Variable-step parallel mounting hot die bonder and mounting method thereof

Abstract

The invention discloses a variable-step parallel mounting hot die bonder and a mounting method thereof, and relates to the technical field of hot die bonders, the hot die bonder comprises a rack, a heating tunnel furnace, a material stirring assembly and a control system; the heating tunnel furnace is used for continuously heating a lead frame, at least two mounting function units are sequentially arranged in the conveying direction of the heating tunnel furnace, and each mounting function unit is provided with an independent chip picking and mounting execution mechanism. At least two mounting function units with independent chip picking and mounting execution mechanisms are arranged in the conveying direction of the heating tunnel furnace, and the variable material stirring step pitch design of the material stirring assembly and the cooperative control of the control system are matched. The problems that in the prior art, the chip mounting process depends on a single bonding head to complete mounting of two chips in sequence, a chip mounting station becomes a bottleneck restricting the takt of the whole machine, and when only a single chip needs to be mounted, multiple sets of execution mechanisms are idle, and the equipment utilization rate is remarkably reduced are effectively solved.

Description

Technical Field

[0001] This invention relates to the field of thermal die bonders, and particularly to a variable pitch parallel mounting thermal die bonder and its mounting method. Background Technology

[0002] Thermal die bonders are key process equipment in power device packaging production. They continuously heat the leadframe under controlled high temperature and protective gas conditions, causing the solder to wet, spread, and solidify, thereby achieving a reliable metallurgical bond between the chip and the leadframe. A typical thermal die bond process includes leadframe heating, solder application, die pressing, and chip mounting. Each process is usually completed at corresponding functional stations arranged sequentially along the leadframe transport direction. Existing thermal die bonders are mainly classified into single-solder application, single-die pressing, and single-bond structures, as well as multi-station structures that extend from these. Among them, thermal die bonders with single-solder application, single-die pressing, and single-bond structures have long been widely used as the mainstream solution in the power device packaging field due to their clear structure and relatively simple control logic.

[0003] As power device packaging technology advances towards higher integration, applications requiring multiple chips to be mounted on the same leadframe are increasingly common. To meet the demands of dual-chip packaging, existing technologies primarily employ the following methods: First, dual-chip mounting is achieved through two independent die bonding processes. The leadframe enters the hot-form die bonder twice, completing the mounting of two chips separately. While this approach eliminates the need for equipment modification, the product undergoes two complete heating and cooling processes, negatively impacting solder morphology consistency and packaging reliability. Second, two single-head hot-form die bonders are connected end-to-end, allowing the leadframe to sequentially enter both machines during a single transfer to complete the mounting of two chips. This approach improves production continuity but requires a large footprint, consumes significant energy, and has a cycle time limited by the single-machine die bonding capacity. Third, a dual-head hot-form die bonder is used. This involves installing two placement heads on a single leadframe and configuring two sets of solder application assemblies and two sets of die-casting assemblies in the preceding process, enabling the same leadframe to complete the solder processing and mounting of both chips in a single heating process. However, the aforementioned dual-head placement solution still relies on a single placement head to sequentially place two chips, making the placement station a bottleneck restricting the overall cycle time. Furthermore, this solution is primarily designed for dual-chip packaging; when only a single chip needs to be placed, the multiple sets of actuators remain idle, significantly reducing equipment utilization. Therefore, achieving high placement cycle time, high equipment utilization, and flexible compatibility with both single-chip and dual-chip packaging under a single continuous thermal cycle has become a pressing technical problem to be solved in this field. Summary of the Invention

[0004] This invention provides a variable-pitch parallel hot die bonder and its bonding method, which can solve the problems in the prior art where the bonding process still relies on a single bonding head to sequentially complete the bonding of two chips, the bonding station becomes a bottleneck restricting the overall cycle time, and when only a single chip needs to be bonded, the multiple sets of actuators are idle, resulting in a significant decrease in equipment utilization.

[0005] A variable-pitch parallel placement thermal die bonder includes a frame, a heated tunnel furnace, a chip picker assembly, and a control system. The heated tunnel furnace continuously heats the lead frame. At least two placement functional units are sequentially arranged along the conveying direction of the heated tunnel furnace. Each placement functional unit has an independent chip pick-up and placement execution mechanism for performing chip placement operations under heating conditions. The chip picker assembly is located to the side or above the heated tunnel furnace and drives the lead frame to move intermittently along the conveying direction. The chip picker assembly has a variable chip picker pitch. The control system is communicatively connected to the chip picker assembly and each of the placement functional units. The chip picker assembly has at least a first chip picker pitch mode and a second chip picker pitch mode. In the first chip picker pitch mode, the pitch of two adjacent chip pickers allows different placement functional units to complete placement on different placement areas of the lead frame within the same cycle. In the second chip picker pitch mode, the pitch of two adjacent chip pickers allows different placement functional units to sequentially place multiple chips on the same placement area without the lead frame leaving the heated tunnel furnace.

