the bottom wall of the mounting groove 29; the limiting part 291 protrudes from the bottom wall of the groove. The speaker 60 is fixedly connected to the bottom wall of the groove by adhesive or other means.

[0061] like Figure 2 The screen 30 is mounted on the second surface of the middle frame 20, and a sound outlet gap F is formed between the end of the screen 30 and the frame 22. The screen 30 closes the through groove 214, and a front cavity A is formed between the back of the screen 30 and the through groove 214. The front cavity A is opposite to the speaker and communicates with the sound outlet gap F. Specifically, the portion of the screen 30 opposite to the through groove 214 has a gap between itself and the second surface. This gap extends to the inner side 221 of the frame and communicates with the through groove 214. This gap is also connected to the sound outlet gap.

[0062] It should be noted that this embodiment only demonstrates one assembly method of the screen 30, back cover 10, and middle frame 20, but is not limited to this. For example, the positions of the screen 30 and back cover 10 in the middle frame 20 can be replaced, and a sound outlet gap F can still be formed between the end of the screen 30 and the frame 22. A front cavity A is formed between the back cover and the middle plate, and the position of the front cavity remains unchanged. The sound outlet gap F is connected to the frame 22 through a hole.

[0063] like Figure 5 As shown, the circuit board 40 includes a front surface 41, a back surface 42, and a first end face 43. The first end face 43 connects the front surface 41 and the back surface 42. The front surface 41 and the back surface 42 are arranged facing away from each other along the thickness direction of the circuit board. The camera module, bracket, and processor are located on the front surface 41. The circuit board 40 also includes a clearance groove 44 and a first adhesive groove 45. The clearance groove 44 passes through the front surface 41, the back surface 42, and the first end face 43. The clearance groove 44 is used to avoid the speaker 60 and the limiting part 291. There are two first adhesive grooves 45, which are located on opposite sides of the clearance groove 44 and pass through the front surface 41, the back surface 42, and the first end face 43. Both the clearance groove 44 and the first adhesive groove 45 are rectangular through grooves, which means that both the clearance groove 44 and the first adhesive groove 45 have openings that penetrate the first end face 43.

[0064] In this embodiment, the sealing element 50 includes a first sealing body 51 and a second sealing body 52. ​​Both the first sealing body 51 and the second sealing body 52 are made of an elastic material, such as rubber. The first sealing body 51 includes two first sealing segments 511 and a first connecting segment 512. The first connecting segment 512 connects the ends of the two first sealing segments 511, and the two first sealing segments 511 and the first connecting segment 512 form a first notch 514. Specifically, the first sealing body 51 is a C-shaped sheet, and both the two first sealing segments 511 and the first connecting segment 512 are strip-shaped sheets. A second adhesive groove 513 is provided at the end of the first sealing segment 511 away from the first connecting segment 512, and the second adhesive groove 513 penetrates the end of the first sealing segment 511 and two surfaces in the thickness direction of the first sealing segment 511.

[0065] In this embodiment, the second sealing body 52 has the same structure as the first sealing body 51. The second sealing body 52 includes two second sealing segments 521 and a second connecting segment 522. The second connecting segment 522 connects the ends of the two second sealing segments 521, and the two second sealing segments 521 and the second connecting segment 522 form a second notch 524. Specifically, the second sealing body 52 is a C-shaped sheet, and both the two second sealing segments 521 and the second connecting segment 522 are strip-shaped sheets. A third adhesive groove 523 is provided at the end of the second sealing segment 521 away from the second connecting segment 522. The third adhesive groove 523 penetrates the end of the second sealing segment 521 and two surfaces in the thickness direction of the second sealing segment 521. The second adhesive groove 513 and the third adhesive groove 523 have a C-shaped structure and are used to communicate with the first adhesive groove 45; the first notch 514 and the second notch 524 correspond to the clearance groove 44.

[0066] In this embodiment, the bracket 70 is a rectangular plate, including a third surface 71, a fourth surface 72, and a second end face. The third surface 71 and the fourth surface 72 are both connected to the second end face. The bracket 70 also includes two fourth adhesive grooves 75, which penetrate the third surface 71, the fourth surface 72, and the second end face. The two fourth adhesive grooves 75 are spaced apart and correspond to the two first adhesive grooves 45 respectively. The bracket 70 also has a recess 74, formed by the fourth surface 72 recessed towards the third surface 71, and the recess 74 forming the protrusion on the third surface 71. The recess 74 is used to form part of the rear cavity of the speaker, thereby increasing the space of the rear cavity. In other embodiments, this recess may be omitted.

