Packaging structure and electronic equipment
By embedding the ASIC chip inside the support plate and fully encapsulating it, the problem of reduced acoustic performance caused by the excessive space occupied by the ASIC chip is solved, and the volume of the back cavity of the bone voiceprint sensor is increased and the acoustic performance is improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- WEIFANG GOERTEK MICROELECTRONICS CO LTD
- Filing Date
- 2025-05-08
- Publication Date
- 2026-05-01
AI Technical Summary
In the prior art, the ASIC chip and MEMS chip are located in the same cavity, which reduces the rear cavity space of the bone voiceprint sensor and reduces its acoustic performance.
The ASIC chip is embedded inside the support plate, which reduces the cavity space occupied by the ASIC chip, increases the volume of the rear cavity, and fully encapsulates the ASIC chip with COB glue to reduce the influence of light and improve acoustic performance.
The volume of the back cavity of the bone conduction sensor was increased, which improved the acoustic performance and signal-to-noise ratio and reduced the impact of light on the performance of the ASIC chip.
Smart Images
Figure CN224192067U_ABST
Abstract
Description
Packaging structure and electronic devices Technical Field
[0001] This application belongs to the field of acoustic equipment technology, specifically relating to a packaging structure and electronic device. Background Technology
[0002] Bone conduction sensors typically pick up sound signals through vibration pickup components, which then generate air vibrations that act on a MEMS chip. The MEMS chip converts the vibration signals into electrical signals, which are then processed by an ASIC chip before being output.
[0003] In the prior art, ASIC chips are usually located in the same cavity as MEMS chips, which reduces the back cavity space formed in the bone voiceprint sensor structure and reduces the acoustic performance of the bone voiceprint sensor. Summary of the Invention
[0004] This application aims to provide a packaging structure and electronic device to at least solve one of the problems of the prior art.
[0005] According to a first aspect of this application, a packaging structure is provided, comprising:
[0006] substrate;
[0007] A housing, wherein the housing is disposed on the substrate and a receiving cavity is formed between the housing and the substrate;
[0008] A vibration pickup component is disposed on the substrate and located within the receiving cavity, and the vibration pickup component is used to pick up vibration signals;
[0009] A support plate is stacked on the side of the vibration pickup assembly away from the substrate, and the support plate is provided with through holes;
[0010] The MEMS chip is disposed on the support plate on the side away from the vibration pickup component and opposite to the through hole. The vibration signal picked up by the vibration pickup component can be transmitted to the MEMS chip through the through hole.
[0011] An ASIC chip is at least partially embedded inside the support plate and is electrically connected to the MEMS chip and the substrate, respectively.
[0012] Optionally, the support plate has a receiving groove on the side away from the vibration pickup component, and the ASIC chip is embedded in the receiving groove, the depth of the receiving groove being greater than or equal to the thickness of the ASIC chip.
[0013] Optionally, the ASIC chip is encapsulated in the receiving groove using COB adhesive, and the COB adhesive completely covers the upper surface of the ASIC chip.
[0014] Optionally, the inner walls of the receiving grooves are all bonded to the ASIC chip.
[0015] Optionally, the shape of the receiving slot is consistent with the shape of the ASIC chip.
[0016] Optionally, the support plate is made of epoxy resin material, and the thickness of the support plate is greater than 200 μm.
[0017] Optionally, the housing is provided with a pressure relief hole communicating with the receiving cavity, and the pressure relief hole is opposite to the ASIC chip.
[0018] Optionally, the vibration pickup assembly includes a support column, a mass block, and a diaphragm. The support column is fixed on the substrate, the periphery of the diaphragm is connected to the support column, and the mass block is fixed to the center of the diaphragm.
[0019] The diaphragm is used to pick up vibration signals, and vibration gaps are respectively provided between the support plate and the diaphragm on the side of the vibration pickup assembly facing the vibration pickup assembly.
[0020] Optionally, a first groove is provided on the side of the substrate facing the vibration pickup assembly and at a position opposite to the diaphragm, and the substrate avoids the mass block through the first groove;
[0021] The support plate has a second groove on the side facing the vibration pickup assembly and opposite the diaphragm. The support plate avoids the diaphragm through the second groove.
