Die bonding equipment

Abstract

The invention relates to the technical field of die bonders, in particular to die bonding equipment. The die bonding equipment comprises a base, a table board assembly and a guide rail assembly, the guide rail assembly comprises a fixed module and a movable module, the fixed module comprises a first fixed guide rail and a second fixed guide rail which are arranged at the two opposite ends of the base in parallel, and the movable module comprises a first movable guide rail and a second movable guide rail which are arranged in parallel. The sides, close to each other, of the first moving guide rail and the second moving guide rail are each connected with a binding head assembly, and each binding head assembly is provided with a suction nozzle and a dispensing assembly so as to execute chip mounting and dispensing actions. The first moving guide rail and / or the second moving guide rail move along the length directions of the first fixed guide rail and the second fixed guide rail so as to drive the corresponding binding head assemblies to move synchronously; the binding head assemblies are in sliding connection with the corresponding first moving guide rails or the second moving guide rails and can move in the length direction of the first moving guide rails or the second moving guide rails. The problems that existing die bonding equipment is poor in applicability and low in efficiency are solved.

Description

Technical Field

[0001] This invention relates to the field of die bonding machine technology, and particularly to a die bonding device. Background Technology

[0002] Die bonders are devices used to automatically place components at high speed and with high precision. They are the most critical and complex equipment in the entire chip packaging production process.

[0003] Currently, most die bonding equipment on the market has limited functionality, poor applicability, and low efficiency. It also has a small number of bonding nozzles and a small range of force control for the placement head with poor control precision. Therefore, it is difficult to apply to advanced die bonding processes that require high precision and simultaneous bonding of multiple types of chips. Summary of the Invention

[0004] To address the technical problems of poor applicability and low efficiency of existing die bonding equipment, this invention provides a die bonding device.

[0005] The present invention provides a die bonding device, comprising a base, a mesa assembly, and a guide rail assembly. Both the mesa assembly and the guide rail assembly are disposed on the upper surface of the base, with the guide rail assembly located above the mesa assembly. The guide rail assembly includes a fixed module and a movable module, which are vertically arranged, and the movable module is parallel to the mesa assembly. The fixed module includes a first fixed guide rail and a second fixed guide rail arranged parallel to each other at opposite ends of the base. The movable module includes a first movable guide rail and a second movable guide rail arranged parallel to each other. The guide rail is slidably connected to the first fixed guide rail and the second fixed guide rail at both ends; a binding head assembly is respectively connected to one side of the first movable guide rail and the second movable guide rail that are close to each other. The binding head assembly is provided with a suction nozzle and a dispensing assembly to perform patch application and dispensing operations; the first movable guide rail and / or the second movable guide rail moves along the length direction of the first fixed guide rail and the second fixed guide rail to drive the corresponding binding head assembly to move synchronously; the binding head assembly is slidably connected to the corresponding first movable guide rail or the second movable guide rail, and can move along the length direction of the first movable guide rail or the second movable guide rail.

[0006] Preferably, the head-binding assembly includes a ZR module, which includes multiple ZR drive components. Each ZR drive component is connected to a suction nozzle, which performs lifting and rotating movements through the ZR drive components. The multiple suction nozzles on the ZR module may be of the same or different types.

[0007] Preferably, the head-binding assembly includes a first mounting plate, on which a ZR module and a Z-axis module are fixed, and a second mounting plate is fixed on the Z-axis module, on which a vision inspection component, a height measurement component, and a dispensing component are fixed. When the Z-axis module is working, it drives the second mounting plate to perform lifting and lowering movements; A connecting plate is provided on one side of the first moving guide rail and the second moving guide rail that are close to each other, and the connecting plate is slidably connected to the first moving guide rail or the second moving guide rail; The connecting plate and the first mounting plate are fixedly connected to each other to connect the headgear assembly to the first moving guide rail and the second moving guide rail.

[0008] Preferably, the first fixed guide rail has a clearance opening at one end near the base, and the table assembly includes a track module. One end of the track module is fixed between the first fixed guide rail and the second fixed guide rail, and the other end passes through the clearance opening and extends outward from the base. The track module is perpendicular to the first fixed guide rail and is located between the first movable guide rail and the second movable guide rail.

[0009] Preferably, the tabletop assembly sequentially defines a loading / unloading area and a processing area along its length; the loading / unloading area is located on the side of the first fixed guide rail away from the second fixed guide rail, the processing area is located between the first fixed guide rail and the second fixed guide rail, and the processing area corresponds to the movable area of ​​the first movable guide rail and the second movable guide rail.

[0010] Preferably, the platform assembly includes a material stage and a wafer stage, the material stage and the wafer stage are disposed on the track module and move between the loading / unloading area and the processing area via the track module; the track module includes a first track, a second track and a third track arranged in parallel and at intervals, the first track and the third track are respectively located on opposite sides of the second track, a material stage is slidably connected to the first track and the third track respectively, and the wafer stage is slidably connected to the second track.

[0011] Preferably, the platform assembly includes a vacuum device; the vacuum device includes a vacuum tube, which is connected to the material stage and the wafer stage respectively to adsorb the material placed thereon; the vacuum tube can move with the material stage and the wafer stage.

[0012] Preferably, the tabletop assembly further includes a nozzle holder and a top-view camera, both located in the processing area; the first track has a nozzle holder and a top-view camera on the side away from the second track, and the third track has a nozzle holder and a top-view camera on the side away from the second track; the nozzle holder stores multiple different types of nozzles; the top-view camera is positioned close to the material table and is used to identify the position of the material adsorbed by the nozzles on the head-binding assembly.

