Display module and manufacturing method thereof

Abstract

The invention provides a display module and a manufacturing method thereof, and relates to the technical field of display devices.The manufacturing method of the display module comprises the steps that an LED chip array is attached to the mounting surface of a substrate layer, the surface of the LED chip array is coated with a liquid light-transmitting layer, and the surface of the liquid light-transmitting layer is covered with a fluorescent layer; the manufacturing method comprises the steps that a substrate layer, a coating liquid-state light-transmitting layer and a fluorescent layer are manufactured, then the substrate layer, the coating liquid-state light-transmitting layer and the fluorescent layer are subjected to press fit and thermosetting, then the light-transmitting layer and the fluorescent layer are cut, grooves are formed between at least part of adjacent LED chips, and finally the grooves are coated with isolation layers to obtain the display module. The mode that the light transmitting layer is integrally coated on the surface of the LED chip array, the fluorescent layer is integrally covered on the surface of the light transmitting layer, and then uniform cutting is carried out is adopted, the precision requirement is low, the steps are simple, the difficulty of the preparation technology can be reduced, and the problems that in the related technology, the steps of the manufacturing process of the display module are tedious, and the technology difficulty is high are solved.

Description

Technical Field

[0001] This application relates to the field of display device technology, specifically to display modules and their manufacturing methods. Background Technology

[0002] With the innovation and development of light-emitting diode (LED) display technology, LED display products have gradually entered all aspects of our lives, and mini chip-on-board (MINI COB) display modules with higher resolution have also become the mainstream LED display products.

[0003] In the field of MINI COB modules, not only is the demand for Mini Red-Green-Blue (MINI RGB) module solutions continuing to grow, but there is also a significant demand for MINI COB white light display modules. How to achieve uniform white light display modules with small pitch and display higher-definition images and videos has become a topic and direction for the display industry. Among related technologies, the manufacturing process of display modules is complicated and the process is difficult. Summary of the Invention

[0004] The purpose of this application is to provide a display module and its manufacturing method, which improves the problem of cumbersome manufacturing process and high technical difficulty in the related art.

[0005] On one hand, embodiments of this application provide a method for manufacturing a display module, including:

[0006] The LED chip array is mounted on the mounting surface of the substrate layer;

[0007] A liquid light-transmitting layer is coated on the surface of the LED chip array and the mounting surface of the substrate layer, and a fluorescent layer is covered on the surface of the liquid light-transmitting layer;

[0008] The substrate layer, the light-transmitting layer, and the fluorescent layer are laminated together, and the light-transmitting layer and the fluorescent layer are cured.

[0009] Cut the light-transmitting layer and the fluorescent layer, and form trenches between at least some of the adjacent LED chips;

[0010] An isolation layer is applied to the trench and the surface of the LED chip array to obtain a display module.

[0011] In one embodiment, in the step of cutting the light-transmitting layer and the phosphor layer to form a trench between at least partially adjacent LED chips, the width at the opening of the trench is greater than or equal to the width at the bottom of the trench in a direction perpendicular to the mounting surface of the substrate layer.

[0012] In one embodiment, prior to the step of coating an isolation layer in the trench and on the surface of the LED chip array to obtain the display module, the method further includes:

[0013] The light-transmitting layer and the fluorescent layer are cut, and the trenches are formed around each of the LED chips in the LED chip array.

[0014] In one embodiment, the step of coating a liquid light-transmitting layer on the surface of the LED chip array and the mounting surface of the substrate layer, and covering the surface of the liquid light-transmitting layer with a phosphor layer includes:

[0015] A liquid light-transmitting layer is coated on the surface of the LED chip array and the mounting surface of the substrate layer, so that the light-transmitting layer encapsulates the LED chip array;

[0016] A fluorescent layer is applied to the surface of the light-transmitting layer, wherein the fluorescent layer at least completely covers the LED chip array, and the width of the fluorescent layer is greater than the width of the LED chip array.

[0017] In one embodiment, the fluorescent layer used in the step of covering the surface of the light-transmitting layer with a fluorescent layer has a pre-set thickness of 0.05-0.2 mm.

