Multilayer electronic component

Abstract

Disclosed is a multilayer electronic component including a body having first and second surfaces opposite to each other in a first direction, third and fourth surfaces opposite to each other, and fifth and sixth surfaces opposite to each other. The body includes a stack region having dielectric layers and internal electrodes alternately disposed in a first direction, a first edge region between the stack region and the third surface, and a second edge region between the stack region and the fourth surface. First and second external electrodes are disposed on the third and fourth surfaces, respectively. The first via electrode and the second via electrode pass through the first edge region and the second edge region, respectively. 3% < = R1 < = 7% and / or 3% < = R2 < = 7% are satisfied, where R1 represents a ratio of an area of the first via electrode to an area of the first edge region and R2 represents a ratio of an area of the second via electrode to an area of the second edge region in a cross section of the body in the second direction and the third direction.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2024-0156140, filed on November 6, 2024, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] This disclosure relates to a multilayer electronic component. Background Technology

[0003] Multilayer ceramic capacitors (MLCCs, a type of multilayer electronic component) are chip capacitors mounted on printed circuit boards in various types of electronic products, such as image display devices (including liquid crystal displays (LCDs) and plasma display panels (PDPs)), computers, smartphones, and mobile phones, for charging or discharging from them. These multilayer ceramic capacitors are used as components in a wide variety of electronic devices due to their small size, guaranteed high capacitance, and ease of installation.

[0004] Recently, with the improvement of the performance of electronic products equipped with MLCCs, there is a need for MLCCs with higher and more uniform capacitance. However, due to the poor contact between the internal and external electrodes of the MLCC, capacitance distribution and ESR distribution may occur. To solve these problems, a method exists in which holes are formed in the body and via electrodes connected to the internal electrodes of the same polarity are provided.

[0005] (Patent Document 1) Japanese Patent No. 2004-281957. Summary of the Invention

[0006] One aspect of this disclosure is to provide a multilayer electronic component with excellent electrical properties.

[0007] However, the problems to be solved by this disclosure are not limited to those described above, and will be more readily understood in the process of describing specific embodiments of this disclosure.

[0008] A multilayer electronic component according to embodiments of the present disclosure may include: a body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction; the body includes a stacked region, a first edge region, and a second edge region; the stacked region includes a dielectric layer and a first inner electrode and a second inner electrode alternately disposed in the first direction, with the dielectric layer between the first inner electrode and the second inner electrode; the first edge region is disposed between the stacked region and the third surface; the second inner electrode is not present in the first edge region; and the second edge region is disposed in the stacked region. Between the region and the fourth surface, the first inner electrode is not present in the second edge region; a first outer electrode and a second outer electrode are respectively disposed on the third surface and the fourth surface and respectively connected to the first inner electrode and the second inner electrode; and a first through-hole electrode and a second through-hole electrode pass through the first edge region and the second edge region and are respectively connected to the first inner electrode and the second inner electrode, wherein the multilayer electronic component satisfies at least one of 3%≤R1≤7% and 3%≤R2≤7%, wherein, in the cross-section of the body in the second direction and the third direction, R1 is the ratio of the area of ​​the first through-hole electrode to the area of ​​the first edge region, and R2 is the ratio of the area of ​​the second through-hole electrode to the area of ​​the second edge region. Attached Figure Description

[0009] The above and other aspects, features and advantages of this disclosure will become clearer from the following detailed embodiments, taken in conjunction with the accompanying drawings, in which: Figure 1 This is a perspective view schematically illustrating a multilayer electronic assembly according to an embodiment of the present disclosure.

[0010] Figure 2 schematically showing along Figure 1 The cross-sectional view taken from line I-I'.

[0011] Figure 3 schematically showing along Figure 1 The cross-sectional view taken from line II-II'.

[0012] Figure 4 schematically showing along Figure 2 The cross-sectional view taken from line III-III'.

[0013] Figure 5 It has removed the internal electrode and the through-hole electrode. Figure 4 The cross-sectional view schematically shows the area of ​​the edge region.

[0014] Figure 6 The internal electrode has been removed. Figure 4 The cross-sectional view schematically shows the area of ​​the through-hole electrode. Detailed Implementation

[0015] In the following description, embodiments of the present disclosure will be illustrated with reference to the accompanying drawings. However, embodiments of the present disclosure may be modified in various other forms, and the scope of the present disclosure is not limited to the embodiments described below. Furthermore, embodiments of the present disclosure may be provided to describe the present disclosure more completely to those skilled in the art. Therefore, for clarity of description, the shape and size of elements in the drawings may be exaggerated, and elements indicated by the same reference numerals in the drawings may be the same elements.

