Method, computer program product and system for operating particle beam apparatus

Abstract

The present invention relates to a method, a computer program product and a system for operating a particle beam apparatus for imaging, processing and / or analyzing an object. The method includes providing first and second structural data; determining a target arrangement of the first device; providing at least one moving path; modeling a movement path of the first device within the particle beam apparatus; performing an inspection to determine whether the modeling of the movement path has the result of (i) having at least one common point for a first surface arrangement of the first device and a second surface arrangement of the at least one second device when performing the movement process, or (ii) being at a shortest distance but having no common point, where the shortest distance is less than a predefinable minimum distance; and displaying a message, abandoning the movement process, changing a speed of the movement process, aborting the movement process, switching the movement process to a further movement process, performing the movement process of the first device using the movement device for moving the first device, depending on a result of the checking.

Description

Technical Field

[0001] This invention relates to a method for operating a particle beam apparatus to image, process, and / or analyze objects within the apparatus. The invention also relates to a computer program product and a system comprising a particle beam apparatus for performing the method according to the invention. For example, the particle beam apparatus is implemented as an electron beam apparatus and / or an ion beam apparatus. Background Technology

[0002] Electron beam devices, particularly scanning electron microscopes (hereinafter referred to as SEM) and / or transmission electron microscopes (hereinafter referred to as TEM), are used to examine objects (hereinafter referred to as samples) in order to learn about their properties and behavior under certain conditions.

[0003] In SEM, an electron beam (hereinafter referred to as a primary electron beam) is generated by a beam generator and focused onto the object to be inspected by a beam guiding system. The primary electron beam is guided onto the surface of the object using a guiding device in the form of a scanning device. During this process, the electrons of the primary electron beam interact with the object. As a result of this interaction, the object emits electrons (so-called secondary electrons), and the electrons of the primary electron beam are backscattered (so-called backscattered electrons). The secondary electrons and backscattered electrons are detected and used for image generation. Thus, an image representation of the object to be inspected is obtained. Furthermore, interaction radiation (e.g., X-ray radiation or cathodoluminescence) is generated during the interaction, and this interaction radiation is detected by a detector and subsequently evaluated for object analysis.

[0004] In the case of TEM, a primary electron beam is generated by a beam generator and guided onto the object to be inspected by a beam guiding system. The primary electron beam radiates through the object. As the primary electron beam passes through the object, the electrons interact with the material of the object. The electrons passing through the object are imaged onto a fluorescent screen or detector (e.g., a camera) by a system consisting of an objective lens and a projection unit. Imaging can also be performed in the scanning mode of TEM. Typically, this type of TEM is called STEM. Alternatively, an additional detector can be used to detect backscattered electrons at the object and / or secondary electrons emitted by the object to image the object.

[0005] Combining the functions of STEM and SEM in a single particle beam device is known. Therefore, such a particle beam device can be used to perform inspections on objects using SEM and / or STEM functions.

[0006] Furthermore, particle beam devices with ion beam columns are known. Ions for processing objects are generated by an ion beam generator arranged in the ion beam column. For example, during processing, materials of the object are ablated, or materials are applied to the object, for example, in the case of a gas supply. Additionally, or alternatively, ions are also used for imaging.

[0007] Furthermore, existing technologies disclose the use of combined equipment for inspecting objects, in which both electrons and ions can be directed to the object to be inspected. For example, it is known to equip SEMs with ion beam columns. Ions are generated using an ion beam generator arranged in the ion beam column for the purpose of preparing objects (e.g., ablating or applying material to an object) or for imaging. For this purpose, a guiding device in the form of a scanning device is used to scan the ions across the object. SEMs are specifically used here to observe preparations, and also for further inspection of prepared or unprepared objects.

[0008] As explained above, backscattered electrons and secondary electrons emitted due to the interaction of the primary electron beam with the object can be detected and used for image creation. Thus, an image representation of the object is obtained. However, this image representation typically depicts only a very limited spatial area of ​​the object. For example, this area is less than 1 mm × 1 mm, while the object size is typically at least 1 cm × 1 cm. For instance, even in the case described above where the object is analyzed using a detector, only radiation from a very limited spatial area can be evaluated. Even in the case described above where the object is processed using ions from an ion beam generator of a particle beam device with an ion beam column, only a very limited spatial area can be processed.

[0009] Moving an object within a particle beam apparatus allows for imaging, processing, and / or analysis of other regions of the object. Alternatively, or as an alternative, other objects can be imaged, processed, and / or analyzed when the object and / or other objects move relative to the beam post of the particle beam apparatus. A moving device is used to move the object within the particle beam apparatus. By moving the object within the particle beam apparatus, it is possible, alternatively or as an alternative, to set different distances between the objective lens of the particle beam apparatus and the object, wherein different distances are suitable for different settings of the particle beam apparatus. For example, another moving device is used to move another object within the particle beam apparatus. Referring to the statements above and below regarding objects, object movement, and moving devices, these statements apply similarly.

[0010] As an object moves within a particle beam apparatus, it may collide with, for example, another object disposed within and / or on the particle beam apparatus, and / or with the particle beam apparatus itself. If the object collides with another object, the object and / or the other object may be contaminated, damaged, and / or destroyed. Therefore, collisions between objects are undesirable during operation of the particle beam apparatus. The other object can be, for example, another object.

[0011] To enable movement of an object within a particle beam device, the object is positioned on a moving device; for example, the object is positioned on an object holder and / or an object stage. The moving device can perform the movement of the object, such as translational and / or rotational movement.

[0012] It is known from the prior art that an object is arranged on an object holder. The object is arranged by the object holder on an object platform capable of performing at least one translational movement and at least one rotational movement. The object can be moved from a first position to a second position by at least one translational movement and / or at least one rotational movement of the object platform.

[0013] Furthermore, as is known from existing technology, the three-dimensional shape of an object (sample) is measured by shape measurement and stored as first shape data. Based on the first shape data and second shape data associated with the three-dimensional shape of the sample chamber, movement of the object is performed to avoid collision between the object and the sample chamber.

[0014] It is also known from existing technology that a surface model of a structure is calculated based on the detected light rays emitted from it. This surface model is then used to determine its location and orientation relative to an object region, and a measurement point is determined relative to the surface model. The object is then located based on the calculated surface model, the determined location, the orientation, and the determined measurement point. In this case, a surface model of the microscope portion can also be calculated and combined with the surface model of the structure to form a common surface model. The surface model of the structure can be used to locate points within the object region. The common surface model can be used to monitor the distance between the structure and the microscope portion, thereby avoiding collisions during the location process.

[0015] A method is also known from the prior art, which involves operating a particle beam device in a 3D operating mode to capture a three-dimensional representation of an object by transverse scanning of the particle beam (performing a scan perpendicular to the optical axis of the particle beam device). Here, the method is implemented such that the three-dimensional representation information from the 3D operating mode is combined with information from a high-resolution operating mode, enabling the user of the particle beam device to easily identify which areas of the object have been examined. The method can also be used to locate measurement sites again if the object moves relative to the particle beam device, or for example, if the object is removed from the particle beam device and reinserted for further examination.

[0016] Regarding prior art, see US 11,217,422 B2, JP 7008650 B2, EP 3 693 989 A1, DE 102010 046 902 A1 and US 8,227,752 B1.

[0017] To avoid collisions between a first device and at least one second device during operation of a particle beam device, it is known to implement a particle beam device such that when a collision is determined and / or predetermined to occur between the first device and at least one second device, a control unit stops the movement of the first device. For this purpose, for example, data of the first device and / or at least one second device is captured and / or retrieved, wherein the data describes the external shape of the first device and / or at least one second device. For example, the first device is understood as any element capable of being movably arranged in and / or on the particle beam device. For example, at least one second device is understood as any element capable of being arranged in and / or on the particle beam device. Alternatively or as an alternative, the particle beam device is understood as at least one second device. Summary of the Invention

[0018] The technical problem to be solved by the present invention is to provide an additional method for operating a particle beam device, a computer program product, and a system including a particle beam device, by means of which the movement of the device in the particle beam device can be easily performed, and in particular, this can be performed automatically.

[0019] The aforementioned technical problem is solved by a method for operating a particle beam device to image, process, and / or analyze objects. This application also provides a computer program product comprising program code that is loaded or can be loaded into a processor unit and, when executed, controls the particle beam device to cause the execution of the method according to the invention. The invention also relates to a particle beam device. Further features of the invention will become apparent from the following description and / or the accompanying drawings.

[0020] The method according to the invention is used to operate a particle beam apparatus for imaging, processing, and / or analyzing an object. In this case, the object can represent any element arranged in the sample chamber of the particle beam apparatus. Specifically, the particle beam apparatus has at least one beam generator for generating a particle beam comprising charged particles. For example, the charged particles are electrons or ions. The particle beam apparatus also has, for example, guiding, shaping, and / or focusing the particle beam comprising charged particles onto the object.

[0021] Furthermore, the particle beam device specifically includes a first device. For example, the object is implemented as the first device. For example, the first device is understood as any element capable of being movably arranged in and / or on the particle beam device. An element is movably arranged when it can be moved using at least one moving device. Regarding at least one moving device, refer to the following statement.

[0022] The particle beam device also has, for example, at least one second device. For instance, at least one second device is understood to be any element capable of being arranged in and / or on the particle beam device. Alternatively or as an alternative, for example, the particle beam device is understood to be at least one second device.

[0023] Furthermore, the particle beam device has at least one detector, for example, for detecting interacting particles and / or interacting radiation. When the particle beam is incident on an object, interacting particles and / or interacting radiation are generated by the interaction between the particle beam and the object. As a result of the interaction, in particular, the object emits electrons (so-called secondary electrons) and electrons from the primary electron beam are backscattered (so-called backscattered electrons). The secondary electrons and backscattered electrons are detected and used for image generation. Thus, an image representation of the object to be examined is obtained. In addition, interacting radiation (e.g., X-ray radiation or cathodoluminescence) is generated during the interaction, and this interacting radiation is detected, for example, by a detector and subsequently evaluated for object analysis.

[0024] Furthermore, the particle beam device has at least one moving device, for example, for moving the first device. In this case, the at least one moving device may be designed to perform at least one translational movement and / or at least one pivotal movement. Regarding translational and / or pivotal movements, refer to further statements below.

[0025] Furthermore, the particle beam device has at least one control unit, for example, for receiving control data and / or for actuating at least one moving device. Additionally, the particle beam device has at least one data storage unit, for example, for storing data (particularly structural data and / or collision data). Furthermore, the particle beam device has, for example, a processor unit loaded with a computer program product having at least one of the features further mentioned above or below, or a combination of at least two of the features further mentioned above or below.

[0026] In other words, at least one moving device can perform at least one translational movement and / or at least one pivotal movement about at least one axis of rotation in at least one spatial direction. In this context, translational movement should be understood as a linear movement in which all points of the body undergo the same displacement. Pivotal movement should be understood as a movement in which all points of the body move along a circular path about a common axis (axis of rotation). In this context, during pivotal movement, the movement must not result in a closed circular path about the common axis.

[0027] This method includes the method steps explained below.

[0028] In one method step according to the invention, first structural data and second structural data are provided. The first structural data and second structural data will be discussed in more detail below.

[0029] The first structural data includes information regarding at least one first surface arrangement of a first device within the particle beam apparatus. In other words, for example, the first structural data may describe at least one first surface arrangement of the first device. The second structural data includes information regarding at least one second surface arrangement of at least one second device within the particle beam apparatus. In other words, for example, the second structural data may describe at least one second surface arrangement of at least one second device.

[0030] Furthermore, it is specified that, for example, the first surface arrangement has a first limited space that partially or completely surrounds the first device. In other words, the first limited space defines the first surface arrangement. Based on the first device, the first limited space has a range, for example, up to 100 mm, up to 50 mm, up to 20 mm, up to 10 mm, up to 1 mm, up to 500 μm, up to 300 μm, up to 100 μm, or up to 10 μm. However, the invention is not limited to such ranges. Rather, the range of the first limited space can have any value suitable for the invention. In particular, the range of the first limited space is variable. For example, the range of the first limited space depends on the moving speed of the first device and / or at least one second device. Alternatively, the range of the first limited space depends on the distance between the first device and at least one second device. Specifically, it is specified that the range of the first limited space increases with increasing distance between the first device and at least one second device, and decreases with decreasing distance between the first device and at least one second device. Alternatively, or as an alternative, the extent of the first limited space is specified to increase with the increasing moving speed of the first device and / or at least one second device, and the extent of the first limited space is specified to decrease with the decreasing moving speed of the first device and / or at least one second device.

[0031] Furthermore, it is specified that, for example, the second surface arrangement has a second limited space that partially or completely surrounds at least one second device. In other words, the second limited space defines the second surface arrangement. Based on at least one second device, the second limited space has a range, for example, up to 100 mm, up to 50 mm, up to 20 mm, up to 10 mm, up to 1 mm, up to 500 μm, up to 300 μm, up to 100 μm, or up to 10 μm. However, the invention is not limited to such ranges. Rather, the range of the second limited space can have any value suitable for the invention. In particular, the range of the second limited space is variable. For example, the range of the second limited space depends on the moving speed of the first device and / or at least one second device. Alternatively, the range of the second limited space depends on the distance between the first device and at least one second device. Specifically, it is specified that the range of the second limited space increases with increasing distance between the first device and at least one second device, and decreases with decreasing distance between the first device and at least one second device. Alternatively, or as an alternative, the extent of the second limited space is specified to increase with the increasing moving speed of the first device and / or at least one second device, and the extent of the second limited space is specified to decrease with the decreasing moving speed of the first device and / or at least one second device.

[0032] For example, when performing the method steps according to the invention, particularly in the check performed to determine whether the first surface arrangement and the second surface arrangement have at least one common point during the movement of the first device, a first limited range space of the first surface arrangement and / or a second limited range space of the second surface arrangement are used. Specifically, it is specified that the check is performed to determine whether the first limited range space and the second limited range space have a common point.

[0033] Furthermore, the first structural data and / or the second structural data include, for example, information regarding at least one transformation of the first device and / or at least one second device. Within the meaning of this invention, a transformation of the first device and / or at least one second device can be understood as, for example, movement of the first device and / or at least one second device. During movement, the first device and / or at least one second device undergoes a transformation because the characteristics of the first device and / or at least one second device (i.e., its spatial positioning) change. Specifically, this transformation can be understood as movement of the first device and / or at least one second device along a movement path. In this context, within the meaning of this invention, a movement path can be understood as a series of points in space, wherein these points are implemented such that movement from the first point of the series to the last point of the series can be performed. In the movement from the first point of the series to the last point of the series, each point in the series can be traversed sequentially. For example, only a portion of the movement path can also be understood as the movement path. In this case, only a portion of the points in the series will be traversed during the movement. Each point in the series is also referred to hereinafter as an intermediate point. Alternatively, within the meaning of this invention, a transformation of the first device and / or at least one second device may be understood as a modification of the first device and / or at least one second device. Alternatively, within the meaning of this invention, a transformation of the first device and / or at least one second device may not be understood as a modification of the first device and / or at least one second device. In this case, within the meaning of this invention, a transformation of the first device and / or at least one second device is understood as a movement of the first device and / or at least one second device.

[0034] Within the meaning of this invention, deformation of the first device and / or at least one second device can be understood as, for example, a change in the surface arrangement of the first device and / or at least one second device. In this case, the deformed device can, for example, maintain its spatial positioning during deformation. For example, during deformation of the first device within the meaning of this invention, the surface arrangement of the first device can change, while the center of mass of the first device does not change spatially. Alternatively, within the meaning of this invention, deformation of the first device and / or at least one second device can be understood as expansion and / or contraction. Within the meaning of this invention, expansion is understood as an increase in spatial extent. Within the meaning of this invention, contraction is understood as a decrease in spatial extent. For example, expansion can be thermal expansion. In other words, the expansion of the first device and / or at least one second device can be caused by a temperature change in the first device and / or at least one second device. For example, contraction can be thermal contraction. In other words, the contraction of the first device and / or at least one second device can be caused by a temperature change in the first device and / or at least one second device.

[0035] Alternatively, within the meaning of this invention, deformation of the first device and / or at least one second device can be understood as stretching. Within the meaning of this invention, stretching is understood as a change in the length of a body subjected to at least one force. In this case, stretching can achieve shortening or elongation of the body. Alternatively, within the meaning of this invention, deformation of the first device and / or at least one second device can be understood as torsion. Within the meaning of this invention, torsion of the body is understood as twisting of the body. For example, two opposing torques acting on the body cause twisting of the body.

[0036] Furthermore, or alternatively, within the scope of this invention, variations of the first device and / or at least one second device may include changes to the first device and / or at least one second device itself. For example, a change to the first device includes movement of a first portion of the first device relative to a second portion of the first device. If the first device is implemented, for example, as a movable manipulator, a change to the movable manipulator may include movement of a line of the movable manipulator relative to the body of the movable manipulator.

[0037] As explained above, first structural data and second structural data are provided in the above method steps of the method according to the invention. The provision of the first structural data and the second structural data can be performed in at least one of at least three possible variations.

[0038] In a first variation providing first structural data and / or second structural data, the first structural data and / or second structural data are retrieved from a data storage unit of the particle beam device. For example, the data storage unit is assigned to and / or arranged on the particle beam device. Alternatively, the data storage unit is arranged separately from the particle beam device. Specifically, the data storage unit is specified to be capable of signal and / or radio connection with the particle beam device. In this case, the data storage unit is implemented such that it is suitable for storing and retrieving data. In other words, the data storage unit stores data corresponding to the first structural data and / or second structural data. This data corresponding to the first structural data and / or second structural data can be retrieved from the data storage unit. Alternatively, the first structural data and / or second structural data can be calculated based on the data stored in the data storage unit.

