Diamond aluminum matrix composite laser milling device and method

Abstract

The invention discloses a laser milling device and method for a diamond aluminum-based composite material, and relates to the technical field of laser milling. The laser milling device comprises a workpiece placing table, a laser coherent detection device for identifying a workpiece, a feedback analysis device electrically connected with the laser coherent detection device, a control system electrically connected with the feedback analysis device, and a dual-mode laser electrically connected with the control system, the dual-mode laser is used for receiving a control signal of the control system, the control system controls the dual-mode laser to switch a corresponding laser mode for a material of the workpiece, and the problem of selective machining is thoroughly solved through a coordinated removal mechanism of a dual-mode laser technology. And a high-quality machined surface with a smooth surface and a uniform structure is obtained, so that high-quality, high-precision and intelligent laser milling of the diamond / aluminum-based composite material is realized.

Description

Technical Field

[0001] This invention relates to the field of laser milling technology, and specifically to a laser milling device and method for diamond-aluminum composite materials. Background Technology

[0002] Diamond / aluminum matrix composites face numerous challenges in machining. Due to the presence of hard and brittle reinforcing particles, cutting diamond / aluminum matrix composites suffers from severe tool wear, low machining accuracy, and poor surface quality. Furthermore, the discrete distribution of reinforcing particles within the aluminum matrix generates alternating cutting forces, making the machined surface more prone to uneven stress distribution and residual stress, severely impacting part stability and fatigue life, thus hindering the widespread application of diamond / aluminum matrix composites. Laser milling, as a non-contact machining method, effectively avoids tool wear problems and reduces the impact of mechanical stress on the material, making it suitable for machining composites containing hard reinforcing phases. In addition, the high precision and excellent controllability of laser processing give it unique advantages in the field of precision machining of composite materials. Laser milling utilizes a high-energy-density laser beam to irradiate the workpiece, removing material through the thermal and photochemical effects of the laser beam, effectively avoiding the aforementioned problems.

[0003] However, diamond and aluminum alloys exhibit significant differences in their laser absorption characteristics and coefficients of thermal expansion. Diamond has extremely low laser absorption in the visible and near-infrared bands and possesses excellent optical transparency, while aluminum alloys, although highly reflective, still have some laser absorption capacity at specific wavelengths. During the laser-material interaction process, diamond requires a higher energy density for effective removal, while the aluminum matrix is ​​relatively easy to machine. This significant difference in optical properties leads to a typical "selective machining" phenomenon in diamond / aluminum composites under the same laser parameters—the aluminum matrix over-melts while the diamond particles are almost unaffected, resulting in a severe phase height difference and "ring-shaped depressions" on the final machined surface. Existing laser milling technologies use single wavelengths and fixed power density process parameters, which cannot simultaneously achieve optimal processing conditions for both phases. How to achieve coordinated removal of diamond and aluminum alloys to obtain milled products with smooth surfaces and uniform material microstructure has become an urgent problem to be solved in laser milling of diamond / aluminum composites.

[0004] Therefore, it is necessary to develop and design laser milling devices and methods for diamond-aluminum composite materials. Real-time monitoring of the distribution of diamond and aluminum alloy during the milling process and taking appropriate measures to achieve coordinated removal of the two materials, thereby improving the processing accuracy, is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0005] To address the aforementioned issues, this invention provides a laser milling device and method for diamond / aluminum matrix composites. By integrating ultraviolet pulsed lasers (for the high energy density requirements of diamond) and mid-infrared continuous lasers (for the mild melting requirements of the aluminum matrix), it achieves precise milling of heterogeneous two-phase materials. A real-time identification and distribution monitoring system for material phases is established using laser coherent detection technology. A dynamic mapping relationship between material phases and laser parameters is established to achieve real-time optimization of process parameters. The coordinated removal mechanism of dual-mode laser technology completely solves the problem of "selective processing," resulting in a high-quality machined surface with a smooth surface and uniform microstructure. This enables high-quality, high-precision, and intelligent laser milling of diamond / aluminum matrix composites.