[0006] The present invention provides a variable-pitch parallel placement hot die bonder, which, compared with the prior art, has the following beneficial effects, but is not limited to: This variable-pitch parallel placement thermal die bonder effectively solves the problems of existing technologies, such as the reliance on a single bonding head to sequentially place two chips, the placement station becoming a bottleneck restricting the overall cycle time, and multiple idlers and significantly reduced equipment utilization when only a single chip needs to be placed. The first pitch mode of the placement component allows different placement units to complete placement on different areas of the lead frame within the same cycle time, achieving multi-station parallel placement and significantly improving the overall placement cycle time. The second pitch mode of the placement component allows different placement units to sequentially place multiple chips on the same area without removing the lead frame from the heated tunnel oven, adapting to multi-chip placement needs without requiring additional placement stations and accommodating flexible switching between multi-chip and single-chip placement scenarios.

[0007] Furthermore, a first mounting functional unit and a second mounting functional unit are sequentially arranged along the conveying direction of the heating tunnel oven; the first mounting functional unit includes a first bonding head assembly, a first wafer disk movement assembly, and a first ejector pin assembly mounted on the rack; the second mounting functional unit includes a second bonding head assembly, a second wafer disk movement assembly, and a second ejector pin assembly mounted on the rack.

[0008] Furthermore, a first mounting vision camera assembly is provided on one side of the first ejector assembly, and a second mounting vision camera assembly is provided on one side of the second ejector assembly.

[0009] Furthermore, along the conveying direction of the heating tunnel oven, a first soldering component, a second soldering component, a first molding component, and a second molding component are sequentially arranged before the mounting functional unit. The first soldering component and the first molding component correspond to the working positions of the first mounting functional unit, and the second soldering component and the second molding component correspond to the working positions of the second mounting functional unit.

[0010] Furthermore, in the first feeding step distance mode, the step distance between two adjacent feedings is twice the width of the patch area; in the second feeding step distance mode, the step distance between two adjacent feedings is one times the width of the patch area.

[0011] Furthermore, the maximum feeding stroke of the feeding component is greater than twice the width of the patch area to support the switching between the first feeding step and the second feeding step.

[0012] Furthermore, the feeding assembly includes a moving shaft and multiple actuating components. The multiple actuating components are detachably connected to the moving shaft in sequence along the conveying direction of the heating tunnel furnace. The moving shaft is connected to a vertical drive component and a horizontal drive component, both of which are connected to the frame.

[0013] Furthermore, the actuating component includes a connecting plate, one end of which is detachably connected to the moving shaft, and the other end of which is detachably connected to a first adjusting plate. One end of the first adjusting plate is connected to a second adjusting plate, and an actuating lever is connected to the bottom of the second adjusting plate.

[0014] Furthermore, the feed end of the frame is provided with a feeding component, and the discharge end of the frame is provided with a discharging component.

[0015] A mounting method for a variable-pitch parallel mounting thermal die bonder, based on the aforementioned variable-pitch parallel mounting thermal die bonder, includes the following steps: S1, feeding the lead frame into a heated tunnel furnace from the feed end, and continuously heating the lead frame within the heated tunnel furnace; S2, the control system acquires the current packaging condition command, and controls the feeding assembly to switch to the corresponding feeding pitch mode according to the packaging condition command; S3, the feeding assembly drives the lead frame to move intermittently along the conveying direction of the heated tunnel furnace, so that the lead frame passes through each... Placement function unit; S4: When the material feeding component is running in the first material feeding step distance mode, the step distance of two adjacent material feeding operations allows different placement function units to perform chip placement operations in parallel on different placement areas of the lead frame within the same cycle; When the material feeding component is running in the second material feeding step distance mode, the step distance of two adjacent material feeding operations allows different placement function units to perform multiple chip placement operations on the same placement area in sequence while the lead frame is still in the heated tunnel oven; S5: The lead frame after placement is output from the material outlet. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of a variable-pitch parallel mounting hot die bonder according to an embodiment of the present invention; Figure 2 for Figure 1 Schematic diagram of the structure of the middle feeding assembly; Figure 3 for Figure 2 A magnified view of a section at point A in the middle; Figure 4 for Figure 1 Schematic diagram of the middle lead frame; Figure 5 This is a flowchart illustrating the mounting method of a variable-pitch parallel mounting thermal die bonder according to an embodiment of the present invention.