[0039] In a second variation providing first and / or second structural data, the user of the particle beam device inputs the first and / or second structural data into the control unit of the particle beam device using an input unit. In this case, the control unit is configured to control the particle beam device. For example, the control unit is designed to actuate at least one moving device and / or actuate a guiding device of the particle beam device. As described above, the user of the particle beam device uses the input unit of the particle beam device for input. In this case, the input unit is configured to input data. For example, the input unit is configured as a keyboard, and / or a joystick, and / or at least one sensor that transmits data to the control unit, and / or at least one detector that transmits data to the control unit. Alternatively or as an alternative, the input unit can be configured as a camera, which is programmed using a computer program to capture gestures made by the user and interpret the gestures as data. Furthermore, alternatively or as an alternative, the input unit can be configured as a unit that allows reading desired data from a file. In other words, the first and / or second structural data are provided using the input unit.

[0040] In a third variation providing first and / or second structural data, at least one detector and / or at least one sensor for recording structural data from a particle beam apparatus are used to record the first and / or second structural data. For example, the detector for recording structural data may correspond to the detector of the particle beam apparatus further mentioned above. In this case, the detector for recording structural data is implemented such that it is designed to detect interacting particles and / or interacting radiation. When the particle beam is incident on the first device and / or at least one second device, the interaction between the particle beam and the first device and / or at least one second device produces interacting particles and / or interacting radiation. As a result of the interaction, specifically, the first device and / or at least one second device emits electrons (so-called secondary electrons), and electrons from the primary electron beam are backscattered (so-called backscattered electrons). The secondary electrons and backscattered electrons are detected and used for image generation. Thus, an image representation of the first device and / or at least one second device to be examined is obtained. Furthermore, interacting radiation (e.g., X-ray radiation or cathodoluminescence) is generated during the interaction, and this interacting radiation is detected, for example, by the detector for recording structural data and subsequently evaluated for analysis of the first device and / or at least one second device. The sensor used for recording structural data is implemented such that it is designed to capture the physical characteristics of the first device and / or at least one second device. For example, the sensor for recording structural data can capture electromagnetic radiation scattered at the first device and / or at least one second device. In particular, in this case, the electromagnetic radiation may include at least one wavelength in the wavelength range of 400 nm to 2000 nm.

[0041] It should be noted that various variations of the above-described variants can be used to provide the first structural data and the second structural data. In other words, the variant used to provide the first structural data may not correspond to the variant used to provide the second structural data. For example, the first structural data is provided by recording the first structural data using at least one detector for recording structural data, and the second structural data is provided by retrieving the second structural data from the data storage unit of the particle beam device.

[0042] The first and / or second structural data can be provided, for example, in the form of CAD data. In other words, a CAD model can exist from which information related to the first and / or second structural data can be obtained.

[0043] In another method step according to the invention, a target arrangement of the first device is determined using a control unit of the particle beam device. In this case, the target arrangement, within the scope of the invention, is, for example, the relative arrangement of the first device with respect to at least one second device. In other words, the target arrangement specifies, for example, the desired arrangement to be achieved by the first device relative to at least one second device. For example, the target arrangement of the first device is determined by inputting target data into the control unit of the particle beam device and / or by loading target data from a data storage unit into the control unit of the particle beam device. Specifically, the target data is input using an input unit or an input device of the control unit. The target data, within the scope of the invention, is suitable for defining the target arrangement. For example, the target data includes spatial coordinates of the first device relative to at least one second device, wherein the spatial coordinates of the first device relative to at least one second device describe at least one location of the first device relative to at least one second device in the target arrangement. Alternatively or as an alternative, the target arrangement of the first device can be determined by capturing the target data using at least one sensor and / or at least one detector. Furthermore, alternatively or as an alternative, the target arrangement of the first device can be determined by calculating the target data using the control unit of the particle beam device. For example, the control unit of the particle beam device can be used to calculate the target data using a computer program employing an image recognition method. Regarding the control unit and input unit, the statements above also apply here.

[0044] In a further step of the method according to the invention, a processor unit is used to provide at least one movement path for the first device to reach a target arrangement of the first device. Regarding the movement path, reference is made to the statements above, which similarly apply herein. For example, the processor unit is assigned to and / or arranged on a particle beam device.

[0045] Providing a movement path includes determining the movement path, for example, by defining intermediate points, where intermediate points are points in space that can be used to describe the movement path (see also the statement about movement paths above in this regard). For example, intermediate points can be described using spatial coordinates. For instance, the movement path can be determined by the shortest distance between intermediate points.

[0046] For example, when a movement path is provided, the processor unit generates data describing the movement path. For instance, the data describes multiple movement paths. Specifically, a single movement path can be selected from the multiple movement paths. The single movement path can be selected from the multiple movement paths, for example, based on predefined criteria. Predefined criteria for selecting a single movement path may include, for example, the length of the single movement path, the duration of the movement process associated with the single movement path, the distance between the single movement path and surrounding devices, and / or the location of the single movement path. The movement process within the context of this invention is understood herein as the execution of movement. In other words, for example, the movement of a first device along a movement path is referred to as a movement process. For example, the movement process is controlled by a control unit of the particle beam device using at least one movement device. In other words, the movement process is executed, for example, in an automated manner. At least one movement device is adapted to move the first device within the particle beam device (see, in this regard, further statements regarding at least one movement device given above or below). For example, the first device is arranged on at least one movement device in the form of an object holder and / or an object stage. At least one movement device can perform movement of the first device, such as translational movement and / or pivoting movement.

[0047] In a further method step according to the invention, a processor unit is used to model at least one movement path of the first device within the particle beam apparatus. In other words, the movement path is modeled by computation. The provisioning and modeling of the movement path may be included in a single method step or may be the same.

[0048] The first structural data, the second structural data, and the target arrangement of the first device are used for modeling. Regarding the movement path, the statements above also apply similarly herein. The processor unit of the particle beam device is designed to perform computational operations and / or execute programs. In particular, a portion of the movement path can also be understood as a movement path within the scope of this invention. Modeling the movement path within the scope of this invention includes determining the movement path. In other words, modeling can be understood as simulating the movement path.

[0049] The provisioning and / or modeling of at least one movement path of the first device within the particle beam apparatus using the processor unit can be repeated. For example, the provisioning and / or modeling of at least one movement path of the first device within the particle beam apparatus can be repeated when a user of the particle beam apparatus provides input (wherein the input is intended for repeated modeling). For example, the provisioning and / or modeling of a new target arrangement input using the input unit can be intended for repeated provisioning and / or modeling.

[0050] In another method step according to the invention, on one hand, a processor unit is used to check whether the modeling of the movement path of the first device within the particle beam device has the following result: when performing a movement process along the modeled movement path, at least one first surface arrangement of the first device and at least one second surface arrangement of the at least one second device have at least one common point at at least one point on the modeled movement path. On the other hand, in this method step according to the invention, a check is performed to determine whether the modeling of the movement path of the first device within the particle beam device has the following result: when performing a movement process along the modeled movement path, at least one first surface arrangement of the first device and at least one second surface arrangement of the at least one second device are at the shortest distance from each other, wherein the shortest distance is less than a predefined minimum distance, and wherein, when performing a movement process along the modeled movement path, at least one first surface arrangement of the first device and at least one second surface arrangement of the at least one second device have no common point. Within the meaning of the invention, the distance between the first body and the second body is understood to refer to the shortest possible connection among all possible connections between any point on the surface of the first body and any point on the surface of the second body. Among all distances between at least one first surface arrangement of the first device and at least one second surface arrangement of the at least one second device during the movement process along the modeled movement path, the smallest possible distance is referred to as the shortest distance. The predefined minimum distance can be provided, for example, by retrieval from a data storage unit and / or by input from a user-accessible input unit of the particle beam device. For example, the predefined minimum distance is not less than 10 µm.

[0051] In other words, in the above-described method steps according to the invention, a check is performed to determine whether there is a match between at least one first point of at least one first surface arrangement of the first device and at least one second point of at least one second surface arrangement of the at least one second device when the movement process is performed along the modeled movement path. Furthermore, a check is performed to determine whether, during the movement process along the modeled movement path, there exists a state where the shortest distance between at least one first surface arrangement of the first device and at least one second surface arrangement of the at least one second device is lower than a predefined minimum distance. In other words, a check is performed to determine whether, during the movement process along the modeled movement path, at least one first surface arrangement of the first device and at least one second surface arrangement of the at least one second device are closer to each other than a predefined minimum distance is specified. The predefined minimum distance can be retrieved, for example, from a data storage unit. Alternatively, or as an alternative, the predefined minimum distance can be determined by input from a user input unit of the particle beam device.

[0052] In another method step according to the present invention, different processing is performed based on the inspection results in the above method steps.

[0053] If at least one first surface arrangement of the first device and at least one second surface arrangement of the at least one second device have at least one common point when the movement process is performed along the modeled movement path, then at least one of the following method steps is performed in a further method step of the method according to the invention:

[0054] (a) Displaying the message on the display unit of the particle beam device;

[0055] (b) Abandon or terminate the movement of the first device along the provided movement path. If the movement of the first device along the provided movement path has not yet started, then the movement process is not initiated accordingly. However, if the movement of the first device along the provided movement path has already started, then the process is terminated;

[0056] (c) Discard the movement of the first device along the provided movement path, or switch it to another movement process. If the movement of the first device along the provided movement path has not yet started, then the movement process is not initiated accordingly. However, if the movement of the first device along the provided movement path has already started, then it is switched to another movement process. For example, switching the movement process of the first device includes restricting the other movement process to predefined degrees of freedom of movement of the first device, in particular to one or more predefined translational and / or rotational movements;

[0057] (d) Perform the movement of the first device along the provided movement path using at least one moving device for moving the first device;

[0058] (e) Using a moving device for moving the first device to change the speed of the first device's movement along the provided moving path.

[0059] The aforementioned additional movement process can be, for example, a manual movement process, that is, a movement process controlled by user input. Alternatively, or as an alternative, the additional movement process can be a movement of the first device along an additional movement path, wherein the additional movement path originates from the provided movement path, for example, such that the additional movement path can be obtained by shifting or rotating the provided movement path. For example, the additional movement path is generated from the provided movement path such that all points of the provided movement path are shifted in a certain direction (e.g., a direction parallel to the optical axis of the particle beam device).

[0060] The display unit described above, within the scope of this invention, is designed to display data. For example, the display unit is used to convey information to a user of a particle beam device, indicating that at least one first surface arrangement of a first device and at least one second surface arrangement of at least one second device have at least one common point when a movement process is performed along a modeled movement path.

[0061] The aforementioned process of suspending the movement of the first device along the provided movement path includes, for example, stopping the movement of the first device along the provided movement path. Alternatively, or as an alternative, suspending the movement of the first device along the provided movement path includes, for example, not initiating the movement of the first device along the provided movement path.

[0062] When the movement process of the first device along the provided movement path is switched to another movement process, the target data is no longer used to further control the movement process of the first device along the provided movement path.

[0063] In the aforementioned additional movement process within the scope of this invention, the first device moves, for example, through input from the user input unit and control unit of the particle beam device. In other words, for example, the user of the particle beam device controls the movement of the first device. Switching the movement of the first device along the provided movement path to another movement process includes, for example, terminating the movement of the first device along the provided movement path.

[0064] During the aforementioned process of moving the first device along the provided moving path, for example, the first device and at least one second device may come into contact because at least one first surface arrangement of the first device and at least one second surface arrangement of the at least one second device have at least one common point when the moving process is performed along the modeled moving path.

[0065] For example, as a result of the above identification that at least one first surface arrangement of the first device and at least one second surface arrangement of the at least one second device have at least one common point when performing a movement process along the modeled movement path, a decision regarding whether to perform at least one of method steps (a) to (e) (i.e., (a) displaying a message on the display unit of the particle beam device, and / or (b) abandoning or terminating the movement process of the first device along the provided movement path, and / or (c) abandoning the movement process of the first device along the provided movement path, or switching it to another movement process, and / or (d) performing the movement process of the first device along the provided movement path, and / or (e) using a movement device for moving the first device to change the speed of the movement process of the first device along the provided movement path) can be stored in the data storage unit. In other words, the data storage unit contains information such as that a message is always displayed on the display unit of the particle beam device, and the movement process of the first device along the provided movement path is always terminated once the check result is that at least one first surface arrangement of the first device and at least one second surface arrangement of the at least one second device have at least one common point when performing a movement process along the modeled movement path. Alternatively, the decision can be made by the user of the particle beam device. In this case, for example, a message is displayed on the display unit of the particle beam device, linking to at least one selection option regarding whether the movement of the first device along the provided movement path should be abandoned, and / or whether the movement of the first device along the provided movement path should be stopped, and / or whether the movement of the first device along the provided movement path should be switched to another movement process, and / or whether the speed of the movement of the first device along the provided movement path should be changed. The message display may include, for example, information about the arrangement, the expected distance between the first device and at least one second device, a visualization of the arrangement, and / or warning messages. By inputting through an input unit, the user of the particle beam device can select from at least one selection option. Alternatively, the user of the particle beam device can choose to execute the movement of the first device along the provided movement path, for example, to intentionally bring the first device into mechanical contact with at least one second device.

[0066] When a first point of at least one first surface arrangement of the first device and a second point of at least one second surface arrangement of the at least one second device are at the shortest distance during a movement along the modeled movement path, wherein the shortest distance is less than a predefined minimum distance, and wherein at least one first surface arrangement of the first device and at least one second surface arrangement of the at least one second device have no common points during the movement along the modeled movement path, at least one of the following method steps is performed in a further method step of the method according to the invention:

[0067] (a) Displaying the message on the display unit of the particle beam device;

[0068] (b) Discard the movement of the first device along the provided path, or change the speed of the movement of the first device along the provided path. If the movement of the first device along the provided path has not yet started, then the movement is not initiated accordingly. However, if the movement of the first device along the provided path has already started, then the speed of the first device along the provided path is changed. For example, the speed is changed based on the shortest distance. Specifically, the smaller the distance between the first device and the second device, the lower the speed;

[0069] (c) Discard the movement of the first device along the provided moving path, or terminate the movement of the first device along the provided moving path. If the movement of the first device along the provided moving path has not yet started, then the movement process is not initiated accordingly. However, if the movement of the first device along the provided moving path has already started, then the movement of the first device along the provided moving path is terminated;

[0070] (d) Discard the movement of the first device along the provided movement path, or switch the movement of the first device along the provided movement path to another movement process. If the movement of the first device along the provided movement path has not yet started, then the movement process is not initiated accordingly. However, if the movement of the first device along the provided movement path has already started, then the movement of the first device along the provided movement path is switched to another movement process. For example, switching the movement process of the first device includes restricting the other movement process to predefined degrees of freedom of movement of the first device, in particular to one or more predefined translational and / or rotational movements;

[0071] (e) The process of moving the first device along the provided movement path is performed using at least one moving device for moving the first device.

[0072] Regarding displaying messages on the display unit of the particle beam device, discarding the movement of the first device along the provided movement path, terminating the movement of the first device along the provided movement path, switching the movement of the first device along the provided movement path to another movement process, and executing the movement of the first device along the provided movement path, the statements above apply similarly herein. When changing the speed of the first device's movement along the movement path, for example, using at least one moving device, the first device moves slower and / or faster than the normal speed of the movement along the provided movement path. For example, the speed changes based on the shortest distance. The normal speed of the movement process and / or the changed speed of the movement process are stored, for example, in a data storage unit. Alternatively or as an alternative, the normal speed of the movement process and / or the changed speed of the movement process can be predefined by input from the user of the particle beam device.

[0073] As a result of the above identification of the following: when performing a movement process along the modeled movement path, at least one first point of at least one first surface arrangement of the first device and at least one second point of at least one second surface arrangement of the at least one second device are at the shortest distance, wherein the shortest distance is less than a predefined minimum distance, and wherein when performing a movement process along the modeled movement path, at least one first surface arrangement of the first device and at least one second surface arrangement of the at least one second device have no common points, regarding whether to perform at least one of the method steps (a) to (e) (i.e., (a) displaying a message on the display unit of the particle beam device, and / or (b) abandoning the movement process of the first device along the provided movement path or changing the speed of the movement process of the first device along the provided movement path, and / or (c) abandoning the movement process of the first device along the provided movement path or terminating the movement process of the first device along the provided movement path, and / or (d) abandoning the movement process of the first device along the provided movement path or switching the movement process of the first device along the provided movement path to another movement process, and / or (e) The decision to perform the movement of the first device along the provided movement path using at least one moving device for moving the first device can be, for example, stored in a data storage unit and / or determined by input from the user of the particle beam device. Regarding the storage of decisions in a data storage unit and the making of decisions by the user of the particle beam device, the statements above also apply similarly herein.

[0074] When at least one first surface arrangement of the first device and at least one second surface arrangement of the at least one second device are at the shortest distance during the movement process along the modeled movement path, wherein the shortest distance is greater than or equal to a predefined minimum distance, and wherein at least one first surface arrangement of the first device and at least one second surface arrangement of the at least one second device therefore have no common points during the movement process along the modeled movement path, the movement process of the first device along the provided movement path is performed using at least one moving device for moving the first device.