[0067] The second end face of the bracket 70 includes a slope 76, which is inclined toward the third surface 71. The fourth adhesive groove 75 also penetrates the slope 76. Specifically, a protrusion is provided on the third surface 71, and the end face of the protrusion is the aforementioned slope 76, which connects to the second end face. The slope 76 can be understood as a part of the second end face.

[0068] See also Figure 6 , Figure 7 and Figure 8 , Figure 6 for Figure 3 The diagram shows the assembly of some parts of the electronic device. Figure 7 for Figure 6 The diagram shown illustrates the structure of the electronic device equipped with a support frame. Figure 8 for Figure 1The diagram shows a three-dimensional cross-sectional view of the electronic device from another angle. A first sealing body 51 is fixed to the first surface 211 of the middle plate and located within the mounting groove 29. A sealant can be applied between the two first sealing sections 511 and the first surface 211 to improve sealing performance. The speaker 60 and the limiting portion are located within the first notch 514. Along the width direction of the electronic device, the two first sealing sections 511 are located on both sides of the speaker, with the ends of the two first sealing sections 511 away from the first connecting section 512 abutting against the inner side surface 221 of the frame. The second adhesive groove 513 and the inner side surface 221 form a rectangular through groove, meaning the inner side surface 221 closes the opening of the second adhesive groove 513 at the end face of the first sealing section 511. The first connecting section 512 is spaced apart from the frame 22. The circuit board 40 is mounted in the mounting groove 29 and stacked with the middle plate. Along the thickness direction of the electronic device, the back surface 42 of the circuit board 40 abuts against the first sealing body 51. The speaker 60 and the limiting portion are located within the clearance groove 44. The opening of the first adhesive groove 45 and the inner side surface 221 form a rectangular through groove. The second sealing body 52 is stacked on the front side 41 of the circuit board 40. Along the thickness direction of the electronic device, the orthographic projection of the second sealing body 52 overlaps with that of the first sealing body 51, and the second notch 524 and the first notch 514 completely overlap. Along the thickness direction of the electronic device, the second notch 524, the first notch 514 and the clearance groove 44 are connected and their orthographic projections completely overlap.

[0069] The bracket 70 is stacked on the circuit board 40, with its third surface 71 facing the front surface 41 of the circuit board 40 and abutting against the second sealing body 52; that is, the second sealing body 52 is sandwiched between the bracket 70 and the circuit board 40. Along the thickness direction of the electronic device, the bracket 70 closes the second notch 524, the first notch 514, and the clearance groove 44. The recess 74 of the bracket 70 faces the second notch 524. Part of the middle plate, the circuit board 40, the sealing member 50, and the bracket 70 together form the rear cavity B of the speaker 60. That is, the second notch 524, the first notch 514, the clearance groove 44, and the recess 74 constitute the space of the rear cavity B. The projection of the second notch 524 is completely located within the recess 74, or the projection of the second notch 524 and the orthographic projection of the recess 74 completely coincide. It is understood that the sealant seals the gaps between the circuit board 40 and the middle plate, as well as between the circuit board and the bracket 70, and forms the rear cavity B. Furthermore, the bracket 70 separates the rear cavity B from the rear shell 10, preventing sound waves from vibrating the rear shell 10 during speaker 60 operation and avoiding any vibration affecting the user experience. In the thickness direction of the electronic device, the sealant and the recess 74 increase the space of the rear cavity B, improving the sound quality of the speaker 60. Moreover, the sealant 50, while forming the rear cavity B, also seals the gaps between the circuit board and the middle plate 21 and the bracket 70, increasing the space of the rear cavity B while achieving sealing performance, resulting in a simple structure. The dimensions of the sealant 50 along the length and width of the electronic device are smaller than the dimensions of the circuit board; that is, the size of the notch is determined by the actual design of the clearance groove, without affecting the usable area of ​​the circuit board. The orthogonal projection of the recess 74 can be larger than the clearance groove 44, increasing the space of the rear cavity.

