Circuit board assembly and manufacturing method thereof

Abstract

The invention provides a circuit board assembly manufacturing method which comprises the steps that a circuit board to be bent is provided, the circuit board to be bent is divided into a first area, a second area and a third area, the second area and the third area are connected with the first area, electronic elements and a plurality of first connecting pads are arranged in the second area, and the electronic elements are arranged among the first connecting pads arranged at intervals; the third area is provided with a first conduction body and a plurality of second conduction bodies, and the first conduction body is arranged among the plurality of second conduction bodies which are arranged at intervals. The first area is bent, so that the second area corresponds to the third area, the first conduction body is electrically connected with the electronic element, and the plurality of second conduction bodies are connected with the plurality of first connection pads one by one. Filling bodies are arranged between the second area and the third area, and the circuit board assembly is obtained. In addition, the invention also provides a circuit board assembly.

Description

Technical Field

[0001] This invention relates to the field of circuit board technology, and in particular to a method for manufacturing a circuit board assembly and a circuit board assembly manufactured by this method. Background Technology

[0002] Embedded component technology involves directly embedding surface mount components (SMDs) or some larger discrete components into the interior of a multilayer printed circuit board (PCB), which can be achieved by adding layers one by one.

[0003] However, this method involves a complex manufacturing process, requiring high-precision processing equipment and sophisticated techniques. For example, during manufacturing, each layer's etching, drilling, and electroplating processes must be executed with absolute precision; any deviation could render the entire circuit board unusable. Summary of the Invention

[0004] In view of this, it is necessary to provide a method for manufacturing a circuit board assembly that can solve the above-mentioned technical problems, and a circuit board assembly manufactured by such method.

[0005] A method for manufacturing a circuit board assembly includes the following steps: providing a circuit board to be bent, the circuit board being divided into a first region and a second region and a third region connecting the first region; the second region is provided with electronic components and a plurality of first connecting pads, the electronic components being disposed between the plurality of spaced-apart first connecting pads; the third region is provided with a first conductor and a plurality of second conductors, the first conductors being disposed between the plurality of spaced-apart second conductors; bending the first region so that the second region corresponds to the third region, the first conductors being electrically connected to the electronic components, and the plurality of second conductors being connected one-to-one to the plurality of first connecting pads; and providing a filler between the second region and the third region to obtain the circuit board assembly.

[0006] In some possible implementations, one end of the circuit board to be bent has a first region, a second region, and a third region, and the other end has another first region, another second region, and another third region. The two third regions are arranged adjacent to each other. The step of "bending the first region" includes bending the two first regions so that the two second regions correspond one-to-one with the two third regions, and forming a gap between the two second regions. The step of "providing a filler between the second region and the third region" includes providing a filler between the second region and the third region through the gap.

[0007] In some possible implementations, before the step "bending the first area", the second area and the third area are arranged side by side, and the step "bending the first area" includes: bending the opposite ends of the first area by 180 degrees.

[0008] In some possible implementations, the step of "bending the first region" further includes: providing a first electrical connector on a plurality of first connecting pads; providing a second electrical connector on the first conductor; and providing a third electrical connector on a plurality of second conductors, wherein the sum of the heights of the second conductors and the second electrical connectors is greater than the sum of the heights of the first connecting pads and the first electrical connectors.

[0009] The step of "bending the first area" further includes: connecting the first electrical connector and the second electrical connector, and connecting the second electrical connector and the electronic component.

[0010] In some possible implementations, the method for manufacturing the circuit board to be bent includes the steps of: providing a circuit board substrate, the circuit board substrate including an insulating layer, a first circuit layer and a second circuit layer disposed on opposite sides of the insulating layer, and an interlayer conductor penetrating the insulating layer and communicating between the first circuit layer and the second circuit layer, the first circuit including a plurality of first connection pads; electroplating a plurality of first conductors and a plurality of third conductors on the first circuit; electroplating the third conductors to form second conductors; and disposing electronic components on the circuit board to obtain the circuit board to be bent.

[0011] In some possible implementations, the method for manufacturing the circuit board to be bent further includes the step of: setting a cover layer on the second circuit layer.

