Electronic device

Abstract

A heat sink and a plug housing are brought into contact with each other with little sliding with a simple structure. In an electronic device (10), a heat sink (51) is supported so as to be movable in a first direction with respect to a socket housing (61), a contact surface (25) of a plug housing (21) and a heat discharge surface of the heat sink (51) are formed as inclined surfaces, a pressing unit (63) is disposed between the heat sink (51) and the socket housing (61), and a guide portion (cam groove (62)) is formed in the socket housing (61). The heat sink (51) has a guide portion (57) that restricts movement of the heat sink (51) in a negative second direction when the heat sink (51) is positioned in a positive first direction with respect to the socket housing (61), and restricts movement of the heat sink (51) in the positive second direction when the heat sink (51) is positioned in the negative first direction with respect to the socket housing (61). The guided part is guided by a guide part (cam groove (62)) formed in the socket housing (61).

Description

Technical Field

[0001] This disclosure relates to an electronic device. Background Technology

[0002] In recent years, due to the increased communication speed and processing power requirements, the power consumption of electronic devices has increased, thus necessitating higher heat dissipation efficiency. Therefore, there is a demand for electronic devices, such as optical transceivers equipped with heat sinks, that can achieve efficient heat dissipation simply through solid-to-solid contact.

[0003] The structure of such an electronic device is disclosed, for example, in Patent Document 1, etc. For example... Figure 31 as well as Figure 32 As shown, in the optical transceiver (10) disclosed in Patent Document 1 below as a conventional electronic device, the contact surfaces (15a, 14a) between the heat sink (15) and the transceiver housing (14) are inclined surfaces, and a soft heat-conducting sheet (18) is attached to the contact surface (15a, 14a) of either the heat sink (15) or the transceiver housing (14). The heat sink (15) is supported such that it can move within a predetermined range in the front-back and vertical directions relative to the retainer (12) according to the insertion of the transceiver housing (14), and is inserted into the transceiver housing (14) without rubbing the contact surface of the heat-conducting sheet (18). At the final insertion position of the transceiver housing (14), the contact surfaces of the heat sink (15) and the transceiver housing (14) are pressed against each other through the heat-conducting sheet (18). Furthermore, reference numerals related to the description in the prior art documents are distinguished from the embodiments of this disclosure by using parentheses.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2009-152427 Summary of the Invention

[0007] (a) Technical problems to be solved

[0008] However, in the optical transceiver (10) disclosed in the aforementioned patent document 1, since the heat sink (15) is supported so that it can move within a specified range in the front-back direction and the up-down direction relative to the retainer (12) according to the insertion position of the transceiver frame (14), a pressure spring (17a, 17b) is required. In order to avoid friction with the heat-conducting plate (18), a structure such as a locking protrusion (19) and a locking hole (20) is also required, which is a complex structure.

[0009] Therefore, the object of the present invention is to provide an electronic device that enables a heat sink (or a heat-conducting plate if a heat-conducting plate is installed) to make almost non-slip contact with the plug housing through a simple structure.

[0010] (II) Technical Solution

[0011] The electronic device disclosed herein is characterized by comprising: a plug connector including a plug housing and a plug outer shell; a socket housing having an opening for inserting and removing the plug connector; and a heat sink, which is provided via a socket housing mounted on the socket housing, thereby being movably disposed relative to the socket housing. When the plug connector is inserted into the opening of the socket housing and becomes engaged, the electronic device contacts the heat dissipation surface of the heat sink through the contact surface of the plug housing, thereby the heat sink dissipates heat generated from the plug connector. The insertion / removal direction of the plug connector relative to the opening of the socket housing is defined as a first direction, and the removal direction of the plug connector relative to the opening is defined as a positive first direction, and the insertion direction is defined as a negative first direction. Simultaneously, a direction orthogonal to the first direction is defined as a second direction, and the heat sink is movably disposed relative to the socket housing in the engaged state. The direction in which the heat dissipation surface of the radiator is disposed on the plug housing is defined as the positive second direction. When the direction in which the plug housing is disposed relative to the heat dissipation surface of the radiator is defined as the negative second direction, the radiator is supported so that it can move relative to the socket housing in the first direction. Both the contact surface of the plug housing and the heat dissipation surface of the radiator are formed as inclined surfaces with an inclination relative to the first direction. A pressing unit is disposed between the radiator and the socket housing. The pressing unit presses the radiator relative to the socket housing in the positive first direction. A guide portion is formed in the socket housing. The guide portion restricts the movement of the radiator in the negative second direction when the radiator is in the positive first direction relative to the socket housing, and restricts the movement in the positive second direction when the radiator is in the negative first direction relative to the socket housing. The radiator has a guided portion, which is guided by the guide portion formed in the socket housing.

[0012] Furthermore, in the electronic device disclosed herein, the guiding portion can be formed as a cam groove with a groove shape, and the guided portion can be formed as a cylindrical protrusion with a groove shape embedded in the cam groove. When the second direction dimension between the negative second direction portion of the cam groove on the positive first direction side and the positive second direction portion of the cam groove on the negative first direction side is set as α, and the diameter dimension of the cylindrical protrusion shape constituting the cylindrical protrusion, i.e., the second direction dimension, is set as β, the following mathematical formula holds: α≒β.

