Base body, light-emitting device, and light-emitting module

Abstract

A base that can be commonly used in a plurality of light-emitting devices having different light-emitting element configurations is achieved. The substrate is provided with: an upper surface; a lower surface; a first side surface; a second side surface opposite to the first side surface or located on the opposite side of the first side surface; a plurality of upper wiring portions including, on the upper surface side, a first upper wiring portion provided on the first side surface side, and a second upper wiring portion provided on one side of the first side surface side or the second side surface side apart from the first upper wiring portion; the lower surface side comprises a first lower wiring part which is arranged on the first side surface side and is electrically connected with the first upper wiring part, and a second lower wiring part which is separated from the first lower wiring part, is arranged on one side of the first side surface side or the second side surface side and is electrically connected with the second upper wiring part. And a third lower wiring portion provided on the second side surface side and separated from the first lower wiring portion, the third lower wiring portion being electrically connected to the first upper wiring portion.

Description

Technical Field

[0001] This invention relates to a substrate, a light-emitting device, and a light-emitting module. Background Technology

[0002] Japanese Patent Application Publication No. 2019-212752 discloses a light-emitting device in which multiple semiconductor laser elements are arranged within a closed space of a package. Additionally, a package having a first electrode layer and a second electrode layer and electrically connected to the semiconductor laser elements is disclosed.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: (Japan) Japanese Patent Application Publication No. 2019-212752 Summary of the Invention

[0006] The technical problem that the invention aims to solve

[0007] An invention is disclosed that solves the technical problem of realizing a substrate that can be used in multiple light-emitting devices with different light-emitting element structures.

[0008] Alternatively, instead of addressing the aforementioned technical problems, an invention has been disclosed that solves the technical problem of increasing the degree of freedom in wiring design.

[0009] Alternatively, instead of the aforementioned technical problems, an invention has been disclosed that solves the technical problem of realizing a light-emitting module that enables the independent control of multiple light-emitting elements emitting light with different emission peak wavelengths, such as red, green, and blue light.

[0010] Alternatively, instead of the aforementioned technical problems, an invention has been disclosed that solves the technical problem of miniaturizing a light-emitting module or a device having one or more light-emitting devices as a whole.

[0011] Alternatively, instead of the aforementioned technical problems, an invention has been disclosed that solves the technical problem of providing a light-emitting module that improves the mounting accuracy or bonding strength of the light-emitting device relative to the wiring board.

[0012] It should be noted that this specification also discloses an invention that comprehensively solves multiple technical problems among the above-mentioned technical problems.

[0013] Technical solutions for solving technical problems

[0014] The substrate disclosed in the embodiment includes: an upper surface; a lower surface; a first side surface; a second side surface, which is opposite to the first side surface or located on the opposite side of the first side surface; a plurality of upper wiring portions, which on the upper surface side include a first upper wiring portion disposed on the first side surface and a second upper wiring portion disposed on one side of the first side surface or the second side surface, separate from the first upper wiring portion; and a plurality of lower wiring portions, which on the lower surface side include a first lower wiring portion disposed on the first side surface and electrically connected to the first upper wiring portion, a second lower wiring portion disposed on one side of the first side surface or the second side surface and electrically connected to the second upper wiring portion, and a third lower wiring portion disposed on the second side surface and electrically connected to the first upper wiring portion.

[0015] The light-emitting device disclosed in the embodiments includes: the substrate; and one or more light-emitting elements disposed on the substrate and electrically connected to the first upper wiring portion and the second upper wiring portion.

[0016] The disclosed light-emitting module includes: a substrate, which is the substrate described above, and a second upper wiring portion is provided on a first side side; one or more light-emitting elements are disposed on the substrate and electrically connected to the first upper wiring portion and the second upper wiring portion; a wiring substrate having a plurality of electrode components and disposed on the substrate, the plurality of electrode components including electrode components engaged with the third lower wiring portion and electrode components engaged with the second lower wiring portion provided on the first side side.

[0017] The disclosed embodiment of the light-emitting module includes: a substrate, which is the aforementioned substrate, a second upper wiring portion disposed on a first side surface, the plurality of upper wiring portions further including a third upper wiring portion disposed on the second side surface and a fourth upper wiring portion disposed on the second side surface, separated from the third upper wiring portion and disposed on the second side surface; the plurality of lower wiring portions further including a fourth lower wiring portion disposed on the second side surface and electrically connected to the third upper wiring portion, a fifth lower wiring portion disposed on the second side surface and electrically connected to the fourth upper wiring portion, and a fifth lower wiring portion disposed on the first side surface and electrically connected to the third upper wiring portion, separated from the fourth lower wiring portion and disposed on the first side surface and electrically connected to the third upper wiring portion. A sixth lower wiring portion electrically connected to the three upper wiring portions; one or more first light-emitting elements disposed on the substrate and electrically connected to the first upper wiring portion and the second upper wiring portion; one or more second light-emitting elements disposed on the substrate and electrically connected to the third upper wiring portion and the fourth upper wiring portion; a wiring substrate having a plurality of electrode components and disposed on the substrate, the plurality of electrode components including an electrode component engaged with the third lower wiring portion, an electrode component engaged with the second lower wiring portion disposed on the first side side, an electrode component engaged with the fourth lower wiring portion, and an electrode component engaged with the fifth lower wiring portion disposed on the second side side.

[0018] The disclosed light-emitting module includes: a substrate, which is the substrate described above, and a second upper wiring portion is provided on the second side side; one or more light-emitting elements are disposed on the substrate and electrically connected to the first upper wiring portion and the second upper wiring portion; a wiring substrate having a plurality of electrode components and disposed on the substrate, the plurality of electrode components including electrode components that engage with the third lower wiring portion and electrode components that engage with the second lower wiring portion provided on the second side side.

[0019] The light-emitting module of the embodiment includes: a first light-emitting device having a first substrate and one or more first light-emitting elements disposed on the first substrate, the first substrate being the aforementioned substrate, a second upper wiring portion being disposed on a second side surface, the plurality of upper wiring portions further including a third upper wiring portion disposed on the first side surface on an upper surface side, and the plurality of lower wiring portions further including a fourth lower wiring portion disposed on the first side surface on a lower surface side, separate from the first lower wiring portions and electrically connected to the third upper wiring portion, the one or more first light-emitting elements being electrically connected to the first upper wiring portion and the second upper wiring portion of the first substrate; and a second light-emitting device having a second substrate and one or more first light-emitting elements disposed on the second substrate. One or more second light-emitting elements, the second substrate being the same substrate as the first substrate, the one or more second light-emitting elements being electrically connected to the first upper wiring portion and the third upper wiring portion of the second substrate; a wiring substrate having a plurality of electrodes and disposed on the first substrate and the second substrate, the plurality of electrode components including an electrode component engaged with the first lower wiring portion of the first substrate, an electrode component engaged with the second lower wiring portion of the first substrate disposed on the second side of the first substrate, an electrode component engaged with the third lower wiring portion of the second substrate, and an electrode component engaged with the fourth lower wiring portion of the second substrate disposed on the first side of the second substrate.

[0020] In at least one of the inventions disclosed in the embodiments, a substrate that can be used in multiple light-emitting devices with different structures of light-emitting elements, such as the color of the emitted light and the configuration of the elements, can be realized. Attached Figure Description

[0021] Figure 1 This is a perspective view of the light-emitting module in each implementation method.

[0022] Figure 2 This is a top view of the wiring board in each embodiment.

[0023] Figure 3 yes Figure 2 A schematic cross-sectional view of the wiring board at section line III-III.

[0024] Figure 4 This is a perspective view of the light-emitting device in each embodiment.

[0025] Figure 5 This is a side view of the light-emitting device in each embodiment.

[0026] Figure 6 yes Figure 4 A cross-sectional view of the light-emitting device at section line VI-VI.

[0027] Figure 7A This diagram shows an example of the constituent elements arranged in the internal space of the light-emitting device in each embodiment.

[0028] Figure 7B This is another example of the constituent elements arranged in the internal space of the light-emitting device in each embodiment.

[0029] Figure 8 This is a perspective view of the packaging of each implementation method.

[0030] Figure 9 yes Figure 8 A cross-sectional view of the package at the IX-IX section line.

[0031] Figure 10 This is a top view of the base of each embodiment.

[0032] Figure 11A This is a bottom view of the substrate of the first embodiment, viewed from the top surface side perspective.

[0033] Figure 11B This is a bottom view of the base of the first embodiment.

[0034] Figure 12A yes Figure 10 Cross-sectional views of the substrates of each embodiment at the XIIA-XIIA section line.

[0035] Figure 12B It is Figure 12A The cross-sectional view is an enlarged cross-sectional view of the matrix in the Z direction.

[0036] Figure 13A This is a top view showing an example of an upper wiring portion provided in the first layer of the insulating layer of the substrate in the first embodiment.

[0037] Figure 13B It means having Figure 13A A top view of an example of a wiring section in the middle of the third layer of the insulating layer within the first layer of the substrate.

[0038] Figure 14A This is a top view showing another example of the upper wiring portion provided with the first layer of the insulating layer of the substrate in the first embodiment.

[0039] Figure 14B It means having Figure 14A A top view of an example of a wiring section in the middle of the third layer of the insulating layer within the first layer of the substrate.

[0040] Figure 15 This is a top view showing the appearance of the light-emitting elements, etc., arranged on the auxiliary mounting substrate in each embodiment.

[0041] Figure 16 This is a side view showing the appearance of the light-emitting elements, etc., arranged on the auxiliary mounting substrate in each embodiment.

[0042] Figure 17A This is a top view of the first light-emitting module in each implementation.

[0043] Figure 17B This is a top view of the first wiring board in each embodiment.

[0044] Figure 17C It is a top view showing the internal space of the first and second light-emitting devices of the first light-emitting module.

[0045] Figure 18A This is a top view of the second light-emitting module in each embodiment.

[0046] Figure 18B This is a top view of the second wiring board in each embodiment.

[0047] Figure 18C This is a top view showing the internal space of the first and second light-emitting devices in the second light-emitting module.

[0048] Figure 19A This is a top view of the third light-emitting module in the first embodiment.

[0049] Figure 19B This is a top view of the third wiring board of the first embodiment.

[0050] Figure 19C This is a top view showing the internal space of the first and second light-emitting devices in the third light-emitting module.

[0051] Figure 20A This is a top view of the fourth light-emitting module in the first embodiment.

[0052] Figure 20B This is a top view of the fourth wiring board of the first embodiment.

[0053] Figure 20C This is a top view showing the internal space of the first and second light-emitting devices in the fourth light-emitting module.

[0054] Figure 21 This is a bottom view of the substrate of the second embodiment, viewed from the top surface side.

[0055] Figure 22A This is a top view showing an example of an upper wiring portion provided in the first layer of the insulating layer of the substrate in the second embodiment.

[0056] Figure 22B It means having Figure 22A A top view of an example of a wiring section in the middle of the third layer of the insulating layer within the first layer of the substrate.

[0057] Figure 23A This is a top view of the fifth wiring board of the second embodiment.

[0058] Figure 23B This is a top view showing the internal space of the first light-emitting device in the light-emitting module of the second embodiment, which corresponds to the third and fourth light-emitting modules of the first embodiment. Detailed Implementation

[0059] In this specification or claims, the term "polygon" refers not only to triangles and quadrilaterals, but also to shapes in which the corners of a polygon have been rounded, chamfered, or de-rounded. Furthermore, shapes in which the middle portions of the sides have been processed, not limited to the corners (ends of sides), are also referred to as polygons. In other words, the interpretation of "polygon" as used in this specification and claims includes shapes that retain the basic polygonal shape but have undergone partial processing.

[0060] Furthermore, this applies not only to polygons, but also to terms describing specific shapes such as trapezoids, circles, and concave / convex shapes. The same applies to the treatment of the sides that form the shape. That is, even if the diagonal or middle portion of a side has been modified, the interpretation of "side" still includes the modified portion. It should be noted that when distinguishing between unmodified "polygons" or "sides" and the modified shape, the term "strictly defined" is used, for example, recorded as "a strictly defined quadrilateral."

[0061] In this specification or claims, the descriptions of top and bottom, left and right, front and back, front and back, front and back, inside and outside, etc., are merely descriptions of relative positions, orientations, directions, etc., and may not be consistent with the actual relationship in use.

[0062] In the accompanying drawings, arrows are sometimes used to indicate directions such as the X, Y, and Z directions. The direction of these arrows is matched across multiple drawings of the same embodiment. Furthermore, in the drawings, the direction of the arrows labeled X, Y, and Z is designated as the positive direction, and the opposite direction as the negative direction. For example, the direction marked with X at the tip of the arrow is the X direction and is positive. It should be noted that in this specification, the positive X direction is referred to as the "positive X direction," and the opposite direction as the "negative X direction." The term "X direction" encompasses both positive and negative directions. The same applies to the Y and Z directions.

[0063] In this specification, when an object is described as "one or more," both the method of having one object and the method of having multiple objects are summarized and described. Therefore, by specifying "one or more," implementations having one or more objects, implementations having at least one object, and implementations having multiple objects are all supported.

[0064] In this specification, the description of "one or each" object is a summary of descriptions of one object in an embodiment having one object, descriptions of one object in an embodiment having multiple objects, and descriptions of multiple objects separately in an embodiment having multiple objects. Therefore, by describing "one or each" object, it is supported that in an embodiment having one object, at least one of these objects has description content; in an embodiment having multiple objects, each of these multiple objects has description content; and in an embodiment having one or more objects, all objects have description content.

[0065] Furthermore, in this specification, for example, when describing constituent elements, the terms "component" or "part" are sometimes used. "Companion" refers to an object that is physically treated as a single unit. An object that is physically treated as a single unit can also be described as an object treated as a component during the manufacturing process. On the other hand, "part" refers to an object that does not need to be physically treated separately. For example, "part" is used when partially capturing a part of a component, or when multiple components are grouped together as a single object.

[0066] It should be noted that the distinction between "component" and "part" in the above-mentioned writing does not imply a conscious limitation of the scope of rights in the interpretation of the theory of equality. That is, even if there is a constituent element described as a "component" in the claims, the applicant does not consider that treating that constituent element as a physically independent entity is essential for the application of the present invention solely based on this situation.

[0067] In this specification or claims, a certain constituent element may be represented by multiple elements. When distinguishing these constituent elements, the prefixes "first" and "second" are sometimes added to the beginning of the constituent element for differentiation. Furthermore, the objects distinguished in this specification and the claims may differ. Therefore, even if a constituent element marked with the same prefix as in this specification is described in the claims, the object defined by that constituent element may not be consistent between this specification and the claims.

[0068] For example, in this specification, there are constituent elements distinguished by the designations "first," "second," and "third." When these constituent elements, marked with "first" and "third" in this specification, are described in the claims, it is easy to observe that the constituent elements are sometimes distinguished by the designations "first" and "second" in the claims. In this case, the constituent elements marked "first" and "second" in the claims refer to the constituent elements marked "first" and "third" in this specification, respectively. It should be noted that this rule is not limited to constituent elements and can be reasonably and flexibly applied to other objects.

[0069] The following describes a method for implementing the present invention. Furthermore, specific methods for implementing the present invention will be described with reference to the accompanying drawings. It should be noted that the method for implementing the present invention is not limited to this specific method. That is, the illustrated embodiments are not the only way to implement the present invention. It should also be noted that the size and positional relationships of the components shown in the drawings are sometimes exaggerated for ease of understanding.