[0013] Preferably, the visual detection component includes a first camera and a second camera, wherein the recognition accuracy of the first camera and the second camera is different.

[0014] Preferably, the binding head assemblies on the first and second moving guide rails can be operated simultaneously on the wafer stage without interfering with each other.

[0015] Compared with the prior art, the die bonding device provided by the present invention has the following advantages: 1. This invention provides a die bonding device, in which the table assembly and guide rail assembly are both disposed on the upper surface of the base, with the guide rail assembly located above the table assembly, forming a spatial misalignment in the vertical direction. This ensures that the table assembly and guide rail assembly do not interfere with each other during operation, and also allows for a compact arrangement of each component, reducing the overall size of the die bonding device. The fixed module and moving module of the guide rail assembly are vertically arranged, and the moving guide rail can move along the length of the fixed guide rail. The binding head assembly on the moving guide rail can also move along the length of the moving guide rail. Through the two-stage movement of the moving guide rail and itself, the binding head assembly achieves flexible movement in the XY direction above the base, which can fully cover the working area of ​​the table assembly and avoid blind spots. Furthermore, each binding head assembly integrates a suction nozzle and a dispensing assembly, enabling a single binding head assembly to simultaneously perform placement and dispensing functions. This eliminates the need to switch binding heads and reposition during dispensing and placement operations, shortening the die bonding process time and improving the overall die bonding efficiency.

[0016] 2. In the die bonding equipment provided in this embodiment of the invention, the ZR module includes multiple ZR drive components, and each ZR drive component is connected to a suction nozzle. Through the design of multiple suction nozzles, the binding head assembly can pick up multiple materials at the same time. Compared with the traditional single suction nozzle design, it can significantly increase the material processing capacity of a single operation and improve die bonding efficiency. At the same time, it allows multiple different types of suction nozzles to be integrated on the same binding head assembly, which is convenient for quick switching or simultaneous operation according to process requirements. This allows the equipment to adapt to materials of different sizes and shapes, broadens the scope of application of the equipment, and reduces the equipment modification costs caused by material changes. The ZR drive components can drive the suction nozzles to achieve lifting and rotation movements, thereby accurately adjusting the height difference between the suction nozzle and the table assembly and the material bonding angle, ensuring the positional accuracy of material bonding.

[0017] 3. In the die bonding equipment provided in this embodiment of the invention, the bonding head assembly includes a vision inspection component and a height measurement component. The vision inspection component can identify the position coordinates of the material in real time, and the height measurement component can detect the height distance between the bonding head assembly and the material or wafer. The two work together to dynamically calibrate the dispensing position and the placement height, effectively reducing the die bonding defect rate caused by inaccurate positioning. The bonding head assembly is fixed to the first moving guide rail and the second moving guide rail through the connection of the first mounting plate and the connecting plate, thereby realizing the overall movement of the bonding head assembly. The Z-axis module is connected to the second mounting plate, which integrates the vision inspection component, the height measurement component and the dispensing component, to drive the components to rise and fall synchronously, realizing integrated detection and control of the material position, height and dispensing process, improving the placement accuracy and dispensing consistency.

[0018] 4. The die bonding equipment provided in this embodiment of the invention has an avoidance opening on the first fixed guide rail and the track module extends through to the outside of the base, so that loading and unloading operations can be completed outside the equipment without having to go deep into the equipment. This not only facilitates the operation of operators to pick up and put down materials, but also avoids the risk of collision with the guide rails and binding head assembly inside the equipment during loading and unloading. Secondly, the design of the avoidance opening provides space for the extension of the track module, optimizes the spatial layout inside the die bonding equipment, facilitates the smooth movement of materials between the processing area and the loading and unloading area, and ensures the vertical layout of the track module and the fixed guide rail, so that the track module can be accurately positioned between the two moving guide rails. This ensures that when the binding head assembly moves along the moving guide rail, it can directly cover the table on the track module, shorten the working stroke of the binding head assembly, and improve the response speed.

[0019] 5. The die bonding equipment provided in this embodiment of the invention divides the loading and unloading and processing functional areas along the length of the table assembly, realizing the physical separation of the material loading, processing and unloading areas, and improving the continuous operation capability of the equipment; the processing area is set as a movable area corresponding to the moving guide rail, ensuring that the movement range of the binding head assembly can completely cover the processing area, and all processing actions can be completed without additional adjustment of the module stroke, reducing equipment debugging time, and avoiding processing omissions due to insufficient stroke.

[0020] 6. In the die bonding equipment provided in this embodiment of the invention, the track module includes a first track, a second track, and a third track that are parallel and spaced apart. Material platforms are set on the first and third tracks, and a wafer stage is set on the second track. This allows materials and wafers to move independently along the tracks, facilitating flexible allocation of different workstations during processing. The wafer stage is independently set on the middle second track, separating its movement path from that of the material platforms, avoiding interference between the wafer and other materials during movement. At the same time, it ensures that the wafer stage is accurately positioned at the working center of the two bonding assemblies, improving the consistency of wafer bonding. Material platforms are set on both sides of the wafer stage, allowing the two bonding assemblies to have separate material supplies, shortening the material picking distance of the bonding assemblies and improving placement efficiency. The parallel and spaced layout of the three tracks ensures that the movement of each platform does not interfere with each other, improving the stability of equipment operation.

