Display device

Abstract

The invention discloses a display device. A display device according to the present disclosure may include: a substrate including a display area and a non-display area; at least two light emitting regions disposed on the display region and constituting one sub-pixel; the groove part is at least arranged on the outer side of each light emitting area; at least two contact regions disposed to be spaced apart from the respective light emitting regions; a first electrode disposed in each of the light emitting regions; a contact wiring portion provided in each of the contact areas; a light emitting layer disposed on the first electrode; and a second electrode disposed on the light emitting layer and separated in the two light emitting regions by the trench portion, and separated portions of the second electrode may be electrically connected to the contact wiring portions, respectively.

Description

Technical Field

[0001] This disclosure relates to display devices. Background Technology

[0002] Display devices are suitable for a variety of electronic devices, such as TVs, smartphones, laptops, and tablets. To this end, a number of studies have been conducted to develop thinner, lighter, and lower-power display devices.

[0003] Among various display devices that display information as images, organic light-emitting display (OLED) devices are self-emissive elements that emit light themselves without the need for an external light source. OLED devices have advantages such as fast response speed, high luminous efficiency, high brightness, wide viewing angle, high contrast ratio, and excellent color reproduction.

[0004] With the recent increase in demand for high-resolution display devices, the application scope of organic light-emitting display devices is expanding. Summary of the Invention

[0005] During the manufacturing process of organic light-emitting display devices, a decrease in brightness in the display area may occur. One reason for this decrease in brightness may be the appearance of dark spots in the sub-pixels arranged on the display area, thereby increasing the area that does not emit light.

[0006] Dark spots may be caused by defective subpixels that cannot emit light. Defective subpixels may be caused by unwanted reactions, such as from impacts from outside the display device, gases generated inside the display device, or damage to the light-emitting layer containing organic materials caused by moisture or oxygen.

[0007] Even if dark spots appear in some parts of the display area, these dark spots may reduce the image quality provided across the entire display area, thereby reducing user immersion and the reliability of the display device.

[0008] To overcome the above-mentioned shortcomings, the inventors of this disclosure have invented a display device capable of driving defective sub-pixels into normal sub-pixels through various experiments.

[0009] The objective of embodiments of this disclosure is to provide a display device capable of driving defective subpixels as normal subpixels.

[0010] Furthermore, an objective of the embodiments of this disclosure is to provide a display device whose yield can be improved by easily removing dark spots from defective sub-pixels without using laser processing.

[0011] The objectives to be achieved by embodiments of this disclosure are not limited to those described above, and other objectives and advantages of this disclosure not mentioned herein may be understood from the following description and may be more clearly understood from embodiments of this disclosure. Furthermore, it will be readily understood that the objectives and advantages of this disclosure may be achieved by the means set forth in the claims and combinations thereof.

[0012] A display device according to embodiments of the present disclosure may include: a substrate including a display area and a non-display area; at least two light-emitting areas disposed on the display area and forming a sub-pixel; at least a trench portion disposed outside each light-emitting area; at least two contact areas disposed spaced apart from the respective light-emitting areas; a first electrode disposed in each light-emitting area; a contact wiring portion disposed in each contact area; a light-emitting layer disposed on the first electrode; and a second electrode disposed on the light-emitting layer and separated in the two light-emitting areas by the trench portion, wherein the separated portions of the second electrode may be electrically connected to the contact wiring portions respectively.

[0013] According to embodiments of this disclosure, a subpixel that emits light of one color may include a pair of subpixels. With this configuration, even if a defect occurs in one subpixel of the pair, the remaining subpixels in the pair can still emit light, allowing the corresponding subpixel to function as a normal subpixel.

[0014] By setting cathode electrodes and cathode contacts that are separated from each other through grooves, protruding patterns, etc., so that a cathode electrode is connected to each sub-pixel, a pair of sub-pixels that emit light of a certain color can be supplied with electrical voltage separately.

[0015] Therefore, even if one subpixel in a pair of subpixels emitting light of the same color is defective and does not emit light, it can still function normally by supplying electrical voltage to the other subpixel. Thus, the corresponding subpixel can operate normally.

[0016] Therefore, according to the embodiments of this disclosure, repair processes such as laser cutting can be omitted, thereby optimizing the processing steps and increasing the yield of the display device. Furthermore, even if defects occur in some sub-pixels, the corresponding sub-pixels can still operate normally, thereby improving the reliability of the display device.

[0017] Therefore, defects such as reduced brightness caused by dark spots where some sub-pixels do not emit light can be prevented. Thus, the display device can achieve high brightness, allowing it to be driven with low power, thereby reducing power consumption.

[0018] In addition, product reliability can be improved by preventing dark spot defects in the display area, thereby increasing the user's immersion in the screen.

[0019] In addition to the effects mentioned above, this disclosure may also have other effects, which those skilled in the art will clearly recognize from the following description. Attached Figure Description

[0020] Figure 1 This is a plan view of a display device according to an embodiment of the present disclosure;

[0021] Figure 2 It is set in Figure 1 A planar view of examples of pixels in region I;

[0022] Figure 3 It is along Figure 2 A cross-sectional view taken from line II-II' in the diagram;

[0023] Figure 4 It shows the setting Figure 2 A planar view of a sub-pixel in region III;

[0024] Figure 5 It is along Figure 4 A cross-sectional view taken from line IV-IV' in the diagram;

[0025] Figures 6 to 13 This is a diagram illustrating a method for manufacturing a display device according to an embodiment of the present disclosure;

[0026] Figure 14 The diagram is an example of a modification of an implementation of the present disclosure;

[0027] Figure 15 This is a diagram based on another embodiment of the present disclosure;

[0028] Figures 16 to 21 This is a diagram illustrating a method for manufacturing a display device according to another embodiment of this disclosure; and

[0029] Figure 22 and Figure 23 This is an equivalent circuit diagram of a sub-pixel of a display device according to an embodiment of the present disclosure. Detailed Implementation

[0030] The advantages and features of this disclosure, as well as the methods for achieving these advantages and features, will be discussed later in the appendix. Figure 1 The following detailed description of the embodiments will make it apparent. However, this disclosure is not limited to the embodiments disclosed below, but can be embodied in various different forms. Therefore, these embodiments are described only to complete this disclosure and to fully inform those skilled in the art of the subject of this disclosure of its scope.

[0031] The shapes, dimensions, ratios, angles, numbers, etc., disclosed in the accompanying drawings used to describe embodiments of this disclosure are illustrative, and this disclosure is not limited thereto. Throughout the detailed description, the same reference numerals refer to the same parts. Furthermore, in describing this disclosure, detailed descriptions of related known technologies will be omitted if it is determined that such detailed descriptions may unnecessarily obscure the essential points of this disclosure. When the terms "comprising," "including," "having," "configured with," "be comprised of," etc., are used in this disclosure, the presence or addition of other elements may be permitted unless the term "only" is used. When a component is described using a singular form, it may include the meaning of the plural form unless explicitly stated otherwise.

[0032] It should be noted that any component will be interpreted as including tolerances or error ranges, even if they are not explicitly described.

[0033] When describing the positional relationship between two elements, for example, when using terms such as "on," "above," "below," or "near," one or more other elements may be inserted between the two elements, unless "exactly," "directly," or "close to" are used.

[0034] When describing temporal relationships, such as when time sequence is described as “after,” “following,” “next,” “before,” etc., discontinuous cases can also be included, unless the terms “just” or “directly” are used.

[0035] It should be understood that although the terms "first," "second," etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. Therefore, without departing from the scope of the technical concept of this disclosure, the first element mentioned in the following description may refer to the second element.

[0036] The various features of the various embodiments of this disclosure may be coupled or combined with each other in part or in whole, so as to be interconnected and operated in various technical ways, and the various embodiments may be implemented independently of each other or together in an associated relationship.

[0037] In the following description, a display device according to various embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0038] Figure 1 This is a plan view of a display device according to an embodiment of the present disclosure. Figure 2 It shows the setting Figure 1 A plan view of an example of pixels in region I. Figure 3 It is along Figure 2The cross-sectional view taken from line II-II' in the diagram. Figure 4 It shows the setting Figure 2 A planar graph of a sub-pixel in region III. Figure 5 It is along Figure 4 The cross-sectional view taken from line IV-IV' in the diagram.

[0039] Reference Figure 1 and Figure 2 The display device according to the embodiments of the present disclosure may include a substrate 100 having a display area DA and a non-display area NDA located outside the display area DA.

[0040] The display area DA can be an area where an image is displayed, and the non-display area NDA can be an area where no image is displayed. The non-display area NDA can be located in the peripheral area (or boundary area) of the substrate 100; however, this is not exhaustive. For example, the remainder of the display area DA, except for the light-emitting area from which light is emitted to the outside, can be referred to as the non-display area NDA.

[0041] The display device according to the embodiments of the present disclosure may be a transparent display device that transmits light when displaying an image, so that a background or object disposed on the back side of the display device can be visually perceived by the user.

[0042] Multiple pixels can be set in the display area DA. An image can be displayed in the display area DA using multiple pixels. In the non-display area NDA, various wiring and circuits for driving the multiple pixels in the display area DA can be set. For example, the non-display area NDA can house a gate driver 10, a data driver 20, and a power supply section 30. The non-display area NDA may also include a timing controller.

