De-layering uneven substrates

Abstract

The invention relates to the removal of an edge region (14, 14 ') of a working layer (12, 12') arranged on an uneven substrate (10) by means of a layer removal device (100). The delamination device (100) has a delamination unit (20), a working plane movement unit (30) and a distance adjustment unit (50). The delamination unit (20) is designed to remove the edge region (14, 14 ') and has a delamination outlet (22, 22'), which is designed to be arranged opposite the working layer (12, 12 '). The working plane movement unit (30) is designed to move the delamination unit (20) in the working plane (40) above the edge region (14, 14 '). The distance adjustment unit (50) is designed to maintain a deviation from a predetermined distance between the delamination outlet (22) of the delamination unit (20) and the surface (16) of the edge region (14) in a distance direction (z) perpendicular to the working plane (40) within a predetermined deviation value when the delamination unit (20) is moved in the working plane (40) above the edge region (14, 14 '). This makes it possible to improve the removal of edge regions of the working layer on an uneven substrate.

Description

Technical Field

[0001] This invention relates to delamination of uneven, particularly curved, substrates. It provides an apparatus and method for removing edge regions of a working layer from an uneven, particularly curved, substrate. Background Technology

[0002] US 2006 / 0003591 A1 describes a method for removing edge protrusions on a wafer. The method includes: providing a wafer having a layer; coating the layer with photoresist; rotating the wafer; and removing the edge protrusion from the wafer by removing an edge bulge portion of the edge protrusion in a first step and removing an edge segment of the edge protrusion in a second step. Summary of the Invention

[0003] It can be seen as an object of the present invention to provide a delamination apparatus, a delamination module, a delamination system, a substrate processing system, and a method for removing edge regions of a working layer disposed on an uneven substrate, which can achieve better removal of edge regions of a working layer disposed on an uneven substrate, particularly a curved substrate.

[0004] According to a first aspect of the present invention, a delamination apparatus for removing edge regions of a working layer disposed on an uneven substrate is provided. The delamination apparatus includes a delamination unit, a working plane movement unit, and a distance adjustment unit. The delamination unit is configured to remove the edge regions and has a delamination outlet. The delamination outlet is configured to be disposed opposite to the working layer. The working plane movement unit is configured to move the delamination unit in the working plane above the edge regions. The distance adjustment unit is configured to maintain a deviation of a predetermined distance in a distance direction perpendicular to the working plane between the delamination outlet of the delamination unit and the surface of the edge regions within a predetermined deviation value when the delamination unit moves in the working plane above the edge regions. Because the distance adjustment unit is provided, and this distance adjustment unit is configured to maintain a deviation of the predetermined distance in the distance direction between the delamination outlet of the delamination unit and the surface of the edge regions within a predetermined deviation value when the delamination unit moves in the working plane above the edge regions, collision between the delamination unit and the substrate can be avoided, and the edge regions of the working layer can be removed with improved accuracy on uneven substrates. By maintaining a nearly constant distance between the delamination outlet and the surface of the edge region, an almost straight edge can be produced at the transition from the removed edge region to the working layer. This reduces edge effects, which can be amplified in the case of non-straight, particularly wavy, edges. Wavy edges occur particularly when the distance between the delamination outlet and the surface of the edge region fluctuates and the removed surface depends on the distance from the delamination outlet to the surface of the edge region. This is the case, for example, when the delamination outlet is not arranged perpendicular to the surface of the edge region, but at an angle relative to the surface, for example, at 45°, and / or the delamination outlet has a tapered output volume, such that larger surfaces are removed at a greater distance and smaller surfaces are removed at a smaller distance.

[0005] The distance between the delamination outlet of the delamination unit and the surface of the edge region in a direction perpendicular to the working plane can be, for example, the minimum vertical distance between the point of the delamination outlet closest to the surface, particularly its distal end, and the surface of the edge region. However, this distance can also be the vertical distance from any other point of the delamination outlet to the surface of the edge region.

[0006] The delamination outlet can be configured to apply a delamination agent, such as a dissolving medium or an etching medium, to the edge region to remove the edge region. The delamination outlet can be, for example, the outlet of a nozzle. The delamination outlet can be configured to apply the delamination agent to a surface of the edge region that is vertically related to the distance between the delamination outlet and the surface of the edge region. This allows for the removal of surfaces of different sizes depending on the distance between the delamination outlet and the surface of the edge region. For example, the delamination outlet can be configured to produce a tapered output volume, thereby removing larger surfaces at a greater distance and smaller surfaces at a smaller distance. Alternatively or additionally, the delamination outlet can be arranged perpendicular to the surface of the edge region or at an angle relative to the surface of the edge region, for example, at an angle between 5° and 85°, particularly at an angle of 45°. This allows for the application of the delamination agent from the delamination outlet to the surface of the edge region at an angle, thereby removing surfaces of different sizes of the edge region depending on the distance between the delamination outlet and the surface of the edge region.

[0007] The distance adjustment unit can be configured to maintain a deviation from a predetermined distance within a predetermined deviation value of 6 mm or less, preferably 3 mm or less, during the movement of the delamination unit over the edge region in the working plane. The predetermined distance can be a fixed distance in the distance direction between the delamination exit of the delamination unit and the surface of the edge region, for example, a distance in the distance direction optimized for processing the edge region. The predetermined distance can also be variable along the edge region, for example, according to a predetermined height profile. This can enable edge region removal based on a height profile. The height profile can be, for example, a measured height profile of the working layer or uneven substrate on the substrate. The height profile of the working layer or uneven substrate can be measured, for example, before or during edge region removal. Alternatively, the height profile can also be a predetermined height profile that creates a predetermined structure on the edge region or at the transition between the removed edge region and the working layer. Furthermore, the predetermined height profile can take into account the height profile of the working layer and / or the uneven substrate.

[0008] The substrate can be, for example, a angular substrate. An angular substrate is a substrate that is not perfectly circular. In other words, a angular substrate is a substrate with longitudinal sides connected to each other via corners. One, several, or all corners of the angular substrate can be rounded. An angular substrate can be, for example, rectangular or square.

[0009] A delamination unit may be or include a delamination head having one or more nozzles. In this case, the delamination outlet is the outlet of one of the nozzles or one of the multiple nozzles. Multiple delamination outlets may also be provided, each at a different nozzle. The nozzles may be configured to apply a dissolving or etching medium to a working layer on the substrate to remove portions of the working layer, particularly edge regions. The delamination unit may also have multiple delamination heads, such as two delamination heads. The delamination heads may be arranged on opposite longitudinal sides of the substrate in the working plane. Each delamination head may have one or more nozzles. A greater number of nozzles allows for increased processing speed and greater flexibility in the material to be removed, as different media can be supplied to the nozzles.

[0010] The uneven substrate can be a curved substrate, particularly one curved along one or more directions or in one or more planes. For example, the edges of the substrate may have a convex profile along a cross-section perpendicular to the working plane. Alternatively or additionally, the uneven substrate may have a non-smooth, non-planar, or non-flat surface, i.e., one or more protrusions and / or depressions may be present on the surface. The substrate may also have structures, such as circuitry, arranged on the substrate below the working layer. In this case, these structures should be understood as part of the substrate and should be distinguished from the working layer. The substrate and the working layer are formed of different materials. The substrate may, for example, be formed of glass. The substrate may, for example, have a substrate thickness between 100 μm and 1 cm, for example between 200 μm and 6 mm, particularly between 200 μm and 3.5 mm. For example, for a curved substrate, the substrate thickness may be substantially constant, i.e., having a constant substrate thickness whose value deviates only a few μm along the substrate. For example, the lowest point of an uneven substrate may have a height difference between 100 μm and 2 cm, preferably between 1 mm and 15 mm, and particularly between 1 mm and 6 mm, relative to the highest point of the uneven substrate. For example, for a curved substrate, the height difference may be caused by the curvature.