[0018] In one embodiment, in the step of covering the surface of the light-transmitting layer with a fluorescent layer, the fluorescent layer gradually covers the light-transmitting layer from the middle to both ends.

[0019] In one embodiment, during the step of cutting the light-transmitting layer and the phosphor layer to form a trench between at least partially adjacent LED chips, the phosphor layer is cut while the light-transmitting layer remains continuous.

[0020] In one embodiment, in the step of coating an isolation layer in the trench and on the surface of the LED chip array to obtain a display module, the outermost portion of the isolation layer is connected to the substrate layer, or the outermost portion of the isolation layer fills a recess in the substrate layer, the recess in the substrate layer having a bottom lower than the bottom of the LED chip.

[0021] In one embodiment, the step of laminating the substrate layer, the light-transmitting layer, and the fluorescent layer includes:

[0022] The substrate layer, the light-transmitting layer, and the fluorescent layer are pressed together at a temperature of 120°C-130°C and a pressure of 0.1MPa-0.3MPa.

[0023] On the other hand, embodiments of this application also provide a display module manufactured by the display module manufacturing method described above.

[0024] According to the display module and its manufacturing method in the above embodiments, in the manufacturing method of the display module, an LED chip array is mounted on the mounting surface of a substrate layer, a liquid light-transmitting layer is coated on the surface of the LED chip array, and a phosphor layer is covered on the surface of the liquid light-transmitting layer. Then, the substrate layer, the coated liquid light-transmitting layer and the phosphor layer are pressed and thermoset together. Then, the light-transmitting layer and the phosphor layer are cut so that at least some adjacent LED chips form a trench, and the light-transmitting layer and the phosphor layer are aligned on the inner side of the trench. Finally, an isolation layer is coated in the trench to obtain the display module. In the manufacturing method provided in this application embodiment, the light-transmitting layer is coated on the surface of the LED chip array and the phosphor layer is covered on the surface of the light-transmitting layer in sequence, and then the layers are cut uniformly. The precision requirements are low and the steps are simple, which helps to reduce the difficulty of the manufacturing process. The light-transmitting layer and the phosphor layer are aligned on the inner side of the trench. During the process of coating the isolation layer into the trench, air bubbles are easily discharged, which improves the production efficiency and the reliability of the finished display module. This improves the problem of complicated steps and high process difficulty in the manufacturing process of display modules in related technologies. Attached Figure Description

[0025] Figure 1 A flowchart illustrating a method for manufacturing a first display module according to an embodiment of this application.

[0026] Figure 2 for Figure 1 A schematic diagram illustrating the manufacturing method of the provided display module.

[0027] Figure 3 This is a flowchart illustrating an embodiment of covering the surface of an LED chip array with a liquid light-transmitting layer and a phosphor layer.

[0028] Figure 4 This is a flowchart illustrating the lamination of a substrate layer, a light-transmitting layer, and a fluorescent layer according to an embodiment of this application.

[0029] Figure 5 A flowchart illustrating a method for manufacturing a second display module according to an embodiment of this application.

[0030] Figure 6 A flowchart illustrating a third method for manufacturing a display module according to an embodiment of this application.

[0031] Figure 7This is a schematic diagram of the structure of a display module provided in an embodiment of this application.

[0032] Figure 8 This is a schematic diagram of another display module provided in an embodiment of this application.

[0033] Figure 9 This is a schematic diagram of the structure of another display module provided in an embodiment of this application.

[0034] Figure 10 This is a schematic diagram of another display module provided in an embodiment of this application.

[0035] Figure 11 This is a schematic diagram of the structure of a groove in a display module provided in an embodiment of this application.

[0036] Figure 12 This is a schematic diagram of another type of trench in a display module provided in an embodiment of this application.

[0037] in:

[0038] 1. Display module; 10. Substrate layer; 20. LED chip; 30. Light-transmitting layer; 40. Phosphor layer; 50. Isolation layer; 60. Driving electronic components; 70. Trench. Detailed Implementation

[0039] The present application will be further described in detail below with reference to specific embodiments and accompanying drawings. Similar elements in different embodiments are referred to by associated similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of the present application. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, certain operations related to the present application are not shown or described in the specification. This is to avoid obscuring the core parts of the present application with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.

