Electronic equipment and pickup method

Abstract

The invention provides an electronic device and a pickup method, and belongs to the technical field of terminals, the electronic device comprises a hybrid microphone array, the hybrid microphone array comprises omnidirectional microphones and directional microphones, the direction with the maximum sound signal gain of the hybrid microphone array is the target direction, and the direction with the maximum sound signal gain of the directional microphones is the target direction. The target direction is jointly determined by the omnidirectional microphone and the directional microphone; the directional microphone comprises a first sound inlet and a second sound inlet which are communicated with each other, and the first sound inlet and the second sound inlet are both arranged on a rear camera Deco included in the electronic equipment; or, the first sound inlet is formed in the rear camera Deco, and the second sound inlet is formed in the top of the electronic equipment; or the first sound inlet and the second sound inlet are both arranged on the side surface of the electronic equipment. According to the scheme of the invention, the array structure of the omnidirectional microphone and the directional microphone is combined with the back-end algorithm, so that the pickup enhancement in a specific direction can be realized.

Description

Electronic devices and sound pickup methods Technical Field

[0001] This application relates to the field of terminal technology, and in particular to an electronic device and a sound pickup method. Background Technology

[0002] Sound pickup technology is widely used in various audio and video scenarios, and it mainly uses microphone arrays to pick up sound. Currently, in electronic devices, sound is usually picked up by deploying omnidirectional microphones or omnidirectional microphone arrays. However, omnidirectional microphones have a consistent response to sound signals in all directions of space, and can only rely on array algorithms to enhance sound from specific directions in space.

[0003] For scenarios such as large conferences and speeches, it is often necessary to pick up sound from a specific direction at a long distance. However, omnidirectional microphone arrays have a relatively short pickup range, which cannot meet this requirement. Omnidirectional microphone arrays also have many requirements regarding the distance between microphones, and the consistency of their directional effect across different frequencies is often poor, thus affecting the overall directional performance of the array. Furthermore, due to the weak frequency consistency of the array algorithm, it can lead to different gain effects on sound signals at different frequencies, i.e., "sound coloration," which affects the sound quality of the picked-up sound. Therefore, how to solve these problems has become a worthy research topic. Summary of the Invention

[0004] This application provides an electronic device and a sound pickup method, which solves the problem of poor sound pickup in headphones by combining a hybrid microphone array structure of omnidirectional and directional microphones with a back-end algorithm.

[0005] In a first aspect, an electronic device is provided, including a hybrid microphone array comprising an omnidirectional microphone and a directional microphone, wherein the direction in which the acoustic signal gain of the hybrid microphone array is greatest is a target direction, and the target direction is jointly determined by the omnidirectional microphone and the directional microphone; wherein the directional microphone includes a first sound inlet and a second sound inlet connected together, and both the first sound inlet and the second sound inlet are disposed on a rear camera deco included in the electronic device; or, the first sound inlet is disposed on the rear camera deco, and the second sound inlet is disposed on the top of the electronic device; or, both the first sound inlet and the second sound inlet are disposed on the side of the electronic device.

[0006] This application utilizes one or more directional microphones paired with an omnidirectional microphone to form a hybrid microphone array. Combined with a backend signal processing module, the acoustic signal is post-processed, allowing adjustment of the enhancement direction of the combined microphone array, thereby achieving directional far-field sound pickup enhancement. It should be understood that by retaining the omnidirectional microphone and adding only one or more directional microphones (with fixed pointing directions), the hybrid microphone array maintains the microphone's pickup characteristics while remaining compatible with the overall device architecture, having minimal impact on the device's appearance. Furthermore, the signal processing module allows for flexible adjustment of the enhancement direction, effectively improving the sound pickup effect, broadening the range of applicable scenarios, and enhancing the user experience.

[0007] In conjunction with the first aspect, in some implementations of the first aspect, both the first sound inlet and the second sound inlet are disposed on the rear camera Deco included in the electronic device, including:

[0008] If the rear camera deco has thickness, the first sound inlet is located on the upper side, left side, or right side of the rear camera deco; if the rear camera deco has no thickness, the first sound inlet is located on the upper side edge, left side edge, or right side edge of the rear camera deco; the second sound inlet is located on the plane where the rear camera deco is located, and the plane is parallel to the screen of the electronic device.

[0009] For example, as shown in Figures 7 and 8 of Embodiment 1 of this application.

[0010] It should be understood that the second sound inlet can be either a hole or a micro-slit.

[0011] In this embodiment, one or more directional microphones can be added to an electronic device that includes an omnidirectional microphone. Taking a single directional microphone as an example, the two sound inlets of the directional microphone can be evenly distributed on the rear camera deco, and the direction of the line connecting the two sound inlets is the sound pickup enhancement direction of the directional microphone. The layout of the two sound inlets of the directional microphone can ensure the sound pickup characteristics of the directional microphone, while also being compatible with the existing rear camera deco; it will not have a significant impact on the appearance of the electronic device.

[0012] In conjunction with the first aspect, in some implementations of the first aspect, if the rear camera deco has a thickness, the first sound inlet is disposed on the upper side, left side, or right side of the rear camera deco, including: the first sound inlet being a hole, disposed on the upper side, left side, or right side of the rear camera deco; the first sound inlet being a micro-slit, disposed on the edge of the upper, left, or right side of the rear camera deco closer to the screen; or, the first sound inlet being disposed on the edge of the upper, left, or right side of the rear camera deco farther from the screen.

[0013] In conjunction with the first aspect, in some implementations of the first aspect, both the first sound inlet and the second sound inlet are disposed on the rear camera Deco included in the electronic device, including:

[0014] If the rear camera deco has thickness, both the first and second sound inlets are located on the side of the rear camera deco; if the rear camera deco has no thickness, both the first and second sound inlets are located on the side edge of the rear camera deco.

[0015] For example, as shown in FIG9 of Embodiment 1 of this application.

[0016] In conjunction with the first aspect, in some implementations of the first aspect, both the first sound inlet and the second sound inlet are holes or microslits, or one is a hole and the other is a microslit;

[0017] If the rear camera deco has a thickness, both the first sound inlet and the second sound inlet are located on the side of the rear camera deco, including: a sound inlet that is a hole located on the side of the rear camera deco; and a sound inlet that is a micro-slit located on the edge of the rear camera deco on the side closer to the screen of the electronic device, or on the edge away from the screen.

[0018] In conjunction with the first aspect, in some implementations of the first aspect, the first sound inlet is disposed on the rear camera Deco, including:

[0019] The first sound inlet is located on the plane of the rear camera deco, and the plane is parallel to the screen of the electronic device; or, if the rear camera deco has thickness, the first sound inlet is located on the upper side of the rear camera deco; or, if the rear camera deco has no thickness, the first sound inlet is located on the upper side edge of the rear camera deco.

[0020] Examples include Figure 11 in Embodiment 2 and Figure 16 in Embodiment 3 of this application.

[0021] In conjunction with the first aspect, in some implementations of the first aspect, if the rear camera deco has a thickness, the first sound inlet is disposed on the upper side of the rear camera deco, including:

[0022] If the rear camera deco has thickness, the first sound inlet, which is a hole, is located on the upper side of the rear camera deco; the first sound inlet, which is a micro-slit, is located on the edge of the rear camera deco near the screen, or on the edge away from the screen.

[0023] In conjunction with the first aspect, in some implementations of the first aspect, the second sound inlet is disposed on the top of the electronic device, including:

[0024] The second sound inlet, which is a hole, is located on the top of the electronic device; the second sound inlet, which is a micro-slit, is located on the edge of the top of the electronic device near the screen, or on the edge away from the screen.

[0025] In this application embodiment, one or more directional microphones can be added to an electronic device including an omnidirectional microphone. Taking a directional microphone as an example, the two sound inlets of the directional microphone can be distributed as follows: one can be located on the top of the phone (including the top of the mid-frame, the side edge near the screen, or the side edge near the rear camera deco), and the other can be located on the rear camera deco (including the side, the side edge near the screen, or the side edge away from the screen), or the other can be located on the plane of the rear camera deco. The direction of the line connecting the two sound inlets is the sound pickup enhancement direction of the directional microphone. The layout of the two sound inlets of the directional microphone can ensure the sound pickup characteristics of the directional microphone, and at the same time, it can be compatible with the original rear camera deco; it will not have a significant impact on the appearance of the electronic device.

[0026] In conjunction with the first aspect, in some implementations of the first aspect, both the first sound inlet and the second sound inlet are holes or microslits, or one is a hole and the other is a microslit;

[0027] Both the first and second sound inlets are located on the side of the electronic device, including:

[0028] The sound inlet, which is a hole, is located on the side of the electronic device; the sound inlet, which is a micro-slit, is located on the edge of the side of the electronic device near the screen, or on the edge away from the screen.

[0029] As exemplarily shown in Embodiment 4 of this application.

[0030] In this embodiment, one or more directional microphones can be added to an electronic device that includes an omnidirectional microphone. Taking a single directional microphone as an example, the two sound inlets of the directional microphone can be simultaneously distributed on the left or right side of the phone, and the direction of the line connecting the two sound inlets is the sound pickup enhancement direction of the directional microphone. The layout of the two sound inlets of the directional microphone can ensure the sound pickup characteristics of the directional microphone, while not involving any changes to the original rear camera deco; it will also not have a significant impact on the product appearance of the electronic device.

[0031] In conjunction with the first aspect, in some implementations of the first aspect, the side is the left side or the right side.

[0032] In conjunction with the first aspect, in some implementations of the first aspect, the direction of the line connecting the first sound inlet and the second sound inlet is the sound pickup enhancement direction of the directional microphone; when the directional microphone is a figure-eight directional microphone, both bidirectional sound signals transmitted in the sound pickup enhancement direction are enhanced; when the directional microphone is a cardioid or supercardioid directional microphone, only unidirectional sound signals transmitted in the sound pickup enhancement direction are enhanced.