[0012] A circuit board assembly includes a bent circuit board and a filler. The bent circuit board is divided into a first region and a second region and a third region connecting the first region. The second region contains electronic components and a plurality of first connecting pads. The electronic components are disposed between the spaced-apart first connecting pads. The third region contains a first conductor and a plurality of second conductors, with the first conductors disposed between the spaced-apart second conductors. The first region is bent such that the second region corresponds to the third region, and the first conductors are electrically connected to the electronic components. The plurality of second conductors are connected one-to-one to the plurality of first connecting pads. The filler is disposed between the second region and the third region.

[0013] In some possible implementations, an adhesive is also included, which is attached between the side of the electronic component away from the first conductor and the third region.

[0014] In some possible implementations, the first conductor and the electronic component are connected by conductive adhesive or solder, and the second conductor and the first connecting pad are connected by conductive adhesive or solder.

[0015] In some possible implementations, a cover layer is also included, which is disposed on the outer surface of the bent circuit board.

[0016] The circuit board assembly manufacturing method provided in this application involves first fabricating the circuit board to be bent and then performing the bending operation, allowing electronic components to be embedded within the bent circuit board. This reduces the complex alignment and connection processes between the internal circuitry of the multilayer circuit board and the embedded components. In this manufacturing method, etching only needs to be performed on the double-layer copper-clad substrate, reducing the process difficulty and lessening the precision requirements on the equipment, thereby lowering equipment purchase and maintenance costs. Furthermore, the subsequent bending operation replaces some of the complex interlayer connection processes, which helps to reduce process steps, shorten the production cycle, improve production efficiency, and ultimately reduce overall production costs. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments / methods of the present invention, the drawings used in the description of the embodiments / methods will be briefly introduced below. Obviously, the drawings described below are some embodiments / methods of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a partial cross-sectional schematic diagram of a double-sided copper-clad substrate provided in an embodiment of this application.

[0019] Figure 2 For etching Figure 1 The diagram shows a cross-sectional view of the first intermediate obtained by the double-sided copper-clad substrate.

[0020] Figure 3 for Figure 2 The diagram shows a cross-section of the first intermediate body after the opening is set.

[0021] Figure 4 for Figure 3 The diagram shows a cross-sectional view of an interlayer conductor installed inside the opening.

[0022] Figure 5 for Figure 4 The diagram shows a cross-sectional view of the first circuit layer after the first conductor is installed.

[0023] Figure 6 for Figure 5 The diagram shows a cross-section of a primary conductor after a secondary conductor has been added.

[0024] Figure 7 for Figure 6 The diagram shows a cross-section of the second line layer after the cover layer has been installed.

[0025] Figure 8 for Figure 7 The diagram shows a cross-section after the groove is filled with thermally conductive adhesive.

[0026] Figure 9 for Figure 8 The diagram shows a cross-sectional view of the electronic components after the thermally conductive adhesive has been applied.

[0027] Figure 10 for Figure 9 The diagram shows a cross-sectional view of the circuit board to be bent after the first conductor is connected to the first electrical connector.

[0028] Figure 11 for Figure 10 The diagram shows a cross-sectional view of the bent circuit board after it has been bent.

[0029] Figure 12 for Figure 11 A schematic diagram of the circuit board assembly obtained after filling the bent circuit board with filler.

[0030] Explanation of main component symbols

[0031] Circuit board assembly 100

[0032] 10 circuit boards to be bent

[0033] Zone 101

[0034] Second District 102

[0035] District 3, 103

[0036] Covering layer 11

[0037] Second line layer 12

[0038] Insulation layer 13

[0039] First Line Layer 14

[0040] First connecting pad 141

[0041] Second connecting pad 142

[0042] Third connecting pad 143

[0043] First electrical connector 144

[0044] Electronic Components 20

[0045] First copper foil layer 21

[0046] Second copper foil layer 22

[0047] First intermediate 23

[0048] Opening 231

[0049] Conductor 232

[0050] Double-sided copper-clad substrate 24

[0051] First conductor 30

[0052] Second electrical connector 301

[0053] Primary conductor 31

[0054] Secondary conductor 32

[0055] Second conductor 33

[0056] Second intermediate 34

[0057] Grooving 341

[0058] Thermal adhesive 342

[0059] 50 Bending circuit boards

[0060] Electromagnetic shielding structure 51

[0061] Filler 60

[0062] Length direction A

[0063] Thickness direction B

[0064] The following detailed description, in conjunction with the accompanying drawings, will further illustrate the present invention. Detailed Implementation

[0065] To better understand the above-mentioned objectives, features, and advantages of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0066] Numerous specific details are set forth in the following description to provide a thorough understanding of the invention. The described embodiments are only a part of, and not all, of the embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0067] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0068] The following will provide a more detailed description of the circuit board assembly manufacturing method and the circuit board assembly 100 formed therefrom provided by the present invention, in conjunction with the accompanying drawings and embodiments.

