Display device, method for manufacturing display device, and electronic device

Abstract

The invention relates to a display device, a method for manufacturing the display device, and an electronic device. The display device includes a display panel; a connection member connected to the display panel; a circuit board connected to the connecting member; the driving circuit is arranged on the display panel; and a cover member disposed on the display panel to cover a portion of the connecting member and the driving circuit.

Description

Display device, method for manufacturing display device, and electronic device

[0001] Cross-references to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2024-0150541, filed on October 30, 2024, the entire disclosure of which is incorporated herein by reference. Technical Field

[0003] This disclosure relates to display devices, methods for manufacturing display devices, and electronic devices including display devices. Background Technology

[0004] Typically, electronic devices such as smartphones, tablet PCs, digital cameras, laptops, navigation devices, and smart TVs include organic light-emitting display devices for displaying images.

[0005] Organic light-emitting diode (OLED) displays offer advantages such as high brightness, low driving voltage, fast response speed, and wide color reproduction range, and are therefore used in various devices, including smartphones. Existing OLED displays may include a display panel with multiple pixels and a circuit unit that provides signals to the display panel. The display panel may include signal lines for transmitting signals used to realize an image and a substrate on which switching elements for driving the pixels are disposed. The circuit unit may include a system for supplying signals and power for realizing the image, a control circuit board including a controller that converts signals supplied from the system into signals to be supplied to the display panel, and a drive circuit board that processes the signals converted by the control circuit board and transmits the converted signals to the display panel.

[0006] To facilitate the above processing, the display panel and the driver circuit board can be electrically connected. However, existing methods for assembling electronic devices may cause deformation of the display panel. Therefore, there is a need for improved display devices and methods for assembling them. Summary of the Invention

[0007] This disclosure includes providing a display device configured to prevent warping of the display panel during a process of joining a circuit board and a connecting member connected to the display panel, providing an electronic device including the display device, and a method for manufacturing the display device.

[0008] The above and other aspects of this disclosure will become more apparent from reference to the embodiments described throughout this disclosure.

[0009] According to one aspect, this disclosure relates to a display device. The display device may include: a display panel; a connecting member connected to the display panel; a circuit board connected to the connecting member; a driving circuit disposed on the display panel; and a covering member disposed on the display panel to cover a portion of the connecting member and the driving circuit.

[0010] Before the connecting components and circuit boards are connected to each other, the cover component can be configured to be placed on the display panel.

[0011] The display panel may include a substrate and display units disposed on the substrate. Furthermore, connecting members may be connected to the substrate, and driving circuitry and covering members may be disposed on the substrate.

[0012] The driving circuit can be disposed on the substrate such that the driving circuit is closer to the display unit than the connecting components.

[0013] The display device may include additional connecting members besides the (first) connecting member. For example, the connecting members may be provided as a plurality of connecting members, and a portion of each of the plurality of connecting members may be configured to be spaced apart from each other on the display panel in a first direction. Similarly, the display device may include additional driving circuitry besides the (first) driving circuitry. For example, the driving circuitry may be provided as a plurality of driving circuitry, and the plurality of driving circuitry may be configured to be spaced apart from each other on the display panel in a first direction. Furthermore, a covering member may extend on the display panel in the first direction to cover a portion of each of the plurality of connecting members and the plurality of driving circuitry.

[0014] Multiple drive circuits are configured to be spaced apart from multiple connecting members in a second direction, which intersects with the first direction. The second direction may be transverse to the first direction.

[0015] The length of the display panel in the first direction can be greater than the extension length of the covering member in the first direction.

[0016] A first receiving groove may be formed in the cover member, the first receiving groove being configured to receive part of the connecting member. In addition, a second receiving groove may be formed in the cover member, the second receiving groove being configured to receive the driving circuit.

[0017] According to another aspect of this disclosure, a method for manufacturing a display device is performed. The method for manufacturing a display device may include: preparing a display panel; bonding a driving circuit to the display panel; bonding a portion of a connecting member to the display panel; placing a cover member on the display panel to cover a portion of the connecting member and the driving circuit; and bonding the connecting member and a circuit board.

[0018] The driving circuit may include additional driving circuits besides the (first) driving circuit; for example, the driving circuit may be provided as a plurality of driving circuits. According to this arrangement, in the bonding of the driving circuits to the display panel, the plurality of driving circuits may be bonded to the display panel such that each of the plurality of driving circuits is spaced apart from each other in a first direction on the display panel.

[0019] The connecting members may include additional connecting members besides the (first) connecting member; for example, the connecting members may be provided as a plurality of connecting members. In the engagement of a portion of each of the plurality of connecting members to the display panel, a portion of one of the plurality of connecting members may be spaced apart from portions of the other connecting members in a first direction on the display panel.

[0020] In the engagement of a portion of a connecting member to a display panel, a portion of each of the plurality of connecting members can be engaged to the display panel such that the corresponding portion is spaced apart from the plurality of driving circuits in a second direction, which intersects the first direction.

[0021] During the process of placing the cover component on the display panel, the cover component can be placed on the display panel to cover a portion of each of the multiple connecting components and multiple drive circuits.

[0022] When the cover member is placed on the display panel to cover a portion of the connecting member and the driving circuit, a first receiving groove is formed in the cover member to be received on the top of a portion of the connecting member, and a second receiving groove is formed in the cover member to be received on the top of the driving circuit.

[0023] According to another aspect, this disclosure relates to an electronic device. The electronic device may include a display panel; a connecting member connected to the display panel; a circuit board connected to the connecting member; a driving circuit disposed on the display panel; and a covering member placed on the display panel to cover a portion of the connecting member and the driving circuit.

[0024] Before the connecting components and circuit board area are connected to each other, the cover component can be configured to be placed on the display panel.