[0021] 7. The die bonding equipment provided in this embodiment of the invention has a vacuum adsorption device that is connected to the material stage and the wafer stage via a vacuum tube. The vacuum tube can move with the material stage and the wafer stage. With this design, the vacuum device can fix the material and the wafer on the corresponding stage when it is working, preventing the material from shifting or tilting when the stage moves or the binding assembly is working, ensuring the positioning accuracy of the material and reducing die bonding deviation. The vacuum tube connects the material stage and the wafer stage and moves with them, which can maintain stable adsorption during material transportation and processing, prevent material displacement or falling off, ensure the reliability and accuracy of the processing, and improve the reliability of equipment operation.

[0022] 8. The die bonding equipment provided in this embodiment of the invention is equipped with nozzle placement racks and upward-viewing cameras on both sides of the processing area to accommodate the synchronous operation of the head-binding assemblies on the two moving guide rails, avoiding waiting problems caused by insufficient equipment resources on one side. At the same time, placing the upward-viewing camera close to the material table shortens the distance the head-binding assembly moves between the material table and the upward-viewing camera, facilitating the head-binding assembly to quickly change nozzles and detect the position of the adsorbed material in real time, improving the equipment's adaptability to different processes and the visual positioning efficiency before mounting. It should be understood that the nozzle placement rack can store various types of nozzles. When the processed material is changed, the head-binding assembly can directly pick up and place nozzles inside the equipment without disassembling the assembly or connecting an external nozzle storage device, shortening the nozzle change time and reducing changeover costs.

[0023] 9. In the die bonding equipment provided in this embodiment of the invention, the vision inspection component includes a first camera and a second camera. The first camera and the second camera have different recognition accuracies. By setting two cameras with different accuracies, the detection requirements of different scenarios can be adapted. The low-precision camera can quickly complete the coarse positioning of the material and improve the detection efficiency; the high-precision camera can accurately identify the slight displacement of the material before bonding, ensuring the die bonding accuracy and achieving a balance between efficiency and accuracy, improving the alignment accuracy and system response efficiency. Furthermore, when facing process flows with different accuracy requirements, the dual-precision vision inspection system does not need to frequently change or adjust the camera parameters, and can handle the detection of materials with different sizes and accuracy requirements, reducing equipment debugging time and broadening the equipment's adaptability to different precision die bonding requirements.

[0024] 10. The die bonding equipment provided in this embodiment of the invention allows the binding head assemblies on the first and second moving guide rails to operate simultaneously on the wafer stage without interfering with each other. By operating the dual binding head assemblies synchronously, dispensing and placement actions can be completed simultaneously in different areas of the wafer stage. Compared with a single binding head assembly, this can nearly double the wafer processing efficiency, significantly improving the production efficiency of the equipment. It is especially suitable for large-size wafers or multi-chip simultaneous mounting or composite process scenarios. The dual binding head assemblies do not interfere with each other during synchronous operation, avoiding the risk of component collision damage. At the same time, it ensures that the operating accuracy of the two components does not affect each other, ensuring the consistency of wafer bonding and the safety of equipment operation. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the structural framework of a die bonding device provided in an embodiment of the present invention.

[0027] Figure 2 This is a partial structural block diagram of a die bonding device provided in an embodiment of the present invention.

[0028] Figure 3 This is a schematic diagram of the structure of a binding head assembly in a die bonding device provided in an embodiment of the present invention.

[0029] Figure 4 This is a front view of a binding head assembly in a die bonding device provided in an embodiment of the present invention.

[0030] Figure 5 This is a schematic diagram of the overall structure of a die bonding device provided in an embodiment of the present invention.

[0031] Figure 6 This is a partially enlarged view of a die bonding device provided in an embodiment of the present invention.

[0032] Figure 7 This is a schematic diagram of the frame of the mesa assembly in a die bonding device provided in an embodiment of the present invention.

[0033] Figure 8 This is a schematic diagram of the structural framework of a mesa assembly in a die bonding device provided in an embodiment of the present invention.

[0034] Explanation of reference numerals in the attached diagram: 100. Die bonding equipment; 1. Base; 11. Fixed module; 111. First fixed guide rail; 1111. Clearance opening; 1112. First slide rail; 1113. Second slide rail; 112. Second fixed guide rail; 1121. Third slide rail; 1122. Fourth slide rail; 12. Moving module; 121. First moving guide rail; 122. Second moving guide rail; 2. Tabletop assembly; 21. Track module; 211. First track; 212. Second track; 213. Third track; 22. Material table; 23. Die bonding table; 24. Nozzle placement rack; 25. Top-view camera; 26. Vacuum device; 261. Vacuum air pipe; 27. Loading and unloading area; 28. Processing area; 3. Binding head assembly; 31. Dispensing assembly; 32. Height measurement assembly; 33. Vision inspection assembly; 331. First camera; 332. Second camera; 34. ZR module; 341. ZR drive; 342. Nozzle; 35. Z-axis module; 36. First mounting plate; 37. Second mounting plate; 38. Connecting plate. Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0036] In the embodiments provided by this invention, it should be understood that "B corresponding to A" means that B is associated with A, and B can be determined based on A. However, it should also be understood that determining B based on A does not mean determining B solely based on A; B can also be determined based on A and / or other information.