[0016] In the accompanying drawings, for the purpose of clarifying this disclosure, parts irrelevant to the description will be omitted, and thicknesses may be enlarged to clearly show layers and regions. The same reference numerals will be used to denote components having the same function within the same conceptual scope. Furthermore, throughout the specification, unless otherwise specifically stated, when an element is referred to as "comprising" or "including" another element, it means that the element may also include other elements, without excluding other elements.

[0017] In the accompanying drawings, X may be defined as a first direction or thickness direction, Y may be defined as a second direction or length direction, and Z may be defined as a third direction or width direction. In the following text, X may be referred to as "first direction" or "first direction X", Y may be referred to as "second direction" or "second direction Y", and Z may be referred to as "third direction" or "third direction Z".

[0018] Multilayer electronic components Figure 1 This is a perspective view schematically illustrating a multilayer electronic assembly according to an embodiment of the present disclosure.

[0019] Figure 2 schematically showing along Figure 1 The cross-sectional view taken from line I-I'.

[0020] Figure 3 schematically showing along Figure 1 The cross-sectional view taken from line II-II'.

[0021] Figure 4 schematically showing along Figure 2 The cross-sectional view taken from line III-III'.

[0022] Figure 5 It has removed the internal electrode and the through-hole electrode. Figure 4 The cross-sectional view schematically shows the area of ​​the edge region.

[0023] Figure 6 The internal electrode has been removed. Figure 4 The cross-sectional view schematically shows the area of ​​the through-hole electrode.

[0024] In the following text, reference will be made to Figures 1 to 6 A multilayer electronic assembly 100 according to embodiments of the present disclosure is described in detail. Additionally, a multilayer ceramic capacitor is described as an example of a multilayer electronic assembly, but the present disclosure is not limited thereto, and is applicable to various multilayer electronic assemblies (such as inductors, piezoelectric elements, varistors, or thermistors).

[0025] A multilayer electronic component 100 according to an embodiment of the present disclosure may include: a body 110 including a dielectric layer 111 and inner electrodes 121 and 122; outer electrodes 131 and 132; and through-hole electrodes 141 and 142.

[0026] There are no particular restrictions on the specific shape of the main body 110, but as Figure 1 As shown, the body 110 may have a hexahedral shape or a shape similar to a hexahedron. Due to the shrinkage of the ceramic powder particles included in the body 110 during the sintering process, or due to the polishing process for the corners of the body 110, the body 110 may not have a hexahedral shape with perfectly straight lines, but may have a generally hexahedral shape.

[0027] The main body 110 may have a first surface 1 and a second surface 2 that are opposite to each other in a first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and are opposite to each other in a second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1, the second surface 2, the third surface 3 and the fourth surface 4 and are opposite to each other in a third direction.

[0028] The body 110 may include dielectric layers 111 and internal electrodes 121 and 122 alternately disposed with the dielectric layers 111. The plurality of dielectric layers 111 are in a sintered state, such that adjacent dielectric layers 111 can be integrated with each other, making it difficult to identify the boundaries between them without the use of a scanning electron microscope (SEM).

[0029] The dielectric layer 111 may include, for example, a perovskite-type compound represented by ABO3 as a main component. The perovskite-type compound represented by ABO3 may include, for example, BaTiO3, (Ba 1-x Ca x TiO3 (0) <x<1)、Ba(Ti 1-y Ca y )O3(0 <y<1)、(Ba 1- x Ca x (Ti) 1-yZr y )O3 (0 < x < 1, 0 < y < 1) and (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 ≤ x ≤ 0.5, 0 ≤ y ≤ 0.5), or one or more of them.

[0030] There is no particular limitation on the average thickness of the dielectric layer 111. For example, the average thickness of the dielectric layer 111 can be 0.1 μm to 20 μm, 0.1 μm to 10 μm, 0.1 μm to 5 μm, 0.1 μm to 2 μm, or 0.1 μm to 0.4 μm.

[0031] The inner electrodes 121 and 122 may include a first inner electrode 121 and a second inner electrode 122. The first inner electrode 121 and the second inner electrode 122 may be alternately arranged in the first direction X, and the dielectric layer 111 is interposed between the first inner electrode 121 and the second inner electrode 122. That is, the first inner electrode 121 and the second inner electrode 122 (a pair of electrodes with different polarities) may be arranged to face each other, and the dielectric layer 111 is interposed between them. The first inner electrode 121 and the second inner electrode 122 may be electrically separated from each other by the dielectric layer 111 disposed between them.

[0032] The first inner electrode 121 is spaced apart from the fourth surface 4 and may be connected to a first outer electrode 131 provided on the third surface 3. The second inner electrode 122 is spaced apart from the third surface 3 and may be connected to a second outer electrode 132 provided on the fourth surface 4.