[0017] Explanation of reference numerals in the attached figures: 1. Frame; 2. Heating tunnel oven; 3. Feeding assembly; 4. Control system; 5. First mounting functional unit; 6. Second mounting functional unit; 7. First soldering assembly; 8. Second soldering assembly; 9. First mold assembly; 10. Second mold assembly; 11. Feeding assembly; 12. Unloading assembly; 13. Lead frame; 31. Moving shaft; 32. Actuator; 33. Vertical drive; 34. Horizontal drive; 51. First die assembly; 52. First wafer disk motion assembly; 53. First ejector pin assembly; 54. First mounting vision camera assembly; 61. Second die assembly; 62. Second wafer disk motion assembly; 63. Second ejector pin assembly; 64. Second mounting vision camera assembly; 321. Connecting plate; 322. First adjusting plate; 323. Second adjusting plate; 324. Actuator lever. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings showing multiple embodiments according to this application. It should be understood that the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments described in this application without creative effort will fall within the scope of protection of this application.

[0019] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used in the description of this application is for the purpose of describing specific embodiments only and is not intended to limit this application; the terms "comprising," "including," "having," "containing," etc., in the description, claims, and accompanying drawings of this application are open-ended terms. Therefore, "comprising," "including," or "having" refers to, for example, a method or apparatus having one or more steps or elements, but is not limited to having only these one or more elements. The terms "first," "second," etc., in the description, claims, or accompanying drawings of this application are used to distinguish different objects, not to describe a specific order or hierarchy. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0020] In the description of this invention, it should be understood that the terms "upper", "lower", "left", "right", "front", "rear", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0021] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "attachment" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0022] It should be emphasized that when the term "comprising / including" is used in this specification, it is used to explicitly indicate the presence of the stated feature, integer, step, or component, but does not exclude the presence or addition of one or more other features, integers, steps, parts, or groups of features, integers, steps, or parts.

[0023] In this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, in this application, the character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0024] like Figure 1-4 As shown in the figure, an embodiment of the present invention provides a variable-pitch parallel placement thermal die bonder, including a frame 1, a heated tunnel furnace 2, a chip picker assembly 3, and a control system 4. The heated tunnel furnace 2 is used to continuously heat the lead frame 13. At least two placement functional units are arranged sequentially in the conveying direction of the heated tunnel furnace 2. Each placement functional unit has an independent chip pick-up and placement execution mechanism for performing chip placement operations under heating conditions. The chip picker assembly 3 is located on the side or above the heated tunnel furnace 2 and is used to drive the lead frame 13 to move intermittently along the conveying direction. The component 3 has a variable feeding pitch; the control system 4 is communicatively connected to the feeding assembly 3 and each mounting functional unit; wherein, the feeding assembly 3 has at least a first feeding pitch mode and a second feeding pitch mode; in the first feeding pitch mode, the pitch of two adjacent feeding operations enables different mounting functional units to complete the mounting of different mounting areas of the lead frame 13 within the same cycle; in the second feeding pitch mode, the pitch of two adjacent feeding operations enables different mounting functional units to sequentially mount multiple chips in the same mounting area without the lead frame 13 being removed from the heating tunnel oven 2.

[0025] In this embodiment, the heating tunnel oven 2, the chip picker assembly 3, and the control system 4 are carried by the frame 1. The heating tunnel oven 2 continuously heats the lead frame 13. At least two placement functional units with independent chip pick-up and placement execution mechanisms are arranged along the conveying direction of the heating tunnel oven 2. With the variable chip picker step distance design of the chip picker assembly 3 and the coordinated control of the control system 4, the existing technology effectively solves the problems of the chip placement process relying on a single bonding head to sequentially complete the placement of two chips, the chip placement station becoming a bottleneck restricting the overall cycle time, and multiple sets of execution mechanisms being idle and the equipment utilization rate significantly decreasing when only a single chip needs to be placed. Through the first chip picker step distance mode of the chip picker assembly 3, different placement functional units can be divided within the same cycle time. The lead frame 13 can be used to mount chips in different areas, enabling multi-station parallel mounting, significantly improving the overall mounting cycle time, breaking through the efficiency bottleneck caused by a single mounting head, and making full use of the functions of multiple mounting execution mechanisms to avoid idle mechanisms. The second mounting step mode of the feeding component 3 allows different mounting functional units to mount multiple chips in the same area sequentially without the lead frame 13 leaving the heating tunnel oven 2. This adapts to multi-chip mounting requirements without the need for additional mounting stations, and allows for flexible switching between multi-chip and single-chip mounting scenarios, further improving equipment utilization and balancing mounting efficiency with scenario adaptability. At the same time, the continuous heating design of the heating tunnel oven 2 ensures the thermal environment stability of chip mounting and improves mounting quality.