[0025] The display device may include additional connecting members besides the (first) connecting member. For example, the connecting members may be provided as a plurality of connecting members, and a portion of each of the plurality of connecting members is spaced apart on the display panel along a first direction. Similarly, the display device may include additional driving circuitry besides the (first) driving circuitry. For example, the driving circuitry may be provided as a plurality of driving circuitry, and the plurality of driving circuitry may be configured to be spaced apart from each other on the display panel along the first direction. Furthermore, a covering member may extend on the display panel along the first direction to cover a portion of each of the plurality of connecting members and the plurality of driving circuitry.

[0026] Multiple drive circuits can be configured to be spaced apart from each other in a second direction intersecting the first direction, along with multiple connecting members.

[0027] The length of the display panel in the first direction may be longer than the length of the covering member extending in the first direction.

[0028] A first receiving groove may be formed in the cover member, the first receiving groove being configured to receive part of the connecting member. Furthermore, a second receiving groove may also be formed in the cover member, the second receiving groove being configured to receive a drive circuit.

[0029] By arranging a cover member on the display panel to cover a portion of the connecting member and drive circuitry as described herein, stress can be prevented from being applied to the display panel and warping of the display panel can be prevented during the bonding process between the connecting member and the circuit board.

[0030] The advantages of the various aspects of this disclosure are not limited to those described above; additional advantages can be achieved through the aspects of this disclosure as described herein. Attached Figure Description

[0031] The above and other aspects and features of this disclosure will become more apparent from the detailed description of exemplary embodiments with reference to the accompanying drawings, in which:

[0032] Figure 1 is a plan view of an electronic device according to an embodiment of the present disclosure;

[0033] Figure 2 is a plan view of a display device according to an embodiment of the present disclosure;

[0034] Figure 3 is a plan view showing the state in which the cover window included in Figure 2 has been removed;

[0035] Figure 4 is a plan view showing the state in which the covering member included in Figure 3 has been removed;

[0036] Figure 5 is a cross-sectional view taken along line A-A' in Figure 2;

[0037] Figure 6 is an enlarged cross-sectional view of part B in Figure 5;

[0038] Figure 7 is a schematic cross-sectional view of the display panel in Figure 5;

[0039] Figure 8 is a plan view of the steps of preparing a display panel in a method for manufacturing a display device according to an embodiment of the present disclosure;

[0040] Figure 9 is a plan view of the steps for attaching the drive circuit to the display panel in Figure 8;

[0041] Figure 10 is a plan view of the steps of joining a portion of the connecting member to the display panel in Figure 9;

[0042] Figure 11 is a plan view of the steps for installing the covering component onto the display panel in Figure 10; and

[0043] Figure 12 is a diagram showing the connection of the connecting components to the circuit board after the steps in Figure 11. Detailed Implementation

[0044] The advantages and features of this disclosure, as well as methods of implementing them, will become apparent from the exemplary embodiments described below with reference to the accompanying drawings. However, this disclosure is not limited to the exemplary embodiments disclosed herein and can be implemented in various ways. Exemplary embodiments are provided for illustrative purposes and to fully convey the scope of this disclosure to those skilled in the art.

[0045] As used herein, the phrase "element A on element B" means that element A can be directly disposed on element B and / or element A can be indirectly disposed on element B via another element C, wherein element C itself can be one or more elements. In this disclosure, the same reference numerals denote the same elements throughout the disclosure. The dimensions, proportions, angles, and quantities of elements given in the drawings, and where applicable, are illustrative only and not limiting.

[0046] Although terms such as "first," "second," etc., are used to arbitrarily distinguish the elements described by these terms, these terms are not necessarily intended to indicate the timing or other priority of these elements. These terms are only used to distinguish one element from another. Therefore, as used herein, in some examples, within the scope of this disclosure, a first element may be a second element.

[0047] Features of various examples of embodiments of this disclosure are intended to be combined in part or in whole. Furthermore, various examples of embodiments may be practiced individually or in combination.

[0048] In the following, examples of embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0049] Figure 1 is a plan view of an electronic device according to an embodiment of the present disclosure;

[0050] Referring to Figure 1, electronic device 1 can be any electronic device that provides a display screen. Examples of electronic device 1 may include, but are not limited to, mobile phones, smartphones, tablet PCs, mobile communication terminals, electronic notebooks, e-books, personal digital assistants (PDAs), portable multimedia players (PMPs), navigation devices, ultra-mobile PCs (UMPCs), televisions, game consoles, wristwatches, head-mounted displays, personal computer monitors, laptops, vehicle dashboards, digital cameras, camcorders, outdoor billboards, electronic billboards, various medical devices, various examination devices, various household appliances (such as refrigerators and washing machines) that include a display area, Internet of Things (IoT) devices, etc.

[0051] Electronic device 1 may include a display area DA and a non-display area NDA. When viewed from above (or from the front, for example, if the electronic device is mounted for viewing purposes), the shape of the display area DA may be the same as the shape of electronic device 1. For example, if electronic device 1 has a rectangular shape when viewed from above, the display area DA may also have a rectangular shape when viewed from above. In some examples, the total surface area of ​​the display area DA may be smaller than the total surface area of ​​electronic device 1.

[0052] The display area DA may include a plurality of pixels configured to display an image. Because the non-display area NDA does not contain pixels, the non-display area NDA may be configured such that it does not display an image. In some examples, the non-display area NDA may be peripherally positioned around the display area DA. While in some examples the non-display area NDA may surround the display area DA, embodiments of this disclosure are not limited thereto. In other examples, the display area DA may be partially surrounded by the display area NDA.

[0053] An electronic device 1 according to an embodiment of the present disclosure may include a display device 10 (see FIG2).

[0054] Figure 2 is a plan view of a display device according to an embodiment of the present disclosure. Figure 3 is a plan view showing the state in which the cover window included in Figure 2 is removed. Figure 4 is a plan view showing the state in which the cover member included in Figure 3 is removed. Figure 5 is a cross-sectional view taken along line A-A' of Figure 2.