[0069] Please see Figures 1 to 12 One embodiment of this application provides a method for manufacturing a circuit board assembly 100, including the following steps:

[0070] S1: Please see Figure 10 A bendable circuit board 10 is provided. The bendable circuit board 10 has a length direction A. Along the length direction A, the bendable circuit board 10 is divided into a first region 101 and a second region 102 and a third region 103 connecting the first region 101. The second region 102 is provided with electronic components 20 and two first connecting pads 141. The electronic components 20 are disposed between the two spaced-apart first connecting pads 141. The third region 103 is provided with three first conductors 30 and two second conductors 33, with the three first conductors 30 arranged side by side between the two spaced-apart second conductors 33.

[0071] In this embodiment, the two ends of the circuit board 10 to be bent are respectively provided with a first region 101, a second region 102, and a third region 103. Along the length direction A, the two third regions 103 are arranged adjacent to each other. The two second regions 102 are respectively located at the outermost ends of the circuit board 10 to be bent.

[0072] In this embodiment, the circuit board 10 to be bent further has a thickness direction B. Along the thickness direction B, the circuit board 10 to be bent includes a cover layer 11, a second circuit layer 12, an insulating layer 13, and a first circuit layer 14 stacked sequentially. The method for manufacturing the circuit board 10 to be bent includes the following steps:

[0073] S101: Please refer to Figure 1A double-sided copper-clad substrate 24 is provided, comprising an insulating layer 13, a first copper foil layer 21, and a second copper foil layer 22. The first copper foil layer 21 and the second copper foil layer 22 are respectively disposed on opposite surfaces of the insulating layer 13. Along the length direction A of the double-sided copper-clad substrate 24, the double-sided copper-clad substrate 24 is divided into a first region 101, a second region 102, and a third region 103. The insulating layer 13 is made of polyimide (PI). In other embodiments of this application, the insulating layer 13 is made of either polyethylene terephthalate (PET) or polyethylene naphthalate (PEN).

[0074] S102: Please refer to Figure 2 The process involves etching the first copper foil layer 21 to obtain the first circuit layer 14, and etching the second copper foil layer 22 to obtain the second circuit layer 12, thereby obtaining the first intermediate 23. Specifically, the etching process includes drying, developing, and etching. The first circuit layer 14 includes two first connecting pads 141, two second connecting pads 142, and three third connecting pads 143 spaced apart. The two first connecting pads 141 are spaced apart in the second region 102, and the two second connecting pads 142 and the three third connecting pads 143 are located in the third region 103. The two second connecting pads 142 are spaced apart, and the three third connecting pads 143 are arranged side-by-side between the two second connecting pads 142.

[0075] S103: Please refer to Figure 3 An opening 231 is provided in the first intermediate body 23, the opening 231 penetrating the second circuit layer 12 and the insulating layer 13. Two first connecting pads 141 and two second connecting pads 142 are exposed at the bottom of the opening 231. The opening 231 is formed by mechanical drilling. In other embodiments, the opening 231 can be formed by laser etching, chemical etching, or other methods.

[0076] S104: Please refer to Figure 4An interlayer conductor 232 is formed by electroplating within the opening 231. The interlayer conductor 232 electrically connects the first connecting pad 141 and the second circuit layer 12, and also electrically connects the second connecting pad 142 and the second circuit layer 12. The second circuit layer 12, the interlayer conductor 232, and the first connecting pad 141 are electrically connected together. In other words, the interlayer conductor 232 electrically connects the first circuit layer 141 and the second circuit layer 12 together.

[0077] S105: Please refer to Figure 5 The first conductive body 30 is formed by electroplating on the side of the three third connecting pads 143 opposite to the insulating layer 13, and the first-level conductive body 31 is formed by electroplating on the two second connecting pads 142. The first conductive body 30 and the first-level conductive body 31 are formed simultaneously by selective electroplating. Along the thickness direction B, the heights of the first conductive body 30 and the first-level conductive body 31 are approximately the same.