[0026] Specifically, the heating tunnel furnace 2 typically adopts a closed furnace structure, with heating elements and a hot air circulation system arranged along the conveying direction inside to form a stable high-temperature process zone. The furnace chamber is filled with protective gases such as nitrogen to prevent solder oxidation. Through a multi-temperature zone independent temperature control design, it is ensured that the lead frame 13 can be uniformly heated and reach the set process temperature during continuous conveying. The control system 4, as the core control unit of the die bonder, typically uses a PLC or industrial computer combined with servo drive technology. On the one hand, it achieves the rhythmic movement of the lead frame 13 by precisely controlling the drive motor of the feeding assembly 3. On the other hand, it collects temperature sensor data from each station in real time and adjusts the heating power in a closed loop to maintain temperature stability. At the same time, it coordinates the motion trajectory of each mounting functional unit with the visual positioning system to ensure the precise timing coordination of the entire die bonder process and the reliable execution of parallel operation logic.

[0027] like Figure 1 and Figure 2 As shown, a first mounting function unit 5 and a second mounting function unit 6 are sequentially arranged along the conveying direction of the heating tunnel furnace 2; the first mounting function unit 5 includes a first bonding head assembly 51, a first wafer disk movement assembly 52 and a first ejector pin assembly 53 mounted on the rack 1; the second mounting function unit 6 includes a second bonding head assembly 61, a second wafer disk movement assembly 62 and a second ejector pin assembly 63 mounted on the rack 1.

[0028] In this embodiment, by sequentially arranging the first mounting functional unit 5 and the second mounting functional unit 6 along the conveying direction of the heating tunnel furnace 2, the problems of low efficiency and idle multiple mechanisms in the existing single-head mounting are solved. The first mounting functional unit 5 is equipped with a first mounting head assembly 51, a first wafer disk movement assembly 52 and a first ejector pin assembly 53 mounted on the rack 1. The second mounting functional unit 6 is equipped with a second mounting head assembly 61, a second wafer disk movement assembly 62 and a second ejector pin assembly 63 mounted on the rack 1. Each of the two mounting functional units has a complete and independent chip picking, positioning and mounting execution structure, without sharing core components. It can cooperate with the variable step distance mode of the material picking assembly 3 to achieve parallel mounting of different mounting areas of the lead frame 13 within the same cycle, greatly improving the overall mounting cycle. It can also sequentially complete the mounting of multiple chips in the same mounting area in multi-chip mounting scenarios, giving full play to the synergistic effect of the dual mounting heads, dual wafer disks and dual ejector pins.

[0029] Specifically, the first bonding head assembly 51 and the second bonding head assembly 61 independently perform chip picking and placement operations, avoiding fatigue wear and efficiency bottlenecks caused by continuous operation of a single bonding head. The first wafer disk motion assembly 52 and the second wafer disk motion assembly 62 can independently supply materials to adapt to the placement requirements of chips of different specifications. The first ejector assembly 53 and the second ejector assembly 63 precisely cooperate with the corresponding bonding head assembly to complete chip ejection and placement positioning, improving the accuracy of chip placement. At the same time, both placement functional units are mounted on the rack 1, with a reasonable structural layout and strong stability, further ensuring the consistency of placement under continuous heating environment, taking into account efficiency, accuracy and equipment utilization.

[0030] Among them, the first bonding assembly 51, the first wafer disk motion assembly 52, the first ejector pin assembly 53, the second bonding assembly 61, the second wafer disk motion assembly 62, and the second ejector pin assembly 63 are all existing devices.

[0031] like Figure 1 and Figure 2 As shown, a first mounting vision camera assembly 54 is provided on one side of the first ejector assembly 53, and a second mounting vision camera assembly 64 is provided on one side of the second ejector assembly 63.

[0032] In this embodiment, by setting a first placement vision camera component 54 on one side of the first ejector component 53 and a second placement vision camera component 64 on one side of the second ejector component 63, the accuracy and reliability of chip placement can be improved, and problems such as placement offset and positioning error can be avoided. The first placement vision camera component 54 can accurately capture the position information of the chip ejected by the first ejector component 53 and the positioning information of the lead frame 13 corresponding to the placement area, and feed it back to the control system 4 in real time to assist the first mounting head component 51 in accurately picking up and placing the chip, avoiding placement defects caused by positioning deviation. The second placement vision camera component 64 is set to correspond to the second ejector component 63, and similarly can accurately locate the chip ejected by the second ejector component 63 and the placement area of ​​the lead frame 13, and cooperate with the second mounting head component 61 to complete accurate placement. The two vision camera components each correspond to an independent placement function unit, realizing synchronous visual positioning and independent calibration of the two stations, which does not interfere with the parallel operation rhythm of the two placement function units, and can ensure the placement accuracy of each station.

[0033] like Figure 1 and Figure 2 As shown, along the conveying direction of the heating tunnel oven 2, before the placement functional unit, there are a first soldering component 7, a second soldering component 8, a first molding component 9, and a second molding component 10 arranged in sequence. The first soldering component 7 and the first molding component 9 correspond to the working positions of the first placement functional unit 5, and the second soldering component 8 and the second molding component 10 correspond to the working positions of the second placement functional unit 6, forming a workstation linkage layout of soldering-molding-placement, which effectively optimizes the pre-processing process before chip placement and improves placement quality and work continuity.