[0075] This invention is based on the following unexpected insight. A movement path of the first device is modeled based on the provided structural data of the first device and at least one second device, and the determined target arrangement of the first device. A check is performed to determine whether the modeling of the movement path of the first device within the particle beam device has the following results: at at least one point along the movement path, when the first device moves along the modeled movement path, (i) a collision occurs between the first device and at least one second device within the particle beam device, and / or (ii) the shortest distance between the first device and at least one second device is less than a predefined minimum distance, but wherein no collision occurs between the first device and at least one second device within the particle beam device. The check results can be stored. Depending on the inspection results, (a) a message is displayed on the display unit of the particle beam device, and / or (b) the movement of the first device along the movement path is abandoned or the speed of the movement of the first device along the movement path is changed, and / or (c) the movement of the first device along the movement path is abandoned or the movement of the first device along the movement path is stopped, and / or (d) the movement of the first device along the movement path is abandoned or the movement of the first device along the movement path is switched to another movement process, and / or (e) the movement of the first device along the movement path is performed using a movement device for moving the first device. The present invention enables the movement of the first device along the movement path to be performed in a suitable manner based on the provided structural data and the determined target arrangement. Therefore, the present invention enables the movement of the first device along the movement path to be performed such that the first device does not collide with at least one second device within the particle beam device and / or the particle beam device itself. The present invention enables the avoidance of collisions between the first device and at least one second device within the particle beam device and / or with the particle beam device itself, wherein such collisions may result in contamination, damage, and / or destruction of the first device and / or at least one second device. Therefore, the present invention makes it possible to avoid the inability to use the first device and / or at least one second device. For example, by determining a target arrangement, the present invention can also achieve contact between the micromanipulator and the sheet. For example, if the determined target arrangement corresponds to a site on the sheet or a site on the micromanipulator, then the micromanipulator can be made to contact the sheet. Furthermore, the present invention also allows the first device to intentionally contact at least one second device. This can, for example, create a mechanical connection. Alternatively, or as an alternative, this can create an electrical connection.

[0076] The method according to the invention is also particularly applicable to situations where the first device has already moved within the sample chamber of the particle beam apparatus and at least the second device is introduced into the sample chamber of the particle beam apparatus only while the first device is moving. Furthermore, the method according to the invention is also particularly applicable to situations where the first device has already moved within the sample chamber of the particle beam apparatus and at least one second device moves within the sample chamber while the first device is moving. In this respect, the method according to the invention is also applicable when the first device and / or at least the second device are already moving.

[0077] The method according to the invention is also particularly applicable to situations where the first device has already moved within the sample chamber of the particle beam apparatus and the direction of movement of the first device is changed while it is moving. Once the change in the direction of movement of the first device is detected, the method according to the invention is performed partially or completely.

[0078] In one embodiment of the method according to the invention, additionally or alternatively, the inspection results are stored as collision data in the data storage unit. In other words, the inspection information explained above is stored as collision data in the data storage unit. Regarding the data storage unit, refer to the statement above. For example, the collision data includes information about common points along the modeled movement path where at least one first surface arrangement of the first device and at least one second surface arrangement of the at least one second device are located. For example, the collision data includes information about a minimum distance between at least one first surface arrangement of the first device and at least one second surface arrangement of the at least one second device that occurs during the movement along the modeled movement path being less than a predefined minimum distance. For example, the stored collision data can be displayed on a display unit.

[0079] In other embodiments of the method according to the invention, additionally or as an alternative, at least one of the following elements is specified as being used as the first device and / or at least one second device: an object, an object stage, an object holder, a micromanipulator, a sample chamber, a lock, a light source, a beam column, a capture device (e.g., a detector for recording structural data and / or a sensor for recording structural data and / or any detector arranged on the particle beam device), a gas injection system, a charge compensation device, a camera, a locking lever, a clamp, a scanning system (e.g., in the form of at least one focusing lens and / or in the form of at least one objective lens and / or in the form of at least one deflection unit), electrodes, cables, hoses, a scanning force microscope, a microtome, a plasma cleaner, a Faraday cup, an aperture, an objective cover, at least a portion of the beam column, and the particle beam device. In other words, any element within the particle beam device and / or the particle beam device itself, provided it is suitable for use as the first device and / or at least one second device, is acceptable as long as it is appropriate for the purposes of this invention. If an element within the purposes of this invention can be movably arranged within the particle beam device, then that element is suitable as the first device. For example, if an element in the sense of the present invention is designed to move relative to another element using an object stage, then the element is suitable as a first device. In this case, the movement can be automated, for example, by using a control unit. Alternatively, or as an alternative, the movement can be manual, for example, if the movement is performed by manual actuation by a user of the particle beam device. If an element in the sense of the present invention can be arranged within and / or is the particle beam device, then the element is suitable as at least one second device. For example, at least one second device can also be arranged only partially within the particle beam device, for example, if at least one second device is implemented as a lock. In particular, if the first device and at least one second device may collide and / or be at a minimum distance below a predefined minimum distance due to the movement of the first device, then an element in the sense of the present invention is suitable as at least one second device.

[0080] In another embodiment of the method according to the invention, additionally or as an alternative, it is specified that the movement path of the first device within the particle beam apparatus is provided and / or modeled considering a predefined minimum distance, such that the distance between the first device and at least one second device always corresponds to at least the predefined minimum distance. In other words, the movement path of the first device within the particle beam apparatus is provided and / or modeled such that, during the execution of movement along the modeled movement path, any distance between a first position on at least one first surface arrangement of the first device and a second position on at least one second surface arrangement of the at least one second device is not less than the minimum distance. In other words, the movement path of the first device within the particle beam apparatus is provided and / or modeled such that no collision occurs between the first device and at least one second device, and the distance between the first device and at least one second device is always at least the minimum distance. It should be noted that the distance in the context of this invention refers to a physical distance. In other words, if the first device and at least one second device are not in contact with each other, the distance in the context of this invention can be greater than zero. In the context of this invention, if the first device and at least one second device are in contact with each other, the distance can be zero. Within the scope of this invention, the distance can be less than zero if the first device and at least one second device are in contact with each other and pressure is applied between them. For example, by performing a movement process, the first device and at least one second device can be stacked on top of each other, such that the first device is positioned on top of the at least one second device under pressure, for example, to establish a connection between the first device and the at least one second device.

[0081] The minimum distance can be, for example, a predefined minimum distance. In this case, the movement path of the first device within the particle beam apparatus is provided and / or modeled such that the shortest distance between the first device and at least one second device is always greater than the predefined minimum distance. The minimum distance can be provided, for example, by retrieving from a data storage unit and / or by input from a user-accessible input unit of the particle beam apparatus. For example, the minimum distance is not less than 10 µm. Referring to the statements above regarding the shortest and minimum distances, these statements also apply similarly here.

[0082] Furthermore, or alternatively, the method according to the invention may have at least one of the features further mentioned above or below, or a combination of at least two of the features further mentioned above or below.

[0083] The embodiments of the method according to the present invention are not limited to the order of the method steps presented above. Instead, any order of method steps suitable for solving the problem within the scope of the present invention may be used. Alternatively, it is also provided that at least two method steps are performed in parallel. Alternatively, it is also provided that individual method steps are omitted.

[0084] The present invention also relates to a computer program product comprising program code capable of being loaded or loaded into a processor unit of a particle beam apparatus, wherein, when executed in the processor unit, the program code controls the particle beam apparatus to perform a method having at least one of the preceding or following features, or a combination of at least two of the preceding or following features. In other words, the present invention also relates to a non-volatile computer-readable medium comprising software capable of being loaded or loaded into a processor unit of a particle beam apparatus, wherein, when executed in the processor unit, the software controls the particle beam apparatus to perform a method having at least one of the preceding or following features, or a combination of at least two of the preceding or following features. The software includes executable code for performing at least one of the preceding or following method steps. In this respect, the present invention also relates to a processor unit disposed on a particle beam apparatus and designed to perform a method having at least one of the preceding or following features, or a combination of at least two of the preceding or following features.

[0085] The present invention also relates to a system comprising a data storage unit for storing structural data and a particle beam device for imaging, processing, and / or analyzing an object, wherein the particle beam device has been further explained above and will be described in further detail below. This explanation will be briefly summarized below.

[0086] The particle beam device has at least one beam generator for generating at least one particle beam comprising at least one charged particle. For example, the charged particles are electrons and / or ions. The particle beam device has a first device. For example, the object is implemented as the first device. For example, the first device is understood as any element capable of being movably arranged in and / or on the particle beam device. The element is movably arranged when it can be moved using at least one moving device. Referring to the at least one moving device, refer to the following statement. The particle beam device also has at least one second device. For example, at least one second device is understood as any element capable of being arranged in and / or on the particle beam device. Alternatively or as an alternative, the particle beam device is understood to be at least one second device. Furthermore, the particle beam device has at least one guiding device for guiding, shaping, and / or focusing the particle beam comprising charged particles onto the object. Furthermore, the particle beam device has at least one detector, for example, for detecting interacting particles and / or interacting radiation. When the particle beam is incident on the object, interacting particles and / or interacting radiation are generated by the interaction between the particle beam and the object. As a result of the interaction, specifically, the object emits electrons (so-called secondary electrons) and the electrons of the primary electron beam are backscattered (so-called backscattered electrons). The secondary electrons and backscattered electrons are detected and used for image generation. Thus, an image representation of the object to be examined is obtained. Furthermore, interaction radiation (e.g., X-ray radiation and / or cathodoluminescence) is generated during the interaction, and this interaction radiation is detected, for example, by a detector and subsequently evaluated for object analysis. Additionally, the particle beam device has at least one moving device for moving the first device. In this case, the at least one moving device can be designed to perform at least one translational movement and / or at least one pivotal movement. Regarding translational and / or pivotal movements, these statements, referring to the foregoing statements, also apply similarly herein. Furthermore, the particle beam device according to the invention has at least one control unit specifically for receiving control data and / or specifically for actuating at least one moving device and / or specifically for inputting structural data. Furthermore, the particle beam device has at least one data storage unit, for example, for storing data (particularly structural data and / or collision data). In addition, the particle beam device has a processor unit loaded with a computer program product having the features already mentioned above.

[0087] In one embodiment of the particle beam device, additionally or alternatively, the particle beam device is specified to have at least one display unit for outputting messages and / or at least one detector and / or at least one sensor for recording structural data. For example, the detector and / or sensor for recording structural data are designed to capture at least one first surface arrangement of a first device and / or at least one second surface arrangement of a second device. For example, the detector for recording structural data is implemented as an optical camera. For example, the sensor for recording structural data is implemented as a light sensor, a LiDAR sensor, and / or an ultrasonic sensor.

[0088] In another embodiment of the system according to the invention, or alternatively, the first device and / or at least one second device are provided to be implemented as at least one of the following elements: at least one object, object stage, object holder, micromanipulator, sample chamber, lock, light source, beam column, capture device, gas injection system, charge compensation device, camera, locking lever, clamp, scanning system (e.g., in the form of at least one focusing lens and / or in the form of at least one objective lens and / or in the form of at least one deflection unit), electrodes, cables, hoses, scanning force microscope, microtome, plasma cleaner, Faraday cup, aperture, objective cover, at least a portion of the beam column, and particle beam apparatus. In this case, the capture device may be, for example, a detector and / or a sensor for recording structural data. Alternatively, the capture device may be any detector arranged in and / or on the particle beam apparatus. In other words, any element within the particle beam apparatus and / or the particle beam apparatus itself may be used as the first device and / or at least one second device, provided it is suitable for the purposes of this invention. If an element within the purposes of this invention can be movably arranged within the particle beam apparatus, then that element is suitable as the first device. For example, if an element in the sense of the present invention is designed to move relative to another element using an object stage, then the element is suitable as a first device. In this case, the movement can be automated, for example, by using a control unit. Alternatively, or as an alternative, the movement can be manual, for example, if the movement is performed by manual actuation by a user of the particle beam device. If the element in the sense of the present invention can be arranged within and / or is the particle beam device, then the element is suitable as at least one second device. In particular, if the first device and at least one second device may collide and / or be at a minimum distance below a predefined minimum distance due to the movement of the first device, then the element in the sense of the present invention is suitable as at least one second device.

[0089] In another embodiment of the system according to the invention, additionally or alternatively, the beam generator is specified as a first beam generator. In this case, the particle beam is implemented as a first particle beam comprising a first charged particle, and the guiding device is implemented as a first guiding device for guiding, shaping, and / or focusing the first particle beam onto a region within the sample chamber. In this case, the region within the sample chamber may be, in particular, an object and / or a region on an object. Furthermore, the particle beam device has at least one second beam generator and at least one second guiding device, the at least one second beam generator being used to generate at least one second particle beam comprising a second charged particle, the at least one second guiding device being used to guide, shape, and / or focus the at least one second particle beam onto a region within the sample chamber. The second guiding device may be implemented, for example, a second scanning device and / or a second objective lens.

[0090] In another embodiment of the system according to the invention, the particle beam device is specified as an electron beam device and / or an ion beam device. Attached Figure Description

[0091] Further practical embodiments and advantages of the present invention are described below with reference to the accompanying drawings, in which:

[0092] Figure 1 A schematic diagram of the first particle beam device is shown;

[0093] Figure 1A Another schematic diagram of the first particle beam device is shown;

[0094] Figure 2 A schematic diagram of the second particle beam device is shown;

[0095] Figure 3 A schematic diagram of the third particle beam device is shown;

[0096] Figure 4 A schematic diagram of one embodiment of a mobile device in the form of an object platform is shown;

[0097] Figure 5 It shows according to Figure 4 Another schematic diagram of the object stage; and

[0098] Figure 6 A schematic diagram of a sequence according to an embodiment of the method according to the present invention is shown.

[0099] The invention will now be explained in more detail using particle beam apparatuses in the form of SEMs and combined apparatuses including electron beam columns and ion beam columns. It is explicitly stated that the invention can be used in any particle beam apparatus, particularly in any electron beam apparatus and / or any ion beam apparatus.

[0100] These figures are not drawn to scale. Detailed Implementation

[0101] Figure 1 A schematic diagram of SEM 100 is shown. SEM 100 has a first beam generator in the form of an electron source 101, which is implemented as a cathode. Additionally, SEM 100 is provided with an extraction electrode 102 and an anode 103, which is positioned at one end of a beam guide tube 104 of SEM 100. For example, electron source 101 is implemented as a thermal field emitter. However, the invention is not limited to this electron source 101. Instead, any electron source suitable for the invention can be used.

[0102] Electrons emitted from electron source 101 form a primary electron beam. The electrons are accelerated to the anode potential due to the potential difference between electron source 101 and anode 103. In the embodiment shown here, the anode potential relative to the ground potential of the sample chamber 120 is 100 V to 35 kV, for example 5 kV to 15 kV, particularly 8 kV. However, alternatively, the anode potential may also be at ground potential.

[0103] Two focusing lenses are arranged on the beam guide tube 104, specifically a first focusing lens 105 and a second focusing lens 106. When viewed from the direction of the first objective lens 107 starting from the electron source 101, in this case, the first focusing lens 105 is arranged in front, followed by the second focusing lens 106. It is explicitly stated that another embodiment of the SEM 100 may include only a single focusing lens. A first aperture unit 108 is arranged between the anode 103 and the first focusing lens 105. Together with the anode 103 and the beam guide tube 104, the first aperture unit 108 is at a high voltage potential (specifically the potential of the anode 103) or connected to ground. The first aperture unit 108 has a plurality of first apertures 108A, in... Figure 1 One of these is shown in the diagram. For example, there are two first apertures 108A. Each of the many first apertures 108A has a different aperture diameter. The desired first aperture 108A can be adjusted onto the optical axis OA of the SEM 100 by means of an adjustment mechanism (not shown). It is explicitly stated that in another embodiment, the first aperture unit 108 may be provided with only a single first aperture 108A. In this embodiment, the adjustment mechanism may not be provided. Thus, the first aperture unit 108 is stationary. A stationary second aperture unit 109 is arranged between the first condenser lens 105 and the second condenser lens 106. Alternatively, the second aperture unit 109 is specified to be movable.

[0104] The first objective lens 107 has pole shoes 110 in which boreholes are formed. A beam guide tube 104 is guided through the boreholes. Coils 111 are arranged in the pole shoes 110.

[0105] An electrostatic deceleration device is arranged in the lower region of the beam guide tube 104. The electrostatic deceleration device includes a single electrode 112 and a tubular electrode 113. The tubular electrode 113 is arranged at one end of the beam guide tube 104, which faces the object 125 arranged on the movable object holder 114.

[0106] SEM 100 has a first device. For example, the first device is understood as any element capable of being movably arranged in and / or on SEM 100. An element is movably arranged when it can be moved using at least one moving device. Within the meaning of this invention, at least one moving device is implemented such that it is adapted to move the first device within SEM 100. For example, the first device is arranged on at least one moving device, wherein the at least one moving device is implemented in the form of an object stage 122. According to... Figure 1 In embodiments of the present invention, the first device of the SEM 100 may be implemented as an object 125 and an object holder 114. The object stage 122 may perform movement of the first devices 114, 125 (in the form of object holders 114 and object 125), such as translational movement and / or pivoting movement. The SEM 100 also has at least one second device. For example, at least one second device is understood to be any element capable of being arranged in and / or on the SEM 100. Alternatively or as an alternative, the SEM 100 is understood to be at least one second device. According to... Figure 1 In embodiments of the present invention, at least one second device of the SEM 100 may be implemented as a radiation detector 119. Regarding the radiation detector 119, refer to further statements below.

[0107] In this case, object 125 can represent any element arranged in sample chamber 120 of SEM 100.

[0108] For example, the movement of the first devices 114, 125 is controlled by the control unit 123 of the SEM 100 using the object stage 122. In this case, the control unit 123 is implemented to be adapted to control the SEM 100. For example, the control unit 123 is designed to actuate the object stage 122 and / or actuate the guiding device of the SEM 100. Regarding the guiding device, refer to further description below. In other words, the movement process is performed, for example, in an automated manner.

[0109] In other words, the moving device, in the form of an object platform 122, can perform at least one translational movement in at least one spatial direction and / or at least one pivotal movement about at least one axis of rotation. In this context, translational movement should be understood as a linear movement in which all points of the object undergo the same displacement. Pivotal movement should be understood as a movement in which all points of the object move along a circular path about a common axis (axis of rotation). In this context, during pivotal movement, the movement must not result in a closed circular path about the common axis.

[0110] The tubular electrode 113, together with the beam guide tube 104, is at the potential of the anode 103, while the single electrode 112 and the object 125 are at a lower potential relative to the anode 103. In this case, this is the ground potential of the housing of the sample chamber 120. Therefore, the electrons of the primary electron beam can be slowed down to the desired energy required to examine the object 125.

