Three-dimensional uniform temperature plate with gap isolation structure

Abstract

The invention discloses a three-dimensional uniform temperature plate with an isolation gap structure, which comprises a bottom uniform temperature plate with a bottom plate and a top plate, and the top plate is provided with a connecting port; the vertical temperature equalizing unit is connected to the bottom temperature equalizing plate; wherein the top plate is provided with a vertical wall which extends up and down, the bottom of the shell is provided with a vertical section which extends downwards, and a gap is formed between the vertical wall and the vertical section; the vertical section and the vertical wall are in at least partial close fit relation, and a plurality of fusion parts which are solidified after fusion are formed through welding-flux-free fusion welding, and the fusion parts are located at the bottom of the gap. And at least one of the close fit relationship and the plurality of melting parts enables the top capillary material to be isolated from the outside and not to be communicated with the outside in the capillary phenomenon.

Description

Technical Field

[0001] This invention relates to a heat dissipation plate for uniform temperature distribution, and in particular to a three-dimensional heat dissipation plate with an isolation gap structure. Background Technology

[0002] Chinese patent CN 106288891B discloses a three-dimensional heat-conducting structure and its manufacturing method. The key technical aspect of this patent is the placement of a heat pipe with an open end on a vapor chamber plate with insertion holes, inserting the open end into the insertion holes, and providing a support ring that is secured to the junction of the heat pipe and the vapor chamber plate. Figure 6 In particular, it is revealed that a chamfer is formed on one side of the adjacent heat pipe by using a support ring, which allows the solder to remain between the chamfer and the outer surface of the heat pipe, so as not to overflow onto the surface of the heat spreader, and to provide a better bonding effect.

[0003] However, while the aforementioned technology can retain solder, it suffers from two major problems. First, the location where the heat pipe inserts into the socket often creates gaps between the heat pipe and the socket wall. These gaps are ideal channels for capillary action. Therefore, if the heat pipe and socket wall are not completely sealed, molten solder during soldering is highly likely to flow into the heat spreader due to capillary action and be absorbed by its capillary structure. This prevents the solder from remaining in its proper position, leading to soldering failure and also clogging and damaging the capillary structure. Second, using a support ring adds an extra component. Assembly introduces tolerances, and an extra part increases assembly and component costs. Therefore, the aforementioned existing technology is prone to producing defective products and significantly increases costs.

[0004] Therefore, the problem to be solved by this invention is how to develop a three-dimensional heat spreader structure that prevents solder from flowing into the heat spreader during welding and being sucked into the capillary structure to cause blockage, while also being easy to manufacture. Summary of the Invention

[0005] The main objective of this invention is to propose a three-dimensional heat spreader with an isolation gap structure, which can seal the gaps to produce an isolation effect, so that the solder will not flow through the gaps to the capillary structure and be absorbed by it during welding, making it less likely to produce defective products in manufacturing.

[0006] To achieve the above objectives, the present invention proposes a three-dimensional heat equalization plate with an isolation gap structure, comprising: a bottom heat equalization plate having a base plate and a top plate attached to the base plate, forming an accommodating space between the base plate and the top plate; a bottom capillary material disposed on the base plate within the accommodating space; a top capillary material disposed on the top plate within the accommodating space; the bottom capillary material and the top capillary material being separated by a predetermined distance; the bottom capillary material extending upwards with a plurality of capillary columns abutting against the top capillary material; the top plate having a connecting port; and the top capillary material having a through hole, the through hole being vertically opposite to the connecting port and spatially communicating; and a vertical heat equalization unit. The device comprises an outer shell forming an internal vertical space. The bottom of the outer shell has a bottom opening and is connected to a top plate. The vertical space is spatially connected to a receiving space via the bottom opening, a connection port, and a perforation. The vertical temperature distribution unit contains an upper capillary layer and a working fluid, which is placed within the receiving space. The top capillary material and the upper capillary layer are connected or in contact, and are capillarily connected to allow the working fluid to flow. The top plate has a vertically extending wall that curves along the periphery of the connection port, and the bottom of the outer shell has a wall that extends downwards along the periphery of the bottom opening. A vertical section is provided, and a vertical wall is fitted onto the outside of the vertical section, forming a gap around the bottom opening between the vertical wall and the vertical section; at least a portion of the vertical section and the vertical wall are in a tight fit relationship, and the bottom end of one of the vertical section and the vertical wall is higher than or flush with the bottom end of the other; the vertical section and the vertical wall are fused together without solder to form multiple molten portions that solidify after melting, and these multiple molten portions are located at the bottom of the gap; the top capillary material covers the bottom of the vertical wall, the bottom of the vertical section, and the multiple molten portions; the top of the vertical wall has an upwardly and outwardly extending flared section, the flared section... A recess is formed between the opening segment and the upright segment, gradually opening from bottom to top. The recess is spatially connected to the gap, and the recess contains a solder. At least one of the aforementioned tight fit relationship and the aforementioned plurality of molten parts constitutes a complete seal for the gap. When the aforementioned tight fit relationship constitutes a complete seal for the gap, it means that the upright segment and the upright wall form a complete tight fit, thus sealing the gap and isolating the recess from the top capillary material, so that they are not connected in a capillary manner. When the aforementioned plurality of molten parts constitute a complete seal for the gap, it means that all of the plurality of molten parts are connected, thus isolating the gap from the top capillary material, so that they are not connected in a capillary manner.