[0006] To achieve the above objectives, the present invention provides the following solution: A laser milling device for diamond-aluminum composite materials includes a workpiece placement stage, a laser coherent detection device for identifying the workpiece, a feedback analysis device electrically connected to the laser coherent detection device, a control system electrically connected to the feedback analysis device, and a dual-mode laser electrically connected to the control system. The dual-mode laser is used to receive control signals from the control system, and the control system controls the dual-mode laser to switch the corresponding laser mode for the material of the workpiece.

[0007] Preferably, the laser coherent detection device includes a monochromatic laser, a first beam splitter that receives the laser beam emitted by the monochromatic laser, a focusing lens connected to the light output port on one side of the first beam splitter, a collecting lens system for collecting the reflected beam from the workpiece, a coherent signal acquisition and analysis system connected to the collecting lens system and the light output port on the other side of the first beam splitter, and a scanning motor for driving the focusing lens and the collecting lens system to move. The coherent signal acquisition and analysis system is electrically connected to the feedback analysis device.

[0008] Preferably, the first beam splitter is connected to the coherent signal acquisition and analysis system in sequence through a second beam splitter and a first fiber coupler, and the collecting lens system is connected to the coherent signal acquisition and analysis system in sequence through a third beam splitter and a second fiber coupler. The first fiber coupler and the second fiber coupler are respectively connected to the third beam splitter and the second beam splitter.

[0009] Preferably, a reflector and a frequency modulator are sequentially disposed between the first beam splitter and the second beam splitter.

[0010] Preferably, the dual-mode laser is used to generate ultraviolet pulsed laser and mid-infrared continuous laser.

[0011] Preferably, the dual-mode laser is disposed above the workpiece placement stage, and a drive motor for driving the dual-mode laser to move is disposed on the dual-mode laser.

[0012] This invention also discloses a laser milling method for diamond-aluminum matrix composites, using the aforementioned laser milling device for diamond-aluminum matrix composites, characterized by mainly including the following steps: The laser coherence detection device is activated to scan the surface of the workpiece; The dual-mode laser, the feedback analysis device, and the control system are activated to perform a coordinated milling operation. The control system adjusts the laser processing parameters of the dual-mode laser based on the material distribution information fed back in real time by the feedback analysis device until the milling operation is completed.

[0013] Preferably, before scanning, basic laser milling process parameters are set according to the characteristics of the workpiece.

[0014] Preferably, the basic laser milling process parameters include laser wavelength, laser power, scanning speed, laser focal length, pulse width, wavelength, pulse energy, peak power, spot diameter, frequency, and energy density.

[0015] Preferably, during the scanning process of the workpiece surface, the horizontal overlap between pulses on the same scanning line and the vertical overlap between pulses on adjacent scanning lines are set to 50% to 80% of the laser spot diameter, and the scanning line spacing, which refers to the distance between the center lines of two adjacent scanning lines, is set to 60% to 80% of the laser spot diameter.

[0016] The present invention achieves the following technical effects compared to the prior art: By setting up a laser coherence detection device to analyze the surface morphology and reinforcing phase distribution of the workpiece surface to be processed, the surface analysis information is then sent to the control system via a feedback analysis device. The control system switches between different laser modes and adjusts the laser output type and power according to the distribution of the aluminum matrix and diamond. Mid-infrared continuous laser is used for processing on the aluminum matrix, while pulsed ultraviolet laser is used on the diamond. The power and other parameters are adjusted to complete the milling process. At the same time, the laser coherence device scans the state of the surface to be processed at the front end of the laser beam in real time and transmits the analyzed data to the feedback analysis device for processing. The feedback analysis device then transmits the information to the control system. The control system switches the laser mode through algorithms and adjusts the laser power, scanning speed and other process parameters in real time, thereby ensuring that the laser milling process is controllable throughout. This improves the quality and precision of laser milling. In other words, the coordinated removal mechanism of dual-mode laser technology completely solves the problem of "selective processing" and obtains a high-quality processed surface with a smooth surface and uniform structure. This achieves high-quality, high-precision, and intelligent laser milling of diamond / aluminum matrix composites. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Appendix Figure 1 This is a schematic diagram of the overall connection relationship of the laser milling device for diamond-aluminum composite materials disclosed in this invention; Appendix Figure 2 This is a schematic diagram of the laser milling process structure of the diamond-aluminum composite material laser milling device disclosed in this invention; Appendix Figure 3 This is a flowchart illustrating the working process of the laser milling device for diamond-aluminum composite materials disclosed in this invention. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] The purpose of this invention is to provide a laser milling device and method for diamond / aluminum matrix composites. By integrating ultraviolet pulsed laser (for the high energy density requirements of diamond) and mid-infrared continuous laser (for the mild melting requirements of the aluminum matrix), it achieves precise milling of heterogeneous two-phase materials. It utilizes laser coherent detection technology to establish a real-time identification and distribution monitoring system for material phases, establishes a dynamic mapping relationship between material phases and laser parameters to achieve real-time optimization of process parameters, and completely solves the problem of "selective processing" through the coordinated removal mechanism of dual-mode laser technology, obtaining a high-quality processed surface with a smooth surface and uniform structure. Thus, it achieves high-quality, high-precision, and intelligent laser milling of diamond / aluminum matrix composites.