[0037] It should be understood that the phrase "one embodiment" or "an embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of the invention. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Those skilled in the art should also recognize that the embodiments described in the specification are optional embodiments, and the actions and modules involved are not necessarily essential to the invention.

[0038] In various embodiments of the present invention, it should be understood that the sequence number of each process does not necessarily imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0039] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, or they may sometimes be executed in reverse order, depending on the functions involved. It is particularly important to note that each block in a block diagram and / or flowchart, and combinations of blocks in block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0040] Please see Figures 1-4This invention provides a die bonding device 100, including a base 1, a platform assembly 2, and a guide rail assembly. Both the platform assembly 2 and the guide rail assembly are disposed on the upper surface of the base 1, with the guide rail assembly located above the platform assembly 2. The guide rail assembly includes a fixed module 11 and a movable module 12, which are vertically arranged, with the movable module 12 parallel to the platform assembly 2. The fixed module 11 includes a first fixed guide rail 111 and a second fixed guide rail 112 parallel to each other at opposite ends of the base 1. The movable module 12 includes a first movable guide rail 121 and a second movable guide rail 122 parallel to each other. The first fixed guide rail 121 and the second fixed guide rail 112 are slidably connected to each other. The first moving guide rail 121 and the second moving guide rail 122 are respectively connected to the side of the first moving guide rail 121 and the second moving guide rail 122 that are close to each other. The binding head assembly 3 is provided with a suction nozzle 342 and a dispensing assembly 31 to perform the patch application and dispensing actions. The first moving guide rail 121 and / or the second moving guide rail 122 move along the length direction of the first fixed guide rail 111 and the second fixed guide rail 112 to drive the corresponding binding head assembly 3 to move synchronously. The binding head assembly 3 is slidably connected to the corresponding first moving guide rail 121 or second moving guide rail 122 and can move along the length direction of the first moving guide rail 121 or the second moving guide rail 122.

[0041] The die bonding device 100 provided in this embodiment of the invention has a table assembly 2 and a guide rail assembly both disposed on the upper surface of a base 1, with the guide rail assembly located above the table assembly 2, so as to form a spatial misalignment in the vertical direction. This ensures that the table assembly 2 and the guide rail assembly do not interfere with each other during operation, and also allows the components to be arranged compactly, reducing the overall volume of the die bonding device 100.

[0042] In some embodiments, the bottom of the moving module 12 is higher than the top of the tabletop assembly 2, and the moving module 12 does not interfere with the tabletop assembly 2 below it when it moves.

[0043] Understandably, the fixed module 11 and the movable module 12 of the guide rail assembly are arranged vertically. The movable module 12 is slidably mounted on the fixed module 11 and parallel to the table assembly 2. The position of the table assembly 2 corresponds to the range of motion of the movable module 12. The movable guide rail can move along the length direction of the fixed guide rail, that is, along the width direction of the table assembly 2. The binding head assembly 3 on the movable guide rail can also move along the length direction of the movable guide rail, that is, along the length direction of the table assembly 2. Through the two-stage movement of the movable guide rail and itself, the binding head assembly 3 realizes flexible movement in the XY direction above the base 1, which can fully cover the working area of ​​the table assembly 2 and avoid blind spots.

[0044] As a feasible implementation, the first fixed guide rail 111 is provided with a first slide rail 1112 and a second slide rail 1113 spaced apart along its length. The second fixed guide rail 112 is provided with a third slide rail 1121 and a fourth slide rail 1122 spaced apart along its length. The two ends of the first movable guide rail 121 are connected to the first slide rail 1112 and the third slide rail 1121, respectively. The two ends of the second movable guide rail 122 are connected to the third slide rail 1113 and the fourth slide rail 1122, respectively. The first movable guide rail 121 and the second movable guide rail 122 move under the guidance of the corresponding slide rails. The spaced arrangement of the first slide rail 1112 and the second slide rail 1113, the third slide rail 1121 and the fourth slide rail 1122 ensures that the first movable guide rail 121 and the second movable guide rail 122 will not collide during movement, thus ensuring that the die bonding equipment 100 can work normally.

[0045] Specifically, a set of binding head assemblies 3 are respectively arranged on one side of the first moving guide rail 121 and the second moving guide rail 122 close to each other. Each binding head assembly 3 integrates a suction nozzle 342 and a dispensing assembly 31, so that a single binding head assembly 3 can simultaneously perform placement and dispensing functions. When the equipment performs dispensing and placement operations, there is no need to switch binding heads and reposition, which shortens the operation time of the die bonding process and improves the overall die bonding efficiency.

[0046] Furthermore, the head-binding assembly 3 includes a ZR module 34, which includes multiple ZR drive members 341. Each ZR drive member 341 is connected to a suction nozzle 342, which achieves lifting and rotating movements through the ZR drive members 341. The multiple suction nozzles 342 on the ZR module 34 may be of the same or different types.

[0047] In the die bonding equipment 100 provided in this embodiment of the invention, the ZR module 34 includes a plurality of ZR drive units 341 arranged in parallel, and each ZR drive unit 341 is connected to a nozzle 342. Through the design of multiple nozzles 342, a single bonding head assembly 3 can pick up multiple chips for bonding at the same time. Compared with the traditional single nozzle 342 design, it can greatly increase the material processing capacity of a single operation and improve the die bonding efficiency.

[0048] Specifically, the number of nozzles 342 set on the ZR module 34 can be set according to actual application needs, and no further restrictions are imposed here.