[0033] The conductive metal included in the inner electrodes 121 and 122 may be one or more of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti, and their alloys. More preferably, the inner electrodes 121 and 122 may include Ni, but the present disclosure is not limited thereto.

[0034] There is no particular limitation on the average thickness of the inner electrodes 121 and 122. The average thickness of the inner electrodes 121 and 122 can be, for example, 0.1 μm to 10.0 μm, 0.1 μm to 3.0 μm, 0.1 μm to 1.0 μm, or 0.1 μm to 0.4 μm.

[0035] The average thickness of dielectric layer 111 refers to the average thickness of dielectric layer 111 in the first direction X, and the average thickness of inner electrodes 121 and 122 refers to the average thickness of inner electrodes 121 and 122 in the first direction X. The average thickness of dielectric layer 111 and the average thickness of inner electrodes 121 and 122 can be measured by scanning cross-sections of the body 110 in the first and second directions using a scanning electron microscope (SEM) at 10,000x magnification. More specifically, the average thickness of dielectric layer 111 can be measured by measuring the thickness of dielectric layer 111 at multiple points (e.g., 5 points equally spaced from each other) in the second or third direction, and then averaging the results. Similarly, the average thickness of inner electrodes 121 and 122 can be measured by measuring the thickness of one inner electrode 121 or 122 at multiple points (e.g., 5 points equally spaced from each other) in the second or third direction, and then calculating the average value. Ten equally spaced points can be specified in the stacked region RO. By performing an average measurement and then calculating the average value for each of the 10 dielectric layers 111 and the 10 inner electrodes 121 and 122, the average thickness of the dielectric layer 111 and the average thickness of the inner electrodes 121 and 122 can be made more generalized.

[0036] The main body 110 may be disposed inside the multilayer electronic component 100, and may include a stacked region RO, a first edge region RM1, and a second edge region RM2. The stacked region RO forms a capacitor by including a dielectric layer 111 and a first internal electrode 121 and a second internal electrode 122 alternately disposed in a first direction, with the dielectric layer 111 located between the first internal electrode 121 and the second internal electrode 122. The first edge region RM1 is disposed between the stacked region RO and the third surface 3, and the second internal electrode 122 is not present in the first edge region RM1. The second edge region RM2 is disposed between the stacked region RO and the fourth surface 4, and the first internal electrode 121 is not present in the second edge region RM2. That is, the edge regions RM1 and RM2 may be disposed on two surfaces of the stacked region RO that are opposite to each other in the second direction Y.

[0037] The first internal electrode 121 may include a first main portion 121a and a first lead-out portion 121b. The first main portion 121a is disposed in the stacking region RO and stacked with the second internal electrode 122 in the first direction X. The first lead-out portion 121b is disposed in the first edge region RM1, extends from the first main portion 121a, and is exposed on the third surface 3. That is, the first edge region RM1 may refer to the area where multiple first leads-out portions 121b are stacked in the first direction X without being inserted into the second internal electrode 122.

[0038] The second internal electrode 122 may include a second main portion 122a and a second lead-out portion 122b. The second main portion 122a is disposed in the stacking region RO and stacked with the first internal electrode 121 in the first direction X. The second lead-out portion 122b is disposed in the second edge region RM2 and extends from the second main portion 122a and is exposed on the fourth surface 4. That is, the second edge region RM2 may refer to the area where multiple second leads-out portions 122b are stacked in the first direction X without being inserted into the first internal electrode 121.

[0039] In addition, refer to Figure 4 The widths of the lead-out portions 121b and 122b in the third direction Z are shown to be the same as the widths of the main portions 121a and 122a in the third direction Z, but this disclosure is not limited thereto. For example, the widths of the lead-out portions 121b and 122b in the third direction Z may be greater than or less than the widths of the main portions 121a and 122a in the third direction Z. In addition, the widths of the lead-out portions 121b and 122b in the third direction Z may gradually increase or decrease from the main portions 121a and 122a to the third surface 3 or the fourth surface 4.

[0040] The main body 110 may include a first cover portion 112 and a second cover portion 113 disposed on two opposing surfaces of the stacked region RO in the first direction X. The first cover portion 112 may be disposed sequentially on one surface of the stacked region RO in the first direction X, one surface of the first edge region RM1 in the first direction X, and one surface of the second edge region RM2 in the first direction X. The second cover portion 113 may be disposed sequentially on the other surface of the stacked region RO in the first direction X, the other surface of the first edge region RM1 in the first direction X, and the other surface of the second edge region RM2 in the first direction X. Except for excluding the internal electrode, the cover portions 112 and 113 may have a structure similar to that of the dielectric layer 111.