[0070] like Figure 2 and Figure 8Along the thickness direction of the electronic device, the first adhesive groove 45 of the circuit board 40, the second adhesive groove 513 and the third adhesive groove 523 of the sealant 50, and the fourth adhesive groove 75 of the bracket 70 are opposite and connected. Specifically, the orthographic projections of the first adhesive groove 45, the second adhesive groove 513, the third adhesive groove 523, and the fourth adhesive groove 75 completely overlap. The first adhesive groove 45, the second adhesive groove 513, the third adhesive groove 523, and the fourth adhesive groove 75 constitute the dispensing groove C. The dispensing groove C is a through groove. The two grooves along the thickness direction of the electronic device face the first surface 211 of the middle plate and the inner surface of the rear shell 10, respectively. Adhesive can be dispensed from the groove facing the rear shell 10 to form a sealing strip, thereby sealing and connecting the sealant 50, the circuit board 40, and the bracket 70. The inclined surface 76 abuts against the inner side surface 221 of the frame and forms a strip-shaped groove D between the inner side surface 221 and the inner side surface 221. A sealing colloid (not shown in the figure) is formed in the strip-shaped groove D, and the sealing colloid seals the rear cavity B. It is understandable that groove D and dispensing groove C are connected. The sealing strip in groove D and the sealing adhesive in dispensing groove C can be considered as a composite sealing strip. The sealing adhesive can be an extension of the sealing strip and can be formed simultaneously to seal the gaps between circuit board 40 and bracket 70, and between bracket 70 and frame 22. In one embodiment, dispensing groove C can be omitted, that is, the bevel can be omitted, and bracket 70 directly abuts against the inner surface of frame 22. The sealing strip refers to the adhesive strip formed in groove D. In this embodiment, the gap between bracket 70 and frame 22 can be directly sealed by dispensing adhesive. Alternatively, the adhesive on the back of the positioning back cover and the middle frame 20 can be extended to the gap between bracket 70 and frame 22 to seal the gap.

[0071] Please see Figure 9 and Figure 10 , Figure 9 for Figure 1 A perspective cross-sectional view of the second embodiment of the electronic device from one angle; Figure 10 for Figure 1 The diagram shows a partial structural schematic of the second embodiment of the electronic device. In this second embodiment, the difference from the previous embodiment is the structure of the sealing member 50, the elimination of the first adhesive groove 45 in the circuit board 40, and the elimination of the fourth adhesive groove 75 in the bracket 70; the structure of the middle frame 20 and its assembly relationship with the speaker 60 can be directly referred to the description of the first embodiment, and will not be repeated here.

[0072] like Figure 10 The circuit board 40 includes a front side 41 and a back side 42. The front side 41 and the back side 42 are arranged facing away from each other along the thickness direction of the circuit board. The camera module, bracket, and processor are located on the front side 41. The circuit board 40 also includes a clearance groove 44. The clearance groove 44 extends through the front side 41 and the back side 42, as well as the end face (not shown) connecting the front side 41 and the back side 42. The clearance groove 44 is used to avoid the speaker 60 and the limiting part 291.

[0073] like Figure 11 , Figure 11 for Figure 1 The diagram shows a partial structural view of the electronic device from another angle; the bracket 70 is a rectangular plate, which includes a third surface 71, a fourth surface 72, and an end face 73, with the third surface 71 and the fourth surface 72 both connected to the end face 73. The bracket 70 also has a recess 74, which is formed by the fourth surface 72 recessed towards the third surface 71, and the recess 74 is used to form part of the rear cavity of the speaker.

[0074] In this embodiment, the sealing element 50 includes a first sealing body 51, a second sealing body 52, and a third sealing body 53. The first and second sealing bodies 51 and 52 are made of an elastic material, such as rubber. The first sealing body 51 includes two spaced-apart and opposite free ends, and the second sealing body 52 includes two spaced-apart and opposite free ends. In the thickness direction of the sealing element 50, the free ends of the first and second sealing bodies 51 are connected by a connecting portion 504 (the dashed lines in the relevant figures represent the separation between component areas to clarify the component positions), and the first and second sealing bodies 51 and 52 are spaced apart, forming an insertion gap 503 between them. The first and second sealing bodies 51 and 52 form a C-shaped structure and surround a C-shaped notch 57. The sealing element 50 is an integrally molded structural component.