[0049] Understandably, the ZR drive unit 341 has the driving functions of the Z-axis and R-axis. When it is working, it can drive the nozzle 342 to achieve lifting and rotation movements, thereby accurately adjusting the height difference between the nozzle 342 and the table assembly 2 and the material placement angle, ensuring the positional accuracy of the material bonding.

[0050] In some embodiments, the nozzles 342 provided on the ZR module 34 are of different types. By allowing multiple different types of nozzles 342 to be integrated on the same binding assembly 3, multiple chips can be picked up and mounted simultaneously, which is suitable for mounting various types of chips onto wafers. The setting of multiple types of nozzles 342 also makes it easy for the equipment to quickly switch or perform multiple operations simultaneously according to process requirements, enabling the equipment to adapt to materials of different sizes and shapes, broadening the scope of application of the equipment, and reducing the equipment modification costs caused by material changes. Please refer to the following: Figure 6 The head-binding assembly 3 includes a first mounting plate 36, on which a ZR module 34 and a Z-axis module 35 are fixed. A second mounting plate 37 is fixed on the Z-axis module 35, on which a vision inspection component 33, a height measuring component 32, and a dispensing component 31 are fixed. When the Z-axis module 35 is working, it drives the second mounting plate 37 to perform lifting and lowering movements. A connecting plate 38 is provided on one side of the first moving guide rail 121 and the second moving guide rail 122, which are close to each other. The connecting plate 38 is slidably connected to the first moving guide rail 121 or the second moving guide rail 122. The connecting plate 38 is fixedly connected to the first mounting plate 36 to connect the head-binding assembly 3 to the first moving guide rail 121 and the second moving guide rail 122.

[0051] It should be noted that the connecting plate 38 can slide along the length of the first moving guide rail 121 or the second moving guide rail 122. The head binding assembly 3 is connected to the connecting plate 38 through the first mounting plate 36, so that when the connecting plate 38 slides, it drives the head binding assembly 3 to move synchronously along the length of the first moving guide rail 121 or the second moving guide rail 122.

[0052] Understandably, the vision inspection component 33 is used to identify the position coordinates of the material, and the height measurement component 32 can detect the height between the binding head component 3 and the chip or wafer. The two work together to dynamically calibrate the dispensing position and the mounting height, effectively reducing the die bonding defect rate caused by inaccurate positioning.

[0053] In one implementation, the vision inspection component 33, the height measurement component 32, and the dispensing component 31 are all integrated on the second mounting plate 37, which is fixed on the Z-axis module 35. Under the action of the Z-axis module 35, the vision inspection component 33, the height measurement component 32, and the dispensing component 31 move up and down through the second mounting plate 37, thereby achieving integrated detection and control of the material position, height, and dispensing process. Under the action of the second mounting plate 37, the up and down movement of the vision inspection component 33, the height measurement component 32, and the dispensing component 31 can be kept synchronized, improving the alignment accuracy of the patch and the consistency of the dispensing.

[0054] Specifically, the bottom surface of the dispensing assembly 31 is lower than the bottom surface of the vision inspection assembly 33 and the height measurement assembly 32, so as to ensure that when the dispensing assembly 31 moves above the wafer substrate and descends to perform dispensing, the vision inspection assembly 33 and the height measurement assembly 32, which descend synchronously with it, will not collide with the wafer substrate, thus ensuring the normal execution of the dispensing process.

[0055] As another implementation, after the dispensing assembly 31 is driven by the Z-axis module 35 to rise, its bottom surface is higher than the bottom surface of the ZR module 34, so that when the ZR module 34 is mounted on the wafer substrate, the dispensing assembly 31 will not collide with the wafer substrate, thus ensuring the normal execution of the mounting process.

[0056] Specifically, the vision inspection component 33 includes a first camera 331 and a second camera 332. The first camera 331 and the second camera 332 have different recognition accuracies. By setting two cameras with different accuracies, the inspection needs of different scenarios can be adapted. The low-precision camera can quickly complete the coarse positioning of materials and improve inspection efficiency. The high-precision camera can accurately identify the slight deviation of materials before bonding, ensuring die bonding accuracy and achieving a balance between efficiency and accuracy, thereby improving alignment accuracy and system response efficiency. Secondly, when facing process flows with different accuracy requirements, the dual-precision vision inspection system does not need to frequently change or adjust camera parameters, and can handle the inspection of materials with different sizes and accuracy requirements, reducing equipment debugging time and broadening the equipment's adaptability to different precision die bonding needs.

[0057] As a feasible implementation, the first camera 331 is a 1x camera and the second camera 332 is a 4x camera. The first camera 331 is used to identify the material and position of the low-precision patch, and the second camera 332 is used to identify the material and position of the high-precision patch.

[0058] It is understandable that although high-precision cameras can also be used for the position recognition of low-precision patches, the field of view of a high-precision camera, such as a 4x camera, is smaller than that of a 1x camera. If a 4x camera is used to perform position recognition in the low-precision patch process, the small field of view of the 4x camera may not be able to cover all the recognition features, thus requiring the recognition point to be moved and multiple recognitions to be performed.

[0059] It should be noted that the number of cameras and the recognition accuracy of the cameras set on the visual inspection component 33 can be adjusted according to actual application requirements, as long as they can adapt to various process requirements; the above description is only one embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the principles of the present invention should be included within the protection scope of the present invention.