[0043] The gate driver 10 can be configured in a GIP (gate-in-board) manner on one edge or opposite edge of the substrate 100. The gate driver 10 can generate a gate signal. The gate signal can be provided to the pixel via a scan line.

[0044] The data driver 20 can generate data signals. These data signals can be provided to the pixels in the display area DA via multiple data lines.

[0045] The power supply section 30 can generate a high-potential power voltage (EVDD) and a low-potential power voltage (EVSS) to be supplied to the display area DA. The power supply section 30 can supply the generated high-potential power voltage (EVDD) and low-potential power voltage (EVSS) to the pixels via signal lines.

[0046] The display area DA may include multiple first signal lines SL1 and multiple second signal lines SL2. The multiple first signal lines SL1 may extend in a first direction of the substrate 100, and the multiple second signal lines SL2 may extend in a second direction of the substrate 100. The first direction may be the Y-axis direction, and the second direction may be the X-axis direction intersecting the first direction; however, this is not exhaustive.

[0047] The multiple first signal lines SL1 may include at least one of a common power line, a data line, a pixel power line, and a reference power line. The multiple second signal lines SL2 may include at least one of a scan line and a cathode contact wiring.

[0048] The display area DA may include multiple transmissive areas TA and multiple pixel areas PA. The transmissive areas TA and pixel areas PA may be alternately arranged in the X-axis direction, which is a second direction of the substrate 100. The multiple transmissive areas TA may be arranged to be spaced apart from each other in the Y-axis direction, which is a first direction. However, this is not exhaustive.

[0049] The transmissive region TA transmits light, allowing the back surface of the display device to be perceived. Therefore, the transmissive region TA can be an area without opaque or reflective materials. Thus, the transmissive region TA can be an area with high light transmittance. The pixel region PA can be an area that transmits almost no external light. The pixel region PA can be an area with multiple sub-pixels SP1, SP2, SP3, and SP4. Furthermore, the pixel region PA can be an area with light-emitting elements corresponding to each sub-pixel SP1, SP2, SP3, and SP4.

[0050] Pixel region PA can be disposed between adjacent transmissive regions TA, and has multiple signal lines disposed therein for driving multiple sub-pixels SP1, SP2, SP3, SP4. Transmissive region TA may not overlap with the multiple signal lines disposed in pixel region PA. Furthermore, transmissive region TA may not overlap with the light-emitting elements disposed in the multiple sub-pixels SP1, SP2, SP3, SP4.

[0051] Each of the multiple sub-pixels SP1, SP2, SP3, SP4 disposed on the pixel region PA includes a region that emits light corresponding to a certain color. Three or four or more sub-pixels of the multiple sub-pixels SP1, SP2, SP3, SP4 that are adjacent to each other and correspond to different colors can form a pixel region that emits light of various colors.

[0052] By combining the light emitted from two or more adjacent sub-pixels SP1, SP2, SP3, SP4 that constitute a pixel region, the pixel region can display various colors, thereby emitting an image to the display area DA. For example, a pixel set in the pixel region may include a first sub-pixel SP1, a second sub-pixel SP2, a third sub-pixel SP3, and a fourth sub-pixel SP4. The emitting area EA can be set corresponding to each sub-pixel SP1, SP2, SP3, SP4.

[0053] The light-emitting regions EA disposed in each sub-pixel SP1, SP2, SP3, and SP4 can emit light of different colors. For example, the first sub-pixel SP1 can have a first light-emitting region EA located therein that emits light of a first color; the second sub-pixel SP2 can have a second light-emitting region EA located therein that emits light of a second color; the third sub-pixel SP3 can have a third light-emitting region EA located therein that emits light of a third color; and the fourth sub-pixel SP4 can have a fourth light-emitting region EA located therein that emits light of a fourth color. For example, the first color of light can be green light; the second color of light can be white light; the third color of light can be blue light; and the fourth color of light can be red light. However, the embodiments of this disclosure are not limited thereto. Furthermore, the arrangement order and arrangement direction of the sub-pixels SP1, SP2, SP3, and SP4 can be changed in various ways.

[0054] Each of the plurality of pixels may include one or more first sub-pixels SP1, one or more second sub-pixels SP2, one or more third sub-pixels SP3, and one or more fourth sub-pixels SP4. For example, a pixel may include a pair of first sub-pixels SP1, a pair of second sub-pixels SP2, a pair of third sub-pixels SP3, and a pair of fourth sub-pixels SP4. The pair of first sub-pixels SP1 may be configured with first-first sub-pixel SP1a and first-second sub-pixel SP1b. The pair of second sub-pixels SP2 may be configured with second-first sub-pixel SP2a and second-second sub-pixel SP2b. The pair of third sub-pixels SP3 may be configured with third-first sub-pixel SP3a and third-second sub-pixel SP3b. The pair of fourth sub-pixels SP2 may be configured with fourth-first sub-pixel SP4a and fourth-second sub-pixel SP4b.

[0055] Therefore, a unit pixel may include: a first sub-pixel SP1a, a first sub-pixel SP1b, a second sub-pixel SP2a, a second sub-pixel SP2b, a third sub-pixel SP3a, a third sub-pixel SP3b, a fourth sub-pixel SP4a, and a fourth sub-pixel SP4b. However, the implementation of this disclosure is not limited thereto.

[0056] Multiple subpixels constituting a unit pixel can be arranged in various ways. For example, in a unit pixel, pairs of first subpixels SP1 can be arranged in the same column; pairs of second subpixels SP2 can be arranged in the same column; pairs of third subpixels SP3 can be arranged in the same column; and pairs of fourth subpixels SP4 can be arranged in the same column. First subpixels SP1 and second subpixels SP2 can be arranged in the same row, and third subpixels SP3 and fourth subpixels SP4 can be arranged in the same row. The number and arrangement of multiple subpixels constituting a unit pixel are given as examples only, and the implementation of this disclosure is not limited thereto.

[0057] In a subpixel pair, one subpixel can be a primary subpixel, and the other subpixel can be a redundant subpixel. A redundant subpixel is one that can be repaired and operate like a normal subpixel in the event of a defect in the primary subpixel. If a defect occurs in the primary subpixel, the redundant subpixel can emit light and function as a normal subpixel. Therefore, by placing the primary and redundant subpixels together in a single subpixel, display quality degradation caused by subpixel defects in other situations can be prevented.

[0058] For example, in a subpixel set within a single pixel, the first-first subpixel SP1a, the second-first subpixel SP2a, the third-first subpixel SP3a, and the fourth-first subpixel SP4a can be used as principal subpixels, while the first-second subpixel SP1b, the second-second subpixel SP2b, the third-second subpixel SP3b, and the fourth-second subpixel SP4b can be used as redundant subpixels. This will be described in more detail later.

[0059] Reference Figure 2 and Figure 3 According to embodiments of this disclosure, the substrate 100 may include a transmissive region TA and a pixel region PA. The pixel region PA may include a light-emitting region EA and a non-light-emitting region NEA. Light-emitting elements ED and circuit elements for driving the light-emitting elements ED may be disposed in the pixel region PA. For example, the pixel region PA may include a plurality of transistors TR, a light-emitting element ED, and insulating layers 103, 105, 107, 110, 120, 125, 135, 145, and 155. The light-emitting element ED has an anode electrode 160, a light-emitting layer 170, a cathode electrode 180, a dam 165, a connecting electrode 150, and via electrodes 147 and 159 electrically connecting the plurality of transistors TR to the light-emitting element ED. The pixel region PA may also include a structure 183 and a trench portion 169 configured to separate the cathode electrodes 180 of sub-pixel pairs disposed in the same column. An explanation of this will follow later. Figure 5 The information is provided in the text.

[0060] The area beneath the transmissive region TA may lack both a light-emitting element and the circuitry necessary to drive it. Therefore, the transmissive region TA can comprise a structure consisting of laminated, insulating layers 103, 105, 107, 110, 120, 125, 135, 145, and 155 made of transparent material. This structure allows the transmissive region TA to be a region with high light transmittance. In the example, the transmissive region TA can also increase transmittance by removing some of the dikes 165 and / or layers 155; however, this is not an exhaustive approach.

[0061] A pixel region PA may include multiple sub-pixels in which a light-emitting element ED is disposed.

[0062] Figure 4 It shows the setting Figure 2 A planar graph of a sub-pixel in region III. Figure 5 It is along Figure 4 The cross-sectional view taken by line IV-IV′ in the diagram. Although Figure 4 The first-first sub-image SP1a and the first-second sub-image SP1b of the first sub-pixel SP1 are shown, but the second sub-pixel SP2, the third sub-pixel SP3, and the fourth sub-pixel SP4 can have substantially the same structure as the first sub-pixel SP1. Additionally, for ease of explanation, Figure 4 Only the anode electrodes 160a and 160b, the first signal line SL1, the cathode contact portions 161a and 161b, the structures 183a and 183b, and the embankment 165 are shown.

[0063] Reference Figure 4 and Figure 5 A transistor array portion 200 may be disposed on the substrate 100. The transistor array portion 200 may include a first transistor TR1, a second transistor TR2, and a capacitor CT.

[0064] The first transistor TR1 of the transistor array section 200 may be disposed on the substrate 100. The substrate 110 may include an insulating material. For example, the substrate 100 may include glass, resin, or plastic material. The substrate 100 may include a flexible material.

