Display module and display device

Abstract

The invention discloses a display module and a display device. The display module comprises a flexible display panel; a chip; the main flexible circuit board and / or the binding area can be bent so that the main flexible circuit board can be located on the side, close to the display area, of the binding area or located on the side, away from the display area, of the binding area. And a component. The orthographic projection of the component in the display area is not overlapped with the orthographic projection of the binding area in the display area, and / or the orthographic projection of the chip in the display area is not overlapped with the orthographic projection of the main flexible circuit board in the display area; in the second direction, the component and the binding area are at least partially overlapped, and / or the chip and the main flexible circuit board are at least partially overlapped.

Description

A display module and a display device Technical Field

[0001] This disclosure pertains to the field of display equipment technology, and particularly relates to a display module and a display device. Background Technology

[0002] With the development of technology and the continuous improvement of manufacturing processes, the production capacity and yield of flexible organic light-emitting diode (OLED) display modules have gradually climbed to a high level. Products based on flexible OLED display modules are also becoming more diversified, multifunctional, and versatile, and are gradually being integrated into daily life, industrial production, and high-tech intelligent manufacturing. Among them, the thinness, screen-to-body ratio, impact resistance, and aesthetics of flexible OLED display products such as smart wearables and mobile phones are attracting more attention from consumers. At the same time, the multi-form, diversification, and multifunctionality of flexible OLED display products are becoming further pursuit points for consumers.

[0003] In related technologies, in flexible OLED display products, components are located on the side of the main flexible printed circuit (MFPC) away from the display area, while chips (ICs) are located on the side of the bonding area away from the display area. The components and chips have a certain height, which occupies a large space. At the same time, the entire flexible OLED display product needs to avoid the positions of components and chips, resulting in a large overall thickness of the flexible OLED display product, which does not meet the requirement of making flexible OLED display products thinner and lighter.

[0004] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art.

[0005] Summary of the Invention

[0006] By utilizing one or more embodiments of the present disclosure, the technical problem that the overall thickness of flexible OLED display products is too large and does not meet the requirements for thinner and lighter flexible OLED display products is solved.

[0007] According to some embodiments of the present disclosure, the display module includes: a flexible display panel, wherein in a first direction, the flexible display panel includes a display area, a bending area, and a bonding area connected in sequence, the display area having a first surface and a second surface disposed opposite to each other, the bending area being bendable such that the bonding area is located on the side where the second surface of the display area is located; a chip disposed in the bonding area; and a main flexible circuit board, the main flexible circuit board including a first bonding end electrically connected to the bonding area, the main flexible circuit board and / or the bonding area being bendable such that the main flexible circuit board is located on the side of the bonding area closer to the display area or on the side of the bonding area farther from the display area. The display area is located on one side; and components are disposed on the main flexible circuit board; wherein the orthographic projection of the component in the display area does not overlap with the orthographic projection of the bonding area in the display area, and / or the orthographic projection of the chip in the display area does not overlap with the orthographic projection of the main flexible circuit board in the display area; in a second direction, the component at least partially overlaps with the bonding area, and / or the chip at least partially overlaps with the main flexible circuit board; the first direction is the direction in which the display area, the bending area, and the bonding area are sequentially connected, the second direction is the direction perpendicular to the display area, and the third direction is the direction perpendicular to both the first direction and the second direction.

[0008] In some embodiments, the component is located on the side of the main flexible circuit board near the bonding area; in the third direction, at least one side of the bonding area is recessed inward relative to the main flexible circuit board by a first recess distance, and the component is disposed in the area of ​​the main flexible circuit board that protrudes relative to the bonding area.

[0009] In some implementations, in the first direction and the third direction, the distance between the component and the edge of the main flexible circuit board is at least 1.0 mm, and the distance between the component and the bonding area is at least 2.0 mm.

[0010] In some embodiments, the component is located on the side of the main flexible circuit board near the bonding area; a first component clearance hole is provided in the area of ​​the bonding area corresponding to the component.

[0011] In some implementations, the distance between the component and the edge of the first component clearance hole is at least 0.5 mm in both the first direction and the third direction.

[0012] In some embodiments, the chip is located on the side of the bonding area close to the main flexible circuit board; a first chip clearance hole is provided in the area of ​​the main flexible circuit board corresponding to the chip.

[0013] In some implementations, the distance between the chip and the edge of the first chip clearance hole is at least 1.0 mm in both the first direction and the third direction.

[0014] In some embodiments, the main flexible circuit board has an adhesive layer on the side near the display area to bond the main flexible circuit board to the display area, and / or the main flexible circuit board has the adhesive layer on the side near the bonding area to bond the main flexible circuit board to the bonding area.

[0015] In some embodiments, in the first direction and the third direction, the adhesive layer is recessed at least 0.2 mm from the edge of the main flexible circuit board, the adhesive layer is recessed at least 0.2 mm from the edge of the bonding area, and the adhesive layer is recessed at least 0.2 mm from the edge of the display area.

[0016] In some embodiments, the main flexible circuit board is located on the side of the bonding area away from the display area, and the display module further includes a bending pad, which is disposed on the side of the display area close to the bonding area, and in the second direction, the bending pad is connected to the display area and the bonding area respectively.

[0017] In some embodiments, a second component clearance hole is provided in the area of ​​the bending pad corresponding to the component, and / or a second chip clearance hole is provided in the area of ​​the bending pad corresponding to the chip.

[0018] In some embodiments, in the first direction and the third direction, the distance between the edge of the second component clearance hole and the component is at least 1.0 mm, and the orthographic projection of the bent pad on the main flexible circuit board is recessed at least 0.2 mm relative to the edge of the main flexible circuit board; and / or, in the first direction and the third direction, the distance between the edge of the second chip clearance hole and the chip is at least 1.0 mm, and the orthographic projection of the bent pad on the bonding area is recessed at least 0.2 mm relative to the edge of the bonding area.

[0019] In some embodiments, the bending pad is connected to the main flexible circuit board in the second direction.

[0020] In some embodiments, the display device further includes an under-screen material layer disposed on a second surface of the display area.

[0021] According to some embodiments of the present disclosure, the display device includes the display module described above.

[0022] The embodiments disclosed herein have at least the following beneficial effects:

[0023] In the aforementioned display module, the first bonding end of the main flexible circuit board is electrically connected to the bonding area. The main flexible circuit board and / or the bonding area are bendable so that the main flexible circuit board is located on the side of the bonding area closer to the display area or on the side of the bonding area farther from the display area, thereby integrating the main flexible circuit board and the bonding area together, i.e., the main flexible circuit board and the bonding area are stacked. The chip area of ​​the bonding area can be reinforced by the main flexible circuit board, improving the chip's resistance to compression and impact. By ensuring that the orthographic projection of the component in the display area does not overlap with the orthographic projection of the bonding area in the display area, and / or that the orthographic projection of the chip in the display area does not overlap with the orthographic projection of the main flexible circuit board in the display area; and / or that the component and the bonding area at least partially overlap in a second direction, and / or that the chip and the main flexible circuit board at least partially overlap in a second direction, the components and / or the chip can have a certain degree of overlap with the bonding area and / or the main flexible circuit board in the second direction, thereby making full use of the space in the second direction, reducing the thickness of the whole machine in the second direction, and improving the overall space utilization rate. At the same time, when the components and / or chips overlap with the bonding area and / or the main flexible circuit board to a certain extent in the second direction, at least one side of the components and / or chips can be located inside the bonding area and / or the main flexible circuit board. In other words, the components and chips can be hidden to a certain extent, thereby reducing the risk of damage to the components and chips from external impacts and improving the overall machine's resistance to compression and impact. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this disclosure, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 shows a rear view of a display module in the related art;