[0060] Please see Figures 5-7The first fixed guide rail 111 has a clearance opening 1111 at one end near the base 1. The table assembly 2 includes a track module 21. One end of the track module 21 is fixed between the first fixed guide rail 111 and the second fixed guide rail 112, and the other end passes through the clearance opening 1111 and extends outward from the base 1. The track module 21 is perpendicular to the first fixed guide rail 111 and is located between the first moving guide rail 121 and the second moving guide rail 122.

[0061] It should be noted that the first fixed guide rail 111 and the second fixed guide rail 112 are located at opposite ends of the base 1. One end of the track module 21 is located in the middle of the first fixed guide rail 111 and the second fixed guide rail 112, and the other end extends toward the first fixed guide rail 111, passes through the clearance opening 1111 on the first fixed guide rail 111, and is partially exposed on the base 1. The design of the clearance opening 1111 provides space for the extension of the track module 21, optimizes the internal spatial layout of the die bonding equipment 100, and facilitates the movement of materials on the track to complete the processing.

[0062] Specifically, the track module 21 and the first fixed guide rail 111 are arranged in a cross shape, and the part of the track module 21 located between the first fixed guide rail 111 and the second fixed guide rail 112, and also located between the first moving guide rail 121 and the second moving guide rail 122. That is, the space enclosed by the fixed module 11 and the moving module 12 corresponds to the track module 21. This allows the moving trajectory of the head-binding assembly 3 to cover the working area on the track assembly, shorten the working stroke of the head-binding assembly 3, and improve the response speed.

[0063] Please refer to the previous document. Figure 1 In some embodiments, the tabletop assembly 2 is sequentially defined along its length as a loading / unloading area 27 and a processing area 28; the loading / unloading area 27 is located on the side of the first fixed guide rail 111 away from the second fixed guide rail 112, and the processing area 28 is located between the first fixed guide rail 111 and the second fixed guide rail 112, and the processing area 28 corresponds to the movable area of ​​the first movable guide rail 121 and the second movable guide rail 122.

[0064] Understandably, by clearly defining the functional areas for loading, unloading, and processing on the tabletop component 2, the regional physical separation of loading, processing, and unloading is achieved, improving the continuous operation capability of the equipment. The processing area 28 is set as a movable area corresponding to the moving guide rail, ensuring that the movement range of the head-binding component 3 can completely cover the processing area 28. All processing actions can be completed without additional adjustment of the module stroke, reducing equipment debugging time and avoiding processing omissions due to insufficient stroke.

[0065] It should be noted that the processing area 28 is located at one end of the track module 21 near the second fixed guide rail 112, and the loading and unloading area 27 is located at one end of the track module 21 near the first fixed guide rail, that is, the part that extends outward relative to the base 1. By setting the loading and unloading area 27 outside the base 1, the operator can perform loading and unloading operations outside the die bonding equipment 100 without having to go deep into the equipment. This not only makes it convenient for the operator to pick up and put down materials, but also avoids the risk of collision with the guide rails and binding head assembly 3 inside the equipment during the loading and unloading process.

[0066] Please see Figure 1 , Figure 7 and Figure 8 The platform assembly 2 includes a material stage 22 and a wafer stage 23. The material stage 22 and the wafer stage 23 are mounted on the track module 21 and move between the loading / unloading area 27 and the processing area 28 via the track module 21. The track module 21 includes a first track 211, a second track 212 and a third track 213 arranged in parallel and at intervals. The first track 211 and the third track 213 are located on opposite sides of the second track 212. A material stage 22 is slidably connected to the first track 211 and the third track 213 respectively, and a wafer stage 23 is slidably connected to the second track 212.

[0067] In the die bonding equipment 100 provided in this embodiment of the invention, the track module 21 includes a first track 211, a second track 212, and a third track 213 that are parallel and spaced apart. The parallel and spaced arrangement of the three tracks ensures that the movement of each platform does not interfere with each other, thereby improving the stability of the equipment operation. Material platforms 22 are set on the first track 211 and the third track 213, and a wafer platform 23 is set on the second track 212, so that materials and wafers can move independently along the tracks. This facilitates flexible allocation of different workstations during the processing. The wafer platform 23 is independently set on the middle second track 212, separating its movement path from that of the material platform 22, thus avoiding interference between the wafer and other materials during the movement process. At the same time, it ensures that the wafer platform 23 can be accurately positioned at the working center of the two bonding head assemblies 3, thereby improving the consistency of wafer bonding.

[0068] Specifically, material stations 22 are set on both sides of the wafer stage 23, so that the two binding assemblies 3 have separate material supply, which shortens the material picking distance of the binding assembly 3 and improves the mounting efficiency.

[0069] In some embodiments, the wafer stage 23 is used to place the wafer substrate to be mounted, and the material stage 22 is used to place the chip. The die bonding equipment 100 provided in this embodiment can perform flat mounting or stack mounting on the wafer substrate, and it is suitable for a variety of advanced packaging processes.

[0070] Optionally, the material stage 22 is equipped with multiple waffle box placement areas, which can be used to place different types of chips, so that the die bonding equipment 100 can perform mounting processing on various types of chips.

[0071] As a feasible implementation, the tabletop assembly 2 also includes a nozzle placement rack 24 and a top-view camera 25, both of which are located in the processing area 28; a nozzle placement rack 24 and a top-view camera 25 are provided on the side of the first track 211 away from the second track 212, and a nozzle placement rack 24 and a top-view camera 25 are provided on the side of the third track 213 away from the second track 212; the top-view camera 25 is located close to the material table 22 and is used to identify the position of the material adsorbed by the nozzle 342 on the head-binding assembly 3.