[0070] <First Implementation>

[0071] The light-emitting module 901 of the first embodiment will be described. Figures 1 to 20C This is a diagram illustrating one way of showing an example of the light-emitting module 901 of the first embodiment. Figure 1 This is a 3D view of the light-emitting module 901. Figure 2 This is a top view of the wiring board 101. It should be noted that... Figure 2 The wiring substrate 101 shown represents a schematic wiring substrate. The first wiring substrate 1011 to the fourth wiring substrate 1014, except for the second wiring substrate 1012, are examples of each wiring substrate 101. Figure 2 The wiring board 101 shown is not completely identical. Figure 3 yes Figure 2 A schematic cross-sectional view of the wiring substrate 101 at section III-III. Figure 4 This is a three-dimensional view of the light-emitting device 1. Figure 5 This is a side view of the light-emitting device 1. Figure 6 yes Figure 4 A cross-sectional view of the light-emitting device 1 at section line VI-VI. Figure 7A This is a diagram showing an example of the constituent elements arranged in the internal space of the light-emitting device 1. Figure 7B This is a diagram showing another example of the constituent elements arranged in the internal space of the light-emitting device 1. Figure 8 This is a 3D view of package 10. Figure 9 yes Figure 8 A cross-sectional view of package 10 at the IX-IX section line.

[0072] Figure 10 This is a top view of base 11. Figure 11A This is a bottom view of the substrate 11 viewed from the top surface perspective. It should be noted that... Figure 11A The dashed line indicates the lower wiring section 12B when viewed from the upper surface side. Figure 11B This is a bottom view of base 11. Figure 12A It is along Figure 10 A cross-sectional view of the substrate 11 at the XIIA-XIIA section line. Figure 12B It is Figure 12A The cross-sectional view is an enlarged cross-sectional view of the base 11 in the Z direction at a scale. Figure 13A This is a top view showing an example of an upper wiring portion 12A provided in the first layer 11S1 of the insulating layer 11S of the substrate 11. It should be noted that... Figure 13A The shaded line indicates the portion that does not overlap with the fourth layer 11S4 when viewed from above. Figure 13B It means having Figure 13A A top view of an example of an intermediate wiring portion 12C provided in the third layer 11S3 of the insulating layer 11S in the substrate 11 of the first layer 11S1. Figure 14A This is a top view showing another example of an upper wiring portion 12A disposed in the first layer 11S1 of the insulating layer 11S of the substrate 11. It should be noted that... Figure 14A The shaded line indicates the portion that does not overlap with the fourth layer 11S4 when viewed from above. Figure 14B It means having Figure 14A A top view of an example of an intermediate wiring portion 12C provided in the third layer 11S3 of the insulating layer 11S in the substrate 11 of the first layer 11S1. Figure 15 This is a top view showing the appearance of the light-emitting elements 20, etc., arranged on the auxiliary mounting substrate 30. Figure 16 This is a side view showing the appearance of the light-emitting element 20 and the like arranged on the auxiliary mounting substrate 30.

[0073] Figure 17A This is a top view of the first light-emitting module 901A. Figure 17B This is a top view of the first wiring board 1011. Figure 17C This is a top view showing the internal space of the first light-emitting device 1A and the second light-emitting device 1B of the first light-emitting module 901A. Figure 18A This is a top view of the second light-emitting module 901B. Figure 18B This is a top view of the second wiring board 1012. Figure 18C This is a top view showing the internal space of the first light-emitting device 1A and the second light-emitting device 1B of the second light-emitting module 901B. Figure 19A This is a top view of the third light-emitting module 901C. Figure 19B This is a top view of the third wiring board 1013. Figure 19C This is a top view showing the internal space of the first light-emitting device 1A and the second light-emitting device 1B of the third light-emitting module 901C. Figure 20A This is a top view of the fourth light-emitting module 901D. Figure 20B This is a top view of the fourth wiring board 1014. Figure 20C This is a top view showing the internal space of the first light-emitting device 1A and the second light-emitting device 1B included in the fourth light-emitting module 901D. It should be noted that, regarding the light-emitting module 901, achieving a match between the XYZ directions of the first light-emitting device 1A and the XYZ directions of the light-emitting module 901 does not necessarily mean achieving a match between the XYZ directions of the second light-emitting device 1B and the XYZ directions of the light-emitting module 901. Figure 17B , Figure 18B , Figure 19B as well as Figure 20B The portion of the insulating component 131 that is positioned above the electrode component 121 has been removed. Figure 17C , Figure 18C , Figure 19C and Figure 20C The dashed line in the figure represents the lower wiring section 12B in perspective.

[0074] The light-emitting module 901 has multiple components. The multiple components of the light-emitting module 901 include one or more light-emitting devices 1, a wiring board 101, a connector 201, and a thermistor 301.

[0075] It should be noted that the light-emitting module 901 may also have other constituent elements besides these. For example, the light-emitting module 901 may also have a light-emitting device different from the light-emitting device 1. In addition, the light-emitting module 901 may not have some of the constituent elements listed herein.

[0076] The light-emitting device 1 comprises multiple components. These components include a package 10, one or more light-emitting elements 20, one or more auxiliary mounting substrates 30, one or more reflective components 40, one or more protective components 50, multiple wirings 60, and optical components 70.

[0077] It should be noted that the light-emitting device 1 may also include other constituent elements. For example, in addition to one or more light-emitting elements 20, the light-emitting device 1 may also include light-emitting elements. Alternatively, the light-emitting device 1 may not include some of the constituent elements listed here.

[0078] First, let’s explain each of the constituent elements.

[0079] (Package 10)

[0080] Package 10 includes a base 11 and a cover 14. The cover 14 is joined to the base 11 to form package 10. An internal space is defined within package 10 for configuring other constituent elements. This internal space is a closed space surrounded by the base 11 and the cover 14. Furthermore, this internal space can be sealed in a vacuum or hermetically sealed state.

[0081] When viewed from above, the outer edge of package 10 is rectangular. This rectangle can be a rectangle with a long side and a short side. In the illustrated package 10, the long side of the rectangle is in the same direction as the X direction, and the short side is in the same direction as the Y direction. It should be noted that, when viewed from above, the outer edge shape of package 10 may not be rectangular.

[0082] In the package 10, an internal space is formed for configuring other constituent elements. The first upper surface 11A of the package 10 is part of the area defining the internal space. In addition, each inner surface 11E and the lower surface 14B of the package 10 is part of the area defining the internal space.

[0083] The substrate 11 has a first upper surface 11A and a lower surface 11B. The substrate 11 has a second upper surface 11C. The substrate 11 has one or more outer surfaces 11D. The substrate 11 has one or more inner surfaces 11E. One or more outer surfaces 11D intersect with the second upper surface 11C. One or more outer surfaces 11D intersect with the lower surface 11B. One or more inner surfaces 11E intersect with the second upper surface 11C.

[0084] One or more outer surfaces 11D may include a first outer surface 11D1 and a second outer surface 11D2. The second outer surface 11D2 is the outer surface 11D located on the opposite side of the first outer surface 11D1. One or more inner surfaces 11E may include a first inner surface 11E1 and a second inner surface 11E2. The second inner surface 11E2 is the inner surface 11E opposite to the first inner surface 11E1.

[0085] It should be noted that the outer surface 11D or the inner surface 11E is part or all of one or more sides of the substrate 11. Alternatively, the substrate 11 may not necessarily have an inner surface 11E. Hereinafter, the "first outer surface 11D1 or first inner surface 11E1" is sometimes referred to as the "first side of the substrate 11," and the "second outer surface 11D2 or second inner surface 11E2" is sometimes referred to as the "second side of the substrate 11."

[0086] Viewed from above, the outer edge of the substrate 11 is rectangular. Viewed from above, the outer edge of the substrate 11 is the same as the outer edge of the package 10. Viewed from above, the outer edge of the first upper surface 11A is rectangular. This rectangle can be a rectangle with a long side and a short side. The direction of the long side of the first upper surface 11A is parallel to the direction of the long side of the outer edge of the substrate 11. It should be noted that, viewed from above, the outer edge of the first upper surface 11A may not be rectangular.

[0087] When viewed from above, the first upper surface 11A is surrounded by the second upper surface 11C. The second upper surface 11C is an annular surface that surrounds the first upper surface 11A when viewed from above. The second upper surface 11C is a rectangular annular surface. Here, the frame defined by the inner edge of the second upper surface 11C is referred to as the inner frame of the second upper surface 11C, and the frame defined by the outer edge of the second upper surface 11C is referred to as the outer frame of the second upper surface 11C.

[0088] The substrate 11 has a recess surrounded by a frame formed by a second upper surface 11C. The recess defines a portion in the substrate 11 that is recessed downwards from the second upper surface 11C. A first upper surface 11A is part of the recess. One or more inner side surfaces 11E are part of the recess. The second upper surface 11C is located above the first upper surface 11A.

[0089] The base 11 has one or more stepped portions 11F. Each stepped portion 11F has an upper surface 11G and a side surface 11H that intersects with and extends downward from the upper surface 11G. Here, a stepped portion 11F has only one upper surface 11G and one side surface 11H. The upper surface 11G intersects with the inner side surface 11E. The side surface 11H intersects with the first upper surface 11A.

[0090] One or more step portions 11F are disposed inside the inner frame of the second upper surface 11C when viewed from above. One or more step portions 11F are formed along part or all of the inner side surface 11E when viewed from above. In the base 11, the side surface 11H is the inner side surface, but the side surface 11H and the inner side surface 11E are different surfaces. One or more inner side surfaces 11E and one or more side surfaces 11H are perpendicular to the first upper surface 11A. The perpendicularity here is allowed to be ±3 degrees.

[0091] One or more stepped portions 11F may include a first stepped portion 11F1 and a second stepped portion 11F2. The first stepped portion 11F1 and the second stepped portion 11F2 are disposed at opposite positions on their respective side surfaces 11H. The first stepped portion 11F1 and the second stepped portion 11F2 are disposed on the short side side of the inner frame of the second upper surface 11C.

[0092] A first stepped portion 11F1 is provided on the first side surface of the base 11. A second stepped portion 11F2 is provided on the second side surface of the base 11. The first stepped portion 11F1 is formed along the first inner side surface 11E1. The second stepped portion 11F2 is formed along the second inner side surface 11E2.

[0093] The substrate 11 has a base portion 11M and a frame portion 11N. The base portion 11M and the frame portion 11N can be components made of different materials. The substrate 11 can be configured to include a base component corresponding to the base portion 11M and a frame component corresponding to the frame portion 11N.

[0094] The base 11M includes a first upper surface 11A. The frame portion 11N includes a second upper surface 11C. The frame portion 11N includes one or more outer side surfaces 11D and one or more inner side surfaces 11E. The frame portion 11N includes one or more stepped portions 11F.

[0095] The lower surface of the base 11M constitutes part or all of the lower surface 11B of the base 11. When the lower surface of the base 11M constitutes part of the lower surface 11B of the base 11, the lower surface of the frame portion 11N constitutes the remaining area of ​​the lower surface 11B of the base.

[0096] The substrate 11 has a plurality of wiring portions 12. The plurality of wiring portions 12 includes one or more wiring portions 12 disposed in the internal space of the package 10 and one or more wiring portions 12 disposed on the outer surface of the package 10.

[0097] The plurality of wiring portions 12 includes a plurality of upper wiring portions 12A disposed on the upper surface side of the base 11. The plurality of wiring portions 12 includes a plurality of lower wiring portions 12B disposed on the lower surface side of the base 11. The plurality of wiring portions 12 are disposed separately from each other.

[0098] In the substrate 11, the upper wiring section 12A is electrically connected to the lower wiring section 12B. Multiple upper wiring sections 12A are each electrically connected to one or more lower wiring sections 12B.

[0099] The plurality of upper wiring sections 12A include upper wiring sections 12A electrically connected to at least one lower wiring section 12B and upper wiring sections 12A electrically connected to two or more lower wiring sections 12B. By providing two or more lower wiring sections 12B electrically connected to the same upper wiring section 12A, it is possible to select which lower wiring section 12B is connected to an external circuit, thereby increasing the freedom of wiring design.

[0100] The plurality of upper wiring sections 12A include upper wiring sections 12A that are electrically connected to only one lower wiring section 12B and upper wiring sections 12A that are electrically connected to two or more lower wiring sections 12B. The plurality of upper wiring sections 12A include two or more upper wiring sections 12A that are electrically connected to two or more lower wiring sections 12B respectively.

[0101] The plurality of upper wiring portions 12A include an upper wiring portion 12A disposed on the first side that is electrically connected to a lower wiring portion 12B disposed on the second side.

[0102] The number of lower wiring portions 12B in the substrate 11 is preferably three times or less than the number of upper wiring portions 12A. This is because the number of wiring portions 12 provided in the substrate 11 also affects the size of the substrate 11. It should be noted that the number of lower wiring portions 12B in the substrate 11 may also be twice or less than the number of upper wiring portions 12A.

[0103] In a top view, the plurality of upper wiring portions 12A include a first upper wiring portion 12A1 disposed on a first side of the base 11. The plurality of upper wiring portions 12A include a second upper wiring portion 12A2 disposed on the first side of the base 11. In a top view, the plurality of upper wiring portions 12A include a third upper wiring portion 12A3 disposed on a second side of the base 11. In a top view, the plurality of upper wiring portions 12A include a fourth upper wiring portion 12A4 disposed on a second side of the base 11.

[0104] In the substrate 11, the first upper wiring section 12A1 and the second upper wiring section 12A2 are not electrically connected. In the substrate 11, the third upper wiring section 12A3 and the fourth upper wiring section 12A4 are not electrically connected. In the substrate 11, the first upper wiring section 12A1 and the third upper wiring section 12A3 are not electrically connected. The first upper wiring section to the fourth upper wiring sections 12A1 to 12A4 are not electrically connected to each other.

[0105] One or more upper wiring portions 12A are provided on the upper surface 11G of the stepped portion 11F. The base 11 has one or more upper wiring portions 12A provided on the upper surface 11G of the first stepped portion 11F1. The base 11 has one or more upper wiring portions 12A provided on the upper surface 11G of the second stepped portion 11F2. It should be noted that the upper wiring portions 12A may be provided on an upper surface different from the upper surface 11G of the base 11.

[0106] One or more lower wiring portions 12B are provided on the lower surface 11B of the package 10. One or more lower wiring portions 12B are provided on the lower surface of the frame portion 11N. It should be noted that the lower wiring portions 12B may also be provided on an outer surface of the package 10 that is different from the lower surface 11B. In this case, it is more appropriate to refer to them as "inner wiring portion 12A" and "outer wiring portion 12B" based on the relationship between the surface defining the internal space of the package 10 and the outer surface of the package 10, rather than referring to them as "upper wiring portion 12A" and "lower wiring portion 12B".

[0107] When viewed from below, the plurality of lower wiring portions 12B include a first lower wiring portion 12B1 disposed on a first side of the base 11. The plurality of lower wiring portions 12B include a second lower wiring portion 12B2 disposed on the first side of the base 11. When viewed from below, the plurality of lower wiring portions 12B include a third lower wiring portion 12B3 disposed on a second side of the base 11.

[0108] When viewed from below, the plurality of lower wiring portions 12B include a fourth lower wiring portion 12B4 disposed on the second side of the base 11. When viewed from below, the plurality of lower wiring portions 12B include a fifth lower wiring portion 12B5 disposed on the second side of the base 11. When viewed from below, the plurality of lower wiring portions 12B include a sixth lower wiring portion 12B6 disposed on the first side of the base 11.

[0109] In the substrate 11, the first lower wiring section 12B1 and the second lower wiring section 12B2 are not electrically connected. In the substrate 11, the first lower wiring section 12B1 and the third lower wiring section 12B3 are electrically connected. In the substrate 11, the fourth lower wiring section 12B4 and the fifth lower wiring section 12B5 are not electrically connected, and in the substrate 11, the fourth lower wiring section 12B4 and the sixth lower wiring section 12B6 are electrically connected.

[0110] In the substrate 11, the first upper wiring section 12A1 is electrically connected to the first lower wiring section 12B1. In the substrate 11, the first upper wiring section 12A1 is electrically connected to the third lower wiring section 12B3. In the substrate 11, the second upper wiring section 12A2 is electrically connected to the second lower wiring section 12B2. In the substrate 11, the third upper wiring section 12A3 is electrically connected to the fourth lower wiring section 12B4. In the substrate 11, the third upper wiring section 12A3 is electrically connected to the sixth lower wiring section 12B6. In the substrate 11, the fourth upper wiring section 12A4 is electrically connected to the fifth lower wiring section 12B5.