[0026] Figure 2 shows a cross-sectional view of the module shown in Figure 1 (AA section);

[0027] Figure 3 shows a cross-sectional view of the module shown in Figure 1;

[0028] Figure 4 shows a rear view of a display module according to some embodiments of the present disclosure;

[0029] Figure 5 shows a rear view of the binding area in Figure 4;

[0030] Figure 6 shows a rear view of the main flexible circuit board in Figure 4;

[0031] Figure 7 shows a CC cross-sectional view of the module shown in Figure 4;

[0032] Figure 8 shows a cross-sectional view of the module shown in Figure 4;

[0033] Figure 9 shows a rear view of a display module according to some embodiments of the present disclosure;

[0034] Figure 10 shows a rear view of the binding area in Figure 9;

[0035] Figure 11 shows a rear view of the main flexible circuit board in Figure 9;

[0036] Figure 12 shows a cross-sectional view of the EE module shown in Figure 9;

[0037] Figure 13 shows a cross-sectional view of the module shown in Figure 9;

[0038] Figure 14 shows a rear view of a display module according to some embodiments of the present disclosure;

[0039] Figure 15 shows a rear view of the main flexible circuit board in Figure 14;

[0040] Figure 16 shows a rear view of the binding area in Figure 14;

[0041] Figure 17 shows a rear view of the bent gasket in Figure 14;

[0042] Figure 18 shows a cross-sectional view of the module shown in Figure 14;

[0043] Figure 19 shows the HH cross-sectional view of the module shown in Figure 14;

[0044] Figure 20 shows a cross-sectional view of module II shown in Figure 14;

[0045] Figure 21 shows a rear view of a display module according to some embodiments of the present disclosure;

[0046] Figure 22 shows a rear view of the main flexible circuit board in Figure 21;

[0047] Figure 23 shows a rear view of the binding area in Figure 21;

[0048] Figure 24 shows a rear view of the bent gasket in Figure 21;

[0049] Figure 25 shows a cross-sectional view of module JJ in Figure 21;

[0050] Figure 26 shows a cross-sectional view of module KK in Figure 21;

[0051] Figure 27 shows a rear view of a display module according to some embodiments of the present disclosure;

[0052] Figure 28 shows a rear view of the main flexible circuit board in Figure 27;

[0053] Figure 29 shows a rear view of the binding area in Figure 27;

[0054] Figure 30 shows a rear view of the bent gasket in Figure 27;

[0055] Figure 31 shows the LL cross-sectional view of the module shown in Figure 27;

[0056] Figure 32 shows a cross-sectional view of the MM section of the module shown in Figure 27;

[0057] Figure 33 shows a rear view of a display module according to some embodiments of the present disclosure;

[0058] Figure 34 shows a rear view of the main flexible circuit board in Figure 33;

[0059] Figure 35 shows a rear view of the binding area in Figure 33;

[0060] Figure 36 shows a rear view of the bent gasket in Figure 33;

[0061] Figure 37 shows an NN cross-sectional view of the module shown in Figure 33.

[0062] Figure label:

[0063] 100 Flexible display panel; 110 Display area; 120 Bending area; 130 Bonding area; 131 First component clearance hole; 200 Chip; 300 Main flexible circuit board; 310 First bonding end; 320 First chip clearance hole; 330 Adhesive layer; 340 Connector; 350 Reinforcing plate; 400 Component; 500 Bending gasket; 510 Second component clearance hole; 520 Second chip clearance hole; 600 Under-display material layer; 700 Polarizing layer; 800 Optical adhesive layer; 900 Cover plate; F1 First direction; F2 Second direction; F3 Third direction. Detailed Implementation

[0064] The technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this disclosure, and not all of them. Based on the embodiments of this disclosure, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this disclosure.

[0065] Furthermore, reference numerals and / or reference letters may be repeated in different examples in this disclosure. Such repetition is for simplification and clarity purposes and does not in itself indicate a relationship between the various embodiments and / or settings discussed. In addition, this disclosure provides examples of various specific processes and materials, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0066] This disclosure is described below with reference to the accompanying drawings and specific embodiments:

[0067] In related technologies, as shown in Figures 1 to 3, in flexible OLED display products, after the main flexible circuit board 300 is bonded to the bonding area 130, the main flexible circuit board 300 and the bonding area 130 are located on the same side of the second surface of the display area 110. A bending spacer 500 is provided between the bonding area 130 and the display area 110 to pad the bonding area 130. At the same time, the component 400 is located on the side of the main flexible circuit board 300 away from the display area 110, and the chip 200 is located on the side of the bonding area 130 away from the display area 110. In the second direction F2, both the component 400 and the chip 200 have a certain height, which will occupy a large space. At the same time, the entire flexible OLED display product needs to avoid the positions of the component 400 and the chip 200, resulting in a large overall thickness of the flexible OLED display product in the second direction F2, which does not meet the requirement of thinner and lighter flexible OLED display products. Furthermore, the components 400 and chip 200 lack effective protection measures relative to the main flexible circuit board 300 and bonding area 130, resulting in poor compression resistance and impact resistance of the flexible OLED display product. The components 400 and / or chip 200 are easily damaged by external impacts, which in turn leads to poor image quality and reduced yield of the flexible OLED display product.

[0068] To address the aforementioned problems with display modules, a display module according to some embodiments of this disclosure, as shown in Figures 4 to 37, includes: a flexible display panel 100, a chip 200, a main flexible circuit board 300, and components 400. In the first direction F1, the flexible display panel 100 includes a display area 110, a bending area 120, and a bonding area 130 connected in sequence. The display area 110 has a first surface and a second surface disposed opposite to each other. The bending area 120 is bendable so that the bonding area 130 is located on the side where the second surface of the display area 110 is located. The chip 200 is disposed in the bonding area 130. The main flexible circuit board 300 includes a first bonding end 310, which is electrically connected to the bonding area 130. The main flexible circuit board 300 and / or the bonding area 130 are bendable so that the main flexible circuit board 300 is located on the side of the bonding area 130 closer to the display area 110 or on the side of the bonding area 130 farther from the display area 110. Components 400 are disposed in... The components are placed on the main flexible circuit board 300; wherein the orthographic projection of the component 400 in the display area 110 does not overlap with the orthographic projection of the bonding area 130 in the display area 110, and / or, the orthographic projection of the chip 200 in the display area 110 does not overlap with the orthographic projection of the main flexible circuit board 300 in the display area 110; in the second direction F2, the component 400 and the bonding area 130 at least partially overlap, and / or, the chip 200 and the main flexible circuit board 300 at least partially overlap; the first direction F1 is the direction in which the display area 110, the bending area 120 and the bonding area 130 are connected in sequence, the second direction F2 is the direction perpendicular to the display area 110, and the third direction F3 is the direction perpendicular to both the first direction F1 and the second direction F2.