[0078] S106: Please refer to Figure 6 A secondary conductor 32 is formed by electroplating on the primary conductor 31. The primary conductor 31 and the secondary conductor 32 together constitute the second conductor 33. Along the thickness direction B, the height of the second conductor 33 is greater than the height of the first conductor 30.

[0079] S107: Please see again Figure 6 A cover layer 11 is formed on the second circuit layer 12 to obtain the second intermediate 34. The cover layer 11 is made of materials such as polyimide (PI), polyester film, and polytetrafluoroethylene (PTFE). The cover layer 11 is used to protect the second circuit layer 12 from physical damage, chemical corrosion, and electromagnetic interference.

[0080] S107: Please refer to Figure 7 A slot 341 is provided in the second intermediate body 34, the slot 341 penetrating the first circuit layer 14 and the insulating layer 13, with a portion of the second circuit layer 12 exposed in the slot 341. The slot 341 is located in the second region 102, between the two first connecting pads 141. The slot 341 is formed by chemical etching.

[0081] S108: Please refer to Figure 8Thermally conductive adhesive 342 is disposed within the slot 341. The thermally conductive adhesive 342 is made of either silicone-based thermally conductive adhesive 342 or ceramic-filled thermally conductive adhesive 342. The thermally conductive adhesive 342 can transfer the heat generated by the electronic component 20 to the second circuit layer 12, thereby facilitating heat dissipation of the electronic component 20 and improving the reliability of the circuit board assembly 100.

[0082] S109: Please refer to Figure 9 The electronic component 20 is disposed in the slot 341 and fixed in the slot 341 by the thermally conductive adhesive 342. Part of the electronic component 20 protrudes from the slot 341.

[0083] S110: Please refer to Figure 10 A first electrical connector 144 is provided on the first connecting pad 141, and a second electrical connector 301 is provided on the first conductive body 30 to obtain the circuit board 10 to be bent. The first electrical connector 144 includes conductive adhesive or solder paste, copper paste, or other soldering materials. The second electrical connector 301 includes conductive adhesive or solder paste, copper paste, or other soldering materials. The sum of the heights of the second conductive body 33 and the second electrical connector 301 is greater than the sum of the heights of the first connecting pad 141 and the first electrical connector 144.

[0084] S2: Please see Figure 11 The circuit board 10 to be bent is bent so that the cover layer 11 is turned outwards, and the electronic component 20 and the first circuit layer 14 are wrapped inside, to obtain a bent circuit board 50. The bent area is the first region 101. After the first region 101 is bent, the second region 102 corresponds to the third region 103. The first conductor 30 is electrically connected to the electronic component 20, and multiple second conductors 33 are connected one-to-one to multiple first connecting pads 141.

[0085] In this embodiment, both ends of the circuit board 10 to be bent are bent, that is, the first area 101 at both ends is bent, so that the circuit board 10 to be bent takes on a roughly U-shaped structure after bending. Specifically, step S2 includes:

[0086] S201: A fixture (not shown) is provided, the fixture comprising a base (not shown) and two adjustable bending dies (not shown). Both bending dies are mounted on the base and their position and angle can be adjusted via a precise slide rail and screw adjustment system.

[0087] The bending die is made of high-strength aluminum alloy, possessing excellent rigidity and wear resistance. Its surface in contact with the circuit board 10 to be bent is covered with a layer of soft silicone material, 2mm-3mm thick, with a Shore hardness between 40A and 60A. This silicone material provides sufficient friction during bending to secure the circuit board 10 while preventing indentations or damage. A positioning pin (not shown) is also provided at the front end of each bending die. The positioning pin has a diameter of 0.5mm-1mm and engages with pre-set positioning holes (not shown) on the circuit board 10 to ensure accurate positioning of the circuit board 10 on the fixture.

[0088] S202: Bend each of the opposite ends of the first region 101 by 180 degrees. First, place the circuit board 10 to be bent on the base of the fixture, and accurately position the circuit board 10 to be bent by the engagement of the positioning pin and the positioning hole. Then, activate the adjustment device of the bending mold, move the two bending molds to the positions of the two ends of the first region 101 to be bent, and make the silicone material covering layer 11 tightly adhere to the circuit board 10 to be bent.