[0111] The substrate 11 has a plurality of insulating layers 11S. In the substrate 11, a plurality of insulating layers 11S are provided in the vertical direction. The plurality of insulating layers 11S includes a first layer 11S1 on which the upper wiring portion 12A is provided. The plurality of insulating layers 11S includes a second layer 11S2 on which the lower wiring portion 12B is provided. The plurality of insulating layers 11S includes one or more third layers 11S3 disposed between the first layer 11S1 and the second layer 11S2. The plurality of insulating layers 11S includes one or more fourth layers 11S4 disposed above the first layer 11S1.

[0112] The plurality of wiring sections 12 include a plurality of intermediate wiring sections 12C disposed between the first layer 11S1 and the second layer 11S2. The intermediate wiring sections 12C may be disposed between the first layer 11S1 and the third layer 11S3. The intermediate wiring sections 12C may be disposed between two consecutive third layers 11S3. The intermediate wiring sections 12C may be disposed between the third layer 11S3 and the second layer 11S2.

[0113] One or more intermediate wiring portions 12C are not disposed within the internal space of the package 10. One or more intermediate wiring portions 12C are not disposed on the outer surface of the package 10. One or more intermediate wiring portions 12C are disposed inside the package 10 and not on the surface of the substrate 11.

[0114] The plurality of insulating layers 11S includes one or more insulating layers 11S having through-hole wiring connected to the upper and lower wiring portions 12. Through-hole wiring is disposed in the through holes of the insulating layers 11S. The portions of the insulating layers 11S in which the through-hole wiring is disposed are conductive.

[0115] Multiple through-hole wirings are provided in the first layer 11S1. Multiple through-hole wirings are provided in the second layer 11S2. Multiple through-hole wirings are provided in one or each of the third layers 11S3. In the substrate 11, multiple through-hole wirings are provided in all insulating layers 11S disposed between the surface where multiple upper wiring portions 12A are provided and the surface where multiple lower wiring portions 12B are provided.

[0116] The plurality of wiring sections 12 include wiring sections 12 having a region extending from the first side side to the second side side. This wiring section is an upper wiring section 12A or a middle wiring section 12C. Thus, an upper wiring section 12A can be provided that is electrically connected to both the lower wiring section 12B provided on the first side side and the lower wiring section 12B provided on the second side side.

[0117] exist Figure 13A and Figure 13BIn the example of the substrate 11 shown, among the plurality of intermediate wiring portions 12C, there is an intermediate wiring portion 12C having a region extending from a first side side to a second side side. Among the plurality of intermediate wiring portions 12C, there is a first intermediate wiring portion 12C1, which has a region extending from the first side side to the second side side and is electrically connected to a first upper wiring portion 12A1, a first lower wiring portion 12B1, and a third lower wiring portion 12B3. Among the plurality of intermediate wiring portions 12C, there is a second intermediate wiring portion 12C2, which has a region extending from the first side side to the second side side and is electrically connected to a third upper wiring portion 12A3, a fourth lower wiring portion 12B4, and a sixth lower wiring portion 12B6.

[0118] exist Figure 14A and Figure 14B In the example of the substrate 11 shown, the first upper wiring portion 12A1 has a region extending from the first side surface to the second side surface. Additionally, the third upper wiring portion 12A3 has a region extending from the first side surface to the second side surface. The first upper wiring portion 12A1 has a first region that overlaps with the fourth layer 11S4 when viewed from above and a second region that does not overlap with the fourth layer 11S4, and has a region extending from the first side surface to the second side surface in the first region. When viewed from above, the third upper wiring portion 12A3 has a third region that overlaps with the fourth layer 11S4 and a fourth region that does not overlap with the fourth layer 11S4, and has a region extending from the first side surface to the second side surface in the third region.

[0119] The plurality of wiring portions 12 include two wiring portions 12 each having a region extending from a first side side to a second side side. These two wiring portions 12 are disposed on the same insulating layer 11S. One of the two wiring portions 12 has a region extending from the first side side to the second side side on a third side side of the substrate 11, and the other has a region extending from the first side side to the second side side on a fourth side side of the substrate 11. By thus disposing of two wiring portions 12 with regions extending from the first side side to the second side side on a single insulating layer 11S, a substrate 11 with increased flexibility in wiring design can be achieved using fewer insulating layers 11S.

[0120] It should be noted that the third side surface of the substrate 11 is either the third outer side surface 11D3 or the third inner side surface 11E3, which intersects with the first and second side surfaces of the substrate 11. The fourth side surface of the substrate 11 is either the fourth outer side surface 11D4 or the fourth inner side surface 11E4, which intersects with the first and second side surfaces of the substrate 11. The fourth outer side surface 11D4 is located on the opposite side of the third outer side surface 11D3, and the fourth inner side surface 11E4 is opposite to the third inner side surface 11E3.

[0121] One of the features can be understood as the following wiring design: In the base 11, an upper wiring portion 12A (e.g., a first upper wiring portion 12A1) is provided on one side of the first side or the second side of the base 11. In addition, an upper wiring portion 12A (e.g., a second upper wiring portion 12A2, a third upper wiring portion 12A3, or a fourth upper wiring portion 12A4) is provided on one side or the other side of the first side or the second side of the base 11. One of the upper wiring portions 12A (e.g., the first upper wiring portion 12A1) is electrically connected to a lower wiring portion 12B provided on one side of the first side or the second side of the base 11 and a lower wiring portion 12B provided on the other side of the first side or the second side of the base 11.

[0122] Additionally, the following wiring design can be understood as one of the features: in the base 11, two upper wiring portions 12A (e.g., a first upper wiring portion 12A1 and a second upper wiring portion 12A2) are provided on one side of the first side or the second side of the base 11, and one of the upper wiring portions 12A (e.g., the first upper wiring portion 12A1) is electrically connected to a lower wiring portion 12B provided on one side of the first side or the second side of the base 11, and to a lower wiring portion 12B provided on the other side of the first side or the second side of the base 11.

[0123] Additionally, the following wiring design can be understood as one of the features: in the base 11, an upper wiring portion 12 (e.g., a first upper wiring portion 12A1) is provided on one side of the first side or the second side of the base 11, and an upper wiring portion 12A (e.g., a fourth upper wiring portion 12A4) is provided on the other side of the first side or the second side of the base 11, wherein one of the upper wiring portions 12A (e.g., the first upper wiring portion 12A1) is electrically connected to a lower wiring portion 12B provided on one side of the first side or the second side of the base 11, and to a lower wiring portion 12B provided on the other side of the first side or the second side of the base 11.

[0124] Additionally, the following wiring design can be understood as one of the features: In the base 11, an upper wiring portion 12A (e.g., a first upper wiring portion 12A1) is provided on one side of the first side or the second side of the base 11, and an upper wiring portion 12A (e.g., a third upper wiring portion 12A3) is provided on the other side of the first side or the second side of the base 11. The upper wiring portions 12A (e.g., the first upper wiring portion 12A1 and the third upper wiring portion 12A3) are respectively electrically connected to a lower wiring portion 12B provided on one side of the first side or the second side of the base 11 and a lower wiring portion 12B provided on the other side of the first side or the second side of the base 11.

[0125] Additionally, the following wiring design can be understood as one of the features: in the base 11, two upper wiring portions 12A (e.g., a first upper wiring portion 12A1 and a second upper wiring portion 12A2) are provided on one side of the first side or the second side of the base 11, and an upper wiring portion 12A (e.g., a fourth upper wiring portion 12A4) is provided on the other side of the first side or the second side of the base 11, and one of the upper wiring portions 12A (e.g., a first upper wiring portion 12A1) is electrically connected to a lower wiring portion 12B provided on one side of the first side or the second side of the base 11, and to a lower wiring portion 12B provided on the other side of the first side or the second side of the base 11.

[0126] In the substrate 11, when viewed from above, when the substrate 11 is divided into two regions by an imaginary line passing through and parallel to the side surface 11H of the first step portion 11F1, the region containing the upper surface 11G of the first step portion 11F1 has one or more lower side wiring portions 12B provided on the lower surface 11B of the substrate 11.

[0127] In the substrate 11, when viewed from above, when the substrate 11 is divided into two regions by an imaginary line passing through and parallel to the side surface 11H of the second step portion 11F2, the region containing the upper surface 11G of the second step portion 11F2 has one or more lower side wiring portions 12B provided on the lower surface 11B of the substrate 11.

[0128] The substrate 11 has a bonding pattern 13A. The bonding pattern 13A is disposed on the second upper surface 11C. The bonding pattern 13A is arranged in a ring shape. The bonding pattern 13A is arranged in a rectangular ring shape. In a top view, the first upper surface 11A is surrounded by the bonding pattern 13A.

[0129] The substrate 11 can be formed, for example, using ceramic as the main material. Examples of ceramics that can be used as the main material of the substrate 11 include aluminum nitride, silicon nitride, aluminum oxide, or silicon carbide.

[0130] Here, the main material refers to the material that constitutes the largest proportion of the mass or volume in the formed object. It should be noted that when an object is formed from a single material, that material is the main material. That is, in the case of a main material, the proportion of that material can be 100%.

[0131] The substrate 11 can also be formed using base components and frame components made from different main materials. For example, the base component can be formed using a metal or a metal-containing composite, graphite, diamond, or other materials with excellent heat dissipation as the main material. Examples of metals that can be used as the main material of the base component include copper, aluminum, or iron. Examples of composites that contain a metal that can be used as the main material of the base component include copper-molybdenum or copper-tungsten. For example, the frame component can be formed using ceramics, listed as a main material of the substrate 11, as the main material.

[0132] The wiring section 12 can be formed using a metallic material as the main material, for example. Examples of metallic materials that can be used as the main material of the wiring section 12 include single metals such as Cu, Ag, Ni, Au, Ti, Pt, Pd, Cr, and W, or alloys containing these metals. The wiring section 12 can be composed of one or more metal layers, for example.

[0133] The bonding pattern 13A can be formed, for example, using a metallic material as the main material. Examples of metallic materials that can serve as the main material of the bonding pattern 13A include single metals such as Cu, Ag, Ni, Au, Sn, Ti, and Pd, or alloys containing these metals. The bonding pattern 13A can be composed of one or more metallic layers.

[0134] The cover 14 has an upper surface 14A and a lower surface 14B. Additionally, the cover 14 has one or more side surfaces 14C. The cover 14 is constructed in the shape of a rectangular parallelepiped. It should be noted that the shape of the cover 14 may not be a rectangular parallelepiped.

[0135] The cover 14 is joined to the base 11. The lower surface 14B of the cover 14 is joined to the second upper surface 11C of the base 11. The cover 14 is joined to the base 11 by the joining pattern 13A. The cover 14 is joined to the base 11 by an adhesive.

[0136] The cover 14 is translucent, allowing light to pass through. Here, translucency refers to a transmittance of 80% or more for light incident on the cover 14. It should be noted that the cover 14 may also have some opaque areas (areas without light transmission).

[0137] The cover 14 can be formed, for example, using glass as the main material. Alternatively, the cover 14 can be formed, for example, using sapphire as the main material.

[0138] (Light-emitting element 20)

[0139] The light-emitting element 20 has an upper surface 21A, a lower surface 21B, and multiple side surfaces 21C. The upper surface 21A is rectangular in shape. Furthermore, this rectangle has a long side and a short side. The light-emitting element 20 has a rectangular shape when viewed from above. It should be noted that the shape of the upper surface 21A and the shape of the light-emitting element 20 when viewed from above are not limited to these.

[0140] The light-emitting element 20 has a light-emitting surface 22. For example, the side surface 21C can serve as the light-emitting surface 22. The side surface 21C that serves as the light-emitting surface 22 intersects with the short side of the upper surface 21A. Alternatively, for example, the upper surface 21A can serve as the light-emitting surface 22. The light-emitting element 20 has one or more light-emitting surfaces 22.

[0141] The light-emitting element 20 can, for example, be a light-emitting element that emits blue light. Alternatively, for example, the light-emitting element 20 can be a light-emitting element that emits green light. Additionally, for example, the light-emitting element 20 can be a light-emitting element that emits red light. It should be noted that the light-emitting element 20 can also be a light-emitting element that emits light of other colors or wavelengths.

[0142] Here, blue light refers to light with a peak emission wavelength in the range of 420nm to 494nm. Green light refers to light with a peak emission wavelength in the range of 495nm to 570nm. Red light refers to light with a peak emission wavelength in the range of 605nm to 750nm.

[0143] Examples of light-emitting elements 20 that emit blue or green light include those comprising nitride semiconductors. Examples of GaN-based semiconductors include GaN, InGaN, and AlGaN. Examples of light-emitting elements 20 that emit red light include those comprising InAlGaP, GaInP, and GaAs-based semiconductors such as GaAs and AlGaAs.

[0144] The light-emitting element 20 can be, for example, a semiconductor laser element. Alternatively, the light-emitting element 20 can be a single-emitter semiconductor laser element with one emitter. Furthermore, the light-emitting element 20 can be a multi-emitter semiconductor laser element with multiple emitters. It should be noted that the light-emitting element 20 is not limited to a semiconductor laser element; it can also be a light-emitting diode, etc.

[0145] Here, a semiconductor laser element, which is one example of a light-emitting element 20, will be described.

[0146] A semiconductor laser element emits directional laser light. Diverging light is emitted from the light-emitting surface 22 of the semiconductor laser element. The light emitted from the semiconductor laser element forms an elliptical far-field pattern (hereinafter referred to as "FFP") on a surface parallel to the light-emitting surface 22. The FFP is the shape and intensity distribution of the emitted light at the location leaving the light-emitting surface of the semiconductor laser element.

[0147] Here, light passing through the center of the elliptical shape of the FFP, in other words, light with peak intensity in the FFP's intensity distribution, is referred to as light traveling along the optical axis or light passing through the optical axis. Furthermore, in the intensity distribution of the FFP, light with a peak intensity value of 1 / e... 2 Light of the above intensities is called the primary component of light.

[0148] The shape of the FFP (Factor-Free Plane) emitted from the semiconductor laser element is an ellipse in a plane parallel to the light exit surface 22, where the stacking direction is longer than the direction perpendicular to the stacking direction. The stacking direction refers to the direction in which multiple semiconductor layers containing the active layer are stacked within the semiconductor laser element. The direction perpendicular to the stacking direction can also be called the planar direction of the semiconductor layer. Alternatively, the major axis of the elliptical shape of the FFP can be called the fast axis direction of the semiconductor laser element, and the minor axis direction can be called the slow axis direction.

[0149] Based on the light intensity distribution of FFP, 1 / e of the peak light intensity 2 The light spread angle of the semiconductor laser element is defined as the light spread angle of the peak light intensity (the light passing through the optical axis) multiplied by 1 / e of the peak light intensity. 2 The angle formed by the light intensity is represented by the light beam. It should be noted that the light spread angle is different from 1 / e of the peak light intensity. 2 In addition to the light intensity, it is sometimes calculated from, for example, the light intensity at half the peak light intensity. In this specification, when simply referred to as the "light diffusion angle," it refers to 1 / e of the peak light intensity. 2 The diffusion angle of light at a given light intensity.

[0150] The spread angle of light emitted from a semiconductor laser element along its fast axis can be greater than 15 degrees and less than 40 degrees. Furthermore, the spread angle along its slow axis can exceed 0 degrees and be less than 10 degrees. Additionally, the spread angle along the fast axis is larger than the spread angle along the slow axis.

[0151] For example, the spread angle of blue light emitted from a semiconductor laser element along its fast axis can be greater than 15 degrees and less than 30 degrees, while the spread angle along its slow axis can be greater than 0 degrees and less than 10 degrees. Similarly, for example, the spread angle of green light emitted from a semiconductor laser element along its fast axis can be greater than 15 degrees and less than 30 degrees, while the spread angle along its slow axis can be greater than 0 degrees and less than 10 degrees. Furthermore, for example, the spread angle of red light emitted from a semiconductor laser element along its fast axis can be greater than 20 degrees and less than 40 degrees, while the spread angle along its slow axis can be greater than 0 degrees and less than 10 degrees.