[0033] In conjunction with the first aspect, in some implementations of the first aspect, the bidirectional direction of the sound pickup enhancement direction includes any one of the left-right direction, up-down direction, and diagonal up-down direction of the electronic device;

[0034] The unidirectional direction of the sound pickup enhancement direction includes any one of the following: left direction, right direction, up direction, and diagonally upward direction.

[0035] In conjunction with the first aspect, in some implementations of the first aspect, the sound inlet of the omnidirectional microphone is located at any one or more positions on the top, bottom, and rear camera Deco of the electronic device.

[0036] Secondly, a sound pickup method is provided, applied to an electronic device, the electronic device including a hybrid microphone array, the hybrid microphone array including an omnidirectional microphone and a directional microphone, and the direction of the maximum sound signal gain of the hybrid microphone array pointing towards a target direction; the direction includes: acquiring the sound signal picked up by the omnidirectional microphone and the sound signal picked up by the directional microphone; transforming the sound signal picked up by the omnidirectional microphone and the sound signal picked up by the directional microphone in the time domain to the frequency domain using a short-time Fourier transform algorithm; obtaining filter coefficients based on the sound signal of the omnidirectional microphone transformed to the frequency domain and the sound signal of the directional microphone transformed to the frequency domain; the filter coefficients make the direction of the maximum gain of the filtered sound signal the target direction.

[0037] In conjunction with the second aspect, in some implementations of the second aspect, when the electronic device is a mobile phone, the target direction is a direction close to the top of the mobile phone.

[0038] For example, the direction near the top of the phone can be perpendicular to the top of the phone.

[0039] In conjunction with the second aspect, in certain implementations of the second aspect, the acoustic signal from the omnidirectional microphone transformed to the frequency domain and the acoustic signal from the directional microphone transformed to the frequency domain include:

[0040] The acoustic signal from the omnidirectional microphone, transformed into the frequency domain, is subjected to de-reverberation processing.

[0041] The acoustic signal from the directional microphone, transformed into the frequency domain, is subjected to dereverberation processing; wherein the dereverberation processing is used to remove environmental noise from the acoustic signal transformed into the frequency domain.

[0042] The filter coefficients are obtained from the reverberation-reduced acoustic signal.

[0043] In conjunction with the second aspect, in some implementations of the second aspect, obtaining the filter coefficients based on the dereverberated acoustic signal includes:

[0044] Amplitude compensation is performed on the acoustic signal of the omnidirectional microphone in the frequency domain after reverberation processing;

[0045] The acoustic signal from the directional microphone in the frequency domain after reverberation processing is subjected to amplitude compensation and phase compensation. The amplitude compensation compensates for amplitude loss in the acoustic signal caused by the device structure and environmental objects of the electronic device. The phase compensation ensures that the phase difference between the compensated omnidirectional microphone and the compensated directional microphone acoustic signal is a preset phase difference.

[0046] The filter coefficients are obtained based on the compensated acoustic signals from the omnidirectional microphone and the directional microphone.

[0047] In conjunction with the second aspect, in some implementations of the second aspect, obtaining the filter coefficients based on the compensated acoustic signals from the omnidirectional microphone and the compensated directional microphone includes:

[0048] The filter coefficients are obtained based on the compensated acoustic signals from the omnidirectional microphone and the directional microphone, and the steering vector, wherein the steering vector is:

[0049]

[0050] in, θ represents the direction of the acoustic signal gain of the hybrid microphone array, j 2 =-1, ω=2πf, f is the frequency point of the sound signal in the frequency domain, τ0 is the delay of the plane wave arriving at the two adjacent microphones when it is incident from the 0° direction, ⊙ is the Adama product of the matrix, and c(ω, θ) is the microphone directivity correction factor when sound signals of different frequencies are incident from different directions as measured.

[0051] The filter coefficients h t (ω) is:

[0052] h t (ω)=A H (AA H ) -1 b

[0053] Where H is the matrix conjugate transpose. b = [10...0] T T denotes matrix transpose; θ max θ represents the direction of maximum acoustic signal gain. min This indicates the direction of maximum acoustic signal attenuation.

[0054] In conjunction with the second aspect, in some implementations of the second aspect, the method further includes: performing post-processing noise reduction on the filtered acoustic signal; and transforming the post-processed noise-reduced acoustic signal to the time domain using inverse short-time Fourier transform.

[0055] Thirdly, an electronic device is provided, comprising: a processor; a memory; the memory storing a computer program, the computer program including instructions that, when executed by the processor, cause the electronic device to perform the method as described in any of the implementations of the second aspect above.

[0056] Fourthly, a chip system is provided, the chip system including a processing circuit, a receiving pin, and a transmitting pin; wherein the receiving pin, the transmitting pin, and the processing circuit communicate with each other through an internal connection path, and the processing circuit executes the method described in any of the implementations of the second aspect above to control the receiving pin to receive signals and control the transmitting pin to transmit signals.

[0057] Fifthly, a computer-readable storage medium is provided that stores computer-executable program instructions, which, when executed on a computer, cause the computer to perform the method as described in any of the implementations of the second aspect above.

[0058] In a sixth aspect, a computer program product is provided, the computer program product including computer program code, which, when run on a computer, causes the computer to perform the method as described in any of the implementations of the second aspect above. Attached Figure Description

[0059] Figure 1 is a schematic diagram of the structure of an omnidirectional microphone provided by related technologies;

[0060] Figure 2 is a schematic diagram of the structure of a directional microphone provided by related technologies;

[0061] Figure 3 is a schematic diagram of the directional characteristics of an omnidirectional microphone;

[0062] Figure 4 is a schematic diagram of the directionality formed by a directional microphone;

[0063] Figure 5 is a schematic diagram of the planar distribution of the sound inlet of an omnidirectional microphone provided in an embodiment of this application;

[0064] Figure 6 is a schematic diagram of the planar distribution of the sound inlet of a microphone array provided in an embodiment of this application;

[0065] Figure 7 is a schematic diagram of the planar distribution of the sound inlet of a directional microphone provided in an embodiment of this application;

[0066] Figure 8 is a schematic diagram of the planar distribution of the sound inlet of another directional microphone provided in an embodiment of this application;

[0067] Figure 9 is a schematic diagram of the planar distribution of the sound inlet of another directional microphone provided in an embodiment of this application;

[0068] Figure 10 is a three-dimensional schematic diagram of the sound inlet distribution of the directional microphone provided in the embodiment of this application;

[0069] Figure 11 shows a schematic diagram of the planar distribution of the sound inlet of another directional microphone provided in an embodiment of this application;

[0070] Figure 12 is a side view of the sound inlet of a directional microphone provided in an embodiment of this application;

[0071] Figure 13 is a three-dimensional schematic diagram of the sound inlet distribution of a directional microphone provided in an embodiment of this application;

[0072] Figure 14 is a three-dimensional schematic diagram of the sound inlet distribution of a directional microphone provided in an embodiment of this application;

[0073] Figure 15 is a three-dimensional schematic diagram of the sound inlet distribution of a directional microphone provided in an embodiment of this application;

[0074] Figure 16 shows a schematic diagram of the planar distribution of the sound inlet of another directional microphone provided in an embodiment of this application;

[0075] Figure 17 is a side view of the sound inlet of a directional microphone provided in an embodiment of this application;

[0076] Figure 18 is a three-dimensional schematic diagram of the sound inlet distribution of a directional microphone provided in an embodiment of this application;

[0077] Figure 19 shows a schematic diagram of the planar distribution of the sound inlet of another directional microphone provided in an embodiment of this application;

[0078] Figure 20 is a three-dimensional schematic diagram of the sound inlet distribution of a directional microphone provided in an embodiment of this application;

[0079] Figure 21 is a schematic flowchart of a sound pickup method provided in an embodiment of this application;

[0080] Figure 22 is a simplified combined layout diagram of a hybrid microphone array provided in an embodiment of this application;

[0081] Figure 23 is a schematic diagram of the simulated directivity of a hybrid microphone array provided in an embodiment of this application. Detailed Implementation

[0082] It should be noted that the terminology used in the implementation section of the embodiments of this application is only used to explain the specific embodiments of this application and is not intended to limit this application. In the description of the embodiments of this application, unless otherwise stated, " / " means "or", for example, A / B can mean A or B; "and / or" in this document is merely a description of the association relationship of related obstacles, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, and B alone. In addition, in the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more, "at least one" or "one or more" means one, two or more.

[0083] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

[0084] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0085] The technical solution of this application will be described in detail below with reference to specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments.

[0086] To better understand the device sound pickup method provided in the embodiments of this application, the following will first introduce the terms or concepts that may be involved in the embodiments below.

[0087] 1. Omnidirectional microphone

[0088] An omnidirectional microphone is a microphone that is equally sensitive to sound signals (or speech signals) in all directions of space, and it can collect sound signals from any direction.

[0089] For example, Figure 1 is a schematic diagram of the structure of an omnidirectional microphone provided by the related technology.

[0090] As shown in Figure 1, the opening at the top is the sound inlet of an omnidirectional microphone, which can use this sound inlet to collect sound signals from any direction.

[0091] 2. Directional microphone

[0092] A directional microphone is a microphone that is only sensitive to sound signals from a specific direction; that is, a directional microphone can only collect sound signals from a specific direction. In the embodiments of this application, the directional microphone can be a figure-eight directional microphone or a cardioid directional microphone. The figure-eight directional microphone's pickup shape resembles the number "8," while the cardioid microphone's pickup shape resembles a pattern. A figure-eight directional microphone can also be called a bicardioid microphone or a bidirectional microphone.

[0093] For example, Figure 2 is a schematic diagram of the structure of a directional microphone provided by the related technology.

[0094] As shown in Figure 2, the two openings at the top and bottom are the two sound inlets of a directional microphone. These two sound inlets are connected by a pipe, and the directional microphone can use these two sound inlets to collect sound signals from a specific direction.