[0111] The object 125 and the single electrode 112 can also be at different potentials and at a potential different from ground. This allows for adjustment of the deceleration point of the primary electron beam relative to the object 125. For example, if deceleration is performed very close to the object 125, the aberrations become smaller.

[0112] SEM 100 also includes at least one data storage unit 126 for storing and reading data from the data storage unit. SEM 100 also includes a processor unit 127. Processor unit 127 is designed to perform computational operations and / or execute programs. Program code of a computer program product is loaded into processor unit 127, and when executed, the program code controls SEM 100 to perform the method according to the invention. The method according to the invention will be discussed in further detail below.

[0113] The SEM 100 also includes a guiding device having a first deflection unit 130 and a second deflection unit. For example, the scanning device 115 is implemented as the second deflection unit of the SEM 100. The first deflection unit 130 is arranged on the source side within the first objective lens 107. In contrast, the second deflection unit 115 is arranged on the object side on the beam guide tube 104 within the first objective lens 107. The first deflection unit 130 and the second deflection unit 115 are cross-beam deflection units. In other words, both the first deflection unit 130 and the second deflection unit 115 are implemented such that they deflect the primary electron beam in two directions that are not parallel to each other and are perpendicular to the optical axis OA of the SEM 100. For example, the first deflection unit 130 and / or the second deflection unit 115 are implemented as magnetic deflection units(s). Specifically, the first deflection unit 130 and / or the second deflection unit 115 each respectively have, for example, four air coils (not shown) arranged around the optical axis OA of the SEM 100. However, the present invention is not limited to the aforementioned number of air coils. Instead, any number of air coils suitable for the present invention can be used. Alternatively or as an alternative, the first deflection unit 130 and / or the second deflection unit 115 are specified as multiple electrostatic deflection units. The first deflection unit 130 and the second deflection unit 115 are then arranged within the beam guide tube 104. Specifically, the first deflection unit 130 and / or the second deflection unit 115 each respectively include, for example, four electrodes arranged around the optical axis OA of the SEM 100 and capable of applying different electrostatic potentials to these electrodes. However, the present invention is not limited to the aforementioned number of electrodes. Instead, any number of electrodes suitable for the present invention can be used. Through the first deflection unit 130 and the second deflection unit 115, the primary electron beam is deflected and can be scanned on the object 125. During this process, electrons of the primary electron beam interact with the object 125. The interaction produces interacting particles, which are detected. Specifically, the interacting particles are electrons emitted from the surface of object 125 (so-called secondary electrons) or backscattered electrons from a primary electron beam (so-called backscattered electrons).

[0114] In one embodiment of SEM 100, the second deflection unit 115 is implemented as a scanning device and is designed to enable a primary electron beam to be directed in a targeted manner onto and over a region on the surface of object 125 (scanning process). Specifically, during the exemplary scanning process, the primary electron beam is directed to any desired number of sites on a region on the surface of object 125.

[0115] The SEM 100 has guiding devices for guiding, shaping, and / or focusing a primary electron beam onto an object 125. The guiding devices are arranged in the form of a beam guide tube 104 within and / or on the beam post of the SEM 100. For example, electrostatic and / or magnetic deflection units, as further mentioned above and below, can be used as guiding devices. Specifically, the guiding devices include electrostatic and / or magnetic units for beam shaping or beam guiding, an astigmatism reducer (not shown), a first condenser lens 105, a second condenser lens 106, a first objective lens 107, a first deflection unit 130, a second deflection unit 115, a first aperture unit 108, and / or a second aperture unit 109 through which the primary electron beam is defined. In particular, the beam guide tube 104 of the SEM 100 can also be implemented as a guiding device.

[0116] A detector arrangement with a first detector 116 and a second detector 117 is arranged in the beam guide tube 104 for detecting secondary electrons and / or backscattered electrons. In this case, in the beam guide tube 104, the first detector 116 is arranged along the optical axis OA on the source side, while the second detector 117 is arranged along the optical axis OA on the object side. The first detector 116 and the second detector 117 are offset from each other along the direction of the optical axis OA of the SEM 100. Both the first detector 116 and the second detector 117 have corresponding through-holes through which the primary electron beam can pass. The first detector 116 and the second detector 117 are approximately at the potential of the anode 103 and the beam guide tube 104. The optical axis OA of the SEM 100 extends through the corresponding through-holes.

[0117] The second detector 117 is primarily used to detect secondary electrons. Upon exiting the object 125, the secondary electrons initially have low kinetic energy and move randomly. They are accelerated towards the first objective lens 107 by a strong extraction field emanating from the tubular electrode 113. The secondary electrons enter the first objective lens 107 in a roughly parallel manner. The beam diameter of the secondary electron beam remains relatively small even within the first objective lens 107. The first objective lens 107 then exerts a strong influence on the secondary electrons and generates a relatively short focal point at a sufficiently steep angle relative to the optical axis OA, causing the secondary electrons to diverge significantly downstream of the focal point and incident on the effective region of the second detector 117. In contrast, the second detector 117 detects only a small fraction of the backscattered electrons at the object 125 (i.e., backscattered electrons with relatively high kinetic energy compared to the secondary electrons exiting the object 125). The high kinetic energy of the backscattered electrons upon exiting the object 125 and the angle relative to the optical axis OA result in the beam waist (i.e., the region of smallest diameter beam) of the backscattered electrons being located near the second detector 117. Most of the backscattered electrons pass through the opening in the second detector 117. Therefore, the first detector 116 is essentially used to detect the backscattered electrons.

[0118] In another embodiment of SEM 100, the first detector 116 may additionally be implemented with a reverse field grating 116A. The reverse field grating 116A is arranged on the side of the first detector 116 facing the object 125. The reverse field grating 116A has a negative potential relative to the potential of the beam guide tube 104, such that only backscattered electrons with high kinetic energy pass through the reverse field grating 116A to reach the first detector 116. Alternatively, the second detector 117 may have an additional reverse field grating, which is implemented similarly to the aforementioned reverse field grating 116A of the first detector 116 and has a similar function.

[0119] Additionally, in sample chamber 120, SEM 100 has chamber detector 500, such as an Everhart-Thornley detector or ion detector, which has a detection surface coated with metal and blocking light.

[0120] The detection signals generated by the first detector 116, the second detector 117 and the chamber detector 500 are used to generate one or more images of the surface of the object 125.

[0121] The following facts are explicitly mentioned: the apertures of the first aperture unit 108 and the second aperture unit 109, as well as the passage openings of the first detector 116 and the second detector 117, are shown in an exaggerated manner. The passage openings of the first detector 116 and the second detector 117 have a range of 0.5 mm to 5 mm perpendicular to the optical axis OA. For example, the passage opening is circular and has a diameter in the range of 1 mm to 3 mm perpendicular to the optical axis OA.

[0122] In the embodiment shown here, the second aperture unit 109 is designed as a pinhole aperture and is provided with a second aperture 118 for the passage of a primary electron beam, the second aperture ranging from 5 µm to 500 µm, for example, 35 µm. Alternatively, in another embodiment, the second aperture unit 109 is provided with multiple apertures that can be mechanically displaced relative to the primary electron beam or that can be directed to these apertures by using electrical and / or magnetic deflection units. The second aperture unit 109 is implemented as a pressure stage aperture. This separates a first region from a second region, in which the electron source 101 is arranged and an ultra-high vacuum (10) exists. -7 hPa to 10 -12 hPa), this second region has a high vacuum (10 hPa), -3 hPa to 10 -7 The second region is the intermediate pressure region of the bundle guide tube 104, which leads to the sample chamber 120.

[0123] Sample chamber 120 is under vacuum. A pump (not shown) is installed on sample chamber 120 to generate this vacuum. Figure 1 In the illustrated embodiment, the sample chamber 120 operates within a first pressure range or a second pressure range. The first pressure range includes only pressures less than or equal to 10. -3 The pressure is hPa, and the second pressure range only includes pressures greater than 10. -3 The pressure is hPa. Sample chamber 120 is vacuum-sealed to ensure these pressure ranges.

[0124] An object holder 114 is arranged on an object stage 122. The object stage 122 is configured to move in three directions perpendicular to each other, specifically in the x-direction (first stage axis), y-direction (second stage axis), and z-direction (third stage axis). Furthermore, the object stage 122 is capable of rotating about two mutually perpendicular axes of rotation (the stage's rotation axes). The invention is not limited to the object stage 122 described above. Instead, the object stage 122 may have additional translational and rotational axes along or about which it can move. According to... Figure 1 In an embodiment of the present invention, the above-mentioned at least one moving device is implemented as an object platform 122.

[0125] SEM 100 also features a third detector 121 disposed within sample chamber 120. More precisely, when viewed from electron source 101 along optical axis OA, the third detector 121 is positioned downstream of object stage 122. Object stage 122, and therefore object holder 114, is rotatable, allowing a primary electron beam to radiate through object 125 disposed on object holder 114. As the primary electron beam passes through object 125 to be examined, the electrons of the primary electron beam interact with the material of object 125. The third detector 121 detects the electrons that have passed through object 125 to be examined.

[0126] A radiation detector 119 is arranged on the sample chamber 120. This radiation detector is used to detect the interactive radiation generated when a primary electron beam is incident on the object 125, such as X-ray radiation and / or cathodoluminescence. Radiation detector 119, a first detector 116, a second detector 117, and chamber detector 500 are connected to a control unit 123, which has a display unit 124. A third detector 121 is also connected to the control unit 123. It is not shown for clarity. The control unit 123 processes the detection signals generated by the first detector 116, the second detector 117, the radiation detector 119, the third detector 121, and / or the chamber detector 500, and displays these detection signals as images on the display unit 124.

[0127] Control unit 123 is connected to a guide device in the form of a first deflection unit 130 and a second deflection unit 115. Additionally, control unit 123 is connected to another unit of SEM 100. This is not shown in more detail for clarity.

[0128] In SEM 100, distance A can be adjusted using control unit 123 of SEM 100. Distance A is given by: (a) the object distance between the outer boundary of the first objective lens 107 of SEM 100 and the object 125; or (b) the focal plane distance between the outer boundary of the first objective lens 107 of SEM 100 and the focal plane of the first objective lens 107. The aforementioned distance A, depending on case (a) or case (b), is also referred to as the working distance. For example, distance A in case (a) is adjusted by moving the object stage 122 and / or moving the first objective lens 107 using objective lens moving device 132. For example, distance A in case (b) is adjusted by changing the excitation of the first objective lens 107 along the optical axis OA of SEM 100.

[0129] Figure 1A Another schematic diagram of SEM 100 is shown. This other schematic diagram of SEM 100 is based on... Figure 1 Yes. (Reference) Figure 1 And first refer to the explanations provided above, which also apply to this situation.

[0130] and Figure 1 Different, according to Figure 1A The SEM 100 is equipped with a detector 140 for recording structural data and a sensor 141 for recording structural data.

[0131] For example, the detector 140 and / or the sensor 141 for recording structural data are designed to capture at least one first surface arrangement of the first device and / or at least one second surface arrangement of the second device. For example, the detector 140 for recording structural data is implemented as an optical camera. For example, the sensor 141 for recording structural data is implemented as a light sensor, a LiDAR sensor, and / or an ultrasonic sensor.

[0132] In one embodiment of SEM 100, additionally or as an alternative, the first device and / or at least one second device are specified to be implemented as at least one of the following units: object 125, object stage 122, object holder 114, micromanipulator, sample chamber 120, lock, light source, beam column (e.g., in the form of beam guide tube 104), capture device (in the form of at least one of the detectors 116, 117, 119, 121, 140, 500 described above), capture device (in the form of sensor 141), gas injection system, charge compensation The system includes a compensation device, camera, locking lever, gripper, scanning system (in the form of a first condenser lens 105 and / or a second condenser lens 106 and / or a first objective lens 107 and / or a second deflection unit 115 and / or a first deflection unit 130), electrodes (in the form of a single electrode 112 and / or a tubular electrode 113), cables, hoses, a scanning force microscope, a microtome, a plasma cleaner, a Faraday cup, an aperture (in the form of a first aperture unit 108 and / or a second aperture unit 109), an objective cover, at least a portion of a beam post 104, and a SEM 100. In this case, the capture device may be, for example, a detector 140 for recording structural data and / or a sensor 141 for recording structural data. Alternatively or as an alternative, the capture device may be any of the aforementioned detectors 116, 117, 119, 121, 500 arranged in and / or on the SEM 100.

[0133] In other words, any element within SEM 100 and / or SEM 100 itself, as long as it is suitable for the purposes of this invention, can be used as a first device and / or at least one second device. If an element within the scope of this invention can be movably arranged within SEM 100, then that element is suitable as a first device. For example, if an element within the scope of this invention is designed such that it moves relative to another element using object stage 122, then that element is suitable as a first device. In this case, the movement can be automated, for example, performed using control unit 123. Alternatively, or as an alternative, the movement can be manual, for example, if performed by manual actuation of the SEM 100 by a user. If an element within the scope of this invention can be arranged within SEM 100 and / or is SEM 100 itself, then that element is suitable as at least one second device. For example, at least one second device can also be arranged only partially within SEM 100, for example, if at least one second device is implemented as a lock. In particular, if the first device and at least one second device may collide and / or be at a minimum distance below a predefined minimum distance due to the movement of the first device, then the element within the meaning of the present invention is suitable as at least one second device.

[0134] Figure 2A particle beam apparatus in the form of a combined device 200 is shown. The combined device 200 has two particle beam columns. First, as already shown... Figure 1 As shown, the combined apparatus 200 includes a SEM 100 but lacks a sample chamber 120. Instead, the SEM 100 is arranged in a sample chamber 201. Sample chamber 201 is under vacuum. To generate this vacuum, a pump (not shown) is arranged on sample chamber 201. Figure 2 In the illustrated embodiment, sample chamber 201 operates within a first pressure range or a second pressure range. The first pressure range includes only pressures less than or equal to 10. -3 The pressure is hPa, and the second pressure range only includes pressures greater than 10. -3 The pressure is hPa. Sample chamber 201 is vacuum-sealed to ensure these pressure ranges.

[0135] The third detector 121 is arranged in the sample chamber 201.

[0136] The SEM 100 is used to generate the first particle beam, specifically the primary electron beam as further described above, and has the optical axis described above, which is located in... Figure 2 Reference numeral 709 is provided in the accompanying drawing and is hereinafter referred to as the first beam axis. Secondly, the combining device 200 is provided with an ion beam device 300, which is also arranged on the sample chamber 201. The ion beam device 300 also has an optical axis, which is located in… Figure 2 The figure is provided with reference numeral 710 and is referred to hereinafter as the second beam axis.

[0137] For example, the SEM 100 is arranged vertically relative to the sample chamber 201. In contrast, the ion beam device 300 is arranged at an angle relative to the SEM 100, for example, approximately 0° to 90°. Figure 2 The diagram shows an arrangement of approximately 50°. The ion beam apparatus 300 has a second beam generator in the form of an ion beam generator 301. The ion beam generator 301 generates ions that form a second particle beam in the form of an ion beam. These ions are accelerated by an extraction electrode 302 at a predefined potential. The second particle beam then passes through an ion optics unit of the ion beam apparatus 300, which has a focusing lens 303 and a second objective lens 304. The second objective lens 304 ultimately generates an ion probe, which is focused onto an object 125 disposed on an object holder 114. The object holder 114 is disposed on an object stage 122.

[0138] Above the second objective lens 304 (i.e., in the direction of the ion beam generator 301), an adjustable or selectable aperture 306, a first electrode arrangement 307, and a second electrode arrangement 308 are arranged, wherein the first electrode arrangement 307 and the second electrode arrangement 308 are implemented as scanning electrodes. A second particle beam is scanned on the surface of the object 125 by the first electrode arrangement 307 and the second electrode arrangement 308, wherein the first electrode arrangement 307 operates along a first direction, while the second electrode arrangement 308 operates along a second direction opposite to the first direction. Thus, scanning is performed, for example, in the first direction. Scanning in the second direction perpendicular to the first direction is achieved by additional electrodes (not shown) rotated 90° on the first electrode arrangement 307 and the second electrode arrangement 308.

[0139] As explained above, the object holder 114 is arranged on or forms the object stage 122. Figure 2 In the illustrated embodiment, the object stage 122 is also configured to move in three directions perpendicular to each other, specifically in the x-direction (first stage axis), y-direction (second stage axis), and z-direction (third stage axis). Furthermore, the object stage 122 is capable of rotating about two mutually perpendicular axes of rotation (the stage's rotation axes).

[0140] To better showcase the individual units of the combined device 200, Figure 2 The distances between the individual units of the combined device 200 shown in the image are presented in an exaggerated manner.

[0141] A radiation detector 119 for detecting interacting radiation (e.g., X-ray radiation and / or cathodoluminescence) is arranged in sample chamber 201. Radiation detector 119 is connected to control unit 123, which has a display unit 124 and a processor unit 127. Alternatively, another detector, specifically in the form of a chamber detector 500 for detecting secondary electrons, may be arranged in sample chamber 201. This additional detector is also connected to control unit 123.

[0142] Control unit 123 processes data from first detector 116 ( Figure 2 (Not shown in the text), second detector 117 ( Figure 2 The detection signals generated by the third detector 121 (not shown), radiation detector 119 and / or room detector 500 are displayed on the display unit 124 in the form of numerical values, charts, images and / or analyses.

[0143] The control unit 123 also includes a data storage unit 126 for storing and reading data. The control unit 123 also includes a processor unit 127. The processor unit 127 is designed to perform computational operations and / or execute programs. Program code of a computer program product is loaded into the processor unit 127, and when executed, the program code controls the combined device 200 to perform the method according to the invention. The method according to the invention will be discussed in further detail below.