[0022] According to a second aspect of this application, an electronic device is provided, comprising: the packaging structure described in the first aspect.
[0023] The packaging structure provided in this application reduces the space occupied by the ASIC chip in the cavity by embedding at least a portion of the ASIC chip inside the support plate. When applied to bone conduction sensors, it increases the volume of the rear cavity, thereby improving its acoustic performance.
[0024] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description
[0025] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:
[0026] Figure 1 is a side sectional view of the packaging structure provided in this application.
[0027] Figure label:
[0028] 1. Substrate; 11. First groove; 2. Housing; 21. Pressure relief hole; 3. Vibration pickup assembly; 31. Support column; 32. Diaphragm; 33. Mass block; 4. Support plate; 41. Through hole; 42. Receiving groove; 43. Second groove; 5. MEMS chip; 6. ASIC chip; 7. COB adhesive. Detailed Implementation
[0029] Embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application are within the scope of protection of this application.
[0030] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.
[0031] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0032] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0033] The packaging structure and electronic device according to embodiments of this application are described below with reference to FIG1.
[0034] As shown in Figure 1, according to a first aspect of this application, a packaging structure is provided, including a substrate 1, a housing 2, a vibration pickup component 3, a support plate 4, a MEMS chip 5, and an ASIC chip 6; the housing 2 is disposed on the substrate 1 and forms a receiving cavity between the housing 2 and the substrate 1; the vibration pickup component 3 is disposed on the substrate 1 and located within the receiving cavity, and the vibration pickup component 3 is used to pick up vibration signals; the support plate 4 is stacked on the side of the vibration pickup component 3 away from the substrate 1, and the support plate 4 is provided with a through hole 41; the MEMS chip 5 is disposed on the side of the support plate 4 away from the vibration pickup component 3 and opposite to the through hole 41, and the vibration signal picked up by the vibration pickup component 3 can be transmitted to the MEMS chip 5 through the through hole 41; the ASIC chip 6 is at least partially embedded inside the support plate 4 and is electrically connected to the MEMS chip 5 and the substrate 1 respectively.
[0035] Specifically, in this embodiment, the encapsulation structure can be applied to a bone voiceprint sensor, wherein the vibration pickup component 3 can pick up external vibration signals (sound signals) and drive the surrounding air to vibrate through vibration. The vibrating air acts on the MEMS chip 5 through the through hole 41. The MEMS chip 5 converts the vibration signal into an electrical signal, which is then processed by the ASIC chip 6 and transmitted.
[0036] In the above embodiments, the MEMS chip 5 forms a front cavity and a rear cavity for the bone voiceprint sensor on both sides, with the rear cavity being the receiving cavity. The size of the rear cavity has a significant impact on the acoustic performance of the sensor. This application reduces the space occupied by the ASIC chip 6 within the receiving cavity by embedding at least a portion of the ASIC chip 6 inside the support plate 4, thereby increasing the volume of the rear cavity and improving the SNR performance of the bone voiceprint sensor. Here, "at least a portion of the ASIC chip 6 is embedded inside the support plate 4" means that the ASIC chip 6 can be partially or completely embedded inside the support plate 4; the specific design can be tailored to actual needs and is not limited here. Furthermore, external light has a significant impact on the performance of the ASIC chip 6; embedding at least a portion of the ASIC chip 6 inside the support plate 4 can simultaneously reduce the impact of light on the performance of the ASIC chip 6.
[0037] In the above embodiments, the ASIC chip 6 can be directly injection molded onto the support plate 4, or it can be embedded in the support plate 4 by digging a groove and then encapsulating it in the groove. There are no restrictions on this.
[0038] Optionally, as shown in Figure 1, a receiving groove 42 is provided on the side of the support plate 4 away from the vibration pickup component 3, and the ASIC chip 6 is embedded in the receiving groove 42. The depth of the receiving groove 42 is greater than or equal to the thickness of the ASIC chip 6.