[0072] It should be noted that a material platform 22 is slidably connected to the first track 211 and the third track 213, and an upward-viewing camera 25 is set near the first track 211 or the third track 213. By setting the upward-viewing camera 25 close to the material platform 22, the distance that the binding head assembly 3 moves between the material platform 22 and the upward-viewing camera 25 is shortened. After the binding head assembly 3 grabs the chip from the material platform 22, it can quickly move to the upper part of the nearby upward-viewing camera 25 to identify and adjust the position of the chip on the binding head assembly 3.

[0073] Specifically, the suction nozzle 342 and the upward-viewing camera 25 are located on the side of the first track 211 or the third track 213 away from the second track 212, thereby shortening the distance between the first track 211, the second track 212 and the third track 213, reducing the moving distance of the binding assembly 3 during operation, and improving the mounting efficiency. Suction nozzle placement racks 24 and upward-viewing cameras 25 are set on both sides of the processing area 28 to adapt to the synchronous operation of the binding assembly 3 on the two moving guide rails, avoiding the waiting problem caused by insufficient equipment resources on one side.

[0074] In some embodiments, the nozzle placement rack 24 stores multiple different types of nozzles 342. When the processed material is changed, the head binding assembly 3 can directly pick up and put in the nozzles 342 inside the equipment without disassembling the assembly or connecting an external nozzle storage device, thus shortening the nozzle replacement time and reducing the replacement cost.

[0075] Furthermore, the platform assembly 2 includes a vacuum device 26; the vacuum device 26 includes a vacuum tube 261, which is connected to the material stage 22 and the wafer stage 23 respectively, to adsorb the materials placed on them; the vacuum tube 261 can move with the material stage 22 and the wafer stage 23.

[0076] The die bonding equipment 100 provided in this embodiment of the invention has a vacuum adsorption device that is connected to the material stage 22 and the wafer stage 23 via a vacuum tube 261. The vacuum tube 261 can move with the material stage 22 and the wafer stage 23. With this design, when the vacuum device 26 is working, it can fix the material and the wafer on the corresponding stage, preventing the material from shifting or tilting when the stage moves or the binding assembly 3 is working, ensuring the positioning accuracy of the material and reducing die bonding deviation. The vacuum tube 261 connects the material stage 22 and the wafer stage 23 and moves with them, which can maintain stable adsorption during material transportation and processing, prevent material displacement or falling off, ensure the reliability and accuracy of the processing, and improve the reliability of equipment operation.

[0077] It should be noted that the die bonding equipment 100 provided in this embodiment can complete chip mounting through the following workflow: The operator first places the waffle box containing the chip onto the material stage 22 in the loading / unloading area 27, places the wafer substrate onto the wafer stage 23, and turns on the vacuum device 26 to firmly attach the chip and wafer substrate to the material stage 22 and wafer stage 23. Then, the track module 21 is activated to push the material stage 22 and wafer stage 23, which are loaded with the chip and wafer substrate, from the loading / unloading area 27 to the processing area 28. At this time, the material stage 22 and wafer stage 23 are located below the movable area of ​​the first moving guide rail 121 and the second moving guide rail 122. Then, the binding head assembly 3 is moved above the material stage 22, and the chip on the material stage 22 is photographed and identified by the vision inspection component 33. After obtaining the center coordinates of the chip, the suction nozzle 342 on the ZR module 34 is moved... Move the assembly above the center coordinates to pick up the chip. It should be understood that the head assembly 3 is equipped with multiple nozzles 342. Repeat the above operation until all nozzles 342 on the ZR module 34 have picked up the chip. Move the head assembly 3 above the upward-viewing camera 25 and take a second picture of the chip on each nozzle 342 to identify the placement center of the chip picked up by the nozzle 342. After identifying and adjusting the chip position on the nozzle 342, move the head assembly 3 above the wafer stage 23. Use the vision inspection component 33 to take a picture of the position to be placed on the wafer substrate and use the height measurement component 32 to detect the height of the position to be placed. Based on the detection data of the vision inspection component 33 and the height measurement component 32, move the dispensing component 31 to dispense glue to the position to be placed. Then move the nozzle 342 above the position to be placed and attach the chip to the wafer substrate.

[0078] As an optional implementation, the dispensing assembly 31 first dispenses adhesive to multiple mounting positions, and then moves the binding head assembly 3 to sequentially mount the chips on different nozzles 342 to different mounting positions that have already undergone dispensing.

[0079] As another feasible implementation, after the dispensing assembly 31 dispenses adhesive to a mounting position, it moves the nozzle 342 above the mounting position and attaches the chip thereto to the mounting position. The above operation is repeated until all the chips on the nozzle 342 of the binding assembly 3 are attached to the wafer substrate.

[0080] Specifically, when the wafer substrate completes chip mounting and / or all chips on the material stage 22 are mounted onto the wafer substrate, the track module 21 pushes the material stage 22 and the wafer stage 23 to the loading / unloading area 27 for unloading or material replenishment.

[0081] As a preferred embodiment, the binding assembly 3 on the first moving guide rail 121 and the second moving guide rail 122 can be operated simultaneously on the wafer stage 23 without interfering with each other. By operating the dual binding assembly 3 synchronously, dispensing and placement actions can be completed simultaneously in different areas of the wafer stage 23. Compared with the single binding assembly 3, the wafer processing efficiency can be nearly doubled, significantly improving the production efficiency of the equipment. It is especially suitable for large-size wafers or multi-chip simultaneous mounting or composite process scenarios.