[0011] The working plane motion unit may have one or more linear travel systems. These linear travel systems may be orthogonally oriented to each other. For example, the working plane motion unit may have two linear travel systems arranged orthogonally to each other in the working plane. These linear travel systems may, for example, be implemented as linear axes and configured to allow the delamination unit to move linearly in one direction within the working plane. This enables the delamination unit to move within the working plane.

[0012] The edge region can be, for example, between 0 mm and 20 mm, particularly between 100 μm and 1 mm.

[0013] The distance adjustment unit may include a distance sensor and a distance direction movement unit. The distance sensor may be configured to determine the distance in the distance direction between the delamination outlet of the delamination unit and the surface of the edge region. The distance direction movement unit may be configured to move the uneven substrate relative to the delamination outlet of the delamination unit in the distance direction based on the distance determined by the distance sensor. This ensures that the deviation from a predetermined distance in the distance direction between the delamination outlet of the delamination unit and the surface of the edge region is maintained within a predetermined deviation value while the delamination unit moves in the working plane above the edge region.

[0014] The distance direction motion unit can be configured to move the uneven substrate and the delamination outlet of the delamination unit relative to each other in the distance direction by a predetermined distance based on the distance determined by the distance sensor.

[0015] The distance direction motion unit can be a linear movement system, for example, in the form of a linear stage, configured to linearly move the substrate and / or the delamination unit in the distance direction. Moving the delamination unit also moves the delamination outlet relative to the substrate in the distance direction. Multiple distance sensors can also be provided, for example, each on a single delamination unit. Multiple distance direction motion units can also be provided, for example, one distance direction motion unit on each delamination unit or multiple distance direction motion units on each delamination unit. This enables the deviation in the distance direction from the surface of the delamination outlet and the edge region of the respective delamination unit to be kept within a predetermined deviation value during the movement of the respective delamination unit in the working plane above the edge region. Furthermore, if a delamination unit has multiple distance sensors and distance direction motion units, the deviation in the distance direction from the surfaces of the multiple delamination outlets and the edge regions, particularly the edge regions on the top and bottom sides, of the respective delamination unit can be kept within a predetermined deviation value during the movement of the respective delamination unit in the working plane above the edge region.

[0016] A distance sensor can be configured to determine the distance between the delamination outlet of the delamination unit and the surface of the edge region based on distance measurements, such as time-of-flight measurements or color difference measurements. The distance sensor can be, for example, a confocal color sensor configured to determine the distance based on color difference measurements. The distance sensor can have a signal transmitter and a signal receiver. The signal transmitter can be arranged at a predetermined distance from the delamination outlet of the delamination unit and configured to transmit a signal in the distance direction to the surface of the edge region. The signal can be reflected from the surface of the edge region, and the signal receiver can be configured to receive the reflected signal. The distance sensor can have a time-of-flight meter configured to determine the distance between the delamination outlet of the delamination unit and the surface of the edge region based on the time of flight of the signal. The distance sensor can be configured to generate a control signal based on the determined distance. The control signal can be transmitted to a distance adjustment unit so that it can control the distance adjustment unit to maintain a deviation from a predetermined distance in the distance direction between the delamination outlet of the delamination unit and the surface of the edge region within a predetermined deviation value. For example, the delamination outlet or substrate of the delamination unit can move in the distance direction based on a control signal.

[0017] The distance sensor may have a control unit configured to generate control signals. The control unit may include a time-of-flight meter. The time-of-flight meter may be a physical unit or implemented as software. The control signals may, for example, manipulate a stepper motor, linear motor, or other driver of the distance direction motion unit to match the distance in the distance direction between the delamination outlet of the delamination unit and the surface of the edge region, thereby keeping the deviation from a predetermined distance in the distance direction between the delamination outlet of the delamination unit and the surface of the edge region within a predetermined deviation value as the delamination unit moves above the edge region in the working plane.

[0018] The delamination apparatus may have a holding unit. The holding unit may be configured to hold a substrate. Alternatively or additionally, the holding unit may be configured to rotate the substrate relative to the delamination unit. The holding unit may be configured to be rotated about a rotation axis extending perpendicular to the working plane, so as to rotate the substrate relative to the delamination unit. This can enable the removal of edge regions on different longitudinal sides of an uneven substrate using a single delamination head.

[0019] The holding unit can be included in the distance adjustment unit or be part of the distance adjustment unit.

[0020] The holding unit may have one or more retainers. The retainer or retainers may be configured to hold an uneven substrate without contact. The retainer or retainers may, for example, be an air cushion retainer or a pneumatic retainer. Alternatively, the retainer or retainers may also hold the substrate in place, for example, by suction of the substrate. One or more pneumatic retainers and one or more retainers that suction the substrate may also be provided. The holding unit may, for example, have four retainers. These four retainers may be arranged relative to each other in a defined shape, for example, oriented relative to each other in a circular or square shape, to hold the uneven substrate.

[0021] The holding unit may have at least two holders configured to hold and fix corresponding areas of the bottom side of the uneven substrate. These holders may be arranged such that the unevenness of the substrate is reduced. This reduces the unevenness of the substrate so that a predetermined deviation in the distance direction between the surface of the delamination unit and the edge region is kept within a predetermined deviation value as the delamination unit moves above the edge region in the working plane. For example, the holders may be arranged along the curvature of the curved substrate to reduce or eliminate the curvature.

[0022] The retainer may have its own suction unit to pull the underside region of the substrate toward the retainer and thus further reduce the unevenness of the substrate. The suction unit may, for example, be configured to utilize the Bernoulli effect to generate a vacuum by means of airflow to suction the substrate.

[0023] The holding unit may have a movable holder. The movable holder may be configured to hold an uneven substrate. The distance adjustment unit may be configured to move the movable holder parallel to the delamination unit in a holding plane parallel to the working plane, such that the movable holder is at a constant distance from the delamination outlet of the delamination unit in the distance direction. Because the uneven substrate is held by the movable holder and the distance between the movable holder and the delamination outlet of the delamination unit remains constant in the distance direction during movement, the deviation from a predetermined distance in the distance direction between the delamination outlet of the delamination unit and the surface of the curved edge region of the substrate with a substantially constant substrate thickness can be kept within a predetermined deviation value as the delamination unit moves above the edge region in the working plane.

[0024] The movable retainer can be configured to retain uneven, particularly curved, substrates without contact. For this purpose, the movable retainer can be, for example, an air cushion retainer or a pneumatic retainer.

[0025] The delamination unit can be configured to simultaneously remove edge regions on the top side of the working layer and additional edge regions on the bottom side of the working layer. This enables faster and more complete removal of edge regions. Because the deviation in the distance direction between the delamination exit of the delamination unit and the surface of the edge region is kept within a predetermined deviation value as the delamination unit moves above the edge region in the working plane, collision between the delamination unit and the substrate can be avoided.