[0039] Specifically, in this embodiment, by creating a receiving groove 42 in the support plate 4, the ASIC chip 6 can be embedded inside the support plate 4. The depth of the receiving groove 42 is greater than or equal to the thickness of the ASIC chip 6, meaning the ASIC chip 6 is completely buried within the receiving groove 42. This minimizes the space occupied by the ASIC in the receiving cavity, maximizing the volume of the rear cavity and further improving the acoustic performance of the bone conduction sensor. Furthermore, embedding the front part of the ASIC chip 6 inside the support plate 4 also further reduces the impact of light on the performance of the ASIC chip 6.
[0040] Optionally, as shown in Figure 1, the ASIC chip 6 is encapsulated in the receiving groove 42 by COB adhesive 7, and the COB adhesive 7 completely covers the upper surface of the ASIC chip 6.
[0041] Specifically, in practical applications, COB (Chip On Board) is a technology that directly mounts a bare chip onto a printed circuit board, achieving electrical and mechanical connections. Here, COB technology is used to fix the ASIC chip 6 within the receiving slot 42. The COB adhesive 7 completely covers the outward-facing surface of the ASIC chip 6 (i.e., the upper surface of the ASIC chip 6 in Figure 1), achieving full encapsulation and shielding of the ASIC chip 6. This minimizes the impact of external light on the performance of the ASIC chip 6, thereby improving the acoustic performance of the bone conduction sensor.
[0042] Optionally, the inner walls of the receiving groove 42 are all bonded to the ASIC chip 6.
[0043] Specifically, in practical applications, an adhesive can be applied to the inner wall of the receiving groove 42 to form a stable connection between the ASIC chip 6 and the inner wall (including the side walls and bottom wall) of the receiving groove 42. This improves the connection reliability between the ASIC chip 6 and the support plate 4, thereby enhancing the reliability of the entire packaging structure. Furthermore, bonding the ASIC chip 6 to the inner wall of the receiving groove 42 with adhesive also prevents light from entering through the gap between the receiving groove 42 and the ASIC chip 6, thus ensuring the performance of the ASIC chip 6.
[0044] Optionally, as shown in Figure 1, the shape of the receiving slot 42 is consistent with the shape of the ASIC chip 6. That is, when the ASIC chip 6 is square, the shape of the receiving slot 42 is also square, which can better position and fix the ASIC chip 6.
[0045] Optionally, the support plate 4 is made of epoxy resin material and the thickness of the support plate 4 is greater than 200um.
[0046] Specifically, in this embodiment, the support plate 4 can be made of rigid resin material, with a strength sufficient to support the ASIC chip 6 and MEMS chip 5. The epoxy resin material of the support plate 4 facilitates the processing of the receiving groove 42. In practical applications, the thickness of the ASIC chip 6 is approximately between 100µm and 150µm. Setting the thickness of the support plate 4 to greater than 200µm satisfies both the strength requirements of the support plate 4 and allows the entire ASIC chip 6 to be embedded within the support plate 4, thus improving the reliability of the entire packaging structure.
[0047] Optionally, as shown in Figure 1, the housing 2 is provided with a pressure relief hole 21 that communicates with the receiving cavity, and the pressure relief hole 21 is opposite to the ASIC chip 6.
[0048] Specifically, in this embodiment, the pressure relief hole 21 is positioned opposite the ASIC chip 6. This avoids the pressure relief hole 21 impacting the MEMS chip 5, thus improving the safety and reliability of the MEMS chip 5. In some embodiments, since the ASIC chip 6 can be completely embedded inside the support plate 4, there is no issue of light entering the receiving cavity through the pressure relief hole 21 affecting the performance of the ASIC chip 6.
[0049] Optionally, as shown in Figure 1, the vibration pickup assembly 3 includes a support column 31, a mass block 33, and a diaphragm 32. The support column 31 is fixed on the substrate 1, the periphery of the diaphragm 32 is connected to the support column 31, and the mass block 33 is fixed at the center of the diaphragm 32. The diaphragm 32 is used to pick up vibration signals, and vibration gaps are respectively provided between the support plate 4 and the substrate 1 on the side facing the vibration pickup assembly 3 and the diaphragm 32.