[0007] Therefore, this invention can seal the gaps to create an isolation effect, preventing solder from flowing through the gaps into the capillary structure and being absorbed during welding, thus reducing the likelihood of defective products during manufacturing.

[0008] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the present invention. Attached Figure Description

[0009] Figure 1 This is a perspective view of the first preferred embodiment of the present invention.

[0010] Figure 2 This is a partial exploded view of the first preferred embodiment of the present invention.

[0011] Figure 3 For along Figure 1 Sectional view along section 3-3.

[0012] Figure 4 For along Figure 1 Sectional view along section line 4-4.

[0013] Figure 5 for Figure 3 A magnified view of a portion of the image.

[0014] Figure 6 This is a bottom view of the first preferred embodiment of the present invention after the partial components have been removed, mainly showing the state in which multiple molten parts are all connected in a circle.

[0015] Figure 7 This is a usage state diagram of the first preferred embodiment of the present invention.

[0016] Figure 8 This is a schematic diagram of the fins installed in the first preferred embodiment of the present invention.

[0017] Figure 9 This is a sample diagram of another embodiment of the first preferred embodiment of the present invention.

[0018] Figure 10 This is a perspective view of the second preferred embodiment of the present invention.

[0019] Figure 11 This is a bottom view of the second preferred embodiment of the present invention after the partial components have been removed, mainly showing the state in which multiple molten parts are independent and not connected.

[0020] Figure 12 This is a partial cross-sectional view of the third preferred embodiment of the present invention.

[0021] Figure 13 This is a partial cross-sectional schematic diagram of the fourth preferred embodiment of the present invention.

[0022] Figure 14 This is a partial cross-sectional view of the fifth preferred embodiment of the present invention.

[0023] Among them, the attached figures are labeled

[0024] 10: Three-dimensional heat exchange plate with an isolation gap structure

[0025] 11: Bottom heat spreader

[0026] 12: Base Plate

[0027] 121: Base Fabric

[0028] 13: Storage space

[0029] 131: Capillary column

[0030] 14: Top Slab

[0031] 141: Top fine wood

[0032] 145: Perforation

[0033] 148: Vertical Wall

[0034] 149:Expanded section

[0035] 15: Connection Port

[0036] 21: Vertical temperature equalization unit

[0037] 22: Outer shell

[0038] 221: Bottom opening

[0039] 222: Upright board

[0040] 228: Upright Section

[0041] 23: Upper capillary layer

[0042] 231: Vertical capillary layer

[0043] 232: Supporting capillary column

[0044] 24: Vertical Space

[0045] 27: Chengwo

[0046] 30: Three-dimensional heat exchange plate with an isolation gap structure

[0047] 31: Bottom heat spreader

[0048] 341: Top fine wood

[0049] 348: Vertical Wall

[0050] 41: Vertical temperature equalization unit

[0051] 428: Upright Section

[0052] 50: Three-dimensional heat exchange plate with an isolation gap structure

[0053] 51: Bottom heat spreader

[0054] 548: Vertical Wall

[0055] 61: Vertical temperature equalization unit

[0056] 628: Upright Section

[0057] 70: Three-dimensional heat exchange plate with an isolation gap structure

[0058] 74: Top Plate

[0059] 748: Vertical Wall

[0060] 749:Expanded section

[0061] 828: Upright Section

[0062] 87: Chengwo

[0063] 91: Heat source

[0064] 92: Fins

[0065] 99: Solder

[0066] S: Gap

[0067] WS: Melting section

[0068] 21': Vertical temperature equalization unit

[0069] 10”: Three-dimensional heat exchange plate with an isolation gap structure