[0075] The seal 50 includes a first sealing surface 501 and a second sealing surface 502. The first sealing surface 501 is the surface of the first sealing body 51 facing away from the second sealing body 52, and the second sealing surface 502 is the surface of the second sealing body 52 facing away from the first sealing body 51. A third sealing body 53 connects the two free ends of the second sealing body 52 and is located on the second sealing surface 502. The third sealing body 53 is a strip-shaped body that protrudes from the second sealing surface 502, and the surface of the third sealing body 53 facing away from the second sealing surface 502 is flush with the end faces of the free ends of the first sealing body 51 and the second sealing body 52. ​​The third sealing body 53 can be understood as a sealing strip.

[0076] In this embodiment, the structure of the first sealing body 51 and the second sealing body 52 differs from that of the first sealing body 51 and the second sealing body 52 in the first embodiment only in that the first sealing body 51 and the second sealing body 52 in this embodiment do not have a glue groove.

[0077] Please see Figure 12 and Figure 13 , Figure 12 for Figure 1 A partial structural assembly diagram of the second embodiment of the electronic device shown; Figure 13 for Figure 1The second embodiment of the electronic device shown is a perspective cross-sectional view from another angle. The circuit board 40 is inserted into the insertion gap 503 of the seal 50. The clearance groove 44 is opposite to the notch 57. In the thickness direction of the electronic device, the clearance groove 44 and the notch 57 completely overlap. The end face of the circuit board 40 abuts against the connecting portion 504. The circuit board 40 and the seal 50 are mounted in the mounting groove 29. The first sealing body 51 is fixed to the first surface 211 of the middle plate. The circuit board 40 is mounted in the mounting groove 29 and stacked with the middle plate. Along the thickness direction of the electronic device, the circuit board 40 is sandwiched between the first sealing body 51 and the second sealing body 52. ​​The speaker 60 and the limiting portion are located within the notch 57 and the clearance groove 44. Along the width direction of the electronic device, the end faces of the free ends of the first sealing body 51 and the second sealing body 52 abut against and seal against the inner surface 221 of the frame 22. The connecting portion abuts against the inner surface 221 of the frame 22. The third sealing body 53 abuts against and seals against the inner surface 221 of the frame, used to seal the rear cavity B. The first sealing body 51, the second sealing body 52, and a portion of the frame surround the speaker 60 and are spaced apart from the speaker.

[0078] The bracket 70 is stacked on the circuit board 40, with its third surface 71 facing the front surface 41 of the circuit board 40 and abutting against the second sealing surface 502 of the second sealing body 52; that is, the second sealing body 52 is sandwiched between the bracket 70 and the circuit board 40. Along the thickness direction of the electronic device, the bracket 70 closes the notch 57 and the clearance groove 44, and the recess 74 of the bracket 70 faces the notch 57. The notch 57, the clearance groove 44, and the recess 74 together form the space of the rear cavity B of the speaker 60. The projection of the notch 57 is completely located within the recess 74, or the projections of the notch 57 and the recess 74 completely coincide. It can be understood that the seal seals the gaps between the circuit board 40 and the middle plate, as well as between the circuit board and the bracket 70, and forms the rear cavity B. Moreover, the bracket 70 separates the rear cavity B from the rear shell 10, which can prevent the sound waves from vibrating the rear shell 10 during the operation of the speaker 60, thus preventing the rear shell 10 from vibrating and affecting the user experience. In the thickness direction of the electronic device, the seal and the recess 74 can increase the space of the rear cavity B, improving the sound quality of the speaker 60. In this embodiment, the end face of the bracket 70 abuts against the third sealing body 53, thereby sealing the rear cavity B. The end face of the bracket 70 and the third sealing body 53 can also be connected by sealant. The seal in this embodiment is an integrally formed structural component with the third sealing body 53, simplifying assembly.

[0079] In other embodiments, the bracket 70 abuts against the inner side 221 of the frame 22, the third sealing body is omitted, and the bracket 70 and the inner side 221 of the frame 22 can be sealed with sealant. In other embodiments, the adhesive backing of the positioning back cover 10 and the middle frame 20 can be extended to the gap between the bracket 70 and the frame 22 to seal the gap. Various sealing methods can be used between the bracket 70, the frame 22, and the sealing element, which can be selected according to the actual situation to facilitate overall installation.

[0080] Please see Figure 14 and Figure 15 , Figure 14 for Figure 1 A partially exploded view of the third embodiment of the electronic device shown. Figure 15 for Figure 14 The diagram shows an exploded view of the electronic device from another angle. In the third embodiment of this application, the difference from the second embodiment is in the structure of the sealing member 50. For the same components, please refer to the description of the second embodiment, and they will not be repeated here.