[0021] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0022] The laser milling apparatus for diamond-aluminum matrix composites disclosed in this embodiment of the invention includes at least a workpiece placement stage for placing the diamond-aluminum matrix composite material. A laser coherent detection device for identifying and scanning the diamond-aluminum matrix composite material is mounted on the workpiece placement stage via a frame. The laser coherent detection device is electrically connected to a feedback analysis device, which is electrically connected to a control system. The control system is electrically connected to a dual-mode laser, which receives control signals from the control system. The control system controls the dual-mode laser to switch the corresponding laser mode for different materials on the workpiece, performing targeted processing and removal on the diamond-aluminum matrix composite material. For example, when removing diamond, the control system controls the dual-mode laser to switch to the laser mode for diamond removal, emitting ultraviolet pulsed laser light. When removing the aluminum matrix, the control system controls the dual-mode laser to emit mid-infrared continuous laser light. The laser coherent detection device is used to perform surface morphology and reinforcing phase separation on the workpiece surface to be processed. The surface analysis is then transmitted to the control system via a feedback analysis device. The control system switches between different laser modes and adjusts the laser type and power output based on the distribution of the aluminum matrix and diamond. Mid-infrared continuous laser is used for processing on the aluminum matrix, while pulsed ultraviolet laser is used on the diamond. Power and other parameters are adjusted to complete the milling process. Simultaneously, a laser coherence device scans the surface to be processed at the front end of the laser beam in real time and transmits the analyzed data to the feedback analysis device for processing. The feedback analysis device then transmits the information to the control system, which uses algorithms to switch laser modes and adjust process parameters such as laser power and scanning speed in real time. This ensures that the entire laser milling process is controllable, improving the quality and precision of laser milling. In other words, the coordinated removal mechanism of dual-mode laser technology completely solves the problem of "selective processing," resulting in a high-quality processed surface with a smooth surface and uniform structure. This achieves high-quality, high-precision, and intelligent laser milling of diamond / aluminum matrix composites.

[0023] It should be noted that a mid-infrared continuous laser with a wavelength of approximately 1064nm is used on the aluminum substrate.

[0024] refer to Figures 1-3In one embodiment, the laser coherent detection device includes a monochromatic laser. The laser beam emitted by the monochromatic laser is connected to a first beam splitter. The first beam splitter has two output ports. One output port serves as the probe light emitted by a focusing lens and illuminates the material surface for scanning the surface of the diamond-aluminum based material. The other output port serves as the reference light and is connected to a coherent signal acquisition and analysis system. A scanning motor is mounted on the frame and is connected to a focusing lens and a collecting lens system. The scanning motor controls the probe beam to scan the workpiece surface in a specific pattern, achieving point-by-point detection of the entire surface. The coherent signal acquisition and analysis system is connected to a feedback analysis device. The electrical connection is used to split the monochromatic laser into a probe beam and a reference beam via a first beam splitter. The probe beam scans the workpiece surface point by point through a focusing lens under the control of a scanning motor. The reflected light is collected by a collecting lens. During the scanning detection process, when the laser beam moves from the aluminum region to the diamond particle region, the optical parameters of the reflected light undergo a jump change. This change will generate a characteristic modulation pattern in the coherent detection signal. The signal acquisition and analysis system can identify these signal characteristics caused by the difference in material composition by processing and spectral analysis of the two signals, thereby achieving accurate detection of the distribution, size and concentration of diamond particles in the aluminum matrix.