[0065] The first transistor TR1 may include a first semiconductor layer 109, a first gate insulating layer 110, a first gate electrode 113a, and a first source / drain electrode 140.

[0066] Multiple buffer layers 103, 105, and 107 may be disposed between the substrate 100 and the first transistor TR1. The multiple buffer layers 103, 105, and 107 may include a first buffer layer 103, a second buffer layer 105, and a third buffer layer 107. The first buffer layer 103, the second buffer layer 105, and the third buffer layer 107 may overlap each other in the vertical direction to cover the entire surface of the substrate 100. The first buffer layer 103, the second buffer layer 105, and the third buffer layer 107 can reduce or prevent moisture, oxygen, or impurities from penetrating the substrate 100. Therefore, the transistor can be protected from the effects of moisture, oxygen, or impurities penetrating the substrate 100. The first buffer layer 103, the second buffer layer 105, and the third buffer layer 107 may include an inorganic insulating film comprising silicon oxide (SiOx) or silicon nitride (SiNx), but embodiments of this disclosure are not limited thereto.

[0067] The first semiconductor layer 109 of the first transistor TR1 may include a silicon-based semiconductor material. For example, the first semiconductor layer 109 may include low-temperature polycrystalline silicon (LTPS). The first semiconductor layer 109 may include a channel region, a source region, and a drain region. The region of the first semiconductor layer 109 that overlaps with the first gate electrode 113a in the vertical direction may be the channel region. The source region and the drain region may be located on opposite sides of the channel region.

[0068] The first gate insulating layer 110 may be disposed between the first semiconductor layer 109 and the first gate electrode 113a. The first gate insulating layer 110 may be made of silicon oxide (SiOx); however, this is not an exhaustive list.

[0069] A light-blocking layer may also be included between one of the buffer layers 103, 105, and 107 and the first semiconductor layer 109 to block external light from entering the first semiconductor layer 109.

[0070] The first gate electrode 113a can be formed as a single layer or multiple layers of any one or alloy of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu).

[0071] Multiple first conductive patterns 113b and 113c may be formed on the first gate insulating layer 110 at locations different from where the first gate electrode 113a is formed. The multiple first conductive patterns 113b and 113c may comprise the same material as the first gate electrode 113a. Each of the multiple first conductive patterns 113b and 113c may be spaced apart from each other.

[0072] The first interlayer insulating layer 120 may be disposed on the first gate electrode 113a and a plurality of first conductive patterns 113b, 113c to cover them. The first interlayer insulating layer 120 may include an inorganic insulating material. For example, the first interlayer insulating layer 120 may include silicon nitride (SiNx).

[0073] A second conductive pattern 123b can be formed on the first interlayer insulating layer 120. The second conductive pattern 123b can be formed at a different location than the region where the first transistor TR1 is formed. For example, the second conductive pattern 123b can be formed to overlap one of a plurality of first conductive patterns 113b, 113c in the vertical direction. In the example, the first conductive pattern 113b and the second conductive pattern 123b can form the capacitor CT region.

[0074] A first protective layer 125 may be disposed on the first interlayer insulating layer 120. The first protective layer 125 may be configured to cover the second conductive pattern 123b. The first protective layer 125 may include an inorganic insulating material. For example, the first protective layer 125 may include, but is not limited to, silicon oxide (SiOx).

[0075] A second transistor TR2 may be disposed on the first protective layer 125. The second transistor TR2 may include a second semiconductor layer 129, a second gate insulating layer 130, a second gate electrode 133, and a second source / drain electrode 141.

[0076] The second semiconductor layer 129 of the second transistor TR2 may include an oxide semiconductor material. For example, the second semiconductor layer 129 may include, but is not limited to, oxide semiconductor materials such as indium gallium zinc oxide (IGZO), indium zinc oxide (IZO), or indium gallium zinc tin oxide (IGZTO). The second semiconductor layer 129 may include a channel region, a source region, and a drain region. The region of the second semiconductor layer 129 that overlaps with the second gate electrode 133 in the vertical direction may be the channel region. The source region and drain region may be located on opposite sides of the channel region. In this example, the second transistor TR2 may be a driving transistor for driving a sub-pixel.

[0077] The second gate insulating layer 130 may be disposed between the second semiconductor layer 129 and the second gate electrode 133. The second gate insulating layer 130 may be configured as a single layer or multiple layers of silicon oxide (SiOx) or silicon nitride (SiNx).

[0078] The second gate electrode 133 may be disposed on the second gate insulating layer 130. The second gate electrode 133 may contain the same material as the first gate electrode 113a, but is not limited to the same material as the first gate electrode 113a.

[0079] A second interlayer insulating layer 135 may be disposed on the second gate electrode 133 to cover the second gate electrode 133. The second interlayer insulating layer 135 may include an inorganic insulating material. For example, the second interlayer insulating layer 135 may include silicon nitride (SiNx).

[0080] The first source / drain electrode 140 and the second source / drain electrode 141 can be disposed on the second interlayer insulating layer 135.

[0081] The first source / drain electrode 140 and the second source / drain electrode 141 can be configured to be spaced apart from each other. For example, the first source / drain electrode 140 can be electrically connected to the first transistor TR1. The first source / drain electrode 140 can be electrically connected to the source region and drain region of the first semiconductor layer 109, respectively, through a first via electrode 137 that penetrates the second interlayer insulating layer 135, the first protective layer 125, the first interlayer insulating layer 120, and the first gate insulating layer 110.

[0082] For example, the second source / drain electrode 141 can be electrically connected to the second transistor TR2. The second source / drain electrode 141 can be electrically connected to the source region and drain region of the second semiconductor layer 129 respectively through the second via electrode 139 that penetrates the second interlayer insulating layer 135.

[0083] The first source / drain electrode 140 and the second source / drain electrode 141 can be formed as, but not limited to, a multilayer of any one or an alloy of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). For example, the first source / drain electrode 140 and the second source / drain electrode 141 can be configured by providing a second metal layer on the upper and lower surfaces of the first metal layer, respectively, to place the first metal layer between the second metal layers. For example, the first metal layer may include aluminum (Al), and the second metal layer may include titanium (Ti); however, this is not an exhaustive list.

[0084] A planarization layer 145 can be provided on the first source / drain electrode 140 and the second source / drain electrode 141.

[0085] The planarization layer 145 can planarize the step difference caused by the lower circuit elements including the first transistor TR1 and the second transistor TR2. The planarization layer 145 may include an organic insulating material, such as acrylic resin, epoxy resin, phenolic resin, polyamide resin or polyimide resin, and however, there is no limitation on the type of organic insulating material, as long as it can planarize the step difference.

[0086] A connection electrode 150 can be provided on the planarization layer 145. The connection electrode 150 can be electrically connected to the second transistor TR2. The connection electrode 150 can be connected to the second source / drain electrode 141 through a third via electrode 147 penetrating the planarization layer 145. And it can be electrically connected to the second transistor TR2 through the second source / drain electrode 141.

[0087] The connecting electrode 150 can be formed as, but is not limited to, a multilayer of any one or alloy of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). For example, the connecting electrode 150 can be configured by forming a second metal layer on the upper and lower surfaces of the first metal layer, respectively, to insert the first metal layer therebetween. For example, the first metal layer may include aluminum (Al), and the second metal layer may include titanium (Ti); however, this is not an exhaustive list.

[0088] The connecting electrode 150 can be configured to overlap with the first-first sub-pixel SP1a and the first-second sub-pixel SP1b of the first sub-pixel SP1. For example, the connecting electrode 150 can be configured to extend from the first-first sub-pixel SP1a to the first-second sub-pixel SP1b. The connecting electrode 150 can be located in a non-light-emitting area so as not to overlap with the light-emitting area. The connecting electrode 150 can supply driving power from the second transistor TR2, which is a driving transistor, to the first-first sub-pixel SP1a and the first-second sub-pixel SP1b of the first sub-pixel SP1.

[0089] A second protective layer 155 may be provided on the connecting electrode 150. The second protective layer 155 may include an inorganic insulating material. For example, the second protective layer 155 may include, but is not limited to, silicon oxide (SiOx). The second protective layer 155 may include trench portions 169a and 169b. The trench portions 169a and 169b may have a recessed shape in the thickness direction of the second protective layer 155. For example, the trench portions 169a and 169b may include a bottom surface and opposing sidewalls extending from the bottom surface. For example, the trench portions 169a and 169b may have a shape with four outer sides surrounding each of the first-first sub-pixel SP1a and the first-second sub-pixel SP1b.

[0090] A third protective layer 157 may be disposed on the second protective layer 155. The third protective layer 157 may include an organic insulating material. For example, the third protective layer 157 may include, but is not limited to, organic insulating materials such as polyimide resin. The third protective layer 157 may also be referred to as an outer coating.

[0091] Anode electrodes 160a and 160b and cathode contact portions 161a and 161b can be provided on the third protective layer 157.

[0092] The anode electrodes 160a and 160b may include a first anode electrode 160a disposed in the first first sub-pixel SP1a and a first second anode electrode 160b disposed in the first second sub-pixel SP1b.