[0144] Figure 3 This is a schematic diagram of another embodiment of a particle beam apparatus according to the present invention. This embodiment of the particle beam apparatus is provided with reference numeral 400 and includes a mirror corrector for correcting, for example, chromatic aberration and / or spherical aberration. The particle beam apparatus 400 includes a particle beam column 401, which is implemented as an electron beam column and substantially corresponds to the electron beam column of a corrected SEM. However, the particle beam apparatus 400 is not limited to an SEM with a mirror corrector. Rather, the particle beam apparatus may include any type of corrector unit suitable as a corrector unit within the scope of this invention.

[0145] The particle beam column 401 includes a particle beam generator in the form of an electron source 402 (cathode), an extraction electrode 403, and an anode 404. For example, the electron source 402 is implemented as a thermal field emitter. Electrons emitted from the electron source 402 are accelerated to the anode 404 due to the potential difference between the electron source 402 and the anode 404. Accordingly, a particle beam in the form of an electron beam is formed along the first optical axis OA1.

[0146] After the particle beam is emitted from the electron source 402, the particle beam is guided along a beam path corresponding to the first optical axis OA1. The first electrostatic lens 405, the second electrostatic lens 406, and the third electrostatic lens 407 are used to guide the particle beam.

[0147] Furthermore, a deflection device is used to adjust the particle beam along the beam path. The deflection device in this embodiment includes a source adjustment unit having two magnetic deflection units 408 arranged along the first optical axis OA1. Additionally, the particle beam device 400 includes an electrostatic beam deflection unit. A first electrostatic beam deflection unit 409 (also implemented as a quadrupole in another embodiment) is arranged between the second electrostatic lens 406 and the third electrostatic lens 407. The first electrostatic beam deflection unit 409 is also arranged downstream of the magnetic deflection units 408. A first multipole unit 409A in the form of a first magnetic deflection unit is arranged on one side of the first electrostatic beam deflection unit 409. Furthermore, a second multipole unit 409B in the form of a second magnetic deflection unit is arranged on the other side of the first electrostatic beam deflection unit 409. The first electrostatic beam deflection unit 409, the first multipole unit 409A, and the second multipole unit 409B are adjusted for the purpose of adjusting the particle beam relative to the axis of the third electrostatic lens 407 and the entrance window of the beam deflection device 410. The first electrostatic beam deflection unit 409, the first multipole unit 409A, and the second multipole unit 409B can interact like a Wien filter. An additional magnetic deflection unit 432 is arranged at the entrance of the beam deflection device 410.

[0148] A beam deflection device 410 is used as a particle beam deflector to deflect the particle beam in a specific manner. The beam deflection device 410 includes multiple magnetic sectors, specifically a first magnetic sector 411A, a second magnetic sector 411B, a third magnetic sector 411C, a fourth magnetic sector 411D, a fifth magnetic sector 411E, a sixth magnetic sector 411F, and a seventh magnetic sector 411G. The particle beam enters the beam deflection device 410 along a first optical axis OA1 and is deflected by the beam deflection device 410 towards a second optical axis OA2. The beam is deflected by angles from 30° to 120° through the first magnetic sector 411A, the second magnetic sector 411B, and the third magnetic sector 411C. The second optical axis OA2 is oriented at the same angle relative to the first optical axis OA1. The beam deflection device 410 also precisely deflects the particle beam guided along the second optical axis OA2 towards a third optical axis OA3. The beam deflection is provided by the third magnetic sector 411C, the fourth magnetic sector 411D, and the fifth magnetic sector 411E. Figure 3In the embodiments described herein, deflection relative to the second optical axis OA2 and relative to the third optical axis OA3 is provided by deflecting the particle beam by an angle of 90°. Therefore, the third optical axis OA3 extends coaxially with the first optical axis OA1. However, it should be noted that the particle beam device 400 according to the invention described herein is not limited to a deflection angle of 90°. Instead, any suitable deflection angle, such as 70° or 110°, can be selected by the beam deflection device 410, resulting in the first optical axis OA1 not extending coaxially with respect to the third optical axis OA3. Further details regarding the beam deflection device 410 are provided in WO 2002 / 067286 A2.

[0149] After the particle beam has been deflected by the first magnetic sector 411A, the second magnetic sector 411B, and the third magnetic sector 411C, the particle beam is guided along the second optical axis OA2. The particle beam is guided to the electrostatic mirror 414 and travels along the path to the electrostatic mirror 414 along the fourth electrostatic lens 415, the third multipole unit 416A in the form of a magnetic deflection unit, the second electrostatic beam deflection unit 416, the third electrostatic beam deflection unit 417, and the fourth multipole unit 416B in the form of a magnetic deflection unit. The electrostatic mirror 414 includes a first mirror electrode 413A, a second mirror electrode 413B, and a third mirror electrode 413C. Electrons of the particle beam reflected back at the electrostatic mirror 414 travel again along the second optical axis OA2 and re-enter the beam deflection device 410. These electrons are then deflected by the third magnetic sector 411C, the fourth magnetic sector 411D, and the fifth magnetic sector 411E to the third optical axis OA3.

[0150] Electrons from the particle beam exit the beam deflection device 410 and are guided along the third optical axis OA3 to the object 425, which is to be inspected and arranged in the object holder 114. Along the path to the object 425, the particle beam is guided to the fifth electrostatic lens 418, the beam guide tube 420, the fifth multipole unit 418A, the sixth multipole unit 418B, and the objective lens 421. The fifth electrostatic lens 418 is an electrostatic immersion lens. Through the fifth electrostatic lens 418, the particle beam is decelerated or accelerated to the potential of the beam guide tube 420.

[0151] Through objective lens 421, the particle beam is focused onto the focal plane on which object 425 is positioned. Object holder 114 is positioned on or forms the movable object stage 424. The movable object stage 424 is positioned within the sample chamber 426 of the particle beam apparatus 400. The object stage 424 is configured to move in three mutually perpendicular directions: specifically in the x-direction (first stage axis), y-direction (second stage axis), and z-direction (third stage axis). Furthermore, the object stage 424 is capable of rotating about two mutually perpendicular rotation axes (the stage's rotation axes).

[0152] Sample chamber 426 is under vacuum. A pump (not shown) is installed on sample chamber 426 to generate this vacuum. Figure 3 In the illustrated embodiment, sample chamber 426 operates within a first pressure range or a second pressure range. The first pressure range includes only pressures less than or equal to 10. -3 The pressure is hPa, and the second pressure range only includes pressures greater than 10. -3 The pressure is hPa. Sample chamber 426 is vacuum-sealed to ensure these pressure ranges.

[0153] Objective lens 421 can be implemented as a combination of magnetic lens 422 and sixth electrostatic lens 423. The end of beam guide tube 420 can also be an electrode of the electrostatic lens. After exiting beam guide tube 420, the particles of the particle beam are decelerated to the potential of object 425. Objective lens 421 is not limited to the combination of magnetic lens 422 and sixth electrostatic lens 423. Instead, objective lens 421 can take any suitable form. For example, objective lens 421 can also be implemented as a purely magnetic lens or a purely electrostatic lens.

[0154] The particle beam focused onto object 425 interacts with object 425, generating interacting particles. Specifically, secondary electrons are emitted from object 425, or backscattered electrons are emitted from object 425. These secondary or backscattered electrons are also accelerated and guided along the third optical axis OA3 into the beam guide tube 420. In particular, the trajectories of the secondary and backscattered electrons travel in the opposite direction to the particle beam's path.

[0155] The particle beam apparatus 400 includes a first analytical detector 419 arranged along the beam path between the beam deflection device 410 and the objective lens 421. Secondary electrons traveling in a direction oriented at a large angle relative to the third optical axis OA3 are detected by the first analytical detector 419. Backscattered electrons and secondary electrons at a small axial distance relative to the third optical axis OA3 at the site of the first analytical detector 419 enter the beam deflection device 410 and are deflected along the detection beam path 427 by the fifth magnetic sector 411E, the sixth magnetic sector 411F, and the seventh magnetic sector 411G to the second analytical detector 428. For example, the deflection angle is 90° or 110°.

[0156] The first analysis detector 419 generates a detection signal primarily composed of emitted secondary electrons. This detection signal is directed to the control unit 123 and used to obtain information about the characteristics of the interaction region between the focused particle beam and the object 425. Specifically, the focused particle beam is scanned across the object 425 using a scanning device 429. Using the detection signal generated by the first analysis detector 419, an image of the scanned area of ​​the object 425 can then be generated and displayed on a presentation unit. The presentation unit is, for example, a display unit 124 arranged on the control unit 123. The control unit 123 also includes a processor unit 127.

[0157] The second analysis detector 428 is also connected to the control unit 123. Detection signals from the second analysis detector 428 are directed to the control unit 123 and used to generate an image of the scanned area of ​​the object 425 and display the image on a presentation unit. The presentation unit is, for example, a display unit 124 arranged on the control unit 123.

[0158] A radiation detector 119 for detecting interacting radiation (e.g., X-ray radiation and / or cathodoluminescence) is arranged on or in the sample chamber 426. The radiation detector 119 is connected to a control unit 123, which has a display unit 124. The control unit 123 processes the detection signals from the radiation detector 119 and displays these detection signals in an analytical form on the display unit 124.

[0159] The control unit 123 also includes a data storage unit 126 for storing and retrieving data. In other words, the data storage unit 126 is adapted for storing and retrieving data. The control unit 123 also includes a processor unit 127. The processor unit 127 of the particle beam device 400 is designed to perform computational operations and / or execute programs. Program code of a computer program product is loaded into the processor unit 127, and when executed, the program code controls the particle beam device 400 to perform the method according to the invention. The method according to the invention will be discussed in further detail below.

[0160] In addition, the particle beam device 400 has a chamber detector 500 connected to the control unit 123.

[0161] In the case of particle beam device 400, the particle beam can be rotated (e.g., tilted) relative to object 425, for example, by using a fifth multipole unit 418A and a sixth multipole unit 418B. Alternatively or as an alternative, the particle beam can be rotated (e.g., tilted) relative to object 425, for example, by using a first multipole unit 409A and a second multipole unit 409B.

[0162] As further explained above, any component within the particle beam device and / or the particle beam device itself, as long as it is suitable for the purposes of this invention, can be implemented as the first device and / or at least one second device. For example, as a supplement or alternative to the exemplary embodiment of the radiation detector 119 described above, at least one second device can be implemented as at least one of the following units: SEM 100, beam guide tube 104, first focusing lens 105, second focusing lens 106, first objective lens 107, first aperture unit 108, second aperture unit 109, single electrode 112, tubular electrode 113, object holder 114, second deflection unit 115, first detector 116, second detector 117, radiation detector 119, sample chamber 120, third detector 121, object stage 122, object 125, first deflection unit 130, and a structure for recording data. The device includes a detector 140, a sensor 141 for recording structural data, a combination device 200, a sample chamber 201, an ion beam device 300, a focusing lens 303, a second objective lens 304, an adjustable or selectable aperture 306, a first electrode arrangement 307, a second electrode arrangement 308, a particle beam device 400 including a corrector unit, a first electrostatic lens 405, a second electrostatic lens 406, a third electrostatic lens 407, a magnetic deflection unit 408, a first electrostatic beam deflection unit 409, and a first multi-electrode unit. The components include: a first magnetic sector 409A, a second multi-pole unit 409B, a beam deflection device 410, a first magnetic sector 411A, a second magnetic sector 411B, a third magnetic sector 411C, a fourth magnetic sector 411D, a fifth magnetic sector 411E, a sixth magnetic sector 411F, a seventh magnetic sector 411G, a first reflector electrode 413A, a second reflector electrode 413B, a third reflector electrode 413C, an electrostatic reflector 414, a fourth electrostatic lens 415, a second electrostatic beam deflection unit 416, and a third... Multipole unit 416A, fourth multipole unit 416B, third electrostatic beam deflection unit 417, fifth electrostatic lens 418, fifth multipole unit 418A, sixth multipole unit 418B, first analytical detector 419, beam guide tube 420, objective lens 421, magnetic lens 422, sixth electrostatic lens 423, object stage 424, object 425, sample chamber 426, second analytical detector 428, scanning device 429, additional magnetic deflection unit 432, and chamber detector 500.

[0163] The object stages 122 and 424 of the particle beam devices 100, 200, and 400 explained above will now be discussed in more detail below. The object stages 122 and 424 are implemented as movable object carriers in the form of object stages, which... Figure 4 and Figure 5The following is illustrated schematically. It is noted that the invention is not limited to the object platforms 122, 424 described herein. Rather, the invention may include any movable object platform suitable for the present invention.

[0164] Object holders 114 are arranged on object stages 122 and 424. Object stages 122 and 424 have moving elements that ensure the movement of the object stages 122 and 424 allows for, for example, inspection of areas of interest on objects 125 and 425 using particle beams. Figure 4 and Figure 5 The moving element is illustrated in the diagram and described below.

[0165] The object stages 122 and 424 have a first moving element 600, for example, arranged on a housing 601 of a sample chamber 120, 201, or 426, in which the object stages 122 and 424 are subsequently arranged. The first moving element 600 enables movement of the object stages 122 and 424 along the z-axis (the axis of the third stage). Furthermore, a second moving element 602 is provided. The second moving element 602 enables rotation of the object stages 122 and 424 about a first axis of rotation 603 (also referred to as the tilt axis) of the stage. This second moving element 602 is used to tilt the objects 125 and 425 about the first axis of rotation 603 of the stage, wherein the objects 125 and 425 are arranged on an object holder 114.

[0166] A third moving element 604 is arranged on the second moving element 602. This third moving element is implemented as a guide for the slider and ensures that the object platforms 122 and 424 can move in the x-direction (the axis of the first platform). The aforementioned slider is another moving element, specifically a fourth moving element 605. The fourth moving element 605 is implemented to allow the object platforms 122 and 424 to move in the y-direction (the axis of the second platform). For this purpose, the fourth moving element 605 has a guide in which the other slider is guided, and the object holder 114 is arranged on this other slider.

[0167] The object holder 114 is further configured to have a fifth moving element 606, which enables the object holder 114 to rotate about a second rotation axis 607 of the stage. The second rotation axis 607 of the stage is oriented perpendicular to the first rotation axis 603 of the stage.

[0168] Due to the above arrangement, the object platforms 122, 424 of the embodiments discussed herein have the following kinematic chain: first moving element 600 (moving along the z-axis) - second moving element 602 (rotating about the first rotation axis 603 of the platform) - third moving element 604 (moving along the x-axis) - fourth moving element 605 (moving along the y-axis) - fifth moving element 606 (rotating about the second rotation axis 607 of the platform). Alternatively or as an alternative, other kinematic chains may be implemented.

[0169] In another embodiment (not shown), additional moving elements are provided on the object stage 122, 424, making movement along an additional translation axis and / or about an additional rotation axis possible.

[0170] As from Figure 5 As is evident, each of the aforementioned moving elements is connected to drive units M1 to M5, which are in the form of motors. In this respect, the first moving element 600 is connected to the first drive unit M1 and is driven by the driving force provided by the first drive unit M1. The second moving element 602 is connected to the second drive unit M2, which drives the second moving element 602. The third moving element 604 is connected to the third drive unit M3. The third drive unit M3 provides the driving force for driving the third moving element 604. The fourth moving element 605 is connected to the fourth drive unit M4, whereby the fourth drive unit M4 drives the fourth moving element 605. Furthermore, the fifth moving element 606 is connected to the fifth drive unit M5. The fifth drive unit M5 provides the driving force for driving the fifth moving element 606.

[0171] The aforementioned drive units M1 to M5 can be implemented as, for example, stepper motors, and are controlled by the drive control unit 608, with each drive unit supplied with power current by the drive control unit 608 (see [link]). Figure 5 It is explicitly stated that the present invention is not limited to the movement of the object platforms 122 and 424 by stepper motors. Rather, any drive unit suitable as a drive unit in the sense of the present invention (e.g., a brushless motor) can be used as a drive unit.

[0172] The following will be about according to Figure 1 SEM 100 explains in more detail embodiments of the methods for operating particle beam devices 100, 200, 400 to image, process and / or analyze objects 125, 425 according to the present invention. Figure 6 A schematic diagram of a sequence according to a second embodiment of the method of the present invention is shown, the method being based on... Figure 1The SEM 100 is executed. In the case of the other particle beam devices 200 and 400 mentioned above, the following statements regarding the execution of this embodiment of the method according to the invention, with necessary modifications, also apply. Hereinafter, for example, the first device is implemented as an object holder 114 with an object 125, and at least one second device is implemented as a radiation detector 119. The further statements above similarly apply here to the first devices 114, 125 (i.e., in the form of object holders 114 and object 125) and at least one second device 119 (i.e., in the form of a radiation detector 119).

[0173] The method according to the invention is used to operate a SEM 100 to image, process, and / or analyze an object 125. In this case, the object 125 can represent any element arranged in the sample chamber 120 of the SEM 100. In other words, any element arranged in the sample chamber 120 of the SEM 100 can be implemented as the object 125.

[0174] Among other things, in the method according to the invention, (A) first structural data and second structural data are provided; (B) a target arrangement of the first devices 114, 125 is determined; (C) at least one movement path of the first devices 114, 125 to reach the target arrangement of the first devices 114, 125 is provided; (D) at least one movement path of the first devices 114, 125 within SEM 100 is modeled; (E) a check is performed to determine whether the modeling of the movement path has the following result: during the movement process, at least one first surface arrangement of the first devices 114, 125 and at least one second surface arrangement of at least one second device 119 (i) have at least one common point, or (ii) are at the shortest distance but have no common point, wherein the shortest distance is less than a predefined minimum distance; (F) optionally, the check result is stored as collision data in data storage unit 126; and (G) Depending on the inspection results, a message may be displayed, and / or the movement process may be abandoned, and / or the speed of the movement process may be changed, and / or the movement process may be stopped, and / or the movement process may be switched to another movement process, and / or the first device 114, 125 may be moved along the provided movement path using the object platform 122.

[0175] In method step S1 of the method according to the invention, first structural data and second structural data are provided. The first structural data and second structural data will be discussed in more detail below.

