Infrared anti-reflection tempered glass film and preparation method thereof
By depositing multiple layers of magnesium fluoride and germanium films onto tempered glass film in an alternating coating structure, the problem of insufficient transmittance of tempered film to visible and infrared light is solved, achieving high transmittance and low reflectance, thus improving the functionality of infrared sensors and lidar.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- DONG GUAN JIAYI OPTOELECTRONIC CO LTD
- Filing Date
- 2026-02-10
- Publication Date
- 2026-05-05
AI Technical Summary
In existing technologies, tempered glass films have insufficient transmittance for visible and infrared light, which limits the use of front-facing infrared sensors or infrared lidar functions.
Infrared antireflective tempered glass film is used, which forms an interlaced coating structure by depositing multiple layers of magnesium fluoride film and multiple layers of germanium film on the glass layer. Combined with a silicon dioxide base film and a sealing film, it increases the refractive index and reduces the reflectivity, thereby enhancing the transmittance of visible and infrared light.
It improves the transmittance of visible light at 550nm to ≥95% and infrared transmittance at 940nm to ≥94%, reduces the impact of tempered glass film on the screen's infrared sensor or LiDAR function, and improves screen clarity.
Smart Images
Figure CN121974572A_ABST
Abstract
Description
Technical Field
[0001] This invention patent relates to the technical field of anti-reflective tempered glass films, and more specifically, to infrared anti-reflective tempered glass films and their preparation methods. Background Technology
[0002] Tempered glass screen protectors are protective films made of tempered glass used to protect the screens of electronic devices such as mobile phones. They are processed through high-temperature quenching and other processes to form a compressive stress layer on the glass surface, thereby improving hardness and impact resistance.
[0003] Common tempered glass screen protectors include privacy screen protectors and anti-reflective screen protectors. For example, the prior patent with authorization announcement number CN218910219U discloses a high light transmittance and low haze mobile phone tempered glass screen protector, which includes a substrate, a glass layer, a release adhesive layer, an AF layer, and a conventional anti-reflective AR layer. The release adhesive layer and the glass layer respectively cover both sides of the substrate. The conventional anti-reflective AR layer is located on the side of the glass layer away from the substrate. The AF layer is located on the side of the conventional anti-reflective AR layer away from the substrate. A colorless anti-reflective AR layer covers the AF layer and the conventional anti-reflective AR layer.
[0004] In existing technologies, the transmittance of visible and infrared light is still insufficient, which limits the use of front-facing infrared sensors or infrared lidar, making it inconvenient to use mobile phones. Summary of the Invention
[0005] The purpose of this invention is to provide an infrared anti-reflective tempered glass film and its preparation method, aiming to solve the problem of limited use of front-mounted infrared sensors or infrared lidar functions in the prior art.
[0006] This invention is implemented as follows: an infrared antireflective tempered glass film, comprising an AF layer, a hardening layer, an antireflective module, a silica layer, and a glass layer, wherein the AF layer, the hardening layer, the antireflective module, the silica layer, and the glass layer are arranged in a sequentially overlapping manner; the antireflective module is used to improve the transmittance of visible light and infrared light, and the antireflective module comprises a silica base film layer, multiple magnesium fluoride film layers, and multiple germanium film layers, wherein the silica base film layer is arranged as the bottom layer, and the magnesium fluoride film layers and the germanium film layers are arranged in a sequentially staggered overlapping manner.
[0007] Furthermore, the total number of layers formed by the silicon dioxide base film, the magnesium fluoride film, and the germanium film ranges from 7 to 12.
[0008] Furthermore, the thickness of the alternating magnesium fluoride film and the germanium film is in the range of 280-480 nm.
[0009] Furthermore, the antireflective module includes a silicon dioxide sealing layer, with the magnesium fluoride film layer and the germanium film layer coated between the silicon dioxide base film layer and the silicon dioxide sealing layer, and the silicon dioxide sealing layer is arranged in a flat coating pattern; the silicon dioxide base film layer and the silicon dioxide sealing layer are respectively made of silicon dioxide material.