[0081] The sealing element 50 in this embodiment further includes a support plate 58, which is connected between the two free ends of the second sealing body 52. ​​The support plate 58 causes the second sealing body 52 to form a rectangular frame structure, meaning the support plate 58 is located within the notch of the second sealing body 52. ​​The surface of the support plate 58 and the surface of the second sealing body 52 facing away from the first sealing body 51 together form a second sealing surface 501 (which can be called a sealing surface). The third sealing body 53 (which can be called a sealing strip) protrudes from the sealing surface 501 and is located near the end of the connecting portion.

[0082] See also Figure 16 , Figure 16 for Figure 1 The diagram shows a perspective cross-sectional view of a third embodiment of the electronic device. The end face 73 of the bracket 70 is beveled. The third sealing body 53 includes a surface 530, and a bearing bevel 581 connects the surface 530 and the sealing surface 505 (second sealing surface). The circuit board 40 is inserted into the insertion gap 503 between the first sealing body 51 and the second sealing body 52. ​​Along the thickness direction of the electronic device, a bearing plate 58 and the second sealing body 52 are clamped between the circuit board 40 and the bracket 70. Along the length direction of the electronic device, a sealing strip connects and seals between the end face 73 of the bracket 70 and the inner side of the frame 22. The end face 73 of the bracket 70 abuts against the bearing bevel 581. The direction of contact between the end face 73 and the bearing bevel 581 intersects but is not perpendicular to the thickness direction of the electronic device. The direction of contact between the end face 73 and the bearing bevel 581 intersects with the clamping direction of the sealing strip, the frame 22, and the bracket 70.

[0083] In this embodiment, the support plate not only increases the sealing area of ​​the bracket 70 and the seal 50, but also increases the load-bearing capacity of the second seal 52 when it is subjected to pressure from the bracket 70. The cooperation between the end face 73 and the bearing inclined surface 581 can divide the pressure of the bracket 70 in the thickness direction of the electronic device into a force in the thickness direction (Z-axis) and a force in the length direction (Y-axis) (perpendicular to the frame and the sealing strip direction), that is, reduce the force in the thickness direction, reduce the force on the second seal, and increase the holding force of the bracket 70 in the direction of the frame 22, increase the force clamping the sealing strip, which can offset the pressure on the sealing strip in the thickness direction, prevent the sealing strip from moving towards the circuit board between the frame 22 and the end face 73 of the bracket, and improve the sealing performance and installation stability of the seal.

[0084] like Figure 14 and Figure 15 In this embodiment, the first sealing surface 501 of the first sealing body 51 is provided with a first sealing protrusion 515, which extends along the length of the first sealing body 51. The first sealing protrusion 515 is a raised ridge, which is approximately C-shaped, and its two free ends can abut against the surface of the sealing strip, i.e., the third sealing body 53. The second sealing surface 502 is provided with a second sealing protrusion 525, which extends along the length of the second sealing body 52. ​​The second sealing protrusion 525 is a raised ridge, which is approximately C-shaped, and its two free ends are flush with the end faces of the two free ends of the second sealing body 52.

[0085] like Figure 17 As shown, Figure 17 for Figure 1 Another perspective three-dimensional structural cross-sectional view of the third embodiment of the electronic device shown.

[0086] The support plate 58 and the second sealing body 52 are sandwiched between the front surface 41 of the circuit board 40 and the fourth surface 72 of the bracket 70, and the second sealing protrusion 525 abuts against the fourth surface 72 of the bracket 70. The first sealing body 51 is sandwiched between the middle plate and the back surface 42 of the circuit board 40, and the first sealing protrusion 515 abuts against the first surface 211 of the middle plate 21. Both the first sealing protrusion 515 and the second sealing protrusion 525 are made of elastic material, such as rubber, so they will deform when sandwiched by the circuit board 40, the bracket 70 and the middle plate 21, thereby improving the sealing performance of the sealing element 50.

[0087] In one embodiment, the first sealing protrusion 515 and the second sealing protrusion 525 are made of an elastic material, and the hardness of the first sealing protrusion 515 and the second sealing protrusion 525 is less than the hardness of the first sealing body 51 and the second sealing body 52. ​​The surfaces of the first sealing body 51 and the second sealing body 52 are also elastic, enabling them to fit tightly with the surfaces of the circuit board 40, the bracket 70, and the middle plate 21, thereby achieving a sealing effect. The first sealing protrusion 515 and the second sealing protrusion 525 of this embodiment conform to the application of any of the above three embodiments, and will not be elaborated further here.