[0025] It should be noted that a scanning motor may not be installed on the frame. Instead, the entire laser coherent inspection device can be moved by placing a guide rail and a slider. For example, a slider can be installed on the guide rail and connected to the laser coherent inspection device, thereby realizing the three-dimensional movement of the laser coherent inspection device to achieve complete scanning of the workpiece.

[0026] The core idea of ​​laser coherent detection technology is to use the wave properties of light to identify different materials. Diamond, as a wide-bandgap semiconductor material, is almost transparent to visible and near-infrared light. When a laser irradiates a diamond particle, most of the light penetrates into the particle and undergoes multiple reflections and refractions before being emitted again, causing a characteristic change in the phase of the scattered light. In contrast, the laser can hardly penetrate the aluminum surface and instead causes strong reflection at the surface. When a highly coherent monochromatic laser irradiates the surface of the composite material, the diamond and aluminum substrate will produce completely different responses to the light waves, forming reflected light with different phases and intensities. After interfering with the reference light, different interference fringes will be produced, thus distinguishing the material composition of the surface.

[0027] In one embodiment, a first beam splitter is connected to a coherent signal acquisition and analysis system via a second beam splitter and a first fiber coupler. A collecting lens system is connected to the coherent signal acquisition and analysis system via a third beam splitter and a second fiber coupler. The first fiber coupler is connected to the third beam splitter, and the second fiber coupler is connected to the second beam splitter. The collecting lens system collects the reflected light and uses the third beam splitter to decompose it into two orthogonally polarized beams. These two orthogonally polarized beams, decomposed from the reference light by the second beam splitter, are coherently mixed with the reference light in the first and second fiber couplers, respectively. The coherent signal acquisition and analysis system then filters, amplifies, and acquires the signal. Finally, the material type of the current irradiated area is identified by analyzing the intensity and phase characteristics of the interference signal.

[0028] It should be noted that splitting the light into two orthogonally polarized beams can improve the accuracy and stability of the detection system. When the laser irradiates the surface of the workpiece, diamond and aluminum materials will produce different optical responses. Using two mutually perpendicular polarized beams for simultaneous detection can obtain more complete optical information and avoid information loss caused by a single polarization direction. At the same time, dual-path detection can also effectively eliminate external interference, such as the influence of laser power fluctuations and environmental vibrations on the measurement results. By comparing and analyzing the differences between the two signals, the system can more accurately identify the material distribution on the workpiece surface, providing a reliable basis for subsequent laser parameter adjustments.

[0029] In one implementation, a reflector and a frequency modulator are sequentially arranged between the first beam splitter and the second beam splitter. The reflector first ensures that the reference light can enter the frequency modulator accurately. The frequency modulator processes the reference light and loads it with a specific high-frequency carrier for identification. Subsequently, this marked reference light is mixed with the probe light carrying surface information returned from the collecting lens system through an optical fiber coupler.

[0030] As one implementation method, a dual-mode laser is used to generate ultraviolet pulsed laser and mid-infrared continuous laser. The coherent signal acquisition and analysis system transmits the detected material information to the control system through a feedback system. The control system selects the appropriate dual-mode laser for processing according to the material type. When diamond is detected, the pulsed ultraviolet laser mode is used for processing; when aluminum matrix is ​​detected, the continuous mid-infrared laser mode is used for processing. At the same time, the feedback analysis device monitors the processing effect and feeds the information back to the control system for parameter adjustment. This realizes an intelligent processing process that automatically selects appropriate laser parameters according to different materials.

[0031] refer to Figure 1As a preferred approach, the dual-mode laser is positioned above the workpiece placement stage, and a drive motor is installed on the dual-mode laser to drive its movement. By setting the drive motor, the three-dimensional movement of the dual-mode laser can be realized, thereby ensuring the processing effect of the workpiece.