[0055] According to one embodiment of this disclosure, the display device 10 is configured to display moving or still images. The display device 10 can be used as a display screen for portable electronic devices such as, but not limited to, mobile phones, smartphones, tablet PCs, smartwatches, watch phones, mobile communication terminals, e-notebooks, e-book readers, portable multimedia players (PMPs), navigation devices, and ultra-mobile PCs (UMPCs), as well as a display screen for various other products such as televisions, laptop computers, monitors, billboards, and products related to the Internet of Things. In other examples, the display device 10 can be used as a display screen for use inside a vehicle (e.g., on a center console).

[0056] Display device 10 may be a light-emitting display device, such as, but not limited to, an organic light-emitting display device including organic light-emitting diodes, a quantum dot light-emitting display device including a quantum dot light-emitting layer, an inorganic light-emitting display device including inorganic semiconductors, or a micro light-emitting display device including micro light-emitting diodes (LEDs). In the following description, an organic light-emitting display device is described as an example of display device 10. However, it will be understood that this disclosure is not limited thereto.

[0057] The first direction D1 may be parallel to a first side of the display device 10 that is associated with the horizontal direction. For example, when viewed from above, the horizontal direction of the display device 10 may be parallel to the edge of the display device 10 along the width direction of the display device 10. The second direction D2 may be parallel to a second side of the display device 10 that is associated with the vertical direction. For example, when viewed from above, the vertical direction of the display device 10 may be parallel to the edge of the display device 10 along the height direction of the display device 10. The term "vertical direction" is used to distinguish it from "horizontal direction," and "vertical direction" means a direction that would be vertical if the display device 10 is in an upright position. Throughout this disclosure, the second direction D2 may be referred to as the vertical direction whether the display device 10 is placed flat on the ground or upright. The third direction D3 may refer to the thickness direction of the display device 10.

[0058] When viewed from above, the display device 10 may have a quadrilateral shape. This quadrilateral shape can be a square or a rectangle. For example, when viewed from above, the display device 10 may have a rectangular shape having a long side in a first direction D1 and a short side in a second direction D2. The angle where the long side in the first direction D1 intersects the short side in the second direction D2 may be rounded with a predetermined curvature or may be an acute angle and defined as a right angle. When viewed from above, the shape of the display device 10 is not limited to a quadrilateral shape. In some examples, the display device 10 may have other polygonal shapes, circular shapes, or elliptical shapes.

[0059] Referring to Figures 2 to 5, a display device 10 according to an embodiment of the present disclosure includes a cover window 100, a display panel 200, a panel bottom member 300, a connecting member 400, a circuit board 500, a driving circuit 600, and a cover member 700.

[0060] Cover window 100 can be formed of a material with high light transmittance. Cover window 100 can be formed of a polymer resin such as polyimide or glass. Cover window 100 can be attached to the polarizing film PF of display panel 200 by an adhesive component such as optically clear adhesive (OCA) film.

[0061] Referring to Figure 5, the display panel 200 can be disposed below the cover window 100. When viewed from above, the display panel 200 can have a rectangular shape having a long side in a first direction D1 and a short side in a second direction D2. In the display panel 200, the angle at the intersection of the long side in the first direction D1 and the short side in the second direction D2 can be defined as a right angle or can be rounded with a predetermined curvature. In some examples, when viewed from above, the display panel 200 can have a quadrilateral shape other than a rectangle, a polygonal shape other than a quadrilateral shape, a circular shape, an elliptical shape, or an irregular shape.

[0062] The display panel 200 may include a display area comprising multiple emitting regions configured to emit light and a non-display area disposed around the display area. The non-display area may surround the display area. Multiple display pads may be disposed in the non-display area at one edge of the display panel 200.

[0063] Referring again to Figure 5, the display panel 200 may include a substrate SUB, a display unit PAL, a sensor unit SENL, and a polarizing film PF.

[0064] The substrate SUB can be formed from an insulating material such as, but not limited to, glass, quartz, or polymer resin. The substrate SUB can be a rigid substrate or a flexible substrate that can be bent, folded, and rolled.

[0065] The display unit (PAL) can be disposed on the substrate (SUB). The display unit (PAL) can be a layer comprising multiple emitting regions that emit light. The display unit (PAL) may include a buffer film, a thin-film transistor layer on which thin-film transistors are disposed, a light-emitting element layer that emits light, and an encapsulation layer for encapsulating the light-emitting element layer.

[0066] The sensor unit SENL can be disposed on the display unit PAL. The sensor unit SENL may include sensor electrodes and can be configured to detect whether it is in contact with the display panel 200, for example, whether a user has touched the display panel 200.

[0067] A polarizing film PF can be disposed on the sensor unit SENL. The polarizing film PF can prevent the degradation of image visibility of the display panel 200 due to reflection of external light. The polarizing film PF may include a linear polarizer and a phase retardation film such as a λ / 4 (quarter wavelength) waveplate. The phase retardation film can be disposed on the sensor unit SENL, and the linear polarizer can be disposed on the phase retardation film. A cover window 100 can be disposed on the polarizing film PF.

[0068] Referring again to Figure 5, the panel bottom member 300 may be disposed below the substrate SUB, such that the panel bottom member 300 is on one side of the display panel 200. In some examples, the panel bottom member 300 may be attached to the lower surface of the substrate SUB via an adhesive layer (not shown). The adhesive layer (not shown) may include pressure-sensitive adhesive (PSA). The panel bottom member 300 may include at least one of the following components: a light-absorbing component for absorbing incident light from outside the display device 10, a buffer component for absorbing external impacts, and a heat dissipation component for effectively dissipating heat from the display panel 200.

[0069] The light-absorbing component may be disposed below the substrate SUB. The light-absorbing component is configured to block light transmission to prevent components (such as circuit board 500) disposed below the display panel 200 from being seen from the top side of the display panel 200. The light-absorbing component may include light-absorbing materials such as black pigments and black dyes.

[0070] A buffer member can be disposed below the light-absorbing member. The buffer member is configured to absorb external impacts to prevent damage to the display panel 200. The buffer member can be composed of a single layer or multiple layers. In some examples, the buffer member can be formed from a polymer resin such as polyurethane, polycarbonate, polypropylene, or polyethylene, or it can be formed from an elastic material such as rubber or sponge. Foaming processes applied to polyurethane or acrylic materials can be used to produce the sponge.