[0040] Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments, and the operational steps involved in each embodiment can also be rearranged or adjusted in a manner that is obvious to those skilled in the art. Therefore, the specification and drawings are only for clearly describing a particular embodiment and do not imply that they represent the necessary composition and / or order.

[0041] The serial numbers assigned to components in this document, such as "first" and "second," are used only to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages).

[0042] Please also refer to Figure 1 , Figure 2 and Figure 7 It should be noted that, Figure 2 Only some steps of the method for manufacturing a display module are shown. This application provides a method for manufacturing a display module, which includes the following steps:

[0043] S200: The LED chip array is mounted on the mounting surface of the substrate layer.

[0044] This application does not limit the specific form of the substrate layer 10. For example, it can be selected as a printed circuit board (PCB) substrate, a glass substrate, a flexible printed circuit board (FPC) substrate, etc. The specific form can be set according to the actual situation.

[0045] Furthermore, this embodiment does not limit the spacing between adjacent LED chips 20. For example, the spacing between LED chips 20 can be set to 0.7mm-0.9mm, specifically 0.7mm, 0.75mm, 0.8mm, or 0.9mm, etc., and can be set according to actual conditions. For example, in this embodiment, the spacing between LED chips 20 can be set to 0.8mm. In this embodiment, the LED chips 20 are specifically mounted on the display area of ​​the substrate layer 10.

[0046] This application does not limit the specific method of mounting the LED chip array. For example, in this embodiment, solder paste can be used to mount the LED chip array on the mounting surface of the substrate layer 10. In some other embodiments, other adhesives can also be used for mounting. The specific method can be set according to the actual situation.

[0047] S300: A liquid light-transmitting layer is coated on the surface of the LED chip array and the mounting surface of the substrate layer, and a phosphor layer is covered on the surface of the liquid light-transmitting layer.

[0048] This application embodiment does not limit the specific structure and form of the liquid light-transmitting layer 30. For example, in one embodiment, the liquid light-transmitting layer 30 can be made of epoxy resin, silicone or silicone resin, etc. In this embodiment, the liquid light-transmitting layer 30 can be used as an adhesive to adhere to the surface of the LED chip array and the substrate layer 10, and is also used to cover the surface of the fluorescent layer 40 on the liquid light-transmitting layer 30.

[0049] In addition, please see Figure 3 In one implementation, step S300 may specifically include:

[0050] Step S310: Apply a liquid light-transmitting layer to the surface of the LED chip array and the mounting surface of the substrate layer, so that the light-transmitting layer encapsulates the LED chip array.

[0051] Specifically, in this embodiment, the liquid light-transmitting layer 30 covers at least the display area of ​​the substrate layer 10. That is, in this embodiment, the liquid light-transmitting layer 30 needs to cover at least all the LED chips 20. Furthermore, the liquid light-transmitting layer 30 can be uniformly distributed in the aforementioned area. It is understood that since the liquid light-transmitting layer 30 is in an uncured liquid state with a certain viscosity and fluidity, uniformly distributing the liquid light-transmitting layer 30 in the aforementioned area facilitates a smoother phosphor layer 40 when it is subsequently covered.

[0052] Step S320: Cover the surface of the light-transmitting layer with a fluorescent layer, wherein the fluorescent layer at least completely covers the LED chip array, and the width of the fluorescent layer is greater than the width of the LED chip array.

[0053] In this embodiment, a pre-fabricated fluorescent layer 40 can be used. The pre-fabricated thickness of the fluorescent layer 40 can be set to 0.05mm-0.2mm, for example, it can be 0.05mm, 0.06mm, 0.08mm, 0.11mm, 0.13mm, 0.15mm, 0.18mm or 0.2mm, etc., and can be set according to the actual situation.

[0054] The fluorescent layer can be prepared by the following method:

[0055] A suitable silicone rubber or silicone resin is uniformly mixed with the corresponding phosphor powder to obtain a uniform liquid phosphor.