[0013] That is, in the electronic device disclosed herein, before the plug connector is inserted into the opening of the socket housing, the heat sink is pushed in the positive first direction by a pressing unit that pushes it in the pull-out direction, i.e., the positive first direction, and the cylindrical protrusion abuts against the negative second direction portion of the cam groove, thereby placing the heat sink in a position separated from the plug housing. If the plug connector is inserted into the opening of the socket housing in the negative first direction from this state, the contact surface of the heat sink and the inclined surface of the heat dissipation surface of the plug housing come into contact with each other during the engagement. If the plug connector is further pressed in the negative first direction from the state of the inclined surfaces coming into contact with each other, the cylindrical protrusion of the heat sink abuts against the positive second direction portion of the cam groove and is pushed towards the plug housing side, i.e., the negative second direction side. Since this structure does not require the pressure spring (17a, 17b), engaging protrusion (19), engaging hole (20) and other structures required by the prior art, the structure is simple and easy to manufacture, and therefore the cost is low. Furthermore, when the plug connector is pulled out from the opening of the socket housing, the pressing unit presses the heat sink in the first positive direction, and the inclined surfaces of the heat sink and the plug housing separate from each other. As a result, the cylindrical protrusion moves in the first positive direction in the cam groove, thereby returning the heat sink to the position separated from the plug housing before engagement.

[0014] Furthermore, in the electronic device disclosed herein, a locking part as a fixing unit is formed in the plug housing, and a locked part as a fixing unit is formed in the socket housing. When the plug connector is inserted into the opening of the socket housing and becomes a mating state, the locking part engages with the locked part to resist the pressing force applied by the pressing unit and maintain the mating state of the plug connector relative to the socket housing.

[0015] Furthermore, in the electronic device disclosed herein, the pressing unit can be configured as a component integral with the socket housing.

[0016] Furthermore, in the electronic device disclosed herein, the pressing unit can be configured as a component separate from the socket housing.

[0017] Furthermore, in the electronic device disclosed herein, the pressing unit can be configured as a cantilever spring formed in the shape of a cantilever beam or a double-support spring formed in the shape of a double-support beam.

[0018] In addition, in the electronic device disclosed herein, a heat-conducting fin can be provided on the heat dissipation surface of the heat sink.

[0019] Furthermore, in the electronic device disclosed herein, the groove shape of the guide portion formed as a cam groove can be formed into an approximately L-shaped form.

[0020] (III) Beneficial Effects

[0021] According to this disclosure, an electronic device can be provided that allows a heat sink (or heat-conducting plate if a heat-conducting plate is installed) to make almost non-slip contact with the plug housing through a simple structure. Attached Figure Description

[0022] Figure 1 This is a perspective view showing the overall structure of the electronic device according to this embodiment, and is a view of the socket connector and plug connector constituting the electronic device in a mated state when viewed from the upper left of the front surface.

[0023] Figure 2 This is a perspective view showing the overall structure of the electronic device according to this embodiment, and is a view of the socket connector and plug connector constituting the electronic device in an unfitted state when viewed from the upper left of the front surface.

[0024] Figure 3 This is a perspective view of the socket connector of this embodiment as viewed from the upper left of the front surface.

[0025] Figure 4 It means to Figure 3 The diagram shows an exploded perspective view of the structural components of the socket connector of this embodiment after disassembly.

[0026] Figure 5 This is a perspective view of the heat sink, a structural component of the socket connector in this embodiment, as viewed from the upper left of the front surface.

[0027] Figure 6 This is a perspective view of the heat sink, a structural component of the socket connector in this embodiment, as viewed from the lower left of the front surface.

[0028] Figure 7 This is a left-side view of the heat sink, which is a structural component of the socket connector in this embodiment.

[0029] Figure 8 This is a perspective view of the socket housing, a structural component of the socket connector in this embodiment, viewed from the upper left front surface.

[0030] Figure 9 This is a perspective view of the socket housing, a structural component of the socket connector in this embodiment, viewed from the lower left rear surface.

[0031] Figure 10 This is a left-side view of the socket housing, which is a structural component of the socket connector in this embodiment.

[0032] Figure 11 This is a perspective view of the plug connector of this embodiment as viewed from the upper left of the front surface.

[0033] Figure 12This is a perspective view of the plug connector of this embodiment as viewed from the upper right rear surface.

[0034] Figure 13 This is a top view of the plug connector of this embodiment.

[0035] Figure 14 It means Figure 13 Left side view of the longitudinal section of the XIV-XIV line section.

[0036] Figure 15 This is a diagram used to illustrate the operation of the electronic device of this embodiment. It is a diagram showing the state in which the plug connector is not inserted into the opening of the socket housing and is not engaged, viewed from the upper left of the front surface.

[0037] Figure 16 This is a diagram used to illustrate the operation of the electronic device of this embodiment. It is a top view of the plug connector not being inserted into the opening of the socket housing and not being engaged.