[0088] In one embodiment, in any of the above embodiments, the outer surfaces of the first sealing body 51 and the second sealing body 52 are elastic surfaces, that is, the surfaces in contact with the frame 22, circuit board 40, bracket 70, and middle plate 21 are all elastic, which can achieve a sealing effect. In one embodiment, both the first sealing body 51 and the second sealing body 52 include a plastic skeleton and a soft rubber covering the outer periphery of the skeleton, and the surface of the soft rubber is the elastic surface. The soft rubber can be rubber, and the hardness of the plastic is greater than that of the soft rubber. The skeleton and the soft rubber can be formed by in-mold injection molding, which can ensure that the sealing element has sufficient strength while achieving a good sealing effect.

[0089] The embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. An electronic device, characterized in that, The device includes a mid-frame, a circuit board, a speaker, a bracket, and seals. The mid-frame includes a mid-plate and a frame connecting the edges of the mid-plate. The speaker is located on the surface of the mid-plate and near the inner side of the frame. The circuit board includes a clearance groove that extends through two surfaces of the circuit board in the thickness direction and an end face connecting the two surfaces. The sealing element includes a first sealing body and a second sealing body. Both the first sealing body and the second sealing body have two free ends. The two free ends of the first sealing body are spaced apart and opposite to each other, and the two free ends of the second sealing body are also spaced apart and opposite to each other. Along the thickness direction of the electronic device, the first sealing body, the circuit board, the second sealing body, and the bracket are sequentially stacked on the middle plate. The first sealing body is connected to the surface of the middle plate and is sandwiched between the circuit board and the middle plate. The second sealing body is sandwiched between the circuit board and the bracket. The surfaces of both free ends of the first sealing body abut against the inner side of the frame. The first sealing body and the frame surround the speaker and are spaced apart from the speaker. The surfaces of both free ends of the second sealing body abut against the inner side of the frame. The second sealing body and the frame surround the speaker and are spaced apart from the speaker. The end face of the circuit board abuts against the inner side of the frame. The speaker is located in the clearance groove. The first sealing body and the second sealing body are arranged along the edge of the clearance groove. A portion of the middle plate, a portion of the frame, the circuit board, the sealing element, and the bracket together form the rear cavity of the speaker. The end face of the bracket is sealed to the inner side of the frame.

2. The electronic device according to claim 1, characterized in that, The first sealing body has a first notch, the second sealing body has a second notch, and the clearance groove, the first notch, and the second notch are all C-shaped structures; along the thickness direction of the electronic device, the orthographic projections of the clearance groove, the first notch, and the second notch completely overlap, and the bracket covers the clearance groove, the first notch, and the second notch; the speaker is located inside the first notch and the second notch.

3. The electronic device according to claim 1, characterized in that, The bracket includes an end face, and a sealing strip is connected between the end face of the bracket and the inner side of the frame.

4. The electronic device according to claim 1, characterized in that, The bracket abuts against the inner side of the frame. The electronic device also includes a back cover, which is connected to the middle frame. An adhesive backing is connected between the back cover and the middle frame. The adhesive backing covers and seals the gap between the bracket and the inner side of the frame in the thickness direction of the electronic device.

5. The electronic device according to claim 3, characterized in that, The end face of the bracket includes a bevel, which is spaced apart from the inner side of the frame. A groove is formed between the bevel and the inner side of the frame. A sealing strip is formed in the groove and connects the bevel and the inner side of the frame.

6. The electronic device according to claim 5, characterized in that, The electronic device is also provided with a dispensing groove. Along the thickness direction of the electronic device, the dispensing groove passes through the end of the circuit board, the free end of the first sealing body, the free end of the second sealing body, and the end of the bracket. The dispensing groove communicates with the groove. The sealing strip extends to the dispensing groove and is also connected to the groove wall of the dispensing groove, the inner side of the frame, and the surface of the middle plate.

7. The electronic device according to claim 3, characterized in that, Along the thickness direction of the electronic device, the first sealing body and the second sealing body are connected by a connecting part, the sealing strip connects the two free ends of the second sealing body, and the sealing strip is located on the surface of the second sealing body opposite to the first sealing body. The sealing strip is clamped between the end face of the bracket and the inner side of the frame.

