LED packaging colloid presenting non-luminous color and preparation method thereof

Abstract

The invention discloses an LED packaging colloid presenting a non-luminous color and a preparation method thereof, and belongs to the technical field of semiconductor device packaging. The packaging colloid is composed of a colloid base material and inorganic color paste uniformly dispersed in the colloid base material. The specific preparation method comprises the steps of material preparation, premixing, vacuum stirring and defoaming, dispensing, curing and the like, and inorganic color paste is uniformly mixed and cured in colloid. According to the LED device applying the colloid, the packaging colloid can present a stable preset color when the colloid is not powered on, light emitted after the colloid is powered on penetrates through the colloid, and the light emitting color is in visual coordination with the natural color of the colloid. According to the invention, the integration of the coloring effect and the packaging body is realized, the problems that the external coloring is easy to fall off and discolor and the lighting effect is influenced are solved, and the advantages of firm coloring, strong weather resistance, good process compatibility, environmental protection, reliability and the like are realized.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device packaging technology, specifically to an LED encapsulation colloid that exhibits a non-luminescent color and its preparation method. Background Technology

[0002] LED devices have been widely used in lighting, display, and backlighting due to their advantages such as energy saving, long lifespan, and high brightness. With increasing market demands for personalized and aesthetically pleasing product appearances, the need for coloring the LED devices themselves (especially their encapsulated components) is growing. Traditional methods for coloring or surface treatment of LED encapsulated components mainly include the following, but all have significant drawbacks: External post-processing coloring: This involves spraying, coating with colored coatings, or attaching colored films to the surface of a pre-formed colorless and transparent encapsulating colloid. The main drawback of this method is the weak adhesion between the colored layer and the colloid substrate. With prolonged use or under the high temperatures and UV radiation generated by LED operation, the coating is prone to peeling, cracking, or fading, affecting not only aesthetics but also product reliability and lifespan. Furthermore, the external coating may be uneven, affecting the consistency of the product's appearance.

[0003] Adding organic colorants or dyes: Organic colorants are directly mixed into the encapsulating colloidal raw materials. Although the coloring process is relatively simple, most organic colorants have poor heat resistance and UV aging resistance. Under the high temperatures generated by LED chips during long-term operation and the short-wavelength light radiation (especially blue light and ultraviolet light) emitted by the chips themselves, the molecular structure of organic colorants is easily damaged, leading to rapid color fading and yellowing, failing to meet the long lifespan requirements of LED devices. At the same time, some organic dyes may decompose and produce harmful substances during the aging process.

[0004] Impact on optical performance: Both of the above methods may adversely affect the optical performance of LEDs. External coatings or certain organic colorants may absorb or scatter some light, leading to a decrease in the light output efficiency (luminous efficacy) of the LED, a change in the light output angle, or a shift in the color of the emitted light, making it difficult to achieve the design goal of visually coherent consistency between the "appearance color when not lit" and the "color of the emitted light when lit".

[0005] Therefore, there is an urgent need in this field for a new LED encapsulation colloid coloring solution that provides a strong, durable, and stable coloring effect, can withstand the high temperature and high radiation working environment of LEDs, and does not affect the original optical performance and reliability of LEDs. At the same time, the process should be simple, environmentally friendly, and compatible with existing production lines. Summary of the Invention

[0006] In view of the shortcomings of the prior art, the purpose of this invention is to provide an LED encapsulating colloid that presents a non-luminous color and its preparation method, so as to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, a specific embodiment of the present invention provides an LED encapsulation colloid that presents a non-luminescent color, comprising: a colloid substrate; and an inorganic color paste uniformly dispersed within the cured colloid substrate; wherein the inorganic color paste is used to make the LED encapsulation colloid present a preset color in a non-energized state, and transmit light emitted by the LED chip in an energized state, so that the color in the non-energized state is consistent with the color in the energized state.