[0038] Figure 17 This is a diagram used to illustrate the operation of the electronic device of this embodiment. It is a left-side view of the plug connector not being inserted into the opening of the socket housing and not being engaged.

[0039] Figure 18 It means Figure 16 Left side view of the longitudinal section of the XVIII-XVIII line section.

[0040] Figure 19 It means Figure 17 A top view of the cross section along the XIX-XIX line.

[0041] Figure 20 This diagram illustrates the operation of the electronic device according to this embodiment. It shows the state of the plug connector being inserted into the opening of the socket housing from the upper left of the front surface during the engagement process.

[0042] Figure 21 This is a diagram used to illustrate the operation of the electronic device of this embodiment, and is a top view of the state in which the plug connector is inserted into the opening of the socket housing during engagement.

[0043] Figure 22 This is a diagram used to illustrate the operation of the electronic device of this embodiment. It is a left-side view of the state in which the plug connector is inserted into the opening of the socket housing during engagement.

[0044] Figure 23 It means Figure 21 Left side view of the longitudinal section of the XXIII-XXIII line section.

[0045] Figure 24 It means Figure 22A bottom view of the cross section along line XXIV-XXIV.

[0046] Figure 25 This is a diagram used to illustrate the operation of the electronic device of this embodiment. It is a diagram showing the plug connector fully inserted into the opening of the socket housing from the upper left of the front surface.

[0047] Figure 26 This is a diagram used to illustrate the operation of the electronic device of this embodiment. It is a top view showing the plug connector fully inserted into the opening of the socket housing in a mating state.

[0048] Figure 27 This is a diagram used to illustrate the operation of the electronic device of this embodiment. It is a left-side view of the plug connector fully inserted into the opening of the socket housing in a mating state.

[0049] Figure 28 It means Figure 26 Left side view of the longitudinal section of the XXVIII-XXVIII line section.

[0050] Figure 29 It means Figure 27 A top view of the cross section along line XXIX-XXIX.

[0051] Figure 30 This is a diagram used to explain the operation of the electronic device of this embodiment, showing the positional relationship between the cylindrical protrusion and the cam groove.

[0052] Figure 31 This is a schematic diagram illustrating a heat dissipation device included in an optical transceiver, which is a prior art electronic device.

[0053] Figure 32 This is a diagram illustrating a structural example of removing an optical transceiver from an existing electronic device.

[0054] Explanation of reference numerals in the attached figures:

[0055] 10: Electronic device; 20: Plug connector; 21: Plug housing; 22: Plug outer shell; 23: Cable mounting part; 24: Locking part (fixing unit); 24a: Claw shape; 25: Contact surface; 26: Plug opening; 27: Plug side mating terminal; 30: Socket connector; 31: Base plate; 32: Mounting hole; 41: Socket outer shell; 42: Opening; 43: Socket side mating terminal; 44: Top open hole; 45: Locked part (fixed unit formed by horizontal wall surface and hole shape); 51: Heat sink; 52: Base part; 53: Fin-shaped part; 54: Protrusion; 56: Heat conducting plate (heat dissipation surface); 57: Cylindrical protrusion (guided part); 61: Socket housing; 62: Cam groove (guided part); 63: Pressing unit (cantilever spring formed by cantilever beam shape); 65: Limiting part. Detailed Implementation

[0056] The preferred embodiments for implementing this disclosure will now be described using the accompanying drawings. Furthermore, for ease of explanation, a first direction, a second direction, and a third direction are defined in the drawings. In this specification, the first direction is the front-to-back direction. In the drawings, the front-to-back direction is represented by the Y direction. Specifically, the front direction is designated as the +Y direction, and the rear direction as the -Y direction. The first direction serves as the insertion / removal direction between the socket housing 41 and the plug connector 20 of the electronic device 10 constituting this embodiment. That is, the direction in which the plug connector 20 moves relative to the socket housing 41 in the +Y direction (front) is the removal direction, and the direction in which the plug connector 20 moves relative to the socket housing 41 in the -Y direction (rear) is the insertion direction.

[0057] In addition, in this specification, the second direction is the vertical direction. In the figures, the vertical direction is represented by the Z direction. Specifically, the upper direction is designated as the +Z direction, and the lower direction as the -Z direction. The second direction is a direction orthogonal to the first direction, and when the plug connector 20 is inserted into the opening 42 of the socket housing 41 constituting the electronic device 10 of this embodiment, the direction in which the heat dissipation surface of the heat sink 51 is disposed relative to the contact surface 25 of the plug housing 21 is the positive second direction (+Z direction (upper)), and the direction in which the contact surface 25 of the plug housing 21 is disposed relative to the heat dissipation surface of the heat sink 51 is the negative second direction (-Z direction (lower)).

[0058] Furthermore, in this specification, the third direction is the left-right direction. In the figures, the left-right direction is represented as the X direction. Specifically, the left is designated as the +X direction, and the right as the -X direction. However, the first direction (Y direction), the second direction (Z direction), and the third direction (X direction) defined in this specification do not limit the direction in which the electronic device 10 of this embodiment is used. The electronic device 10 of this embodiment can be used in all directions.