[0176] The first structural data includes information regarding at least one first surface arrangement of the first devices 114, 125 within the SEM 100. In other words, for example, the first structural data may describe at least one first surface arrangement of the first devices 114, 125. The second structural data includes information regarding at least one second surface arrangement of at least one second device 119 within the SEM 100. In other words, for example, the second structural data may describe at least one second surface arrangement of at least one second device 119.

[0177] For example, a first surface arrangement is defined to have a first limited space that partially or completely surrounds the first devices 114, 125. In other words, the first limited space defines the first surface arrangement. Based on the first devices 114, 125, the first limited space has a range, for example, up to 100 mm, up to 50 mm, up to 20 mm, up to 10 mm, up to 1 mm, up to 500 μm, up to 300 μm, up to 100 μm, or up to 10 μm. However, the invention is not limited to such a range. Instead, the range of the first limited space can have any value suitable for the invention. In particular, the range of the first limited space is variable. For example, the range of the first limited space depends on the moving speed of the first devices 114, 125 and / or at least one second device 119. Alternatively, the range of the first limited space depends on the distance between the first devices 114, 125 and at least one second device 119. Specifically, the range of the first limited space is defined to increase as the distance between the first devices 114, 125 and at least one second device 119 increases, and the range of the first limited space is defined to decrease as the distance between the first devices 114, 125 and at least one second device 119 decreases. Alternatively, the range of the first limited space is defined to increase as the moving speed of the first devices 114, 125 and / or at least one second device 119 increases, and the range of the first limited space is defined to decrease as the moving speed of the first devices 114, 125 and / or at least one second device 119 decreases.

[0178] Furthermore, it is specified that, for example, the second surface arrangement has a second limited range space that partially or completely surrounds at least one second device 119. In other words, the second limited range space defines the second surface arrangement. Based on at least one second device 119, the second limited range space has a range, for example, up to 100 mm, up to 50 mm, up to 20 mm, up to 10 mm, up to 1 mm, up to 500 μm, up to 300 μm, up to 100 μm, or up to 10 μm. However, the invention is not limited to such a range. Instead, the range of the second limited range space can have any value suitable for the invention. In particular, the range of the second limited range space is variable. For example, the range of the second limited range space depends on the moving speed of the first devices 114, 125 and / or at least one second device 119. Alternatively, the range of the second limited range space depends on the distance between the first devices 114, 125 and at least one second device 119. Specifically, the range of the second limited space is defined to increase as the distance between the first devices 114, 125 and at least one second device 119 increases, and the range of the second limited space is defined to decrease as the distance between the first devices 114, 125 and at least one second device 119 decreases. Alternatively, the range of the second limited space is defined to increase as the moving speed of the first devices 114, 125 and / or at least one second device 119 increases, and the range of the second limited space is defined to decrease as the moving speed of the first devices 114, 125 and / or at least one second device 119 decreases.

[0179] For example, when performing the method steps according to the invention, particularly in the check to determine whether the first surface arrangement and the second surface arrangement have at least one common point during the movement of the first devices 114, 125, a first limited range space of the first surface arrangement and / or a second limited range space of the second surface arrangement are used. Specifically, it is specified that the check is performed to determine whether the first limited range space and the second limited range space have a common point.

[0180] Furthermore, the first structural data and / or the second structural data include, for example, information regarding at least one transformation of the first devices 114, 125 and / or at least one second device 119. Within the meaning of this invention, a transformation of the first devices 114, 125 and / or at least one second device 119 can be understood as, for example, movement of the first devices 114, 125 and / or at least one second device 119. During movement, the first devices 114, 125 and / or at least one second device 119 undergo transformation because the characteristics of the first devices 114, 125 and / or at least one second device 119 (i.e., their spatial positioning) change. Specifically, this transformation can be understood as movement of the first devices 114, 125 and / or at least one second device 119 along a movement path. In this context, within the meaning of this invention, a movement path can be understood as a series of points in space, wherein these points are implemented such that movement from the first point in the series to the last point in the series can be performed. In the movement from the first point in the series to the last point in the series, each point in the series can be passed sequentially. For example, the movement path can also be understood as only a portion of the movement path. In this case, the movement will only pass through some points in the series of points. These points in the series are also referred to hereinafter as intermediate points. Alternatively, within the meaning of this invention, the transformation of the first device 114, 125 and / or at least one second device 119 can be understood as a variation of the first device 114, 125 and / or at least one second device 119. Alternatively, within the meaning of this invention, the transformation of the first device 114, 125 and / or at least one second device 119 may not be understood as a variation of the first device 114, 125 and / or at least one second device 119. In this case, within the meaning of this invention, the transformation of the first device 114, 125 and / or at least one second device 119 can be understood as a movement of the first device 114, 125 and / or at least one second device 119.

[0181] Within the meaning of this invention, deformation of the first device 114, 125 and / or at least one second device 119 can be understood as, for example, a change in the surface arrangement of the first device 114, 125 and / or at least one second device 119. In this case, the deformed device can, for example, maintain its spatial positioning during deformation. For example, during deformation of the first device 114, 125 within the meaning of this invention, the surface arrangement of the first device 114, 125 can change, while the center of mass of the first device 114, 125 does not change spatially. Alternatively, within the meaning of this invention, deformation of the first device 114, 125 and / or at least one second device 119 can be understood as expansion and / or contraction. Within the meaning of this invention, expansion is understood as an increase in spatial extent. Within the meaning of this invention, contraction is understood as a decrease in spatial extent. For example, expansion can be thermal expansion. In other words, the expansion of the first device 114, 125 and / or at least one second device 119 can be caused by temperature changes in the first device 114, 125 and / or at least one second device 119. For example, contraction can be thermal contraction. In other words, the contraction of the first device 114, 125 and / or at least one second device 119 can be caused by temperature changes in the first device 114, 125 and / or at least one second device 119.

[0182] Alternatively, within the meaning of this invention, deformation of the first devices 114, 125 and / or at least one second device 119 can be understood as stretching. Within the meaning of this invention, stretching is understood as a change in the length of a body subjected to at least one force. In this case, stretching can achieve shortening or elongation of the body. Alternatively, within the meaning of this invention, deformation of the first devices 114, 125 and / or at least one second device 119 can be understood as torsion. Within the meaning of this invention, torsion of the body is understood as twisting of the body. For example, two opposing torques acting on the body cause twisting of the body.

[0183] Furthermore, or alternatively, within the scope of this invention, variations of the first devices 114, 125 and / or at least one second device 119 may include changes to the first devices 114, 125 and / or at least one second device 119 themselves. For example, a change to the first devices 114, 125 may include movement of a first portion of the first devices 114, 125 relative to a second portion of the first devices 114, 125. If the first device is, for example, implemented as a movable manipulator, a change to the movable manipulator may include movement of the line of the movable manipulator relative to the body of the movable manipulator.

[0184] In method step S1 of the method according to the invention, first structural data and second structural data are provided. The provision of the first structural data and the second structural data can be performed in at least one of at least three possible variations.

[0185] In a first variant providing first structural data and / or second structural data, the first structural data and / or second structural data are retrieved from the data storage unit 126 of the SEM 100. Regarding the data storage unit 126, the statements above also apply similarly herein. In other words, the data storage unit 126 stores data corresponding to the first structural data and / or second structural data. This data corresponding to the first structural data and / or second structural data can be retrieved from the data storage unit 126. Alternatively or as an alternative, the first structural data and / or second structural data can be calculated based on the data stored in the data storage unit 126.

[0186] In a second variation of providing first structural data and / or second structural data, the user of SEM 100 inputs the first structural data and / or second structural data into the control unit 123 of SEM 100 using the input unit of SEM 100. In this case, the input unit is implemented such that it is adapted to input data. For example, the input unit is implemented as a keyboard, joystick, at least one of the sensors mentioned above, and / or at least one of the aforementioned detectors. Alternatively or as an alternative, the input unit can be implemented as a camera, which is programmed using a computer program to capture gestures made by the user and interpret the gestures as data. Furthermore, alternatively or as an alternative, the input unit can be implemented as a unit that allows data to be read from a file. In other words, the first structural data and / or second structural data are provided using the input unit.

[0187] In a third variation providing first and / or second structural data, at least one detector and / or at least one sensor of the SEM 100 are used to record the first and / or second structural data. For example, detector 140 for recording structural data is used as a detector, and / or sensor 141 for recording structural data is used as a sensor. In this case, detector 140 for recording structural data is implemented such that it is designed to detect interacting particles and / or interacting radiation. When a primary electron beam is incident on the first device 114, 125 and / or at least one second device 119, the interaction between the primary electron beam and the first device 114, 125 and / or at least one second device 119 produces interacting particles and / or interacting radiation. As a result of the interaction, specifically, the first device 114, 125 and / or at least one second device 119 emits electrons (so-called secondary electrons) and the electrons of the primary electron beam are backscattered (so-called backscattered electrons). Secondary electrons and backscattered electrons are detected and used for image generation. This yields an image representation of the first device 114, 125 to be inspected and / or at least one second device 119 to be inspected. Furthermore, interaction radiation (e.g., X-ray radiation or cathodoluminescence) is generated during the interaction, and this interaction radiation is detected, for example, by a detector 140 for recording structural data and subsequently evaluated for analysis of the first device 114, 125 and / or at least one second device 119.

[0188] The sensor 141 for recording structural data is implemented such that it is designed to capture the physical characteristics of the first devices 114, 125 and / or at least one second device 119. For example, the sensor 141 for recording structural data can capture electromagnetic radiation scattered at the first devices 114, 125 and / or at least one second device 119. In particular, in this case, the electromagnetic radiation may include at least one wavelength in the range of 400 nm to 2000 nm.

[0189] It should be noted that various variations of the above-described variations can be used to provide the first structural data and the second structural data. In other words, the variation used to provide the first structural data may not correspond to the variation used to provide the second structural data. For example, the first structural data is provided by recording the first structural data using at least one detector 140 for recording structural data, and the second structural data is provided by retrieving the second structural data from the data storage unit 126 of the SEM 100.

[0190] The first and / or second structural data can be provided, for example, in the form of CAD data. In other words, a CAD model can exist from which information related to the first and / or second structural data can be obtained.

[0191] In method step S2 of the method according to the invention, the target arrangement of the first devices 114, 125 is determined using the control unit 123 of the SEM 100. In this case, the target arrangement, within the scope of the invention, is, for example, the relative arrangement of the first devices 114, 125 with respect to at least one second device 119. In other words, the target arrangement specifies, for example, the desired arrangement of the first devices 114, 125 relative to at least one second device 119. For example, the target arrangement of the first devices 114, 125 is determined by inputting target data into the control unit 123 of the SEM 100 and / or by loading target data from the data storage unit 125 into the control unit 123 of the SEM 100. Specifically, the target data is input using an input unit or an input device of the control unit 123. The target data, within the scope of the invention, is suitable for defining the target arrangement. For example, the target data includes the spatial coordinates of the first devices 114, 125 relative to at least one second device 119, wherein the spatial coordinates of the first devices 114, 125 relative to at least one second device 119 describe at least one position of the first devices 114, 125 relative to at least one second device 119 in the target arrangement. Alternatively or as an alternative, the target arrangement of the first devices 114, 125 can be determined by capturing the target data using at least one sensor and / or at least one detector. Furthermore, alternatively or as an alternative, the target arrangement of the first devices 114, 125 can be determined by calculating the target data. For example, the target data can be calculated using a computer program that applies image recognition methods. The statements regarding the control unit 123 and the input unit, referring to the foregoing statements, also apply similarly herein.

[0192] In method step S3 of the method according to the invention, processor unit 127 provides at least one movement path for the first devices 114, 125 to reach the target arrangement of the first devices 114, 125. Regarding the movement path, reference is made to the statements above, which also apply hereby.

[0193] Providing a movement path includes determining the movement path, for example, by defining intermediate points, where intermediate points are points in space that can be used to describe the movement path (see also the statement about movement paths above in this regard). For example, intermediate points can be described using spatial coordinates. For instance, the movement path can be determined by the shortest distance between intermediate points.

[0194] For example, when a movement path is provided, processor unit 127 generates data describing the movement path. For instance, the data describes multiple movement paths. Specifically, a single movement path can be selected from the multiple movement paths. The single movement path can be selected from the multiple movement paths, for example, based on predefined criteria. Predefined criteria for selecting a single movement path may include, for example, the length of the single movement path and / or the duration of the movement process associated with the single movement path and / or the distance between the single movement path and surrounding devices and / or the location of the single movement path. Within the context of this invention, a movement process is understood herein to refer to the execution of movement. In other words, for example, the movement of the first devices 114, 125 along a movement path is referred to as a movement process. For example, the movement process is controlled by control unit 123 of SEM 100 using object stage 122. In other words, the movement process is executed, for example, in an automated manner.

[0195] In method step S4 of the method according to the invention, the movement path of the first devices 114, 125 within the SEM 100 is modeled using processor unit 127. In other words, the movement path is modeled by calculation. The provision of the movement path and the modeling of the movement path may be included in a single method step or may be the same. First structural data, second structural data, and the target arrangement of the first devices 114, 125 are used for modeling. Regarding the movement path, reference is made to the statements above, which similarly apply herein. In particular, a portion of the movement path may also be understood as a movement path within the meaning of the invention. Modeling the movement path in the meaning of the invention includes determining the movement path. In other words, modeling can be understood as simulating the movement path.

[0196] The provision and / or modeling of at least one movement path of the first devices 114, 125 within the SEM 100 using processor unit 127 can be repeated. For example, when a user of the SEM 100 makes input (wherein the input is intended to be repeatedly provided and / or modeled), the provision and / or modeling of at least one movement path of the first devices 114, 125 within the SEM 100 using processor unit 127 can be repeated. For example, inputting a new target arrangement using the input unit can be intended to be repeatedly provided and / or modeled.

[0197] In method step S5 of the method according to the invention, on one hand, a check is performed to determine whether the modeling of the movement paths of the first devices 114, 125 within the SEM 100 has the following result: when performing a movement process along the modeled movement path, at least one first surface arrangement of the first devices 114, 125 and at least one second surface arrangement of the at least second device 119 have at least one common point at at least one point on the modeled movement path. On the other hand, in method step S5 of the method according to the invention, a check is performed to determine whether the modeling of the movement paths of the first devices 114, 125 within the SEM 100 has the following result: when performing a movement process along the modeled movement path, at least one first surface arrangement of the first devices 114, 125 and at least one second surface arrangement of the at least second device 119 are at the shortest distance between each other, wherein the shortest distance is less than a predefined minimum distance, and wherein, when performing a movement process along the modeled movement path, at least one first surface arrangement of the first devices 114, 125 and at least one second surface arrangement of the at least second device 119 have no common point. Within the meaning of this invention, the distance between the first and second bodies is understood to be the shortest possible connection among all possible connections between any point on the surface of the first body and any point on the surface of the second body. The smallest possible distance among all distances between at least one first surface arrangement of the first devices 114, 125 and at least one second surface arrangement of the at least second device 119, realized during the movement process along the modeled movement path, is referred to as the shortest distance. The predefined minimum distance can be provided, for example, by retrieval from the data storage unit 126 and / or by input from the user-accessible input unit of the SEM 100. For example, the predefined minimum distance is not less than 10 µm.

[0198] In other words, in method step S5 of the method according to the invention, a check is performed to determine whether there is a match between at least one first point of at least one first surface arrangement of at least one of the first devices 114, 125 and at least one second point of at least one second surface arrangement of at least one second device 119 when the movement process is performed along the modeled movement path. Furthermore, a check is performed to determine whether, during the movement process along the modeled movement path, there exists a state where the shortest distance between at least one first surface arrangement of the first devices 114, 125 and at least one second surface arrangement of at least one second device 119 is lower than a predefined minimum distance. In other words, a check is performed to determine whether, during the movement process along the modeled movement path, at least one first surface arrangement of the first devices 114, 125 and at least one second surface arrangement of at least one second device 119 are closer to each other than a predefined minimum distance is specified. The predefined minimum distance can be retrieved, for example, from the data storage unit 126. Alternatively, or as an alternative, the predefined minimum distance can be determined by input from the user input unit of the SEM 100.

[0199] In an optional method step S6 of the method according to the invention, the inspection result is stored as collision data in the data storage unit 126. In other words, the information regarding the inspection explained above is stored as collision data in the data storage unit 126. Referring to the statement above, the collision data includes, for example, information about common points along the modeled movement path of at least one first surface arrangement of the first devices 114, 125 and at least one second surface arrangement of at least one second device 119. For example, the collision data includes information about the shortest distance between at least one first surface arrangement of the first devices 114, 125 and at least one second surface arrangement of at least one second device 119 being less than a predefined minimum distance during the movement along the modeled movement path. For example, the stored collision data can be displayed on the display unit 124.

[0200] In subsequent method steps according to the invention, different processing is performed based on the inspection results in method step S5 (which may optionally be stored in the form of collision data in method step S6).

[0201] If, in the method step of the form of distinguishing step Q1, it is identified that when the movement process is performed along the modeled movement path, at least one first surface arrangement of the first devices 114, 125 and at least one second surface arrangement of the at least second device 119 have at least one common point, then method step S6A is performed after method step S6. In method step S6A of the method according to the invention, at least one of the following method steps is performed:

[0202] (a) Displaying the message on display unit 124 of SEM 100;

[0203] (b) Abandon or terminate the movement of the first devices 114, 125 along the provided movement path. If the movement of the first devices 114, 125 along the provided movement path has not yet started, then the movement process is not initiated accordingly. However, if the movement of the first devices 114, 125 along the provided movement path has already started, then the process is terminated;

[0204] (c) Discard the movement of the first devices 114 and 125 along the provided movement path, or switch them to another movement process. If the movement of the first devices 114 and 125 along the provided movement path has not yet started, then the movement process is not initiated accordingly. However, if the movement of the first devices 114 and 125 along the provided movement path has already started, then it is switched to another movement process. For example, switching the movement process of the first devices 114 and 125 includes restricting the other movement process to predefined degrees of freedom of movement of the first devices 114 and 125, in particular to one or more predefined translational and / or rotational movements;

[0205] (d) Using the object stage 122 to perform the movement of the first devices 114 and 125 along the provided movement path;

[0206] (e) Using a moving device (in the form of an object platform 122) for moving the first devices 114, 125 to change the speed of the first devices 114, 125 moving along the provided moving path.