[0069] In some embodiments of this disclosure, as shown in Figures 4 to 37, the first bonding end 310 of the main flexible circuit board 300 is electrically connected to the bonding area 130. The main flexible circuit board 300 and / or the bonding area 130 can be bent so that the main flexible circuit board 300 is located on the side of the bonding area 130 closer to the display area 110 or on the side of the bonding area 130 farther from the display area 110, thereby integrating the main flexible circuit board 300 and the bonding area 130 together, that is, the main flexible circuit board 300 and the bonding area 130 are stacked. The chip 200 area of ​​the bonding area 130 can be reinforced by the main flexible circuit board 300, thereby improving the chip 200's resistance to compression and impact. By ensuring that the orthographic projection of component 400 in display area 110 does not overlap with the orthographic projection of bonding area 130 in display area 110, and / or that the orthographic projection of chip 200 in display area 110 does not overlap with the orthographic projection of main flexible circuit board 300 in display area 110; and that component 400 and bonding area 130 at least partially overlap in the second direction F2, and / or that chip 200 and main flexible circuit board 300 at least partially overlap in the second direction F2, the components 400 and / or chip 200 can overlap with bonding area 130 and / or main flexible circuit board 300 to a certain extent in the second direction F2, thereby making full use of the space in the second direction F2, reducing the thickness of the whole machine in the second direction F2, and improving the utilization rate of the whole machine space. At the same time, when the component 400 and / or chip 200 overlap with the bonding area 130 and / or main flexible circuit board 300 to a certain extent in the second direction F2, at least one side of the component 400 and / or chip 200 can be located inside the bonding area 130 and / or main flexible circuit board 300. That is to say, the component 400 and chip 200 can be hidden to a certain extent, thereby reducing the risk of damage to the component 400 and chip 200 from external impacts and improving the overall machine's resistance to compression and impact.

[0070] In some embodiments of this disclosure, the flexible display panel 100 may be an OLED display panel or an AMOLED display panel.

[0071] In some embodiments of this disclosure, as shown in Figures 4 to 37, optionally, the chip 200 can be disposed in the bonding region 130 using a COP (Chip On Pi) packaging process. The chip 200 can be located on the side of the bonding region 130 closer to the display region 110, or it can be located on the side of the bonding region 130 farther from the display region 110. In some embodiments, the position of the main flexible circuit board 300 relative to the bonding region 130 can be adaptively adjusted.

[0072] In some embodiments of this disclosure, as shown in Figures 4 to 37, the main flexible circuit board 300 is electrically connected to the bonding area 130 via a first bonding end 310. Both the main flexible circuit board 300 and the bonding area 130 are flexible, allowing the main flexible circuit board 300 and / or the bonding area 130 to be bent near the first bonding end 310. This allows the main flexible circuit board 300 and the bonding area 130 to be stacked, and the main flexible circuit board 300 can be used to reinforce the bonding area 130, improving the impact resistance of the bonding area 130 and the chip 200 on it. Simultaneously, in this configuration, the main flexible circuit board 300 can be located on the side of the bonding area 130 closer to the display area 110; the main flexible circuit board 300 can also be located on the side of the bonding area 130 farther from the display area 110.

[0073] In some embodiments of this disclosure, as shown in Figures 4 to 37, the component 400 is disposed on the main flexible circuit board 300. Optionally, the component 400 may be located on the side of the flexible circuit board close to the bonding area 130, so that the component 400 and the bonding area 130 can at least partially overlap in the second direction F2, so as to make full use of the space in the second direction F2, improve the space utilization of the display module, and to a certain extent avoid the display module being too thick in the second direction F2.

[0074] In some embodiments of this disclosure, as shown in Figures 4 to 37, the main flexible circuit board 300 is further provided with a board-to-board connector 340 (BTB) for electrical connection of the main flexible circuit board 300. Optionally, the board-to-board connector 340 is disposed on one side of the main flexible circuit board 300, and a reinforcing plate 350 is provided on the other side of the main flexible circuit board 300 opposite to the board-to-board connector 340. The reinforcing plate 350 may be non-reinforced and is used to reinforce the area of ​​the main flexible circuit board 300 where the board-to-board connector 340 is located.

[0075] In some embodiments of this disclosure, optionally, a protective adhesive layer or other structure may be provided on the outer side of the bending region 120 for including the bending region 120 of the flexible display panel 100.

[0076] In some embodiments of this disclosure, as shown in Figures 4 to 37, the display module further includes an under-display material layer 600. The under-display material layer 600 is disposed on the second surface of the display area 110. When the bonding area 130 and the main flexible circuit board 300 are flipped to the side where the second surface of the display area 110 is located via the bending area 120, the under-display material layer 600 is located between the display area 110 and the bonding area 130, or between the display area 110 and the main flexible circuit board 300. Optionally, the under-display material layer 600 may include any one or more of the following: a support layer, a back film (U-film), a heat dissipation film (SCF), etc.

[0077] In some embodiments of this disclosure, as shown in Figures 4 to 37, the display module further includes a polarizer (POL) layer 700, an optical adhesive layer 800, and a cover plate 900. The polarizer 700 is disposed on the first surface of the display area 110 and can be used to suppress the reflection interference of ambient light. The cover plate 900 is adhered to the polarizer 700 away from the display area 110 by the optical adhesive layer 800 and can be used to protect the internal structure of the display device.

[0078] As an alternative implementation, as shown in Figures 4 to 26, the component 400 is located on the side of the main flexible circuit board 300 near the bonding area 130; in the third direction F3, at least one side of the bonding area 130 is recessed inward by a first recess distance relative to the main flexible circuit board 300, and the component 400 is disposed in the area of ​​the main flexible circuit board 300 that protrudes relative to the bonding area 130.

[0079] In some embodiments of this disclosure, as shown in Figures 4 to 26, the main flexible circuit board 300 and the bonding area 130 are stacked. When the component 400 is located on the side of the main flexible circuit board 300 close to the bonding area 130, at least one side of the bonding area 130 is recessed by a first recess distance relative to the main flexible circuit board 300 in the third direction F3. Then, the main flexible circuit board 300 will have a region protruding relative to the bonding area 130 in the third direction F3. By placing the component 400 in the region of the main flexible circuit board 300 protruding relative to the bonding area 130 in the third direction F3, the orthographic projection of the component 400 in the display area 110 and the orthographic projection of the bonding area 130 in the display area 110 can be made to not overlap. That is, the component 400 and the bonding area 130 are staggered in the first direction F1 and the third direction F3. At the same time, the component 400 and the bonding area 130 have a certain overlap in the second direction F2, thereby reducing the size in the second direction F2 to a certain extent and saving overall space. Optionally, the first indentation distance can be adaptively adjusted according to the size, quantity, and setting position of the component 400; the setting position of the component 400 can be adjusted according to the actual layout.

[0080] In some embodiments of this disclosure, as shown in Figures 4 to 13, the main flexible circuit board 300 and the bonding area 130 are stacked together, and the main flexible circuit board 300 is located between the bonding area 130 and the display area 110. Thus, the main flexible circuit board 300 can replace the bending spacer 500, so that the display module no longer needs to set the single-function bending spacer 500, reducing the number of components in the display module and reducing material costs. Chip 200 is located on the side of bonding area 130 away from main flexible circuit board 300, and component 400 is located on the side of main flexible circuit board 300 close to bonding area 130. The two sides of bonding area 130 on the third direction F3 are respectively recessed by a first recess distance relative to main flexible circuit board 300 on the third direction F3, so that component 400 is located on the two sides of bonding area 130 on the third direction F3, and the orthographic projection of component 400 on display area 110 does not overlap with the orthographic projection of bonding area 130 on display area 110. In other words, component 400 and bonding area 130 are offset.