[0059] First, refer to Figures 1-14 as well as Figure 30 The overall structure of the electronic device 10 in this embodiment will be described. For example... Figure 1 as well as Figure 2 As shown, the electronic device 10 of this embodiment is configured to have a plug connector 20 and a socket connector 30. The plug connector 20 is pluggable and detachable relative to the socket connector 30.

[0060] like Figures 11-14 As shown, the plug connector 20 is configured to have a plug housing 21 and a plug outer shell 22. The plug housing 21 is made of a conductive metallic material, specifically, such as... Figure 12 As shown, a plug-side mating terminal 27 is disposed inside it. On the other hand, the plug housing 22 is made of a non-conductive material such as resin or elastomer and is configured to cover the outer periphery of the plug housing 21.

[0061] A cable mounting section 23 for mounting cables, optical fibers, and other similar devices is provided on the front side of the plug housing 22. By mounting cables (not shown) via the cable mounting section 23 and connecting them to the plug-side fitting terminal 27, the exchange of electrical signals, power, optical information, etc., can be achieved.

[0062] Furthermore, a locking portion 24, serving as a fixing unit, is formed in the plug housing 22. This locking portion 24 maintains the engagement state between the plug connector 20 and the socket connector 30, as described later. The locking portion 24 in this embodiment has a double-support beam shape and a claw-shaped portion 24a formed in its central portion. Therefore, when the plug connector 20 is inserted into the socket housing 41, it contacts the locking portion 45, which is a fixing unit formed in the socket housing 41, causing the claw-shaped portion 24a in the central portion to bend downwards. Furthermore, if it passes the locking portion 45, the claw-shaped portion 24a returns to its original position and engages with the locking portion 45, thus fulfilling its function as a fixing unit. Conversely, when in the engaged state, when the user presses the locking part 24 from above in the downward-Z direction, the claw shape 24a in the center flexes and moves downward, releasing the engagement with the locked part 45 of the socket housing 41 (described later). Therefore, by pulling the plug connector 20 out of the engaged state with the socket connector 30 from the socket housing 41 in this state, the user can release the plug connector 20 from the engaged state with the socket connector 30.

[0063] Furthermore, a plug opening 26 is formed on the upper rear side of the plug connector 20, opening upwards. Through this plug opening 26, the plug housing 21, which is disposed inside the plug housing 22, is exposed upwards. This exposed portion becomes the contact surface 25 of the plug housing 21. The heat-conducting fins 56 disposed on the heat dissipation surface of the heat sink 51 (described later) contact the contact surface 25 on the upper surface of the plug housing 21, which is open upwards through the plug opening 26, thereby enabling the heat sink 51 to dissipate heat generated from the plug connector 20.

[0064] In addition, such as Figure 14 As shown, the contact surface 25 of the plug housing 21 is formed as an inclined surface with an angle relative to the first direction of this disclosure, namely the front-rear direction (±Y direction). In this embodiment, the contact surface 25 of the plug housing 21 is formed as an inclined surface that descends rearward (-Y direction).

[0065] like Figure 3 as well as Figure 4 As shown, the socket connector 30 is configured to have a base plate 31, a socket housing 41, a heat sink 51, and a socket shell 61.

[0066] The substrate 31 includes printed circuits (not shown) and is configured to exchange electrical signals, power, optical information, etc., by being electrically connected to a socket housing 41 mounted on the upper surface of the substrate 31.

[0067] In addition, especially as Figure 4 As shown, a plurality of mounting holes 32 are formed on the substrate 31. By inserting the legs, terminals, etc. of the socket housing 41 and the socket housing 61 into the plurality of mounting holes 32, these components are fixed to the substrate 31.

[0068] The socket housing 41 has an opening 42 that opens to the front side. By inserting or removing the plug connector 20 relative to the opening 42, the plug connector 20 and the socket connector 30 can be in an engaged state and a disengaged state.

[0069] Additionally, the socket housing 41 is internally equipped with a socket-side mating terminal 43. For example... Figure 18 , Figure 23 as well as Figure 28 As shown, the socket-side mating terminal 43 is surface-mounted to the substrate 31 by soldering, enabling electrical connection to the substrate 31, which includes printed circuits (not shown). Furthermore, when the plug connector 20 and the socket connector 30 are in a mating state, the socket-side mating terminal 43 contacts the plug-side mating terminal 27, thus allowing electrical signals, power, and optical information from cables (not shown) to be transferred to the substrate 31 via the plug connector 20 and the socket connector 30.

[0070] Furthermore, an upward-facing opening 44 is formed at the center of the upper part of the socket housing 41. This upward-facing opening 44 is hole-shaped, and is designed to allow the contact surface 25 of the plug housing 21, which is inserted into the opening 42 of the socket housing 41, to face and contact the heat dissipation surface (heat-conducting fin 56) of the heat sink 51, which will be described later.