[0050] Specifically, in this embodiment, the support column 31 can be an annular support column 31, and the diaphragm 32 can be sealed on the support column 31. The mass block 33 can amplify the vibration signal, facilitating the transmission of the vibration signal picked up by the diaphragm 32. The vibration gap left between the support plate 4 and the substrate 1 and the diaphragm 32 facilitates the vibration of the diaphragm 32. The specific size of the gap can be designed according to the maximum amplitude of the diaphragm 32, and is not limited here.
[0051] Optionally, as shown in FIG1, a first groove 11 is provided on the side of the substrate 1 facing the vibration pickup assembly 3 and opposite to the diaphragm 32, and the substrate 1 avoids the mass block 33 through the first groove 11; a second groove 43 is provided on the side of the support plate 4 facing the vibration pickup assembly 3 and opposite to the diaphragm 32, and the support plate 4 avoids the diaphragm 32 through the second groove 43.
[0052] Specifically, in this embodiment, the arrangement of the first groove 11 and the second groove 43 not only increases the front cavity volume of the bone voiceprint sensor and improves its acoustic performance, but also ensures the miniaturization of the entire packaging structure and the vibration requirements of the vibration pickup component 3, thereby improving the integration of the packaging structure.
[0053] According to a second aspect of this application, an electronic device is provided, comprising: the packaging structure of the first aspect.
[0054] Specifically, in this embodiment, the provided electronic device includes the packaging structure provided in the first aspect, thereby enabling the electronic device to have better acoustic performance. The electronic device may be a mobile phone, tablet, etc., and is not limited thereto.
[0055] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0056] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.
Claims
1. A packaging structure, characterized in that, include: A substrate; a housing disposed on the substrate and forming a receiving cavity between the housing and the substrate; a vibration pickup assembly disposed on the substrate and located within the receiving cavity, the vibration pickup assembly being used to pick up vibration signals; a support plate stacked on the side of the vibration pickup assembly away from the substrate, the support plate being provided with a through hole; a MEMS chip disposed on the side of the support plate away from the vibration pickup assembly and opposite to the through hole, the vibration signal picked up by the vibration pickup assembly being able to be transmitted to the MEMS chip through the through hole; and an ASIC chip, the ASIC chip being at least partially embedded inside the support plate and electrically connected to the MEMS chip and the substrate respectively.
2. The packaging structure according to claim 1, characterized in that, The support plate has a receiving groove on the side away from the vibration pickup component, and the ASIC chip is embedded in the receiving groove. The depth of the receiving groove is greater than or equal to the thickness of the ASIC chip.
3. The packaging structure according to claim 2, characterized in that, The ASIC chip is encapsulated in the receiving groove using COB adhesive, and the COB adhesive completely covers the upper surface of the ASIC chip.
4. The packaging structure according to claim 3, characterized in that, The inner walls of the receiving grooves are all bonded to the ASIC chip.
5. The packaging structure according to claim 2, characterized in that, The shape of the receiving slot is consistent with the shape of the ASIC chip.
6. The packaging structure according to claim 1, characterized in that, The support plate is made of epoxy resin material and has a thickness greater than 200 μm.
7. The packaging structure according to claim 1, characterized in that, The housing is provided with a pressure relief hole that communicates with the receiving cavity, and the pressure relief hole is opposite to the ASIC chip.
8. The packaging structure according to claim 1, characterized in that, The vibration pickup assembly includes a support column, a mass block, and a diaphragm. The support column is fixed on the substrate, the periphery of the diaphragm is connected to the support column, and the mass block is fixed to the center of the diaphragm. The diaphragm is used to pick up vibration signals, and vibration gaps are respectively provided between the support plate and the substrate on the side facing the vibration pickup assembly and the diaphragm.
9. The packaging structure according to claim 8, characterized in that, The substrate has a first groove on the side facing the vibration pickup assembly and opposite to the diaphragm, through which the substrate avoids the mass block; the support plate has a second groove on the side facing the vibration pickup assembly and opposite to the diaphragm, through which the support plate avoids the diaphragm.
10. An electronic device, characterized in that, include: The packaging structure according to any one of claims 1-9.