[0081] As an alternative implementation, in the first direction F1 and the third direction F3, the distance between the component 400 and the edge of the main flexible circuit board 300 is at least 1.0 mm, and the distance between the component 400 and the bonding area 130 is at least 2.0 mm.

[0082] In some embodiments of this disclosure, as shown in Figures 3 to 37, the distance between component 400 and the edge of the main flexible circuit board 300 in the first direction F1 is at least 1.0 mm, and the distance between component 400 and the edge of the main flexible circuit board 300 in the third direction F3 is at least 1.0 mm, to ensure that component 400 does not exceed the range of the main flexible circuit board 300 and is not subject to risks such as collision. The distance between component 400 and bonding area 130 in the first direction F1 is at least 2.0 mm, and the distance between component 400 and bonding area 130 in the third direction F3 is at least 2.0 mm, which can ensure that a certain gap is maintained between component 400 and bonding area 130, allowing for a certain assembly error in the assembly of the display module and avoiding interference or collision between component 400 and bonding area 130. Optionally, the distance between component 400 and the edge of the main flexible circuit board 300 can be 1.0 mm to 10.0 mm, and the distance between component 400 and bonding area 130 can be 2.0 mm to 20.0 mm.

[0083] As an alternative implementation, as shown in Figures 27 to 37, the component 400 is located on the side of the main flexible circuit board 300 near the bonding area 130; a first component clearance hole 131 is provided in the area of ​​the bonding area 130 corresponding to the component 400.

[0084] In some embodiments of this disclosure, as shown in Figures 27 to 37, the component 400 is located on the side of the main flexible circuit board 300 near the bonding area 130. By providing a first component clearance hole 131 in the area of ​​the bonding area 130 corresponding to the component 400, the bonding area 130 can avoid the component 400 through the first component clearance hole 131. This achieves the purpose that the orthographic projection of the component 400 in the display area 110 does not overlap with the orthographic projection of the bonding area 130 in the display area 110. In other words, the component 400 and the bonding area 130 are made to overlap in the first direction. The components 400 and the third direction F3 are staggered. Simultaneously, the component 400 and the bonding area 130 overlap to some extent in the second direction F2. This reduces the size in the second direction F2 to a certain extent, saving overall space. Furthermore, the bonding area 130 is located around the component 400, allowing it to be situated inside the display module and not exposed to the external environment. This improves the protection of the component 400, preventing damage from external impacts and thus enhancing the display module's resistance to compression and impact. Optionally, the position of the component 400 can be adjusted according to the actual layout; correspondingly, the position, size, and number of the first component clearance holes 131 can be adaptively adjusted based on the position, size, and number of the component 400.

[0085] As an alternative implementation, as shown in Figures 27 to 37, the distance between component 400 and the edge of the first component clearance hole 131 is at least 0.5 mm in the first direction F1 and the third direction F3.

[0086] In some embodiments of this disclosure, as shown in Figures 3 to 37, the distance between component 400 and the edge of the first component clearance hole 131 is at least 0.5 mm. This ensures that a certain gap is maintained between component 400 and the edge of the first component clearance hole 131, allowing for a certain assembly error in the assembly of the display module and preventing interference or collision between component 400 and the bonding area 130. Optionally, in the first direction F1 and the third direction F3, the distance between component 400 and the edge of the first component clearance hole 131 can be 0.5 mm to 5.0 mm.

[0087] As an optional implementation, as shown in Figures 9 to 13, 21 to 26 and 33 to 37, the chip 200 is located on the side of the bonding area 130 close to the main flexible circuit board 300; a first chip clearance hole 320 is provided in the area of ​​the main flexible circuit board 300 corresponding to the chip 200.

[0088] In some embodiments of this disclosure, as shown in Figures 9 to 13, 21 to 26, and 33 to 37, the chip 200 is located on the side of the bonding area 130 close to the main flexible circuit board 300. By providing a first chip clearance hole 320 in the area of ​​the main flexible circuit board 300 corresponding to the chip 200, the main flexible circuit board 300 can avoid the chip 200 through the first chip clearance hole 320. This achieves the purpose that the orthographic projection of the chip 200 in the display area 110 does not overlap with the orthographic projection of the main flexible circuit board 300 in the display area 110. In other words, it ensures that the chip 200 and the main flexible circuit board 300 are bonded together. The circuit board 300 is staggered in the first direction F1 and the third direction F3. Simultaneously, the chip 200 and the main flexible circuit board 300 overlap to some extent in the second direction F2. This reduces the size in the second direction F2 to a certain extent, saving overall space. Furthermore, the main flexible circuit board 300 is located around the chip 200, allowing the chip 200 to be housed within the display module and not exposed to the external environment. This improves the protection of the chip 200 from external impacts, thereby enhancing the display module's resistance to compression and impact. Optionally, the position of the chip 200 can be adjusted according to design requirements; correspondingly, the position and size of the first chip clearance hole 320 can be adaptively adjusted according to the position and size of the component 400.

[0089] In some embodiments of this disclosure, as shown in Figures 9 to 13, 21 to 26, and 33 to 37, the thickness of the chip 200 is less than 0.17 mm, the thickness of the main flexible circuit board 300 can be 0.12 mm, and the thickness of the adhesive layer 330 is 0.05 mm to 0.1 mm. Therefore, the total thickness of the main flexible circuit board 300 and at least one adhesive layer 330 disposed on the main flexible circuit board 300 is greater than 0.17 mm. That is to say, the thickness of the first chip clearance hole 320 in the second direction F2 is at least greater than 0.17 mm. The main flexible circuit board 300 and the adhesive layer 330 disposed on the main flexible circuit board 300 can make the chip 200 completely located within the first chip clearance hole 320, thereby achieving the purpose of completely hiding the chip 200 inside without leakage, and thus improving the protection of the chip 200.

[0090] As an optional implementation, as shown in Figures 9 to 13, 21 to 26 and 33 to 37, the distance between the chip 200 and the edge of the first chip clearance hole 320 is at least 1.0 mm in the first direction F1 and the third direction F3.

[0091] In some embodiments of this disclosure, as shown in Figures 9 to 13, 21 to 26, and 33 to 37, the distance between the chip 200 and the edge of the first chip clearance hole 320 is at least 1.0 mm. This ensures that a certain gap is maintained between the chip 200 and the edge of the first chip clearance hole 320, allowing for a certain assembly error in the assembly of the display module and preventing interference or collision between the chip 200 and the main flexible circuit board 300. Optionally, the distance between the chip 200 and the edge of the first chip clearance hole 320 can be from 1.0 mm to 10.0 mm.

[0092] As an alternative implementation, as shown in Figures 4 to 37, the main flexible circuit board 300 is provided with an adhesive layer 330 on the side near the display area 110 to bond the main flexible circuit board 300 to the display area 110, and / or, the main flexible circuit board 300 is provided with an adhesive layer 330 on the side near the bonding area 130 to bond the main flexible circuit board 300 to the bonding area 130.