[0089] Next, the bending operation is initiated at a stable and slow speed. Using a motor-driven screw adjustment system, the two bending dies rotate in opposite directions at a speed of 5°-10° per minute, gradually bending both ends of the first zone 101. This continues until the opposite ends of the first zone 101 are bent to 180 degrees. At this point, the two second zones 102 precisely correspond to the two third zones 103, forming a gap of 0.5mm-1mm between the two second zones 102. The size of this gap can be precisely controlled by a fine-tuning device on the fixture to meet the requirements of the subsequent filling material 60 (see...). Figure 12 Requirements for the filling process.

[0090] In this embodiment, when the first electrical connector 144 is a conductive adhesive, step S2 further includes: irradiating the conductive adhesive with ultraviolet light to cure it. When the first electrical connector 144 and the second electrical connector 301 are solders, step S2 further includes: heating and melting the solder, cooling and curing it to form a solder joint between the first conductor 30 and the electronic component 20; simultaneously heating and melting the solder, cooling and curing it to form solder joints between multiple second conductors 33 and multiple connecting pads. The solder joints at each location can be used for electrical conduction. The second circuit layer 12, the second connecting pad 142, and the second conductor 33 together form an electromagnetic shielding structure 51, and the electronic component 20 is located within the electromagnetic shielding structure 51. The electromagnetic shielding structure 51 can prevent external electromagnetic interference.

[0091] S3: Please see Figure 12 A filler 60 is disposed between the second region 102 and the third region 103 to obtain the circuit board assembly 100. The filler 60 includes at least one of epoxy resin, silicone rubber, thermoplastic elastomer, alumina ceramic, boron nitride, copper powder filler, and composite filler. The filler 60 is used to fix the electronic components 20, enhance the structural strength of the circuit board assembly 100, assist in heat dissipation, buffer vibration and shock, improve insulation performance, and accommodate thermal expansion and contraction.

[0092] Compared with the prior art, the method for manufacturing the circuit board assembly 100 provided in this application has the following advantages:

[0093] (i) By first fabricating the circuit board 10 to be bent and then performing the bending operation, the electronic components 20 are embedded within the bent circuit board 50, thereby reducing the complex alignment and connection processes between the internal circuitry of the multilayer circuit board and the embedded components. In this fabrication method, etching only needs to be performed on the double-layer copper-clad substrate, reducing the process difficulty and lessening the precision requirements on the equipment, thus lowering equipment purchase and maintenance costs. Furthermore, the subsequent bending operation replaces some of the complex interlayer connection processes, which helps to reduce process steps, shorten the production cycle, improve production efficiency, and ultimately reduce overall production costs.

[0094] (ii) By bending, the second circuit layer 12, the second connecting pad 142 and the second conductor 33 are electrically connected, so that the second circuit layer 12, the second connecting pad 142 and the second conductor 33 together form an electromagnetic shielding structure 51, and the electronic component 20 is located in the electromagnetic shielding structure 51. The electromagnetic shielding structure 51 can prevent external electromagnetic interference.

[0095] Please see Figure 12 This application also provides a circuit board assembly 100, including a bent circuit board 50 and a filler 60. The bent circuit board 50 is divided into a first region 101 and a second region 102 and a third region 103 connecting the first region 101. An electronic component 20 and a plurality of connecting pads are disposed in the second region 102. The electronic component 20 is disposed between the plurality of spaced-apart connecting pads. The third region 103 is provided with a first conductor 30 and a plurality of second conductors 33. The first conductor 30 is disposed between the plurality of spaced-apart second conductors 33. The first region 101 is bent so that the second region 102 corresponds to the third region 103. The first conductor 30 is electrically connected to the electronic component 20, and the plurality of second conductors 33 are connected one-to-one to the plurality of connecting pads. The filler 60 is disposed between the second region 102 and the third region 103.

[0096] In this embodiment, multiple second conductors 33 are connected one-to-one with multiple first connection pads 141, and the second circuit layer 12 is connected to multiple first connection pads 141, thereby forming an enclosing electromagnetic shielding structure 51 around the electronic component 20. The electromagnetic shielding structure 51 can be used to shield the crosstalk of other electronic components 20 inside the circuit board assembly 100, as well as the electromagnetic interference of the external environment to the electronic components 20 inside the shielding structure.