[0070] 148”: Vertical wall

[0071] 21”: Vertical temperature equalization unit

[0072] 228”: Upright segment

[0073] 27”: Chengwo

[0074] S”: Gap

[0075] WS”: Melting section Detailed Implementation

[0076] To illustrate the technical features of the present invention in detail, the following preferred embodiments are described below with reference to the accompanying drawings, wherein:

[0077] like Figures 1 to 6 As shown, the present invention, through a first preferred embodiment, illustrates a three-dimensional heat exchanger 10 with an isolation gap structure, mainly composed of a bottom heat exchanger 11, a vertical heat exchanger unit 21, and a working fluid (not shown in the figure), wherein:

[0078] The bottom temperature distribution plate 11 has a bottom plate 12 and a top plate 14 attached to the bottom plate 12. A receiving space 13 is formed between the bottom plate 12 and the top plate 14. A bottom capillary 121 is provided on the bottom plate 12 and located in the receiving space 13. A top capillary 141 is provided on the top plate 14 and located in the receiving space 13. The bottom capillary 121 and the top capillary 141 are separated by a predetermined distance. Multiple capillary columns 131 extend upward from the bottom capillary 121 and abut against the top capillary 141. The top plate 14 has a connecting port 15 and the top capillary 141 has a through hole 145. The through hole 145 and the connecting port 15 are vertically opposite each other and spatially connected.

[0079] The upright temperature equalization unit 21 has a shell 22 and an upright space 24 formed inside. The bottom of the shell 22 has a bottom opening 221. The bottom of the shell 22 is connected to the top plate 14. The upright space 24 is spatially connected to the accommodating space 13 through the bottom opening 221, the connection port 15 and the perforation 145. The upright temperature equalization unit 21 has an upper capillary layer 23 inside. In this first embodiment, the upright temperature equalization unit 21 is an upright temperature equalization plate, and the outer shell 22 has two upright plates 222 that are separated by a predetermined distance and joined together at the edge. The upper capillary layer 23 is attached to the two upright plates 222, and the portion of the upper capillary layer 23 attached to the two upright plates 222 is defined as the two upright capillary layers 231. The two upright capillary layers 231 are separated by a predetermined distance, and a plurality of supporting capillary columns 232 are provided between the two upright capillary layers 231. The two upright capillary layers 231 and the plurality of supporting capillary columns 232 are connected in a capillary manner.

[0080] The working fluid (not shown in the figure) is placed in the accommodating space 13. Since the working fluid is the known working fluid inside the heat exchanger, it is adsorbed in the aforementioned bottom capillary 121, top capillary 141, multiple capillary columns 131 and upper capillary layer 23, and therefore it is difficult to show in the figure. Please allow the applicant not to show it in the figure.

[0081] The bottom capillary material 121, the plurality of capillary columns 131, the top capillary material 141 and the upper capillary layer 23 are connected or in contact with each other and are interconnected in a capillary manner so that the working fluid can flow.

[0082] The technical features of this first embodiment will be further explained below.

[0083] The top plate 14 has a vertical wall 148 extending vertically along the periphery of the connection port 15. The bottom of the outer shell 22 has a vertical section 228 extending downward along the periphery of the bottom opening 221. The vertical wall 148 is fitted onto the outside of the vertical section 228, and a gap S is formed between the vertical wall 148 and the vertical section 228 surrounding the bottom opening 221. In addition, since the vertical section 228 is formed by extending downward from the bottom of the outer shell 22, it is usually integrally formed with the outer shell 22 during actual manufacturing. For the sake of definition, in this first embodiment, the portion of the outer shell 22 below the connection port 15 is defined as the vertical section 228.