[0041] The average thickness of the covers 112 and 113 is not particularly limited. The average thickness of the covers 112 and 113 can be, for example, 300 μm or less, 100 μm or less, 30 μm or less, or 20 μm or less. The average thickness of the covers 112 and 113 can also be, for example, 5 μm or more, 10 μm or more, or 20 μm or more. The average thickness of the covers 112 and 113 can refer to the average thickness of each of the first cover 112 and the second cover 113.

[0042] The average thickness of the covering portions 112 and 113 may refer to the average thickness of the covering portions 112 and 113 in the first direction X, and may be the average thickness in the first direction X measured at 5 points that are equally spaced from each other in the cross section of the main body 110 in the first and second directions.

[0043] The main body 110 may include a first side portion 114 and a second side portion 115, which are respectively disposed on two opposing surfaces of the stacked region RO in a third direction. The first side portion 114 may be sequentially disposed on one surface of the stacked region RO in a third direction, one surface of the first edge region RM1 in a third direction, and one surface of the second edge region RM2 in a third direction. The second side portion 115 may be sequentially disposed on another surface of the stacked region RO in a third direction, another surface of the first edge region RM1 in a third direction, and another surface of the second edge region RM2 in a third direction. That is, the side portions 114 and 115 may refer to the regions between the two ends of the inner electrodes 121 and 122 and the outer surface of the main body 110 in a cross-section cut along the first and third directions of the main body 110. Except for excluding the inner electrodes 121 and 122, the side portions 114 and 115 may have a structure similar to that of the dielectric layer 111.

[0044] The average thickness of sides 114 and 115 is not particularly limited. The average thickness of sides 114 and 115 can be, for example, 100 μm or less, 20 μm or less, or 15 μm or less. The average thickness of sides 114 and 115 can be, for example, 5 μm or more, or 10 μm or more. The average thickness of sides 114 and 115 can refer to the average thickness of each of the first side 114 and the second side 115.

[0045] The average thickness of sides 114 and 115 may refer to the average thickness of sides 114 and 115 in the third direction Z, and may be the average thickness in the third direction Z measured at 5 points that are equally spaced from each other in the cross section of the body 110 in the first direction and the third direction.

[0046] External electrodes 131 and 132 may be disposed on the third surface 3 and the fourth surface 4. For example, the first external electrode 131 may be disposed on the third surface 3 and connected to the first internal electrode 121, and the second external electrode 132 may be disposed on the fourth surface 4 and connected to the second internal electrode 122. The first external electrode 131 may be configured to extend from the third surface 3 to the first surface 1 and the second surface 2, and the second external electrode 132 may be configured to extend from the fourth surface 4 to the first surface 1 and the second surface 2. In addition, the first external electrode 131 and the second external electrode 132 may be configured to extend to the fifth surface 5 and the sixth surface 6.

[0047] The type or shape of the outer electrodes 131 and 132 is not specifically limited, and they may have a multilayer structure. For example, the outer electrodes 131 and 132 may include a base electrode layer in contact with the inner electrodes 121 and 122, as well as a plating layer disposed on the base electrode layer.

[0048] The substrate electrode layer may be a sintered electrode layer comprising a metal and a glass. The metal included in the sintered electrode layer may include, for example, Cu, Ni, Pd, Pt, Au, Ag, Pb and / or alloys thereof. The glass included in the sintered electrode layer may include one or more oxides of, for example, Ba, Ca, Zn, Al, B and Si. However, this disclosure is not limited thereto.

[0049] The substrate electrode layer may be constructed solely of a sintered electrode layer comprising metal and glass, but this disclosure is not limited thereto, and the substrate electrode layer may have a multilayer structure. The substrate electrode layer may include, for example, a sintered electrode layer and a resin electrode layer, the sintered electrode layer comprising metal and glass, and the resin electrode layer disposed on the sintered electrode layer and comprising metal particles and resin.

[0050] The metal particles included in the resin electrode layer may include one or both of spherical and plate-like particles. The metals included in the resin electrode layer may include, for example, Cu, Ni, Pd, Pt, Au, Ag, Pb, Sn, and / or alloys thereof. The resin included in the resin electrode layer may include, for example, one or more of epoxy resin, acrylic resin, and ethyl cellulose resin.

[0051] The coating may include, for example, Ni, Sn, Pd and / or alloys thereof, and may be formed as multiple layers. The coating may be, for example, a Ni coating or a Sn coating, or it may be in the form of Ni and Sn coatings sequentially formed on a substrate electrode layer. Alternatively, the coating may include multiple Ni coatings and / or multiple Sn coatings.

[0052] Although the accompanying drawings depict a structure in which the multilayer electronic assembly 100 has two external electrodes 131 and 132, it is not limited thereto, and the number or shape of the external electrodes 131 and 132 may be changed depending on the shape of the internal electrodes 121 and 122 or for other purposes.