[0071] In addition, such as Figure 4 As shown, a locking portion 45, serving as a fixed unit, is formed at the upper front of the socket housing 41. This locking portion 45 engages with the locking portion 24 of the plug connector 20. The locking portion 45 is formed with a hole shape into which the claw shape 24a constituting the locking portion 24 can be inserted, and a horizontal wall surface located in front of the hole shape. Therefore, when the plug connector 20 is inserted into the socket housing 41, the claw shape 24a constituting the locking portion 24 contacts the horizontal wall surface of the locking portion 45 constituting the socket housing 41 and flexes downward. If it passes over the horizontal wall surface of the locking portion 45, the claw shape 24a returns to its original position and engages with the hole shape of the locking portion 45, thus functioning as a fixing unit. Conversely, when in the engaged state, when the user presses the locking part 24 from above in the Z direction, the claw shape 24a flexes and moves downward, disengaging from the hole shape constituting the locked part 45 and releasing the engagement state. Therefore, by pulling the plug connector 20 out of the engagement state with the socket connector 30 from the socket housing 41 in this state, the user can release the plug connector 20 from the engagement state with the socket connector 30.

[0072] Especially Figures 5-7 As shown, the heat sink 51 is configured to have a base portion 52 in the shape of a flat plate at the bottom, and fin-shaped portions 53 formed with multiple walls erected from the base portion 52 upwards. The heat sink 51 is formed of a metal material with high thermal conductivity, such as aluminum alloy. Due to the presence of the fin-shaped portions 53 with multiple walls, the heat sink 51 has a large surface area, thus becoming a component with high heat dissipation efficiency.

[0073] Furthermore, the plug housing 21, which is the object of heat dissipation for the heat sink 51, is located below the heat sink 51. Therefore, a rectangular protrusion 54 is formed on the lower surface of the base portion 52 constituting the heat sink 51. The lower surface of this protrusion 54 is the heat dissipation surface of the heat sink 51, and therefore a heat-conducting fin 56 is provided thereon. By providing the heat-conducting fin 56 at the contact point with the plug housing 21, which is the object of heat dissipation, thermal resistance (difficulty in heat transfer) can be reduced, and a higher heat dissipation effect can be achieved.

[0074] In addition, such as Figure 7As shown, the lower side of the heat-conducting fin 56, which serves as the heat dissipation surface of the heat sink 51, is formed as an inclined surface with an angle relative to the first direction of this disclosure, namely the front-rear direction (±Y direction). In this embodiment, the heat dissipation surface on the lower surface side of the protrusion 54 constituting the heat sink 51 is formed as an inclined surface that descends rearward (-Y direction). Furthermore, the heat dissipation surface of the heat sink 51 and the contact surface 25 of the plug housing 21 are inclined surfaces that are arranged opposite each other in the mating state, and their inclination angles are formed to be approximately the same. Therefore, the configuration is such that when the plug connector 20 is inserted into the opening 42 of the socket housing 41 and is in the mating state, the heat dissipation surface (heat-conducting fin 56) of the heat sink 51 and the contact surface 25 of the plug housing 21 can contact each other without gap.

[0075] Furthermore, cylindrical protrusions 57, each consisting of four cylindrical protrusions protruding in the left and right directions, are formed on the left and right sides of the base portion 52 of the radiator 51. These four cylindrical protrusions 57 form the guided portions of this disclosure. The four cylindrical protrusions 57 become components that are embedded in the guide portions of this disclosure, namely the cam grooves 62, which are formed in the socket housing 61 described later.

[0076] The socket housing 61 is a component for mounting the heat sink 51 in a movable state relative to the socket outer shell 41. Specifically, the socket housing 61 has two cam grooves 62 on each of its left and right sides, totaling four. These four cam grooves 62 form the guide portions of this disclosure. The heat sink 51 is supported within the range of the four cam grooves 62 by engaging its four cylindrical protrusions 57 with the four cam grooves 62, allowing it to move relative to the socket housing 61. Furthermore, the groove shape of the four cam grooves 62 is approximately L-shaped.

[0077] In addition, such as Figures 8-10 As shown, the socket housing 61 has a pressing unit 63 for pressing the heat sink 51, which is mounted using the cam groove 62, relative to the socket housing 61 in a positive first direction, i.e., forward (+Y direction). In this embodiment, the pressing unit 63 is formed as a cantilever spring consisting of a cantilever beam shape of a component integral with the socket housing 61.

[0078] In addition, such as Figures 8-10 As shown, the socket housing 61 has a limiting part 65, which contacts the heat sink 51 when the heat sink 51 mounted by the cam groove 62 is pressed forward (+Y direction) by the pressing force of the pressing unit 63, thereby defining the stopping position of the heat sink 51. The limiting part 65 defines the range of movement of the heat sink 51 pressed by the pressing unit 63 in the first direction, i.e., the forward (+Y direction).

[0079] The socket housing 61 of this embodiment has the structure described above, and is therefore configured such that, with the heat sink 51 installed using the cam groove 62, it is inserted downwards (in the -Z direction) relative to the socket housing 41 from above, thereby completing the socket connector 30.