[0008] According to an embodiment of this application, an LED encapsulating colloid presenting a non-luminescent color and its preparation method are disclosed. The LED encapsulating colloid can present a stable and uniform preset color when no power is applied. When power is applied to emit light, the color can be visually consistent with the transmitted light. Moreover, the coloring process does not affect the light transmittance, mechanical strength, luminous efficiency, and lifespan of the colloid.

[0009] In addition, the LED encapsulating colloid exhibiting a non-luminous color and its preparation method proposed in this application may also have the following additional technical features: In one embodiment of this application, the inorganic color paste accounts for 0.1% to 5% of the total mass of the colloidal substrate and the inorganic color paste.

[0010] In one embodiment of this application, the inorganic color paste is a high-temperature and ultraviolet-resistant inorganic pigment dispersion with a particle size of 0.1 μm to 10 μm.

[0011] In one embodiment of this application, the colloidal substrate is one or more of silicone, epoxy resin, and modified silicone.

[0012] A method for preparing an LED encapsulating colloid that exhibits a non-luminescent color includes the following steps: S1: Prepare materials by weighing out component A, component B of the colloidal substrate and inorganic color paste according to the formula. S2: Premixing, the inorganic color paste is initially mixed with one of component A or component B of the colloidal substrate to obtain a premix; S3: Vacuum stirring and degassing: The premix and another component of the colloidal substrate are placed in a vacuum environment and stirred and mixed to uniformly disperse the inorganic color paste in the mixture and remove air bubbles. S4: Dispensing and curing. The mixture processed in step S3 is injected into the encapsulation mold or dispensed onto the surface of the LED chip and then heated and cured to form a solid encapsulation colloid in which the inorganic color paste is uniformly dispersed inside.

[0013] In one embodiment of this application, in step S3, the vacuum level of the vacuum environment is -0.095 MPa to -0.1 MPa, and the stirring time is 10 to 30 minutes.

[0014] In one embodiment of this application, in step S4, the temperature for heat curing is 100°C to 150°C, and the curing time is 1 to 4 hours.

[0015] An LED device includes: an LED chip; an LED encapsulating colloid that emits a non-luminescent color and covers the LED chip; wherein the LED encapsulating colloid is bonded to the surface of the LED chip without gaps to form a sealing protective layer.

[0016] The advantages of this invention compared to existing technologies are: (1) By uniformly dispersing and embedding inorganic color paste inside the encapsulating colloid, the coloring of the colloid body is achieved. The color and the colloid become one, fundamentally solving the problem of easy peeling and detachment of the external coloring layer, and greatly improving the color durability.

[0017] (2) Select inorganic pigments that are resistant to high temperature and ultraviolet light. Their chemical properties are extremely stable and can withstand the high temperature and ultraviolet radiation generated by the LED chip. They are not easy to fade or turn yellow after long-term use. Their color retention is far superior to organic coloring methods and matches the long life characteristics of LED.

[0018] (3) Inorganic color paste particles are small and uniformly dispersed, and have selective absorption of visible light. They can present the desired color and maintain high transmittance for specific wavelengths of light. By carefully selecting the type and amount of color paste, the color of the colloid when the LED is not lit and the color of the transmitted light (or the light after the chip emits light and is converted by phosphor) can be visually highly coordinated and consistent, thus improving the aesthetics and design of the product.

[0019] (4) This preparation method can be directly integrated into the existing LED packaging dispensing or molding process. Only the color paste needs to be added and fully dispersed in the mixing stage. There is no need to add post-processing steps such as spraying and baking, which simplifies the process, improves production efficiency, and is fully compatible with the existing production line.

[0020] (5) The addition of inorganic color paste does not significantly affect the original light transmittance, insulation, mechanical strength, and thermal stability of the colloid, thus ensuring the reliability of LED devices. It eliminates the need for external coloring processes and related materials. Although this increases the cost of the color paste, it reduces the overall production cost and minimizes after-sales issues caused by color fading, making it cost-effective.