[0152] (Auxiliary mounting base plate 30)

[0153] The auxiliary mounting base plate 30 has an upper surface 31A, a lower surface 31B, and one or more side surfaces 31C. The upper surface 31A can be considered a mounting surface for mounting other components. The upper surface 31A is rectangular in shape. This rectangle of the upper surface 31A may have a short side and a long side. It should be noted that the shape of the upper surface 31A may not be rectangular.

[0154] The auxiliary mounting substrate 30, viewed from above, has a rectangular shape. This rectangle of the auxiliary mounting substrate 30 may have a short side and a long side. It should be noted that the shape of the auxiliary mounting substrate 30, viewed from above, may not be rectangular. When viewed from above, the auxiliary mounting substrate 30 may have a shape in which the length in one direction (hereinafter referred to as the short side direction of the auxiliary mounting substrate 30) is smaller than the length in the direction perpendicular to it (hereinafter referred to as the long side direction of the auxiliary mounting substrate 30). In the illustrated auxiliary mounting substrate 30, the short side direction is the same as the X direction, and the long side direction is the same as the Y direction.

[0155] The auxiliary mounting substrate 30 can be configured to have a substrate 32A and an upper metal member 32B. Alternatively, the auxiliary mounting substrate 30 can also be configured to have a lower metal member 32C. The upper metal member 32B is disposed on the upper surface of the substrate 32A. The lower metal member 32C is disposed on the lower surface of the substrate 32A. The auxiliary mounting substrate 30 also includes a wiring layer 33. The wiring layer 33 is disposed on the upper metal member 32B.

[0156] The substrate 32A is insulating. The substrate 32A is formed, for example, from silicon nitride, aluminum nitride, or silicon carbide. The main material of the substrate 32A can be a ceramic with good heat dissipation (high thermal conductivity).

[0157] The upper metal component 32B is primarily made of metals such as copper and aluminum. The upper metal component 32B has one or more metal layers. The upper metal component 32B may have multiple metal layers, each primarily made of a different metal.

[0158] The lower metal component 32C is primarily made of metals such as copper and aluminum. The lower metal component 32C has one or more metal layers. The lower metal component 32C may have multiple metal layers, each primarily made of a different metal.

[0159] The wiring layer 33 can be formed using metal. For example, the wiring layer 33 can be formed using AuSn solder (AuSn metal layer).

[0160] For example, the length of the auxiliary mounting substrate 30 in the short-length direction or short-side direction is 700 μm or more and 1200 μm or less. Furthermore, the length of the auxiliary mounting substrate 30 in the long-length direction or long-side direction is 1000 μm or more and 2500 μm or less. Additionally, the difference between the length of the auxiliary mounting substrate 30 in the long-side direction and the length in the short-side direction is 200 μm or more and 1800 μm or less.

[0161] For example, the thickness of the auxiliary mounting substrate 30 (width in the direction perpendicular to the upper surface 31A) is 200 μm or more and 400 μm or less. Additionally, for example, the thickness of substrate 32A is 100 μm or more and 300 μm or less. Additionally, for example, the thickness of the upper metal member 32B is 30 μm or more and 100 μm or less. Additionally, for example, the thickness of the lower metal member 32C is 30 μm or more and 100 μm or less. Additionally, for example, the thickness of wiring layer 33 is 1 μm or more and 10 μm or less.

[0162] (Reflective component 40)

[0163] The reflecting component 40 has a lower surface 41A and a light-reflecting surface 41B. Furthermore, the light-reflecting surface 41B is inclined relative to the lower surface 41A. The straight line connecting the lower and upper ends of the light-reflecting surface 41B is inclined relative to the lower surface 41A. The angle at which the light-reflecting surface 41B is inclined relative to the lower surface 41A is called the tilt angle of the light-reflecting surface 41B.

[0164] The light-reflecting surface 41B is a plane. It should be noted that the light-reflecting surface 41B can also be a curved surface. The tilt angle of the light-reflecting surface 41B is 45 degrees. It should be noted that the tilt angle of the light-reflecting surface 41B can also be other than 45 degrees.

[0165] The main material of the reflective component 40 can be glass, metal, etc. Heat-resistant materials can be used as the main material of the reflective component 40. Examples of main materials include quartz or BK7 (borosilicate glass) glass, and metals such as Al. The reflective component 40 can also be formed using Si as the main material.

[0166] If the main material is a reflective material such as Al, the light-reflecting surface 41B can be formed from the main material. Alternatively, instead of forming the light-reflecting surface 41B from the main material, the main material can be used to form the approximate shape of the reflective component 40, and the light-reflecting surface 41B can be formed on the surface of the approximate shape. In this case, the light-reflecting surface 41B can be formed, for example, using a metal layer such as Ag or Al, or a dielectric multilayer film such as Ta2O5 / SiO2, TiO2 / SiO2, or Nb2O5 / SiO2.

[0167] The reflectivity of the light-reflecting surface 41B relative to the peak wavelength of the light incident on it is 90% or more. Alternatively, this reflectivity may be 95% or more. Furthermore, the reflectivity may be 99% or more. The reflectivity may be 100% or less.

[0168] (Protective Component 50)

[0169] The protective element 50 has an upper surface 51A, a lower surface 51B, and one or more side surfaces 51C. The protective element 50 is rectangular in shape. It should be noted that the protective element 50 may not be rectangular in shape.

[0170] The protection element 50 is used to prevent excessive current from flowing through a specific component (such as a semiconductor laser component) and causing damage. A Zener diode can be used as an example of the protection element 50. Furthermore, a Zener diode formed of Si can be employed as the Zener diode.

[0171] (Wiring 60)

[0172] Wiring 60 is a linear conductive material with its two ends serving as joints. The joints at both ends become joints with other components. Wiring 60 is used for electrical connection between two components. Wiring 60 is, for example, a metallic conductor. Metals such as gold, aluminum, silver, and copper can be used.

[0173] (Optical component 70)

[0174] The optical component 70 has an upper surface 71A, a lower surface 71B, and one or more side surfaces 71C. The optical component 70 imparts optical effects to light incident upon it. The optical effects imparted to light by the optical component 70 include, for example, focusing, collimation, diffusion, polarization, diffraction, wave combining, guiding, reflection, and wavelength conversion.

[0175] The optical component 70 has an optically active surface that imparts optical effects. The upper surface 71A, lower surface 71B, or side surface 71C can serve as the optically active surface. Alternatively, the optically active surface can be located at a different position than the upper surface 71A, lower surface 71B, and side surface 71C. For example, the optically active surface can also be formed internally, rather than on the surface of the optical component 70.

[0176] Optical component 70 may have one or more lens surfaces 71D. Lens surface 71D is the optical working surface of optical component 70. It should be noted that optical component 70 with lens surface 71D can also be referred to as a lens component. Light emitted from optical component 70 through lens surface 71D is given the optical function of focusing, diffusing, or collimating by optical component 70. For example, optical component 70 is a collimating lens that causes light entering optical component 70 to be collimated and emitted outwards.

[0177] One or more lens surfaces 71D are disposed on the upper surface 71A side. It should be noted that lens surfaces 71D can also be disposed on the lower surface 71B side. The upper surface 71A and the lower surface 71B are planar. One or more lens surfaces 71D intersect with the upper surface 71A. When viewed from above, one or more lens surfaces 71D are surrounded by the upper surface 71A.

[0178] When viewed from above, the optical component 70 has a rectangular shape. It should be noted that the shape of the optical component 70 when viewed from above may not be rectangular. The lower surface 71B is flat. No lens surface 71D is formed on the lower surface 71B side of the optical component 70. The lower surface 71B has a rectangular shape. It should be noted that the shape of the lower surface 71B may not be rectangular.

[0179] In the optical component 70, the portion that overlaps with the lens surface 71D when viewed from above is designated as a lens portion 72A. In the optical component 70, the portion that overlaps with the upper surface 71A when viewed from above is designated as a non-lens portion 72B. The lower surface 71B has a region that constitutes the lower surface of one or more lens portions 72A and a region that constitutes the lower surface of the non-lens portion 72B.

[0180] The optical component 70 may have a plurality of lens surfaces 71D continuously formed in one direction. When viewed from above, the direction in which the plurality of lens surfaces 71D are arranged is called the connecting direction of the lenses. In the illustrated optical component 70, the connecting direction is the same as the X-direction.

[0181] Multiple lens surfaces 71D are formed such that the vertices of each lens surface 71D are aligned on a straight line. This imaginary straight line connecting the vertices is parallel to the lower surface 71B of the optical component 70. It should be noted that this parallelism includes a difference within ±5 degrees.

[0182] The curvature of some or all of the multiple lens surfaces 71D, and more than two lens surfaces 71D, can be the same. All of the multiple lens surfaces 71D can have the same curvature.

[0183] The optical component 70 is transparent. The transmittance of the optical component 70 relative to the peak wavelength of light incident on it is 80% or more. The optical component 70 may also have transparent areas and opaque areas (hereinafter referred to as opaque areas). In the opaque areas, the transmittance relative to the peak wavelength of light incident on the optical component 70 is 50% or less. The optical component 70 can be formed using, for example, glass such as BK7.

[0184] (Wireline board 101)

[0185] Wiring substrate 101 has an upper surface 101A, a lower surface 101B, and one or more side surfaces 101C. Wiring substrate 101 has a plate-like shape. In top view, the outer edge of wiring substrate 101 is rectangular. This rectangle can be a rectangle with a long side and a short side. In the illustrated package 10, the short side of this rectangle is oriented in the same direction as the X-direction, and the long side is oriented in the same direction as the Y-direction.

[0186] The wiring board 101 has a heat dissipation section 101D, an electrode section 101E, and an insulation section 101F. The heat dissipation section 101D functions as a heat dissipation path for heat emitted from other components mounted on the wiring board 101. The electrode section 101E is electrically connected to the other components mounted on the wiring board 101.

[0187] The insulating portion 101F insulates the heat dissipation portion 101D from the electrode portion 101E. The insulating portion 101F is provided to electrically insulate the heat dissipation portion 101D from the electrode portion 101E in the wiring board 101.

[0188] On the upper surface 101A of the wiring board 101, the heat dissipation portion 101D, the electrode portion 101E, and the insulating portion 101F have an uppermost region for the heat dissipation portion 101D (hereinafter referred to as the first region of the upper surface 101A), an uppermost region for the electrode portion 101E (hereinafter referred to as the second region of the upper surface 101A), and an uppermost region for the insulating portion 101F (hereinafter referred to as the third region of the upper surface 101A). In the upper surface 101A, the first region and the second region are separated by the third region.

[0189] The wiring board 101 may have a dummy electrode section 101I. The dummy electrode section 101I can be formed in the same manner as the electrode section 101E. For the dummy electrode section 101I, it is not necessary for other components to be electrically connected to the dummy electrode section 101I in order to supply power to other components. That is, the dummy electrode section 101I can be electrically connected to other components, but other components can receive power supply even if they are not electrically connected to the dummy electrode section 101I.

[0190] The wiring board 101 includes a heat dissipation component 111, a plurality of electrode components 121, and one or more insulating components 131. The heat dissipation portion 101D includes the heat dissipation component 111, the electrode portion 101E includes a plurality of electrode components 121, and the insulating portion 101F includes one or more insulating components 131.

[0191] The wiring substrate 101 includes one or more metal layers 141. The one or more metal layers 141 include one or more first metal layers 141A included in the heat dissipation portion 101D and one or more second metal layers 141B included in the electrode portion 101E.

[0192] One or more through holes 101H are provided on the wiring board 101. The one or more through holes 101H include through holes 101H for fixing the wiring board 101 to other components (constituents). For example, a screw is inserted into the through hole 101H to fix the wiring board 101 to the other component. The one or more through holes 101H include through holes 101H for positioning when fixing the wiring board 101 to other components.

[0193] The heat dissipation component 111 has a first upper surface 111A. The heat dissipation component 111 has one or more second upper surfaces 111B located at a position lower than the first upper surface 111A. The heat dissipation component 111 has one or more first side surfaces 111C intersecting the first upper surface 111A. The heat dissipation component 111 has one or more second side surfaces 111D intersecting the second upper surfaces 111B respectively. The heat dissipation component 111 has a lower surface 111E.

[0194] The heat dissipation component 111 has a protrusion protruding from one or each of the second upper surfaces 111B. The protrusion has a first upper surface 111A and one or more first side surfaces 111C. The height of the protrusion of the heat dissipation component 111 (from the second upper surface 111B to the first upper surface 111A) is less than the height from the lower surface 111E to the second upper surface 111B.

[0195] Viewed from above, the outer edge of the heat dissipation component 111 is rectangular. This rectangle has a long side and a short side. In the illustrated heat dissipation component 111, the direction of the long side is the same as the Y-direction, and the direction of the short side is the same as the X-direction.

[0196] One or more insulating components 131 are disposed on the heat dissipation component 111. The one or more insulating components 131 include a first insulating component 131A disposed on one or more second upper surfaces 111B.

[0197] Multiple electrode components 121 are disposed on the first insulating component 131A. The multiple electrode components 121 are disposed in multiple mutually separated regions. The heat dissipation component 111 is separated from each electrode component 121. Each electrode component 121 is insulated from the heat dissipation component 111 via the first insulating component 131A.

[0198] The plurality of electrode components 121 include one or more first electrode components 121A and one or more second electrode components 121B. In top view, a first upper surface 111A is disposed between the first electrode component 121A and the second electrode component 121B. In top view, the first electrode component 121A, the first upper surface 111A, and the second electrode component 121B are arranged sequentially.

[0199] The wiring board 101 may have one or more dummy electrode components 151. The dummy electrode section 101I includes one or more dummy electrode components 151. It should be noted that part or all of the dummy electrode section 101I can be formed by electrode components 121.

[0200] One or more dummy electrode components 151 are disposed on the first insulating component 131A. In a top view, a first upper surface 111A can be disposed between the first electrode component 121A and the dummy electrode component 151. In a top view, the first upper surface 111A can be disposed between the dummy electrode component 151 and the second electrode component 121B.

[0201] Each electrode component 121 has an upper surface 122A and one or more side surfaces 122B. In a top view, the first upper surface 111A of the heat dissipation component 111 is separated from the upper surface 122A of each electrode component 121. One or more electrode components 121 have a side surface 122B opposite to the first side surface 111C of the heat dissipation component 111.

[0202] One or more insulating components 131 include a second insulating component 131B disposed between the heat dissipation component 111 and each electrode component 121. One or each of the first side surfaces 111C of the heat dissipation component 111 is covered by the second insulating component 131B. One or each of the electrode components 121 has a side surface 122B, i.e., the side surface 122B opposite to the first side surface 111C, covered by the second insulating component 131B. The second insulating component 131B fills the space between the first side surface 111C and the side surface 122B.

[0203] The second insulating component 131B covers a portion of the first upper surface 111A that is continuous from the first side surface 111C of the heat dissipation component 111. The second insulating component 131B also covers a portion of the upper surface 122A that is continuous from the side surface 122B of the electrode component 121.

[0204] When viewed from above, the second insulating member 131B is partially disposed on the electrode member 121. Through the second insulating member 131B, a connected electrode member 121 is visually divided into multiple regions. In this way, a wiring pattern 101G is formed on the upper surface 101A of the wiring substrate 101.

[0205] One or more metal layers 141 are disposed on the heat dissipation component 111 or the electrode component 121. A first metal layer 141A is disposed on the heat dissipation component 111. A second metal layer 141B is disposed on the electrode component 121. The upper surface of one or more metal layers 141 forms a portion of the upper surface 101A of the wiring substrate 101. The upper surface of the insulating component 131 forms another portion of the upper surface 101A of the wiring substrate 101.

