Atomization assembly and electronic atomization device
By designing a stable electrical connection structure in the electronic atomization device, the problem of unstable electrical connection of the heating element is solved, thereby improving the conductivity and atomization effect of the atomization component.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHENZHEN SMOORE TECH LTD
- Filing Date
- 2021-12-02
- Publication Date
- 2026-05-12
AI Technical Summary
In existing electronic atomization devices, the electrical connection of the heating element is unstable, which affects the atomization performance.
Design an atomizing component, including a housing assembly and a heating element. The atomizing surface of the heating element is connected to the atomizing chamber and the air outlet channel. An electrical connector is provided to ensure a stable connection between the electrode and the power supply assembly. A spring sheet is used to abut against the electrode and extend to the bottom surface of the heating base to connect with the power supply assembly.
A stable electrical connection improves the conductivity of the heating element, ensuring the reliability of the atomizing component and the atomization effect.
Smart Images
Figure CN122004530A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of atomization component technology, specifically to an atomization component and an electronic atomization device. Background Technology
[0002] Electronic atomizing devices generally include an atomizing component and a power supply component. The atomizing component includes a liquid reservoir, an airflow channel, and a heating element; the airflow channel includes an inlet channel, an atomizing chamber, and an outlet channel. The power supply component includes a power supply and control circuitry. Liquid in the reservoir flows to the heating element. When the user inhales, the control circuit controls the power supply to provide electrical energy, which heats the atomized liquid to generate an aerosol. Air enters through the inlet channel, carrying the aerosol from the atomizing chamber out through the outlet channel.
[0003] Among them, the electrical connection performance of the heating element affects the atomization performance of the heating element. Summary of the Invention
[0004] This application provides an atomizing component and an electronic atomizing device to improve the electrical connection stability of the heating element.
[0005] To address the aforementioned technical problems, the first technical solution provided in this application is as follows: An atomizing component is provided, comprising: a housing assembly and a heating element; the housing assembly has a liquid storage chamber, an air outlet channel, and an atomizing chamber; the liquid storage chamber is used to store a matrix; the housing assembly includes a housing and a heating base, the heating base being located within the housing, and the heating base and housing cooperating to form the liquid storage chamber; the heating element is used to atomize the matrix to generate an aerosol; the heating element is located within the heating base; the atomizing surface of the heating element is exposed in the atomizing chamber and parallel to the longitudinal direction of the atomizing component, the atomizing chamber communicating with the atomizing surface of the heating element and the air outlet channel; wherein, the heating element includes an electrode, the electrode being disposed on the atomizing surface; the atomizing component further includes an electrical connector; the electrical connector is disposed in the heating base; one end of the electrical connector extends into the heating base, and the side of the electrical connector abuts against the electrode; the other end of the electrical connector is exposed on the bottom surface of the heating base for connection to a power supply assembly.
[0006] In one embodiment, the heating base includes a first sub-heating base and a second sub-heating base that are fixedly connected; the first sub-heating base is provided with a groove that communicates with a liquid storage chamber; a heating element is disposed in the groove; and the atomizing surface of the heating element cooperates with the second sub-heating base to form an atomizing chamber.
[0007] In one embodiment, the electrical connector is a spring, which is disposed on the second sub-heater base.
[0008] In one embodiment, one end of the spring extends out of the second sub-heating base and is bent to form an elastic contact end that abuts against the electrode; and / or, the other end of the spring is bent vertically to form a contact end parallel to the bottom surface of the second sub-heating base and exposed on the bottom surface of the second sub-heating base for connection to a power supply assembly.
[0009] In one embodiment, the first sub-heating seat includes a top cover and a lower seat, the top cover and the lower seat being integrally formed; the lower seat has a groove on its side.
[0010] In one embodiment, the top cover is provided with a vent hole; one end of the vent hole is connected to the atomizing chamber, and the other end of the vent hole is connected to the air outlet channel.
[0011] In one embodiment, the second sub-heating seat includes an upper seat and a base; a top cover covers the base and abuts against the upper seat; the base covers the top cover and abuts against the lower seat; the atomizing surface of the heating element cooperates with the upper seat to form an atomizing cavity.