[0021] (6) Inorganic color paste is non-toxic and harmless, with no release of volatile organic compounds (VOCs), and the production process is environmentally friendly, which is in line with the development trend of green manufacturing of electronic products.

[0022] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a three-dimensional schematic diagram of a specific form of the LED encapsulating colloid exhibiting a non-luminous color, prepared by the preparation method according to an embodiment of the present invention. Figure 2 This is a product structure diagram of an LED encapsulating colloid that presents a non-luminous color according to an embodiment of the present invention; Figure 3 This is a flowchart of a method for preparing an LED encapsulating colloid that exhibits a non-luminous color, according to an embodiment of the present invention.

[0025] Explanation of reference numerals in the attached figures: 1. Colloidal substrate; 2. Inorganic color paste; 3. LED chip; 100. LED encapsulation colloid. Detailed Implementation

[0026] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] It should be noted that, unless otherwise specified, the embodiments and features described in the present invention can be combined with each other.

[0028] Example 1: An LED encapsulating colloid exhibiting a non-luminescent color and its basic preparation method The objective of this invention is to provide an LED encapsulation colloid 100 that presents a non-luminous color. The core concept of this encapsulation colloid 100 is to use an inorganic color paste 2 with specific optical properties as a functional filler, uniformly dispersed in a liquid colloidal substrate 1 before the colloid cures. Subsequently, through a curing process, the inorganic color paste 2 is permanently and uniformly embedded within the solidified colloidal network. This structure allows the LED encapsulation colloid 100 to exhibit a preset color determined by the inorganic color paste 2, such as blue, white, or gold, rather than the traditional transparent or milky white, when not powered. When the LED chip 3 is powered on and emits light, the emitted light can effectively pass through the colored colloid. Due to the selective transmission or slight scattering of light by the inorganic color paste 2 in specific wavelengths, the color of the emitted light is visually coordinated and consistent with the color of the colloid itself, thus achieving an integrated visual effect of "colored when not lit, and harmonious color when lit." Meanwhile, the embedded inorganic color paste 2 is firmly bonded to the colloidal substrate 1, solving the problem of easy peeling and fading of external coloring.

[0029] In one embodiment of this application, such as Figures 1-3 As shown, the LED encapsulation colloid 100 provided by the present invention comprises two main parts: a colloid substrate 1 and an inorganic color paste 2.

[0030] Colloidal substrate 1: Colloidal substrate 1 is the continuous phase host material constituting the encapsulating colloid 100. Its function is to provide physical protection, electrical insulation, stress buffering, and light transmission medium for the LED chip 3. In this embodiment, the colloidal substrate 1 is selected as an addition-type silicone rubber with high light transmittance and excellent aging resistance. This silicone rubber is typically a two-component system, including a vinyl-containing polysiloxane (component A) and a polysiloxane crosslinking agent and platinum catalyst containing silane-hydrogen bonds (component B). During the curing process, components A and B undergo a hydrosilylation reaction under heating conditions to form a three-dimensional crosslinked network structure, thereby transforming from a liquid state into an elastic solid state. Colloidal substrate 1 must possess good flowability (for easy dispensing or potting), high light transmittance (to ensure light extraction efficiency), and excellent heat resistance and UV aging resistance (to adapt to the LED operating environment).