[0010] The preparation method of infrared antireflective tempered glass film is as follows: (1) Clean the glass layer, and deposit a silicon dioxide layer on the glass layer; (2) Deposit an anti-reflection module on the silicon dioxide layer. The anti-reflection module includes a silicon dioxide base film layer, a multilayer magnesium fluoride film layer and a multilayer germanium film layer. The silicon dioxide base film layer is arranged as the bottom layer, and the magnesium fluoride film layer and the germanium film layer are arranged in a sequentially staggered coating. (3) The antireflection module includes a silicon dioxide sealing layer, the magnesium fluoride film layer and the germanium film layer are coated between the silicon dioxide base film layer and the silicon dioxide sealing layer, and the silicon dioxide sealing layer is arranged in a flat coating.
[0011] (4) On the silicon dioxide sealing layer, a hardening layer and an AF layer are deposited in sequence, cured, and a protective film is applied.
[0012] Furthermore, the total number of layers formed by the silicon dioxide base film, the magnesium fluoride film, and the germanium film ranges from 7 to 12.
[0013] Furthermore, the silicon dioxide base film layer and the silicon dioxide sealing film layer are both made of silicon dioxide material, and the thickness of the silicon dioxide sealing film layer is 60nm.
[0014] Furthermore, the refractive index of the magnesium fluoride film is 1.38, the refractive index of the germanium film is 4.0, and the refractive index of the silicon dioxide base film and the silicon dioxide sealing film is 1.46; the magnesium fluoride film and the germanium film are arranged in an alternating high and low refractive index coating.
[0015] Furthermore, the thickness of the magnesium fluoride film is greater than the thickness of the germanium film, and the thickness of the magnesium fluoride film is more than twice the thickness of the germanium film.
[0016] Compared with the prior art, the infrared anti-reflection tempered glass film provided by the present invention adopts a multi-layer coating process to improve the refractive index of the tempered glass film and reduce the reflectivity, thereby improving the transmittance of visible light and infrared light. When used for front-facing infrared sensors or infrared lidar functions, the impact of the tempered glass film on the screen's infrared sensor or lidar functions is reduced. Attached Figure Description
[0017] Figure 1This is a schematic diagram of the material layers of the infrared anti-reflection tempered glass film provided by the present invention; Figure 2 This is a schematic diagram of the antireflection module of the infrared antireflection tempered glass film provided by the present invention; Figure 3 This is a schematic flowchart of the preparation method of the infrared anti-reflective tempered glass film provided by the present invention. Detailed Implementation
[0018] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.
[0019] The implementation of the present invention will be described in detail below with reference to specific embodiments.
[0020] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components. In the description of this invention, it should be understood that if terms such as "upper," "lower," "left," and "right" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, they are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the accompanying drawings are only for illustrative purposes and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.
[0021] Referring to the figure, a preferred embodiment of the present invention is provided.
[0022] The infrared antireflective tempered glass film includes an AF layer 1, a hardening layer 2, an antireflective module 3, a silica layer 4, and a glass layer 5. The AF layer 1, hardening layer 2, antireflective module 3, silica layer 4, and glass layer 5 are arranged in sequence. The antireflective module 3 is used to improve the transmittance of visible light and infrared light. The antireflective module 3 includes a silica base film layer 31, a multilayer magnesium fluoride film layer 32, and a multilayer germanium film layer 33. The silica base film layer 31 is arranged as the bottom layer, and the magnesium fluoride film layer 32 and the germanium film layer 33 are arranged in a sequentially staggered layering.
[0023] The aforementioned infrared anti-reflective tempered glass film employs a multi-layer coating process to increase the refractive index and reduce the reflectivity of the tempered glass film, thereby enhancing the transmittance of visible and infrared light. When used with front-facing infrared sensors or infrared lidar functions, it reduces the impact of the tempered glass film on the screen's infrared sensor or lidar functions.