[0026] The delamination unit may have a top-side delamination head opposite the top side of the working layer and a bottom-side delamination head opposite the bottom side of the working layer. Alternatively, there may be only one delamination head on both the top and bottom sides, configured to remove edge regions on both sides in parallel. During operation of the delamination apparatus, the bottom-side delamination head may be arranged such that the substrate is located between the top-side and bottom-side delamination heads. The top-side and bottom-side delamination heads may have the same number and configuration of nozzles. Alternatively, they may have different numbers and / or configurations of nozzles. Depending on the nozzle configuration, it may operate at different pressures, for example, between 0.5 bar and 10 bar, particularly between 0.5 bar and 2 bar. Higher pressures may achieve improved delamination but will also increase nozzle wear. Depending on the nozzle configuration, this configuration may additionally or alternatively be supplied with different dissolving or etching media. Depending on the nozzle configuration, the nozzle may be suitable for different dissolving or etching media, such as chemically resistant ones. This enables the removal of edge regions formed from different materials. The dissolving or etching medium may be, for example, sodium persulfate, sulfuric acid (H2SO4), tetrabromoethane, hydrogen peroxide (H2O2), or nitrogen (N2).

[0027] The delamination device may have one or more rinsing nozzles. The rinsing nozzle or the plurality of rinsing nozzles may be included in or part of a delamination unit. The rinsing nozzle may be configured to apply a rinsing medium to the edge region to be removed, in order to rinse the edge region, particularly the dissolved material. The rinsing medium may be, for example, deionized (DI) water or alcohol, particularly isopropanol.

[0028] The delamination apparatus may have one or more suction units configured to remove dissolving and / or etching media along with the material being removed. This reduces or prevents contamination of the delamination apparatus, the substrate, and the working layer. For example, when etching and dissolving media are sprayed onto the edge regions of the working layer, small droplets of the etching and dissolving media, such as micro-jet particles, may be ejected from the edge regions into their surrounding environment, such as onto the substrate or the working layer. By suctioning the droplets during their flight phase, contamination of the substrate and the working layer can be prevented. Matching the pressure and the suction intensity provided by the one or more suction units ensures that no residual material (e.g., dissolving or etching media) remains on the surface at the edge of the substrate after the working layer is removed.

[0029] The delamination unit can be configured to remove edge regions of the working layer containing Ajinomoto deposited film (ABF), copper (Cu), or titanium (Ti). The edge regions may contain a predetermined percentage, preferably greater than 50%, of ABF, Cu, or Ti, or be formed from one or more of these materials. The edge regions may also be formed from or contain other materials, such as metals. Depending on the material to be removed, the delamination unit may include different numbers and / or configurations of nozzles. The dissolving or etching medium and / or pressure can be adapted to remove one or more materials. This enables optimized removal of edge regions from different materials.

[0030] According to another aspect of the invention, a delamination module is provided having a delamination apparatus according to at least one of claims 1 to 7 or any embodiment of a delamination apparatus. The delamination module additionally includes at least one media storage device. The media storage device is configured to contain one or more dissolving media, one or more etching media, or one or more dissolving media and one or more etching media, and to supply the dissolving media or etching media, or the dissolving media and etching media, to the delamination unit of the delamination apparatus.

[0031] According to another aspect of the invention, a delamination system is provided having one or more delamination modules as described in claim 8 or any of the embodiments thereof. The delamination system additionally includes a substrate transport system for transporting an uneven substrate. The substrate transport system may be configured to transport the uneven substrate between different modules, such as the delamination modules.

[0032] According to another aspect of the invention, a substrate processing system having one or more delamination systems as described in claim 9 or any embodiment thereof is provided. The substrate processing system additionally includes at least one functional module for processing uneven substrates. The substrate processing system may, for example, be configured for processing uneven substrates in the form of curved wafers, particularly curved glass wafers. The glass wafers may, for example, be rounded, angular glass wafers. The substrate processing system may, for example, include multiple functional modules, such as a spin coater, a chemical developing unit, one or more ovens, an exposure unit, etc., for processing uneven substrates.

[0033] According to another aspect of the present invention, a method for removing edge regions of a working layer disposed on an uneven substrate is provided. The method includes the following steps:

[0034] The de-lamination unit is moved above the edge region in the working plane with its de-lamination exit positioned opposite the working layer, and...

[0035] Edge regions are removed; wherein, the deviation of a predetermined distance in a distance direction perpendicular to the working plane between the delamination unit's delamination outlet and the surface of the edge region is maintained within a predetermined deviation value as the delamination unit moves above the edge region in the working plane. Because the deviation of the predetermined distance in the distance direction between the delamination unit's delamination outlet and the surface of the edge region is maintained within a predetermined deviation value as the delamination unit moves above the edge region in the working plane, edge regions can be removed with improved accuracy on uneven substrates, and thus, complete removal of the working layer's edge regions from the substrate is achieved.

[0036] The method may include one or more of the following steps:

[0037] A delamination unit configured for removing edge regions and having a delamination output is provided.

[0038] A working plane motion unit is provided, configured to move the de-lamination unit in the working plane above an edge region.

[0039] A distance adjustment unit is provided, configured to keep a deviation in the distance direction between the delamination unit and the surface of the edge region of the delamination unit within a predetermined deviation value when the delamination unit moves above the edge region in the working plane.

[0040] A distance sensor is provided, the distance sensor being configured to determine the distance in the distance direction between the delamination outlet of the delamination unit and the surface of the edge region.

[0041] A distance direction motion unit is provided, which is configured to move an uneven substrate and a delamination outlet of a delamination unit relative to each other in a distance direction based on a distance determined by a distance sensor.

[0042] Multiple or all steps can be performed in a meaningful order or in parallel with each other. Some steps can also be performed in parallel with each other and in sequence with one or more other steps.

[0043] The method may include one or more of the following steps:

[0044] Measure the distance between the de-delamination outlet and the edge region of the de-delamination unit in a direction perpendicular to the working plane;

[0045] Based on the distance between the delamination outlet of the delamination unit and the surface of the edge region determined by the distance sensor, the uneven substrate and the delamination outlet of the delamination unit are moved relative to each other in the distance direction to keep the deviation from the predetermined distance between the delamination outlet of the delamination unit and the surface of the edge region in the distance direction perpendicular to the working plane within a predetermined deviation value when the delamination unit moves above the edge region in the working plane.

[0046] Maintain an uneven substrate;

[0047] The uneven substrate is rotated relative to the delamination unit;

[0048] The uneven substrate is held in place at least two areas on the bottom side of the uneven substrate, thereby reducing the unevenness of the substrate.

[0049] During the holding of the uneven substrate by the movable holder, the movable holder is moved parallel to the delamination unit in the holding plane parallel to the delamination unit, such that the movable holder is at a constant distance from the delamination outlet of the delamination unit in the distance direction.

[0050] At the same time, remove the edge areas on the top side and the additional edge areas on the bottom side of the working layer;

[0051] Use a dissolving or etching medium that is compatible with the material of the edge area to remove the edge area.

[0052] Remove the edge regions of the working layer that contain ABF, Cu, or Ti.

[0053] According to another aspect of the present invention, the delamination apparatus according to at least one of claims 1 to 7, or the delamination apparatus of any embodiment thereof, is used for:

[0054] Remove edge regions; and / or

[0055] Remove the metal layer or paint from the edge areas; and / or

[0056] Remove the edge areas of the working layer on a rectangular substrate; and / or

[0057] Remove the edge regions of the working layer on the wafer.