[0095] 3. Beam

[0096] The spatial direction of a microphone's response to a sound signal can be represented by a beam. In other words, the beam can represent the microphone's sensitivity to sound signals in a specific direction. The direction in which the beam points indicates that the microphone is more sensitive to sound signals in that direction.

[0097] Figure 3 shows a schematic diagram of the beam pattern formed by an omnidirectional microphone. The beam pattern of the omnidirectional microphone is close to a circle, and the boundary of this circle is at 0 dB, that is, the maximum concavity is 0 dB. This indicates that the omnidirectional microphone is sensitive to sound signals from all directions in space and will not only collect sound signals from a specific direction, so its directivity is poor.

[0098] Figure 4(a) shows a schematic diagram of the beam directionality of a figure-eight directional microphone. The beam shape of this directional microphone resembles the number "8". For example, in the 0° and 180° directions, the directional beam can reach 0dB, meaning that the sound signal in these directions is not attenuated. However, sound signals in other directions are suppressed. For example, the maximum dip depth in the 90° and 270° directions is -40dB, indicating significant sound signal attenuation. The maximum dip depth indicates the degree of sound signal attenuation in a specific direction. Taking Figure 4(a) as an example, the maximum dip depth of the figure-eight directional microphone is -40dB, indicating that the directional microphone does not collect sound signals in that specific direction.

[0099] Figure 4(b) shows a schematic diagram of the beam pattern formed by a cardioid microphone; Figure 4(c) shows a schematic diagram of the beam pattern formed by a supercardioid microphone. The beam shapes of these two directional microphones are similar. For example, in the 0° direction shown in the figure, the directional beam can reach 0dB, meaning that the sound signal in the 0° direction is not attenuated. However, sound signals in other directions are suppressed. For example, in Figure 4(b), the maximum attenuation depth in the 180° direction is -40dB, indicating significant sound signal attenuation. The maximum attenuation depth can be used to represent the degree of sound signal attenuation by a directional microphone in a specific direction. Taking Figure 4(b) as an example, the maximum attenuation of the cardioid directional microphone is -40dB, indicating that the directional microphone does not collect sound signals in that specific direction.

[0100] 4. Microelectromechanical system (MEMS) microphone

[0101] MEMS microphones, also known as silicon microphones, are acoustic-to-electrical transducers based on MEMS technology. They are characterized by good frequency response and low noise. The general structure of a MEMS microphone consists of a printed circuit board (PCB) and a housing forming a microphone package. Internally, a MEMS chip and an application-specific integrated circuit (ASIC) chip electrically connected to it are integrated on the PCB, transmitting signals via bonding wires. The MEMS chip includes a substrate, a diaphragm fixed to the substrate, and a backplate. The diaphragm and backplate constitute a capacitor integrated on a silicon wafer. During sound pickup, sound enters the microphone through the sound hole and acts on the diaphragm of the MEMS chip. The vibration of the diaphragm changes the distance between the diaphragm and the backplate, thereby converting the acoustic signal into an electrical signal. In this application's embodiments, both the omnidirectional and directional microphones can be MEMS microphones.

[0102] 5. Deco

[0103] "Deco" refers to the decorative design of a camera module. It is not an abbreviation, but a noun used to describe the decorative design elements around a camera module. These elements can be of different shapes, colors, or materials, used to enhance the overall design language and aesthetics of electronic devices.

[0104] In this embodiment, the rear camera Deco refers to the decorative design area corresponding to the rear camera module of the electronic device.

[0105] As described in the background section, omnidirectional microphones exhibit a consistent response to sound signals in all spatial directions, leading to poor overall directional performance of the array and impacting sound quality. Unlike omnidirectional microphones, directional microphones possess specific spatial directivity, allowing them to enhance sound signals in specific directions and improve pickup performance.

[0106] In recent years, with the development of microphone technology, the technology of directional microphones has matured, making their application in electronic products possible. However, some problems and contradictions have emerged in actual use.

[0107] For example, firstly, when directional microphones are used in electronic devices, two sound holes are generally required on the device's surface. This necessitates a meticulous design of the device's structure to ensure both the microphone's pickup characteristics and compatibility with the overall device architecture. Secondly, considering the limitations on the number of microphones in consumer electronics and the impact of the structural requirements of directional microphones (requiring two sound holes) on the product's appearance, the number of directional microphones should not be excessive. Thirdly, while the spatial directivity of a directional microphone is fixed once integrated into the device, in practical applications, the direction of directional sound enhancement should be flexibly adjustable within a 360° range depending on the scenario. Therefore, how to further address these issues becomes a worthy research topic.

[0108] In view of this, embodiments of this application provide a sound pickup device that combines one or more directional microphones with an omnidirectional microphone to form a hybrid microphone array. By combining this with a back-end signal processing module to post-process the sound signal, the enhancement direction of the combined microphone array can be adjusted, thereby achieving directional far-field sound pickup enhancement.

[0109] It should be understood that by retaining the omnidirectional microphone and adding only one or more directional microphones (with a fixed pointing direction), the hybrid microphone array can be compatible with the overall architecture of the device while maintaining the microphone's sound pickup characteristics, and has little impact on the device's appearance. In addition, because the signal processing module makes the enhancement direction adjustment flexible, the sound pickup effect can be effectively improved, the sound pickup can be adapted to a wider range of scenarios, and the user experience can also be improved.

[0110] In this application embodiment, the sound pickup device can also be referred to as an electronic device. This application embodiment does not specifically limit the type of electronic device. In some embodiments, the device can be a mobile phone, wearable device (e.g., smart bracelet, smartwatch, earphones, etc.), tablet computer, laptop computer, handheld computer, laptop, ultra-mobile personal computer (UMPC), cellular phone, personal digital assistant (PDA), augmented reality (AR) / virtual reality (VR) device, or other IoT (Internet of Things) devices, as well as a television, large screen, printer, projector, etc.

[0111] For ease of illustration, the following explanation will use a mobile phone as the sound pickup device.

[0112] For example, Figure 5 shows a schematic diagram of the planar distribution of an omnidirectional microphone provided in an embodiment of this application. As shown in Figure 5, the mobile phone may include three sound inlets located at the top, bottom, and rear camera deco of the phone, respectively. Based on this, this application further adds one or more directional microphones to the mobile phone to form a microphone array including omnidirectional and directional microphones.

[0113] For example, Figure 6 shows a schematic diagram of the planar distribution of the sound inlets of a microphone array according to an embodiment of this application. As shown in Figure 6, this application can provide one or more directional microphones, and the sound inlets of the one or more directional microphones can be located on the left, right, top, or rear camera deco of the mobile phone.

[0114] In this embodiment, the sound inlets of the omnidirectional microphone and the directional microphone can be used independently or partially shared; this embodiment does not limit this. As shown in Figure 6, the sound inlets on the rear camera Deco can be shared by the omnidirectional microphone and the directional microphone.

[0115] It is understood that the layout illustrated in the embodiments of this application does not constitute a specific limitation on the directional microphone and its corresponding sound inlet. In other embodiments of this application, the mobile phone may include more or fewer directional microphones and sound inlets than illustrated.

[0116] Optionally, in the embodiments of this application, the sound inlet of the directional microphone can be any shape such as a hole or a micro-slit. When the sound inlet is a hole, the shape of the hole can be circular, elliptical, etc. The embodiments of this application do not impose any limitations on the shape, size, etc. of the sound inlet.

[0117] Optionally, in this embodiment, when the sound inlet of the directional microphone is set on the rear camera Deco, it can be set on the plane where the rear camera Deco is located; if the rear camera Deco has a certain thickness, the sound inlet of the directional microphone can be set on the side of the rear camera Deco, where the side refers to the curved surface in the thickness direction; if the rear camera Deco has no thickness, the sound inlet of the directional microphone can also be set on the side edge (or side) of the rear camera Deco.

[0118] It should be noted that, taking a directional microphone as an example, the direction of the line connecting the two sound inlets of the directional microphone is the sound pickup enhancement direction of a single directional microphone. When the directional microphone is a figure-eight directional microphone, it can enhance the sound signals transmitted in both directions in the sound pickup enhancement direction; when the directional microphone is a cardioid or supercardioid directional microphone, it can only enhance the sound signals transmitted in one direction in the sound pickup enhancement direction.

[0119] The following four examples illustrate in detail the distribution of the sound inlets of the directional microphones on a mobile phone.

[0120] Example 1

[0121] Figures 7 to 9 show schematic diagrams of the planar distribution of the sound inlet of a directional microphone provided in an embodiment of this application.

[0122] Taking the addition of a directional microphone to a mobile phone as an example, the two sound inlets of this directional microphone can be evenly distributed on the rear camera deco. The direction parallel to the bottom of the phone is the X direction, and the direction parallel to the side of the phone is the Y direction; the X and Y directions are perpendicular to each other.

[0123] Optionally, as shown in Figures 7(a) and (b), if the rear camera Deco has a certain thickness, the sound inlet 1 can be distributed on the left side of the rear camera Deco; if the rear camera Deco has no thickness, the sound inlet 1 can be distributed on the left edge of the rear camera Deco; the sound inlet 2 can be distributed on the plane where the rear camera Deco is located, that is, on the XOY plane formed by the X-axis and the Y-axis.

[0124] Optionally, as shown in (c) and (d) of Figure 7, if the rear camera Deco has a certain thickness, the sound inlet 1 can be distributed on the right side of the rear camera Deco; if the rear camera Deco has no thickness, the sound inlet 1 can be distributed on the right edge of the rear camera Deco; the sound inlet 2 can be distributed on the XOY plane where the rear camera Deco is located.

[0125] Optionally, as shown in Figures 8(a) and (b), if the rear camera Deco has a certain thickness, the sound inlet 1 can be distributed on the upper side of the rear camera Deco; if the rear camera Deco has no thickness, the sound inlet 1 can be distributed on the upper edge of the rear camera Deco; the sound inlet 2 can be distributed on the XOY plane where the rear camera Deco is located.