[0032] It should be noted that the drive motor can be set on the horizontal and vertical guide rails on the workpiece placement table. The drive motor can move on the horizontal and vertical guide rails and can drive the dual-mode laser to move up and down to achieve three-dimensional movement of the dual-mode laser.

[0033] This invention also discloses a laser milling method for diamond-aluminum matrix composites, which uses the laser milling device for diamond-aluminum matrix composites as described above, and mainly includes the following steps: The laser coherent detection device is activated to scan the surface of the workpiece. The probe light emitted by its monochromatic laser, under the control of the scanning motor, performs a high-precision, non-contact point-by-point scan on the surface of the workpiece (diamond-aluminum matrix composite material). The reflected light carrying surface morphology information undergoes heterodyne interference with the frequency-modulated reference light. The feedback analysis device calculates in real time to generate a high-resolution three-dimensional morphology map and material distribution map of the current processing area (precisely distinguishing diamond particles from the aluminum matrix). The dual-mode laser, feedback analysis device, and control system are activated to perform coordinated milling operations. The dual-mode laser can switch instantaneously between two processing modes: a high-energy pulse mode is used to ablate and remove high-hardness diamond particles, while a continuous or long pulse mode is used to melt and evaporate relatively soft aluminum substrates. The control system dynamically adjusts the processing strategy based on the material distribution map provided in real time by the feedback analysis device. Spatially, it controls the laser focus to move along a predetermined path and instantly switches the output mode of the dual-mode laser according to the material type of the current scanning point (diamond or aluminum) to achieve precise processing. In terms of parameters, it adjusts the laser power, pulse frequency, scanning speed and other parameters of the corresponding mode in real time to optimize removal efficiency and suppress thermal damage. The control system adjusts the laser processing parameters of the dual-mode laser based on the material distribution information fed back by the feedback analysis device in real time until the milling operation is completed.

[0034] Throughout the process, the processing parameters are no longer fixed, but dynamically adjusted based on the real-time perceived material properties, achieving true adaptive processing. For composite materials such as diamond / aluminum with extremely large hardness differences, the dual-mode laser switching strategy is the only advanced method that can simultaneously and efficiently process two phases while reducing thermal damage to the soft matrix. It transforms post-process inspection into in-process inspection, realizing inspection while processing, significantly improving the first-pass yield and processing reliability. Closed-loop feedback enables the system to automatically perform compensation processing, minimizing human intervention and improving the processing consistency and automation level of complex curved surfaces or precision parts.

[0035] As a preferred approach, basic laser milling process parameters are set according to the characteristics of the workpiece before scanning. This allows the system to start from a better, targeted initial state for fine-tuning, greatly reducing the number of trial and error iterations required to find feasible parameters. This shortens the initial adaptation time of the entire processing cycle and improves production efficiency.

[0036] As one implementation method, the basic laser milling process parameters for processing aluminum substrates using mid-infrared continuous lasers include laser wavelength, laser power, scanning speed, and laser focal length. The basic laser milling process parameters for processing diamond using pulsed lasers include pulse width, wavelength, pulse energy, peak power, spot diameter, frequency, and energy density.

[0037] As an implementation method, during the scanning process of the workpiece surface, the horizontal overlap between pulses on the same scanning line and the vertical overlap between pulses on adjacent scanning lines are set to 50% to 80% of the laser spot diameter. This ensures that the processed surface is continuous and uniform, avoiding the appearance of "fish scale patterns". The scanning line spacing refers to the distance between the center lines of two adjacent scanning lines, which is set to 60% to 80% of the laser spot diameter. The reasonable configuration of these two parameters ensures that the entire processing area is covered without omissions, while avoiding the thermal impact and efficiency reduction caused by excessive overlap. These are the core control elements for achieving high-quality laser milling.

[0038] This invention avoids the problems of severe tool wear, low machining accuracy, and poor surface quality that occur in traditional milling by using laser milling. It also avoids the problem of uneven stress distribution and residual stress on the machined surface caused by the discrete distribution of reinforcing particles in the aluminum matrix, which can generate alternating cutting forces.