[0031] Inorganic Pigment Paste 2: Inorganic Pigment Paste 2 is the key functional component for achieving non-electrified coloring in this invention. It is not a simple powder, but a paste-like uniform dispersion formed by pre-dispersing micro- and nano-sized inorganic pigment particles in a compatible carrier (such as silicone oil, resin, etc.). In this embodiment, the selected inorganic pigment paste 2 is a high-temperature and UV-resistant inorganic pigment dispersion. Its main pigment particle component is cobalt aluminum spinel (CoAl2O4), which has extremely stable chemical properties. The particle size D50 of Inorganic Pigment Paste 2 is controlled between 0.1 μm and 10 μm. If the particle size is too small (e.g., below 0.1 μm), severe agglomeration may occur, affecting dispersion uniformity and light transmittance; if the particle size is too large (e.g., exceeding 10 μm), excessive Mie scattering of light may occur, affecting light transmittance uniformity and even producing a visible grainy appearance. Controlling its mass ratio to 0.1% to 5% of the total mass of the colloidal substrate 1 and inorganic pigment paste 2 is crucial for achieving effective coloring without affecting light transmittance. When the addition amount is less than 0.1%, the coloring effect is not obvious; when it is more than 5%, it may significantly reduce the light transmittance of the colloid and affect the LED brightness. In a specific formulation of this embodiment, the amount of inorganic color paste 2 added is 0.8% of the total mass of the colloid.

[0032] In one embodiment of this application, such as Figures 1-3 As shown, the inorganic color paste 2 is not attached to the surface of the colloidal substrate 1, but is uniformly dispersed inside the cured colloidal substrate 1. Specifically, during the mixing stage before curing, the carrier of the inorganic color paste 2 is compatible with the liquid colloidal substrate 1 (component A or component B). Through mechanical stirring and vacuum degassing, the pigment particles in the inorganic color paste 2 are uniformly distributed in the colloidal liquid phase. During the subsequent heat curing process, the colloidal substrate 1 undergoes a cross-linking reaction, transforming from a liquid into a solid network. This cured network "locks" the uniformly dispersed inorganic color paste 2 particles within it, i.e., embeds them within it. Therefore, after curing, the particles of the inorganic color paste 2 are firmly fixed inside the three-dimensional network structure of the entire colloidal substrate 1, forming an inseparable whole. From a microscopic perspective, the inorganic color paste 2 particles are uniformly distributed as fillers within the continuous colloidal substrate 1 phase.

[0033] Complete preparation method and workflow Step S1: Material preparation First, based on the total mass of the final LED encapsulating colloid 100 to be prepared and the preset addition ratio, accurately weigh each raw material component. Specifically, this includes: Weigh out a predetermined amount of component A (a vinyl polysiloxane) of colloidal substrate 1.

[0034] Weigh out a predetermined amount of component B (containing a crosslinking agent and catalyst with silane bonds) of colloidal substrate 1.

[0035] Weigh out the predetermined amount of inorganic color paste 2 (cobalt blue paste), which is 0.8% of the total mass of components A, B and the color paste.

[0036] Step S2: Premixing The purpose of this step is to achieve preliminary and effective wetting and dispersion of the inorganic color paste 2, avoiding uneven dispersion when it is directly mixed with all components. The weighed inorganic color paste 2 and component A of the colloidal substrate 1 (or component B, but component A is used as an example in this embodiment) are placed in a mixing container. Preliminary mechanical stirring is performed using a planetary mixer or similar equipment at normal pressure and room temperature. The stirring speed is approximately 300-500 rpm, and the stirring time is approximately 3-5 minutes. This process allows the high-viscosity inorganic color paste 2 to be initially diluted, sheared, and dispersed by the lower-viscosity component A, forming a premix with uniform color. This step is crucial, as it lays the foundation for subsequent efficient vacuum dispersion.

[0037] Step S3: Vacuum stirring and degassing This step is the core of this method for achieving high-quality dispersion and degassing. The premix obtained in step S2 is added together with the previously weighed component B of the colloidal substrate 1 into the barrel of a vacuum mixer. The barrel is closed and sealed, and the vacuum pump is started to maintain the vacuum environment inside the barrel at -0.095 MPa to -0.1 MPa (i.e., a relative vacuum of approximately 95% to 99.9%). Under this high vacuum environment, the stirring device is started. The stirring blades perform strong shearing and stirring of the mixture under vacuum for 10 to 30 minutes (20 minutes in this embodiment). This process achieves three objectives: Uniform dispersion: Under high shear force, the premix and component B are fully mixed, and the pigment particles of inorganic color paste 2 are further dispersed to achieve a uniform dispersion state at the micro-nano level, thus avoiding particle agglomeration.