[0093] Anode electrodes 160a and 160b may comprise metal oxides such as indium tin oxide (ITO) or indium zinc oxide (IZO). Alternatively, anode electrodes 160a and 160b may comprise a multilayer structure comprising a reflective metal film formed of silver (Ag), aluminum (Al), gold (Au), nickel (Ni), chromium (Cr), and their compounds, but embodiments of this disclosure are not limited thereto. For example, the reflective layer may comprise APC (silver / palladium / copper alloy). In an example, anode electrodes 160a and 160b may be formed as a three-layer structure comprising ITO / APC / ITO. For example, anode electrodes 160a and 160b may also be referred to as pixel electrodes.

[0094] A portion of the anode electrodes 160a and 160b may be configured to penetrate the second protective layer 155 to be electrically connected to the fourth via electrodes 159a and 159b of the connecting electrode 150. The fourth via electrodes 159a and 159b may include a fourth-first via electrode 159a disposed in the first-first sub-pixel SP1a and a fourth-second via electrode 159b disposed in the first-second sub-pixel SP1b. The anode electrodes 160a and 160b may be electrically connected to the second transistor TR2 via the connecting electrode 150 connected to the fourth-first via electrode 159a and the fourth-second via electrode 159b.

[0095] The cathode contact portions 161a and 161b may be disposed on the same plane as the anode electrodes 160a and 160b spaced apart therefrom. The cathode contact portions 161a and 161b may include a first cathode contact portion 161a disposed in the first first sub-pixel SP1a and a first second cathode contact portion 161b disposed in the first second sub-pixel SP1b.

[0096] The cathode contact portions 161a and 161b may be, but are not limited to, made of the same material as the anode electrodes 160a and 160b. In the example, the cathode contact portions 161a and 161b may include a conductive material. When the cathode contact portions 161a and 161b are made of the same material as the anode electrodes 160a and 160b, they can be formed in the same process, thus simplifying the processing steps. See also... Figure 1 and Figure 4The cathode contact portions 161a and 161b can branch from the first signal line SL1, which supplies the power voltage provided from the power supply portion 30 and supplied to each sub-pixel; however, this is not exhaustive. In the example, the cathode contact portions 161a and 161b can extend in the row direction of the display area DA.

[0097] A dam 165 can be provided on the third protective layer 157. The dam 165 can distinguish sub-pixels from each other. In addition, the dam 165 can prevent light of different colors from mixing and being output between adjacent pixels. For this purpose, the dam 165 can be formed to cover the edges of the anode electrodes 160a and 160b. Furthermore, the dam 165 can be formed to cover the edges of each cathode contact portion 161a and 161b to distinguish the anode electrodes 160a and 160b and the cathode contact portions 161a and 161b from each other. In addition, one end of the dam 165 can be configured to extend from the anode electrodes 160a and 160b or the cathode contact portions 161a and 161b to cover the edge of the third protective layer 157 and protrude more than the sidewalls of the trench portions 169a and 169b.

[0098] A portion of each of the anode electrodes 160a and 160b and the cathode contact portions 161a and 161b can be exposed through a dam hole that may include a first opening region OA1 and a second opening region OA2, without being covered by the dam 165. Therefore, the first opening region OA1 and the second opening region OA2 can be respectively disposed in the first-first sub-pixel SP1a and the first-second sub-pixel SP1b. (Refer to...) Figure 4 The first opening region OA1 and the second opening region OA2 can be configured to be spaced apart from each other in the column direction. The first opening region OA1 can be the light-emitting region EA. Figure 3 The remaining area, excluding the luminescent region EA, can be the non-luminescent region NEA (see [reference]). Figure 3 ).

[0099] The barrier 165 may include, but is not limited to, an organic insulating film such as polyimide or epoxy resin. For example, the barrier 165 may be made of an organic material including black pigment. When the barrier 165 is made of a material including black pigment, it may be a black barrier. When the barrier 165 is made of a material including black pigment, it can block light from the outside or light reflected from the outside, thereby further improving the brightness of the display device.

[0100] Light-emitting layers 170a and 170b can be disposed on the anode electrodes 160a and 160b. The light-emitting layers 170a and 170b may include a first-first light-emitting layer 170a disposed in the first-first sub-pixel SP1a and a first-second light-emitting layer 170b disposed in the first-second sub-pixel SP1b.

[0101] In the example, the emissive layers 170a and 170b may include organic materials that emit different colors of light for each pixel. For example, the emissive layers 170a and 170b may emit light of one color: red, green, blue, and white. In another example, the emissive layers 170a and 170b may include organic materials that emit white light and display one color of red, green, or blue through a color filter.

[0102] The light-emitting layers 170a and 170b may include a stacked structure comprising: a hole transport layer (HTL), a light-emitting material layer (EML), an electron transport layer (ETL), a hole blocking layer (HBL), a hole injection layer (HIL), an electron blocking layer (EBL), and an electron injection layer (EIL). Where a stacked structure is included, the stacked structure may include one or more stacked structures. For example, one or more stacked structures may further include a charge generation layer between them.

[0103] Light-emitting layers 170a and 170b can be disposed on anode electrodes 160a and 160b exposed in the first opening region OA1. Light-emitting layers 170a and 170b can be disposed along the sidewalls and upper surface of the embankment 165, and continuously disposed until the cathode contact portions 161a and 161b are exposed in a portion of the second opening region OA2. For example, light-emitting layers 170a and 170b can cover the sidewalls of the embankment 165 in the second opening region OA2 while exposing the surfaces of the cathode contact portions 161a and 161b.

[0104] A portion of the light-emitting layers 170a and 170b may be disposed on the bottom surface of the first-first trench portion 169a surrounding the outer side of the first-first sub-pixel SP1a and the first-second trench portion 169b surrounding the outer side of the first-second sub-pixel SP1b. The portions of the light-emitting layers 170a and 170b disposed in the first-first trench portion 169a and the first-second trench portion 169b may be configured as the lower patterns 171a and 171b of the structures 183a and 183b.

[0105] The first-first trench portion 169a and the first-second trench portion 169b may have an undercut structure, wherein the sidewalls are located inside the embankment 165 rather than at its ends. Therefore, the ends of the embankment 165 may have a shape that is more prominent than the sidewalls of the trench portions 169a and 169b.

[0106] The light-emitting layers 170a and 170b can be configured such that the lower patterns 171a and 171b are only disposed on the bottom surfaces of the groove portions 169a and 169b, and not on the sidewalls. Therefore, the first-first light-emitting layer 170a disposed in the first-first sub-pixel SP1a can be separated from the first-second light-emitting layer 170b disposed in the first-second sub-pixel SP1b by a discontinuity interruption at the corresponding groove portions 169a and 169b.

[0107] Furthermore, the light-emitting layers 170a and 170b can be separated at the first opening region OA1 and the second opening region OA2. For example, the first-first light-emitting layer 170a disposed in the first-first sub-pixel SP1a can have its continuity interrupted at the sidewall of the embankment 165 to expose the upper surface of the first-first cathode contact portion 161a on the second opening region OA2. Similarly, the first-second light-emitting layer 170b disposed in the first-second sub-pixel SP1b can have its continuity interrupted at the sidewall of the embankment 165 to expose the upper surface of the first-second cathode contact portion 161b on the second opening region OA2. Therefore, the light-emitting layers 170a and 170b can be separated by the interruption of the continuity of the light-emitting layers within the second opening region OA2.

[0108] Cathode electrodes 180a and 180b can be disposed on the light-emitting layers 170a and 170b. The cathode electrodes 180a and 180b can be formed to cover the light-emitting layers 170a and 170b. The cathode electrodes 180a and 180b can include a first cathode electrode 180a disposed in the first first sub-pixel SP1a and a first second cathode electrode 180b disposed in the first second sub-pixel SP1b.

[0109] Light-emitting elements ED1a and ED1b may include and be configured with anode electrodes 160a and 160b, light-emitting layers 170a and 170b, and cathode electrodes 180a and 180b. Light-emitting elements ED1a and ED1b may include a first-first light-emitting element ED1a disposed in a first-first sub-pixel SP1a and a first-second light-emitting element ED1b disposed in a first-second sub-pixel SP1b. The first-first light-emitting element ED1a and the first-second light-emitting element ED1b may be, but are not limited to, organic light-emitting elements.

[0110] Cathode electrodes 180a and 180b may comprise metal oxides such as indium tin oxide (ITO) or indium zinc oxide (IZO), but embodiments of this disclosure are not limited thereto. Alternatively, cathode electrodes 180a and 180b may comprise single-layer or multi-layer structures, including reflective metal films formed of silver (Ag), aluminum (Al), gold (Au), nickel (Ni), chromium (Cr), and their compounds, but embodiments of this disclosure are not limited thereto.

[0111] Cathode electrodes 180a and 180b can be disposed on light-emitting layers 170a and 170b disposed on the first opening region OA1. Cathode electrodes 180a and 180b can be disposed on light-emitting layers 170a and 170b disposed along the sidewall and upper surface of the embankment 165. Cathode electrodes 180a and 180b can be connected to the exposed surfaces of cathode contact portions 161a and 161b, while covering the ends of light-emitting layers 170a and 170b in the second opening region OA2.

[0112] A portion of the cathode electrodes 180a and 180b can be disposed on the lower patterns 171a and 171b disposed in the first-first trench portion 169a and the first-second trench portion 169b. A portion of the cathode electrodes 180a and 180b disposed in the first-first trench portion 169a and the first-second trench portion 169b can be configured as the upper patterns 181a and 181b of structures 183a and 183b. Therefore, in the first-first trench portion 169a, a first-first structure 183a in which the first-first lower pattern 171a and the first-first upper pattern 181a are laminated can be disposed, and in the first-second trench portion 169b, a first-second structure 183b in which the first-second lower pattern 171b and the first-second upper pattern 181b are laminated can be disposed.