[0082] It should be noted that the die bonding equipment 100 pre-plans the movement paths of different binding head components 3 based on the position of the wafer stage 23 and controls the binding head components 3 to move within the preset working area. By rationally planning the movement paths and working areas of the two binding head components 3, the two binding head components 3 do not interfere with each other when working synchronously, avoiding the risk of component collision damage. At the same time, it ensures that the working accuracy of the two components does not affect each other, ensuring the consistency of wafer bonding and the safety of equipment operation.

[0083] The die bonding apparatus disclosed in the embodiments of the present invention has been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of the present invention. Furthermore, those skilled in the art will recognize that, based on the ideas of the present invention, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of the present invention. Any modifications, equivalent substitutions, and improvements made within the principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A die bonding device, characterized in that: It includes a base, a tabletop assembly, and a guide rail assembly, wherein the tabletop assembly and the guide rail assembly are both disposed on the upper surface of the base, and the guide rail assembly is located above the tabletop assembly; The guide rail assembly includes a fixed module and a movable module, the fixed module and the movable module are arranged vertically, and the movable module is arranged parallel to the tabletop assembly; The fixed module includes a first fixed guide rail and a second fixed guide rail arranged in parallel at opposite ends of the base, and the movable module includes a first movable guide rail and a second movable guide rail arranged in parallel, with the ends of the first movable guide rail and the second movable guide rail slidably connected to the first fixed guide rail and the second fixed guide rail. A binding head assembly is connected to one side of the first moving guide rail and the second moving guide rail that are close to each other. The binding head assembly is provided with a suction nozzle and a dispensing assembly to perform patch application and dispensing operations. The first moving guide rail and / or the second moving guide rail move along the length direction of the first fixed guide rail and the second fixed guide rail to drive the corresponding head binding assembly to move synchronously; the head binding assembly is slidably connected to the corresponding first moving guide rail or the second moving guide rail, and can move along the length direction of the first moving guide rail or the second moving guide rail.

2. The die bonding apparatus as described in claim 1, characterized in that: The headgear assembly includes a ZR module, which includes multiple ZR drive components. Each ZR drive component is connected to a suction nozzle, which achieves lifting and rotational movements through the ZR drive components. The multiple nozzles on the ZR module may be of the same or different types.

3. The die bonding apparatus as described in claim 2, characterized in that: The head-binding assembly includes a first mounting plate on which a ZR module and a Z-axis module are fixed. A second mounting plate is fixed on the Z-axis module, and a vision inspection component, a height measurement component, and a dispensing component are fixed on the second mounting plate. When the Z-axis module is working, it drives the second mounting plate to perform lifting and lowering movements; A connecting plate is provided on one side of the first moving guide rail and the second moving guide rail that are close to each other, and the connecting plate is slidably connected to the first moving guide rail or the second moving guide rail; The connecting plate and the first mounting plate are fixedly connected to each other to connect the headgear assembly to the first moving guide rail and the second moving guide rail.

4. The die bonding apparatus as described in claim 1, characterized in that: The first fixed guide rail has a clearance opening at one end near the base. The table assembly includes a track module. One end of the track module is fixed between the first fixed guide rail and the second fixed guide rail, and the other end passes through the clearance opening and extends outward from the base. The track module is perpendicular to the first fixed guide rail, and the track module is located between the first moving guide rail and the second moving guide rail.

5. The die bonding apparatus as described in claim 4, characterized in that: The tabletop assembly defines a loading / unloading area and a processing area along its length. The loading and unloading area is located on the side of the first fixed guide rail away from the second fixed guide rail, the processing area is located between the first fixed guide rail and the second fixed guide rail, and the processing area corresponds to the movable area of ​​the first moving guide rail and the second moving guide rail.

6. The die bonding apparatus as described in claim 5, characterized in that: The table assembly includes a material stage and a wafer stage, which are mounted on the track module and move between the loading / unloading area and the processing area via the track module. The track module includes a first track, a second track, and a third track arranged in parallel and spaced apart. The first track and the third track are located on opposite sides of the second track. A material stage is slidably connected to the first track and the third track, and a wafer stage is slidably connected to the second track.

7. The die bonding apparatus as described in claim 6, characterized in that: The tabletop assembly includes a vacuum device; The vacuum device includes a vacuum tube, which is connected to the material stage and the wafer stage respectively, to adsorb the material placed on them; The vacuum tube can move with the material stage and the wafer stage.

8. The die bonding apparatus as described in claim 6, characterized in that: The tabletop assembly also includes a nozzle placement rack and an upward-viewing camera, both of which are located in the processing area; The first track has a nozzle holder and an upward-viewing camera on the side away from the second track, and the third track has a nozzle holder and an upward-viewing camera on the side away from the second track; The nozzle rack stores multiple different types of nozzles; The upward-facing camera is positioned close to the material platform and is used to identify the position of the material adsorbed by the suction nozzle on the head-binding assembly.

9. The die bonding apparatus as described in claim 3, characterized in that: The visual detection component includes a first camera and a second camera, with the first camera and the second camera having different recognition accuracies.

10. The die bonding apparatus as described in claim 6, characterized in that: The binding assemblies on the first and second moving guides can operate simultaneously on the wafer stage without interfering with each other.

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