[0084] The upright section 228 and the upright wall 148 are partially in a tight fit relationship. The bottom end of the upright section 228 is flush with the bottom end of the upright wall 148. Multiple molten portions WS are formed between the upright section 228 and the upright wall 148 through solderless fusion, and these molten portions WS are located at the bottom of the gap S. Figure 6 As shown, all of the multiple molten sections WS are connected, thus isolating the gap S from the top capillary 141 and preventing them from communicating capillarily. The top capillary 141 covers the bottom of the vertical wall 148, the bottom of the vertical section 228, and the multiple molten sections WS. The aforementioned solderless welding is exemplified by existing known laser welding.

[0085] The top plate 14 bends inward and downward along the periphery of the connection port 15 to form a flared section 149, which then extends downward to form the vertical wall 148. Thus, the flared section 149 extends upward and outward from the top of the vertical wall 148. A recess 27, gradually widening from bottom to top, is formed between the flared section 149 and the vertical section 228. The recess 27 spatially connects to the gap S and contains solder 99. In actual manufacturing, when the solder 99 melts during the welding process, it is confined by the recess 27 and does not flow outward; it only fills the recess 27 and the gap S, thereby forming a stable welded structure. In this way, the recess 27 helps to stabilize the weld quality.

[0086] The structure of this first embodiment has been described above. The working condition of this first embodiment will be described next.

[0087] like Figure 7 Reference Figure 5As shown, before use, the bottom heat spreader 11 is placed on a heat source 91, which is a heating chip as an example. During use, the heat energy emitted by the heat source 91 is conducted to the bottom heat exchanger 11, heating the working fluid adsorbed by the bottom capillary material 121. The working fluid vaporizes due to the heat and enters the accommodating space 13, then flows through the perforation 145 and the bottom opening 221 into the upright space 24. Since the upright heat exchanger 21 is used to exchange heat with the external low-temperature environment, its temperature is lower than that of the bottom heat exchanger 11. Here, the vaporized working fluid condenses into a liquid and is adsorbed by the upper capillary layer 23. Then, it rapidly flows back from the upper capillary layer 23 via capillary action, passing through the multiple supporting capillary columns 232, the top capillary material 141, and the multiple capillary columns 131, finally flowing back to the bottom capillary material 121. This completes the entire heat dissipation process.

[0088] Due to the multiple molten sections WS connected together (shown in...) Figure 6 This effectively isolates the gap S from the top capillary material 141 through capillary action. Therefore, when solder 99 (e.g., a strip electrode) is placed in the socket 27 during welding, and the solder 99 melts, it will only enter the gap S through the socket 27 and be blocked by the molten portion WS, rather than being absorbed by the top capillary material 141. The top capillary material 141 will not be damaged by adsorbing the solder 99. In this way, thanks to the blocking effect of the solder 99, the top capillary material 141 and the upper capillary layer 23 are directly attached to the molten portion WS during manufacturing. They can be integrally sintered using copper powder or set using a woven mesh. There is no need to worry about the solder 99 being sucked into the top capillary material 141 through the gap S during welding. Therefore, manufacturing is easier, and manufacturers have more options.

[0089] In addition, such as Figure 8 As shown, in this first embodiment, multiple fins 92 may be further provided, and one side of the multiple fins 92 is attached to the outer shell 22 of the vertical temperature equalization unit 21, and the multiple fins 92 are stacked in a horizontal manner.

[0090] It should be added that, such as Figure 9As shown, the number of the upright temperature equalization unit 21' in this first embodiment can also be multiple, for example, three, and the way it is connected to the bottom temperature equalization plate 11 is the same as the aforementioned structure, and the multiple fins 92 are provided in conjunction with it. This means that the present invention is not limited to one upright temperature equalization unit 21'. Furthermore, the vertical relationship defined in this first embodiment is defined according to the direction in the figure. This is only for the convenience of illustrating the relative spatial relationship and is not intended to limit the patent scope of the present invention. In actual use, the bottom temperature equalization plate 11 may be rotated 90 degrees or used at other angles. Therefore, the vertical relationship defined in the present invention cannot be used as a limitation in actual use.

[0091] like Figure 10 and Figure 11 As shown, the present invention describes a three-dimensional heat exchanger 10” with an isolation gap structure through a second preferred embodiment. Most of the technical features are the same as those of the first embodiment described above, except that:

[0092] In this second embodiment, the upright temperature distribution unit 21” can also be a heat pipe, and the assembly method is generally the same as described above. Figure 5 And it can also be set to multiple, for display convenience, in Figure 10 The system does not display the situation where multiple fins are installed.