[0080] Here, refer to Figure 30 The dimensional conditions of the cam groove 62 formed in the socket housing 61 and the cylindrical protrusion 57 embedded in the cam groove 62 will be explained. In this embodiment, the configuration is such that when the second direction dimension between the negative second direction portion (lower portion) of the cam groove 62 on the positive first direction side (front (+Y direction) side) and the positive second direction portion (upper portion) of the cam groove 62 on the negative first direction side (rear (-Y direction) side) is set as α, and the diameter dimension of the cylindrical protrusion shape constituting the cylindrical protrusion 57, i.e., the second direction dimension (the dimension in the vertical direction (±Z direction)), is set as β, the following mathematical formula holds: α≒β. Therefore, the cam groove 62 formed in the socket housing 61 functions as follows: when the radiator 51 is located in the positive first direction (front (+Y direction)) relative to the socket housing 61, it restricts the movement of the radiator 51 in the negative second direction (downward (-Z direction)); when the radiator 51 is located in the negative first direction (rear (-Y direction)) relative to the socket housing 61, it restricts the movement in the positive second direction (upward (+Z direction)). In other words, the radiator 51 of this embodiment, which is supported so as to be able to move relative to the socket housing 61 in the first direction (front-rear direction (±Y direction)), is configured to move in a direction parallel to the first direction (front-rear direction (±Y direction)).

[0081] Above, refer to Figures 1-14 as well as Figure 30 The overall structure of the electronic device 10 of this embodiment has been described. Next, the following will be... Figures 15-29 The specific operation of the electronic device 10 of this embodiment will be described with reference to the accompanying drawings. Figures 15-19 The image shows the plug connector 20 not inserted into the opening 42 of the socket housing 41 and thus not engaged. Additionally, in... Figures 20-24 The image shows the plug connector 20 in a partially engaged state when inserted into the opening 42 of the socket housing 41. Furthermore, in... Figures 25-29 The image shows the plug connector 20 fully inserted into the opening 42 of the socket housing 41 in a mating state. Furthermore, in... Figure 30 The image shows the positional relationship between the cylindrical protrusion 57 and the cam groove 62.

[0082] exist Figures 15-19 The plug connector 20 shown is not inserted into the opening 42 of the socket housing 41 and is not engaged, especially in the following state: Figure 18As shown, the heat sink 51 is pushed forward (+Y direction) by the pressing unit 63 of the socket housing 61 in the first direction. At this time, the front of the heat sink 51 abuts against the limiting part 65, and the cylindrical protrusions 57 provided on the left and right sides of the heat sink 51 are inserted into the cam grooves 62 provided in the socket housing 61. However, in the un-engaged state, the lower part (-Z direction) of the cylindrical protrusion 57 enters the groove on the first direction side (front (+Y direction) side) of the cam groove 62 provided in the socket housing 61, and is restricted to not move downward (-Z direction) from the predetermined vertical position (Z direction position).

[0083] In addition, such as Figure 18 As shown, the heat sink 51 has a protrusion 54 on its lower surface side, and a heat-conducting plate 56 is provided on the heat dissipation surface constituting the protrusion 54. The heat-conducting plate 56 constituting the heat dissipation surface of this disclosure is formed as an inclined surface that descends rearward (in the -Y direction). On the other hand, regarding the plug connector 20, the contact surface 25 of the plug housing 21 is exposed upward so that the heat-conducting plate 56 can contact it. The contact surface 25 of the plug housing 21 is also inclined in the same way as the heat dissipation surface (heat-conducting plate 56) of the heat sink 51. Since the heat dissipation surface (heat-conducting plate 56) of the heat sink 51 and the contact surface 25 of the plug housing 21 are formed with approximately the same inclination angle and are formed as inclined surfaces facing each other in the mating state, they are configured to be able to contact each other without gap when the two inclined surfaces are in contact.

[0084] exist Figures 20-24 The diagram shows the state from when the plug connector 20 is inserted into the opening 42 of the socket housing 41 before it is fully engaged. Especially in... Figure 23 The diagram illustrates the intermediate engagement state, where the contact surface 25 of the plug housing 21 first comes into contact with the heat-conducting fin 56, which serves as the heat dissipation surface of the heat sink 51, during the insertion of the plug connector 20 into the opening 42 of the socket housing 41. Up to this point, the heat sink 51 is in the same position as in the unengaged state. Furthermore, in... Figure 23 In the state shown, the locking part 24 of the plug connector 20 is bent downward in a claw shape 24a by contacting the horizontal wall surface constituting the locked part 45, and the locking part 24 and the locked part 45 are still in a non-engaged state.

[0085] exist Figures 25-29 The diagram shows a further deepening of the engagement from the intermediate engagement state, with the plug connector 20 fully inserted into the opening 42 of the socket housing 41. If the engagement is further deepened from the intermediate engagement state, the heat-conducting fin 56, which serves as the heat dissipation surface of the heat sink 51, remains in contact with the contact surface 25 of the plug housing 21, and the heat sink 51 and the plug connector 20 move rearward (in the -Y direction) together.