[0058] According to another aspect of the invention, the method according to claim 11 or 12, or the method of any embodiment, is used for:

[0059] Remove edge regions; and / or

[0060] Remove the metal layer or paint from the edge areas; and / or

[0061] Remove the edge areas of the working layer on a rectangular substrate; and / or

[0062] Remove the edge regions of the working layer on the wafer.

[0063] According to another aspect of the present invention, a computer program product is provided for removing edge regions of a working layer disposed on an uneven substrate. The computer program product includes computer program code means that, when implemented on a processor, cause the processor to perform the method according to claim 11 or 12, or any of the methods described herein.

[0064] According to another aspect, a computer-readable medium is provided that stores a computer program product for removing edge regions of a working layer disposed on an uneven substrate. Alternatively or additionally, the computer-readable medium may store a computer program product according to one or more embodiments of the computer program product.

[0065] The delamination apparatus of claim 1, the delamination module of claim 8, the delamination system of claim 9, the substrate processing system of claim 10, the method of claim 11, the use of claim 13, the use of claim 14, and the computer program product of claim 15, as well as the computer-readable medium, may have similar and / or identical preferred embodiments as particularly defined in the dependent claims.

[0066] Furthermore, preferred embodiments of the present invention may also be combinations of features of the dependent claims or the foregoing embodiments with each of the corresponding independent claims.

[0067] These and other aspects of the invention are described in more detail below with reference to the embodiments shown in the accompanying drawings. Attached Figure Description

[0068] In the following figures:

[0069] Figure 1 An exemplary curved substrate having working layers made of Cu on the top and bottom sides is schematically and exemplarily shown.

[0070] Figure 2 A first embodiment of a delamination device in the xz plane is illustrated schematically and exemplary;

[0071] Figure 3 A first embodiment of a delamination device in the yz plane is illustrated schematically and exemplary;

[0072] Figure 4 A second embodiment of a delamination device in the xy plane is illustrated schematically and exemplary;

[0073] Figure 5 A third embodiment of a delamination device in the xz plane is illustrated schematically and exemplary;

[0074] Figure 6 A fourth embodiment of a delamination device in the xz plane is illustrated schematically and exemplary;

[0075] Figure 7 A fifth embodiment of a delamination device in the xz plane is illustrated schematically and exemplary;

[0076] Figure 8 A sixth embodiment of a delamination device in the xy plane is illustrated schematically and exemplary;

[0077] Figure 9 A seventh embodiment of a delamination device in the xy plane is illustrated schematically and exemplary;

[0078] Figure 10 An embodiment of a substrate processing system having functional modules, a substrate conveying system, and a delamination system including a delamination module and a delamination device is illustrated schematically and exemplary.

[0079] Figure 11 An exemplary diagram illustrating an embodiment of a method for removing edge regions of a working layer disposed on an uneven substrate. Detailed Implementation

[0080] Figure 1A curved substrate 10 is shown in cross-section in the xz plane. The substrate 10 has a working layer 12 made of Cu with edge regions 14 to be removed on its top side 18 and a working layer 12' made of Cu with edge regions 14' to be removed on its bottom side 18'. In this embodiment, the substrate is a rectangular glass wafer. In other embodiments, the substrate may have other shapes and / or be formed of other materials or multiple materials. In other embodiments, the working layers may be formed of other materials; for example, the working layer on the top side of the substrate may be formed of a different material than the working layer on the bottom side of the substrate. The working layers may also be formed of multiple materials.

[0081] The following Figures 2 to 9 Different embodiments of a delamination apparatus 100 for removing edge regions 14 and / or 14' of a working layer 12 and / or 12' disposed on an uneven substrate 10 are shown. The delamination apparatus 100 can be used, for example, to remove the edge regions 14 and / or 14' of a working layer in the form of a metal layer or varnish, which is disposed, for example, on a rectangular substrate, particularly a rectangular glass wafer. Components, assemblies, or units having substantially the same function in different embodiments of the delamination apparatus 100 are given the same reference numerals. For clarity, the use of reference numerals to designate all components in the different embodiments has been partially omitted.

[0082] Figure 2 A first embodiment of the delamination device 100 in the xz plane is shown in a schematic cross-sectional view, and Figure 3 A first embodiment of a delamination device 100 in the yz plane is shown. The delamination device 100 includes a delamination unit 20, a work plane motion unit 30, and a distance adjustment unit 50. In this embodiment, the delamination device 100 also includes a control unit 500. In other embodiments, the delamination device may also be connected to a control unit that controls the delamination device. The control unit may be, for example, a computer.

[0083] Delamination unit 20 is used to remove edge regions 14 and 14'. In this embodiment, delamination unit 20 includes two delamination outlets 22 and 22', which are respectively arranged opposite to working layers 12 and 12' and form the respective ends of nozzles 24 and 24'. Nozzles 24 and 24' are supplied with dissolving or etching media from their respective media reservoirs (not shown). Nozzle 24 sprays the dissolving or etching media from its delamination outlet 22 at a predetermined pressure, preferably between 0.5 bar and 10 bar, onto the surface 16 of the edge region 14 on the top side 18 of the substrate 10 to remove the edge region 14. The dissolving or etching media and pressure are adapted to the material to be removed from the working layer. To remove the working layer 12 made of Cu from the substrate 10 in the form of a rectangular glass wafer using the delamination apparatus 100 of the first embodiment, the pressure is between 0.5 bar and 2 bar, and an ammonia-sodium chlorite mixture or a sodium persulfate-sulfuric acid mixture is used as the dissolving or etching media. To enable the delamination unit 20 to spray the etching medium, it is formed of a chemically resistant material, such as polyetheretherketone (PEEK) for ammonia-sodium chlorite mixtures and quartz for sodium persulfate-sulfuric acid mixtures. In other embodiments, the delamination unit may also be configured to remove, for example, edge regions of the working layer containing ABF or Ti.

[0084] In addition to nozzle 24, the delamination unit 20 also includes two rinsing nozzles 26 arranged alongside nozzle 24 to spray rinsing media onto the surface 16 of the edge region 14 to wash away dissolved material and leaching or etching media. Depending on the direction in which the delamination unit 20 moves, one or the other rinsing nozzle 26 can be used to follow nozzle 24 in spraying rinsing media onto the surface 16. Alternatively, the rinsing nozzles 26 can also operate in parallel.

[0085] As an alternative to or supplement to the rinsing nozzle, one or more suction units may be provided to suction the dissolving and etching media, rinsing media, and / or removed material. The suction unit may be designed in a nozzle shape and / or generate negative pressure to draw in and remove the media and / or material. The suction unit may, for example, be arranged on one or more delamination heads. Alternatively, the suction unit may be a separate unit. The suction unit can reduce or prevent contamination of the delamination apparatus, as well as the substrate and working layer.

[0086] The delamination outlet 22' of the nozzle 24', arranged opposite to the working layer 12', sprays a dissolving or etching medium from its delamination outlet 22' onto the surface 16' of the edge region 14' on the top side 18' of the substrate 10 to remove the edge region 14'. The delamination unit 20 also includes two rinsing nozzles 26', arranged next to the nozzle 24' and spraying rinsing medium onto the surface 16' of the edge region 14'. Therefore, the delamination unit 20 can simultaneously remove the edge region 14' of the working layer 12 on the top side 18' of the substrate 10 and another edge region 14' of the working layer 12' on the bottom side 18' of the substrate 10. In other embodiments, the delamination unit may also be configured to remove only the edge region on the top side or the bottom side.