[0126] Optionally, as shown in Figures 9(a) and (b), if the rear camera Deco has a certain thickness, the sound inlet 1 and the sound outlet 1 can be evenly distributed on the side of the rear camera Deco; if the rear camera Deco has no thickness, the sound inlet 1 and the sound outlet 1 can be evenly distributed on the side edge of the rear camera Deco.

[0127] It should be understood that in application scenarios, regardless of whether the phone is placed upright, lying flat, or on its side, it is generally used to pick up sound from the top or back of the phone, so specific enhancement is needed for these directions; the bottom of the phone is generally only used to pick up the user's own voice, and the sound inlet of the omnidirectional microphone is already distributed in this position. Therefore, considering these two aspects, there is no need to set the sound inlet of the directional microphone at the bottom of the phone and the lower side of the rear camera Deco.

[0128] For example, the line connecting the sound inlet 1 and the sound inlet 2 is in the X direction, as shown in Figure 7(a). When the directional microphone is a figure-eight directional microphone, it can enhance the sound received from the left and right sides (positive and negative X directions); as shown in Figure 7(b), when the directional microphone is a cardioid or supercardioid directional microphone, it can enhance the sound received from the left side (negative X direction).

[0129] For example, the line connecting the sound inlet 1 and the sound inlet 2 is in the X direction, as shown in Figure 7(c). When the directional microphone is a figure-eight directional microphone, it can enhance the sound received from the left and right sides (positive and negative X directions); as shown in Figure 7(d), when the directional microphone is a cardioid or supercardioid directional microphone, it can enhance the sound received from the right side (positive X direction).

[0130] For example, the line connecting the sound inlet 1 and the sound inlet 2 is in the Y direction, as shown in Figure 8(a). When the directional microphone is a figure-eight directional microphone, it can enhance the sound received from the upper and lower sides (positive and negative Y directions); as shown in Figure 8(b), when the directional microphone is a cardioid or supercardioid directional microphone, it can enhance the sound received from the upper side (positive X direction).

[0131] For example, the line connecting sound inlet 1 and sound inlet 2 is inclined in the XOY plane, that is, it has a certain angle with the X-axis and Y-axis. Taking the angle of "45° with the negative X-axis and positive Y-axis" as an example, as shown in Figure 9(a), when the directional microphone is a figure-eight directional microphone, it can enhance the sound collected from both directions of "45° with the negative X-axis and positive Y-axis" and "45° with the positive X-axis and negative Y-axis"; as shown in Figure 9(b), when the directional microphone is a cardioid or supercardioid directional microphone, it can enhance the sound collected from only one direction of "45° with the negative X-axis and positive Y-axis".

[0132] It should be understood that the 45° angle is only an example angle, and the direction of the line connecting the sound inlet 1 and the sound inlet 2 can also form other angles with the X-axis and Y-axis. This application does not limit this.

[0133] Optionally, in the above examples, both the sound inlet 1 and the sound inlet 2 can be holes or microslits, or one can be a hole and the other a microslit.

[0134] For example, Figure 10 is a three-dimensional distribution diagram of the sound inlet of a directional microphone provided in an embodiment of this application.

[0135] If the rear camera deco has no thickness, as shown in Figure 10(a), the micro-slit sound inlets can be distributed on the side edges of the rear camera deco. If the rear camera deco has a certain thickness, as shown in Figure 10(b), the micro-slit sound inlets can be distributed on the side edges of the rear camera deco closest to the electronic device body; or, as shown in Figure 10(c), the micro-slit sound inlets can also be distributed on the side edges of the rear camera deco furthest from the electronic device body; or, as shown in Figure 10(d), the hole-shaped sound inlets can be distributed on the side of the rear camera deco.

[0136] It should be understood that only one sound inlet is shown in the figure, and the other is not shown; the sound inlet can be sound inlet 1 or sound inlet 2; the distribution of the two sound inlets can be obtained by combining the four examples shown in Figure 10.

[0137] In this embodiment, one or more directional microphones can be added to an electronic device that includes an omnidirectional microphone. Taking a single directional microphone as an example, the two sound inlets of the directional microphone can be evenly distributed on the rear camera deco, and the direction of the line connecting the two sound inlets is the sound pickup enhancement direction of the directional microphone. The layout of the two sound inlets of the directional microphone can ensure the sound pickup characteristics of the directional microphone, while also being compatible with the existing rear camera deco; it will not have a significant impact on the appearance of the electronic device.

[0138] Example 2

[0139] Figure 11 shows a schematic diagram of the planar distribution of the sound inlet of another directional microphone provided in an embodiment of this application.

[0140] As shown in Figure 11, taking the addition of a directional microphone to a mobile phone as an example, this directional microphone includes two sound inlets. One sound inlet can be located at the top of the phone, and the other sound inlet can be located on the rear camera deco. The sound inlet located on the rear camera deco is situated on the upper side or the upward-facing side edge.

[0141] Optionally, taking the sound inlet 1 as an example, when the rear camera Deco has a certain thickness, the sound inlet 1 can be distributed on the upper side of the rear camera Deco.

[0142] Optionally, taking the sound inlet 1 as a micro-slit as an example, if the rear camera deco has a certain thickness, the sound inlet 1 can be distributed on the side edge of the rear camera deco that is close to the phone screen or away from the phone screen; if the rear camera deco has no thickness, the sound inlet 1 can be distributed on the side edge of the rear camera deco; in particular, regardless of which edge it is located on, the sound inlet 1 is located on the upper side of the rear camera deco.

[0143] Optionally, taking the sound inlet 2 as an example, the sound inlet 2 can be located at the top of the phone. Specifically, it can be located at the top of the phone's mid-frame.

[0144] Optionally, taking the sound inlet 2 as a micro-slit as an example, the sound inlet 2 can be distributed on the edge of the phone near the rear camera Deco side or away from the rear camera Deco side (also known as the side near the screen); where, regardless of which edge it is located on, the sound inlet 2 is located at the top of the phone.

[0145] It should be understood that when the sound inlet 1 is distributed on the edge of the phone near the rear camera Deco side, it can be distributed on the top of the phone back cover or at the junction of the phone back cover and the top mid-frame; when the sound inlet 1 is distributed on the edge of the phone near the screen side, it can be distributed on the top of the phone screen or at the junction of the phone screen and the top mid-frame.

[0146] It should be understood that in application scenarios, regardless of whether the phone is placed upright, lying flat, or on its side, it is generally used to pick up sound coming from the top of the phone, so specific enhancement is needed in these directions. The bottom of the phone is generally only used to pick up the user's own voice, and the omnidirectional microphone inlets are already distributed in this position. Therefore, considering these two aspects, it is not necessary to set the inlets of directional microphones at the bottom of the phone and the lower side of the rear camera deco. It is sufficient to set the inlets of directional microphones only on the top of the phone and the upper side or side edge of the rear camera deco.

[0147] For example, the line connecting the sound inlet 1 and the sound inlet 2 is in the Y direction or approximately the Y direction, as shown in (a) and (c) of Figure 11. When the directional microphone is a figure-eight directional microphone, it can enhance the sound received from the upper and lower sides (positive and negative Y or approximately Y). As shown in (b) and (d) of Figure 11, when the directional microphone is a cardioid or supercardioid directional microphone, it can enhance the sound received from the upper side (positive Y or approximately positive Y).

[0148] It should be explained that while sound inlets 1 and 2 are on the same vertical line in the Y-axis direction, they may indicate the same position or not in the Z-axis direction (the thickness of the phone). The approximate Y-axis direction means that when sound inlets 1 and 2 indicate different positions on the Z-axis, the line connecting sound inlets 1 and 2 will form a certain angle with the positive Y-axis and the negative Z-axis.

[0149] It should be understood that the above is only an example. In addition, the sound inlet 1 and the sound inlet 2 may not be on the same vertical line in the Y-axis direction. This application does not limit this.

[0150] Figure 12 is a side view of the sound inlet of a directional microphone provided in an embodiment of this application; Figures 13 to 15 are three-dimensional views of the sound inlet of a directional microphone provided in an embodiment of this application.

[0151] For example, as shown in Figures 12(a), 13(a), (b), (c), and (d), when the sound inlet 2 is a hole located on the top of the phone's frame, it can be located at position a1. In this case, if the sound inlet 1 is a hole, as shown in Figure 13(a), and the rear camera deco has a certain thickness, the sound inlet 1 can be located on the upper side of the rear camera deco, such as at position b2. If the sound inlet 1 is a micro-slit, and the rear camera deco has no thickness, as shown in Figure 13(b), the sound inlet 1 can also be located on the upper side edge of the rear camera deco, such as at position b1; if the sound inlet 1 is a micro-slit, and the rear camera deco has a certain thickness, as shown in Figures 13(c) and (d), the sound inlet 1 can be located on the side edge of the rear camera deco near or away from the phone screen, and on the upper side of the rear camera deco, such as at positions b1 or b3.

[0152] Based on the above, as shown in Figure 12(a), the direction of the line connecting sound inlet 1 and sound inlet 2 can be the direction indicated by the lines connecting a1 and b1, a1 and b2, and a1 and b3. As shown in Figure 11(a), when the directional microphone is a figure-eight directional microphone, it can respectively amplify the sound received in the approximate vertical directions indicated by the lines connecting a1 to b1, a1 to b2, and a1 to b3; as shown in Figure 11(b), when the directional microphone is a cardioid or supercardioid directional microphone, it can respectively amplify the sound received approximately vertically as indicated by the lines connecting a1 to b1, a1 to b2, and a1 to b3. It should be understood that the directions indicated by the lines connecting a1 and b1, a1 and b2, and a1 and b3 have a small angle with the Y-axis; therefore, they can be considered approximate Y-axis directions.