[0086] At this time, the cylindrical protrusion 57 of the radiator 51 also moves rearward (in the -Y direction) in the cam groove 62. If the movement begins, the cylindrical protrusion 57 is immediately restricted by the cam groove 62 to move upward (in the +Z direction), and the radiator 51 and the plug connector 20 move rearward (in the -Y direction) in parallel. Figure 30 As shown, the actuation mechanism is achieved by making the vertical dimension (±Z direction dimension) α of the lower part (-Z direction part) of the cam groove 62 on the front side (+Y direction side) and the upper part (+Z direction part) on the rear side (-Y direction side) approximately the same as the diameter dimension β of the cylindrical protrusion 57 (set as α≒β).

[0087] Furthermore, when the engagement is deepened further from the aforementioned intermediate engagement state, the load applied to the heat sink 51 from the pressing unit 63 on the forward side (+Y direction side) increases according to the amount of movement of the heat sink 51 in the rearward (-Y direction). The load from the pressing unit 63, the downward (-Z direction) force on the cylindrical protrusion 57 of the heat sink 51 from the cam groove 62, and the force on the heat dissipation surface (heat-conducting fin 56) of the heat sink 51 from the contact surface 25 of the plug housing 21 are balanced by each other, thereby maintaining contact between the heat-conducting fin 56 and the plug housing 21.

[0088] In the interlocking state, such as Figure 29 As shown, the heat sink 51 causes the pressing unit 63 to flex, thus exerting a force on the plug connector 20 side in a direction toward disengagement towards the forward (+Y direction). However, as Figure 28 As shown, the locking part 24 and the hole shape constituting the locked part 45 are in an engaged state, so the force in the disengagement direction acting on the plug connector 20 side is borne by the locking part 24 and the locked part 45 and the engagement state is maintained.

[0089] Furthermore, regarding this type of electronic device, due to the dimensional variations of the various components, including the locking part 24, deviations in the fitting depth are unavoidable. Assuming the heat sink 51 is fixed to the socket housing 61 and cannot move in the front-back and up-down directions (YZ directions), the components have almost no elastic displacement. Therefore, the contact force between the heat-conducting plate 56 and the plug housing 21 will vary significantly due to the deviation in the fitting depth.

[0090] However, in the case of the electronic device 10 of this embodiment, the heat sink 51 can move together with the plug connector 20 in the forward and backward direction (±Y direction). Therefore, by performing elastic displacement through the cantilever spring of the pressing unit 63, the deviation of the contact force between the heat-conducting plate 56 and the plug housing 21 caused by the above-mentioned deviation can be reduced.

[0091] In addition, from the midpoint of engagement to the engagement state, the heat sink 51 and the plug connector 20 move together in a parallel forward and backward direction (±Y direction), so that the heat-conducting plate 56 can make contact with the plug housing 21 with almost no slippage.

[0092] By performing the actions as described above, the following can be achieved: Figures 25-29 The plug connector 20 shown is fully inserted into the opening 42 of the socket housing 41 in a mating state.

[0093] Furthermore, the cam groove 62 of this embodiment is formed into an approximately L-shaped groove. From the above-described operation, the groove shape of the lower (-Z direction) part of the cam groove 62 is recessed to a length greater than the required length. However, this shape is adopted to make it easier to assemble the heat sink 51 into the socket housing 61.

[0094] The above describes the operation of inserting the plug connector 20 into the opening 42 of the socket housing 41. Next, the disengagement operation of pulling the plug connector 20 out of the opening 42 of the socket housing 41 will be described.

[0095] During the disengagement operation, the user presses the locking part 24 downwards (in the -Z direction) from above, causing the claw shape 24a to flex and move downwards, thus releasing the engagement between the locking part 24 and the locked part 45. While maintaining this state, the user pulls out the plug connector 20 forward (in the +Y direction) to perform the disengagement operation. At this time, the pressing unit 63 presses the heat sink 51 forward (in the +Y direction), and the cylindrical protrusion 57 of the heat sink 51 moves forward (in the +Y direction) within the groove of the cam groove 62, thereby returning the heat sink 51 to the state of being engaged. Similarly, during the disengagement operation, when the heat-conducting plate 56, which serves as the heat dissipation surface, contacts the contact surface 25 of the plug housing 21, the heat sink 51 and the plug connector 20 move forward together (in the +Y direction), so that the heat-conducting plate 56 and the plug housing 21 can complete the disengagement operation with almost no slippage.

[0096] According to the electronic device 10 of this embodiment described above, when the plug connector 20 is inserted into the opening 42 of the socket housing 41 and becomes engaged, the contact surface 25 of the plug housing 21 and the heat dissipation surface (heat-conducting plate 56) of the heat sink 51 make contact with each other with almost no friction, thereby enabling the heat sink 51 to efficiently dissipate heat generated from the plug connector 20. Furthermore, according to this embodiment, a mechanism for the heat sink 51 to efficiently dissipate heat generated from the plug connector 20 can be achieved with a simple structure.

[0097] The preferred embodiments of this disclosure have been described above, but the technical scope of this disclosure is not limited to the scope described in the above embodiments. Various changes or improvements can be made to the above embodiments.

[0098] For example, in the above-described embodiment, the pressing unit 63 is a cantilever spring formed in the shape of a cantilever beam in the socket housing 61. However, the pressing unit of this disclosure can be formed as a double-support spring formed in the shape of a double-support beam.