[0038] Degassing: In a vacuum environment, air trapped in the mixture during stirring, as well as any tiny air bubbles that may be present in the raw materials themselves, will expand and escape from the liquid surface due to the extremely low external pressure, and be removed by the vacuum pump. This effectively eliminates air bubbles in the colloid, preventing voids from appearing in the colloid after curing, which would affect optical performance and reliability.

[0039] Promotes mixing: The vacuum environment reduces the resistance inside the liquid, which is conducive to the mutual penetration and uniform distribution of the components.

[0040] After stirring and degassing, the resulting mixture is a uniformly colored, fine-textured compound with no visible air bubbles.

[0041] Step S4: Dispensing and Curing This step involves shaping the mixed adhesive into the final product. The mixed adhesive processed in step S3 is transferred to the dispensing machine or potting equipment. The mixed adhesive is injected through a dispensing needle into the cavity of the packaging mold where the LED chip 3 is pre-placed (for surface-mount LEDs), or directly applied to the surface and surrounding area of ​​the LED chip 3 already fixed on the substrate (for COB integrated packaging). Under surface tension and mold constraints, the adhesive forms the desired lens shape or cover layer, completely encapsulating the LED chip 3. The dispensed workpiece (support or substrate) is then placed in a temperature-controlled oven or tunnel furnace for heat curing. Curing conditions are: temperature controlled between 100°C and 150°C (120°C in this embodiment), and time lasting 1 to 4 hours (2 hours in this embodiment). Under these conditions, components A and B of the colloidal substrate 1 undergo sufficient hydrosilylation reaction, completing cross-linking and curing, transforming from a viscous flow state to an elastic solid state. During the curing process, the uniformly dispersed inorganic color paste 2 particles are permanently fixed inside the newly formed organosilicon three-dimensional network, thereby forming a solid encapsulating colloid 100 in which the inorganic color paste 2 is uniformly dispersed inside.

[0042] Working principle and effects: The LED encapsulation colloid 100 operates as follows: In the non-powered state, ambient light shines on the colloid surface. Part of the light is reflected or scattered by the interface between the colloid substrate 1 and the inorganic color paste 2 particles, while the other part enters the colloid interior. Within the colloid, specific wavelengths of light are selectively absorbed by the inorganic color paste 2 (such as cobalt aluminum spinel), while other wavelengths are scattered or transmitted, perceived by the human eye, thus exhibiting the characteristic blue color of the inorganic color paste. In the powered state, the LED chip 3 (e.g., a chip emitting 450nm blue light) is lit, and the emitted light radiates in all directions. When the light reaches the encapsulation colloid 100, most of the light (especially light complementary to or close to the absorption wavelength of the color paste) can effectively pass through the gaps between the colloid substrate 1 and the inorganic color paste 2 particles. Because the inorganic color paste 2 particles are small in size, uniformly dispersed, and have weak absorption of the target wavelength (such as blue light), the light transmission loss is minimal. Ultimately, the emitted light color blends visually with the color of the colloid itself, presenting a harmonious and consistent blue luminescence effect. Because the inorganic color paste 2 is embedded within the colloid, its color is extremely difficult to detach or change due to external friction, scratches, or environmental erosion, exhibiting exceptional stability. Simultaneously, the inherent high-temperature and UV resistance of inorganic pigments ensures that the color remains consistent even under the heat and UV radiation generated by prolonged LED operation.

[0043] Example 2: A white LED encapsulant using an epoxy resin substrate This embodiment aims to illustrate another alternative combination of colloidal substrate 1 and inorganic color paste 2, and its application to white LEDs.

[0044] The main difference between this embodiment and Embodiment 1 lies in the selection of raw materials and the application objectives.