[0034] In this embodiment, the first soldering component 7 precisely completes the soldering operation at the working station of the first mounting functional unit 5, providing a reliable soldering foundation for chip mounting. Subsequently, the first molding component 9 performs molding processing at the corresponding station, compacting the solder and aligning the station to ensure that the first bonding component 51 of the first mounting functional unit 5 completes precise mounting, improving the connection stability between the chip and the lead frame 13. The second soldering component 8 and the second molding component 10 simultaneously complete the soldering and molding preprocessing at the working station of the second mounting functional unit 6, working in tandem with the first soldering component 7. The first molding assembly 9 forms a dual-station parallel pre-processing system, which, together with the parallel mounting operation of the dual mounting functional units, realizes the synchronous linkage of pre-processing and mounting processes. This avoids the restriction of the overall machine cycle time by a single pre-processing station. By setting the process sequence of soldering and molding, and precisely corresponding to the corresponding mounting functional units, there is no need for cross-station operations. This reduces the transmission loss of the lead frame 13 in the heating tunnel oven 2, ensures the consistency of pre-processing and mounting processes under continuous heating environment, and avoids multiple components being idle. It fully leverages the advantages of dual-station collaboration, taking into account both mounting quality and equipment utilization.

[0035] Furthermore, in the first feeding step mode, the step distance between two adjacent feedings is twice the width of the patch area; in the second feeding step mode, the step distance between two adjacent feedings is one times the width of the patch area.

[0036] In this embodiment, the setting of twice the placement area width in the first material feeding step distance mode allows the first placement functional unit 5 and the second placement functional unit 6 to correspond to different placement areas of the lead frame 13 within the same cycle when the material feeding component 3 drives the lead frame 13 to move intermittently. This enables parallel placement at dual stations, maximizing the operational advantages of dual placement units, avoiding efficiency bottlenecks caused by single placement unit operations, and significantly improving the overall placement cycle time. The setting of one placement area width in the second material feeding step distance mode allows the material feeding component 3 to drive the lead frame 13 to move a smaller step distance. This allows the first placement functional unit 5 and the second placement functional unit 6 to sequentially place multiple chips in the same placement area while the lead frame 13 is in the continuous heating environment of the heating tunnel oven 2, without the need for additional placement stations, thus adapting to multi-chip packaging requirements.

[0037] Specifically, the precise setting of the two step pitch modes can be flexibly switched through the control system 4, taking into account both single-chip parallel placement and multi-chip sequential placement scenarios. It makes full use of multiple placement execution mechanisms, avoids idle mechanisms, and improves equipment utilization. At the same time, precise step pitch control ensures the accurate alignment of the lead frame 13 placement area with each placement functional unit, soldering component, and molding component, further improving placement accuracy and process consistency.

[0038] like Figure 1 and Figure 2 As shown, the maximum feeding stroke of the feeding component 3 is greater than twice the width of the patch area to support the switching between the first feeding step and the second feeding step.

[0039] In this embodiment, the maximum material feeding stroke of the feeding component 3 is set to be greater than twice the width of the placement area, providing reliable structural support for flexible switching between the first feeding step and the second feeding step, effectively ensuring smooth switching between the two placement modes, further optimizing the scene adaptability and operational stability of the equipment, and fully meeting the collaborative operation requirements of the dual placement functional units of the whole machine.

[0040] Specifically, by combining the set first feeding step distance (twice the width of the placement area) and the second feeding step distance (one width of the placement area), the maximum feeding stroke of the feeding component 3 breaks through the limitation of twice the width of the placement area. This not only stably realizes parallel placement of dual stations in the first feeding step distance mode, ensuring that the feeding component 3 drives the lead frame 13 to move twice the width of the placement area with sufficient stroke and smooth movement, ensuring that the first placement functional unit 5 and the second placement functional unit 6 are accurately aligned with different placement areas; but it can also flexibly switch to the second feeding step distance mode without adjusting the overall structure of the feeding component 3. It can achieve accurate feeding of one width of the placement area by simply controlling the control system 4, allowing the two placement functional units to sequentially align with the same placement area to complete the placement of multiple chips.

[0041] like Figure 2 and Figure 3 As shown, the feeding assembly 3 includes a moving shaft 31 and multiple actuating components 32. The multiple actuating components 32 are detachably connected to the moving shaft 31 in sequence along the conveying direction of the heating tunnel furnace 2. The moving shaft 31 is connected to the vertical drive component 33 and the horizontal drive component 34. Both the vertical drive component 33 and the horizontal drive component 34 are connected to the frame 1.