[0087] In this embodiment, the delamination outlets 22 and 22' are arranged perpendicular to surfaces 16 and 16' of the edge regions 14 and 14'. In other embodiments, the delamination outlets may also be arranged at an angle, for example, between 5° and 85°, particularly 45°, relative to the surface of the edge region. The outlets of the rinsing nozzles may also be arranged perpendicular to or at an angle relative to the surface of the edge region.

[0088] Furthermore, in this embodiment, nozzles 24, 24' and rinsing nozzles 26, 26' are arranged on a single delamination head 28. In other embodiments, multiple delamination heads may also be provided. In particular, a delamination head may be provided on the top side and a delamination head may be provided on the bottom side. In addition, more or fewer nozzles may be provided on the delamination unit. For example, one or more nozzles may be used only for removing edge regions on the top side or only for removing edge regions on the bottom side. In addition to the nozzles, only one rinsing nozzle may be provided, or no rinsing nozzles may be provided.

[0089] In this embodiment, the rinsing medium is DI water. Other rinsing media, such as alcohols like isopropanol, may also be used in other embodiments.

[0090] The working plane motion unit 30 is used to move the de-layering unit 20 above the edge regions 14 and 14' in the working plane 40. The working plane 40 is located in the xy plane perpendicular to the distance direction z. In this embodiment, the working plane motion unit 30 has a linear axis 32 connected to the de-layering unit 20 so that the de-layering unit 20 moves linearly above the edge regions 14 and 14'. Other motion systems may be provided in other embodiments.

[0091] The distance adjustment unit 50 is used to maintain a deviation of a predetermined distance in the distance direction z perpendicular to the working plane 40 between the delamination outlet 22 of the delamination unit 20 and the surface 16 of the edge region 14 within a predetermined deviation value as the delamination unit 20 moves above the edge regions 14 and 14' in the working plane 40. In this embodiment, the distance adjustment unit 50 has a distance direction movement unit 52 in the form of a linear axis, a holding unit 54 in the form of a wafer chuck, a holder 56, and a distance sensor 60.

[0092] In this embodiment, the holding unit 54 has four retainers 56 for holding the substrate 10. In this embodiment, the retainers 56 are air cushion retainers, which hold the substrate 10 by abutting against the air cushion created by the retainers 56 without direct contact, thus preventing damage or contamination of the working layer 12'. Other types of retainers may be provided in other embodiments, such as suction retainers or a combination of non-contact retainers and suction retainers. The retainers 56 are arranged in a cross shape around the center of the substrate 10, so that the substrate 10 is held in four regions that are rotated 90° relative to each other about the z-axis around the center of the substrate. In this embodiment, the holding unit 54 is rotatable about the z-axis, allowing the substrate 10 to rotate relative to the delamination unit 20 within the working plane 40.

[0093] Distance sensor 60 is used to determine a distance d in the distance direction z between the delamination exit 22 of the delamination unit 20 and the surface 16 of the edge region 14. In this embodiment, distance sensor 60 is a confocal color sensor that determines the distance d based on color confocal aberration measurements. Distance sensor 60 includes a distance measurement unit 62 that determines the distance d based on a distance measurement signal 64 received by the surface 16. Furthermore, distance measurement unit 62 determines a deviation value from a predetermined distance in the distance direction z between the delamination exit 22 and the surface 16. In other embodiments, other distance sensors may be provided. In alternative embodiments, a distance sensor may be omitted.

[0094] The distance direction movement unit 52 obtains the deviation value of the deviation from the predetermined distance from the distance measurement unit 62, and moves the holding unit 54 by the deviation value of the deviation from the predetermined distance in the distance direction z, so as to move the substrate 10 and the delamination unit 20 relative to each other in the distance direction z based on the distance d determined by the distance sensor 60.

[0095] In other embodiments, particularly those with multiple delamination units, the delamination units can be moved individually instead of resting on the holding unit (see, for example, in...). Figure 4 and Figure 8(See the embodiments in the text). In an alternative embodiment, multiple distance sensors and distance direction motion units can also be arranged on a single delamination unit, for example, on a delamination head for the bottom side and a delamination head for the top side, and the delamination heads can move independently of each other. This allows for the adjustment of the optimized distance between the surfaces on the top and bottom sides and the delamination outlet to improve the removal of edge regions. In particular, when the delamination outlet is moved closer to the surface of the edge region during edge region removal, the removal accuracy can be improved and it can operate with less pressure.

[0096] The control unit 500 includes a processor 510 and a computer-readable medium in the form of a memory 520. The memory 520 stores a computer program product for removing edge regions 14 and 14' of working layers 12 and 12' disposed on an uneven substrate 10. This computer program product includes computer program code means that, when implemented on the processor 510, cause the processor 510 to implement a method for removing edge regions 14 and 14', for example, according to… Figure 11 An embodiment of the method for removing edge regions 14 and 14' is shown. Furthermore, memory 520 may store additional data, such as operating parameters or processing parameters, and provide them to processor 510 for processing.

[0097] Figure 4 A second embodiment of the delamination device 100 in the xy plane is illustrated exemplary and schematically. The nozzles 24 and 24' of the delamination unit 20 are shown in partial perspective to illustrate that edge regions not only on the top side but also on the bottom side of the substrate can be removed by the delamination unit 20. In this embodiment, the substrate 10 is held non-contactly by four holders 56 arranged in a cross shape in the form of air cushions.

[0098] The delamination apparatus 100 of the second embodiment differs from that of the first embodiment in that it includes two delamination units 20 and 20', each of which has a distance sensor 60. Furthermore, the delamination heads 28 of the respective delamination units 20 and 20' are connected to a distance direction motion unit 52 in the form of a linear axis, which can independently move the delamination outlets of the nozzles 24 and 24' of the respective delamination units 20 and 20' in the distance direction z. Therefore, the two delamination units 20 and 20' can simultaneously move in the working plane along the edge region 14 in the y-direction via the linear axis 32 of the working plane motion unit 30, without the risk of collision between the nozzles 24 and 24' and the substrate 10, because when the respective delamination unit moves above the edge region in the working plane, the deviation of a predetermined distance in the distance direction between the delamination outlet of the respective delamination unit and the surface of the edge region can be kept within a predetermined deviation value. This enables the removal of the edge region in parallel using two or more delamination units and increases the processing speed.

[0099] Once one longitudinal side of the substrate has been processed by the delamination unit, i.e., the edge region 14 of the working layer 12 has been removed along the length of that longitudinal side, the substrate can be rotated 90° around the z-axis to process the remaining longitudinal sides. In other embodiments, four delamination units may be arranged, one for each longitudinal side, to remove the edge region along the length of the corresponding longitudinal side.