[0206] The main material of the heat dissipation component 111 can be a metallic material. For example, single metals such as Cu, Ag, Al, Ni, Rh, Au, Ti, Pt, Pd, Mo, Cr, and W, or alloys containing these metals, can be used as the main material of the heat dissipation component 111. The heat dissipation component 111 is preferably formed of a material with excellent heat dissipation properties. The heat dissipation component 111 may be formed containing more than 95% by mass of copper.

[0207] The main material of the electrode component 121 can be a metallic material. For example, single metals such as Cu, Ag, Al, Ni, Rh, Au, Ti, Pt, Pd, Mo, Cr, and W, or alloys containing these metals, can be used as the main material of the electrode component 121.

[0208] The insulating component 131 is formed of an insulating material. For example, polyimide can be used as the main material of the insulating component 131. Alternatively, the insulating component 131 can use glass epoxy resin, liquid crystal polymer, or the like as the main material, which is formed by impregnating one or more sheets of glass cloth with a thermosetting insulating resin such as epoxy resin and then curing the thermosetting insulating resin. For example, the first insulating component 131A can be made of film-like polyimide, and the second insulating component 131B can be made of a solder resist or other corrosion resist.

[0209] The main material of the metal layer 141 can be, for example, a metallic material such as Au, Ag, Cu, Pt, Ni, Pd, or an alloy containing one of them. The metal layer 141 can be formed by performing a plating process.

[0210] (Connector 201)

[0211] Connector 201 has an insertion port for inserting connector cables.

[0212] (Thermistor 301)

[0213] Thermistor 301 can be used as a temperature measuring element.

[0214] Next, the light-emitting device 1 will be described.

[0215] (Light-emitting device 1)

[0216] In the light-emitting device 1, one or more light-emitting elements 20 are disposed within the internal space of the package 10. One or more light-emitting elements 20 are disposed on the substrate 11. One or more light-emitting elements 20 are disposed on the first upper surface 11A of the substrate 11.

[0217] The light-emitting device 1 may include multiple light-emitting elements 20. In other words, one or more light-emitting elements 20 included in the light-emitting device 1 may be composed of multiple light-emitting elements 20. The multiple light-emitting elements 20 are arranged in one direction. This direction is referred to as the first direction. In the illustrated light-emitting device 1, the multiple light-emitting elements 20 are arranged in the X direction. In addition, the first direction is the same as the positive or negative direction of X.

[0218] In the light-emitting device 1, one or more light-emitting elements 20 emit light in a second direction. The second direction is perpendicular to the first direction when viewed from above. One or more light-emitting elements 20 emit light from the light-emitting surface 22 in a direction parallel to the first upper surface 11A. In one or more light-emitting elements 20, the light emitted from the light-emitting surface 22 traveling along the optical axis is parallel to the first upper surface 11A. It should be noted that this parallelism includes a difference of ±3 degrees.

[0219] A first side of the substrate 11 extends away from one or more light-emitting elements 20 in a certain direction, and a second side of the substrate 11 extends away from one or more light-emitting elements 20 in a direction opposite to that direction. In a top view, one or more light-emitting elements 20 are disposed between the first side and the second side of the substrate 11. The first side of the substrate 11 is located at a position extending away from one or more light-emitting elements 20 in the first direction, and the second side of the substrate 11 is located at a position extending away from one or more light-emitting elements 20 in a direction opposite to the first direction.

[0220] The light-emitting device 1 may have two or more light-emitting elements 20 that emit light with different peak wavelengths. Figure 7A This is an example of a light-emitting device 1 that has multiple light-emitting elements 20 that emit light with the same emission peak wavelength. It should be noted that the same emission peak wavelength here means that the difference in emission peak wavelengths is within 15 nm. Figure 7B This is an example of a light-emitting device 1 that has multiple light-emitting elements 20 emitting light at a first emission peak wavelength and multiple light-emitting elements 20 emitting light at a second emission peak wavelength. It should be noted that the difference between the first emission peak wavelength and the second emission peak wavelength is 30 nm or more.

[0221] The light-emitting device 1 may have two or more light-emitting elements 20 that emit light of different colors. Figure 7A It is an example of a light-emitting device 1 that has multiple light-emitting elements 20 that emit light of the same color. Figure 7B This is an example of a light-emitting device 1 that includes multiple light-emitting elements 20 emitting light of a first color and multiple light-emitting elements 20 emitting light of a second color. It should be noted that the first color and the second color are different colors.

[0222] In the light-emitting device 1, one or more light-emitting elements 20 are disposed on one or more auxiliary mounting substrates 30. One or more light-emitting elements 20 are disposed on the substrate 11 via the auxiliary mounting substrate 30. For each of the one or more light-emitting elements 20 included in the light-emitting device 1, an auxiliary mounting substrate 30 is provided relative to each light-emitting element 20.

[0223] In the light-emitting device 1, one or more reflective elements 40 are disposed within the internal space of the package 10. One or more reflective elements 40 are disposed on the substrate 11. One or more reflective elements 40 are disposed on the first upper surface 11A of the substrate 11. The light-emitting device 1 may have multiple reflective elements 40. The multiple reflective elements 40 are arranged in one direction. The multiple reflective elements 40 are arranged in the first direction.

[0224] One or more reflective elements 40 reflect light emitted from one or more light-emitting elements 20. The light reflected by the one or more reflective elements 40 travels in a direction away from the first upper surface 11A. The one or more reflective elements 40 are positioned to exit from the one or more light-emitting elements 20 in a second direction. For each of the one or more light-emitting elements 20 included in the light-emitting device 1, one reflective element 40 is provided.

[0225] In the light-emitting device 1, one or more protective elements 50 are disposed within the internal space of the package 10. The one or more protective elements 50 protect one or more light-emitting elements 20. The one or more protective elements 50 are disposed on the substrate 11 or on the upper surface 31A of the auxiliary mounting substrate 30.

[0226] The light-emitting device 1 includes multiple wirings 60 for electrically connecting one or more light-emitting elements 20 to the package 10. The multiple wirings 60 of the light-emitting device 1 include multiple wirings 60 with one end of the junction connected to the light-emitting element 20.

[0227] The light-emitting device 1 includes multiple wirings 60, one end of which is connected to the upper wiring portion 12A. The light-emitting device 1 also includes one or more wirings 60, one end of which is connected to the upper wiring portion 12A located on the first side of the substrate 11. Finally, the light-emitting device 1 includes one or more wirings 60, one end of which is connected to the upper wiring portion 12A located on the second side of the substrate 11.

[0228] One or more light-emitting elements 20 are electrically connected to the wiring portion 12 of the package 10. One or more protective elements 50 are electrically connected to the wiring portion 12 of the package 10. The light-emitting elements 20 and the protective elements 50 are electrically connected to the wiring portion 12 of the package 10.

[0229] One or more light-emitting elements 20 are electrically connected to two upper wiring sections 12A. One or more light-emitting elements 20 are electrically connected, for example, to a first upper wiring section 12A1 and a second upper wiring section 12A2. One or more light-emitting elements 20 are also electrically connected, for example, to a first upper wiring section 12A1 and a third upper wiring section 12A3.

[0230] In the light-emitting device 1, the upper wiring portion 12A provided on the first side of the substrate 11, the upper wiring portion 12A provided on the second side of the substrate 11, and one or more light-emitting elements 20 can be electrically connected in a current path. Figure 7A The light-emitting device 1, in which all the light-emitting elements 20 are electrically connected in one current path, is an example of the above-described electrical connection method.

[0231] In the light-emitting device 1, two upper wiring portions 12A and one or more light-emitting elements 20 provided on the first side of the substrate 11 can be electrically connected in one current path. Additionally, in the light-emitting device 1, two upper wiring portions 12A and one or more light-emitting elements 20 provided on the second side of the substrate 11 can be electrically connected in one current path. Figure 7B A light-emitting device 1, in which one or more first light-emitting elements 20A are electrically connected in one current path and one or more second light-emitting elements 20B are electrically connected in another current path, is an example of the above-described electrical connection method. It should be noted that both the first light-emitting element 20A and the second light-emitting element 20B are light-emitting elements 20.

[0232] In the light-emitting device 1, the optical component 70 is fixed to the package 10. The optical component 70 is fixed to the package 10 outside the package 10, rather than inside the package 10. The optical component 70 is engaged with the cover 14.

[0233] An optical component 70 is disposed above one or more light-emitting elements 20. The optical component 70 is disposed above one or more reflective components 40. Light emitted from the one or more light-emitting elements 20 exits from the package 10 and enters the optical component 70.

[0234] Light incident on the optical component 70 is given an optical effect by the optical working surface 71D of the optical component 70 and is emitted from the optical component 70. For one or more light-emitting elements 20 included in the light-emitting device 1, an optical working surface 71D is provided for each light-emitting element 20.

[0235] For example, the light-emitting device 1 emits light composed of multiple collimated partial lights. It should be noted that in the light-emitting device 1 having multiple light-emitting elements 20, the light emitted from one light-emitting element 20 corresponds to one partial light.

[0236] Next, the light-emitting module 901 will be described.

[0237] (Light-emitting module 901)

[0238] In the light-emitting module 901, one or more light-emitting devices 1 are disposed on the wiring substrate 101. One or more light-emitting devices 1 are disposed on the upper surface 101A of the wiring substrate 101. One or more light-emitting devices 1 are bonded to the electrode portion 101E of the wiring substrate 101. One or more light-emitting devices 1 are bonded to the electrode portion 101E by a conductive adhesive.

[0239] One or more light-emitting devices 1 are coupled to the heat dissipation portion 101D of the wiring board 101. As a result, the heat generated from the light-emitting element 20 can be released to the heat dissipation portion 101D, and light can be emitted efficiently.

[0240] In one or more light-emitting devices 1, a plurality of lower wiring portions 12B are joined to a wiring substrate 101. The plurality of lower wiring portions 12B are respectively joined to a plurality of regions that are externally separated from each other on the wiring substrate 101. As a result, the mounting accuracy of the light-emitting device 1 can be improved.

[0241] Of the plurality of lower wiring portions 12B provided in the light-emitting device 1, those lower wiring portions 12B that are not required for electrical connection with one or more light-emitting elements 20 may be joined to the dummy electrode portion 101I. That is, the regions in the electrode portion 101E and the regions in the dummy electrode portion 101I may be included in the plurality of regions in which the plurality of lower wiring portions 12B are joined respectively. By providing the dummy electrode portion 101I, the mounting accuracy of the light-emitting device 1 can be improved. Alternatively, the bonding strength between the light-emitting device 1 and the wiring board 101 can be improved.

[0242] The light-emitting module 901 can include multiple light-emitting devices 1, including a first light-emitting device 1A and a second light-emitting device 1B. The first light-emitting device 1A and the second light-emitting device 1B are arranged side by side. In a top view, the direction in which the first light-emitting device 1A and the second light-emitting device 1B are arranged is perpendicular to the direction in which the first electrode component 121A and the second electrode component 121B are arranged. In the illustrated light-emitting module 901, the first light-emitting device 1A and the second light-emitting device 1B are arranged along the Y direction, and the first electrode component 121A and the second electrode component 121B are arranged along the X direction.

[0243] In relation to the light-emitting element 20 of the first light-emitting device 1A, the electrode portion 101E of the wiring board 101 has a first region that is engaged with the lower wiring portion 12B that becomes the first electrode, and a second region that is engaged with the lower wiring portion 12B that becomes the second electrode.

[0244] In relation to the light-emitting element of the second light-emitting device 1B, the electrode portion 101E of the wiring board 101 has a third region that is joined to the lower wiring portion 12B that serves as the first electrode, and a fourth region that is joined to the lower wiring portion 12B that serves as the second electrode. For example, the first electrode and the second electrode are the positive electrode and the negative electrode, respectively.

[0245] In the light-emitting module 901, a connector 201 is disposed on the wiring board 101. The connector 201 engages with the electrode portion 101E of the wiring board 101. The connector 201 engages with a plurality of electrode components 121. The connector 201 is disposed at a position away from the light-emitting device 1 in the direction in which the first electrode component 121A is provided.

[0246] The connector 201 is electrically connected to one or more light-emitting devices 1 via the electrode portion 101E of the wiring board 101. Thus, power can be supplied to one or more light-emitting devices 1 using the connector.

[0247] In the light-emitting module 901, a thermistor 301 is disposed on the wiring board 101. The thermistor 301 is bonded to the electrode portion 101E of the wiring board 101. The thermistor 301 is bonded to a plurality of electrode components 121. In top view, the thermistor 301 is disposed between one or more light-emitting devices 1 and connectors 201. As a result, the distance between the thermistor 301 and the light-emitting device 1 is shortened, which improves the accuracy of the temperature detection of the light-emitting device 1 by the thermistor 301.

[0248] Hereinafter, several variations of the light-emitting module 901 comprising a substrate 11 and one or more light-emitting elements 20 are disclosed. Each variation of the light-emitting module 901 is distinguished as a first light-emitting module 901A, a second light-emitting module 901B, a third light-emitting module 901C, and a fourth light-emitting module 901D.

[0249] (First light-emitting module 901A)

[0250] The first light-emitting module 901A includes a first light-emitting device 1A, a second light-emitting device 1B, and a first wiring board 1011. The first wiring board 1011 is one embodiment of the wiring board 101. In the first light-emitting module 901A, one or more light-emitting elements 20 of the first light-emitting device 1A are connected in series with one or more light-emitting elements 20 of the second light-emitting device 1B.

[0251] The first region of the electrode section 101E has a first electrode component 121A, the second region of the electrode section 101E has a second electrode component 121B, the third region of the electrode section 101E has a second electrode component 121B, and the fourth region of the electrode section 101E has a first electrode component 121A.

[0252] The second and third regions of the electrode portion 101E are formed by a second electrode component 121B. The first electrode component 121A of the first region of the electrode portion 101E is different from the first electrode component 121A of the fourth region of the electrode portion 101E. The first wiring board 1011 has two first electrode components 121A and one second electrode component 121B.

[0253] The first light-emitting device 1A includes one or more light-emitting elements 20 that are electrically connected to the upper wiring portion 12A on the first side surface of the substrate 11 and the upper wiring portion 12A on the second side surface of the substrate 11. The first light-emitting device 1A also includes one or more light-emitting elements 20 that are electrically connected to the lower wiring portion 12B on the first side surface of the substrate 11 and the lower wiring portion 12B on the second side surface of the substrate 11. The same description applies to the second light-emitting device 1B.

[0254] In the first light-emitting device 1A, the upper wiring portion 12A provided on the first side of the substrate 11, the upper wiring portion 12A provided on the second side of the substrate 11, the lower wiring portion 12B provided on the first side of the substrate 11, the lower wiring portion 12B provided on the second side of the substrate 11, and one or more light-emitting elements 20 can be electrically connected in a current path. The description in this paragraph is the same for the second light-emitting device 1B.

[0255] For example, in the first light-emitting device 1A, the upper wiring portion 12A provided on the first side of the substrate 11 is either a first upper wiring portion 12A1 or a second upper wiring portion 12A2. The upper wiring portion 12A provided on the second side of the substrate 11 is either a third upper wiring portion 12A3 or a fourth upper wiring portion 12A4. The lower wiring portion 12B provided on the first side of the substrate 11 is either a first lower wiring portion 12B1 or a second lower wiring portion 12B2. The lower wiring portion 12B provided on the second side of the substrate 11 is either a fourth lower wiring portion 12B4 or a fifth lower wiring portion 12B5. The description in this paragraph is the same for the second light-emitting device 1B.

[0256] In the first light-emitting module 901A, a plurality of electrode components 121 include an electrode component 121 that is engaged with a lower wiring portion 12B provided on the first side side of the substrate 11 of the first light-emitting device 1A, and an electrode component 121 that is engaged with a lower wiring portion 12B provided on the second side side of the substrate 11 of the first light-emitting device 1A.