[0207] The aforementioned additional movement process can be, for example, a manual movement process, that is, a movement process controlled by user input. Alternatively, or as an alternative, the additional movement process can be a movement process of the first devices 114, 125 along an additional movement path, wherein the additional movement path originates from the provided movement path, for example, such that it can be obtained by shifting or rotating the provided movement path. For example, the additional movement path is generated from the provided movement path such that all points of the provided movement path are shifted along a certain direction (e.g., a direction parallel to the optical axis of SEM 100).

[0208] The display unit 124 described above, within the scope of this invention, is designed to display data. For example, the display unit 124 is used to convey information to the user of SEM 100 indicating that at least one first surface arrangement of the first devices 114, 125 and at least one second surface arrangement of the at least second device 119 have at least one common point when performing a movement process along a modeled movement path.

[0209] The aforementioned process of suspending the movement of the first devices 114 and 125 along the provided movement path includes, for example, stopping the movement of the first devices 114 and 125 along the provided movement path. Alternatively, or as an alternative, suspending the movement of the first devices 114 and 125 along the provided movement path includes, for example, not initiating the movement of the first devices 114 and 125 along the provided movement path.

[0210] When the movement process of the first devices 114 and 125 along the provided movement path is switched to another movement process, the target data is no longer used to further control the movement process of the first devices 114 and 125 along the provided movement path.

[0211] In the additional movement process described above within the scope of this invention, the first devices 114 and 125 are moved, for example, by input from the user input unit and control unit 123 of the SEM 100. In other words, the user of the SEM 100 controls the movement of the first devices 114 and 125. Switching the movement process of the first devices 114 and 125 along the provided movement path to another movement process includes, for example, terminating the movement process of the first devices 114 and 125 along the provided movement path.

[0212] When the first devices 114 and 125 are moved along the provided movement path using the object stage 122, for example, the first devices 114 and 125 and at least one second device 119 may come into contact because at least one first surface arrangement of the first devices 114 and 125 and at least one second surface arrangement of the at least one second device 119 have at least one common point when the movement is performed along the modeled movement path.

[0213] For example, as a result of identifying the following in the differentiation step Q1 above: when performing the movement process along the modeled movement path, at least one first surface arrangement of the first devices 114, 125 and at least one second surface arrangement of the second device 119 have at least one common point, regarding whether at least one of method steps (a) to (e) is performed in method step S6A (i.e., (a) displaying a message on the display unit 124 of the SEM 100, and / or (b) abandoning or terminating the movement process of the first devices 114, 125 along the provided movement path, and / or (c) abandoning the movement process of the first devices 114, 125 along the provided movement path, or switching it to another movement process, and / or (d) performing the movement process of the first devices 114, 125 along the provided movement path using the object stage 122, and / or (e) The decision to change the speed of the movement of the first devices 114, 125 along the provided movement path using the object stage 122 for moving the first devices 114, 125 can be stored in the data storage unit 126. In other words, the data storage unit 126 contains information such as always displaying a message on the display unit 124 of the SEM 100, and always suspending the movement of the first devices 114, 125 along the provided movement path once at least one first surface arrangement of the first devices 114, 125 and at least one second surface arrangement of at least one second device 119 have at least one common point during the movement process along the modeled movement path. Alternatively, the decision can be made by the user of the SEM 100. In this scenario, for example, a message is displayed on the display unit 124 of the SEM 100, linking to at least one selection option regarding whether the movement of the first devices 114, 125 along the provided movement path should be abandoned, and / or whether the movement of the first devices 114, 125 along the provided movement path should be stopped, and / or whether the movement of the first devices 114, 125 along the provided movement path should be switched to another movement process, and / or whether the speed of the movement of the first devices 114, 125 along the provided movement path should be changed. The message display may include, for example, information about the arrangement, and / or the expected distance between the first devices 114, 125 and at least one second device 119, and / or a visualization of the arrangement, and / or a warning message. By using the input unit, the user of the SEM 100 can select from at least one selection option. Alternatively or as an alternative, the user of SEM 100 may choose to use the object stage 122 to perform the movement of the first devices 114, 125 along the movement path, for example, to intentionally bring the first devices 114, 125 into mechanical contact with at least one second device 119.

[0214] If, in differentiation step Q1, it is identified that, during the movement process along the modeled movement path, at least one first surface arrangement of the first devices 114, 125 and at least one second surface arrangement of the at least second device 119 have no common points, then the method step in the form of differentiation step Q2 is executed next. If, in differentiation step Q2, it is identified that, during the movement process along the modeled movement path, a first point of at least one first surface arrangement of the first devices 114, 125 and a second point of at least one second surface arrangement of the at least second device 119 are at the shortest distance, wherein the shortest distance is less than a predefined minimum distance, then method step S6B is executed after method step S6. In method step S6B of the method according to the invention, at least one of the following steps is performed:

[0215] (a) Displaying the message on display unit 124 of SEM 100;

[0216] (b) Discard the movement of the first devices 114 and 125 along the provided moving path, or change the speed of the movement of the first devices 114 and 125 along the provided moving path. If the movement of the first devices 114 and 125 along the provided moving path has not yet started, then the movement is not initiated accordingly. However, if the movement of the first devices 114 and 125 along the provided moving path has already started, then the speed of the movement of the first devices 114 and 125 along the provided moving path is changed. For example, the speed is changed according to the shortest distance. In particular, the smaller the distance between the first devices 114 and 125 and the second device 119, the lower the speed;

[0217] (c) Discard the movement of the first devices 114 and 125 along the provided moving path, or terminate the movement of the first devices 114 and 125 along the provided moving path. If the movement of the first devices 114 and 125 along the provided moving path has not yet started, then the movement process is not initiated accordingly. However, if the movement of the first devices 114 and 125 along the provided moving path has already started, then the movement of the first devices 114 and 125 along the provided moving path is terminated.

[0218] (d) Discard the movement of the first devices 114 and 125 along the provided movement path, or switch the movement of the first devices 114 and 125 along the provided movement path to another movement process. If the movement of the first devices 114 and 125 along the provided movement path has not yet started, then the movement process is not initiated accordingly. However, if the movement of the first devices 114 and 125 along the provided movement path has already started, then the movement of the first devices 114 and 125 along the provided movement path is switched to another movement process. For example, switching the movement process of the first devices 114 and 125 includes restricting the other movement process to predefined degrees of freedom of movement of the first devices 114 and 125, in particular to one or more predefined translational and / or rotational movements;

[0219] (e) Using the object stage 122 to perform the movement of the first devices 114, 125 along the provided movement path.

[0220] Regarding displaying messages on the display unit 124 of the SEM 100, discarding the movement of the first devices 114 and 125 along the provided movement path, terminating the movement of the first devices 114 and 125 along the provided movement path, switching the movement of the first devices 114 and 125 along the provided movement path to another movement process, and executing the movement of the first devices 114 and 125 along the provided movement path, the statements above apply similarly herein. When changing the speed of the movement of the first devices 114 and 125 along the provided movement path, for example using the object stage 122, the first devices 114 and 125 are moved slower and / or faster than the normal speed of the movement along the provided movement path. For example, the speed is changed based on the shortest distance. The normal speed of the movement process and / or the changed speed of the movement process are stored, for example, in the data storage unit 126. Alternatively, or as an alternative, the normal speed of the movement process and / or the modified speed of the movement process can be predefined by user input from the SEM 100.

[0221] As a result of identifying the following in the aforementioned differentiation step Q2: when performing the movement process along the modeled movement path, the first point of at least one first surface arrangement of the first devices 114, 125 and the second point of at least one second surface arrangement of the second device 119 are at the shortest distance, wherein the shortest distance is less than a predefined minimum distance, and wherein when performing the movement process along the modeled movement path, at least one first surface arrangement of the first devices 114, 125 and at least one second surface arrangement of the second device 119 have no common points (according to the aforementioned identification in Q1), regarding whether to perform at least one of the method steps (a) to (e) (i.e., (a) displaying a message on the display unit 124 of the SEM 100, and / or (b) discarding the movement process of the first devices 114, 125 along the provided movement path or changing the speed of the movement process of the first devices 114, 125 along the provided movement path, and / or (c) The decision to abandon or terminate the movement of the first devices 114 and 125 along the provided movement path, and / or (d) abandon the movement of the first devices 114 and 125 along the provided movement path or switch the movement of the first devices 114 and 125 along the provided movement path to another movement process, and / or (e) use the object stage 122 to perform the movement of the first devices along the provided movement path, can be stored, for example, in the data storage unit 126 and / or determined by input from the user of the SEM 100. Regarding the storage of decisions in the data storage unit 126 and the making of decisions by the user of the SEM 100, refer to the statements above, which similarly apply here.

[0222] If, in the differentiation step Q2, it is identified that, during the movement process along the modeled movement path, a first point of at least one first surface arrangement of the first devices 114, 125 and a second point of at least one second surface arrangement of at least one second device 119 are at the shortest distance, wherein the shortest distance is greater than or equal to a predefined minimum distance, and wherein, during the movement process along the modeled movement path, at least one first surface arrangement of the first devices 114, 125 and at least one second surface arrangement of at least one second device 119 therefore have no common points, then method step S6C is performed after method step S6. In method step S6C of the method according to the invention, the movement process of the first devices 114, 125 along the provided movement path is performed using an object stage 122 for moving the first devices 114, 125.

[0223] In another embodiment of the method according to the invention, additionally or as an alternative, at least one of the following elements is specified as being used as the first device and / or at least one second device: object 125, object stage 122, object holder 114, micromanipulator, sample chamber 120, lock, light source, beam column (e.g., in the form of beam guide tube 104), capture device in the form of at least one of detectors 116, 117, 119, 121, 140, 500, capture device in the form of sensor 141, gas injection system, charge compensation device, camera, locking bar, clamp, scanning system 105, 106, 107, 115, 130, electrode 112, 113, cable, hose, scanning force microscope, microtome, plasma cleaner, Faraday cup, aperture 108, 109, objective cover, at least a portion of beam column 104, and SEM 100. Regarding the capture devices 116, 117, 119, 121, 140, 141, and 500, refer to the statements above, which also apply here.

[0224] In other words, any element within SEM 100 and / or SEM 100 itself, as long as it is suitable for the purposes of this invention, can be used as a first device and / or at least one second device. If an element within the scope of this invention can be movably arranged within SEM 100, then that element is suitable as a first device. For example, if an element within the scope of this invention is designed such that it moves relative to another element using object stage 122, then that element is suitable as a first device. In this case, the movement can be automated, for example, by using control unit 123. Alternatively, or as an alternative, the movement can be manual, for example, if the movement is performed by manual actuation of the SEM 100 by a user. If an element within the scope of this invention can be arranged within SEM 100 and / or is SEM 100 itself, then that element is suitable as at least one second device. In particular, if, due to the movement of the first device, the first device and at least one second device may collide and / or be at a minimum distance below a predefined minimum distance, then an element within the scope of this invention is suitable as at least one second device.

[0225] For example, alternatively, at least one of the following units can be used as at least one second device: SEM 100, beam guide tube 104, first condenser lens 105, second condenser lens 106, first objective lens 107, first aperture unit 108, second aperture unit 109, single electrode 112, tubular electrode 113, object holder 114, second deflection unit 115, first detector 116, second detector 117, radiation detector 119, sample chamber 120, third detector 121, object stage 122, object 125, first deflection unit 130, for recording structure numbers The device includes a detector 140, a sensor 141 for recording structural data, a combined device 200, a sample chamber 201, an ion beam device 300, a focusing lens 303, a second objective lens 304, an adjustable or selectable aperture 306, a first electrode arrangement 307, a second electrode arrangement 308, a particle beam device 400 including a corrector unit, a first electrostatic lens 405, a second electrostatic lens 406, a third electrostatic lens 407, a magnetic deflection unit 408, and a first electrostatic beam deflection unit 409. Multipole unit 409A, second multipole unit 409B, beam deflection device 410, first magnetic sector 411A, second magnetic sector 411B, third magnetic sector 411C, fourth magnetic sector 411D, fifth magnetic sector 411E, sixth magnetic sector 411F, seventh magnetic sector 411G, first reflector electrode 413A, second reflector electrode 413B, third reflector electrode 413C, electrostatic reflector 414, fourth electrostatic lens 415, second electrostatic beam deflection unit 416, ... The system includes a third multipole unit 416A, a fourth multipole unit 416B, a third electrostatic beam deflection unit 417, a fifth electrostatic lens 418, a fifth multipole unit 418A, a sixth multipole unit 418B, a first analytical detector 419, a beam guide tube 420, an objective lens 421, a magnetic lens 422, a sixth electrostatic lens 423, an object stage 424, an object 425, a sample chamber 426, a second analytical detector 428, a scanning device 429, an additional magnetic deflection unit 432, and a chamber detector 500.

[0226] In another embodiment of the method according to the invention, additionally or as an alternative, it is specified that the movement paths of the first devices 114, 125 within the SEM 100 are provided and / or modeled considering a predefined minimum distance, such that the distance between the first devices 114, 125 and at least one second device 119 always corresponds at least to the predefined minimum distance. In other words, the movement paths of the first devices 114, 125 within the SEM 100 are provided and / or modeled such that, during the execution of movement along the modeled movement paths, any distance between a first position on at least one first surface arrangement of the first devices 114, 125 and a second position on at least one second surface arrangement of the at least second device 119 is not less than the minimum distance. In other words, the movement paths of the first devices 114, 125 within the SEM 100 are provided and / or modeled such that no collision occurs between the first devices 114, 125 and at least one second device 119, and the distance between the first devices 114, 125 and at least one second device 119 always corresponds at least to the minimum distance. It should be noted that the distances referred to in this invention represent physical distances. In other words, if the first devices 114, 125 and at least one second device 119 are not in contact with each other, the distance within the scope of this invention can be greater than zero. Within the scope of this invention, if the first devices 114, 125 and at least one second device 119 are in contact with each other, the distance can be zero. Within the scope of this invention, if the first devices 114, 125 and at least one second device 119 are in contact with each other and pressure is applied between them, the distance can be less than zero. For example, by performing a movement process, the first devices 114, 125 and at least one second device 119 can be stacked on top of each other, such that the first devices 114, 125 are arranged on at least one second device 119 by pressure, for example, to establish a connection between the first devices 114, 125 and at least one second device 119.

[0227] The minimum distance can be, for example, a predefined minimum distance. In this case, the movement paths of the first devices 114, 125 within the SEM 100 are provided and / or modeled such that the shortest distance between the first devices 114, 125 and at least one second device 119 is always greater than the predefined minimum distance. The minimum distance can be provided, for example, by retrieving data from the data storage unit 126 and / or by input from the user-accessible input unit of the SEM 100. For example, the minimum distance is not less than 10 µm. The statements regarding the shortest and minimum distances, referring to those above, also apply similarly here.

[0228] Furthermore, or alternatively, the method according to the invention may have at least one of the features further mentioned above or below, or a combination of at least two of the features further mentioned above or below.

[0229] The embodiments of the method according to the present invention are not limited to the order of the method steps presented above. Instead, any order of method steps suitable for solving the problem within the scope of the present invention may be used. Alternatively, it is also provided that at least two method steps are performed in parallel. Alternatively, it is also provided that individual method steps are omitted.

[0230] The features of the invention disclosed in this application may be essential for implementing the invention in various embodiments, either individually or in any desired combination. The invention is not limited to the described embodiments. Variations are possible within the scope of the claims and taking into account the knowledge of those skilled in the art.