[0056] Use a high-precision scraper or similar tool to evenly coat the liquid fluorescent adhesive onto the flat film or flat plate.

[0057] After baking, a hardened plate-shaped flexible film is obtained to serve as a fluorescent layer, with a typical thickness of 0.05-0.2 mm.

[0058] The fluorescent layer prefabricated by the above method has a small thickness and uniform phosphor distribution inside, making it suitable for manufacturing thin and light display modules with uniform color.

[0059] A fluorescent layer 40 covers the surface of the light-transmitting layer 30. The area covered by the fluorescent layer 40 includes at least the display area. In a preferred embodiment, the coverage area of ​​the fluorescent layer 40 is significantly larger than the display area; for example, the fluorescent layer 40 can cover the entire substrate layer 10. This eliminates the need for precise alignment of the fluorescent layer 40 with the size of the display area during the covering process, thereby reducing the need for precise covering. Furthermore, in one embodiment, the fluorescent layer 40 can gradually cover the light-transmitting layer 30 from the middle to both ends, which can prevent or reduce the possibility of bubble formation.

[0060] It is understood that, in the embodiments of this application, the phosphor layer covering method has the characteristics of integral molding, high efficiency, high consistency, and high reliability. This avoids or reduces the problems of low efficiency, poor phosphor layer consistency, poor phosphor layer adhesion, and reliability risks that occur when a single phosphor layer is applied to each LED chip 20 in traditional processes.

[0061] S400: The substrate layer, the light-transmitting layer and the fluorescent layer are laminated together, and the light-transmitting layer and the fluorescent layer are cured.

[0062] This application does not limit the specific method of pressing. For example, in one embodiment, the substrate layer 10, the light-transmitting layer 30 and the fluorescent layer 40 can be pressed together by high temperature vacuum pressing, and the light-transmitting layer 30 can achieve preliminary cross-linking and hardening after pressing.

[0063] For further details, please refer to Figure 4 In one implementation, step S400 may specifically be step S410.

[0064] Step S410: Press the substrate layer, the light-transmitting layer and the phosphor layer together, and squeeze part of the light-transmitting layer to the surrounding area to make the light-transmitting layer above the LED chip thinner; wherein, the pressing temperature is 120℃-130℃ and the pressure is 0.1MPa-0.3MPa.

[0065] This application does not limit the specific values ​​of the pressing temperature and pressure. For example, in one embodiment, pressing can be performed at 120°C and 0.1 MPa; in another embodiment, pressing can be performed at 125°C and 0.2 MPa; and in yet another embodiment, pressing can be performed at 130°C and 0.3 MPa. The specific settings can be made according to actual conditions. During this process, part of the light-transmitting layer shifts to the surrounding area under vacuum and pressure, making the light-transmitting layer above the LED significantly thinner. This improves the thickness uniformity of the light-transmitting layer, allowing the phosphor layer to cover the relatively flat surface of the light-transmitting layer, thereby improving the color uniformity of the display module.

[0066] Furthermore, in one embodiment, step S410 may be followed by step S420.

[0067] Step S420: Curing the light-transmitting layer and the fluorescent layer.

[0068] This application embodiment can cure the light-transmitting layer and the fluorescent layer by heating. The heating curing conditions are 140-160℃ / 2.5-3.5hr. This application embodiment does not limit the specific heating curing conditions. For example, in one embodiment, the heating curing conditions can be 140℃ / 2.5hr; in another embodiment, the heating curing conditions can be 150℃ / 3hr; and in yet another embodiment, the heating curing conditions can also be 160℃ / 3.5hr, etc., and can be set according to the actual situation. In this process, the optimal performance of the light-transmitting layer 30 can be achieved. This application embodiment is not limited to the use of heating curing method; UV light curing can also be used. The specific curing method is not limited, as long as the curing of the light-transmitting layer and the fluorescent layer can be achieved.

[0069] S500: Cut the light-transmitting layer and the phosphor layer, and form a trench between at least some of the adjacent LED chips.