[0012] In one embodiment, the upper seat includes a first part, a second part, and a third part. The first part is connected to the second part, and the third part is connected to the second part. The first part and the third part are located at opposite ends of the second part. The ends of the first part and the third part that are away from the second part are in contact with the heating element. The second part and the heating element are spaced apart.
[0013] In one embodiment, the base is provided with an air inlet, which is connected to the atomizing chamber.
[0014] In one embodiment, the heating element is flat; the atomizing surface of the heating element is substantially parallel to the air outlet channel.
[0015] In one embodiment, the atomizing surface of the heating element is coplanar with or tangent to the side of the air outlet channel.
[0016] In one embodiment, the atomizing assembly further includes a seal disposed between the heating element and the bottom wall of the groove; the seal has a connecting hole in the middle so that the heating element is at least partially exposed.
[0017] In one embodiment, the atomizing component further includes a liquid guide disposed between the heating element and the bottom wall of the groove.
[0018] To solve the above-mentioned technical problems, the second technical solution provided in this application is: to provide an electronic atomizing device, including an atomizing component and a power supply component, wherein the atomizing component is any one of the above-mentioned atomizing components, and the power supply component controls the operation of the atomizing component.
[0019] The beneficial effects of this application are as follows: Unlike existing technologies, the atomizing assembly of this application includes a housing assembly, a heating element, and an electrical connector. The housing assembly has a liquid storage chamber, an air outlet channel, and an atomizing chamber. The housing assembly includes a housing and a heating base, with the heating base located inside the housing, and the heating base and housing cooperate to form the liquid storage chamber. The heating element is located inside the heating base. The atomizing surface of the heating element is exposed in the atomizing chamber and parallel to the longitudinal direction of the atomizing assembly. The atomizing chamber communicates with the atomizing surface of the heating element and the air outlet channel. The heating element includes an electrode disposed on the atomizing surface. The atomizing assembly also includes an electrical connector. The electrical connector is disposed on the heating base. One end of the electrical connector extends into the heating base, and the side of the electrical connector abuts against the electrode. The other end of the electrical connector is exposed on the bottom surface of the heating base for connection to a power supply assembly. By configuring the electrical connector as described above, a stable and reliable electrical connection between the electrical connector and the electrode of the heating element is maintained, improving the conductivity of the product. Attached Figure Description
[0020] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0021] Figure 1 This is a schematic diagram of the electronic atomizing device provided in this application; Figure 2 This is a schematic diagram of the atomizing component provided in this application; Figure 3 yes Figure 2 A schematic diagram of the localized decomposition structure is provided. Figure 4 yes Figure 2 Schematic diagram of the structure of the heating element; Figure 5 yes Figure 4 Schematic diagram of the structure of a medium-dense matrix; Figure 6 yes Figure 2 Schematic diagram of the structure of the first heating element in the middle; Figure 7 yes Figure 6 A structural schematic diagram of the first sub-heating seat from another angle; Figure 8 yes Figure 2 Schematic diagram of the structure of the second heating element in the middle; Figure 9 yes Figure 8 A structural schematic diagram of the second sub-heater seat from another angle is provided; Figure 10 yes Figure 3 A magnified view of the provided area. Detailed Implementation
[0022] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be particularly noted that the following embodiments are for illustrative purposes only and do not limit the scope of the application. Similarly, the following embodiments are only some, not all, embodiments of the present application, and all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of the present application.
[0023] The terms "first," "second," and "third" in this application are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationships and movement of components in a specific orientation (as shown in the figures). If the specific orientation changes, the directional indication will also change accordingly. The terms "comprising" and "having," and any variations thereof, in the embodiments of this application are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or components inherent to these processes, methods, products, or devices.
[0024] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.
[0025] Please see Figure 1 , Figure 1 This is a schematic diagram of the electronic atomizing device provided in this application.
[0026] Electronic atomization devices can be used for atomizing a substrate. An electronic atomization device includes an atomizing component 1 and a power supply component 2 connected to each other. The atomizing component 1 stores the substrate and atomizes it to form an aerosol. The substrate is generally liquid, but can also be solid or a solid-liquid mixture; liquid substrates can be pharmaceuticals, liquids from plant leaves, etc. The atomizing component 1 can be used in various fields, such as medical applications and electronic aerosolization. The power supply component 2 includes a battery (not shown), an airflow sensor (not shown), and a controller (not shown); the battery powers the atomizing component 1, enabling it to atomize the substrate and form an aerosol; the airflow sensor detects changes in airflow within the electronic atomization device, and the controller controls the operation of the atomizing component 1 based on these airflow changes. The atomizing component 1 and the power supply component 2 can be integrated or detachably connected, depending on specific requirements.