[0113] When viewed in a plan view, each of the first-first structure 183a and the first-second structure 183b can be configured to surround the exterior of each of the pairs of sub-pixels SP1a, SP1b. Each of the first-first structure 183a and the first-second structure 183b can have a rectangular ring shape with an internal spatial portion; however, this is not exhaustive. A first opening region OA1 and a second opening region OA2 can be located within the internal spatial portion of each of the first-first structure 183a and the first-second structure 183b. The first opening region OA1 and the second opening region OA2 can be configured to be spaced apart from each other in the column direction.

[0114] Because the first-first trench portion 169a and the first-second trench portion 169b have an undercut shape, the cathode electrodes 180a and 180b cannot be disposed on the sidewalls of the first-first trench portion 169a and the first-second trench portion 169b.

[0115] Furthermore, the first-first cathode electrode 180a disposed in the first-first sub-pixel SP1a may be disconnected due to a continuity interruption at the end of the dam 165, which protrudes further than the sidewall of the first-first trench portion 169a. Similarly, the first-second cathode electrode 180b disposed in the first-second sub-pixel SP1b may be disconnected due to a continuity interruption at the end of the dam 165, which protrudes further than the sidewall of the first-second trench portion 169b.

[0116] Therefore, the first-first cathode electrode 180a disposed in the first-first sub-pixel SP1a can be configured to be separated from the first-second cathode electrode 180b disposed in the first-second sub-pixel SP1b by interruption of continuity at the corresponding trench portions 169a, 169b.

[0117] Cathode electrodes 180a and 180b can extend from the first opening region OA1 to the second opening region OA2. A portion of the surface of the cathode contact portions 161a and 161b can be exposed in the second opening region OA2. The cathode electrodes 180a and 180b extending into the second opening region OA2 can contact the entire surface of the exposed area of ​​the cathode contact portions 161a and 161b, thus forming a contact area. The cathode electrodes 180a and 180b can be electrically connected to the cathode contact portions 161a and 161b through the contact area.

[0118] Cathode electrodes 180a and 180b can be configured to cover the exposed areas of cathode contact portions 161a and 161b, thereby increasing the surface area in contact with the cathode contact portions 161a and 161b and reducing resistance. As the resistance of cathode electrodes 180a and 180b decreases, the current consumed under the same power supply voltage can be reduced. Therefore, the display device can be driven with low power, resulting in reduced power consumption. Furthermore, when the resistance of cathode electrodes 180a and 180b decreases, the current consumed decreases, preventing voltage drop and thus advantageously reducing brightness deviations caused by position in the display area.

[0119] Simultaneously refer to Figure 4The first-first cathode electrode 180a can be electrically connected to the first-first cathode contact portion 161a branching from the first signal line SL1. Additionally, the first-second cathode electrode 180b can be electrically connected to the first-second cathode contact portion 161b branching from the first signal line SL1 and spaced apart from the first-first cathode contact portion 161a. With this configuration, the pair of first-first sub-pixels SP1a and first-second sub-pixels SP1b disposed in the first sub-pixel SP1 can each be supplied with power from the power supply portion 30 (see [link to power supply section]) via different cathode contact portions 161a, 161b. Figure 1 ) Receives electrical voltage.

[0120] Furthermore, driving power from a second transistor TR2 can be supplied to the pair of first-first sub-pixels SP1a and first-second sub-pixels SP1b disposed in the first sub-pixel SP1 via the connecting electrode 150.

[0121] Driven power from a second transistor TR2 is supplied to the pair of first-first sub-pixels SP1a and first-second sub-pixels SP1b via connecting electrode 150, while power voltage can be supplied to the separate first-first cathode electrodes 180a and first-second cathode electrodes 180b. Therefore, even if either the first-first sub-pixel SP1a or the first-second sub-pixel SP1b is defective and not lit, the other can still operate normally. Thus, the corresponding first sub-pixel SP1a can operate normally.

[0122] For example, a defect may occur in the first sub-pixel SP1a of the first sub-pixel SP1a and the first sub-pixel SP1b of the first sub-pixel SP1. In this case, driving power can be supplied from a second transistor TR2 to the first sub-pixel SP1b through the connection electrode 150, and the power voltage can be supplied to the first and second cathode electrodes 180b electrically connected to the first and second cathode contact portions 161b, thus allowing the first sub-pixel SP1 to emit light normally. Therefore, since repair processes such as laser cutting can be omitted, the processing steps can be optimized, thereby increasing the yield of the display device. In addition, even if a defect occurs in a portion of a sub-pixel pair that emits light of the same color, the corresponding sub-pixel can still operate normally, thereby improving the reliability of the display device. Therefore, dark spot defects in the display area can be prevented, thereby increasing the user's screen immersion and thus increasing the reliability of the product.

[0123] Figures 6 to 13 This is a diagram illustrating a method for manufacturing a display device according to an embodiment of the present disclosure. Figures 6 to 13 It is along Figure 4 The cross-sectional view taken by line V-V' in the diagram. For ease of explanation, Figures 6 to 13 The structure of the transistor array portion 200, located below the second protective layer 155, is briefly shown. Furthermore, for ease of explanation, only the second transistor TR2 is briefly shown in the transistor array portion 200. Additionally, although... Figures 6 to 13 The first-first subpixel of the first subpixel is shown as an example, but the first-second subpixel and other subpixels have essentially the same configuration as the first-first subpixel.

[0124] Reference Figure 6 The connecting electrode 150 may be disposed on the transistor array section 200. The transistor array section 200 may include a first transistor TR1 (see...). Figure 5 ), second transistor TR2 and capacitor CT (see Figure 5 In this example, the second transistor TR2 may be, but is not limited to, a driving transistor. The connection electrode 150 can be electrically connected to the second transistor TR2 via a third via electrode 147. A second protective layer 155 and a third protective layer 157 may be formed on the connection electrode 150. The second protective layer 155 may include an inorganic insulating material. For example, the second protective layer 155 may include silicon oxide (SiOx). The third protective layer 157 may include an organic insulating material. For example, the third protective layer 157 may include a polyimide resin.

[0125] The third protective layer 157 may include an opening pattern 157h that exposes a portion of the surface of the second protective layer 155. In a portion of the opening pattern 157h, a via 158a may be formed that penetrates the second protective layer 155 and exposes a portion of the surface of the connecting electrode 150.

[0126] Reference Figure 7 The first anode electrode 160a and the first cathode contact portion 161a can be formed on the third protective layer 157. The first anode electrode 160a and the first cathode contact portion 161a can be formed on the same plane spaced apart from each other. The first anode electrode 160a and the first cathode contact portion 161a can comprise and be formed of the same material. In this case, they can be formed in the same process, thus simplifying the processing steps.

[0127] A portion of the first-first anode electrode 160a may be configured to fill the via 158a penetrating the second protective layer 155 and be electrically connected to the fourth-first via electrode 159a of the connecting electrode 150.

[0128] Reference Figure 8A dam 165 may be formed on the second protective layer 155. The dam 165 may be formed to cover the edge of each of the first-first anode electrode 160a and the first-first cathode contact portion 161a. The dam 165 may include a dam hole exposing a portion of the surface of the first-first anode electrode 160a and the first-first cathode contact portion 161a. The dam hole may include a first opening region OA1 and a second opening region OA2. The first opening region OA1 may expose a portion of the surface of the first-first anode electrode 160a, and the second opening region OA2 may expose a portion of the surface of the first-first cathode contact portion 161a. The dam 165 may be disposed between the first-first anode electrode 160a and the first-first cathode contact portion 161a, which are spaced apart from each other. In an example, the dam 165 may be formed to cover the exposed surface of the fourth-first via electrode 159a.

[0129] Reference Figure 9 A mask pattern 166 can be formed. The mask pattern 166 can be formed by applying a photoresist material and performing photolithography and development processes. The mask pattern 166 may include an opening 168 surrounding the outside of a sub-pixel. In an example, the opening 168 may include a first portion near a first opening region OA1 and a second portion near a second opening region OA2. The first and second portions of the opening 168 may have different widths; however, this is not exhaustive. For example, the first and second portions may have the same width.

[0130] Simultaneously refer to Figure 9 and Figure 10 An etching process can be performed using mask pattern 166 as an etching mask to form first-first trench portions 169a within the second protective layer 155. The etching process can be performed using a wet etching method.

[0131] The first-first trench portion 169a, including the bottom surface and two sidewalls, can be formed by a wet etching process, wherein the second protective layer 155 is etched from the surface in the thickness direction. The second protective layer 155 can be over-etched into an undercut shape relative to the embankment 165 by an isotropic wet etching process. For example, the second protective layer 155 can also be etched inward from one end of the embankment 165 and from one end of the third protective layer 157 by a first distance d1. Thus, one end of each of the embankment 165 and the third protective layer 157 can be formed into a shape that protrudes more than the sidewalls of the first-first trench portion 169a. Next, the mask pattern 166 is removed.