[0153] For example, as shown in Figure 12(b), Figure 14(a), (b), (c), and (d), when the sound inlet 2 is a micro-slit located at the top of the phone and close to the screen, it can be located at position a2. In this case, the sound inlet 1 is a hole, as shown in Figure 14(a), and the rear camera deco has a certain thickness. The sound inlet 1 can be located on the upper side of the rear camera deco, such as at position b2. If the sound inlet 1 is a micro-slit and the rear camera deco has no thickness, as shown in Figure 14(b), the sound inlet 1 can also be located on the upper side edge of the rear camera deco, such as at position b1. If the sound inlet 1 is a micro-slit and the rear camera deco has a certain thickness, as shown in Figure 14(c) and (d), the sound inlet 1 can be located on the side edge of the rear camera deco close to or away from the phone screen, and on the upper side of the rear camera deco, such as at positions b1 or b3.

[0154] In conjunction with the above, as shown in Figure 12(b), the direction of the line connecting sound inlet 1 and sound inlet 2 can be the direction indicated by the lines connecting a2 and b1, a2 and b2, and a2 and b3. As shown in Figure 11(c), when the directional microphone is a figure-eight directional microphone, it can respectively amplify the sound received in the approximate upper and lower directions indicated by the lines connecting a2 to b1, a2 to b2, and a2 to b3; as shown in Figure 11(d), when the directional microphone is a cardioid or supercardioid directional microphone, it can respectively amplify the sound received approximately above, indicated by the lines connecting a2 to b1, a2 to b2, and a2 to b3. It should be understood that the directions indicated by the lines connecting a2 and b1, a2 and b2, and a2 and b3 have a small angle with the Y-axis; therefore, they can be considered approximate Y-axis directions.

[0155] For example, as shown in Figure 12(c), Figure 15(a), (b), (c), and (d), when the sound inlet 2 is a micro-slit located at the top of the phone and near the rear camera Deco, it can be located at position a3. In this case, the sound inlet 1 is a hole, as shown in Figure 15(a), and the rear camera Deco has a certain thickness. The sound inlet 1 can be located on the upper side of the rear camera Deco, such as at position b2. If the sound inlet 1 is a micro-slit and the rear camera Deco has no thickness, as shown in Figure 15(b), the sound inlet 1 can also be located on the upper side edge of the rear camera Deco, such as at position b1. If the sound inlet 1 is a micro-slit and the rear camera Deco has a certain thickness, as shown in Figure 15(c) and (d), the sound inlet 1 can be located on the side edge of the rear camera Deco near or away from the phone screen, and on the upper side of the rear camera Deco, such as at positions b1 or b3.

[0156] Based on the above, as shown in Figure 12(c), the direction of the line connecting sound inlet 1 and sound inlet 2 can be the direction indicated by the lines connecting a3 and b1, a3 and b2, and a3 and b3. As shown in Figure 11(c), when the directional microphone is a figure-eight directional microphone, it can respectively amplify the sound received in the approximately up and down directions indicated by the lines connecting a3 to b1, a3 to b2, and a3 to b3; as shown in Figure 11(d), when the directional microphone is a cardioid or supercardioid directional microphone, it can respectively amplify the sound received above or approximately above indicated by the lines connecting a3 to b1, a3 to b2, and a3 to b3. It should be understood that the direction indicated by the line connecting a3 and b1 is the Y-axis direction, and the angle between the directions indicated by the lines connecting a3 and b2 and a3 and b3 and the Y-axis is small; therefore, it can be considered an approximate Y-axis direction.

[0157] In this application embodiment, one or more directional microphones can be added to an electronic device including an omnidirectional microphone. Taking a directional microphone as an example, the two sound inlets of the directional microphone can be distributed as follows: one can be located on the top of the phone (including the top of the mid-frame, the side edge near the screen or the side of the rear camera deco), and the other can be located on the rear camera deco (including the side, the side edge near the screen or the side of the rear camera deco). The direction of the line connecting the two sound inlets is the sound pickup enhancement direction of the directional microphone. The layout of the two sound inlets of the directional microphone can ensure the sound pickup characteristics of the directional microphone, and at the same time, it can be compatible with the original rear camera deco; it will not have a significant impact on the product appearance of the electronic device.

[0158] Example 3

[0159] Figure 16 shows a schematic diagram of the planar distribution of the sound inlet of another directional microphone provided in an embodiment of this application.

[0160] As shown in Figure 16, taking the addition of a directional microphone to a mobile phone as an example, this directional microphone includes two sound inlets. One sound inlet can be located at the top of the phone, and the other sound inlet is located on the rear camera deco. The sound inlet on the rear camera deco is located on a plane parallel to the phone screen, that is, on the XOY plane. Here, the sound inlet on the XOY plane is shaped like a hole, and its position on the rear camera deco can be slightly higher, closer to the top of the phone.

[0161] Optionally, taking a hole as an example, the sound inlet 2 can be located at the top of the phone. Specifically, it can be located at the top of the phone's mid-frame.

[0162] Optionally, taking the sound inlet 2 as a micro-slit as an example, the sound inlet 2 can be distributed on the edge of the phone near the rear camera Deco side or away from the rear camera Deco side (also known as the side near the screen); where, regardless of which edge it is located on, the sound inlet 2 is located at the top of the phone.

[0163] It should be understood that when the sound inlet 1 is distributed on the edge of the phone near the rear camera Deco side, it can be distributed on the top of the phone back cover or at the junction of the phone back cover and the top mid-frame; when the sound inlet 1 is distributed on the edge of the phone near the screen side, it can be distributed on the top of the phone screen or at the junction of the phone screen and the top mid-frame.

[0164] It should be understood that in application scenarios, regardless of whether the phone is placed upright, lying flat, or on its side, it is generally used to pick up sound coming from the top of the phone, so specific enhancement is needed in these directions. The bottom of the phone is generally only used to pick up the user's own voice, and the sound inlets of the omnidirectional microphones are already distributed in this position. Therefore, considering these two aspects, it is not necessary to set the sound inlets of directional microphones at the bottom of the phone and the lower side of the rear camera deco. It is sufficient to set the sound inlets of directional microphones only at the top of the phone and on the plane where the rear camera deco is located.

[0165] For example, the line connecting the sound inlet 1 and the sound inlet 2 is in the approximate Y direction, as shown in (a) and (c) of Figure 16. When the directional microphone is a figure-eight directional microphone, it can enhance the sound received from the upper and lower sides (approximately Y direction); as shown in (b) and (d) of Figure 16, when the directional microphone is a cardioid or supercardioid directional microphone, it can enhance the sound received from the upper side (approximately positive Y direction).

[0166] It should be explained that while sound inlets 1 and 2 are on the same vertical line in the Y-axis direction, they do not indicate the same position in the Z-axis direction (the thickness of the phone). The approximate Y-axis direction means that when sound inlets 1 and 2 indicate different positions on the Z-axis, the line connecting sound inlets 1 and 2 will form a certain angle with the positive Y-axis and the negative Z-axis.

[0167] It should be understood that the above is only an example. In addition, the sound inlet 1 and the sound inlet 2 may not be on the same vertical line in the Y-axis direction. This application does not limit this.

[0168] Figure 17 is a side view of the sound inlet of a directional microphone provided in an embodiment of this application; Figure 18 is a three-dimensional view of the sound inlet of a directional microphone provided in an embodiment of this application.

[0169] For example, as shown in Figures 17(a) and 18(a), when the sound inlet 2 is a hole located on the top of the phone's mid-frame, it can be located at position a1. In this case, the sound inlet 1 is a hole, as shown in Figure 18(a). Regardless of whether the rear camera Deco has a certain thickness, the sound inlet 1 can be located in the plane where the rear camera Deco is located, such as at position b4.

[0170] Based on the above, as shown in Figure 17(a), the direction of the line connecting sound inlet 1 and sound inlet 2 can be the direction indicated by the line connecting a1 and b4. Referring to Figure 16(a), when the directional microphone is a figure-eight directional microphone, it can correspondingly amplify the sound received in the approximate vertical directions indicated by the line connecting a1 and b4; referring to Figure 16(b), when the directional microphone is a cardioid or supercardioid directional microphone, it can correspondingly amplify the sound received approximately vertically as indicated by the line connecting a1 and b4. It should be understood that the angle between the direction indicated by the line connecting a1 and b4 and the Y-axis is small; therefore, it can be considered approximately the Y-axis direction.

[0171] For example, as shown in Figures 17(b) and 18(b), when the sound inlet 2 is a micro-slit located at the top of the phone and close to the screen, it can be located at position a2. In this case, the sound inlet 1 is a hole, as shown in Figure 18(b). Regardless of whether the rear camera deco has a certain thickness, the sound inlet 1 can be located in the plane where the rear camera deco is located, such as at position b4.

[0172] Based on the above, as shown in Figure 17(b), the direction of the line connecting sound inlet 1 and sound inlet 2 can be the direction indicated by the line connecting a2 and b4. As shown in Figure 16(c), when the directional microphone is a figure-eight directional microphone, it can correspondingly amplify the sound received in the approximately vertical directions indicated by the line connecting a2 and b4; as shown in Figure 16(d), when the directional microphone is a cardioid or supercardioid directional microphone, it can correspondingly amplify the sound received approximately vertically indicated by the line connecting a2 and b4. It should be understood that the angle between the direction indicated by the line connecting a2 and b4 and the Y-axis is small; therefore, it can be considered approximately the Y-axis direction.

[0173] For example, as shown in Figures 17(c) and 18(c), when the sound inlet 2 is a micro-slit located at the top of the phone and close to the rear camera Deco side, it can be located at position a3. In this case, the sound inlet 1 is a hole, as shown in Figure 18(c). Regardless of whether the rear camera Deco has a certain thickness, the sound inlet 1 can be located on the plane where the rear camera Deco is located, such as at position b4.