[0070] After this step, the LED chip 20 can be cut into independent light-emitting units. In this embodiment, at least some adjacent LED chips 20 are cut with grooves that are consistent in both the horizontal and vertical directions. Specifically, in this embodiment, since the cutting blades have the same width, the cut grooves can have a consistent width. This embodiment does not limit the width of the grooves; the width of the grooves can be set between 0.1mm and 0.3mm, for example, 0.1mm, 0.2mm, 0.25mm, or 0.3mm, etc., and can be set according to the actual situation.

[0071] This application embodiment can employ various cutting methods. For example, in one embodiment, a vertical cut can be made from top to bottom. Furthermore, this application embodiment does not limit the cutting depth. For instance, in one embodiment, the fluorescent layer 40 can be cut, and a portion of the light-transmitting layer 30 can be cut to maintain the continuity of the light-transmitting layer 30. Please refer to [link to relevant documentation]. Figure 2 After the trench is formed, the portion of the light-transmitting layer 30 left after cutting forms the bottom of the trench, ensuring continuity between the light-transmitting layers 30 on different LED chips 20. This avoids cutting into the substrate layer 10, reduces the requirement for cutting precision, and improves cutting efficiency. Alternatively, in another embodiment, both the phosphor layer 40 and the light-transmitting layer 30 can be cut off. In this case, the bottom of the trench can be formed by the substrate, and the specific configuration can be adjusted according to actual conditions. In this embodiment, the phosphor layer 40 and the light-transmitting layer 30 are aligned on the inner surface of the trench 70, which helps to eliminate air bubbles generated during the subsequent coating of the isolation layer 50 within the trench 70, thereby improving the overall reliability of the product.

[0072] Furthermore, this application does not limit the specific form of the cutting blade. For example, in one embodiment, a circular or annular cutting blade can be used, and the blade thickness can be set to 0.2 mm, with the blade rotation speed set to 20,000-30,000 rpm. In another embodiment, laser cutting or similar methods can also be used, and the specific settings can be adjusted according to actual conditions.

[0073] It should be noted that the embodiments of this application do not limit the specific form and structure of the trenches described above. Please refer to [link / reference]. Figure 11 For example, in one embodiment, the trench 70 may be square in shape. That is, in this embodiment, the width of the trench 70 at its opening is equal to the width of the trench 70 at its bottom in the direction perpendicular to the mounting surface of the substrate layer 10, to facilitate the subsequent application of the isolation layer 50 within the trench 70. Please refer to [link to relevant documentation]. Figure 12 For example, in another embodiment, the shape of the trench 70 can be a shape with a larger upper area and a smaller lower area. That is, in this embodiment, in the direction perpendicular to the mounting surface of the substrate layer 10, the width at the opening of the trench 70 is greater than the width at the bottom of the trench 70. This can facilitate the subsequent coating and filling of the isolation layer 50, and further facilitate the elimination of air bubbles generated during the coating process of the isolation layer 50, thereby improving the reliability of the entire product.

[0074] In addition, please see Figure 5 In some implementations, step S500 may be followed by:

[0075] Step S510: Cut the light-transmitting layer and the phosphor layer, and form grooves around each LED chip in the LED chip array.

[0076] It is understood that in this implementation, not only are grooves cut between adjacent LED chips 20, but also on the outer periphery of LED chips 20 located at the edge of the LED chip array. This allows the isolation layer 50 to be filled around the LED chips 20, thereby avoiding or reducing light leakage.

[0077] S600: An isolation layer is applied to the trench and the surface of the LED chip array to obtain a display module.

[0078] It is understood that after the trench is dug, the isolation layer 50 can be coated inside the trench and applied to the surface of the LED chip array, specifically the surface of the phosphor layer 40, to ultimately form the display module. It should be noted that this application does not limit the specific composition of the isolation layer 50. For example, in one embodiment, the isolation layer 50 may contain at least one of nano-silica, nano-alumina, nano-zirconium tungstate, and carbon powder, and the particle size of the isolation layer 50 can be set to 5nm~200nm, for example, 5nm, 50nm, 100nm, 150nm, 180nm, or 200nm, etc., which can be set according to actual conditions and are not limited here. Furthermore, the isolation layer 50 can be gray, with a certain light transmittance, serving as a highly consistent outer surface for the entire display module. The isolation layer 50 can also have a light absorption effect, preventing interference between different LED chips 20, thereby enabling the entire display module to have high contrast when emitting light.