[0097] In this embodiment, the first conductive body 30 and the electronic component 20 are connected by conductive adhesive or solder, and the second conductive body 33 and the connecting pad are connected by conductive adhesive or solder. The conductive adhesive or solder is used to achieve electrical connection.

[0098] In this embodiment, the circuit board assembly 100 further includes a cover layer 11, which is disposed on the outer surface of the bent circuit board 50. The cover layer 11 can be used to prevent the circuit board assembly 100 from being subjected to external physical damage, such as scratches or impacts, and to prevent moisture and humidity from entering the circuit board assembly 100, thereby preventing short circuits, corrosion, and other problems caused by moisture, and improving the reliability of the circuit board assembly 100 in different environments.

[0099] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. A method for manufacturing a circuit board assembly, characterized in that, Including steps: A circuit board to be bent is provided. The circuit board to be bent is divided into a first area and a second area and a third area connecting the first area. The second area is provided with electronic components and a plurality of first connecting pads. The electronic components are disposed between the plurality of first connecting pads that are spaced apart. The third area is provided with a first conductor and a plurality of second conductors. The first conductors are disposed between the plurality of second conductors that are spaced apart. The first region is bent so that the second region corresponds to the third region. The first conductor is electrically connected to the electronic component, and multiple second conductors are connected one by one to multiple first connection pads. A filler is disposed between the second region and the third region to obtain the circuit board assembly.

2. The manufacturing method as described in claim 1, characterized in that, One end of the circuit board to be bent is provided with a first area, a second area, and a third area, and the other end is provided with another first area, another second area, and another third area. The two third areas are arranged adjacent to each other. The step of "bending the first area" includes: The two first regions are bent so that the two second regions correspond one-to-one with the two third regions, and a gap is formed between the two second regions. The step of "providing a filler between the second region and the third region" includes: A filler is provided between the second and third zones through the gap.

3. The manufacturing method as described in claim 1, characterized in that, Before the step "bending the first area", the second area and the third area are arranged side by side. The step "bending the first area" includes bending the opposite ends of the first area by 180 degrees.

4. The manufacturing method as described in claim 1, characterized in that, Before the step "bending the first area", the method further includes: providing a first electrical connector on a plurality of first connecting pads; providing a second electrical connector on a first conductor; providing a second electrical connector on a plurality of second conductors, wherein the sum of the heights of the second conductors and the second electrical connectors is greater than the sum of the heights of the first connecting pads and the first electrical connectors; The step "bending the first area" further includes: connecting the first electrical connector and the second electrical connector, and connecting the second electrical connector and the electronic component.

5. The manufacturing method as described in claim 1, characterized in that, The method for manufacturing the circuit board to be bent includes the following steps: A circuit board is provided, the circuit board including an insulating layer, a first circuit layer and a second circuit layer disposed on opposite sides of the insulating layer, and an interlayer conductor penetrating the insulating layer and communicating the first circuit layer and the second circuit layer, wherein the first circuit includes a plurality of first connection pads. Electroplating is performed on the first line to form multiple first conductors and multiple third conductors; The third conductor is electroplated to form the second conductor, and electronic components are disposed on the circuit board to obtain the circuit board to be bent.

6. The manufacturing method as described in claim 5, characterized in that, The method for manufacturing the circuit board to be bent also includes the following steps: An overlay layer is provided on the second line layer.

7. A circuit board assembly, characterized in that, include: A bent circuit board is divided into a first region and a second region and a third region connecting the first region. The second region is provided with electronic components and a plurality of first connecting pads. The electronic components are disposed between the plurality of first connecting pads that are spaced apart. The third region is provided with a first conductor and a plurality of second conductors. The first conductors are disposed between the plurality of second conductors that are spaced apart. The first region is bent so that the second region corresponds to the third region. The first conductors are electrically connected to the electronic components, and the plurality of second conductors are connected one-to-one to the plurality of first connecting pads. A filler body is disposed between the second region and the third region.

8. The circuit board assembly as claimed in claim 7, characterized in that, It also includes an adhesive that connects the side of the electronic component away from the first conductor to the third region.

9. The circuit board assembly as claimed in claim 7, characterized in that, The first conductor and the electronic component are connected by conductive adhesive or solder, and the second conductor and the first connecting pad are connected by conductive adhesive or solder.

10. The circuit board assembly as claimed in claim 7, characterized in that, It also includes a cover layer disposed on the outer surface of the bent circuit board.

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