[0071] The heat dissipation component can be disposed below the buffer component. The heat dissipation component may include a first heat dissipation layer comprising graphite or carbon nanotubes and a second heat dissipation layer formed of a thin metal film such as copper, nickel, ferrite, or silver. The heat dissipation component is capable of blocking electromagnetic waves and has high thermal conductivity.

[0072] Referring to Figures 4 and 5, the connecting member 400 can be connected to the display panel 200. In some embodiments, the connecting member 400 can be connected to a plurality of display pads of the display panel 200 by thermal bonding technology or via conductive bonding members (such as anisotropic conductive films). For example, one side of the connecting member 400 can be bonded to a plurality of display pads disposed on a substrate SUB of the display panel 200. With this arrangement, the display panel 200 and the connecting member 400 can be electrically connected.

[0073] In some embodiments, the display device 10 may include a single connecting member 400. In other embodiments, such as those shown in Figures 2 to 5, the display device 10 may include more than one connecting member 400. As shown in Figure 4, a plurality of connecting members 400 may be connected to the display panel 200. In this example, one side of each of the plurality of connecting members 400 may be disposed on the substrate SUB, such that the plurality of connecting members 400 are spaced apart from each other in a first direction D1. Furthermore, one side of each of the plurality of connecting members 400 may be engaged to the substrate SUB, such that the plurality of connecting members 400 are spaced apart from each other on the substrate SUB. In the above example, a portion of the connecting member 400 having a length smaller than the entire length of the connecting member 400 is disposed and engaged to the substrate SUB.

[0074] In some examples, the multiple connecting components 400 may be flexible printed circuit boards or flip films.

[0075] The circuit board 500 can be connected to a plurality of connecting members 400 of the display device 10. In some embodiments, the circuit board 500 can be connected to the plurality of connecting members 400 by thermal bonding technology or via conductive bonding members (such as anisotropic conductive films). For example, the circuit board 500 can be bonded to one side of each of the plurality of connecting members 400, such that a plurality of circuit pads disposed on the circuit board 500 are connected to the plurality of connecting members 400. In this way, the connecting members 400 and the circuit board 500 can be electrically connected. In some embodiments, one or more aspects of the above-described connection of the circuit board 500 can be applied to any one or more connecting members 400.

[0076] When the connecting member 400 is bent, the circuit board 500 can overlap with the bottom member 300 of the panel. The circuit board 500 can be a flexible printed circuit board (FPCB), a rigid and non-bendable rigid printed circuit board (PCB), or a composite printed circuit board including a rigid printed circuit board and a flexible printed circuit board.

[0077] Circuit board 500 can process signals converted in the control circuit board and transmit these signals to display panel 200. Circuit board 500 can be electrically connected to display panel 200 via connecting member 400.

[0078] The driving circuit 600 can be disposed on the display panel 200. The driving circuit 600 can receive control signals and power voltages through the circuit board 500 and generate and output signals and voltages for driving the display panel 200. The driving circuit 600 can be formed as an integrated circuit (IC) and can be connected to the circuit board 500.

[0079] The driving circuit 600 can be bonded to the substrate SUB of the display panel 200 via thermal bonding technology or via conductive bonding members (such as anisotropic conductive films). In some embodiments, the driving circuit 600 is a single driving circuit 600. In other embodiments, such as those shown in Figures 2 to 5, the driving circuit 600 may include more than one driving circuit 600. As shown in Figure 4, a plurality of driving circuits 600 can be disposed on the substrate SUB such that the plurality of driving circuits 600 are spaced apart from each other in a first direction D1. Furthermore, the plurality of driving circuits 600 can be bonded to the substrate SUB such that the plurality of driving circuits 600 are spaced apart from each other on the substrate SUB in the first direction D1.

[0080] In some examples, each of the plurality of driving circuits 600 may be disposed on the substrate SUB such that the driving circuit 600 is closer to the display unit PAL than the plurality of connecting members 400. For example, the plurality of driving circuits 600 may be spaced apart from the display unit PAL and the plurality of connecting members 400 in a second direction D2 that is perpendicular to the first direction D1 (e.g., in a second direction D2 that is transverse to the first direction D1), and the plurality of driving circuits 600 are configured to be closer to the display unit PAL than the connecting members 400 in the second direction D2.

[0081] A cover member 700 may be disposed on the display panel 200 to cover a portion of each of the plurality of connecting members 400 and each of the plurality of driving circuits 600. For example, as shown in FIG3, the cover member 700 may have a length extending in a first direction D1 on the substrate SUB to cover a portion of each of the plurality of connecting members 400 and the entirety of each of the plurality of driving circuits 600. In some examples, the cover member 700 may cover the same portion of each of the plurality of connecting members 400 that is bonded to the display panel 200, for example, as shown in FIG5. In other examples, the cover member 700 may cover a smaller portion of each connecting member 400 than the portion of each connecting member 400 bonded to the display panel 200.

[0082] The length of the cover member 700 in the first direction D1 may be shorter than the length of the display panel 200 in the first direction D1. In some embodiments, the first side of the cover member 700 and the second side of the cover member 700 opposite to the first side may be located on the base SUB of the display panel 200, wherein the length of the cover member 700 extends from the first side to the second side in the first direction D1.

[0083] Figure 6 is an enlarged view of part B of Figure 5. In Figure 6, a first receiving groove and a second receiving groove are defined in the covering member 700.

[0084] When the cover member 700 is disposed on the base SUB to cover a portion of each of the plurality of connecting members 400 and the plurality of drive circuits 600, the first receiving recess can accommodate (and the size of the first receiving recess is adapted to accommodate) a portion of each of the plurality of connecting members 400. In some examples, the cover member 700 may define a number of first receiving recesses that are commensurate with the number of the plurality of connecting members 400. For example, when the display device 10 includes five connecting members 400, the cover member 700 may define five first receiving recesses.