[0257] In the first light-emitting module 901A, a plurality of electrode components 121 include an electrode component 121 that is engaged with a lower wiring portion 12B provided on the first side side of the substrate 11 of the second light-emitting device 1B, and an electrode component 121 that is engaged with a lower wiring portion 12B provided on the second side side of the substrate 11 of the second light-emitting device 1B.

[0258] For example, in an embodiment of the first light-emitting module 901A, it is considered that one or more light-emitting elements 20 provided by the first light-emitting device 1A and one or more light-emitting elements 20 provided by the second light-emitting device 1B are both light-emitting elements 20 that emit light of the same color.

[0259] (Second light-emitting module 901B)

[0260] The second light-emitting module 901B includes a first light-emitting device 1A, a second light-emitting device 1B, and a second wiring board 1012. The second wiring board 1012 is one embodiment of the wiring board 101. In the second light-emitting module 901B, one or more light-emitting elements 20 of the first light-emitting device 1A are connected in series, and one or more light-emitting elements 20 of the second light-emitting device 1B are connected in series. However, the first light-emitting device 1A and the second light-emitting device 1B are not electrically connected. Viewed from above, the first light-emitting device 1A and the second light-emitting device 1B are arranged with their orientations reversed by 180 degrees.

[0261] The first region of the electrode section 101E has a first electrode component 121A, the second region of the electrode section 101E has a first electrode component 121A, the third region of the electrode section 101E has a first electrode component 121A, and the fourth region of the electrode section 101E has a first electrode component 121A.

[0262] It should be noted that the first electrode of the first light-emitting device 1A and the first electrode of the second light-emitting device 1B may not be the same electrode. For example, the first electrode and the second electrode of the first light-emitting device 1A may be positive and negative electrodes, respectively, while the first electrode and the second electrode of the second light-emitting device 1B may be negative and positive electrodes.

[0263] The second wiring board 1012 does not have a second electrode component 121B. In the second wiring board 1012, a dummy electrode component 151 is provided at the location in the first wiring board 1011 where the second electrode component 121B is provided. In a top view, a first upper surface 111A is disposed between the first electrode component 121A and the dummy electrode component 151.

[0264] The first electrode component 121A in the first region of the electrode section 101E, the first electrode component 121A in the second region of the electrode section 101E, the first electrode component 121A in the third region of the electrode section 101E, and the first electrode component 121A in the fourth region of the electrode section 101E are different first electrode components 121A. The second wiring board 1012 has four first electrode components 121A.

[0265] One or more light-emitting elements 20 of the first light-emitting device 1A are electrically connected to the upper wiring portion 12A on the first side of the substrate 11 and the upper wiring portion 12A on the second side of the substrate 11. One or more light-emitting elements 20 of the first light-emitting device 1A are electrically connected to two lower wiring portions 12B on the first side of the substrate 11.

[0266] In the first light-emitting device 1A, the upper wiring portion 12A provided on the first side of the substrate 11, the upper wiring portion 12A provided on the second side of the substrate 11, the two lower wiring portions 12B provided on the first side of the substrate 11, and one or more light-emitting elements 20 can be electrically connected in a current path.

[0267] For example, in the first light-emitting device 1A, the upper wiring portion 12A provided on the first side of the substrate 11 is either a first upper wiring portion 12A1 or a second upper wiring portion 12A2. The upper wiring portion 12A provided on the second side of the substrate 11 is either a third upper wiring portion 12A3. The two lower wiring portions 12B provided on the first side of the substrate 11 are either a first lower wiring portion 12B1 or a second lower wiring portion 12B2, and a sixth lower wiring portion 12B6.

[0268] One or more light-emitting elements 20 of the second light-emitting device 1B are electrically connected to the upper wiring portion 12A on the first side of the substrate 11 and the upper wiring portion 12A on the second side of the substrate 11. One or more light-emitting elements 20 of the second light-emitting device 1B are electrically connected to the two lower wiring portions 12B on the second side of the substrate 11.

[0269] In the second light-emitting device 1B, the upper wiring portion 12A provided on the first side of the substrate 11, the upper wiring portion 12A provided on the second side of the substrate 11, the two lower wiring portions 12B provided on the second side of the substrate 11, and one or more light-emitting elements 20 can be electrically connected in a current path.

[0270] For example, in the second light-emitting device 1B, the upper wiring portion 12A provided on the first side of the substrate 11 is a first upper wiring portion 12A1. The upper wiring portion 12A provided on the second side of the substrate 11 is a third upper wiring portion 12A3 or a fourth upper wiring portion 12A4. The two lower wiring portions 12B provided on the second side of the substrate 11 are a fourth lower wiring portion 12B4 or a fifth lower wiring portion 12B5, and a third lower wiring portion 12B3.

[0271] In the second light-emitting module 901B, a plurality of electrode components 121 include: an electrode component 121 electrically connected to an upper wiring portion 12A disposed on a first side surface of the substrate 11 of the first light-emitting device 1A and engaged with a lower wiring portion 12B disposed on the first side surface of the substrate 11; and an electrode component 121 electrically connected to an upper wiring portion 12A disposed on a second side surface of the substrate 11 of the first light-emitting device 1A and engaged with a lower wiring portion 12B disposed on the first side surface of the substrate 11.

[0272] In the second light-emitting module 901B, a plurality of electrode components 121 include: an electrode component 121 electrically connected to an upper wiring portion 12A disposed on a first side surface of the substrate 11 of the second light-emitting device 1B and engaged with a lower wiring portion 12B disposed on a second side surface of the substrate 11; and an electrode component 121 electrically connected to an upper wiring portion 12A disposed on a second side surface of the substrate 11 of the second light-emitting device 1B and engaged with a lower wiring portion 12B disposed on a second side surface of the substrate 11.

[0273] For example, in an embodiment of the second light-emitting module 901B, consider a method in which light of a first color is emitted from one or more light-emitting elements 20 of the first light-emitting device 1A, and light of a second color different from the first color is emitted from one or more light-emitting elements 20 of the second light-emitting device 1B.

[0274] (Third light-emitting module 901C)

[0275] The third light-emitting module 901C includes a first light-emitting device 1A, a second light-emitting device 1B, and a third wiring board 1013. The third wiring board 1013 is one embodiment of the wiring board 101. In the third light-emitting module 901C, one or more light-emitting elements 20 of the first light-emitting device 1A are connected in series. One or more first light-emitting elements 20A of the second light-emitting device 1B are connected in series, and one or more second light-emitting elements 20B are connected in series. The first light-emitting device 1A and the second light-emitting device 1B are not electrically connected. The first light-emitting elements 20A and the second light-emitting elements 20B of the second light-emitting device 1B are not electrically connected.

[0276] In the third light-emitting module 901C, when viewed from above, the arrangement of the light-emitting element 20 and the reflective component 40 in the first light-emitting device 1A differs from that in the second light-emitting device 1B by 180 degrees. In other words, in the first light-emitting device 1A, the reflective component 40 is positioned away from the light-emitting element 20 in a certain direction, while in the second light-emitting device 1B, the reflective component 40 is positioned away from the light-emitting element 20 in the opposite direction.

[0277] In addition to having a third region that is connected to the lower wiring portion 12B that serves as the first electrode and a fourth region that is connected to the lower wiring portion 12B that serves as the second electrode in relation to the first light-emitting element 20A of the second light-emitting device 1B, the electrode portion 101E of the third wiring substrate 1013 also has a fifth region that is connected to the lower wiring portion 12B that serves as the first electrode and a sixth region that is connected to the lower wiring portion 12B that serves as the second electrode in relation to the second light-emitting element 20B of the second light-emitting device 1B.

[0278] The electrode section 101E has a first electrode component 121A in a first region and a second electrode component 121B in a second region. The electrode section 101E has a first electrode component 121A in a third region and a second electrode component 121B in a fourth region. The electrode section 101E has a first electrode component 121A in a fifth region and a first electrode component 121A in a sixth region.

[0279] In the third wiring board 1013, a dummy electrode component 151 is provided in a portion of the location in the first wiring board 1011 where the second electrode component 121B is provided. In a top view, a first upper surface 111A is disposed between the first electrode component 121A and the dummy electrode component 151.

[0280] The first electrode component 121A in the first region of the electrode section 101E, the first electrode component 121A in the third region of the electrode section 101E, the first electrode component 121A in the fifth region of the electrode section 101E, and the first electrode component 121A in the sixth region of the electrode section 101E are different first electrode components 121A. The third wiring board 1013 has three first electrode components 121A relative to the second light-emitting device 1B.

[0281] One or more light-emitting elements 20 of the first light-emitting device 1A are electrically connected to the upper wiring portion 12A on the first side of the substrate 11 and the upper wiring portion 12A on the second side of the substrate 11. One or more light-emitting elements 20 of the first light-emitting device 1A are electrically connected to the lower wiring portion 12B on the first side of the substrate 11 and the lower wiring portion 12B on the second side of the substrate 11.

[0282] In the first light-emitting device 1A, the upper wiring portion 12A provided on the first side of the substrate 11, the upper wiring portion 12A provided on the second side of the substrate 11, the lower wiring portion 12B provided on the first side of the substrate 11, the lower wiring portion 12B provided on the second side of the substrate 11, and one or more light-emitting elements 20 can be electrically connected in a current path.

[0283] For example, in the first light-emitting device 1A, the upper wiring portion 12A provided on the first side of the substrate 11 is either a first upper wiring portion 12A1 or a second upper wiring portion 12A2. The upper wiring portion 12A provided on the second side of the substrate 11 is either a third upper wiring portion 12A3. The lower wiring portion 12B provided on the first side of the substrate 11 is either a first lower wiring portion 12B1 or a second lower wiring portion 12B2, or a sixth lower wiring portion 12B6.

[0284] One or more first light-emitting elements 20A of the second light-emitting device 1B are electrically connected to two upper wiring portions 12A provided on the first side of the substrate 11. One or more first light-emitting elements 20A of the second light-emitting device 1B are electrically connected to two lower wiring portions 12B provided on the first side of the substrate 11.

[0285] One or more second light-emitting elements 20B of the second light-emitting device 1B are electrically connected to two upper wiring portions 12A provided on the second side of the substrate 11. One or more second light-emitting elements 20B of the second light-emitting device 1B are electrically connected to the lower wiring portion 12B provided on the first side of the substrate 11 and the lower wiring portion 12B provided on the second side of the substrate 11.

[0286] In the second light-emitting device 1B, two upper wiring portions 12A provided on the first side of the substrate 11, two lower wiring portions 12B provided on the first side of the substrate 11, and one or more first light-emitting elements 20A can be electrically connected in a current path.

[0287] In the second light-emitting device 1B, the two upper wiring portions 12A provided on the second side of the substrate 11, the lower wiring portion 12B provided on the first side of the substrate 11, the lower wiring portion 12B provided on the second side of the substrate 11, and one or more second light-emitting elements 20B can be electrically connected in a current path.

[0288] For example, in the second light-emitting device 1B, among the wiring portions 12 that are electrically connected to one or more first light-emitting elements 20A, the two upper wiring portions 12A provided on the first side of the substrate 11 are the first upper wiring portion 12A1 and the second upper wiring portion 12A2, and the two lower wiring portions 12B provided on the first side of the substrate 11 are the first lower wiring portion 12B1 and the second lower wiring portion 12B2.

[0289] For example, in the second light-emitting device 1B, among the wiring sections 12 that are electrically connected to one or more second light-emitting elements 20B, the two upper wiring sections 12A provided on the second side of the substrate 11 are the third upper wiring section 12A3 and the fourth upper wiring section 12A4, the lower wiring section 12B provided on the first side of the substrate 11 is the sixth lower wiring section 12B6, and the lower wiring section 12B provided on the second side is the fifth lower wiring section 12B5.

[0290] In the third light-emitting module 901C, a plurality of electrode components 121 include an electrode component 121 that is engaged with a lower wiring portion 12B provided on the first side side of the substrate 11 of the first light-emitting device 1A, and an electrode component 121 that is engaged with a lower wiring portion 12B provided on the second side side of the substrate 11 of the first light-emitting device 1A.

[0291] In the third light-emitting module 901C, a plurality of electrode components 121 include two electrode components 121 that are electrically connected to one or more first light-emitting elements 20A, one of which is engaged with one of the two lower wiring portions 12B provided on the first side side of the base 11 of the second light-emitting device 1B, and the other of which is engaged with the other of the two lower wiring portions 12B provided on the first side side of the base 11 of the second light-emitting device 1B.

[0292] In the third light-emitting module 901C, the plurality of electrode components 121 include: an electrode component 121 electrically connected to one or more second light-emitting elements 20B and engaged with a lower wiring portion 12B disposed on the first side side of the substrate 11 of the second light-emitting device 1B; and an electrode component 121 engaged with a lower wiring portion 12B disposed on the second side side of the substrate 11 of the second light-emitting device 1B.

[0293] For example, in the embodiment of the third light-emitting module 901C, it is considered to independently connect and drive light-emitting elements that emit three different colors of light. The three different colors are, for example, red, green, and blue.

[0294] (Fourth light-emitting module 901D)

[0295] The fourth light-emitting module 901D includes a first light-emitting device 1A, a second light-emitting device 1B, and a fourth wiring board 1014. The fourth wiring board 1014 is one embodiment of the wiring board 101. In the fourth light-emitting module 901D, one or more light-emitting elements 20 of the first light-emitting device 1A are connected in series. One or more first light-emitting elements 20A of the second light-emitting device 1B are connected in series, and one or more second light-emitting elements 20B are connected in series. The first light-emitting device 1A and the second light-emitting device 1B are not electrically connected. The first light-emitting elements 20A and the second light-emitting elements 20B of the second light-emitting device 1B are not electrically connected.

[0296] In the fourth light-emitting module 901D, when viewed from above, the arrangement of the light-emitting element 20 and the reflective component 40 in the first light-emitting device 1A is the same as the arrangement of the light-emitting element 20 and the reflective component 40 in the second light-emitting device 1B. In other words, in the first light-emitting device 1A, the reflective component 40 is positioned away from the light-emitting element 20 in a certain direction, and in the second light-emitting device 1B, the reflective component 40 is positioned away from the light-emitting element 20 in the same direction.

[0297] In addition to having a third region that is connected to the lower wiring portion 12B that serves as the first electrode and a fourth region that is connected to the lower wiring portion 12B that serves as the second electrode in relation to the first light-emitting element 20A of the second light-emitting device 1B, the electrode portion 101E of the fourth wiring substrate 1014 also has a fifth region that is connected to the lower wiring portion 12B that serves as the first electrode and a sixth region that is connected to the lower wiring portion 12B that serves as the second electrode in relation to the second light-emitting element 20B of the second light-emitting device 1B.

[0298] The electrode section 101E has a first electrode component 121A in a first region and a second electrode component 121B in a second region. The electrode section 101E has a first electrode component 121A in a third region and a second electrode component 121B in a fourth region. The electrode section 101E has a first electrode component 121A in a fifth region and a first electrode component 121A in a sixth region.

[0299] In the fourth wiring board 1014, a dummy electrode component 151 is provided in a portion of the location in the first wiring board 1011 where the second electrode component 121B is provided. In a top view, a first upper surface 111A is disposed between the first electrode component 121A and the dummy electrode component 151.

[0300] The first electrode component 121A in the first region of the electrode section 101E, the first electrode component 121A in the third region of the electrode section 101E, the first electrode component 121A in the fifth region of the electrode section 101E, and the first electrode component 121A in the sixth region of the electrode section 101E are different first electrode components 121A. The fourth wiring board 1014 has three first electrode components 121A relative to the second light-emitting device 1B.

[0301] One or more light-emitting elements 20 of the first light-emitting device 1A are electrically connected to the upper wiring portion 12A on the first side of the substrate 11 and the upper wiring portion 12A on the second side of the substrate 11. One or more light-emitting elements 20 of the first light-emitting device 1A are electrically connected to the lower wiring portion 12B on the first side of the substrate 11 and the lower wiring portion 12B on the first side of the substrate 11.