[0039] Laser coherence analysis was used to analyze the surface morphology and distribution of reinforcing phases on the workpiece. Based on the differences in the properties of diamond and aluminum alloy, different laser modes and parameters were used for milling on the aluminum matrix and the diamond. This ensured that the melting and evaporation of diamond was basically consistent with that of the aluminum matrix. This effectively solved the problems of uneven surface and non-uniform microstructure and unsatisfactory mechanical properties caused by the different absorption and reflection of laser by the reinforcing phase and the substrate, as well as the different evaporation and loss, during the laser milling of composite materials.

[0040] The laser coherent detection device scans the state of the surface to be processed at the front end of the laser beam in real time, analyzes the surface condition in real time, and transmits the analyzed data to the control system. The control system switches the laser mode and adjusts the laser milling parameters in real time through algorithms, thereby improving the controllability of the laser milling process.

[0041] It should be noted that, for those skilled in the art, it is obvious that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A laser milling device for diamond-aluminum composite materials, characterized in that, The device includes a workpiece placement stage, a laser coherent detection device for identifying the workpiece, a feedback analysis device electrically connected to the laser coherent detection device, a control system electrically connected to the feedback analysis device, and a dual-mode laser electrically connected to the control system. The dual-mode laser is used to receive control signals from the control system, and the control system controls the dual-mode laser to switch the corresponding laser mode for the material of the workpiece.

2. The laser milling device for diamond-aluminum composite materials according to claim 1, characterized in that, The laser coherent detection device includes a monochromatic laser, a first beam splitter that receives the laser beam emitted by the monochromatic laser, a focusing lens connected to the light output port on one side of the first beam splitter, a collecting lens system for collecting the reflected beam from the workpiece, a coherent signal acquisition and analysis system connected to the collecting lens system and the light output port on the other side of the first beam splitter, and a scanning motor for driving the focusing lens and the collecting lens system to move. The coherent signal acquisition and analysis system is electrically connected to the feedback analysis device.

3. The laser milling device for diamond-aluminum composite materials according to claim 2, characterized in that, The first beam splitter is connected to the coherent signal acquisition and analysis system in sequence through the second beam splitter and the first fiber coupler. The collecting lens system is connected to the coherent signal acquisition and analysis system in sequence through the third beam splitter and the second fiber coupler. The first fiber coupler and the second fiber coupler are respectively connected to the third beam splitter and the second beam splitter.

4. The laser milling device for diamond-aluminum composite materials according to claim 3, characterized in that, A reflector and a frequency modulator are sequentially arranged between the first beam splitter and the second beam splitter.

5. The laser milling device for diamond-aluminum composite materials according to claim 1, characterized in that, The dual-mode laser is used to generate ultraviolet pulsed laser and mid-infrared continuous laser.

6. The laser milling device for diamond-aluminum composite materials according to claim 1, characterized in that, The dual-mode laser is positioned above the workpiece placement stage, and a drive motor is provided on the dual-mode laser to drive its movement.

7. A laser milling method for diamond-aluminum matrix composites, using the laser milling apparatus for diamond-aluminum matrix composites as described in any one of claims 1-6, characterized in that, The main steps include: The laser coherence detection device is activated to scan the surface of the workpiece; The dual-mode laser, the feedback analysis device, and the control system are activated to perform a coordinated milling operation. The control system adjusts the laser processing parameters of the dual-mode laser based on the material distribution information fed back in real time by the feedback analysis device until the milling operation is completed.

8. The laser milling method for diamond-aluminum matrix composites according to claim 7, characterized in that, Before scanning, basic laser milling process parameters are set according to the characteristics of the workpiece.

9. The laser milling method for diamond-aluminum matrix composites according to claim 8, characterized in that, The basic laser milling process parameters include laser wavelength, laser power, scanning speed, laser focal length, pulse width, wavelength, pulse energy, peak power, spot diameter, frequency, and energy density.

10. The laser milling method for diamond-aluminum matrix composites according to claim 7, characterized in that, During the scanning process of the workpiece surface, the horizontal overlap between pulses on the same scanning line and the vertical overlap between pulses on adjacent scanning lines are set to 50% to 80% of the laser spot diameter. The scanning line spacing refers to the distance between the center lines of two adjacent scanning lines, which is set to 60% to 80% of the laser spot diameter.

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