[0100] Figure 5A third embodiment of the delamination device 100 in the xz plane is illustrated schematically and exemplary. Compared to the first two embodiments of the delamination device 100, the third embodiment does not include a distance sensor or a distance direction movement unit. Instead, the holding unit 54 has eight holders 58 that hold a corresponding area of ​​the bottom side 18' of the bent substrate 10 in place, and these eight holders are thus arranged such that they reduce the bending of the substrate 10. In this embodiment, the holders 58 are arranged in a cross shape, such that each arm of the cross includes two of the eight holders 58. In addition, the holders 58 draw the substrate 10 onto its bottom side 18', such that the bending is reduced by the suction force and a nearly flat substrate 10 is produced. By reducing the bending of the substrate 10, the deviation in the distance direction z between the delamination outlets 22 and 22' of the delamination unit 20 and the surfaces 16 and 16' of the edge regions 14 and 14' can be maintained within a predetermined deviation value when the delamination unit 20 moves in the working plane 40 above the edge regions 14 and 14' by means of the linear axis 32 of the working plane movement unit 30. In this embodiment, the holding unit 54 can also rotate about the z-axis, so that the substrate can be rotated, thereby allowing the delamination unit 20 to process different longitudinal sides of the rectangular substrate 10.

[0101] Figure 6 A fourth embodiment of the delamination device 100 in the xz plane is illustrated schematically and exemplary. The fourth embodiment includes all the features of the third embodiment, but also includes a distance sensor 60 and a distance direction movement unit 52, similar to the first two embodiments of the delamination device 100. The distance sensor 60 and distance direction movement unit 52 of the fourth embodiment have equivalent functions to those of the distance sensors and distance direction movement units of the first and second embodiments, therefore a repetitive description of their functions is omitted here. Further reduction of deviation from a predetermined distance between them can be achieved by arranging a retainer 58 to reduce the bending of the substrate 10 by suctioning the bottom side 18' of the substrate 10, combined with moving the delamination outlets 22 and 22' relative to the surfaces 16 and 16' of the edge regions 14 and 14' in the distance direction z.

[0102] Figure 7A fifth embodiment of the delamination apparatus 100 in the xz plane is schematically and exemplaryly illustrated. In this embodiment, the substrate 10 is held non-contactly by a movable retainer 59 in the form of a movable air cushion retainer. The movable retainer 59 moves parallel to the delamination unit 20 in a holding plane 70 parallel to the working plane 40 via the linear axis 57 of the distance adjustment unit 50, such that the movable retainer 59 is at a constant distance from the delamination outlet 22 of the delamination unit 20 in the distance direction z. This achieves: reduced bending of the substrate at the corresponding portion of the edge region 14 to be removed and avoids collision between the nozzles 24 and 24' and the substrate 10. The movable retainer 59 moves accordingly to stabilize the position of the substrate. For further stabilization of the substrate, additional retainers may be provided, such as a suction retainer near the center of the substrate (see [link to documentation]). Figure 9 (Seventh embodiment of the delamination device in the text).

[0103] Figure 8 A sixth embodiment of the delamination device 100 in the xy-plane is illustrated schematically and exemplary. In this embodiment, eight retainers 58 for suctioning the underside of the substrate are arranged in a cross shape around the center of the substrate. Additionally, four retainers 56 in the form of air cushion retainers for contactless retention of the substrate are arranged in a cross shape around the center. The retainers 56 are arranged with a 45° rotation about the z-axis relative to the retainers 58. The retainers 56 prevent contamination or damage to the working layer on the underside near the edge areas. In other embodiments, other numbers of air cushion retainers and suction retainers may be provided.

[0104] This embodiment also includes a nozzle and a flushing nozzle. In other embodiments, there may be only one nozzle, or multiple nozzles and one or more flushing nozzles. A greater number of nozzles increases processing speed because more fluid can be sprayed onto the edge area in a shorter time to remove it.

[0105] Figure 9 A seventh embodiment of the delamination device 100 in the xy plane is illustrated schematically and exemplary. In this embodiment, a movable retainer 59 is combined with a suction retainer 58. The movable retainer 59 is an air cushion retainer that can move in the y-direction parallel to the delamination units 20, 20'.

[0106] Figure 10 An embodiment of a substrate processing system 400 is illustrated schematically and exemplary, having two delamination systems 300 and 300', a functional module 410, a substrate transfer system 420, and a control unit 500.

[0107] In this embodiment, delamination systems 300 and 300' each have two delamination modules 200 and 200'. In other embodiments, they may also have one or more delamination modules. Additionally, delamination systems 300 and 300' include a substrate transport system 310 for transporting substrates. The substrate transport system 310 transports substrate 10 between delamination systems 300 and 300' and the substrate transport system 420 of functional module 410. Furthermore, substrate 10 may also be transported between delamination systems 300 and 300', for example, if multiple different working layers are arranged overlapping each other on substrate 10, and the edge regions of these working layers are successively removed by different delamination devices 100.

[0108] Delamination modules 200 and 200' each have a delamination device 100 according to the invention and a plurality of media storage devices 210 and 220.

[0109] Delamination device 100 can be based on Figures 2 to 9 The delamination device 100 shown is one embodiment of the design. In other embodiments of the substrate processing system, different embodiments or alternative implementations may also include a delamination device in the delamination module.

[0110] In this embodiment, media reservoirs 210 and 220 contain dissolving or etching media and rinsing media and supply them to the delamination unit of the delamination apparatus 100. In other embodiments, more or fewer media reservoirs may be provided, such as one or three, four, five, six, or more media reservoirs. The number of media reservoirs can be adjusted depending on how many nozzles need to be supplied with media and how many different media are available.

[0111] In this embodiment, functional module 410 includes multiple functional units, namely a spin coater 412, a chemical developing unit 414, an exposure unit 416, and an oven 418. In other embodiments, the functional module may also include only one or more other functional units, or may be a single functional unit, such as a spin coater. The functional module 410 is used to process substrate 10. In this embodiment, the functional module 410 generates a working layer on the substrate 10. The edge regions of the working layer on the substrate 10 are then removed by the delamination systems 300 and 300'. The resulting processed substrate can then be supplied to further processing steps. For this purpose, a substrate transfer system 420 can transfer the substrate 10 between the functional module 410 and the delamination systems 300 and 300' and transfer it out of the substrate processing system 400 (not shown).

[0112] In this embodiment, the processing of the substrate processing system 400 is centrally controlled by the control unit 500. In other embodiments, multiple local control units may be provided, or control may be implemented by an external control unit.

[0113] The control unit 500 includes a processor 510 and a computer-readable medium in the form of a memory 520. The processor 510 performs calculations. The memory 520 stores various data, such as operating parameters and computer program products, and provides them to the processor 510 so that the control unit 500 can implement various methods for operating different components, modules, devices, and units of the substrate processing system 400.

[0114] Figure 11 The time progression of an embodiment of a method 1000 for removing edge regions of a working layer disposed on an uneven substrate is shown. The method can be implemented by means of a delamination device, for example by means of... Figures 2 to 9 One of the delamination devices 100 shown, particularly Figure 8 An embodiment of the delamination apparatus 100 shown is illustrated. The method can be used, for example, to remove the edge regions of a metal layer or paint from a substrate, such as a rectangular substrate or a rectangular glass wafer. The method can also be used, for example, in a delamination apparatus incorporated into a substrate processing system.