[0085] When the cover member 700 is disposed on the base SUB to cover a portion of each of the plurality of connecting members 400 and the plurality of drive circuits 600, the second receiving recess can accommodate (and the second receiving recess is sized to accommodate) the plurality of drive circuits 600. In some examples, the cover member 700 may define the second receiving recess in a number commensurate with the number of the plurality of drive circuits 600. For example, in the case where the display device 10 includes five drive circuits 600, the cover member 700 may define five second receiving recesses.

[0086] Before connecting the plurality of connecting members 400 and the circuit board 500, a cover member 700 may be disposed on the substrate SUB of the display panel 200. For example, after a portion of each of the plurality of driving circuits 600 and the plurality of connecting members 400 is sequentially bonded to the substrate SUB of the display panel 200, the cover member 700 may be disposed on the substrate SUB of the display panel 200 to cover a portion of each of the plurality of connecting members 400 and the plurality of driving circuits 600. In this way, before thermally bonding the plurality of connecting members 400 and the circuit board 500, because the cover member 700 covers a portion of each of the plurality of connecting members 400 and the plurality of driving circuits 600 on the substrate SUB of the display panel 200, stress that occurs during the process of thermally bonding the plurality of connecting members 400 to the circuit board 500 is prevented from being transferred to the display panel 200. Therefore, the intended arrangement of the display device 10 prevents warping that may occur in the display panel 200.

[0087] Figure 7 is a schematic cross-sectional view of the display panel of Figure 5. In Figure 7, the display unit PAL includes a buffer film 202, a thin-film transistor layer 203, a light-emitting element layer 204, and an encapsulation layer 205. It should be understood that the components of the display panel 200 (see Figure 5) shown in Figure 7 are an example arrangement and are not limiting.

[0088] A buffer film 202 can be formed on a substrate SUB. The buffer film 202 can be formed on the substrate SUB to protect the thin-film transistor 235 and the light-emitting element from moisture that permeates through the substrate SUB, which is susceptible to moisture penetration. The buffer film 202 can be formed from multiple inorganic layers stacked alternately. For example, the buffer film 202 can be formed from silicon oxide (SiO₂). x ) membrane, silicon nitride (SiN) x Multiple films are formed by alternating stacking of one or more inorganic films, including a silicon oxynitride film and a silicon oxynitride film. In some examples, the buffer film 202 can be omitted from the display unit PAL.

[0089] The thin-film transistor layer 203 can be disposed on the buffer film 202. The thin-film transistor layer 203 includes a thin-film transistor 235, a gate insulating film 236, an interlayer insulating film 237, a protective film 238, and an organic film 239.

[0090] Each of the thin-film transistors 235 includes an active layer 231, a gate electrode 232, a source electrode 233, and a drain electrode 234. In the arrangement shown in FIG. 7, the thin-film transistor 235 is formed as a top gate in which the gate electrode 232 is located on the top side of the active layer 231; however, it should be noted that the present disclosure is not limited thereto. That is, the thin-film transistor 235 may be formed as a bottom gate in which the gate electrode 232 is located on the bottom side of the active layer 231, or as a dual gate in which the gate electrode 232 is located on both the top and bottom sides of the active layer 231.

[0091] An active layer 231 is formed on the buffer film 202. The active layer 231 can be formed of a silicon-based semiconductor material or an oxide-based semiconductor material. For example, the active layer 231 can be formed of polycrystalline silicon, amorphous silicon, or oxide semiconductor. A light-blocking layer can be formed between the buffer film 202 and the active layer 231 to block external light that would otherwise be received on the active layer 231.

[0092] A gate insulating film 236 can be formed on the active layer 231. The gate insulating film 236 can be formed of an inorganic film. For example, the gate insulating film 236 can be made of silicon oxide (SiO2). x ) membrane, silicon nitride (SiN) x Multiple films, such as a silicon oxide film and a silicon nitride film, are formed.

[0093] The gate electrode 232 may be formed on the gate insulating film 236. The gate electrode 232 and the gate line may be formed as a single layer or multiple layers. In some examples, the gate electrode 232 may be formed of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or alloys thereof.

[0094] An interlayer insulating film 237 can be formed on the gate electrode 232 and the gate line. The interlayer insulating film 237 can be made of, for example, silicon oxide (SiO2). x ) membrane, silicon nitride (SiN) x Inorganic membrane formation, or membrane based on a combination of silicon oxide and silicon nitride membranes.

[0095] Source electrode 233 and drain electrode 234 may be formed on interlayer insulating film 237. Each of source electrode 233 and drain electrode 234 may be connected to active layer 231 through contact holes penetrating gate insulating film 236 and interlayer insulating film 237. Each of source electrode 233 and drain electrode 234 may be formed as a single layer or multiple layers. In some examples, source electrode 233 and drain electrode 234 may be formed of any one of (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or alloys thereof.

[0096] A protective film 238 for protecting the thin-film transistor 235 can be formed on the source electrode 233 and the drain electrode 234. In some examples, the protective film 238 can be made of, for example, silicon oxide (SiO2). x ) membrane, silicon nitride (SiN) x Inorganic membrane formation, or membrane based on a combination of silicon oxide and silicon nitride membranes.

[0097] An organic film 239 for planarizing the steps caused by the thin-film transistor 235 can be formed on the protective film 238. In some examples, the organic film 239 can be formed of an organic film including acrylic resin, epoxy resin, phenolic resin, polyamide resin and polyimide resin.

[0098] The light-emitting element layer 204 can be formed on the thin-film transistor layer 203. The light-emitting element layer 204 includes a light-emitting element and a barrier. The light-emitting element and the barrier are formed on the organic film 239. The light-emitting element can be an organic light-emitting element including an anode electrode 241, a light-emitting layer 242, and a cathode electrode 243.

[0099] The anode electrode 241 can be formed on the organic film 239. The anode electrode 241 can be connected to the drain electrode 234 of the thin-film transistor 235 through contact holes that penetrate the protective film 238 and the organic film 239.