[0079] In one embodiment, the coating area of ​​the isolation layer 50 may be larger than the display area; please refer to [further details omitted]. Figure 8 As shown, in this embodiment, the outermost part of the isolation layer 50 is directly connected to the substrate layer 10, which can further prevent or reduce the possibility of light leakage from the LED chip 20 located at the edge.

[0080] Please also refer to Figure 9 and Figure 10 In other embodiments, the aforementioned trenches can be adjusted to adapt to the specific structure of the substrate layer. Please refer to [link to relevant documentation]. Figure 9 In this embodiment, the substrate layer 10 can be configured with a stepped structure at the edge of the LED chip array, and the bottom of the stepped structure is lower than the bottom of the LED chip 20. This allows the outermost portion of the isolation layer 50 to fill the aforementioned stepped structure, further preventing or reducing the possibility of light leakage from the LED chip 20 located at the edge. Similarly, please refer to... Figure 10In this embodiment, the substrate layer 10 may have a groove structure at the edge of the LED chip array, and the bottom of the groove is lower than the bottom of the LED chip 20. This allows the outermost portion of the isolation layer 50 to fill the aforementioned groove structure, thereby further preventing or reducing the possibility of light leakage from the LED chip 20 located at the edge. By providing a recess at the edge of the substrate layer 10, the recess may include a stepped structure or a groove. The shape of the recess is not limited, as long as the recess has a bottom and the bottom of the recess is lower than the bottom of the LED chip 20, the outermost portion of the isolation layer 50 filling the recess can prevent or reduce the possibility of light leakage from the LED chip 20 located at the edge.

[0081] Please see Figure 6 It is understood that, in some implementations, the method for manufacturing the display module may further include:

[0082] Step S100: Mount the driving electronic components on the surface of the substrate layer.

[0083] It is understood that the driving electronic components 60 are disposed opposite to the LED chip array on two surfaces of the substrate layer 10. In this embodiment, the driving electronic components are mounted on the back side of the substrate layer, and step S200 corresponds to mounting the LED chip array on the mounting surface opposite to the back side of the substrate layer.

[0084] This application does not limit the specific method by which the driving electronic component 60 is mounted on the substrate layer 10. For example, it can be mounted on the substrate layer 10 by surface mount technology (SMT).

[0085] It should be noted that the specific order of steps S100 is not limited in the embodiments of this application. For example, step S100 can be set as the first step or the last step. The specific order can be set according to the actual situation.

[0086] In summary, according to the manufacturing method of the display module in the above embodiments, the LED chip array is mounted on the mounting surface of the substrate layer 10, a liquid light-transmitting layer 30 is coated on the surface of the LED chip array, and a phosphor layer 40 is covered on the surface of the liquid light-transmitting layer 30. Then, the substrate layer 10, the liquid light-transmitting layer 30 and the phosphor layer 40 are pressed and thermoset together. Then, the light-transmitting layer 30 and the phosphor layer 40 are cut to form grooves between at least some adjacent LED chips 20. Finally, an isolation layer 50 is coated in the grooves to obtain the display module. In the manufacturing method provided in this application embodiment, the light-transmitting layer 30 is coated on the surface of the LED chip array and the phosphor layer 40 is covered on the surface of the light-transmitting layer 30, and then cut uniformly. The precision requirements are low and the steps are simple, which helps to reduce the difficulty of the manufacturing process and improves the problem of complicated steps and high process difficulty in the manufacturing process of display modules in related technologies.