[0093] In some embodiments of this disclosure, as shown in Figures 4 to 37, an adhesive layer 330 is provided on the side of the main flexible circuit board 300 near the display area 110 to bond the main flexible circuit board 300 to the display area 110, and / or, an adhesive layer 330 is provided on the side of the main flexible circuit board 300 near the bonding area 130 to bond the main flexible circuit board 300 to the bonding area 130. The adhesive layer 330 is stacked on the surface of the main flexible circuit board 300, and the adhesive layer 330 needs to avoid components 400 and holes disposed on the main flexible circuit board 300. For example, the adhesive layer 330 needs to have through holes to avoid components 400, and the adhesive layer 330 needs to have through holes to avoid the first chip avoidance hole 320.

[0094] In some embodiments of this disclosure, as shown in Figures 4 to 37, the main flexible circuit board 300 and the bonding area 130 are stacked. When the main flexible circuit board 300 is located on the side of the bonding area 130 away from the display area 110, an adhesive layer 330 may be provided on the side of the main flexible circuit board 300 close to the bonding area 130, so that the main flexible circuit board 300 and the bonding area 130 can be bonded and fixed by the adhesive layer 330. Optionally, the adhesive layer 330 used for bonding the main flexible circuit board 300 and the bonding area 130 can be insulating tape or graphite sheet tape to ensure insulation between the main flexible circuit board 300 and the bonding area 130. The thickness of the adhesive layer 330 used for bonding the main flexible circuit board 300 and the bonding area 130 can be 50µm to 100µm, and the adhesion is >1500gf / inch.

[0095] In some embodiments of this disclosure, as shown in Figures 4 to 37, the main flexible circuit board 300 and the bonding area 130 are stacked. When the main flexible circuit board 300 is located on the side of the bonding area 130 near the display area 110, an adhesive layer 330 may be provided on the side of the main flexible circuit board 300 near the bonding area 130, so that the main flexible circuit board 300 and the bonding area 130 can be bonded and fixed by the adhesive layer 330. Simultaneously, an adhesive layer 330 may also be provided on the side of the main flexible circuit board 300 near the display area 110, so that the main flexible circuit board 300 and the display area 110 or the under-screen material layer 600 of the second surface of the display area 110 can be bonded and fixed by the adhesive layer 330. Optionally, the adhesive layer 330 used for bonding the main flexible circuit board 300 and the display area 110 may be conductive tape, so that the main flexible circuit board 300 can be electrically connected to the display area 110 through the conductive tape, achieving a grounding function.

[0096] As an alternative implementation, as shown in Figures 4 to 37, in the first direction F1 and the third direction F3, the adhesive layer 330 is recessed at least 0.2 mm from the edge of the main flexible circuit board 300, the adhesive layer 330 is recessed at least 0.2 mm from the edge of the bonding area 130, and the adhesive layer 330 is recessed at least 0.2 mm from the edge of the display area 110.

[0097] In some embodiments of this disclosure, as shown in Figures 4 to 37, by making the adhesive layer 330 recessed at least 0.2 mm from the edge of the main flexible circuit board 300, at least 0.2 mm from the edge of the bonding area 130, and at least 0.2 mm from the edge of the display area 110, the adhesive layer 330 can be prevented from being too large, thus avoiding adhesive overflow at the edges of the main flexible circuit board 300, the bonding area 130, and the display area 110.

[0098] In some embodiments of this disclosure, as shown in Figures 4 to 37, optionally, the adhesive layer 330 is recessed from the edge of the main flexible circuit board 300 by 0.2 mm to 2.0 mm, the adhesive layer 330 is recessed from the edge of the bonding area 130 by 0.2 mm to 2.0 mm, and the adhesive layer 330 is recessed from the edge of the display area 110 by 0.2 mm to 2.0 mm.

[0099] In some embodiments of this disclosure, as shown in Figures 4 to 37, optionally, the adhesive layer 330 is recessed at least 0.2 mm inward relative to the component 400, and the adhesive layer 330 is recessed at least 0.2 mm inward relative to the first chip clearance hole 320, which can prevent the adhesive layer 330 from being too large and causing adhesive overflow. Optionally, the recessed distance of the adhesive layer 330 relative to the component 400 is 0.2 mm to 2.0 mm, and the recessed distance of the adhesive layer 330 relative to the first chip clearance hole 320 is 0.2 mm to 2.0 mm.

[0100] As an optional implementation, as shown in Figures 14 to 37, the main flexible circuit board 300 is located on the side of the bonding area 130 away from the display area 110. The display module also includes a bending pad 500, which is disposed on the side of the display area 110 close to the bonding area 130. In the second direction F2, the bending pad 500 is connected to the display area 110 and the bonding area 130 respectively.

[0101] In some embodiments of this disclosure, as shown in Figures 14 to 37, the main flexible circuit board 300 is located on the side of the bonding area 130 away from the display area 110, so the bonding area 130 and the display area 110 are suspended in the second direction F2; by providing a bending pad 500 on the side of the display area 110 close to the bonding area 130, the bending pad 500 is supported between the bonding area 130 and the display area 110, so that the curvature of the bending area 120 of the flexible display panel 100 can reach the design parameters and remain stable.

[0102] As an optional implementation, as shown in Figures 14 to 37, a second component clearance hole 510 is provided in the area of ​​the bent pad 500 corresponding to the component 400, and / or a second chip clearance hole 520 is provided in the area of ​​the bent pad 500 corresponding to the chip 200.

[0103] In some embodiments of this disclosure, as shown in Figures 14 to 37, the component 400 may be located on the side of the main flexible circuit board 300 near the display area 110. When the binding area 130 is recessed relative to the main flexible circuit board 300 on the third direction F3 or when the binding area 130 has a first component clearance hole 131 to avoid the component 400, the component 400 on the main flexible circuit board 300 is positioned toward the bending pad 500, and there may be interference between it and the bending pad 500. As shown in Figures 14 to 37, by providing a second component clearance hole 510 in the area corresponding to the component 400 in the bending pad 500, the bending pad 500 can avoid the component 400 through the second component clearance hole 510, so that the orthographic projection of the component 400 in the display area 110 does not overlap with the orthographic projection of the bending pad 500 in the display area 110. That is to say, the component 400 and the bending pad 500 are staggered in the first direction F1 and the third direction F3. At the same time, the component 400 and the bending pad 500 can have a certain degree of overlap in the second direction F2. On the one hand, this reduces the size in the second direction F2 to a certain extent, saving overall space. On the other hand, the bending pad 500 is located around the component 400, so that the component 400 is located inside the display module and is not exposed to the external environment. This can improve the protection of the component 400 and prevent the component 400 from being damaged by external impact, thereby improving the compression resistance and impact resistance of the display module. Optionally, the thickness of the bending pad 500 in the second direction F2 can be adjusted so that the total thickness of the bending pad 500, the bonding area 130, and the adhesive layer 330 disposed on the main flexible circuit board 300 in the second direction F2 is greater than the thickness of the component 400 in the second direction F2. This allows the component 400 to be completely located within the space formed by the first component clearance hole 131 and / or the second component clearance hole 510, thereby achieving the purpose of completely hiding the component 400 inside without exposure, and thus improving the protection of the component 400.