8. The electronic device according to any one of claims 1-5, characterized in that, The circuit board also includes two first adhesive grooves located on opposite sides of the clearance groove. The first adhesive grooves penetrate the end face of the circuit board. The two free ends of the first sealing body are provided with second adhesive grooves, the two free ends of the second sealing body are provided with third adhesive grooves, and the bracket is provided with two spaced fourth adhesive grooves. Along the thickness direction of the electronic device, the first glue groove, the second glue groove, the third glue groove and the fourth glue groove are connected to form a dispensing groove. A sealing glue is formed in the dispensing groove, and the sealing glue connects the groove wall of the dispensing groove, the inner side of the frame and the surface of the middle plate.

9. The electronic device according to claim 1 or 2, characterized in that, Along the thickness direction of the electronic device, the two free ends of the first sealing body and the two free ends of the second sealing body are respectively connected by a connecting part, and an insertion gap is formed between the first sealing body and the second sealing body. The circuit board is located in the insertion gap, and the end face of the circuit board abuts against the connecting part.

10. The electronic device according to claim 9, characterized in that, The sealing element also includes a support plate, which is connected between the two free ends of the second sealing body. The surface of the support plate and the second sealing body facing away from the first sealing body is the sealing surface. The sealing element further includes a sealing strip, which protrudes from the sealing surface; The support plate and the second sealing body are sandwiched between the circuit board and the bracket, and the sealing strip is connected and sealed between the end face of the bracket and the inner side of the frame.

11. The electronic device according to claim 10, characterized in that, The end face of the bracket is inclined, the sealing strip includes a surface, and a bearing inclined surface is connected between the surface and the sealing surface. The bearing plate and the second sealing body are sandwiched between the circuit board and the bracket, and the end face of the bracket abuts against the bearing inclined surface.

12. The electronic device according to claim 1 or 2, characterized in that, The surface of the first sealing body facing away from the second sealing body is the first sealing surface, and the surface of the second sealing body facing away from the first sealing body is also the first sealing surface. The first sealing surface has a first sealing protrusion that extends along the length of the first sealing body, and the second sealing surface has a second sealing protrusion that extends along the length of the second sealing body.

13. The electronic device according to claim 12, characterized in that, The first sealing protrusion and the second sealing protrusion are made of elastic material, and the hardness of the first sealing protrusion and the second sealing protrusion is less than the hardness of the first sealing body and the second sealing body.

14. The electronic device according to claim 1 or 2, characterized in that, The outer surfaces of the first sealing body and the second sealing body are elastic surfaces. Both the first sealing body and the second sealing body include a plastic skeleton and a soft rubber covering the outer periphery of the skeleton, wherein the surface of the soft rubber is the elastic surface.

15. The electronic device according to claim 9, characterized in that, The first sealing body further includes two first sealing sections and a first connecting section. The first connecting section connects the ends of the two first sealing sections. The two first sealing sections and the first connecting section form a first notch. The end of the first sealing section away from the first connecting section is provided with a second adhesive groove. The second sealing body further includes two second sealing sections and a second connecting section. The second connecting section connects the ends of the two second sealing sections. The two second sealing sections and the second connecting section form a second notch. The end of the second sealing section away from the second connecting section is provided with the third adhesive groove.

16. The electronic device according to claim 1 or 2, characterized in that, The bracket has a recess that is recessed into the bracket from one surface along the thickness direction of the electronic device. The recess is opposite to the clearance groove and forms part of the rear cavity.

17. The electronic device according to claim 1, characterized in that, The electronic device includes a back cover and a screen, which are mounted on opposite sides of the middle frame in the thickness direction, and the back cover covers the bracket. Alternatively, a front cavity for a speaker is formed between the middle plate and the rear shell, and a sound outlet gap is formed between the screen covering the bracket and the frame, with the front cavity of the speaker communicating with the sound outlet gap.

18. The electronic device according to claim 17, characterized in that, The middle plate is also provided with a through groove that penetrates the surface of the middle plate in the thickness direction. Along the thickness direction of the electronic device, the speaker is opposite to the through groove. The electronic device further includes a screen, which is mounted on both sides of the middle plate in the thickness direction along with the speaker. A sound outlet gap is formed between the screen and the frame. The screen closes the through slot and forms a front cavity with the through slot. The front cavity communicates with the sound outlet gap.

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