[0045] Colloidal Substrate 1: In this embodiment, epoxy resin is selected as colloidal substrate 1. Epoxy resin systems typically include an epoxy resin matrix and an amine or anhydride curing agent. This embodiment uses a modified epoxy resin with high light transmittance and resistance to yellowing, along with its matching curing agent.

[0046] Inorganic Pigment Paste 2: In this embodiment, titanium dioxide (TiO2) is used as the pigment in an inorganic white paste with a particle size D50 of approximately 0.2 μm. Titanium dioxide has high reflectivity and scattering properties across the entire visible light spectrum, strong tinting strength, and excellent weather resistance.

[0047] Proportion: The amount of inorganic color paste 2 added is 2.0% of the total mass of the colloid.

[0048] Preparation method process: The process is the same as in Example 1, including material preparation, premixing (mixing white paste with epoxy resin main agent), vacuum stirring and degassing (vacuum degree -0.1MPa, stirring for 15 minutes), dispensing / potting, and heat curing (curing temperature 135℃, time 2.5 hours).

[0049] Applications and Effects: This white encapsulating colloid was used to encapsulate a white LED device made by exciting yellow phosphors with a blue LED chip. In the non-powered state, the LED exhibits a uniform milky white color with a soft appearance. When powered on, the light emitted by the blue chip partially excites the phosphor to emit yellow light, which mixes to form white light. When the white light passes through the milky white colloid, it undergoes gentle scattering, resulting in a softer, more uniform light output without glaring spots. The milky white appearance of the colloid and the emitted white light are visually harmonious in color temperature, enhancing the product's perceived quality. Testing showed that after high temperature, high humidity, and UV aging tests, the whiteness retention rate of this white colloid was significantly higher than that of the comparative sample containing added organic white dye.

[0050] Example 3: A gold LED encapsulating colloid for COB packaging and its structure This embodiment aims to demonstrate the application of the present invention in a specific LED device structure—COB (Chip on Board) integrated packaging—and further clarify the complete structure of the LED device.

[0051] The LED device in this embodiment includes: LED chip 3: In this embodiment, multiple flip-chip blue LED chips are fixed to the circuit pads of a metal substrate (such as an aluminum substrate) by eutectic bonding or conductive adhesive.

[0052] LED encapsulation colloid 100 exhibiting a non-luminescent color: The composition and preparation method of this colloid 100 are similar to those described above, but specific parameters are different. The colloid substrate 1 is a modified silicone gel with a high refractive index to improve light extraction efficiency. The inorganic color paste 2 is a bismuth vanadate (BiVO4)-based inorganic golden yellow paste with an average particle size D50 of approximately 1.2 μm, added at 1.2% of the total colloid mass. This colloid 100 is applied using a dot-coating process to coat the LED chip 3 and fill the gaps between the chips, forming an integral encapsulation layer.

[0053] LED chips 3 are fixed to the substrate by solder joints. Subsequently, the mixed adhesive is applied to the chip array via the dispensing and curing process in step S4. After leveling, the adhesive completely covers the top and sides of each LED chip 3 and fills all gaps between the chips. After curing, the formed LED encapsulation colloid 100 achieves a gapless bond with the surface of the LED chip 3 and the surface of the substrate. This "gapless bond" means that the colloid is well-wetted between the colloid and the chip / substrate, with no visible bubbles or delamination, thus forming a dense, sealed protective layer. This protective layer not only provides mechanical support and environmental protection for the chip, but its golden appearance also constitutes the final visual appearance of the COB module.

[0054] Preparation method and effects: The preparation method is the same as in Example 1. Premixing involves mixing color paste with component B, with vacuum stirring and degassing parameters of -0.096 MPa for 25 minutes, and curing at 110°C for 3 hours. The resulting COB module exhibits an elegant and uniform gold color when not powered on, making it highly decorative. When powered on, the light emitted by the blue LED chip combines with the gold colloid, or, when combined with phosphor (such as phosphor that produces a warm tone), emits warm white light with a color temperature of 2700K-3000K. The golden appearance and warm white light complement each other perfectly, greatly enhancing the aesthetics and added value of the lighting fixture or light source product. Simultaneously, the integrated encapsulation structure provides excellent sealing and high reliability.