[0174] Based on the above, as shown in Figure 17(c), the direction of the line connecting sound inlet 1 and sound inlet 2 can be the direction indicated by the line connecting a3 and b4. Referring to Figure 16(c), when the directional microphone is a figure-eight directional microphone, it can correspondingly amplify the sound received in the approximate vertical directions indicated by the line connecting a3 and b4; referring to Figure 16(d), when the directional microphone is a cardioid or supercardioid directional microphone, it can correspondingly amplify the sound received approximately vertically as indicated by the line connecting a3 and b4. It should be understood that the angle between the direction indicated by the line connecting a3 and b4 and the Y-axis is small; therefore, it can be considered approximately the Y-axis direction.

[0175] In this application embodiment, one or more directional microphones can be added to an electronic device including an omnidirectional microphone. Taking a directional microphone as an example, the two sound inlets of the directional microphone can be distributed as follows: one can be located on the top of the phone (including the mid-frame, the side edge near the screen, or the side near the rear camera deco), and the other can be located on the plane of the rear camera deco. The direction of the line connecting the two sound inlets is the sound pickup enhancement direction of the directional microphone. The layout of the two sound inlets of the directional microphone can ensure the sound pickup characteristics of the directional microphone, and at the same time, it can be compatible with the original rear camera deco; it will not have a significant impact on the product appearance of the electronic device.

[0176] Example 4

[0177] Figure 19 shows a schematic diagram of the planar distribution of the sound inlet of another directional microphone provided in an embodiment of this application.

[0178] As shown in Figure 19, taking the addition of a directional microphone to a mobile phone as an example, the two sound inlets of the directional microphone can be simultaneously distributed on the left side or the right side of the mobile phone.

[0179] As shown in Figures 19(a) and (b), the sound inlet 1 and the sound inlet 2 can be simultaneously located on the left side of the phone; or, as shown in Figures 19(c) and (d), the sound inlet 1 and the sound inlet 2 can be simultaneously located on the right side of the phone.

[0180] Optionally, the two sound inlets of the directional microphone can be simultaneously located on the left side near the top of the phone or simultaneously located on the right side near the top of the phone.

[0181] It should be understood that in application scenarios, regardless of whether the phone is placed upright, lying flat, or on its side, it is generally used to pick up sound coming from the top of the phone, so specific enhancement is needed in these directions. The bottom of the phone is generally only used to pick up the user's own voice, and the omnidirectional microphone inlet is already distributed in this position. Therefore, considering these two aspects, it is not necessary to set the directional microphone inlet at the bottom or lower side of the phone. It is sufficient to set the directional microphone inlet on the left or right side of the phone near the top.

[0182] For example, the line connecting the sound inlet 1 and the sound inlet 2 is in the Y direction or approximately the Y direction, as shown in (a) and (c) of Figure 19. When the directional microphone is a figure-eight directional microphone, it can enhance the sound received from the upper and lower sides (positive and negative Y or approximately Y). As shown in (b) and (d) of Figure 19, when the directional microphone is a cardioid or supercardioid directional microphone, it can enhance the sound received from the upper side (positive Y or approximately positive Y).

[0183] It should be explained that while sound inlets 1 and 2 are on the same vertical line in the Y-axis direction, they may indicate the same position or not in the Z-axis direction (the thickness of the phone). The approximate Y-axis direction means that when sound inlets 1 and 2 indicate different positions on the Z-axis, the line connecting sound inlets 1 and 2 will form a certain angle with the positive Y-axis and the negative Z-axis.

[0184] Figure 20 is a three-dimensional schematic diagram of the sound inlet of a directional microphone provided in an embodiment of this application.

[0185] For example, as shown in Figure 20(a), when both the sound inlet 1 and the sound inlet 2 are micro-slits, they can be located simultaneously on the edge of the side of the phone near the screen; as shown in Figure 20(b), when both the sound inlet 1 and the sound inlet 2 are micro-slits, they can also be located simultaneously on the edge of the side of the phone near the rear camera Deco; as shown in Figure 20(c), when both the sound inlet 1 and the sound inlet 2 are micro-slits, one can be located on the edge of the side of the phone near the screen, and the other can be located on the edge of the side of the phone near the rear camera Deco; as shown in Figure 20(c), when both the sound inlet 1 and the sound inlet 2 are holes, they can be located simultaneously on the side frame of the phone.

[0186] In summary, when the sound inlet 1 is simultaneously located on the edge of the side of the phone near the screen and on the edge of the side of the phone near the rear camera Deco, or on the side frame of the phone, the direction of the line connecting the two sound inlets is the Y-axis direction; when one sound inlet is located on the edge of the side of the phone near the screen and the other is located on the edge of the side of the phone near the rear camera Deco, the direction of the line connecting the two sound inlets can be considered to be approximately the Y-axis direction.

[0187] In this embodiment, one or more directional microphones can be added to an electronic device that includes an omnidirectional microphone. Taking a single directional microphone as an example, the two sound inlets of the directional microphone can be simultaneously distributed on the left or right side of the phone, and the direction of the line connecting the two sound inlets is the sound pickup enhancement direction of the directional microphone. The layout of the two sound inlets of the directional microphone can ensure the sound pickup characteristics of the directional microphone, while not involving any changes to the original rear camera deco; it will also not have a significant impact on the product appearance of the electronic device.

[0188] It should be understood that the above four embodiments are only illustrated using two sound inlets of a directional microphone as examples. In practical applications, electronic devices can have multiple sound inlets of directional microphones arranged side by side, and this application embodiment does not impose any restrictions on this.

[0189] Next, referring to Figures 21 and 22, the backend algorithm processing of the sound pickup method provided in this application embodiment will be described. For example, as shown in Figure 21, it is a schematic flowchart illustrating the algorithm processing involved in the implementation of a device sound pickup method provided in this application embodiment. The execution entity of this process may include a sound acquisition module, a processing module, etc., in the electronic device, and specifically may include the following steps:

[0190] S111, the first omnidirectional microphone acquires the first sound signal.

[0191] Here, the omnidirectional microphone corresponds to any one of the omnidirectional microphones in the hybrid microphone array in Figure 6 above. In some embodiments, the first sound signal may be the signal corresponding to the input sound acquired by the omnidirectional microphone.

[0192] S112, the first sound signal is framed.

[0193] S113 transforms the acoustic signal corresponding to the omnidirectional microphone after frame division from the time domain to the frequency domain.

[0194] In some embodiments, the acoustic signal corresponding to the omnidirectional microphone can be transformed from the time domain to the frequency domain using a short-time Fourier transform. The specific calculation method will be described below and will not be detailed here.

[0195] S114 performs dereverberation processing on the signal transformed to the frequency domain.

[0196] In some embodiments, a reverberation algorithm can be used to de-reverberate the first sound signal corresponding to the omnidirectional microphone in the frequency domain.

[0197] S121, the Nth omnidirectional microphone acquires the Nth sound signal.

[0198] Here, the omnidirectional microphone corresponds to any one of the omnidirectional microphones in the hybrid microphone array in Figure 6 above, excluding the first omnidirectional microphone. N can be any integer greater than or equal to 1.

[0199] In some embodiments, the Nth sound signal may be the signal corresponding to the input sound acquired by the omnidirectional microphone.

[0200] S122, the Nth sound signal is divided into frames.

[0201] S123 transforms the acoustic signal corresponding to the omnidirectional microphone after frame division from the time domain to the frequency domain.

[0202] For an explanation of S123, please refer to the description of S113 above, which will not be repeated here.

[0203] S124 performs dereverberation processing on the signal transformed to the frequency domain.

[0204] For an introduction to S124, please refer to the description of S114 above, which will not be repeated here.

[0205] It should be understood that the above illustration uses a hybrid microphone array comprising two omnidirectional microphones as an example. Of course, in the embodiments of this application, the hybrid microphone array may include one, three, or more omnidirectional microphones, and this application does not limit this. The signal processing process for each omnidirectional microphone can refer to the steps of S111 to S114 described above.

[0206] S131, the directional microphone acquires the X-sound signal.

[0207] Here, the directional microphone can correspond to the directional microphone in the hybrid microphone array in Figure 6 above.

[0208] In some embodiments, the X-sound signal can be the signal corresponding to the input sound acquired by the directional microphone. The directional microphone here can be any one of a figure-eight, cardioid, or supercardioid directional microphone.

[0209] It should be noted that X is only used to distinguish it from the signal acquired by the omnidirectional microphone mentioned above, and is not limited to a specific number.

[0210] S132, the Xth sound signal is framed.

[0211] S133 transforms the acoustic signal corresponding to the directional microphone after frame division from the time domain to the frequency domain.

[0212] In some embodiments, the acoustic signal corresponding to the directional microphone can be transformed from the time domain to the frequency domain using a short-time Fourier transform. The specific calculation method will be described below and will not be detailed here.

[0213] S134 performs dereverberation processing on the signal transformed to the frequency domain.

[0214] In some embodiments, a reverberation algorithm can be used to de-reverberate the Xth sound signal corresponding to the directional microphone in the frequency domain.

[0215] S140: Amplitude compensation and phase compensation are performed on the signals obtained in S114, S124 and S134 above to obtain the corresponding compensated signals.

[0216] In some embodiments, amplitude compensation can be performed on the acoustic signal corresponding to an omnidirectional microphone in the frequency domain using amplitude compensation factors and phase compensation factors, respectively. Similarly, amplitude compensation and phase compensation can be performed on the acoustic signal corresponding to a directional microphone in the frequency domain using amplitude compensation factors and phase compensation factors, respectively. The specific calculation process will be described below and will not be detailed here.

[0217] It should be understood that amplitude compensation of the acoustic signal can reduce the amplitude loss caused by actual equipment structure and environmental factors, making the processed acoustic signal closer to the theoretical value. Phase compensation of the acoustic signal can ensure that the phase difference between the acoustic signal corresponding to a directional microphone and the acoustic signal corresponding to an omnidirectional microphone is specific, thereby achieving acoustic signal enhancement at a specific angle.

[0218] S150 uses a microphone directivity correction factor to correct the directivity of a hybrid microphone array.