[0132] Reference Figure 11The first-first light-emitting layer 170a can be formed on the first opening region OA1 and the second opening region OA2. The first-first light-emitting layer 170a may include an organic material. The first-first light-emitting layer 170a can be formed on the exposed surfaces of the first-first anode electrode 160a and the first-first cathode contact portion 161a. The first-first light-emitting layer 170a can be formed extending from the first opening region OA1 to the second opening region OA2. The first-first light-emitting layer 170a can be formed on the upper surface of the embankment 165 and the upper surface of the third protective layer 157, respectively.

[0133] A portion of the first-first luminescent layer 170a may be formed on the bottom surface of the first-first trench portion 169a. Since the first-first trench portion 169a has an undercut shape, the first-first luminescent layer 170a may not be formed on the sidewalls of the first-first trench portion 169a. Therefore, the first-first luminescent layer 170a can be separated by a break in the continuity between the embankment 165 and the third protective layer 157, wherein the first-first trench portion 169a is positioned between the embankment 165 and the third protective layer 157. The portion of the first-first luminescent layer 170a disposed on the bottom surface of the first-first trench portion 169a may be formed as a lower pattern 171a.

[0134] Reference Figure 12 A removal process is performed to selectively remove a portion of the first-first light-emitting layer 170a formed on the exposed surface of the first-first cathode contact portion 161a. The removal process can be performed by using a laser drilling method to selectively remove only a portion of the first-first light-emitting layer 170a formed on the exposed surface of the first-first cathode contact portion 161a.

[0135] Therefore, a portion of the surface of the first-first cathode contact portion 161a can be exposed in the second opening region OA2. In the example, the first-first cathode contact portion 161a can have the same surface area as the second opening region OA2. Furthermore, the first-first light-emitting layer 170a can have its continuity interrupted at the sidewall of the embankment 165 covering the edge of the first-first cathode contact portion 161a in the second opening region OA2. Therefore, the first-first light-emitting layer 170a can be separated at the first opening region OA1 and the second opening region OA2.

[0136] Reference Figure 13 A first cathode electrode 180a can be formed. The first cathode electrode 180a can be formed on the first light-emitting layer 170a. Therefore, a first light-emitting element ED1a including a first anode electrode 160a, a first light-emitting layer 170a and a first cathode electrode 180a can be constructed in the first sub-pixel.

[0137] The first-first cathode electrode 180a can be formed to extend from the first opening region OA1 to the second opening region OA2. A portion of the first-first cathode electrode 180a can be configured as an upper pattern 181a by being disposed on a lower pattern 171a on the bottom surface of the first-first trench portion 169a. Therefore, a first-first structure 183a including the lower pattern 171a and the upper pattern 181a can be formed on the bottom surface of the first-first trench portion 169a. When viewed in a plan view, the first-first structure 183a can be formed to surround the exterior of the first-first sub-pixel SP1a. For example, the first-first structure 183a can have a rectangular ring shape with a space portion disposed inside. Alternatively, the first structure 183a can have a polygonal ring shape.

[0138] The first-first cathode electrode 180a can be separated due to the interruption of continuity between the dam 165 and the third protective layer 157, wherein the first-first trench portion 169a is located between the dam 165 and the third protective layer 157. Therefore, the first-first cathode electrode 180a can be separated from other adjacent cathode electrodes, wherein the first-first trench portion 169a is located between the cathode electrodes.

[0139] The first-first cathode electrode 180a can form a contact region CA by contacting the entire exposed surface region of the first-first cathode contact portion 161a in the second opening region OA2. The first-first cathode electrode 180a can be formed to cover the exposed surface region of the first-first cathode contact portion 161a, thereby increasing the contact surface area and reducing the resistance.

[0140] Figure 14 This is a diagram illustrating a modified example of an implementation method based on the present disclosure. Figure 14 It is along Figure 4 The cross-sectional view taken from line IV-IV' in the diagram. Figure 14 Display device and Figure 5 The display device is the same, except that it includes a protruding pattern 160p configured to cover one or more edges of the third protective layer 157, and therefore, repeated descriptions will be omitted. Figure 14 In this context, the same reference numerals are used to indicate the same as those in the accompanying drawings. Figure 5 The same parts.

[0141] like Figure 14As shown, when the protruding pattern 160p is formed to have a protruding shape and cover one or more edges of the third protective layer 157, the protruding pattern 160p can be configured to protrude more than the sidewalls of the trench portions 169a, 169b. In this case, the light-emitting layers 170a, 170b can be provided along the shape of the protruding pattern 160p. Cathode electrodes 180a, 180b can be provided on the light-emitting layers 170a, 170b. Therefore, it is possible to prevent the light-emitting layers 170a, 170b and the cathode electrodes 180a, 180b from forming on the sidewalls of the trench portions 169a, 169b.

[0142] Therefore, its advantage lies in the fact that it is easier to configure separate cathode electrodes 180a and 180b.

[0143] Figure 15 This is a diagram of another embodiment of the present disclosure. Figure 15 It is along Figure 4 A cross-sectional view taken from line IV-IV' in the diagram. Figure 15 In this context, the same reference numerals are used to indicate the same as those in the accompanying drawings. Figure 5 The same parts will be omitted or their repeated detailed descriptions will be simplified.

[0144] Reference Figure 15 The connection electrode 150 can be disposed on the planarization layer 145 of the substrate 100, wherein the transistor array portion 200 is disposed on the substrate 100. The transistor array portion 200 may include a first transistor TR1, a second transistor TR2, and a capacitor CT. The connection electrode 150 can be electrically connected to the second transistor TR2 through a third via electrode 147.

[0145] A step difference planarization layer 210 can be provided on the connecting electrode 150. The step difference planarization layer 210 can planarize the step difference caused by the connecting electrode 150. The step difference planarization layer 210 may include an organic insulating material.

[0146] The step difference planarization layer 210 may include a trench portion 215 having a recessed shape in the thickness direction. The trench portion 215 may include a bottom surface and opposing sidewalls extending from the bottom surface. In an example, the trench portion 215 may expose a portion of the surface of the connecting electrode 150 in the boundary region between the first sub-pixel SP1a and the first second sub-pixel SP1b. In an example, in a plan view, the trench portion 215 may have a shape with four outer sides surrounding each of the first sub-pixel SP1a and the first second sub-pixel SP1b.

[0147] Anode electrodes 160a and 160b and cathode contact portions 161a and 161b can be disposed on the step difference planarization layer 210. A portion of the anode electrodes 160a and 160b can be configured to penetrate the step difference planarization layer 210 to electrically connect to the fourth via electrodes 159a and 159b of the connecting electrode 150. Therefore, the connecting electrode 150 can electrically connect the second transistor TR2 to the first anode electrode 160a of the first-first sub-pixel SP1a and the first anode electrode 160b of the first-second sub-pixel SP1b.

[0148] The anode electrodes 160a and 160b and the cathode contact portions 161a and 161b can be disposed on the same plane and spaced apart from each other.

[0149] Furthermore, a plurality of protruding patterns 160p can be disposed on the step difference planarization layer 210, spaced apart from the anode electrodes 160a, 160b and the cathode contact portions 161a, 161b, respectively. One of the plurality of protruding patterns 160p can be spaced apart from the anode electrodes 160a, 160b. Another of the plurality of protruding patterns 160p can be spaced apart from the cathode contact portions 161a, 161b. For example, the plurality of protruding patterns 160p can protrude from the upper edge of the step difference planarization layer 210 toward the trench portion 215, wherein the trench portion 215 is disposed in the step difference planarization layer 210. For example, the plurality of protruding patterns 160p can have a shape that protrudes further than the sidewalls of the trench portion 215.

[0150] The cathode contact portions 161a, 161b and the plurality of protruding patterns 160p may be, but are not limited to, made of the same material as the anode electrodes 160a, 160b. In the example, the cathode contact portions 161a, 161b and the plurality of protruding patterns 160p may include a conductive material. When the cathode contact portions 161a, 161b and the plurality of protruding patterns are made of the same material as the anode electrodes 160a, 160b, they can be formed in the same process, thus simplifying the processing steps.

[0151] A dam 165 may be disposed on the step difference planarization layer 210. Dam 165 may include, but is not limited to, inorganic insulating materials. Dam 165 may be formed to cover the edges of each of the anode electrodes 160a, 160b and cathode contact portions 161a, 161b. Furthermore, dam 165 may be disposed on the trench portion 215 while simultaneously covering multiple protruding patterns 160p. For example, dam 165 may be disposed on the sidewalls and bottom surface of the trench portion 215. Therefore, dam 165 may cover a portion of the surface of the connecting electrode 150 exposed by the trench portion 215 in the boundary region between the first-first sub-pixel SP1a and the first-second sub-pixel SP1b.

[0152] The dam 165 may include a first opening region OA1 that exposes a portion of the surface of the anode electrodes 160a, 160b and a second opening region OA2 that exposes a portion of the surface of the cathode contact portions 161a, 161b. The first opening region OA1 and the second opening region OA2 may be spaced apart from each other in a column direction. The first opening region OA1 may be a light-emitting region. In the example, the remaining regions other than the first opening region OA1 may be non-light-emitting regions.

[0153] Light-emitting layers 170a and 170b can be disposed on the anode electrodes 160a and 160b. The light-emitting layers 170a and 170b can be disposed on the anode electrodes 160a and 160b exposed in the first opening region OA1. The light-emitting layers 170a and 170b can be disposed along the sidewall and upper surface of the embankment 165. The light-emitting layers 170a and 170b can be disposed on the upper surface of the embankment 165 in the second opening region OA2, thereby exposing a portion of the surface of the cathode contact portions 161a and 161b.