[0099] Furthermore, for example, in the above-described embodiment, the pressing unit 63 is configured as an integral part of the socket housing 61. However, the pressing unit of this disclosure may also be configured as a separate part from the socket housing. Specifically, by forming the pressing unit of this disclosure as a coil spring or leaf spring separate from the socket housing 61 and disposed between the socket housing 61 and the heat sink 51, an electronic device that can perform the same function as the above-described embodiment can be realized.

[0100] Additionally, for example, in the above embodiment, a structure is illustrated where a heat-conducting plate 56 is provided relative to the heat dissipation surface of the heat sink 51 that abuts against the contact surface 25 of the plug housing 21. However, in the electronic device disclosed herein, the provision of the heat-conducting plate 56 may be omitted.

[0101] Furthermore, for example, in the above-described embodiment, an example is shown where the guide portion formed on the socket housing 61 is formed as a cam groove 62 with a groove shape, and the guided portion formed on the heat sink 51 is formed as a cylindrical protrusion 57 with a cylindrical protrusion shape, which is embedded in the groove shape of the cam groove 62 serving as the guide portion. However, regarding the shape of the guide portion and the guided portion of this disclosure, all methods can be adopted within the range that can achieve the same effect as the above-described embodiment.

[0102] Furthermore, for example, in the above embodiment, the electronic device 10 was described as an optical transceiver; however, this embodiment is merely one example of the electronic device that can be implemented using the present disclosure. The electronic device of the present disclosure can be applied to all types of electronic devices within the scope of being able to achieve the same effects as those achieved in the above embodiment.

[0103] As is evident from the claims, the manner in which such changes or improvements are made is also included within the scope of this disclosure.

Claims

1. An electronic device, characterized in that, have: A plug connector, comprising a plug housing and a plug outer shell; A socket housing having an opening for inserting and removing the plug connector; and A radiator, which is provided via a socket housing mounted on the socket housing, is thus movably disposed relative to the socket housing. When the electronic device is in a mated state by inserting the plug connector into the opening of the socket housing, the heat dissipation surface of the heat sink comes into contact with the contact surface of the plug housing, thereby allowing the heat sink to dissipate heat generated from the plug connector. Specifically, the insertion / removal direction of the plug connector relative to the opening of the socket housing is defined as the first direction, and the removal direction of the plug connector relative to the opening is defined as the positive first direction, while the insertion direction is defined as the negative first direction. Meanwhile, when the direction orthogonal to the first direction is defined as the second direction, and the direction in which the heat dissipation surface of the heat sink is configured relative to the heat dissipation surface of the plug housing in the mating state is defined as the positive second direction, and the direction in which the plug housing is configured relative to the heat dissipation surface of the heat sink is defined as the negative second direction, The heat sink is supported so that it can move relative to the socket housing in a first direction. The contact surface of the plug housing and the heat dissipation surface of the heat sink are both formed as inclined surfaces with an angle relative to the first direction. A pressing unit is disposed between the heat sink and the socket housing, the pressing unit pressing the heat sink relative to the socket housing in a positive first direction. A guide portion is formed in the socket housing, which restricts the movement of the heat sink in a negative second direction when the heat sink is located in a positive first direction relative to the socket housing, and restricts the movement in a positive second direction when the heat sink is located in a negative first direction relative to the socket housing. The radiator has a guided portion that is guided by a guide portion formed in the socket housing.

2. The electronic device according to claim 1, characterized in that, The guide portion is formed as a cam groove with a groove shape. The guided portion is formed as a cylindrical protrusion consisting of a groove-shaped cylindrical protrusion that is embedded in the cam groove. The configuration is such that the second direction dimension between the negative second direction portion of the cam groove on the positive first direction side and the positive second direction portion of the cam groove on the negative first direction side is set as α. When the diameter of the cylindrical protrusion that constitutes the cylindrical protrusion, i.e. the second direction dimension, is set as β, the following mathematical formula holds: α≒β.

3. The electronic device according to claim 1 or 2, characterized in that, A locking part, serving as a fixing unit, is formed in the plug housing. A locking part, which serves as a fixed unit, is formed in the socket housing. When the plug connector is inserted into the opening of the socket housing and becomes engaged, the locking part engages with the locked part, thereby resisting the pressing force applied by the pressing unit and maintaining the engagement state of the plug connector relative to the socket housing.

4. The electronic device according to claim 1 or 2, characterized in that, The pressing unit is configured as an integral part of the socket housing.

5. The electronic device according to claim 1 or 2, characterized in that, The pressing unit is configured as a separate component from the socket housing.

6. The electronic device according to claim 1 or 2, characterized in that, The pressing unit is formed as a cantilever spring with a cantilever beam shape or a double-support spring with a double-support beam shape.

7. The electronic device according to claim 1 or 2, characterized in that, A heat-conducting fin is provided on the heat dissipation surface of the radiator.

8. The electronic device according to claim 2, characterized in that, The groove shape of the guide portion, which forms the cam groove, is approximately L-shaped.

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