[0219] S160, design guide vector to obtain filter coefficients.

[0220] S170 uses a filter to process the acoustic signal in the frequency domain and obtain the filtered signal.

[0221] In some embodiments, a filter can be set according to the filter coefficients, and then the filter can be used to filter the signal after amplitude compensation and phase compensation.

[0222] Specifically, after obtaining the filter, the frequency-domain compensated signal can be divided into frames and filter coefficients h. t The signals are multiplied by (ω), and the results of the multiplication are then summed to obtain a single-channel output signal containing the results of the array algorithm. The process of obtaining the filter coefficients can be found in the following description, which will not be detailed here.

[0223] S180 performs post-processing noise reduction on filtered acoustic signals based on statistical methods.

[0224] In some embodiments, after acquiring a single-channel output signal, a single-channel post-processing noise reduction module based on a statistical model can be cascaded at the back end to denoise the acquired signal. This noise reduction module can be, for example, a noise reduction module based on Wiener filtering, or a noise reduction module based on logarithmic minimum mean square error, etc.

[0225] S190 transforms the post-processed, noise-reduced acoustic signal to the time domain using the inverse short-time Fourier transform.

[0226] Then, the acoustic signal in the time domain can be output.

[0227] It should be noted that, through actual testing of the device combining the hybrid microphone array and back-end algorithm involved in the sound pickup method provided in this application embodiment, an excellent unidirectional sound signal enhancement effect can be obtained. That is, electronic devices such as mobile phones that use this hybrid microphone array and back-end algorithm can enhance the sound signals coming from the front and sides of the mobile phone, while significantly reducing the influence of sound signals in other spatial directions on the sound pickup effect.

[0228] For ease of understanding, the following uses a mobile phone with the above-mentioned hybrid microphone array structure as an example, combined with simplified layout and simulation results, to introduce the backend algorithm processing and the effects of the sound pickup method provided in this application embodiment during implementation.

[0229] The hybrid microphone array provided in this application embodiment includes M microphone array elements. For ease of description, the first array element can be set as a directional microphone.

[0230] After omnidirectional and directional microphones pick up sound signals, the sound signals in the time domain can be converted to the frequency domain using a short-time Fourier transform. The sound signal after the short-time Fourier transform can be calculated using the following formula (1-1):

[0231]

[0232] Where m represents the microphone element number, which can be 1, 2, ..., M; t represents the sequence number of each frame of the sound signal after dividing the sound signal into T frames, which can be 1, 2, ..., T, where T is an integer greater than or equal to 2; τ0 = δ / c is the delay of the plane wave arriving at two adjacent microphones when it is incident from the 0° direction; j 2 =-1, ω=2πf;x m，t Let y be the t-th frame of the speech signal acquired by the m-th microphone element under ideal conditions; m,t (ω) represents the acoustic signal in the frequency domain after the short-time Fourier transform.

[0233] Then, the acoustic signal y can be processed using a dereverberation algorithm. m,t (ω) is used for dreverberation processing to remove background noise and reverberation caused by sound reflections in space from the audio signal. For example, this dreverberation algorithm can be the WPE (weighted prediction error) algorithm. The audio signal after dreverberation using the WPE algorithm can be represented by the following formula (1-2):

[0234] y′ m，t (ω)=WPE(y m，t (ω)) (1-2)

[0235] Where, y′ m，t (ω) represents the sound signal after de-reverberation.

[0236] In some embodiments, to reduce the loss of acoustic signals caused by the spatial environment or equipment structure, amplitude compensation can be applied to the dederotropic acoustic signals. For example, the amplitude-compensated acoustic signals picked up by the corresponding microphone array elements can be calculated using the following formulas (1-3), (1-4), and (1-5):

[0237]

[0238] y″ 2，t (ω)=a 2，t (ω)y′ m，t (ω) (1-4)

[0239] …

[0240] y″ M，t (ω)=a M，t (ω)y″ m，t (ω) (1-5)

[0241] Among them, y″ 1，t (ω) represents the sound signal after amplitude compensation of the sound signal picked up by the directional microphone; y″ 2,t(ω) to y″ M，t (ω) represents the sound signal after amplitude compensation of the sound signal picked up by the omnidirectional microphone; ω is the frequency point of the sound signal in the frequency domain; a 1，t (ω) is the amplitude compensation factor corresponding to the directional microphone; a 2，t (ω) to a M，t (ω) is the amplitude compensation factor corresponding to the omnidirectional microphone; a 1，t (ω) to a M，t (ω) can be obtained by comparing the deviation between the measured value and the theoretical value of the acoustic signal at the maximum incident direction; , where b is the first letter of bi-directional; and e is the natural constant.

[0242] It should be understood that by performing amplitude compensation on the sound signal, the amplitude loss caused by the influence of equipment structure, environmental factors, etc. during the transmission process can be reduced, making the sound signal closer to the theoretical value without the influence of external factors.

[0243] In some embodiments, phase compensation can also be performed on the acoustic signals corresponding to the omnidirectional microphone and the directional microphone using the following formulas (1-6):

[0244] y″ m，t (ω)=[y″ 1，t (ω), y″ 2，t (ω)...y″ M，t (ω)] T =d(ω,θ)c(ω,θ)x″ m，t (ω)(1-6)

[0245] in, x″ is the guide vector. m，t (ω) represents the sound signal collected by the m-th microphone element in real-world conditions; c(ω, θ) = [1, c2(ω, θ), c3(ω, θ)]. M (ω,θ)] T This refers to the amplitude correction factor for acoustic signals of different frequencies incident from different directions, obtained through actual measurements; y″ m,t (ω) represents the acoustic signal after phase compensation. That is,

[0246] It should be understood that c(ω, θ) is the microphone directivity correction factor described in S150 above.

[0247] It should be understood that by performing phase compensation on the acoustic signals in the frequency domains corresponding to the omnidirectional and directional microphones respectively, multiple acoustic signals with specific phase differences can be obtained, which facilitates the subsequent enhancement of acoustic signals in specific directions.

[0248] Then, the filter coefficients can be solved using the null method, which requires finding the enhancement direction θ = θ max The gain is strongest when the attenuation direction is specified as θ = θ min1 θ min2 , ..., θ minM The gain is 0. For example, the filter coefficients can be calculated using the following formulas (1-7) to (1-12):

[0249]

[0250] Formulas (1-7) and (1-10) can be uniformly expressed by the following formula (1-11):

[0251] Ah t (ω)=b (1-11)

[0252] in,

[0253] Solving the above formula (1-11) yields the filter coefficients, which are shown in the following formula (1-12):

[0254] h t (ω)=A H (AA H ) -1 b (1-12)

[0255] Among them, h t (ω) represents the filter coefficients; H represents the matrix conjugate transpose.

[0256] In some embodiments, a corresponding filter can be designed based on the calculated filter coefficients. After obtaining the filter, the acoustic signal in the frequency domain can be compared frame by frame with the filter coefficients h. t (ω) are multiplied, and the results of each frame after multiplication are superimposed to obtain a single-channel output signal containing the results of array algorithm processing.

[0257] In some embodiments, after acquiring the single-channel output signal, a single-channel post-processing noise reduction module based on a statistical model can be cascaded at the back end to denoise the acquired signal. This noise reduction module can be, for example, a noise reduction module based on Wiener filtering, or a noise reduction module based on logarithmic minimum mean square error, etc.

[0258] It should be understood that the noise reduction effect can be further enhanced through the processing of this post-processing noise reduction module.

[0259] In some embodiments, after post-processing and denoising the single-channel output signal in the frequency domain, the optimized time-domain speech signal can be output through inverse short-time Fourier transform to obtain the final output signal.

[0260] As exemplarily shown in Figure 22, this is a schematic diagram of the combined layout of one directional microphone and three omnidirectional microphones in a hybrid microphone array provided in an embodiment of this application. The sound source direction is the right-hand horizontal direction.

[0261] Taking the layout in Figure 22 as an example, Figure 23 is a schematic diagram of the simulated directivity of Figure 22 at different frequencies.

[0262] For example, the test environment can be as follows: in a fully anechoic chamber, the test sound source is white noise. The hybrid microphone array is fixed on a pre-set turntable, and the turntable is rotated in 10° increments by a motor. After each rotation, the pickup signal of the hybrid microphone array is collected. Then, a pickup directivity diagram representing the relationship between the pickup signal and the angle is obtained. According to the results shown in the directivity diagram in Figure 23, the generated beam enhancement direction mainly points towards the sound source direction, i.e., the lateral 0° direction. When deviating from ±60°, the suppression of the fixed beam reaches more than 12dB, and it has good directivity at 500Hz, 1kHz, 3kHz, and 6kHz, indicating that the array has good consistency at different frequencies.

[0263] Therefore, the hybrid microphone array structure and corresponding back-end algorithm provided by the embodiments of this application described above can meet the requirements for enhancement in a specific direction.

[0264] Based on the same technical concept, embodiments of this application also provide an electronic device, including a processor; a memory; the memory storing a computer program, the computer program including instructions, which, when executed by the processor, cause the electronic device to perform one or more steps of any of the above methods.

[0265] Based on the same technical concept, this application embodiment also provides a chip system, the chip system including: a processing circuit, a receiving pin, and a transmitting pin; wherein, the receiving pin, the transmitting pin, and the processing circuit communicate with each other through an internal connection path, and the processing circuit executes one or more steps of any of the above methods to control the receiving pin to receive signals and control the transmitting pin to transmit signals.

[0266] Based on the same technical concept, embodiments of this application also provide a computer-readable storage medium storing computer-executable program instructions, which, when executed on a computer, cause the computer or processor to perform one or more steps of any of the above methods.

[0267] Based on the same technical concept, embodiments of this application also provide a computer program product containing instructions, the computer program product including computer program code, which, when run on a computer, causes the computer or processor to perform one or more steps of any of the above methods.