[0027] Please see Figures 2-5 , Figure 2 This is a schematic diagram of the atomizing component provided in this application. Figure 3 yes Figure 2 The provided diagram shows a partial decomposition structure. Figure 4 yes Figure 2 Schematic diagram of the structure of the heating element. Figure 5 yes Figure 4 A schematic diagram of the structure of a medium-dense matrix.
[0028] The atomizing assembly 1 includes a housing 10, a heating base 11, and a heating element 12. The housing 10 has a liquid storage chamber 13, an air outlet channel 14, and a receiving cavity 15; wherein the liquid storage chamber 13 surrounds the air outlet channel 14, and the heating base 11 is located in the receiving cavity 15. The housing 10 and the heating base 11 together form a housing assembly. The liquid storage chamber 13 is used to store the substrate. The air outlet channel 14 is parallel to the central axis of the atomizing assembly 1 and extends at one end to the end face of the housing 10 to form a suction port 16, through which the user inhales. In one embodiment, the entire length of the air outlet channel 14 is parallel to the central axis of the atomizing assembly 1. The heating element 12 is located on the heating base 11 and is used to atomize the substrate. The atomizing surface of the heating element 12 is positioned facing the side wall of the housing 10, meaning that the atomizing surface of the heating element 12 is exposed in the atomizing cavity 17 and is substantially parallel to the air outlet channel 14. The atomizing surface of the heating element 12 cooperates with the heating base 11 to form the atomizing cavity 17, which is connected to the air outlet channel 14. In other words, the atomized aerosol from the heating element 12 reaches the suction port 16 through the air outlet channel 14 within the atomizing cavity 17 and is inhaled by the user. The angle between the atomizing surface of the heating element 12 and the central axis of the atomizing assembly 1 is less than 30°. In one embodiment, the atomizing surface of the heating element 12 is parallel to the central axis of the atomizing assembly 1.
[0029] By aligning the entire air outlet channel 14 parallel to the central axis of the atomizing component 1, and extending one end of the air outlet channel 14 to the end face of the housing 10 to form a suction port 16, the atomizing surface of the heating element 12 is parallel to the central axis of the atomizing component 1. The atomizing cavity 17 formed by the atomizing surface of the heating element 12 and the heating base 11 is connected to the air outlet channel 14. The aerosol atomized by the heating element 12 flows in a straight line from the atomizing cavity 17 to the suction port 16 and is inhaled by the user, avoiding detours and reducing the contact between the aerosol and the wall, thereby reducing the formation of condensate. Furthermore, the shortened airway length ensures that the temperature of the aerosol reaching the user's mouth is suitable, which is beneficial for improving the taste.
[0030] In one embodiment, the atomizing surface of the heating element 12 is coplanar or tangent to the side surface of the exhaust channel 14, further allowing the aerosol to flow in a straight line to the suction port 16. When the cross-section of the exhaust channel 14 is circular, the atomizing surface of the heating element 12 is tangent to the side surface of the exhaust channel 14; when the cross-section of the exhaust channel 14 is square, the atomizing surface of the heating element 12 is coplanar with a portion of the side surface of the exhaust channel 14. Specifically, the distance between the atomizing surface of the heating element 12 and the axis of the exhaust channel 14 is a first value, and the radius of the exhaust channel 14 (when the cross-section of the exhaust channel 14 is circular) is a second value. The first value and the second value are the same, so that the aerosol flows out along a straight channel. In other embodiments, the first value may be greater than or less than the second value.