[0302] In the first light-emitting device 1A, the upper wiring portion 12A provided on the first side side of the substrate 11, the upper wiring portion 12A provided on the second side side of the substrate 11, the lower wiring portion 12B provided on the first side side of the substrate 11, the lower wiring portion 12B provided on the first side side of the substrate 11, and one or more light-emitting elements 20 can be electrically connected in a current path.

[0303] For example, in the first light-emitting device 1A, the upper wiring portion 12A provided on the first side of the substrate 11 is either a first upper wiring portion 12A1 or a second upper wiring portion 12A2. The upper wiring portion 12A provided on the second side of the substrate 11 is either a third upper wiring portion 12A3. The lower wiring portion 12B provided on the first side of the substrate 11 is either a first lower wiring portion 12B1 or a second lower wiring portion 12B2, or a sixth lower wiring portion 12B6.

[0304] One or more first light-emitting elements 20A of the second light-emitting device 1B are electrically connected to two upper wiring portions 12A provided on the first side of the substrate 11. One or more first light-emitting elements 20A of the second light-emitting device 1B are electrically connected to the lower wiring portion 12B provided on the first side of the substrate 11 and the lower wiring portion 12B provided on the second side of the substrate 11.

[0305] One or more second light-emitting elements 20B of the second light-emitting device 1B are electrically connected to two upper wiring portions 12A provided on the second side of the substrate 11. One or more second light-emitting elements 20B of the second light-emitting device 1B are electrically connected to two lower wiring portions 12B provided on the second side of the substrate 11.

[0306] In the second light-emitting device 1B, two upper wiring portions 12A provided on the first side of the substrate 11, a lower wiring portion 12B provided on the first side of the substrate 11, a lower wiring portion 12B provided on the second side of the substrate 11, and one or more first light-emitting elements 20A can be electrically connected in a current path.

[0307] In the second light-emitting device 1B, the two upper wiring portions 12A provided on the second side of the substrate 11, the two lower wiring portions 12B provided on the second side of the substrate 11, and one or more second light-emitting elements 20B can be electrically connected in a current path.

[0308] For example, in the second light-emitting device 1B, among the wiring portions 12 that are electrically connected to one or more first light-emitting elements 20A, the two upper wiring portions 12A provided on the first side of the substrate 11 are the first upper wiring portion 12A1 and the second upper wiring portion 12A2, the lower wiring portion 12B provided on the first side of the substrate 11 is the second lower wiring portion 12B2, and the lower wiring portion 12B provided on the second side of the substrate 11 is the third lower wiring portion 12B3.

[0309] For example, in the second light-emitting device 1B, among the wiring portions 12 that are electrically connected to one or more second light-emitting elements 20B, the two upper wiring portions 12A provided on the second side of the substrate 11 are the third upper wiring portion 12A3 and the fourth upper wiring portion 12A4, and the two lower wiring portions 12B provided on the second side of the substrate 11 are the fourth lower wiring portion 12B4 and the fifth lower wiring portion 12B5.

[0310] In the fourth light-emitting module 901D, a plurality of electrode components 121 include an electrode component 121 that is engaged with a lower wiring portion 12B provided on the first side side of the substrate 11 of the first light-emitting device 1A, and an electrode component 121 that is engaged with a lower wiring portion 12B provided on the second side side of the substrate 11 of the first light-emitting device 1A.

[0311] In the fourth light-emitting module 901D, the plurality of electrode components 121 include an electrode component 121 that is electrically connected to one or more first light-emitting elements 20A and is engaged with a lower wiring portion 12B disposed on the second side side of the substrate 11 of the second light-emitting device 1B, and an electrode component 121 that is engaged with a lower wiring portion 12B disposed on the first side side of the substrate 11 of the second light-emitting device 1B.

[0312] In the fourth light-emitting module 901D, a plurality of electrode components 121 include two electrode components 121 that are electrically connected to one or more second light-emitting elements 20B, one of which is engaged with one of the two lower wiring portions 12B provided on the second side side of the base 11 of the second light-emitting device 1B, and the other of which is engaged with the other of the two lower wiring portions 12B provided on the second side side of the base 11 of the second light-emitting device 1B.

[0313] For example, in an embodiment of the fourth light-emitting module 901D, it is considered to independently connect and drive light-emitting elements that emit three different colors of light. The three different colors could be, for example, red, green, and blue.

[0314] As described above, regarding the structure of the light-emitting element 20, the substrate 11 of the first embodiment can be used in light-emitting devices with different electrical connection methods. Figure 7A The light-emitting device 1 shown Figure 7B The light-emitting device 1 shown is shown on both sides.

[0315] In addition, like the first light-emitting device 1A of the first light-emitting module 901A and the second light-emitting device 1B of the third light-emitting module, the one or more light-emitting elements 20 provided by the light-emitting device 1 can be electrically connected through one current path or through two current paths, thus increasing the freedom of wiring design.

[0316] In addition, the number of current paths to be set varies depending on the number of light-emitting elements 20 that are to be driven independently. However, as with the second light-emitting device 1B of the third light-emitting module, two current paths can be set in one light-emitting device 1. Therefore, the number of light-emitting devices 1 required can be reduced according to the number of current paths required, which can help to miniaturize the overall device with one or more light-emitting devices 1.

[0317] Furthermore, even if the wiring portion 12 used has the same upper wiring portion 12A but a different lower wiring portion 12B, it is possible to use a common substrate 11, just like the first light-emitting device 1A of the first light-emitting module 901A and the first light-emitting device 1A of the second light-emitting module 901B.

[0318] In addition, the upper wiring section 12A and the lower wiring section 12B, which are usually provided on the same side, are electrically connected. As with the first light-emitting device 1A of the second light-emitting module 901B, the base 11 is designed to be able to utilize the upper wiring section 12A provided on both the first and second side sides and the two lower wiring sections 12B provided on one of the first or second side sides, thus allowing for a high degree of freedom in wiring design.

[0319] In addition, the upper wiring section 12A and the lower wiring section 12B, which are usually provided on the same side, are electrically connected. As with the second light-emitting device 1B of the third light-emitting module 901C, the base 11 is designed to be able to utilize the two upper wiring sections 12A provided on one of the first side or the second side and the wiring sections 12B provided on both the first side and the second side. Therefore, the wiring design has a high degree of freedom.

[0320] Furthermore, in the configuration of each light-emitting module 901 from the first light-emitting module 901A to the fourth light-emitting module 901D, a common substrate 11 can be used, which can increase the freedom of wiring design. It should be noted that, from the viewpoint of the freedom of wiring design for the configuration of multiple light-emitting modules 901, the light-emitting module 901 has two light-emitting devices 1, but it can also be said that the common substrate 11 is not used between the two light-emitting devices 1.

[0321] Furthermore, as shown in the light-emitting module 901 of the third light-emitting module 901C and the fourth light-emitting module 901D, the light-emitting module 901 can independently drive multiple light-emitting elements 20 that emit different light emission peak wavelengths or colors. For example, the light-emitting module 901 can independently control the emission of three light-emitting elements 20 that emit red, green, and blue light respectively.

[0322] Furthermore, by actively utilizing the lower wiring portion 12B provided on one of the first or second side sides, the first electrode component 121A can be easily used for electrical connection with the wiring substrate 101. Therefore, compared to the side from the second electrode component 121B toward the first electrode component 121A, the area ratio of the electrode component 121 to the wiring substrate 101 when viewed from above can be reduced, and miniaturization of the light-emitting module 901 can be achieved.

[0323] <Second Implementation>

[0324] The light-emitting module 901 of the second embodiment will be described. Figures 1 to 10 , Figure 12A , Figure 12B , Figures 15 to 18C , Figures 21 to 23B The accompanying drawing is an exemplary embodiment of the light-emitting module 901. Figure 1 This is a 3D view of the light-emitting module 901. Figure 2 This is a top view of the wiring board 101. It should be noted that... Figure 2 The wiring board 101 shown represents a schematic wiring board, and a fifth wiring board 1015, as one embodiment of the wiring board 101, is shown. Figure 2 The wiring board 101 shown is not completely identical. Figure 3 yes Figure 2 A schematic cross-sectional view of the wiring substrate 101 at section III-III. Figure 4 This is a three-dimensional view of the light-emitting device 1. Figure 5 This is a side view of the light-emitting device 1. Figure 6 yes Figure 4 A cross-sectional view of the light-emitting device 1 at section line VI-VI. Figure 7A This is a diagram showing an example of the constituent elements arranged in the internal space of the light-emitting device 1. Figure 7B This is a diagram showing another example of the constituent elements arranged in the internal space of the light-emitting device 1. Figure 8 This is a 3D view of package 10. Figure 9 yes Figure 8 A cross-sectional view of package 10 at the IX-IX section line.

[0325] Figure 10 This is a top view of base 11. Figure 21 This is a bottom view of the substrate 11 viewed from the top surface perspective. It should be noted that... Figure 21 The dashed line indicates the lower wiring section 12B when viewed from the upper surface side. Figure 12A yes Figure 10 A cross-sectional view of the substrate 11 at the XIIA-XIIA section line. Figure 12B It is Figure 12A The cross-sectional view is an enlarged cross-sectional view of the base 11 in the Z direction at a scale. Figure 22A This is a top view showing an example of the upper wiring portion 12A in the first layer 11S1 of the insulating layer 11S provided in the substrate 11. It should be noted that... Figure 22A The shaded line indicates the portion that does not overlap with the fourth layer 11S4 when viewed from above. Figure 22B It means having Figure 22A A top view of an example of an intermediate wiring portion 12C provided in the third layer 11S3 of the insulating layer 11S within the substrate 11 of the first layer 11S1. Figure 15This is a top view showing the appearance of the light-emitting elements 20, etc., arranged on the auxiliary mounting substrate 30. Figure 16 This is a side view showing the appearance of the light-emitting element 20 and the like arranged on the auxiliary mounting substrate 30.

[0326] Figure 17A This is a top view of the first light-emitting module 901A. Figure 17B This is a top view of the first wiring board 1011. Figure 17C This is a top view showing the internal space of the first light-emitting device 1A and the second light-emitting device 1B of the first light-emitting module 901A. Figure 18A This is a top view of the second light-emitting module 901B. Figure 18B This is a top view of the second wiring board 1012. Figure 18C This is a top view showing the internal space of the first light-emitting device 1A and the second light-emitting device 1B of the second light-emitting module 901B. Figure 19A This is a top view of the third light-emitting module 901C. Figure 19B This is a top view of the third wiring board 1013. Figure 19C This is a top view showing the internal space of the first light-emitting device 1A and the second light-emitting device 1B of the third light-emitting module 901C. Figure 23A This is a top view of the fifth wiring board 1015. Figure 23B This is a top view showing the internal space of the first light-emitting device 1A in the fifth light-emitting module. It should be noted that, regarding the light-emitting module 901, achieving a match between the XYZ directions of the first light-emitting device 1A and the XYZ directions of the light-emitting module 901 does not necessarily mean achieving a match between the XYZ directions of the second light-emitting device 1B and the XYZ directions of the light-emitting module 901. Figure 23A The portion of the insulating component 131 that is positioned above the electrode component 121 has been removed. Figure 23B The lower wiring portion 12B is shown in perspective with a dashed line. Here, the fifth light-emitting module is a general term for the light-emitting modules 901 that correspond to both the third light-emitting module 901C and the fourth light-emitting module 901D in the first embodiment. Therefore, in Figure 23B In the diagram, since the second light-emitting device 1B can be installed in two orientations, it becomes a rough diagram with an uncertain orientation.

[0327] The description of the light-emitting module 901 and its constituent elements in the second embodiment described above, and the elements related to the light-emitting module 901... Figures 1 to 10 , Figure 12A , Figure 12B , Figures 15 to 18C , Figures 21 to 23B The entire description of the luminous module 901, after removing any potentially contradictory content from the attached diagram, also applies. All non-conflicting content will not be repeated here.

[0328] In the second embodiment, the lower wiring portion 12B electrically connected to the second upper wiring portion 12A2 and the lower wiring portion 12B electrically connected to the fourth upper wiring portion 12A4 are different from the light-emitting device 1 or the base 11 in the first embodiment.

[0329] In the first embodiment, the lower wiring section 12B electrically connected to the second upper wiring section 12A2 located on the first side is a lower wiring section 12B located on the first side, but in the second embodiment, it is a lower wiring section 12B located on the second side. Similarly, in the first embodiment, the lower wiring section 12B electrically connected to the second upper wiring section located on the second side is a lower wiring section 12B located on the second side, but in the second embodiment, it is a lower wiring section 12B located on the first side.

[0330] Even with this light-emitting device 1, the same method as the first light-emitting module 901A of the first embodiment can be achieved using the first wiring board 1011. Furthermore, the same method as the second light-emitting module 901B of the first embodiment can be achieved using the second wiring board 1012.

[0331] To achieve the same method as the third light-emitting module 901C in the first embodiment using such a light-emitting device 1, a fifth wiring board 1015 can be used. Similarly, to achieve the same method as the fourth light-emitting module 901D in the first embodiment using such a light-emitting device 1, a fifth wiring board 1015 can be used.

[0332] When using the light-emitting device 1 or the substrate 11 in the second embodiment, the same effect as described in the first embodiment can be obtained. Therefore, as the substrate 11, the second upper wiring portion 12A2 provided on the first side only needs to be electrically connected to the lower wiring portion 12B provided on either the first or second side. Similarly, the fourth upper wiring portion 12A4 provided on the second side only needs to be electrically connected to the lower wiring portion 12B provided on either the first or second side.

[0333] The various embodiments of the present invention have been described above, but the light-emitting module, light-emitting device, or substrate of the present invention are not strictly limited to the light-emitting module, light-emitting device, or substrate of each embodiment. That is, the present invention is not limited to the shape and structure of the light-emitting module, light-emitting device, or substrate disclosed in each embodiment. The present invention does not necessarily require all of its constituent elements to be applied. For example, if a part of the constituent elements of the light-emitting module, light-emitting device, or substrate disclosed in the embodiments is not described in the claims, the degree of design freedom of those skilled in the art, such as substitution, omission, shape modification, and material change, is recognized for that part of the constituent elements, and the invention described in the claims is applied based on this.

[0334] Based on the content described herein, the following technical matters are disclosed.

[0335] (Item 1) A substrate comprising: an upper surface; a lower surface; a first side surface; a second side surface opposite to or located on the opposite side of the first side surface; a plurality of upper wiring portions comprising, on the upper surface side, a first upper wiring portion disposed on the first side surface and a second upper wiring portion disposed on one side of the first side surface or the second side surface; and a plurality of lower wiring portions comprising, on the lower surface side, a first lower wiring portion disposed on the first side surface and electrically connected to the first upper wiring portion, a second lower wiring portion disposed on one side of the first side surface or the second side surface and electrically connected to the second upper wiring portion, and a third lower wiring portion disposed on the second side surface and electrically connected to the first upper wiring portion.

[0336] (Item 2) The substrate according to Item 1, wherein the second upper wiring portion is disposed on the first side side.

[0337] (Item 3) The substrate according to Item 2, wherein it comprises: a plurality of insulating layers including a first layer having the upper wiring portion and a second layer having the lower wiring portion; a plurality of intermediate wiring portions disposed between the first layer and the second layer, wherein the plurality of intermediate wiring portions includes a first intermediate wiring portion having a region extending from the first side side to the second side side and electrically connected to the first upper wiring portion, the first lower wiring portion and the third lower wiring portion.

[0338] (Item 4) The substrate according to Item 2, wherein it comprises a plurality of insulating layers, the plurality of insulating layers including a first layer on which the upper wiring portion is disposed and a second layer disposed on the first layer, wherein, in a top view, the first upper wiring portion has a first region overlapping with the second layer and a second region not overlapping with the second layer, and the first region has a region extending from the first side side to the second side side.