[0154] A portion of the light-emitting layers 170a and 170b can be disposed on the bottom surface of the trench portion 215. This portion of the light-emitting layers 170a and 170b disposed in the trench portion 215 can be configured as the lower patterns 171a and 171b of structures 183a and 183b. The trench portion 215 can have an undercut structure, wherein the sidewalls are closer to the inner side than the ends of the plurality of protruding patterns 160p. Therefore, the ends of the embankment 165 covering the plurality of protruding patterns 160p can have a shape that protrudes more than the sidewalls of the trench portion 215. Therefore, the light-emitting layers 170a and 170b may not be disposed on the sidewalls of the trench portion 215. Therefore, the light-emitting layers 170a and 170b disposed in each sub-pixel SP1a and SP1b can be separated from each other due to the interruption of continuity at the corresponding trench portion 215.

[0155] Cathode electrodes 180a and 180b can be disposed on the light-emitting layers 170a and 170b. Cathode electrodes 180a and 180b can be disposed on the light-emitting layers 170a and 170b disposed on the first opening region OA1.

[0156] A portion of the cathode electrodes 180a and 180b can be configured as upper patterns 181a and 181b of structures 183a and 183b, which are disposed on lower patterns 171a and 171b of trench portions 215. Therefore, structures 183a and 183b, laminated with lower patterns 171a and 171b and upper patterns 181a and 181b, can be provided in each trench portion 215. In the example, the upper patterns 181a and 181b can be shaped to cover the upper surface and sidewalls of the lower patterns 171a and 171b.

[0157] Furthermore, since the cathode electrodes 180a and 180b are not deposited on the sidewalls of the trench portion 215, they can be separated from each other in the embankment 165 in the boundary region between the first-first sub-pixel SP1a and the first-second sub-pixel SP1b. Therefore, the first-first cathode electrode 180a disposed in the first-first sub-pixel SP1a can be configured to be separated from the first-second cathode electrode 180b disposed in the first-second sub-pixel SP1b due to the interruption of continuity at the corresponding trench portion 215.

[0158] Cathode electrodes 180a and 180b can form contact areas that connect to the exposed surfaces of cathode contact portions 161a and 161b, while simultaneously covering the ends of the light-emitting layers 170a and 170b separated from each other in the second opening region OA2. Cathode electrodes 180a and 180b can be electrically connected to cathode contact portions 161a and 161b through the contact areas.

[0159] Cathode electrodes 180a and 180b can be configured to cover the exposed areas of cathode contact portions 161a and 161b, thereby increasing the surface area in contact with the cathode contact portions 161a and 161b and reducing resistance. Furthermore, power voltage can be supplied to the first-first cathode electrode 180a disposed in the first-first sub-pixel SP1a and the first-second cathode electrode 180b disposed in the first-second sub-pixel SP1b, respectively. Therefore, even if a defect occurs in either the first-first sub-pixel SP1a or the first-second sub-pixel SP1b, the other can operate normally without repair processing, allowing the corresponding sub-pixel to be identified as normal. Thus, since repair processing such as laser cutting can be omitted, the processing steps can be optimized, thereby increasing the yield of the display device.

[0160] Figures 16 to 21 This is a diagram illustrating a method for manufacturing a display device according to another embodiment of the present disclosure. Figures 16 to 21 It is along Figure 4 The cross-sectional view taken from line VV′ in the diagram. For ease of explanation, Figures 16 to 21 Only a brief description is given of the step difference planarization layer 210 in the transistor array section 200. Furthermore, although... Figures 16 to 21 The first-first subpixel of the first subpixel is shown as an example, but the first-second subpixel and other subpixels have essentially the same configuration as the first-first subpixel.

[0161] Reference Figure 16The first-first anode electrode 160a, the first-first cathode contact portion 161a, and the plurality of protruding patterns 160p can be formed on the step difference planarization layer 210. The first-first anode electrode 160a, the first-first cathode contact portion 161a, and the plurality of protruding patterns 160p can comprise and be formed of the same material. In this case, they can be formed in the same process, and thus the processing steps can be simplified.

[0162] In a subsequent step, a mask pattern 300 can be formed on the step difference planarization layer 210. The mask pattern 300 can be formed by patterning a photoresist material. The mask pattern 300 may include an opening 300h that exposes a portion of the surface of a plurality of protruding patterns 160p. The first-first anode electrode 160a and the first-first cathode contact portion 161a can be blocked by the mask pattern 300.

[0163] Reference Figure 17 The trench portion 215 can be formed within the step difference planarization layer 210 by performing an etching process, in which a mask pattern 300 is used as an etching mask to etch the portion exposed through the opening hole 300h. Through the etching process, the step difference planarization layer 210 can be over-etched into an undercut shape with respect to a plurality of protruding patterns 160p. Since the step difference planarization layer 210 and the protruding patterns 160p have different etching rates, they can be formed into undercut shapes. For example, the protruding patterns 160p can have a relatively slower etching rate compared to the step difference planarization layer 210. Therefore, the step difference planarization layer 210 can be further etched inward from one end of each of the plurality of protruding patterns 160p. Thus, one end of each of the plurality of protruding patterns 160p can be formed into a shape that protrudes further than the sidewall of the trench portion 215. Next, the mask pattern 300 is removed.

[0164] Reference Figure 18 A dam 165 may be formed on the step difference planarization layer 210. The dam 165 may be formed to cover the edge of each of the first-first anode electrode 160a and the first-first cathode contact portion 161a. The dam 165 may include a first opening region OA1 exposing a portion of the surface of the anode electrode 160a and a second opening region OA2 exposing a portion of the surface of the cathode contact portion 161a. The dam 165 may be disposed between the first-first anode electrode 160a and the first-first cathode contact portion 161a, which are spaced apart from each other.

[0165] The embankment 165 may include an inorganic insulating material. Therefore, the embankment 165 may be formed on the two sidewalls and bottom surface of the trench portion 215, while covering multiple protruding patterns 160p.

[0166] Reference Figure 19 A first-first light-emitting layer 170a can be formed on the first opening region OA1 and the second opening region OA2. The first-first light-emitting layer 170a may include an organic material. The first-first light-emitting layer 170a can be formed on the exposed surfaces of the first-first anode electrode 160a and the first-first cathode contact portion 161a. The first-first light-emitting layer 170a can be formed to extend from the first opening region OA1 to the second opening region OA2. The first-first light-emitting layer 170a can extend along the upper surface and sidewalls of the embankment 165.

[0167] A portion of the first-first luminescent layer 170a may be formed on the bottom surface of the trench portion 215. Since the plurality of protruding patterns 160p have a shape that protrudes further than the sidewalls of the trench portion 215, the first-first luminescent layer 170a may not be formed on the sidewalls of the trench portion 215. Therefore, the first-first luminescent layer 170a may be separated at the edge of the embankment 165. A portion of the first-first luminescent layer 170a disposed on the bottom surface of the trench portion 215 may be formed as a lower pattern 171a.

[0168] Reference Figure 20 Only the portion of the first-first luminescent layer 170a formed on the exposed surface of the first-first cathode contact portion 161a can be selectively removed from it using laser drilling method L. Therefore, a portion of the surface of the first-first cathode contact portion 161a can be exposed in the second opening region OA2. In this example, the first-first cathode contact portion 161a can have the same surface area as the second opening region OA2. Furthermore, the first-first luminescent layer 170a can have a break in its continuity at the upper surface of the embankment 165 covering the edge of the first-first cathode contact portion 161a in the second opening region OA2. Therefore, the first-first luminescent layer 170a can be separated from the portion formed on the first opening region OA1 at the second opening region OA2.

[0169] Reference Figure 21 A first cathode electrode 180a can be formed. The first cathode electrode 180a can be formed on the first light-emitting layer 170a. Therefore, a first light-emitting element ED1a including a first anode electrode 160a, a first light-emitting layer 170a and a first cathode electrode 180a can be constructed in the first sub-pixel.

[0170] The first-first cathode electrode 180a can be formed to extend from the first opening region OA1 to the second opening region OA2. A portion of the first-first cathode electrode 180a can be configured as an upper pattern 181a on a lower pattern 171a provided on the bottom surface of the first-first trench portion 169a. Therefore, a first-first structure 183a including the lower pattern 171a and the upper pattern 181a can be formed on the bottom surface of the first-first trench portion 169a. (See also...) Figure 4 When viewed in a plan view, the first-first structure 183a can be formed as the outer part surrounding the first-first sub-pixel SP1a. For example, the first-first structure 183a can have a rectangular ring shape with a space portion disposed inside. Alternatively, the first structure 183a can have a polygonal ring shape.

[0171] The first cathode electrode 180a can be separated by a continuity interruption, with the trench portion 215 disposed therebetween. Therefore, the first cathode electrode 180a can be separated from the adjacent cathode electrode. The separated first cathode electrode 180a and the other cathode electrode can each be supplied with an electrical voltage. Thus, even if a defect occurs in a sub-pixel, an electrical voltage can be supplied to another sub-pixel without defects to enable it to emit light, thereby allowing the sub-pixel to operate normally.