[0031] In this embodiment, see Figure 4 and Figure 5 The heating element 12 includes a dense substrate 121 and a heating film 122. The dense substrate 121 includes a first surface 1211 and a second surface 1212 opposite to the first surface 1211; a plurality of first micropores 1213 are provided on the dense substrate 121, and the first micropores 1213 are through holes penetrating the first surface 1211 and the second surface 1212. The heating film 122 is located on the first surface 1211. The surface on the dense substrate 121 where the heating film 122 is disposed is an atomizing surface, that is, the first surface 1211 of the dense substrate 121 is an atomizing surface, and the second surface 1212 of the dense substrate 121 is a liquid-absorbing surface. In other words, the dense substrate 121 includes a liquid-absorbing surface and an atomizing surface opposite to the liquid-absorbing surface, and the heating film 122 is located on the atomizing surface; the first micropores 1213 are through holes penetrating the liquid-absorbing surface and the atomizing surface. The first micropore 1213 is used to guide the matrix from the liquid absorption surface to the atomizing surface, and the first micropore 1213 has a capillary effect. The material of the dense substrate 121 is dense ceramic or glass; when the material of the dense substrate 121 is glass, the glass is borosilicate glass, quartz glass or photosensitive lithium aluminosilicate glass.
[0032] The heating film 122 has multiple second micropores 1221 that correspond one-to-one with and are interconnected with the multiple first micropores 1213. The resistance of the heating film 122 of the heating element 12 at room temperature (20℃~25℃) is 0.5~2 ohms. It is understood that the dense substrate 121 provides structural support, and the heating film 122 in the heating element 12 is electrically connected to the power supply component 2. When the power of the electronic atomizing device is 6 watts to 8.5 watts and the battery voltage range is 2.5 volts to 4.4 volts.
[0033] This application improves product consistency by precisely controlling the porosity of the heating element 12 through the provision of multiple first micropores 1213 with capillary forces on the dense substrate 121. In other words, during mass production, the porosity of the dense substrate 121 in the heating element 12 is essentially uniform, and the thickness of the heating film 122 formed on the dense substrate 121 is uniform, ensuring consistent atomization effects across different batches of electronic atomizing devices.
[0034] In other embodiments, the heating element 12 may also be a sheet-like porous ceramic heating element, which may be designed according to specific needs.
[0035] The heating base 11 includes a first sub-heating base 111 and a second sub-heating base 112. The first sub-heating base 111 and the second sub-heating base 112 cooperate to clamp the heating element 12, thereby fixing the heating element 12. Specifically, the first sub-heating base 111 and the second sub-heating base 112 clamp the two surfaces of the heating element 12 in a direction perpendicular to the axial direction of the atomizing assembly 1. While fixing the heating element 12 in a direction perpendicular to the heating element 12, they also protect the heating element 12, improving its impact resistance and preventing it from breaking. In one embodiment, the first sub-heating base 111 and the second sub-heating base 112 have corresponding protrusions and hooks that engage; the first sub-heating base 111 and the second sub-heating base 112 are connected by protrusions and hooks. In other embodiments, the first sub-heating base 111 and the second sub-heating base 112 can also be connected by interference fit, magnetic attraction, or other methods.
[0036] Specifically, a groove 1111 is provided on the first sub-heating seat 111 or the second sub-heating seat 112. The groove 1111 communicates with the liquid storage chamber 13, and the heating element 12 is disposed in the groove 1111. In one embodiment, the groove 1111 is provided on the first sub-heating seat 111, and the heating element 12 is disposed in the groove 1111. The atomizing surface of the heating element 12 cooperates with the second sub-heating seat 112 to form an atomizing cavity 17. In another embodiment, a cavity (not shown) is formed on the second sub-heating seat 112. The cavity wall includes a first sidewall and a second sidewall disposed opposite to each other. A groove 1111 is provided on the first sidewall of the cavity, and the heating element 12 is disposed in the groove 1111. The atomizing surface of the heating element 12 cooperates with the second sidewall to form an atomizing cavity 17. The second sidewall is located on the side of the first sidewall away from the first sub-heating seat 111. The groove 1111 can be designed according to specific needs. The groove 1111 can be used to install the heating element 12 and make the heating element 12 contact the matrix in the liquid storage chamber 13.
[0037] Please see Figures 6-9 , Figure 6 yes Figure 2 A schematic diagram of the structure of the first heating element in the middle. Figure 7 yes Figure 6 A structural schematic diagram of the first sub-heating seat from another angle is provided. Figure 8 yes Figure 2 A schematic diagram of the structure of the second heating element. Figure 9 yes Figure 8 A structural schematic diagram of the second sub-heater seat from another angle is provided.