[0053] The multilayer electronic assembly 100 may include a first through-hole electrode 141 and a second through-hole electrode 142. The first through-hole electrode 141 passes through a first edge region RM1 and can be connected to a first inner electrode 121. The second through-hole electrode 142 passes through a second edge region RM2 and can be connected to a second inner electrode 122.

[0054] The first through-hole electrode 141 may be configured to be connected to a plurality of first leads 121b but spaced apart from the second inner electrode 122, and the second through-hole electrode 142 may be configured to be connected to a plurality of second leads 122b but spaced apart from the first inner electrode 121.

[0055] Through-hole electrodes 141 and 142 can stably connect multiple inner electrodes 121 and 122. That is, even if a portion of the inner electrodes 121 and 122 may not contact the outer electrodes 131 and 132 disposed on the third surface 3 and the fourth surface 4 due to shrinkage or poor polishing during the sintering process, the inner electrodes 121 and 122 can still be electrically connected to the outer electrodes 131 and 132 via the through-hole electrodes 141 and 142 through the inner electrodes 121 and 122 of different layers. Therefore, the capacitance and ESR characteristics of the multilayer electronic component 100 can be improved.

[0056] Although the through-hole electrodes 141 and 142 do not necessarily have to be in contact with the outer electrodes 131 and 132, in order to more stably ensure the electrical connection between the inner electrodes 121 and 122 and the outer electrodes 131 and 132, the first through-hole electrode 141 may be exposed on the first surface 1 and the second surface 2 and connected to the first outer electrode 131, and the second through-hole electrode 142 may be exposed on the first surface 1 and the second surface 2 and connected to the second outer electrode 132.

[0057] According to embodiments of this disclosure, one or both of 3%≤R1≤7% and 3%≤R2≤7% are satisfied, wherein, in the cross-section of the body 110 in the second direction Y and the third direction Z, R1 is the ratio of the area of ​​the first through-hole electrode 141 to the area of ​​the first edge region RM1, and R2 is the ratio of the area of ​​the second through-hole electrode 142 to the area of ​​the second edge region RM2. More preferably, both 3%≤R1≤7% and 3%≤R2≤7% can be satisfied.

[0058] When R1 and / or R2 are less than 3%, the effect of improving capacitance and ESR characteristics through via electrodes 141 and 142 may not be significant. Furthermore, to form via electrodes 141 and 142, holes must be machined in the body 110, but there is a risk of cracking in the body 110 during the hole machining process. In particular, when R1 and / or R2 exceed 7%, the side effect of cracking in the body 110 may become significant.

[0059] There is no particular limitation on the number of through-hole electrodes 141 and 142, but multiple first through-hole electrodes 141 and multiple second through-hole electrodes 142 can be provided. For example, three or more first through-hole electrodes 141 and two through-hole electrodes 142 can each be provided. For example, multiple first through-hole electrodes 141 can be arranged along a third direction Z, and multiple second through-hole electrodes 142 can be arranged along a third direction Z. In this case, the area of ​​the first through-hole electrodes 141 can be the total area of ​​the multiple first through-hole electrodes 141, and the area of ​​the second through-hole electrodes 142 can be the total area of ​​the multiple second through-hole electrodes 142.

[0060] For details, refer to Figure 5 and Figure 6R1 can refer to the ratio of the total area TM1 of the plurality of first through-hole electrodes 141 to the area AM1 of the first edge region RM1, and R2 can refer to the ratio of the total area TM2 of the plurality of second through-hole electrodes 142 to the area AM2 of the second edge region RM2.

[0061] For example, R1 and R2 can be measured by analyzing images of cross-sections of the body 110 in the second direction Y and the third direction Z, captured by an optical microscope. The stacked region RO and the edge regions RM1 and RM2 can be distinguished by brightness differences in the images captured by the optical microscope, and the areas in the edge regions RM1 and RM2 where via electrodes 141 and 142 are provided and areas where via electrodes 141 and 142 are not provided can also be distinguished by brightness differences. The cross-section of the body 110 in the second direction Y and the third direction Z can be a cross-section passing through the stacked region RO, and can be, for example, a cross-section of the body 110 polished to the center of the body 110 in the first direction X in the second direction Y and the third direction Z.

[0062] In an embodiment, when the length of the first edge region RM1 in the second direction Y is L1, and the distance between the third surface 3 and the first through-hole electrode 141 in the second direction Y is L1a, the ratio of L1a to L1 (L1a / L1) can be greater than or equal to 5%. When L1a / L1 is less than 5%, there is a risk of cracking due to the first through-hole electrode 141 being too close to the third surface 3 of the body 110. There is no particular upper limit to L1a / L1, but when the first through-hole electrode 141 and the second inner electrode 122 become too close, there is a risk of short circuit. Therefore, L1a / L1 being less than or equal to 50% is likely ideal.