[0100] A dam can be formed to cover the edge of the anode electrode 241 on the organic film 239 to separate the emission regions EA of multiple pixels. In other words, the dam is used to define the emission regions EA of multiple pixels. The emission region EA of each of the multiple pixels in which the anode electrode 241, the light-emitting layer 242, and the cathode electrode 243 are stacked in sequence indicates the area in which holes from the anode electrode 241 and electrons from the cathode electrode 243 recombine with each other in the light-emitting layer 242 to emit light.

[0101] A light-emitting layer 242 is formed on the anode electrode 241 and the embankment. The light-emitting layer 242 can be an organic light-emitting layer. The light-emitting layer 242 can emit one of red, green, and blue light. Alternatively, in some examples, the light-emitting layer 242 can be a white light-emitting layer that emits white light. In this case, the light-emitting layer 242 can have a structure in which red, green, and blue light-emitting layers are stacked, and these layers can be common layers formed for multiple pixels. When the light-emitting layer 242 is a white light-emitting layer with stacked red, green, and blue light-emitting layers, the display panel 200 may also include separate color filters for displaying red, green, or blue.

[0102] The light-emitting layer 242 may include a hole transport layer, a light-emitting layer, and an electron transport layer. Furthermore, the light-emitting layer 242 may be formed in a series structure of two or more stacked components, in which case a charge-generating layer may be formed between the stacked components.

[0103] The cathode electrode 243 can be formed on the light-emitting layer 242. The cathode electrode 243 can be formed to cover the light-emitting layer 242. The cathode electrode 243 can be a common layer formed for multiple pixels. In other words, the cathode electrode 243 can be a single layer covering all pixels of the display.

[0104] When the light-emitting element layer 204 is formed by a top-emission method in which light is emitted upwards, the anode electrode 241 can be formed of a metallic material with high reflectivity. In some examples, the anode electrode 241 can be constructed from one of the following: a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and indium tin oxide (ITO) (ITO / Al / ITO), an alloy of silver (Ag), palladium (Pd), and copper (Cu) (APC alloy), and a stacked structure of APC alloy and ITO (ITO / APC / ITO). Furthermore, the cathode electrode 243 can be formed from a transparent conductive oxide (TCO) capable of transmitting light, such as ITO or zinc-doped indium oxide (IZO), or from a semi-transmissive conductive material, such as magnesium (Mg), silver (Ag), or an alloy of magnesium (Mg) and silver (Ag). When the cathode electrode 243 is formed from a semi-transmissive conductive material, the light emission efficiency can be improved due to the microcavity effect.

[0105] When the light-emitting element layer 204 is formed by a bottom emission method in which light is emitted downwards, the anode electrode 241 can be formed of a transparent conductive oxide (TCO) such as ITO or IZO, or a semi-transparent conductive material such as magnesium (Mg), silver (Ag), or an alloy of magnesium (Mg) and silver (Ag). The cathode electrode 243 can be formed of a metallic material with high reflectivity. In some examples, the cathode electrode 243 can be constructed of one of the following: a stacked structure of aluminum (Al) and titanium (Ti) (Ti / Al / Ti), a stacked structure of Al and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of APC alloy and ITO (ITO / APC / ITO). When the anode electrode 241 is formed of a semi-transparent conductive material, the light emission efficiency can be improved due to the microcavity effect.

[0106] An encapsulation layer 205 may be formed on the light-emitting element layer 204. The encapsulation layer 205 serves to prevent air or moisture from penetrating the light-emitting layer 242 and the cathode electrode 243. For this purpose, the encapsulation layer 205 may also include at least one inorganic film. The inorganic film may be formed of, for example, silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, or titanium oxide. Furthermore, the encapsulation layer 205 may also include at least one organic film. The inorganic film may have a thickness sufficient to prevent particles from penetrating the encapsulation layer 205 and entering the light-emitting layer 242 and the cathode electrode 243.

[0107] The sensor unit SENL can be formed on the encapsulation layer 205. In the example where the sensor unit SENL is formed directly on the encapsulation layer 205, the thickness of the display device 10 (see FIG. 5) can be reduced compared to a display device in which a separate touch panel is attached to the encapsulation layer 205.

[0108] The sensor unit SENL may include sensor electrodes for sensing a user's touch capacitively, and touch lines connecting pads and sensor electrodes. For example, the sensor unit SENL can sense a user's touch through self-capacitance sensing or mutual capacitance sensing. In the example shown in FIG7, the sensor unit SENL consists of two layers including a drive electrode TE, a sensing electrode RE, and a bridge BE connected between the drive electrodes TE for mutual capacitance sensing.

[0109] The bridge BE can be formed on the encapsulation layer 205. The bridge BE can be composed of, but is not limited to, a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of APC alloy and ITO (ITO / APC / ITO). In some examples, the bridge BE can be composed of a single layer including molybdenum (Mo), titanium (Ti), copper (Cu), aluminum (Al), or ITO.

[0110] The first sensing insulating film TINS1 is formed on the bridge BE. The first sensing insulating film TINS1 can be formed of an inorganic film, such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0111] The driving electrode TE and the sensing electrode RE can be formed on the first sensing insulating film TINS1. The driving electrode TE and the sensing electrode RE can be formed as, but are not limited to, a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of APC alloy and ITO (ITO / APC / ITO). In some examples, the driving electrode TE and the sensing electrode RE can be composed of a monolayer including molybdenum (Mo), titanium (Ti), copper (Cu), aluminum (Al), or ITO.

[0112] A contact hole can be formed in the first sensing insulating film TINS1 to expose the bridge BE. The drive electrode TE can be connected to the bridge BE through the contact hole.

[0113] A second sensing insulating film TINS2 is formed on the driving electrode TE and the sensing electrode RE. The second sensing insulating film TINS2 can provide a flat surface on the driving electrode TE, the sensing electrode RE, and the bridge BE, which have different heights. The second sensing insulating film TINS2 can be formed from an organic film including one of acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin.