[0115] In step 1100, the uneven substrate is held in place by suction at eight regions on the bottom side of the substrate, thereby reducing the unevenness of the substrate. Furthermore, the uneven substrate is held non-contactly at or near the edges at four regions on the bottom side of the substrate to avoid contamination and / or damage to the edge areas of the working layer. To hold these eight regions in place, eight retainers for suction of the bottom side of the substrate are arranged in a cross shape around the center point of the substrate, such that two suction retainers form one arm of the resulting cross shape. Air cushion retainers that generate air cushions are arranged to hold the uneven substrate non-contactly at these four regions, and the uneven substrate is held non-contactly on the air cushions. The substrate can be held in this manner, for example, by… Figure 8 The embodiment of the delamination device 100 shown retains the substrate. In other embodiments, the uneven substrate may also be retained in other ways or by other numbers of retainers. The method steps are correspondingly matched to the number and type of retaining units, particularly the retainers.

[0116] In this embodiment, step 1100 is performed sequentially in time and therefore in parallel with all subsequent steps until the edge region is removed and the substrate has been replaced with a new substrate to be processed, i.e. the substrate is permanently retained during processing.

[0117] In step 1200, the distance between the delamination outlet of the delamination unit and the surface of the edge region is measured in a distance direction perpendicular to the working plane to determine the distance value. For this purpose, a distance sensor can be used, for example; in particular, the distance can be measured based on color difference measurement.

[0118] In step 1300, based on the distance value determined by the distance sensor between the delamination outlet of the delamination unit and the surface of the edge region, the uneven substrate and the delamination outlet of the delamination unit are moved relative to each other in a distance direction. This is to keep the deviation from a predetermined distance in a distance direction perpendicular to the working plane between the delamination outlet of the delamination unit and the surface of the edge region within a predetermined deviation value as the delamination unit moves above the edge region in the working plane. The movement in the distance direction can be performed, for example, by means of a distance direction movement unit.

[0119] In step 1400, the de-lamination unit is moved in the working plane above the de-lamination outlet, which is arranged opposite to the working layer.

[0120] Steps 1100 to 1300 are performed in parallel with step 1400, such that when the delamination unit moves above the edge region in the working plane, the deviation from the predetermined distance between the delamination outlet of the delamination unit and the surface of the edge region in a distance direction perpendicular to the working plane is maintained within a predetermined deviation value. In other embodiments, the uneven substrate can also be moved, for example, rotated relative to the delamination unit. In particular, for circular substrates, rotating the substrate allows for simple movement to remove the edge region.

[0121] Furthermore, in other embodiments, steps 1200 and 1300 can be omitted, thereby maintaining the deviation from the predetermined distance in the direction perpendicular to the working plane between the delamination outlet of the delamination unit and the surface of the edge region within a predetermined deviation value, even if the distance in the direction perpendicular to the working plane is not matched. Particularly for curved substrates, this can be achieved, for example, solely through suction by a retainer, as these can reduce the curvature of the substrate, thereby maintaining the deviation from the predetermined distance in the direction perpendicular to the working plane between the delamination outlet of the delamination unit and the surface of the edge region within a predetermined deviation value.

[0122] In step 1500, edge regions are removed. In this embodiment, edge regions of the working layer on both the top and bottom sides of the substrate are removed simultaneously, such as in… Figure 2 and Figure 3As shown in the diagram. To remove the edge region, depending on the material to be removed from the edge region, such as ABF, Cu, or Ti, a corresponding dissolving medium or etching medium is sprayed onto the edge region at a corresponding pressure, for example, between 0.5 bar and 10 bar, from the delamination outlet of the nozzle of the delamination unit. Furthermore, the edge region is rinsed with a rinsing nozzle that sprays a rinsing medium, such as DI water or an alcohol, such as isopropanol, onto the edge region to wash away the dissolved material and the dissolving medium or etching medium. In this embodiment, the rinsing nozzle is spatially arranged directly behind the nozzle that sprays the dissolving medium or etching medium, such that rinsing occurs temporally directly after the application of the dissolving medium or etching medium. Alternatively, in other embodiments, rinsing may be performed only after the action time of the dissolving medium or etching medium.

[0123] In step 1600, the uneven substrate is rotated relative to the delamination unit so that an edge region on one side of the substrate can be removed. By rotating the substrate relative to the delamination unit, the substrate is also rotated relative to the delamination outlet, allowing the delamination outlet to move over other portions of the edge region. Step 1500 can be performed in parallel with steps 1400 and 1600. Step 1600 is optional and depends on the shape of the substrate and how the substrate moves relative to the delamination unit. In other embodiments, step 1600 can be omitted; for example, for a circular substrate, the substrate can be rotated in step 1400 to move over the edge region so that the entire edge region of the working layer on the substrate can be removed.

[0124] Multiple or all steps can be performed in a meaningful order or in parallel with each other. Some steps can also be performed in parallel with each other and in sequence with one or more other steps.

[0125] In another embodiment, for example, it may be specified that: while the movable holder holds the uneven substrate, the movable holder moves in parallel with the delamination unit in a holding plane parallel to the working plane, such that the movable holder is at a constant distance from the delamination exit of the delamination unit in the distance direction. Alternatively or additionally, in other embodiments, it may be specified that: a dissolving or etching medium adapted to the material of the edge region is provided to remove the edge region.

[0126] The above description of the invention, taken in conjunction with the accompanying drawings, serves to exemplify the features of the invention through embodiments. However, the features set forth in the embodiments are merely exemplary and should not be construed as limiting. In particular, the invention is not limited to the features of the embodiments or individual embodiments. For example, it may be possible to operate the invention using other retainers or other delamination units or delamination agents in one embodiment. Different layers, such as different metal layers, are conceivable as working layers. Furthermore, different materials may be used for the one or more delamination outlets. In particular, the delamination outlet, the material of the delamination outlet, and the delamination agent may be adapted or matched to each other and to the material to be removed from the edge regions of the working layer.

[0127] Other variations and modifications of the illustrated embodiments can be understood and implemented by those skilled in the art based on the modifications made to the claimed invention in view of the drawings, description and claims.

[0128] The words “contains,” “has,” and “includes” do not exclude additional elements, components, or steps, and the indefinite article “one” does not exclude multiple.

[0129] A unit, processor, or device may, for example, fulfill multiple functions of different technical solutions mentioned in the claims. The fact that specific means are mentioned in different claims should not be construed as precluded from the advantageous use of combinations of these means.

[0130] A method step performed by one or more units, components, or devices—such as: removing an edge region; maintaining a deviation of a predetermined distance between the delamination unit's delamination outlet and the surface of the edge region in a distance direction perpendicular to the working plane within a predetermined deviation value as the delamination unit moves above the edge region in the working plane; measuring the distance between the delamination unit's delamination outlet and the surface of the edge region in a distance direction perpendicular to the working plane; and moving an uneven substrate and the delamination outlet of the delamination unit relative to each other in a distance direction based on the distance between the delamination unit's delamination outlet and the surface of the edge region determined by a distance sensor, so as to maintain the deviation of the predetermined distance between the delamination unit's delamination outlet and the surface of the edge region in a distance direction perpendicular to the working plane within a predetermined deviation value as the delamination unit moves above the edge region in the working plane. The process involves: maintaining a predetermined deviation value when moving the material above the edge region in the plane; holding the uneven substrate; rotating the uneven substrate relative to the delamination unit; fixing the uneven substrate at at least two regions on the bottom side of the uneven substrate to reduce its unevenness; moving the movable holder parallel to the delamination unit in a holding plane parallel to the working plane while the uneven substrate is held by the movable holder, such that the movable holder is at a constant distance from the delamination exit of the delamination unit in the distance direction; simultaneously removing the edge region of the working layer on the top side of the substrate and another edge region of the working layer on the bottom side of the substrate; providing a dissolving or etching medium adapted to the material of the edge region to remove the edge region, etc.—which can also be implemented by other numbers of units, components, or devices. These method steps and / or methods can be implemented or configured, for example, as computer program code or computer program code means and / or specific hardware.