[0038] See Figure 2 , Figures 6-9 The first sub-heating seat 111 includes a top cover 1112 and a lower seat 1113, and the second sub-heating seat 112 includes an upper seat 1121 and a base 1122. The top cover 1112 of the first sub-heating seat 111 covers the base 1122 of the second sub-heating seat 112 and abuts against the upper seat 1121 of the second sub-heating seat 112, and the base 1122 of the second sub-heating seat 112 covers the top cover 1112 of the first sub-heating seat 111 and abuts against the lower seat 1113 of the first sub-heating seat 111, for ease of assembly. It is understood that the top cover 1112 and the lower seat 1113 of the first sub-heating seat 111 can be integrally formed or fixed together by adhesive or other means; the upper seat 1121 and the base 1122 of the second sub-heating seat 112 can also be integrally formed or fixed together by adhesive or other means, depending on the specific design requirements.
[0039] The lower seat 1113 of the first sub-heating base 111 has a groove 1111 on its side. The atomizing surface of the heating element 12 mates with the side of the upper seat 1121 of the second sub-heating base 112 to form an atomizing chamber 17. The top cover 1112 of the first sub-heating base 111 has a liquid outlet 1114 and a vent 1115. One end of the vent 1115 communicates with the atomizing chamber 17, and the other end communicates with the air outlet channel 14. One end of the liquid outlet 1114 communicates with the liquid storage chamber 13. The lower seat 1113 of the first sub-heating base 111 has a liquid outlet channel 1116. One end of the liquid outlet channel 1116 communicates with the other end of the liquid outlet 1114, and the other end communicates with the groove 1111. The base 1122 of the second sub-heating base 112 has an air inlet 1123, which communicates with the atomizing chamber 17. Specifically, external gas enters the atomizing chamber 17 through the air inlet 1123, carrying the aerosol in the atomizing chamber 17 through the vent 1115 into the air outlet 14, and then reaches the suction port 16 to be inhaled by the user. The liquid discharge channel 1116 and the liquid discharge port 1114 can be a single unit (when the liquid discharge channel and the liquid discharge port have the same shape and diameter) or they can be two separate parts (when the liquid discharge channel and the liquid discharge port have different shapes). The liquid discharge channel 1116 and the liquid discharge port 1114 cooperate to form a fluid channel.
[0040] In this embodiment, the liquid lowering channel 1116 penetrates the lower seat 1113 of the first sub-heating seat 111; that is, the liquid lowering channel 1116 is a through hole penetrating the lower seat 1113. A liquid inlet hole 1117 is provided on the bottom wall of the groove 1111 to allow the groove 1111 to communicate with the liquid lowering channel 1116. It can be understood that the structure of the liquid lowering channel 1116 can be designed as needed, ensuring that the groove 1111 communicates with the liquid inlet hole 1117, and thus with the liquid storage chamber 13.
[0041] See Figure 8 and Figure 9An air inlet 1123 is provided on the base 1122 of the second sub-heating seat 112, and a through hole 1124 is provided on the upper seat 1121 of the second sub-heating seat 112. The axis of the through hole 1124 is perpendicular to the height direction of the upper seat 1121, and the through hole 1124 communicates with the atomizing chamber 17. The end of the base 1122 forms a stepped structure (not shown in the figure), and the end of the housing 10 abuts against the stepped surface of the stepped structure, thereby sealing the end of the housing 10. There is a gap between the upper seat 1121 and the housing 10, through which the air inlet 1123 is exposed, and the through hole 1124 communicates with the air inlet 1123 through the gap. It is understood that in other embodiments, an air inlet 1123 is provided on the base 1122 of the second sub-heating seat 112. The air inlet 1123 is a through hole that penetrates the base 1122, and the axis of the air inlet 1123 is parallel to the central axis of the atomizing component 1. The arrangement of the air inlet 1123 can be designed as needed, as long as it can enable the external gas to communicate with the atomizing chamber 17.