[0114] A bridge BE connecting adjacent driving electrodes TE can be disposed on the encapsulation layer 205, and the driving electrode TE and the sensing electrode RE can be disposed on the first sensing insulating film TINS1. Therefore, the driving electrode TE and the sensing electrode RE can be electrically separated from each other at their intersection, while the sensing electrode RE can be electrically connected to each other in a first direction D1 (see FIG. 5), and the driving electrode TE can be electrically connected to each other in a second direction D2 (see FIG. 5) different from the first direction D1.

[0115] The polarizing film PF can be disposed on the second sensing insulating film TINS2 and configured to prevent the image visibility of the display panel 200 from being degraded due to the reflection of external light.

[0116] In some embodiments, a standalone display device 10 is contemplated. For example, it is contemplated that in some embodiments, any display device 10 contemplated by this disclosure may be a standalone display device 10. In other embodiments, an electronic device 1 including a display device 10 is contemplated (see FIG. 1). It is contemplated that any display device 10 contemplated by this disclosure may be incorporated into any electronic device 1 contemplated by this disclosure. Furthermore, in any of these embodiments, any combination of the contemplated features of the display device 10 may be included.

[0117] Hereinafter, a method for manufacturing a display device according to an embodiment of the present disclosure will be described with reference to Figures 8 to 12.

[0118] A method for manufacturing a display device according to an embodiment of the present disclosure may include one or more of the following: taking a display panel 200, preparing the display panel 200, attaching a driving circuit 600 to the display panel 200, attaching a portion of a connecting member 400 to the display panel 200, placing a covering member 700 on the display panel 200 to cover a portion of the connecting member 400 and the driving circuit 600, and attaching the connecting member 400 and the circuit board 500.

[0119] Figure 8 is a plan view of the steps in preparing a display panel in a method for manufacturing a display device according to an embodiment of the present disclosure. In some alternative examples, the preparation step is completed before the display panel is picked up and the method is performed.

[0120] Referring to Figure 8 and in conjunction with Figures 1 to 7, during the preparation of the display panel 200, the cover window 100 is removed from the polarizing film PF.

[0121] In some embodiments, the display panel 200 is prepared before the cover window 100 is disposed on the polarizing film PF. Preparing the display panel 200 before the cover window 100 is disposed on the polarizing film PF facilitates the bonding of a portion of each of the plurality of connecting members 400 and the plurality of driving circuits 600 to the substrate SUB of the display panel 200. Although this embodiment contemplates bonding a portion of each of the plurality of connecting members 400 and the plurality of driving circuits 600 to the display panel 200 before the cover window 100 is disposed on the polarizing film PF, this disclosure is not limited thereto. For example, a portion of each of the plurality of connecting members 400 and the plurality of driving circuits 600 may be bonded to the display panel after the cover window 100 is disposed on the polarizing film PF.

[0122] Another step in the method involves bonding a plurality of driving circuits 600 to the display panel 200 (see FIG. 5). FIG. 9 is a plan view of the steps for bonding the driving circuits to the display panel of FIG. 8. In FIG. 9, the plurality of driving circuits 600 may be bonded to a substrate SUB of the display panel 200. For example, the plurality of driving circuits 600 may be bonded to the substrate SUB such that the plurality of driving circuits 600 are spaced apart from each other on the substrate SUB in a first direction D1. The plurality of driving circuits 600 may be bonded to the substrate SUB of the display panel 200 by thermal bonding technology or via conductive bonding members (such as anisotropic conductive films).

[0123] Another step in the method involves bonding a plurality of connecting members 400 to the display panel 200 (see FIG. 5). FIG. 10 is a plan view of the steps of bonding a portion of a connecting member to the display panel of FIG. 9. In FIG. 10, a portion of each of the plurality of connecting members 400 may be bonded to a substrate SUB of the display panel 200. For example, a portion of each of the plurality of connecting members 400 may be bonded to the substrate SUB such that the plurality of connecting members 400 are spaced apart from each other on the substrate SUB in a first direction D1. The plurality of connecting members 400 may be spaced apart from a plurality of driving circuits 600 in a second direction D2, and the plurality of connecting members 400 may be closer to the circuit board 500 in the second direction D2 than the plurality of driving circuits 600. A portion of each of the plurality of connecting members 400 may be bonded to the substrate SUB of the display panel 200 by thermal bonding technology or via conductive bonding members (such as anisotropic conductive films).

[0124] Figure 11 is a plan view of the steps of attaching a cover member to the display panel in Figure 10. In Figure 11, the cover member 700 may be disposed on the base SUB of the display panel 200 (see Figure 5) to cover a portion of each of the plurality of connecting members 400 and the plurality of driving circuits 600. For example, the cover member 700 may extend on the base SUB of the display panel 200 in a first direction D1 to cover a portion of each of the plurality of connecting members 400 and the plurality of driving circuits 600. As described in Figure 11, the cover member 700 covers all of the plurality of driving circuits 600. The length of the cover member 700 in the first direction D1 may be shorter than the length of the display panel 200 in the first direction D1. In some embodiments, opposite sides (i.e., two ends) of the cover member 700 in the first direction D1 may be disposed on the base SUB of the display panel 200.

[0125] When the cover member 700 is disposed on the base SUB of the display panel 200 to cover a portion of each of the plurality of connecting members 400 and the drive circuit 600, a portion of each of the plurality of connecting members 400 can be accommodated in a first receiving groove of the cover member 700, and the plurality of drive circuits 600 can be accommodated in a second receiving groove of the cover member 700.