[0087] In addition, please see Figures 7 to 10 This application also provides a display module 1, which may include: a substrate layer 10, LED chips 20, a light-transmitting layer 30, a phosphor layer 40, an isolation layer 50, and a driving electronic component 60. A plurality of LED chips 20 are arrayed on the mounting surface of the substrate layer 10. The light-transmitting layer 30 and the phosphor layer 40 cover the surfaces of the LED chips 20 and the substrate layer 10 in a direction away from the substrate layer 10. At least partially adjacent LED chips 20 form trenches 70. The light-transmitting layer 30 and the phosphor layer 40 are aligned on the inner sides of the trenches 70. The isolation layer 50 fills the interior of the trenches 70. The driving electronic component 60 is located on the back side of the substrate layer 10 opposite to the mounting surface. This display module 1 can be manufactured by the method described above.

[0088] The above examples illustrate this application only to aid understanding and are not intended to limit its scope. Those skilled in the art to which this application pertains can make various simple deductions, modifications, or substitutions based on the ideas presented.

Claims

1. A method for manufacturing a display module, characterized in that, include: The LED chip array is mounted on the mounting surface of the substrate layer; A liquid light-transmitting layer is coated on the surface of the LED chip array and the mounting surface of the substrate layer, and a fluorescent layer is covered on the surface of the liquid light-transmitting layer; The substrate layer, the light-transmitting layer, and the fluorescent layer are laminated together, and the light-transmitting layer and the fluorescent layer are cured. The light-transmitting layer and the fluorescent layer are cut to form a trench between at least partially adjacent LED chips, with the light-transmitting layer and the fluorescent layer aligned on the inner side of the trench. An isolation layer is applied to the trench and the surface of the LED chip array to obtain a display module.

2. The method for manufacturing a display module as described in claim 1, characterized in that, In the step of cutting the light-transmitting layer and the phosphor layer to form a trench between at least partially adjacent LED chips, the width of the trench opening is greater than or equal to the width of the trench bottom in a direction perpendicular to the mounting surface of the substrate layer.

3. The method for manufacturing a display module as described in claim 1, characterized in that, Before the step of coating an isolation layer in the trench and on the surface of the LED chip array to obtain the display module, the following steps are also included: The light-transmitting layer and the fluorescent layer are cut, and the trenches are formed around each of the LED chips in the LED chip array.

4. The method for manufacturing a display module as described in claim 1, characterized in that, The step of coating a liquid light-transmitting layer on the surface of the LED chip array and the mounting surface of the substrate layer, and covering the surface of the liquid light-transmitting layer with a phosphor layer includes: A liquid light-transmitting layer is coated on the surface of the LED chip array and the mounting surface of the substrate layer, so that the light-transmitting layer encapsulates the LED chip array; A fluorescent layer is applied to the surface of the light-transmitting layer, wherein the fluorescent layer at least completely covers the LED chip array, and the width of the fluorescent layer is greater than the width of the LED chip array.

5. The method for manufacturing a display module as described in claim 4, characterized in that, In the step of covering the surface of the light-transmitting layer with a fluorescent layer, the fluorescent layer gradually covers the light-transmitting layer from the middle to both ends.

6. The method for manufacturing a display module as described in claim 1, characterized in that, In the step of cutting the light-transmitting layer and the phosphor layer to form trenches between at least some of the adjacent LED chips, the phosphor layer is cut while the light-transmitting layer remains continuous.

7. The method for manufacturing a display module as described in claim 1, characterized in that, In the step of coating an isolation layer in the trench and on the surface of the LED chip array to obtain a display module, the outermost portion of the isolation layer is connected to the substrate layer, or the outermost portion of the isolation layer fills a recess in the substrate layer, the recess in the substrate layer having a bottom lower than the bottom of the LED chip.

8. The method for manufacturing a display module as described in claim 1, characterized in that, The step of laminating the substrate layer, the light-transmitting layer, and the fluorescent layer includes: The substrate layer, the light-transmitting layer, and the fluorescent layer are pressed together at a temperature of 120°C-130°C and a pressure of 0.1MPa-0.3MPa.

9. The method for manufacturing a display module as described in claim 4, characterized in that, The fluorescent layer used in the step of covering the surface of the light-transmitting layer with a fluorescent layer has a pre-set thickness of 0.05-0.2 mm.

10. A display module, characterized in that, It is manufactured by the method of manufacturing a display module as described in any one of claims 1-9.

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