[0024] By interleaving multiple layers of magnesium fluoride film 32 and multiple layers of germanium film 33, the refractive index of the tempered glass film is increased and the reflectivity is reduced, thereby improving the transmittance of visible and infrared light.
[0025] The total number of layers formed by the silica base film 31, magnesium fluoride film 32, germanium film 33 and silica sealing film 34 ranges from 7 to 12, ensuring sufficient transmittance of visible and infrared light.
[0026] Currently, the transmittance of ordinary tempered glass screen protectors and AR anti-reflective tempered glass screen protectors at 550nm in the visible light band is ≥91% / ≥94%, and the transmittance at 940nm in the infrared band is ≥89% / ≥90%, respectively. When used, they may affect mobile phones with front-facing infrared sensors or infrared lidar functions.
[0027] This application employs a multi-layer coating process to increase the refractive index of the substrate and reduce the reflectivity, thereby improving the transmittance of visible and infrared light. After the improvement, the transmittance of visible light at 550nm is ≥95%, and the transmittance of infrared light at 940nm is ≥94%. While improving screen clarity and reducing reflection, this application also reduces the impact of the tempered glass film on the screen's infrared sensor or lidar function.
[0028] The thickness of the alternating magnesium fluoride film 32 and germanium film 33 ranges from 280 to 480 nm.
[0029] The thickness of the alternating magnesium fluoride film layer 32 and germanium film layer 33 is 280nm, with a transmittance of ≥95% in the visible light band and ≥94% in the infrared band.
[0030] The thickness of the alternating magnesium fluoride film layer 32 and germanium film layer 33 is 480nm, with a transmittance of ≥97% in the visible light band and ≥96% in the infrared band.
[0031] The thickness of the alternating magnesium fluoride film layer 32 and germanium film layer 33 is 350nm, with a transmittance of ≥96% in the visible light band and ≥95% in the infrared band.
[0032] The antireflective module 3 includes a silicon dioxide sealing layer 34, a magnesium fluoride film layer 32, and a germanium film layer 33, which are coated between the silicon dioxide base film layer 31 and the silicon dioxide sealing layer 34, and the silicon dioxide sealing layer 34 is arranged in a flat coating pattern; the silicon dioxide base film layer 31 and the silicon dioxide sealing layer 34 are both made of silicon dioxide material.
[0033] The silica base film layer 31 and the silica sealing film layer 34 work together to provide a sealing effect, and also protect the magnesium fluoride film layer 32 and the germanium film layer 33, ensuring the effect of improving the transmittance of visible and infrared light.
[0034] The preparation method of infrared antireflective tempered glass film is as follows: (1) Clean the glass layer 5, and deposit a silicon dioxide layer 4 on the glass layer 5; (2) An anti-reflection module 3 is deposited on the silicon dioxide layer 4. The anti-reflection module 3 includes a silicon dioxide bottom film layer 31, a multilayer magnesium fluoride film layer 32 and a multilayer germanium film layer 33. The silicon dioxide bottom film layer 31 is arranged as the bottom layer, and the magnesium fluoride film layer 32 and the germanium film layer 33 are arranged in a staggered manner. (3) The anti-reflection module 3 includes a silicon dioxide sealing layer 34, a magnesium fluoride film layer 32 and a germanium film layer 33, which are coated between the silicon dioxide base film layer 31 and the silicon dioxide sealing layer 34, and the silicon dioxide sealing layer 34 is arranged in a flat coating.
[0035] (4) On the silicon dioxide sealing layer 34, hardening layer 2 and AF layer 1 are deposited in sequence, cured, and covered with a protective film.
[0036] The above-mentioned method for preparing infrared anti-reflective tempered glass film employs a multi-layer coating process to increase the refractive index and reduce the reflectivity of the tempered glass film, thereby enhancing the transmittance of visible and infrared light. When used with front-facing infrared sensors or infrared lidar functions, this method reduces the impact of the tempered glass film on the screen's infrared sensor or lidar functions.