[0339] (Item 5) The substrate according to any one of items 2 to 4, wherein the plurality of upper wiring portions further include, on the upper surface side, a third upper wiring portion disposed on the second side side and a fourth upper wiring portion disposed on the second side side separate from the third upper wiring portion; and on the lower surface side, the plurality of lower wiring portions further include, on the lower surface side, a fourth lower wiring portion disposed on the second side side and electrically connected to the third upper wiring portion, a fifth lower wiring portion disposed on the second side side separate from the fourth lower wiring portion and electrically connected to the fourth upper wiring portion, and a sixth lower wiring portion disposed on the first side side separate from the fourth lower wiring portion and electrically connected to the third upper wiring portion.

[0340] (Item 6) The substrate according to Item 5, comprising: a first layer having the upper wiring portion thereon; a second layer having the lower wiring portion thereon; and a plurality of intermediate wiring portions disposed between the first layer and the second layer, the plurality of intermediate wiring portions comprising: a first intermediate wiring portion having a region extending from the first side side to the second side side and electrically connected to the first upper wiring portion, the first lower wiring portion and the third lower wiring portion; and a second intermediate wiring portion having a region extending from the first side side to the second side side and electrically connected to the third upper wiring portion, the fourth lower wiring portion and the sixth lower wiring portion.

[0341] (Item 7) The substrate according to Item 1, wherein the second upper wiring portion is disposed on the second side side.

[0342] (Item 8) The substrate according to Item 7, wherein it comprises: a plurality of insulating layers including a first layer having the upper wiring portion and a second layer having the lower wiring portion; a plurality of intermediate wiring portions disposed between the first layer and the second layer, the plurality of intermediate wiring portions including a first intermediate wiring portion having a region extending from the first side side to the second side side and electrically connected to the first upper wiring portion, the first lower wiring portion and the third lower wiring portion.

[0343] (Item 9) The substrate according to Item 7 or 8, wherein the plurality of lower wiring portions further includes a fourth lower wiring portion, which is disposed separately from the first lower wiring portion on the other side of the first side side or the second side side, and is electrically connected to the second upper wiring portion.

[0344] (Item 10) The substrate according to any one of items 7 to 9, wherein the plurality of upper wiring portions further include a third upper wiring portion disposed on the first side side on the upper surface side, and the plurality of lower wiring portions further include a fourth lower wiring portion disposed on the first side side separate from the first lower wiring portion and electrically connected to the third upper wiring portion on the lower surface side.

[0345] (Item 11) A light-emitting device comprising: a substrate as described in any one of items 1 to 10; and one or more light-emitting elements disposed on the substrate and electrically connected to the first upper wiring portion and the second upper wiring portion.

[0346] (Item 12) A light-emitting module comprising: a substrate as described in any one of items 2 to 6; one or more light-emitting elements disposed on the substrate and electrically connected to a first upper wiring portion and a second upper wiring portion; a wiring substrate having a plurality of electrode components and disposed on the substrate, the plurality of electrode components including an electrode component engaged with the third lower wiring portion and an electrode component engaged with the second lower wiring portion disposed on the first side side.

[0347] (Item 13) A light-emitting module comprising: a substrate as described in item 5 or 6; one or more first light-emitting elements disposed on the substrate and electrically connected to a first upper wiring portion and a second upper wiring portion; one or more second light-emitting elements disposed on the substrate and electrically connected to a third upper wiring portion and a fourth upper wiring portion; a wiring substrate having a plurality of electrode components and disposed on the substrate, the plurality of electrode components including an electrode component engaged with the third lower wiring portion, an electrode component engaged with the second lower wiring portion disposed on the first side side, an electrode component engaged with the fourth lower wiring portion, and an electrode component engaged with the fifth lower wiring portion disposed on the second side side.

[0348] (Item 14) A light-emitting module comprising: a substrate as described in any one of items 7 to 9; one or more light-emitting elements disposed on the substrate and electrically connected to a first upper wiring portion and a second upper wiring portion; a wiring substrate having a plurality of electrode components and disposed on the substrate, the plurality of electrode components including an electrode component engaged with the third lower wiring portion and an electrode component engaged with the second lower wiring portion disposed on the second side side.

[0349] (Item 15) A light-emitting module comprising: a first light-emitting device having: a first substrate, which is the substrate described in Item 10; one or more first light-emitting elements disposed on the first substrate and electrically connected to a first upper wiring portion and a second upper wiring portion of the first substrate; a second light-emitting device having: a second substrate, which is the substrate described in Item 10; one or more second light-emitting elements disposed on the second substrate and electrically connected to the first upper wiring portion and the third upper wiring portion of the second substrate; and a wiring substrate having a plurality of electrodes disposed on the first substrate and the second substrate, the plurality of electrode components including an electrode component engaged with a first lower wiring portion of the first substrate, an electrode component engaged with a second lower wiring portion of the first substrate disposed on a second side of the first substrate, an electrode component engaged with a third lower wiring portion of the second substrate, and an electrode component engaged with a fourth lower wiring portion of the second substrate disposed on a first side of the second substrate.

[0350] Industrial availability

[0351] The light-emitting module, light-emitting device, or substrate described in the embodiments can be used in a projector. That is, a projector can be considered one application of the present invention. It should be noted that the present invention is not limited thereto and can be used in various applications such as lighting, exposure, automotive headlights, head-mounted displays, and backlights for other displays.

[0352] Explanation of reference numerals in the attached figures

[0353] 1: Light-emitting device

[0354] 1A: First light-emitting device

[0355] 1B: Second light-emitting device

[0356] 10: Packaging

[0357] 11: Matrix

[0358] 11A: First upper surface

[0359] 11B: Lower surface

[0360] 11C: Second upper surface

[0361] 11D: Outer surface

[0362] 11D1: First outer surface

[0363] 11D2: Second outer surface

[0364] 11D3: Third outer surface

[0365] 11D4: Fourth outer surface

[0366] 11E: Inner surface

[0367] 11E1: First inner surface

[0368] 11E2: Second inner surface

[0369] 11E3: Third inner surface

[0370] 11E4: Fourth inner surface

[0371] 11F: Staircase

[0372] 11F1: First step

[0373] 11F2: Second Step

[0374] 11G: Upper surface

[0375] 11H: Side view

[0376] 11M: Base

[0377] 11N: Frame

[0378] 11S: Insulation layer

[0379] 11S1: First layer

[0380] 11S2: Second layer

[0381] 11S3: Third layer

[0382] 11S4: Fourth layer

[0383] 12: Wiring section

[0384] 12A: Upper wiring section

[0385] 12A1: First upper wiring section

[0386] 12A2: Second upper wiring section

[0387] 12A3: Third upper wiring section

[0388] 12A4: Fourth upper wiring section

[0389] 12B: Lower wiring section

[0390] 12B1: First lower side wiring section

[0391] 12B2: Second lower wiring section

[0392] 12B3: Third lower wiring section

[0393] 12B4: Fourth lower wiring section

[0394] 12B5: Fifth lower side wiring section

[0395] 12B6: Sixth lower wiring section

[0396] 12C: Intermediate Wiring Section

[0397] 12C1: First intermediate wiring section

[0398] 12C2: Second intermediate wiring section

[0399] 13A: Joining pattern

[0400] 14: Cover

[0401] 14A: Upper surface

[0402] 14B: Lower surface

[0403] 14C: Side view

[0404] 20: Light-emitting element

[0405] 20A: First light-emitting element

[0406] 20B: Second light-emitting element

[0407] 21A: Upper surface

[0408] 21B: Lower surface

[0409] 21C: Side view

[0410] 22: Light exit surface

[0411] 30: Auxiliary mounting base plate

[0412] 31A: Upper surface

[0413] 31B: Lower surface

[0414] 31C: Side view

[0415] 32A: Substrate

[0416] 32B: Upper metal component

[0417] 32C: Lower metal component

[0418] 33: Wiring layer

[0419] 40: Reflective component

[0420] 41A: Lower surface

[0421] 41B: Light reflecting surface

[0422] 50: Protective components

[0423] 51A: Upper surface

[0424] 51B: Lower surface

[0425] 51C: Side View

[0426] 60: Wiring

[0427] 70: Optical components (lens components)

[0428] 71A: Upper surface

[0429] 71B: Lower surface

[0430] 71C: Side View

[0431] 71D: Lens surface (optical working surface)

[0432] 72A: Lens section

[0433] 72B: Non-lens section

[0434] 101: Wiring board

[0435] 1011: First wiring board

[0436] 1012: Second wiring board

[0437] 1013: Third wiring board

[0438] 1014: Fourth wiring board

[0439] 1015: Fifth Wiring Board

[0440] 101A: Upper surface

[0441] 101B: Lower surface

[0442] 101C: Side View

[0443] 101D: Heat dissipation unit

[0444] 101E: Electrode section

[0445] 101F: Insulation section

[0446] 101G: Wiring pattern

[0447] 101H: Through hole

[0448] 101I: Dummy Electrode Section

[0449] 111: Heat dissipation components

[0450] 111A: First upper surface

[0451] 111B: Second upper surface

[0452] 111C: First side view

[0453] 111D: Second side view

[0454] 111E: Lower surface

[0455] 121: Electrode components

[0456] 121A: First electrode component

[0457] 121B: Second electrode component

[0458] 122A: Upper surface

[0459] 122B: Side view

[0460] 131: Insulating components

[0461] 131A: First insulating component

[0462] 131B: Second insulating component

[0463] 141: Metal layer

[0464] 141A: First metal layer

[0465] 141B: Second metal layer

[0466] 151: Dummy Electrode Components

[0467] 201: Connector

[0468] 301: Thermistor

[0469] 901: Light-emitting module

[0470] 901A: First Light-Emitting Module

[0471] 901B: Second Light-Emitting Module

[0472] 901C: Third Light-Emitting Module

[0473] 901D: Fourth light-emitting module.

Claims

1. A matrix, characterized in that, have: upper surface; Lower surface; First perspective; The second side is opposite to or located on the opposite side of the first side; Multiple upper wiring portions, each comprising, on its upper surface side, a first upper wiring portion disposed on the first side side, and a second upper wiring portion disposed on one side of the first side side or the second side side, separate from the first upper wiring portion. A plurality of lower side wiring portions include, on the lower surface side, a first lower side wiring portion disposed on the first side side and electrically connected to the first upper side wiring portion, a second lower side wiring portion disposed on one side of the first side side or the second side side and electrically connected to the second upper side wiring portion, and a third lower side wiring portion disposed on the second side side and electrically connected to the first upper side wiring portion, which is separate from the first lower side wiring portion.

2. The matrix according to claim 1, characterized in that, The second upper wiring section is disposed on the first side side.

3. The matrix according to claim 2, characterized in that, have: Multiple insulating layers, including a first layer having the upper wiring portion and a second layer having the lower wiring portion; Multiple intermediate wiring sections are disposed between the first layer and the second layer. The plurality of intermediate wiring portions include a first intermediate wiring portion having a region extending from the first side side to the second side side, and being electrically connected to the first upper wiring portion, the first lower wiring portion, and the third lower wiring portion.

4. The matrix according to claim 2, characterized in that, It has multiple insulating layers, including a first layer on which the upper wiring portion is disposed, and a second layer disposed on top of the first layer. When viewed from above, the first upper wiring portion has a first region that overlaps with the second layer and a second region that does not overlap with the second layer. The first region has a region extending from the first side side to the second side side.

5. The matrix according to any one of claims 2 to 4, characterized in that, The plurality of upper wiring portions further include, on the upper surface side, a third upper wiring portion disposed on the second side side, and a fourth upper wiring portion disposed on the second side side separate from the third upper wiring portion. The plurality of lower wiring portions further include, on the lower surface side, a fourth lower wiring portion disposed on the second side side and electrically connected to the third upper wiring portion, a fifth lower wiring portion disposed on the second side side and electrically connected to the fourth upper wiring portion, and a sixth lower wiring portion disposed on the first side side and electrically connected to the third upper wiring portion, which is separate from the fourth lower wiring portion.

6. The matrix according to claim 5, characterized in that, have: The first layer has the aforementioned upper wiring section; The second layer has the lower wiring section provided thereon; Multiple intermediate wiring sections are disposed between the first layer and the second layer. The plurality of intermediate wiring portions include: a first intermediate wiring portion having a region extending from the first side side to the second side side and electrically connected to the first upper wiring portion, the first lower wiring portion and the third lower wiring portion; and a second intermediate wiring portion having a region extending from the first side side to the second side side and electrically connected to the third upper wiring portion, the fourth lower wiring portion and the sixth lower wiring portion.

7. The matrix according to claim 1, characterized in that, The second upper wiring section is disposed on the second side side.

8. The matrix according to claim 7, characterized in that, have: Multiple insulating layers, including a first layer having the upper wiring portion and a second layer having the lower wiring portion; Multiple intermediate wiring sections are disposed between the first layer and the second layer. The plurality of intermediate wiring portions include a first intermediate wiring portion having a region extending from the first side side to the second side side, and being electrically connected to the first upper wiring portion, the first lower wiring portion, and the third lower wiring portion.

9. The matrix according to claim 7 or 8, characterized in that, The plurality of lower wiring portions further include a fourth lower wiring portion, which is separate from the first lower wiring portion and disposed on the other side of the first side side or the second side side, and is electrically connected to the second upper wiring portion.

10. The matrix according to any one of claims 7 to 9, characterized in that, The plurality of upper wiring sections further include a third upper wiring section disposed on the first side surface. The plurality of lower wiring portions further include, on the lower surface side, a fourth lower wiring portion that is separate from the first lower wiring portion and disposed on the first side side, and is electrically connected to the third upper wiring portion.

11. A light-emitting device, characterized in that, have: The matrix according to any one of claims 1 to 10; One or more light-emitting elements are disposed on the substrate and electrically connected to the first upper wiring portion and the second upper wiring portion.

12. A light-emitting module, characterized in that, have: The matrix according to any one of claims 2 to 6; One or more light-emitting elements are disposed on the substrate and electrically connected to the first upper wiring portion and the second upper wiring portion; A wiring board having multiple electrode components and configured with the substrate, The plurality of electrode components include an electrode component that engages with the third lower side wiring portion and an electrode component that engages with the second lower side wiring portion disposed on the first side side.

13. A light-emitting module, characterized in that, have: The matrix as described in claim 5 or 6; One or more first light-emitting elements are disposed on the substrate and electrically connected to the first upper wiring portion and the second upper wiring portion; One or more second light-emitting elements are disposed on the substrate and electrically connected to the third upper wiring portion and the fourth upper wiring portion; A wiring board having multiple electrode components and configured with the substrate, The plurality of electrode components include an electrode component that engages with the third lower side wiring portion, an electrode component that engages with the second lower side wiring portion disposed on the first side side, an electrode component that engages with the fourth lower side wiring portion, and an electrode component that engages with the fifth lower side wiring portion disposed on the second side side.

14. A light-emitting module, characterized in that, have: The matrix according to any one of claims 7 to 9; One or more light-emitting elements are disposed on the substrate and electrically connected to the first upper wiring portion and the second upper wiring portion; A wiring board having multiple electrode components and configured with the substrate, The plurality of electrode components include an electrode component that engages with the third lower side wiring portion and an electrode component that engages with the second lower side wiring portion disposed on the second side side.

15. A light-emitting module, characterized in that, have: A first light-emitting device comprising: a first substrate, which is the substrate as described in claim 10; and one or more first light-emitting elements disposed on the first substrate and electrically connected to the first upper wiring portion and the second upper wiring portion of the first substrate. The second light-emitting device comprises: a second substrate, which is the substrate according to claim 10; and one or more second light-emitting elements disposed on the second substrate and electrically connected to the first upper wiring portion and the third upper wiring portion of the second substrate. A wiring board having multiple electrodes and configured with the first substrate and the second substrate, The plurality of electrode components include an electrode component that engages with the first lower side wiring portion of the first substrate, an electrode component that engages with the second lower side wiring portion of the first substrate disposed on the second side side of the first substrate, an electrode component that engages with the third lower side wiring portion of the second substrate, and an electrode component that engages with the fourth lower side wiring portion of the second substrate disposed on the first side side of the second substrate.

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