[0126] Figure 12 is a diagram showing the connection members being bonded to the circuit board after the steps in Figure 11. In Figure 12, the other end of each of the plurality of connection members 400, opposite to the end bonded to the display panel 200 (see Figure 5), is bonded to the circuit board 500. The plurality of connection members 400 and the circuit board 500 can be bonded by thermal bonding technology or via conductive bonding members (such as anisotropic conductive films). When the plurality of connection members 400 are thermally bonded to the circuit board 500, stress may occur during the process of bonding the plurality of connection members 400 to the circuit board 500. Without sufficient protective arrangements, this stress may be transmitted and otherwise applied to the display panel 200, which may cause deformation and warping in the display panel 200. However, in this method, because the cover member 700 covers a portion of each of the multiple connecting members 400 and the multiple drive circuits 600 on the substrate SUB of the display panel 200 before the multiple connecting members 400 and the circuit board 500 are thermally bonded, stress transfer that occurs during the process of thermally bonding the multiple connecting members 400 to the circuit board 500 and is otherwise applied to the display panel 200 can be prevented. Therefore, deformation and warping of the display panel 200 can be prevented.

[0127] In some embodiments, the method may be performed using one or more connection members 400 and one or more drive circuits 600. In this way, the manufactured display device 10 may include at least one connection member 400 and at least one drive circuit 600.

[0128] However, it should be understood that the aspects and features of the embodiments of this disclosure are not limited to those described herein. The above and other aspects of this disclosure will become more apparent to those skilled in the art to which this disclosure pertains from the claims, and include their equivalents.

Claims

1. A display device, wherein, The display device includes: a display panel; a connecting member connected to the display panel; a circuit board connected to the connecting member; a driving circuit disposed on the display panel; and a covering member disposed on the display panel to cover a portion of the connecting member and the driving circuit.

2. The display device according to claim 1, wherein, The cover member is configured to be disposed on the display panel before the connecting member and the circuit board are connected to each other.

3. The display device according to claim 1, wherein, The display panel includes: a substrate; and a display unit disposed on the substrate, wherein the connecting member is connected to the substrate, and the driving circuit and the covering member are disposed on the substrate.

4. The display device according to claim 3, wherein, The driving circuit is disposed on the substrate such that the driving circuit is closer to the display unit than the connecting member.

5. The display device according to claim 1, wherein, The connecting member is a first connecting member, and the driving circuit is a first driving circuit. The display device further includes: a plurality of connecting members, wherein a portion of the first connecting member and a portion of each of the plurality of connecting members are spaced apart from each other on the display panel along a first direction; a plurality of driving circuits, wherein the first driving circuit and each of the plurality of driving circuits are spaced apart from each other on the display panel along the first direction; and wherein the covering member extends on the display panel along the first direction to cover the portion of the first connecting member, the portion of each of the plurality of connecting members, the first driving circuit, and each of the plurality of driving circuits.

6. The display device according to claim 5, wherein, The first driving circuit and the plurality of driving circuits are spaced apart from the first connecting member and the plurality of connecting members in a second direction transverse to the first direction.

7. The display device according to claim 5, wherein, The length of the display panel in the first direction is greater than the length of the covering member in the first direction.

8. The display device according to claim 1, wherein, The covering member defines a first receiving groove and a second receiving groove, the first receiving groove being sized to receive a portion of the connecting member, and the second receiving groove being sized to receive the drive circuit.

9. A method for manufacturing a display device, wherein, The method includes: taking a display panel; attaching a driving circuit to the display panel; attaching a portion of a connecting member to the display panel; placing a cover member on the display panel to cover the portion of the connecting member and the driving circuit; and attaching the connecting member to a circuit board.

10. The method according to claim 9, wherein, The driving circuit is a first driving circuit, and the method further includes: attaching a plurality of driving circuits to the display panel such that the plurality of driving circuits are spaced apart from each other in a first direction and spaced apart from the first driving circuit in the first direction.

11. The method according to claim 10, wherein, The connecting member is a first connecting member, and the method further includes: attaching a portion of each of the plurality of connecting members to the display panel such that a portion of one of the plurality of connecting members is spaced apart in the first direction from portions of the other connecting members of the plurality of connecting members and the portion of the first connecting member.

12. The method according to claim 11, wherein, The engagement of a portion of the first connecting member and a portion of each of the plurality of connecting members with the display panel causes the first connecting member and the plurality of connecting members to be spaced apart from the first driving circuit and the plurality of driving circuits in a second direction transverse to the first direction.

13. The method according to claim 11, wherein, The step of placing the covering member on the display panel further includes placing the covering member on the display panel to cover the portion of the first connecting member, the portion of each of the plurality of connecting members, the first driving circuit, and the plurality of driving circuits.

14. The method according to claim 9, wherein, The step of placing the cover member on the display panel further includes placing the cover member on the display panel such that a first receiving groove defined by the cover member is positioned on the portion of the connecting member, and a second receiving groove defined by the cover member is positioned on the driving circuit.

15. An electronic device, wherein, The electronic device includes: a display panel; a connecting member connected to the display panel; a circuit board connected to the connecting member; a driving circuit disposed on the display panel; and a covering member disposed on the display panel to cover a portion of the connecting member and the driving circuit.

16. The electronic device according to claim 15, wherein, The cover member is configured to be placed on the display panel before the connecting member and the circuit board are connected to each other.

17. The electronic device according to claim 15, wherein, The connecting member is a first connecting member, and the driving circuit is a first driving circuit. The electronic device further includes: a plurality of connecting members, a portion of the first connecting member and a portion of each of the plurality of connecting members being disposed spaced apart from each other on the display panel along a first direction; a plurality of driving circuits, the first driving circuit and each of the plurality of driving circuits being disposed spaced apart from each other on the display panel along the first direction; and wherein the covering member extends on the display panel along the first direction to cover the portion of the first connecting member, the portion of each of the plurality of connecting members, the first driving circuit, and each of the plurality of driving circuits.

18. The electronic device according to claim 17, wherein, The first driving circuit and the plurality of driving circuits are spaced apart from the first connecting member and the plurality of connecting members in a second direction transverse to the first direction.

19. The electronic device according to claim 17, wherein, The length of the display panel in the first direction is greater than the length of the covering member in the first direction.

20. The electronic device according to claim 15, wherein, The covering member defines: a first receiving groove, the first receiving groove being sized to receive the portion of the connecting member, and a second receiving groove, the second receiving groove being sized to receive the driving circuit.

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