[0063] In this embodiment, when the distance between the stacked region RO and the first via electrode 141 in the second direction Y is L1b, the ratio of L1b to L1 (L1b / L1) can be greater than or equal to 5%. When L1b / L1 is less than 5%, there is a risk of short circuit due to the first via electrode 141 being too close to the second inner electrode 122. There is no particular upper limit to L1b / L1, but when the first via electrode 141 becomes too close to the third surface 3, there is a risk of cracking. Therefore, L1b / L1 of 45% or less is likely ideal.

[0064] In this embodiment, when the diameter of the first through-hole electrode 141 is D1, D1 can be greater than or equal to 5 μm. When D1 is less than 5 μm, the effect of improving capacitance and ESR characteristics through the first through-hole electrode 141 may not be significant. There is no particular upper limit to D1; for example, it can be less than or equal to 0.9 × L1. Optionally, to prevent cracking, D1 can be less than or equal to 0.5 × L1.

[0065] In an embodiment, when the distance between two adjacent first through-hole electrodes 141 among the plurality of first through-hole electrodes 141 is D2, the ratio (D2 / D1) of D2 to D1 may be greater than or equal to 1.2. When D2 / D1 is less than 1.2, the distance between the plurality of first through-hole electrodes 141 is too close, and there may be a risk of cracks occurring between the plurality of holes. The upper limit of D2 / D1 is not particularly limited, but may be, for example, 2.5 or less. When D2 / D1 exceeds 2.5, the improvement effect on the capacitance and ESR characteristics of the through-hole electrodes 141 and 142 may not be significant.

[0066] In addition, except for the difference that the first through-hole electrode 141 is connected to the first inner electrode 121 and the second through-hole electrode 142 is connected to the second inner electrode 122, the first through-hole electrode 141 and the second through-hole electrode 142 may be in a substantially symmetric relationship with each other. Therefore, descriptions such as L1a / L1, L1b / L1, D1, and D2 / D1 may equally apply to the second edge region RM2 and the second through-hole electrode 142.

[0067] The shapes of the through-hole electrodes 141 and 142 are not particularly limited, but the cross-sections of the through-hole electrodes 141 and 142 may be circular, triangular, or quadrilateral. However, in order to prevent cracks from occurring, the cross-sections of the through-hole electrodes 141 and 142 may desirably be triangular rather than quadrilateral, and more desirably be circular. That is, in the embodiment, in the cross-section of the main body 110 in the second direction Y and the third direction Z, the cross-sections of the first through-hole electrode 141 and the second through-hole electrode 142 may be circular.

[0068] Hereinafter, an example of a method for forming the multilayer electronic component 100 will be described. However, the manufacturing method of the multilayer electronic component 100 is not limited thereto.

[0069] First, ceramic powder for forming the dielectric layer 111 is prepared. The ceramic powder may include, for example, BaTiO3, (Ba 1- x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1- y Zr y )O3 (0 < y < 1) or (Ca 1-x Sr x )(Zr 1-y Ti yBaTiO3 (0≤x≤0.5, 0≤y≤0.5). For example, BaTiO3 powder can be synthesized by reacting a titanium raw material, such as titanium dioxide, with a barium raw material, such as barium carbonate. Methods for synthesizing ceramic powders may include, for example, solid-state methods, sol-gel methods, hydrothermal synthesis methods, etc., but this disclosure is not limited to these. Next, the prepared ceramic powder is dried and ground, and then an organic solvent (such as ethanol) and a binder (such as polyvinyl butyral) are mixed to prepare a ceramic slurry. This ceramic slurry is then coated onto a carrier film and dried to prepare a ceramic green sheet.

[0070] Next, the conductive paste (containing metal powder, adhesive, organic solvent, etc.) for the internal electrode is printed onto the ceramic green sheet at a predetermined thickness using screen printing or gravure printing, thereby forming the internal electrode pattern.

[0071] Subsequently, the ceramic green sheet with the internal electrode pattern printed on it is peeled off from the carrier film, and then a predetermined number of ceramic green sheets with the internal electrode pattern printed on them are stacked and pressed to form a ceramic laminate. A predetermined number of ceramic green sheets without the internal electrode pattern are stacked on the upper and lower parts of the ceramic laminate to form the cover portions 112 and 113 after sintering. The ceramic laminate is then cut into sheets of a predetermined size, and the cut sheets are sintered at a temperature greater than or equal to 1000°C and less than or equal to 1400°C to form the body 110.