[0231] List of reference numerals

[0232] 100SEM

[0233] 101 Electronic Source

[0234] 102 lead-out electrode

[0235] 103 anode

[0236] 104 bundles of guide tubes

[0237] 105 First Converging Lens

[0238] 106 Second Converging Lens

[0239] 107 First Objective

[0240] 108 First Aperture Unit

[0241] 108A First Aperture

[0242] 109 Second Aperture Unit

[0243] 110 Extreme Boots

[0244] 111 coil

[0245] 112 single electrode

[0246] 113 tubular electrode

[0247] 114 Object Holder

[0248] 115 Second Deflection Unit

[0249] 116 First Detector

[0250] 116A Opposite Field Grating

[0251] 117 Second Detector

[0252] 118 Second Aperture

[0253] 119 Radiation Detector

[0254] 120 Sample Room

[0255] 121 Third Detector

[0256] 122 object stage

[0257] 123 Control Unit

[0258] 124 display units

[0259] 125 objects

[0260] 126 data storage units

[0261] 127 processor units

[0262] 130 First Deflection Unit

[0263] 132 Lens Moving Device

[0264] 140 detectors for recording structural data

[0265] 141 Sensors used to record structural data

[0266] 200 combination equipment

[0267] Sample Room 201

[0268] 300 Ion Beam Equipment

[0269] 301 Ion Beam Generator

[0270] Extraction electrodes in 302 ion beam equipment

[0271] 303 Converging Lens

[0272] 304 Second Objective

[0273] 306 Adjustable or Selectable Aperture

[0274] 307 First Electrode Arrangement

[0275] 308 Second Electrode Arrangement

[0276] 400 Particle beam devices including corrector units

[0277] 401 particle beam column

[0278] 402 Electronic Source

[0279] 403 lead-out electrode

[0280] 404 anode

[0281] 405 First Electrostatic Lens

[0282] 406 Second Electrostatic Lens

[0283] 407 Third Electrostatic Lens

[0284] 408 magnetic deflection unit

[0285] 409 First Electrostatic Beam Deflection Unit

[0286] 409A First Multipole Unit

[0287] 409B Second Multipole Unit

[0288] 410 beam deflection device

[0289] 411A First Magnetic Sector

[0290] 411B Second Sector

[0291] 411C Third Sector

[0292] 411D Fourth Magnetic Sector

[0293] 411E Fifth Sector

[0294] 411F Sixth Magnetic Sector

[0295] 411G Seventh Sector

[0296] 413A First Reflector Electrode

[0297] 413B Second Reflector Electrode

[0298] 413C Third Reflector Electrode

[0299] 414 electrostatic reflector

[0300] 415 Fourth Electrostatic Lens

[0301] 416 Second Electrostatic Beam Deflection Unit

[0302] 416A Third Multipole Unit

[0303] 416B Fourth Multipole Unit

[0304] 417 Third Electrostatic Beam Deflection Unit

[0305] 418 Fifth Electrostatic Lens

[0306] 418A Fifth Multipole Unit

[0307] 418B Sixth Multipole Unit

[0308] 419 First Analytical Detector

[0309] 420 bundle guide tubes

[0310] 421 Objective Lens

[0311] 422 Magnetic Lens

[0312] 423 Sixth Electrostatic Lens

[0313] 424 object stage

[0314] 425 objects

[0315] Sample Room 426

[0316] 427 Detection Beam Path

[0317] 428 Second Analysis Detector

[0318] 429 Scanning Device

[0319] 432 additional magnetic deflection units

[0320] 500-room detector

[0321] 600 First Moving Component

[0322] 601 housing

[0323] 602 Second Moving Element

[0324] The first rotation axis of the 603 stage

[0325] 604 Third Moving Element

[0326] 605 Fourth Moving Element

[0327] 606 Fifth Moving Element

[0328] The second rotation axis of the 607 stage

[0329] 608 drive control unit

[0330] 709 First Axis

[0331] 710 Second Beam Axis

[0332] Distance A

[0333] M1 First Drive Unit

[0334] M2 Second Drive Unit

[0335] M3 Third Drive Unit

[0336] M4 Fourth Drive Unit

[0337] M5 Fifth Drive Unit

[0338] OA optical axis

[0339] OA1 First Optical Axis

[0340] OA2 Second Optical Axis

[0341] OA3 Third Optical Axis

[0342] Q1 Method Steps

[0343] Q2 Method Steps

[0344] S1 to S6 Method Steps

[0345] S6A Method Steps

[0346] S6B Method Steps

[0347] S6C method steps.

Claims

1. A method for operating a particle beam device (100, 200, 400) for imaging, processing, and / or analyzing an object (125, 425), characterized in that, This method includes the following steps: - Provide first structural data and second structural data, wherein the first structural data includes information regarding the arrangement of at least one first surface of a first device (114, 125, 425) within the particle beam apparatus (100, 200, 400), and wherein the second structural data includes information regarding at least one second device (100, 104, 105, 106, 107, 108, 109, 112, 113, 114, 115, 116, 117, 119, 120, 121, 122, 125, 130, 140) within the particle beam apparatus (100, 200, 400). , 141, 200, 201, 300, 303, 304, 306, 307, 308, 400, 405, 406, 407, 408, 409, 409A, 409B, 410, 411A, 411B, 411C, 411D, 411E, 411F , 411G, 413A, 413B, 413C, 414, 415, 416, 416A, 416B, 417, 418, 418A, 418B, 419, 420, 421, 422, 423, 424, 425, 426, 428, 429, 432 Information regarding the arrangement of at least one second surface of the first device (114, 125, 425) and / or the at least one second device (100, 104, 105, 106, 107, 108, 109, 112, 113, 114, 115, 116, 117, 119, 120, 121, 122, 125, 130, 140, 141, 200, 201, 300, 303, 304, 306, 307, 308, 400, 405, 406, 407). The information pertains to at least one transformation of the following data: 408, 409, 409A, 409B, 410, 411A, 411B, 411C, 411D, 411E, 411F, 411G, 413A, 413B, 413C, 414, 415, 416, 416A, 416B, 417, 418, 418A, 418B, 419, 420, 421, 422, 423, 424, 425, 426, 428, 429, 432, 500), and wherein providing the first structural data and the second structural data includes at least one of the following method steps: (a) Retrieve from the data storage unit (126) of the particle beam device (100, 200, 400); (b) The user of the particle beam device (100, 200, 400) uses the input unit to input to the control unit (123) of the particle beam device (100, 200, 400); (c) Recording the first structural data and / or the second structural data using at least one detector (116, 117, 119, 121, 140, 419, 428, 500) and / or at least one sensor (141) of the particle beam apparatus (100, 200, 400); -The control unit (123) of the particle beam device (100, 200, 400) determines the target arrangement of the first device (114, 125, 425); - The processor unit (127) provides at least one movement path required for the first device (114, 125, 425) to reach the target arrangement of the first device (114, 125, 425); - The processor unit (127) is used to model the movement path of the first device (114, 125, 425) within the particle beam device (100, 200, 400), wherein the first structural data, the second structural data and the target arrangement of the first device (114, 125, 425) are used in the modeling. - The processor unit (127) is used to perform checks to determine the arrangement of at least one first surface of the first device (114, 125, 425) and the at least one second device (100, 104, 105, 106, 107, 108, 109, 112, 113, 114, 115, 116, 117, 119, 120, 121, 122, 125, 130, 140, 141, 200, 201, 300, 303, 304) when the first device (114, 125, 425) moves along the modeled movement path. Whether at least one of the second surface arrangements of 306, 307, 308, 400, 405, 406, 407, 408, 409, 409A, 409B, 410, 411A, 411B, 411C, 411D, 411E, 411F, 411G, 413A, 413B, 413C, 414, 415, 416, 416A, 416B, 417, 418, 418A, 418B, 419, 420, 421, 422, 423, 424, 425, 426, 428, 429, 432, 500) (i) has at least one common point, or (ii) At the shortest distance, wherein the shortest distance is less than a predefined minimum distance, and wherein at least one first surface of the first device (114, 125, 425) is arranged and the at least one second device (100, 104, 105, 106, 107, 108, 109, 112, 113, 114, 115, 116, 117, 119, 120, 121, 122, 125, 130, 140, 141, 200, 201, 300, 303, 304, 306, 307, 308, 400) is at ...00) is at the short At least one second surface arrangement of (405, 406, 407, 408, 409, 409A, 409B, 410, 411A, 411B, 411C, 411D, 411E, 411F, 411G, 413A, 413B, 413C, 414, 415, 416, 416A, 416B, 417, 418, 418A, 418B, 419, 420, 421, 422, 423, 424, 425, 426, 428, 429, 432, 500) has no common point; and - Perform one of the following steps: (i) When the movement of the first device (114, 125, 425) is performed along the modeled movement path, at least one first surface of the first device (114, 125, 425) and at least one second device (100, 104, 105, 106, 107, 108, 109, 112, 113, 114, 115, 116, 117, 119, 120, 121, 122, 125, 130, 140, 141, 200, 201, 300, 303, 304, 306, 307, 308, 400, 405) are arranged. When at least one second surface arrangement of 406, 407, 408, 409, 409A, 409B, 410, 411A, 411B, 411C, 411D, 411E, 411F, 411G, 413A, 413B, 413C, 414, 415, 416, 416A, 416B, 417, 418, 418A, 418B, 419, 420, 421, 422, 423, 424, 425, 426, 428, 429, 432, 500) has the at least one common point, perform at least one of the following method steps: (a) Displaying a message on the display unit (124) of the particle beam device (100, 200, 400); (b) Discard or terminate the movement of the first device (114, 125, 425) along the provided movement path; (c) Discard the movement of the first device (114, 125, 425) along the provided movement path, or switch it to another movement process; (d) Using a moving device (122, 424) for moving the first device (114, 125, 425), the first device (114, 125, 425) is moved along the provided moving path. (e) Using a moving device (122, 424) for moving the first device (114, 125, 425), the speed of the first device (114, 125, 425) moving along the provided moving path is changed; (ii) When the movement process is performed along the modeled movement path, a first point arranged on at least one first surface of the first device (114, 125, 425) and the at least one second device (100, 104, 105, 106, 107, 108, 109, 112, 113, 114, 115, 116, 117, 119, 120, 121, 122, 125, 130, 140, 141, 200, 201, 300, 303, 304, 306, 307, 308, 400, 405, 406, 4 07, 408, 409, 409A, 409B, 410, 411A, 411B, 411C, 411D, 411E, 411F, 411G, 413A, 413B, 413C, 414, 415, 416, 416A, 416B, 417, 418, 418A, 418B, 419, 420, 421, 422, 423, 424, 425, 426, 428, 429, 432, 500) at least one second surface arrangement of the second point is located at the shortest distance, wherein the shortest distance is less than the possible A predefined minimum distance, and when the movement process is performed along the modeled movement path, at least one first surface arrangement of the first device (114, 125, 425) and the at least one second device (100, 104, 105, 106, 107, 108, 109, 112, 113, 114, 115, 116, 117, 119, 120, 121, 122, 125, 130, 140, 141, 200, 201, 300, 303, 304, 306, 307, 308, 400, 405, 406) When at least one second surface arrangement of (407, 408, 409, 409A, 409B, 410, 411A, 411B, 411C, 411D, 411E, 411F, 411G, 413A, 413B, 413C, 414, 415, 416, 416A, 416B, 417, 418, 418A, 418B, 419, 420, 421, 422, 423, 424, 425, 426, 428, 429, 432, 500) does not have the common point, perform at least one of the following method steps: (a) Displaying a message on the display unit (124) of the particle beam device (100, 200, 400); (b) Discard the movement of the first device (114, 125, 425) along the provided moving path, or change the speed of the movement of the first device (114, 125, 425) along the provided moving path; (c) Discard the movement of the first device (114, 125, 425) along the provided moving path, or terminate the movement of the first device (114, 125, 425) along the provided moving path; (d) Discard the movement of the first device (114, 125, 425) along the provided movement path, or switch the movement of the first device (114, 125, 425) along the provided movement path to another movement process. (e) Using a moving device (122, 424) for moving the first device (114, 125, 425), the movement of the first device (114, 125, 425) along the provided moving path is performed; or (iii) When the movement process is performed along the modeled movement path, a first point arranged on at least one first surface of the first device (114, 125, 425) and the at least one second device (100, 104, 105, 106, 107, 108, 109, 112, 113, 114, 115, 116, 117, 119, 120, 121, 122, 125, 130, 140, 141, 200, 201, 300, 303, 304, 306, 307, 308, 400, 405, 406, 407, 408, 409, 409A, 409B, 410, 411A, 411B, 411C, 411) A second point of at least one second surface of (D, 411E, 411F, 411G, 413A, 413B, 413C, 414, 415, 416, 416A, 416B, 417, 418, 418A, 418B, 419, 420, 421, 422, 423, 424, 425, 426, 428, 429, 432, 500) is located at the shortest distance, wherein the shortest distance is greater than or equal to the predefined minimum distance, and the movement of the first device (114, 125, 425) along the provided movement path is performed using a moving device (122, 424) for moving the first device (114, 125, 425).

2. The method according to claim 1, characterized in that, The results of the inspection are stored as collision data in the data storage unit (126).

3. The method according to claim 1 or 2, characterized in that, At least one of the following units is used as the first device (114, 125, 425) and / or as the at least one second device (100, 104, 105, 106, 107, 108, 109, 112, 113, 114, 115, 116, 117, 119, 120, 121, 122, 125, 130, 140, 141, 200, 201, 300, 303, 304, 306, 307, 308, 400, 405, 406, 407, 408, 409, 409A, 409B). 410, 411A, 411B, 411C, 411D, 411E, 411F, 411G, 413A, 413B, 413C, 414, 415, 416, 416A, 416B, 417, 418, 418A, 418B, 419, 420, 421, 422, 423, 424, 425, 426, 428, 429, 432, 500: The object (125, 425), the object stage (122, 424), the object holder (114), the micromanipulator, the sample chamber (120, 201, 426), lock, light source, beam post (104, 420), capture device (116, 117, 119, 121, 140, 141, 419, 428, 500), gas injection system, charge compensation device, camera, locking bar, gripper, scanning system (105, 106, 107, 115, 130, 303, 304, 405, 406, 407, 408, 409, 409A, 409B, 410, 411A, 411B, 411C, 411D, 411E, 411F, 411G, 4 13A, 413B, 413C, 414, 415, 416, 416A, 416B, 417, 418, 418A, 418B, 421, 422, 423, 429, 432), electrodes (112, 113, 307, 308), cables, hoses, scanning force microscope, microtome, plasma cleaner, Faraday cup, aperture (108, 109, 306), objective cover, at least a portion of the beam column (104, 420), ion beam apparatus (300), and particle beam apparatus (100, 200, 400).

4. The method according to any one of the preceding claims, characterized in that, Consider a predefined minimum distance to provide and / or model the movement path of the first device within the particle beam device (100, 200, 400), such that the first device (114, 125, 425) and the at least one second device (100, 104, 105, 106, 107, 108, 109, 112, 113, 114, 115, 116, 117, 119, 120, 121, 122, 125, 130, 140, 141, 200, 201, 300, 303, 304, 306, 307, 308) are considered. The distances between 400, 405, 406, 407, 408, 409, 409A, 409B, 410, 411A, 411B, 411C, 411D, 411E, 411F, 411G, 413A, 413B, 413C, 414, 415, 416, 416A, 416B, 417, 418, 418A, 418B, 419, 420, 421, 422, 423, 424, 425, 426, 428, 429, 432, and 500 always correspond to at least the predefined minimum distance.

5. A computer program product comprising program code capable of being loaded into a processor unit (127) of a particle beam device (100, 200, 400) and, when executed, controlling the particle beam device (100, 200, 400) to perform the method according to at least one of the preceding claims.

6. A system comprising a data storage unit (126) for storing structural data and a particle beam apparatus (100, 200, 400) for imaging, processing, and / or analyzing objects (125, 425), wherein, The particle beam device (100, 200, 400) includes: - At least one beam generator (101, 301, 402) for generating at least one particle beam comprising charged particles; - At least one guiding device (104, 105, 106, 107, 108, 109, 115, 130, 303, 304, 306, 307, 308, 405, 406, 407, 408, 409, 409A, 409B, 410, 411A, 411B, 411C, 411D, 411E, 411F, 411G, 413A, 413B, 413C, 414, 415, 416, 416A, 416B, 417, 418, 418A, 418B, 420, 421, 422, 423, 429, 432), the at least one guiding device being used to guide, shape and / or focus a particle beam comprising charged particles onto the object (125, 425); - A first device (114, 125, 425) and at least one second device (100, 104, 105, 106, 107, 108, 109, 112, 113, 114, 115, 116, 117, 119, 120, 121, 122, 125, 130, 140, 141, 200, 201, 300, 303, 304, 306, 307, 308, 400, 405, 406, 407). 408, 409, 409A, 409B, 410, 411A, 411B, 411C, 411D, 411E, 411F, 411G, 413A, 413B, 413C, 414, 415, 416, 416A, 416B, 417, 418, 418A, 418B, 419, 420, 421, 422, 423, 424, 425, 426, 428, 429, 432, 500); - At least one moving device (122, 424) for moving the first device (114, 125, 425). - At least one control unit (123) for inputting the structural data; and - At least one processor unit (127), the computer program product according to claim 5 is loaded into the at least one processor unit.

7. The system according to claim 6, characterized in that, The particle beam device (100, 200, 400) has at least one display unit (124) for outputting messages, at least one detector (140) for recording structural data, and / or at least one sensor (141) for recording structural data.

8. The system according to claim 6 or 7, characterized in that, The first device (114, 125, 425) and / or the at least one second device (100, 104, 105, 106, 107, 108, 109, 112, 113, 114, 115, 116, 117, 119, 120, 121, 122, 125, 130, 140, 141, 200, 201, 300, 303, 304, 306, 307, 308, 400, 405, 406, 407, 408, 409, 409A, 409B, 410, 411A, 411) B, 411C, 411D, 411E, 411F, 411G, 413A, 413B, 413C, 414, 415, 416, 416A, 416B, 417, 418, 418A, 418B, 419, 420, 421, 422, 423, 424, 425, 426, 428, 429, 432, 500) are implemented as at least one of the following units: the at least one object (125, 425), object stage (122, 424), object holder (114), micromanipulator, sample This chamber (120, 201, 426), lock, light source, beam post (104, 420), capture device (116, 117, 119, 121, 140, 141, 419, 428, 500), gas injection system, charge compensation device, camera, locking lever, gripper, scanning system (105, 106, 107, 115, 130, 303, 304, 405, 406, 407, 408, 409, 409A, 409B, 410, 411A, 411B, 411C, 411D, 411E, 41 1F, 411G, 413A, 413B, 413C, 414, 415, 416, 416A, 416B, 417, 418, 418A, 418B, 421, 422, 423, 429, 432), electrodes (112, 113, 307, 308), cables, hoses, scanning force microscope, microtome, plasma cleaner, Faraday cup, aperture (108, 109, 306), objective cover, at least a portion of the beam column (104, 420), and the particle beam apparatus (100, 200, 400).

9. The system according to any one of claims 6 to 8, characterized in that, The beam generator (101) is implemented as a first beam generator, wherein the particle beam is implemented as a first particle beam including first charged particles, wherein the guiding device (104, 105, 106, 107, 108, 109, 115, 130) is implemented as a first guiding device for guiding, shaping and / or focusing the first particle beam onto the first device (114, 125), and wherein the particle beam device (200) further comprises: - At least one second beam generator (301), the at least one second beam generator being used to generate at least one second particle beam including a second charged particle; and - At least one second guiding device (303, 304, 306, 307, 308) for guiding, shaping and / or focusing the at least one second particle beam onto the first device (114, 125).

10. The system according to any one of claims 6 to 9, characterized in that, The particle beam equipment (100, 200, 400) is an electron beam equipment and / or an ion beam equipment.

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