[0042] In this embodiment, the moving shaft 31 serves as the core load-bearing component, providing an installation base for multiple actuating components 32. These actuating components 32 are arranged along the conveying direction of the heating tunnel furnace 2, enabling synchronous and stable movement of the lead frame 13. This avoids problems such as uneven force distribution and lead frame 13 offset caused by a single actuating component, ensuring the stability of the material feeding process. The actuating components 32 are detachable, allowing for flexible adjustment of their number and spacing based on the specifications of the lead frame 13 and the width of the mounting area, adapting to the needs of different mounting scenarios and improving the equipment's versatility. The vertical drive component 33 and the horizontal drive component 34 work together to precisely control the vertical lifting and horizontal movement of the moving shaft 31, enabling intermittent material feeding actions of the material feeding assembly 3. This not only precisely matches the switching requirements of the first and second material feeding steps, ensuring the accuracy of the material feeding steps, but also works in conjunction with the continuous heating environment within the heating tunnel furnace 2 to achieve precise alignment between the lead frame 13 and each mounting functional unit, soldering assembly, and molding assembly.

[0043] The vertical drive component 33 and the horizontal drive component 34 together constitute the power and execution core of the feeding assembly 3. The horizontal drive component 34 (such as a linear motor, synchronous belt module, or cylinder) is fixed on the frame 1 and connected to the moving shaft 31. It drives the moving shaft 31 to make precise horizontal reciprocating motion along the conveying direction of the heating tunnel furnace 2, thereby driving the actuating component 32 to push the lead frame 13 to achieve intermittent forward movement with a set step distance. The vertical drive component 33 is also connected to the moving shaft 31. It drives the moving shaft 31 to drive the actuating component 32 to make vertical lifting and lowering motion. When feeding, it descends to insert the actuating rod 324 into the work position gap of the lead frame 13 to apply a pushing force. After pushing, it rises to disengage the actuating component 32 from the lead frame 13 and return to the initial position, thereby avoiding interference with the lead frame 13 during the return stroke. Through the timing coordination of the vertical drive component 33 and the horizontal drive component 34, the feeding assembly 3 can achieve precise, stable, and adjustable intermittent conveying of the lead frame 13.

[0044] like Figure 2 and Figure 3 As shown, the actuating component 32 includes a connecting plate 321. One end of the connecting plate 321 is detachably connected to the moving shaft 31, and the other end of the connecting plate 321 is detachably connected to the first adjusting plate 322. One end of the first adjusting plate 322 is connected to the second adjusting plate 323, and the bottom of the second adjusting plate 323 is connected to an actuating lever 324.

[0045] In this embodiment, one end of the connecting plate 321 is detachably connected to the moving shaft 31, continuing the detachable installation characteristic of the actuating component 32 as a whole. This facilitates flexible disassembly and replacement of the actuating component 32 according to the specifications of the lead frame 13, and also facilitates later maintenance and repair. The other end of the connecting plate 321 is detachably connected to the first adjusting plate 322, allowing for flexible adjustment of the installation positions of the first adjusting plate 322, the second adjusting plate 323, and the actuating lever 324. This adapts to lead frames 13 of different thicknesses and specifications, improving the versatility of the actuating component 32. The first adjusting plate 322 and the second adjusting plate 323... The connection structure of 23 allows for further fine-tuning of the height and horizontal position of the toggle lever 324, ensuring that the toggle lever 324 can accurately fit the lead frame 13 and guaranteeing the stability of the feeding action. The toggle lever 324 connected to the bottom of the second adjustment plate 323, as a component that directly contacts the lead frame 13, accurately transmits the driving force of the moving shaft 31, realizing the smooth intermittent movement of the lead frame 13. In conjunction with the variable step distance mode of the feeding assembly 3, it ensures that when switching between the first feeding step distance and the second feeding step distance, the lead frame 13 can accurately align with each mounting functional unit, soldering assembly, and molding assembly.

[0046] like Figure 1 As shown, the feed end of the frame 1 is equipped with a feeding component 11, and the discharge end of the frame 1 is equipped with a discharging component 12.

[0047] In this embodiment, a feeding assembly 11 is provided at the feeding end of the frame 1, and a discharging assembly 12 is provided at the discharging end of the frame 1. Together with the heating tunnel oven 2, the material feeding assembly 3, and the mounting functional unit carried on the frame 1, a complete automated production line is formed, effectively improving the automation level of the whole machine, reducing manual intervention, and ensuring the continuity and stability of the lead frame 13 conveying, adapting to the high-efficiency operation requirements of the dual mounting functional unit. The feeding assembly 11 is located at the feeding end of the frame 1, which can realize the automatic continuous feeding of the lead frame 13 without manual feeding of each piece into the heating tunnel oven 2; the discharging assembly 12 is located at the discharging end of the frame 1, which can automatically collect and sort the lead frames 13 after mounting, realizing the automated output of the mounted finished product.