[0037] The coating sequence is as follows: First, a silicon dioxide base film layer 31 is deposited, followed by a multilayer magnesium fluoride film layer 32 and a multilayer germanium film layer 33. The multilayer magnesium fluoride film layer 32 and the multilayer germanium film layer 33 are deposited in an alternating sequence. The number of layers of the multilayer magnesium fluoride film layer 32 and the multilayer germanium film layer 33 ranges from 5 to 10. Then, a silicon dioxide sealing film layer 34 is deposited to complete the setting of the anti-reflection module 3.
[0038] The thickness of the silicon dioxide encapsulation layer 34 ranges from 50 to 70 nm, with an optimal thickness of 60 nm.
[0039] The thickness of the silicon dioxide sealing layer 34 is 50nm, 60nm and 70nm. The transmittance of visible light and infrared light of the tempered glass film is about the same. Using 70nm will easily lead to the tempered glass film being too thick, and using 50nm will easily lead to the tempered glass film being too thin, which will affect the service life of the anti-reflection module 3.
[0040] A hardening layer 2 is deposited, with a thickness of 85 nm, and an AF layer 1 is deposited, with a thickness of 15 nm.
[0041] Vacuum level 10 during magnetron sputtering machining -2 ~10 -3 Pa range.
[0042] The coating consists of a silicon dioxide base film layer 31, a multilayer magnesium fluoride film layer 32, a multilayer germanium film layer 33, a silicon dioxide sealing film layer 34, a hardening layer 2, and an AF layer 1. After each layer is coated, the curing conditions are: place it in an environment of 150 ~ 250℃ and bake for 3-5 minutes. The last layer is baked for 10-15 minutes.
[0043] The total number of layers formed by the silicon dioxide base film 31, the magnesium fluoride film 32 and the germanium film 33, and the silicon dioxide sealing film 34 ranges from 7 to 12.
[0044] The silica base film layer 31 and the silica sealing film layer 34 are both made of silica material, and the thickness of the silica sealing film layer 34 is 60nm.
[0045] The magnesium fluoride film 32 has a refractive index of 1.38, the germanium film 33 has a refractive index of 4.0, and the silicon dioxide base film 31 and the silicon dioxide sealing film 34 have a refractive index of 1.46. The magnesium fluoride film 32 and the germanium film 33 are arranged in an alternating high and low refractive index coating. In this way, the high and low refractive indices alternately cancel out reflections, the germanium film 33 optimizes the infrared light transmittance, and the magnesium fluoride film 32 ensures the performance in the visible light band.
[0046] In step (1), the glass layer 5 is cleaned and dried, and the surface cleanliness is ≤5μm particle residue.
[0047] A base layer of silicon dioxide, 4, with a thickness of 60 nm, is deposited using magnetron sputtering with a vacuum level of 5 × 10⁻⁶. -3 Pa, after coating, bake at 200℃ for 3 minutes.
[0048] The germanium film layer 33 can reduce infrared absorption and increase infrared light transmittance.
[0049] The thickness of the magnesium fluoride film 32 is greater than the thickness of the germanium film 33, and the thickness of the magnesium fluoride film 32 is more than twice the thickness of the germanium film 33; to ensure the transmittance of infrared light.
[0050] The silicon dioxide sealing layer 34 has a thickness of 60 nm and a vacuum degree of 5 × 10⁻⁶. -3 Bake at 200℃ for 3 minutes.
[0051] The thickness of the hardening layer 2 coating is 85 nm, and the vacuum degree is 3 × 10⁻⁶. -3 Bake at 230℃ for 4 minutes.
[0052] The thickness of the AF layer 1 coating is 15 nm, and the vacuum degree is 2 × 10⁻⁶. -2 Pa, bake at 250℃ for 12 minutes, extend the baking time to improve adhesion.