[0104] In some embodiments of this disclosure, as shown in Figures 14 to 37, the chip 200 may be located on the side of the bonding area 130 close to the display area 110. In this case, the chip 200 on the bonding area 130 is positioned toward the bending pad 500, and there may be interference between it and the bending pad 500. As shown in Figures 14 to 37, by providing a second chip clearance hole 520 in the area corresponding to the chip 200 in the bending pad 500, the bending pad 500 can avoid the chip 200 through the second chip clearance hole 520, so that the orthographic projection of the chip 200 in the display area 110 does not overlap with the orthographic projection of the bending pad 500 in the display area 110. That is to say, the chip 200 and the bending pad 500 are offset from each other in the first direction F1 and the third direction F3. At the same time, the chip 200 and the bending pad 500 can have a certain degree of overlap in the second direction F2. On the one hand, this reduces the size in the second direction F2 to a certain extent, saving overall space. On the other hand, the bending pad 500 is located around the chip 200, so that the chip 200 is located inside the display module and is not exposed to the external environment, which can improve the protection of the chip 200 and prevent the chip 200 from being damaged by external impact, thereby improving the compression resistance and impact resistance of the display module.

[0105] As an optional implementation, in the first direction F1 and the third direction F3, the distance between the edge of the second component clearance hole 510 and the component 400 is at least 1.0 mm, and the orthographic projection of the bent pad 500 on the main flexible circuit board 300 is recessed by at least 0.2 mm relative to the edge of the main flexible circuit board 300; and / or, in the first direction F1 and the third direction F3, the distance between the edge of the second chip clearance hole 520 and the chip 200 is at least 1.0 mm, and the orthographic projection of the bent pad 500 on the bonding area 130 is recessed by at least 0.2 mm relative to the edge of the bonding area 130.

[0106] In some embodiments of this disclosure, as shown in Figures 14 to 37, the distance between the edge of the second component clearance hole 510 and the component 400 in the first direction F1 and the third direction F3 is at least 1.0 mm. This ensures that a certain gap is maintained between the edge of the second component clearance hole 510 and the component 400, allowing for a certain assembly error in the assembly of the display module and preventing interference or collision between the component 400 and the bending pad 500. The orthogonal projection of the bending pad 500 on the main flexible circuit board 300 is recessed by at least 0.2 mm relative to the edge of the main flexible circuit board 300. The bending pad 500 can provide support for the main flexible circuit board 300 and also prevent the bending pad 500 from exceeding the range of the main flexible circuit board 300, thus avoiding material waste or affecting the dimensional design space of the main flexible circuit board 300. Optionally, in the first direction F1 and the third direction F3, the distance between the edge of the second component clearance hole 510 and the component 400 can be 1.0mm to 10.0mm, and the orthographic projection of the bent pad 500 on the main flexible circuit board 300 can be recessed by 0.2mm to 2.0mm relative to the edge of the main flexible circuit board 300.

[0107] In some embodiments of this disclosure, as shown in Figures 14 to 37, the distance between the edge of the second chip clearance hole 520 and the chip 200 in the first direction F1 and the third direction F3 is at least 1.0 mm. This ensures that a certain gap is maintained between the edge of the second chip clearance hole 520 and the chip 200, allowing for a certain assembly error in the assembly of the display module and preventing interference or collision between the chip 200 and the bending pad 500. The orthographic projection of the bending pad 500 on the bonding area 130 is recessed by at least 0.2 mm relative to the edge of the bonding area 130. The bending pad 500 can both provide support for the bonding area 130 and prevent the bending pad 500 from exceeding the range of the bonding area 130, thus avoiding material waste or affecting the dimensional design space of the bonding area 130. Optionally, in the first direction F1 and the third direction F3, the distance between the edge of the second chip clearance hole 520 and the chip 200 can be 1.0mm to 10.0mm, and the orthographic projection of the bent pad 500 on the bonding area 130 can be recessed by 0.2mm to 2.0mm relative to the edge of the bonding area 130.

[0108] As an alternative implementation, as shown in Figures 21 to 26, the bent pad 500 is connected to the main flexible circuit board 300 in the second direction F2.

[0109] In some embodiments of this disclosure, as shown in Figures 21 to 26, a second component clearance hole 510 is provided in the area corresponding to the component 400 of the bending pad 500. When the component 400 is cleared through the second component clearance hole 510, the area of ​​the main flexible circuit board 300 where the component 400 is located corresponds to the main flexible circuit board 300. This allows the bending pad 500 to connect with the main flexible circuit board 300, so that the flexible circuit board can be supported by the bending pad 500. This allows the main flexible circuit board 300 to remain flat in the first direction F1 and the third direction F3.

[0110] As an optional implementation, as shown in Figures 4 to 37, the display device further includes an under-screen material layer 600, which is disposed on the second surface of the display area 110.

[0111] In some embodiments of this invention, as shown in Figures 4 to 37, an under-display material layer 600 is disposed on the second surface of the display area 110 to protect the second surface of the display area 110 and provide certain functions for the second surface of the display area 110, such as heat dissipation, heat dissipation, and buffering. The structure of the under-display material layer 600 can be adjusted to meet the functional requirements of the second surface of the display area 110. Optionally, the under-display material layer 600 may include a back heat dissipation tape (SCF), which may include an adhesive layer, a buffer layer, a heat dissipation layer, and a protective layer, and is adhered to the second surface of the display area 110 via the adhesive layer. Optionally, the adhesive layer may be any one of a mesh adhesive layer, a thermally conductive silicone layer, or a thermally conductive adhesive layer. The adhesive layer is used to adhere to the second surface of the display area 110, and to connect the back heat dissipation film to the display area 110. The adhesive layer can be used to conduct heat from the display area 110, transferring the heat from the display area 110 to the buffer layer and the heat dissipation layer to dissipate heat from the display area 110. The adhesive layer can also be used to conduct electrical charge from the display area 110, electrically connecting the display area 110 to the main flexible circuit board 300, and can realize the grounding function of the flexible display panel 100.

[0112] In some embodiments of this disclosure, as shown in Figures 4 to 8, the main flexible circuit board 300 is stacked between the bonding area 130 and the display area 110. On the one hand, the main flexible circuit board 300 can serve as a material for the bending pad 500, ensuring that the curvature of the bending area 120 of the flexible display panel 100 meets the design parameters and remains stable, while also reducing the thickness of the flexible display panel 100 in the second direction F2. On the other hand, the main flexible circuit board 300 can serve as a reinforcing layer, increasing the strength of the bonding area 130 and the chip 200 disposed on the bonding area 130. The chip 200 is located on the side of the bonding area 130 away from the display area 110 and the main flexible circuit board 300, while the component 400 is located on the side of the main flexible circuit board 300 facing the bonding area 130. The position of the component 400 can be adjusted according to the actual layout, and the distance between the component 400 and the edge of the main flexible circuit board 300 is greater than 1.0 mm to prevent the component 400 from exceeding the range of the main flexible circuit board 300. The bonding area 130 is recessed relative to the main flexible circuit board 300 in the third direction F3, allowing the components 400 to be located on opposite sides of the bonding area 130 in the third direction F3. The distance between the components 400 and the edge of the bonding area 130 is greater than 2.0mm to avoid interference with the display area 110. The bonding area 130 and the adhesive layer 330 disposed on the main flexible circuit board 300 for bonding with the bonding area 130 overlap with the components 400 in the second direction F2, which can make full use of the space utilization in the second direction F2, save the overall space, and reduce the thickness of the flexible display panel 100 in the second direction F2. The main flexible circuit board 300 is bonded to the bonding area 130 and the display area 110 via an adhesive layer 330. The adhesive layer 330 used for bonding the main flexible circuit board 300 to the bonding area 130 can be insulating tape or graphite sheet tape, with a thickness of 50um to 100um, an adhesion of >1500gf / inch, and a recess of more than 0.2mm relative to the edge of the bonding area 130. The adhesive layer 330 used for bonding the main flexible circuit board 300 to the display area 110 can be conductive tape, with a recess of more than 0.2mm relative to the edge of the main flexible circuit board 300.