[0072] Furthermore, sides 114 and 115 can be formed by coating a conductive paste for the internal electrodes onto the ceramic green sheet at locations other than where sides 114 and 115 will be formed, and then sintering. Alternatively, to suppress step differences caused by the internal electrodes 121 and 122, the ceramic laminate can be cut such that the internal electrode pattern is exposed on the two third-side surfaces of the cut sheet, and then the sheet for forming the sides can be attached to the two third-side surfaces of the cut sheet, and then sintered to form sides 114 and 115.

[0073] Next, hole machining is performed on the body 110. Hole machining can be performed by mechanical drilling or CO2 laser irradiation on the body 110, but this disclosure is not limited thereto. Subsequently, through-hole electrodes 141 and 142 can be formed by filling the formed holes with conductive paste.

[0074] Subsequently, external electrodes 131 and 132 can be formed on the body 110 where through-hole electrodes 141 and 142 are formed. There are no particular limitations on the method of forming external electrodes 131 and 132.

[0075] For example, when the external electrodes 131 and 132 include a sintered electrode layer, the body 110 can be immersed in a paste for the external electrodes comprising metal powder, glass frit, binder and organic solvent, and then the paste for the external electrodes can be sintered at a temperature of 500°C to 900°C to form a sintered electrode layer.

[0076] For example, when the external electrodes 131 and 132 include a resin electrode layer, the body 110 can be immersed in a conductive resin composition including metal powder, resin, adhesive and organic solvent, and then subjected to a curing heat treatment at a temperature of 250°C to 550°C to form a resin electrode layer.

[0077] In addition, electroplating and / or electroless plating can be performed to form a coating on the sintered electrode layer or resin electrode layer.

[0078] (Example) After preparing a sample sheet with dimensions of 1005 (length: approximately 1.0 mm, width: approximately 0.5 mm, thickness: approximately 0.5 mm) using the method described above for manufacturing multilayer electronic components, the electrical characteristics according to R1 and R2 were evaluated. R1 and R2 were measured from images of cross-sections of the polished sample sheet in the second and third directions, taken at half the distance from the first direction, observed using an optical microscope. Sample number 1 is a sample sheet without through-hole electrodes.

[0079] The capacitance of each sample number was evaluated by measuring the average capacitance (average capacitance value) of a total of 10 sample pieces for each sample number using a capacitance meter. With a target capacitance value of 15 μF as a benchmark, the relative value of the average capacitance value of each sample number to the target capacitance value was calculated (expressed as capacitance (%)) and listed in Table 1 below.

[0080] ESR evaluation was performed using an LCR meter (frequency: 500kHz, SMD clamp probe), and ESR was measured for each sample number (a total of 10 samples were taken for each sample number). The average values ​​are listed in Table 1 below.

[0081] When crack evaluation is performed by measuring the cross-section of each sample piece (a total of 10 sample pieces for each sample piece) using an optical microscope, if no sample piece has a crack, it is rated as excellent (○), if 3 or fewer sample pieces have a crack, it is rated as good (△), and if more than 3 sample pieces have a crack, it is rated as poor (X). The results are listed in Table 1 below.

[0082] The final evaluation is made by taking all characteristics into account and rating them as excellent (VG), good (G), or poor (B), as shown in Table 1 below.

[0083] [Table 1]

[0084] The capacitance values ​​of samples 1 and 2 are approximately 60% of the target capacitance value. It can be confirmed that when R1 (R2) is greater than or equal to 3%, the capacitance value rapidly increases to more than 90% of the target capacitance value. When R1 (R2) increases from 3% to 7%, the capacitance characteristics improve, but when R1 (R2) exceeds 7%, the capacitance value converges (e.g., approaches a certain value).

[0085] The ESR values ​​for samples 1 and 2 are approximately 6 mΩ. It can be confirmed that when R1 (R2) is greater than or equal to 3%, the ESR can rapidly decrease to approximately 3 mΩ. In addition, it can be confirmed that the ESR decreases as R1 (R2) increases from 3% to 7%, but when R1 (R2) exceeds 7%, the ESR value converges (e.g., approaches a certain value).

[0086] Furthermore, it can be confirmed that when R1 (R2) is in the range of 1% to 5%, no cracks will appear at all, but cracks will appear when R1 (R2) is greater than or equal to 7%.

[0087] Therefore, it can be confirmed that when R1 and / or R2 are greater than or equal to 3% and less than or equal to 7%, the electrical characteristics and reliability of multilayer electronic components are significantly improved.

[0088] This disclosure is not limited to the above embodiments and drawings, but is defined by the appended claims. Therefore, those skilled in the art can make various substitutions, modifications, or changes without departing from the scope of this disclosure as defined by the appended claims, and such substitutions, modifications, or changes should be construed as being included within the scope of this disclosure.