[0093] Figure 11 This demonstrates that the multiple molten sections WS” of the multiple vertical heat equalization units 21” are not connected to each other, thus providing the effect of welding and fixing the vertical section 228” to the vertical wall 148”. For one vertical heat equalization unit 21”, its vertical section 228” and vertical wall 148” are completely tightly fitted together, sealing the gap S”. Therefore, even if the multiple molten sections WS” are not completely connected, this tight fit can seal the gap S”, thereby ensuring that the socket 27” and the top capillary material (not shown in the figure) (see reference) are properly connected. Figure 5 By isolating the capillary structure and preventing it from being connected, the solder 99 can be prevented from being absorbed by the top capillary material through the gap S”, thus preventing the top capillary material from being damaged by adsorbing the solder 99.

[0094] The remaining structures and effects of this second embodiment are the same as those of the aforementioned first embodiment, and will not be described again.

[0095] like Figure 12 As shown, the present invention describes a three-dimensional heat exchanger 30 with an isolation gap structure through a third preferred embodiment. Most of the technical features are the same as those of the first embodiment described above, except that:

[0096] The bottom end of the vertical section 428 is higher than the bottom end of the vertical wall 348, and the molten part WS is located at the contact position where the bottom end of the vertical section 428 contacts the side of the vertical wall 348.

[0097] In the aforementioned structure, the top capillary 341 is slightly different in shape from the first embodiment because it covers the bottom of the vertical wall 348 and the bottom of the vertical section 428.

[0098] The aforementioned structure allows the manufacturer to adjust the assembly depth of the upright heat equalization unit 41 relative to the bottom heat equalization plate 31 as needed, and the setting position of the molten part WS can also be adjusted accordingly, which facilitates production and manufacturing.

[0099] The remaining structures and effects of this third embodiment are the same as those of the aforementioned first embodiment, and will not be described again.

[0100] like Figure 13 As shown, the present invention describes a three-dimensional heat exchanger 50 with an isolation gap structure through a fourth preferred embodiment. Most of the technical features are the same as those of the previously disclosed second embodiment, except that:

[0101] The bottom of the vertical section 628 is lower than the bottom of the vertical wall 548.

[0102] The molten part WS is located at the contact position between the bottom end of the vertical wall 548 and the side of the vertical section 628.

[0103] The aforementioned structure allows the manufacturer to adjust the assembly depth of the upright heat equalization unit 61 relative to the bottom heat equalization plate 51 as needed, and the setting position of the molten part WS can also be adjusted accordingly, which facilitates production and manufacturing.

[0104] The remaining structures and effects of this fourth embodiment are the same as those of the aforementioned first embodiment, and will not be described again.

[0105] like Figure 14 As shown, the present invention describes a three-dimensional heat exchanger 70 with an isolation gap structure through a fifth preferred embodiment. Most of the technical features are the same as those of the previously disclosed fourth embodiment, except that:

[0106] The vertical wall 748 is formed by the upward bending and extension of the top plate 74, and the flared section 749 is formed by the upward and outward extension of the top of the vertical wall 748.

[0107] In this case, the bottom of the upright section 828 is also lower than the bottom of the upright wall 748.

[0108] The aforementioned structure makes it convenient for the manufacturer to set the solder 99, and during the welding process, the solder 99 can be kept in the socket 87 without overflowing, which can ensure the quality of the welding.

[0109] The remaining structures and effects of this fifth embodiment are the same as those of the first embodiment described above, and will not be repeated hereafter.

[0110] The above description is merely illustrative of the present invention through embodiments and should not be construed as limiting the patent scope of the present invention. Any simple variations or equivalent implementations made in accordance with the patent scope and patent specification of the present invention should be covered by the patent scope of the present invention.

[0111] Of course, the present invention may have other various embodiments. Without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and modifications according to the present invention, but these corresponding changes and modifications should all fall within the protection scope of the claims of the present invention.