[0113] In some embodiments of this disclosure, as shown in Figures 9 to 13, the difference from the embodiments shown in Figures 4 to 8 lies in the placement of the chip 200. The chip 200 is located on the side of the bonding area 130 near the display area 110 and the main flexible circuit board 300. Simultaneously, the main flexible circuit board 300 has a first chip avoidance hole 320 to avoid the chip 200. The distance between the edge of the first chip avoidance hole 320 and the chip 200 is greater than 1.0 mm to avoid interference with the chip 200. As shown in Figures 12 and 13, the chip 200 is completely hidden within the space enclosed by the bonding area 130, the main flexible circuit board 300, and the display area 110, thereby effectively protecting the chip 200 from damage. It also reduces the size of the display module in the second direction F2, improving the overall space utilization.

[0114] In some embodiments of this disclosure, as shown in Figures 14 to 20, a bonding area 130 is stacked between the main flexible circuit board 300 and the display area 110, and a bending pad 500 is stacked between the bonding area 130 and / or the main flexible circuit board 300 and the display area 110. The main flexible circuit board 300 can serve as a reinforcing layer to increase the strength of the bonding area 130 and the chip 200 disposed on the bonding area 130. In the first direction F1 and the third direction F3, the bending pad is recessed inward by more than 0.2 mm relative to the edge of the main flexible circuit board 300, and simultaneously, the bending pad is recessed inward by more than 0.2 mm relative to the edge of the bonding area 130. The chip 200 is located on the side of the bonding area 130 closer to the display area 110, and the component 400 is located on the side of the main flexible circuit board 300 facing the bonding area 130. The position of the component 400 can be adjusted according to the actual layout. The distance between the component 400 and the edge of the main flexible circuit board 300 is greater than 1.0 mm to avoid the component 400 exceeding the range of the main flexible circuit board 300. The bonding area 130 is recessed relative to the main flexible circuit board 300 on the third-direction F3, allowing components 400 to be located on opposite sides of the bonding area 130 on the third-direction F3. The distance between the components 400 and the edge of the bonding area 130 is greater than 2.0 mm to avoid interference with the display area 110. The main flexible circuit board 300 is bonded to the bonding area 130 by an adhesive layer 330. The adhesive layer 330 used for bonding the main flexible circuit board 300 to the bonding area 130 can be insulating tape or graphite sheet tape, with a thickness of 50 μm to 100 μm, an adhesion of >1500 gf / inch, and a recess of more than 0.2 mm relative to the edge of the bonding area 130. In this design, components 400 and 200 face the bending pad 500. A second component clearance hole 510 is provided on the bending pad 500 to avoid interference with component 400. The edge of the second component clearance hole 510 is more than 1.0 mm away from component 400 to avoid interference. Simultaneously, a second chip clearance hole 520 is provided on the bending pad 500 to avoid interference with chip 200. The edge of the second chip clearance hole 520 is more than 1.0 mm away from chip 200 to avoid interference. As shown in Figures 18 to 20, components 400 and 200 are completely hidden within the space enclosed by the main flexible circuit board 300 / bonding area 130, the bending pad 500, and the display area 110. This effectively protects components 400 and 200 from collision damage and also reduces the size of the display module in the second direction F2, improving the overall space.

[0115] In some embodiments of this disclosure, as shown in Figures 21 to 26, the difference from the embodiments shown in Figures 14 to 20 is that the chip 200 is positioned differently. The chip 200 is located on the side of the bonding area 130 away from the display area 110 and on the side of the bonding area 130 close to the main flexible circuit board 300. At the same time, the main flexible circuit board 300 has a first chip avoidance hole 320 to avoid the chip 200. The distance between the edge of the first chip avoidance hole 320 and the chip 200 is greater than 1.0 mm to avoid interference with the chip 200. As shown in Figures 25 and 26, the thickness of chip 200 is less than 0.17 mm, the thickness of the main flexible circuit board 300 can be 0.12 mm, and the thickness of adhesive layer 330 is 0.05 mm to 0.1 mm. Therefore, the total thickness of the main flexible circuit board 300 and at least one adhesive layer 330 disposed on the main flexible circuit board 300 is greater than 0.17 mm. That is to say, the thickness of the first chip clearance hole 320 in the second direction F2 is at least greater than 0.17 mm. The main flexible circuit board 300 and the adhesive layer 330 disposed on the main flexible circuit board 300 can make chip 200 completely located within the first chip clearance hole 320, achieving the purpose of completely hiding chip 200 inside without leakage, thereby improving the protection of chip 200.

[0116] In some embodiments of this disclosure, as shown in Figures 27 to 32, a bonding area 130 is stacked between the main flexible circuit board 300 and the display area 110, and a bending pad 500 is stacked between the bonding area 130 and / or the main flexible circuit board 300 and the display area 110. The main flexible circuit board 300 can serve as a reinforcing layer to increase the strength of the bonding area 130 and the chip 200 disposed on the bonding area 130. In the first direction F1 and the third direction F3, the bending pad is recessed inward by more than 0.2 mm relative to the edge of the main flexible circuit board 300, and simultaneously, the bending pad is recessed inward by more than 0.2 mm relative to the edge of the bonding area 130. The chip 200 is located on the side of the bonding area 130 closer to the display area 110, and the component 400 is located on the side of the main flexible circuit board 300 facing the bonding area 130. The position of the component 400 can be adjusted according to the actual layout. The distance between the component 400 and the edge of the main flexible circuit board 300 is greater than 1.0 mm to avoid the component 400 exceeding the range of the main flexible circuit board 300. The main flexible circuit board 300 is bonded to the bonding area 130 by an adhesive layer 330. The adhesive layer 330 used for bonding the main flexible circuit board 300 to the bonding area 130 can be insulating tape or graphite sheet tape, with a thickness of 50um to 100um, an adhesion of >1500gf / inch, and a recess of more than 0.2mm relative to the edge of the bonding area 130. In this design, component 400 faces the bonding area 130 and the bending pad 500. A first component clearance hole 131 can be formed in the bonding area 130 to avoid component 400, and a second component clearance hole 510 can be formed on the bending pad to avoid component 400. The distance between the edge of the first component clearance hole 131 and component 400 is greater than 1.0 mm, and the distance between the edge of the second component clearance hole 510 and component 400 is greater than 1.0 mm, so as to avoid interference between the first component clearance hole 131 and the second component clearance hole 510 and component 400. Chip 200 faces the bending pad 500, and a second chip clearance hole 520 can be formed on the bending pad 500 to avoid chip 200. The distance between the edge of the second chip clearance hole 520 and chip 200 is greater than 1.0 mm, so as to avoid interference with chip 200. As shown in Figures 31 and 32, the components 400 and 200 are completely hidden within the space enclosed by the main flexible circuit board 300, the bonding area 130, the bending pad 500, and the display area 110. This effectively protects the components 400 and 200 from collision damage and also reduces the size of the display module in the second direction F2, thus improving the overall space.