[0055] The technical solution described in the above-described embodiments of this application involves uniformly dispersing and curing inorganic color paste 2 within a colloidal substrate 1 to form an LED encapsulation colloid 100. This colloid 100 is then coated onto an LED chip 3 using a preparation method including material preparation, premixing, vacuum stirring and degassing, dispensing, and curing to manufacture an LED device. This solution achieves the core effect of the LED displaying a preset color through the colloid itself when not powered, and maintaining visually consistent light color when powered. It also brings multiple beneficial effects such as strong colorfastness and weather resistance, good process compatibility, and environmental friendliness and reliability.

[0056] It should be further explained that, through the dispensing and curing steps, the LED encapsulating colloid 100 can be molded into any desired shape according to the cavity or dispensing path of the encapsulation mold, such as a hemispherical lens, a planar cover layer, or other customized three-dimensional structures, thereby making this method flexibly applicable to the manufacture of LED products with various appearances and light emission requirements.

[0057] Obviously, the above-described embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention also intends to include these modifications and variations.

Claims

1. An LED encapsulating colloid that exhibits a non-luminescent color, characterized in that, include: Colloidal substrate (1); Inorganic color paste (2) is uniformly dispersed inside the cured colloidal substrate (1); The inorganic color paste (2) is used to make the LED encapsulation colloid present a preset color in the non-powered state, and transmit the light emitted by the LED chip (3) in the powered state, so that the color in the non-powered state is consistent with the color in the powered state.

2. The LED encapsulating colloid exhibiting a non-luminous color according to claim 1, characterized in that, The inorganic color paste (2) accounts for 0.1% to 5% of the total mass of the colloidal substrate (1) and the inorganic color paste (2).

3. The LED encapsulating colloid exhibiting a non-luminous color according to claim 1, characterized in that, The inorganic pigment paste (2) is an inorganic pigment dispersion that is resistant to high temperature and ultraviolet light, and its particle size is 0.1 μm to 10 μm.

4. The LED encapsulating colloid exhibiting a non-luminous color according to claim 1, characterized in that, The colloidal substrate (1) is one or more of silicone, epoxy resin, and modified silicone.

5. A method for preparing an LED encapsulating colloid exhibiting a non-luminescent color as described in any one of claims 1-4, characterized in that, Includes the following steps: S1: Prepare materials by weighing the A and B components of the colloidal substrate (1) and the inorganic color paste (2) according to the ratio. S2: Premixing, the inorganic color paste (2) is initially mixed with one of the A or B components of the colloidal substrate (1) to obtain a premix; S3: Vacuum stirring and degassing: The premix and another component of the colloidal substrate (1) are placed in a vacuum environment for stirring and mixing, so that the inorganic color paste (2) is evenly dispersed in the mixture and the bubbles are removed; S4: Dispensing and curing. The mixture processed in step S3 is injected into the encapsulation mold or dotted onto the surface of the LED chip (3) and then heated and cured to form a solid encapsulation colloid in which the inorganic color paste (2) is uniformly dispersed inside.

6. The preparation method according to claim 5, characterized in that, In step S3, the vacuum level of the vacuum environment is -0.095 MPa to -0.1 MPa, and the stirring time is 10 to 30 minutes.

7. The preparation method according to claim 5, characterized in that, In step S4, the temperature for heating and curing is 100°C to 150°C, and the curing time is 1 to 4 hours.

8. An LED device, characterized in that, include: LED chip (3); The LED encapsulation colloid (100) that presents a non-luminous color as described in any one of claims 1-4 covers the LED chip (3). The LED encapsulation colloid (100) is bonded to the surface of the LED chip (3) without gaps to form a sealed protective layer.

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