[0042] See Figure 2 , Figure 3 , Figures 6-9 The atomizing assembly 1 also includes an isolation plug 18, which is partially disposed in the liquid discharge channel 1116 and / or the liquid discharge hole 1114. When the isolation plug 18 is in the first position, the liquid storage chamber 13 is not in communication with the groove 1111; when the isolation plug 18 is in the second position, the liquid storage chamber 13 is in communication with the groove 1111. That is, when the isolation plug 18 is in the first position, the isolation plug 18 blocks the liquid inlet hole 1117 or the liquid discharge hole 1114 on the bottom wall of the groove 1111, so that the liquid storage chamber 13 is not in communication with the groove 1111; when the isolation plug 18 is in the second position, the isolation plug 18 does not block the liquid discharge hole 1114 and the liquid inlet hole 1117 on the bottom wall of the groove 1111, so that the liquid storage chamber 13 is in communication with the groove 1111.
[0043] The isolation plug 18 includes a sealing part 181 and a pull rod 182. The sealing part 181 is disposed in the liquid discharge channel 1116 and / or the liquid discharge hole 1114, and its shape matches the shape of the liquid discharge channel 1116 and / or the liquid discharge hole 1114. The pull rod 182 is disposed at the end of the sealing part 181 away from the liquid storage chamber 13. The base 1122 of the second sub-heating seat 112 is provided with a connecting hole 1125, which corresponds to the liquid discharge channel 1116. The pull rod 182 is disposed in the connecting hole 1125 to connect with the sealing part 181, and the end of the pull rod 182 extends out of the housing 10 on the side away from the suction port 16. The sealing part 181 is made of silicone, and the pull rod 182 is made of silicone, plastic, wood, etc. The connection method between the sealing part 181 and the pull rod 182 can be designed as needed, such as integral molding.
[0044] By setting the isolation plug 18, the isolation plug 18 blocks the liquid inlet 1117 and puts it in the first position when shipping, reducing the risk of leakage during transportation and storage. When in use, the isolation plug 18 is pulled to the bottom to put it in the second position, allowing the substrate to enter the groove 1111. After the isolation plug 18 is pulled to the bottom to put it in the second position, the pull rod 182 can also be cut off (the user can pull the pull rod 182 off to separate it from the sealing part 181), which facilitates the electrical connection between the atomizing assembly 1 and the power supply assembly 2.
[0045] It is understandable that when the distance between the top surface of the sealing part 181 and the bottom wall of the liquid storage chamber 13 is a first value, and the distance between the end of the liquid inlet hole 1117 near the liquid storage chamber 13 and the bottom wall of the liquid storage chamber 13 is a second value, if the first value is greater than the second value, and the length of the sealing part 181 is less than the height of the liquid inlet hole 1117, the matrix will enter the liquid inlet hole 1117 from the top surface of the sealing part 181 and flow to the side of the heating element 12 near the atomizing chamber 17, and then flow from the side of the heating element 12 near the atomizing chamber 17 to the other side of the heating element 12, and then leak out from the liquid outlet channel 1116. That is, there is a risk of leakage if the length of the sealing part 181 is less than the height of the liquid inlet hole 1117. Therefore, the length of the sealing part 181 is set to be no less than the height of the liquid inlet hole 1117. The length of the sealing part 181 is the distance between its top and bottom surfaces along the length of the atomizing assembly 1; the height of the liquid inlet 1117 is the distance between the end of the liquid inlet 1117 near the liquid storage chamber 13 and the end of the liquid inlet away from the liquid storage chamber 13.
[0046] See Figure 3 The atomizing assembly 1 also includes a seal 19 disposed between the heating element 12 and the bottom wall of the groove 1111. A connecting hole 191 is provided in the center of the seal 19 to expose at least part of the heating element 12, allowing it to contact the substrate. Specifically, the connecting hole 191 exposes at least part of a plurality of first micropores 1213 on the dense substrate 121 of the heating element 12. The first micropores 1213 communicate with the liquid storage chamber 13 through the connecting hole 191 and the groove 1111, guiding the substrate from the liquid absorption surface to the atomizing surface, where it is atomized by the heating film 122 on the atomizing surface. By providing the seal 19 between the heating element 12 and the bottom wall of the groove 1111, the heating element 12 is buffered, improving its impact resistance.
[0047] The atomizing assembly 1 also includes a liquid guide 20, which is disposed between the heating element 12 and the bottom wall of the groove 1111. The liquid guide 20 is a liquid-guiding material such as liquid-guiding cotton or porous ceramic. By setting the liquid guide 20, uneven liquid absorption by the heating element 12 can be avoided when the liquid level of the matrix is lower than the top of the liquid inlet 1117. The liquid guide 20 can absorb the liquid at the bottom of the liquid channel 1116 and distribute it evenly to the liquid absorption surface of the heating element 12, which is beneficial to the consistency of taste. The liquid guide 20 is located on the side of the sealing member 19 away from the heating element 12.