[0089] Furthermore, the term "embodiment" does not imply the same embodiment and is provided to emphasize and explain different unique features. However, the embodiments presented above do not preclude implementation in combination with features of another embodiment. For example, unless there is a description contrary to or contradictory to the item in another embodiment, the item may be understood as a description related to another embodiment, even if it is not described in another embodiment.

[0090] In this disclosure, the term "connection" includes not only direct connections but also indirect connections such as those via adhesive layers. Additionally, the term "electrical connection" includes both physical and non-physical connections. The terms "first," "second," etc., are used to distinguish one element from another and do not limit the order and / or importance associated with the elements. In some cases, without departing from the scope of this disclosure, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

[0091] As one of the various effects of this disclosure, multilayer electronic components with excellent reliability can be provided.

[0092] While embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and variations may be made without departing from the scope of this disclosure as defined by the appended claims.

Claims

1. A multilayer electronic component, comprising: A body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction. The body includes a stacked region, a first edge region and a second edge region. The stacked region includes a dielectric layer and a first inner electrode and a second inner electrode alternately disposed in the first direction, with the dielectric layer between the first inner electrode and the second inner electrode. The first edge region is disposed between the stacked region and the third surface, and the second inner electrode is not present in the first edge region. The second edge region is disposed between the stacked region and the fourth surface, and the first inner electrode is not present in the second edge region. The first external electrode and the second external electrode are respectively disposed on the third surface and the fourth surface and are respectively connected to the first internal electrode and the second internal electrode; as well as The first through-hole electrode and the second through-hole electrode pass through the first edge region and the second edge region, respectively, and are connected to the first inner electrode and the second inner electrode, respectively. The condition satisfies at least one of 3%≤R1≤7% and 3%≤R2≤7%, wherein, in the cross-section of the body in the second direction and the third direction, R1 is the ratio of the area of ​​the first through-hole electrode to the area of ​​the first edge region, and R2 is the ratio of the area of ​​the second through-hole electrode to the area of ​​the second edge region.

2. The multilayer electronic component according to claim 1, in, Both the first through-hole electrode and the second through-hole electrode are configured in multiple forms. Wherein, the area of ​​the first through-hole electrode is the total area of ​​the plurality of first through-hole electrodes. The area of ​​the second through-hole electrode is the total area of ​​the plurality of second through-hole electrodes.

3. The multilayer electronic component according to claim 2, in, Multiple first through-hole electrodes are arranged along the third direction. The plurality of second through-hole electrodes are arranged along the third direction.

4. The multilayer electronic component according to claim 1, in, The ratio of L1a to L1 is greater than or equal to 5%, where L1 is the length of the first edge region in the second direction, and L1a is the distance between the third surface and the first via electrode in the second direction.

5. The multilayer electronic component according to claim 1, in, The ratio of L1b to L1 is greater than or equal to 5%, where L1 is the length of the first edge region in the second direction, and L1b is the distance between the stacked region and the first via electrode in the second direction.

6. The multilayer electronic component according to claim 1, in, D1 is greater than or equal to 5 μm, where D1 is the diameter of the first through-hole electrode.

7. The multilayer electronic component according to claim 3, in, The ratio of D2 to D1 is greater than or equal to 1.2, where D1 is the diameter of the first through-hole electrode and D2 is the distance between two adjacent first through-hole electrodes among a plurality of first through-hole electrodes.

8. The multilayer electronic component according to claim 7, in, The ratio of D2 to D1 is less than or equal to 2.

5.

9. The multilayer electronic component according to claim 1, in, The first external electrode is configured to extend from the third surface to both the first surface and the second surface. The second external electrode is configured to extend from the fourth surface to both the first and second surfaces. The first through-hole electrode is exposed on the first surface and the second surface and is connected to the first external electrode. The second through-hole electrode is exposed on the first surface and the second surface and is connected to the second external electrode.

10. The multilayer electronic component according to claim 1, in, The first inner electrode includes a first main portion and a first lead-out portion. The first main portion is disposed in the stacking area and stacked with the second inner electrode. The first lead-out portion is disposed in the first edge area and extends from the first main portion and exposes the third surface. The second inner electrode includes a second main portion and a second lead-out portion. The second main portion is disposed in the stacking area and stacked with the first inner electrode. The second lead-out portion is disposed in the second edge area and extends from the second main portion and is exposed to the fourth surface.

11. The multilayer electronic component according to claim 1, in, In the cross-sections of the main body in the second direction and the third direction, the cross-sections of the first through-hole electrode and the second through-hole electrode are circular.

12. The multilayer electronic assembly according to claim 10, in, The first through-hole electrode is connected to multiple first leads of multiple first inner electrodes and spaced apart from multiple second inner electrodes, and The second through-hole electrode is connected to a plurality of second leads of a plurality of second inner electrodes and is spaced apart from a plurality of first inner electrodes.

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