[0131] Computer program products may be stored or provided on suitable media, such as optical storage media or solid-state media. They may also be provided together with other hardware or as part of other hardware. Furthermore, they may be provided in other ways, such as via the Internet, Ethernet, or other wired or wireless telecommunications systems.

[0132] The reference numerals used in the claims should not be construed as limiting features of the embodiments, but rather as examples of features of the claims.

[0133] This invention relates to the removal of edge regions of a working layer disposed on an uneven substrate using a delamination apparatus. The delamination apparatus includes a delamination unit, a work plane movement unit, and a distance adjustment unit. The delamination unit is configured to remove the edge regions and has a delamination outlet configured to be disposed opposite to the working layer. The work plane movement unit is configured to move the delamination unit in the work plane above the edge regions. The distance adjustment unit is configured to maintain a deviation in a distance direction perpendicular to the work plane from a predetermined distance between the delamination outlet of the delamination unit and the surface of the edge regions within a predetermined deviation value as the delamination unit moves in the work plane above the edge regions. This improves the removal of edge regions of the working layer on uneven substrates.

Claims

1. A delamination device (100) for removing edge regions (14, 14') of working layers (12, 12') disposed on an uneven substrate (10), comprising: A de-layering unit (20) is configured to remove edge regions (14, 14') and has a de-layering outlet (22, 22') configured to be arranged opposite to the working layer (12, 12'); A working plane motion unit (30) configured to move the de-lamination unit (20) above the edge regions (14, 14') in the working plane (40); and characterized in that: Distance adjustment unit (50) is configured to keep the deviation of a predetermined distance between the de-delamination outlet (22) of the de-delamination unit (20) and the surface (16) of the edge region (14) in a distance direction (z) perpendicular to the working plane (40) within a predetermined deviation value when the de-delamination unit (20) moves above the edge region (14, 14') in the working plane (40).

2. The delamination device (100) according to claim 1, wherein, The distance adjustment unit (50) has a distance sensor (60) and a distance direction motion unit (52), and the distance sensor (60) is configured to determine the distance (d) in the distance direction (z) between the delamination outlet (22) of the delamination unit (20) and the surface (16) of the edge region (14), and the distance direction motion unit (52) is configured to move the uneven substrate (10) and the delamination outlet (22) of the delamination unit (20) relative to each other in the distance direction (z) based on the distance (d) determined by the distance sensor (60).

3. The delamination apparatus (100) according to claim 1 or 2, the delamination apparatus comprising a holding unit (54) configured to hold a substrate (10).

4. The delamination device (100) according to claim 3, wherein, The retaining unit (54) has at least two retainers (58) configured to hold a corresponding area of ​​the bottom side (18') of the uneven substrate (10) in place, and the retainers (58) are arranged such that the unevenness of the substrate (10) is reduced.

5. The delamination device (100) according to claim 3 or 4, wherein, The holding unit (54) has a movable holder (59) configured to hold an uneven substrate (10), and the distance adjustment unit (50) is configured to move the movable holder (59) parallel to the delamination unit (20) in a holding plane (70) parallel to the working plane (40), such that the movable holder (59) is located at a constant distance from the delamination outlet (22) of the delamination unit (20) in the distance direction (z).

6. The delamination apparatus (100) according to at least one of claims 1 to 5, wherein, The delamination unit (20) is configured to simultaneously remove the edge region (14) of the working layer (12) on the top side (18) of the substrate (10) and the additional edge region (14') of the working layer (12') on the bottom side (18') of the substrate.

7. The delamination apparatus (100) according to at least one of claims 1 to 6, wherein, The delamination unit (20) is configured to remove the edge region (14, 14') of the working layer (12, 12') containing the Ajinomoto deposit film, Cu or Ti.

8. A delayer module (200) having a delayer apparatus (100) according to at least one of claims 1 to 7, the delayer module additionally comprising at least one media reservoir (210, 220), the media reservoir being configured to contain one or more dissolving media, one or more etching media, or one or more dissolving media and one or more etching media and to supply the dissolving media or etching media or the dissolving media and etching media to the delayer apparatus (100) as a delayer unit (20).

9. A delamination system (300) having one or more delamination modules (200, 200') according to claim 8, the delamination system additionally comprising a substrate conveying system (310) for conveying an uneven substrate (10).

10. A substrate processing system (400) having one or more delamination systems (300, 300') according to claim 9, the substrate processing system additionally comprising at least one functional module (410) for processing an uneven substrate (10).

11. A method (1000) for removing edge regions (14, 14') of a working layer (12, 12') disposed on an uneven substrate (10), comprising: The de-lamination unit is moved above the edge region in the working plane with its de-lamination exit positioned opposite the working layer, and... Remove edge areas. Its features are, The deviation of the delamination unit from the surface of the delamination outlet and the edge region in a distance direction perpendicular to the working plane is kept within a predetermined deviation value as the delamination unit moves above the edge region in the working plane.

12. The method (1000) according to claim 11, comprising one or more of the following steps: Measure the distance between the de-delamination outlet and the edge region of the de-delamination unit in a direction perpendicular to the working plane; Based on the distance between the delamination outlet of the delamination unit and the surface of the edge region determined by the distance sensor, the uneven substrate and the delamination outlet of the delamination unit are moved relative to each other in the distance direction to keep the deviation from the predetermined distance between the delamination outlet of the delamination unit and the surface of the edge region in the distance direction perpendicular to the working plane within a predetermined deviation value when the delamination unit moves above the edge region in the working plane. Maintain an uneven substrate; Rotate the uneven substrate relative to the delamination unit; The uneven substrate is held in place at least two areas on the bottom side of the uneven substrate, thereby reducing the unevenness of the substrate. During the holding of the uneven substrate by the movable holder, the movable holder is moved parallel to the delamination unit in the holding plane parallel to the delamination unit, such that the movable holder is at a constant distance from the delamination outlet of the delamination unit in the distance direction. Simultaneously remove the edge region of the working layer on the top side of the substrate and the additional edge region of the working layer on the bottom side of the substrate; Use a dissolving or etching medium that is compatible with the material of the edge area to remove the edge area.

13. Use of the delamination device (100) according to at least one of claims 1 to 7, for: Remove edge regions (14, 14'); and / or Remove the metal layer or paint from the edge areas (14, 14'); and / or Remove the edge regions (14, 14') of the working layer (12, 12') on the rectangular substrate (10); and / or Remove the edge regions (14, 14') of the working layer (12, 12') on the wafer.

14. The use of the method (1000) according to claim 11 or 12, for: Remove edge regions (14, 14'); and / or Remove the metal layer or paint from the edge areas (14, 14'); and / or Remove the edge regions (14, 14') of the working layer (12, 12') on the rectangular substrate (10); and / or Remove the edge regions (14, 14') of the working layer (12, 12') on the wafer.

15. A computer program product for removing edge regions (14, 14') of a working layer (12, 12') disposed on an uneven substrate (10), the computer program product comprising computer program code means that, when the computer program product is executed on a processor, the computer program code means cause the processor (510) to perform the method according to claim 11 or 12.

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