[0048] like Figure 5 As shown, a mounting method for a variable pitch parallel mounting thermal die bonder, based on the variable pitch parallel mounting thermal die bonder, includes the following steps: S1, feeding the lead frame 13 into the heating tunnel furnace 2 from the feed end, and continuously heating the lead frame 13 inside the heating tunnel furnace 2; S2, the control system 4 acquires the current packaging condition command, and controls the feeding component 3 to switch to the corresponding feeding pitch mode according to the packaging condition command; S3, the feeding component 3 drives the lead frame 13 to move intermittently along the conveying direction of the heating tunnel furnace 2, so that the lead frame 13... S4: When the feeding component 3 is running in the first feeding step distance mode, the step distance of two adjacent feeding operations allows different feeding function units to perform chip mounting operations on different mounting areas of the lead frame 13 in parallel within the same cycle; When the feeding component 3 is running in the second feeding step distance mode, the step distance of two adjacent feeding operations allows different feeding function units to perform multiple chip mounting operations on the same mounting area in sequence while the lead frame 13 is still in the heating tunnel furnace 2; S5: The lead frame 13 after mounting is output from the discharge end.

[0049] In this embodiment, by feeding the lead frame 13 into the heating tunnel oven 2 from the feeding end and continuously heating it, a stable thermal environment is provided for subsequent mounting processes, ensuring the reliability of chip mounting connections. Simultaneously, the feeding component 11 enables automated feeding, improving operational continuity. The control system 4 acquires packaging condition commands and controls the feeding component 3 to switch the corresponding feeding step mode, achieving precise adaptation of the mounting mode and flexibly handling single-chip and multi-chip mounting requirements. No manual adjustment of the equipment structure is required, improving operational convenience. The feeding component 3 drives the lead frame 13 to move intermittently along the conveying direction of the heating tunnel oven 2, allowing the lead frame 13 to sequentially pass through each mounting functional unit. This precisely coordinates with the pre-processing processes of the soldering component and the molding component, and the mounting processes of the mounting functional units, ensuring the reliability of each process. The processes are seamlessly connected; corresponding placement operations are performed for the two material feeding step distance modes. In the first material feeding step distance mode, different placement functional units can perform parallel placement of different chip areas of the lead frame 13, which greatly improves the overall placement cycle time and makes full use of the structural advantages of the dual placement functional units to avoid idleness of the mechanism. In the second material feeding step distance mode, different placement functional units can perform sequential placement of multiple chips in the same chip area without the need for additional workstations, adapting to multi-chip packaging requirements. At the same time, the lead frame 13 does not leave the heating tunnel oven 2, ensuring a consistent thermal environment and improving placement quality. The placed lead frame 13 is output from the discharge end, and the finished product is automatically collected with the unloading component 12, forming a complete closed loop operation, reducing manual intervention, lowering labor costs, and ensuring the integrity of the finished product.

[0050] Specifically, the two placement vision camera components correspond to their respective placement stations, enabling synchronous real-time detection at both stations. This avoids interfering with the collaborative operation rhythm of the first placement functional unit 5 and the second placement functional unit 6, while accurately capturing the entire placement process status at each station. It promptly detects issues such as missing chips, placement misalignment, or soldering abnormalities, preventing the continuation of abnormalities that could lead to batch defects. When an abnormality is detected, the control system 4 can execute one or a combination of preset strategies: stopping the operation of the corresponding placement functional unit, marking the abnormal placement area and allowing subsequent processes to continue, or pausing the material handling component 3 and issuing an alarm signal. This flexibly adapts to the handling needs of different abnormal scenarios: stopping the operation of the corresponding placement functional unit can quickly stop losses and prevent the fault from escalating; marking the abnormal placement area and continuing subsequent processes can balance work efficiency and prevent a single abnormality from dragging down the overall machine cycle time; pausing the material handling component 3 and issuing an alarm signal can promptly remind staff to troubleshoot the fault, ensuring work safety and process standardization. The entire detection and control system achieves precise monitoring, accurate identification of abnormalities, and flexible handling of the entire placement process.

[0051] The above-disclosed embodiments are merely a few specific examples of the present invention. However, the embodiments of the present invention are not limited thereto, and any variations that can be conceived by those skilled in the art should fall within the protection scope of the present invention.