[0172] The first-first cathode electrode 180a can form a contact region CA by contacting the entire exposed surface area of ​​the first-first cathode contact portion 161a in the second opening region OA2. The first-first cathode electrode 180a is formed to cover the exposed surface area of ​​the first-first cathode contact portion 161a, thereby increasing the contact area and thus having the effect of reducing resistance.

[0173] Figure 22 and Figure 23 This is an equivalent circuit diagram of a sub-pixel of a display device according to an embodiment of the present disclosure. For ease of explanation, in Figure 22 and Figure 23 Only the second transistor and the light-emitting element are shown in the image. Figure 23 and Figure 22 The equivalent circuits shown are the same, the difference being that... Figure 23 It also includes the light-emitting element ED1c, so a detailed description that will be repeated will be omitted.

[0174] Reference Figure 22According to embodiments of this disclosure, each of the plurality of sub-pixels may include a second transistor TR2 and light-emitting elements ED1a and ED1b. Light-emitting elements ED1a and ED1b may be disposed in a pair of sub-pixels emitting a single color. The light-emitting elements ED1a and ED1b disposed in the pair of sub-pixels may include a first-first light-emitting element ED1a as a primary light-emitting element and a first-second light-emitting element ED1b as a redundant light-emitting element. Each light-emitting element ED1a and ED1b may include an anode electrode, a light-emitting layer, and a cathode electrode. The first-first light-emitting element ED1a, which is the primary light-emitting element in the pair of sub-pixels, may be disposed in the primary sub-pixel, and the first-second light-emitting element ED1b, which is the redundant light-emitting element, may be disposed in the redundant sub-pixel in the pair of sub-pixels.

[0175] In the example, the second transistor TR2 can be a driving transistor for driving the light-emitting elements ED1a and ED1b. The second transistor TR2 may include a first node ND1, a second node ND2, a third node ND3, and a fourth node ND4. The first node ND1 of the second transistor TR2 can be a gate node. The first node ND1 of the second transistor TR2 can be electrically connected to the scan line of the second signal line SL2. The second nodes ND2 and the third node ND3 of the second transistor TR2 can be source nodes or drain nodes of the transistor.

[0176] The second node ND2 and the third node ND3 of the second transistor TR2 can be electrically connected to the anode electrodes of the light-emitting elements ED1a and ED1b. Therefore, one transistor can be connected to at least two light-emitting elements ED1a and ED1b that emit light of the same color. The fourth node ND4 of the second transistor TR2 can be electrically connected to the power line of the first signal line SL1 that supplies the high-potential power voltage EVDD.

[0177] The cathode electrodes of the light-emitting elements ED1a and ED1b can be separated from each other, allowing low-potential electrical voltages EVSS1a and EVSS1b to be applied to them respectively. For example, the cathode electrodes of the light-emitting elements ED1a and ED1b can be connected to the following according to the present disclosure: Figure 5 , Figure 14 and Figure 15 In any of the embodiments described herein, the cathode contact portion allows low-potential power supply voltages EVSS1a and EVSS1b to be applied to the cathode electrodes respectively. Therefore, the light-emitting elements ED1a and ED1b can be connected in parallel. The cathode electrodes of the light-emitting elements ED1a and ED1b can be connected according to the present disclosure. Figure 5 , Figure 14 and Figure 15In any of the embodiments, the structures 183a and 183b are separated from each other.

[0178] Reference Figure 23 According to embodiments of the present disclosure, each of the plurality of sub-pixels disposed in the display area of ​​the display device may further include a first-third light-emitting element ED1c in one sub-pixel, which emits light of the same color. For this purpose, the second node ND2, the third node ND3, and the fifth node ND5 of the second transistor TR2 may be electrically connected to the anode electrodes of the light-emitting elements ED1a, ED1b, and ED1c. Therefore, one transistor may be electrically connected to three light-emitting elements ED1a, ED1b, and ED1c that emit light of the same color. However, this is not exhaustive. For example, four light-emitting elements that emit light of the same color may be electrically connected to one transistor.

[0179] Furthermore, the cathode electrodes of the light-emitting elements ED1a, ED1b, and ED1c can be separated from each other, allowing low-potential electrical voltages EVSS1a, EVSS1b, and EVSS1c to be applied to the cathode electrodes respectively. Therefore, the light-emitting elements ED1a, ED1b, and ED1c can be connected in parallel.

[0180] The display device according to various embodiments of the present disclosure can be described as follows.

[0181] A display device according to embodiments of the present disclosure may include: a substrate including a display area and a non-display area; at least two light-emitting areas disposed on the display area and forming a sub-pixel; at least a trench portion disposed outside each light-emitting area; at least two contact areas disposed spaced apart from the respective light-emitting areas; a first electrode disposed in each light-emitting area; a contact wiring portion disposed in each contact area; a light-emitting layer disposed on the first electrode; and a second electrode disposed on the light-emitting layer and separated in the two light-emitting areas by the trench portion, wherein the separated portions of the second electrode may be electrically connected to the contact wiring portions respectively.

[0182] Although embodiments of the present disclosure have been described in detail with reference to the accompanying drawings, those skilled in the art should understand that the present disclosure is not necessarily limited to the above embodiments, and that the above embodiments can be practiced in various modifications without departing from the technical concept of the present disclosure. Therefore, the embodiments disclosed in this disclosure are not intended to limit the technical concept of the present disclosure, but rather to illustrate it, and the scope of the technical concept of the present disclosure is not limited by these embodiments. Therefore, it should be understood that the embodiments described above are given by way of example only in all respects and are not intended to limit the present disclosure.

Claims

1. A display device, comprising: A substrate, comprising a display area and a non-display area; At least two light-emitting areas are disposed on the display area and constitute a sub-pixel; At least a groove portion should be provided on the outer side of each light-emitting area; At least two contact areas, wherein the at least two contact areas are configured to be spaced apart from the corresponding light-emitting areas; The first electrode is set in each light-emitting region; Contact wiring portions are provided in each contact area; A light-emitting layer disposed on the first electrode; as well as A second electrode is disposed on the light-emitting layer and separated in the two light-emitting regions by the trench portion. The separated portions of the second electrode are electrically connected to the contact wiring portion.

2. The display device according to claim 1, wherein, The at least two light-emitting regions include a first sub-pixel and a first sub-pixel that emit light of the same color.

3. The display device according to claim 1, wherein, A portion of the surface of the contact wiring portion is exposed, and the separated portions of the second electrode respectively contact the entire surface of the exposed portion of the contact wiring portion.

4. The display device according to claim 2, wherein, The substrate further includes: a transistor; a planarization layer covering the transistor; and a connection electrode disposed on the planarization layer and electrically connected to the transistor. The first sub-pixel and the first sub-pixel are electrically connected to the transistor via the connecting electrode.

5. The display device according to claim 4, further comprising a protective layer disposed on the planarization layer, in, The groove portion includes a recessed bottom surface in the thickness direction of the protective layer, and opposing sidewalls extending from the bottom surface. The protective layer includes an inorganic insulating material.

6. The display device according to claim 4, further comprising a step difference planarization layer disposed on the planarization layer, in, The trench portion includes a recessed bottom surface in the thickness direction of the step difference planarization layer, and opposing sidewalls extending from the bottom surface. The step difference planarization layer exposes a portion of the surface of the connecting electrode.

7. The display device according to claim 1, wherein, Multiple light-emitting regions are arranged on the substrate in multiple row directions and multiple column directions. The light-emitting regions that emit different colors of light are alternately arranged in the multiple row directions and the multiple column directions, and In this sub-pixel, at least two light-emitting regions constituting the sub-pixel are arranged in a column direction.

8. The display device according to claim 1, wherein, The display area includes multiple transmissive areas and multiple pixel areas. The pixel areas include multiple light-emitting areas, and the transmissive areas do not overlap with the multiple light-emitting areas.

9. The display device of claim 1, further comprising a dam disposed in the light-emitting area and the contact area, the dam covering the edge of each of the light-emitting area and the contact area and having an end that protrudes further than the sidewall of the groove portion.

10. The display device according to claim 1, further comprising a structure disposed within the groove portion, in, The structure includes: Including the lower pattern of the light-emitting layer; and The upper pattern is disposed on the lower pattern and includes the second electrode.

11. The display device of claim 6, further comprising a plurality of protruding patterns disposed on the same plane as the first electrode and the contact wiring portion, and the plurality of protruding patterns having an end that protrudes further than the sidewall of the trench portion.

12. The display device of claim 11, further comprising a dam disposed in the light-emitting area and the contact area, the dam having an end that protrudes further than the sidewall of the groove portion, while covering the plurality of protruding patterns.

13. The display device according to claim 9, wherein, The embankment is disposed on the bottom surface and sidewalls of the trench portion and comprises inorganic insulating material.

14. The display device according to claim 1, further comprising a structure disposed within the groove portion, in, The structure includes: Including the lower pattern of the light-emitting layer; and The upper pattern includes the second electrode and covers the upper surface and sidewalls of the lower pattern.

15. The display device according to claim 14, wherein, When viewed in a plan view, the structure has a rectangular ring shape, which has a space portion disposed inside.

16. The display device according to claim 1, wherein, The second electrode is disposed in two adjacent light-emitting regions to be separated on opposite sides, wherein the trench portion is disposed between the two adjacent light-emitting regions.

17. The display device according to claim 10 or 14, wherein, The lower pattern is disposed on the bottom surface of the groove portion, but not on the sidewall of the groove portion.

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