[0117] In some embodiments of this disclosure, as shown in Figures 33 to 37, the difference from the embodiments shown in Figures 27 to 32 is that the chip 200 is positioned differently. The chip 200 is located on the side of the bonding area 130 away from the display area 110 and on the side of the bonding area 130 close to the main flexible circuit board 300. At the same time, the main flexible circuit board 300 has a first chip avoidance hole 320 to avoid the chip 200. The distance between the edge of the first chip avoidance hole 320 and the chip 200 is greater than 1.0 mm to avoid interference with the chip 200. As shown in Figure 37, the thickness of chip 200 is less than 0.17 mm, the thickness of main flexible circuit board 300 can be 0.12 mm, and the thickness of adhesive layer 330 is 0.05 mm to 0.1 mm. Therefore, the total thickness of main flexible circuit board 300 and at least one adhesive layer 330 disposed on main flexible circuit board 300 is more than 0.17 mm. That is to say, the thickness of the first chip clearance hole 320 in the second direction F2 is at least greater than 0.17 mm. Main flexible circuit board 300 and adhesive layer 330 disposed on main flexible circuit board 300 can make chip 200 completely located within the first chip clearance hole 320, achieving the purpose of completely hiding chip 200 inside without leakage, thereby improving the protection of chip 200.

[0118] In the above embodiments of this disclosure, the relative positions of the main flexible circuit board 300 and the bonding area 130 can be adjusted according to the placement positions of the components 400 and the chip 200. The opening positions of the main flexible circuit board 300, the bonding area 130, and the bending pad 500 can also be adjusted, thereby hiding the components 400 and the chip 200 inside the display module to a certain extent, improving the protection of the components 400 and the chip 200, reducing the overall thickness of the display module, and improving the display module's resistance to compression and impact.

[0119] Based on the same inventive concept, some embodiments of the display device disclosed herein include the above-described display module.

[0120] Since the display device disclosed herein includes the display module of the above-mentioned technical solution, the display device disclosed herein possesses all the beneficial effects of the above-mentioned display module, which will not be elaborated here.

[0121] In some embodiments of this disclosure, the display device can be a mobile phone, desktop computer, tablet computer, laptop computer, vehicle display, projector, camera, digital camera, electronic watch, computer, electronic instrument, electronic paper, digital photo frame, or other products or components with display functions.

[0122] In this disclosure, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0123] In the description of this disclosure, it should be understood that the terms “center,” “longitudinal,” “lateral,” “length,” “width,” “thickness,” “upper,” “lower,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” “outer,” “clockwise,” and “counterclockwise” indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this disclosure and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this disclosure.

[0124] It should be noted that all directional indications in this embodiment are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0125] In this disclosure, unless otherwise expressly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0126] Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed in this disclosure.

[0127] Although embodiments of the present disclosure have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present disclosure, the scope of which is defined by the claims and their equivalents.

Claims

1. A display module, comprising: A flexible display panel, in a first direction, includes a display area, a bending area, and a bonding area connected in sequence. The display area has a first surface and a second surface disposed opposite to each other. The bending area is bendable so that the bonding area is located on the side where the second surface of the display area is located. A chip, wherein the chip is disposed in the bonding area; A main flexible circuit board, the main flexible circuit board including a first bonding end electrically connected to the bonding area, the main flexible circuit board and / or the bonding area being bendable such that the main flexible circuit board is located on the side of the bonding area closer to the display area or on the side of the bonding area farther from the display area; and... Components, wherein the components are disposed on the main flexible circuit board; Wherein, the orthographic projection of the component in the display area does not overlap with the orthographic projection of the bonding area in the display area, and / or, the orthographic projection of the chip in the display area does not overlap with the orthographic projection of the main flexible circuit board in the display area; In the second direction, the component at least partially overlaps with the bonding area, and / or the chip at least partially overlaps with the main flexible circuit board; the first direction is the direction in which the display area, the bending area, and the bonding area are connected in sequence, the second direction is the direction perpendicular to the display area, and the third direction is the direction perpendicular to both the first direction and the second direction.

2. The display module as described in claim 1, wherein, The component is located on the side of the main flexible circuit board near the bonding area; in the third direction, at least one side of the bonding area is recessed inward relative to the main flexible circuit board by a first recess distance, and the component is disposed in the area of ​​the main flexible circuit board that protrudes relative to the bonding area.

3. The display module as described in claim 2, wherein, In the first direction and the third direction, the distance between the component and the edge of the main flexible circuit board is at least 1.0 mm, and the distance between the component and the bonding area is at least 2.0 mm.

4. The display module as described in claim 1, wherein, The component is located on the side of the main flexible circuit board near the bonding area; a first component clearance hole is provided in the area of ​​the bonding area corresponding to the component.

5. The display module as described in claim 4, wherein, In the first direction and the third direction, the distance between the component and the edge of the first component clearance hole is at least 0.5 mm.

6. The display module as described in claim 1, wherein, The chip is located on the side of the bonding area close to the main flexible circuit board; a first chip clearance hole is provided in the area of ​​the main flexible circuit board corresponding to the chip.

7. The display module as described in claim 6, wherein, In the first direction and the third direction, the distance between the chip and the edge of the first chip clearance hole is at least 1.0 mm.

8. The display module as described in claim 1, wherein, The main flexible circuit board has an adhesive layer on the side near the display area to bond the main flexible circuit board to the display area, and / or the main flexible circuit board has the adhesive layer on the side near the bonding area to bond the main flexible circuit board to the bonding area.

9. The display module as described in claim 8, wherein, In the first direction and the third direction, the adhesive layer is recessed at least 0.2 mm from the edge of the main flexible circuit board, the adhesive layer is recessed at least 0.2 mm from the edge of the bonding area, and the adhesive layer is recessed at least 0.2 mm from the edge of the display area.

10. The display module according to any one of claims 1 to 9, wherein, The main flexible circuit board is located on the side of the bonding area away from the display area, and the display module further includes: A bending pad is disposed on the side of the display area near the binding area, and in the second direction, the bending pad is connected to both the display area and the binding area.

11. The display module as claimed in claim 10, wherein, The bending pad has a second component clearance hole in the area corresponding to the component, and / or the bending pad has a second chip clearance hole in the area corresponding to the chip.

12. The display module as claimed in claim 11, wherein, In the first direction and the third direction, the distance between the edge of the second component clearance hole and the component is at least 1.0 mm, and the orthographic projection of the bending pad on the main flexible circuit board is recessed by at least 0.2 mm relative to the edge of the main flexible circuit board; And / or, in the first direction and the third direction, the distance between the edge of the second chip clearance hole and the chip is at least 1.0 mm, and the orthographic projection of the bent pad on the bonding area is recessed at least 0.2 mm relative to the edge of the bonding area.

13. The display module as claimed in claim 11, wherein, In the second direction, the bending pad is connected to the main flexible circuit board.

14. The display module as described in claim 10, further comprising: An under-display material layer is disposed on the second surface of the display area.

15. A display device, wherein, The display device includes a display module as described in any one of claims 1 to 14.

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