[0268] In the above embodiments, implementation can be achieved entirely or partially through software, hardware, firmware, or any combination thereof. When implemented using software, it can be implemented entirely or partially in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of this application are generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted through the computer-readable storage medium. The computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via wired (e.g., coaxial cable, fiber optic, digital subscriber line) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server or data center that integrates one or more available media. The available medium can be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., DVD), or a semiconductor medium (e.g., solid-state disk, SSD), etc.

[0269] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. This program can be stored in a computer-readable storage medium, and when executed, it can include the processes described in the above method embodiments. The aforementioned storage medium includes various media capable of storing program code, such as ROM or random access memory (RAM), magnetic disks, or optical disks.

[0270] The above description is merely a specific implementation of the embodiments of this application, but the protection scope of the embodiments of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the embodiments of this application should be covered within the protection scope of the embodiments of this application. Therefore, the protection scope of the embodiments of this application should be determined by the protection scope of the claims.

Claims

1. An electronic device, characterized in that, The device includes a hybrid microphone array comprising an omnidirectional microphone and a directional microphone. The direction in which the acoustic signal gain of the hybrid microphone array is greatest is the target direction, which is jointly determined by the omnidirectional microphone and the directional microphone. The directional microphone includes a first sound inlet and a second sound inlet connected together. Both the first sound inlet and the second sound inlet are located on the rear camera deco of the electronic device; alternatively, the first sound inlet is located on the rear camera deco, and the second sound inlet is located on the top of the electronic device; or alternatively, both the first sound inlet and the second sound inlet are located on the side of the electronic device.

2. The electronic device according to claim 1, characterized in that, Both the first and second sound inlets are disposed on the rear camera Deco included in the electronic device, including: if the rear camera Deco has thickness, the first sound inlet is disposed on the upper side, left side, or right side of the rear camera Deco; if the rear camera Deco has no thickness, the first sound inlet is disposed on the upper side edge, left side edge, or right side edge of the rear camera Deco; the second sound inlet is disposed on the plane where the rear camera Deco is located, and the plane is parallel to the screen of the electronic device.

3. The electronic device according to claim 2, characterized in that, If the rear camera deco has a thickness, the first sound inlet is disposed on the upper side, left side, or right side of the rear camera deco, including: the first sound inlet being a hole, disposed on the upper side, left side, or right side of the rear camera deco; the first sound inlet being a micro-slit, disposed on the edge of the upper side, left side, or right side of the rear camera deco closer to the screen; or, the first sound inlet being disposed on the edge of the upper side, left side, or right side of the rear camera deco farther from the screen.

4. The electronic device according to claim 1, characterized in that, The first sound inlet and the second sound inlet are both disposed on the rear camera Deco included in the electronic device, including: if the rear camera Deco has thickness, the first sound inlet and the second sound inlet are both disposed on the side of the rear camera Deco; if the rear camera Deco has no thickness, the first sound inlet and the second sound inlet are both disposed on the side edge of the rear camera Deco.

5. The electronic device according to claim 4, characterized in that, Both the first and second sound inlets are holes or micro-slits, or one is a hole and the other is a micro-slit; if the rear camera deco has thickness, both the first and second sound inlets are located on the side of the rear camera deco, including: the sound inlet that is a hole is located on the side of the rear camera deco; the sound inlet that is a micro-slit is located on the edge of the rear camera deco on the side closer to the screen of the electronic device, or on the edge away from the screen.

6. The electronic device according to claim 1, characterized in that, The first sound inlet is disposed on the rear camera deco, including: the first sound inlet is disposed on the plane where the rear camera deco is located, the plane being parallel to the screen of the electronic device; or, if the rear camera deco has thickness, the first sound inlet is disposed on the upper side of the rear camera deco; or, if the rear camera deco has no thickness, the first sound inlet is disposed on the upper side edge of the rear camera deco.

7. The electronic device according to claim 6, characterized in that, If the rear camera deco has a thickness, the first sound inlet is disposed on the upper side of the rear camera deco, including: if the rear camera deco has a thickness, the first sound inlet, which is a hole, is disposed on the upper side of the rear camera deco; the first sound inlet, which is a micro-slit, is disposed on the edge of the rear camera deco near the screen, or on the edge away from the screen.

8. The electronic device according to claim 1, 6, or 7, characterized in that, The second sound inlet is disposed on the top of the electronic device, including: the second sound inlet being a hole disposed on the top of the electronic device; the second sound inlet being a micro-slit disposed on the edge of the top of the electronic device near the screen, or on the edge away from the screen.

9. The electronic device according to claim 1, characterized in that, Both the first and second sound inlets are holes or micro-slits, or one is a hole and the other is a micro-slit; both the first and second sound inlets are located on the side of the electronic device, including: the sound inlet that is a hole is located on the side of the electronic device; the sound inlet that is a micro-slit is located on the edge of the side of the electronic device near the screen, or on the edge away from the screen.

10. The electronic device according to claim 9, characterized in that, The side refers to either the left side or the right side.

11. The electronic device according to any one of claims 1 to 10, characterized in that, The line connecting the first sound inlet and the second sound inlet is the sound pickup enhancement direction of the directional microphone; when the directional microphone is a figure-eight directional microphone, both bidirectional sound signals transmitted in the sound pickup enhancement direction are enhanced; when the directional microphone is a cardioid or supercardioid directional microphone, only unidirectional sound signals transmitted in the sound pickup enhancement direction are enhanced.

12. The electronic device according to claim 11, characterized in that, The bidirectional direction of the sound pickup enhancement includes any one of the left-right direction, up-down direction, and diagonal up-down direction of the electronic device; the unidirectional direction of the sound pickup enhancement includes any one of the left direction, right direction, up direction, and diagonal up direction.

13. The electronic device according to any one of claims 1 to 12, characterized in that, The sound inlet of the omnidirectional microphone is located at any one or more positions on the top, bottom, and rear camera Deco of the electronic device.

14. A sound pickup method, characterized in that, The invention relates to an electronic device comprising a hybrid microphone array, the hybrid microphone array including an omnidirectional microphone and a directional microphone, wherein the direction of maximum acoustic signal gain of the hybrid microphone array points towards a target direction; the direction includes: acquiring acoustic signals picked up by the omnidirectional microphone and acoustic signals picked up by the directional microphone; transforming both the acoustic signals picked up by the omnidirectional microphone and the directional microphone in the time domain to the frequency domain using a short-time Fourier transform algorithm; obtaining filter coefficients based on the acoustic signals from the omnidirectional microphone and the directional microphone transformed to the frequency domain; the filter coefficients ensure that the direction of maximum gain of the filtered acoustic signal is the target direction.

15. The sound pickup method according to claim 14, characterized in that, When the electronic device is a mobile phone, the target direction is the direction close to the top of the mobile phone.

16. The sound pickup method according to claim 14 or 15, characterized in that, Based on the acoustic signal from the omnidirectional microphone transformed to the frequency domain and the acoustic signal from the directional microphone transformed to the frequency domain, the method includes: performing dereverberation processing on the acoustic signal from the omnidirectional microphone transformed to the frequency domain; performing dereverberation processing on the acoustic signal from the directional microphone transformed to the frequency domain; wherein the dereverberation processing is used to remove environmental noise from the acoustic signal transformed to the frequency domain; and obtaining the filter coefficients based on the dereverberated acoustic signal.

17. The sound pickup method according to claim 16, characterized in that, Obtaining the filter coefficients based on the dedevered acoustic signal includes: performing amplitude compensation on the omnidirectional microphone's acoustic signal in the dedevered frequency domain; performing amplitude compensation and phase compensation on the directional microphone's acoustic signal in the dedevered frequency domain; wherein the amplitude compensation is used to compensate for the acoustic signal amplitude loss caused by the device structure and environmental objects of the electronic device, and the phase compensation makes the phase difference between the compensated omnidirectional microphone and the compensated directional microphone's acoustic signals a preset phase difference; and obtaining the filter coefficients based on the compensated omnidirectional microphone and the compensated directional microphone's acoustic signals.

18. The method according to claim 17, characterized in that, Obtaining the filter coefficients based on the compensated acoustic signals from the omnidirectional microphone and the directional microphone includes: obtaining the filter coefficients based on the compensated acoustic signals from the omnidirectional microphone and the directional microphone, and a steering vector, wherein the steering vector is: in, θ represents the direction of the acoustic signal gain of the hybrid microphone array, j 2 =-1, ω=2πf, where f is the frequency of the acoustic signal in the frequency domain, τ0 is the delay of the plane wave arriving at two adjacent microphones when incident from the 0° direction, ⊙ is the Hadamard product of the matrix, and c(ω,θ) is the microphone directivity correction factor for acoustic signals of different frequencies incident from different directions obtained by actual measurement; the filter coefficient h t (ω) is: h t (ω)=A H ( AA H ) -1 b, where H is the matrix conjugate transpose. b = [ 10...0 ] T T denotes matrix transpose; θ max θ represents the direction of maximum acoustic signal gain. min This indicates the direction of maximum acoustic signal attenuation.

19. The sound pickup method according to any one of claims 14 to 18, characterized in that, The method further includes: performing post-processing noise reduction on the filtered acoustic signal; and transforming the post-processed noise-reduced acoustic signal to the time domain using inverse short-time Fourier transform.

20. An electronic device, characterized in that, include: processor; Memory; The memory stores a computer program that includes instructions that, when executed by the processor, cause the electronic device to perform the method as described in any one of claims 14 to 19.

21. A chip system, characterized in that, The chip system includes a processing circuit, a receiving pin, and a transmitting pin; wherein the receiving pin, the transmitting pin, and the processing circuit communicate with each other through an internal connection path, and the processing circuit executes the method as described in any one of claims 14 to 19 to control the receiving pin to receive signals and control the transmitting pin to transmit signals.

22. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-executable program instructions that, when executed on a computer, cause the computer to perform the method as described in any one of claims 14 to 19.

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