[0048] Please see Figure 10 , Figure 10 yes Figure 3 A magnified view of the provided area.
[0049] The heating element 12 also includes an electrode 123, which is disposed on the atomizing surface, and the heating film 122 is electrically connected to the electrode 123. The atomizing assembly 1 also includes a spring 21, such as a metal spring. One end of the spring 21 is connected to the electrode 123, and the other end is used to connect to the power supply assembly 2. Specifically, the base 1122 of the second sub-heating seat 112 is provided with a mounting hole (not shown), and the other end of the spring 21 is disposed in the mounting hole and exposed at the end of the atomizing assembly 1 for electrical connection to the power supply assembly 2. In one embodiment, the spring 21 is a metal sheet, which is embedded in the second sub-heating seat 112 by injection molding for easy assembly. Specifically, one end of the spring piece 21 extends out of the second sub-heating base 112 and is bent to form an elastic contact end for abutting against the electrode 123. The other end of the spring piece 21 is bent vertically to form a contact end parallel to the bottom surface of the second sub-heating base 112 and exposed on the bottom surface of the second sub-heating base 112 for abutting against the ejector pin of the power supply assembly 2. It is understood that the way the spring piece 21 is fixed to the second sub-heating base 112 can be designed as needed, and this application is not limited in this regard.
[0050] The following section provides a detailed description of the material of the dense substrate 121 of the heating element 12, which is glass.
[0051] The thickness of the dense substrate 121 is 0.1 mm to 1 mm. When the thickness of the dense substrate 121 is greater than 1 mm, it cannot meet the liquid supply requirements, resulting in a decrease in aerosol volume and greater heat loss, and the cost of setting the first micropore 1213 is high. When the thickness of the dense substrate 121 is less than 0.1 mm, the strength of the dense substrate 121 cannot be guaranteed, which is not conducive to improving the performance of the electronic atomization device. Preferably, the thickness of the dense substrate 121 is 0.2 mm to 0.5 mm. The pore size of the first micropore 1213 on the dense substrate 121 is 1 μm to 100 μm. When the pore size of the first micropore 1213 is less than 1 μm, it cannot meet the liquid supply requirements, resulting in a decrease in aerosol volume. When the pore size of the first micropore 1213 is greater than 100 μm, the matrix is prone to flow out from the first micropore 1213 to the first surface 1211, causing leakage and reducing atomization efficiency. Preferably, the pore size of the first micropore 1213 is 20 micrometers to 50 micrometers. It is understood that the thickness of the dense substrate 121 and the pore size of the first micropore 1213 are selected according to actual needs.
[0052] The ratio of the thickness of the dense substrate 121 to the pore size of the first micropore 1213 is between 20:1 and 3:1; preferably, the ratio is 15:1 to 5:1. When the ratio of the thickness of the dense substrate 121 to the pore size of the first micropore 1213 is greater than 20:1, the matrix supplied by the capillary force of the first micropore 1213 is insufficient to meet the atomization requirements of the heating element 12, which easily leads to dry burning and a decrease in the amount of aerosol generated per atomization. When the ratio of the thickness of the dense substrate 121 to the pore size of the first micropore 1213 is less than 3:1, the matrix easily flows out from the first micropore 1213 to the first surface 1211, resulting in matrix waste, decreased atomization efficiency, and consequently a reduction in the total amount of aerosol.
[0053] The ratio of the center-to-center distance between two adjacent first micropores 1213 to the pore diameter of the first micropore 1213 is between 3:1 and 1.5:1, so that the first micropores 1213 on the dense substrate 121 can maximize the strength of the dense substrate 121 while meeting the liquid supply capacity; preferably, the ratio of the center-to-center distance between two adjacent first micropores 1213 to the pore diameter of the first micropore 1213 is between 3:1 and 2:1; more preferably, the ratio of the center-to-center distance between two adjacent first micropores 1213 to the pore diameter of the first micropore 1213 is between 3:1 and 2.5:1.