Claims

1. A three-dimensional heat exchanger with an insulated gap structure, comprising: A temperature equalization plate has a bottom plate and a top plate attached to the bottom plate, forming an accommodating space between the bottom plate and the top plate. A bottom capillary is provided on the bottom plate within the accommodating space, and a top capillary is provided on the top plate within the accommodating space. The bottom capillary and the top capillary are separated by a predetermined distance. Multiple capillary columns extend upward from the bottom capillary and abut against the top capillary. The top plate has a connection port, and the top capillary has a through hole. The through hole and the connection port are vertically opposite each other and spatially connected. A vertical temperature equalization unit has a housing and forms a vertical space inside. The bottom of the housing has a bottom opening, and the bottom of the housing is connected to a top plate. The vertical space is spatially connected to the accommodating space through the bottom opening, the connection port, and the perforation. The vertical temperature equalization unit has an upper capillary layer inside. A working fluid is placed into the accommodating space; in, The top capillary material and the upper capillary layer are connected or in contact with each other and are interconnected in a capillary phenomenon so that the working fluid can flow through them. Its features are: The top plate has a vertical wall that extends vertically along the periphery of the connection opening, and the bottom of the housing has a vertical section that extends downward along the periphery of the bottom opening. The vertical wall is fitted onto the outside of the vertical section, and a gap is formed between the vertical wall and the vertical section around the bottom opening. At least a portion of the vertical section and the vertical wall are in a tight fit relationship. The bottom end of one of the vertical section and the vertical wall is higher than or flush with the bottom end of the other. The vertical section and the vertical wall are welded together without solder to form multiple molten parts that solidify after melting. The multiple molten parts are located at the bottom of the gap. The top capillary material covers the bottom of the vertical wall, the bottom of the vertical section, and the multiple molten parts. The top of the vertical wall has an upward and outward flared section, and a recess that gradually widens from bottom to top is formed between the flared section and the vertical section. The recess is spatially connected to the gap, and the recess contains a solder. Of the aforementioned tight fit relationship and the aforementioned plurality of molten parts, at least one constitutes a complete seal for the gap; when the aforementioned tight fit relationship constitutes a complete seal for the gap, the gap is sealed by a complete tight fit between the vertical section and the vertical wall, thus isolating the socket from the top capillary material and preventing them from communicating in a capillary manner; when the aforementioned plurality of molten parts constitute a complete seal for the gap, all of the plurality of molten parts are connected, thus isolating the gap from the top capillary material and preventing them from communicating in a capillary manner.

2. The three-dimensional temperature equalizer with an isolation gap structure according to claim 1, characterized in that: The top plate bends inward and downward along the periphery of the connection to form the flared section, and then extends downward to form the vertical wall. The bottom end of the vertical section is at the same height as the bottom end of the vertical wall.

3. The three-dimensional temperature equalizer with an isolation gap structure according to claim 1, characterized in that: The top plate bends inward and downward along the periphery of the connection to form the flared section, and then extends downward to form the vertical wall. The bottom end of the vertical section is higher than the bottom end of the vertical wall.

4. The three-dimensional temperature equalizer with an isolation gap structure according to claim 1, characterized in that: The top plate bends inward and downward along the periphery of the connection to form the flared section, and then extends downward to form the vertical wall. The bottom end of the vertical section is lower than the bottom end of the vertical wall.

5. The three-dimensional temperature equalizer with an isolation gap structure according to claim 1, characterized in that: The vertical wall is formed by the upward curving extension of the top plate, the flared section is formed by the upward and outward extension of the top of the vertical wall, and the bottom of the vertical section is lower than the bottom of the vertical wall.

6. The three-dimensional temperature equalizer with an isolation gap structure according to claim 1, characterized in that: The vertical temperature equalization unit is a vertical temperature equalization plate. The outer shell has two vertical plates that are joined together at the edges with a predetermined distance between them. The upper capillary layer is attached to the two vertical plates, and the portion of the upper capillary layer attached to the two vertical plates is defined as the two vertical capillary layers. The two vertical capillary layers are separated by a predetermined distance, and a plurality of supporting capillary columns are provided between the two vertical capillary layers. The two vertical capillary layers and the plurality of supporting capillary columns are connected by capillary action so that the working fluid can flow through them.

7. The three-dimensional temperature equalizer with an isolation gap structure according to claim 1, characterized in that: It also includes multiple fins, and one side of the multiple fins is attached to the outer shell of the vertical heat equalization unit, and the multiple fins are stacked horizontally.

8. The three-dimensional temperature equalizer with an isolation gap structure according to claim 1, characterized in that: The vertical isothermal unit is a heat pipe.

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