[0053] Core parameters for magnetron sputtering: Vacuum level controlled at 2×10 throughout the process. -3 ~ 8×10-3 Pa (adhesion 10) -2 ~10 -3 (Pa range), target material purity: SiO2 ≥ 99.99%, MgF2 ≥ 99.9%, Ge ≥ 99.99%. Performance targets: 550nm visible light transmittance ≥94.5%; 940nm infrared transmittance ≥94.2%; final film hardness: pencil hardness ≥9H, Mohs hardness ≥6, and abrasion resistance and acid and alkali resistance meet the standards.
[0054] Anti-reflective module 3, Example 1: The first layer is a magnesium fluoride film 32, which has a thickness of 45 nm and a vacuum degree of 4 × 10⁻⁶. -3 Pa, baked at 200℃ for 3 minutes; second layer coated with germanium film 33, the thickness of germanium film 33 is 20nm, vacuum degree 3×10 -3 Baking at 220℃ for 4 minutes, then applying a third layer of magnesium fluoride film 32 with a thickness of 55 nm, and a vacuum degree of 4 × 10⁻⁶. -3 Pa, baked at 200℃ for 3 minutes, then the fourth layer, germanium film 33, is applied with a thickness of 18 nm. Vacuum degree 3×10 -3 Baking at 220℃ for 4 minutes, then applying a fifth layer of magnesium fluoride film 32 with a thickness of 52 nm, and a vacuum degree of 4 × 10⁻⁶. -3 Pa, baked at 200℃ for 3 minutes, sixth layer germanium film 33, germanium film layer 33 thickness is 15nm, vacuum degree 2×10 -3 Baking at 220℃ for 4 minutes, then applying a seventh layer of magnesium fluoride film 32 with a thickness of 40 nm, and a vacuum degree of 4 × 10⁻⁶. -3 Bake at 200℃ for 3 minutes.
[0055] Anti-reflective module 3, Example 2: The first layer is a magnesium fluoride film 32, which has a thickness of 45 nm and a vacuum degree of 4 × 10⁻⁶. -3 Pa, baked at 200℃ for 3 minutes; second layer coated with germanium film 33, the thickness of germanium film 33 is 20nm, vacuum degree 3×10 -3 Baking at 220℃ for 4 minutes, then applying a third layer of magnesium fluoride film 32 with a thickness of 55 nm, and a vacuum degree of 4 × 10⁻⁶. -3 Pa, baked at 200℃ for 3 minutes, then the fourth layer, germanium film 33, is applied with a thickness of 18 nm. Vacuum degree 3×10 -3 Baking at 220℃ for 4 minutes, then applying a fifth layer of magnesium fluoride film 32 with a thickness of 52 nm, and a vacuum degree of 4 × 10⁻⁶. -3 Bake at 200℃ for 3 minutes.
[0056] Anti-reflective module 3, Example 3: The first layer is a magnesium fluoride film 32, which has a thickness of 45 nm and a vacuum degree of 4 × 10⁻⁶. -3 Pa, baked at 200℃ for 3 minutes; second layer coated with germanium film 33, the thickness of germanium film 33 is 20nm, vacuum degree 3×10 -3 Baking at 220℃ for 4 minutes, then applying a third layer of magnesium fluoride film 32 with a thickness of 55 nm, and a vacuum degree of 4 × 10⁻⁶. -3 Pa, baked at 200℃ for 3 minutes, then the fourth layer, germanium film 33, is applied with a thickness of 18 nm. Vacuum degree 3×10 -3 Baking at 220℃ for 4 minutes, then applying a fifth layer of magnesium fluoride film 32 with a thickness of 52 nm, and a vacuum degree of 4 × 10⁻⁶. -3 Pa, baked at 200℃ for 3 minutes, sixth layer germanium film 33, germanium film layer 33 thickness is 15nm, vacuum degree 2×10 -3 Baking at 220℃ for 4 minutes, then applying a seventh layer of magnesium fluoride film 32 with a thickness of 40 nm, and a vacuum degree of 4 × 10⁻⁶. -3 Pa, baked at 200℃ for 3 minutes, the eighth layer, germanium film 33, is applied with a thickness of 13 nm, and the vacuum degree is 2×10. -3 Baking at 220℃ for 4 minutes, then applying the ninth layer, a magnesium fluoride film 32, with a thickness of 30 nm, under a vacuum of 4 × 10⁻⁶. -3 Pa, baked at 200℃ for 3 minutes, tenth layer germanium film 33, germanium film layer 33 thickness is 10nm, vacuum degree 2×10 -3 Bake at 220℃ for 4 minutes.