Claims

1. A variable-pitch parallel placement thermal die bonder, characterized in that, include: Rack (1); A heating tunnel oven (2) is used to continuously heat the lead frame (13). At least two mounting function units are arranged sequentially in the conveying direction of the heating tunnel oven (2). Each mounting function unit has an independent chip picking and mounting execution mechanism for performing chip mounting operations in a heating environment. The feeding assembly (3) is located on the side or above the heating tunnel furnace (2) and is used to drive the lead frame (13) to move intermittently along the conveying direction. The feeding assembly (3) has a variable feeding step distance. The control system (4) is communicatively connected to the material feeding assembly (3) and each of the mounting functional units; The feeding component (3) has at least a first feeding step distance mode and a second feeding step distance mode. In the first feeding step distance mode, the step distance of two adjacent feeding operations enables different mounting functional units to complete the mounting of different mounting areas of the lead frame (13) within the same cycle. In the second feeding step distance mode, the step distance of two adjacent feeding operations enables different mounting functional units to complete the mounting of multiple chips in the same mounting area in sequence when the lead frame (13) has not been removed from the heating tunnel oven (2).

2. The variable-pitch parallel placement hot-type die bonder according to claim 1, characterized in that, A first mounting function unit (5) and a second mounting function unit (6) are sequentially arranged along the conveying direction of the heating tunnel oven (2). The first mounting functional unit (5) includes a first mounting head assembly (51), a first wafer disk motion assembly (52), and a first ejector pin assembly (53) mounted on the rack (1). The second mounting functional unit (6) includes a second mounting head assembly (61), a second wafer disk motion assembly (62), and a second ejector pin assembly (63) mounted on the rack (1).

3. The variable-pitch parallel placement hot-type die bonder according to claim 2, characterized in that, A first mounting vision camera assembly (54) is provided on one side of the first ejector assembly (53), and a second mounting vision camera assembly (64) is provided on one side of the second ejector assembly (63).

4. The variable-pitch parallel placement hot-type die bonder according to claim 2, characterized in that, Along the conveying direction of the heating tunnel oven (2), a first soldering component (7), a second soldering component (8), a first molding component (9), and a second molding component (10) are arranged sequentially before the mounting function unit. The first soldering component (7) and the first molding component (9) correspond to the working positions of the first mounting function unit (5), and the second soldering component (8) and the second molding component (10) correspond to the working positions of the second mounting function unit (6).

5. The variable-pitch parallel mounting hot-type die bonder according to claim 1, characterized in that, In the first feeding step mode, the step distance between two adjacent feedings is twice the width of the patch area; in the second feeding step mode, the step distance between two adjacent feedings is one times the width of the patch area.

6. The variable-pitch parallel placement hot-type die bonder according to claim 5, characterized in that, The maximum feeding stroke of the feeding component (3) is greater than twice the width of the patch area to support the switching between the first feeding step and the second feeding step.

7. The variable-pitch parallel mounting hot-type die bonder according to claim 1, characterized in that, The feeding assembly (3) includes a moving shaft (31) and multiple actuating elements (32). The multiple actuating elements (32) are detachably connected to the moving shaft (31) in sequence along the conveying direction of the heating tunnel furnace (2). The moving shaft (31) is connected to a vertical drive element (33) and a horizontal drive element (34). The vertical drive element (33) and the horizontal drive element (34) are both connected to the frame (1).

8. The variable-pitch parallel placement hot-type die bonder according to claim 7, characterized in that, The actuating element (32) includes a connecting plate (321), one end of which is detachably connected to the moving shaft (31), and the other end of which is detachably connected to the first adjusting plate (322). One end of the first adjusting plate (322) is connected to the second adjusting plate (323), and the bottom of the second adjusting plate (323) is connected to an actuating rod (324).

9. The variable-pitch parallel placement hot-type die bonder according to claim 1, characterized in that, The feed end of the frame (1) is provided with a feeding component (11), and the discharge end of the frame (1) is provided with a discharging component (12).

10. A mounting method for a variable-pitch parallel mounting thermal die bonder, characterized in that, The variable pitch parallel placement thermal die bonder, as described in any one of claims 1-9, comprises the following steps: S1. The lead frame (13) is fed into the heating tunnel furnace (2) from the feeding end, and the lead frame (13) is continuously heated in the heating tunnel furnace (2); S2. The control system (4) obtains the current packaging condition command and controls the feeding component (3) to switch to the corresponding feeding step mode according to the packaging condition command. S3, the feeding assembly (3) drives the lead frame (13) to move intermittently along the conveying direction of the heating tunnel furnace (2), so that the lead frame (13) passes through each mounting functional unit in sequence. S4: When the feeding assembly (3) is running in the first feeding step mode, the step distance of two adjacent feedings enables different placement function units to perform chip placement operations on different placement areas of the lead frame (13) in parallel within the same cycle; when the feeding assembly (3) is running in the second feeding step mode, the step distance of two adjacent feedings enables different placement function units to perform multiple chip placement operations on the same placement area in sequence while the lead frame (13) is not removed from the heating tunnel oven (2). S5: The lead frame (13) after mounting is output from the discharge end.

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