[0054] In one specific embodiment, preferably, the ratio of the thickness of the dense substrate 121 to the pore diameter of the first micropore 1213 is 15:1-5:1, and the ratio of the center distance between two adjacent first micropores 1213 to the pore diameter of the first micropore 1213 is 3:1-2.5:1.
[0055] The above description is only a part of the embodiments of this application and does not limit the scope of protection of this application. Any equivalent device or equivalent process transformation made based on the content of this application specification and drawings, or directly or indirectly applied to other related technical fields, are similarly included in the patent protection scope of this application.
Claims
1. An atomizing component, characterized in that, include: The housing assembly has a liquid storage chamber, an air outlet channel, and an atomizing chamber; the liquid storage chamber is used to store a matrix; the housing assembly includes a housing and a heating base, the heating base being located inside the housing, and the heating base cooperating with the housing to form the liquid storage chamber; A heating element is provided for atomizing the matrix to generate an aerosol; the heating element is located inside the heating base; the atomizing surface of the heating element is exposed to the atomizing cavity and is parallel to the longitudinal direction of the atomizing assembly; the atomizing cavity is connected to the atomizing surface of the heating element and the air outlet channel. The heating element includes an electrode disposed on the atomizing surface; the atomizing assembly further includes an electrical connector disposed on the heating base; one end of the electrical connector extends out of the heating base, and the side of the electrical connector abuts against the electrode; the other end of the electrical connector is exposed on the bottom surface of the heating base for connection to a power supply assembly.
2. The atomizing component according to claim 1, characterized in that, The heating base includes a first sub-heating base and a second sub-heating base that are fixedly connected. The first sub-heating seat is provided with a groove, which communicates with the liquid storage cavity; the heating element is disposed in the groove; the atomizing surface of the heating element cooperates with the second sub-heating seat to form the atomizing cavity.
3. The atomizing component according to claim 2, characterized in that, The electrical connector is a spring clip, which is disposed on the second sub-heater base.
4. The atomizing component according to claim 3, characterized in that, One end of the spring plate extends out of the second sub-heating base and is bent to form an elastic contact end, abutting against the electrode; and / or The other end of the spring is bent vertically to form a contact end parallel to the bottom surface of the second sub-heater base and exposed on the bottom surface of the second sub-heater base for connection to the power supply assembly.
5. The atomizing component according to claim 2, characterized in that, The first sub-heating seat includes a top cover and a lower seat, wherein the top cover and the lower seat are integrally formed; The groove is provided on the side of the lower seat.
6. The atomizing component according to claim 5, characterized in that, The top cover is provided with a vent hole; one end of the vent hole is connected to the atomizing chamber, and the other end of the vent hole is connected to the air outlet channel.
7. The atomizing component according to claim 5, characterized in that, The second sub-heating seat includes an upper seat and a base; the top cover covers the base and abuts against the upper seat; the base covers the top cover and abuts against the lower seat; The atomizing surface of the heating element mates with the upper seat to form the atomizing cavity.
8. The atomizing component according to claim 7, characterized in that, The upper seat includes a first section, a second section, and a third section. The first section is connected to the second section, and the third section is connected to the second section. The first section and the third section are located at opposite ends of the second section. The ends of the first section and the third section that are away from the second section are in contact with the heating element. The second section and the heating element are spaced apart.
9. The atomizing component according to claim 7, characterized in that, The base is provided with an air inlet, which is connected to the atomizing chamber.
10. The atomizing component according to claim 1, characterized in that, The heating element is flat; the atomizing surface of the heating element is basically parallel to the air outlet channel.
11. The atomizing component according to claim 10, characterized in that, The atomizing surface of the heating element is coplanar with or tangent to the side of the air outlet channel.
12. The atomizing component according to claim 2, characterized in that, The atomizing assembly also includes a sealing element disposed between the heating element and the bottom wall of the groove; the sealing element has a connecting hole in the middle so that the heating element is at least partially exposed.
13. The atomizing component according to claim 2, characterized in that, The atomizing component also includes a liquid guide, which is disposed between the heating element and the bottom wall of the groove.
14. An electronic atomizing device, characterized in that, It includes an atomizing component and a power supply component, wherein the atomizing component is the atomizing component according to any one of claims 1-13, and the power supply component controls the operation of the atomizing component.