[0057] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.
Claims
1. An infrared anti-reflective tempered glass film, characterized in that, The device includes an AF layer, a hardening layer, an antireflection module, a silicon dioxide layer, and a glass layer, wherein the AF layer, the hardening layer, the antireflection module, the silicon dioxide layer, and the glass layer are arranged in a sequentially overlapping manner; the antireflection module is used to improve the transmittance of visible light and infrared light, and the antireflection module includes a silicon dioxide base film layer, multiple magnesium fluoride film layers, and multiple germanium film layers, wherein the silicon dioxide base film layer is arranged as the bottom layer, and the magnesium fluoride film layers and the germanium film layers are arranged in a sequentially staggered overlapping manner.
2. The infrared anti-reflective tempered glass film as described in claim 1, characterized in that, The total number of layers formed by the silicon dioxide base film, the magnesium fluoride film, and the germanium film ranges from 7 to 12.
3. The infrared anti-reflective tempered glass film as described in claim 2, characterized in that, The thickness of the alternating magnesium fluoride film and germanium film is in the range of 280-480 nm.
4. The infrared anti-reflective tempered glass film as described in claim 2, characterized in that, The antireflective module includes a silicon dioxide sealing layer, with the magnesium fluoride film layer and the germanium film layer sandwiched between the silicon dioxide base film layer and the silicon dioxide sealing layer, and the silicon dioxide sealing layer is arranged in a flat coating pattern; the silicon dioxide base film layer and the silicon dioxide sealing layer are each made of silicon dioxide material.
5. A method for preparing an infrared antireflective tempered glass film, characterized in that, The steps are as follows: (1) Clean the glass layer, and deposit a silicon dioxide layer on the glass layer; (2) Deposit an anti-reflection module on the silicon dioxide layer. The anti-reflection module includes a silicon dioxide base film layer, a multilayer magnesium fluoride film layer and a multilayer germanium film layer. The silicon dioxide base film layer is arranged as the bottom layer, and the magnesium fluoride film layer and the germanium film layer are arranged in a sequentially staggered coating. (3) The antireflection module includes a silicon dioxide sealing layer, the magnesium fluoride film layer and the germanium film layer are coated between the silicon dioxide base film layer and the silicon dioxide sealing layer, and the silicon dioxide sealing layer is arranged in a flat coating.
6. (4) On the silicon dioxide sealing layer, a hardening layer and an AF layer are deposited in sequence, cured, and a protective film is applied.
7. The method for preparing the infrared antireflective tempered glass film as described in claim 5, characterized in that, The total number of layers formed by the silicon dioxide base film, the magnesium fluoride film, and the germanium film ranges from 7 to 12.
8. The method for preparing the infrared antireflective tempered glass film as described in claim 5, characterized in that, The silica base film and the silica sealing film are both made of silica material, and the thickness of the silica sealing film is 60nm.
9. The method for preparing the infrared antireflective tempered glass film as described in claim 5, characterized in that, The refractive index of the magnesium fluoride film is 1.38, the refractive index of the germanium film is 4.0, and the refractive index of the silicon dioxide base film and the silicon dioxide sealing film is 1.46; the magnesium fluoride film and the germanium film are arranged in an alternating high and low refractive index coating.
10. The method for preparing the infrared antireflective tempered glass film as described in claim 5, characterized in that, The thickness of the magnesium fluoride film is greater than the thickness of the germanium film, and the thickness of the magnesium fluoride film is more than twice the thickness of the germanium film.